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Abstract

This article decribes the electroless deposition of NiP or CoP on a copper foil. The phosphide layer serves as an adhesive layer for the subsequent polyimide coating.

Country

United States

Language

English (United States)

This text was extracted from an ASCII text file.

This is the abbreviated version, containing approximately
87% of the total text.

Electroless Deposition of NiP or CoP on a Copper Foil
Functioning
as an Adhesive Layer for Subsequent Polyimide Coating

This article
decribes the electroless deposition of NiP or CoP
on a copper foil. The phosphide layer
serves as an adhesive layer
for the subsequent polyimide coating.

The base
material for flexible circuit boards or multi-layer
thin film structures consists of a dielectric (polyimide) which is
laminated or coated with a copper foil on one or two sides. To
achieve good chemical adhesion between the copper and the polyimide
the foil is electrolessly coated with a thin layer of NiP or CoP on
the side facing the insulator.

This cover
layer is subjected to a chemical or electrolytical
secondary treatment, whereby a homogeneous surface is achieved which
causes a uniform adhesion, also resisting thermal stress.

The copper
foil is covered on one side with a thin (< 0.5 &mu
m) electroless NiP or CoP layer. After a
subsequent rinsing process
it is put into the secondary treatment bath, where a reproducible
surface oxidation takes place. After
rinsing and drying the foil can
be coated with the polyimide.

Chemical
oxidation is initiated by dipping into a solution
containing sodium borate or by electrolytical (anodic) treatment in
such a solution.

Since the
copper forms a homogeneous layer, smaller dimensions
are possible when etching the conductive paths because of thinner
copper layers and the f...