Nanofluids—a simple product of the emerging world of nanotechnology—are suspensions of nanoparticles (nominally 1–100 nm in size) in conventional base fluids such as water, oils, or glycols. Nanofluids have seen enormous growth in popularity since they were proposed by Choi in 1995. In the year 2011 alone, there were nearly 700 research articles where the term nanofluid was used in the title, showing rapid growth from 2006 (175) and 2001 (10). The first decade of nanofluid research was primarily focused on measuring and modeling fundamental thermophysical properties of nanofluids (thermal conductivity, density, viscosity,heat transfer coefficient). Recent research, however, explores the performance of nanofluids in a wide variety of other applications. Analyzing the available body of research to date, this article presents recent trends and future possibilities for nanofluids research and suggests which applications will see the most significant improvement from employing nanofluids.

Atomic layer deposition(ALD) is gaining attention as a thin filmdeposition method, uniquely suitable for depositing uniform and conformal films on complex three-dimensional topographies. The deposition of a film of a given material by ALD relies on the successive, separated, and self-terminating gas–solid reactions of typically two gaseous reactants. Hundreds of ALD chemistries have been found for depositing a variety of materials during the past decades, mostly for inorganic materials but lately also for organic and inorganic–organic hybrid compounds. One factor that often dictates the properties of ALDfilms in actual applications is the crystallinity of the grownfilm: Is the material amorphous or, if it is crystalline, which phase(s) is (are) present. In this thematic review, we first describe the basics of ALD, summarize the two-reactant ALD processes to grow inorganic materials developed to-date, updating the information of an earlier review on ALD [R. L. Puurunen, J. Appl. Phys. 97, 121301 (2005)], and give an overview of the status of processing ternary compounds by ALD. We then proceed to analyze the published experimental data for information on the crystallinity and phase of inorganic materials deposited by ALD from different reactants at different temperatures. The data are collected for films in their as-deposited state and tabulated for easy reference. Case studies are presented to illustrate the effect of different process parameters on crystallinity for representative materials: aluminium oxide, zirconium oxide, zinc oxide, titanium nitride, zinc zulfide, and ruthenium. Finally, we discuss the general trends in the development of film crystallinity as function of ALD process parameters. The authors hope that this review will help newcomers to ALD to familiarize themselves with the complex world of crystalline ALDfilms and, at the same time, serve for the expert as a handbook-type reference source on ALD processes and film crystallinity.

B migration in Si and Ge matrices raised a vast attention because of its influence on the production of confined, highly p-doped regions, as required by the miniaturization trend. In this scenario, the diffusion of B atoms can take place under severe conditions, often concomitant, such as very large concentration gradients, non-equilibrium point defect density, amorphous-crystalline transition, extrinsic doping level, co-doping, B clusters formation and dissolution, ultra-short high-temperature annealing. In this paper, we review a large amount of experimental work and present our current understanding of the B diffusion mechanism, disentangling concomitant effects and describing the underlying physics. Whatever the matrix, B migration in amorphous (α-) or crystalline (c-) Si, or c-Ge is revealed to be an indirect process, activated by point defects of the hosting medium. In α-Si in the 450-650 °C range, B diffusivity is 5 orders of magnitude higher than in c-Si, with a transient longer than the typical amorphous relaxation time. A quick B precipitation is also evidenced for concentrations larger than 2 × 1020 B/cm3. B migration in α-Si occurs with the creation of a metastable mobile B, jumping between adjacent sites, stimulated by dangling bonds of α-Si whose density is enhanced by B itself (larger B density causes higher B diffusivity). Similar activation energies for migration of B atoms (3.0 eV) and of dangling bonds (2.6 eV) have been extracted. In c-Si, B diffusion is largely affected by the Fermi level position, occurring through the interaction between the negatively charged substitutional B and a self-interstitial (I) in the neutral or doubly positively charged state, if under intrinsic or extrinsic (p-type doping) conditions, respectively. After charge exchanges, the migrating, uncharged BI pair is formed. Under high n-type doping conditions, B diffusion occurs also through the negatively charged BI pair, even if the migration is depressed by Coulomb pairing with n-type dopants. The interplay between B clustering and migration is also modeled, since B diffusion is greatly affected by precipitation. Small (below 1 nm) and relatively large (5-10 nm in size) BI clusters have been identified with different energy barriers for thermal dissolution (3.6 or 4.8 eV, respectively). In c-Ge, B motion is by far less evident than in c-Si, even if the migration mechanism is revealed to be similarly assisted by Is. If Is density is increased well above the equilibrium (as during ion irradiation), B diffusion occurs up to quite large extents and also at relatively low temperatures, disclosing the underlying mechanism. The lower B diffusivity and the larger activation barrier (4.65 eV, rather than 3.45 eV in c-Si) can be explained by the intrinsic shortage of Is in Ge and by their large formation energy. B diffusion can be strongly enhanced with a proper point defect engineering, as achieved with embedded GeO2 nanoclusters, causing at 650 °C a large Is supersaturation. These aspects of B diffusion are presented and discussed, modeling the key role of point defects in the two different matrices.

This paper presents an in-depth overview of the present status and novel developments in the field of plasma processing of low dielectric constant (low-k) materials developed for advanced interconnects in ULSI technology. The paper summarizes the major achievements accomplished during the last 10 years. It includes analysis of advanced experimental techniques that have been used, which are most appropriate for low-k patterning and resist strip, selection of chemistries, patterning strategies, masking materials, analytical techniques, and challenges appearing during the integration. Detailed discussions are devoted to the etch mechanisms of low-k materials and their degradation during the plasma processing. The problem of k-value degradation (plasma damage) is a key issue for the integration, and it is becoming more difficult and challenging as the dielectric constant of low-k materials scales down. Results obtained with new experimental methods, like the small gap technique and multi-beams systems with separated sources of ions, vacuum ultraviolet light, and radicals, are discussed in detail. The methods allowing reduction of plasma damage and restoration of dielectric properties of damaged low-k materials are also discussed.

Since the discovery of III-Voxidation by Dallesasse and Holonyak in 1989, significant progress has been made both technically and commercially in the use of oxides in compound semiconductor devices. Devices ranging from lasers to transistors have been fabricated that capitalize on the process-induced modification of refractive index and conductivity, allowing control of the two carriers of information in opto-electronic systems—the photon and the electron. Of particular note has been the use of oxidation for the fabrication of high-speed vertical-cavity surface-emitting lasers, which have extensive use in optical data links found in enterprise networks, data centers, and supercomputing applications. The discovery of III-Voxidation and key technical milestones in the fabrication of photonic and electronic devices that use oxidation are reviewed.

This is a review of the theoretical and applied progress made based on the Constructal law of design and evolution in nature, with emphasis on the last decade. The Constructal law is the law of physics that accounts for the natural tendency of all flow systems (animate and inanimate) to change into configurations that offer progressively greater flow access over time. The progress made with the Constructal law covers the broadest range of science, from heat and fluid flow and geophysics, to animal design, technology evolution, and social organization (economics, government). This review presents the state of this fast growing field, and draws attention to newly opened directions for original research. The Constructal law places the concepts of life, design, and evolution in physics.

The notion of using electron spins as bits for highly efficient computation coupled with non-volatile data storage has driven an intense international research effort over the past decade. Such an approach, known as spin-based electronics or spintronics, is considered to be a promising alternative to charge-based electronics in future integrated circuit technologies. Many proposed spin-based devices, such as the well-known spin-transistor, require injection of spin polarized currents from ferromagnetic layers into semiconductor channels, where the degree of injected spin polarization is crucial to the overall device performance. Several ferromagnetic Heusler alloys are predicted to be half-metallic, meaning 100% spin-polarized at the Fermi level, and hence considered to be excellent candidates for electrical spin injection. Furthermore, they exhibit high Curie temperatures and close lattice matching to III-V semiconductors. Despite their promise, Heusler alloy/semiconductor heterostructures investigated in the past decade have failed to fulfill the expectation of near perfect spin injection and in certain cases have even demonstrated inferior behavior compared to their elemental ferromagnetic counterparts. To address this problem, a slew of theoretical and experimental work has emerged studying Heusler alloy/semiconductor interface properties. Here, we review the dominant prohibitive materials challenges that have been identified, namely atomic disorder in the Heusler alloy and in-diffusion of magnetic impurities into the semiconductor, and their ensuing detrimental effects on spin injection. To mitigate these effects, we propose the incorporation of half-metallic Heusler alloys grown at high temperatures (>200 °C) along with insertion of a MgO tunnel barrier at the ferromagnet/semiconductor interface to minimize magnetic impurity in-diffusion and potentially act as a spin-filter. By considering evidence from a variety of structural, optical, and electrical studies, we hope to paint a realistic picture of the materials environment encountered by spins upon injection from Heusler alloys into semiconductors. Finally, we review several emerging device paradigms that utilize Heusler alloys as sources of spin polarized electrons.

Raman spectroscopy represents an insightful characterization tool in electronics, which comprehensively suits the technological needs for locally and quantitatively assessing crystal structures, domain textures, crystallographic misalignments, and residual stresses in piezoelectric materials and related devices. Recent improvements in data processing and instrumental screening of large sampling areas have provided Raman spectroscopic evaluations with rejuvenating effectiveness and presently give spin to increasingly wider and more sophisticated experimental explorations. However, the physics underlying the Raman effect represents an issue of deep complexity and its applicative development to non-cubic crystallographic structures can yet be considered in its infancy. This review paper revisits some applicative aspects of the physics governing Raman emission from crystalline matter, exploring the possibility of disentangling the convoluted dependences of the Raman spectrum on crystal orientation and mechanical stress. Attention is paid to the technologically important class of piezoelectric materials, for which working algorithms are explicitly worked out in order to quantitatively extract both structural and mechanical information from polarized Raman spectra. Systematic characterizations of piezoelectric materials and devices are successively presented as applications of the developed equations. The Raman response of complex crystal structures, described here according to a unified formalism, is interpreted as a means for assessing both crystallographic textures and stress-related issues in the three-dimensional space (thus preserving their vectorial and tensorial nature, respectively). Statistical descriptions of domain textures based on orientation distribution functions are also developed in order to provide a link between intrinsic single-crystal data and data collected on polycrystalline (partly textured) structures. This paper aims at providing rigorous spectroscopic foundations to Raman approaches dealing with the analyses of functional behavior and structural reliability of piezoelectric devices.

High throughput (combinatorial) materials science methodology is a relatively new research paradigm that offers the promise of rapid and efficient materials screening, optimization, and discovery. The paradigm started in the pharmaceutical industry but was rapidly adopted to accelerate materials research in a wide variety of areas. High throughput experiments are characterized by synthesis of a “library” sample that contains the materials variation of interest (typically composition), and rapid and localized measurement schemes that result in massive data sets. Because the data are collected at the same time on the same “library” sample, they can be highly uniform with respect to fixed processing parameters. This article critically reviews the literature pertaining to applications of combinatorial materials science for electronic, magnetic, optical, and energy-related materials. It is expected that high throughput methodologies will facilitate commercialization of novel materials for these critically important applications. Despite the overwhelming evidence presented in this paper that high throughput studies can effectively inform commercial practice, in our perception, it remains an underutilized research and development tool. Part of this perception may be due to the inaccessibility of proprietary industrial research and development practices, but clearly the initial cost and availability of high throughput laboratory equipment plays a role. Combinatorial materials science has traditionally been focused on materials discovery, screening, and optimization to combat the extremely high cost and long development times for new materials and their introduction into commerce. Going forward, combinatorial materials science will also be driven by other needs such as materials substitution and experimental verification of materials properties predicted by modeling and simulation, which have recently received much attention with the advent of the Materials Genome Initiative. Thus, the challenge for combinatorial methodology will be the effective coupling of synthesis, characterization and theory, and the ability to rapidly manage large amounts of data in a variety of formats.

Physical mechanisms causing the efficiency droop in InGaN/GaN blue light-emitting diodes and remedies proposed for droop mitigation are classified and reviewed. Droop mechanisms taken into consideration are Auger recombination, reduced active volume effects, carrier delocalization, and carrier leakage. The latter can in turn be promoted by polarizationcharges, inefficient hole injection, asymmetry between electron and hole densities and transport properties, lateral current crowding, quantum-well overfly by ballistic electrons, defect-related tunneling, and saturation of radiative recombination. Reviewed droop remedies include increasing the thickness or number of the quantum wells, improving the lateral current uniformity, engineering the quantum barriers (including multi-layer and graded quantum barriers), using insertion or injection layers, engineering the electron-blocking layer (EBL) (including InAlN, graded, polarization-doped, and superlattice EBL), exploiting reversed polarization (by either inverted epitaxy or N-polar growth), and growing along semi- or non-polar orientations. Numerical device simulations of a reference device are used through the paper as a proof of concept for selected mechanisms and remedies.

Nickel-silicon compounds, as most of the transition metal silicides, show peculiar thermodynamic and kinetic behaviours. The reason resides in the metastability of a rich variety of different phases, which are frequently favoured by the interaction with the substrate or by the limited amount of atoms available during the reactions (thin films). The large effort devoted to the comprehension of the phenomena governing Ni-Si interaction from the very beginning of the reaction process testifies the widespread interest in the field and it is driven by the need to push as far forward as possible the scaling down of micro/nano-electronics devices. Here, we provide a review on the crucial role of the early stages of the Ni-Si atomic interaction to show how this interaction has a huge impact on the reaction process and on the structural properties of the reaction products. The formation of a Ni-Si mixed layer at the deposition stage, its structure and its role in the further evolution of the reaction couple are discussed on [001] Si and amorphous Si substrates. Controlling the mixed layer properties becomes extremely important in a regime wherein kinetics upsets thermodynamic stability, i.e., in thin films interactions, and during low temperature and/or ultra-rapid thermal processes, as required by the scaling down of the devices. In the review, it is highlighted how the opportunity to control thickness and composition of the mixed (precursor) layer opens the field to tailor new materials possessing intriguing properties, such as the case of transrotational Ni-silicides. Compared to standard poly-Ni silicides, they offer large chemical and structural stability windows as well as a promising electrical behaviour.

Metals are known to have unique thermal, mechanical, electrical, and catalytic properties. On the other hand, metallic nanowires are promising materials for variety of applications such as transparent conductive film for photovoltaic devices, electrodes for batteries, as well as nano-reinforcement for composite materials. Whereas varieties of methods have been explored to synthesize metalnanowires with different characteristics, electrospinning has also been found to be successful for that purpose. Even though electrospinning of polymeric nanofibers is a well-established field, there are several challenges that need to be overcome to use the electrospinning technique for the fabrication of metallic nanowires. These challenges are mainly related to the multi-steps fabrication process and its relation to the structure evolution of the nanowires. In addition to reviewing the literature, this article identifies promising avenues for further research in this area with particular emphasis on the applications that nonwoven metalwires confined in a nano-scale can open.

There has been significant progress on the fundamental science and technological applications of complex oxides and multiferroics. Among complex oxide thin films, barium strontium titanate (BST) has become the material of choice for room-temperature-based voltage-tunable dielectric thin films, due to its large dielectric tunability and low microwave loss at room temperature. BST thin film varactor technology based reconfigurable radio frequency (RF)/microwave components have been demonstrated with the potential to lower the size, weight, and power needs of a future generation of communication and radar systems. Low-power multiferroicdevices have also been recently demonstrated. Strong magneto-electric coupling has also been demonstrated in different multiferroic heterostructures, which show giant voltage control of the ferromagnetic resonance frequency of more than two octaves. This manuscript reviews recent advances in the processing, and application development for the complex oxides and multiferroics, with the focus on voltage tunable RF/microwave components. The over-arching goal of this review is to provide a synopsis of the current state-of the-art of complex oxide and multiferroicthin film materials and devices, identify technical issues and technical challenges that need to be overcome for successful insertion of the technology for both military and commercial applications, and provide mitigation strategies to address these technical challenges.