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Abstract

This method provides controlled-collapse semiconductor chip contact terminals for flip-chip bonding, and reduces the number of terminals evaporation masks necessary from two to one.

Country

United States

Language

English (United States)

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One Mask Terminal Process

This method provides controlled-collapse semiconductor chip contact
terminals for flip-chip bonding, and reduces the number of terminals evaporation
masks necessary from two to one.

A metal mask 10 having openings corresponding to desired contact locations
is mounted over previously prepared semiconductor chip 12, including
conductive line 14 and insulating layer 16. The masked wafer is placed in an
evaporation chamber and a flashing of chromium-copper-gold 18 is deposited.
Subsequently, a sufficient quantity of lead 20 and tin 22 is deposited through
mask 10 to provide the controlled collapse terminal. Lead-tin evaporation
proceeds to a point, such that the final height of the metallurgy is above the
original mask height. Utilizing a single mask, as described, eliminates the
requirement of a second mask for lead-tin having a larger opening.