The BCM43465 chip supports 2.2Gbps and four concurrent MU-MIMO (multi-user, multiple input, multiple output) devices. MU-MIMO combined with 160MHz enables devices to fully utilize available bandwidth to deliver more than 2x the performance.

The new chips are further enhanced by NitroQAM technology, Broadcom's 1024-QAM modulation scheme, which gives up to a 25 percent throughput boost over 802.11ac's 256-QAM. In addition, by using a powerful Digital Signal Processing (DSP) based architecture, Broadcom's silicon can perform advanced spectrum capture, analysis and classification right on the chip without impacting performance. Broadcom's Advanced Spectrum Capture Engine (AsCE) allows the chip to identify non-Wi-Fi interference and adjust accordingly, delivering improved reliability and quality.

"We're leaving no stone unturned in our mission to drive the transition to 802.11ac across all segments and markets," said Ed Redmond, Broadcom Vice President & General Manager, Compute and Connectivity. "We intend to continue doing so by offering differentiated, comprehensive solutions that assure our OEMs have future-proof solutions that provide end users the quality, reliability and capacity they increasingly demand across high-density applications."