Webinar Video:10-Minute GDSII Tapeout Quotes

Replay of a live eSilicon webinar moderated by Dan Nenni (SemiWiki founder) where we demonstrate our GDSII quoting portal. Working with a real customer, we generate a complete, executable quotation for a production GDSII tapeout at TSMC in about 10 minutes. We also explore "what if" scenarios to optimize unit price for the program. Created: July 31, 2014, 8:00 AM PDT.

Embedded content addressable memories (CAMs) allow system designers to define various configurations to match architectural requirements to achieve the optimal performance, power and cost of the system.

This application note describes a simple way to customize eSilicon’s eFlexCAM™ memories into a register-array CAM that supports parallel compare and write operations and multiple byte-match lines, typically used in network security applications.

Broad Packaging Expertise

Packaging expertise at eSilicon covers many disciplines. We take a holistic approach to package selection, identifying the solutions best suited for a given application. The considerations made at the very beginning of a project include the following:

Signal count/type

Signal integrity

Power delivery

Isolation/crosstalk

Signal transition

Electromagnetic interface (EMI)

PCB routing options

Space requirements

Cost considerations

Thermal considerations

Volume vs. assembly source

Reliability considerations

Various FBGA Configurations

Signal Integrity Team

Our signal integrity team is not as an afterthought of the design process. Instead, signal integrity at the die, package and system levels is considered up front. Our team is a scalable extension of your own and we can either complement your own capabilities or add capabilities in complex electrical performance modeling. Rules of thumb may be a good starting point, but we do not rely on these to determine the outcome. Before a part is ever constructed, we can work with you to determine what services make the most sense for a given application and what needs to be done to overcome any performance concerns you may have.

Our team can help indentify the right approach and provide the Touchstone or Wideband SPICE models you may need for your own system work or downstream customer requirements. We can also perform simulation work at the system level for your application bring-up board including a socket, connectors, external components and the device under test.