Being a C/M service facility, I see many different types of SMT and SMT/Mixed technology assemblies. Yet this double-sided reflow process is presently causing us some disruptions. I don't want to again attempt to invent the wheel, so I'm asking for some advise or directions as to where I may find some.

| *Reply to: ericr@nj.tanon.com | | Without going into a lengthy explaination {at this time}, has anyone experimented, tested, evaluate, and/or 'perfected' an SMT double-side reflow process. Presently I'm using a Kester R593 OA (water soluble) Sn63/Pb37 -325/+500 mesh solder formula, while reflowing (tops) in Electrovert convection ovens (Omni-Flow & and 500-CLV). | | Being a C/M service facility, I see many different types of SMT and SMT/Mixed technology assemblies. Yet this double-sided reflow process is presently causing us some disruptions. I don't want to again attempt to invent the wheel, so I'm asking for some advise or directions as to where I may find some. | | Again, thanks for your assistance in this matter. | | Sincerely, | Eric R. | G'Day Eric,

Its not a problem, the technique is published in the IPC land pattern standards. Paste, place and reflow one side, turn the PCB over and repeat the operation. Just be careful not to have components which have a high weight to pad ratio on the bottom of the board during the second trip through the oven.

You will also need to have a carrier for the board (to keep the components of the mesh), we make ours out of Durapol. Have fun setting up that oven. TB