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Abstract

Described is a low-cost Integrated Circuit (IC) heatsink concept that is compatible with Direct Chip Attach (DCA) wirebonded IC's.

Country

United States

Language

English (United States)

This text was extracted from an ASCII text file.

This is the abbreviated version, containing approximately
100% of the total text.

Integrated Circuit Heatsink for Electronics on Flex Cable

Described is
a low-cost Integrated Circuit (IC) heatsink
concept that is compatible with Direct Chip Attach (DCA) wirebonded
IC's.

The exposed
surface area of the heatsink shown in the Figure
and the direct contact with the Integrated Circuit (IC) die allows
for
natural or forced air convection for heat transfer away from the IC.

The heatsink
is mounted to the top of the IC die and protrudes
through the encapsulant material. The
heatsink is held in place with
a thin layer of encapsulant to act as the bond between the heatsink
and the IC, and also by the encapsulation material surrounding the
component. The heatsink would be treated
to be electrically
non-conductive and made from material with optimum thermal
conductivity.