The first-generation Core i3 targeted to laptops, named 3xx, uses the Nehalem microarchitecture. They can use two different pinouts, BGA1288 or socket G1, and have an integrated dual-channel DDR3 memory controller supporting 800 MHz and 1,066 MHz DDR3 memories. (“UM” models support only DDR3-800 memories.) They have an integrated PCI Express 2.0 controller supporting one x16 connection, and an integrated DirectX 10 video controller running at 500 MHz with 667 MHz “boost” clock (166 MHz with 500 MHz “boost” clock in “UM” models). Communication with the motherboard chipset is achieved through a DMI bus (1 GB/s per direction, which is listed as 2.5 GT/s by Intel). These processors support two video monitors.

All Core i3 CPUs support Hyper-Threading (HT) technology, which simulates two logical processing cores in each physical core. Therefore, they are recognized by the operating system as four-core CPUs.

sSpec

Model

Clock

Cores

HT

Video

Video Clock

Video Boost

Tech.

L3 Cache

TDP (W)

Max. Temp. (°C)*

Package

SLC25

390M

2.66 GHz

2

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

35

90

G1

SLC24

390M

2.66 GHz

2

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

35

105

BGA1288

SLBZX

380M

2.53 GHz

2

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

35

90

G1

SLBSL

380UM

1.33 GHz

2

Yes

HD Graphics

166 MHz

500 MHz

32 nm

3 MiB

18

105

BGA1288

SLBUK

370M

2.40 GHz

2

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

35

90

G1

SLBU5

350M

2.26 GHz

2

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

35

90

G1

SLBU6

350M

2.26 GHz

2

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

35

105

BGA1288

SLBPK

350M

2.26 GHz

2

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

35

90

G2

SLBPL

350M

2.26 GHz

2

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

35

105

BGA1288

SLBNF

330M

2.13 GHz

2

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

35

105

BGA1288

SLBMD

330M

2.13 GHz

2

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

35

90

G1

SLBUG

330UM

1.20 GHz

2

Yes

HD Graphics

166 MHz

500 MHz

32 nm

3 MiB

18

105

BGA1288

SLBXW

330E

2.13 GHz

2

Yes

HD Graphics

500 MHz

667 MHz

32 nm

3 MiB

35

105

BGA1288

TDP stands for Thermal Design Power and indicates the CPU maximum thermal dissipation, i.e., the CPU cooler must be able to dissipate at least this amount of heat.

* The temperatures listed above are Tjunction, which is the maximum internal temperature of the CPU. On some other models, the manufacturer lists Tcase, which is the maximum external temperature of the CPU. The two are not comparable.