According
to its published roadmap, Enpirion's next milestone will be adding
copper on its Fe-Co alloy on silicon to allow 12kW per inch3.
The company says it has plans to continue shrinking packages to roughly
a quarter of the current size and increasing the kilowatts output to 50
kW per inch3 at frequencies higher than 40 mHz by layering multi-FCA and Dielectric on silicon sometime in 2016.

Well, yes, but the passive being put on chip here is ferrite core inductors, which is a big deal, as it allows very large inductors needed for reasonably low frequency switching power supplies to be integrated.

The picture above is a comparison of the "big" discrete inductors and the wafer level micro-inductors they sit on.
The announcement is about the capability to incorporate magnetic alloy with wafer processing to make such MEMS inductors possible.