The new NAND flash memory module will be available in samples for mobile equipment manufacturers in September, with mass production starting in the fourth quarter of the year. New samples of chips with 64GB capacity will be available in August.

The module stacks 16 64Gbit NAND chips fabricated using a 32-nanometer (nm) lithography process, which allowed Toshiba to fit it and a dedicated controller into a small package, 0.66-inch wide by 0.86-inch long, and only .05-in thick. The individual NAND chips are only 30 micrometers thick. A micrometer is equal to one-millionth of a meter.

Toshiba said it is the first manufacturer to successfully combine 16 64Gbit NAND chips using advanced chip thinning and layering technologies. Its line of embedded flash modules now offers capacities ranging from 2GB to 128GB.

"Demand continues to grow for large density chips that support high-resolution video and deliver enhanced storage, particularly in the area of embedded memories with a controller function that minimize development requirements and ease integration into system designs," Toshiba said in a statement.

The new memory module's controller handles essential functions, including write block management, error correction and driver software. Toshiba said it simplifies system development, allowing portable device manufacturers to minimize development costs and speed time to market for new products.

The screen was particularly good. It is bright and visible from most angles, however heat is an issue, particularly around the Windows button on the front, and on the back where the battery housing is located.

My first impression after unboxing the Q702 is that it is a nice looking unit. Styling is somewhat minimalist but very effective. The tablet part, once detached, has a nice weight, and no buttons or switches are located in awkward or intrusive positions.

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