Abstract:

A system for making electrical contact between a transmit/receive module
and a testing device for the transmission of high-frequency signals
includes a mechanically guided, frame-shaped contacting unit having a
plurality of contact elements for contacting the TR module. The
contacting unit surrounds the T/R module and is positioned relative to
the T/R module such that the contact with the T/R module is established
in one operation via the contact elements. A line substrate, which is
arranged on the contacting unit and electrically connected with it, is
constructed as a shielded triplate line by which the high-frequency
signals can be conducted to the testing device.

Claims:

1. A system for making an electrical connecting between a transmit/receive
module T/R and a testing device for the transmission of high-frequency
signals, said system comprising:a mechanically guided, frame-shaped
contacting unit having a plurality of contact elements for contacting the
TR module; anda line substrate arranged on the contacting unit and
electrically connected with it; wherein,the contacting unit surrounds the
T/R module for making said contact and is positioned relative to the T/R
module such that the contact with the T/R module is established in a
single operation by way of the contact elements; andsaid line substrate
is constructed as a shielded triplate line by which a high-frequency
signal can be conducted to the testing device.

2. The system according to claim 1, further comprising a trough configured
to receive the T/R module to be tested for rough positioning.

3. The system according to claim 1, wherein:the contact elements of the
contacting unit are constructed as spring contact pins; andduring the
contacting, said spring contact pins come in contact with metallic
contact surfaces on the line substrate and the T/R module.

4. The system according to claim 3, wherein the contact elements of the
contacting unit are surrounded by further contact elements for shielding
the high-frequency signal.

5. The system according to claim 1, wherein the high-frequency signal is
conducted via a throughplating from a module-side metallization plane to
a central metallization plane of the triplate line.

6. The system according to claim 5, wherein the throughplating for the
high-frequency signal is surrounded by throughplatings between the
module-side metallization plane and the metallization plane away from the
module, of the triplate line.

7. The system according to claim 1, further comprising additional
throughplatings between the module-side metallization plane and the
metallization plane away from the module, on both sides along the inner
conductor of the central metallization plane.

8. The system according to claim 6, wherein the throughplatings are
mutually connected between the module-side metallization plane and the
metallization plane away from the module, in the central metallization
plane by means of a metallization surface.

9. The system according to claim 2, further comprising a transition to a
shielded coplanar line at an end of the triplate line.

10. The system according claim 9, wherein the coplanar line is connected
with a coaxial connector for connecting the testing device.

11. The system according to claim 10, wherein throughplatings between the
module-side metallization plane of the triplate line and the
metallization plane away from the module, are provided on the triplate
line along the outer contour of the coaxial connector.

12. The system according to claim 1, wherein:by way of the line substrate
and additional contact pins inside the contacting unit, direct-current
signals and control signals can be transmitted between a conductor card
arranged on the line substrate and the T/R module; andsignal guidance
takes place within the module-side metallization plane of the triplate
line.

13. The system according to claim 1, further comprising a pressure plate
which presses upon the housing of the T/R module, which pressure plate
has a step-shaped construction on at least one of its edges.

[0002]The invention relates to a system for connecting a transmit/receive
(T/R) module to a testing device, particularly in the case of active
antennas in the high-frequency range.

[0003]According to the state of the art, T/R modules (which in this case
constitute a test item) can be contacted and evaluated by installation in
special testing mounts. The high-frequency connection to the tester
environment is established by coaxial connectors, and the high-frequency
connection to the test item is established by adaptors with bonded wires
and/or small bands. The supply of direct current and connection to the
control signals are effected in a similar manner. After the test has
taken place, the bonded connections are removed again, but remnants of
the connection and visible traces remain on the connecting pads of the
test items.

[0004]Alternatively, such mechanically high-expenditure (and also not
traceless or residue-free) contact with test items may be provided by
needle adapters for the low-frequency control or direct-current supply.

[0005]For this purpose, the high-frequency signals are fed via special
coaxial test probes (high-frequency probes). In this type of contact,
both the needles and the test probes leave traces (scratches) on the
connecting pad during the contacting, and such traces (scratches) could
impair further processing of the modules (installation into a system by
bonding connection). In addition, for reasons of space and
high-frequency-related demands, the connecting pads are kept very small.
Therefore, in order to ensure secure contact of the modules for the
measurement, both the test item and the test probes must be optically
aligned manually with one another using a microscope, independently of
another. Only this fairly high-expenditure approach ensures that the
individual mechanical tolerances of the test items do not disturb the
electrical characteristics of the modules. It should further be noted
that the quality of the contact has a direct effect on the quality of the
measuring results, and qualitatively high-value contacts are achieved
only by experienced operating personnel.

[0006]In this type of contacting, the respective testing probes must be
aligned individually, typically by using optical methods under a
microscope, which is very time-consuming. Furthermore, the quality of the
contacting is highly dependent on the skill of the operating personnel.

[0007]One object of the present invention, therefore, is to provide a
system for contacting T/R modules which eliminates the disadvantages of
the above-described contacting methods.

[0008]Another object of the invention is to achieve a high quality contact
that is easy to handle and can be reproduced.

[0009]These and other objects and advantages are achieved by the system
according to the invention, in which the optical alignment of the test
item is replaced by mechanically guiding and centering a frame-shaped
contacting unit on the frame of the T/R module to be tested, so that all
connections can be made in a single operation. A line substrate
(constructed as a shielded triplate line) arranged on the contacting unit
establishes the connection to the connection ports of the testing device.
The contacting unit has contact elements (for example, spring contact
pins) connecting the line substrate with the corresponding contact pads
of the T/R module.

[0010]The requirement for individual alignment of the testing probes with
the test item in order to assure secure and reliable connection to the
T/R modules, is eliminated by the contacting system according to the
invention, as is the need for viewing through a microscope.

[0011]All required contacts (i.e., in addition to the high-frequency,
low-frequency or DC signals) can be reliably and simultaneously closed in
one operation.

[0012]With the system according to invention, the quality of the contact
is largely independent of the skills of the operating personnel, thereby
ensuring that the characteristics of the test items are accurately
represented.

[0013]Another advantage of the system according to the invention is that
calibration of the test setup, for which the same contacting principle
can be used, can be carried out very simply. The calibrating elements for
this purpose have the same construction as the line substrate, and have
co-planar lines of different lengths which are mounted on a metal
carrier. The metal carrier has an outer contour that approximates the
test item, and can be inserted into the testing mount and contacted
equally as easily as the T/R modules. No additional expenditures are
required for adjusting and aligning for this purpose. Even the inserting
sequence can be predefined by the control program for the operator.

[0014]Other objects, advantages and novel features of the present
invention will become apparent from the following detailed description of
the invention when considered in conjunction with the accompanying
drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0015]FIG. 1 is a lateral view of a system according to the invention for
making contact using mechanical guidance;

[0016]FIG. 2 is a cross-sectional view of a line substrate;

[0017]FIG. 3 shows the connection of a coaxial connector at the end of the
line substrate;

[0018]FIG. 4 is a bottom view of a line substrate;

[0019]FIG. 5 is a cross-sectional view of a system according to the
invention with the contacted T/R module;

[0020]FIG. 6 shows contact elements at the transition from the T/R module
to the contacting unit; and

[0021]FIG. 7 shows contact elements at the transition from the contacting
unit to the line substrate.

DETAILED DESCRIPTION OF THE DRAWINGS

[0022]FIG. 1 is an overall view of the system according to the invention.
For mechanical preadjustment, the T/R module 1 is placed in a trough 18
in the base plate 16 of the system. The line substrate 5 with the
contacting unit 3 arranged on its underside is arranged on a movable
plate 14. The line substrate 5 and the contacting unit 3 are electrically
connected with one another via several contacts, as explained in detail
below. (For improved clarity, the contacting unit 3 is shown separately
from the line substrate 5 in FIG. 1; in actual operation, however, it is
arranged displaced upwardly in a recess of the line substrate 5, flush
with its underside, so that it would not be visible in this lateral
view.) The line substrate 5 as well as the contacting unit 3 are
constructed in the form of a rectangular frame which is open in the
interior and which is illustrated in FIGS. 2 and 3.

[0023]The movable plate 14 and the line substrate 5, with the contacting
unit 3 arranged thereon can be displaced parallel in their vertical
position by means of an upward or downward movement of the lever 10.
(During a downward movement, the pressure spring 12, must be overcome.)

[0024]For contacting the T/R module 1, which is roughly prepositioned in
the trough 18, the lever 10 is moved downward, so that the frame-shaped
contacting unit 3 moves downward and encloses the outer frame of the T/R
module 1. In this manner, it is thereby centered and unambiguously
positioned relative to the T/R module 1. (The mechanical lever device has
the play required for this purpose.) As a result, the contact elements
(here: spring contact pins) of the contacting unit 3 are simultaneously
connected with the corresponding contact elements (here: contact
surfaces) on the T/R module 1, and the contact to the T/R module 1 is
established.

[0025]FIG. 2 is a cross-sectional view of the line substrate 5, which is
constructed as a so-called shielded triplate line. The latter comprises
three parallel metallization planes E1, E2, E3 separated by two
substrates S1, S2, with the center metallization plane E2 being divided
into three separate (coplanar) individual conductors having a central
inner conductor.

[0026]Because the line substrate 5 has the shape of a rectangular frame,
it surrounds an open inside area (which may be achieved, for example, by
milling out a closed substrate). It is glued by adhesive 52 onto a
carrier plate 53 made of aluminum. The position of the contacting element
3, which is also frame-shaped, is outlined by broken lines.

[0027]Metallized throughplatings D12, D12a, D13 from the bottom side
metallization plane E1 (which is situated toward the module) to the
metallization plane E3 (which is away from the module), as well as from
the bottom side metallization plane E1 to the central metallization plane
E2, are situated within the line substrate 5. These are used for either
conducting the high-frequency signal, or for suppressing any type of
bridging by higher modes. Boreholes without metallization also contained
in FIG. 2 are used for the mechanical fastening of the parts with respect
to one another.

[0028]At one end, the line substrate 5 has a transition from the shielded
triplate line to a shielded coplanar line. For this purpose, the top
metallization plane E3, which is situated away from the module, and the
top substrate S2 were removed to the center metallization plane E2. In
this area, the connector can be mounted for connection of a coaxial line
of the testing device.

[0029]In order to suppress the excitation of higher modes, which can
propagate out along the connector flange and then farther between the
line substrate 5 and the metallic carrier plate 53, in the transition
area, a conductive adhesive foil is advantageously used as the adhesive
layer 52.

[0030]FIG. 3 is a top view of the transition area of the line substrate 5,
with a coaxial connector 55 already having been connected. The top
metallization plane E3, situated away from the module, and the substrate
S2 situated underneath were removed to the extent necessary for mounting
the connector 55. As a result, the three coplanar single conductors
(inner conductor 60, outer conductors 59, 61) of the central
metallization plane E2 are exposed in this area. The inner conductor 60
is connected with the inner conductor of the coaxial connector 55.

[0031]For suppressing higher modes along the outer contour of the coaxial
connector, throughplatings D13 are provided between the two outer
metallization planes E1, E3 of the triplate line. For the same purpose,
additional throughplatings D12a are present along the connector flange
between the bottom metallization plane E1 close to the module and the
central metallization plane E2.

[0032]For shielding the high-frequency signal, additional throughplatings
D13 are provided between the module-side E1 metallization plane and the
metallization plane E3 away from the module, on both sides along the
inner conductor 60 of the central metallization plane E2. In the
transition area, in which the top metallization plane E3 is not present,
these throughplatings which are parallel to the inner conductor connect
the bottom metallization plane E1, which is close to the module, and the
central metallization plane E2.

[0033]FIG. 4 shows the line substrate 5 from the bottom (i.e., viewed from
the T/R module). This figure illustrates the module-side metallization
plane E1 in its rectangular frame-shaped construction with an interior
opening 51.

[0034]The throughplating D12 conducts the high-frequency signal from the
T/R module to the central metallization plane E2 of the triplate line, as
will be explained in greater detail below in connection with FIG. 7.

[0035]The line structures 58 for the direct current (power supply) worked
into the metallization plane E1 and control signals are also illustrated.
These line structures comprise contact surfaces for contacting via spring
contact pins of the contacting unit. The direct-current signals and the
control signals can be conducted on this plane directly to a conductor
card (not shown) and, from there, can be transmitted by multiple-pole
connectors to the measuring instruments of the testing device.

[0036]Integration of the power supply mounted on the separate conductor
card into the line substrate has several advantages. Thus, short line
connections can be implemented, which are required for an
interference-free operation of the T/R modules. The same applies to
high-frequency connections. Short connection paths are advantageously
implemented in the construction of the line substrate and also in the
additional connecting structures for suppressing or avoiding undesired
couplings and/or resonance effects.

[0037]FIG. 5 is a cross-sectional view of the system according to the
invention with a contacted T/R module 1. The latter comprises a base
plate 13, with contact surfaces on its top side (FIG. 6), as well as a
module housing with a frame 15 and a lid 17. The module 1 is disposed in
a trough 18 made of an electrically conductive material inside the base
plate 16 of the system. The line substrate 5 and the contacting unit 3
arranged thereon surround the frame 15 of the module 1 from all four
peripheral sides (not visible in this manner in FIG. 5 because this
figure shows only one side of the arrangement). Within the contacting
unit 3, electric contact elements 31 are illustrated, which in this case
are constructed as spring contact pins that establish electrical contact
between the T/R module 1 and the line substrate 5.

[0038]By means of the system according to the invention, not only closed
modules can be measured but even open modules are also subjected to a
preliminary test. To ensure an electrically effective covering of the
open modules, a pressure plate 19 may be provided in the part of the
system that moves down from above. This pressure plate 19 presses the lid
17, which in this case rests loosely on top, onto the frame 15 of the
module 1. To suppress surface waves which propagate from the output side
of the module 1 between the contacting unit 3 of the module frame 15 and
farther on the surface of the module lid 17 as well as between the
contacting unit 3 and the module frame 15 to the input of the module 1,
the pressure plate 19 is step-shaped at least at one of its edges, as
illustrated in FIG. 5. This shape of the pressure plate 19 causes a
sufficiently high disturbance (interruption) of the described propagation
path.

[0039]FIG. 6 is a view along Line A-A of FIG. 5. The metallic coplanar
contact surfaces 80 are illustrated at the input/output of the T/R module
1. (The contact points of the spring contact pins within the contacting
unit are also marked.) The ground/signal/ground transition is established
by the three spring contact pins of the central row. To suppress waves
which propagate in the contacting unit (the latter acting as a dielectric
waveguide), additional spring contact pins for shielding the
high-frequency signal are placed in the contacting unit (in FIG. 5, the
left and the right row of contact pins) which surround the contact pins
of the central row conducting the high-frequency signal. They cause a
conducting of the high-frequency signal in the contacting unit 3 which
follows a coaxial line. As a result, the performance of the
ground/signal/ground transition from a coplanar line (T/R module) to a
triplate line (line substrate) is significantly improved (uncoupling).

[0040]FIG. 7 shows the connection geometry for the high-frequency signal
on the underside of the line substrate, and thus on the module-side
metallization plane E1 of the triplate line (view along Line B-B in FIG.
5). The contact points 31 of the spring contact pins of the contacting
unit 3 are also shown.

[0041]The high-frequency signal is conducted via the throughplating D12
(see also FIG. 2) to the central metallization plane E2 of the shielded
triplate line. In the view of FIG. 7, this throughplating is situated
behind the conductive contact surface 81 on which the contact point 31 of
a spring contact pin is located. The ring-shaped non-metallized area of
the metallization plane E1 surrounding this contact surface is shown in a
hatched manner.

[0042]The throughplating D12 for conducting the high-frequency signal is
surrounded within the line substrate 5 advantageously by additional
throughplatings D13 for electrical connection of the module-side
metallization plane and the metallization plane away from the module.
Such throughplatings D13 also exist on both sides along the inner
conductor 60 (shown by a broken line in FIG. 7) of the central
metallization plane E2. In the central metallization plane, the
throughplatings D13 are mutually connected by way of a metallization
surface 130 (shown by a broken line). Corresponding to the position of
the throughplatings D13, the metallization surface 130 surrounds the
throughplating in a circular section which continues in two linear
sections on both sides and parallel to the inner conductor 60.

[0043]These additional measures are provided for shielding and suppressing
higher modes and the undesirable propagation of fields.

[0044]The foregoing disclosure has been set forth merely to illustrate the
invention and is not intended to be limiting. Since modifications of the
disclosed embodiments incorporating the spirit and substance of the
invention may occur to persons skilled in the art, the invention should
be construed to include everything within the scope of the appended
claims and equivalents thereof.