Market leading process software technology for accurate real time control of deposition.

Process Modules:

High temperature deposition chamber up to 1000°C

Increased layer quality

Epitaxial growth

HiPIMS sputtering (highly ionised) chamber

High aspect ratio metallisation

Layer property tuning

Direct magnetron sputtering (DC, RF and pDC)

Multi-magnetron chamber (Co-sputtering)

Ebeam evaporation

RF/ICP etch, degass, cooling, alignment station

Single wafer or batch processing directly from cassette to casette

Flexible investment – scalable capacity

The Flextura PVD platform is truly almost Plug&Play and you may add process modules as your need for capacity or new processes increase. The modules function as stand alone units – see Flextura Sputter or Flextura Evaporator – which may be connected to a Flextura PVD Cluster.

The Flextura way of thinking is giving you the possibility to let the capital investment follow increasing demands of your facility.