“Turn toward the future” – IPC Apex Expo invites specialist visitors to San Diego, California from 27 February to 1st March 2018 under this banner. Rehm Thermal Systems is once again present at this electronics trade fair this year and will demonstrate its latest plant technology for reliable reflow convection and condensation soldering.

The company will present the following thermal system solutions:

The VisionXP+ convection soldering system combines many further developments, in particular with regard to optimizing energy efficiency and reducing emissions. By using this system, 20 % of energy can be saved in electronics manufacturing, consuming an average of 10 tonnes less CO2 per year. This machine is also available with a vacuum option, where condensation soldering processes is possible with or without vacuum for the first time.

The ViCON software will also be presented, which is in the area of smart data and networking, featuring a touch-screen user interface. The German machine manufacturer has developed an innovative solution for easy operability and optimal process traceability in the VisionX series. The software can, for example, monitor all values that have changed, or collect and statistically evaluate alarms in order to avoid errors and to optimize machine settings.

Reflow condensation soldering with the CondensoX series carries out the soldering process by means of hot steam and the Galden medium. Large, heavy boards can be processed without a problem since the heat transfer is up to ten times higher than with convection soldering. The use of the injection principle and the control of temperature and pressure ensure accurate and diverse reflow profiling. The company will present the CondensoXC at the trade fair. The plant is a particularly space-efficient, high-performance system in the series and ideal for laboratory applications, small batch production or prototyping. Void-free soldering can be easily implemented in all systems of the series with the vacuum option.