The EMVA Conference unites business leaders and technical experts within the machine vision industry from Europe and around the world to present and discuss the trends and challenges of this business. It provides a unique platform in Europe for networking, establishing contacts and exchanging ideas. And every year during the EMVA conference the outstanding and innovative work of a student or a young professional in the field of machine vision or image processing is honored. The event 2015 took place from June 11 to 13, 2015 in Athen, Greece.

On June 13, 2015 the EMVA Young Professional Award 2015 went to Benjamin Busam for his work on adaptable high-resolution real-time stereo tracking, at that time being external PhD Student in informatics with focus on Computer Vision at the Chair for Computer Aided Medical Procedures of the Technical University of Munich in cooperation with FRAMOS GmbH. The awardee holds a Master degree in mathematics and is currently development engineer in the imaging systems department of FRAMOS.

As part of the regular conference program he had the opportunity to present his work, an adaptable high-resolution tracking system based on stereo computer vision that can be used for real-time tracking applications which require high accuracy. Furthermore, the technological advantage lies in the ability to overcome current practical difficulties such as line of sight problems while opening the way for further developments of inside-out tracking solutions in the medical domain. The Optical Tracking System facilitates high-precision, real-time pose estimation of tools and objects with a new concept in both hard- and software which robustly operates even in case of partial object occlusion.

By this, the system is not subject to medical applications only but also generally applicable for many industrial tasks involving highly accurate robot-guidance, tool-navigation and 3D measurements as it is applied e.g. to the advanced concept for flexible machines in new additive and subtractive manufacturing processes focused on the next generation of complex 3D metal components.