And ASML, one of the world’s largest makers of equipment used in computer chip factories, says it has stopped 450mm equipment development for the time being.

“ASML has always said that 450mm introduction needs industry alignment between a number of chip makers,” Ryan Young, an ASML spokesman told the Times Union on Monday. “At the end of last year, due to an absence of such alignment, ASML paused our 450mm development program.”

Today the chip makers use 300mm wafers, but in 2011, Gov. Andrew Cuomo stunned the world announcing that he had gotten together the top five companies in the industry to push forward with 450mm manufacturing, a move that was expected to ratchet up profits since more chips could be made in less time and cost than on the smaller wafers.

Cuomo brought together Intel, Samsung, Taiwan Semiconductor, GlobalFoundries and IBM, promising them $200 million in state subsidies and a new $365 million clean room facility at the SUNY College of Nanoscale Science and Engineering in Albany to develop 450mm manufacturing lines. The group is called the Global 450 Consortium, or G450C.

Under the terms of the five-year deal, those five companies pledged $375 million, and another $450 million was going to be sought from the chip manufacturing equipment makers, companies like Tokyo Electron, ASML and Applied Materials.

However, there are now rumblings that the equipment manufacturers are balking at the idea and that some of the companies that are part of the G450C are getting nervous about moving to 450mm, which is a huge risk because of the expense.

An official in the Cuomo administration called the stories misleading and that all five members of the G450C are pushing forward with 450mm development.

Cuomo has also bet huge on the future of 450mm chip manufacturing by marketing the Marcy Nanocenter outside of Utica as a 450mm fab site. Cuomo’s $1 billion Nano Utica project at SUNY IT is located next to the Marcy Nanocenter and the two sites are expected to be symbiotic.