Prior to joining Exponent, Dr. Dong was a research assistant in Advanced Materials and Mechanics Laboratory at SUNY Binghamton, where he developed a novel bismuth-nickel (Bi-Ni) transient liquid phase (TLP) bonding as a high-temperature lead-free solder alternative with various bond-line-thicknesses (BLT) through sputtering, preform and paste methods. The microstructure including intermetallic compound development and mechanical reliability of the solder joints were analyzed after accelerated testing (thermal cycling and thermal shock) with SEM-EDS and die shear testing. Additionally, his PhD dissertation focused on polyurethane-based conformal coatings for tin whisker mitigation in terms of curing condition and adhesion properties. Dr. Dong also acquired Lean Six Sigma Green Belt certification in 2018.

CREDENTIALS & PROFESSIONAL HONORS

Ph.D., Materials Science and Engineering, State University of New York, Binghamton, 2018