Los Angeles, CA – December 15, 2016 – Qual-Pro Corporation, an industry leading electronics manufacturing service provider for high-reliability, high criticality electronics, today announced that the company’s white paper on “Optimization of Stencil Apertures to Compensate for Scooping During Printing” has been selected as one of IPC APEX EXPO 2017 Educational Programs. Gabriel Briceno Ph.D will be presenting at the “Technology’s Turning Point” technical conference. The conference will feature approximately 90 technical papers detailing original research and innovations from industry experts around the world.

“Having Gabriel Briceno Ph.D on staff has been a great benefit to our customers. Gabriel’s expertise on Solder volume has allowed us to operate our SPI equipment at much tighter tolerances. “As a result achieving higher quality rates at SMT”, said Pat Rader, Qual-Pro’s Director of Engineering. Brian Shane Qual-Pro’s CEO added “Not only do we remain focused on refining quality for our customers but also improving process for the entire industry.