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Recently, the focus of attention in the IC packaging industry has been squarely on removing costs from the manufacturing supply chain. As the economic recovery accelerates, however, advances in innovative IC package design and manufacture are likely to lead the headlines. IC integration technologies, in particular, such as wafer-level packaging design, through silicon via (TSV) technology — especially in the area of IC/memory integration — and an explosion of new developments in the area of multi-die and die stacking technologies are poised to move the industry further and faster than in recent years. This paper will review how materials suppliers have invested significant resources to deliver market-ready materials aligned with this renewed emphasis on packaging technology development.