NFC, E-PAYMENT & WIRELESS POWER TESTING

Micropross design R&D and Manufacturing test tools which characterize and test the electrical and protocol performance of products such as smart cards, smartphones and smart object in design, conformance and production

NFC, E-PAYMENT & WIRELESS POWER TESTING

Micropross design R&D and Manufacturing test tools which characterize and test the electrical and protocol performance of products such as smart cards, smartphones and smart object in design, conformance and production

NFC, E-PAYMENT & WIRELESS POWER TESTING

Micropross design R&D and Manufacturing test tools which characterize and test the electrical and protocol performance of products such as smart cards, smartphones and smart object in design, conformance and production

SWP-HCI U-SIM

(ETSI TS 102 694-2, ETSI TS 102 695-2)

Micropross proposes a test library, on top of the MP300 TC3, allowing to perform electrical and protocol test of SWP enabled U-SIM, following the requirement of the ETSI (ETSI TS 102 694-2 (SWP) and ETSI TS 102 695-2 (HCI)). This solution is validated by Global Platform.

SWP (Single Wire Protocol) is the communication protocol between the mobile handset and the UICC that enables the NFC application to reside on the U-ICC.

The HCI (Host Controller Interface) provides a logical interface on top of the SWP to support the creation of a host network and support contactless applications on the U-ICC

What we propose, is a test platform that allows to simulate a CLF, and therefore test the good behaviour of the U-SIM following the test methods defined in the ETSI specifications ETSI TS 102 694-2 (SWP) and ETSI TS 102 695-2 (HCI).

The main features of this SWP/HCI test library for U-SIM are :

Test of a U-SIM according to the standards ETSI TS 102 694-2 (SWP) and ETSI TS 102 695-2 (HCI)