Services are available to repair damage to surface mount and BGA pads, gold edge contacts, plated holes, circuit board base materials, etc. (BGA: ball grid array, a surface-mount integrated circuit package in which the die is attached to the printed circuit board with either plastic or ceramic solder balls instead of metal leads) Specialist job shops can repair damaged circuits, lands, surface mount pads, and gold edge contacts. They can repair burns and defects in the base board and mask. Services include BGA component removal, replacement and salvage; x-ray inspection; circuit pattern design changes at BGA sites; repair of lifted or missing BGA pads; and repair of solder mask at the BGA sites. Damaged or missing BGA pads are replaced by following an IPC recommended procedure. This procedure uses specially fabricated adhesive backed BGA pads that are thermally bonded to the board surface.

When your design requires changes or modifications at a BGA site, using a standard jumper wire is normally not an option. Jumper wires are simply too large to fit under a BGA component. This ingenious modification procedure uses flat copper ribbon thin enough to fit safely under the BGA component. X-ray services for BGA component and site inspection will pin point defects including solder joint shorts, opens, and voids.