tag: string stacking

In 2013, Samsung reached a major milestone in the IC industry by shipping the world’s first 3D NAND device. Now, after some delays and uncertainty, Intel, Micron, SK Hynix and the SanDisk/Toshiba duo are finally ramping up or sampling 3D NAND.
3D NAND is the long-awaited successor to today’s planar or 2D NAND, which is used in memory cards, solid-state storage drives (SSDs), USB flash dr... » read more

NAND flash memory is a key enabler in today’s systems, but it’s a difficult business. NAND suppliers require deep pockets and strong technology to survive in the competitive landscape. And going forward, vendors face new challenges on several fronts.
On one front, for example, the overall NAND market is currently in the doldrums, amid soft product prices and a mild capacity glut. Demand ... » read more