Greatek Electronics, a second-tier IC packaging and testing house, plans to expand its quad-flat packaging (QFP) and small-outline packaging (SOP) capacity this month, according to a company source.

Greatek plans to add five wire bonders, which will provide its Miaoli-based plant with a full capacity of 710 wire bonders, the firms said. Among the wire bonders, 350 sets are used for QFP and SOP services, the executive said. The plant also has 150 IC-testers.

The executive said the expansion is in line with the firm’s plan to increase sales from QFP and SOP services, which currently contribute 60-70% of the firm’s packaging revenues and generate higher margins than its low-end technologies.

Greatek’s sales are split 93:7 between its packaging and testing services.

According to the source, Greatek’s customers include Sunplus Technology, Realtek Semiconductor, MediaTek, Silicon Storage Technology (SST), Winbond Electronics and Macronix International. Its top-three customers currently account for 34% of its revenues.