Thursday, October 15, 2009

Date: * Dec.9, 2009 * collocated with o IEDM Conference (Dec.6-9 <http://www.his.com/~iedm/general/schedule.html>) o CMC Meeting (Dec.10-11<http://www.geia.org/index.asp?bid=597>)Location: * Johns Hopkins University at Homewood Campus in the ComputationalSciences and Engineering o Building (CSEB) Room CSEB 17 o free on-line registration o http://www.mos-ak.org/baltimore/register.php o General visitor information for JHU o http://webapps.jhu.edu/jhuniverse/information_about_hopkins/visitor_information/ o Map of the campus o http://www.mos-ak.org/baltimore/campus_map_0907.pdfAudience: * about 50+ (similar to http://mos-ak.org/sanfrancisco/) * 6-8 invited noted speakers presenting academia and industry o plus a poster session * panel discussion at the end of the workshop o Compact models QA validation: Still a challenge?Synopsis: * HiTech forum to discuss the frontiers of the compact/spicemodeling * MOS-AK/GSA Meetings are organized with aims to strengthen anetwork and discussion forum among experts in the field, enhance openplatform for information exchange related to compact/Spice modeling,bring people in the compact modeling field together, as well as obtainfeedback from technology developers, circuit designers, and CAD toolvendors. The topics cover all important aspects of compact modeldevelopment, implementation, deployment and standardization within themain theme - frontiers of the compact modeling for nm-scale CMOS/SOIcircuit simulation. * The specific workshop goal will be to classify the mostimportant directions for the future development of the compact modelsand to clearly identify areas that need further research. Thisworkshop is designed for device process engineers (CMOS, SOI, BiCMOS,SiGe) who are interested in device modeling; ICs designers (RF/Analog/Mixed-Signal/SoC) and those starting in that area as well as devicecharacterization, modeling and parameter extraction engineers. Thecontent will be beneficial for anyone who needs to learn what isreally behind the IC simulation in modern device models.

Publication: * The MOS-AK presentation will be available on-line after theevent * Selected papers will be recommended for further publications o Solid-State Electronics o International Journal of Numerical Modeling

Thursday, October 1, 2009

I would like to thank all MOS-AK contributors, speakers andpresenters, for sharing their compact modeling competence, R&Dexperience and delivering valuable MOS-AK presentations. I am sure,that our modeling event in Athens was beneficial to all MOS-AKWorkshop attendees and the ESSDERC/ESSCIRC conference participants. Myextra "Thank You" goes to our special guest Larry Nagel, who haskindly accepted our invitation to present vital live of the SPICE.

Organization of our modeling event would not be possible with ourgenerous sponsor: Accelicon, Helic, Tanner and Toshiba. I also wouldlike to personally acknowledge local ESSDERC/ESSCIRC organizers, inparticular Prof. Bucher for his dedication, commitment and providingsmooth logistics.

Selected MOS-AK presentations will be recommended for furtherpublication thru our Technical MOS-AK/GSA Program Promoters andindividual authors will be informed by a separate email.

I hope, we would have a next chance to meet all of you and youracademic and industrial partners at future MOS-AK/GSA modelingevents.