RoodMicrotec endeavors to support its customers through the complete “concept to final tested parts” process. Our highly experienced experts are available at all times through the process to ensure a smooth and successful project.

Engineering services, test program development

We develop test software for optimal and efficient test of semiconductor wafers and packaged devices. We also offer support for for optoelectronic semiconductors such as image sensors, photo diodes, Opto-ASICs.

Customers benefit from engineering support from qualification to volume production:

development of test concepts

development of test software and hardware

characterization

test program conversion

modification and optimisation of test solutions, e.g. test time reduction

special preparation and failure analysis on chip level (crystal structure)

Approval and analyses for various applications such as aerospace, general lighting, industry electronics, medical equipment and automotive.

Failure & Technological analysis

Failure and Technology Analysis

Failure analyses in order to clarify the failure cause as soon as possible.
From single device to the whole system – and from highly complex IC up to printed circuit board (PCB), mounting & interconnection technology and printed board assembly (PBA).