Our Taping & Reeling Services are supported by the manufacturing division of Reel Service where a range of carrier tapes are designed and manufactured from top quality, high specification base materials. Our in-house design expertise, custom tooling and material manufacturing capabilities ensure well defined, strong pocket formation including deep pocket forming.

State of the art, high-speed Tape & Reel equipment supports an annual capacity for tape & reel in excess of 200 million devices, providing users with unparalleled value chain solutions.

Specific processing requirements across the semiconductor and electronics business environment are addressed through strategic partnerships, attention to detail and transparency in information communication.

Devices can be received in a variety of formats: wafer, film frame, strip, tray, tube or loose. Semiconductors, electro-mechanical and mechanical devices ranging from legacy Pin Through Hole (PTH), Axial, Radial and Surface Mount Device (SMD) to Wafer Level CSP/Die Package can all be Taped & Reeled.