The committee also appointed Yi-Shao Lai (ASE), Curt Shannon
(SigmaTech),
and David Read (NIST) as the new leaders of the Inspection & Metrology Task
Force. The task force also discussed
creating a reference standard on test and detection protocols for metrology
tools to be used for “round-robins”.

The Thin Wafer Handling Task Force continued its discussion and
development of a Guide for Multi-Wafer
Transport and Storage Containers for Thin Wafers (#5175). Areas of focus for this activity will
include, but are not limited to: shipping containers (post de-bond),
transportation after dicing, containers that support tape frame, criteria for the
cleaning process (before as well as on mounted thin frame), and final packaging
(structure for supporting wafers).

The Bonded Wafer Stacks TF reviewed preliminary drafts of
the bonded wafer parameters (#5173)
as well as ID and marking (#5174)
specifications.

The next SEMI North America 3DS-IC committee and Task Force
meetings will be held on October 25 in conjunction with the North America
Standards Fall 2011 meetings in San Jose, California.