2.7 TIs New Space Saving Package

[MUSIC PLAYING] Hi. My name is Julie Burke, and I'm the Product Marketing Engineer for Texas Instruments' Standard Linear and Logic group. Thanks for joining me today as I tell you how micro-QFN packaging is creating enhanced design opportunities.
As electronics continue to permeate into new areas of automotive, medical, and industrial applications, packaging finds itself at the forefront of enabling new features required for growth in these markets.
The need to further customize packaging for such applications will play a much bigger role moving forward in order to enable device solutions that were previously not possible.
As handheld devices continue to require reduced package thickness, TI's micro-QFN package steps up to the challenge. Micro-QFN offers a wide array of pin and package solutions while reducing package thickness from the traditional QFN and one millimeter down to half a millimeter, as well as shrinking surface area by 40%. This size reduction is essential as demands for smaller, thinner packages continue to arise.
TI currently offers several solutions ranging from eight to 32 pins in the micro-QFN package. Similarly, TI offers a micro-SON package, which is a two-sided array for those applications requiring more space-constrained solutions.
For more information, such as size options and package drawings, visit ti.com/uqfn or engage in TI's e2e community where you can ask questions and help solve problems like these with your fellow engineers. Just visit ti.com/e2e. Thanks for watching.