Alpha WS-820 is a brand new solder paste offering the ideal arrangement of printability and reflow profile process window. This innovative product also offers outstanding cleanability in a lead free alloy solder paste. It has excellent print volume and print volume repeatability down to 12 mil, offers excellent wetting characteristics and it has high reflow yield with IPC Class II voiding performance when used to solder BGA components...

Product Information

ideal for printability and reflow profile process window, lead free with excellent cleanability