IPC and CALCE Present 7th International Symposium on Tin Whiskers Event to Feature Experts from CALCE, Lockheed Martin and Other Leading Organizations

IPC and CALCE Present 7th International Symposium on Tin Whiskers Event to Feature Experts from CALCE, Lockheed Martin and Other Leading Organizations

Oct 01, 2013

IPC — Association Connecting Electronics Industries® and its educational partner, CALCE® (Center for Advanced Life Cycle Engineering) at the University of Maryland, will host the 7th International Symposium on Tin Whiskers, November 12–13, 2013, in Costa Mesa, Calif.

The opening keynote session, “Space: The Intolerant Final Frontier,” will be presented by John Kowalchik, vice president of mission success at Lockheed Martin, after which technical presentations will deliver an in-depth look at the causes of growth, as well as risk mitigation, materials, detection and failure analysis.

Over a day-and-a-half, industry experts from CALCE, BAE Systems Platform Solutions, Celestica, Lockheed Martin, Raytheon, Rockwell Collins, Robert BOSCH GmbH, Loughborough University, Purdue University and Brown University will present leading research to detect and mitigate whisker growth.

Highlights include, “Conformal Coating Materials & Application: State of the Industry Assessment,” “Tin Whisker Risk Mitigation at a Large Defense OEM – Past, Present and Future,” “Tin Whisker Growth and Microstructure Evolution During Thermal Cycling,” and “Characterization of Nanoparticle Enhanced Conformal Coatings for Whisker Mitigation.” The collaboration between IPC and CALCE represents a first for the annual symposium. “IPC and CALCE share a common goal of helping to educate the industry on the latest information about tin whiskers theory and practice,” says Sanjay Huprikar, IPC vice president of member success. “This partnership has expanded the reach of both organizations, allowing us to develop a strong agenda with presenters who have deep knowledge of the complex technical challenges related to tin whiskers.” More information about the 7th International Symposium on Tin Whiskers, including a link to registration, is available at www.ipc.org/tin-whiskers. The symposium runs prior to the IPC Conference on Solder and Reliability on November 13-14.

This makes for three days of technical presentations that cover the full range of reliability challenges. Information about tabletop exhibits and hospitality sponsorships is available by contacting Maria Labriola, IPC manager of sales, at MariaLabriola@ipc.org or +1 847-597-2866.

IPC (www.IPC.org)is a global industry association based in Bannockburn, Ill., dedicated to the competitive excellence and financial success of its 3,300 member companies which represent all facets of the electronics industry, including design, printed board manufacturing, electronics assembly and test. As a member-driven organization and leading source for industry standards, training, market research and public policy advocacy, IPC supports programs to meet the needs of an estimated $2.0 trillion global electronics industry. IPC maintains additional offices in Taos, N.M.; Arlington, Va.; Stockholm, Sweden; Moscow, Russia; Bangalore, India; Bangkok, Thailand; and Shanghai, Shenzhen, Chengdu, Suzhou and Beijing, China.