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Abstract

Hermetically sealed and densely packed chips or modules 1 can be effectively cooled, irrespective of their mechanical relationship, if they are mounted on a flexible circuit 2. This flexible circuit is placed around a foam rubber mat 3, so that the chips are arranged on either side (Fig. 1). The package is transferred to a metal housing 4, by which mat 3 is compressed. As a result, the chips are pressed against metal housing 4 for heat discharge. The two ends of the flexible circuit are linked with a connector 5, positioned on the left hand side of metal housing 4 and serving to plug the circuitry package into a socket of another card or board. It is also possible to replace the flexible circuit loop by two flexible circuits 2a, 2b (Fig.

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United States

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English (United States)

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High Density Memory Package

Hermetically sealed and densely packed chips or modules 1 can be effectively
cooled, irrespective of their mechanical relationship, if they are mounted on a
flexible circuit 2. This flexible circuit is placed around a foam rubber mat 3, so
that the chips are arranged on either side (Fig. 1). The package is transferred to
a metal housing 4, by which mat 3 is compressed. As a result, the chips are
pressed against metal housing 4 for heat discharge. The two ends of the flexible
circuit are linked with a connector 5, positioned on the left hand side of metal
housing 4 and serving to plug the circuitry package into a socket of another card
or board. It is also possible to replace the flexible circuit loop by two flexible
circuits 2a, 2b (Fig. 2) with chips on either side of mat 3, if connectors 5a, 5b are
required on both sides of the assembly.