GaSonics Offers A3010 Photoresist Removal Chamber on PEP Platform

San Jose--Aug. 27, 1997--GaSonics International (San Jose) announced that it has made available its A3010 photoresist removal chamber on the company's Performance Enhancement Platform (PEP).

With the new tool, the PEP 3010A, customers of standalone A3010 tools can migrate to a higher-productivity platform without any new process development.

The PEP 3010A extends GaSonics' PEP product line, which also includes the PEP 3510A and 3510C systems featuring platen-based heating. Key features of the 3010A include lamp-based chamber heating, which enables rapid changes in chamber temperature, and closed-loop temperature control for precise monitoring of wafer temperature during processing. The PEP 3010A offers 15 percent higher throughput than the standalone A3010 system and improves reliability through an advanced wafer handling system and a modular design for easy maintenance. Another inherent advantage of the PEP platform is its user-friendly graphical user interface, which facilitates the tracking of wafer statistics.

The PEP 3010A is compatible with both 150 and 200 mm wafers and is available with both Standard Mechanical InterFace (SMIF) and Automatic Guide Vehicle (AGV) options.