Abstract:

A bracket is used to mount a heat sink to a printed circuit board (PCB).
The heat sink can dissipate heat for an electronic component mounted on
the PCB. Cantilevers can be detached from the bracket, and replaced by
other cantilevers with different sizes to mount a plurality of heat sinks
having different sizes.

Claims:

1. A bracket for mounting a heat sink, the bracket comprising:a support
member; anda plurality of cantilevers rotatably mounted to the support
member and radially extending from the support member, wherein an
installing element is formed on each cantilever opposite to the support
member, to mount the heat sink.

2. The bracket of claim 1, further comprising four screws and four nuts,
wherein the support member comprises four corners, four depressed
portions are defined in the four corners of the support member, a through
hole is defined in a bottom of each depressed portion, a mounting hole is
defined in a first end of each cantilever, wherein the screws pass
through the corresponding through holes of the support member and the
mounting holes of the corresponding cantilevers, to engage with the
corresponding nuts, to rotatably mount the cantilevers to the support
member.

3. The bracket of claim 2, wherein each depressed portion is substantially
square-shaped, and the first end of each cantilever is substantially
circle-shaped.

4. The bracket of claim 2, wherein the installing element is formed on a
second end opposite to the first end of each cantilever.

5. The bracket of claim 4, wherein a screw hole is defined in each
installing element, and screws are operable to pass through the heat sink
to engage in the screw holes of the corresponding installing elements.

6. A system, comprising:a printed circuit board (PCB) comprising an
electronic component mounted on a first surface of the PCB, the PCB
defining a plurality of locating holes therein around the electronic
component;a heat sink defining a plurality of assembly holes therein;a
support member attached to a second surface opposite to the first surface
of the PCB;a plurality of cantilevers each comprising a first end
rotatably mounted to the support member and a second end extending out of
the support member, wherein an installing element is formed on each
cantilever, corresponding to the plurality of assembly holes of the heat
sink; anda plurality of fastening members, wherein the plurality of
fastening members are operable to pass through the plurality of assembly
holes of the heat sink, the plurality of locating holes of the PCB, to
engage with the plurality of installing elements of the plurality of
cantilevers, respectively.

7. The system of claim 6, wherein the installing element is formed on the
second end of each cantilever.

8. A system for mounting a heat sink having a plurality of assembly holes,
the system comprising:a printed circuit board (PCB) comprising an
electronic component mounted on a first surface of the PCB, the PCB
defining a plurality of locating holes therein around the electronic
component;a support member attached to a second surface opposite to the
first surface of the PCB;a plurality of cantilevers each comprising a
first end rotatably mounted to the support member and a second end
extending out of the support member, wherein an installing element is
formed on the second end of each cantilever, and inserted into the
corresponding locating holes of the PCB; anda plurality of fastening
members, wherein the plurality of cantilevers are rotatably adjusted such
that the plurality of installing elements of the plurality of cantilevers
align with the plurality of assembly holes correspondingly, and the
plurality of fastening members pass through the plurality of assembly
holes of the heat sink, to engage with the plurality of installing
elements of the plurality of cantilevers.

9. The system of claim 8, wherein each installing element defines a screw
hole, the plurality of fastening members are a plurality of screws to
engage in the screw holes of the corresponding installing element, after
passing through the corresponding assembly holes of the heat sink.

10. The system of claim 8, wherein the plurality of cantilevers comprise
four cantilevers rotatably mounted to four corners of the support member.

11. The system of claim 10, wherein the support member comprises four
corners, a depressed portion is defined in each corner of the support
member, the depressed portion defines a through hole therein, the first
end of each cantilever defines a mounting hole corresponding to the
through hole of a corresponding depressed portion, wherein a fastener
passing through each through hole and a mounting hole of a corresponding
cantilever to rotatably mount the first end of each cantilever to the
support member.

Description:

BACKGROUND

[0001]1. Technical Field

[0002]The present disclosure relates to mounting brackets, and
particularly to a mounting bracket for mounting a heat sink to a printed
circuit board (PCB).

[0003]2. Description of Related Art

[0004]Heat generated by semiconductor components must be adequately and
timely removed to prevent increased temperature from damaging the
semiconductor components. One way for solving the heat dissipation
problem is to attach heat dissipation devices, such as heat sinks, to
PCBs, such as motherboards, on which the semiconductor components are
arranged. Generally, a bracket is used to mount a heat dissipation device
to a motherboard. Presently, different heat dissipation devices and
motherboards are used. A bracket for mounting one kind of heat
dissipation device generally does not fit for another kind of heat
dissipation device, however designing another bracket for a different
kind of heat dissipation device is time-consuming and costly.

BRIEF DESCRIPTION OF THE DRAWINGS

[0005]FIG. 1 is an exploded, isometric view of an exemplary embodiment of
a bracket for mounting a heat sink.

[0006]FIG. 2 is an assembled, isometric view of the bracket of FIG. 1.

[0007]FIG. 3 is an exploded, isometric view of the bracket of FIG. 1, a
first printed circuit board, and a first heat sink.

[0008]FIG. 4 is an assembled, isometric view of FIG. 3, but viewed from an
inverted perspective.

[0009]FIG. 5 is an isometric view of the bracket of FIG. 1, a second
printed circuit board, and a second heat sink.

[0010]FIG. 6 is an assembled, isometric view of FIG. 5.

DETAILED DESCRIPTION

[0011]Referring to FIG. 1, an exemplary embodiment of a bracket includes a
support member 20, a plurality of cantilevers 30, and a plurality of
mounting elements. The bracket is used to mount a heat sink to a printed
circuit board (PCB). The heat sink can dissipate heat for an electronic
component mounted on the PCB. Each mounting element may include a screw
40 and a nut 41.

[0012]The support member 20 is substantially square-shaped. A
substantially square-shaped depressed portion 204 is defined in a
corresponding corner of a top of the support member 20. A through hole
208 is defined in a bottom of each depressed portion 204.

[0013]Each cantilever 30 is substantially bar-shaped. A first end of each
cantilever 30 is substantially circle-shaped. A mounting hole 302 is
defined in the first end of each cantilever 30. An installing element 304
extends from a second end of each cantilever 30 opposite to the first
end. A screw hole 306 is defined in each installing element 304. In other
embodiments, each cantilever 30 can be changed to another shape according
to requirements.

[0014]Referring to FIG. 2, in assembly, the first end of each cantilever
30 is placed on the bottom of the corresponding depressed portion 204,
with the mounting hole 302 of the cantilevers 30 aligned with the through
hole 208 of the depressed portions 204. The screws 40 pass through the
corresponding through holes 208 of the support member 20, the mounting
holes 302 of the corresponding cantilevers 30, to engage with the
corresponding nuts 41, thereby mounting the cantilevers 30 to the support
member 20. Therefore, the cantilevers 30 can rotate relative to the
support member 20 around the corresponding screws 40, and the cantilevers
30 radially extend from four corners of the support member 20.

[0015]Referring to FIGS. 3 and 4, when the bracket is used to mount a
substantially square-shaped heat sink 60 to a PCB 50 defining four
locating holes 502 around an electronic component 52 mounted on a first
surface of the PCB 50, the cantilevers 30 are rotated, until the
cantilevers 30 symmetrically extend out from the support member 20. The
electronic component 52 may be a central processing unit on the PCB 50.
The bracket is attached to a second surface opposite to the first surface
of the PCB 50, with the installing elements 304 inserted into the
corresponding locating holes 502 of the PCB 50. The heat sink 60 is
attached on the electronic component 52. Fastening elements, such as
screws 70, pass through assembly holes 602 defined in four corners of the
heat sink 60, to engage in the screw holes 306 of the corresponding
cantilevers 30. Therefore, the bracket mounts the heat sink 60 to the PCB
50.

[0016]Referring to FIGS. 5 and 6, when the bracket is used to mount a
substantially rectangular-shaped heat sink 80 to a PCB 90 defining four
locating holes 902 around an electronic component 92 on the PCB 90, the
cantilevers 30 are rotated, until the installing elements 304 are aligned
with the corresponding locating holes 902 of the PCB 90. The installing
elements 304 are inserted into the corresponding locating holes 902.
Screws 70 pass through assembly holes 802 defined in four corners of the
heat sink 80, to engage in the screw holes 306 of the corresponding
cantilevers 30. Therefore, the bracket mounts the heat sink 80 to the PCB
90.

[0017]In other embodiments, when heat sink with another shape is mounted
to a PCB, while the cantilevers 30 cannot be rotated to reach locating
holes of the PCB. The cantilevers 30 can be detached from the support
member 20, and replaced by other cantilevers with different sizes and/or
shapes from the cantilevers 30, to mount the heat sink to the PCB.

[0018]It is to be understood, however, that even though numerous
characteristics and advantages of the embodiments have been set forth in
the foregoing description, together with details of the structure and
function of the embodiments, the disclosure is illustrative only, and
changes may be made in details, especially in matters of shape, size, and
arrangement of parts within the principles of the embodiments to the full
extent indicated by the broad general meaning of the terms in which the
appended claims are expressed.