The CL-2400 is designed for measurements on conductors, such as aluminum discs, and semiconductors, such as silicon wafers. Thickness is measured as the material under measurement passes through the gap formed between two opposing gap sensors.
The CL-2400 can be used for static or running thickness measurements. BCD output, RS-232C interface, and remote control inputs are provided for external control, analysis, and measurement automation. Discontinued, replaced with the CL-5610.