Semprius, Inc., a
company commercializing its novel process for printing high-performance semiconductors,
and X-FAB Semiconductor Foundries AG, the leading analog/mixed-signal semiconductor
foundry, today announced a development agreement to provide turnkey silicon
wafer fabrication for Semprius' customers. Under terms of the agreement, X-FAB
made a strategic investment of $1.5 million in Semprius and, effective immediately,
will be the designated foundry for Semprius technology.

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Semprius develops novel technology for the manufacture of advanced semiconductor
devices. This technology enables “point-of-use electronics,” greatly
broadening the options available to designers of advanced electronic devices.
For many existing designs, the technology can enable a manufacturing process
that is faster and far less expensive. It is ideal for multiple markets and
applications, including solar modules, electronic displays and wireless devices.

X-FAB is the world's leading analog/mixed-signal semiconductor foundry.
Its large portfolio of foundry technologies range from advanced modular CMOS
and BiCMOS platforms – with a broad spectrum of additional analog functions
and modular options – to specialty technologies such as MEMS, BCD and
SOI-based processes.

“The strategic relationship with X-FAB will provide our customers with
ready access to world-class semiconductor fabrication in all aspects, from a
Semprius-certified design kit to fully warranted wafer delivery,” said
Joe Carr, President and CEO of Semprius, Inc. “We are delighted to be
working with such a strong technology and service-focused partner.”

“Semprius' expertise and innovative intellectual property position
it as a key driver in the field of printed electronics,” said Hans-Juergen
Straub, CEO of X-FAB. “Its advanced technology opens a multitude of new
markets for our foundry business, and we foresee many areas of potential cooperation
with Semprius.”

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