Cooler Master announce TPC 812 Vapor Chamber CPU cooler

Cooler Master today unveils an industry first in CPU cooling, the TPC 812 CPU Cooler. With the TPC 812, air cooling performance potential reaches new heights thanks to its two vertical vapor chambers. There will be two versions, one for the US market and one for the EU market. The EU version will have a slimmer fan than the US version.

TPC 812 (US)

TPC 812XS (EU)

The Next Step The first ever CPU heatsink to utilize vertical vapor chambers and combine it with a heat pipe array, TPC 812 is prepared to handle massive heat loads generated by overclocked multi core CPUs. A 100% polished pure copper base combined with improved solder reflux techniques further increase its thermal transfer capabilities. A special heatsink fin design coupled with an improved fan mounting system and air pressure optimized fin layout all lend themselves to a collective synergy that makes the TPC 812 best even some all-in-one (AIO) liquid cooling units. The bundled fans have been tweaked for ideal noise airflow and air pressure characteristics allowing the TPC 812 to be effective yet silent.

The TPC 812XS EU features a fan which provides 17.4-58.4 CFM at 8 to 30dBA. Whilst the TPC 812 US features a fan which provides 19.17-86.15 CFM at 19-40dBA. Apart from that one difference in the fans the two are identical. Although note the US version fan makes it 1CM wider than the EU version which could prove an issue in terms of RAM clearance.