第1章 全球和台灣的IC封裝、實驗產業趨勢

中國的市場佔有率急速成長

不確實的市場成長：2015年

第2章 全球和台灣的IC封裝、實驗產業的未來

積極擴大

SiP主要技術

IC製造工廠的高端異種封裝技術開發的影響

結論

附錄

詞彙表

企業清單

目錄

Product Code: SCRPT15090801

Driven by the development of mobile devices, the worldwide IC packaging and testing industry saw a significant growth in 2014. With leadership in technology and production capacity, the Taiwanese IC packaging and testing industry has enjoyed the highest growth in the world. As the availability of wearable devices and the IoT (Internet of Things) increases, new opportunities and challenges await the Taiwanese IC packaging and testing industry. This report recaps the recent development of the worldwide and Taiwanese IC packaging and testing industry while forecasting their developments in 2015 and beyond from the aspects of market trends and industrial structure.

Enhancement in Technology and Production Capacity as Key to Stay Ahead

Appendix

Glossary of Terms

List of Companies

List of Topics

Overview of the major trends in the worldwide and Taiwanese IC packaging and testing industries, including major vendors' rankings by revenue in 2014 and market share by region from 2012 to 2015. Also provided are shipment value forecasts of the worldwide and Taiwanese IC packaging and testing industries from 2015 to 2017

Highlights of the industry's future development, touching on vendors' capacity expansion activities from 2013 to present, growing demand for SiP technology due to wearable devices and IoT, and development of high-end heterogeneous packaging technologies