Lattice Semiconductor Corporation (NASDAQ: LSCC), the leading provider of customizable smart connectivity solutions, today announced the expansion of its Lattice Snap® wireless connector product family to support broader adoption of 60 GHz wireless technology in consumer and embedded applications. The new Lattice Snap modules, based on Lattice’s production-proven SiBEAM 60 GHz technology, enable manufacturers to easily integrate short-range, high-speed 60 GHz wireless links into their products. To simplify the design process further, Lattice included the Snap modules, which are compliant with regulatory requirements in several jurisdictions, into their Snap evaluation kit for fast prototyping and time-to-market.

“We were seeking a wireless solution that was robust, easy to integrate and wouldn’t require a lot of design support,” said Ehren Achee, CTO at SecuraShot. “Lattice’s Snap modules met all of our expectations, allowing us to develop a more rugged product that can seamlessly support the transfer of data wirelessly without delay.”

The Snap modules offer 12 Gbps full-duplex bandwidth at sub-frame latencies, making this technology ideal for the replacement of physical connectors, such as USB. By eliminating the connector, the industrial designs of new products can be optimized by making them thinner, lighter, and environment-proof, all while maintaining a robust and high-speed connection. To enable faster prototyping for both existing and new customers, Lattice created the Snap Evaluation Kit, which includes the modules, system design guidelines and improved de-bug tools.

“As a leader in wireless connectivity solutions, the Lattice Snap products demonstrate our commitment to innovate products at the edge,” said Abdullah Raouf, senior manager at Lattice. “SiBEAM Snap wireless connector technology offers a unique advantage in data transfer for a variety of high volume mobile applications, such as smartphones, tablets and notebooks. The new Snap modules not only accelerate time to market, but will enable 60 GHz technology to be easily integrated into broader consumer and industrial products.”

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