The back getting hot is part of the passive cooling design of the device. The back helps the device shed heat while it is under load, which means smaller, quieter fan could be used. It is nothing to worry about.

Have there been any issues with the device case warping/bending at all due to temperatures? What have been your experiences?

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I'm pretty certain the temperature would have to be in the high hundreds before the SP3 casing becomes malleable enough to bend or warp. The SP3 will cut off waaaaaayyyy before it ever reached any dangerous temps.

Thats what I thought - has anyone had issues with bending or warping? I have seen some posts on here that seem to show this (and was blamed on heat) although I find it hard to believe that the CPU could do this.

Thats what I thought - has anyone had issues with bending or warping? I have seen some posts on here that seem to show this (and was blamed on heat) although I find it hard to believe that the CPU could do this.

The lowest possible melting point of a eutectic magnesium alloy is 342c or 648f.
The melting point of an alloy of two or more metals depends on the relative proportions of the ingredients. An eutectic mixture is the mixture at such proportions that the melting point is as low as possible.