Corial 210RL RIE etch system

Corial 210RL RIE etch system in brief

The Corial 210RL offers a flexible solution for reactive ion etching of wafer pieces, or up to full 200 mm wafers.

Designed with a vacuum load-lock, the Corial 210RL provides RIE capabilities over a variety of materials including silicon, silicon compounds, polymers, III-V and II-VI compound semiconductors, and metals.

With a small footprint, and a modular design approach supporting tiered upgrades, this etch tool is ideal for R&D centers.

Key benefits

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FLEXIBILITY

Load lock enables using a combination of fluorinated and chlorinated chemistries in the same tool

System can be upgraded from a basic RIE tool to an advanced ICP-RIE system with a vacuum load lock

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LOW COST OF OWNERSHIP

Reactor design and retractable liner increase time between cleans and reduce clean time

Upgrades

Additional gas inputs

Chamber for sputter-etch

The RIE process chamber is designed for etching and/or sputtering of thin films on any kind of substrate, up to 200 mm diameter. The reactor is equipped with a removable liner to collect etch by-products and/or sputtered materials, to increase time between cleans

ICP reactor

The ICP reactor is designed for applications requiring a high-density plasma source. The ICP source results in improved etch rates, better uniformity, selectivity, and profile control

Light tower

The signal light tower provides an easy-to-view indicator of the system’s processing status

Laser interferometry

End point detection by laser interferometry to enhance etch control through automated measurement of etch rate and etch depth