SpringSoft and TSMC Commence Joint Development of Multi-Node Process Design Kit Portfolio SpringSoft announced a multi-year technology agreement with TSMC to jointly develop and validate process design kits (PDKs) for leading-edge chip manufacturing technologies. The collaboration between the two companies is driven by customer demand for SpringSoft PDKs and their mutual support of interoperable PDKs as the long-term goal for providing custom chip designers with the ultimate in manufacturing flexibility, technology choice, and design productivity.