Description:

ABM's High Resolution Mask Aligner is a very versatile instrument with interchangeable light sources which allow Near-UV (405-365 nm) as well as Mid- and Deep-UV (254 nm, 220 nm) exposures in proximity (non-contact) or contact (soft & hard) modes. The exposure can cover an area 200 mm in diameter. The bottom-mount mask system accommodates masks up to 9 inches square and substrates from small chips to wafers up to 200 mm. The alignment tooling system also features an air-bearing substrate-to-mask planarization system for wedge-error compensation. The printing resolution is 0.8 µm for Near-UV and 0.4 µm for Mid-UV and Deep-UV in vacuum contact mode. Exposures in Mid- and Deep-UV require quartz masks.

Capabilities:

Hard or Soft Contact Modes

Any size or shape sample up to 200mm and 0.250in.

UV, Mid-UV, and DUV Exposure Modes

Split-field CCD Zoom Microscope Alignment System

Bottom-mounting Mask Holders

Results:

This material is based upon work supported by the National Science Foundation under Grant No. ECCS-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.