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Heat Transfer papers from the 2010 COMSOL Conference show solutions for Design Engineers and Researchers

Almost every manufacturing process and product design must consider the effect of thermal fluctuations. COMSOL Multiphysics Heat Transfer Module provides a combination of simulation capabilities to model heat transfer via conduction, convection, and radiation, as well as the ability to couple these to other physics. Design engineers face a number of these problems when enhancing and developing new products.

Here is a list of the latest Heat Transfer papers and presentations that were presented at the COMSOL Multiphysics Conference in the Fall of 2010 showing how many different heat transfer problems were solved using COMSOL.