The Enplate Onyx mid-phosphorus electroless nickel process from Enthone is designed to provide an optimum black appearance on complex part geometries, including electrical connector components used in the commercial and military aerospace industries...New Product AnnouncementsPublished: 9/30/2013

Boron Specialties will demonstrate its use of dimethylamine borane (DMAB) as a mild, water-soluble reducing agent in process baths for electroless deposition of metals such as copper, gold and nickel onto metals, plastics and other substrates.New Product AnnouncementsPublished: 4/16/2013

MacDermid’s NiKlad ICE Ultra is designed to combine the hardness and uniformity of electroless nickel deposits with the lubricity and anti-stick properties of polytetrafluoroethylene (PTFE). New Product AnnouncementsPublished: 8/31/2012

Columbia Chemical will display its Marquee Envy MP mid-phosphorous electroless nickel plating process, which contains no lead or cadmium, and has a fast deposition rate.New Product AnnouncementsPublished: 6/4/2012

MacDermid’s NiKlad Eclipse, on display at Sur/Fin 2011, is a process designed to consistently produce a true black electroless nickel deposit on a wide variety of substrates. New Product AnnouncementsPublished: 5/9/2011