The good old Amiga system is could be resurfacing soon. Amiga and ACK Software Controls announced that the two firms are working on two new computers, one targeting a price point of $500 and another that will be aiming to attract performance-focused users and a budget of about $1500.

Akita Elpida Memory, the DRAM backend production subsidiary of Elpida Memory, announced the development of a 1.4 mm-thick multi-chip package (MCP) with 20 stacked dies, claiming it as the world's thinnest MCP.

Seoul (Korea) – Stacking is the magic word that promises more capable and sometimes also faster multi-chip packages than what can be achieved today. Samsung claims to have developed a first “through silicon via” (TSV) DRAM stack that soon could deliver 4 GB memory modules for the mainstream market.