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With upgraded and enhanced subsystems, the IConn
PSPLUSTM machines are engineered to deliver all the capability needed for wire bonding today PLUS tomorrow. The bonders were designed with new capabilities and enhanced features focusing on five key areas: process robustness, production portability, ease of use, strong hardware performance, and upgradeability. The IConn
PSPLUSTM LA is the large area version which extends the bondable area to 87mm.

Nelson Wong, Vice President, Wire Bonding Solution Business Unit, said, “The five key areas that the IConn
PSPLUSTM focuses on have made significant hardware improvements that sync well with advanced features to enhance user experience and deliver productivity improvements. The IConn
PSPLUSTM extends the Company’s position as the market leading provider of wire bonding solutions.”

The IConn
PSPLUSTM and IConn
PSPLUSTM LA
will debut at the SEMICON China show at the Shanghai New International Expo Centre, Booth #3417, from March 18-20, 2014.

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a global leader in the design and manufacture of semiconductor and LED assembly equipment. As a pioneer in this industry, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions, adding wedge bonding and a broader range of expendable tools to its core ball bonding products. Combined with its extensive expertise in process technology, K&S is well positioned to help customers meet the challenges of assembling the next-generation semiconductor and LED devices. (
www.kns.com)

Product Features:

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