Nemotek Technologie,
a manufacturer of customized Wafer-Level Cameras for portable applications,
today announced that it has successfully completed extreme temperature testing
for its Wafer-Level Packaging (WLP) solution. Reinforcing its ability to produce
stable, robust solutions that withstand the most intense, environmental conditions,
Nemotek Technologie completed several extreme tests including moisture soak
level and temperature humidity resulting in high quality results for its low
defect WLP solutions.

By completing a series of extreme condition testing for its wafer level packaging,
Nemotek Technologie’s offerings handle all levels of environmental conditions
that a camera phone might experience during daily consumer usage. The moisture
soak level (pre-conditioning) tests focus on the functional and visual elements
of wafer-level technology, measuring the electrical performance of the WLP’s
internal circuitry as well as the external routing that was imposed during packaging.
The image quality obtained after the testing was completed emphasizes its high-standard
packaging process. Additionally, the WLP passed the steady state temperature
humidity test, high temperature storage life test and temperature cycling test
with no visual defects.

“By testing our solutions under the most extreme conditions and obtaining
superior results demonstrates to the market and our customer base that Nemotek
Technologie has a competitive advantage on portable applications,” said
Jacky Perdrigeat, CEO of Nemotek Technologie. “The tests validate our
ability to deliver world-class solutions while establishing the company as well-positioned
to drive the market for wafer-level technology.”

Nemotek Technologie recently announced the availability of its customizable
and flexible WLP solution that is designed to meet customer requests and image
sensor needs. Featuring one of the smallest and thinnest form factors on the
market today, the WLP utilizes reflow compatible materials to build the optical
elements of the camera module. The camera module is then efficiently mounted
directly to a board for camera phone or other mobile device assembly. The use
of reflow compatible materials enables customers to save costs with less components
and manual processes, ensuring a higher quality at affordable prices.