APP56/OO: Thermally-induced residual stresses in MEMS sensors

Project ID

APP56/OO

Website

Start Date

NO START DATE RECORDED

Last Updated

Thu 2007-Feb-22 14:16:38

Abstract

In the course of eutectically bonding MEMS sensors to a substrate, residual thermal stresses can be induced in the sensor. These stresses have the potential to bias sensor signals, damage encapsulation and alter the operational range of the device. Using thermo- mechanical analyses, the goal of this work is to characterize the residual stresses and seek ways to ameliorate their effects on sensor packaging and operation.