MEMS Foundry

Our Place, or Yours...

ULVAC’s foundry services feature two of ULVAC’s advanced, high density plasma, etching products. One etcher is designed for deep oxide etching for MEMS, MOEMS, Microfluidic and Photonic Applications. The second type of etcher is designed for etching III-V materials, metals and ceramics for power device, RF and piezoelectric MEMS applications. The processing facility also includes an advanced plasma ashing system, for thick resist stripping/cleaning and organic sacrificial layer removal for MEMS micro-mirrors. The facility has wet clean systems, an SEM and metrology tools; all sized for processing 100mm – 200mm wafers and glass, quartz and sapphire substrates. The ULVAC foundry enables you to accelerate device development, eliminate prototype-to-product variability and accelerate time-to-market scheduling.