An unmatched combination of performance, reliability and economy make this laser an ideal choice for cutting, drilling and marking in microelectronics fabrication and packaging. Applications include cutting flex material, chip and mold form marking, IC package trimming, as well as wafer scribing and cutting. In addition, 3D chip package manufacturing tasks such as via drilling and other processing of glass, ceramics, copper and composites are enabled. A particular advantage of the AVIA LX 355-20 is a shorter pulse width that reduces the heat-affected zone and enables higher precision processing of thinner materials.