Process for electrolytic deposition of copper

The invention can be in copper refining electrolysis, which operate for a uniform deposition with cathodic additives in the electrolyte, will be applied. The invention is based on the technical task of finding for the electrolytic refining of copper additions, which ensure smooth even at higher current densities, cathode surface and low levels of sulfur in the unincorporated Katodenkupfer.According to the invention the object is achieved in that the electrolyte solution in addition to glue or gelatin bis-(3-natriumsulfopropyl) is disulfide (SPS) was added. With the inventive method can also be produced at higher current densities very smooth cathode with extremely low S contents.