GSP 1345 Thermally Conductive Epoxy Potting Compound

GSP 1345 is a two-part, thermally conductive epoxy system. It features an easy to use 1:1 mix ratio. With virtually no settling of fillers, it is can be packaged and stored in cartridges. The system is a good candidate in potting applications where heat transfer is required. This system exhibits robust cured properties with excellent adhesion and impact resistance.