JSTD CIS and 7711/7721 CIS

IPC: Combination JSTD CIS & 7711/7721 CIS

This is a comprehensive, hands-on solder training program based on J-STD-001 and IPC 7711. The program describes materials, methods and verification criteria for producing high quality soldered interconnections. With the combined modules of the 7711 program the student gets the rework processes and procedures accepted by the industry.

The particular combination class covers the soldering and rework of through hole technology and surface mount technology. Each successful student will receive an IPC 7711 CIS and IPC JSTD-001 certificate.

All written exam grades for Modules completed will be averaged together. The minimum score for successful completion is 70%. The minimum score for each lab session is also 70%.

Upon successful completion of the course students will receive an IPC J-STD-001 Certified IPC Specialist certification and the IPC 7711 certificate good for two years.

Day 1

Introductions, Equipment Familiarizations, JSTD Mandatory Module 1

This module is an introduction and overview to the entire contents of J-STD-001 Rev. E. and is a prerequisite to any of the following four technical specific modules. Module 1 consists of lecture, review, and an open and closed book written exam.

Day 2

JSTD Module 3

This module provides requirements for though-hole technology consisting of lecture, review, and instructor demonstrations. Students must prepare and solder through hole components to a printed circuit board. Components include a variety of axial and radial leaded devices. Students must also remove components from a PCB in a non-destructive manner. Students must demonstrate proficiency in the above and also pass the end open book exam.

Day 3

JSTD Module 4

This module provides requirements for surface mount technology consisting of lecture, review, and instructor demonstrations. Components types include 1206 through 0402 chips, SOIC’s, PLCC’s, SOT’s, QFP’s, TSOP’s, etc. The students must demonstrate proficiency in various types of installations (convective and conductive) and removals and pass an open book examination.

Day 4

IPC 7711/7721 CIS Module 1 and 3

Module 1 : Common Procedures : All 7711/21 certification candidates must attend this session and pass an end of session written test (multiple choice) of 20 questions. The candidate must achieve a score of 70% or better to advance to the other modules. The session is entitled common procedures because these basic issues are common to the IPC 7711 and 7721.
The common procedures module includes information on:

Scope and Purpose or the standards

Explanation of the standard layout

Definitions of terms used in the standard

Basic considerations for any soldering process

Process goals and guidelines

Discussion of primary heating methods

Use of preheating and auxiliary heating methods

Vision System considerations (microscope basics)

Selecting the appropriate rework/repair/modification procedures

Basics of a time/temperature profile

Handling Electronic Assemblies

Electrostatic discharge and electrical overstress

ESD protective materials

ESD workstations

Discussion on cleaning assemblies

Need for baking and preheating PCB’s

Module 3: PTH Technology : This module covers the various ways to install and remove PTH type components. Students are graded on the IPC Class 3 criteria on installations of various axial and radial leaded devices using conductive applications. The student will watch the IPC video VT-41, Through Hole Rework, instructed on proper stress relief bends and the proper use of vacuum extraction hand pieces. The student will also have the opportunity to use a solder flow fountain to remove and install multi-leaded PTH devices. Lastly the student will be instructed in the workmanship standards associated with PTH configurations.

Day 5

7711 modules 4,5,6

Module 4: Chip Components: This module instructs the student on various ways to install SMT chips and MELF using both conductive and convective techniques. Students install components ranging from 1206’s down to 0402’s. Students remove components using various conductive tips and focused hot air. Appropriate workmanship standards are reviewed and students must install and remove components to the IPC Class 3 criteria. Pad re-leveling and tinning is also covered.

Module 5: SOIC and SOT’s :This module covers various procedures for the installation of small outline transistors and small outline integrated circuits utilizing both conductive and convective techniques. Students will also discuss component polarity and orientation issues associated with multi-leaded SMT devices. Surface mount land preparation is also discussed. Workmanship standards for gull wing devices are presented and the student must install and remove devices to the IPC Class 3 criteria.

Module 6: QFP and PLCC: This module covers the various procedures for installing and removing surface mount J-leaded devices (Plastic Leaded Chip Carriers) and Quad Flat Packs. Device pitch ranges from 50 mils down to 20 mils. Students will use both conductive (point-to-point and drag soldering) and convective (hot-air and solder paste) techniques. Students will also be taught various ways to remove shorts between leads of PLCC’s and QFP’s. Appropriate workmanship standards are reviewed and, again, students are graded to the IPC Class 3 criteria.

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