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Vacuum Solutions for Physical Vapor Deposition (PVD)

PVD is mainly used to generate barrier and seed layers for copper based devices, depositing mainstream materials like Tantalumnitride, Copper, Cobalt, Titanium Titaniumnitride, Aluminum and its alloys. PVD processes require high vacuum in the range of 10-5 - 10-8 mbar.

Since the processes is fairly clean, mostly standard vacuum pumps can be utilized. High vacuum is also required in transfer chambers, wafer clean and cool chambers as well as for loading and unloading of the wafers (L/L). The architecture of the PVD tools requires several high vacuum pumps from 70 - 1,500 l/s to perform the various process steps.