Workshop Focus:
The Advanced Interconnect Technologies Workshop has been organized to allow for the presentation and debate of some of the latest interconnect and processing technologies in Electronic Packaging.

Wednesday, July 14, 2010

Registration: 7:00 am - 5:00 pm

Continental Breakfast: 7:00 am - 8:00 am

Opening Remarks: 8:20 am - 8:30 am

Keynote Presentation: 8:30 am - 9:30 amFuture Interconnect Demands for Super Computing How T. Lin, Ph. D., Endicott Interconnect Technologies, Inc.Dr. Lin is a Chief Scientist in the R&D group of Endicott Interconnect Technologies, Inc. and holds a Ph. D. in electrical Engineering from Rensselaer Polytechnic Institute. He earned both MSEE and BEE in EE both from Georgia Institute of Technologies. He was with IBM MD from 1977 to 2001 where he developed large scale precisions artwork generators and high-speed PWB testers. Currently, he is the TA of company CTO at Endicott Interconnect Technologies working on developing advanced computing architectures, advanced electronic packaging technologies and optical interconnects. Dr. Lin has received three IBM Outstanding Innovation/Achievement Awards and 40 US issued Patents. He has published over 30 journal articles in the area of optical interconnects, electronic and electro optical packaging.

Session 1: 3D InterconnectSession Chair: Anwar Mohammed, Huawei Technologies 9:30 am - 12:00 pmThe next significant frontier in Semiconductor Packaging is 3D integration. It offers many promises and expectations and yet there are substantial challenges that need to be surmounted. The touted benefits include enhanced performance, lower power consumption, optimized real estate utilization, improved reliability and yields and reduced packaging and overall cost. It is also envisaged that this technology will play a leading role in board size reduction and integration which will be a salient challenge in the very near future. However, promising 3 D approaches like Through Silicon Vias (TSVs) and others will need to solve critical processing, manufacturing and supply chain issues before the technology can claim an acceptable level of maturity that can lead to mass conversions. This session will cover some of those challenges and alternative approaches to overcome them.

Powerpoint/Presentation file for CD-Rom due not later than: July 15, 2010

Powerpoint/Presentation file used during session: Speaker's responsibility to bring to session on USB and/or CD (recommended to have back-up on personal laptop or email to jmorris@imaps.org prior to event)