Alloys and Compounds for Thermoelectric and Solar Cell Applications IV

Presentation Title

Study of Diffusion Barrier for the Interfacial Reactions in Thermoelectric Materials under Current Stressing

Author(s)

, Li-Chen Lo, Po-Yin Chien

On-Site Speaker (Planned)

Abstract Scope

This study investigates the interfacial reactions between solders, Ni diffusion barrier layer and the thermoelectric materials. Both p- and n- type bismuth telluride (Bi2Te3) thermoelectric were connected to Pb-free solders with Ni diffusion barriers in between. Different current densities were applied to the samples at various temperatures. Ni layer showed good barrier properties and the interfaces remained intact after current stressing. Intermetallic compounds were formed at the interfaces. The growth kinetics of the compounds will be discussed. Peltier effect also significantly dominated the evolution of the compounds when applying high current densities.