Hammond News

The distributed intelligence capability inherent in the IoT increasingly requires small sub-systems housed in robust enclosures to be installed in the factory environment. In many IoT systems, environmental sensors, monitoring basics such as temperature, humidity and pressure are widely dispersed, and, increasingly, they are now intelligent sub-systems, with data processing and communications capability embedded on a small PCB. Our new 1551V family of miniature ventilated enclosures have been designed specifically for housing such intelligent sensors that require physical protection combined with free passage of air. While there is no international standard for physical sizes, many of the newest products from leading sensor manufacturers are designed on the PCB sizes listed below. For active components that produce relatively large amounts of waste heat, the 1551V obviously provides excellent airflow for cooling purposes.