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Abstract:

A method for packaging LED chip modules is provided. First, a first
sacrificial layer is disposed on a substrate. Afterwards, LED chips are
synchronously disposed on the first sacrificial layer before the first
sacrificial layer cures. Next, a first material, a second sacrificial
layer, and a second material are used to form a support layer on the
first sacrificial layer. The first sacrificial layer and the second
sacrificial layer are then removed, so that LED chip modules are
obtained, wherein each LED chip module has a corresponding support layer.
Furthermore, a moving fixture is provided to synchronously remove chips
from a wafer and dispose them on the sacrificial layer.

Claims:

1. A method for packaging LED chip modules, suitable for mass-producing
multiple LED chip modules, each of the LED chip modules comprising at
least one LED chip, said method for packaging comprising the steps of:
disposing a first sacrificial layer on a substrate; synchronously
disposing multiple LED chips on said first sacrificial layer before said
first sacrificial layer has been cured; forming a support layer from a
first material, a second sacrificial layer, and a second material on said
cured first sacrificial layer, wherein a module pattern is defined in
said second sacrificial layer, and said support layer comprises said
first material and said second material; and removing said first
sacrificial layer and said module pattern, so as to obtain said LED chip
modules, wherein each of said LED chip modules comprises said
corresponding support layer.

2. The method for packaging LED chip modules according to claim 1,
wherein the thickness of said first sacrificial layer is not larger than
the height of each of said LED chips in said step of disposing a first
sacrificial layer.

3. The method for packaging LED chip modules according to claim 1,
wherein, prior to said step of synchronously disposing chips, said method
for packaging further comprises the steps of: placing and arranging each
of said multiple LED chips into a corresponding accommodating location in
a carrying disc of a moving fixture; and moving said multiple LED chips
placed in said carrying disc synchronously and correspondingly.

4. The method for packaging LED chip modules according to claim 3,
wherein, in said step of arranging chips, each of said multiple LED chips
is removed chip-by-chip from a wafer attached on a blue tape and
comprising said LED chips, using vacuum suction, sticky adhesion,
magnetic adhesion, gripping or snapping, and then placed in each of said
accommodation locations, arranged in a matrix form, in said carrying
disc.

5. The method for packaging LED chip modules according to claim 3,
wherein said moving fixture comprises multiple suction tips, further
comprising the step of synchronously sucking said LED chips through
vacuum suction using said suction tips, and then placing them,
synchronously, in said carrying disc.

6. The method for packaging LED chip modules according to claim 1,
wherein, subsequent to said step of synchronously disposing chips, said
method for packaging further comprises: curing said first sacrificial
layer, so as to stick said LED chips to the substrate.

7. The method for packaging LED chip modules according to claim 1,
wherein said step of forming a support layer comprises: forming a
reflector film from said first material on said cured first sacrificial
layer; defining said module pattern on said reflector film by said second
sacrificial layer to form multiple independent and exposed regions; and
forming a base on each of said independent and exposed regions from said
second material, wherein a region of said reflector film corresponding to
each of said bases is a reflector, and said reflectors and said bases
together form said support layer.

8. The method for packaging LED chip modules according to claim 7,
wherein each of said LED chip modules comprises an optical cup
constituted by a predetermined zone of said corresponding support layer,
and a predetermined number of said LED chips located in said optical cup.

9. The method for packaging LED chip modules according to claim 1,
wherein said step of forming a support layer comprises: defining said
module pattern by said second sacrificial layer on said cured first
sacrificial layer to form multiple independent and exposed regions; and
forming a reflector and a base on each of said independent and exposed
regions from said first material and said second material in turn,
wherein said reflectors and said bases together form said support layer.

10. The method for packaging LED chip modules according to claim 9,
wherein each of said LED chip modules comprises an optical cup
constituted by a predetermined zone of said corresponding support layer,
and a predetermined number of said LED chips located in said optical cup.

11. The method for packaging LED chip modules according to claim 9,
wherein said reflector of each of said LED chip modules includes a
enclosed groove or a enclosed flange surrounding said at least one LED
chip.

12. The method for packaging LED chip modules according to claim 11,
wherein each of said LED chip modules is further synchronously subjected
to the following steps: forming an insulating layer on said enclosed
groove or said enclosed flange; forming two conductive layers on said
insulating layer; connecting each of two wires between said conductive
layer and said at least one LED chip; and forming a encapsulation on said
at least one LED chip, wherein the area formed from said encapsulation is
restricted by said enclosed groove or said enclosed flange; wherein each
of said two wires is extended towards the outside of said encapsulation
via said corresponding conductive layer.

13. The method for packaging LED chip modules according to claim 11,
wherein said second sacrificial layer further defines a sacrificial
flange, and said enclosed groove is thus formed on said reflector.

14. The method for packaging LED chip modules according to claim 11,
wherein said step of forming a support layer further includes defining a
sacrificial groove in said first sacrificial layer, and said enclosed
flange is thus formed on said reflector.

15. The method for packaging LED chip modules according to claim 1,
wherein said substrate of said at least one LED chip is provided with at
least one concave structure, into which said support layer grows.

16. The method for packaging LED chip modules according to claim 1,
wherein each of said first sacrificial layer and said second sacrificial
layer is a photoresistant layer.

17. A moving fixture, suitable for moving multiple LED chips
synchronously, said moving fixture comprising: an upper molding board
having a vacuum chamber; a lower molding board having multiple
through-holes, wherein said through-holes pass through a body of said
lower molding board and communicate with said vacuum chamber; and a
carrying disc having multiple accommodating locations, into which said
LED chips are placed, wherein said LED chips placed in said carrying disc
are adapted to be sucked synchronously by said moving fixture using
vacuum suction.

18. The fixture according to claim 17, further comprising a vacuum seal
ring, said vacuum seal ring being clamped between said upper molding
board and said lower molding board, wherein said vacuum chamber of said
upper molding board is located within the enclosing range of said vacuum
seal ring.

19. The fixture according to claim 18, wherein said vacuum chamber and a
vacuum piping are connected with each other.

20. The fixture according to claim 17, wherein said carrying disc
comprises at least one first locator.

21. The fixture according to claim 20, wherein said lower molding board
comprises at least one second locator, said second locator being
cooperated with said first locator, in such a way that said first and
second locators are positioned perpendicularly to each other.

22. The fixture according to claim 17, further comprising: multiple
suction tips corresponding and communicating with respective ones of said
through-holes extending outwardly from an external surface of the body of
said lower molding board, wherein said LED chips placed in said carrying
disc are sucked synchronously by said suction tips using vacuum suction.

23. The fixture according to claim 22, wherein said suction tips and said
accommodating locations of said carrying disc are arranged
correspondingly with each other in a matrix form.

24. An LED chip module, comprising: at least one LED chip having a
substrate and a plurality of epitaxial layers; an optical cup having a
inside bottom and an upper edge, said optical cup carrying at least one
LED chip via said inside bottom; said upper edge of said optical cup
including at least one enclosed groove or at least one enclosed flange
surrounding said at least one LED chip; at least one insulating layer
located on said enclosed groove or said enclosed flange; two conductive
layers located on said insulating layer; two wires, each connected
between said corresponding conductive layer and said at least one LED
chip; and an encapsulation structure covering said at least one LED chip,
wherein the range formed with said encapsulation structure is restricted
by said enclosed groove or said enclosed flange, and each of said two
wires extends outside of said encapsulation structure via said
corresponding conductive layer.

25. The LED chip module according to claim 24, wherein said optical cup
is provided with a reflector and a base, and said substrate of said at
least one LED chip is carried by said optical cup via said reflector.

26. The LED chip module according to claim 25, wherein said substrate of
said LED chip is provided with at least one concave structure, into which
said reflector and said base grow.

[0002] The present invention is related to a package method and related
apparatus, particularly to a method for packaging LED chip modules and
moving fixture thereof.

BACKGROUND

[0003] Nowadays, methods for packaging LED chips are substantially similar
to those for packaging general chips. FIG. 1 is a cross-section view
illustrating a conventional LED chip module.

[0004] Referring to FIG. 1, a silver glue 11 is dispensed into a
pre-produced packaging base 12 during the process of packaging an LED
chip 100. Subsequently, but before the silver glue 11 dries and cures,
individual LED chips 100 retrieved via vacuum suction from a wafer
attached to a blue tape are placed, one at a time, onto the packaging
base 12. Afterwards, the silver glue 11 is cured by means of baking, such
that the LED chip 100 is stuck on the packaging base 12 by means of the
silver glue 11, so as to obtain the LED chip module 1 as illustrated in
FIG. 1. Then, an LED light source module (not shown) is obtained by
carrying out processes, such as wire bonding, optical adhesive filling,
cutting and other conventional steps.

[0005] While the above-mentioned process is suitable for mass production
of LED chip modules, the process is burdened by several serious
drawbacks. One significant limitation is that as improvements are made
allowing LED chips 100 to become smaller, a mismatch is created between
the pre-produced packaging base 12 and the chip 100. The volume of the
pre-produced packaging base 12 is incapable of being reduced because of
the machining existing in the packaging base.

[0006] In view of the above, a novel technology for packaging LED is
provided in Taiwan Patent Application No. 096141685 to address the
above-mentioned problem. In this manner, the volume of the packaged LED
chip module may be reduced effectively, and brightness is improved at the
same time.

[0007] However, other problems remain with mass production of LEDs. One
problem occurs when LED chips are embedded, one at a time, into a
recently deposited or coated layer of "photoresist." The photoresist
layer may dry and cure before all of the LED chips are embedded into the
layer.

SUMMARY OF THE INVENTION

[0008] The present invention provides a method for packaging LED chip
modules that better facilitates their mass production.

[0009] The present invention provides a moving fixture, used in the method
for packaging LED chip modules, suitable for moving multiple chips
synchronously.

[0010] The present invention provides a method for packaging LED chip
modules, suitable for mass-producing multiple LED chip modules. Each of
the LED chip modules comprises at least one LED chip. This method for
packaging comprises: disposing a first sacrificial layer on a substrate;
synchronously disposing multiple LED chips on the first sacrificial layer
before the first sacrificial layer has been cured; forming a support
layer from a first material, a second sacrificial layer, and a second
material on the cured first sacrificial layer, wherein a module pattern
is defined in the second sacrificial layer, and the support layer
comprises the first material and the second material; and removing the
first sacrificial layer and the module pattern, so as to obtain the LED
chip modules, wherein each of the LED chip modules comprises the
corresponding support layer.

[0011] The present invention provides an LED chip module, comprising at
least one LED chip having a substrate and a plurality of epitaxial
layers; an optical cup having a inside bottom and an upper edge, the
optical cup carrying the at least one LED chip via the inside bottom; the
upper edge of the optical cup comprising at least one enclosed groove or
at least one enclosed flange surrounding the at least one LED chip; at
least one insulating layer located on the enclosed groove or enclosed
flange; two conductive layers located on the insulating layer; two wires,
each connected between the corresponding conductive layer and the at
least one LED chip; and a encapsulation structure covering the at least
one LED chip, in which the range formed with the encapsulation structure
is restricted by the enclosed groove or enclosed flange, and each of the
two wires is extended towards the outside of the encapsulation via the
corresponding conductive layer.

[0012] In one embodiment of the present invention, the thickness of the
first sacrificial layer is not larger than the height of the LED chip in
the step of disposing a first sacrificial layer.

[0013] In one embodiment of the present invention, the method for
packaging further comprises a step of arranging chips and a step of
moving chips prior to the step of synchronously disposing chips. In the
step of placing and arranging chips, each of the LED chips is placed into
a corresponding accommodating location in a carrying disc of a moving
fixture. In the step of moving chips, the multiple LED chips placed in
the carrying disc are moved synchronously and correspondingly.

[0014] In one embodiment of the present invention, in the step of
arranging chips, each of the multiple LED chips is removed chip-by-chip
from a wafer attached on a blue tape and comprising the LED chips, using
vacuum suction, sticky adhesion, magnetic adhesion, gripping or snapping,
and then placed in each of the accommodation locations, arranged in a
matrix form, in the carrying disc.

[0015] In one embodiment of the present invention, the moving fixture
comprises multiple suction tips, further comprising the step of
synchronously sucking the LED chips through vacuum suction using said
suction tips, and then placing them, synchronously, in the carrying disc.

[0016] In one embodiment of the present invention, the method for
packaging further comprises a step of sticking chips subsequent to the
step of synchronously disposing chips. In the step of sticking chips, the
first sacrificial layer is cured so as to stick the LED chips to the
substrate.

[0017] In one embodiment of the present invention, the step of forming a
support layer comprises steps as follows: forming a reflector film from
the first material on the cured first sacrificial layer, defining the
module pattern on the reflector film by the second sacrificial layer to
form multiple independent and exposed regions, forming a base on each of
the independent and exposed regions from the second material, in which a
region of the reflector film corresponding to each of the bases is a
reflector, and the reflectors and the bases together form the support
layer.

[0018] In one embodiment of the present invention, the step of forming a
support layer comprises steps as follows: defining the module pattern by
the second sacrificial layer on the cured first sacrificial layer to form
multiple independent and exposed regions, forming a reflector and a base
on each of the independent and exposed regions from the first material
and the second material in turn, in which the reflectors and the bases
together form the support layer.

[0019] In one embodiment of the present invention, each of the LED chip
modules comprises an optical cup constituted by a predetermined zone of a
corresponding support layer, and a predetermined number of LED chips
located in the optical cup.

[0020] In one embodiment of the present invention, each of the first
sacrificial layer and the second sacrificial layer is a photoresistant
layer.

[0021] The present invention provides a moving fixture, suitable for
moving multiple LED chips synchronously. The moving fixture comprises an
upper molding board, a lower molding board, and a carrying disc. The
upper molding board is provided with a vacuum chamber. The lower molding
board is provided with multiple through-holes. The through-holes pass
through a body of the lower molding board and communicate with the vacuum
chamber. The carrying disc is provided with multiple accommodating
locations, into which the LED chips are placed. In this connection, the
LED chips placed in the carrying disc are adapted to be sucked
synchronously by the moving fixture using vacuum suction.

[0022] In one embodiment of the present invention, the moving fixture
further comprises a vacuum seal ring. The vacuum seal ring is clamped
between the upper molding board and the lower molding board, in which the
vacuum chamber of the upper molding board is located within the enclosing
range of the vacuum seal ring.

[0023] In one embodiment of the present invention, the vacuum chamber and
a vacuum piping are connected with each other.

[0024] In one embodiment of the present invention, the carrying disc
comprises at least one first locator.

[0025] In one embodiment of the present invention, the lower molding board
comprises at least one second locator. The second locator is cooperated
with the first locator, in such a way that the first and second locators
are positioned perpendicularly to each other.

[0026] In one embodiment of the present invention, the moving fixture
further comprises multiple suction tips. The suction tips are
corresponding and communicating with respective ones of the through-holes
extending outwardly from an external surface of the body of the lower
molding board. Here, the LED chips placed in the carrying disc are sucked
synchronously by the suction tips using vacuum suction.

[0027] In one embodiment of the present invention, the suction tips and
accommodating locations of the carrying disc are arranged correspondingly
with each other in a matrix form.

[0028] Based on the above, in the embodiments of the present invention, a
special fixture is used to position chips all at once, so as to eliminate
the problem of incapability of actual mass-production resulted from only
positioning chips chip-by-chip being allowed presently.

[0029] For better understanding of above-mentioned features and
advantages, the present invention will be described by specific
embodiments in conjunction with accompanying drawings in detail as
follows.

BRIEF DESCRIPTION OF DRAWINGS

[0030]FIG. 1 is a cross-section view illustrating a conventional LED chip
module.

[0031]FIG. 2 is a flow chart of a method for packaging mass-produced LED
chip modules according to one embodiment of the present invention.

[0032]FIG. 3 is a top diagram of the LED chip module produced by the
method for packaging mass-produced LED chip modules illustrated in FIG.
2.

[0034]FIG. 5 shows the step of disposing photoresist of the method for
packaging mass-produced LED chip modules according to one embodiment of
the present invention.

[0035]FIG. 6 shows the step of arranging chips of the method for
packaging mass-produced LED chip modules according to one embodiment of
the present invention.

[0036]FIG. 7 shows the step of sucking chips by a fixture of the method
for packaging mass-produced LED chip modules according to one embodiment
of the present invention.

[0037]FIG. 8 shows the structure of fixture used in carrying out the step
of sucking chips by a fixture

[0038]FIG. 9 shows the step of synchronously disposing chips of the
method for packaging mass-produced LED chip modules according to one
embodiment of the present invention.

[0039]FIG. 10 shows the step of forming a support layer of the method for
packaging mass-produced LED chip modules according to one embodiment of
the present invention.

[0040]FIG. 11 shows the step of forming a support layer of the method for
packaging mass-produced LED chip modules according to another embodiment
of the present invention.

[0041]FIG. 12 shows the step of forming a enclosed groove of the method
for packaging mass-produced LED chip modules according to one embodiment
of the present invention.

[0042]FIG. 13 shows the step of forming a enclosed flange of the method
for packaging mass-produced LED chip modules according to one embodiment
of the present invention.

[0043]FIG. 14 shows the step of encapsulation of the method for packaging
mass-produced LED chip modules according to one embodiment of the present
invention.

[0044]FIG. 15 shows the step of encapsulation of the method for packaging
mass-produced LED chip modules according to another embodiment of the
present invention.

[0045]FIG. 16 shows one embodiment of the present invention, using a
substrate having at least one concave structure.

DETAILED DESCRIPTION OF THE INVENTION

[0046] In the exemplified embodiments of the present invention, a method
for packaging mass-produced LED chip modules, used for mass-producing the
LED chip modules including optical cups in practice, is provided. In this
connection, the method for packaging mass-produced LED chip modules
comprises steps of disposing sacrificial layer, arranging chips, sucking
chips by a fixture, synchronously disposing chips, sticking chips,
forming a support layer, and removing sacrificial layer for obtaining
finished product, so as to mass-produce the LED chip modules.

[0047] In the step of disposing sacrificial layer, a layer of first
photoresist (i.e., a first sacrificial layer), having a thickness not
larger than the height of the LED chip, is disposed onto a temporary
substrate.

[0048] In the step of arranging chips, each of the LED chips is removed
from a blue tape chip-by-chip by means of vacuum suction, sticky
adhesion, magnetic adhesion, gripping or snapping, when a wafer is
attached to the blue tape and cut into multiple LED chips. It is followed
by placing each of the removed LED chips, in turn, into each
accommodating location of a carrying disc having accommodating locations
in a matrix form.

[0049] In the step of sucking chips by a fixture, a fixture having
numerous suction tips is used to suck the numerous LED chips located in
the carrying disc via the suction tips one-to-one at the same time in a
way of vacuum suction.

[0050] In the step of synchronously disposing chips, the fixture is moved
to press the sucked numerous LED chips all at once into the first
photoresist at the same time, before the first photoresist is not cured
yet, in such a way that the first photoresist may be formed as a
continuously smooth concave pattern towards the temporary substrate, from
the contact area with each of the LED chips, due to surface tension.

[0051] In the step of sticking chips, the first photoresist formed with
numerous concave arc patterns is cured, so as to stick the LED chips.

[0052] In the step of forming a support layer, a support layer is formed
on the cured first photoresist, and a module pattern, over the
predetermined number of the LED chips, is defined in cooperation with the
second photoresist (i.e., a second sacrificial layer), so as to obtain
the numerous LED chip modules, connected to the temporary substrate by
means of the first photoresist, respectively, in which each of the LED
chip modules is provided with an optical cup constituted by a
predetermined zone of the support layer, and a predetermined number of
the LED chips located in the optical cup.

[0053] In the step of removing sacrificial layer for obtaining finished
products, the first photoresist and the module pattern are removed, in
such a way that the temporary substrate and the LED chip modules are
separated, for obtaining the numerous LED chip modules.

[0054] In the exemplified embodiments of the present invention, the effect
consists in: mass-producing the LED chip modules including the optical
cups in seven steps in cooperation with the fixture in practice.

[0055] In the following description, similar elements indicated by the
same number. The description of each embodiment is used for illustrating
the specific embodiment capable of being embodied by the present
invention with reference to accompanying drawings. The terms for
direction, such as "upper", "lower", "front", "rear", "left", "right",
and etc., for example, mentioned in the present invention is only the
direction with reference to the accompanying drawings. Therefore, these
terms for direction are used for describing, not for restricting the
present invention.

[0056]FIG. 2 is a flow chart of a method for packaging mass-produced LED
chip modules according to one embodiment of the present invention. In
this embodiment, referring to FIG. 2, the method for packaging
mass-produced LED chip modules comprises seven processes including steps
of disposing sacrificial layer 31, arranging chips 32, sucking chips by a
fixture 33, synchronously disposing chips 34, sticking chips 35, forming
a support layer 36, and removing sacrificial layer for obtaining finished
products 37. Then, an LED chip module 4, as shown in FIGS. 3 and 4 may be
mass-produced in practice.

[0057]FIG. 3 is a top diagram of the LED chip module produced by the
method for packaging mass-produced LED chip modules illustrated in FIG.
2. Moreover, FIG. 4 is a diagram showing the section along V-V in FIG. 3.

[0058] In this embodiment, referring to FIGS. 3 and 4, the LED chip module
4 comprises an optical cup 41, and an LED chip 100 located in the optical
cup 41. In this connection, the optical cup 41 is provided with a
reflector 411, constituted by a material of high reflectivity (i.e., a
first material), for reflecting light, and a base 412, constituted by a
material of high thermal conductivity (i.e., a second material), for heat
dissipation. Moreover, the LED chip 100 is a general mass-produced LED
chip having a structure widely known to those skilled in this art and
should not be detailed herein. The LED chip module 4 should be subjected
to processes, such as wire bonding, optical adhesive filling, and etc.,
successively to form an LED light source module capable of radiating
light when electric power is provided. These subsequent processes are not
related to the present invention essentially, and then should not be
described further herein.

[0059] Exemplified embodiments of the method for packaging mass-produced
LED chip modules illustrated below will be more clear when they are read
in conjunction with the above-mentioned description of the LED chip
module 4.

[0060]FIG. 5 shows the step of disposing photoresist of the method for
packaging mass-produced LED chip modules according to one embodiment of
the present invention. In the present invention, referring to FIGS. 2 and
5, the step of disposing photoresist 31 is carried out firstly to coat a
layer of first photoresist 62, having a thickness not larger than the
height of the LED chip 100, onto a temporary substrate 61.

[0061] At this time, the steps of arranging chips 32 and sucking chips by
a fixture 33 are carried out synchronously.

[0062]FIG. 6 shows the step of arranging chips of the method for
packaging mass-produced LED chip modules according to one embodiment of
the present invention. In the present invention, referring to FIGS. 2 and
6, the step of arranging chips 32 is carried out to remove each of the
LED chips 100 from a blue tape 63 chip-by-chip by means of vacuum
suction, sticky adhesion, magnetic adhesion, gripping or snapping, when a
wafer 200 is attached to the blue tape 63 and cut into multiple LED chips
100. It is followed by placing each of the removed LED chips 100, in
turn, into each accommodating location 641 of a carrying disc 64 having
accommodating locations 641 in a matrix form. In the present invention,
the carrying disc 64 is provided, for example, with a plurality of first
locators 642, used for positioning.

[0063]FIG. 7 shows the step of sucking chips by a fixture of the method
for packaging mass-produced LED chip modules according to one embodiment
of the present invention. FIG. 8 shows the structure of fixture used for
carrying out the step of sucking chips by a fixture. In this embodiment,
referring to FIGS. 2, 7 and 8, the step of sucking chips by a fixture 33
is then carried out. In this connection, a fixture 65 having numerous
suction tips 651 (and a one-to-one correspondence with the LED chips 100)
is used to suck the numerous LED chips 100 located in the carrying disc
64 via the suction tips 651 at the same time using vacuum suction. In
this case, the fixture 65 comprises, for example, an upper molding board
652 and a lower molding board 653 matching each other, as well as a
vacuum seal ring 654 clamped between the upper and lower molding boards
652 and 653.

[0064] In this embodiment, the upper molding board 652 is provided with a
passing vacuum chamber 655 connectable to the vacuum piping (not shown)
in the production line and located within the enclosing range of the
vacuum seal ring 654. The lower molding board 653 is further provided
with numerous through-holes 656 passing through the board body and
communicated with the vacuum chamber 655. Moreover, the suction tips 651
are in communication with respective and corresponding through-holes 656,
projecting and extending downwardly from the lower external surface of
the board body.

[0065] In addition, the lower molding board 653 of the fixture 65 is
provided with a plurality of second locators 657 matched and positioned
perpendicularly to the first locators 642. Thereby, the fixture 65 is
allowed to suck each of the LED chips 100 in the carrying disc 64
precisely by means of each of the corresponding suction tips 651, when
its second locators 657 are positioned perpendicularly to the first
locators 642 of the carrying disc 64.

[0066]FIG. 9 shows the step of synchronously disposing chips of the
method for packaging mass-produced LED chip modules according to one
embodiment of the present invention. In this embodiment, referring to
FIGS. 2 and 9, the step of synchronously disposing chips 34 is then
carried out. The fixture 65 is moved to press the sucked numerous LED
chips 100 into the first photoresist 62 at the same time, before the
first photoresist 62 is cured, in such a way that the first photoresist
62 is formed as a continuously smooth concave pattern towards the
temporary substrate 61, from the contact area with each of the LED chips
100, due to surface tension.

[0067] Afterwards, a step of sticking chips 35 is carried out, and the
first photoresist 61 formed with numerous concave arc patterns is thus
cured. In the step of sticking chips 35, the first photoresist 61 is
cured by means of baking, for example.

[0068]FIG. 10 shows the step of forming a support layer of the method for
packaging mass-produced LED chip modules according to one embodiment of
the present invention. In this embodiment, referring to FIGS. 2, 4 and
10, the step of forming a support layer 36 is then carried out, so as to
form a support layer 66 on the cured first photoresist 62, and define a
module pattern 68, over the predetermined number of the LED chips 100, in
cooperation with the second photoresist 67. Then, the numerous LED chip
modules 4, connected to the temporary substrate 61 by means of the first
photoresist 62, respectively, are obtained. In this connection, each of
the LED chip modules 4 is provided with the optical cup 41 constituted by
a predetermined zone of the support layer 66, and the LED chip 100
located in the optical cup 41.

[0069] In the step of forming a support layer 36, in more detail, the
cured first photoresist 62 is firstly plated thereon with a material
having high reflectivity to form a reflector film 661. On the reflector
film 661, subsequently, there is disposed with the liquid second
photoresist 67. Afterwards, the second photoresist 67 is defined as the
module pattern 68 by means of lithography process. At this time, the
surface of a reflector film 661 is formed with numerous independent and
exposed regions by means of the module pattern 68. Subsequently, the
surface of the reflector film 661 is further thickened to form numerous
bases 412 by means of a material of high thermal conductivity (for
instance, copper). In this case, a region of the reflector film 661
corresponded by each of the bases is just a reflector 411. In this
embodiment, the support layer 66 is constituted by the reflector 411 and
the base 412, for example, so as to obtain the multiple LED chip modules
4, connected with the first photoresist 62 and temporary substrate 61,
respectively.

[0070]FIG. 11 shows the step of forming a support layer of the method for
packaging mass-produced LED chip modules according to another embodiment
of the present invention. Referring to FIGS. 2, 4 and 11, the step of
forming a support layer in this embodiment and that shown in FIG. 10 are
similar, with the difference therebetween as follows.

[0071] In the step of forming a support layer 36 of this embodiment, the
cured first photoresist 62 is firstly disposed with the liquid second
photoresist 67, and this second photoresist 67 is then defined as the
module pattern 68 by means of lithography process, to form multiple
independent and exposed regions. In each of these independent and exposed
regions, afterwards, the reflector 411 and the base 412 are formed from
the material of high reflectivity and the material of high thermal
conductivity in turn, in which the reflector 411 and the base 412 form
the support layer 66 together.

[0072] Subsequently, referring to FIGS. 2, 3 and 4, a step of removing
sacrificial layer for obtaining finished products 37 is finally carried
out to remove the first photoresist 62 and the module pattern 68, in such
a way that the temporary substrate 61 and the LED chip modules 4 are
separated, for obtaining the numerous LED chip modules 4.

[0073] The processes, including wire bonding, encapsulation, etc., may be
carried out before or after the step of removing sacrificial layer for
obtaining finished products 37. An overflow of adhesive may occur,
however, because the packaging adhesive often flows along the wire used
for wire bonding due to surface tension, in such a way that the shape of
encapsulation is changed after encapsulation, leading to a reduced light
extraction efficiency. Therefore, the present invention provides another
embodiment, as illustrated in FIG. 12. A sacrificial flange 69 may be
further defined in the second photoresist 67 by means of lithography
process, and an enclosed groove 70 may be then formed on the reflector
411 due to the sacrificial flange 69, in which the enclosed groove 70
surrounds at least one of the LED chips 100.

[0074] In the above-mentioned step of forming a support layer 36 of the
present invention, it is also possible to define the photoresist 67 as
the module pattern 68, followed by defining a sacrificial groove 71 in
the first photoresist 62 by means of lithography process, as illustrated
in FIG. 13. Afterwards, the reflector 411 may be then formed with an
enclosed flange 72, surrounding at least one of the LED chips 100, due to
the sacrificial groove 71.

[0075] After the above-mentioned process is completed, referring to FIGS.
14 and 15, each of the LED chip modules 4 is further synchronously
subjected to steps as follows: firstly, forming an insulating layer 74 on
the enclosed groove 70 or the enclosed flange 72; afterwards, forming two
conductive layers 76 on the insulating layer 74, and then connecting each
of two wires 78 between the corresponding conductive layer 76 and at
least one of the LEDs 100; finally, forming a encapsulation 80 on at
least one of the LEDs 100, in which the area formed from the
encapsulation 80 may be restricted by the enclosed groove 70 or the
enclosed flange 72, for avoiding the occurrence of overflow of adhesive.
Moreover, each of the two wires 78 is extended towards the outside of the
encapsulation 80 via the corresponding conductive layer 76, so as to
connect to external circuits, or electrically connect to other LED chip
modules.

[0076] It should be stated that, when the first photoresist 62 and the
module pattern 68 are removed during the step of removing sacrificial
layer for obtaining finished products 37, the local structure of the
reflector film 661 covered by the module pattern 68 is etched to be
removed directly due to extreme thinness of the reflector, so as to
obtain the numerous independent LED chip modules 4.

[0077] It should be stated, additionally, one LED chip 100 in one optical
cup 41 is described in all of the exemplified embodiments of the present
invention. However, it is known to those having ordinary skill in the art
that a plurality of LED chips 100 in one optical cup 41 is achieved, only
the change in pattern is required for defining the second photoresist 67
as the module pattern 68. This is only a simple design of pattern change,
and thus should not be detailed herein.

[0078] Furthermore, as illustrated in FIG. 16, a substrate 102 of the at
least one LED chip 100 may be further formed with at least one concave
structure 82, into which the support layer 66 grows possibly,
facilitating the enlargement of the contact area between the support
layer 66 and the substrate 102. Thereby, the enhancement of heat
dissipation, and more stable connection between the support layer 66 and
the substrate 102 of the LED chip 100 are thus obtained.

[0079] In one embodiment of the present embodiment, there is provided an
LED chip module, comprising at least one LED chip 100 having a substrate
and a plurality of epitaxial layers; an optical cup 41 having a inside
bottom and an upper edge, the optical cup 41 carrying at least one LED
chip 100 via the inside bottom; the upper edge of the optical cup 41
comprising at least one enclosed groove 70 or at least one enclosed
flange 72 surrounding the at least one LED chip 100; at least one
insulating layer 74 located on the enclosed groove 70 or the enclosed
flange 72; two conductive layers 76 located on the insulating layer 74;
two wires 78, each connected between the corresponding conductive layer
76 and the at least one LED chip 100; and a encapsulation structure
covering the at least one LED chip 100, in which the range formed with
the encapsulation structure is restricted by the enclosed groove 70 or
the enclosed flange 72, and each of the two wires 78 is extended towards
the outside of the encapsulation structure via the corresponding
conductive layer 76.

[0080] In one example of the present embodiment, the optical cup 41 is
provided with a reflector 411 and a support layer 66, in which the
substrate of at least one LED chip 100 is carried by the optical cup 41
via the reflector 411.

[0081] In another example of the present invention, the substrate of the
LED chip 100 is provided with at least one concave structure 82, into
which the reflector 411 and the support layer 66 grow.

[0082] To sum up, in the embodiments of the present invention, a special
fixture is used to position chips all at once, for the elimination of the
current problem of incapability of actual mass-production resulted from
only positioning all chips chip-by-chip. Additionally, in the embodiments
of the present invention, the volume of the packaged LED chip module may
be reduced effectively, and brightness is improved at the same time.

[0083] Although the present invention has been disclosed by embodiments as
above, the present invention is not thus restricted. A few of variations
and modifications are possible for those having ordinary skill in the art
without departing from the spirit and scope of the invention. Thus, the
scope of the present invention should depend upon what the appended
claims define.