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Antistatic Label Solutions for PCB Applications

Monday, September 29, 2014

Today, electronic device manufacturers face device failures that can be caused by an electrostatic discharge (ESD) event at the circuit board level. ESD damage affects production yield, product reliability and profitability. As electronic devices become smaller and more complex the more sensitive to ESD they become.

Polyonics antistatic label materials, XF-781 (1 mil) and XF-782 (2 mil) were designed to address two major ESD concerns that standard labels can present. First, they reduce the charge generated when the label is removed from the liner that can discharge and destroy sensitive components during application.

Polyonics antistatic label materials provide peel voltages of less than 100 volts. This significantly reduces the electro-static charge generated when the label is removed from the liner (known as tribo-charging ) that can discharge and destroy sensitive components during label application.

Second, after the label has been applied and during the label life these materials are designed to prevent significant charge build-up on the label surface which can result in a static discharge event.

With a label surface resistance between 1.0 x 108 and 1.0 x 1011 Ohms these labels are in the dissipative range. This means after the label has been applied and during the label life, the label is designed to prevent significant charge build up on the label surface (Induction) which could later result in a static discharge event at the board level.

Applications for antistatic materials include:

Identification of static sensitive PCB's

Tracking of static sensitive electronic components

Static sensitve ESD packaging

Static sensitive warranty labeling

Polyonics antistatic labels use TriboGardTM technology to produce low peel voltages (<100v) when their liners are removed. This helps prevent the generation of electrostatic charges during assembly that could lead to a discharge (ESD) and potentially damage the component or device.