Objectives

The target of i‐FLEXIS is the development of an innovative, large‐area and low‐cost integrated Xray
sensor system based on heterogeneous components, away from silicon technology or other
similar covalent materials based devices/systems.

i. conformable and bendable: the materials employed in the fabrication of the nanoscale devices that are integrated in the large area radiation sensor system can be processed at very
low temperature (≤150 °C), allowing to realize the complete system on flexible substrates, such as plastics or paper.

ii. optically transparent: the active materials used for the devices (organic single crystals and high
mobility oxide thin film semiconductors) coupled to the use of plastic substrates and thin layers
of printed metal interconnects grant a very low visible impact to the final complete system.

2. design and fabricate a photonic sensor unit that integrates the OSSC as the active X‐ray
sensing element and appropriate amplification of its electrical output signal (that could vary from
0.01‐10μA).

3. design and integration of the whole i‐FLEXIS system, integrating the photonic sensor
and the readout electronics into a 2D matrix that will act as a pixellated X‐ray sensing system. A fully printed organic CMOS platform will be used and proof of principle for an oxide TFT based
low operating voltage (5V) CMOS one will be introduced. The fabrication process will be scaled to a
10x10 cm² prototype.