Grinding wheel made of the directionally aligned SiC whiskers was produced and its grinding characteristics were examined.Grinding characteristics of the resinoid, vitrified, metal and glass bonded wheels were tested and it was clarified that the resinoid wheel showed the best performance in the surface finish. Next, the authors succeeded in developing a loading free-grinding method in which free grains were mixed with grinding fluid, and overcoming a weak point of SiC whisker wheel. Futhermore, these wheel was applied to the lapping process, and very smooth surfaces of the hardened die steel and Si wafer were obtained.In addition to these experiments, tool wear were investigated in cutting the resinoid wheel. As the results, the effect of whisker size, shape and orientation on the tool wear were made clear and new model of wear mechanism due to fatigue was proposed.