Compound semiconductor
solutions for advanced
power electronics

IMAGINE: Leading the Advance in
Power Electronics

As global society seeks applications that offer higher-efficiency energy
utilization, corporations worldwide are increasing investment in
cost-effective, high-performance power electronic devices. For decades,
energy, transportation and industrial systems have run on conventional
silicon-based power diodes and transistors. Yet, steadily increasing demands
for higher power densities are pushing silicon-based semiconductor devices to
their physical limits. The solution is next-generation wide-bandgap
semiconductor materials, such as silicon carbide (SiC), that are suited to
efficiently handle the electrical loads, switching rates and other performance
capabilities required to reduce energy losses and lower overall system
costs.

As a leading global provider of high-quality compound semiconductors for
power electronics applications, Dow Corning is helping to drive this
revolution forward. Our SiC semiconductor portfolio offers 4H n+ conducting SiC
wafers as well as SiC epitaxial layers (n- or p-doped).

Our n-conducting 100- and 150-mm diameter SiC substrates and epitaxy
services offer the industry-leading technology needed to develop more efficient
and compact power electronics targeting the following sectors.

Industrial:
Dow Corning’s high-quality SiC wafers offer a solid foundation to develop
a new generation of industrial motor controls and power supplies that use
electricity and space more effectively and operate more efficiently.

Transportation: From rail to road to aerospace, Dow Corning’s SiC
solutions can help device manufacturers and systems producers reduce the size
and weight of power modules while potentially increasing a vehicle’s
acceleration, range and/or speed.

Energy: SiC substrates and epitaxy from Dow Corning can help you
increase the efficiency and performance of your solar inverter and wind turbine
designs, and also provide the fundamental building blocks for the emerging
smart grid. Our SiC solutions may further reduce system costs through better
thermal management, smaller form factors and simplified system designs.

Dow Corning also offers more than 70 years of proven expertise
innovating advanced silicone
encapsulants,
sealants, potting
agents and
coatings for its power electronics design partners. We work closely with
customers to develop the advanced packaging solutions that will improve the
cost efficiency, durability and performance of their most advanced power
electronic components.

A proactive and collaborative innovator, Dow Corning offers a reliable
global supply base for industrial and energy electronics solutions, as well as
world-renowned customer service. If you are looking for application expertise
and support please
contact us. We can help you improve the reliability and value of your
design, whether it involves the manufacture, assembly, protection or
enhancement of power electronic components and systems.

Discover a higher
industry standard for 100-mm SiC wafer quality

Balance performance and cost for all
your power electronic device designs