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To provide multiphysics simulation software that would be easier for customers to use and manage, COMSOL® developed the new version of its flagship product to support the parallelism on Windows HPC Server 2008. The company also recognized the large market potential that the Microsoft technical computing platform represented and expects that the Windows Server–based version of its product will account for a significant percentage of future sales.

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In this Joule heating effects problem we will demonstrate how to model and simulate the heating of a fuse in a circuit board using the new COMSOL Multiphysics version 4. We will solve how hot a fuse gets in the circuit board when high voltage and current is passed through the fuse.