Launch Date

Lithography

Lithography refers to the semiconductor technology used to manufacture an integrated circuit, and is reported in nanometer (nm), indicative of the size of features built on the semiconductor.

# of Cores

Cores is a hardware term that describes the number of independent central processing units in a single computing component (die or chip).

# of Threads

A Thread, or thread of execution, is a software term for the basic ordered sequence of instructions that can be passed through or processed by a single CPU core.

Processor Base Frequency

Processor Base Frequency describes the rate at which the processor's transistors open and close. The processor base frequency is the operating point where TDP is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Max Turbo Frequency

Max turbo frequency is the maximum single core frequency at which the processor is capable of operating using Intel® Turbo Boost Technology and, if present, Intel® Thermal Velocity Boost. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Cache

CPU Cache is an area of fast memory located on the processor. Intel® Smart Cache refers to the architecture that allows all cores to dynamically share access to the last level cache.

Bus Speed

A bus is a subsystem that transfers data between computer components or between computers. Types include front-side bus (FSB), which carries data between the CPU and memory controller hub; direct media interface (DMI), which is a point-to-point interconnection between an Intel integrated memory controller and an Intel I/O controller hub on the computer’s motherboard; and Quick Path Interconnect (QPI), which is a point-to-point interconnect between the CPU and the integrated memory controller.

TDP

Thermal Design Power (TDP) represents the average power, in watts, the processor dissipates when operating at Base Frequency with all cores active under an Intel-defined, high-complexity workload. Refer to Datasheet for thermal solution requirements.

Configurable TDP-up Frequency

Configurable TDP-up Frequency is a processor operating mode where the processor behavior and performance is modified by raising TDP and the processor frequency to fixed points. The Configurable TDP-up Frequency is where the Configurable TDP-up is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Configurable TDP-up

Configurable TDP-up is a processor operating mode where the processor behavior and performance is modified by raising TDP and the processor frequency to fixed points. The use of Configurable TDP-up is typically executed by the system manufacturer to optimize power and performance. Configurable TDP-up is the average power, in watts, that the processor dissipates when operating at the Configurable TDP-up frequency under an Intel-defined, high-complexity workload.

Configurable TDP-down Frequency

Configurable TDP-down Frequency is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The Configurable TDP-down Frequency is where the Configurable TDP-down is defined. Frequency is measured in gigahertz (GHz), or billion cycles per second.

Configurable TDP-down

Configurable TDP-down is a processor operating mode where the processor behavior and performance is modified by lowering TDP and the processor frequency to fixed points. The use of Configurable TDP-down is typically executed by the system manufacturer to optimize power and performance. Configurable TDP-down is the average power, in watts, that the processor dissipates when operating at the Configurable TDP-down frequency under an Intel-defined, high-complexity workload.

Embedded Options Available

Embedded Options Available indicates products that offer extended purchase availability for intelligent systems and embedded solutions. Product certification and use condition applications can be found in the Production Release Qualification (PRQ) report. See your Intel representative for details.

Max Memory Size (dependent on memory type)

Max memory size refers to the maximum memory capacity supported by the processor.

Memory Types

Intel® processors come in four different types: a Single Channel, Dual Channel, Triple Channel, and Flex Mode.

Max # of Memory Channels

The number of memory channels refers to the bandwidth operation for real world application.

Max Memory Bandwidth

Max Memory bandwidth is the maximum rate at which data can be read from or stored into a semiconductor memory by the processor (in GB/s).

ECC Memory Supported ‡

ECC Memory Supported indicates processor support for Error-Correcting Code memory. ECC memory is a type of system memory that can detect and correct common kinds of internal data corruption. Note that ECC memory support requires both processor and chipset support.

Graphics Video Max Memory

The maximum amount of memory accessible to processor graphics. Processor graphics operates on the same physical memory as the CPU (subject to OS, driver, and other system limitations).

Graphics Output

Graphics Output defines the interfaces available to communicate with display devices.

4K Support

4K support indicates the product's support of 4K resolution, defined here as minimum 3840 x 2160.

Max Resolution (HDMI 1.4)‡

Max Resolution (HDMI) is the maximum resolution supported by the processor via the HDMI interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.

Max Resolution (DP)‡

Max Resolution (DP) is the maximum resolution supported by the processor via the DP interface (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your system.

Max Resolution (eDP - Integrated Flat Panel)‡

Max Resolution (Integrated Flat Panel) is the maximum resolution supported by the processor for a device with an integrated flat panel (24bits per pixel & 60Hz). System or device display resolution is dependent on multiple system design factors; actual resolution may be lower on your device.

DirectX* Support

DirectX indicates support for a specific version of Microsoft’s collection of API’s (Application Programming Interfaces) for handling multimedia compute tasks.

Intel® Clear Video Technology

Intel® Clear Video Technology is a suite of image decode and processing technologies built into the integrated processor graphics that improve video playback, delivering cleaner, sharper images, more natural, accurate, and vivid colors, and a clear and stable video picture.

PCI Express Revision

PCI Express Revision is the version supported by the processor. Peripheral Component Interconnect Express (or PCIe) is a high-speed serial computer expansion bus standard for attaching hardware devices to a computer. The different PCI Express versions support different data rates.

PCI Express Configurations ‡

PCI Express (PCIe) Configurations describe the available PCIe lane configurations that can be used to link the PCH PCIe lanes to PCIe devices.

Max # of PCI Express Lanes

A PCI Express (PCIe) lane consists of two differential signaling pairs, one for receiving data, one for transmitting data, and is the basic unit of the PCIe bus. # of PCI Express Lanes is the total number supported by the processor.

Sockets Supported

The socket is the component that provides the mechanical and electrical connections between the processor and motherboard.

TJUNCTION

Junction Temperature is the maximum temperature allowed at the processor die.

Intel® Speed Shift Technology

Intel® Speed Shift Technology uses hardware-controlled P-states to deliver dramatically quicker responsiveness with single-threaded, transient (short duration) workloads, such as web browsing, by allowing the processor to more quickly select its best operating frequency and voltage for optimal performance and power efficiency.

Intel® Turbo Boost Technology ‡

Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t.

Intel® vPro™ Platform Eligibility ‡

Intel® vPro™ Technology is a set of security and manageability capabilities built into the processor aimed at addressing four critical areas of IT security: 1) Threat management, including protection from rootkits, viruses, and malware 2) Identity and web site access point protection 3) Confidential personal and business data protection 4) Remote and local monitoring, remediation, and repair of PCs and workstations.

Intel® Virtualization Technology for Directed I/O (VT-d) ‡

Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments.

Intel® TSX-NI

Intel® Transactional Synchronization Extensions New Instructions (Intel® TSX-NI) are a set of instructions focused on multi-threaded performance scaling. This technology helps make parallel operations more efficient via improved control of locks in software.

Instruction Set

An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with.

Instruction Set Extensions

Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions).

Idle States

Idle States (C-states) are used to save power when the processor is idle. C0 is the operational state, meaning that the CPU is doing useful work. C1 is the first idle state, C2 the second, and so on, where more power saving actions are taken for numerically higher C-states.

Enhanced Intel SpeedStep® Technology

Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery.

Thermal Monitoring Technologies

Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. An on-die Digital Thermal Sensor (DTS) detects the core's temperature, and the thermal management features reduce package power consumption and thereby temperature when required in order to remain within normal operating limits.

Intel® Flex Memory Access

Intel® Flex Memory Access facilitates easier upgrades by allowing different memory sizes to be populated and remain in dual-channel mode.

Intel® Identity Protection Technology ‡

Intel® Identity Protection Technology is a built-in security token technology that helps provide a simple, tamper-resistant method for protecting access to your online customer and business data from threats and fraud. Intel® IPT provides a hardware-based proof of a unique user’s PC to websites, financial institutions, and network services; providing verification that it is not malware attempting to login. Intel® IPT can be a key component in two-factor authentication solutions to protect your information at websites and business log-ins.

Intel® Stable Image Platform Program (SIPP)

Intel® Smart Response Technology

Intel® Smart Response Technology combines the fast performance of a small solid state drive with the large capacity of a hard disk drive.

Intel® My WiFi Technology

Intel® My WiFi Technology enables wireless connection of an UltrabookTM or laptop to WiFi-enabled devices such as printers, stereos, etc.

Intel® AES New Instructions

Intel® AES New Instructions (Intel® AES-NI) are a set of instructions that enable fast and secure data encryption and decryption. AES-NI are valuable for a wide range of cryptographic applications, for example: applications that perform bulk encryption/decryption, authentication, random number generation, and authenticated encryption.

Secure Key

Intel® Software Guard Extensions (Intel® SGX)

Intel® Software Guard Extensions (Intel® SGX) provide applications the ability to create hardware enforced trusted execution protection for their applications’ sensitive routines and data. Run-time execution is protected from observation or tampering by any other software (including privileged software) in a system.

Intel® Memory Protection Extensions (Intel® MPX)

Intel® Memory Protection Extensions (Intel® MPX) provides a set of hardware features that can be used by software in conjunction with compiler changes to check that memory references intended at compile time do not become unsafe at runtime due to buffer overflow or underflow.

Intel® Trusted Execution Technology ‡

Intel® Trusted Execution Technology for safer computing is a versatile set of hardware extensions to Intel® processors and chipsets that enhance the digital office platform with security capabilities such as measured launch and protected execution. It enables an environment where applications can run within their own space, protected from all other software on the system.

Execute Disable Bit ‡

Execute Disable Bit is a hardware-based security feature that can reduce exposure to viruses and malicious-code attacks and prevent harmful software from executing and propagating on the server or network.

Tray Processor

Intel ships these processors to Original Equipment Manufacturers (OEMs), and the OEMs typically pre-install the processor. Intel refers to these processors as tray or OEM processors. Intel doesn't provide direct warranty support. Contact your OEM or reseller for warranty support.

More support options for Intel® Core™ i5-7Y54 Processor (4M Cache, up to 3.20 GHz)

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All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability, functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.

Intel classifications are for informational purposes only and consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company as an importer and/or exporter is responsible for determining the correct classification of your transaction.

Refer to Datasheet for formal definitions of product properties and features.

‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications (motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility. Functionality, performance, and other benefits of this feature may vary depending on system configuration.

Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel® Turbo Boost Technology. See www.intel.com/technology/turboboost/ for more information.

System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.

“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.

Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M. Please contact OEM for the BIOS that includes the latest Processor configuration update.