Storage Capacity Empowered by Intel® Innovation

Intel introduces the world’s first PCIe* SSDs with Intel® QLC Technology. Intel® QLC 3D NAND Technology provides up to 33% high areal density1 than its 3D NAND predecessor. It also uniquely features PCIe* acceleration, to deliver a reliable mix of performance, capacity, and value-making it a smart storage solution for both datacenter and client markets.

Intel® QLC Technology leverages current 3D NAND, with a proven 64-layer structure, and adds an additional bit per cell that provides 4bits/cell (QLC), making it the world's highest-density flash memory. Additionally, this technology uses a floating gate cell because it is a reliable, low-cost storage method. Last, Intel® QLC Technology was paired with PCIe*- (NVMe*) technology, to provide up to a 4x performance benefit over SATA interfaces.2

Prepare for the future with Intel QLC-built on reliable Intel® technology and backed by Intel manufacturing leadership.

Amazing Is Now Affordable

Intel® QLC 3D NAND Technology enables consumers to tackle today’s storage needs and prepare for the growing demands of tomorrow. These client SSDs pack in more data than TLC-based storage, allowing up to 2x more capacity in identical footprints.1 Only Intel coupled this game-changing technology with PCIe* to deliver affordable PCIe* performance.

Architected for Capacity and Reliability

Intel® 3D NAND Technology is an innovative response to the industry’s growing demand for data storage capacity. Compared to other available NAND solutions, Intel® 3D NAND Technology is designed on floating gate architecture with a smaller cell size and a highly efficient memory array, which enables higher capacity solutions and high reliability with strong protection from charge loss.

Innovation Leadership

64-Layer Breakthrough

Intel has applied 30 years of flash cell experience to transition NAND from 2D to 3D, multi-level cell (MLC) to tri-level cell (TLC), and 32-layer to our breakthrough 64-layer technology. All of this is done to deliver the highest areal density8 and rapidly grow storage capacities in 3D NAND solutions.

Expansive Portfolio

Built on a Proven Process

With 3D NAND technology, Intel delivers innovative, high-value capabilities into a broad product portfolio. Our experience of designing this architecture into SSD solutions enables us to rapidly improve performance, power consumption, performance consistency, and reliability with each generation.

Manufacturing Scalability

Enabling Disruptive Opportunities

Intel is using manufacturing processes proven by decades of high volume output to build 3D NAND technology. With strong generational synergy across our factory network, Intel expects to grow 3D NAND capacity faster than the market, enabling us to deliver disruptive total cost of ownership and application acceleration to our customer base.

Comparing 3.5’ 4TB WD Gold TB Enterprise class 7200 RPM HDD enabling up 24 HDDs per 2U and a total of 20U and 960TB total to 30.72TB E1.L Intel® SSD D-5 P4326 (available at a future date) enabling up to 32 per 1U and a total of 1U and 983TB total. So 20 rack units to 1 rack unit.

4

Power, Cooling, Consolidation cost savings. Based on HDD: 7.2K RPM 4TB HDD, AFR of 2.00% and 7.7W active power, 24 drives in 2U (1971W total power) https://www.seagate.com/files/www-content/datasheets/pdfs/exos-7-e8-data-sheet-DS1957-1-1709US-en_US.pdf SSD: 22W active power 44% AFR, 32 drives in 1U (704W total power); Cooling cost based on deployment term of 5 years with Kwh cost of $.158 and number of watts to cool 1 watt 1.20 Based on 3.5” HDD 2U 24 drives and EDSFF 1U Long 1U 32 drives. Hybrid storage based on using Intel® Transforming Learning Course(s) (Intel® TLC) SSD for cache.