A deep look inside the Galaxy S6

A new teardown of Samsung’s Galaxy S6 flagship reveals the new Galaxy S models might be even more important for the company than initially thought, as Samsung is betting big on several internal components it developed for the new flagship handsets. Unlike other teardowns looking at repairability, Chipworks took apart the Galaxy S6 to find out more details about the chips it packs, discovering a variety of Samsung-made chips inside the handsets on top of the main 64-bit octa-core Exynos 7420 System-on-Chip (SoC).

“Samsung is continuing the trend of introducing their own silicon into their phones,” the publication wrote.”Now we not only have the APU and memory, but also the modem, two PMICs (power management ICs), an RF transceiver chip, an envelope tracking IC, likely the NFC controller, and an image processor (and a Samsung Electro-Mechanics Wi-Fi module).”

The Galaxy S6 and Galaxy S6 edge aren’t the only “tools” Samsung is using to slow its profit decline. The company is putting a lot more faith in its own chips, which could later find their way into other mobile devices from Samsung and other device makers.

Analysts expect Samsung’s semiconductor business to contribute to the company’s recovery, Reuters reports, with a recent report from Bloomberg revealing that Samsung will also have a strong presence inside this year’s iPhones.

The obvious highlight of the Galaxy S6 handsets is the 14nm FinFET Exynos 7420 processor, a performance beast as illustrated by recent benchmark tests, though Chipworks has not posted a cross-section photo showing the 3D FinFET design.

More details about Chipworks Galaxy S6 teardown are available at the source link.