During the transferring process of the large die surfaces, there are extensive needs of die
surface polishing. Since almost large die surfaces are free-form surfaces, currently, these are almost
manually implemented. In order to overcome this barrier, this paper focuses on a new technology of
floating polishing, including a) the design of polisher body which has five degrees of freedom and
realize the floating polishing while keep the polishing head being indifference equilibrium within the
working range, b) normal force of polishing head on die surface analyses and experimental
verification by using the slip line field method, and c) establishments of the interference boundaries
between dies surface features and polishing head. The research achievements will be used for the
development of a portable, state-of-the-art polishing machine and the optimization of the associated
polishing process parameters in near future.