Today Asetek announced E4 Computer Engineering as a new datacenter OEM partner. E4 Computer Engineering has utilized Asetek RackCDU D2C (Direct-to-Chip) liquid cooling for the D.A.V.I.D.E. SUPERCOMPUTER in Italy. Commissioned by PRACE (The Partnership for Advanced Computing in Europe) and installed at CINECA (PRACE Italian hosting member), the innovative OpenPOWER-based HPC cluster is built on top of the IBM POWER8 architecture.

The D.A.V.I.D.E. Supercomputer required both maximum computational performance with high density along with a focus on reduced power consumption, making liquid cooling essential,” said Cosimo Gianfreda, E4 Computer Engineering Chief Technology Officer. “Because of Asetek’s success in cooling top HPC sites around the world, they were a natural partner for us.”

D.A.V.I.D.E. (Development for an Added Value Infrastructure Designed in Europe) is based on the OpenPOWER platform and is among the harbingers of a new generation of HPC systems which deliver high performance while being environmentally conscious.

It is rewarding to see E4 leveraging our investment in liquid cooling for the POWER architecture,” said John Hamill, Asetek Chief Operating Officer. “Being a European company as well, we are pleased that E4 has chosen to use Asetek Direct-to-Chip liquid cooling for this innovative cluster, the first of this kind in Europe.”

Asetek RackCDU D2C is a hot water liquid cooling solution that captures between 60% and 80% of server heat, reducing data center cooling cost by over 50% and allowing 2.5x-5x increases in data center server density.

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