Description

Microlithic is a patent pending breakthrough technology platform from Marki Microwave that allows us to create mixers with superior performance and a 14x size reduction. The Microlithic Technology Platform consists of a novel material system combined with advanced computer aided design methodology. This methodology allows Marki Microwave to support the microlithic mixer line with accurate simulation models.

This Microlithic mixer is similar in circuit design to an M1 mixer. Due to it's improved materials technology and design process it has superior isolation and spurious performance, as well as being 14x smaller than the smallest package M1.

1Connectorized package consists of chip package wire bonded to a substrate, equivalent to an evaluation board. 2Chip package connects to external circuit through wire bondable gold pads.*CH Substrate material is .010 thick Ceramic. I/O traces and ground plane finish is 2.5 microns Au over .05 microns WTi. Wire Bonding - Ball or wedge bond with 0.025 mm (1 mil) diameter pure gold wire. Thermosonic wirebonding with a nominal stage temperature of 150 °C and a ball bonding force of 40 to 50 grams or wedge bonding force of 18 to 22 grams is recommended. Use the minimum level of ultrasonic energy to achieve reliable wirebonds. Wirebonds should be started on the chip and terminated on the package or substrate. All bonds should be as short as possible.