We provide IC design services that tailor to your needs. Whether you are thinking about building new IC for new capabilities from an idea, simplifying system solution by IP or component integration, converting gate array or FPGA to IC for cost reduction, or getting assistance in part of the chip design such as physical design service, Valence is ready to help you complete the task.

We have extensive ASIC (application specific integrated circuit) design experience and many proven ASICs inside electronics products that are available worldwide. We believe that IC design is only part of the custom service in delivering the chip from concept to mass production. Professional project management and tightly integrated logistic support also play significant roles in the success of providing winning custom design ASIC service.

Simplicity ¡V Our strong R&D team have amassed abundant experience in understanding customers¡¦ need. Customers can benefit from our highly integrated ASIC solution to have simple system level design, saving efforts from procurement, logistics and inventory control of external components, as well as lowering manufacturing cost.

Reliability ¡V With over 20 years¡¦ IC design experience, our ASIC products have been adopted and proven by worldwide leading company. Our customer base includes top tier manufacturers like Sony, Thomson, Philips, Haier, and Asus, etc.

Responsiveness ¡V With extensive exposure to Greater China region and established system application teams in Hong Kong and Shenzhen, we have amassed abundant system design experience and are quick to response to customer need.

2. Prototype
Create a prototype using field programmable gate array (FPGA) for the logical portion, and discrete ICs are used for analog portion to emulate the actual chip.
3. Functional verification
Apply the prototype to system application for system functional verification.

Chip Design
After verifying the prototype, chip design begins:

1. Circuit design and simulationConvert the prototype design into circuitry and map the circuits with the predefined chip process library for simulation and verification.

2. Floorplanning, physical design and verification
Estimate the physical size and location of each circuit sub-block within the chip and convert the circuits into geometric shapes which correspond to the patterns of semiconductor layers that make up the components of the chip while minimizing the overall die size.

Production and Verification
Once test production and verification in the Production and Verification stage:

1. Tape out
Chip design database is sent to mask shop for mask data preparation, then to fabrication house for wafer fabrication.
2. Wafer test
Each dice inside the wafer will be tested pin by pin at the wafer tester to ensure the output characteristics meet the design specification.
3. Packaging
Wafer will be cut into individual die and the good dice are packaged in selected package form.

Mass Production
The chip is ready for mass production after passing final system application verification.