A new Field Emission Gun Scanning Electron Microscope (FEGSEM) with improved capability for low voltage operation will be optimised for high resolution Electron Back Scatter Diffraction (EBSD) in the range 5-10keV, where our preliminary experiments suggest that an improvement in spatial resolution by a factor of 2 will be achievable. Further development of our post-acquisition EBSD software will also result in better angular resolution. Detailed analysis of the stored diffraction patterns will be used to measure recovery and stored energy.The improved capability for EBSD will be world leading and will increase the range of possible applications.Projects which will particularly benefit will include: Characterisation of deformed or recovered microstructures. Measurements of inhomogeneous deformation and internal energy. Microstructures and stored energies in thermomechanically joined alloys. Investigation of severely deformed and nanocrystalline metals. Investigation of stress corrosion failure.

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