The MoSys MSH420 MUX PHY IC is a flexible SerDes device designed to MUX high-speed protocols into a higher rate output in one direction and DeMUX in the other direction. The device bit interleaves protocol independent rates ranging from 10-14G into a single stream at 2 times the rate. In a typical application, the device will MUX and DeMUX 8 lower speed lanes to 4 at double the data rate. Using a unique training capability, the device can maintain lane ID from point to point. For RapidIO, each pair of 10G or 12.5G data streams is combined into 20G or 25G, making the device ideal for a broad range of bandwidth consolidation applications, such as increasing backplane density or consolidating 8 12.5G links into 4 25G links to leverage the QSFP28 ecosystem.

IDT’s 10xN RXS2448 RapidIO switch offers ultra-low port-to-port latency approaching 100ns and a flexible, non-blocking fabric with switching performance of up to 600 Gbps to deliver an optimized high-speed switching solution. The new switches are backward-compatible with existing RapidIO ecosystems, protecting previous hardware and software investments while accelerating time to market.

“Mobile edge and data analytics applications require extremely high-speed, low latency movement of data in order to meet the performance requirements of the complex electronic systems within the mobile network infrastructure,” stated Sean Fan, vice president and general manager, Computing and Communications Division at IDT. “IDT’s latest RXS2448 RapidIO switch and the MoSys’ LineSpeed Flex MUX technology deliver these capabilities with higher density, lower power and a reduced number of cables.”

“IDT’s RapidIO switching solutions have a proven track record as a low-latency interconnect in the mobile edge and other expanding applications,” stated John Monson, VP of marketing and sales for MoSys. “The MoSys 28G protocol-agnostic 2:1 MUX allows customers to scale in performance and density at low cost and to risk leverage a proven and expanding 25G and 100G ecosystem for backplane and module interconnect.”