The Snapdragon 845 could be getting announced much earlier than expected, with a poster revealing that its unveiling could take place during the month of December. Prior to this announcement, a specifications leak of the SoC displays several changes and additions we can expect from the chipset so let us dive in quickly.

Snapdragon X20 Modem in Tow but Same Processing Node Expected for the Snapdragon 845 – Snapdragon 855 to Get 7nm Node

The leaked sheet below reveals the different changes coming with the Snapdragon 845 announcement. According to the details, the chip will be featuring four ARM Cortex-A75 cores and four ARM Cortex-A53 cores which will be paired with the Adreno 630 GPU for added graphical performance. On top of this, expect the Snapdragon 845 to feature the X20 connectivity modem too, which is expected to drive up downlink speeds of 1.2Gbps.

An early announcement of this chipset could also explain why Samsung is eager to get the Galaxy S9 out in the open at an early date, with rumors also suggesting that Qualcomm is working closely with Xiaomi to optimize the chipset for the upcoming Mi7. The manufacturing process will remain limited to 10nm FinFET for the time being, which only provides a foreshadowing that the upcoming Snapdragon 855 will be bearing the 7nm FinFET mark.

An early release of the Snapdragon 845 will be advantageous for nearly all flagship smartphone manufacturers, as they have no other alternative remaining unless they are focused on making their custom SoCs. This will translate into an earlier release date of their own products, meaning a better shot of seizing a higher percentage of the market share.

Additional info states that Q1 2018 is going to be the period when the Snapdragon 845 will be in action. This is probably going to be the time when manufacturers start to adopt the chip in their flagship devices, so perhaps we will see far better performance while being manufactured on the same node.