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WEEKLY NEWSLETTER

Our free weekly newsletter brings you the top MEMS stories from 9,200+ sources worldwide. Our newsletter also reports on the most vital newly-granted patents in the MEMS industry. Subscribe today and join our 34,800+ subscribers by clicking the link below.

The power and attractiveness of Apple's iPhone 4 lies in the sophisticated integration of multiple sensing technologies. Of specific note is the integration of a full 9 degrees-of-freedom (DoF) motion sensing. The iPhone 4 is the first portable consumer device to incorporate a three-axis accelerometer, three-axis gyroscope, and three-axis electronic compass. The addition of these sensors allows for much better rotational motion sensing, gaming, image stabilization, dead reckoning for GPS, gesture recognition and other applications, than was possible with only an accelerometer.

The Institute of Microelectronics (IME) in Singapore and GlobalFoundries are joining hands to develop MEMS based capacitive sensor platform technology for motion sensing applications that are relevant to consumer electronics, automotive and aerospace industries. MEMS capacitive sensor technologies are increasingly common in today's consumer electronics, and play a key role in the way users interact with mobile communication devices and 3D virtual multimedia gaming systems.

Teledyne Technologies and DALSA Corporation jointly announced this week that they have entered into a definitive agreement that provides for the acquisition of DALSA Corporation, including its digital imaging and MEMS foundry business, by a wholly-owned subsidiary of Teledyne. According to Dr. Robert Mehrabian, Teledyne's President and CEO, DALSA's MEMS capabilities will be augmented by having access to Teledyne's extensive MEMS research activities and advanced process technologies.

Analog Devices, a provider of MEMS and semiconductor technologies for signal-processing applications, announced this week that the U.S. International Trade Commission (ITC) reportedly ruled "decisively in favor" of Analog Devices in its lawsuit against Knowles Electronics.

This recent ruling follows ITC's ruling on November 22nd when Administrative Law Judge Robert K. Rogers, Jr. found Knowles Electronics' MEMS microphone packaging patents were invalid, a ruling that Analog Devices says is consistent with the position taken by the U.S. Patent and Trademark Office, where all of Knowles' asserted claims were rejected in separate reexaminations.

Attitude and heading reference systems, traditionally based on large mechanical components and instruments, are experiencing further miniaturization enabled by MEMS technologies. Applications for attitude and heading reference systems include control and stabilization, measurement and correction, and navigation. We recently spoke with Per Slycke, Chief Technology Officer at Xsens Technologies based in the Netherlands. In this detailed interview, Per reviews the current status of MEMS based attitude and heading reference systems and discusses ongoing and future trends.

Highlighted by their adoption in Apple’s iPhone 4, MEMS microphones are set to achieve a more than 50 percent increase in shipments in 2010 and a fourfold rise by 2014, according to the market research firm iSuppli, now part of IHS Inc.

Global MEMS microphone shipments are set to expand to 695.6 million units this year, up 57.7 percent from 441 million in 2009. By 2014, shipments will rise to 1.7 billion units, four times the total for 2009.

Real-time detection of degradation in the quality of public water supplies currently relies on bulky monitoring stations which typically contain a range of traditional, non-MEMS sensors and also require use of chemicals and continual maintenance. This makes current systems too expensive to provide comprehensive monitoring coverage for an entire water distribution network, according to Optiqua Technologies, a company based in Singapore and The Netherlands.

Innovative Micro Technology (IMT) announced this week the addition of a new geometry point in its technology roadmap for through silicon vias (TSVs). Joining the copper-filled 15 by 60 micron depth TSV configuration that has been in production for nearly 2 years, IMT has been sampling its 50 by 250 micron copper-filled TSV which is planned for production shortly after the first of the year.

High-performance gyroscopes have traditionally been exclusively made with non-MEMS technologies such as fiber optic gyroscopes (FOGs) and ring laser gyros (RLGs). However, MEMS based inertial sensor technologies are continually improving and now increasingly being used in aerospace and defense applications. We recently spoke with Dr. David Arch, Marketing and Product Manager for inertial sensors at Honeywell Aerospace. In this detailed interview, David reviews the most important performance metrics for gyroscopes, outlines the current status of MEMS gyro development and discusses ongoing and future trends. Dr. Arch also provides size and cost comparisons of the latest MEMS gyroscopes versus FOGs and RLGs.

Analog Devices announced that Knowles Electronics' patents have been found invalid by the U.S. International Trade Commission (ITC) judge. The company said that the ITC ruled decisively against Knowles Electronics and administrative Law Judge Robert K. Rogers, Jr. concluded that Knowles’ patents were invalid. According to the company, Judge Rogers determined that Analog Devices should not be prohibited from importing or selling its microphones.