The Chamfer Diameter (CD) holds the Free Air Ball during the 1st bonding.
The size of the CD needs to be optimized with the Bond Pad Opening in order to ensure prime performance.

If the CD is too large to transfer the USG during 1st bonding, the pad may incur damage.
On the flip side, if the CD is too small and there is no gap between the CD and the hole, this causes the wire to be cut too
early during the second bonding process and as a result, wires will go missing (as illustrated in the picture below).

Outer Radius and Face Angle

The Outer Radius (OR) is crucial during the 2nd bonding process, particularly for stitch readings.
A small OR can cause Heel Cracks (as shown in the picture below). On the other hand, if the OR is too large,
there won’t be sufficient space for the Face Angle (FA), which can lead to issues with stitch readings.

The Face Angle is unique to the package, as is the bonding environment.
We take the FA and OR into consideration and offer tailored solutions for each customer, in order to ensure prime stitches
during the 2nd bonding process.

Type

STANDARD

BOTTLENECK

ROUND(SLIM)

DEEP ACCESS

APPLICATION

CA: 15º 20º 30º

FINE PITCH BONDING

SiP, MEMS PKG, etc.

PRE-MOLDED PKG

With 40 years of know-how in precision manufacturing, the shortest lead time in the industry, and ultra competitive pricing, we offer our customers
the utmost in industry-leading products and dedicated customer service.

SURFACE ROUGHNESS OF EMOSSED TYPE (Ra)

0.035㎛

0.065㎛

0.080㎛

0.10㎛

0.15㎛

FINISH TYPE: Selection Guide

Ra 0.030㎛

Ra 0.65㎛

Ra 0.10㎛

FINISH TYPE: Selection Guide

POLISHED

ULTRA POLISHED

MATTE

UF

TUF

Widely used in Au wire bonding
to reduce capillary
contamination

Fine polishing helps minimize
clogging

Ideal for Cu wire bonding and
similar conditions

Ultra fine Ra is compatible with
Cu wire and rough-ended lead
frame material

TUF finishing is ideal for
uncontrolled roughened lead
frame conditions