Seagate is looking for a Wafer-Level Thin Film Transfer Intern to be located in our Bloomington, MN facility.

Intern will be responsible for helping identify, create, and validate layer transfer solutions in recording head fabrication. The primary goal is to transfer a thin film layer processed on a carrier wafer to a target wafer with sufficient bonding strength to survive subsequent wafer processing. Individual will participate in assessing options in materials selection, wafer surface preparation and layer transfer technique, then work with engineering staff to implement and validate the best option(s) in prototype recording heads. Individual will also work closely with metrology engineers in assessing, selecting and implementing characterization techniques to validate the bonding quality at the interface between the transferred layer and the target wafer. Key activities include development of film deposition, wafer surface preparation, layer transfer, and carrier wafer removal processes and bonding quality characterization metrology. Individual will work with a team of PhD engineers in lab and clean room environments using different experimental techniques including physical vapor deposition, ion milling, photo-lithography patterning, adhesion, and SEM/TEM characterization, etc.

Graduate course work with hands-on experimental thin film layer transfer work is required, with particular consideration given to candidates having backgrounds in wafer bonding, thin film or device transfer printing, and wafer-level packaging process.

Must be able to work and communicate effectively with a diverse group of engineers and technicians, and be an innovative and self-motivated worker.

Preferred Qualifications:

Prior experience in an industrial R&D environment and familiarity with thin film deposition techniques (PVD and/or CVD) are also pluses.