SMT and BGA Rework Systems

The BGA3200 rework table include BGA mounter system, transmission
system and weld system. It is use to rework and weld BGA and CSP
chips. Achieve surface mounter pin and PCB surface board imaging
synchronously and contraposition exactly.

The BGA3100 rework table include BGA mounter system, transmission
system and weld system. It is use to rework and weld BGA and CSP
chips. Achieve surface mounter pin and PCB surface board imaging
synchronously and contraposition exactly.

The BGA3000 exactitude BGA-SMT orientation system uses an optic system
to achieve surface component pin and PCB suface pad imaging on the CCD
at the same time, and the process could be observed through the
microscope.

The BGA1600C Repair workstation is a new product for the BGA chip
repairing market. It deals with BGA, CSP, LGA (Land Grid Array), Micro
SMD, MLF (Micro-Lead Frame), BCC (Bumped Chip Component) and assemble
rework system for super dense foot chip. It is convenient and stable
for all kinds of PCB, especially for large size PCBs.

The BGA1600+ Repair workstation is a new product for the BGA chip
repairing market. It deals with BGA, CSP, LGA (Land Grid Array), Micro
SMD, MLF (Micro-Lead Frame), BCC (Bumped Chip Component) and assemble
rework system for super dense foot chip. It is convenient and stable
for all kinds of PCB, especially for large size PCBs.

The BGA1600 Repair workstation is a new product for the BGA chip
repairing market. It deals with BGA, CSP, LGA (Land Grid Array), Micro
SMD, MLF (Micro-Lead Frame), BCC (Bumped Chip Component) and assemble
rework system for super dense foot chip. It is convenient and stable
for all kinds of PCB, especially for large size PCBs.