Capabilities

Download Our Capabilities Sheet

At Canadian Circuits, we are consistently enhancing our capabilities because we understand that our customers require a wide range of manufacturing services. As a leading innovator in the Printed Circuit Board Industry, we are motivated to push our boundaries and improve our capabilities. Our factory is capable of manufacturing all production and prototype volumes in standard lead times to suit any demand. With over 25 years of experience in manufacturing a variety of standard and complex PCB’s, we are your one stop shop for all PCB needs!

PC BOARD TECHNOLOGIES

STANDARD

PROTOTYPE

ADVANCED
(HDI)

Up To 20 Layers

Yes

Yes

Yes

Blind & Buried Vias

Yes

Yes

Yes

Via In Pad

Yes

Yes

Yes

Sequential Lamination

Yes

Yes

Yes

Impedance Control

Yes

Yes

Yes

Hybrids & Mixed Dielectrics

Yes

Yes

Yes

Rigid, Flex & Rigid-Flex

Yes

Yes

Yes

Metal Core

Yes

Yes

Yes

Conductive Hole Fill

Yes

Yes

Yes

Edge Plating & Constellation

Yes

Yes

Yes

Variety of Panel Sizes Available

Yes

Yes

Yes

DIMENSIONS

Maximum Panel Sizes

18” X 24”
(457mm X 609mm)

18” X 24”
(457mm X 609mm)

12’ X 18”
(305mm X 457mm)

Maximum Usable area

16” X 22”
(406mm X 559mm)

16” X 22”
(406mm X 559mm)

10.4” X 16”
(264mm X 406mm)

Minimum Board Thickness

0.030” (0.762mm)

0.005” (0.127mm)

0.005” (0.127mm)

Minimum Core Thickness

0.014” (0.356mm)

0.005” (0.127mm)

0.003” (0.076mm)

Thickness Tolerance

±10%

±8%

±7%

Dimensional Tolerance

±10 mil

±7 mil

±5 mil

COPPER PADS & TRACES

Min Trace Width & Spacing

0.007”/0.007” (0.178mm/0.178mm)

0.005”/0.005” (0.127mm/0.127mm)

0.003”/0.003” (0.076mm/0.076mm)

Minimum SMD Spacing

0.004” (0.102mm)

0.004” (0.102mm)

0.004” (0.102mm)

Minimum SMD Pitch

0.008” (0.203mm)

0.008” (0.203mm)

0.008” (0.203mm)

Min Annular Ring – Via

0.005” (0.127mm)

0.004” (0.102mm)

0.003” (0.076mm)

Min Annular Ring – Component

0.007” (0.178mm)

0.005” (0.127mm)

0.003” (0.076mm)

Max Finish Cu Weight – Outer

8 OZ

20 OZ

40 OZ

Max Finish Cu Weight – Inner/td>

1 OZ

4 OZ

6 OZ

Minimum Pad Size For Testing

0.010” (0.254mm)

0.008” (0.203mm)

0.006” (0.152mm)

DRILLS

Smallest Drill Diameter

0.012” (0.305mm)

0.008″ (0.203mm)

0.006″ (0.152mm)

Minimum Plated Hole Size

0.008″ (0.203mm)

0.006″ (0.152mm)

0.006″ (0.152mm)

Minimum Unplated Hole Size

0.008″ (0.203mm)

0.006″ (0.152mm)

0.006″ (0.152mm)

Tolerance of Plated Holes

±0.003″ (±0.076mm)

±0.002″ (±0.051mm)

±0.002″ (±0.051mm)

Tolerance of Unplated Holes

±0.002″ (±0.051mm)

±0.002″ (±0.051mm)

±0.001″ (±0.025mm)

Maximum PTH Aspect Ratio

5:1

8:1

10:1

Blind And Buried Vias

Max Blind Via Aspect Ratio

5:1

8:1

10:1

Min Blind Via Hole Size

0.008″ (0.203mm)

0.008″ (0.203mm)

0.008″ (0.203mm)

Min Buried Via Hole Size

0.008″ (0.203mm)

0.008″ (0.203mm)

0.008″ (0.203mm)

Via In Pad

Conductive Fill

Yes

Yes

Yes

Non-Conductive Fill

Yes

Yes

Yes

SURFACE FINISHES

HASL

Yes

Yes

Yes

ENIG

Yes

Yes

Yes

ENENIG

Yes

Yes

Yes

Immersion Silver

Yes

Yes

Yes

Immersion Tin

Yes

Yes

Yes

Lead Free HASL

Yes

Yes

Yes

SOLDER MASK AND LEGEND

Green, Red, Black, Yellow, Blue, White, Clear, Grey, Purple

Yes

Yes

Yes

FABRICATION

V-Score

Yes

Yes

Yes

V-Score Angles

30°

30°

30°

Bevel Angles

15°, 30° and
45°

15°, 30° and
45°

15°, 30° and 45°

QUALITY AND TESTING

Certifications

ISO 9001:2015

Yes

Yes

Yes

UL E103209

Yes

Yes

Yes

IPC 6012, Class 1, 2 And 3

1 and 2

1 and 2

1 and 2

Test And Measurement

ZMetrix TDR

Yes

Yes

Yes

Camtek AOI

Yes

Yes

Yes

CMI XRF

Yes

Yes

Yes

MicroCraft, ATG FPT

Yes

Yes

Yes

Electrical Test Ranges

Continuity

5-80 Volts

5-80 Volts

5-80 Volts

Isolation

10M Ohm

10M Ohm

10M Ohm

Voltages

100 Volts

100 Volts

100 Volts

Controlled Impedance

±10%

±8%

±7%

AVAILABLE REPORTS

Microsection

Yes

Yes

Yes

Solderability

Yes

Yes

Yes

CTM via X-Ray Fluorescence

Yes

Yes

Yes

Time Domain Reflectrometry

Yes

Yes

Yes

COC & FIR

Yes

Yes

Yes

Have a Question?

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