Topics discussed include:
• How saturated and linear PA designs have slightly different requirements
• Compact model-based simulation of PA die
• Understanding why process statistics and statistical simulation (of both die and package) are important
• The use of compact HBT models for die design and discussion of common misconceptions regarding the importance of “array” level modeling
• EM simulation of on-chip passives, laminate and package – including process variation and its impact on front-end module performance and yield.

Join us for this practical and informative webcast.

Who should attend:
Target audience is designers, modelers, and design automation working on power amplifier design