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Method for a wafer hole

Publishing Venue

Abstract

Disclosed is a method for a wafer hole. Benefits include improved functionality.

Country

United States

Language

English (United States)

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This is the abbreviated version, containing approximately
100% of the total text.

Method for a wafer hole

Disclosed is a method for a wafer hole. Benefits include
improved functionality.

Background

A conventional
silicon wafer is a round disc (see Figure 1).

The increasing size
of wafers results in problems with warpage, ease of handling/transportation,
and storage. Conventionally, these problems are addressed with the following
solutions:

• Definition of an
acceptable warpage tolerance

• Extra care with
respect to wafer handling/transportation

• Modification of wafer
storage

Description

The disclosed method includes the insertion of a hole at
the wafer center to provide ease of wafer processing, handling/transportation,
and storage.

A hole is cut into a
wafer at the center to provide a means of mounting or holding contact and
minimizing the risk of wafer warpage and damage due to wafer size (diameter). A
diamond cutter creates the hole, producing a wafer that has a look similar to a
compact disc (see Figure 2).

Advantages

The disclosed method provides advantages, including:
• Improved functionality due to
providing an easier way to hold/mount a wafer to prevent warpage
• Improved functionality due to
enabling the creation of improved wafer transportation and storage methods