On the Road Towards TSV Manufacturing

SEMI Europe Launches New Show Focusing on TSV

GRENOBLE,
France — July 25, 2012 — SEMI Europe today announced that it is
organizing a new event — the European 3D TSV Summit on January 22-23, 2013 in
Grenoble, France. The theme of the first-ever
Summit is “On theRoad towards TSV Manufacturing,” a
critical issue as device designers and manufacturers increasingly cross into
the third dimension (3D) due to the industry’s continuing pursuit of building
more functionality into ever-shrinking silicon “real estate.” Many European
semiconductor companies are now worldwide leaders in 3D-integrated circuits
(IC); the event will support and showcase their capabilities to global leaders
in the field.

IC device requirements continue to increase as
applications get more complex and more multifunctional. Europe’s high-tech industry has responded to
these new requirements with 3D-IC integration with TSV. TSV is the key
technology behind 3D-IC integration and is a “stepping stone” to get the most
out of the combination of “More Moore” and “More than Moore.” Such integration
explores a new area of microelectronics, reaching beyond the boundaries of
conventional semiconductor “Moore’s Law” downscaling. 3D-IC integration focuses
on creating high-value products, encouraging new technological possibilities
and almost unlimited application potential. According to Yole Développment, the
shipment volume of 3D-IC wafers will reach 10 million units in 2012.

The European 3D TSV Summit is expected to demonstrate the
full range of 3D technology and R&D processes in Europe, with leading
companies participating, showing a range from initial prototypes to high-volume
production. The show is targeted both at engineers up through top executives from
European fabs, IDMs, TSV companies, equipment and materials companies and fabless
— and attendees from all over the world who are interested in European
capabilities. In addition to the conference and an exhibition, attendees will
get opportunities to network and participate in round table talks.

The European 3D
TSV Summit is a new event launched by SEMI Europe. For
more information about the event, please
contact Yann Guillou in the SEMI Europe Grenoble Office (yguillou@semi.org).

About SEMI

SEMI is the global industry association serving the nano-
and microelectronics manufacturing supply chains. Our 2,000 member
companies are the engine of the future, enabling smarter, faster and more
economical products that improve our lives. Since 1970, SEMI has been committed
to helping members grow more profitably, create new markets and meet common
industry challenges. SEMI maintains offices in Beijing, Bengaluru, Berlin,
Brussels, Grenoble, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore,
Tokyo, and Washington, D.C. For more information on SEMI, visit www.semi.org.