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Abstract:

Apparatus and method for tire temperature measurement is disclosed. The
apparatus includes a thermocouple having a measurement junction and a
pair of first and second conductive leads. The measurement junction is
mounted in a passage provided in the tire. The pair of first and second
conductive leads extend through the passage in the tire and exit the tire
at an interface. A patch is mounted to the tire at the interface. The
pair of first and second conductive leads extend from the interface into
a passage provided in the patch. The first and second conductive leads
are surrounded by the patch at the interface where the first and second
conductive leads exit the surface of the tire.

Claims:

1. A tire temperature measurement apparatus, comprising: a thermocouple
having a measurement junction and a pair of first and second conductive
leads, said measurement junction being mounted in a first passage
provided in the tire, said pair of first and second conductive leads
extending through the first passage in the tire and exiting the surface
of the tire at an interface; a patch mounted to the tire at said
interface, said pair of first and second conductive leads extending from
said interface into a second passage provided in said patch; and a
temperature measurement circuit in operable communication with said pair
of first and second conductive leads; wherein said first and second
conductive leads are surrounded by said patch at said interface where
said first and second conductive leads exit the tire.

2. The tire temperature measurement apparatus of claim 1, wherein said
temperature measurement circuit comprises a processor and a reference
junction, said reference junction comprising a temperature measurement
device in thermal contact with said reference junction.

5. The tire temperature measurement apparatus of claim 2, wherein said
processor and said reference junction are located on a circuit board
mounted to said patch.

6. The tire temperature measurement apparatus of claim 2, wherein said
processor is located on a circuit board mounted to said patch and said
reference junction is embedded in said patch.

7. The tire temperature measurement apparatus of claim 1, wherein said
apparatus further comprises: a first support element embedded in said
patch, said first support element comprising a pair of first and second
posts extending from said first support element; a second support element
located above a top surface of said patch, said first and second posts
extending through said second support element; and a circuit board
located above said second support element, said first and second posts
being operably connected to said circuit board to provide mechanical
support for said circuit board; wherein said apparatus comprises a third
passage provided through said first support element and said second
support element, said third passage being provided between said first
post and said second post such that said first and second posts and said
third passage are arranged in a substantially linear relationship.

8. The tire temperature measurement apparatus of claim 7, wherein said
first and second conductive leads extend through said third passage
provided through said first support element and said second support
element.

9. The tire temperature measurement apparatus of claim 8, wherein said
third passage provided through said first support element and said second
support element is filled with a urethane or epoxy material, said
urethane or epoxy material having a modulus of elasticity approximately
equal to the modulus of elasticity of said first support element and said
second support element.

10. The tire temperature measurement apparatus of claim 7, wherein said
first and second posts and said third passage provided through said first
support element and said second support element are arranged in a
substantially linear relationship along a line about 80.degree. to about
100.degree. to a longitudinal direction of the patch, the longitudinal
direction of the patch being substantially perpendicular to the direction
of rotation of the tire.

11. A method for measuring temperature of a tire, comprising: placing a
patch on a surface of the tire; providing a first passage in said patch
and the tire; inserting a thermocouple comprising a measurement junction
and a pair of first and second conductive leads into said first passage
provided in said patch and in the tire such that said measurement
junction of said thermocouple is mounted in said first passage provided
in the tire and said first and second conductive leads extend through
said first passage in the tire and exit the surface of the tire at an
interface; placing said first and second wires in operable communication
with a temperature measurement circuit; and determining said temperature
of said tire at the location of said measurement junction; wherein said
first and second conductive leads are surrounded by said patch at said
interface where said first and second conductive leads exit the surface
of the tire.

12. The method of claim 11, wherein said temperature measurement circuit
comprises a processor and a reference junction, said reference junction
comprising a temperature measurement device in thermal contact with said
reference junction.

15. The method of claim 12, wherein said method comprises mounting a
circuit board to said patch, said processor and said reference junction
being located on said circuit board.

16. The method of claim 12, wherein said method comprises mounting a
circuit board to said patch, said processor being located on said circuit
board and said reference junction being embedded in said patch.

17. The method of claim 11, wherein said method further comprises:
embedding a first support element in said patch, said first support
element comprising a pair of first and second posts extending from said
first support element; positioning a second support element above a top
surface of said patch such that said first and second posts extend
through said second support element; operably connecting a circuit board
to said first and second posts extending from said first support element;
and providing a second passage through said first support element and
said second support element between said first post and said second post
such that said first and second posts and said second passage are
arranged in a substantially linear relationship.

18. The method of claim 17, wherein said method comprises threading said
first and second conductive leads through said second passage provided
through said first support element and said second support element.

19. The method of claim 18, wherein said method comprises filling said
second passage provided through said first support element and said
second support element with a urethane or epoxy material having a modulus
of elasticity substantially equal to the modulus of elasticity of said
first support element and said second support element.

20. The method of claim 17, wherein said method comprises arranging said
patch on said tire such that said first and second posts and said second
passage provided through said first support element and said second
support element are arranged in a substantially linear relationship along
a line about 80.degree. to about 100.degree. to a longitudinal direction
of the patch, the longitudinal direction of the patch being substantially
perpendicular to the direction of rotation of the tire.

Description:

FIELD OF THE INVENTION

[0001] The present subject matter relates to an apparatus and method for
tire temperature measurement. In particular, the present subject matter
relates to an apparatus and method for tire temperature measurement using
a thermocouple embedded or provided in a tire.

BACKGROUND OF THE INVENTION

[0002] Temperature measurement of a tire during use on vehicles is
difficult. A common method for temperature tire measurement is insertion
of a thermocouple into the tire. A thermocouple typically includes a
junction of two conductive leads formed from dissimilar metals. The
voltage produced by the junction of the two conductive leads is directly
proportional to the temperature at the junction according to the well
known Seebeck effect. The temperature of the tire at the measurement
junction can be determined by measuring the voltage produced by the
junction, so long as a reference junction temperature is also known. The
depth and angle of insertion of the thermocouple can be controlled so as
to place the junction of the thermocouple at the point of interest for
temperature measurement.

[0003]FIG. 1 illustrates a typical thermocouple 200 embedded into a
passage 110 provided in tire structure 100. As illustrated, the rubber
material of tire structure 100 surrounds and holds thermocouple 200.
Thermocouple 200 includes a measurement junction 205 of dissimilar
conductors surrounded by a protective casing 208. Dissimilar conductors
210 and 220 extend out from measurement junction 205 as conductive leads
210 and 220. By commonly known methods, measurement junction 205 has been
inserted at a desired depth and angle so as to be located at a point of
interest for measurement. Conductors 210 and 220 extend through passage
110 and exit the rubber material of tire 100 at interface 120.

[0004] A disadvantage of using thermocouples in the manner discussed above
is the significant cyclic stress that can be applied to the thermocouple
conductive leads during rotation of the tire. This cyclic stress can be
particularly strong when concentrated at the interface where the
conductive leads exit the surface of the tire. The stresses applied to
the conductive leads can rapidly fatigue the conductive leads, resulting
in distorted temperature measurements and eventual failure of the
thermocouple.

[0005] Thus, there is a need for a tire temperature measurement apparatus
and method that overcomes the above disadvantages. While various
implementations of tire temperature measurement techniques using
thermocouples have been implemented, no design has emerged that generally
encompasses all of the desired characteristics as hereafter presented in
accordance with the subject technology.

SUMMARY OF THE INVENTION

[0006] Aspects and advantages of the invention will be set forth in part
in the following description, or may be obvious from the description, or
may be learned through practice of the invention.

[0007] One exemplary embodiment of the present invention is directed to a
tire temperature measurement apparatus. The apparatus includes a
thermocouple having a measurement junction and a pair of first and second
conductive leads. The measurement junction is mounted in a passage
provided in the tire. The pair of first and second conductive leads
extends through the passage in the tire and exits the tire at an
interface. A patch is mounted to the tire at the interface. The pair of
first and second conductive leads extends from the interface into a
similar passage provided in the patch. The apparatus further includes a
temperature measurement circuit in operable communication with the pair
of first and second conductive leads. The first and second conductive
leads are surrounded by the patch at the interface where the first and
second conductive leads exit the surface of the tire. Thus, the patch
material also holds the pair of first and second conductive leads,
reducing the cyclic stress concentration that can occur at this
interface.

[0008] Various additions or modifications can be made to this exemplary
embodiment of the invention.

[0009] For example, another exemplary embodiment of the present invention
is directed to a method for measuring temperature of a tire. The method
includes placing a patch on a surface of a tire and providing a passage
in the patch and in the tire. The method includes inserting a
thermocouple having a measurement junction and a pair of first and second
conductive leads into the passage provided in the patch and the tire such
that the measurement junction of the thermocouple is mounted in the
passage provided in the tire and the first and second conductive leads
extend through the passage in the tire and exit the surface of the tire
at an interface. The method further includes placing the first and second
conductive leads in operable communication with a temperature measurement
circuit and measuring the thermocouple measurement junction signal and
calculating the temperature of the tire at the measurement junction. The
first and second conductive leads are surrounded by the patch at the
interface where the first and second conductive leads exit the surface of
the tire.

[0010] These and other features, aspects and advantages of the present
invention will become better understood with reference to the following
description and appended claims. The accompanying drawings, which are
incorporated in and constitute a part of this specification, illustrate
embodiments of the invention and, together with the description, serve to
explain the principles of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011] A full and enabling disclosure of the present invention, including
the best mode thereof, directed to one of ordinary skill in the art, is
set forth in the specification, which makes reference to the appended
figures, in which:

[0012]FIG. 1 provides a cross-sectional view of an exemplary thermocouple
measurement junction located in a passage provided in a tire;

[0013]FIG. 2 provides a cross-sectional view of an exemplary apparatus
for tire temperature measurement according to one exemplary embodiment of
the present disclosure;

[0014]FIG. 3 provides a plan view of an exemplary reference junction that
can be used as part of an exemplary temperature measurement circuit
according to one exemplary embodiment of the present disclosure;

[0015]FIG. 4 provides an exploded view of an exemplary apparatus for tire
temperature measurement according to one exemplary embodiment of the
present disclosure; and

[0016]FIG. 5 provides a cross-sectional view of an exemplary apparatus
for tire temperature measurement according to one exemplary embodiment of
the present disclosure.

DETAILED DESCRIPTION OF THE DRAWINGS

[0017] Reference now will be made in detail to embodiments of the
invention, one or more examples of which are illustrated in the drawings.
Each example is provided by way of explanation of the invention, not
limitation of the invention. In fact, it will be apparent to those
skilled in the art that various modifications and variations can be made
in the present invention without departing from the scope or spirit of
the invention. For instance, features illustrated or described as part of
one embodiment, can be used with another embodiment to yield a still
further embodiment. Thus, it is intended that the present invention
covers such modifications and variations as come within the scope of the
appended claims and their equivalents.

[0018] Generally, the present subject matter is directed to methods and
apparatus for measuring the temperature of a tire. According to exemplary
aspects of the present disclosure, a thermocouple having a measurement
junction and a pair of first and second conductive leads can be inserted
into a tire. The angle and depth of insertion can be controlled to insert
the measurement junction of the thermocouple at a point of interest for
temperature measurement for the tire. The thermocouple conductive leads
extend from the junction through the tire and exit the surface of the
tire at an interface.

[0019] The apparatus and methods of the present disclosure reduce cyclic
stresses applied to the thermocouple conductive leads during rolling of
the tire by keeping the leads enclosed in a patch of similar material as
the tire material at the interface where the conductive leads exit the
surface of the tire. For instance, the conductive leads are enclosed in
the patch until the conductive leads are connected to a temperature
measurement circuit. As will be discussed in detail below, the conductive
leads are connected to a temperature measurement circuit at a necessary
reference junction where the conductive leads may join copper or other
dissimilar conductive metals.

[0020] By enclosing the conductive leads in a patch formed, for instance,
from a rubber material, the movement and flexing of the conductive leads
during tire rotation can be reduced to the same or lower level as occurs
within the material of the tire. Accordingly, enclosing the thermocouple
conductive leads in the patch at the interface where the conductive leads
exit the surface of the tire protects the conductive leads from damage or
other fatigue caused during rotation of the tire at least to a level of
fatigue lower than that which occurs while embedded in the material of
the tire.

[0021] The temperature measurement circuit can be used to convert the
voltage produced by the thermocouple junction into a temperature
measurement. The temperature measurement circuit can include a processor
and a reference junction. The reference junction is the location where
the conductive leads of the thermocouple are physically joined to
communication leads for communicating thermocouple signals to the
processor. As will be discussed in detail below, the conductive materials
of the communication leads can be different from the conductive materials
of the pair of first and second thermocouple leads, leading to
distortions in the signal provided by the thermocouple alone since any
junction of dissimilar metals occurring in the circuit will also generate
a voltage according to the Seebeck effect. The reference junction can
include an independent temperature measurement device such as a p-n
junction or a thermistor that is used to generate an error signal to
compensate for the distortions caused by the junction of dissimilar
metals at the reference junction. The processor can be configured to
determine the temperature of the tire at the location of the thermocouple
junction by using the signals provided by the communication leads and the
error signal provided by the independent temperature measurement device.

[0022] In accordance with certain embodiments of the present disclosure,
the processor and the reference junction can be located on a circuit
board that is mounted to the tire. In other embodiments, the reference
junction can be located in the patch and the processor can be located on
a circuit board that is mounted to the tire. It may be necessary to
independently measure the temperature of the reference junction to
compensate for distortions caused by the junction of dissimilar metals at
the reference junction. It can also be necessary to take precautions
against the formation of temperature gradients across the reference
junction where the two conductive leads are joined with communication
leads. In certain embodiments, this can be accomplished by keeping the
junctions of the two conductive leads with the communications leads
thermally close together with each other and with an independent
temperature measurement transducer, and through the use of proper
insulation material surround the reference junction and the temperature
measurement transducer.

[0023] The circuit board containing the microprocessor and/or the
reference junction can be mounted to the tire using a variety of
techniques. For instance, in one embodiment, the circuit board can be
mounted directly to the patch that encloses the thermocouple conductive
leads and/or the reference junction. In another embodiment, the circuit
board can be mounted to the tire using 1-D orthogonal connection line
techniques disclosed in PCT Application Serial No. PCT/US2008/074765 and
PCT Application Serial No. PCT/US2009/042357, both of which are hereby
incorporated by reference for all purposes.

[0024]FIG. 1 illustrates a typical thermocouple 200 inserted into passage
110 provided in tire 100. Thermocouple 200 includes a measurement
junction 205 of dissimilar conductive metals. For instance, measurement
junction 205 can be a junction of chromel and alumel conductors. The
conductors extend from measurement junction 205 as conductive leads 210
and 220. Conductive lead 210, for instance, can be the chromel conductive
lead. Conductive lead 220, for instance, can be the alumel conductive
lead. In accordance with well known principles, i.e. the Seebeck effect,
the voltage produced by the junction of the dissimilar conductors is
directly proportional to the temperature of the junction. Thus, the
temperature of a point of interest on a tire can be determined by
measuring the voltage between conductive leads 210 and 220 of
thermocouple 200.

[0025] Thermocouple junction 205 is surrounded by a protective casing 208
to protect measurement junction 205. Protective casing 208 can be any of
a variety of materials, including ceramic materials, plastic materials,
rubber materials, or any other suitable materials. Preferably, this
protective casing is formed from an electrically insulating material in
order to avoid interference from the tire material in case the tire
material electrical conductivity is great enough to interfere with the
thermocouple signal. Conductive leads 210 and 220 are each provided with
an insulator covering. In certain embodiments, conductive leads 210 and
220 can be coiled in a tight pitch around a multi-filament core material
as shown in FIG. 1. Coiling the leads 210 and 220 in a tight pitch can
provide added stability, strength, and flexing durability to thermocouple
200. This approach is compatible with principles of thermocouple
measurement which generally advise to reduce thermocouple wire diameter
to avoid possible temperature measurement error due to thermal conduction
of the wires themselves.

[0026] Thermocouple 200 can be inserted into tire 100 using a variety of
different techniques. For instance, in one embodiment, passage 110 can
have previously been provided in tire 100 by drilling tire 100 with a
small conventional drill. Thermocouple 200 can be inserted into tire 100
by first inserting thermocouple 200 into a rigid tube such that the
protective casing 208 of junction 205 abuts the edge of the tube and such
that conductive leads 210 and 220 are located inside the hollow portion
of the tube. The tube/thermocouple assembly is then inserted into passage
110. The protective casing 208 of junction 205 is retained by frictional
engagement with the sides of passage 110. The tube can be withdrawn,
leaving thermocouple 200 mounted in tire 100. The angle and depth of
insertion of thermocouple 200 into tire 100 can be controlled using a
variety of techniques to provide the measurement junction 205 of
thermocouple 200 at a point of interest for temperature measurement for
the tire.

[0027] As illustrated in FIG. 1, conductive leads 210 and 220 of
thermocouple 200 extend through passage 110 of tire 100 and exit the
surface of tire 100 at interface 120. During rotation of tire 100,
significant cyclic stresses are applied to conductive leads 210 and 220.
As previously described, these cyclic stresses are particularly
concentrated and strong at the interface 120 where the conductive leads
exit the surface of the tire 100 into the air. In this case, stresses
applied from rotation of the tire can rapidly fatigue conductive leads
210 and 220, resulting in distorted temperature measurements and eventual
failure of thermocouple 200.

[0028] To overcome these disadvantages, embodiments of the present
disclosure maintain conductive leads 210 and 220 of thermocouple 200
enclosed in a patch at interface 120 where conductive leads 210 and 220
exit the surface of tire 100. For instance, with reference now to FIG. 2,
thermocouple 200 is mounted in a passage 110 provided in tire 100. The
junction and protective casing of thermocouple 200 are retained at the
bottom of passage 110 while the conductive leads of thermocouple 200
extend through passage 110 and exit the surface of tire 100 at interface
120.

[0029] As illustrated, a patch 300 is located on the surface of tire 100
at interface 120. Patch 300 can be formed from any of a variety of
materials, including rubber materials, elastomeric materials and/or
polymeric materials. Preferably, the material of patch 300 is similar to
the material of tire 100. Patch 300 depicted in FIG. 2 provides a support
surface for circuit board 400. Circuit board 400 can be secured to patch
300 using a Chemlok® adhesive material or other suitable adhesive
material. Patch 300 serves to provide support for circuit board 400 and
also serves to dampen stresses and other forces applied to circuit board
400 during rotation of tire 100.

[0030] At interface 120, where the conductive leads of thermocouple 200
exit the surface of tire 100, the conductive leads of thermocouple 200
are completely surrounded by patch 300. The conductive leads of
thermocouple 200 remain enclosed in the patch 300 until they are operably
connected to the temperature measurement circuit. In this manner, patch
300 protects the conductive leads from damage or other fatigue during
rotation of the tire.

[0031] As shown in FIG. 2, temperature measurement circuit includes a
reference junction 410 and a processor 420. Processor 420 is used to
determine temperature using signals provided from thermocouple 200 and an
error signal from reference junction 410. Processor 420 can store
temperature measurements in a database or can transmit temperature
measurements to an external device via, for instance, RF communication
techniques. Processor 420 of FIG. 2 is located on circuit board 400 and
can be programmed with various instructions to perform various functions
in accordance with aspects of the present technology. For instance,
processor 420 can include one or more computing devices that are adapted
to provide desired functionality by accessing software instructions
rendered in a computer-readable form. When software is used, any suitable
programming, scripting, or other type of language or combinations of
languages may be used. However, software need not be used exclusively, or
at all. For example, some embodiments set forth herein may also be
implemented by hard-wired logic or other circuitry, including, but not
limited to, application-specific circuits. Of course, combinations of
computer-executed software and hard-wired logic or other circuitry may be
suitable, as well.

[0032] The conductive leads of thermocouple 200 are operably connected to
the temperature measurement circuit at reference junction 410. Reference
junction 410 is the junction where the conductive leads of thermocouple
200 are physically connected to the temperature measurement circuit. In
FIG. 2, reference junction 410 is located within patch 300. Communication
leads 230 communicate signals from reference junction 410 to
microprocessor 230. Communication leads 230 extend through passage 110
provided in patch 300 until connected to circuit board 400. As will be
discussed with respect to FIGS. 4 and 5, reference junction 410 can also
be located on circuit board 400 such that thermocouple conductive leads
extend all the way through passage 110 in patch 300 until connected to a
reference junction located on circuit board 400.

[0033] Reference junction 410 will now be discussed in detail with respect
to FIG. 3. As discussed above, conductive leads 210 and 220 of
thermocouple 200 are formed from dissimilar conductors that are joined
together at measurement junction 205. For instance, the conductive leads
210 and 220 of thermocouple 200 can be formed from chromel material and
alumel material respectively. The junction of dissimilar metals at
thermocouple measurement junction 205 produces a temperature-dependent
voltage that is used to determine the temperature of tire 100 at the
location of measurement junction 205.

[0034] To communicate the appropriate thermocouple signals to processor
420 so that processor 420 can convert the thermocouple signals into
temperature measurements, conductive leads 210 and 220 of thermocouple
200 must be physically joined at some location to communication leads 230
of a temperature measurement circuit. The communication leads 230 can be
formed from the same conductive materials as thermocouple conductive
leads 210 and 220. However, in many instances, the conductive material of
the communication leads 230 is different from that of thermocouple leads
210 and 220. For instance, the communication leads 230 can be formed from
a copper material, and the thermocouple conductive leads 210 and 220 can
be formed from a chromel and alumel material respectively. Similar to
thermocouple junction 205, the physical connection between dissimilar
metals of thermocouple conductive leads 210 and 220 and the communication
leads 230 will produce a temperature-dependent voltage opposed in
polarity to the voltage produced at the thermocouple junction.

[0035] More particularly, referring now to FIG. 3, conductive lead 210 is
physically connected to communication lead 230 at junction 414.
Conductive lead 220 is physically connected to communication lead 230 at
junction 416. If conductive lead 210 is framed from a different
conductive material than communication lead 230, a temperature-dependent
voltage opposed in polarity to the thermocouple junction voltage will be
generated by junction 414. Similarly, if conductive lead 220 is formed
from a different conductive material than communication lead 230, a
temperature-dependent voltage opposed in polarity to the thermocouple
junction voltage will be generated by junction 416.

[0036] To compensate for the distortions to the thermocouple signal
created at reference junction 410, a temperature measurement device can
be placed in intimate thermal contact with reference junction 410. For
instance, junction 414 and junction 416 can be located on a copper or
other thermal conductive plate 412. Temperature measurement device can be
placed in thermal contact with thermal conductive plate 412 at the center
418 of conductive plate between junctions 414 and 416. The temperature
measurement device will produce an error signal based on the temperature
of thermal conductive plate 412. The temperature measurement device can
be any of a variety of suitable devices for measuring the temperature of
reference junction 410, including a p-n junction or a thermistor. The
error signal can be communicated to processor 420 through a communication
lead 230. Based on signals received from communication leads 230,
processor 420 will generate a temperature measurement based on the
voltage produced by measurement junction 205.

[0037] The apparatus of FIG. 2 can be constructed using techniques similar
to those discussed with respect to the insertion of thermocouple 200 into
tire 100 of FIG. 1. For example, patch 300 can first be placed on the
surface of tire 100. Passage 110 can be provided in tire 100 and patch
300 by drilling the tire 100 and patch 300 a small conventional drill.
Printed circuit board 400 can be placed on top of patch 300 prior to
drilling the tire 100 and patch 300. The passage 110 provided in circuit
board 400 can be used as a guide for drilling passage 110 into patch 300
and tire 100.

[0038] As discussed above, thermocouple 200 can be inserted into tire 100
by first inserting thermocouple 200 into a tube such that the protective
casing 208 of measurement junction 205 abuts the edge of the tube and
such that conductive leads 210 and 220 are located inside the hollow
portion of the tube. The tube/thermocouple assembly can then inserted
into the passage 110 provided by the stinger apparatus. The protective
casing 208 of measurement junction 205 is retained by compression and
frictional engagement with the sides of passage 110. The tube can be
withdrawn, leaving thermocouple 200 mounted in tire 100. The conductive
leads 210 and 220 can then be placed in operable communication with a
temperature measurement circuit, for instance, by connecting conductive
leads 210 and 220 to the temperature measurement circuit at reference
junction 410.

[0039] In certain embodiments, passage 110 provided in patch 300 and tire
100 can be filled with a filler material 130. Filler material 130 can be
a urethane material, epoxy material, or other suitable material. Filler
material 130 provides an added layer of protection for thermocouple 200
and serves to further reduce stresses applied to thermocouple 200 during
rotation of tire 100. In a particular embodiment, filler material 130 can
have a modulus of elasticity that is similar to the modulus of elasticity
of the material of patch 300 or tire 100.

[0040] FIGS. 4 and 5 depict another exemplary embodiment of the present
disclosure. As shown, a patch 300 is located on the surface of tire 100.
Patch 300 can be formed from any of a variety of materials, including
rubber materials, elastomeric materials and/or polymeric materials. Patch
300 provides mechanical support for circuit board 400. Circuit board 400
can include a temperature measurement circuit for determining temperature
measurements from signals provided through conductive leads of
thermocouple 200.

[0041] Patch 300 includes a first support element 310 embedded within
patch 300. First support element 310 can have a degree of rigidity so as
to provide mechanical support for circuit board 400. First support
element 310 can be composed of any insulating or non-conductive material,
such as, for example, FR4. First support element 310 can be bonded to
patch 300 through an adhesive such as the Chemlok® adhesive or other
suitable adhesive. In another embodiment, first support element 310 can
be formed of a hard rubber or other rigid material that is embedded,
integral, or a part of patch 300. In this embodiment, no adhesive is
necessary to bond first support element 310 to patch 300. First support
element 310 can include rounded edges to reduce strain applied to patch
300.

[0042] First support element 310 includes a pair of first and second posts
312 and 314 that extend from first support element 310. First and second
posts 312 and 214 can be attached to first support element 310 through
nuts or sockets embedded in first support element 310. In other
embodiments, first and second posts 312 and 314 can be integral with
first support element 310. First support element 310 can also include an
opening or passage for passage of the thermocouple 200. As shown in FIGS.
4 and 5, the opening or passage for passage of thermocouple 200 can be
arranged in a substantially linear relationship between first and second
posts 312 and 314.

[0043] Located above the top surface of patch 300 is second support
element 320. Second support element 320 acts as a spacer between printed
circuit board 400 and patch 300. Second support element 320 can have a
height sufficient to prevent circuit board 400 from contacting the top
surface of tire 400 when subjected to mechanical stresses, such as, for
example, during rotation of a tire. Second support element 320, similar
to first support element 310, may be formed of an insulating material,
such as, for example, FR4. The second support element 320 cooperates with
first support element 310 to provide mechanical support for circuit board
400. As illustrated, first and second posts 312 and 314 extend through
openings provided in second support element 320 and are connected to
circuit board 400. Fasteners 330 can be used to mechanically connect
circuit board 400 to first and second posts 312 and 314. Second support
element 320 can also include an opening or passage for passage of the
thermocouple 200. As shown in FIGS. 4 and 5, the opening or passage for
passage of the thermocouple can be arranged in a substantially linear
relationship between the openings for receiving first and second posts
312 and 314.

[0044] Thermocouple 200 is mounted in a passage 110 provided in tire 100.
The measurement junction and protective casing of thermocouple 200 are
retained at the bottom of passage 110 while the conductive leads of
thermocouple 200 extend through passage 110 and exit the surface of tire
100 at interface 120. The conductive leads of thermocouple 200 extend
through passage 110 provided in patch 300 and extend through the openings
or passages provided in first support element 310 and second support
element 320 until the conductive leads of thermocouple reach circuit
board 400. The conductive leads 220 are connected to a reference junction
410 that is located on circuit board 400. Reference junction 410 can be
similar to the reference junction discussed above with respect to FIG. 3.

[0045] At interface 120, the conductive leads of thermocouple 200 are
completely surrounded by patch 300. The conductive leads of thermocouple
200 remain completely surrounded by patch 300 until the conductive leads
pass through the opening in first support element 310 and second support
element 320. By enclosing the conductive leads in patch 300, first
support element 310, and second support element 320, the movement and
flexing of the conductive leads during tire rotation can be reduced.

[0046] To further reduce stresses applied to thermocouple 200 during
rotation of tire 100, circuit board 400 and patch 300 can be mounted to
tire 100 using 1-D orthogonal connection line techniques disclosed in PCT
Application Serial No. PCT/US2008/074765 and PCT Application Serial No.
PCT/US2009/042357, both of which are hereby incorporated by reference for
all purposes.

[0047] For instance, patch 300 can have a longitudinal direction
represented by line B-B' in FIG. 4, Patch 300 can be mounted to tire such
that the longitudinal direction of patch 300 is substantially
perpendicular to the direction of rotation of tire 100, which is
represented in FIG. 4 and FIG. 5 as line A-A'. First and second posts 312
and 314 in addition to passage provided in first support element 310 and
second support element 320 can be arranged in a substantially linear
relationship along a line about 80° to about 100° to the
longitudinal direction of patch 300.

[0048] When patch 300 is positioned such that the longitudinal direction
of patch 300 is substantially perpendicular to the direction of rotation
of tire 100, a primary bending direction is established in the
longitudinal direction of patch 300. The mounting of thermocouple 200,
patch 300, and circuit board 400 such that first and second support posts
312 and 314 and thermocouple 200 are in a substantially linear
relationship along a line about 80° to about 100° to the
longitudinal direction of patch 300 limits strain at and between
connections between thermocouple 200, patch 300, and circuit board 400
due to their substantially perpendicular alignment to the primary strain
direction, i.e. the longitudinal direction of patch 300.

[0049] The apparatus of FIGS. 4 and 5 can be constructed using techniques
similar to those discussed with respect to the insertion of thermocouple
200 into tire 100 of FIGS. 1 and 2. For example, patch 300 can first be
placed on the surface of tire 100. First support element 310 having first
and second posts 312 and 314 are embedded in patch 300. Second support
element 320 can be position above patch 300 such that first and second
posts 312 and 314 extend through second support element 320. Circuit
board 400 can be operably connected to first and second posts 312 and 314
extending from first support element 310 and through second support
element 320. As illustrated in FIGS. 4 and 5, a passage 110 is provided
in first support element 310, second support element 320, and circuit
board 400.

[0050] Passage 110 can be extended into patch 300 and tire 100 by drilling
patch 300 and tire 100. The passage 110 provided in first support element
310, second support element 320, and circuit board 400 can be used as a
guide for drilling passage 110 into patch 300 and tire 100.

[0051] As discussed above, thermocouple 200 can be inserted into tire 100
by first inserting thermocouple 200 into a rigid tube such that the
protective casing 208 of measurement junction 205 abuts the edge of the
tube and such that conductive leads 210 and 220 are located inside the
hollow portion of the tube. The tube/thermocouple assembly can then
inserted into the passage 110. The protective casing 208 of measurement
junction 205 is retained by compression and frictional engagement with
the sides of passage 110. The tube can be withdrawn, leaving thermocouple
200 mounted in tire 100. The conductive leads 210 and 220 can then be
placed in operable communication with a temperature measurement circuit,
for instance, by connecting conductive leads 210 and 220 to the
temperature measurement circuit at reference junction 410.

[0052] In certain embodiments, passage 110 provided in circuit board 400,
first support element 310, second support element 320, patch 300 and tire
100 can be filled with a filler material 130. Filler material 130 can be
a urethane material, epoxy material, or other suitable material. Filler
material 130 provides an added layer of protection for thermocouple 200
and serves to further reduces stresses applied to thermocouple 200 during
rotation of tire 100. In a particular embodiment, filler material 130 can
have a modulus of elasticity that is similar to the modulus of elasticity
of the material of first support element 310 and second support element
320.

[0053] Although the discussion of the present subject matter has been made
with reference to a single thermocouple mounted in a tire, those of
ordinary skill in the art, using the disclosures provided herein, should
readily understand that a plurality of thermocouples can be used without
deviating from the scope of the present invention. Such plurality of
thermocouples can be connected to a single reference junction or to a
plurality of different reference junctions and/or temperature measurement
circuits as desired.

[0054] While the present subject matter has been described in detail with
respect to specific embodiments thereof, it will be appreciated that
those skilled in the art, upon attaining an understanding of the
foregoing may readily produce alterations to, variations of, and
equivalents to such embodiments. Accordingly, the scope of the present
disclosure is by way of example rather than by way of limitation, and the
subject disclosure does not preclude inclusion of such modifications,
variations and/or additions to the present subject matter as would be
readily apparent to one of ordinary skill in the art.