Advanced BGA rework systems

Rework system for elements type: PBGA, µBGA, CSP, Flip Chip and all SMD.

BGA components mount is essentially different from other SMD components mounts. Soldering points in quantity even hundreds are located underneath of component housing which become invisible after placing BGA component on PCB. This requires soldering technology similar to multi zone soldering oven process. To avoid shortages and ensures exact connections, no less important is correct component positioning before mounting.

Performs by non contact hot air blow method with fixed and stabilized temperature. Process is performed in four stages: pre heating, soak, reflow and cooling. Each stage parameters (time, temperature and air flow) are individually selected depending on component type and size. All parameters are gathered in profile and saved in system's memory, then they can be used when needed without necessity of renewed entering. Real time process is illustrated as a graph on monitor screen, which gives complete process control and enables operator to make possible real time parameters modification.