LYON, France – February 23, 2017: “Advanced substrates are the key interconnect component of advanced packaging architectures”, comments Andrej Ivankovic, Technology & Market Analyst, Advanced Packaging & Semiconductor Manufacturing at Yole Développement (Yole).Indeed advanced substrates are critical in enabling future products and markets.To answer to technology evolution and market needs, Yole’s advanced packaging team has established a stand-alone dedicated advanced substrate activity, focused on exploring the market and technologies of PCBs , package substrates and RDLs . And today, the “More than Moore” market research and strategy consulting company announces its first report titled “Advanced Substrates Overview: From IC Package to Board”. This technology & market analysis serves as an overview of advanced substrate technologies, markets, and supply chain, to be supported by subsequent in-depth reports.Advanced substrates are a key enabler of future products and markets. Yole’s analysts offer you a special focus on this industry and its competitive landscape.

The board vs. FC substrate area is characterized by the transition from the subtractive to the mSAP process, and competition between board and substrate manufacturers. Evaluation of “substrate-like PCBs” is already under way at OEMs, and so too the potential new integration opportunities they could bring. Furthermore, developments in FC substrate, FOWLP, and 2.5D/3D packaging have created an immense competitive arena for L/S < 10/10 um packaging, with a large variety of solutions coming from business models across the supply chain including IDMs, foundries, OSATs, WLP houses, substrate manufacturers, and EMS.

As shown in figure 2, the transition to substrates for ICs below L/S < 10/10 um has begun, led by application processors/basebands in FOWLP and advanced FC substrates, and the first GPUs in 2.5D/3D TSV configuration. The “below L/S < 10/10 um” advanced substrate roadmap is open, with intense R&D underway and each manufacturer developing strategies and targets for their respective solutions….

Yole’s advanced substrates report is an overview of the technology status and market evolution. It will be followed by further in-depth reports. Today, with this first edition, the objective is to provide an overview of board, substrate and RDL interconnects, analyze the technology trends and assess future development of the advanced substrate market. A detailed description of the report is available on i-micronews.com, Advanced Packaging reports section.

The Fan-Out platform’s excitement has clearly caught the attention of the advanced packaging industry as well as advanced substrate manufacturers. Day to day, Yole’s advanced packaging team is enlarging its know-how to understand the technical and economic issues.Analysts are daily interacting with advanced packaging leaders to turn research results into strategies and define a long-term view of the business.To point out its commitment towards the advanced packaging community, Yole is playing a key role within the program of the 13th International Conference and Exhibition on Device Packaging (March 6-9, 2017 - Fountain Hills, Arizona USA). The consulting company announces two presentations on March 7:• What is driving the 3D TSV technologies business? Santosh Kumar, Sr Technology & Market Analyst, Yole• FOWLP: market & technology trend. Jérôme Azemar, Technology & Market Analyst, Yole