The
physical vapor deposition (PVD) equipment market is projected to
register at a CAGR of 8.9% during the forecast period, 2018-2023.

Traditionally,
the consumer electronics market constantly demands higher power
dissipation, faster speeds, and higher pin counts, along with smaller
footprints and lower profiles. The miniaturization and integration of
semiconductors have given rise to smaller, lighter, and more portable
devices, like tablets, smartphones, and the emerging IoT devices. With
each technological iteration, consumer electronics product are becoming
smarter, lighter, and more-energy efficient than previous generations.

Even
the biggest smart phone brands, like apple and Google, are implementing
water resistance and tamper proof solutions to meet their consumer
requirements. The Apple's 2007 version of iPhone had involved just two
wafer level packaging. By the third iteration of iPhone, the device
consisted of seven wafer levels packaging. By 2016, the iPhone 7 series
had about 44 wafer levels of packaging in the device. This is the case
with all the other consumer electronics giants in the market, and this
is driving these vendors to make hardware that is more reliable, using
PVD technology.Companies Mentioned