Custom Thermal Gaskets

THERMAL MANAGEMENT

HIGH SPEED PROCESSORS AND HIGH DENSITY ELECTRONIC PACKAGES GENERATE SIGNIFICANT HEAT THAT CAN COMPROMISE THE PERFORMANCE AND LIFETIME OF COMPUTING DEVICES AND ELECTRONIC SYSTEMS. FABRITECH INCORPORATES THERMAL ELASTOMERS TO HELP PROTECT YOUR ELECTRONICS THROUGH EFFECTIVE THERMAL MANAGEMENT.

Fabritech’s elastomer products use thermally conductive materials, which remove and distribute heat buildup for reliable and efficient system operations. Materials are formulated to either isolate heat or effectively conduct and transfer the heat buildup.

Our elastomer thermal pads fill the gaps between the heat generating components and heat dissipating surfaces (heatsinks) to maximize thermal dissipation, while forming an electrically-insulating layer between the two surfaces. These materials can be used with or without a reinforcing carrier.

Products:

Product Specifications

Take a look at the details below for information about the specifications & capabilities of our Elastomeric Tooling products.

Materials

Boron-nitride-filled silicone elastomer, low modulus, filled-silicone polymer on a rubber-coated fiberglass carrier, silicone polymer (acrylic is available as well) that is combined with a thermal medium.