SUPPORT SUBSTRATE, LAMINATE WITH SUPPORT SUBSTRATE, AND METHOD FOR MANUFACTURING PACKAGE SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT

Abstract:

A method for manufacturing a package substrate for mounting a semiconductor element, including: a first laminate readying step for readying a first laminate having a resin layer, an adhesive layer provided on at least the side of one surface of the resin layer and provided with a peeling means, and a first metal layer provided on the adhesive layer; a first wiring formation step for etching the first metal layer and forming a first wiring conductor on the first laminate; a second laminate formation step for laminating an insulating resin layer and a second metal layer in the sequence listed on the surface of the first laminate on which the first wiring conductor is provided, and forming a second laminate; a second wiring formation step for forming, in the insulating resin layer, a non-penetrating hole reaching the first wiring conductor, performing electroplating and/or electroless plating on the insulating resin layer in which the non-penetrating hole is formed, and forming a second wiring conductor on the insulating resin layer; and a peeling step for peeling at least the resin layer from the second laminate on which the second wiring conductor is formed.