Appli-Thane® 7300

2.5 W/mK

Ideal for aerospace applications as it meets NASA’s outgassing requirements. The cured material’s ability to not crack or harm bonded rigid components during thermal cycling is a major plus. Appli-Thane® 7300 is also used in manufacturing and automated dispensing applications due to its 4-hour pot life. Provides best-in-class thermal conductivity for applications requiring aggressive heat dissipation of components.

Uncured

Work Life

4 hours @ 25°C

Viscosity

Paste @ 25°C

Shelf Life

6 months @ -40°C9 months @ -60°C

Cure options

2 hours @ 96°C4 hours @ 72°C2 weeks @ 25°C

Cured Properties

Based on cure of 2 hours @ 96°C

Color

Blue

Shore A Hardness

95

Shore D Hardness

45

Glass Transition Temp (°C)

-40

Density (g/cc)

2.8

Lap Shear 2024T3 Clad (psi)

500

Tensile Strength (psi)

450

Tensile Modulus (psi)

9,500

Compressive Strength (psi)

1,400

Compressive Modulus (psi)

14,500

Elongation (%)

5

Poisson’s Ratio

0.38

Electrical Properties

Based on cure of 2 hours @ 96°C

Dielectric Constant

16 @ 10 kHz14 @ 100 kHz11 @ 1 MHz

Dissipation Factor

0.00 @ 10 kHz0.07 @ 100 kHz0.18 @ 1 MHz

Dielectric Strength (volts/mil)

650

Volume Resistivity (ohm-cm)

1.0E 13 @ 400 VDA

Thermal Properties

Based on cure of 2 hours @ 96°C

CTE below Tg (ppm/°C)

25

CTE above Tg (ppm/°C)

75

Glass Transition Temp (°C)

-40

Operating Temp. Range (°C)

-100 to 160

Thermal Conductivity (W/mK)

2.5

Outgassing Properties

Based on cure of 2 hours @ 96°C

TML (%)

0.19

CVCM (%)

0.03

WVR (%)

0.04

Outgassing Properties

Based on cure of 2 weeks @ 25°C

TML (%)

0.12

CVCM (%)

0.01

WVR (%)

0.03

Acoustic Properties

Velocity (m/s)

2,145

Impedance (MRayles)

6.28

Loss (dB/cm-MHz)

-16.5

Density (g/cc)

2.8

Key Features

High Thermal Conductivity

Meets NASA Outgassing Requirements

Electrically Insulative

Semi-flexible

Superior Thermal Cycling

Hydrolytic Stability

Ideal for Electrical Potting

Injectable

Long Pot Life

Low Glass Transition Temperature

Low Modulus

Self Leveling

Solvent Resistant

The data contained herein is provided for informational purposes only and are believed to be reliable. APPLI-TEC does not guarantee suitability of this product for any resultant application or freedom from patent infringement. Furthermore, APPLI-TEC disclaims any liability for incidental and consequential damages of any kind including but not limited to lost profits.