The THS6002 contains two high-current, high-speed drivers and two high-speed receivers. These drivers and receivers can be configured differentially for driving and receiving signals over low-impedance lines. The THS6002 is ideally suited for asymmetrical digital subscriber line (ADSL) applications where it supports the high-peak voltage and current requirements of that application. Both the drivers and the receivers are current feedback amplifiers designed for the high slew rates necessary to support low total harmonic distortion (THD) in ADSL applications. Separate power supply connections for each driver are provided to minimize crosstalk.

CAUTION: The THS6002 provides ESD protection circuitry. However, permanent damage can still occur if this device is subjected to high-energy electrostatic discharges. Proper ESD precautions are recommended to avoid any performance degradation or loss of functionality.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PowerPAD is a trademark of Texas Instruments Incorporated.

PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.

The THS6002 is packaged in the patented PowerPAD package. This package provides outstanding thermal characteristics in a small footprint package, which is fully compatible with automated surface mount assembly procedures. The exposed thermal pad on the underside of the package is in direct contact with the die. By simply soldering the pad to the PWB copper and using other thermal outlets, the heat is conducted away from the junction.

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTE 1: The THS6002 incorporates a PowerPad on the underside of the chip. This acts as a heatsink and must be connected to a thermal dissipation plane for proper power dissipation. Failure do so can result in exceeding the maximum junction temperature, which could permanently damage the device. See the Thermal Information section of this document for more information about PowerPad technology.