ASML (Veldhoven, the Netherlands) announced earlier this year that it was willing to sell up to 25 percent of the company to chip vendors that wish to participate in its EUV and 450-mm development programs.

Samsung, Intel and TSMC are supporting the development of EUV lithography to replace 193-nm optical lithography for future chip scaling. All three are also eager to move to 450-mm wafers from current 300-mm wafers to improve their profit on each wafer processed.

Samsung's investment completes ASML's five-year program for EUV and 450-mm R&D, ASML said, bringing the total investment from the chip firms to 1.38 billion euro (about $1.72 billion). ASML said it wouldn't solicit participation from any other customers. See related stories: