Figure 5X-ray reflectivity curves from a mechano-chemically polished silicon (100) wafer. Curves a and b were obtained with data collection times of 1000 and 10 s, respectively. Curves c and d were obtained with data collection times of 1.0 and 0.1 s, respectively, after rotating the sample to lower the glancing angle in order to enhance the incident beam intensity I0 in the covered Q-range to compensate for the short exposure time. Each curve is shifted vertically for clarity. The used X-ray energy ranges are given in the figure. Curve e was obtained by the angle-scan mode using the present reflectometer setting with a horizontal slit of 0.1 mm width downstream of the polychromator. The angle-scan curve e was obtained by connecting seven partial reflectivity curves measured using seven different X-ray energies (17.7, 18.2, 18.6, 19.1, 19.5, 19.9 and 20.3 keV). Error bars are shown for all data points of all the curves.