North American Semiconductor Equipment Industry Posts February 2008 Book-to-Bill

North American Semiconductor Equipment Industry Posts FEBRUARY 2008 Book-to-Bill Ratio of 0.93

SAN JOSE, Calif. – March 18, 2008 – North American-based manufacturers of semiconductor equipment posted $1.23 billion in orders in February 2008 (three-month average basis) and a book-to-bill ratio of 0.93 according to the February 2008 Book-to-Bill Report published today by SEMI. A book-to-bill of 0.93 means that $93 worth of orders were received for every $100 of product billed for the month.

The three-month average of worldwide bookings in February 2008 was $1.23 billion. The bookings figure is about eight percent greater than the final January 2008 level of $1.14 billion, but 12 percent less than the $1.40 billion in orders posted in February 2007.

The three-month average of worldwide billings in February 2008 was $1.32 billion. The billings figure is about three percent greater than the final January 2008 level of $1.28 billion, but about eight percent less than the February 2007 billings level of $1.42 billion.

"The three month average for North American bookings and billings improved slightly in February, however they remain at levels below those reported last year," said Stanley T. Myers, president and CEO of SEMI. “Though current inventory and utilization rates are at healthy levels, device manufacturers are being conservative in their Capex spending."

The SEMI book-to-bill is a ratio of three-month moving averages of worldwide bookings and billings for North American-based semiconductor equipment manufacturers. Billings and bookings figures are in millions of U.S. dollars.

Billings

(Three-month avg.)

Bookings

(Three-month avg.)

Book-to-Bill

September 2007

1,557.4

1,235.0

0.79

October 2007

1,477.5

1,176.9

0.80

November 2007

1,383.2

1,130.7

0.82

December 2007

1,361.7

1,156.3

0.85

January 2008 (final)

1,279.3

1,141.0

0.89

February 2008 (prelim.)

1,315.2

1,228.9

0.93

Source: SEMI March 2008

The data contained in this release was compiled by David Powell, Inc., an independent financial services firm, without audit, from data submitted directly by the participants. SEMI and David Powell, Inc. assume no responsibility for the accuracy of the underlying data.

The data are contained in a monthly Book-to-Bill Report published by SEMI. The report tracks billings and bookings worldwide of North American-headquartered manufacturers of equipment used to manufacture semiconductor devices, not billings and bookings of the chips themselves.

SEMI is the global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. SEMI member companies are the engine of the future, enabling smarter, faster and more economical products that improve our lives. Since 1970, SEMI has been committed to helping members grow more profitably, create new markets and meet common industry challenges. SEMI maintains offices in Austin, Beijing, Brussels, Hsinchu, Moscow, San Jose, Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org.

Association Contacts

Dan Tracy/SEMI
Tel: 1.408.943.7987
E-mail: dtracy@semi.org

Scott Smith/SEMI
Tel: 1.408.943.7957
E-mail: ssmith@semi.org

Editors Note:

The March 2008 SEMI Book-to-Bill Report is scheduled for publication on April 17, 2008; 3:00 p.m. PDT (subject to change).

Independently from SEMI, The Semiconductor Equipment Association of Japan (SEAJ) releases its February Book-to-Bill Report on approximately the same date. The SEAJ Book-to-Bill Report tracks billings and bookings worldwide of Japanese-headquartered semiconductor equipment manufacturers. For more information on the SEAJ data, visit www.seaj.or.jp