M/A-COM Tech Asia performs 100% on-wafer RF, DC and output power testing on the XZ1001-BD, as well as 100%
visual inspection to MIL-STD-883 method 2010. The chip has surface passivation to protect and provide a rugged part with backside via holes and gold metallization to allow either a conductive epoxy or eutectic solder die attach process.

Production samples and parts are available today from stock. The XZ1001-BD datasheet and additional product
information can be obtained from the M/A-COM Tech Asia website at www.macomtechasia.com.