Seoul Semiconductor Announces Mass Production of the New WICOP Concept LED

On September 15th at the Pudong Marriott Hotel, Shanghai, China, Seoul Semiconductor, a global leader in LED technology (www.seoulsemicon.com) announced a new product, based on the new concept of WICOP LEDs. This technology does not need processes such as die bonding or wire bonding which are necessary for conventional LED package production nor does it contain major LED package component parts such as lead-frame, or gold wire.

WICOP (Wafer Level Integrated Chip on PCB) is SSC's totally new concept LED product to overcome the limits of the existing CSP technology

WICOP (Wafer Level Integrated Chip on PCB) is SSC's totally new concept LED product to overcome the limits of the existing CSP technology

WICOP (Wafer Level Integrated Chip on PCB) is a totally new concept for an LED product which has overcome the limits posed by the existing CSP (Chip Scale Package) solutions. Seoul Semiconductor succeeded in developing and producing the product for the first time worldwide in 2012. As it is designed to directly connect the chip to PCB, there is no need for packaging processes, such as die bonding or wire bonding. In addition, as there is no intermediate substrate, the size of the chip and package is 100% the same. It is characterized by the super small size and high efficiency. It is also good for the high luminance and thermal conductivity.

In the case of the widely available product TOP LED, a variety of equipment is required for the production such as die bonding machines to attach the chip to the lead frame, wire bonding machines to connect electrodes to the gold wire, as well as material in the product itself, such as lead frame, gold wire, and adhesives required in each process. Due to this packaging process a conventional LED results in a package size larger than the actual chip size, and so is space limited as the size of the chip could not be made smaller to meet specification requirements.

CSP (Chip Scale Package) technology, derived from silicon, is a technology developed to minimize the size of semiconductor parts (package) to the size of a chip. Generally, when the size of the package does not exceed more than 1.2 times the chip, it is classified as CSP. This technology was applied to the LED industry and other companies announced products using this technology in 2012. However, as products using this technology need die bonding equipment, intermediate substrate or ceramic and silicon material to attach the chip to the PCB, it is difficult to see the technology as a complete CSP.

Seoul Semiconductor were the first to introduce a complete concept of WICOP products in which the size of the package (PKG) is the same as that of chip, and does not use other costly materials by directly attaching the chip to the PCB. It started to mass produce relevant products and supply them to client companies, thus firmly establishing its position as the leading company in the industry. Also, it secured global patents in respect to WICOP and succeeded in constructing a technological entry barrier.

Since 2013, WICOP has been supplied to main customers for use in LCD backlights and camera flashes, as well as in head lamps of vehicles. With the release of an LED package WICOP2 for use for lighting applications, Seoul Semiconductor has been able to possess a WICOP product portfolio applicable to all fields of the LED industry. Seoul Semiconductor plans to actively target an LED lighting-source market made up of luminaires, vehicle, and IT products that is currently estimated to be approximately 20 trillion ($20B) with this WICOP technology.

Mr. Kibum Nam, Head of Central Research Center at Seoul Semiconductor, emphasized that “through the development of WICOP, which is an innovative, small sized, highly efficient LED technology, the effective value of packaging equipment which was once essential in the semiconductor assembly process will noticeably decrease. As all of the parts which have been used for more than 20 years will not be necessary any more, there will be a huge change in the LED industry in the future” and that “Seoul Semiconductor has already acquired hundreds of patents in a global portfolio with respect to WICOP and will keep a close eye at how other manufacturers develop similar products using similar technology”.

About Seoul Semiconductor: Seoul Semiconductor manufactures and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination lighting, appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, deep UV LEDs, "Acrich", the world’s first commercially produced direct AC LED, and "Acrich MJT - Multi-Junction Technology" a proprietary family of high-voltage LEDs.

Samsung Electronics has announced that it has made an important upgrade in the luminous efficacy of its mid-power LED package. The LM301B was introduced to the market with the industry’s highest light efficacy among mid-power LED packages in 2017. Now, it has enhanced the efficacy considerably ...
Read more »

Tridonic initiated patent lawsuits against telecommunication retailer S-KON eKontor24 GmbH. Although District Court Munich I affirmed Tridonic’s arguments, parties agreed on a settlement for reasons of legal certainty and prompt settlement of the dispute.
Read more »

With the stray light corrected CAS 140D Instrument Systems – as a technical pioneer – is the first to offer an array spectrometer that can reliably assess the blue light hazard from light sources within the prescribed limiting values. Hitherto only double monochromators were recommended for this ...
Read more »

Edison Opto, a global LED lighting manufacturer, unveils two new products in EdiPower Series for broad lighting applications. First, the Tunable Series with superior CRI of 95 supports two output channels to enable two dimming options to dim LED lighting without a brightness drop. In addition, the ...
Read more »

Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP as one of the leading partners for research and development for surface technologies and organic electronics and Sefar AG, a leading manufacturer of precision fabrics from monofilaments, developed a roll-to-roll ...
Read more »