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WILMINGTON, MA — Rudolph Technologies, Inc. recently announced that it has received orders for over $15 million of legacy and new process control systems from a memory manufacturer based in Asia. The systems will be used by a top-tier memory chip maker as they rapidly transition high-end DRAM (DDR4, DDR5) and HBM DRAM packaging from wire bonding to advanced packaging architectures. The shift from wire bonding is needed to achieve higher data speeds, superior power distribution and thermal properties using copper pillars, micro-bumps, and through silicon vias (TSVs) for stacked chip-to-chip interconnects.Delivery of systems will be completed by the end of the first quarter, with additional orders expected throughout 2019 as memory manufacturers transition their high-speed DRAM from wire-bonded architecture to advanced packaging.“Rudolph began working with our customers’ R&D teams nearly ten years ago to develop 2D/3D measurements of the emerging copper bump process. That long-term customer engagement has resulted in systems and software that we believe to be the industry standard for advanced packaging metrology,” stated Cleon Chan, vice president of global field operations at Rudolph. “Stacking die using TSVs and micro-bumps for HBM DRAM packages requires precise control of the copper features that will ultimately make the electrical connections between the stacked memory chips and the logic chip in the same package. After significant development in the package and the process control methods, these devices are now beginning high-volume manufacturing, which is being driven by the data speed and capacity demands from big data servers and graphics applications. These new, non-wire bonded memory architectures are creating a very healthy demand for our back-end process control systems. This customer is also using Rudolph systems for post-saw film-frame inspection looking for package defects.”A combination of Rudolph’s 2D/3D inspection systems and metal metrology systems provide a total process control solution to help assure that height, diameter, location and coplanarity of copper micro-bumps, pillar bumps, and TSVs are precisely controlled. After the packages are molded and separated by sawing, additional Rudolph inspection systems provide outgoing quality checks for sidewall delamination and/or hairline cracks, which are considered killer defects for advanced memory packages.About Rudolph TechnologiesRudolph Technologies, Inc. is a leader in the design, development, manufacture and support of defect inspection, lithography, process control metrology, and process control software used by semiconductor and advanced packaging device manufacturers worldwide. Rudolph delivers comprehensive solutions throughout the fab with its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market of their devices. Headquartered in Wilmington, Massachusetts, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the Company’s website at http://www.rudolphtech.com.(NOTE: The above press release is from Rudolph Technologies via BusinessWire.)Like Wilmington Apple on Facebook. Follow Wilmington Apple on Twitter. Follow Wilmington Apple on Instagram. Subscribe to Wilmington Apple’s daily email newsletter HERE. Got a comment, question, photo, press release, or news tip? Email wilmingtonapple@gmail.com.Share this:TwitterFacebookLike this:Like Loading… RelatedWilmington’s Rudolph Technologies Receives $8M Order From Leading Asian Memory ManufacturerIn “Business”Wilmington’s Rudolph Technologies Unveils New Inspection Suite For Semiconductor ManufacturingIn “Business”Wilmington’s Rudolph Technologies Receives $11 Million OrderIn “Business”read more

Iran has offered about 50 oil and gas projects to be developed by foreign investors with local partners under a new scheme it hopes will initially generate $25 billion in investments, reported state media on Saturday, 28 November.Iran reached a deal with world powers in July, under which sanctions will be lifted in return for it scaling down its nuclear programme.It has outlined plans to rebuild its main industries and trade relationships following the agreement, targeting oil and gas projects worth $185 billion by 2020.Some 135 energy companies attended a conference in Tehran to hear the terms of a new energy contract â€” which it calls its integrated petroleum contract (IPC).”The estimate is that if we can draw about $25 billion (in foreign investments) in a first phase, that would be a very good figure,” Oil Minister Bijan Zanganeh told reporters in remarks carried by state television.Iran needs Western oil companies to help revive its ageing oilfields and develop new oil and gas projects and the new oil contracts are part of its drive to attract Western investors.British Petroleum, France’s Total, Norway’s Statoil, China’s Sinopec, Shell, Italy’s Eni, and Spanish oil major Repsol were among companies attending the conference, reported the oil ministry’s website Shana.Zanganeh repeated that US companies would also be allowed to participate in IPCs, under which foreign investors should have local partners and commit to technology transfer.”The current (crude oil) prices and even less will not create a problem for the projects’ reimbursement or profits because of low finished cost in our industry,” Shana quoted Zanganeh as saying. He added that Iran’s production cost was $10 per barrel.The price of oil has fallen to around $45 per barrel from as much as $115 in the middle of last year.Iran’s output is down one million barrels per day (bpd) to 2.7 million bpd since the start of 2012 when sanctions were imposed.read more