JunPus International Co., Ltd. is a leading Manufacturer, Supplier and Exporter ofThermal Compound, Thermal Compounds, Thermal Compound Paste with a factory in Taiwan. We supply and export consistently high class products and continually improve upon the manufacturing processes and work environment through total employee involvement and strict adherence to fair business ethics. We have gained several patents in the field. Our sincerity and hard work has helped us to match our quality with international standards. If you are interested in any styles of our products, please feel free tocontact us.We are the leading manufacturer, supplier and exporter of which are engineered from the best quality raw material and are acknowledged for their sturdy construction and durable service life. During the manufacturing process, our expert teams checks the quality of the products thus we ensure the superior products to our clients. It is primarily used in the electronics and computer industries to assist a heat sink to draw heat away from a semiconductor component such as an integrated circuit or transistor. In electronics, it is often used to aid a component's thermal dissipation via a heat sink. We are best known for satisfying customers with the efficiency and long last lasting ability of our products.

Nano Diamond Thermal Grease DX1
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This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.

This product has the following superior properties such as high chemical stability, being non-corrosive, anti-oxidation, non-toxicity, non-volatility, non-flammability, and causing no irritation to human skin. It can withstand long-term storage, does not easily solidify, and can be readily implemented to the printing and coating process.

Good performance is obtained when use JP-Dx1 for thermal conductivity of semiconductor devices, such as CPUs, ICs, High Power LED and power transistors.

Application:Main ingredients:Nanodiamond, silicon•Major applications:o Heat sink interface for the high-power chips in power source electronics such as power supplyo Heat sink interface for High Bright LED High Bright LEDo Heat sink interface for CPU in various computers or high-power chipso Heat sink interface for Graphics Processing Unit (GPU) in different display cards•This product complies with the RoHS (Restriction of use of hazardous substances) Directive: SGS no.CE/2008/12124•Thermal Conductivity:16(W/m•K)