Tag Archives: SOI

IBM is the first announced customer for GLOBALFOUNDRIES’ Fab 8 in Malta, NY. The companies plan to manufacture IBM’s 32nm SOI devices at the site using an SOI process technology. The new plant has already been facilitized with more than … Continue reading →

Last week, the first session of the International SoC Conference focused on FDSOI (fully depleted silicon-on-insulator) IC fabrication. Now if your thinking resembles mine before I watched this presentation, you think that FDSOI is an advanced IC-fabrication process that gives … Continue reading →

Cadence just published a story about working with IBM on developing advanced Spice-level simulation models for IBM’s advanced SOI (silicon on insulator) IC processes to achieve better correlation between the circuit simulation results and the actual silicon. Now you only … Continue reading →

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About the author:

Steve Leibson has appeared on television with Leonard Nimoy (Star Trek's Mr. Spock), however he's not a TV star (although he's always open to offers). He is the Cadence EDA360 Evangelist and a Marketing Director at Cadence Design Systems, the leading EDA vendor for system and chip-level design tools, design IP and IP design platforms, and verification IP. Steve’s written some of the key books about IP-based SOC design including “Designing SOCs with Configured Cores,” published in 2006 and “Engineering the Complex SOC,” co-authored with Dr. Chris Rowen and published in 2004. An experienced design engineer, Steve has been evangelizing advanced, IP-centric SOC design since 2001.