Background

There is growing interest in relying on micromachined systems for gas-handling applications. Current limitations to the adoption of this technology stem from device operation at high temperatures, thus requiring thermal isolation in addition to vacuum-sealed lead transfer and low parasitic capacitance.

Technology

Researchers at the University of Michigan have developed improved micromachined devices including a packaged micromachined pump for on-chip vacuum. The device has attained evacuation of a cavity to 0.46 atm using 80mW input power, while maintaining high thermal isolation between a polysilicon heater of the pump and the rest of the device.