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Abstract

The illustrated structures provide a conformable heat transfer structure utilizing a low melting point bismuth alloy solder in combination with an elastomeric material with embedded wires to conduct heat from a chip to a heat sink, and to confine the plastic flow of the solder.

Country

United States

Language

English (United States)

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Chip Heat Transfer Structure

The illustrated structures provide a conformable heat transfer structure
utilizing a low melting point bismuth alloy solder in combination with an
elastomeric material with embedded wires to conduct heat from a chip to a heat
sink, and to confine the plastic flow of the solder.

Effective heat transfer from a chip to the ultimate heat sink requires intimate
contact between successive members in the heat conducting path. Because of
surface irregularities in the mating members and differences in their respective
coefficients of expansion as well as the fragility of the chip, which precludes
excessive pressure, effective heat transfer across the interface requires the use
of a conformable material having a high thermal conductivity at the interface.
Additionally, the interface material must have suitable plastic flow characteristics
such that it will conform to the mating surfaces while retaining its basic shape so
as not to flow out of the interface region.

By selection of the appropriate alloy of a low melting point bismuth solder
having a solidus-liquidus temperature range of, for example, 86 degrees C to 100
degrees C, the solder residing at some temperature within this range will, through
plastic flow, provide the necessary conformable interface to the chip.
Additionally, by casting the solder in a shape complementary to both the chip and
the so-called "hat" heatsink, the plastic flow of the solder will provide a self-
healing conformable heat transfer medium between the chip and the heat sink.
To restrain the plastic flow of the solder, an elastomeric material having operating
temperatures of -55 degrees C to +200 degrees C is utilized as a gasket. This
gasket material is further provided with convoluted wires arrayed generally
perpendicular to the surfaces of the material at a density in the range of 100-150
wires per square centimeter to enhance the resilience and to some extent the
thermal conductivity of the material.

The foregoing principles are embodied in the following structures. Fig. 1
illustrates one structured embodiment wherein the chip 10, supported on
substrate 11, is overlaid with the stepped washer 12 of copper or aluminum and
the low melting point solder cylindrical plug 13. The plug 13 fits within the
cylindrical cav...