Kuek

Hsieh Ting Kuek, Melaka MY

Patent application number

Description

Published

20100124802

Method of manufacturing a semiconductor package using a carrier - A method of manufacturing a semiconductor package includes providing a carrier, forming a post slot and a terminal slot in the carrier, depositing a post in the post slot, depositing a terminal in the terminal slot, forming an encapsulant slot in the carrier, wherein the post extends into and is located within a periphery of the encapsulant slot and the terminal extends into the encapsulant slot, mechanically attaching a semiconductor chip to the post, electrically connecting the chip to the terminal, depositing an encapsulant in the encapsulant slot, and removing the carrier from the terminal.

05-20-2010

Soon-Chun Kuek, Rock Hill, SC US

Patent application number

Description

Published

20100098835

Compensation of Actinic Radiation Intensity Profiles for Three-Dimensional Modelers - There is provided methods and apparatus for compensation of intensity profiles of imagers used in three-dimensional modelers. The intensity profile of the actinic radiation projected from the imager is determined by a variety of techniques, including but not limited to manually operated sensors, exposed and scanned actinic radiation-sensitive paper, and intensity profilers. Once the intensity profile of the imager is determined, each layer of the solidifiable liquid material is cured by projecting a plurality of patterns (as opposed to a single pattern) defining the two-dimensional cross-section of the part being cured. The patterns vary in duration, number, and/or shape to correlate to the intensity profile so that a single layer of selectively cured solidifiable liquid material is cured with a substantially equivalent (or otherwise controlled) amount of actinic radiation per unit of surface area to provide generally controlled and consistent part quality.

04-22-2010

20120007288

Compensation of Actinic Radiation Intensity Profiles for Three-Dimensional Modelers - There is provided methods and apparatus for compensation of intensity profiles of imagers used in three-dimensional modelers. The intensity profile of the actinic radiation projected from the imager is determined by a variety of techniques, including but not limited to manually operated sensors, exposed and scanned actinic radiation-sensitive paper, and intensity profilers. Once the intensity profile of the imager is determined, each layer of the solidifiable liquid material is cured by projecting a plurality of patterns (as opposed to a single pattern) defining the two-dimensional cross-section of the part being cured. The patterns vary in duration, number, and/or shape to correlate to the intensity profile so that a single layer of selectively cured solidifiable liquid material is cured with a substantially equivalent (or otherwise controlled) amount of actinic radiation per unit of surface area to provide generally controlled and consistent part quality.

01-12-2012

Soon-Chun Kuek, Fort Mill, SC US

Patent application number

Description

Published

20120133080

Additive Manufacturing Methods for Improved Curl Control and Sidewall Quality - There is provided methods and apparatus for improving the accuracy of three-dimensional objects formed by additive manufacturing. By depositing or hardening build material within the interior of the layers in certain patterns, the stresses that lead to curl in the object can be isolated and controlled. Similarly, certain patterns for depositing or hardening the build material provide for reduced layer thicknesses to improve the sidewall quality of the object being formed. The patterns within the interior of the layers can include gaps or voids for particular layers being deposited or hardened, and the gaps or voids can be partially filled, fully filled, or not filled at all when subsequent layers are deposited or hardened. Accordingly, the accuracy of three-dimensional objects formed by additive manufacturing is improved.