Advantages & Application Notes:- Extended pot-life and can be cured at relatively low temperatures such as 80°C. - Designed to be used in the 300°C range for applications such as wire bonding operations and eutectic lid-sealing processes. - Contains no solvents or thinners. NASA approved, low outgassing epoxy – http://outgassing.nasa.gov/- Also suggested for hybrid - aerospace circuits found in Rf / Microwave devices like cockpits and satellites. - Paste-like rheology allows for application by commercial dispensing equipment, stamping, screen printing, or by hand with spatula or toothpick. - Compatible with Au-plated ceramic substrates found in traditional and custom hybrids.