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Description/Abstract

The increasing influence of computational modelling in all technologicalprocesses generates an increased demand for accurate values of the physicalproperties of the materials involved, which are used as fundamental inputsfor every model.In the production of electronic circuits, a thorough knowledge of thethermal conductivity of molten solders can result in a better controlledsoldering process. As a result, this information can be used for setting theoptimum soldering profile and thereby lead to improvement in the qualitycontrol of the solder joints.This paper describes the principles of the experimental technique employedfor the measurement of the thermal conductivity of molten solders anddescribes the essential features of the instrumentation. The values of thethermal conductivity of different lead and lead-free solder compositions,measured at various temperatures and temperature profiles, are comparedand briefly discussed.