Using custom I/O panels, expandable sidewall modules and a host of application specific PC104e I/O expansion cards, the F-Series Platform can be easily modified to take on additional I/O including video compression and frame grabbers, ARINC and 1553 cards, Ethernet and Ethernet switching plus FPGA and GPGPU processing.

The new F-Series Platform takes full advantage of Intel's cutting edge processor and all its capabilities, including the 8-series QM87 PCH chipset, making the system useful where multi-core processor performance is needed in space constrained, rugged or extended temperature environments.

By combining a suite of high speed I/O with a high performance HD4600 graphics engine, the F- Series enables unparalleled performance for countless applications. These include radar and sonar processing; image signal processing; hyperspectral imaging; tactical command and control; surveillance and reconnaissance in defense; transportation, mining and industrial applications.

The rugged system platform incorporates a thermally conductive base as well as ribbed sidewalls and fins to provide convection and conduction cooling for superior thermal management. The mission computer, which can withstand external temperatures of -40°C to +70°C, is designed to meet MIL-STD-810F, ensuring reliable performance in high shock and vibration applications.

Offered in three different modular chassis sizes to fit different configuration environments, Elma's new F- Series Platform ensures optimal performance while meeting SWaP requirements.