Advantech, ARM, Bosch Sensortec, Sensirion, and Texas Instruments are to co-operate on a physically interchangeable standard for wireless IoT sensor nodes and have started an industry body.

Based on the 22x30mm M.2 (also known as NGFF – next-generation form-factor) physical shape, developed for computer expansion boards, it is to be know as M2.COM and will combine wireless technology, a microcontroller and networking capability. The industry body will share the M2.COM name.

“One of the key challenges hindering a fast growth of sensor-enabled devices in IoT relevant markets is the lack of widely adopted open -platform” said Bosch v-p marketing Jeanne Forget. “For Bosch Sensortec, it’s therefore essential to actively participate in developing open platforms like the M2.COM. We believe that through the collaboration of these partners the M2.COM open platform will become a driver for sensors in IoT markets.”

The idea is that companies will be able to develop their own sensor boards, into which the small M2.COM board is plugged to provide intelligence and radio links.

“You no longer need to put everything into one sensor but can develop M2.COM and your sensor carrier board separately,” said M2.COM. “Now the sensor maker can choose different M2.COM modules to transmit data by different methods, and the module maker can develop another M2.COM module that supports many sensors.”