HM-2 Thermally Conductive Adhesive Film is currently being used or evaluated for a variety of Thermal Interface Material applications, including die attach, , LED assembly, heat pipe attachment, heat sink attachment and production dice thermal test equipment. An on-going product improvement program (see PowerPoint presentation) has already demonstrated lower total thermal resistance and this will be incorporated into our production process in the near future. A combination of lower interface resistance and higher bulk conductivity will be needed to reach our HM-2 performance Goal.

HM-2 Application Bonding: See Thermoplastic Film Bonding Page, Section A. All instructions for NTP/TP-3 also apply to HM-2 since they all use the same thermoplastic resin.