IoPP Packaging & Leadership Conference features Ronald deVlam, CEO, Webb deVlam Often, innovation isn't about inventing. It's about reinventing. In his don't-miss session at IoPP's Packaging & Leadership Conference - taking place May 10-11 at the Hyatt Regency O'Hare in Rosemont, IL - Ronald deVlam, General Manager and CEO, Webb deVlam, will guide attendees through the packaging innovation roadmap, which begins with the brand, the business, and the consumer. Supported by successful case studies, he'll shed light on the ingredients for innovative design, discuss the role of macro and micro trends, and how, by combining all of these ingredients together with a creative team, you can create memorable and practical design for today, and for the future. Ronald is just one of the dynamic speakers you'll hear at the conference, which is designed to deliver critical information to professionals who design, manage and influence how products are packaged. Also included is an exclusive networking reception, taking place on May 10, just before the much-anticipated AmeriStar and IoPP Honors & Awards Dinner. On May 11, the conference focus shifts to Leadership, and provides a forum for IoPP members to exchange ideas and explore the future of the Institute. Register now!

IoPP Packaging Education Scholarship Fund deadline March 18IoPP is proud to offer four $2,500 academic scholarships for 2011/2012 to recognize exceptional college students headed for a career in packaging. The scholarships have been created to support packaging education and to raise awareness of packaging as a career choice. The scholarships are funded by founding supporters, including the Central Ohio, Minnesota, Tejas and Chicago IoPP chapters and IoPP benefactor companies. Deadline for applications is March 18. Please submit now.

Packaging Machinery: Basics close to selling out! Register now!Often, professionals who are responsible for package development have little formal training in packaging machinery. Packaging Machinery: Basics, taking place March 28-30, 2011 at Frain Industries in Franklin Park, IL (near Chicago's O'Hare Airport), is for working professionals who need to know more about machinery and how it integrates into the package development process. Taught by John Henry CPP, this course is close to selling out, so please register now to ensure your spot in the class.

IoPP to sponsor the 2nd China Safe & Sustainable Packaging Summit 2011 IoPP is pleased to be announced as a sponsor for the 2nd China Safe & Sustainable Packaging Summit, taking place March 23-25 in Hangzhou, China. This global event helps attendees understand China's packaging market and make appropriate strategies to strengthen their businesses in China. Besides government officials' in-depth analysis of pertinent policies and regulations in China, speakers from word-leading packaging manufacturers and brand owners will share with you their practice of sustainable packaging including sustainable resource use, low cost production, customer-friendly packaging and waste reduction through speeches and real-life case studies.