Graco Advanced Fluid Dispense (AFD), a world leader in fluid handling products and systems, announces the Therm-O-Flow® Bulk Hot Melt System, an ideal fit for moisture block coating applications in the cable industry. With material throughput capability 200 percent greater than the leading competitor, Therm-O-Flow systems have been designed ...

Developed for high-energy pulsed Q-switching infrared laser applications, a new, high-absorption samarium oxide glaze from Morgan Advanced Materials means it is now able to offer three grades of glaze for laser systems. The samarium glaze absorbs radiation at the Nd-YAG lasing wavelength of 1,064nm, and its further ...

Morgan Advanced Materials (MGAM) announces its extensive range of ceramic capacitors for high voltage DC and AC and high power radio frequency (RF) applications. MGAM’s line of high voltage ceramic capacitors includes high voltage encapsulated discs, live line capacitors, and voltage multiplier assemblies, as well as ...

Microsemi has announced its new high reliability PD-OUT/SP11, an outdoor-rated lightning protection device supporting both Power-over-Ethernet (PoE) and non-PoE enterprise installations. The new Microsemi PD-OUT/SP11 is a single-port device, protecting all eight wires of the Ethernet cable ...

Morgan Advanced Materials has announced new solutions in sacrificial wear layers to extend the life of alumina or beryllia electrostatic chucks (ESCs) for semiconductor, solar, and LED applications. Applied as a final protective layer, the Diamonex technical hard-coats offer extended...

DELO now offers a UL 94-V0 flame-retardant adhesive. DELO-DUOPOX FR898 is a two-component adhesive that is self-extinguishing and has a very low burn time. Designed for use in switches, connectors and relays for electronics as well as in electric motors for mechanical engineering...

AI Technology (AIT) has introduced a new Flip-Chip Underfill solution that combines a High Tg of >240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices...

DELO now offers a special heat-curing adhesive that cures to full strength in temperatures as low as 60°C. The new DELOMONOPOX LT204 epoxy resin minimizes thermal stress and warping of components being bonded, making it ideal for optical packaging applications...

The new Beckhoff EQxxxx EtherCAT Box I/O series in durable V2A stainless steel housings are rated at protection class IP 69K. As a result, these rugged and robust I/O modules are designed for use directly on machines in application areas...