Laser texturing is extensively investigated for modifying surface properties. A continuous wave (CW) fiber laser (λ=
1090nm) was used to pattern a silicon wafer surface in ambient and O2 atmosphere respectively. The O2 gas stream was
delivered through a coaxial nozzle to the laser spot. Characterization of the patterned features was carried out by surface
profiling, scanning electron microscope (SEM), energy dispersive X-ray spectroscopy (EDS or EDX), Raman
spectroscopy, and X-ray photoelectron spectroscopy (XPS). Formation of laser-induced silicon oxide sub-micron bumps
was observed, which were analyzed and shown to cause changes in surface wetability and reflectivity.