Synopsys and UMC Collaborate On Signal Integrity Test Chip

2/4/2002 - Synopsys, Inc. (Nasdaq:SNPS), the technology leader for complex integrated circuit (IC) design, and UMC (NYSE:UMC), a world-leading semiconductor foundry, today announced they have taped out a test chip for researching signal integrity effects for designs developed in UMC's 0.13 micron Fusion process. The chip, dubbed ATG-SI, contains test structures that allow the study of multiple threshold voltages, inductance effects and model extraction. The chip also tests other signal integrity issues, including crosstalk and noise, which affect the performance and reliability of today's aggressive system-on-chip (SoC) designs. Both Synopsys and UMC are committed to addressing the needs of digital, analog, RF and mixed-signal designers who are targeting their designs to 0.13 micron and below copper process technologies.