PRODUCTSMultichip Package

Overview

Multichip Package is packed with different types of memory. It has both NAND and Mobile DRAM within one package, which provides cost benefits and advantages in space allocation when mounted onto the system.
MCP allows flexibility for various physical sizes of any smartphone design. By packing two memories into one package, it saves space by half. This is the main advantage that leads smartphones to adopt eMCP, a package with consisting of eMMC and DRAM.