Popular

August 28, 2008

New Line of High Performance Gap Fillers Meets Customer Need for Various Levels of Conductivity and Compression Force

by Sam Savage

WORCESTER, Mass., Aug. 28 /PRNewswire/ -- The Composites Division of Saint-Gobain Performance Plastics Corporation (SGPPL) introduces ThermaCool(R) TC2006, TC3006 and TC3008, a new line of high performance gap fillers developed specifically to meet the demanding requirements of printed circuit boards, power supply devices and other electronic applications. These products are available in industry-leading 24" x 24" sheets, maximizing converter efficiency.

These super soft and compliant gap fillers deliver excellent thermal conductivity for exceptional heat transfer, and can accommodate materials of varying coefficients of thermal expansion. Their low compression force enables them to span multiple components with minimal pressure, making them particularly effective as board sizes continue to shrink. Intrinsically tacky, they require no adhesive and can also be ordered with fabric or scrim surfaces.

-- TC3008 - High performance gap filler useful for higher conductivity applications in which compression is more than 10%.

"Because of the market need for various levels of conductivity and compression, we purposefully looked to develop not just one product, but an entire line that would meet customer requirements," says Business Development Manager Steven Jette. "We are very excited to launch this line after more than two years of research and development. Initial response from both converters and end-users has been extremely positive with respect to quality, performance, and our pricing levels."

SGPPL is part of Saint-Gobain, a leading producer of construction products, flat glass, high-performance materials and packaging, and Europe's largest distributor of building materials. Headquartered in Paris, Saint- Gobain had worldwide sales of more than $59 billion in 2007 and has more than 207,000 employees in 56 countries.