Technology

NEXT sensors are produced in materials only a few micrometers thick. The material is applied on top of rigid substrates (glass) or flexible substrates (PET) creating both rigid and flexible fingerprint sensors.

Requirements

In order to meet the requirements of all mass market environments, the smart card industry has over decades developed testing regimes and standards. NEXT sensors are built to be compliant with all requirements and standards, including the ISO/IEC 10373-1:2006, defining requirements of card bendability.

NEXT sensors are tested with industry standard tools for bending in all directions.

Physical flexibility

Smart card standards flexibility at full sensor size

NB-0610-S2 - Full physical flexibility fingerprint sensor

Industry testing regime compliance

Biometric smart cards with NB-0610-S2 chipset have been proven to withstand dynamic and torsional bending as per ISO/IEC 10373-1:2006.

Read more about NEXT full physical flexibility fingerprint sensor NB-0610-S2

NEXT Biometrics

NEXT sensors are tested with industry standard tools for bending in all directions.

NEXT Biometrics

NEXT Biometrics patented technology called NEXT Active Thermal™ enables NEXT to produce large-size, high performance fingerprint sensors at industry’s best cost per area pricepoint.