New memory packaging IP packs multi-gigabit capacity in a small form factor

A multi-die, face-down design approach delivers the memory capacity and performance of a small-outline dual in-line memory module (SODIMM) in a miniature, soldered-down, ball grid array (BGA) package. Developed by Invensas Corp., DIMM-in-a-package IP opens the way to the production of ultra-small-form-factor memory modules—for example, fitting four memory chips in a 16 x 16 x 1.0mm form factor. This Quad Face Down (QFD) wirebonded package can be assembled in a single pass for a per-die assembly cost of less than single-die packaging. The package consists of two DRAM die mounted face down on a multi-layer organic window substrate along with two spacer die. Atop this lower structure, two more DRAM die are mounted rotated 90 degrees relative the lower die. Because there are no topside wire loops, the package minimizes topside encapsulation. As a result of the reduced stack height and the lateral displacement of the DRAM die, the package dissipates heat more effectively than conventional designs.

The platform features a common package outline but supports a range of memory technologies including DDR3, DDR4, GDDR5, and LPDDR3 with compatible ballouts. As such, the same test infrastructure can be used for all types, increasing manufacturing efficiency while minimizing capital investment.

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