In an attempt to further popularize ultra-small form-factor systems, Intel Corp. plans to sell specially-designed cooling solutions for thin-ITX platforms.

As personal computers become thinner and smaller, they require smaller components. There are small mainboards, tiny graphics cards and miniature solid-state drives. While nearly everything inside the PC has been getting smaller thanks to advanced process technologies and due to overall trend towards miniaturization, cooling solutions has been growing in sizes in the last decade. In a bid to help system manufacturers to make powerful systems smaller, Intel will offer custom-designed active thermal solution HTS1155LP, according to an Intel roadmap published by MyCE web-site.

Intel HTS1155LP active thermal solution is designed for ultra-thin desktops and is currently compatible with Intel’s own DH61AG mainboard as well as all thin mini-ITX H6x-based mainboards from other vendors. The system relies on a relatively small heat-sink that weighs 264 grams, three heat-pipes as well as a blower with 1180 – 3380rpm fan speed. The blower comes with 4-pin connector, hence, its speed can controlled by firmware.

Pricing of the Intel HTS1155LP active thermal solution is unclear since it will be initially available at Intel authorized distributors primarily to system makers.