>---------->From: Andy Ingraham[SMTP:ingraham@wrksys.ENET.dec.com]>Sent: Thursday, May 01, 1997 12:24 PM>To: si-list@silab.Eng.Sun.COM; si-list@silab.Eng.Sun.COM>Cc: ingraham@wrksys.ENET.dec.com>Subject: Re: Power/ground connections/bypassing on ICs>>Thank you to everyone who contributed to my question about power>and ground connections to integrated circuits and filter/bypass>capacitors.>>So then, is there no one here who advocates running traces from IC>power/ground pins first to a bypass capacitor, and then on to the>power/ground planes?>>I thought my question might have touched off some argument, or at>least someone saying that it works in some cases. (Such as the>person who last week told me to do this for mixed-signal devices>that don't specifically need filtered power.)>>One reply mentioned removing the thermal reliefs from the vias. >Is this a common practice? Does it really make a difference?>>Regards,>Andy Ingraham>