SAN JOSE, Calif.—(BUSINESS WIRE)—September 9, 2008—
Apache Design Solutions, the technology leader in power, noise, and
reliability (PNR) signoff for chip, package, and system designs, today
announced that the company will present a technical paper on development
and validation of a microcontroller model for EMC (ElectroMagnetic
Compatibility) at the EMC Europe 2008 conference being held September 8 –
12, 2008 in Hamburg, Germany. EMC lab of Missouri University and Texas
Instruments are co-authors of the technical paper.

WHO:

Apache Design Solutions, Inc.

WHAT:

Technical session on the development and validation of
microcontroller power delivery network model for EMC with correlated
results presented by Pius Ng of Apache Design Solutions, Jason
Whiles and Haixiao Weng of Texas Instruments, and Shaohua Li, Hemant
Bishnoi, David Pommerenke, and Daryl Beetner of Missouri University.

Apache delivers the industry’s leading power,
noise, and reliability (PNR) signoff solutions for chip, package, and
system designs. Apache’s innovative platforms
consider multiple noise sources that impact the design—such
as power, signal, package / system IO, substrate, and temperature—and
enable engineers to optimize and validate their designs. Certified by
TSMC and Common Platform Reference Flows, Apache’s
products are adopted by 80% of the top IDM, fabless semiconductor, and
foundries for risk mitigation, cost reduction, and time-to-market
improvements. Apache is a global company with R&D centers and direct
sales / support offices worldwide. For more information, visit
www.apache-da.com.