Analog integration: Getting the heat out

Participate in live chat June 25th on analog integration. Experts discuss how best to get the heat out.

With more and more functionality being packed onto ICs, power dissipation increases, and with that, the die temperature rises. New methods are being developed to pull the heat out. Among the most promising is the use of a synthetic diamond material.

On Tuesday, June 25 at 2:00 p.m. ET, we will be having another chat on Planet Analog's Integration Nation site. The topic is "Analog integration is increasing: How can we best get the heat out?" This discussion will be based on my recent blog, (Synthetic) Diamonds Are a Designer's Best Friend.

We'll discuss the physics of heat conduction just a bit and then look at the details of the new technology.

We will be inviting industry experts from Element Six (synthetic diamond), Thermalloy (heat sinks), JEDEC (standards), Vicor (a unique IC thermal design), and a thermoelectric cooler supplier. As we get confirmations of our invited guests we will post updates.