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October 14th, 2003

New hybrid material has potential use in microelectronics

Abstract:
U of T scientists have developed a new class of hybrid materials combining organic and inorganic elements that could lead to improved computer chips, among other applications. The material is a porous solid that assembles itself at the molecular level and displays superior insulating properties to silica; it is categorized as a nanocomposite because the nanoscale pore size of its honeycomb-like structure is so tiny, measuring in the billionths of a metre in diameter and organic and inorganic parts are integrated into a composite structure.