Thailand – August, 2011 - Dymek Thailand complete installation for WestBond 7476EX. Ultrasonic wire bonder, the order is from one of well-know OEM microelectronic manufacturer produce the microelectronic in Thailand support major well-know semiconductor in USA and EUROPE.

The 7476EX Wedge Ultrasonic Wire Bonder to interconnect aluminum convertible or gold wire leads to various semiconductor devices between diagonal and vertical feed methods. X-Y-Z single lever micromanipulator; all axes straight-line and orthogonal, and locked pneumatically by exchange of clamps between angled and vertical wire feed methods. Machine operation, configuration, and bond settings are controlled by microprocessor and option for high and low frequency.