IBM said that a custom processor designed for the Xbox 360 console is in production at the company’s East Fishkill, New York, wafer fab and at a fab belonging to Chartered Semiconductor Manufacturing in Singapore. The chip includes three 64-bit PowerPC processor cores. Each can support two processing threads simultaneously and operate at clock frequencies of up to 3.2-GHz. The integrated circuit links together 165 million transistors and is being fabricated using IBM’s 90 nm SOI manufacturing process. The chip includes 1-Mbyte of shared secondary cache memory and an off-chip bus able to operate at 5.4Gbps / pin which amounts to an aggregated bandwidth of 21.6GB/s. IBM said that a custom processor designed for the Xbox 360 console is in production at the company’s East Fishkill, New York, wafer fab and at a fab belonging to Chartered Semiconductor Manufacturing in Singapore. The chip includes three 64-bit PowerPC processor cores. Each can support two processing threads simultaneously and operate at clock frequencies of up to 3.2-GHz. The integrated circuit links together 165 million transistors and is being fabricated using IBM’s 90 nm SOI manufacturing process. The chip includes 1-Mbyte of shared secondary cache memory and an off-chip bus able to operate at 5.4Gbps / pin which amounts to an aggregated bandwidth of 21.6GB/s.