Course Description:
Flip chip use is growing in both flip chip-in-package and flip chip-on-laminate
applications. This course will provide insight into the design and assembly
of electronics using flip chip devices. The practical issues of implementing
flip chip technology from wafer bumping to reliability characterization
are covered. This course will begin with an examination of bumping options
and corresponding design rules. Redistribution will also be discussed.
Substrate requirements for flip chip will then be presented including
a discussion of high density interconnect options and substrate design.
Assembly of flip chip devices adds materials and processes to the standard
SMT assembly process and the integration of these into the SMT process
flow is examined. Materials and processes to be discussed include lead
free alloys, fluxes, underfills (capillary flow, fluxing no-flow, and
wafer applied), substrate dehydration, flux and underfill application,
underfill curing, inspection, and underfill characterization techniques.
The presentation will conclude with a discussion of flip chip assembly
reliability testing, test vehicle design and failure analysis.

Who should attend?
This Workshop is intended for those individuals soon to be responsible
for implementing flip chip assembly, suppliers of materials and equipment
for flip chip assembly and others interested in flip chip implementation.

The Instructor:Dr. Wayne Johnson is a Professor of Electrical Engineering
at Auburn University and Director of the Laboratory for Electronics Assembly
and
Packaging (LEAP). At Auburn, he has established teaching and
research laboratories for advanced packaging and electronics assembly.
Research
efforts are focused on materials, processing, and reliability
for advanced SMT, wire bond and flip chip assembly. He has published
and presented
numerous papers at workshops and conferences and in technical
journals on flip chip assembly. He received the 1997 Auburn Alumni Engineering
Council Senior Faculty Research Award for his work in electronics
packaging
and assembly.

Dr. Johnson is currently the Technical
Vice President of the International Microelectronics and Packaging
Society. He was the 1991 President of the
International Society for Hybrid Microelectronics (ISHM). He
received the 1993 John A. Wagnon,
Jr. Technical Achievement Award from ISHM, was named a Fellow of the Society
in 1994 and received the Daniel C. Hughes Memorial Award in 1997. He is
also a member SMTA and IPC and a Fellow of IEEE.

Dr. Johnson received
the B.E. and M.Sc. degrees in 1979 and 1982 from Vanderbilt
University, Nashville, TN, and the Ph.D. degree in 1987 from Auburn
University,
Auburn, AL, all in electrical engineering. He has worked in the microelectronics
industry for DuPont, Eaton, and Amperex.

Course Description:
This course will provide an introduction to microelectronics packaging
technology for engineers, technicians and others involved in
manufacturing, processing, development, quality, sales and marketing.
Emphasis will
be on visual aids including actual samples and a variety of photos
and figures to provide the attendee with not only a solid base in how
various
microcircuits are made by various materials, processes and equipment
but also what they look like. The attendee will learn classic
hybrid definitions as well as current state of the art terminology
of materials,
processes and equipment, including: thick film technology, thin
film technology and monolithic semiconductor technology; substrates
(ceramic,
conductors, dielectrics, co-fired, LTCC); components (passives,
actives, chips vs. discrete, SMT components and flip chip); assembly
including
details of die attach, wire bonding and micro soldering, rework & repair;
final assembly including details of visual inspection techniques,
test, and failure analysis. Also covered is design, documentation standards,
acronyms, list of symbols, clean rooms and handling techniques.
Video
clips highlight various microcircuit assembly processes. Included
in the course handout is an updated glossary and list of references
the
attendee will find invaluable.

Who should attend?
This course is designed for the attendee who has little initial familiarity
with Microelectronics Packaging engineering terminology but would like
to relate it to real life, everyday applications. Ideal for, entry level
technicians and engineers but also for people in quality assurance, sales,
marketing, purchasing, safety, administration and program management.
Emphasis will be on visual aids.

The Instructor:Phil Creter is a long-time member of IMAPS, having joined
the New England Chapter of ISHM in 1974. He is a Fellow of the Society,
and has been elected National Treasurer and President of the
New England
Chapter
(twice). He received a BS in Chemistry from Suffolk University
and has published numerous papers, holds a U.S. patent, has made
many technical
presentations (received Best Paper of Session award IMAPS 1998)
and has chaired several technical sessions. He is currently a
consultant (Creter & Associates)
and has over 30 years of microelectronics packaging experience
at Polymer Flip Chip Corporation, Mini-Systems, GTE and Itek
Corporation. His past
positions include GTE Microelectronics Center Manager, Process
Engineering Manager, Process Development Manager, Materials Engineering
Manager and
Manufacturing Engineer. He currently teaches professional development
courses at microelectronics events and is a certified instructor
for the Department of Homeland Security.