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Abstract

This disclosure describes a method of solder removal from previously soldered electrical connections by using the forces produced in a centrifuge and simultaneously raising the temperature of the connectors beyond the melting point of the residual solder. The parts to be desoldered are clamped suitably in a centrifuge with the solder removal path pointing on a radius outward from the spin axis. The rate of rotation is set empirically such that the forces developed by the angular velocity of the parts are sufficient to exceed the adhesion characteristics of the solder and the connector base material. The geometry of the previously soldered connections, the mass of the residual solder,the heat gradient and the desired rate of removal will affect the speed required to accomplish the desired results.

Country

United States

Language

English (United States)

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This is the abbreviated version, containing approximately
100% of the total text.

This disclosure describes a method of solder removal from previously soldered
electrical connections by using the forces produced in a centrifuge and
simultaneously raising the temperature of the connectors beyond the melting
point of the residual solder. The parts to be desoldered are clamped suitably in a
centrifuge with the solder removal path pointing on a radius outward from the
spin axis. The rate of rotation is set empirically such that the forces developed
by the angular velocity of the parts are sufficient to exceed the adhesion
characteristics of the solder and the connector base material. The geometry of
the previously soldered connections, the mass of the residual solder,the heat
gradient and the desired rate of removal will affect the speed required to
accomplish the desired results.