OCZ Technology Group, Inc., a leading provider of high-performance solid-state drives (SSDs) and memory modules for computing devices and systems, unveils new Xtreme Thermal Exchange (XTE) and Blade 2 high-speed desktop memory, providing the optimal balance of blazing DDR3 performance and cooling efficiency in one solution. Committed to staying ahead of the curve in the high performance segment of the memory market, OCZ is offering high-end memory that keeps pace with intensive overclocking, gaming, and other high-productivity computing environments.

“Building on our previous lines of enthusiast overclocking memory, the new XTE and Blade 2 DDR3 memory series are designed to set the benchmark once again and deliver the ultimate in performance and stability,” said Alex Mei, CMO of OCZ Technology Group. “Featuring new compact, yet highly efficient heatspreader designs, these hand-tested kits are the ideal solution for overclockers gaming and productivity applications, and are optimized for the latest generation of platforms from Intel and AMD.”

Offering enthusiasts extreme speeds, Blade 2 Series features a new finned anodized aluminum heatsink design for superior thermal management, and are available in 2400MHz and 2133MHz performance kits. Other new additions include the Platinum XTE and Gold XTE Series, to be deployed in premium 2133MHz, 2000MHz, and 1600MHz solutions, coupled with a sleek low-profile anodized aluminum heatspreader design to offset high temperatures that can damage DRAM ICs.

Developed for next generation platforms that take advantage of extreme speeds, OCZ XTE and Blade 2 solutions are the choice counterparts for leading-edge performance and reliability, meeting the demand for high-speed AMD AM3, Intel Core i3, i5, and i7 processors. With an ideal combination of frequency and low latency, OCZ’s latest 6GB and 4GB memory kits are specifically designed and qualified on a range of motherboards supporting enhanced clock speeds beyond typical JEDEC profiles.

OCZ’s XTE and Blade 2 triple-channel and dual-channel kits are available in PC3-19200, PC3-17000, PC3-16000, and PC3-12800 speed ratings, and are 100% hand-tested for quality assurance. Furthermore, each OCZ module is backed by the OCZ Lifetime Warranty and industry-leading technical support for unparalleled peace of mind.

Corsair introduced a new line of PC3-12800 (DDR3-1600 MHz) memory kits based its latest memory module design, the Corsair Vengeance. The Vengeance modules make use standard height DIMM PCBs, making use of a 'light' heatsink that goes on to be slightly taller than the PCB. 'Light', because unlike the heatsinks on the Dominator modules, Vengeance's heatsink looks to consist of just thick metal plates of the heatspreader elongating into a few heatsink fins, much like G.Skill's RipJaws modules.

The world-famous DRAM module manufacturer KINGMAX presented overclocking DDR3 2400MHz Nano Gaming RAM. It is the unique and the only one DRAM module can be operated at 2400MHz without conventional heat sink. Instead of adding conventional heat sink, Nano Gaming RAM adopts the nano thermal dissipation technology（NTD Tech）to improve thermal performance by 10%. Its bandwidth can reach up to 19.2GB/sec under low voltage which means the performance will be more conspicuously improved in 3D shooting games that involve more rigorous requirements for speed.

Heat dissipation is always the key issue for the stability of system operation. Particularly in overclocking or 3D games, high temperature may easily cause the instability of operation. Targeting the overclocking and game market, KINGMAX DDR3 Nano Gaming Ram adopting NTD Tech increases the effect of heat radiation, it not only keeps the working temperature far lower than conventional heat sinks, but improves thermal dissipation performance by 10%, thereby effectively maintaining low temperature and high stability. In other words, only NTD Tech can replace conventional heat sinks and only Nano Gaming Ram can allow overclocking enthusiasts and gamers to feel free to challenge the overclocking limit.

KINGMAX Nano Gaming Ram not only has excellent thermal dissipation performance, but reaches 2400MHz and provides high speed transfer bandwidth up to 19.2GB/s with low voltage 1.65V and CL value 9-11-9-27. It exhibits great effects of 3D games. Besides that, Nano Gaming Ram has ASIC chip embedded for anti-counterfeiting purpose design to prohibit counterfeiting. Meanwhile, it supports dual channel platform of Intel P55 chipset (2200MHz above), to reach 100% system compatibility and stability, to fully satisfy the high quality requirements of overclocking and game masters.

Nano Gaming Ram series include 1600MHz, 2000MHz, 2200MHz and 2400MHz for different kind of Motherboard and CPU matches. All products have passed not only 100% rigorous tests before ex-factory delivery, but CE (EU), Intel’s XMP certifications and RoHS. KINGMAX memory modules have been well acclaimed by consumers due to their excellent compatibility, stability and outstanding overclocking performance. KINGMAX provides worldwide lifetime warranty service to exemplify its persistence on premium quality and insistence on flawless customer service.

Crucial has launched a DDR3 memory line-up, dubbed Ballistix Smart Tracer, which allows users to control activity-indicating and ground-effect LED colors and patterns. The new modules also include integrated thermal sensor that allows users to monitor memory temperature. The two rows of lights can be customized using the Ballistix MOD utility that is offered for free by Crucial.

On January 11, 2011, OCZ announced that they will be discontinuing their RAM production citing poor market performance and the weakening global DRAM market. OCZ will discontinue their remaining lines of DRAM models by the end of their 2010 fiscal year on February 28, 2011.[2]

A while ago OCZ already announced that it would pull back from the enthusiast memory market, but in the latest Third Quarter Results OCZs Ryan Petersen, CEO mentioned that it is going to halt DRAM production completely.In August 2010, the Company announced a strategic optimization of its memory products whereby it discontinued certain unprofitable commodity memory module products with the intent to continue only with certain high-performance memory products. However, since that time, there has been well-chronicled, continued weakness in the global DRAM markets. Having balanced this DRAM market weakness against the capital needs of the Company's growing SSD products, the board has determined that it is in the best interests to accelerate plans to discontinue its remaining DRAM module products by the end of its current fiscal year of February 28, 2011. Accordingly, our DRAM products are now expected to have minimal, if any, sales in the next fiscal year and beyond.