BGA Soldering PCB Manufacturing

The Ball Grid Array or BGA, is a very different package to those using pins, such as the quad flat pack. The pins of the BGA package are arranged in a grid pattern and this gives rise to the name. In addition to this, rather than having the more traditional wire pins for the connections, pads with balls of solder are used instead. On the printed circuit board, PCB, onto which the BGA components are to be fitted there is a matching set of copper pads to provide the required connectivity.

Our Capabilities of BGA Soldering PCB Manufacturing

Total Pad Size

Standard

Advanced

Capture Pad

Drill + 0.008

Drill + 0.006

Landing Pad

Drill + 0.008

Drill + 0.006

BC Mechanical Drill (Type III)

0.008

0.006

Laser Drill Size

0.004-0.010

0.0025

Material Thickness

0.0035

0.0025

Stacked Via

Yes

Yes

Type I Capabilities single & Double Deep

Yes

Yes

Type II Capabilities Buried Vias with Microvias

Yes

Yes

Type III Capabilities

Yes

Yes

Copper Filled Microvia

Yes

Yes

Smallest Copper Filled Microvia

0.004

0.0025

Copper Filled Microvia Aspect Ratio

0.75:1

1:1

Smallest Laser Microvia Hole Size

0.004

0.0025

Laser Via Aspect Ratio (Depth:Diameter)

0.75:1

1:1

Costs and Quotation of BGA Soldering PCB Manufacturing

The total costs of BGA soldering PCB manufacturing and assembly services are mainly determined by PCB dimension, laminate thickness, surface finish, layer(s), other special technical requirements (such as blind & buried via, impedance), components, numbers of soldering pads and test plan. You can send PCB files (Gerbers) and BOM to get instant quotation within 24 hours

NOD Electronics has a vast amount of expertise in Ball Grid Array PCB assembly (BGA). Our facilities house the most current BGA placement equipment as well as X-ray inspection equipment. We have developed over the years BGA assembly processes with a proven record of producing BGA circuit boards with excellent yield rates and the highest quality in the electronics manufacturing industry.