Technomelt- Low Pressure Molding

TECHNOMELT Solutions for Modern PCB and Circuitry Protection
TECHNOMELT Low Pressure Molding solutions are the benchmark for modern PCB and
circuitry protection. The simplicity of these products is their advantage: because the entire
TECHNOMELT operation takes place at low pressure, cycle time is short and fine or fragile
circuitry is not damaged. See how beneficial TECHNOMELT can be as an alternative for your
potting and encapsulating processes.

Low Pressure Molding Technology

Low pressure molding is a faster and more efficient process than conventional potting.
TECHNOMELT is a one-part material that requires no mixing or curing; reduces material
consumption through streamlined, multi-level, contour-exact encapsulation; and offers a
sustainable solution through its unique re-usable formulation and green chemistry. Integrating TECHNOMELT as an alternative to potting also reduces part numbers by eliminating the
need for a housing or additional parts to achieve strain relief.