Design, Characterization, and Packaging for MEMS and Microelectronics

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The thick metal is used primarily for the construction of low-loss signal conduction
paths, such as coplanar waveguides. ... Simulation of the various device
topologies and sizes were performed using Ansofta#39;s HFSS. [22] By utilizing the
batch mode capabilities of this software, numerous simulations were performed
with minimal user input after simulation ... [7-15, 20] Due to the large number of
experiments that are planned, the drive mechanisms for the rotating devices must
be designedanbsp;...

Title

:

Design, Characterization, and Packaging for MEMS and Microelectronics

Author

:

Paul D. Franzon, United States. Air Force. Asian Office of Aerospace Research and Development, Institute of Electrical and Electronics Engineers. South Australia Section

Publisher

:

Society of Photo Optical - 2001

ISBN-13

:

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