process of chemical vapor deposition carried out at atmospheric pressure; typically results in the inferior film quality and conformality of coating as compared to Low Pressure CVD (LPCVD).

Plasma Enhanced Chemical Vapor Deposition, PECVD

process of chemical vapor deposition in which species to be deposited are generated in plasma; as a result, deposition using the same source gases is taking place at lower wafer temperature then in conventional CVD which requires high temperature to break bonds and to release desired species from input gases; somewhat lower film quality than in the case of pure thermal Low Pressure Chemical Vapor Deposition (LPCVD).