(Cat? OR feline) AND NOT dog?
Cat? W/5 behavior
(Cat? OR feline) AND traits
Cat AND charact*

This guide provides a more detailed description of the syntax that is supported along with examples.

This search box also supports the look-up of an IP.com Digital Signature (also referred to as Fingerprint); enter the 72-, 48-, or 32-character code to retrieve details of the associated file or submission.

Concept Search - What can I type?

For a concept search, you can enter phrases, sentences, or full paragraphs in English. For example, copy and paste the abstract of a patent application or paragraphs from an article.

Concept search eliminates the need for complex Boolean syntax to inform retrieval. Our Semantic Gist engine uses advanced cognitive semantic analysis to extract the meaning of data. This reduces the chances of missing valuable information, that may result from traditional keyword searching.

Conventionally, I/O
density in CPU packages is increased by decreasing the solder bump pitch and
diameter. However, pitch reduction is limited by the solder stencil printing
used to create substrate bumps (see Figure 1).

Description

The disclosed method
is high-density I/O packaging. The method routes fine pitch, high speed I/O
bumps on a die to an interposer where fine-pitch wire bonds connect to the
substrate (see Figure 2).

The disclosed method
includes an interposer with fine-pitch pads and traces. The pads on one end of
the interposer match the fine-pitch I/O bumps on the die. The pads on the other
end of the interposer are for fine-pitch wire bonding. The interposer must be
very thin (~50 µm) and can be made of silicon or organic material. The
interposer can be prelaminated or preattached to the substrate.

The disclosed method
can be implemented using the following steps:

1. Attach fine pitch
interposer (see Figure 3).

2. Pick-and-place the anisotropic
conductive film (ACF): A patch of ACF is pick-and-placed on the substrate (see
Figure 4).