SAN JOSE, CALIF. –– April 15, 2014 ––ProPlus Design Solutions, Inc. will demonstrate its entire line of FinFET-ready Design for Yield (DFY) products for nano-scale modeling and giga-scale simulations at a series of TSMC 2014 Technology Symposium events in April and May.

The North America TSMC 2014 Technology Symposium events where ProPlus will exhibit will be held April 22 in San Jose, Calif., April 29 in Boston, and May 1 in Austin, Texas. ProPlus joins TSMC at the China Symposium in Shen Zhen May 8 and the Taiwan Symposium May 29.

NanoSpice™, a next-generation giga-scale high-performance parallel SPICE simulator able to handle more than 500-million element designs, and the core engine of BSIMProPlus™, the leading modeling platform for nanometer devices used by all major foundries for SPICE model generations