The best shaped functional integration

A high number of channels on the smallest possible PCB space characterises the CPX-L I/O modules from Festo. Behind them are the LSF-SMD PUSH IN PCB terminals.

The trend towards functional integration continues without interruption. “No innovation has had as much impact on automation, or produced such a sustainable way to lower production costs and raise productivity,” according to Eberhard Klotz, Festo‘s Head of Marketing Products and Technology.

This belief is reflected by Festo‘s combining electronic and pneumatic modules where possible, for example in the CPX automation platform with their extensive functional integration of motion control modules, servo-pneumatic positioning systems, pressure sensor modules, proportional pressure control valves or packaged solutions for security technology.

With the OMNIMATE device connection technology Weidmüller is also driving the functional integration trend forwards. The PCB terminals and connectors combine maximal functionality in a minimal format. It is therefore no wonder that Festo decided to use Weidmüller‘s connection components for their CPX-L IP20 remote I/O module. Festo profited when working in partnership with Weidmüller thanks to their long years of knowledge in the area of device connection technology and Festo also received significant support in the design-in process.

“Pre-drying is not required thanks to the LCP insulation which guarantees high structural stability without blistering. With two solder pins per pole, the LSF-SMD is adequately attached to the circuit board and does not need an additional mounting flange. An efficient automatic assembly process is further supported by the tape-on-reel packaging in standard belt widths. Optimised pick-and-place pads facilitate secure suction pick-up and placement in a fully automated SMT process.”

The LSF-SMD provides user friendly connection interfaces to Festo‘s CPX-L-I/O modules: “Our requirements were to achieve a high number of channels of digital inputs and outputs in the smallest possible PCB area. At the same time, the connection method used needed to be simple and easy to operate,” explained Hrvoje Vuksanovic, product manager at Festo.

With the LSF-SMD Weidmüller offered a perfect solution. It has a pitch of 3.5 mm and the wire outlet direction of 180° allows for high packing density with a maximum connection cross-sectional area of 1.5 mm².

“The positive result for us was a reduced number of PCBs and the associated housing was also smaller,” Vuksanovic was pleased to add. Another advantage of the LSD-SMD PCB terminals is the PUSH IN terminal system – Weidmüller‘s spring connection for direct insertion technology. A reliable contact is ensured by the direct, tool free connection. The integrated release button means that wires are simply and quickly released as needed. Compared to a screw connection method, PUSH IN saves up to 70 percent of the wiring time, compared to a tension clamp technique, around 40 percent.

As an experienced solution provider in the area of device connections, Weidmüller could perfectly meet Festo‘s requirements. These were for quick installation thanks to the PUSH IN connection system, cost reductions and competitive prices for the end customer thanks to the miniaturisation, space-saving installation in the electrical cabinet thanks to the functional integration in the best shape.