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Overview

BokarXURB-S set has an independent heating system, a Hot Plate XURB-H matching the reballing fixture. This heating method allows for reflow of reballed IC in approximately 2 minutes, which is 2 to 3 times faster and better than on any other heating system.

Specifically designed for XURB-S, the XURB-H unit has temperature controller with closed loop feedback, which guarantees proper heating rate and maximum temperature limit preventing reballed component damage; it also includes cooling fan, like no other unit in the industry to speed-up reballing time and make better quality solder balls.

Standard Bokar XURB-S System includes:

XURB-H Heating Unit with XURB-CF cooling fan

XURB-BF – Base with stencil holding frame. One universal frame holds the XURB-I insert specific for the IC body up to a size 40x40mm, and has one frame holding the stencil which is specific for balls pattern and size