Technical Conference topics

The Technical Conference provides status updates on the development of specific products and business sectors. It is industry and application oriented and promotes the ongoing development of products and business segments.

3D structural electronics

Integration of electronics and components into the housing via 3D printing, in-molding, thermoforming, or 3D MID and its application in for example automotive or aerospace.

Smart textiles

Challenges and advances in materials and integration of various functionalities in textiles.

Technical Conference Chair:

Prof. Gerwin Gelinck, TNO/Holst Centre (NL), Program Director

Poster Session

In addition to the presentations, the Technical Conference will be hosting a
Poster Session. Here, new ideas or technologies are presented in short form. The posters will be presented in the ICM foyer where theyare made accessible to all trade fair and conference visitors.

As part of this session, the authors of the posters are present to answer any questions visitors may have about the interesting and innovative issues they raise. This will take place on March 25, 2020 from 18:00 to 19:30. This event is also open to all visitors attending both the Conference and the trade fair. Here, through one-on-one discussions, guests can gain further knowledge and establish useful contacts.