Component placement is an electronics manufacturing process that places electrical components precisely on printed circuit boards to create electrical interconnections between functional components and the interconnecting circuitry in the PCBs. The component leads must be accurately immersed in the solder paste previously deposited on the PCB pads.

The placement drifts during the build about .06-.10 mm on parts. It has happened on several different builds this week. It is enough to cause some defects after reflow on small parts (0402) and rnets.

I dial it in using double sticky tape and then after 3-5 boards it is off in the x again, usually back to where it was earlier. The Y has also needed adjustment, but not quite as much.

The PCB seems clamped securely. Part heights are correct. The machine is older 13714.5 hours on the counter One other symptom this morning is the 8 pin standard soic with 1.27mm pitch parts are way off in the x. .15-.20mm