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Appeared on: Tuesday, April 03, 2012
Spansion and SK Hynix Team Up On NAND

Spansion and SK Hynix today announced an alliance to
deliver Spansion SLC NAND products at the 4x, 3x, and 2x
nodes to the embedded market.

The first Spansion SLC NAND products resulting from this
alliance will be available beginning in the second
quarter of 2012. As part of the relationship, the
companies will enter into a patent cross-licensing
agreement.

Spansion's NAND products complement its NOR offering and
complete its product line, which is targeted at embedded
applications such as automotive, industrial and
telecommunications. Spansion's SLC NAND product portfolio
will come with Spansion's customer support. Spansion said
it would apply its stringent process for qualification,
testing, extended temperature support and packaging to
its NAND products. The company plans to introduce a
family of NAND products over the next few quarters.

NOR memory is a non-volatile storage technology that does
not require power to retain data and is faster in
processing data than NAND flash memory devices, although
its storage capability is limited.

"As demand for NAND memory grows in embedded segments, we
are well positioned as we continue to broaden our
portfolio of Flash memory products to meet the stringent
requirements of the embedded industry," said John
Kispert, president and CEO of Spansion. "Our cooperation
with SK Hynix will enable us to expand our leadership in
the embedded market with serial NOR, parallel NOR and now
SLC NAND products."

"We look forward to partnering with Spansion and
leveraging each other's strengths," said Oh Chul Kwon,
President and CEO of SK Hynix. "Together we can deliver
innovative NAND products to the embedded market-
combining Spansion's leadership position and established
customer relationships across multiple embedded segments
with SK Hynix's NAND manufacturing size and scale."