5962-8767905K

Overview

The DLA SMD 5962-8767901xx is a highes- reliability Class K two-channel hermetically sealed optocoupler in a 16-Pin ceramic DIP package. Solder dipped leads and various lead form options are also available. See datasheet for details.

The product is capable of operation and storage over the full military temp range and may also be purchased as either commercial grade or with MIL-PRF-38534 Class Level H testing on the SMD. The device is manufactured and tested on a MIL-PRF-38534 certified line and included in the DLA Qualified Manufacturers List QML-38534 for Hybrid Microcircuits.

Each channel contains a GaAsP LED which is optically coupled to an integrated photon detector. Separate connections for the photodiodes and output transistor collectors improve the speed up to a hundred times that of a conventional phototransistor coupler by reducing the base-collector capacitance.

The device is suitable for wide bandwidth analog applications, as well as for interfacing TTL to LSTTL or CMOS. Current Transfer Ratio (CTR) is 9% min at IF = 16mA. The 18V Vcc capability will enable the designer to interface any TTL family to CMOS. The availability of the base lead allows optimized gain/bandwidth adjustment in analog applications. The shallow depth of the IC photodiode provides better radiation immunity than conventional phototransistor couplers.

These products are also available with the transistor base node connected to improve common mode immunity and ESD susceptibility. In addition, higher CTR minimums are available by special request.

Package styles for this die set in one, two or four channels are 8 and 16-Pin DIP thru hole, 16-Pin surface mount DIP flat pack, and 20 pad leadless ceramic chip carrier. Most devices are available with a variety of lead forms and plating options. See datasheet for details.

As the same die are used for each channel of each device listed in the datasheet, absolute maximum ratings, recommended operating conditions, electrical specifications, and performance characteristics shown in the datasheet figures are virtually identical for all parts. Occasional exceptions exist due to package variations and limitations and are as noted. Additionally, the same package assembly processes and materials are used in all devices. These similarities give justification for the use of data obtained from one part to represent other parts performance for reliability and certain limited radiation test results.

Description and Extent of Change: Avago Technologies will change the barcode label to provide for the name of country of origin in full. In doing so, the following changes will be made: (1) The naming convention for country of origin to made in (2) 2-alpha country code in both text and barcode to name of origin country of the product shipped in full (3) To provide for the required space for the country of origin, the dept ID will move moved up to the same line as vendor ID. Please see below diagram on the changes made.

Sensitive and high reliability electronic applications in areas such as space, aeronautics, military, and naval will continue to rely on high reliability hermetic components. The risks associated with using plastic electronic components in harsh and rugged environments, where components may be subjected to extremes of temperature, humidity, radiation, and shock/acceleration are just too great.

File Size: 338 KB

Language: English

03/21/2010

pdf

Create

Subscribe to Alert

Please enter your email address below to subscribe to alert updates to the document or download you have selected.