Objective:
The technology can be used for selective plating of conductive copper, nickel and other metal patterns on dielectrics that do not contain metal foils, without the usage of photolithographyApplication:

required thickness of conductors is provided by the electroless plating from solutions of copper or nickel (up to 0,2 µm) and subsequent electrochemical deposition of copper (up to 25–35 µm) or electroless nickel plating (up to 12 µm)