Sn97Ag3 Solder

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As one of the lead free Sn-Ag alloy solders,
Sn97Ag3 solder is also widely used because of good
wettability, fast soldering speed, bright and smooth solder point surface, good
fluidity and high thermal fatigue resistance. Its solidus is221 ℃, and liquidus is222℃.

Roles
of Each Element

1. Silver provides mechanical strength, but
it has weaker ductility than lead. In lead free Sn-Ag alloy solders, silver
improves resistance to fatigue from thermal cycles.

2. Copper lowers the melting point,
improves resistance to thermal cycle fatigue, and improves wetting properties
of the molten solder. It also slows down the rate of dissolution of copper.