The RIE 2000/3000 Reactive Ion Etcher is specifically designed for
anisotropic etching of microelectronic devices. This R&D sized instrument is
designed to simulate the operation of larger production instruments in
process development and pilot production applications. The RIE 2000/3000 is
a turbo pumped system capable of reaching a base pressure of less than 10-6
torr. This low base pressure provides a clean etch environment and highly
anisotropic etch without undercutting by eliminating residual species within
the chamber prior to starting the etch process. The RIE-2000 model include
as standard a two channel precision needle valve gas control and separate
vent to atmosphere line. In replacement of the needle valve set up, the
RIE-2000 can be equipped with up to two mass flow controller channels for
accurate ratio of two species. The RIE-3000 can be equipped with up to five
mass flow controller channels and in this case, the MFC controls are mounted
into a stand alone cabinet connected to the main system. The RIE-3000 can
ratio four process gas species to one species, if needed, or control the
flows of each species independently. The rotational speed of the turbo pump
can be controlled in order to set a precise pressure with the set mass
flows.[Read Brochure....]

South Bay Technology is no longer accepting web site orders. On October 4th, 2017 Ted Pella, Inc. purchased the products of South Bay Technology.
Ted Pella, Inc. is in the process of evaluating and transitioning the products of SBT, which will happen over a period of the next several months.
Please contact sales@tedpella.com for inquiries as to the status of products you wish to order.