Ensemble2 to Address the Architectural Challenges of the Data Plane with a Scalable, Standards-Based Architecture

HOUSTONMercury Computer Systems, Inc. announces at the TI Developer Conference its Ensemble2 modular platform for the data plane built around the performance, scalability, and reliability of the serial RapidIO embedded system interconnect and the Advanced Telecom Computing Architecture (AdvancedTCA).

Leveraging Mercury's renowned expertise in building efficient, scalable platforms for highly demanding applications in embedded computing, Ensemble2 is expected to deliver unprecedented levels of integration and scalability across a broad class of processing architectures that includes digital signal processors (DSPs), communications processors, FPGAs, and network processors.

The Ensemble2 platform will provide OEMs with cost efficiency and time-to- market advantages. From the lab to production, Ensemble2 is designed for next-generation infrastructure development and deployment.

Building upon the success and performance of the initial Ensemble system launched in 2004, Ensemble2 will add DSPs and network processors to the processing portfolio. "The feedback Mercury received from tier one Ensemble customers is very positive," said Mark Skalabrin, vice president and general manager, OEM Solutions Group at Mercury. "Our telecommunications customers have gained valuable insight into the capabilities of serial RapidIO as they evaluate technology options for their next-generation infrastructure platforms."

Through close collaboration with customers and silicon partners, Ensemble2 is designed to address the unique system architecture challenges of data plane applications including media gateways, radio network controllers, and routers used in mobile networks. "Ensemble2 will enable customers to move to production more quickly with RapidIO," Mr. Skalabrin added.

Ensemble2 is designed to be a fully integrated system with the essential hardware modules and software packages for seamless interoperability with the latest silicon from leading manufacturers including TI, Freescale, Xilinx, Altera, Tundra Semiconductor, and Intel. The first two data plane hardware modules to be released with Ensemble2 are a 16-slot serial RapidIO/Gigabit Ethernet switch board, and an Advanced Mezzanine Card (AMC) carrier board with four bays. The bays can be populated with a variety of RapidIO and Gigabit Ethernet-based AMCs including Mercury's E2-MTI AMC based on Texas Instruments' TMS320TCI6482 DSP.

"Ensemble2 is well-architected to provide TI silicon in a system solution that customers can immediately use to develop applications," said Alan Gatherer, chief technology officer, wireless infrastructure for Texas Instruments. "Having support for TI's serial RapidIO DSPs in Ensemble2 will enable our customers to get to market with lower risk by providing a cost- effective, standards-based environment concurrent with the availability of silicon."

In addition to the built-in performance and flexibility of the hardware, initially Mercury will make available a Linux-based system management software suite for Ensemble2 to exploit RapidIO's rich in-band management features. This will enable customers to monitor real-time performance, trap on certain events in the switch complex, and detect and mitigate the effects of errors. As a result, customers will have the ability to examine and tune applications to the underlying performance characteristics of the network in the early deployment phases of RapidIO.

For more information on Ensemble2, visit Mercury's website at www.mc.com/ensemble2.