Kit 27. 1W TDA7052 POWER AMPLIFIER

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1 Kit 27. 1W TDA7052 POWER AMPLIFIER This is a 1 watt mono amplifier Kit module using the TDA7052 from Philips. (Note, no suffix.) It is designed to be used as a building block in other projects where a battery powered, audio amplifier is required. The kit is constructed on a single-sided printed circuit board (PCB). Protel Autotrax and Schematic were used to design the board. ASSEMBLY INSTRUCTIONS Assembly is straight forward. Make sure you get the integrated circuit and the capacitors are the correct way around. The electrolytic capacitors are polarized; they have a + or - marked on them and they must be inserted correctly into the PCB. COMPONENTS Capactors: 2.2uF electrolytic C nF ceramic/mono C uF electrolytic C3 1 Kit 27 PCB 1 10K Piher log potentiometer 1 1K resistor 5%, 1/4W R1 1 Spindle for potentiometer 1 TDA7052 chip 1 8 pin IC socket 1 CIRCUIT DESCRIPTION The data sheet contains all the necessary information about the TDA7052. You may download it from the software download page on our website at Here are the main points: the module has a low component count no external heatsink is needed it is short circuit protected ideal for 3V - 15V battery operation into an 8 ohm speaker

5 FUNCTIONAL DESCRIPTION The TDA7052 is a mono output amplifier designed for battery-fed portable audio applications, such as tape recorders and radios. The gain is fixed internally at 40 db. A large number of tape recorders and radios are still designed for mono sound, plus a space-saving trend by reduction of the number of battery cells. This means a decrease in supply voltage which results in an reduction of output power. To compensate for this reduction, the TDA7052 uses the Bridge-Tied-Load principle (BTL) which can deliver an output power of 1,2 W (THD = 10%) into an 8 Ω load with a power supply of 6 V. The load can be short-circuited at each signal excursion. RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) SYMBOL PARAMETER MIN. MAX. UNIT V P Supply voltage 18 V I OSM Non-repetitive peak output current 1,5 A P tot Total power dissipation see Fig. 2 T c Crystal temperature 150 C T stg Storage temperature range C Fig.2 Power derating curve. POWER DISSIPATION Assume V P = 6 V; R L = 8 Ω; T amb = 50 C maximum. The maximum sinewave dissipation is 0,9 W R th j-a = , 110 K/W. Where R th j-a of the package is 110 K/W, so no external heatsink is required. July

9 SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our IC Package Databook (order code ). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T stg max ). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development. Preliminary specification This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications. Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. July

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