I was just told by a visitor (PCB Experts) at our company that RFID PCBs should not be built using a no clean solder flux process due to possible reliability issues. This really got my boss going and asked me to look into this. This is the first time I heard of this and I found nothing on the internet indicating that this could be a problem. Could this statement be true, is it a myth, or a fact? Please help. Thank you.