FLEX 2019 and MSTC to Highlight SMART MedTech, Transpo and IoT

Flexible and printed electronics innovations and autonomous mobility sensors will take center stage as more than 700 attendees gather for 120 market and technical presentations, 70 exhibits and four short courses at the co-located FLEX 2019 and MEMS & Sensors Technical Congress (MSTC) in Monterey, California, February 18-21, 2019.

Themed Electronics Out of the Box, FLEX 2019, the Flexible & Printed Electronics Conference and Exhibition, will highlight new form factors enabled by advances in flexible, printed and hybrid electronics. MSTC, themed Sensor Systems Enabling Autonomous Mobility, will showcase sensor innovations and emerging applications. The events cover a broad span of new applications and innovation drivers in key markets such as SMART Medtech, SMART Transportation and Internet of Things (IoT).

FLEX and MSTC will unite in the exhibition, opening keynotes, panel discussion, networking events and short courses, with the events featuring separate technical sessions. Attendees will connect with a broad group of subject matter experts and industry innovators.

FLEX 2019 and MSTC 2019 at a Glance

FLEX 2019 technical sessions will spotlight innovations in flexible and printed electronics products, equipment and materials as well as unique electronics applications they deliver, from new battery structures and antennas to bio-medical devices.

“Advances in flexible electronics, MEMS and sensors have immediate, positive impact on the world we live in,” said Ajit Manocha, president and CEO of SEMI. "FLEX 2019 and MSTC 2019 are the ideal platforms to showcase how sensors harness the power of data and improve our lives.”

The special poster session highlighting student projects related to flexible electronics or MEMS and sensors will be back by popular demand. The posters are evaluated for their scientific methods, command of the subject matter and usefulness of the ideas to the industry. Winners receive cash awards, plaques and recognition at the annual FLEXI Awards ceremony.

Keynotes include:

Ford Motor Company – The changing automotive sensor landscape

John Deere Electronics Solutions – Autonomy in agriculture to solve challenges in space, form factor, power availability and harsh operating conditions

Rogers Research, Northwestern University – The emergence of diverse, novel classes of biocompatible electronic and microfluidic systems with skin-like physical properties to enable innovations in sports and fitness

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Judy Warner speaks with Tim Redfern, Insulectro president, and Kevin M. Miller, VP of sales, about growth in the printed electronics market, the direction Insulectro is going, and opportunities for North American PCB suppliers. They note that the company will increase their focus and investment in the printed electronics market.

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FLEX 2019 and MSTC to Highlight SMART MedTech, Transpo and IoT

Flexible and printed electronics innovations and autonomous mobility sensors will take center stage as more than 700 attendees gather for 120 market and technical presentations, 70 exhibits and four short courses at the co-located FLEX 2019 and MEMS & Sensors Technical Congress (MSTC) in Monterey, California, February 18-21, 2019.

Themed Electronics Out of the Box, FLEX 2019, the Flexible & Printed Electronics Conference and Exhibition, will highlight new form factors enabled by advances in flexible, printed and hybrid electronics. MSTC, themed Sensor Systems Enabling Autonomous Mobility, will showcase sensor innovations and emerging applications. The events cover a broad span of new applications and innovation drivers in key markets such as SMART Medtech, SMART Transportation and Internet of Things (IoT).

FLEX and MSTC will unite in the exhibition, opening keynotes, panel discussion, networking events and short courses, with the events featuring separate technical sessions. Attendees will connect with a broad group of subject matter experts and industry innovators.

FLEX 2019 and MSTC 2019 at a Glance

FLEX 2019 technical sessions will spotlight innovations in flexible and printed electronics products, equipment and materials as well as unique electronics applications they deliver, from new battery structures and antennas to bio-medical devices.

“Advances in flexible electronics, MEMS and sensors have immediate, positive impact on the world we live in,” said Ajit Manocha, president and CEO of SEMI. "FLEX 2019 and MSTC 2019 are the ideal platforms to showcase how sensors harness the power of data and improve our lives.”

The special poster session highlighting student projects related to flexible electronics or MEMS and sensors will be back by popular demand. The posters are evaluated for their scientific methods, command of the subject matter and usefulness of the ideas to the industry. Winners receive cash awards, plaques and recognition at the annual FLEXI Awards ceremony.

Keynotes include:

Ford Motor Company – The changing automotive sensor landscape

John Deere Electronics Solutions – Autonomy in agriculture to solve challenges in space, form factor, power availability and harsh operating conditions

Rogers Research, Northwestern University – The emergence of diverse, novel classes of biocompatible electronic and microfluidic systems with skin-like physical properties to enable innovations in sports and fitness

Special Coverage

Real Time with… IPC APEX EXPO 2019 Show & Tell Magazine
This special I-Connect007 publication is a supplement to our other monthly magazines and brings you exclusive, in-depth coverage of the recent event.
We invite you to download your copy now.