The system consists of male shrouds that are mounted on the PCBs, and a female bullet that directly contacts the PCBs and eliminates misalignment issues when using multiple contacts. The 3 mm board-to-board spacing enables very high-density board stacking, and the .150” minimum pitch between adjacent connectors allows systems to have very high density interconnects.

Surface-mount, solder on or thread-in, solderless male shrouds are available with smooth bore and detent variants, with the female-to-female bullet adapter inserted between to complete the interconnect. The low-force, solderless installation prevents damage to the PCB, with an engage force as low as 2.8 lbs, which reduces assembly time and improves yield, and the interconnects are rated for 500 mating cycles.

Amphenol SV Microwave’s 3 mm Board-to-Board Interconnects are 50 Ω and are specified from DC to 40 GHz. The offer low VSWR and insertion loss to maintain signal integrity and minimal loss through the interconnect, with VSWR rated at 1.10:1 at 18 GHz and 1.30:1 at 40 GHz, and insertion loss at 0.30 dB at 18 GHz and 0.60 dB at 40 GHz. They can operate from -65°C to +165°C, and permit .005” of axial misalignment and .007” of radial misalignment. To learn more about Amphenol SV Microwave’s 3mm Board-to-Board Interconnects, visit Mouser.com.

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