DuPont

In Mold Electronics - New Solutions With Next Generation Materials

Santa Clara Convention Center, CA, USA

Grand Ballroom G

14 November 2018

17:00 - 17:20

Presentation Summary

In Mold Electronic technology reduces weight and saves on assembly cost by printing multilayer touch circuitry within compact spaces. And because these new electronic inks work with existing in-mold decorative processes, there's no need for costly re-tooling. Now you can create products with greater eye appeal, fewer PCB assemblies, and performance - all at the same time. Learn how DuPont has utilized its electronic inks experience to create the newest In Mold Electronic products that can help you meet consumer needs for exciting 3D designs.

Speaker Biography (Dave Hui)

Dave leads DowDuPont In-Mold Electronics Business development activities in North America region, focusing on establishing an ecosystem of IME alliances and partnership to support Smart Surfaces innovation. Prior to Business Development role, Dave joined DuPont Microcircuit Material in 2010 as a Product Development Scientist after his MSc and PhD in Material Science at the University of Manchester. His experience spans various technology solutions focusing in Printed Electronics and chemical material compatibility.

Company Profile (DuPont Advanced Materials)

DuPont Advanced Materials has 50 years of experience in the development, manufacture and sale of specialised inks for a wide variety of printed electronic applications in the display, photovoltaic, automotive, biomedical, telecommunication and consumer products markets. DuPont Advanced Materials will be exhibiting its 2nd generation of stretchable/washable inks for wearables and the latest suite of formable inks for in-mould electronics applications.

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