Economy, fabless relationships, 450mm and more on deck at The ConFab 2012

April 12, 2012 — The ConFab 2012, an invitation-only global conference and business meeting on semiconductor manufacturing, June 3-6 in Las Vegas, selected speakers and sessions for 2012 that cover the business climate for semiconductor companies in the face of uncertain economies; the impact of the “smart society” on the electronics industry; the relationship between fabless semiconductor companies, foundries, and packaging houses; insights into the technical challenges the industry faces; a fresh status report on the transition to 450mm wafers; a look at the increasing importance of 3D integration and advanced packaging, and an in-depth look at the changing requirements of legacy fabs.

Chuck Spinner, Vice President and General Manager, ON Semiconductor U.S.

Sanjay Rajguru, Director, ISMI

Gary Robertson, Division General Manager, KLA-Tencor

John Frank, Senior VP Industrial and Advanced Technology, CH2MHill

Entering its eighth year, The ConFab offers a venue for executives from semiconductor equipment and material suppliers to meet with key decision makers from semiconductor manufacturers. Attendees are pre-screened to verify that they are key participants in the buying process. The event is organized by Pennwell Corporation.

“The outlook for the semiconductor industry has never been brighter, and our program is designed to highlight new opportunities as well as coming challenges. A special thanks to this year’s advisory board for their expertise in bringing it all together,” said Peter Singer, conference chair and editor-in-chief of Solid State Technology.

FEATURED PRODUCTS

TECHNOLOGY PAPERS

View this paper to learn how Epicor ERP specifically aligns to the business needs of the electronics and high-tech industry, and hear how one electronics organization achieved improved operational controls, better inventory accuracy, and world class tools to meet supply chain requirements with Epicor ERP.July 01, 2015Sponsored by Epicor

Operational efficiency is a critical factor in the fluid processing industry. The synergy of fitting components and assembly technology to achieve this objective is the focus of Fit-LINE, Inc. Applying extensive polymer technology and injection molding expertise, the company has analyzed the design, tooling and manufacturing processes required to create high-performance solutions for demanding high-purity fluid processing applications. Through extensive R&D, testing and evaluation, Fit-LINE has isolated three variables that need to be addressed to ensure leak-free fitting assemblies.June 01, 2015Sponsored by Fit-LINE, Inc.

WEBCASTS

Jon Candelaria, Semiconductor Research Corp.’s director of interconnect and packaging sciences, will summarize a SEMICON West Semiconductor Technology Symposium Session focused on interconnects. He’ll describe the challenges for interconnect technology up to the end of the CMOS roadmap, and a few of the alternatives to address them. Next, he’ll discuss possible directions beyond the roadmap, as well as interconnectivity requirements and solution paths for emerging applications.

Increasing IoT business opportunities drive a need for new packaging techniques such as FOWLP, Embedded Component Packaging, etc. Such new assembly techniques allow more components and functionality to be integrated into an ever decreasing package space. In parallel the faster product cycle drives the need for faster production ramp to stay competitive. All these challenges highlight the need for a better methodology to determine root cause of assembly-related defects during the new package process qualification process. We will demonstrate a totally non-destructive fault localization method based on a lock-in thermography with examples in these areas.