Benefits of Low-Temp Soldering: I-007eBook Now Available

Tired of solder joint failures? Get your head off the pillow! Learn about opportunities and solutions provided by low-temperature soldering in I-Connect007’s newest micro eBook: The Printed Circuit Assembler’s Guide to… Low-Temperature Soldering.

The Printed Circuit Assembler’s Guide to… is an ongoing book series specifically dedicated to educating PCB assemblers and serves as a go-to resource for essential assembly topics.

Written by Morgana Ribas and other expert authors from Alpha Assembly Solutions, this book provides an introduction to the evolution of modern low-temperature soldering, illustrates the importance of chemistry when developing low-temperature solders, and discusses advanced and emerging applications where lower melting point alloys can provide unique assembly solutions.

“Due to the recent burgeoning in the use of low-temperature solders within the electronics assembly industry, much has been written about bismuth- and tin-based solders and solder pastes. This book does a good job of distilling out the chaff and focusing on the most relevant, valuable information available,” says Raiyo Aspandiar, senior engineer at Intel Corporation.

Readers will learn the benefits low-temperature alloys have to offer, such as reducing costs, creating more reliable solder joints, and overcoming design limitations with traditional alloys.

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The procedures described for Rolls Royce were directly comparable with those described for MBDA, and the presenters were unanimous in re-emphasising the importance of working closely with their chosen PCB fabricators at all levels and all stages of design, qualification and production of their circuit boards.

This article focuses on three different coating material groups that were formulated to operate under high thermal stress and are applied at the printed circuit board manufacturing level. While used for principally different applications, these coatings have in common that they can be key to a successful thermal management concept especially in e-mobility and lighting applications.

In a recent conference call, I-Connect007 editorial team was joined by Circuit Automation’s Yuki Kojima, VP of engineering; Larry Lindland, sales and applications manager; and Tom Meeker, CEO, for a lively discussion about solder mask. Spoiler: It’s not all about the equipment.

Printer Version

Benefits of Low-Temp Soldering: I-007eBook Now Available

Tired of solder joint failures? Get your head off the pillow! Learn about opportunities and solutions provided by low-temperature soldering in I-Connect007’s newest micro eBook: The Printed Circuit Assembler’s Guide to… Low-Temperature Soldering.

The Printed Circuit Assembler’s Guide to… is an ongoing book series specifically dedicated to educating PCB assemblers and serves as a go-to resource for essential assembly topics.

Written by Morgana Ribas and other expert authors from Alpha Assembly Solutions, this book provides an introduction to the evolution of modern low-temperature soldering, illustrates the importance of chemistry when developing low-temperature solders, and discusses advanced and emerging applications where lower melting point alloys can provide unique assembly solutions.

“Due to the recent burgeoning in the use of low-temperature solders within the electronics assembly industry, much has been written about bismuth- and tin-based solders and solder pastes. This book does a good job of distilling out the chaff and focusing on the most relevant, valuable information available,” says Raiyo Aspandiar, senior engineer at Intel Corporation.

Readers will learn the benefits low-temperature alloys have to offer, such as reducing costs, creating more reliable solder joints, and overcoming design limitations with traditional alloys.