(Cat? OR feline) AND NOT dog?
Cat? W/5 behavior
(Cat? OR feline) AND traits
Cat AND charact*

This guide provides a more detailed description of the syntax that is supported along with examples.

This search box also supports the look-up of an IP.com Digital Signature (also referred to as Fingerprint); enter the 72-, 48-, or 32-character code to retrieve details of the associated file or submission.

Concept Search - What can I type?

For a concept search, you can enter phrases, sentences, or full paragraphs in English. For example, copy and paste the abstract of a patent application or paragraphs from an article.

Concept search eliminates the need for complex Boolean syntax to inform retrieval. Our Semantic Gist engine uses advanced cognitive semantic analysis to extract the meaning of data. This reduces the chances of missing valuable information, that may result from traditional keyword searching.

Disclosed is a method for direct chip attachment using thin-film
capacitor technology. Benefits include improved
functionality.

Background

Power delivery
through a low-inductance thin-film capacitor (TFC) is required for
substrateless high-power components and direct chip attachment to a
motherboard.

Conventionally, CPUs
are attached to the motherboard using a land-grid array (LGA) or pin-grid array
(PGA) package and a socket. The package enables the delivery of high-quality
components. The package also translates the geometry from die-level to
board-level dimensions and houses the capacitors required to meet first-droop
and second droop requirements.

The first droop and
second droops are conventionally managed through discrete multilayer capacitors
placed on an organic substrate. No low-inductance first droop capacitor in
direct chip attach (DCA) mode, exists. If direct chip attachment could be
realized, the capacitors would be electrically too far from the die to meet
first droop requirements (see Figure 1).

General description

The disclosed method is a TFC mounted to the die (e.g.
using a a ceramic interposer (CIN)), which facilitates
test/burn-in and enables direct attach to the motherboard by thermal
compression bonding.

The key elements of the method include:

• Thin-film capacitor to provide a
carrier for test/burn-in and management of first droop requirements for CPUs
(in the case of TFC having multilayers of thin film capacitor layers providing
sufficient capacitance, further benefit through management of second droop)

• Direct chip attachment to the
motherboard to convert from die-bump pitch to package-bump pitch dimensions,
using the following: