F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION

F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements

F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels

H—ELECTRICITY

H01—BASIC ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/0001—Technical content checked by a classifier

H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS

Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC

Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

Y10T29/00—Metal working

Y10T29/49—Method of mechanical manufacture

Y10T29/4935—Heat exchanger or boiler making

Abstract

The invention relates to a microcooling device and to a method for the production thereof. The microcooling device is designed for the heat-conducting external accommodation of electronic components 1 and has in its interior a channel structure 13 through which coolant e.g. water can flow. The channel structure is formed by a base substrate 14 having recesses and ribs 15 and a cover layer 11 made from an electrically insulating and heat-conducting material e.g. polycrystalline diamond, for direct mounting of the electronic components. In other arrangements, cover layers 14 are provided on both faces of the base substrate and the ribs 15 may be replaced by pillar-like spacers. The channel structure is made by wet chemistry techniques.

Die Deckschicht ist dichtend mit Stegen verbunden, die aus dem Material des Grundsubstrats gebildet sind und die nach dem Ein bringen der Vertiefungen in das Grundsubstrat stehengeblieben sind. The cover layer is sealed to webs which are formed from the material of the base substrate and which are after the A bring the recesses in the base substrate stopped.

Power splitter for a motor control in an industrial truck, comprises a printed circuit board, whose substrate consists of metal or other good heat conducting material or good heat conducting lower layer, and a cooling body

Heat exchanger for cooling e.g. microprocessor, has heat exchanging unit (3) with inner structure that runs in flow direction for increasing heat transfer and extends in inner space from lower side to upper side

Power splitter for a motor control in an industrial truck, comprises a printed circuit board, whose substrate consists of metal or other good heat conducting material or good heat conducting lower layer, and a cooling body

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