The cost of the chip is directly related to the area. On the same chip, the more chips can be carved, the lower the price of the chip. Because silicon chips are inevitably produced defects (such as impurities, etc.). The larger the area of a chip, the higher the probability of the collision, and the higher the proportion of the whole wafer. A chip to do one hundred chips, a defect is 1\%. If only do ten, out of a defect is 10\%. An extreme example is the large CCD, professional camera or digital camera with the CCD is 23.7x15.6mm, light by the light area of 370 square millimeters, quickly catch up with the area of the high-end RISC processor

Q:How much is the thickness of the silicon wafer

Around 0.670mm. Wafer must be thinned, otherwise the loss of dicing knife

Q:The relationship between the weight and the power of solar wafers!

The thickness of the silicon wafer is unchanged and the weight is unchanged:156*156,8 inch polycrystalline silicon chip efficiency reached 16%, single-chip power of 3.89W.This can be pushed: the thickness of the silicon wafer is 180, the efficiency is up to 16%, and the consumption of the single silicon is 3.89w*7g/w=27.23g.When the thickness of silicon wafer is 180, and the weight of silicon wafer is unchanged, the conversion rate of polycrystalline silicon chip is up to 18%, and the chip power is 156*156*0.18/1000=4.38WThis can be pushed: the thickness of the silicon wafer is 180, the weight of the silicon wafer is unchanged, and the conversion rate of the polycrystalline silicon sheet is up to 18%, and the polysilicon consumption per watt is 27.23/4.38=6.2g

Q:Consult the difference between silicon and battery

From the silicon wafer to the battery piece needs to undergo the process of making wool, and the single crystal silicon wafer is generally made of alkali. Therefore, the appearance of monocrystalline silicon battery is black, and the appearance of polycrystalline silicon sheet is dark blue.

Q:Why do you use a concentrated sulfuric acid and hydrogen peroxide to wash silicon?

It is very difficult to clean, there are organic residues, this cleaning method is remedial method, belong to after the remedy, the cost is slightly higher

Q:What to do with silicon. What is the relationship between the semiconductor and the PCB board

This problem may be more profound understanding of microelectronics.I am learning communication, simply say my understandingPure silicon wafer conductivity is relatively weak. But the incorporation of trivalent impurities or pentavalent after a carrier (free electrons or holes) and semiconductors. The electrical conductivity of semiconductors and the type of doping, the concentration and process. Knowledge of semiconductor doping analog electronic circuits on the textbook.

Q:After wafer cleaning, how to change the film?

Name compositionEffectSPMH2SO4: H2O2: H2ORemoval of heavy organic matter, but it is difficult to remove organic matter when it is very seriousDHFHF: (H2O2): H2OCorrosion of the surface oxide layer to remove metal contaminationAPM (SC1) NH4OH: H2O2: H2O can remove particles, some organic matter and some metals, this solution will increase the surface roughness of silicon waferHPM (SC2) HCl: (H2O2): H2O is mainly used to remove metal contamination

Q:What is a silicon wafer for unidirectional and bidirectional cutting? What is the difference between the two?

Bidirectional cutting line cutting, (1) from the line wheel line network and enter the waste wire wheel (2) after a certain length reverse line wheel released by the waste reverse into the line network into the line wheel (3) repeat from the line wheel into the wire and into the process of waste wire wheelBut the length of 1 is greater than 2

Q:The problem of integrated circuit fabrication is how to realize the functions of capacitors, resistors and transistors on a single chip

For you to say the popular point, just like a piece of cake dug out of different shapes and different holes complex to the level, to know that silicon is a semiconductor