Packaged Parts Test and Burn-in Solutions

ABTS

The Advanced Burn-In and Test System (ABTS) solution provides flexibility for the test / burn-in of packaged semiconductor devices. The solution consists of the ABTS system that provides power, stimulus, test and thermal management. It supports common Burn-in Boards (BIBs) that hold the Devices Under Test (DUT) and a wide range of BIB Loaders for automated loading / unloading DUTs to / from BIBs.