2002: Patent (US 6, 393, 090) is granted for TMBS termination structure, followed by US 6, 420, 768 for further enhancement.

2003: FSMB, the 3rd Folded SMX product, is released to market.

2004: First leadless package (LLP) diodes, the LLP70 and LLP75, are introduced.

2004: The patent US 6, 791, 172 "Power Semiconductor Device Manufactured Using a Chip-Size Package" is granted for the eSMP® package.

2005: First TMBS product is released to market.

Source: www.vishay.com

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