This means us in the March 2nd batch of 350 are round 2 guinea pigs - not that I mind as it's probably more UAT than beta testing ;-).

I think the point is that when they got things underway with assembling the round 2's, their software people had already fixed gapless and AIFF so they are putting the newest firmware on them...and there's probably a few minor assembly tweaks, like a 5 minute soldering job type of thing, to make the wifi work better and thus improve the sound. Since most of the boards are no doubt assembled/paid for I don't think there's going to be any architectural changes.