1809 Mark III Series - SMT Reflow Oven

Best value SMT Reflow Oven in the market. Designed for Low Cost of Ownership.

1809 Mark III

1809 Mark III (with optional 3rd cooling zone)

The 1800 models support high mix / high volume throughput... at speeds up to 32 inches (80 centimeters) per minute, while conserving valuable factory floor space. Rapid response times and precise temperature controls assure process uniformity, regardless of component density or board loading, with identical profile performance in either air or nitrogen.

Highest Yields and Tight Process Control

The most efficient heat transfer from extra high volume, high-velocity, heating modules, producing heater module response of less than one second to temperature changes of less than 0.1ºC, thereby maintaining profile integrity for heavy board loads.

Wide process window for "universal profiling" - allows many different boards to be run on a single temperature profile

With a high-capacity, 26-inch wide heater module, the 1800 Mark III series reflow oven offers unmatched flexibility in board handling. The oven may be fitted with an adjustable single-rail edge hold conveyor/mesh belt combo, to carry even the largest boards or multi-board panels (up to 20 inches wide) through the oven.

There are three configurations of the Mark III series SMT Reflow Ovens. All of which share the same rigid platform and principle of operation.

Features and benefits of Mark III series SMT reflow oven system

New Flux System Virtually Eliminates Maintenance

This new flux collection system traps the fl ux in a separate collection box with easy to remove plates. As a result, the oven tunnel is kept clean - thus saving time consuming P.M. A collection jar captures the fl ux and can be removed while the oven is running for the ultimate in time savings!

Enhanced Heater Modules

Enhanced flow heater modules with 40% larger impellar, blanket the PCB with heat for the lowest delta Ts on the toughest boards! Additionally, the Uniform Gas Management system eliminates net flow which results in nitrogen consumption reductions of up to 40%!

Ultra-Parallel Conveyor System

Four (4) lead screws ensures the tightest tolerances and parallelism - even on boards with 3mm clearance at the edges!

Fastest Cooling Rates

The new Blow Thru Cooling module provides cool rates of >3º C/sec - even on LGA 775! That rate meets even the most demanding lead-free profile requirements!

Powered by ECD, this innovative software package provides three levels of process control from Oven CpK, to Process CpK and Product Traceability, this software ensures that all parameters are optimized and SPC reporting is fast and easy. [more]

New Frame

More than simply beautiful, this new frame utilizes twice the insulation. This modification alone, reduces heat loss and saves up to 40% on electricity costs!

Lead Free Certified

More Lead free product has been run on Heller machines than any other! Heller has pioneered the Lead Free Reflow process by working closely with the Japanese OEM's and International ODM's and EMS's to refine the Lead Free process. The Mark III system includes features that provide:

More heated zones than any other competitor to allow "Profile Sculpting"

Lowest Cost of Ownership

With Heller's Balanced Flow Heater Module (BFM) technology the cost of running nitrogen has been reduced by up to 50%! And the LOW KW features have reduced Electrical consumption by up to 40%! Cost savings on nitrogen and electricity combined of $15,000 - $18,000 per year have been realized by our customers!

Best Return on Investment (ROI)

Total savings of $22,000 - $40,000 per year can be achieved with the new Mark III system for the fastest ROI in the industry!