OCZ Technology Group, a worldwide leader in innovative, ultra-high performance and high reliability memory, today unveiled the Flex II memory series, designed for blazing speeds demanded by enthusiasts. These premium modules run at incredibly fast DDR2-1150 speeds for high-performance systems with integrated water-cooling. Designed to the very core to offer enthusiasts the thermal management innovation of hybrid water and passive cooling, the new PC2-9200 Flex II Series offers rock-solid stability and performance for your high-end gaming or overclocking system.

The OCZ Flex II heat management solution enables high-frequency memory to operate within an optimal balance of extreme speeds and low latencies without the high temperatures that inhibit or damage the module. Each PC2-9200 Flex II memory module features this breakthrough thermal management technology from OCZ. Combining an effective new heatspreader design with integrated liquid injection system and dedicated channels directly over the module’s ICs, Flex II effectively dissipates heat produced by high-speed memory. This sophisticated series was engineered with a unique “flexible” design to give enthusiasts the option to run the modules passively or water cooled via the thick array of aluminum fins, and the concurrent use of both options promotes maximum heat dissipation.

“One of the side effects of extreme memory speeds is an increase in performance robbing heat, and the new Flex II modules are among the most powerful memory solutions in the market place yet are able to remain cool and stable with an innovative new cooling design,” commented Dr. Michael Schuette, VP of Technology Development at OCZ Technology. “The thermal power is addressed using what we believe is the most advanced memory cooling solution currently available, suited for either liquid or air cooling system configuration to unleash the full power of 4 GB of DDR2 at the highest possible frequency.”

The PC2-9200 Flex II modules are optimized for the latest cutting edge platforms and will be available in high-capacity 4GB (2x2048MB) dual channel kits for the latest gaming, 64-bit operating systems, and CAD applications. In its continued effort to make overclocking a user-friendly pastime, OCZ includes all the necessary accessories right in the box to setup your unique water-cooling system immediately after purchase, without the inconvenience of searching for additional hardware. As part of OCZ’s line-up of premium memory, the Flex II series is backed by a Lifetime Warranty and industry-leading technical support.

Harnessing the elite performance of high speeds, tight timings, and leading-edge heat dissipation, the unparalleled design of the new Flex II is a complete, all-encompassing solution certain to set a new standard for serious enthusiasts.

Why would they use 2 separate "cooling channels"? That just adds an extra loop into the equation, you'd have to go in one side, out and back to the other side, and out again, and if you have 2 or even 4 sticks....jesus...that adds far too much to be helpful surely?

Its an awesome concept, but Im not too keen on watercooling my cpu yet alone my memory. Sure Id do it and my nb and maybe my gpu, but I dont think there'd be anything left to cool the memory. Wonder if these will remain cool if you use the passive heatsink without water cooling. Also, can bet these are running at 160 to 200 bucks or so.

These look interesting. Problem is, with 2 gigs of the current Flex DDR2-1150 going for about $110, these could easily go for $200, and I'd imagine OCZ would charge higher initially to recoup R&D costs. These probably cool much better than the current design, because the water passes directly over the memory chips, rather than just cooling the top of the heatspreader (which always seemed inefficient).

Check out the pics (especially the last one) on OCZ's product page. These are meant for motherboards with alternating dual-channel slots. If you have two slots that are adjacent to each other on the same channel, then you're out of luck (but I guess if you can afford these, you can afford a new motherboard--it seems most recent boards have the alternating slots).

If you have a watercooling system, the ideal setup for these would be 1/2 inch inner diameter tubing; you split into two 1/4 ID tubes, and connect two into one module, then out and into the other module, and finally out to be rejoined into a 1/2 inch ID tube.

Edit: These require 2.1v vs. 2.3v for the current models. That, combined with a better cooling solution, could grant amazing overclocking headroom. Maybe on the right motherboard, the lower latencies would make these a good, relatively affordable alternative to DDR3.

Important Note: Due to the width of the heatsink, Flex II memory kits cannot be installed on motherboards that require the modules to be inserted in sockets side by side. A maximum of one Flex II dual channel kit will fit on any motherboard with dual sockets.

Honestly, I think 4GB is the end of the line for DDR2. By the time more capacity is needed, faster processors, more memory bandwidth, and better motherboards will be needed.

If you have a watercooling system, the ideal setup for these would be 1/2 inch inner diameter tubing; you split into two 1/4 ID tubes, and connect two into one module, then out and into the other module, and finally out to be rejoined into a 1/2 inch ID tube.

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That is exactly what I was going to say, Koolance has a similar memory block that has two 1/4" channels with two 1/2 inch fittings. this is the same idea but needs more plumbing You would have to use Y splitters with 1/2" to 1/4" adapters and split your loop to both blocks at the same time. It is a lot of work and you would need to have a good pump a lot of fittings and several different sizes of tubes and adapters.

They need to start telling us what IC's these things use, but judging from the voltages, id say the same as their reaper HPC sticks, possible Power/Elpida. Damn, I want these bad

im having to send 4gb of pc2-9200 (4x1gb) Flex XLC back as the 4gb wont run properly on my rig, so these would be an awesome thing to have, and you get all the tubing and barbs in the kit, ohh mann,.....

Cooling the modules in sequence would be the most practical; least amount of adapters and pressure drop.

Mandelore, your inability to run 4 x 1 GB of RAM at 1150 MHz may be due to a motherboard limitation. It's really hard to push the speeds towards 1200 with 4GB on both the X38 and 780i-based boards.

I'm not sure if have 2 x 2 would help, but it might because you're using less channels. Anyone have a definitive answer? I'd like to know as I'm reluctant to take the DDR3 plunge and wouldn't want to buy expensive DDR2 that I won't be able to fully benefit from.

Wierd stuff, but cool. I myself use their 4gb 9200 reaper HPC, and those are handsome devils But really, if you aren't going to use the water cooling for those heatsinks, I don't see buying them without the water. Will it underperform the specs, if you don't use the additional cooling it was meant to do?