Links

Images

Classifications

H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits

H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components

H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components

H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form

H03K19/17704—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form the logic functions being realised by the interconnection of rows and columns

H—ELECTRICITY

H03—BASIC ELECTRONIC CIRCUITRY

H03K—PULSE TECHNIQUE

H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits

H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components

H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components

H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form

H03K19/17724—Structural details of logic blocks

H03K19/17728—Reconfigurable logic blocks, e.g. lookup tables

H—ELECTRICITY

H03—BASIC ELECTRONIC CIRCUITRY

H03K—PULSE TECHNIQUE

H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits

H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components

H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components

H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form

H03K19/17736—Structural details of routing resources

H—ELECTRICITY

H03—BASIC ELECTRONIC CIRCUITRY

H03K—PULSE TECHNIQUE

H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits

H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components

H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components

H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form

H03K19/1778—Structural details for adapting physical parameters

H—ELECTRICITY

H03—BASIC ELECTRONIC CIRCUITRY

H03K—PULSE TECHNIQUE

H03K19/00—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits

H03K19/02—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components

H03K19/173—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components

H03K19/177—Logic circuits, i.e. having at least two inputs acting on one output; Inverting circuits using specified components using elementary logic circuits as components arranged in matrix form

Abstract

An architecture and distributed hierarchical interconnect scheme for field programmable gate arrays (FPGAs). The FPGA is comprised of a number of cells which perform logical functions on input signals. Programmable intraconnections provide connectability between each output of a cell belonging to a logical cluster to at least one input of each of the other cells belonging to that logical cluster. A set of programmable block connectors are used to provide connectability between logical clusters of cells and accessibility to the hierarchical routing network. An uniformly distributed first layer of routing network lines is used to provide connections amongst sets of block connectors. An uniformly distributed second layer of routing network lines is implemented to provide connectability between different first layers of routing network lines. Switching networks are used to provide connectability between the block connectors and routing network lines corresponding to the first layer. Other switching networks provide connectability between the routing network lines corresponding to the first layer to routing network lines corresponding to the second layer. Additional uniformly distributed layers of routing network lines are implemented to provide connectability between different prior layers of routing network lines. An additional routing layer is added when the number of cells is increased as a square function of two of the prior cell count in the array while the length of the routing lines and the number of routing lines increases as a linear function of two. Programmable bi-directional passgates are used as switches to control which of the routing network lines are to be connected.

Description

This application is a continuation application of Ser. No. 09/034,769; filed Mar. 2, 1998, which is a continuation application of Ser. No. 08/484,922; filed Jun. 7, 1995, now abandoned which is a continuation U.S. Ser. No. 08/101,197, filed Aug. 3, 1993 now U.S. Pat. No. 5,457,410, issued Oct. 10, 1995.

FIELD OF THE INVENTION

The present invention pertains to the field of programmable logic circuits. More particularly, the present invention relates to an architecture and interconnect scheme for programmable logic circuits.

BACKGROUND OF THE INVENTION

When integrated circuits (ICs) were first introduced, they were extremely expensive and were limited in their functionality. Rapid strides in semiconductor technology have vastly reduced the cost while simultaneously increased the performance of IC chips. However, the design, layout, and fabrication process for a dedicated, custom built IC remains quite costly. This is especially true for those instances where only a small quantity of a custom designed IC is to be manufactured. Moreover, the turn-around time (i.e., the time from initial design to a finished product) can frequently be quite lengthy, especially for complex circuit designs. For electronic and computer products, it is critical to be the first to market. Furthermore, for custom ICs, it is rather difficult to effect changes to the initial design. It takes time, effort, and money to make any necessary changes.

In view of the shortcomings associated with custom IC's, field programmable gate arrays (FPGAs) offer an attractive solution in many instances. Basically, FPGAs are standard, high-density, off-the-shelf ICs which can be programmed by the user to a desired configuration. Circuit designers first define the desired logic functions, and the FPGA is programmed to process the input signals accordingly. Thereby, FPGA implementations can be designed, verified, and revised in a quick and efficient manner. Depending on the logic density requirements and production volumes, FPGAs are superior alternatives in terms of cost and time-to-market.

A typical FPGA essentially consists of an outer ring of I/O blocks surrounding an interior matrix of configurable logic blocks. The I/O blocks residing on the periphery of an FPGA are user programmable, such that each block can be programmed independently to be an input or an output and can also be tri-statable. Each logic block typically contains programmable combinatorial logic and storage registers. The combinatorial logic is used to perform boolean functions on its input variables. Often, the registers are loaded directly from a logic block input, or they can be loaded from the combinatorial logic.

Interconnect resources occupy the channels between the rows and columns of the matrix of logic blocks and also between the logic blocks and the I/O blocks. These interconnect resources provide the flexibility to control the interconnection between two designated points on the chip. Usually, a metal network of lines run horizontally and vertically in the rows and columns between the logic blocks. Programmable switches connect the inputs and outputs of the logic blocks and I/O blocks to these metal lines. Crosspoint switches and interchanges at the intersections of rows and columns are used to switch signals from one line to another. Often, long lines are used to run the entire length and/or breadth of the chip.

The functions of the I/O blocks, logic blocks, and their respective interconnections are all programmable. Typically, these functions are controlled by a configuration program stored in an on-chip memory. The configuration program is loaded automatically from an external memory upon power-up, on command, or programmed by a microprocessor as part of system initialization.

Shoup, R. G., “Programmable Cellular Logic Arrays,” Ph.D. dissertation, Carnegie-Mellon University, Pittsburgh, Pa. (March 1970), discussed programmable cellular logic arrays and reiterates many of the same concepts and terminology of Minnick and recapitulates the array of Wahlstrom. In Shoup's thesis, the concept of neighbor connections extends from the simple 2-input 1-output nearest-neighbor connections to the 8-neighbor 2-way connections. Shoup further described use of bus as part of the interconnection structure to improve the power and flexibility of an array. Buses can be used to route signals over distances too long, or in inconvenient directions, for ordinary neighbor connections. This is particularly useful in passing inputs and outputs from outside the array to interior cells.

U.S. Pat. No. 4,020,469 discussed a programmable logic array that can program, test, and repair itself. U.S. Pat. No. 4,870,302 introduced a coarse grain architecture without use of neighbor direct interconnections where all the programmed connections are through the use of three different sets of buses in a channeled architecture. The coarse grain cell (called a Configurable Logical block or CLB) contains both RAM-based logic table look up combinational logic and flip flops inside the CLB where a user defined logic must be mapped into the functions available inside the CLB. U.S. Pat. No. 4,935,734 introduced a simple logic function cell defined as a NAND, NOR or similar types of simple logic function inside each cell. The interconnection scheme is through direct neighbor and directional bus connections. U.S. Pat. Nos. 4,700,187 and 4,918,440 defined a more complex logic function cell where an Exclusive OR and AND functions and a register bit is available and selectable within the cell. The preferred connection scheme is through direct neighbor connections. Use of bi-direction buses as connections were also included.

Current FPGA technology has a few shortcomings. These problems are embodied by the low level of circuit utilization given the vast number of transistors available on chip provided by the manufacturers. Circuit utilization is influenced by three factors. The first one at the transistor or fine grain cell level is the function and flexibility of the basic logic element that can be readily used by the users. The second one is the ease in which to form meaningful macro logic functions using the first logic elements with minimum waste of circuit area. The last factor is the interconnections of those macro logic functions to implement chip level design efficiently. The fine grained cell architectures such as those described above, provided easily usable and flexible logical functions for designers at the base logic element level.

However, for dense and complex macro functions and chip level routing, the interconnection resources required to connect a large number of signals from output of a cell to the input(s) of other cells can be quickly exhausted, and adding these resources can be very expensive in terms of silicon area. As a consequence, in fine grained architecture design, most of the cells are either left unused due to inaccessibility, or the cells are used as interconnect wires instead of logic. This adds greatly to routing delays in addition to low logic utilization, or excessive amount of routing resources are added, greatly increasing the circuit size. The coarse grain architecture coupled with extensive routing buses allows significant improvements for signals connecting outputs of a CLB to inputs of other CLBs. The utilization at the CLB interconnect level is high. However, the difficulty is the partitioning and mapping of complex logic functions so as to exactly fit into the CLBs. If a part of logic inside the CLB is left unused, then the utilization (effective number of gates per unit area used) inside the CLB can be low.

Another problem with prior art FPGAs is due to the fact that typically a fixed number of inputs and a fixed number of outputs are provided for each logic block. If, by happenstance, all the outputs of a particular logic block is used up, then the rest of that logic block becomes useless.

Therefore, there is a need in prior art FPGAs for a new architecture that will maximize the utilization of an FPGA while minimizing any impact on the die size. The new architecture should provide flexibility in the lowest logic element level in terms of functionality and flexibility of use by users, high density per unit area functionality at the macro level where users can readily form complex logic functions with the base logic elements, and finally high percentage of interconnectability with a hierarchical, uniformly distributed routing network for signals connecting macros and base logic elements at the chip level. Furthermore, the new architecture should provide users with the flexibility of having the number of inputs and outputs for individual logical block be selectable and programmable, and a scalable architecture to accommodate a range of FPGA sizes.

SUMMARY OF THE INVENTION

The present invention relates to an architecture of logic and connection scheme for programmable logic circuits, such as those for field programmable gate arrays (FPGAs). The programmable logic circuit is comprised of a number of cells which perform digital functions on input signals. Depending on user's specific design, certain cells are programmably interconnected to a particular configuration for realizing the desired logic functions.

In the currently preferred embodiment, four logic cells (four two-input one-output logic gates and one D flip-flop) form a logical cluster (i.e. a 2×2 cell array) and four sets of clusters form a logical block (i.e. a 4×4 cell array). Within each cluster, there is a set of five intraconnection lines, called Intraconnection Matrix (I-Matrix), one associated with the output of each one of the four gates and the D flip-flop that is connectable to the input of the other cells. Within each logical block, the I-Matrix within each cluster can be extended to an adjacent cluster through a passgate to form connections within the logical block (to extend the intraconnection range). Inside each logical block, there is an associated set of access lines called Block Connectors (BCs). The block connectors provide access to and connectability between the various cells of that same logical block. In other words, each input and output of each of the cells of a logical block is capable of being connected to a set of block connectors corresponding to that logical block. With the judicious use of I-Matrix and block connectors within the same logical block, a set of signals can be internally connected without using any resources outside the logical block. A number of programmable switches are used to control which of the block connectors are to be connected together to a set of inputs and/or outputs of the cells inside the logical block for external access connecting to signals outside the current logical block. In other words, the input and/or output pins inside a logical block that are to be externally connected outside of the current logical block are accessed or connected through block connectors within the current logical block.

In order to route signals between the various logical blocks, a uniformly distributed multiple level architecture (MLA) routing network is used to provide connectability between each of the individual sets of block connectors. Programmable switches are implemented to control which of the first level MLA routing network lines are to be connected together. Additional programmable switches are used to control which of the block connectors are to be connected to specific first level MLA routing lines. For example, the switches can be programmed to allow an originating cell belonging to one logical block to be connected to a destination cell belonging to a different logical block. This can be accomplished by connecting the originating cell through one or more of its block connectors, onto the first level MLA, depending on the distance, other level(s) of MLA, and down through descending levels of MLAs back to the first level MLA, and finally through the block connector of the destination cell. Thereby, the block connectors and first level of MLA routing network provide interconnectability for an 8×8 cell array, called a block cluster.

In the present invention, larger cell arrays can be interconnected by implementing additional levels of MLA routing networks. For example, connectability for a 16×16 cell array, called a block sector, can be achieved by implementing a second level of MLA routing network lines to provide connectability between the various first level of MLA routing lines thereby making connections between different block clusters. Each level of MLA has a corresponding number of switches for providing programmable interconnections of the routing network of that level. Additional switching exchange networks are used to provide connectability between the various levels of MLAs.

In one embodiment, switches are used to provide connectability between two different sets of block connectors. Moreover, switches can be included to provide connectability between different sets of MLA routing lines of a particular level of MLAs. This provides for increased routing flexibility.

In the present invention, all MLA routing network lines are bidirectional. The switches are comprised of programmable bi-directional passgates. For increased number of levels, drivers may be necessary for providing the necessary switching speed for driving the routing lines, passgates, and associated loads, etc. In one embodiment, switches are used to provide programmable connectability amongst various sets of block connectors. Additional switches can be implemented to provide programmable connectability amongst various sets of the first level of MLA. This scheme can be repeated for higher levels of MLAs.

BRIEF DESCRIPTION OF THE DRAWINGS

The present invention is illustrated by way of example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar elements and in which:

FIG. 1 is a block diagram of a field programmable gate array logic upon which the present invention may be practiced.

FIG. 2A shows one example of an individual cell.

FIG. 2B shows another example of an individual cell.

FIG. 3A shows a logical cluster.

FIG. 3B shows the extension of I-matrix intraconnections of a logical cluster to a neighboring logical cluster.

FIG. 4A shows an example of a logical cluster with vertical block connectors.

FIG. 4B shows an example of a logical cluster with horizontal block connectors.

An architecture and interconnect scheme for programmable logic circuits is described. In the following description, for purposes of explanation, numerous specific details are set forth, such as combinational logic, cell configuration, numbers of cells, etc., in order to provide a thorough understanding of the present invention. It will be obvious, however, to one skilled in the art that the present invention may be practiced without these specific details. In other instances, well-known structures and devices are shown in block diagram form in order to avoid unnecessarily obscuring the present invention. It should also be noted that the present invention pertains to a variety of processes including but not limited to static random access memory (SRAM), dynamic random access memory (DRAM), fuse, anti-fuse, erasable programmable read only memory (EPROM), electrically erasable programmable read only memory (EEPROM), FLASH, and ferroelectric processes.

Referring to FIG. 1, a block diagram of a field programmable gate array logic upon which the present invention may be practiced is shown as 100. The I/O logical blocks 102, 103, 111 and 112 provide an interface between external package pins of the FPGA and the internal user logic either directly or through the I/O to Core interface 104, 105, 113, and 114. Four interface blocks 104, 105, 113, and 114 provide decoupling between core 106 and the I/O logic 102, 103, 111, and 112. Core 106 is comprised of a number of clusters 107 which are intraconnected by I-Matrix 101 and interconnected by MLA routing network 108.

Control/programming logic 109 is used to control all of the bits for programming the bit and word lines. For anti-fuse or fuse technology, high voltage/current is applied to either zap or connect a fuse. For EEPROM, Flash, or ferroelectric technology, there is an erase cycle followed by a programming cycle for programming the logic states of the memory bits. In order to minimize skewing, a separate clock/reset logic 110 is used to provide clock and reset lines on a group basis.

In the currently preferred embodiment, each of the clusters 107 is comprised of a 2×2 hierarchy of four cells, called a logical cluster. FIGS. 2A and 2B show examples of individual cells 200 and 250. Cell 200 performs multiple logic functions on two input signals (A and B) and provides an output signal X. In the currently preferred embodiment, cell 200 is comprised of an XOR gate 201, a two-input NAND gate 202, and a two-input NOR gate 203. It should be noted, however, that in other embodiments, cell 200 can include various other types and/or combinations of gates. Cell 250 is comprised of cell 200 coupled with a D flip flop cell 260. The output X of cell 200 can be programmed to connect directly to the data input D of the D flip flop gate 204 by activating switch 218. The data input D can be accessed as a third input of the combined cell 250. Each of the two input signals A and B and the D input of D flip-flop can be inverted or non-inverted, depending on the states of switches 206-211. Activating switches 206, 208 and 210 causes signals A, B and D to be driven by drivers 212-214 to gates 201-204 in a non-inverted fashion. Activating switches 207, 209, and 211 causes the input signals A, B and D to be inverted by inverters 215-217 before being passed to gates 201-204. The six switches 212-217 can individually be turned on and off as programmed by the user.

Note that the XOR gate 201, NAND gate 202, and NOR gate 203 can also be used to perform XNOR, AND and OR by propagating the output signal to the next stage, whereby the signal can be inverted as discussed above.

Three switches 219-221 are respectively coupled to the outputs of the three gates 201-203. Again, these switches are programmable by the user. Thereby, the user can specify which of the outputs from the gates 201-203 is to be sent to driver 224 as the output X from cell 200.

The aforementioned switches 206-211, 218-221 are comprised of bi-directional, program-controlled passgates. Depending on the state of the control signal, the switches are either conducting (i.e. passes a signal on the line) or non-conducting (i.e. does not pass the signal on the line). Switches mentioned in the following sections are similarly comprised of program-controlled passgates.

Referring now to FIG. 3A, a logical cluster 107 is shown. In the currently preferred embodiment, logical cluster 107 is comprised of four cells 301-304 and a D flip-flop 305, twenty five switches 306-330, and five intraconnection lines 331-335. D flip flop 305 and cell 304 form a cell 361, such as cell 250 described with respect to FIG. 2a. The Intraconnection lines 331-335 and switches 306-330 form the I-Matrix. I-Matrix provide connectability of the output, X, of each of the four cells 301-304, and the output X of the D flip-flop 305 to at least one input of each of the other three cells and the D flip-flop. For example, the output X of cell 301 can be connected to input A of cell 302 by enabling switches 306 and 307. Likewise, the output X of cell 301 can be connected to input B of cell 303 by enabling switches 306 and 310. Output X of cell 301 can be connected to input A of cell 304 by enabling switches 306 and 308. Output X of cell 301 can be connected to input D of the D flip-flop cell 305 by enabling switches 306 and 309.

Similarly, the output X from cell 302 can be connected to input A of cell 301 by enabling switches 311 and 312. The output X from cell 302 can be connected to input A of cell 303 by enabling switches 311 and 315. The output X from cell 302 can be connected to input B of cell 304 by enabling switches 311 and 313. Output X of cell 302 can be connected to input D of the D flip-flop cell 305 by enabling switches 311 and 314.

Similarly, the output X from cell 303 can be connected to input B of cell 301 by enabling switches 326 and 327. The output X from cell 303 can be connected to input A of cell 302 by enabling switches 326 and 328. The output X from cell 303 can be connected to input B of cell 304 by enabling switches 326 and 329. Output X of cell 303 can be connected to input D of the D flip-flop cell 305 by enabling switches 326 and 330.

For cell 304, the output X from cell 304 can be connected to input B of cell 301 by enabling switches 316 and 317. The output X from cell 304 can be connected to input B of cell 302 by enabling switches 316 and 318. The output X from cell 304 can be connected to input A of cell 303 by enabling switches 316 and 319. Output X of cell 304 can be programmably connected to input D of the D flip-flop cell 305 by enabling switch 218 in FIG. 2A.

With respect to cell 305, its output is connectable to the A input of cell 301 by enabling switches 320 and 321; the B input of cell 302 by enabling switches 320 and 322; the B input of cell 303 by enabling switches 320 and 325; the A input of cell 304 by enabling switches 320 and 323; and the D input of cell 305 itself by enabling switches 320 and 324.

It can be seen that each output of the cells 301-304 and of the D flip-flop 305 is connectable to the input of each of its neighboring cells and/or flip-flop inside the cluster.

In the currently preferred embodiment of the present invention, each logical cluster is connectable to all the other logical clusters inside each logical block through passgate switches extending the I-Matrix from neighboring clusters inside each logical block. FIG. 3B illustrates the extension of I-Matrix intraconnection lines 331-335 of the cells 301-304 and the D flip-flop 305 of a logical cluster 107 to a neighboring logical cluster 107 through the passgate switches 336-355 within the same logical block.

In the currently preferred embodiment of the present invention, each logical block is connectable to all the other logical blocks of the FPGA. This is accomplished by implementing an architecture with multiple layers of interconnections. It is important to note that this multiple layers routing architecture is a conceptual hierarchy, not a process or technology hierarchy and is hence readily implementable with today's silicon process technology. The bottom most layer of interconnections is referred to as the “block connectors”. A set of block connectors provides the access and interconnections of signals within an associated logical block (which is consisted of four logical clusters or 16 cells). Thereby, different sets of logical clusters within the same logical block are connectable to any of the other logical clusters within that group through the use of extended I-Matrix and/or block connectors. Again, programmable bi-directional passgates are used as switches to provide routing flexibility to the user.

The next level of connections is referred to as the “level 1 Multiple Level Architecture (MLA)” routing network. The level 1 MLA routing network provides the interconnections between several sets of block connectors. Programmable passgates switches are used to provide users with the capability of selecting which of the block connectors are to be connected. Consequently, a first logical block from one set of logical block groups is connectable to a second logical block belonging to the same group. The appropriate switches are enabled to connect the block connectors of the first logical block to the routing lines of the level 1 MLA routing network. The appropriate switches of the level 1 MLA routing network are enabled to provide the connections to the block connectors of the second logical block to the routing lines of the level 1 MLA routing network. The appropriate switches are enabled to connect the routing lines of the level 1 MLA routing network that connected to the block connectors of the first and the second logical blocks. Furthermore, the user has the additional flexibility of programming the various switches within any given logical block to effect the desired intraconnections between each of the cells of any logical block.

The next level of connections is referred to as the “level 2 Multiple Level Architecture (MLA)” routing network. The level 2 MLA provides the interconnections to the various level 1 MLA to effect access and connections of a block cluster. Again, bi-directional passgate switches are programmed by the user to effect the desired connections. By implementing level 2 MLA routing network, programmable interconnections between even larger numbers of logical blocks is achieved.

Additional levels of MLA routing networks can be implemented to provide programmable interconnections for ever increasing numbers and groups of logical blocks, block clusters, block sectors, etc. Basically, the present invention takes a three dimensional approach for implementing routing. Signals are routed amongst the intraconnections of a logical block. These signals can then be accessed through block connectors and routed according to the programmed connections of the block connectors. If needed, signals are “elevated” to the level 1 MLA, routed through the level 1 MLA routing network, “de-elevated” to the appropriate block connectors, and then passed to the destination logical block.

If level 2 MLA routing network is required, some of the signals are elevated a second time from a level 1 MLA routing network line to the level 2 MLA routing network, routed to a different set of level 2 MLA routing network line, and “de-elevated” from the level 2 MLA routing network line to a Level 1 MLA routing network line. Thereupon, the signals are “de-elevated” a second time to pass the signal from the level 1 MLA to the appropriate block connectors of the destination logical block. This same approach is performed for level 3, 4, 5, etc. MLAs on an as needed basis, depending on the size and density of the FPGA. Partial level n MLA can be implemented using the above discussed method to implement a FPGA with a given cell array count.

FIG. 4A shows an example of a logical cluster and the associated vertical block connectors within the logical block. In the currently preferred embodiment, each cell in a logical cluster is accessible from the input by two vertical block connectors and each output of the cell in a logical cluster is accessible to two of the vertical block connectors. For example, input A of cell 301 is accessible to the vertical block connectors 451 (BC-V11) and 453 (BC-V21) through switches 467, 462 respectively, input B of cell 301 is accessible to the vertical block connectors 452 (BC-V12) and 454 (BC-V22) through switches 466, 468 respectively, output X of cell 301 is accessible to the vertical block connectors 455 (BC-V31) and 458 (BC-V42) through switches 460, 459 respectively. Input A of cell 302 is accessible to the vertical block connectors 453 (BC-V21) and 455 (BC-V31) through switches 463, 464 respectively, input B of cell 302 is accessible to the vertical block connectors 454 (BC-V22) and 456 (BC-V32) through switches 469, 470 respectively, output X of cell 302 is accessible to the vertical block connectors 452 (BC-V12) and 457 (BC-V41) through switches 461, 465 respectively. Input A of cell 303 is accessible to the vertical block connectors 451 (BC-V11) and 453 (BC-V21) through switches 485, 476 respectively, input B of cell 303 is accessible to the vertical block connectors 452 (BC-V12) and 454 (BC-V22) through switches 480, 476 respectively, output X of cell 303 is accessible to the vertical block connectors 455 (BC-V31) and 458 (BC-V42) through switches 472, 471 respectively. The input A of cell 304 is accessible to the vertical block connectors 453 (BC-V21) and 455 (BC-V31) through switches 477, 478 respectively, input B of cell 304 is accessible to the vertical block connectors 454 (BC-V22) and 456 (BC-V32) through switches 482, 484 respectively, output X of cell 304 is accessible to the vertical block connectors 452 (BC-V12) and 457 (BC-V41) through switches 475, 474 respectively. D flip-flop cell 305 input is accessible to the vertical block connectors 454 (BC-V22) and 455 (BC-V31) through switches 473, 479 respectively, output X of cell 305 is accessible to the vertical block connectors 452 (BC-V12) and 457 (BC-V41) through switches 483, 486 respectively.

FIGS. 4A and 4B illustrate the vertical and horizontal block connectors accessing method to the upper left (NW) logical cluster inside a logical block in the currently preferred embodiment. The lower left (SW) cluster has the identical accessing method to the vertical block connectors as those of the NW cluster. The upper right (NE) cluster has similar accessing method to those of the NW cluster with respect to the vertical block connectors except the sequence of vertical block connector access is shifted. The vertical block connectors 541-458 can be viewed as chained together as a cylinder (451, 452, . . . , 458). Any shift, say by 4, forms a new sequence: (455, 456, 457, 458, 451, 452, 453, 454). Instead of starting with vertical block connectors 451 and 453 accessing by cell 301 in the NW cluster as illustrated in FIGS. 4A, the cell 301 in the NE cluster is accessible to VBCs 455 and 457. The numbering is “shifted” by four. The access labeling of the lower right (SE) cluster to the VBCs is identical to those of NE cluster.

Similarly, the horizontal block connectors access to the NW cluster is identical to those of the NE cluster and the SW cluster is identical to the SE cluster while the horizontal block connectors access to the SW cluster is shifted by four compared with those of NW cluster.

In the currently preferred embodiment, sixteen block connectors are used per logical block (i.e. four clusters, or a 4×4 cell array). Adding a level 1 MLA routing network allows for the connectability for a block cluster (an 8×8 cell array). Adding level 2 MLA routing network increases the connectability to a block sector (16×16 cell array). Additional levels of MLA routing network increases the number of block sectors by factors of four while the length (or reach) of each line in the MLA routing network increases by factors of two. The number of routing lines in the level 2 MLA is increased by a factor of two; since the number of block sectors increased by a factor of four, on a per unit area basis, the number of routing lines in the next level of hierarchy actually decreases by a factor of two.

FIG. 5A shows a logical block with associated sixteen block connectors and level 1 MLA routing lines associated with the logical block. The sixteen block connectors 501-516 are depicted by heavy lines whereas the sixteen level 1 MLA routing network lines 517-532 are depicted by lighter lines. Note that the length or span of the block connectors terminates within the logical block while the length of the level 1 MLA routing network lines extends to neighboring logical blocks (twice the length of the block connectors).

In the currently preferred embodiment, there are twenty four level 1 MLA turn points for the sixteen level 1 MLA routing network lines within the logical block. In FIG. 5A, the twenty four turn points are depicted as clear dots 541-564. A MLA turn point is a programmable bi-directional passgate for providing connectability between a horizontal MLA routing network line and a vertical MLA routing network line. For example, enabling level 1 MLA turn point 541 causes the horizontal level 1 MLA routing network line 526. and vertical level 1 MLA routing network line 520 to become connected together. FIG. 5B shows level 1 MLA turn point 541. Switch 583 controls whether level 1 MLA routing network line 526 is to be connected to level 1 MLA routing network line 520. If switch is enabled, then level 1 MLA routing network line 526 is connected to level 1 MLA routing network line 520. Otherwise, line 526 is not connected to line 520. Switch 583 is programmable by the user. The turn points are placed as pair-wise groups with the objective of providing switching access connecting two or more block connectors first through the block connector to level 1 MLA exchange networks and then connecting selected level 1 MLA routing lines by enabling the switches. The level 1 MLA lines are used to connect those block connectors that reside in separate logical blocks within the same block cluster.

Similarly, enabling switch 569 causes the signal on block connector 502 to be driven by driver 579 onto the level 1 MLA line 517. Enabling switch 570 causes the signal on level 1 MLA line 517 to be driven by driver 580 onto the block connector 502. Enabling switch 571 causes the signal on block connector 502 to be driven by driver 581 onto the level 1 MLA line 518. Enabling switch 572 causes the signal on level 1 MLA line 518 to be driven by driver 582 onto the block connector 502. Switch 573 is used to control whether a signal should pass form one block connector 501 to the adjacent block connector 584 belonging to the adjacent logical block.

Likewise, switch 574 is used to control whether a signal should pass form one block connector 502 to the adjacent block connector 585 belonging to the adjacent logical block.

FIG. 6 shows the routing network for a block cluster. The block cluster is basically comprised of four logical blocks which can be interconnected by the level 1 MLA exchange networks 533-540. It can be seen that there are thirty-two level 1 MLA routing network lines.

FIG. 7A shows the block diagram for a block sector. The block sector is comprised of four block clusters 701-704. As discussed above, the block clusters are interconnected by block connectors and level 1 MLA routing network lines. In addition, the block sector is also comprised of sixty-four level 2 MLA routing network lines and sixty-four level 2 to level 1 exchange networks to provide connectability between level 1 MLA routing network and level 2 MLA routing network. The level 1 to level 2 MLA routing exchange networks are depicted by rectangles in FIG. 7A. Furthermore, there are forty-eight level 2 MLA turn points associated with each of the four logical blocks within the block sector. Consequently, there are one hundred and ninety-two level 2 MLA turn points for the block sector.

FIG. 7B shows a sample level 1 to level 2 MLA routing exchange network 705. It can be seen that switch 710 is used to control whether a signal should pass between level 1 MLA line 709 and level 2 MLA line 708. Switch 711 is used to control whether a signal should pass between level 1 MLA line 709 and level 2 MLA line 707. Switch 712 is used to control whether a signal should pass between level 1 MLA line 706 and level 2 MLA line 708. Switch 713 is used to control whether a signal should pass between level 1 MLA line 706 and level 2 MLA line 707. Switch 714 is used to control whether a signal should pass form one level 1 MLA line 709 to the adjacent level 1 MLA line 716 belonging to the adjacent block cluster. Likewise, switch 715 is used to control whether a signal should pass form one level 1 MLA line 706 to the adjacent level 1 MLA line 715 belonging to the adjacent block cluster.

FIG. 8A shows a sector cluster. The sector cluster is comprised of four block sectors 801-804 with their associated block connectors, level 1, and level 2 MLA routing network lines and exchange networks. In addition, there are one hundred and twenty-eight level 3 MLA routing network lines, providing connectability between the level 2 MLA lines that belong to different block sectors 801-804 within the same sector cluster 800. There are ninety-six level 3 MLA turn points associated with the level 3 MLA lines for each of the block sector 801-804 (i.e. three hundred and eighty-four total level 3 MLA turn points for the sector cluster). Furthermore, there are thirty-two level 2 to level 3 MLA routing exchange networks associated with each of the four block sector 801-804. Hence, there are total of one hundred and twenty-eight level 3 MLA routing exchange network for providing programmable connectability between the various level 2 and level 3 MLA lines.

FIG. 8B shows an example of a level 2 to level 3 MLA routing exchange network 805. It can be seen that enabling switch 810 causes a signal on the level 2 MLA line 808 to be connected to the level 3 MLA line 806. Disabling switch 810 disconnects the level 2 MLA line 808 from the level 3 MLA line 806. Enabling switch 811 causes a signal on the level 2 MLA line 808 to be connected to the level 3 MLA line 807. Disabling switch 811 disconnects the level 2 MLA line 808 from the level 3 MLA line 807. Likewise, enabling switch 812 causes a signal on the level 2 MLA line 809 to be connected to the level 3 MLA line 806. Disabling switch 812 disconnects the level 2 MLA line 809 from the level 3 MLA line 806. Enabling switch 813 causes a signal on the level 2 MLA line 809 to be connected to the level 3 MLA line 807. Disabling switch 813 disconnects the level 2 MLA line 809 from the level 3 MLA line 807.

In the present invention, larger and more powerful FPGAs can be achieved by adding additional logic sector clusters which are connected by additional levels of MLA routing networks with the corresponding MLA turn points and exchange networks.

In one embodiment of the present invention, each of the five I-Matrix lines (331-335, FIG. 3A) can be extended to provide connectability between two adjacent I-Matrix lines belonging to two different clusters. The passgate switches 336-340, 341-345, 346-350, and 351-355 in FIG. 3B are examples of four different sets of I-Matrix line extension switches. This provides further flexibility by providing the capability of routing a signal between two adjacent clusters without having to be routed through the use of block connectors.

Similarly, block connectors can be extended to provide connectability between two adjacent block connectors belonging to two different logical blocks. Switch 573 of FIG. 5C illustrates such block connector extension connecting block connector 501 to block connector 584 through switch 573. This provides further flexibility by providing the capability of routing a signal between two adjacent logical blocks without having to be routed through the level 1 MLA lines and associated MLA exchange networks. This concept can be similarly applied to the level 1 MLA lines as well. Switch 714 of FIG. 7B shows an example where level 1 MLA line 709 is extended to connect to level 1 MLA line 716 by enabling switch 714. This provides further flexibility by providing the capability of routing a signal between two adjacent block clusters without having to be routed through the level 2 MLA lines and associated MLA exchange networks.

Thus, an architecture with an intraconnect and interconnect scheme for programmable logic circuits is disclosed.

Claims (124)

a first non-segmented routing line in a first dimension selectively coupling a second non-segmented routing line in a second dimension through a first switch, at most one routing line of said first and second non-segmented routing lines spanning any dimension of said integrated circuit; and

said first non-segmented routing line selectively coupling to a third routing line, having a shorter span than said first non-segmented routing line and said second non-segmented routing line, through a second switch.

2. The integrated circuit as set forth in claim 1, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

3. The integrated circuit as set forth in claim 1, wherein said integrated circuit is implemented using technology selected from the group consisting of memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

4. The integrated circuit as set forth in claim 1, wherein said any dimension of said integrated circuit comprises a horizontal span or vertical span of said integrated circuit.

5. The integrated circuit as set forth in claim 1, wherein said second non-segmented routing line is selectively coupled to a fourth routing line through a single switch, said fourth routing line having a shorter span than said second non-segmented routing line.

6. The integrated circuit as set forth in claim 1, further comprising a fifth routing line with a greater span than said first non-segmented routing line wherein said first non-segmented routing line is selectively coupled to said fifth routing line through a single switch.

7. The integrated circuit as set forth in claim 1, further providing a sixth routing line with greater span than said second non-segmented routing line wherein said second non-segmented routing line is selectively coupled to said sixth routing line through a single switch.

8. The integrated circuit as set forth in claim 1, wherein said third routing line is selectively coupled to an input port or output port of a plurality of configurable cells through a single switch or said third routing line is selectively coupled to an input port or output port of a plurality of configurable cells through at least one additional routing line.

9. A method for providing an integrated circuit comprising:

selectively coupling, through a first switch, a first non-segmented routing line along a first dimension to a second non-segmented routing line along a second dimension, at most one of said first non-segmented routing line and said second non-segmented routing line spanning any dimension of said integrated circuit; and

selectively coupling, through a second switch, the first non-segmented routing line to a third routing line having a shorter span than the first non-segmented routing line and the second non-segmented routing line.

10. The method as set forth in claim 9, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

11. The method as set forth in claim 9, wherein said integrated circuit is implemented using technology selected from the group consisting of memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

12. The method as set forth in claim 9, wherein said any dimension of said integrated circuit comprises a horizontal span or vertical span of said integrated circuit.

13. The method as set forth in claim 9, further comprises the step of providing a fourth routing line, having a shorter span than said second non-segmented routing line, wherein said second non-segmented routing line selectively couples, through a single switch, said fourth routing line.

a first non-segmented routing line, and a second non-segmented routing line, and a third non-segmented routing line each with different spans, said third non-segmented routing line having a shorter span than said first non-segmented routing line and said second non-segmented routing line, at most one routing line of said first and second non-segmented routing lines spans any dimension of said integrated circuit;

said first non-segmented routing line selectively coupling to said second non-segmented routing line through a first switch;

said second non-segmented routing line selectively coupling to drive said third non-segmented routing line through a second switch; and

a configurable cell output port selectively coupling to drive said third non-segmented routing line without requiring traversal of said first non-segmented routing line and said second non-segmented routing line.

15. The integrated circuit as set forth in claim 14, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

16. The integrated circuit as set forth in claim 14, wherein said integrated circuit is implemented using technology selected from the group consisting memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

17. The integrated circuit as set forth in claim 14, wherein said any dimension of said integrated circuit comprises a horizontal span or vertical span of said integrated circuit.

18. The integrated circuit as set forth in claim 14, further comprising at least two routing lines having different spans than said second non-segmented routing line wherein said at least two routing lines are selectively controlled to couple said second non-segmented routing line.

19. The integrated circuit as set forth in claim 14, wherein said third non-segmented routing line is selectively coupled to an input port or output port of a configurable cell through one of a single switch and at least one additional routing line.

20. The integrated circuit as set forth in claim 14, further comprises a fourth routing line having a greater span than said first non-segmented routing line wherein said fourth routing line selectively couples said first non-segmented routing line through a single switch.

21. The integrated circuit as set forth in claim 14, wherein said first non-segmented routing line has a greater span than said second non-segmented routing line.

22. The integrated circuit as set forth in claim 14, further comprising a plurality of logic blocks, each logic block comprising a first set of non-segmented routing lines and a plurality of configurable cells wherein an output port of a configurable cell of a logic block is coupled to an input port of another configurable cell of said logic block through a single routing line from said first set of non-segmented routing lines.

23. The integrated circuit as set forth in claim 14, wherein a first portion of one of said first or second non-segmented routing lines in a first dimension selectively couples to a second portion of a fifth routing line in a second dimension through a single switch.

24. The integrated circuit as set forth in claim 14, further comprising a sixth routing line wherein said one of said first, second, and third non-segmented routing lines selectively couples, as an extension, to said sixth routing line through a single switch.

25. A method for providing an integrated circuit comprising:

providing a first non-segmented routing line, a second non-segmented routing line and a third non-segmented routing line, each with different spans, said third non-segmented routing line having a shorter span than said first non-segmented routing line and said second non-segmented routing line, and at most one routing line of said first and said second non-segmented routing lines spanning any dimension of said integrated circuit;

selectively coupling, through a first switch, said first non-segmented routing line to said second non-segmented routing line;

selectively coupling, through a second switch, the second non-segmented routing line to drive said third non-segmented routing line; and

coupling a configurable cell output port to drive the third non-segmented routing line without requiring traversal of said first non-segmented routing line and said second non-segmented routing line.

26. The method as set forth in claim 25, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

27. The method as set forth in claim 25, wherein said integrated circuit is implemented using technology selected from the group consisting of memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

28. The method as set forth in claim 25, wherein said any dimension of said integrated circuit comprises a horizontal span or vertical span of said integrated circuit.

a first non-segmented routing line, a second non-segmented routing line, and a third non-segmented routing line, each with different spans;

said first non-segmented routing line along a first dimension selectively coupled to said second non-segmented routing line along the first dimension through a first switch;

said second non-segmented routing line selectively coupled to drive said third non-segmented routing line through a second switch; and

a configurable cell output port coupled to drive said third non-segmented routing line without requiring traversal of said first non-segmented routing line and said second non-segmented routing line.

30. The integrated circuit as set forth in claim 29, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

31. The integrated circuit as set forth in claim 29, wherein said integrated circuit is implemented using technology selected from the group consisting of memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

32. The integrated circuit as set forth in claim 29, wherein said third non-segmented routing line is selectively coupled to an input port or output port of a configurable cell through one of a single switch and at least one additional routing line.

33. The integrated circuit as set forth in claim 29, further comprising a fourth routing line wherein said fourth routing line selectively couples, as an extension to one of said first, second, and third non-segmented routing lines through a single switch.

34. A method for providing an integrated circuit comprising:

providing a first non-segmented routing line, a second non-segmented routing line, and a third non-segmented routing line, each with different spans;

selectively coupling, through a first switch, said first non-segmented routing line along a first dimension to said second non-segmented routing line along the first dimension;

selectively coupling, through a second switch, said second non-segmented routing line to drive said third non-segmented routing line; and

coupling a configurable cell output port to drive said third non-segmented routing line without requiring traversal of said first non-segmented routing line and said second non-segmented routing line.

35. The method as set forth in claim 34, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

36. The method as set forth in claim 34 wherein said integrated circuit is implemented using technology selected from the group consisting of memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

a first non-segmented routing line, a second non-segmented routing line, and a third non-segmented routing line, wherein said first non-segmented routing line has a greater span than said second non-segmented routing line, said third non-segmented routing line has a shorter span than said second non-segmented routing line, and at most one routing line of said non-segmented routing lines spans any dimension of said integrated circuit;

said first non-segmented routing line selectively coupling to said second non-segmented routing line through a first switch; and

said second non-segmented routing line selectively coupling to said third non-segmented routing line through a second switch wherein said second non-segmented routing line drives said third non-segmented routing line through said second switch and said third non-segmented routing line drives said second non-segmented routing line through said second switch.

38. The integrated circuit as set forth in claim 37, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

39. The integrated circuit as set forth in claim 37, wherein said integrated circuit is implemented using technology selected from the group consisting of memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

40. The programmable logic circuit as set forth in claim 37, wherein said any dimension of said integrated circuit comprises a horizontal span or vertical span of said integrated circuit.

41. The integrated circuit as set forth in claim 37, wherein said third non-segmented routing line is coupled to an input port or output port of a configurable cell without requiring traversal of said first non-segmented routing line and said second non-segmented routing line.

42. The integrated circuit as set forth in claim 37, further comprising at least one fourth routing line having a first portion along a different dimension than a second portion of said first non-segmented routing line wherein said second portion of said first non-segmented routing line selectively couples to said first portion of said fourth routing line through a single switch.

43. The integrated circuit as set forth in claim 37, further comprising at least one fifth routing line having a third portion along a different dimension than a fourth portion of said second non-segmented routing line wherein said fourth portion of said second non-segmented routing line selectively couples to said third portion of said fifth routing line through a single switch.

44. The integrated circuit as set forth in claim 37, further comprising at least one sixth routing line wherein said sixth routing line selectively couples, as an extension, to one of said first, second, and third non-segmented routing lines through a single switch.

45. The integrated circuit as set forth in claim 37, further comprising at least one seventh routing line having a greater span than said first non-segmented routing line wherein said first non-segmented routing line selectively couples to said seventh routing line through a single switch.

46. A method for providing an integrated circuit comprising:

providing a first non-segmented routing line, a second non-segmented routing line, and a third non-segmented routing line, wherein the first non-segmented routing line has a greater span than the second non-segmented routing line, and the second non-segmented routing line has a greater span than the third non-segmented routing line, at most one routing line of said non-segmented routing lines spans any dimension of said integrated circuit;

selectively coupling said first non-segmented routing line to the second non-segmented routing line; and

selectively coupling the second non-segmented routing line to the third non-segmented routing line, wherein the second non-segmented routing line drives the third non-segmented routing line through a single first switch and the third non-segmented routing lines drives the second non-segmented routing line through the single first switch.

47. The method as set forth in claim 46, wherein said first switch comprise components selected from the group consisting of a switch, a programmable passgate and a program controlled driver/receiver.

48. The method as set forth in claim 46, wherein said integrated circuit is implemented using technology selected from the group consisting of memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

49. The method as set forth in claim 46, wherein said any dimension of said integrated circuit comprises a horizontal span or vertical span of said integrated circuit.

50. The method as set forth in claim 46, wherein the third non-segmented routing line couples to an input port or output port of a configurable cell without requiring traversal of the first non-segmented routing line and the second non-segmented routing line.

51. The method as set forth in claim 46, further comprising at least one fourth routing line having a greater span than said first non-segmented routing line wherein said first non-segmented routing line selectively couples to said fourth routing line through a single switch.

a first non-segmented routing line, a second non-segmented routing line, and a third non-segmented routing line having different spans, at most one routing line of said first, second and third non-segmented routing lines spanning any dimension of said integrated circuit;

said first non-segmented routing line selectively coupled to drive said second non-segmented routing line through a first switch;

said second non-segmented routing line selectively coupled to drive said third non-segmented routing line through a second switch;

a fourth routing line selectively coupled to drive at least one of said first non-segmented routing line, said second non-segmented routing line, or said third non-segmented routing line through a third switch; and

a fifth routing line selectively coupled to drive said first non-segmented routing line through a fourth switch.

53. The integrated circuit as set forth in claim 52, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

54. The integrated circuit as set forth in claim 52, wherein said integrated circuit is implemented using technology selected from the group consisting of memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

55. The integrated circuit as set forth in claim 52, wherein said any dimension of said integrated circuit comprises a horizontal span or vertical span of said integrated circuit.

56. The integrated circuit as set forth in claim 52, wherein said third non-segmented routing line is selectively coupled to an input port or output port of a configurable cell without requiring traversal of said first non-segmented routing line and said second non-segmented routing line.

57. The integrated circuit as set forth in claim 52, wherein said fifth routing line has a greater span than said first non-segmented routing line.

58. The integrated circuit as set forth in claim 52, further comprising at least one sixth routing line having a first portion along a different dimension than a second portion of said first non-segmented routing line, wherein said second portion of said first non-segmented routing line is selectively coupled to said first portion of said sixth routing line through a single switch.

59. The integrated circuit as set forth in claim 52, further comprising at least one seventh routing line having a third portion along a different dimension than a fourth portion of said second non-segmented routing line wherein said fourth portion of said second non-segmented routing line is selectively coupled to said third portion of said seventh routing line through a single switch.

60. A method for providing an integrated circuit comprising:

providing a first, a second, and a third non-segmented routing lines having different spans, at most one routing line of said non-segmented routing lines spanning any dimension of said integrated circuit;

selectively coupling said first non-segmented routing line to drive said second non-segmented routing line through a first switch;

selectively coupling said second non-segmented routing line to drive said third non-segmented routing line through a second switch;

selectively coupling a fourth routing line to drive one of said first non-segmented routing line, said second non-segmented routing line, or said third non-segmented routing line, through a third switch; and

selectively coupling a fifth routing line to drive said first non-segmented routing line through a fourth switch.

61. The method as set forth in claim 60, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

62. The method as set forth in claim 60, further comprising implementing said integrated circuit using technology selected from the group consisting of memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

63. The method as set forth in claim 60, wherein said any dimension of said integrated circuit comprises a horizontal span or vertical span of said integrated circuit.

64. The method as set forth in claim 60, wherein the third non-segmented routing line couples to an input port or output port of a configurable cell without requiring traversal of the first non-segmented routing line and the second non-segmented routing line.

65. The method as set forth in claim 60, wherein said fifth routing line has a greater span than said first non-segmented routing line.

a first plurality of configurable cells grouped into regions to form levels of hierarchy;

a first region of a first level of the hierarchy comprising a subset of said first plurality of configurable cells in proximity to each other, and having at least a corresponding first set of non-segmented routing lines spanning at least the length of said first region in a dimension;

said first set of non-segmented routing lines configured to couple to the input ports or output ports of configurable cells of said first region;

a second region of a higher level of the hierarchy than said first region, said second region comprising the configurable cells of at least two adjacent first regions, and having at least a corresponding second set of non-segmented routing lines spanning at least the length of said second region in a dimension;

said first set and said second set of non-segmented routing lines having shorter spans than any dimension of said integrated circuit;

a first routing line of said second set of non-segmented routing lines selectively coupling to a second routing line of said first set of non-segmented routing lines of a first region of said second region through a first switch and selectively coupling to drive a third routing line of said first set of non-segmented routing lines of another first region of said second region through a second switch; and

a fourth routing line selectively coupling to drive said third routing line through a third switch.

67. The integrated circuit as set forth in claim 66, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

68. The integrated circuit as set forth in claim 66, wherein said integrated circuit is implemented using technology selected from the group consisting of memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

69. The integrated circuit as set forth in claim 66, wherein said any dimension of said integrated circuit comprises a horizontal span or vertical span of said integrated circuit.

70. The integrated circuit as set forth in claim 66, further comprising a successive region of a higher level of hierarchy than said second region, comprising the configurable cells of at least two adjacent said second regions and having at least one corresponding third set of routing lines spanning at least the length of said successive region in a dimension, and said third set of routing lines selectively coupled to said second sets of non-segmented routing lines of said second regions of said successive region.

71. A method for providing an integrated circuit comprising:

grouping a first plurality of configurable cells into regions to form levels of hierarchy;

forming a first region comprising a second plurality of proximate configurable cells comprising a subset of the first plurality;

selectively coupling a first set of non-segmented routing lines, the routing lines of the first set of non-segmented routing lines spanning at least the length of a dimension of the first region, to input ports or output ports of configurable cells of the second plurality of configurable cells;

forming a second region comprising a third plurality of configurable cells, the third plurality of configurable cells comprising at least the second plurality of configurable cells of two adjacent first regions;

selectively coupling, a second set of non-segmented routing lines to said first sets of non-segmented routing lines of said first regions, routing lines of the second set of non-segmented routing lines spanning at least the length of a dimension of the second region, wherein a first routing line of said second set of non-segmented routing lines is selectively coupled to a second routing line of the first set of non-segmented routing lines of a first region of said second region through a first switch and to drive a third routing line of another first set of non-segmented routing lines of another first region of said second region through a second switch;

said first set and said second set of non-segmented routing lines having shorter spans than any dimension of said integrated circuit; and

selectively coupling a fourth routing line to drive said third non-segmented routing line through a third switch.

72. The method as set forth in claim 71, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

73. The method as set forth in claim 71, further comprising implements said integrated circuit is technology selected from the group comprising memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

74. The method as set forth in claim 71, wherein said any dimension of said integrated circuit comprises a horizontal span or vertical span of said integrated circuit.

75. The method as set forth in claim 71, further comprising:

providing a successive region of a higher level of hierarchy higher than said second region, said successive region comprising the configurable cells of at least two adjacent second regions, and having at least a corresponding third set of routing lines spanning at least the length of said successive region in a dimension; and

selectively coupling said third set of routing lines to said second sets of non-segmented routing lines of said second regions of said successive region.

a first non-segmented routing line, a second non-segmented routing line, and a third non-segmented routing line, said first non-segmented routing line having a greater span than said second non-segmented routing line and said second non-segmented routing line having a greater span than said third non-segmented routing line;

said first non-segmented routing line selectively coupled to drive said second non-segmented routing line through a single switch; and

said third non-segmented routing line selectively coupled to drive said second non-segmented routing line through another single switch.

77. The integrated circuit as set forth in claim 76, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

78. The integrated circuit as set forth in claim 76, wherein said integrated circuit is implemented using technology selected from the group consisting of memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

79. The integrated circuit as set forth in claim 76, wherein a first portion of said first non-segmented routing line is selectively coupled to portions of a plurality of routing lines in the second dimension through a plurality of switches.

80. The integrated circuit as set forth in claim 76, wherein said third non-segmented routing line is selectively coupled to an input port or output port of a plurality of configurable cells through a single switch and at least one additional routing line.

81. The integrated circuit as set forth in claim 76, further comprising at least one fourth routing line wherein said fourth routing line selectively couples, as an extension, to one of said first, second, and third non-segmented routing line through a single switch.

82. A method for providing an integrated circuit comprising:

selectively coupling, through a single switch, a first non-segmented routing line to drive a second non-segmented routing line with a shorter span; and

selectively coupling, through another single switch, a third non-segmented routing line to the second non-segmented routing line, said third non-segmented routing line having a shorter span than the second non-segmented routing line.

83. The method as set forth in claim 82, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

84. The method as set forth in claim 82, wherein said integrated circuit is implemented using technology selected from the group consisting of memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

a first non-segmented routing line and a second non-segmented routing line having a first span, a third non-segmented routing line having a second span greater than the first span;

said first non-segmented routing line selectively coupling, as an extension, to drive said second routing line through a first switch;

said third non-segmented routing line selectively coupling to said first non-segmented routing line through a second switch and said third non-segmented routing line selectively coupling to drive said second non-segmented routing line through a third switch.

86. The integrated circuit as set forth in claim 85, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

87. The integrated circuit as set forth in claim 85, wherein said integrated circuit is implemented using technology selected from the group consisting of memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

88. A method for providing an integrated circuit comprising:

providing a first and a second non-segmented routing lines having a same first span;

providing a third non-segmented routing line having a second span greater than said first span;

providing a first switch, as an extension, to selectively couple said first non-segmented routing line to drive said second non-segmented routing line;

selectively coupling, through a second switch, the first non-segmented routing line to said third non-segmented routing line; and

selectively coupling, through a third switch, the third non-segmented routing line to drive said second non-segmented routing line.

89. The method as set forth in claim 88, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

90. The method as set forth in claim 88, wherein said integrated circuit is implemented using technology selected from the group consisting of memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

a first non-segmented routing line and a second non-segmented routing line having a same first span, a third and a fourth non-segmented routing lines having a same second span greater than said first span;

said first non-segmented routing line selectively couples, as an extension, to drive said second routing line through a first switch;

said third non-segmented routing line selectively couples, as an extension, to said fourth non-segmented routing line through a second switch;

said first non-segmented routing line selectively couples said third non-segmented routing line through a third switch; and

said fourth non-segmented routing line selectively couples to drive said second non-segmented routing line through a fourth switch.

92. The integrated circuit as set forth in claim 91, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

93. The integrated circuit as set forth in claim 91, wherein said integrated circuit is implemented using technology selected from the group consisting of memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

94. A method for providing an integrated circuit comprising:

providing a first and a second non-segmented routing lines having a same first span;

providing a third and a fourth non-segmented routing lines having a same second span greater than said first span;

providing a first switch, as an extension, to selectively couple said first non-segmented routing line to drive said second non-segmented routing line;

providing a second switch, as an extension, to selectively couple said third non-segmented routing line to said fourth non-segmented routing line;

providing a third switch, selectively coupling said first non-segmented routing line to said third non-segmented routing line; and

providing a fourth switch, selectively coupling said fourth non-segmented routing line to drive said second non-segmented routing line.

95. The method as set forth in claim 94, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

96. The method as set forth in claim 94, wherein said integrated circuit is implemented using technology selected from the group consisting of memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

a first non-segmented routing line having a first span in a first dimension;

a second non-segmented routing line having a second span in the first dimension;

a third non-segmented routing line having a third span in the first dimension, said first, second, and third spans being three different spans, each of said first, second, and third spans being less than a span of said integrated circuit in the first dimension, and said third span being greater than said first span;

a fourth non-segmented routing line having a fourth span in a second dimension;

a fifth non-segmented routing line having a fifth span in the second dimension;

a sixth non-segmented routing line having a sixth span in the second dimension, said fourth, fifth, and sixth spans being three different spans, each of said fourth, fifth, and sixth spans being less than a span of said integrated circuit in the second dimension, and said sixth span being greater than said fourth span; and

wherein said third non-segmented routing line selectively couples to said sixth non-segmented routing line through a first switch.

98. The integrated circuit as set forth in claim 97, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

99. The integrated circuit as set forth in claim 97, wherein said integrated circuit is implemented using technology selected from the group consisting memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

100. The integrated circuit as set forth in claim 97, wherein said first non-segmented routing line selectively couples to at least one of the group consisting of input port of a configurable cell, output port of a configurable cell, and routing line, through a second switch.

101. The integrated circuit as set forth in claim 97, wherein said second non-segmented routing line selectively couples to said fifth non-segmented routing line through a third switch.

102. The integrated circuit as set forth in claim 97, wherein said first non-segmented routing line selectively couples to said second non-segmented routing line.

103. The integrated circuit as set forth in claim 97, wherein said second non-segmented routing line selectively couples to said third non-segmented routing line.

a first non-segmented routing line having a first span in a first dimension;

a second non-segmented routing line having a second span in the first dimension;

a third non-segmented routing line having a third span in the first dimension, said first, second, and third spans being three different spans in the first dimension, said third span being greater than said first and second spans;

a fourth non-segmented routing line having a fourth span in a second dimension;

a fifth non-segmented routing line having a fifth span in the second dimension;

a sixth non-segmented routing line having a sixth span in the second dimension, said fourth, fifth, and sixth spans being three different spans in the second dimension, said sixth span being greater than said fourth and fifth spans; and

said third non-segmented routing line selectively couples to drive said sixth non-segmented routing line and said sixth non-segmented routing line selectively couples to drive said third non-segmented routing line, through a first switch.

105. The integrated circuit as set forth in claim 104, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

106. The integrated circuit as set forth in claim 104, wherein said integrated circuit is implemented using technology selected from the group consisting memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

107. The integrated circuit as set forth in claim 104, wherein said first non-segmented routing line selectively couples to at least one of the group consisting of input port of a configurable cell, output port of a configurable cell, and routing line, through a second switch.

108. The integrated circuit as set forth in claim 104, wherein said second non-segmented routing line selectively couples to said fifth non-segmented routing line through a third switch.

109. The integrated circuit as set forth in claim 104, wherein said first non-segmented routing line selectively couples to said second non-segmented routing line.

110. The integrated circuit as set forth in claim 104, wherein said second non-segmented routing line selectively couples to said third non-segmented routing line.

providing a first, second, and third non-segmented routing lines having a first, second, and third spans respectively in a first dimension, said first, second, and third spans being three different spans in the first dimension, each of said first, second, and third spans being less than a span of said programmable IC in the first dimension, and said third span being greater than said first span;

providing a fourth, fifth, and sixth non-segmented routing lines having a fourth, fifth, and sixth spans respectively in a second dimension, said fourth, fifth, and sixth spans being three different spans in the second dimension, each of said fourth, fifth, and sixth spans being less than a span of said programmable IC in the second dimension, and said sixth span being greater than said fourth span; and

selectively coupling said third non-segmented routing line to said sixth non-segmented routing line through a first switch.

112. The method of claim 111, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

113. The method of claim 111, wherein said integrated circuit is implemented using technology selected from the group consisting memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

114. The method of claim 111, further comprising selectively coupling said first non-segmented routing line to at least one of the group consisting of input port of a configurable cell, output port of a configurable cell, and routing line, through a second switch.

115. The method of claim 111, further comprising selectively coupling said second non-segmented routing line to said fifth non-segmented routing line through a third switch.

116. The method of claim 111, further comprising selectively coupling said first non-segmented routing line to said second non-segmented routing line.

117. The method of claim 111, further comprising selectively coupling said second non-segmented routing line to said third non-segmented routing line.

providing a first, second, and third non-segmented routing lines having a first, second, and third spans respectively in a first dimension, said first, second, and third spans being three different spans in the first dimension, and said third span being greater than said first and second spans;

providing a fourth, fifth, and sixth non-segmented routing lines having a fourth, fifth, and sixth spans respectively in a second dimension, said fourth, fifth, and sixth spans being three different spans in the second dimension, and said sixth span being greater than said fourth and fifth spans;

selectively coupling said third non-segmented routing line to drive said sixth non-segmented routing line through a first switch; and

selectively coupling said sixth non-segmented routing line to drive said third non-segmented routing line through the first switch.

119. The method of claim 118, wherein said switches comprise components selected from the group consisting of switches, programmable passgates and program controlled drivers/receivers.

120. The method of claim 118, wherein said integrated circuit is implemented using technology selected from the group consisting memory, non-volatile memory, ferro-electric, fuse and anti-fuse processes.

121. The method of claim 118, further comprising selectively coupling said first non-segmented routing line to at least one of the group consisting of input port of a configurable cell, output port of a configurable cell, and routing line, through a second switch.

122. The method of claim 118, further comprising selectively coupling said second non-segmented routing line to said fifth non-segmented routing line through a third switch.

123. The method of claim 118, further comprising selectively coupling said first non-segmented routing line to said second non-segmented routing line.

124. The method of claim 118, further comprising selectively coupling said second non-segmented routing line to said third non-segmented routing line.