The original. The IKo™ CLASSIC™ is a practical benchtop
tool with the smallest footprint for up to 8" wafers on the market. It's
designed simply to electroplate high-resolution interconnects
and fine metallic features on wafers and substrates.

micro/macro uniformity <5% across the wafer

superior process control for sub-mil features

low purchase and operating costs

smallest 8" wafer plater footprint on the market (26"X28")

handles various-sized wafers (2 cm2 to 8")

simultaneously processes up to three 2" wafers

extremely fast -- typically, 1µ per minute

uses off-the-shelf chemistries with minimal additives

efficiently reuses chemical solution

easy to use/maintain

FIBRoplate™ IKo™ is fabricated with PVC and polypropylene
and a minimum of metal parts to avoid potential contamination of
electroplating solutions. Metal features are stainless and titanium.
All parts can be easily disassembled for maintenance.

The unit is made up of two sections:

Electroplating Section -- conveniently accessible while preparing
wafers for plating.
Power Section -- rolls over the Electroplating Section for processing.

Wafer holder, ergonomically designed for easy processing and handling. IKo™ can
accommodate various wafer sizes. A full-circle, elastic electric
contact provides uniform current distribution. Result: uniform
thickness features across the wafer.

Reciprocating anode, a proprietary feature. Provides for
an efficient exchange of matter and uniform electric field distribution.