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Abstract:

The present invention relates to a cluster tool for processing
semiconductor substrates. One embodiment of the present invention
provides a mainframe for a cluster tool comprising a transfer chamber
having a substrate transferring robot disposed therein. The substrate
transferring robot is configured to shuttle substrates among one or more
processing chambers directly or indirectly connected to the transfer
chamber. The mainframe further comprises a shutter disk shelf configured
to store one or more shutter disks to be used by the one or more
processing chambers, wherein the shutter disk shelf is accessible to the
substrate transferring robot so that the substrate transferring robot can
transfer the one or more shutter disks between the shutter disk shelf and
the one or more processing chambers directly or indirectly connected to
the transfer chamber.

Claims:

1. A transfer chamber, comprising: a main chamber body comprising a top,
a bottom and a plurality of sidewalls defining a main volume, wherein
each of the plurality of sidewalls has an opening formed therethrough; an
extension chamber body comprising a top, a bottom, and at least a first
sidewall and a second sidewall defining an extension volume, wherein the
extension chamber body is directly attached to one of the plurality of
sidewalls of the main chamber body, and the main volume and the extension
volume are directly connected; a transfer robot mounted in the main
chamber body, wherein rotation of the transfer robot must define a
cylindrical volume extending from the main volume into the extension
volume; and a vacuum pump mounted on the extension chamber body.

2. The transfer chamber of claim 1, further comprising chamber port
assemblies mounted on remaining sidewalls of the main chamber body.

3. The transfer chamber of claim 2, wherein each chamber port assembly
permits rotation of the transfer robot outside the main volume.

4. The transfer chamber of claim 1, wherein the main chamber body and the
extension chamber body form a single vacuum enclosure controlled by the
vacuum pump.

5. The transfer chamber of claim 1, further comprising a shutter disk
shelf disposed in the extension volume of the extension chamber, the
shutter disk shelf is configured to store one or more shutter disks to be
used by one or more processing chambers coupled to the main chamber body,
and the shutter disk shelf is accessible to the transfer robot.

6. The transfer chamber of claim 5, wherein the shutter disk shelf is
disposed in a first portion of the extension volume of the extension
chamber body, and a second portion of the extension volume of the
extension chamber body is configured to provide a passage for the
transfer robot to access a load lock chamber or a pass through chamber
connected to the extension chamber body.

7. The transfer chamber of claim 6, wherein the shutter disk shelf is
disposed in a lower portion of the extension volume.

8. The transfer chamber of claim 6, wherein the shutter disk shelf is
movably disposed in the extension volume.

9. The transfer chamber of claim 8, further comprising an indexer
connected to the shutter disk shelf, wherein the indexer is configured to
transfer the shutter disk shelf vertically in the extension chamber body
so that the shutter disk shelf is accessible to the transfer robot.

10. A cluster tool configured to process one or more substrates,
comprising: a first transfer chamber comprising: a main chamber body
comprising a top, a bottom and a plurality of sidewalls defining a main
volume, wherein each of the plurality of sidewalls has an opening formed
therethrough; an extension chamber body comprising a top, a bottom, and
at least a first sidewall and a second sidewall defining an extension
volume, wherein the extension chamber body is directly attached to one of
the plurality of sidewalls of the main chamber body, and the main volume
and the extension volume are directly connected; a transfer robot mounted
in the main chamber body, wherein rotation of the transfer robot must
define a cylindrical volume extending from the main volume into the
extension volume; and a vacuum pump mounted on the extension chamber
body; one or more processing chambers connected to the plurality of
sidewalls of the main chamber body of the first transfer chamber; and a
load lock chamber connected to the extension chamber body of the first
transfer chamber.

11. The cluster tool of claim 10, further comprising: a second transfer
chamber comprising: a main chamber body comprising a top, a bottom and a
plurality of sidewalls defining a main volume, wherein each of the
plurality of sidewalls has an opening formed therethrough; an extension
chamber body comprising a top, a bottom, and at least a first sidewall
and a second sidewall defining an extension volume, wherein the extension
chamber body is directly attached to one of the plurality of sidewalls of
the main chamber body, and the main volume and the extension volume are
directly connected; a transfer robot mounted in the main chamber body,
wherein rotation of the transfer robot must define a cylindrical volume
extending from the main volume into the extension volume; and a vacuum
pump mounted on the extension chamber body; and a pass through chamber
coupled between the first transfer chamber and the second transfer
chamber.

12. The cluster tool of claim 11, further comprising one or more
processing chambers connected to the second transfer chamber.

13. The cluster tool of claim 10, wherein the main chamber body and the
extension chamber body of the first transfer chamber form a single vacuum
enclosure controlled by the vacuum pump.

14. The cluster tool of claim 10, wherein the first transfer chamber
further comprises a shutter disk shelf disposed in the extension volume
of the extension chamber, the shutter disk shelf is configured to store
one or more shutter disks to be used by one or more processing chambers
coupled to the main chamber body, and the shutter disk shelf is
accessible to the transfer robot.

15. The cluster tool of claim 14, wherein the shutter disk shelf is
disposed in a first portion of the extension volume of the extension
chamber body, and a second portion of the extension volume of the
extension chamber body is configured to provide a passage for the
transfer robot to access the load lock chamber connected to the extension
chamber body.

16. The cluster tool of claim 15, wherein the shutter disk shelf is
disposed in a lower portion of the extension volume.

17. The cluster tool of claim 15, wherein the shutter disk shelf is
movably disposed in the extension volume.

18. The cluster tool of claim 17, wherein the first transfer chamber
further comprises an indexer connected to the shutter disk shelf, and the
indexer is configured to transfer the shutter disk shelf vertically in
the extension chamber body so that the shutter disk shelf is accessible
to the transfer robot.

19. The cluster tool of claim 14, wherein the shutter disk shelf
comprises: a first post; a second post disposed opposing the first post;
and one or more pairs supporting fingers extending from each of the first
and second posts, wherein the one or more pairs of supporting fingers
form one or more slots, and each slot is configured to support one
shutter disk thereon.

20. The cluster tool of claim 19, wherein each of the supporting fingers
comprises two contact balls configured to be in contact with a back side
of a shutter disk.

[0003] Embodiments of the invention generally relate to an integrated
processing system configured to process semiconductor substrates. More
particularly, the invention relates a cluster tool has a mainframe
including a transfer chamber and an extension chamber configured to store
shutter disks therein.

[0004] 2. Description of the Related Art

[0005] The process of forming semiconductor devices is commonly done in a
multi-chamber processing system (e.g., a cluster tool) which has the
capability to process substrates, (e.g., semiconductor wafers) in a
controlled processing environment. A typical controlled processing
environment includes a system that has a mainframe which houses a
substrate transfer robot configured to transport substrates among a load
lock chamber and multiple vacuum processing chambers, which are connected
to the mainframe. The controlled processing environment has many
benefits, such as minimizing contamination of the substrate surfaces
during transfer and during completion of the various substrate processing
steps. Processing in a controlled environment thus reduces the number of
generated defects and improves device yield.

[0006] A mainframe for a cluster tool generally includes a central
transfer chamber housing a robot adapted to shuttle one or more
substrates. Processing chambers and load locks are mounted on the central
transfer chamber. During processing, an internal volume of the central
transfer chamber is typically maintained at a vacuum condition to provide
an intermediate region in which substrates may be shuttled from one
processing chamber to another, and/or to a load lock chamber positioned
at a front end of the cluster tool.

[0007] Some processing chambers, such as a physical vapor deposition (PVD)
chamber, comprise a shutter disk which may be used to protect a substrate
support during conditioning operation. Typically, a PVD processing is
performed in a sealed chamber having a pedestal for supporting a
substrate disposed thereon. The pedestal typically includes a substrate
support that has electrodes disposed therein to electrostatically hold
the substrate against the substrate support during processing. A target,
generally comprised of a material to be deposited on the substrate, is
supported above the substrate, typically fastened to a top of the
chamber. A plasma formed from a gas, such as argon, is supplied between
the substrate and the target. The target is biased, causing ions within
the plasma to be accelerated toward the target. Ions impacting the target
cause material to become dislodged from the target. The dislodged
material is attracted towards the substrate and deposit a film of
material thereon.

[0008] Conditioning operations, such as burn-in process, pasting, and/or
cleaning operations, are performed periodically to ensure processing
performance of the PVD chamber. During conditioning operations, a dummy
substrate or a shutter disk is disposed on the pedestal to protect the
substrate support from any deposition or particle contamination. The
state of the art PVD chambers generally include a shutter disk storage
space designated storing a shutter disk during process, and a robotic arm
configured to transfer the shutter disk between the shutter disk storage
space and the substrate support for conditioning operations. The shutter
disk stays in the shutter disk storage space within the PVD chamber
during deposition, and covers the substrate support during conditioning
operations. The shutter disk storage space and the robotic arm designed
to transfer the shutter disk increases complexity and volume of the PVD
chamber.

[0009]FIG. 1A schematically illustrates a PVD processing chamber 10 of
prior art. The PVD processing chamber 10 includes a chamber body 2 and a
lid assembly 6 that defines an evacuable process volume. The chamber body
2 generally includes sidewalls and a bottom 54. The sidewalls generally
contain a plurality of apertures that include an access port, pumping
port and a shutter disk port 56 (access and pumping ports not shown). The
sealable access port provides for entrance and egress of the substrate 12
from the PVD processing chamber 10. The pumping port is coupled to a
pumping system (also not shown) that evacuates and controls the pressure
within the process volume. The shutter disk port 56 is configured to
allow at least a portion of a shutter disk 14 therethrough when the
shutter disk 14 is in the cleared position. A housing 16 generally covers
the shutter disk port 56 to maintain the integrity of the vacuum within
the process volume.

[0010] The lid assembly 6 of the body 2 generally supports an annular
shield 62 suspended therefrom that supports a shadow ring 58. The shadow
ring 58 is generally configured to confine deposition to a portion of the
substrate 12 exposed through the center of the shadow ring 58.

[0011] The lid assembly 6 further includes a target 64 and a magnetron 66.
The target 64 provides material that is deposited on the substrate 12
during the PVD process while the magnetron 66 enhances uniform
consumption of the target material during processing. The target 64 and
substrate support 4 are biased relative each other by a power source 84.
A gas such as argon is supplied to the process volume 60 from a gas
source 82. A plasma is formed between the substrate 12 and the target 64
from the gas. Ions within the plasma are accelerated toward the target 64
and cause material to become dislodged from the target 64. The dislodged
target material is attracted towards the substrate 12 and deposits a film
of material thereon.

[0012] The substrate support 4 is generally disposed on the bottom 54 of
the chamber body 2 and supports the substrate 12 during processing. A
shutter disk mechanism 8 is generally disposed proximate the substrate
support 4. The shutter disk mechanism 8 generally includes a blade 18
that supports the shutter disk 14 and an actuator 26 coupled to the blade
18 by a shaft 20. Typically, the blade 18 is moved between the cleared
position shown in FIG. 1A and a second position that places the shutter
disk 114 substantially concentric with the substrate support 4. In the
second position, the shutter disk 14 may be transferred (by utilizing the
lift pins) to the substrate support 4 during the target burn-in and
chamber pasting process. Typically, the blade 18 is returned to the
cleared position during the target burn-in and chamber pasting process.
The actuator 26 may be any device that may be adapted to rotate the shaft
20 through an angle that moves the blade 18 between the cleared and
second positions.

[0013] FIG. 1B schematically top and sectional plan views of the PVD
processing chamber. FIG. 1B illustrates the housing 16 relative to the
shutter disk 14, the blade 18 and the substrate support 4.

[0014] Therefore, the state of the art PVD processing chambers with
built-in shutter disk storage and transfer mechanism are not only complex
but also bulky. There are usually multiple processing chambers require a
shutter disk in a cluster tool configured to perform one or more PVD
process steps. With multiple chambers having shutter disk storage and
transferring mechanisms, footprint and cost of a cluster tool can be
increased greatly.

[0015] Therefore, there is need for an efficient shutter disk storage and
transferring mechanism in a cluster tool.

SUMMARY OF THE INVENTION

[0016] The present invention generally provides an apparatus and method
for processing semiconductor substrates. Particularly, the present
invention provides a cluster tool having an extension chamber connected
to a transfer chamber, wherein the extension chamber comprises a shutter
disk shelf to store shutter disks to be used in processing chambers
connected to the transfer chamber.

[0017] One embodiment of the present invention provides a mainframe for a
cluster tool comprising a transfer chamber having a substrate
transferring robot disposed therein, wherein the substrate transferring
robot is configured to shuttle substrates among one or more processing
chambers directly or indirectly connected to the transfer chamber, and a
shutter disk shelf configured to store one or more shutter disks to be
used by the one or more processing chambers, wherein the shutter disk
shelf is accessible to the substrate transferring robot so that the
substrate transferring robot can transfer the one or more shutter disks
between the shutter disk shelf and the one or more processing chambers
directly or indirectly connected to the transfer chamber.

[0018] Another embodiment of the present invention provides a transfer
chamber assembly for a cluster tool comprising a main chamber having a
central robot disposed therein, wherein the main chamber configured to
connect to a plurality of chambers, the central robot is configured to
shuttle one or more substrates among the plurality of chambers connected
to the main chamber, an extension chamber connected to the main chamber,
a shutter disk shelf disposed in the extension chamber, wherein the
shutter disk shelf is configured to support one or more shutter disks
therein, and the shutter disk shelf is accessible to the central robot.

[0019] Yet another embodiment of the present invention provides a cluster
tool configured to process semiconductor substrates comprising a first
transfer chamber having a first central robot disposed therein, a first
extension chamber connected to the first transfer chamber, the first
extension chamber having a first shutter disk shelf positioned therein,
wherein the first shutter disk shelf is configured to support one or more
shutter disks thereon, and the first shutter disk shelf is accessible by
the first central robot, one or more processing chambers connected to the
first transfer chamber, and a load lock chamber connected to the first
extension chamber.

BRIEF DESCRIPTION OF THE DRAWINGS

[0020] So that the manner in which the above recited features of the
present invention can be understood in detail, a more particular
description of the invention, briefly summarized above, may be had by
reference to embodiments, some of which are illustrated in the appended
drawings. It is to be noted, however, that the appended drawings
illustrate only typical embodiments of this invention and are therefore
not to be considered limiting of its scope, for the invention may admit
to other equally effective embodiments.

[0021]FIG. 1A schematically illustrates a sectional side view of a PVD
processing chamber of prior art.

[0022] FIG. 1B schematically illustrates a top view of the PVD processing
chamber of prior art.

[0023]FIG. 2 schematically illustrates a plan view of a cluster tool in
accordance with one embodiment of the present invention.

[0024]FIG. 3A schematically illustrates a sectional side view of a
cluster tool having a vacuum extension with a movable shelf to store
shutter disks in accordance with one embodiment of the present invention.

[0025]FIG. 3B schematically illustrates a sectional side view of a
cluster tool having a vacuum extension with a stationary shelf to store
shutter disks in accordance with one embodiment of the present invention.

[0051]FIG. 11B schematically illustrates a transporting brace in
accordance with one embodiment of the present invention.

[0052] To facilitate understanding, identical reference numerals have been
used, where possible, to designate identical elements that are common to
the figures. It is contemplated that elements disclosed in one embodiment
may be beneficially utilized on other embodiments without specific
recitation.

DETAILED DESCRIPTION

[0053] The present invention generally provides an apparatus and method
for processing substrates using a multi-chamber processing system.
Embodiments of the present invention include a mainframe comprising a
transfer chamber configured to host a substrate transferring robot and an
extension chamber configured to provide a low pressure environment to the
mainframe. Extension chambers in accordance with embodiments of the
present invention also comprise a shelf for storing and support shutter
disks used by processing chambers connected to the mainframe.

[0054]FIG. 2 schematically illustrates a plan view of a cluster tool 100
in accordance with one embodiment of the present invention. The cluster
tool 100 comprises multiple processing chambers coupled to a single
mainframe.

[0055] The cluster tool 100 comprises a front-end environment 102 (also
referred to as a factory interface, or FI) in selective communication
with a load lock chamber 104. One or more pods 101 are coupled to the
front-end environment 102. The one or more pods 101 are configured to
store and transport substrates. A factory interface robot 103 is disposed
in the front-end environment 102. The factory interface robot 103 is
configured to transfer substrates between the pods 101 and the load lock
chamber 104.

[0056] The load lock chamber 104 provides a vacuum interface between the
front-end environment 102 and a mainframe 110. An internal region of the
mainframe 110 is typically maintained at a vacuum condition and provides
an intermediate region to shuttle substrates from one chamber to another
and/or to a load lock chamber.

[0057] In one embodiment, the mainframe 110 is divided into two parts to
minimize the footprint of the cluster tool 100. In one embodiment of the
present invention, the mainframe 110 comprises a transfer chamber 108 and
a vacuum extension chamber 107. The transfer chamber 108 and the vacuum
extension chamber 107 are coupled together and in fluid communication
with one another and form an inner volume in the mainframe 110. An inner
volume of the mainframe 110 is typically maintained a low pressure or
vacuum condition during processing. The load lock chamber 104 may be
connected to the front-end environment 102 and the vacuum extension
chamber 107 via slit valves 105 and 106 respectively.

[0058] The transfer chamber 108 is configured to house a central robot 109
and provide interfaces to a plurality of processing chambers, and/or pass
through chambers for connecting to additional mainframes to extend the
cluster tool 100. In one embodiment, the transfer chamber 108 may be a
polygonal structure having a plurality of sidewalls, a bottom and a lid.
The plurality sidewalls may have opening formed therein and are
configured to connect with processing chambers, vacuum extension chambers
and/or pass through chambers. The transfer chamber 108 shown in FIG. 2
has a square horizontal profile and is coupled to processing chambers
111, 112, 113, and the vacuum extension chamber 107. In one embodiment,
the transfer chamber 108 may be in selective communication with the
processing chambers 111, 112, 113 via slit valves 116, 117, 118
respectively. In one embodiment, the central robot 109 may be mounted in
the transfer chamber 108 at a robot port formed on the bottom of the
transfer chamber 108.

[0059] The central robot 109 is disposed in an internal volume of the
transfer chamber 108 and is configured to shuttle substrates 114 in a
substantially horizontal orientation among the processing chambers 111,
112, 113 and to and from the load lock chamber 104 through the vacuum
extension chamber 107. Details of suitable robots may be found in
commonly assigned U.S. Pat. No. 5,469,035, entitled "Two-axis
magnetically coupled robot", filed on Aug. 30, 1994; U.S. Pat. No.
5,447,409, entitled "Robot Assembly" filed on Apr. 11, 1994; and U.S.
Pat. No. 6,379,095, entitled "Robot for Handling Semiconductor
Substrates", filed on Apr. 14, 2000, which are hereby incorporated by
reference in their entireties. In one embodiment, the central robot 109
may comprise two blades for holding substrates, each blade mounted on an
independently controllable robot arm coupled to the same robot base. In
another embodiment, the central robot 109 is configured to control the
vertical elevation of the blades.

[0060] The vacuum extension chamber 107 is configured to provide an
interface to a vacuum system to the transfer chamber 108. In one
embodiment, the vacuum extension chamber 107 comprises a bottom, a lid
and sidewalls. A pressure modification port 115 may be formed on the
bottom of the vacuum extension chamber 107 and is configured to adapt to
a vacuuming pump system, such as a cryogenic pump, which is required to
maintain high vacuum in the transfer chamber 108. The pressure
modification port 115 may be blocked with a blank off when only a smaller
vacuum pump is needed. A smaller vacuum pump may be coupled to the
transfer chamber 108 through a smaller port formed in on the transfer
chamber 108.

[0061] It should be noted that the vacuum extension chamber 107 is much
smaller/narrower compared to the transfer chamber 108 since the vacuum
extension chamber 107 only needs to be wide enough to allow a substrate
pass through.

[0062] Openings may be formed on the sidewalls so that the vacuum
extension chamber 107 is in fluid communication with the transfer chamber
108, and in selective communication with chambers connected thereon, such
as load lock chambers, pass through chambers, and/or processing chamber.

[0063] In one embodiment, the cluster tool 100 may be configured to
deposit a film on semiconductor substrates using physical vapor
deposition (PVD) process.

[0064] Typically, PVD is performed in a sealed chamber having a pedestal
for supporting a substrate disposed thereon. The pedestal typically
includes a substrate support that has electrodes disposed therein to
electrostatically hold the substrate against the substrate support during
processing. A target, generally comprised of a material to be deposited
on the substrate, is supported above the substrate, typically fastened to
a top of the chamber. A plasma formed from a gas, such as argon, is
supplied between the substrate and the target. The target is biased,
causing ions within the plasma to be accelerated toward the target. Ions
impacting the target cause material to become dislodged from the target.
The dislodged material is attracted towards the substrate and deposit a
film of material thereon.

[0065] Conditioning operations, such as burn-in process, pasting, and/or
cleaning operations, are performed periodically to ensure processing
performance of the PVD chamber. During conditioning operations, a dummy
substrate or a shutter disk is disposed on the pedestal to protect the
substrate support from any deposition or particle contamination. The
state of the art PVD chambers generally include an integral shutter disk
storage space designated storing a shutter disk during the PVD process,
and a robotic arm configured to transfer the shutter disk between the
shutter disk storage space and the substrate support for conditioning
operations. The shutter disk stays in the shutter disk storage space
within the PVD chamber during deposition, and covers the substrate
support during conditioning operations. The shutter disk storage space
and the robotic arm designed to transfer the shutter disk increases
complexity and volume of the PVD chamber.

[0066] In one embodiment of the present invention, the vacuum extension
chamber 107 comprises a shutter disk shelf, further described in FIGS.
3A-B, configured to store one or more shutter disks. PVD chambers
connected to the transfer chamber 108 may store their shutter disks in
the shutter disk shelf and use the central robot 109 to transfer the
shuttle disks. It is also contemplated that the PVD chambers may share
one or more shutter disks. In one embodiment, the shutter disk shelf may
be configured to store one shutter disk for each processing chambers
connected to the transfer chamber 108.

[0067] The shutter disk shelf positioned in the vacuum extension chamber
may also be used for storage, queuing, and/or accommodating any other
disks used in the system. Additionally, the shutter disk shelf may be
used to store and facilitate quick access to any substrate form devices,
i.e. 300 mm disk, that are reusable in the system. The vacuum extension
chamber of the present invention may also provide space for an inspection
station, or cooling/heating station during a process.

[0068] In one embodiment, the shutter disk shelf may provide a recharging
station for a vision calibration substrate. The vision calibration
substrate is a reusable device having one or more wireless cameras
disposed thereon. The vision calibration substrate may be used to
measure, inspect and calibration interiors of a cluster tool accessible
to the central robot, including the transfer chambers, extension
chambers, load lock chambers, pass through chambers, and the processing
chambers. The vision calibration substrate may also be used to calibrate
the central robot. A detailed description of the vision calibration
substrate may be found in the U.S. Pat. No. 7,085,622, entitled "Vision
System", which is hereby incorporated by reference.

[0069] The vision calibration substrate comprises one or more wireless
cameras, which have rechargeable power supplies so that the cameras can
work wirelessly in the interior of the cluster tool. Currently, the power
supplies to the wireless cameras are charged and recharged outside the
cluster tool. The charged vision calibration substrate is generally fed
into the cluster tool from the front-end environment while halting the
process. The vision calibration substrate is taken out of the cluster
tool after the task is completed or the power supplies are depleted. In
one embodiment of the present invention, electrical contacts may be
formed in one or more slots of the shutter disk shelf for charging a
vision calibration substrate. One or more vision calibration substrates
may be stored in the shutter disk shelf and are ready to use at any time.
The measurement using the vision calibration substrates may be performed
with much reduced interruption to the processing in the cluster tool.

[0070] Positioning shutter disks within a mainframe of a cluster tool
simplifies processing chambers that require shutter disks by eliminating
a designated region for shutter disks within the processing chambers, and
devices for transferring and/or monitoring the shutter disks, hence
reducing cost of the processing chambers. Positioning shutter disks
within a mainframe of a cluster tool may also improves gas flows and
electrical characteristics, and thus processing. Additionally, cost of
ownership may also be reduced due to decrease of the overall volume of
the cluster tool since the processing chambers are smaller.

[0071] In one embodiment, the cluster tool 100 may comprises a pre-clean
chamber, a PVD chamber and a degassing chamber connected to the
transferring chamber 108 at positions for processing chambers 111, 112,
113.

[0073] In one embodiment of the present invention, the load lock chamber
104 comprises an upper load lock chamber 104a stacked over a lower load
lock chamber 104b. The upper load lock chamber 104a and the lower load
lock chamber 104b may be operated independently so that transferring of
substrates between the front-end environment 102 and the mainframe 110
can be conducted in both directions simultaneously.

[0074] The load lock chambers 104a, 104b provide a first vacuum interface
between the front-end environment 102 and the mainframe 110 via slit
valves 105a, 106a, 105b, 106b respectively. In one embodiment, the two
load lock chambers 104a, 104b are provided to increase throughput by
alternatively communicating with the mainframe 110 and the front-end
environment 102. While one load lock chamber 104a or 104b communicates
with the mainframe 110, a second load lock chamber 104b or 104a can
communicate with the front-end environment 102.

[0075] In one embodiment, one of the load lock chambers 104a, 104b may be
used as a processing chamber, such as a degas chamber, an inspection
station, a pre-heat chamber, a cooling chamber, or curing chamber. For
example, the slit valve 105b may be replaced by a permanent blocker so
that the lower load lock chamber 104b only opens to the mainframe 110.
The central robot 109 may shuttle substrates to and from the lower load
lock chamber 104b prior to and after a degassing process through the slit
valve 106b.

[0076] Referring to FIG. 3A, the internal volume of the mainframe 110 is
defined by an internal volume 119 of the vacuum extension chamber 107
connected to an internal volume 120 of the transfer chamber 108. An
opening 128 is formed between the transfer chamber 108 and the vacuum
extension chamber 107. The opening 128 provides fluid communication
between the vacuum extension chamber 107 and the transfer chamber 108,
and are large enough to allow the central robot 109 to shuttle substrates
to and from the load lock chamber 104.

[0077] A vacuum system 125 is coupled the vacuum extension chamber 107 and
is configured to provide a low pressure environment to both the internal
volume 119 and the internal volume 120. A robotic mechanism 126 is
coupled to the transfer chamber 108. The transfer chamber 108 and the
vacuum extension chamber 107 are constructed to minimize the foot print
of the cluster tool 100.

[0078] For a cluster tool, when a vacuum system, such as a cryogenic pump,
is required to maintain vacuum, usually high vacuum, within a transfer
chamber, a large vacuum port is generally formed in the transfer chamber.
The transfer chamber, thus, has both a robot port configured to adapt to
a robotic transport mechanism and a vacuum port for the vacuum system.
The robot port is generally positioned near a center of the transfer
chamber, while the vacuum port positioned in a satellite position
relative to the robot port leaving enough space for both the robotic
transport mechanism and the vacuum pump. As a result, the transfer
chamber has a large foot print and a large internal volume. The large
foot print of the transfer chamber greatly enlarges the foot print of the
cluster tool as a whole since processing chambers, load lock chambers
and/or pass through chambers are distributed around the transfer chamber.

[0079] Embodiments of the present invention provides a vacuum system
connection to the transfer chamber for obtaining high vacuum without
greatly enlarge the foot print of the transfer chamber and the cluster
tool. By "outsourcing" the pressure modification port to a separated
extension chamber, size of the transfer chamber may be minimized to be
just enough to provide space for the central robot. Size of the extension
chamber may be determined by the size of the vacuum system needed. The
combined footprint of a transfer chamber with a robot port only and its
extension chamber with a robot port is much smaller compared to the state
of a state of the art transfer chamber with both a vacuum port and a
robot port. The decrease of the foot print of a cluster tool is more
pronounced since a cluster tool may be built around a minimized transfer
chamber when the extension chamber is positioned to take a space of a
load lock chamber around the transfer chamber.

[0080] It should be noted that the size of the extension chamber is
usually much smaller than the size of the transfer chamber since the
extension chamber only needs to be large enough to accommodate passage of
a substrate, while the transfer chamber generally needs to host the
central robot.

[0081] Additionally, internal volume of a transfer chamber and extension
chamber of the present invention is reduced compared to the state of the
art transfer chambers. This allows fast pump downs, requires less energy
to maintain vacuum and smaller, less costly pumps.

[0082] In one embodiment, an indexer 124 is coupled to the movable shutter
disk shelf 122 and is configured to vertically move the movable shutter
disk shelf 122. The movable shutter disk shelf 122 may be positioned on
an upper portion of the internal volume 119 of the vacuum extension
chamber 107 when the central robot 109 transfers substrates to and from
the load lock chamber 104 through a lower portion of the internal volume
119. The movable shutter disk shelf 122 may be lowered to the lower
portion of the internal volume 119 by the indexer 124 so that the central
robot 109 can pick up a shutter disk from the movable shutter disk shelf
122 or drop a shutter disk on the movable shelf 122.

[0083]FIG. 3B schematically illustrates a sectional side view of a
cluster tool 100a having a mainframe 110a in accordance with one
embodiment of the present invention. The mainframe 110a comprises a
vacuum extension chamber 133 with a stationary shelf 135 configured for
storing one or more shutter disks.

[0084] A load lock chamber 130 provides a first vacuum interface between
the front-end environment 102 and the mainframe 110a. In one embodiment,
the load lock chamber 130 comprises an upper substrate support 131 and a
lower substrate support 132 stacked within the load lock chamber 130. The
upper substrate support 131 and the lower substrate support 132 are
configured to support substrates thereon. In one embodiment, the upper
substrate support 131 and the lower substrate support 132 may be
configured to support incoming and outgoing substrates respectively. The
upper substrate support 131 and the lower substrate support 132 may
comprise features for temperature control, such as a built-in heater or
cooler to heat or cool substrates during transferring.

[0085] The internal volume of the mainframe 110a is defined by an internal
volume 134 of the vacuum extension chamber 133 connected to the internal
volume 120 of the transfer chamber 108. An opening 128a is formed between
the transfer chamber 108 and the vacuum extension chamber 133. The
opening 128a provides fluid communication between the vacuum extension
chamber 133 and the transfer chamber 108, and are large enough to allow
the central robot 109 to shuttle substrates to and from the load lock
chamber 130, as well as access the stationary shelf 135 of the vacuum
extension chamber 133.

[0086] In one embodiment, the stationary shelf 135 may be positioned on a
lower portion of the internal volume 134 of the vacuum extension 133
while the central robot 109 is configured to transfer substrates to and
from the load lock chamber 130 through an upper portion of the internal
volume 134.

[0087] In one embodiment, the stationary shelf 135 may comprise supporting
fingers extending from posts positioned on opposite sides of the internal
volume 134.

[0088] It should be noted that the robot 109 may be suspended from a top
wall of the transfer chamber 108. Embodiments of the present invention
may include robots capable of vertical or z-motion.

[0089] Referring back to FIG. 3A, the mainframe 110 of the cluster tool
100 is supported by supporting legs 127. The supporting legs 127 provide
vertical and lateral support to the mainframe 110 and chambers connected
to the mainframe 110. Each of the supporting legs 127 is configured to
support at least a portion of the weight of the mainframe 110 including
the transfer chamber 108, the vacuum extension chamber 107, and
optionally the processing chambers connected thereon. Each of the
supporting legs 127 may be vertically adjustable so that the mainframe
110 and chambers connected thereon may be leveled on site. The supporting
legs 127 are coupled to sidewalls of the mainframe 110 and/or chambers
coupled to the mainframe 110 to provide lateral support to the cluster
tool 100.

[0090] In one embodiment, each of the supporting legs 127 may comprise a
foot 127b connected to a steel tube body 127a. The steel tube body 127a
is configured to be coupled to the mainframe 110. The foot 127b is
configured to contact the ground and adjustable relative to the steel
tube body 127a. Vertical dimension of the supporting leg 127 may be
adjusted by adjusting the foot 127b to provide tolerance in supporting
the cluster tool 100.

[0091] In one embodiment, the mainframe 110 may be supported by for
supporting legs 127 independently mounted on opposite sides of the
mainframe 110, as shown in FIG. 2, and FIGS. 3C-3D. Two of the supporting
legs 127 are independently fastened to sidewalls of the transfer chamber
108 and two of the supporting legs 127 are independently fastened to
sidewalls of the vacuum extension chamber 107. In another embodiment, two
of the supporting legs 127 may be positioned near the joint region of the
vacuum extension chamber 107 and the load lock chamber 104. In one
embodiment, notches may be formed on sidewalls of the mainframe 110 for
the supporting legs 127 to engage with.

[0092] Screws may be used to fasten each supporting leg 127 to a
corresponding location in the mainframe 110. FIG. 4E illustrates screw
holes 318, 319 formed in the chamber body 301 configured to secure
supporting legs in the notches 309.

[0093]FIG. 3c schematically illustrates a partial isometric bottom view
showing one embodiment of supporting legs of a cluster tool 100b similar
to the cluster tool 100 of FIG. 3A. As shown in FIG. 3c, the cluster tool
100b is supported by four independent supporting legs 1271-4. Each of the
supporting legs 1271-4 is independently mounted on the cluster tool 100.
FIG. 3c shows a central structure 160, which includes the transfer
chamber 108 and the vacuum extension chamber 107, and the load lock
chamber 104 coupled together. Additional components, such as processing
chambers, pass through chambers, and front end interface may be extended
from the central structure 160. The supporting legs 1271-4 are coupled to
the central structure 160 providing support to the cluster tool 100 in a
whole. A pair of notches 161 may be formed in the bottom walls near a
joint region of the load lock chamber 104 and the vacuum extension
chamber 107. The notches 161 are configured to provide lateral support to
the supporting leg 127 mounted therein. A pair of notches 162 may be
formed in the transfer chamber 108 and configured to engage supporting
legs 1273-4. The notches 162 also provide lateral support to the
supporting legs 127 mounted therein. The notches 161, 162 may be placed
in locations such that the supporting legs 1271-4 provide balanced
support to the cluster tool 100, including the central structure 160
and/or chambers connected to the central structure 160.

[0094]FIG. 3D schematically illustrates a partial isometric bottom view
showing another embodiment of supporting legs of the cluster tool 100 of
FIG. 3A. In this embodiment, the supporting legs 1271-4 may be mounted on
sidewalls of the load lock chamber 104, or the vacuum extension chamber
107.

[0095] The design of independent supporting legs has several advantages
over conventional cluster tool support, which generally includes a welded
base used to provide a ridged support. The conventional base is typically
in an integral form and is configured to provide support to multiple
components of a cluster tool. The conventional base is costly to build
providing high precision demanded by the semiconductor processing. The
conventional base is also difficult to assemble because it has to be
coupled to multiple components of a cluster tool. The conventional base
usually poses clearance issues for other components in a cluster tool
causing disconnection of utility during utility routing or removal of
chamber components from the base.

[0096] The independent leg supporting of the present invention largely
reduces cost over conventional base. Each supporting leg is manufactured
separately avoiding manufacture cost of a high precision structure. Each
supporting leg is generally coupled to one component, which makes
leveling and other adjustment much easier. The supporting leg is not
limited to any cluster tool configuration. When one or more components,
such as a load lock chamber, are altered, the supporting legs do not need
to be replaced. Furthermore, the supporting leg of the present invention
is much easier to transport.

[0097]FIG. 4A schematically illustrates an exploded sectional view of a
transfer chamber 300 in accordance with one embodiment of the present
invention. The transfer chamber 300 may be used as the transfer chamber
108 of FIG. 2, and FIGS. 3A-B. The transfer chamber 300 comprises a
chamber body 301 having a top wall 313, a plurality of sidewalls 314 and
a bottom wall 315. The chamber body 301 defines an inner volume 312
(shown in FIG. 4c) configured to accommodate a substrate transferring
means, such as a robot, therein. In one embodiment, a central robot may
be disposed in a robot port 304 formed on the bottom wall 315 of the
transfer chamber 300.

[0098] The transfer chamber 300 further comprises a chamber lid 302
configured to seal an opening 303 formed on the top wall 313 of the
chamber body 301. The opening 303 may be configured to assist
installation and/or maintenance of the substrate transferring means. In
one embodiment, the chamber lid 302 may be coupled to the chamber body
301 with a seal ring 317 and a plurality of screws 307. The chamber lid
302 may have a pair of handles 308.

[0099] In one embodiment, the chamber body 301 has a rectangular profile
and comprises four sidewalls 314. Each of the sidewalls 314 has an
opening 305 formed therein. The openings 305 are configured to provide
selective communication between the inner volume 312 and processing
chambers, load lock chambers, and/or vacuum extensions coupled to the
transfer chamber 300. A gland 306 may be formed around the opening 305
and configured to accommodate a seal ring (not shown) to maintain a
pressure barrier around the inner volume 312.

[0100]FIG. 4A schematically illustrates a processing chamber 390 mounted
to the transfer chamber 300 via a chamber port assembly 370 in accordance
with one embodiment of the present invention. The chamber port assembly
370 provides an interface between the transfer chamber 300 and the
processing chamber 390. In one embodiment, the chamber port assembly 370
provides a housing for a slit valve assembly 380 configured to open and
close a substrate opening 392 formed through a sidewall 391 of the
processing chamber 390. The substrate opening 392 is configured to
provide a passage to allow entry and egress of substrates from the
processing chamber 390. Additionally, the chamber port assembly 370
allows mismatch between the opening 305 of the transfer chamber 300 and
the substrate opening 392 of the processing chamber 390.

[0101] The chamber port assembly 370 comprises a body 371 having a
transfer chamber opening 372 open towards one side of the body 371. The
transfer chamber opening 372 is configured to cover the opening 305 of
the transfer chamber 300. The transfer chamber opening 372 is connected
to a chamber opening 373 which opens on an opposite side of the body 371
to define a substrate passage through the chamber port assembly 370. The
chamber opening 373 is configured to align with the substrate opening 392
of the processing chamber 390. A gland 377 may be formed on an outer side
of the substrate opening 392 to accommodate a seal ring (not shown) to
prevent leakage between the chamber port assembly 370 and the processing
chamber 390.

[0102] The slit valve assembly 380 generally comprises a slit valve door
382 activated by an activation member 381 configured to move the slit
valve door 382 between an opening position and a closed position. The
slit valve door 382 of the slit valve assembly 380 may be positioned on
an inner side of the chamber opening 373 and selectively connects and
disconnects the transfer chamber opening 372 and the chamber opening 373,
hence, selectively connecting the transfer chamber 300 and the processing
chamber 390.

[0103] In one embodiment, a plurality of screws 374 may be used to fasten
the chamber port assembly 370 to the transfer chamber 300. In one
embodiment, a seal ring 378 may be used in the gland 306 circumscribing
the opening 305 between the transfer chamber 300 and the chamber port
assembly 370 to fluidly isolate the inner region of the chamber port
assembly 370 and the transfer chamber 300 from an outside environment. A
plurality of screws 393 and a seal ring 394 may be used to mount the
processing chamber 390 to the chamber port assembly 370.

[0104] Additionally, the transfer chamber opening 372 may provide a pocket
of extra room that accommodates the tip of a robot positioned in the
transfer chamber 300 as the blade is rotated in a horizontal plane
(further described with FIG. 4B). The pocket of extra room in the chamber
port assembly 370 allows further reducing in size of the transfer chamber
300, hence reducing foot print of the system. In one embodiment, the
chamber port assembly 370 may comprise one or more sensors configured to
detect substrate and/or robot parts within the transfer chamber opening
372. FIG. 4A schematically shows optical sources 376 and optical
receivers 375 used as sensors to detect substrates and/or robot parts.

[0105] It should be noted that a load lock chamber may be coupled to one
of the sidewall 314 of the transfer chamber 300 directly or via a chamber
port assembly similarly to the chamber port assembly 370.

[0106] In one embodiment, two notches 309 may be formed near corners of
the bottom wall 315. Each of the notches 309 is configured to receive a
supporting leg 360 therein. Each of the supporting legs 306 is configured
to bear at least part of the weight of the transfer chamber 300 and
devices mounted thereto. The supporting leg 360 may be fastened against
the transfer chamber 300 by screws 361. The notch 309 provides two planes
for lateral support for the supporting leg 360.

[0107]FIG. 4B schematically illustrates a plan view of the transfer
chamber 300 of FIG. 4A. FIG. 4c schematically illustrates a sectional
side view of the transfer chamber 300 of FIG. 4A. Referring to FIG. 4c,
the chamber body 301 may be formed by cast aluminum and defining the
inner volume 312 configured to provide space for movement of a central
robot position therein. In one embodiment, the inner volume 312 may be
minimized to be just large enough to accommodate required movement of a
robot disposed therein.

[0108]FIG. 4E schematically illustrates an isometric sectional view of
the transfer chamber 300 of FIG. 4A with a central robot 316 in a
rotation mode. The central robot 316 comprises a top blade 329 and a
bottom blade 330, each configured to transfer a substrate 331
independently. The central robot 316 is capable of rotating about z axis,
translating along the z axis, and translating parallel to x-y plane.
Other suitable robots may be used in the transfer chamber 300. The
central robot 316 may be suspended from the top wall 313 of the transfer
chamber 300 as well with corresponding changes of other structures.

[0109] During processing, the central robot 316 may extend the top blade
329 or the bottom blade 330 through one of the openings 305 on the
sidewalls 314 of the transfer chamber 300 to retrieve a substrate in a
processing chamber/load lock chamber connected to the transfer chamber
300, or a shutter disk stored in a vacuum extension chamber connected to
the transfer chamber 300. The central robot 316 may need to translate
vertically, i.e. along z axis, so that the top blade 329 or the bottom
blade 330 is aligned with the target substrate or shutter disk. Upon
picking up the substrate/shutter disk, the central robot 316 retrieves
the top blade 329 or the bottom blade 330 back to the inner volume 312 of
the transfer chamber 300, and rotates the top blade 329 or the bottom
blade 330 within the inner volume 312 so that the top blade 329 or the
bottom blade 330 is align with an opening 305 connecting a target chamber
for the substrate/shutter disk. The central robot 316 then extends the
top blade 329 or the bottom blade 330 to access the target chamber and
drops the substrate/shutter disk therein.

[0110] It is desirable to minimize the inner volume 312 of the transfer
chamber 300 to reduce system foot print and to reduce volume of the
controlled environment. In one embodiment, the inner volume 312 of the
transfer chamber 300 is defined to match a motion envelop described by
circles 324 and 325, shown in FIGS. 4B and 4C, necessary for the central
robot 316 to perform required functions. The motion envelop of
cylindrical with a large center portion having a radius of the circle
325, and small upper and lower portions having a radius of the circle
324. The large center portion of the motion envelop is partially
accommodated by a large middle portion with a radius of 311 in the inner
volume 312 and extra room in the chamber port assembly 370 and the vacuum
extension chamber 350 connected to the transfer chamber 300.

[0111] In one embodiment, the motion envelop includes space needed for the
central robot 316 to perform rotation and required vertical movement
therein. The motion envelop has a substantially cylindrical shape with an
enlarged middle portion marked by circle 325 configured to allow tips of
the blades 329, 330 during rotation. Accordingly, the inner volume 312 is
substantially cylindrical with a radius marked by line 310 and an
enlarged middle portion having a radius marked by line 311. To further
reduce size of the transfer chamber 300, part of the enlarged middle
portion 325 may be outside the transfer chamber 300 and extends to a
vacuum extension chamber and/or chamber port assemblies 370 connected to
the transfer chamber 300, for example, to the transfer chamber opening
372 of the chamber port assembly 370.

[0112] In one embodiment, a radial clearance 327, shown in FIG. 4c,
between the inner volume 312 and the motion envelop may be about 0.25
inch and the vertical clearances 326, 328 may be about 0.338 inch.

[0113] In one embodiment, software constraints may be used in a control
system so that the central robot 316 stays within the motion envelop.

[0114]FIG. 4D schematically illustrates a bottom view of the transfer
chamber 300 of FIG. 4A. One or more heater ports 320 may be formed on the
bottom wall 315 and configured to connect to cartridge heaters for
heating the chamber body 301 during processing. A gage port 321 may be
formed in the bottom wall 315. The gage port 321 may be used to adapt
sensors, such as a pressure sensor, therein. An optional pressure
modification port 322, and vents 323 may also be formed on the bottom
wall 315 for connection to suitable pumping devices. The gage port 321,
the pressure modification port 322, and the vents 323 may be sealed off
when not needed.

[0115]FIG. 4F schematically illustrates an exemplary vacuum extension
chamber 350 configured to couple with one of the sidewalls 314 of the
transfer chamber 300. In one embodiment, the vacuum extension chamber 350
is configured to provide the transfer chamber 300 an extra space for
connection to a vacuum system to keep the inner volume 312 of the
transfer chamber 300 in a vacuum condition during processing while
minimizing the volume of the transfer chamber 300 and overall internal
volume of the mainframe. The vacuum extension chamber 350 may also
provide a pass way for a robot positioned in the transfer chamber 300 to
a factory interface via a load lock chamber or another transfer chamber
via a pass through chamber.

[0116] A pressure modification port 354 configured to adapt to a vacuum
pump, such as a cryogenic pump, may be formed on a bottom wall 355 of the
vacuum extension chamber 350. An opening 351 configured to connect the
transfer chamber 300 is formed in a sidewall 353 of the vacuum extension
chamber 350. The sidewall 353 of the vacuum extension chamber 350 is
secured against the sidewall 314 of the transfer chamber 300, for example
by a plurality of screws 352, when the vacuum extension chamber 350 is
mounted on the transfer chamber 300. The opening 351 is aligned with the
opening 305 to facilitate fluid communication and/or substrate traffic
between the transfer chamber 300 and the vacuum extension chamber 350. In
one embodiment, a seal ring 356 disposed in the gland 306 circumscribing
the opening 305 may be used to fluidly isolate the inner volume of the
vacuum extension chamber 350 and the transfer chamber 300 from an outside
environment.

[0117]FIG. 5A schematically illustrates a plan view a cluster tool 400
having a transfer chamber in accordance with one embodiment of the
present invention. The cluster tool 400 comprises a transfer chamber 401,
similar to the transfer chamber 300 of FIG. 4A. The transfer chamber 401
is connected to a vacuum extension chamber 408, which is further
connected to a load lock chamber 410 via a slit valve assembly 409. Three
processing chambers 406 are connected to the transfer chamber 401 via
chamber port assemblies 407, similar to the chamber port assembly 370 of
FIG. 4A. The transfer chamber 401 defines an inner volume 402 which may
be maintained in a vacuum condition during processing by a pump system
coupled to the vacuum extension chamber 408. The vacuum extension 401 may
be configured to store one or more shutter disks to be used by the
processing chambers 406.

[0118] A central robot 403 is disposed in the inner volume 402 of the
transfer chamber 401. The central robot 403 is configured to transfer
substrates and/or shutter disks among the processing chambers 406, the
vacuum extension chamber 408 and the load lock chamber 410. The central
robot 403 comprises a top arm 405 and a bottom arm 404, each having a
blade configured to carry a substrate or shutter disk 411 thereon. Shown
in FIG. 5A, both the top arm 405 and the bottom arm 404 are positioned in
the transfer chamber 401.

[0119]FIG. 5B schematically illustrates a plan view of the cluster tool
100 of FIG. 5A wherein the central robot 403 in the transfer chamber 401
rotates an angel from the central robot 403 shown in FIG. 5A. The central
robot 403 may rotate both arms 404, 405 together or independently within
the inner volume 402.

[0122]FIG. 5E schematically illustrates a plan view of the cluster tool
100 of FIG. 5A wherein the top arm 405 of the central robot 403 is
accessing the processing chamber 406 connected to the transfer chamber
401.

[0123]FIG. 6A schematically illustrates an exploded view of a vacuum
extension assembly 500 in accordance with one embodiment of the present
invention. The vacuum extension assembly 500 is configured to connect to
a transfer chamber, such as the transfer chamber 300 of FIG. 4A, and to
provide an interface between the transfer chamber and a load lock chamber
and a fluid communication between the transfer chamber and a vacuum
system.

[0124] The vacuum extension assembly 500 comprises a body 501 defining an
inner volume 512 (marked in FIG. 6B), a top plate 502 disposed on a top
wall 527 of the body 501, and a shelf cover 504 disposed on the top plate
502.

[0125] A pressure modification port 514 may be formed on a bottom wall 528
of the body 501. The pressure modification port 514 is configured to
connect a vacuum pump 508 to provide a low pressure environment to the
inner volume 512 and volumes in fluid communication with the inner volume
512. In one embodiment, an opening 513 may be formed on the top wall 527
of the body 501. The opening 513 may be used to access the inner volume
512 during installation and/or maintenance of the vacuum pump 508.

[0126] As shown in FIG. 6A, the top plate 502 is configured to cover the
opening 513 on the top wall 527. The top plate 502 may have a slit valve
opening 519 and a shelf opening 520 formed therein. The slit valve
opening 519 is configured for installation of a slit valve 506. The shelf
opening 520 is configured to allow a movable shelf 503 to be positioned
at a selected elevation within the inner volume 512.

[0127] In one embodiment, a chamber opening 510 may be formed on a
sidewall 529 which is configured to be coupled with a transfer chamber,
such as the transfer chamber 300 of FIG. 4A. The chamber opening 510 is
configured to provide fluid communication with the transfer chamber and
to provide passage for robot blades coupled to a robot disposed in the
transfer chamber, to transfer substrates, and/or shutter disks.
Therefore, width of the chamber opening 510 is generally slightly larger
than a diameter of the largest substrate configured to be processed in a
cluster tool. The height of the chamber opening 510 is determined by the
motion range of the robot blades.

[0128] In one embodiment, a load lock opening 511 may be formed on a
sidewall 530 opposite to the sidewall 529. The load lock opening 511 is
configured to provide selective communication between the inner volume
512 and one or more load lock chambers coupled to the side wall 529. In
one embodiment, one or more slit valves may be used to selectively seal
the load lock opening 511. As shown in FIG. 6A, a slit valve opening 515
is formed on the bottom wall 528 and is configured to allow a slit valve
507 to be disposed inside the inner volume 512 and to selectively seal
the load lock opening 511. In one embodiment, two slit valves 506, 507
may be used to provide selective fluid communication between the inner
volume 512 and two load lock chambers independently via the load lock
opening 511.

[0129] In one embodiment, the shelf cover 504 is disposed above the top
plate 502 sealing the shelf opening 520. The shelf cover 504 provides
space in connection with the inner volume 512 to store a movable shelf
503 therein. The movable shelf 503 is configured to support one or more
shutter disks thereon. The shutter disks may be used by processing
chambers connected to the transfer chamber that connects to the vacuum
extension assembly 500. In one embodiment, the movable shelf 503 may
comprise two opposing posts 521, each having one or more supporting
fingers 522 extending therefrom. The supporting fingers 522 are
configured to support a shutter disk from the edge.

[0130] In one embodiment, the movable shelf 503 may be connected to an
indexer 505. The indexer 505 may be disposed above the shelf cover 504. A
shaft 532 extends from the indexer 505 through an aperture 557 in the
shelf cover 504 and connects to the movable shelf 503. The shaft 532
moves vertically providing vertical movement to the movable shelf 503, so
that the elevation of the movable shelf 503 may be selected.

[0131] In one embodiment, notches 533 may be formed on the bottom wall 528
and configured to accept independent supporting legs 509 therein. In one
embodiment, windows 516, 517 may be formed on sidewalls 531, 534 of the
body 501 and utilized for observing the interior of the vacuum extension
assembly 500. Transparent materials, such as quartz, may be used to seal
the windows 516, 517.

[0133] As shown in FIG. 6B, the movable shelf 503 is retracted to an upper
portion of the inner volume 512, thus providing a clear passage for the
robot blades 552, 553 extend past the movable shelf 503 to the load lock
chambers 555, 556.

[0134]FIG. 6c schematically illustrates a sectional side view of the
vacuum extension assembly 500 with the movable shelf 503 lowered to a
down position. The movable shelf 503 is positioned by the indexer 505 in
a lower portion of the inner volume 512 such that shutter disks 523 may
be picked up from and dropped onto the supporting fingers 522 by the
robot blades 552, 553. The hand-off between the robot blades 552, 553 and
the movable shelf 503 may be facilitated by at least one of moving the
movable shelf 503 or the robot blades 552, 553 vertically.

[0135] The body 501, top plate 502, shelf cover 504, and movable shelf 503
may be made from any suitable material. In one embodiment, the body 501,
top plate 502, shelf cover 504, and movable shelf 503 are made of cast
aluminum.

[0136] It should be noted that position of indexer 505 may be positioned
in a bottom of the vacuum extension assembly 500 while the vacuum pump
508 are mounted on top.

[0137]FIG. 7A schematically illustrates an isometric view of the movable
shelf 503 in accordance with one embodiment of the present invention. The
movable shelf 503 comprises a bottom disk 580 and two posts 521 extended
from the bottom disk 580. The two posts 521 may be positioned on opposite
sides of the bottom disk 580. One or more supporting fingers 522 extend
from each of the posts 521. Each pair of supporting fingers 522 extending
from opposite posts 521 is configured to support a disk near an edge of
the disk. In one embodiment, vertical distance between neighboring
support fingers 522 may be arranged so that a robot blade may pick up or
drop off shutter disks from/to each pair of support fingers 522. A bridge
581 may be formed between the posts 521. The bridge 581 may be configured
to couple with an indexer so that the movable shelf 503 may be
translated.

[0138]FIG. 7B schematically illustrates a supporting finger 522a in
accordance with one embodiment of the present invention. The supporting
finger 522a is configured to directly support a shutter disk near the
edge.

[0139]FIG. 7C schematically illustrates a supporting finger 522b in
accordance with one embodiment of the present invention. The supporting
finger 522 has two contact posts 585 disposed on a top surface. The
contact posts 585 are configured to contact a shutter disk and provide
point support to reduce particle contamination. In one embodiment, the
contact posts 585, including a substrate supporting roller, may be made
from non-metallic material, such as silicon nitride (SiN).

[0140]FIG. 8A schematically illustrates an isometric sectional view of a
vacuum extension assembly 600 having a stationary shelf in accordance
with one embodiment of the present invention. The vacuum extension
assembly 600 is configured to connect to a transfer chamber, such as the
transfer chamber 300 of FIG. 4A, and to provide an interface between the
transfer chamber and a load lock chamber and to provide fluid
communication between the transfer chamber and a vacuum system.

[0141] The vacuum extension assembly 600 comprises a body 601 and a top
plate 602 defining an inner volume 617 (marked in FIG. 8B). A pressure
modification port 607 may be formed on a bottom wall 606 of the body 601.
The pressure modification port 607 is configured to connect a vacuum
system 612 to provide a low pressure environment to the inner volume 617
and volumes in fluid communication with the inner volume 617. In one
embodiment, a sensor 613 may be disposed on the vacuum system 612 outside
the body 601 and configured to monitor status of the vacuum system 612.
In one embodiment, an opening 614 may be formed on a top wall of the body
601. The opening 614 may be used to access the inner volume 617 during
installation and/or maintenance of the vacuum system 612. The top plate
602 is used to seal the opening 614.

[0142] In one embodiment, a chamber opening 603 may be formed on a
sidewall 615 of the vacuum extension assembly 600 which is configured to
be coupled with a transfer chamber, such as the transfer chamber 300 of
FIG. 4A. The chamber opening 603 is configured to provide fluid
communication with the transfer chamber and to provide passage for robot
blades, typically disposed on a robot in the transfer chamber, to
transfer substrates, and/or shutter disks. Therefore, width of the
chamber opening 603 is generally slightly larger than a diameter of the
largest substrate configured to be processed in a cluster tool. The
height of the chamber opening 603 is selected to allow an appropriate
range for robotic suitable for exchanging substrate and/or shutter disks
between the shelf and the robot blades.

[0143] In one embodiment, a load lock opening 604 may be formed on a
sidewall 605 opposite to the sidewall 615. The load lock opening 604 is
configured to provide selective communication between the inner volume
617 and one or more load lock chambers coupled to the side wall 605. A
slit valve opening 608 is formed through the bottom wall 606 and is
configured to allow a slit valve 609 to be disposed inside the inner
volume 617. The slit valve 609 selectively seals the load lock opening
604.

[0144] In one embodiment, a shutter disk shelf 616 is disposed within the
inner volume 617 of the vacuum extension assembly 600. The shutter disk
shelf 616 is configured to support one or more shutter disks thereon. The
shutter disks may be used by processing chambers connected to the vacuum
extension assembly 600 via the transfer chamber. The shutter disk shelf
616 is positioned in a portion of the inner volume 617 so that the
passage between the chamber opening 603 and the load lock opening 604 is
maintained to allow the robot clear access through the vacuum extension
assembly 600. In one embodiment, as shown in FIG. 8B, the shutter disk
shelf 616 is positioned in a lower portion of the inner volume 617, while
the load lock opening 604 corresponding to an upper portion of the inner
volume 617. The height of the chamber opening 603 is large enough to
accommodate sufficient vertical motion of the robot blades to allow
access to both the load lock opening 603 and the shutter disk shelf 616.

[0145] In one embodiment, the shutter disk shelf 616 may comprise two
opposing posts 618, each having one or more supporting fingers 619
extending therefrom. The supporting fingers 619 are configured to support
a shutter disk near a periphery. Embodiments of the supporting fingers
619 may be similar to those shown in FIGS. 7B-C. In one embodiment, the
fingers 619 may include a roller contact for supporting the shutter disk
thereon.

[0146] In one embodiment, a window 611 may be formed through a sidewall
620 of the body 601 to allow the interior of the vacuum extension
assembly 600 to be viewed. Transparent materials, such as quartz, may be
used to seal the window 611.

[0147] The body 601, top plate 602, and shutter disk shelf 616 may be made
from any suitable material. In one embodiment, the body 601, top plate
602, and shutter disk shelf 616 are made of cast aluminum.

[0148]FIG. 8B schematically illustrates a sectional side view of a
mainframe having the vacuum extension assembly 600 of FIG. 8A. A transfer
chamber 650 is connected to the vacuum extension assembly 600. An inner
volume 654 of the transfer chamber 650 is in fluid communication with the
inner volume 617 of the vacuum extension assembly 600 via the chamber
opening 603 of the vacuum extension assembly 600 and an opening 655 of
the transfer chamber 650. A load lock chamber 660 is connected to the
vacuum extension assembly 600 on a side opposing the transfer chamber
650. The load lock chamber 660 may comprise a substrate support 661
configured to support one or more substrates. The load lock chamber 660
is selectively connected to the inner volume 617 via a slit valve door
610. A central robot 651 is disposed in the inner volume 654 of the
transfer chamber 650. The central robot 651 comprises two robot blades
652, 653. The central robot 651 is configured with arrange of motion to
allow the robot blades 652,653 to access the load lock chamber 660 via an
upper portion of the inner volume 617 of the vacuum extension assembly
600, and to the shutter disk shelf 616 disposed in the lower portion of
the inner volume 617 of the vacuum extension assembly 600.

[0149] As shown in FIG. 8B, the robot blades 652, 653 may be actuated over
the shelf 616 on the way to the load lock chamber 660 to pick up
substrates 622. The slit valve door 610 is moved to an open position to
allow the robot blades 652, 653 to enter the load lock chamber 660.

[0150]FIG. 8c schematically illustrates a sectional side view of the
mainframe of FIG. 8B showing the central robot 651 positioning the robot
blades 652, 653 in a lowered position to access the shutter disks 621
disposed in the shutter disk shelf 616 within the vacuum extension
assembly 600.

[0151]FIG. 9 schematically illustrates a plan view of a cluster tool 200
in accordance with one embodiment of the present invention. FIG. 10
schematically illustrates a sectional side view of the cluster tool 200
of FIG. 9. The cluster tool 200 comprises multiple processing chambers
coupled a mainframe comprising two transfer chambers.

[0152] The cluster tool 200 comprises a front-end environment 202 in
selective communication with a load lock chamber 204. One or more pods
201 are coupled to the front-end environment 202. The one or more pods
201 are configured to store substrates. A factory interface robot 203 is
disposed in the front-end environment 202. The factory interface robot
203 is configured to transfer substrates between the pods 201 and the
load lock chamber 204.

[0153] The load lock chamber 204 provides a vacuum interface between the
front-end environment 202 and a first transfer chamber assembly 210. An
internal region of the first transfer chamber assembly 210 is typically
maintained at a vacuum condition and provides an intermediate region in
which to shuttle substrates from one chamber to another and/or to a load
lock chamber.

[0154] In one embodiment, the first transfer chamber assembly 210 is
divided into two parts. In one embodiment of the present invention, the
first transfer chamber assembly 210 comprises a transfer chamber 208 and
a vacuum extension chamber 207. The transfer chamber 208 and the vacuum
extension chamber 207 are coupled together and in fluid communication
with one another. An inner volume of the first transfer chamber assembly
210 is typically maintained a low pressure or vacuum condition during
process. The load lock chamber 204 may be connected to the front-end
environment 202 and the vacuum extension chamber 207 via slit valves 205
and 206 respectively.

[0155] In one embodiment, the transfer chamber 208 may be a polygonal
structure having a plurality of sidewalls, a bottom and a lid. The
plurality sidewalls may have opening formed therethrough and are
configured to connect with processing chambers, vacuum extension and/or
pass through chambers. The transfer chamber 208 shown in FIG. 9 has a
square or rectangular shape and is coupled to processing chambers 211,
213, a pass through chamber 231 and the vacuum extension chamber 207. The
transfer chamber 208 may be in selective communication with the
processing chambers 211, 213, and the pass through chamber 231 via slit
valves 216, 218, and 217 respectively.

[0156] In one embodiment, a central robot 209 may be mounted in the
transfer chamber 208 at a robot port formed on the bottom of the transfer
chamber 208. The central robot 209 is disposed in an internal volume 220
of the transfer chamber 208 and is configured to shuttle substrates 214
among the processing chambers 211, 213, the pass through chamber 231, and
the load lock chamber 204. In one embodiment, the central robot 209 may
include two blades for holding substrates, each blade mounted on an
independently controllable robot arm mounted on the same robot base. In
another embodiment, the central robot 209 may have the capacity for
vertically moving the blades.

[0157] The vacuum extension chamber 207 is configured to provide an
interface to a vacuum system to the first transfer chamber assembly 210.
In one embodiment, the vacuum extension chamber 207 comprises a bottom, a
lid and sidewalls. A pressure modification port may be formed on the
bottom of the vacuum extension chamber 207 and is configured to adapt to
a vacuuming pump system. Openings are formed on the sidewalls so that the
vacuum extension chamber 207 is in fluid communication with the transfer
chamber 208, and in selective communication with the load lock chamber
204.

[0158] In one embodiment, the cluster tool 200 may be configured to
deposit a film on semiconductor substrates using physical vapor
deposition (PVD) process. During conditioning operations, a dummy
substrate or a shutter disk is disposed on the pedestal to protect the
substrate support from any deposition.

[0159] In one embodiment of the present invention, the vacuum extension
chamber 207 comprises a shutter disk shelf 222, shown in FIG. 10,
configured to store one or more shutter disks 223. Processing chambers
directly or indirectly connected to the transfer chamber 208 may store
their shutter disks in the shutter disk shelf 222 and use the central
robot 209 to transfer the shuttle disks.

[0160] The cluster tool 200 further comprises a second transfer chamber
assembly 230 connected to the first transfer chamber assembly 210 by the
pass through chamber 231. In one embodiment, the pass through chamber
231, similar to a load lock chamber, is configured to provide an
interface between two processing environments. In this case, the pass
through chamber 231 provides a vacuum interface between the first
transfer chamber assembly 210 and the second transfer chamber assembly
230.

[0161] In one embodiment, the second transfer chamber assembly 230 is
divided into two parts to minimize the footprint of the cluster tool 200.
In one embodiment of the present invention, the second transfer chamber
assembly 230 comprises a transfer chamber 233 and a vacuum extension
chamber 232 in fluid communication with one another. An inner volume of
the second transfer chamber assembly 230 is typically maintained a low
pressure or vacuum condition during process. The pass through chamber 231
may be connected to the transfer chamber 208 and the vacuum extension
chamber 232 via slit valves 217 and 238 respectively so that the pressure
within the transfer chamber 208 may be maintained at different vacuum
levels.

[0162] In one embodiment, the transfer chamber 233 may be a polygonal
structure having a plurality of sidewalls, a bottom and a lid. The
plurality sidewalls may have opening formed therein and are configured to
connect with processing chambers, vacuum extension and/or pass through
chambers. The transfer chamber 233 shown in FIG. 9 has a square or
rectangular shape and is coupled to processing chambers 235, 236, 237,
and the vacuum extension chamber 232. The transfer chamber 233 may be in
selective communication with the processing chambers 235, 236, via slit
valves 241, 240, 239 respectively.

[0163] A central robot 234 is mounted in the transfer chamber 233 at a
robot port formed on the bottom of the transfer chamber 233. The central
robot 234 is disposed in an internal volume 249 of the transfer chamber
233 and is configured to shuttle substrates 214 among the processing
chambers 235, 236, 237, and the pass through chamber 231. In one
embodiment, the central robot 234 may include two blades for holding
substrates, each blade mounted on an independently controllable robot arm
mounted on the same robot base. In another embodiment, the central robot
234 may have the capacity for moving the blades vertically.

[0164] In one embodiment, the vacuum extension chamber 232 is configured
to provide an interface between a vacuum system and the second transfer
chamber assembly 230. In one embodiment, the vacuum extension chamber 232
comprises a bottom, a lid and sidewalls. A pressure modification port may
be formed on the bottom of the vacuum extension chamber 232 and is
configured to adapt to a vacuum system. Openings are formed through the
sidewalls so that the vacuum extension chamber 232 is in fluid
communication with the transfer chamber 233, and in selective
communication with the pass through chamber 231.

[0165] In one embodiment of the present invention, the vacuum extension
chamber 232 includes a shutter disk shelf 243, shown in FIG. 10,
configured to store one or more shutter disks 223. Processing chambers
directly or indirectly connected to the transfer chamber 233 may store
their shutter disks in the shutter disk shelf 243 and use the central
robot 234 to transfer the shuttle disks.

[0166] In one embodiment, the cluster tool 200 may be configured to
perform a PVD process. The processing chamber 211 may be a pre-clean
chamber configured to perform a cleaning process prior to a PVD process.
The processing chambers 235, 236, 237 may be PVD chambers configured to
deposition a thin film on a substrate using physical vapor deposition.
The processing chamber 213 may be a de-gas chamber configured to degas
and clean a substrate after a deposition process in a PVD chamber.

[0167] In one embodiment, the transfer chambers 208, 233 may have a
similar design as shown in FIGS. 4A-4F. The transfer chambers 208, 233
are configured to minimize foot print of the cluster tool 200 and are
connected to a vacuum system through separated vacuum extensions.

[0168] The vacuum extension chambers 207, 232 may have similar designs of
the vacuum extension assemblies 500 and 600 shown in FIGS. 6A-6C and
FIGS. 8A-8C.

[0169] As shown in FIG. 10, the load lock chamber 204 comprises an upper
load lock chamber 204a stacked over a lower load lock chamber 204b. The
upper load lock chamber 204a and the lower load lock chamber 204b may be
operated independently so that substrate transferring between the
front-end environment 202 and the first transfer chamber assembly 210 can
be conducted in both directions simultaneously.

[0170] The load lock chambers 204a, 204b provide a first vacuum interface
between the front-end environment 202 and the first transfer chamber
assembly 210. In one embodiment, two load lock chambers 204a, 204b are
provided to increase throughput by alternatively communicating with the
first transfer chamber assembly 210 and the front-end environment 202.
While one load lock chamber 204a or 204b communicates with the first
transfer chamber assembly 210, a second load lock chamber 204b or 204a
can communicate with the front-end environment 202.

[0171] In one embodiment, the load lock chambers 204a, 204b are a batch
type load lock chamber that can receive two or more substrates from the
factory interface, retain the substrates while the chamber is sealed and
then evacuated to a low enough vacuum level to transfer of the substrates
to the first transfer chamber assembly 210.

[0172] The internal volume of the first transfer chamber assembly 210 is
defined by an internal volume 219 of the vacuum extension chamber 207
connected to an internal volume 220 of the transfer chamber 208. An
opening 228 is formed between the transfer chamber 208 and the vacuum
extension chamber 207. The opening 228 provides fluid communication
between the vacuum extension chamber 207 and the transfer chamber 208,
and are large enough to allow the central robot 209 to shuttle substrates
to and from the load lock chamber 204.

[0173] A vacuum system 225 is coupled the vacuum extension chamber 207 and
configured to provide a low pressure environment to both the internal
volume 219 and the internal volume 220. A robotic mechanism 226 is
coupled to the transfer chamber 208. The transfer chamber 208 and the
vacuum extension chamber 207 are constructed to minimize the foot print
of the cluster tool 200.

[0174] In the one hand, the duel load lock chamber improves system
throughput by allowing simultaneous two way substrate transportation. In
the other hand, stacked load lock chambers require more vertical access
space. To allow the robot, such as the central robot 209, to access the
stacked load lock chambers 204a, 204b and the shutter disk shelf 222, the
shutter disk shelf 222 in the vacuum extension chamber 207 is made
vertically movable. An indexer 224 is coupled to the shutter disk shelf
222 and is configured to vertically move the shutter disk shelf 222 into
a position that allows unobstructed movement of the robot through the
vacuum extension chamber 207. The shutter disk shelf 222 may be lowered
to the lower portion of the internal volume 219 by the indexer 224 so
that the central robot 209 interface with the shutter disk shelf 222 to
pick up a shutter disk or drop a shutter disk to the shutter disk shelf
222.

[0175] As shown in FIG. 10, the pass through chamber 231 provides an
interface between the first transfer chamber assembly 210 and the second
transfer chamber assembly 230 allowing the first and second transfer
chamber assemblies 210, 230 to have different levels of vacuum. In one
embodiment, the pass through chamber 231 may comprise a temperature
controlled substrate supports 246, 247 to prepare substrates for a
subsequent processing step. In one embodiment, the substrate support 246
may be heated while the substrate support 247 may be cooled.

[0176] The internal volume of the second transfer chamber assembly 230 is
defined by an internal volume 248 of the vacuum extension chamber 232
connected to an internal volume 249 of the transfer chamber 233. An
opening 244 is formed between the transfer chamber 233 and the vacuum
extension chamber 232. The opening 244 provides fluid communication
between the vacuum extension chamber 232 and the transfer chamber 233,
and are large enough to allow the central robot 234 to shuttle substrates
to and from the pass through chamber 231.

[0177] A vacuum system 242 is coupled the vacuum extension and configured
to provide a low pressure environment to both the internal volume 248 and
the internal volume 249. A robotic mechanism 245 is coupled to the
transfer chamber 233. The transfer chamber 233 and the vacuum extension
chamber 232 are constructed to minimize the foot print of the cluster
tool 200. In embodiment wherein the transfer chambers remain at the same
vacuum level, only one of the vacuum systems may optionally be utilized.

[0178] As shown in FIG. 10, the shutter disk shelf 243 of the vacuum
extension chamber 232 is stationary. The shutter disk shelf 243 is
positioned on a lower portion of the internal volume 248 of the vacuum
extension chamber 232 while the central robot 234 is configured to
transfer substrates to and from the pass through chamber 231 through an
upper portion of the internal volume 248.

[0179] It should be noted that any processing chambers connected to a
transfer chamber may be replaced by a pass through and/or extension
chamber so that another transfer chamber may be added to a cluster tool.

[0180] As shown in FIG. 10, the cluster tool 200 is supported by
supporting legs 227. The supporting legs 227 provide vertical and lateral
support to the mainframe and chambers of the cluster tool 200. Each of
the supporting legs 227 may be vertically adjustable on site. The
supporting legs 227 are coupled to sidewalls of the transfer chambers
208, 233, the vacuum extension chambers 207, 232, and/or the load lock
chamber 204 and the pass through chamber 231 for lateral support to the
cluster tool 200.

[0181] In one embodiment, four pairs supporting legs 227 may be used to
support the cluster tool 200. One pair of supporting legs 227 are coupled
to a backend (away from the front-end environment 202) of each of the
transfer chambers 208, 233. Notches may be formed on the backend of the
transfer chamber 208, 233 for providing lateral support to the supporting
legs 227. A pair of supporting legs 227 is coupled to near a joint region
of the load lock chamber 204 and the vacuum extension chamber 207.
Another pair of supporting legs 227 is coupled to near a joint region of
the pass through chamber 231 and the vacuum extension chamber 232.

[0182] Independent supporting legs of the present invention not only
greatly reduces the cost compared a supporting frame, but also provide
great flexibility to the system. If desired, the cluster tool of the
present invention may also be transported with the independent supporting
legs assembled.

[0183]FIG. 11A schematically illustrates an isometric view of the cluster
tool 200 of FIG. 9 with transporting braces 260 configured to engage the
supporting legs 227 with transporting tools, such as a fork lift, for
transporting the cluster tool 200 in a whole or partially assembled. One
or more transporting braces 260 may be coupled to a cluster tool 200 for
transporting the cluster tool 200 fully or partially assembled. In one
embodiment, each of the transporting braces 206 is coupled to a pair of
the independent supporting legs 127.

[0184]FIG. 11B schematically illustrates the transporting brace 260 in
accordance with one embodiment of the present invention. The transporting
brace 260 has a elongated body 261 formed from a ridged material, such as
steel, and aluminum. The body 261 may be a tube, for reduced weight, with
a rectangular or squared shape. Two lifting openings 262 may be formed
near two ends of the body 261. The lifting opening 262 is configured to
provide interface to a lifting tool, such as a fork lift. Distance
between the two lifting openings 262 on the transporting brace 260 may be
configured to adapt a lifting tool, for example, to adapt a distance
between the forks of a fork lift. In one embodiment, an independent
supporting leg 227 may be bolted to the transporting brace 260 through
one or more coupling holes 263 formed on the body 261. The coupling holes
263 may be elongated to provide tolerance on distance variations between
a pair of independent supporting legs 227.

[0185] Referring back to FIG. 11A, one or more transporting braces 260 may
be coupled to the independent supporting legs 227 of the cluster tool 200
at substantially similar elevation with the lifting openings 262
substantially aligned. A lifting tool may thread thought the lifting
openings 262 of two or more transporting braces 260 to lift and transport
the cluster tool 200.

[0186] The transporting braces of the present invention provide an
interface and robust structure to supporting assembly, such as the
independent supporting legs, during transportation. The transport braces
may be easily coupled to and removed from the cluster tool for
transportation and processing. The transport braces allow the cluster
tool to have a simple, non obstructive supporting assembly using
independent supporting legs, as well as a reinforced structure for
transportation if needed.

[0187] Even though, a PVD process is describe in accordance with the
present application, the cluster tools of the present invention may be
used for any suitable processes.

[0188] While the foregoing is directed to embodiments of the present
invention, other and further embodiments of the invention may be devised
without departing from the basic scope thereof, and the scope thereof is
determined by the claims that follow.

Patent applications by Jason Schaller, Austin, TX US

Patent applications by Applied Materials, Inc.

Patent applications in class WITH VACUUM OR FLUID PRESSURE CHAMBER

Patent applications in all subclasses WITH VACUUM OR FLUID PRESSURE CHAMBER