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Summary

Progressive in content and form, this practical book successfully bridges the gap between the circuit perspective and system perspective of digital integrated circuit design.Digital Integrated Circuitsmaintains a consistent, logical flow of subject matter throughout.Addresses today's most significant and compelling industry topics, including: the impact of interconnect, design for low power, issues in timing and clocking, design methodologies, and the tremendous effect of design automation on the digital design perspective.For readers interested in digital circuit design.

Table of Contents

Preface

vii

Part 1 The Fabrics

1

(66)

Introduction

3

(32)

A Historical Perspective

4

(2)

Issues in Digital Integrated Circuit Design

6

(9)

Quality Metrics of a Digital Design

15

(16)

Cost of an Integrated Circuit

16

(2)

Functionality and Robustness

18

(9)

Performance

27

(3)

Power and Energy Consumption

30

(1)

Summary

31

(1)

To Probe Further

31

(4)

Reference Books

32

(1)

References

33

(2)

The Manufacturing Process

35

(32)

Introduction

36

(1)

Manufacturing CMOS Integrated Circuits

36

(11)

The Silicon Wafer

37

(1)

Photolithography

37

(4)

Some Recurring Process Steps

41

(1)

Simplified CMOS Process Flow

42

(5)

Design Rules---The Contract between Designer and Process Engineer

47

(4)

Packaging Integrated Circuits

51

(10)

Package Materials

52

(1)

Interconnect Levels

53

(6)

Thermal Considerations in Packaging

59

(2)

Perspective---Trends in Process Technology

61

(3)

Short-Term Developments

61

(2)

In the Longer Term

63

(1)

Summary

64

(1)

To Probe Further

64

(3)

References

64

(3)

Design Methodology Insert A IC LAYOUT

67

(64)

To Probe Further

71

(2)

References

71

(2)

The Devices

73

(58)

Introduction

74

(1)

The Diode

74

(13)

A First Glance at the Diode---The Depletion Region

75

(2)

Static Behavior

77

(3)

Dynamic, or Transient, Behavior

80

(4)

The Actual Diode---Secondary Effects

84

(1)

The SPICE Diode Model

85

(2)

The MOS(FET) Transistor

87

(33)

A First Glance at the Device

87

(1)

The MOS Transistor under Static Conditions

88

(26)

The Actual MOS Transistor---Some Secondary Effects

114

(3)

SPICE Models for the MOS Transistor

117

(3)

A Word on Process Variations

120

(2)

Perspective---Technology Scaling

122

(6)

Summary

128

(1)

To Probe Further

129

(2)

References

130

(1)

Design Methodology Insert B Circuit Simulation

131

(46)

References

134

(1)

The Wire

135

(42)

Introduction

136

(1)

A First Glance

136

(2)

Interconnect Parameters---Capacitance, Resistance, and Inductance

138

(12)

Capacitance

138

(6)

Resistance

144

(4)

Inductance

148

(2)

Electrical Wire Models

150

(20)

The Ideal Wire

151

(1)

The Lumped Model

151

(1)

The Lumped RC Model

152

(4)

The Distributed rc Line

156

(3)

The Transmission Line

159

(11)

SPICE Wire Models

170

(4)

Distributed rc Lines in SPICE

170

(1)

Transmission Line Models in SPICE

170

(1)

Perspective: A Look into the Future

171

(3)

Summary

174

(1)

To Probe Further

174

(3)

References

174

(3)

Part 2 A Circuit Perspective

177

(132)

The CMOS Inverter

179

(56)

Introduction

180

(1)

The Static CMOS Inverter---An Intuitive Perspective

180

(4)

Evaluating the Robustness of the CMOS Inverter: The Static Behavior

184

(9)

Switching Threshold

185

(3)

Noise Margins

188

(3)

Robustness Revisited

191

(2)

Performance of CMOS Inverter: The Dynamic Behavior

193

(20)

Computing the Capacitances

194

(5)

Propagation Delay: First-Order Analysis

199

(4)

Propagation Delay from a Design Perspective

203

(10)

Power, Energy, and Energy Delay

213

(16)

Dynamic Power Consumption

214

(9)

Static Consumption

223

(2)

Putting It All Together

225

(2)

Analyzing Power Consumption Using SPICE

227

(2)

Perspective: Technology Scaling and its Impact on the Inverter Metrics

Excerpts

What is New?Welcome to second edition of "Digital Integrated Circuits: A Design Perspective." In the six years since the publication of the first, the field of digital integrated circuits has gone through some dramatic evolutions and changes. IC manufacturing technology has continued to scale to ever-smaller dimensions. Minimum feature sizes have scaled by a factor of almost ten since the writing of the first edition, and now are approaching the 100 nm realm. This scaling has a double impact on the design of digital integrated circuit. First of all, the complexity of the designs that can be put on a single die has increased dramatically. Dealing with the challenges this poses has led to new design methodologies and implementation strategies. At the same time, the plunge into the deep-submicron space causes devices to behave differently, and brings to the forefront a number of new issues that impact the reliability, cost, performance, and power dissipation of the digital IC. Addressing these issues in-depth is what differentiates this edition from the first.A glance through the table of contents reveals extended coverage of issues such as deep-sub micron devices, circuit optimization, interconnect modeling and optimization, signal integrity, clocking and timing, and power dissipation. All these topics are illustrated with state-of-the-art design examples. Also, since MOS now represents more than 99% of the digital IC market, older technologies such as silicon bipolar and GaAs have been deleted (however, the interested reader can find the old chapters on these technologies on the web site of the book). Given the importance of methodology in today's design process, we have includedDesign Methodology Insertsthroughout the text, each of which highlights one particular aspect of the design process. This new edition represents a major reworking of the book. The biggest change is the addition of two co-authors, Anantha and Bora, who have brought a broader insight into digital IC design and its latest trends and challenges. Maintaining the Spirit of the First EditionWhile introducing these changes, our intent has been to preserve the spirit and goals of the first edition--that is, to bridge the gap between thecircuit and system visionson digital design. While starting from a solid understanding of the operation of electronic devices and an in-depth analysis of the nucleus of digital design--the inverter--we gradually channel this knowledge into the design of more complex modules such as gates, registers, controllers, adders, multipliers, and memories. We identify the compelling questions facing the designers of today's complex circuits: What are the dominant design parameters, what section of the design should he focus on and what details could she ignore? Simplification is clearly the only approach to address the increasing complexity of the digital systems. However, oversimplification can lead to circuit failure since global circuit effects such as timing, interconnect, and power consumption are ignored. To avoid this pitfall it is important to design digital circuits with both a circuits and a systems perspective in mind. This is the approach taken in this book, which brings the reader the knowledge and expertise needed to deal with complexity, using both analytical and experimental techniques. How to Use This BookThe core of the text is intended for use in asenior-level digital circuit design class.Around this kernel, we have included chapters and sections covering the more advanced topics. In the course of developing this book, it quickly became obvious that it is difficult to define a subset of the digital circuit design domain that covers everyone's needs. On the one hand, a newcomer to the field needs detailed coverage of the basic concepts. On the other hand, feedback from early readers and reviewers indicated that an in-depth