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Method for an underfill fillet crack-blocking plane

Publishing Venue

Abstract

Disclosed is a method for an underfill fillet crack-blocking plane. Benefits include improved reliability.

Country

United States

Language

English (United States)

This text was extracted from a Microsoft Word document.

At least one non-text object (such as an image or picture) has been suppressed.

This is the abbreviated version, containing approximately
73% of the total text.

Method for an underfill fillet crack-blocking plane

Disclosed is a method for
an underfill fillet crack-blocking plane. Benefits include improved
reliability.

Background

Fillet
cracks are seen at the die corners (see Figure 1). The fillet cracks grow into
the package substrate surface and cause breaks in the Cu lines (package
traces).

Package
substrate open-trace failures due to underfill fillet cracks at die corners
continue to be a major failure mechanism in flip-chip packages. The failure
rate for this mechanism increases as the die size increases and is considered
to be a major issue for large die applications. No conventional solution
exists. Underfill process optimization and the use of alternate underfill
materials are options being evaluated. The problem is expected to worsen with
large-die applications.

Description

The disclosed method is a design with
copper planes placed at the four die corners to stop the underfill fillet
cracks from penetrating into the package substrate and breaking active metal
lines.

The copper planes are placed at the
die corners where fillet cracks are seen. The size and shape of the copper
planes are determined by the locus of fillet cracks seen during reliability
stressing of a variety of die sizes and package geometries. A triangular
blocking plane on the top layer of the package substrate at the die corner is
one disclosed design (see Figure 2). Triangular blocking planes are places at the die corners to prevent
fillet cracks from penet...