What innovations does EEE Components involve?

Research is currently being carried out on preparing the new generation of commercially available deep sub-micron processes for space applications.

These enabling technologies for future missions will facilitate the development of new types of highly integrated and high performance microcircuits needed to build the next generation of on-board systems and payloads with unprecedented functionality and efficiency.

Micro electronic mechanical systems (MEMS) are another area of interest as a means of decreasing the size and cost of spacecraft subsystems and in the process potentially shrinking down satellites themselves.

Innovation also requires continuous adaptation and improvement of applicable standards to cover new technologies and related products. This is achieved within the context of the European Space Components Coordination (ESCC) system, founded on a partnership between industry, national space agencies and ESA. ESCC has the objective of harmonising efforts concerning standardisation, streamlining procurement and product assurance practices and securing supply chains with the aim of increasing the overall percentage of European-made EEE parts.