Insulated Metal Substrate (IMS), based on RA thick Cooper and clad with ED copper foil in the other side. It is designed for a High Thermal dissipation circuitry. With a proprietary formulated reinforced-polymer-ceramic bonding layer with a high thermal conductivity, dielectric strength, and thermal endurance is guaranteed.
The material is supplied with a protective film on the thick Cooper side to protect it against wet PCB process.