Sony Develops “Exmor RS,” the World's First*1 Stacked CMOS Image Sensor
Also introduces imaging modules that deliver high picture quality and compact size, for use in mobile devices such as smartphones and tablets

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August 20, 2012

Sony Develops “Exmor RS,” the World's First*1 Stacked CMOS Image Sensor
Also introduces imaging modules that deliver high picture quality and compact size, for use in mobile devices such as smartphones and tablets

- Sony Continues to Advance the Evolution of World of Digital Imaging -

August 20, 2012, Tokyo, Japan - Sony Corporation (“Sony”) today announced the commercialization of “Exmor RS,” the world's first(*1) CMOS image sensor incorporating a unique, newly-developed ‘stacked structure.’ Shipments will commence in October. Sony is introducing three models of the “Exmor RS,” stacked CMOS image sensor, for use in smartphones and tablets, which combine superior image quality and advanced functionality with compact size. Sony will also launch three corresponding imaging modules incorporating these sensors.
Going forward, Sony will continue to evolve its digital imaging products, while aggressively pursuing the further development and expansion of its core “Exmor RS” stacked CMOS image sensor technologies and lineup, in order to deliver increasingly diverse and user-friendly image capturing experiences.

The “Exmor RS” is a CMOS image sensor that adopts a unique ‘stacked structure.’ This structure layers the pixel section, containing formations of back-illuminated pixels over the chip affixed with mounted circuits for signal processing, in place of conventional supporting substrates used for back-illuminated CMOS image sensors.

Two of the three “Exmor RS” models Sony is launching are the ‘IMX135’, a type 1/3.06 model with 13.13 effective megapixels and the ‘IMX134’, a type 1/4 model with 8.08 effective megapixels, which feature ‘RGBW coding’ function and ‘HDR (High Dynamic Range) movie’ function. The ‘RGBW coding’ function can capture sharp, clear images even when filmed or photographed in low light conditions, such as a dark room or at night by featuring W (white) pixels in addition to conventional RGB (red-green-blue) pixels, and leveraging Sony’s proprietary device technology and signal processing to heighten sensitivity without compromising its high resolution. ‘HDR (High Dynamic Range) movie’ function enables two different exposure conditions to be configured within a single screen when shooting, and seamlessly performs appropriate image processing to generate optimal images with a wide dynamic range and brilliant colors, even when pictures are taken against bright light. The other “Exmor RS” model is the ‘ISX014’, a type 1/4 model with 8.08 effective megapixels, which has a built-in camera signal processing function.

In addition to the higher image quality and superior functionality, the use of a ‘stacked structure’ has helped Sony to achieve a more compact size.

Sony will also bring to market three compact auto-focus imaging modules equipped with lens units and featuring auto-focus mechanisms that incorporate these image sensors: the ‘IU135F3-Z,’ ‘IU134F9-Z’ and ‘IUS014F-Z’. These three imaging modules adopt a newly-designed lens which has been optimized for the industry’s smallest(*1) 1.12μm unit pixel size to achieve higher resolution.

The ‘IU135F3-Z’ is an auto-focus imaging module incorporating a bright, high-resolution F2.2 lens. The ‘IU134F9-Z’ (W:8.5 x D:8.5 x H:4.2mm(*4)) is thin and compact. The ‘IUS014F-Z’ is an all-in-one imaging module that comprises an image sensor with built-in camera signal processing function and built-in auto-focus and picture adjustment function.

Going forward, Sony plans to continue with the proactive development of its “Exmor RS” stacked CMOS image sensors in order to bring to market imaging modules that achieve higher image quality, advanced functionality and an even more compact size. Sony aims to leverage the characteristics of its ‘stacked structure’ design to respond to the demand for larger screens in devices such as smartphones, where the amount of space available for embedding imaging modules is limited, and to continue expanding its product lineup to better accommodate its customers’ needs.

Demand is growing rapidly for mobile devices such as smartphones and tablets, and Sony is committed to strengthening its production capacity(*2) for stacked CMOS image sensors, which combine the dual strengths of advanced functionality and compact size. This will enable Sony to solidify its position as the global leader in CMOS image sensors, and to act as a driving force for the industry in the future.

*2: An announcement was already made (on June 22) regarding capital investment at Sony Semiconductor Corporation's Nagasaki Technology Center with the objective of increasing the production capacity for stacked CMOS image sensors.

Model

Shipment date
(planned)

Sample price
(incl. tax)

Type 1/3.06
13.13 effective megapixels(*3)

Stacked CMOS image sensor
'IMX135'

January, 2013

1,500 JPY

Imaging module
'IU135F3-Z'

March, 2013

8,000 JPY

Type 1/4
8.08 effective megapixels(*3)

Stacked CMOS image sensor
'IMX134'

March, 2013

1,000 JPY

Imaging module
'IU134F9-Z'

May, 2013

5,000 JPY

Type 1/4
8.08 effective megapixels(*3)

Stacked CMOS image sensor
'ISX014'

October, 2012

1,200 JPY

Imaging module
'IUS014F-Z'

November, 2012

6,000 JPY

*3: Based on the method for specifying effective pixels in image sensors

4) The "IUS014F-Z" is an all-in-one model capable of picture adjustment that comes equipped with a camera signal processing function.

Key specifications Stacked CMOS image sensors

Model name

IMX135

IMX134

ISX014

Number of effective pixels

4208(H) x 3120(V)
13.13M pixels

3280(H) x 2464(V)
8.08M pixels

3280 (H) x 2464 (V)
8.08M pixels

Image size

Diagonal 5.867 mm(Type 1/3.06)

Diagonal 4.595 mm(Type 1/4)

Diagonal 4.6 mm(Type 1/4)

Unit cell size

1.12 μm (H) x 1.12 μm (V)

1.12 μm (H) x 1.12 μm (V)

1.12 μm (H) x 1.12 μm (V)

Frame rate

Full

24 fps

30 fps

15 fps

1/2 sub sampling

48 fps

60 fps

30 fps

1/8 sub sampling

Not support

Not support

120 fps

HD mode

1080p 30fps (HDR mode)1080p 60fps720p 60fps

1080p 30fps720p 30fps (HDR mode)720p 60fps

1080p 30fps720p 60fps

Sensitivity
(typical value F5.6)

92mV (Green pixel)127mV (White pixel)

92mV (Green pixel)127mV (White pixel)

84mV

Sensor saturation signal
(minimum value)

260mV

260mV

260mV

Power
supply

Analog

2.7V

2.7V

2.7V

Digital

1.05V

1.05V

1.05V

Interface

1.8V

1.8V

1.8V, 2.7V

Key features

RGBW coding function
HDR movie function

Auto-control function
Picture quality adjustment function

Output

MIPI (4lane, 2lane)

MIPI (4lane, 2lane)

MIPI (4lane, 2lane, 1lane)

Image output format

Bayer RAW

Bayer RAW

YUV,RGB,RAW, Y/Cb/Cr,JPEG + YUV (thumbnail), JPEG (4:2:2)

Key specifications Imaging module

Model

IU135F3-Z

IU134F9-Z

IUS014F-Z

Module size(*4)

W:8.5x D:8.5x H:5.5 mm

W:8.5x D:8.5x H:4.2 mm

W:8.5x D:8.5x H:4.65 mm

AF actuator

VCM (Voice Coil motor)

Lens composition

Plastic
(5 groups 5 elements)

Plastic
(4 groups 4 elements)

Plastic
(4 groups 4 elements)

F-number

F2.2

F2.4

F2.4

Focal length
(35mm conversion)

28mm

*1:Accurate at time of press release (August 20, 2012)

*2:An announcement has already been made (on June 22) regarding capital investment at Sony Semiconductor Corporation's Nagasaki Technology Center with the objective of increasing the production capacity for stacked CMOS image sensors.

Sony Develops “Exmor RS,” the World's First*1 Stacked CMOS Image Sensor
Also introduces imaging modules that deliver high picture quality and compact size, for use in mobile devices such as smartphones and tablets