Advanced memory buffer delivers 40% power savings

San Jose, Calif.Integrated Device Technology Inc. has started to sample the third-generation device in its Advanced Memory Buffer(AMB) family, claiming it offers a 40% savings in power over competitive AMB offerings.

The Advanced Memory Buffer Plus (AMB+) device is compliant with the JEDEC AMB specifications. It is an essential building block in fully-buffered dual in-line memory modules (FB-DIMM) for high-performance, low-power computing platforms.

The IDT AMB+ meets the increasing memory storage requirements of servers and workstations that must achieve higher-performance to support the demands of e-commerce, web-hosting, enterprise and other mission-critical applications.

The challenge for these computing platforms is to continue to scale memory performance and capacity, while reducing power consumption to fit within the tightening constraints of data centers. The high-speed, serial, point-to-point connection between the memory controller and modules on the channel is a key attribute of the FB-DIMM channel architecture used in the memory subsystem of current platforms.

The DRAMs populated on the FB-DIMM rely on the IDT AMB+ to provide that functionality. The AMB+ located on each FB-DIMM collects and distributes the data from or to a DIMM, buffers the data internally on the chip, and receives or forwards it to the next DIMM or memory controller.

The IDT AMB+ is a drop-in, ready-to-use product that immediately provides twenty-five percent savings over previous products, even while operating with DDR2-800 DRAMs, according to IDT. Additional power savings can be achieved by special provisioning incorporated in the device, such as an optional 1.5V core power supply, instead of traditional 1.8V. Consequently, a full-module heat-spreader may no longer be necessary, significantly reducing bill of material costs and increasing packing density.

Advanced engineering samples of the IDT AMB+ are currently available to qualified customers. General sampling and production are scheduled for the third quarter of 2007.