Deposition of thin metal films and carbon nanotubes, plasma etching of Si-based semiconductor and dielectric films, wet etching of metals, semiconductor or dielectric films, film thicknesses and stress characterization. Future capabilities may include complete photolithography and deposition of dielectric films.

Sirus T2 Reactive Ion Etcher is a basic plasma etching system designed to etch dielectrics and other films that require fluorine-based chemistries. The small footprint and robust design make it ideal for the lab environment.

Angstrom Covap is resistive thermal evaporation system capable of deposition of up to two metal films at a time (upgradable to 4).

Resistive evaporation is a commonly used vacuum deposition process in which electrical energy is used to heat a filament which in turn heats a deposition material to the point of evaporation. The process can be performed at very high levels of vacuum allowing for a long mean free path and therefore fewer tendencies to introduce film impurities. High deposition rates can be achieved and lower energy particles can reduce substrate damage.

Angstrom Engineering has developed thin film deposition systems based on this technique which can deposit a wide range of materials including metals, organic, and inorganic polymers. The process can be controlled using quartz rate sensor, temperature, or optical monitoring systems to ensure consistent high-quality results.

First Nano’s EasyTube™ 2000 System is an advanced turnkey thermal catalytic chemical vapor deposition process tool for the synthesis of a wide variety of nanostructured materials. The system is optimized for controlled process development and user safety.

EasyTube™ 2000 is easy to use with PC controlled recipe driven software that automatically acquires and logs data for verifiable repeatability.

The Cee® 200X Precision Spin Coater delivers track-quality performance for photoresist, thin film, or other process chemical coating applications. Fully programmable and user-friendly, the Cee® 200X features the accuracy and repeatability needed to eliminate processing variability from photoresist and thin film deposition processes. With its convenient compact footprint, chemical compatibility, and durability, this easy-to-use benchtop system will provide years of high-performance spin coating, making the Cee® 200X purchase a smart and cost-effective decision for applying coatings to substrates up to 200 mm round or 7" square.

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