Technology Forum in Taiwan held by the SCHMID Group

The second photovoltaic technology symposium presents new technologies of the equipment manufacturer

(PresseBox) (Freudenstadt, 11.05.2012)With the annual Photovoltaic Technology Forum in Taiwan, the SCHMID Group has created a new platform for practice-related exchange of technology in Taiwan. It is already the 2nd Technology Symposium of the SCHMID Group with the motto "Let the Sun shine - Catch the Power" that has been held in Hsinchu, Taiwan, in April 2012.

The internationally operating group of companies welcomed more than 120 participants consisting of local customers from the silicon, wafer, cell and module areas to present the latest SCHMID Group developments. Compared to last year the number of participants had increased by more than 40 percent.

Within the scope of a comprehensive lecture program presented by SCHMID experts and local experts in the photovoltaic industry, like for example Mr. Henry Hu of Winergy and Dr. Jiang-Tsair Lin, the participants had the opportunity of being informed on the latest developments of the SCHMID Group and on market trends and forecasts. The entire value chain of photovoltaics, from the silicon up to the module, was presented with the latest technology updates and roadmaps relating to the SCHMID Group.

In the wafer section special attention was paid to the complete technology portfolio of the SCHMID Group in the field of Diamond Wire Technology - from Diamond Wire itself through to the highly efficient pre-cleaning and final cleaning and up to the metrology sorter that is especially optimized for the diamond wire technology.

Next to the Alkaline Inline Texturing and the Single-Sided Polishing as well as the most cost-effective solution for back side passivation with APCVD (Atmospheric Pressure CVD System), the main interest in the solar cell domain particularly focused on the new metallization technologies. The SCHMID HiMet Technology (High Efficiency Metallization Technology), with more than 70 percent silver saving for the front side, and the new back side tin coating, which represents a 100 % replacement of silver, allowing further significant cost savings.

In the field of modules the trend setting multi bus bar technology and the new generation of membrane-free laminating presses sparked lively interest.

During the breaks all participants had the opportunity for further detailed discussions. Because of their positive feedback, the SCHMID Group is already looking forward to the 2013 Technology Forum.