type of package commonly used to house very high density microchips such as microprocessors; hundreds of leads (pins) come out of the bottom surface of the package; designed to minimize distance signal must travel from the chip to designated pin.

MPGA

Metal Pin Grid Array; type of IC package.

package

housing of the chip or discrete device; electrically interconnects chip with outside circuitry; also provides physical and chemical protection of the chip; designed to dissipate heat generated by the chip; packages are available in the very wide variety of designs.