Help with Polymer and Plastic Composites specifications:

Acrylonitrile-butadiene-styrene (ABS) is a hard, rigid, thermoplastic polymer. It provides good chemical and creep resistance along with dimensional stability. ABS is used in many industries and in a wide array of applications. It is generally inexpensive, but prone to crack under stress. Common trade names include Cycolac® (GE Plastics), Lustran® (Bayer) and Novodur® (Bayer).

Polyacetal or polyoxymethylene (POM) provides a higher strength material compared to polyethylene-type polymers; however, polyacetal materials are susceptible to oxidation at elevated temperatures. DuPont’s Delrin® is a common polyacetal engineering resin that is also used to mold plastic parts.

Acrylic polymers are formed by polymerizing acrylic acids through a reaction with a suitable catalyst. Acrylics provide excellent environmental resistance and have faster-setting times than other resin systems.

Elastomeric materials are based upon or use a butyl, polybutene, or polyisobutylene chemical system. Chlorinated isobutylene or chlorobutyl can be used alone or in blends with other polymers to achieve special properties. Butyl is a commonly-used term for the isobutylene isoprene elastomer. It is known for its resistance to water, steam, alkalis, and oxygenated solvents. Butyl has low gas permeation and is capable of providing high-energy absorption (dampening) and good hot tear strength. Butyl's suggested operating temperature is -75° to 250° F.

Epoxy resins exhibit high strength and low shrinkage during curing. Epoxies are known for their toughness and resistance to chemical and environmental damage. Most epoxies are two-part resins cured at room temperature. Some thermally-cured or thermoset one-part epoxies are also available. Depending on the formulation, epoxy resins are used as casting resins, potting agents, resin binders, or laminating resins in fiberglass or composite construction. They are also used as encapsulants, electrical conductors in microelectronic packaging, and adhesives in structural bonding applications.

Polymers are based on fluoropolymer chemical systems such as polytetrafluoroethylene (PTFE) or polyvinylidene fluoride (PVDF). Fluoropolymers are used in applications requiring superior chemical resistance. PTFE is used in applications requiring superior chemical resistance or low friction.

Liquid crystal polymers (LCP) are thermoplastics with high strength and temperature resistance. Liquid crystal polymers are used in electrical, electronic, and medical applications where the high cost of the material is not an issue.

Ketones encompass polyaryletherketone or polyetheretherketone (PEEK). PEEK is an engineered thermoplastic that can resist high temperatures. It has excellent chemical resistance, fatigue resistance, and thermal stability. PEEK is inert to all common solvents and resists a wide range of organic and inorganic liquids. PEEK has a maximum continuous working temperature of 480°F and retains its mechanical properties up to 570°F in steam or high-pressure applications.

Phenolic and formaldehyde resins are thermosetting molding compounds and adhesives that offer strong bonds and provide good resistance to high temperatures. Phenolic or phenol formaldehyde, urea formaldehyde, furan, and melamine resins fit into this category. Phenolic resin adhesives made from chemicals of the phenol group and formaldehyde are generally the most durable. Phenolic resins are available in liquid, powder, and film form. Special phenolic resins are available that harden at moderate temperatures when mixed with suitable accelerators. Phenol-formaldehyde, resorcinol-formaldehyde, resol, and novalac resins are types of phenolic resins. Urea resin adhesives are made from urea, formaldehyde, and catalysts or hardeners. Urea formaldehyde resins can harden rapidly at moderate temperatures, but generally do not have the properties of phenolic resins. Melamine resins are made through a reaction of dicyandiamide with formaldehyde. Most of the resins in this group have excellent dielectric properties. Furan formaldehyde (FF) resins are made by the polymerization or poly-condensation of furfural, furfural alcohol, or other compounds containing a furan ring, or by the reaction of these furan compounds with other compounds (not over 50%). Fire-retardant furans are used in hand lay-up, spray-up, and filament-winding operations. Furans are commonly used in foundry binders, grinding wheels, refractories, and other high temperature applications. Furan resins and chemicals are also used in fiberglass composites, hybrid resins combined with epoxy or phenolics, and in corrosion-resistant cements.

Polyamide is a commonly-used system for molding high-strength engineered components. Polyamides are also used to produce strong hot-melt adhesives. Polyamides provide higher strength than polyethylene or other commodity-type polymers. Nylon is a well-known example of a polyamide engineering resin that is also used to mold plastic parts.

Polyamide-imides are amorphous thermoplastic materials with excellent mechanical properties, especially at elevated temperatures. Trimellitic anhydrides react with aromatic diamines to produce polyamide-imides. Polyamide-imides are applied in demanding engineering applications. Solvay Advanced Polymer's Torlon® is a well-known example of a polyamide-imide engineering resin that is also used to mold, extrude, or machine plastic parts and stock.

Polybutadiene is a commonly-used polymer system with dielectric potting compounds and coatings. It can be combined with other rubber polymers to form flexible sealants. Polybutadiene remains flexible even at low temperatures.

Polycarbonate is an amorphous material with excellent impact strength, clarity, and optical properties. Polycarbonate has excellent mechanical properties, and can be molded to tight tolerances. Polycarbonates can be attacked by solvents and petrochemicals. Brand names include Caliber® (Dow) and Lexan® (GE) as well as Makrofol® and Makrolon® (Bayer).

Polymers or resins are based on the polyethylene chemical system. Low density polyethylene polymers are used to form a variety of common or commodity-plastic components. High density (HDPE) and ultra-high molecular weight polyethylene (UHMW PE) have good friction and mechanical properties. They are used in medical devices, wear parts, and engineered components.

Polyether block amide (PEBA) resins are a type of polyamide with thermoplastic elastomer characteristics. PEBA can be molded to form flexible components such as hydraulic hose, pneumatic tube, boots, and other parts.

Products are based on thermoplastic polyimide resin or thermoset bismaleimide (BMI) resin. Aromatic polyimides are among the most thermally-stable organic materials. DuPont’s Kapton® film materials are an example of thermoplastic polyimide. Polyimide thermoplastics and BMI thermoset resins have high temperature resistance. Bismaleimide (BMI) resins have processing characteristics similar to epoxy resins and are used as laminating resins, prepregs, and adhesives.

Thermoplastics are based on a polyphthalamide or aromatic polyamide system with a highly crystalline or linear nature. Aramid fibers are based on a polyphthalamide system. DuPont’s Kevlar® fibers are an example of aramid fibers.

Polyurethane (PUR) resins provide excellent flexibility, impact resistance, and durability. Polyurethanes are formed through the reaction of an isocyanate component with polyols or other active hydroxyl group compounds. Polyurethanes require a catalyst, heat, or air evaporation to initiate and complete curing.

Other specialty, proprietary or unlisted resins, chemical systems or compounds or polymer types.

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Polymer or elastomer products use chopped fiber reinforcement to provide improved strength and/or stiffness. Sheet molding compounds (SMC) are provided in the form of sheets, usually with a carrier or release liner. Bulk molding compounds (BMC) are provided in larger, bulk shapes.

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Material is supplied or available in the form of sheets or films. Sheets have a thickness between 0.006" and 0.250" and are 24" inches (609.6 mm) or more in width. Sheets are typically formed to precise thicknesses and/or width requirements.

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Resins or compounds with a high degree of electrical conductivity (low resistivity) are designed for applications such as anti-static or ESD control, EMI/RFI shielding, thick-film metallization, and device and board-level electrical interconnection.

Dielectric compounds and electrical insulation materials are used to form a barrier or isolator between electrical or electronic components. The voltage potential between the conductor and conductive components influences material selection (based on the dielectric strength) in order to reduce shorting. Dielectric constant and loss tangent are important parameters in minimizing crosstalk between insulated circuit paths.

Polymers or elastomers are designed to provide shielding from electromagnetic interference (EMI) or radio frequency interference (RFI). Typically, these compounds have a high degree of electrical conductivity.

The material is flame retardant in accordance with industry standards, such as Underwriters Laboratories, Inc. (UL), Flame Class 94, or other ISO standards. Flame retardant materials reduce the spread of flame or resist ignition when exposed to high temperatures. They also insulate the substrate and delay damage to it.

Products are designed to provide flexibility or dampening of sound, vibration, or shock in suitable applications. Flexible adhesives or sealants form a layer that can bend or flex without cracking or delaminating.

Materials are designed to form a thermally conductive layer on the substrate, between components, or within a finished electronic product. Thermally conductive resins, thermoplastics, encapsulants, potting compounds, tapes, pads, adhesives, and greases are often used between a heat-generating electrical device and a heat sink to improve heat dissipation.

The material is approved to or recognized under one or more requirements of Underwriters Laboratories, Inc. (UL).

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Products are resins, compounds, and plastic composites that are suitable for electrical power or high voltage applications such as generator or motor assemblies, coil or transformer manufacturing, and switch or circuit breaker insulation.

Products are suitable for medical or food-contact applications. They typically comply with requirements from regulatory agencies such as the Food and Drug Administration (FDA), U.S. Department of Agriculture (USDA), National Science Foundation (NSF), 3A-Dairy, Canada AG, or USP Class VI.

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Tensile strength at break is the maximum amount of stress required to fail or break the material under tension loading test conditions. Tensile tests are typically performed according to test procedure standards such as ASTM D-638 or ISO 527-1, ASTM D-1708, ASTM D-2289 (plastics at high strain rates), and ASTM D-882 (thin plastic sheets) as well as other OEM proprietary standards.

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Young's modulus or the modulus of elasticity is a material constant that indicates the variation in strain produced under an applied tensile load. Materials with a higher modulus of elasticity have higher stiffness or rigidity.

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The dielectric constant is the relative permittivity of a material compared to a vacuum or free space. k = εr = ε/ εo= where ε is the absolute permittivity of the material and εo is the absolute permittivity of a vacuum 8.85 x 10-12 F/m.

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