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Abstract

Disclosed is a technique for measuring the registration of sublaminate layers in a printed circuit board using a capacitance bridge to detect misalignment between a reference layer and other layers. It can be used prior to, or after, lamination.

Country

United States

Language

English (United States)

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Disclosed is a technique for measuring the registration of sublaminate layers
in a printed circuit board using a capacitance bridge to detect misalignment
between a reference layer and other layers. It can be used prior to, or after,
lamination.

This measurement uses a pattern of lines or other appropriate shapes placed
in unused areas on each layer of the board. In the figure, two sinusoidal drive
voltages, one at quadrature with respect to the other, are applied to drive lines 1
and 2. The alignment in one direction of the underlying sublaminate layer is
determined by measuring the capacitive current from sense line 3 to ground.
This current is zero if alignment is perfect. The patterns are duplicated and
rotated by 90 degrees for measuring alignment in the other direction. Signals are
coupled into or out of the board using plated through holes or by capacitive
coupling.

In order to test the alignment of a power or ground plane sandwiched
between adjacent layers containing drive and sense line patterns, a hole is drilled
or etched in the power plane and the plane is grounded, thereby acting as an
electrostatic shield to capacitive coupling between the drive lines on one adjacent
layer, and the sense line on the other adjacent layer. Alignment of the
power/ground plane is accurately measured as long as the relative alignment of
the adjacent layers is known.