The Effect of Sterilization Methods on Plastics and Elastomers, 2nd Edition

This extensively updated second edition was created for medical device, medical packaging, and food packaging design engineers, material product technical support, and research/development personnel. This comprehensive databook contains important characteristics and properties data on the effects of sterilization methods on plastics and elastomers. It provides a ready reference for comparing materials in the same family as well as materials in different families.

Data are presented on 43 major plastic and elastomer packaging materials, including biodegradable or organic polymers. New to this edition are resin chapters containing textual summary information including category; a general description; applications; resistances to particular sterilization methods; and regulatory status considerations for use in medical devices and medical/food packaging. The resin chapter material supplier trade name product data is presented in a graphical and tabular format, with results normalized to SI units, retaining the familiar format of the best selling first edition and allowing easy comparison between materials and test conditions.

Liesl K. MasseyFina Oil and Chemical CompanyEducated as a mechanical engineer and MBS, Liesl K. Massey brings substantial and varied plastics industry experience from Fina Oil and Chemical Company and Ferro Corporation to her writing occupation. Past responsibilities include technical service support, new product introductions, account management, and customer service management of a wide range of resin and additive products. She is a past committee member of the annual SPE Polyolefins Conference and is currently consulting within the polymer and polymer additives market.

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{"id":11242227908,"title":"Additive Migration from Plastics into Foods","handle":"978-1-84735-055-8","description":"\u003ch5\u003eDescription\u003c\/h5\u003e\nAuthor: T.R. Crompton \u003cbr\u003eISBN 978-1-84735-055-8 \u003cbr\u003e\u003cbr\u003e\u003cb\u003eA Guide for Analytical Chemists\u003cbr\u003e\u003c\/b\u003eSmithers Rapra Technology\u003cbr\u003e\u003cb\u003e\u003cbr\u003e\u003c\/b\u003eSoft-backed, 255 x 190 mm, 325 pages.\u003cb\u003e\u003cbr\u003e\u003c\/b\u003e\n\u003ch5\u003eSummary\u003c\/h5\u003e\nPlastics are now being used on a large scale for the packaging of fatty and aqueous foodstuffs and beverages, both alcoholic and non-alcoholic. This is evident for all to see on the supermarket shelves, margarine is packed in polystyrene tubs, beer is packed in PVC bottles and meats and bacon in shrink-wrap film. Foods are also increasingly being shipped in bulk, in plastic containers. Additionally, there is the area of use of plastics utensils, containers, and processing equipment in the home and during a bulk preparation of food in producing factories, at home and in restaurants and canteens. \u003cbr\u003e\u003cbr\u003eThus it is likely that some transfer of polymer additives will occur - adventitious impurities such as monomers, oligomers, catalyst remnants and residual polymerization solvents and low molecular weight polymer fractions - from the plastic into the packaged material with the consequent risk of a toxic hazard to the consumer. The actual hazard arising to the consumer from any extractable material is a function of two properties, namely, the intrinsic toxicity of the extracted material as evaluated in animal feeding trials (not dealt with in this book) and the amount of material extracted from the polymer which enters the packed commodity under service conditions, i.e., during packaging operations and during the shelf life of the packaged commodity at the time of the consumption. \u003cbr\u003e\u003cbr\u003eThis book covers all aspects of the migration of additives into food and gives detailed information on the analytical determination of the additives in various plastics. It will be of interest to those engaged in the implementation of packaging legislation, including management, analytical chemists and the manufacturers of foods, beverages, pharmaceuticals and cosmetics and also scientific and toxicologists in the packaging industry.\u003cbr\u003e\u003cbr\u003e\n\u003ch5\u003eTable of Contents\u003c\/h5\u003e\n1 Additive Migration from Plastics into Packaged Commodities \u003cbr\u003e2 Types of Polymers Used in Commodity Packaging \u003cbr\u003e3 Non-Polymeric Components of Plastics \u003cbr\u003e4 Determination of Antioxidants \u003cbr\u003e5 Determination of Ultraviolet Stabilisers in Extractants \u003cbr\u003e6 Determination of Plasticisers in Extractants \u003cbr\u003e7 Determination of Organotin Thermal Stabilisers in Extractants \u003cbr\u003e8 Determination of Organic Sulfur Compounds in Extractants \u003cbr\u003e9 Determination of Polydimethyl Siloxanes in Extractants \u003cbr\u003e10 Determination of Lubricants in Extraction Liquids \u003cbr\u003e11 Determination of Monomers and Oligomers in Extractants \u003cbr\u003e12 Analysis of Polymer Extraction Liquids Containing More Than One Migrant \u003cbr\u003e13 Determination of Additives and their Breakdown Products in Extractants \u003cbr\u003e14 Additive Migration Theory \u003cbr\u003e15 Gas Barrier Properties of Food Packaging Plastic Films \u003cbr\u003e16 Legislative Aspects of the Use of Additives in Packaging Plastics \u003cbr\u003e17 Direct Determination of Migrants from Polymers into Foodstuffs\u003cbr\u003e\u003cbr\u003e\n\u003ch5\u003eAbout Author\u003c\/h5\u003e\nRoy Crompton was Head of the polymer analysis research department of a major international polymer producer for some 15 years. In the early fifties, he was heavily engaged in the development of methods of analysis for low-pressure polyolefins produced by the Ziegler-Natta route, including work on high-density polyethylene and polypropylene. He was responsible for the development of methods of analysis of the organoaluminum catalysts used for the synthesis of these polymers. He was also responsible for the development of thin-layer chromatography for the determination of various types of additives in polymers and did pioneering work on the use of TLC to separate polymer additives and to examine the separated additives by infrared and mass spectrometry. He retired in 1988 and has since been engaged as a consultant in the field of analytical chemistry and has written extensively on this subject, with some 20 books published.","published_at":"2017-06-22T21:14:06-04:00","created_at":"2017-06-22T21:14:06-04:00","vendor":"Chemtec Publishing","type":"Book","tags":["2007","additive","antioxidants","book","determination","extractants","lubricants","migration","monomes","non-polymeric","oligomers","p-applications","packaging","plastic","plasticisers","plasticizers","plastics","polymer","polymers","stabilisers","sulfur compounds","ultraviolet"],"price":17000,"price_min":17000,"price_max":17000,"available":true,"price_varies":false,"compare_at_price":null,"compare_at_price_min":0,"compare_at_price_max":0,"compare_at_price_varies":false,"variants":[{"id":43378395844,"title":"Default Title","option1":"Default Title","option2":null,"option3":null,"sku":"","requires_shipping":true,"taxable":true,"featured_image":null,"available":true,"name":"Additive Migration from Plastics into Foods","public_title":null,"options":["Default Title"],"price":17000,"weight":1000,"compare_at_price":null,"inventory_quantity":1,"inventory_management":null,"inventory_policy":"continue","barcode":"978-1-84735-055-8"}],"images":["\/\/cdn.shopify.com\/s\/files\/1\/1555\/1853\/products\/978-1-84735-055-8.jpg?v=1498185547"],"featured_image":"\/\/cdn.shopify.com\/s\/files\/1\/1555\/1853\/products\/978-1-84735-055-8.jpg?v=1498185547","options":["Title"],"content":"\u003ch5\u003eDescription\u003c\/h5\u003e\nAuthor: T.R. Crompton \u003cbr\u003eISBN 978-1-84735-055-8 \u003cbr\u003e\u003cbr\u003e\u003cb\u003eA Guide for Analytical Chemists\u003cbr\u003e\u003c\/b\u003eSmithers Rapra Technology\u003cbr\u003e\u003cb\u003e\u003cbr\u003e\u003c\/b\u003eSoft-backed, 255 x 190 mm, 325 pages.\u003cb\u003e\u003cbr\u003e\u003c\/b\u003e\n\u003ch5\u003eSummary\u003c\/h5\u003e\nPlastics are now being used on a large scale for the packaging of fatty and aqueous foodstuffs and beverages, both alcoholic and non-alcoholic. This is evident for all to see on the supermarket shelves, margarine is packed in polystyrene tubs, beer is packed in PVC bottles and meats and bacon in shrink-wrap film. Foods are also increasingly being shipped in bulk, in plastic containers. Additionally, there is the area of use of plastics utensils, containers, and processing equipment in the home and during a bulk preparation of food in producing factories, at home and in restaurants and canteens. \u003cbr\u003e\u003cbr\u003eThus it is likely that some transfer of polymer additives will occur - adventitious impurities such as monomers, oligomers, catalyst remnants and residual polymerization solvents and low molecular weight polymer fractions - from the plastic into the packaged material with the consequent risk of a toxic hazard to the consumer. The actual hazard arising to the consumer from any extractable material is a function of two properties, namely, the intrinsic toxicity of the extracted material as evaluated in animal feeding trials (not dealt with in this book) and the amount of material extracted from the polymer which enters the packed commodity under service conditions, i.e., during packaging operations and during the shelf life of the packaged commodity at the time of the consumption. \u003cbr\u003e\u003cbr\u003eThis book covers all aspects of the migration of additives into food and gives detailed information on the analytical determination of the additives in various plastics. It will be of interest to those engaged in the implementation of packaging legislation, including management, analytical chemists and the manufacturers of foods, beverages, pharmaceuticals and cosmetics and also scientific and toxicologists in the packaging industry.\u003cbr\u003e\u003cbr\u003e\n\u003ch5\u003eTable of Contents\u003c\/h5\u003e\n1 Additive Migration from Plastics into Packaged Commodities \u003cbr\u003e2 Types of Polymers Used in Commodity Packaging \u003cbr\u003e3 Non-Polymeric Components of Plastics \u003cbr\u003e4 Determination of Antioxidants \u003cbr\u003e5 Determination of Ultraviolet Stabilisers in Extractants \u003cbr\u003e6 Determination of Plasticisers in Extractants \u003cbr\u003e7 Determination of Organotin Thermal Stabilisers in Extractants \u003cbr\u003e8 Determination of Organic Sulfur Compounds in Extractants \u003cbr\u003e9 Determination of Polydimethyl Siloxanes in Extractants \u003cbr\u003e10 Determination of Lubricants in Extraction Liquids \u003cbr\u003e11 Determination of Monomers and Oligomers in Extractants \u003cbr\u003e12 Analysis of Polymer Extraction Liquids Containing More Than One Migrant \u003cbr\u003e13 Determination of Additives and their Breakdown Products in Extractants \u003cbr\u003e14 Additive Migration Theory \u003cbr\u003e15 Gas Barrier Properties of Food Packaging Plastic Films \u003cbr\u003e16 Legislative Aspects of the Use of Additives in Packaging Plastics \u003cbr\u003e17 Direct Determination of Migrants from Polymers into Foodstuffs\u003cbr\u003e\u003cbr\u003e\n\u003ch5\u003eAbout Author\u003c\/h5\u003e\nRoy Crompton was Head of the polymer analysis research department of a major international polymer producer for some 15 years. In the early fifties, he was heavily engaged in the development of methods of analysis for low-pressure polyolefins produced by the Ziegler-Natta route, including work on high-density polyethylene and polypropylene. He was responsible for the development of methods of analysis of the organoaluminum catalysts used for the synthesis of these polymers. He was also responsible for the development of thin-layer chromatography for the determination of various types of additives in polymers and did pioneering work on the use of TLC to separate polymer additives and to examine the separated additives by infrared and mass spectrometry. He retired in 1988 and has since been engaged as a consultant in the field of analytical chemistry and has written extensively on this subject, with some 20 books published."}

{"id":11242202180,"title":"Adhesives Technology for Electronic Applications, 2nd Edition - Materials, Processing, Reliability","handle":"978-1-4377-7889-2","description":"\u003ch5\u003eDescription\u003c\/h5\u003e\nAuthor: James J. Licari \u0026amp; Dale W. Swanson \u003cbr\u003eISBN 978-1-4377-7889-2 \u003cbr\u003e\u003cbr\u003e512 pages\n\u003ch5\u003eSummary\u003c\/h5\u003e\n\u003cb\u003eKey Features\u003c\/b\u003e\n\u003cli\u003eA complete guide for the electronics industry to adhesive types, their properties, and applications - this book is an essential reference for a wide range of specialists including electrical engineers, adhesion chemists, and other engineering professionals.\u003c\/li\u003e\n\u003cli\u003eProvides specifications of adhesives for particular uses and outlines the processes for application and curing - coverage that is of particular benefit to design engineers, who are charged with creating the interface between the adhesive material and the microelectronic device.\u003c\/li\u003e\n\u003cli\u003eDiscusses the respective advantages and limitations of different adhesives for varying applications, thereby addressing reliability issues before they occur and offering useful information to both design engineers and Quality Assurance personnel.\u003c\/li\u003e\n\u003cp\u003e\u003cb\u003eDescription\u003c\/b\u003e\u003cbr\u003e\u003cbr\u003e\u003cbr\u003eAdhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups.\u003cbr\u003e\u003cbr\u003e\u003cbr\u003eThe book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts, and the regulatory framework make this book particularly important for engineers and managers alike.\u003cbr\u003e\u003cbr\u003e\u003cbr\u003eThe third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.\u003cbr\u003e\u003cbr\u003eAs well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as:\u003cbr\u003e\u003cbr\u003e• Tamper-proof adhesives for electronic security devices.\u003cbr\u003e\u003cbr\u003e• Bio-compatible adhesives for implantable medical devices.\u003cbr\u003e\u003cbr\u003e• Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly - as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market).\u003cbr\u003e\u003cbr\u003e• Nano-fillers in adhesives used to increase the thermal conductivity of current adhesives for cooling electronic devices.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eReadership\u003c\/b\u003e\u003cbr\u003e\u003cbr\u003eElectronics and materials engineers in the automotive, medical, semiconductors, space, plastics, and military industries.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eQuotes\u003c\/b\u003e\u003cbr\u003e\u003cbr\u003e\"I recommend this book without reservation to everyone in electronics who must understand adhesives, or make decisions about adhesives, or both.\" - George Riley\u003c\/p\u003e\n\u003ch5\u003eTable of Contents\u003c\/h5\u003e\n1. Introduction\u003cbr\u003e1.1 Adhesives Types and Definitions\u003cbr\u003e1.2 Summary of Packaging Technologies\u003cbr\u003e1.3 History of Adhesives in Electronic Applications\u003cbr\u003e1.4 Comparison of Polymer Adhesives with Metallurgical and Vitreous Attachment Materials\u003cbr\u003e1.5 Specifications\u003cbr\u003e1.6 The Market \u003cbr\u003e2. Functions and Theory of Adhesives\u003cbr\u003e2.1 Mechanical Attachment\u003cbr\u003e2.2 Electrical Connections\u003cbr\u003e2.3 Thermal Dissipation\u003cbr\u003e2.4 Stress Dissipation \u003cbr\u003e3. Chemistry, Formulation, and Properties of Adhesives\u003cbr\u003e3.1 Chemistry\u003cbr\u003e3.2 Formulation of Adhesives\u003cbr\u003e3.3 Properties \u003cbr\u003e4. Adhesive Bonding Properties\u003cbr\u003e4.1 Cleaning\u003cbr\u003e4.2 Surface Treatments\u003cbr\u003e4.3 Adhesive Dispensing\u003cbr\u003e4.4 Placement of Devices and Components\u003cbr\u003e4.5 Curing\u003cbr\u003e4.6 Rework \u003cbr\u003e5. Applications\u003cbr\u003e5.1 General Applications\u003cbr\u003e5.2 Specific Applications \u003cbr\u003e6. Reliability\u003cbr\u003e6.1 Failure Modes and Mechanisms\u003cbr\u003e6.2 Specifications \u003cbr\u003e7. Test and Inspection Methods\u003cbr\u003e7.1 Physical Tests\u003cbr\u003e7.2 Electrical Tests\u003cbr\u003e7.3 Environmental Tests\u003cbr\u003e7.4 Thermal Tests\u003cbr\u003e7.5 Mechanical and Thermomechanical Tests\u003cbr\u003e7.6 Chemical Analysis\u003cbr\u003eAppendix\u003cbr\u003eConversion Factors\u003cbr\u003eAbbreviations and Acronyms\u003cbr\u003eIndex\n\u003ch5\u003eAbout Author\u003c\/h5\u003e\n\u003cdiv\u003e\u003cb\u003eJames J. Licari\u003c\/b\u003e\u003c\/div\u003e\n\u003cdiv\u003e\u003c\/div\u003e\n\u003cdiv\u003eAvanTeco, Whittier, CA, USA\u003c\/div\u003e\n\u003cdiv\u003ehas his own consulting firm, AvanTeco, specializing in materials and processes for electronics. He holds a BS in Chemistry from Fordham University and a Ph.D. in Chemistry from Princeton University, where he was a DuPont Senior Fellow. His areas of expertise include materials and processes for electronic applications, primarily for high-reliability systems, hybrid microcircuits, printed wiring circuits, and other interconnect packaging technologies. He is an expert on polymeric materials including adhesives, coatings, encapsulants, insulation, reliability based on failure modes and mechanisms. Dr. Licari has had a forty-year career dedicated to the study and advancement of microelectronic materials and processes. Notable achievements throughout this career include conducting the first studies on the reliability and use of die-attach adhesives for microcircuits, which he did in the mid-1970s through the early 1980s, making industry and the government aware of the degrading effects of trace amounts of ionic contaminants in epoxy resins. He conducted early exploratory development on the use of non-noble metal (Cu) thick-film conductor pastes for thick-film ceramic circuits. He carried out the first studies on the use of Parylene as a dielectric and passivation coating for MOS devices and as a particle immobilizer for hybrid microcircuits. He developed the first photo-definable thick-film conductor and resistor pastes that were the forerunners of DuPont’s Fodel process, for which he received a patent was granted in England. And he developed the first photocurable epoxy coating using cationic photoinitiation by employing a diazonium salt as the catalytic agent (U.S. 3205157). The work was referenced as pioneering work in a review article by J.V. Crivello “The Discovery and Development of Onium Salt Cationic Photoinitiators,” J. Polymer Chemistry (1999)\u003c\/div\u003e\n\u003cdiv\u003e\u003c\/div\u003e\n\u003cdiv\u003e\n\u003cb\u003eDale W. Swanson \u003c\/b\u003ehas over 29 years experience in Materials and process engineering\u003c\/div\u003e\n\u003cdiv\u003e\u003c\/div\u003e\n\u003cdiv\u003e\u003c\/div\u003e","published_at":"2017-06-22T21:12:44-04:00","created_at":"2017-06-22T21:12:44-04:00","vendor":"Chemtec Publishing","type":"Book","tags":["2011","adhesives","book","electronic","mechanical testing","p-applications","physical testing","plastic","polymer","surface","thermal testing"],"price":16900,"price_min":16900,"price_max":16900,"available":true,"price_varies":false,"compare_at_price":null,"compare_at_price_min":0,"compare_at_price_max":0,"compare_at_price_varies":false,"variants":[{"id":43378310404,"title":"Default Title","option1":"Default Title","option2":null,"option3":null,"sku":"","requires_shipping":true,"taxable":true,"featured_image":null,"available":true,"name":"Adhesives Technology for Electronic Applications, 2nd Edition - Materials, Processing, Reliability","public_title":null,"options":["Default Title"],"price":16900,"weight":1000,"compare_at_price":null,"inventory_quantity":1,"inventory_management":null,"inventory_policy":"continue","barcode":"978-1-4377-7889-2"}],"images":["\/\/cdn.shopify.com\/s\/files\/1\/1555\/1853\/products\/978-1-4377-7889-2_cc1a9f07-b661-41cc-bfb1-5ab1ffa1d865.jpg?v=1498185491"],"featured_image":"\/\/cdn.shopify.com\/s\/files\/1\/1555\/1853\/products\/978-1-4377-7889-2_cc1a9f07-b661-41cc-bfb1-5ab1ffa1d865.jpg?v=1498185491","options":["Title"],"content":"\u003ch5\u003eDescription\u003c\/h5\u003e\nAuthor: James J. Licari \u0026amp; Dale W. Swanson \u003cbr\u003eISBN 978-1-4377-7889-2 \u003cbr\u003e\u003cbr\u003e512 pages\n\u003ch5\u003eSummary\u003c\/h5\u003e\n\u003cb\u003eKey Features\u003c\/b\u003e\n\u003cli\u003eA complete guide for the electronics industry to adhesive types, their properties, and applications - this book is an essential reference for a wide range of specialists including electrical engineers, adhesion chemists, and other engineering professionals.\u003c\/li\u003e\n\u003cli\u003eProvides specifications of adhesives for particular uses and outlines the processes for application and curing - coverage that is of particular benefit to design engineers, who are charged with creating the interface between the adhesive material and the microelectronic device.\u003c\/li\u003e\n\u003cli\u003eDiscusses the respective advantages and limitations of different adhesives for varying applications, thereby addressing reliability issues before they occur and offering useful information to both design engineers and Quality Assurance personnel.\u003c\/li\u003e\n\u003cp\u003e\u003cb\u003eDescription\u003c\/b\u003e\u003cbr\u003e\u003cbr\u003e\u003cbr\u003eAdhesives are widely used in the manufacture and assembly of electronic circuits and products. Generally, electronics design engineers and manufacturing engineers are not well versed in adhesives, while adhesion chemists have a limited knowledge of electronics. This book bridges these knowledge gaps and is useful to both groups.\u003cbr\u003e\u003cbr\u003e\u003cbr\u003eThe book includes chapters covering types of adhesive, the chemistry on which they are based, and their properties, applications, processes, specifications, and reliability. Coverage of toxicity, environmental impacts, and the regulatory framework make this book particularly important for engineers and managers alike.\u003cbr\u003e\u003cbr\u003e\u003cbr\u003eThe third edition has been updated throughout and includes new sections on nanomaterials, environmental impacts and new environmentally friendly ‘green’ adhesives. Information about regulations and compliance has been brought fully up-to-date.\u003cbr\u003e\u003cbr\u003eAs well as providing full coverage of standard adhesive types, Licari explores the most recent developments in fields such as:\u003cbr\u003e\u003cbr\u003e• Tamper-proof adhesives for electronic security devices.\u003cbr\u003e\u003cbr\u003e• Bio-compatible adhesives for implantable medical devices.\u003cbr\u003e\u003cbr\u003e• Electrically conductive adhesives to replace toxic tin-lead solders in printed circuit assembly - as required by regulatory regimes, e.g. the EU’s Restriction of Hazardous Substances Directive or RoHS (compliance is required for all products placed on the European market).\u003cbr\u003e\u003cbr\u003e• Nano-fillers in adhesives used to increase the thermal conductivity of current adhesives for cooling electronic devices.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eReadership\u003c\/b\u003e\u003cbr\u003e\u003cbr\u003eElectronics and materials engineers in the automotive, medical, semiconductors, space, plastics, and military industries.\u003cbr\u003e\u003cbr\u003e\u003cb\u003eQuotes\u003c\/b\u003e\u003cbr\u003e\u003cbr\u003e\"I recommend this book without reservation to everyone in electronics who must understand adhesives, or make decisions about adhesives, or both.\" - George Riley\u003c\/p\u003e\n\u003ch5\u003eTable of Contents\u003c\/h5\u003e\n1. Introduction\u003cbr\u003e1.1 Adhesives Types and Definitions\u003cbr\u003e1.2 Summary of Packaging Technologies\u003cbr\u003e1.3 History of Adhesives in Electronic Applications\u003cbr\u003e1.4 Comparison of Polymer Adhesives with Metallurgical and Vitreous Attachment Materials\u003cbr\u003e1.5 Specifications\u003cbr\u003e1.6 The Market \u003cbr\u003e2. Functions and Theory of Adhesives\u003cbr\u003e2.1 Mechanical Attachment\u003cbr\u003e2.2 Electrical Connections\u003cbr\u003e2.3 Thermal Dissipation\u003cbr\u003e2.4 Stress Dissipation \u003cbr\u003e3. Chemistry, Formulation, and Properties of Adhesives\u003cbr\u003e3.1 Chemistry\u003cbr\u003e3.2 Formulation of Adhesives\u003cbr\u003e3.3 Properties \u003cbr\u003e4. Adhesive Bonding Properties\u003cbr\u003e4.1 Cleaning\u003cbr\u003e4.2 Surface Treatments\u003cbr\u003e4.3 Adhesive Dispensing\u003cbr\u003e4.4 Placement of Devices and Components\u003cbr\u003e4.5 Curing\u003cbr\u003e4.6 Rework \u003cbr\u003e5. Applications\u003cbr\u003e5.1 General Applications\u003cbr\u003e5.2 Specific Applications \u003cbr\u003e6. Reliability\u003cbr\u003e6.1 Failure Modes and Mechanisms\u003cbr\u003e6.2 Specifications \u003cbr\u003e7. Test and Inspection Methods\u003cbr\u003e7.1 Physical Tests\u003cbr\u003e7.2 Electrical Tests\u003cbr\u003e7.3 Environmental Tests\u003cbr\u003e7.4 Thermal Tests\u003cbr\u003e7.5 Mechanical and Thermomechanical Tests\u003cbr\u003e7.6 Chemical Analysis\u003cbr\u003eAppendix\u003cbr\u003eConversion Factors\u003cbr\u003eAbbreviations and Acronyms\u003cbr\u003eIndex\n\u003ch5\u003eAbout Author\u003c\/h5\u003e\n\u003cdiv\u003e\u003cb\u003eJames J. Licari\u003c\/b\u003e\u003c\/div\u003e\n\u003cdiv\u003e\u003c\/div\u003e\n\u003cdiv\u003eAvanTeco, Whittier, CA, USA\u003c\/div\u003e\n\u003cdiv\u003ehas his own consulting firm, AvanTeco, specializing in materials and processes for electronics. He holds a BS in Chemistry from Fordham University and a Ph.D. in Chemistry from Princeton University, where he was a DuPont Senior Fellow. His areas of expertise include materials and processes for electronic applications, primarily for high-reliability systems, hybrid microcircuits, printed wiring circuits, and other interconnect packaging technologies. He is an expert on polymeric materials including adhesives, coatings, encapsulants, insulation, reliability based on failure modes and mechanisms. Dr. Licari has had a forty-year career dedicated to the study and advancement of microelectronic materials and processes. Notable achievements throughout this career include conducting the first studies on the reliability and use of die-attach adhesives for microcircuits, which he did in the mid-1970s through the early 1980s, making industry and the government aware of the degrading effects of trace amounts of ionic contaminants in epoxy resins. He conducted early exploratory development on the use of non-noble metal (Cu) thick-film conductor pastes for thick-film ceramic circuits. He carried out the first studies on the use of Parylene as a dielectric and passivation coating for MOS devices and as a particle immobilizer for hybrid microcircuits. He developed the first photo-definable thick-film conductor and resistor pastes that were the forerunners of DuPont’s Fodel process, for which he received a patent was granted in England. And he developed the first photocurable epoxy coating using cationic photoinitiation by employing a diazonium salt as the catalytic agent (U.S. 3205157). The work was referenced as pioneering work in a review article by J.V. Crivello “The Discovery and Development of Onium Salt Cationic Photoinitiators,” J. Polymer Chemistry (1999)\u003c\/div\u003e\n\u003cdiv\u003e\u003c\/div\u003e\n\u003cdiv\u003e\n\u003cb\u003eDale W. Swanson \u003c\/b\u003ehas over 29 years experience in Materials and process engineering\u003c\/div\u003e\n\u003cdiv\u003e\u003c\/div\u003e\n\u003cdiv\u003e\u003c\/div\u003e"}