Samsung Starts Mass Production of IoT Solution Product

Samsung Electronics has started mass production of its Exynos i T200—an IoT solution built on a low-power, 28-nanometer High-K Metal Gate (HKMG) process. The chip’s high processing capabilities and connectivity makes it suitable to meet the needs of upcoming IoT cases, but it the company has not yet indicated whether the chip will be used in its proprietary products.

The Exynos i T200 uses a Cortex-R4 processor and an additional Cortex-M0+ processor to perform various tasks without the need for an extra microcontroller IC. In addition to Microsoft Azure Certification for IoT, it natively supports IoTivity, which is an IoT protocol standard from the Open Connectivity Foundation (OCF), to enable seamless interoperability between IoT devices. It supports 802.11b/g/n single-band (2.4GHz) Wi-Fi with certification from the Wi-Fi Alliance.

The chip addresses security through compatibility with separate, designated security-management hardware called the Security Sub-System (SSS). A Physical Un-clonable Function (PUF) IP stores data securely, and also supplies device authentication management without the need to fuse a key onto silicon. It provides a much higher level of security than conventional one-time programmable (OTP) based solutions.

“The Exynos i T200 is an IoT solution optimized to deliver both the performance and security demanded in the IoT market,” says Ben Hur, Vice President of System LSI marketing at Samsung Electronics. “With various Exynos solution offerings, Samsung will deliver further differentiated value to not only mobile devices, but also non-mobile spaces, including automotive and IoT.