Embedded Modules

The modular design philosophy of VIA Embedded x86 Com Express®, ETX®, and Qseven™ form factors provides customers with the freedom to easily customize and modify existing designs in order to create innovative new devices using significantly faster design cycles and fewer resources.

VIA Qseven™ Modules

VIA Qseven™ ARM-based modules deliver high performance and rich multimedia features in an ultra-compact low-power package for a wide range of embedded system applications such as industrial automation, transportation, medical and infotainment.

VIA SOM Modules

VIA ARM-based SOM (system-on-module) modules deliver the perfect balance of performance and rich multimedia features in an ultra-compact, highly-flexible package for a wide range of IoT automation and HMI applications such as transportation, retail and medical.

VIA OPS Modules

Compliant with Intel’s Open Pluggable Specification (OPS), the VIA OPS boards and modules provide a seamless upgrade path for OPS-compatible displays, without the need for additional power, connectivity, or real estate.

VIA COM Express® Modules

VIA COM Express® modules provide scalable solutions for high-level embedded applications and support system expansion and application-specific customization. Designed to combine low power consumption with advanced multimedia performance, VIA COM Express® modules are targeted at industrial PCs and large OEM customers focused on dynamic application segments, including gaming, healthcare, military, transportation, and industrial automation. They are available in a choice of Basic, Mini, and Compact standards.