By Tiffany Trader

NVIDIA, Intel and AMD were not the only chip vendors unveiling new HPC accelerators last week SC12. Texas Instruments (TI) announced a set of heterogeneous processors that they believe will offer among the best performance per watt in the industry. In this case, the chipmaker glued an ARM CPU and DSP together on the same die, offering a low-power SoC with an impressive number of FLOPS. Read more…

By Michael Feldman

Whether you're talking about high performance computers, enterprise servers, or mobile devices, the two biggest impediments to application performance in computing today are the memory wall and the power wall. Venray Technology is aiming to knock down those walls with a unique approach that puts CPU cores and DRAM on the same die. The company has been in semi-stealth mode since it inception seven years ago, but is now trying to get the word out about its technology as it searches for a commercial buyer. Read more…

By Michael Feldman

At the International Solid-State Circuits Conference next week, Intel will provide an in-depth look at Intel’s Nehalem architecture as well as the chip maker’s plans for new types of system-on-a-chip processors. Read more…

Full & Complete coverage of SC17

Did you miss out on Supercomputing 2017? Did you attend, but were stuck in meetings the whole time without an opportunity to walk the show floor and see what new announcements were being made? HPCwire's got you covered, we visited some of the hottest booths in the exhibit hall and spoke with their top executives to get the scoop on the latest solutions, partnerships, and product announcements.

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