FSI International has said it has received an order from a major semiconductor manufacturer that had been evaluating its new ‘ORION’ single wafer cleaning platform, since May, 2008. The system employs a unique closed-chamber design that is claimed to tackle challenging cleaning issues at the 32nm and below. The new system was officially launched in November, 2008.

“This order is important to us on many levels,” said Don Mitchell, FSI’s President and CEO. “It validates the critical capabilities of the ORION for 32nm applications. It also demonstrates this customer’s conviction that those capabilities add sufficient value that even in a deep industry down-cycle, manufacturers are willing to invest in innovative technology, not only to prepare for the future, but also to realize current gains.”

The ORION’s three-dimensional cluster configuration, employing a closed chamber design allows the use of highly-reactive chemistries for single step, all wet stripping and is claimed to eliminate the need for ashing steps.