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China's ZTE, which the US government has accused of repeated sanctions violations, has paid a $1 billion fine, and put $400 million in an escrow account, so that it can continue purchase technology, including semiconductor products, from American companies. What impact will the proposed ban bring to ZTE and the worldwide market? What position of the Chinese companies and American companies in the semiconductor industry? What kind of collaboration in that industry between US and China? How will China catch up to fill in the core technology gap that is revealed by the ZTE instance? And what opportunities exist for professionals and companies in the industry? Dr. Bo Xia, Founder and CEO of Mingchip Technology in Shanghai, China, shares his observation of the semiconductor industry between US and China.

Dr. Bo Xia is an expert in RF transceiver and analog mixed-signal SoC design. He has over 17 years engineering and project management experience in the Integrated Circuit (IC) industry. He received his PhD in Electrical Engineering from Texas A&M University, then worked as a senior design engineer and project lead with Texas Instrument from 2003 to 2007 and designed many analog IPs based on Texas Instrument's sub-micron technology. Then he joined Spreadtrum Corp. (US) as a senior staff engineer and design manager and led the development of world first GSM/TDSCDMA transceiver. From 2008 to 2016, Dr. Xia was a technical director and led the Bluetooth SoC development in Vimicro Corp (US). In 2016, he founded Mingchips Technology Ltd. in China and focused on peripheral circuitry design for cell phones. Dr. Xia is a member of IEEE society and a member of Western Returned Scholar Association. He has published 16 papers on IEEE journals and conferences, and holds 9 granted patents.