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Abstract:

A heat sink apparatus includes a fin module, a base, a first heat pipe,
and a second heat pipe. The base includes an upper surface and a lower
surface. The first heat pipe includes a first connection portion having a
first end and a second end. The first end is connected to a first
receiving portion. The second end is connected to a first body. The first
receiving portion is in contact with the upper surface. The first body
extends through the fin module in a first direction. The second heat pipe
includes a second connection portion having a first end connected to a
second receiving portion and a second end connected to a second body. The
second receiving portion is in contact with the upper surface. The second
body extends through the fin module in a second direction substantially
opposite to the first direction.

Claims:

1. A heat sink apparatus, comprising: a fin module, the fin module
comprises a plurality of fins; a base, the base comprises an upper
surface and a lower surface, the lower surface is adapted to be in
contact with a heat generating element; a first heat pipe, the first heat
pipe comprises a first connection portion having a first end and a second
end, the first end is connected to a first receiving portion, the second
end is connected to a first body, and wherein the first receiving portion
is in contact with the upper surface of the base, the first body extends
through the fin module in a first direction for delivering heat generated
by the heat generating element to the plurality of fins; and a second
heat pipe, the second heat pipe comprises a second connection portion
having a first end and a second end, the first end of the second
connection portion is connected to a second receiving portion, the second
end of the second connection portion is connected to a second body, and
wherein the second receiving portion is in contact with the upper surface
of the base, the second body extends through the fin module in a second
direction substantially opposite to the first direction for delivering
heat generated by the heat generating element to the plurality of fins.

2. The heat sink apparatus of claim 1, wherein the first connecting
portion and the second connecting portion are placed on opposite side
walls which are outside of the fin module.

3. The heat sink apparatus of claim 2, wherein a distance, measured on a
plane perpendicular to the upper surface of the base, between the first
body and the second body is greater than a distance, measured on the
plane, between the first receiving portion and the second receiving
portion.

4. The heat sink apparatus of claim 1, wherein the first receiving
portion, the first connecting portion, and the first body are on a first
plane.

5. The heat sink apparatus of claim 4, wherein the second receiving
portion, the second connecting portion, and the second body are on a
second plane; and an angle less than 90 degrees is defined between the
first plane and the second plane.

6. The heat sink apparatus of claim 5, wherein the second heat pipe has a
U-shaped cross-section, taken along the second plane.

7. The heat sink apparatus of claim 1, wherein the base defines a first
slot recessed from the upper surface of the base; the fin module defines
a first association slot recessed from a surface of the fin module,
wherein the first slot and the first association slot form a first space,
and the first receiving portion is received in the first space.

8. The heat sink apparatus of claim 7, wherein the base defines a second
slot recessed from the upper surface of the base, the second slot is
substantially parallel to the first slot; the fin module defines a second
association slot recessed from the surface of the fin module, wherein the
second slot and the second association slot form a second space, and the
second receiving portion is received in the second space.

9. The heat sink apparatus of claim 1, wherein each of the plurality of
fins is substantially perpendicular to the base.

10. A heat sink apparatus, comprising: a fin module, the fin module
comprising a plurality of fins, the plurality of fins are substantially
parallel to each other; a base, the base is adapted to be in contact with
a heat generating element, the base is substantially perpendicular to the
plurality of fins; a first heat pipe, the first heat pipe comprises a
first connection portion having a first end and a second end, the first
end is connected to a first receiving portion, the second end is
connected to a first body, and wherein the first receiving portion is in
contact between the fin module and the base, the first body extends
through the fin module in a first direction substantially perpendicular
to the plurality of fins for delivering heat generated by the heat
generating element to the plurality of fins; and a second heat pipe, the
second heat pipe comprises a second connection portion having a first end
and a second end, the first end of the second connection portion is
connected to a second receiving portion, the second end of the second
connection portion is connected to a second body, and wherein the second
receiving portion is in contact between the fin module and the base, the
second body extends through the fin module in a second direction
substantially opposite to the first direction to deliver heat generated
by the heat generating element to the plurality of fins.

11. The heat sink apparatus of claim 10, wherein the first connecting
portion and the second connecting portion are placed on opposite side
walls which are outside of the fin module.

12. The heat sink apparatus of claim 11, wherein a distance, measured on
a plane perpendicular to the upper surface of the base, between the first
body and the second body is greater than a distance, measured on the
plane, between the first receiving portion and the second receiving
portion.

13. The heat sink apparatus of claim 10, wherein the first receiving
portion, the first connecting portion, and the first body are on a first
plane.

14. The heat sink apparatus of claim 13, wherein the second receiving
portion, the second connecting portion, and the second body are on a
second plane; and an angle less than 90 degrees is defined between the
first plane and the second plane.

15. The heat sink apparatus of claim 14, wherein the second heat pipe has
a U-shaped cross-section, taken along the second plane.

16. The heat sink apparatus of claim 10, wherein the base defines a first
slot recessed from the base; the fin module defines a first association
slot recessed from the fin module communicating with the first slot,
wherein the first slot and the first association slot form a first space;
and the first receiving portion is received in the first space.

17. The heat sink apparatus of claim 16, wherein the base defines a
second slot recessed from the base, the second slot is substantially
parallel to the first slot; the fin module defines a second association
slot recessed from the fin module communicating with the second slot, the
second slot and the second association slot form a second space; and the
second receiving portion is received in the second space.

18. The heat sink apparatus of claim 10, wherein each of the plurality of
fins is substantially perpendicular to the base.

Description:

BACKGROUND

[0001] 1. Technical Field

[0002] The disclosure generally relates to a heat sink apparatus with heat
pipes.

[0003] 2. Description of Related Art

[0004] Electronic components in computers, such as central processing
units (CPUs), may generate a lot of heat during normal operations. Excess
heat may deteriorate the operational stability of the electronic
components and may damage the electronic components. Thus, excess heat
must be removed quickly to maintain an acceptable operating temperature
of the CPUs and other electronic components in the computers. One known
method for removing heat from the CPU is by mounting a heat sink
apparatus on the CPU. Such heat sink apparatus may include a heat sink
and a plurality of heat pipes mounted on the heat sink. However, the heat
pipes may easily come into contact other electronic elements in the
computer which may cause undesirable effects on the other electronic
elements.

[0005] Thus, there is room for improvement within the art.

BRIEF DESCRIPTION OF THE DRAWINGS

[0006] FIG. 1 is an exploded, isometric view of an embodiment of a heat
sink apparatus according to present disclosure.

[0007] FIG. 2 is another view of the heat sink apparatus of FIG. 1.

[0008] FIG. 3 is an assembled view of FIG. 1.

DETAILED DESCRIPTION

[0009] The disclosure is illustrated by way of example and not by way of
limitation in the figures of the accompanying drawings in which like
references indicate similar elements. It should be noted that references
to "an" or "one" embodiment in this disclosure are not necessarily to the
same embodiment, and such references mean at least one.

[0010] Referring to FIGS. 1 and 2, one embodiment of a heat sink is shown.
The heat sink may include a base 10, a fin module 20, a first heat pipe
30, and a second heat pipe 40.

[0011] The first heat pipe 30 may include a first receiving portion 301, a
first body 302, and a first connecting portion 303. The first connection
portion 303 has a first end connected to the first receiving portion 301,
and a second end connected to the first body 302. The first receiving
portion 301 is in contact with an upper surface of the base 10 to carry
the excess heat away from a heat generating element. The first body 302
extends through the fin module 20 to deliver the excess heat to the fin
module 20 for dispersion. The first receiving portion 301, the first body
302, and the first connecting portion 303 may be on a first plane. The
first heat pipe 30 may has a U-shaped cross-section, taken along the
first plane.

[0012] The second heat pipe 40 may include a second receiving portion 401,
a second body 402, and a second connecting portion 403. The second
connection portion 403 has a first end connected to the second receiving
portion 401, and a second end connected to the second body 402. The
second receiving portion 401 is in contact with the upper surface of the
base 10 to carry the excess heat away from a heat generating element. The
second body 402 extends though the fin module 20 to deliver the excess
heat to the fin module 20 for dispersion. The second receiving portion
401, the second body 402, and the second connecting portion 403 may be on
a second plane. The second heat pipe 40 may has a U-shaped cross-section,
taken along the second plane.

[0013] A lower surface of the base 10 may be used for contacting the heat
generating element, such as a CPU. The upper surface of the base 10 may
comprises a first slot 101 and a second slot 102. The first slot 101 and
the second slot 102 may have U-shaped cross-sections, taken along a plane
substantially perpendicular to the upper surface of the base 10. The
first slot 101 may be substantially parallel to the second slot 102.

[0014] The fin module 20 includes a plurality of fins 201. Each of the
plurality of fins 201 is substantially perpendicular to the base 10. The
fin module 20 may further comprise a first through hole 202 and a second
through hole 203. A distance, measured on a plane perpendicular to the
upper surface of the base 10, between the first through hole 202 and the
second through hole 203 is greater than that between the first slot 101
and the second slot 102. The fin module 20 may further comprise a first
association slot 204 and a second association slot 205, wherein the first
association slot 204 and the second association slot 205 are relatively
located to match the first slot 101 and the second slot 102,
respectively. The first association slot 204 and the second association
slot 205 may have U-shaped cross-sections, taken along a plane
substantially perpendicular to the upper surface of the base 10.

[0015] Referring to FIG. 3, in assembly, the fin module 20 is placed on
the base 10 with the first association slot 204 and the second
association slot 205 aligned with the first slot 101 and the second slot
102, respectively. The first slot 101 and the first association slot 204
form a first space 103. The second slot 102 and the second association
slot 205 form a second space 104. The first receiving portion 301 of the
first heat pipe 30 is inserted into the first space 103, and the first
body 302 is inserted into the first through hole 202 in a first
direction. The second receiving portion 401 of the second heat pipe 40 is
inserted into the second space 104, and the second body 402 is inserted
into the second through hole 203 in a second direction. The first
direction is substantially opposite to the second direction. An angle
between the first plane of the first heat pipe 30 and the second plane of
the second heat pipe 40 may be less than 90 degrees. The first connecting
portion 303 of the first heat pipe 30 and the second connecting portion
403 are disposed on opposite side walls of the fin module 20. The first
body 302 and the second body 402 are substantially perpendicular to the
plurality of fins 201.

[0016] It is to be understood, however, that even though numerous
characteristics and advantages have been set forth in the foregoing
description of embodiments, together with details of the structures and
functions of the embodiments, the disclosure is illustrative only, and
changes may be made in detail, especially in the matters of shape, size,
and arrangement of parts within the principles of the disclosure to the
full extent indicated by the broad general meaning of the terms in which
the appended claims are expressed.