Resistive thermal evaporation is perhaps the simplest form of PVD. It normally uses a resistive heat source to evaporate a source material within a chamber. The evaporated material rises in the chamber via thermal energy, ultimately coating a substrate with a thin film. This process can be used for metals or nonmetals and is a good choice for electrical contacts.

WHY USE VACUUM METALLIZING:

Cost effective way to create thin films of metals or nonmetals with lower melting temperatures