Abstract:

A method according to one embodiment includes ion milling at a first angle
of greater than about 25 degrees from normal relative to a media facing
side of a thin film region of a magnetic head or component thereof for
recessing the thin film region at about a constant rate for films of
interest of the thin film region, planes of deposition of the films being
oriented about perpendicular to the media facing side; and ion milling or
plasma sputtering at a second angle of less than about 25 degrees from
normal relative to the media facing side of the thin film region for
recessing magnetic films therein faster than insulating films therein,
the second angle being smaller than the first angle.

Claims:

1. A method, comprising:ion milling at a first angle of greater than about
25 degrees from normal relative to a media facing side of a thin film
region of a magnetic head or component thereof for recessing the thin
film region at about a constant rate for films of interest of the thin
film region, planes of deposition of the films being oriented about
perpendicular to the media facing side; andion milling or plasma
sputtering at a second angle of less than about 25 degrees from normal
relative to the media facing side of the thin film region for recessing
magnetic films therein faster than insulating films therein, the second
angle being smaller than the first angle.

2. The method of claim 1, wherein the thin films reside in a gap between a
substrate and a closure, the substrate and closure forming portions of a
tape bearing surface.

3. The method of claim 1, wherein the first angle is between about 50
degrees and about 70 degrees.

4. The method of claim 1, wherein the second angle is between about 0
degrees and about 25 degrees.

5. The method of claim 1, wherein at least some of the magnetic films form
write poles.

6. The method of claim 1, wherein at least some of the magnetic films form
reader shields.

7. The method of claim 1, wherein the milling or sputtering is performed
continuously and repeatedly in both directions between the first and
second angles.

8. The method of claim 1, wherein the milling or sputtering is performed
in alternating fashion in the first and second angles.

9. The method of claim 1, wherein the milling at the first angle is
performed before the milling or sputtering at the second angle.

10. The method of claim 9, wherein the milling or sputtering is
continuously performed during a transition from the first angle to the
second angle.

11. The method of claim 1, wherein the milling or sputtering at the second
angle is performed before the milling at the first angle.

12. The method of claim 11, wherein the milling or sputtering is
continuously performed during a transition from the second angle to the
first angle.

13. The method of claim 1, further comprising adding a protective coating
to the media facing side of the thin film region.

14. The method of claim 13, wherein the protective coating above the thin
film region does not extend to a plane extending along a media facing
side of a substrate on which the films are formed.

15. The method of claim 13, wherein the protective coating above the thin
film region extends to a plane extending along a media facing side of a
substrate on which the films are formed.

16. A method, comprising:ion milling at a first angle of between about 25
degrees and about 70 degrees from normal relative to a media facing side
of a thin film region of a magnetic head or component thereof positioned
between a substrate and a closure for recessing the thin film region at
about a constant rate for all films of the thin film region, planes of
deposition of the films being oriented about perpendicular to the media
facing side; andion milling or plasma sputtering at a second angle of
between about 0 and about 25 degrees from normal relative to the media
facing side of the thin film region for recessing magnetic films therein
faster than insulating films therein.

17. A structure, comprising:a substrate having a media facing side; anda
thin film stack formed on the substrate, the thin film stack including
magnetic films and insulating films,wherein the thin film stack is
recessed from a plane extending along the media facing side of the
substrate,wherein the magnetic films are recessed more than the
insulating films,wherein the magnetic films each have a substantially
flat media facing surface,wherein the insulating films each have a
substantially flat media facing surface.

18. The structure of claim 17, wherein milling atoms are not embedded in
the magnetic or transducing films other than those present immediately
after formation of the thin film stack.

19. The structure of claim 17, further comprising a closure coupled to the
thin film stack opposite the substrate, the substrate and closure forming
portions of a tape bearing surface.

20. The structure of claim 17, further comprising a protective coating
over a media facing side of the thin film stack.

Description:

[0002]In magnetic storage systems, data is read from and written onto
magnetic recording media utilizing magnetic transducers commonly. Data is
written onto the magnetic recording media by moving a magnetic recording
transducer to a position over the media where the data is to be stored.
The magnetic recording transducer then generates a magnetic field, which
encodes the data into the magnetic media. Data is read from the media by
similarly positioning the magnetic read transducer and then sensing the
magnetic field of the magnetic media. Read and write operations may be
independently synchronized with the movement of the media to ensure that
the data can be read from and written to the desired location on the
media.

[0003]An important and continuing goal in the data storage industry is
that of increasing the density of data stored on a medium. For tape
storage systems, that goal has lead to increasing the track density on
recording tape, and decreasing the thickness of the magnetic tape medium.
However, the development of small footprint, higher performance tape
drive systems has created various problems in the design of a tape head
assembly for use in such systems.

[0004]In a tape drive system, magnetic tape is moved over the surface of
the tape head at high speed. This movement generally entrains a film of
air between the head and tape. Usually the tape head is designed for
minimizing the spacing between the head and the tape. The spacing between
the magnetic head and the magnetic tape is crucial so that the recording
gaps of the write transducers, which are the source of the magnetic
recording flux, ideally contact the tape to effect efficient signal
transfer, and so that the read elements ideally contact the tape to
provide effective coupling of the magnetic field from the tape to the
read element.

[0005]One particular problem which may be encountered when tape is moved
over the surface of the tape recording head is the tape induced bridging
of metallic portions of the thin films across the top portions of the
films. As a result, thin films which are to be insulated from each other
may actually come into electrical contact with each other, which in time
may result in shorting and failure of the head. This effect can be seen
in FIG. 2D, and will be explained in more detail later. Therefore, it
would be favorable to have a technique of selectively altering the
surface heights of thin films, allowing an insulator to have a higher
surface height than surrounding poles or shields, to minimize this
bridging effect.

[0006]Additionally, the thin entire film region may be recessed from the
surrounding components, such as the substrate and closure, so that the
tape will rarely come into contact with the head components in the thin
film region. One method to recess the thin film region is plasma etching,
such as argon plasma etching. However, as is well known, an argon plasma
etches nickel iron alloys and some other metals commonly used in magnetic
heads much more rapidly than the surrounding insulators. Thus, while
plasma etching may produce an overall recession for all materials in the
gap, the amount of etching required to produce the desired overall
recession may produce excessive magnetic pole, sensor, and shield
recession, and thus lead to excessive spacing loss.

[0007]What is needed is a method to produce overall recession without
excessive metal recession.

SUMMARY

[0008]A method according to one embodiment includes ion milling at a first
angle of greater than about 25 degrees from normal relative to a media
facing side of a thin film region of a magnetic head or component thereof
for recessing the thin film region at about a constant rate for films of
interest of the thin film region, planes of deposition of the films being
oriented about perpendicular to the media facing side; and ion milling or
plasma sputtering at a second angle of less than about 25 degrees from
normal relative to the media facing side of the thin film region for
recessing magnetic films therein faster than insulating films therein,
the second angle being smaller than the first angle.

[0009]A method according to another embodiment includes ion milling at a
first angle of between about 25 degrees and about 70 degrees from normal
relative to a media facing side of a thin film region of a magnetic head
or component thereof positioned between a substrate and a closure for
recessing the thin film region at about a constant rate for all films of
the thin film region, planes of deposition of the films being oriented
about perpendicular to the media facing side; and ion milling or plasma
sputtering at a second angle of between about 0 and about 25 degrees from
normal relative to the media facing side of the thin film region for
recessing magnetic films therein faster than insulating films therein.

[0010]A structure according to one embodiment includes a substrate having
a media facing side; and a thin film stack formed on the substrate, the
thin film stack including magnetic films and insulating films, wherein
the thin film stack is recessed from a plane extending along the media
facing side of the substrate, wherein the magnetic films are recessed
more than the insulating films, wherein the magnetic films each have a
substantially flat media facing surface, wherein the insulating films
each have a substantially flat media facing surface.

[0011]Any of these embodiments may be implemented in a magnetic data
storage system such as a tape drive system, which may include a magnetic
head as recited above, a drive mechanism for passing a magnetic medium
(e.g., recording tape) over the magnetic head, and a controller
electrically coupled to the magnetic head.

[0012]Other aspects and embodiments of the present invention will become
apparent from the following detailed description, which, when taken in
conjunction with the drawings, illustrate by way of example the
principles of the invention.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

[0013]FIG. 1 is a schematic diagram of a simplified tape drive system
according to one embodiment.

[0014]FIG. 2 illustrates a side view of a flat-lapped, bi-directional,
two-module magnetic tape head according to one embodiment.

[0015]FIG. 2A is a tape bearing surface view taken from Line 2A of FIG. 2.

[0017]FIG. 2c is a detailed view of a partial tape bearing surface of a
pair of modules.

[0018]FIG. 2D is a schematic diagram of the bridging effect that can occur
to magnetic heads.

[0019]FIG. 2E is a schematic diagram showing an overetching effect that
can result from plasma etching on thin film regions.

[0020]FIG. 3A is a schematic diagram of ion milling at a first angle on a
thin film region according to one embodiment.

[0021]FIG. 3B is a schematic diagram of ion milling at a second angle on a
thin film region according to one embodiment.

[0022]FIG. 3c is a schematic diagram of the result of ion milling at a
first and second angle on a thin film region according to one embodiment.

[0023]FIG. 3D is a schematic diagram of a thin film region after ion
milling at a first and second angle including a protective coating
according to one embodiment.

DETAILED DESCRIPTION

[0024]The following description is made for the purpose of illustrating
the general principles of the present invention and is not meant to limit
the inventive concepts claimed herein. Further, particular features
described herein can be used in combination with other described features
in each of the various possible combinations and permutations.

[0025]Unless otherwise specifically defined herein, all terms are to be
given their broadest possible interpretation including meanings implied
from the specification as well as meanings understood by those skilled in
the art and/or as defined in dictionaries, treatises, etc.

[0026]It must also be noted that, as used in the specification and the
appended claims, the singular forms "a," "an" and "the" include plural
referents unless otherwise specified.

[0027]A method according to one general embodiment includes ion milling at
a first angle of greater than about 25 degrees from normal relative to a
media facing side of a thin film region of a magnetic head or component
thereof for recessing the thin film region at about a constant rate for
films of interest of the thin film region, planes of deposition of the
films being oriented about perpendicular to the media facing side; and
ion milling or plasma sputtering at a second angle of less than about 25
degrees from normal relative to the media facing side of the thin film
region for recessing magnetic films therein faster than insulating films
therein, the second angle being smaller than the first angle.

[0028]A method according to another general embodiment includes ion
milling at a first angle of between about 25 degrees and about 70 degrees
from normal relative to a media facing side of a thin film region of a
magnetic head or component thereof positioned between a substrate and a
closure for recessing the thin film region at about a constant rate for
all films of the thin film region, planes of deposition of the films
being oriented about perpendicular to the media facing side; and ion
milling or plasma sputtering at a second angle of between about 0 and
about 25 degrees from normal relative to the media facing side of the
thin film region for recessing magnetic films therein faster than
insulating films therein.

[0029]A structure according to one general embodiment includes a substrate
having a media facing side; and a thin film stack formed on the
substrate, the thin film stack including magnetic films and insulating
films, wherein the thin film stack is recessed from a plane extending
along the media facing side of the substrate, wherein the magnetic films
are recessed more than the insulating films, wherein the magnetic films
each have a substantially flat media facing surface, wherein the
insulating films each have a substantially flat media facing surface.

[0030]FIG. 1 illustrates a simplified tape drive 100 of a tape-based data
storage system, which may be employed in the context of the present
invention. While one specific implementation of a tape drive is shown in
FIG. 1, it should be noted that the embodiments described herein may be
implemented in the context of any type of tape drive system.

[0031]As shown, a tape supply cartridge 120 and a take-up reel 121 are
provided to support a tape 122. One or more of the reels may form part of
a removable cassette and are not necessarily part of the system 100. The
tape drive, such as that illustrated in FIG. 1, may further include drive
motor(s) to drive the tape supply cartridge 120 and the take-up reel 121
to move the tape 122 over a tape head 126 of any type.

[0032]Guides 125 guide the tape 122 across the tape head 126. Such tape
head 126 is in turn coupled to a controller assembly 128 via a cable 130.
The controller 128 typically controls head functions such as servo
following, writing, reading, etc. The cable 130 may include read/write
circuits to transmit data to the head 126 to be recorded on the tape 122
and to receive data read by the head 126 from the tape 122. An actuator
132 controls position of the head 126 relative to the tape 122.

[0033]An interface may also be provided for communication between the tape
drive and a host (integral or external) to send and receive the data and
for controlling the operation of the tape drive and communicating the
status of the tape drive to the host, all as will be understood by those
of skill in the art.

[0034]By way of example, FIG. 2 illustrates a side view of a flat-lapped,
bidirectional, two-module magnetic tape head 200 which may be implemented
in the context of the present invention. As shown, the head includes a
pair of bases 202, each equipped with a module 204, and fixed at a small
angle α with respect to each other. The bases are typically
"U-beams" that are adhesively coupled together. Each module 204 includes
a substrate 204A and a closure 204B with a gap 206 comprising readers
and/or writers situated therebetween. In use, a tape 208 is moved over
the modules 204 along a media (tape) bearing surface 209 in the manner
shown for reading and writing data on the tape 208 using the readers and
writers. The wrap angle θ of the tape 208 at edges going onto and
exiting the flat media support surfaces 209 are usually between 1/8
degree and 41/2 degrees.

[0035]The substrates 204A are typically constructed of a wear resistant
material, such as a ceramic. The closures 204B made of the same or
similar ceramic as the substrates 204A.

[0036]The readers and writers may be arranged in a piggyback
configuration. The readers and writers may also be arranged in an
interleaved configuration. Alternatively, each array of channels may be
readers or writers only. Any of these arrays may contain one or more
servo readers.

[0037]FIG. 2A illustrates the tape bearing surface 209 of one of the
modules 204 taken from Line 2A of FIG. 2. A representative tape 208 is
shown in dashed lines. The module 204 is preferably long enough to be
able to support the tape as the head steps between data bands.

[0038]In this example, the tape 208 includes 4-22 data bands, e.g., with
16 data bands and 17 servo tracks 210, as shown in FIG. 2A on a one-half
inch wide tape 208. The data bands are defined between servo tracks 210.
Each data band may include a number of data tracks, for example 96 data
tracks (not shown). During read/write operations, the elements 206 are
positioned within one of the data bands. Outer readers, sometimes called
servo readers, read the servo tracks 210. The servo signals are in turn
used to keep the elements 206 aligned with a particular track during the
read/write operations.

[0039]FIG. 2B depicts a plurality of read and/or write elements 206 formed
in a gap 218 on the module 204 in Circle 2B of FIG. 2A. As shown, the
array of elements 206 includes, for example, 16 writers 214, 16 readers
216 and two servo readers 212, though the number of elements may vary.
Illustrative embodiments include 8, 16, 32, and 64 elements per array
206. A preferred embodiment includes 32 readers per array and/or 32
writers per array. This allows the tape to travel more slowly, thereby
reducing speed-induced tracking and mechanical difficulties. While the
readers and writers may be arranged in a piggyback configuration as shown
in FIG. 2B, the readers 216 and writers 214 may also be arranged in an
interleaved configuration. Alternatively, each array of elements 206 may
be readers or writers only, and the arrays may contain one or more servo
readers 212. As noted by considering FIGS. 2 and 2A-B together, each
module 204 may include a complementary set of elements 206 for such
things as bidirectional reading and writing, read-while-write capability,
backward compatibility, etc.

[0040]FIG. 2c shows a partial tape bearing surface view of complimentary
modules of a magnetic tape head 200 according to one embodiment. In this
embodiment, each module has a plurality of read/write (R/W) pairs in a
piggyback configuration formed on a common substrate 204A and an optional
electrically insulative layer 236. The writers, exemplified by the write
head 214 and the readers, exemplified by the read head 216, are aligned
parallel to a direction of travel of a tape medium thereacross to form an
R/W pair, exemplified by the R/W pair 222.

[0041]Several R/W pairs 222 may be present, such as 8, 16, 32 pairs, etc.
The R/W pairs 222 as shown are linearly aligned in a direction generally
perpendicular to a direction of tape travel thereacross. However, the
pairs may also be aligned diagonally, etc. Servo readers 212 are
positioned on the outside of the array of R/W pairs, the function of
which is well known.

[0042]Generally, the magnetic tape medium moves in forward and reverse
directions as indicated by arrow 220. The magnetic tape medium and head
assembly 200 operate in a transducing relationship in the manner
well-known in the art. The piggybacked MR head assembly 200 includes two
thin-film modules 224 and 226 of generally identical construction.

[0043]Modules 224 and 226 are joined together with a space present between
closures 204B thereof (partially shown) to form a single physical unit to
provide read-while-write capability by activating the writer of the
leading module and reader of the trailing module aligned with the writer
of the leading module parallel to the direction of tape travel relative
thereto. When a module 224, 226 of a piggyback head 200 is constructed,
layers are formed in the gap 218 created above an electrically conductive
substrate 204A (partially shown), e.g., of AlTiC, in generally the
following order for the R/W pairs 222: an insulating layer 236, a first
shield 232 typically of an iron alloy such as NiFe (permalloy), CZT or
Al--Fe--Si (Sendust), a sensor 234 for sensing a data track on a magnetic
medium, a second shield 238 typically of a nickel-iron alloy (e.g., 80/20
Permalloy), first and second writer pole tips 228, 230, and a coil (not
shown).

[0044]The first and second writer poles 228, 230 may be fabricated from
high magnetic moment materials such as 45/55 NiFe. Note that these
materials are provided by way of example only, and other materials may be
used. Additional layers such as insulation between the shields and/or
pole tips and an insulation layer surrounding the sensor may be present.
Illustrative materials for the insulation include alumina and other
oxides, insulative polymers, etc.

[0045]Now referring to FIG. 2D, a common problem associated with magnetic
read heads is bridging where portions of materials form surface bridges
between the read sensor films and the shields. In FIG. 2D, this effect is
shown in relation to either poles or shields 244, which are typically
separated by an insulator 242 of some type. Motion of the tape 208 across
the surface of the head may assist in formation of conductive bridges,
and if enough material bridges across the surface of the insulator 242,
an electrical connection 240 may form between the read sensor and the
shields 244, which can result in shorting and head failure, rendering the
device inoperable. In order to correct this problem, it is generally
preferable to have the shields or poles 244 recessed to a height less
than the insulators 242, thereby rendering it less likely for material to
form an electrical connection 240 across the insulators 242.

[0046]Bridging may involve, for example, migration of metallic films on
the head surface or may involve more complex processes such as
electrochemical formation or media deposition or interactions.

[0047]Referring to FIG. 2E, a method for minimizing the bridging effect is
to recess the entire thin film region 248 of a magnetic head through
plasma etching 246. However, argon plasma etching 246 may be overly
selective of the poles and shield portions of the thin film region 248,
resulting in a loss of signal amplitude, symmetry, or resolution. To
overcome this problem, a more uniform etching or milling method is needed
for producing a recessed thin film region 248 without overetching the
pies and shields.

[0048]Now referring to FIGS. 3A-3D, a method according to one embodiment
is shown. In FIG. 3A, a substrate 204A and a closure 204B may form
portions of an air bearing surface (ABS) or a tape bearing surface (TBS),
and may further define a thin film region 300 which may include multiple
thin films which may reside in a gap, such as gap 206 shown in FIG. 2B.
For illustrative purposes, several of these thin films are identified in
FIGS. 3A-3D and the thin films are shown in relation to a gap between a
substrate 204A and a closure 204B. Moving from the substrate 204A toward
the closure 204B, a first thin film may be the undercoat insulation 306,
then a first shield 308 which should be insulated from a sensor structure
312 by any number of thin films 310, 314, including at least one
insulator. Next, an insulator 318 may separate the second shield 316 from
a first pole 320. Next, another insulator 322, often forming the write
transducer gap, may separate the first pole 320 from a second pole 324 in
the gap region. An overcoat insulator 326 may be next, followed by a
bondline 328 near the closure 204B. There may also be other thin films
and the overall design and ordering of these thin films is for
illustrative purposes only, and in no way should limit the invention, nor
should the inclusion of the substrate 204A and closure 204B in this
description.

[0049]Referring to FIG. 3B, a method, according to one embodiment,
comprises ion milling the structure shown in FIG. 3A at a first angle
φ of greater than about 25° from normal 330 relative to a
media facing side 332, sometimes referred to as the air bearing surface
(ABS) or tape bearing surface (TBS), of a thin film region 300 of a
magnetic head or component thereof for recessing the thin film region 300
at about a constant rate for the films of interest (e.g., the magnetic
and transducing films (including films that may be both magnetic and
transducing) such as the write poles 320, 324 and magnetic and possibly
other portions of the sensor 312; the shields 308, 316; and insulating
layers adjacent to the magnetic and transducing films) of the thin film
region 300, planes of deposition of the films being oriented about
perpendicular to the media facing side 332. Note that some films may etch
at a different rate than the films of interest. For example, the leads
(not shown) tend to etch more slowly than other layers when milled at the
first angle. Note also that the structure being milled is typically
rotated relative to the ion source, or vice versa, during the milling.

[0050]The methodology described herein may also be applied to heads having
films at an angle of less than 90° to the tape bearing surface.

[0051]In particularly preferred embodiments, the first angle φ may be
greater than about 50°, between about 50° and about
70°, ideally about 60°. Ion milling at about 60° is
relatively non-selective, and thus most gap materials tend to etch at
approximately the same rate.

[0052]With continued reference to FIG. 3B, the result of ion milling at
the first angle φ according to one embodiment is shown, as the thin
film region 300 has been recessed from the media facing side 332 by a
distance β. The distance β may be adjusted depending on the
particular effect desired by the method. Note that some of the metallic
layers, e.g., the first shield 308, portions of the read sensor 312,
second shield 316, first pole 320, and/or second pole 324 may protrude
slightly from the overall plane of the media facing surface.

[0053]Referring to FIG. 3c, the method may further comprise ion milling or
plasma sputtering at a second angle ψ of less than about 25°
(and preferably greater than 0°) from normal 330 relative to the
media facing side 332 of the thin film region 300 for recessing magnetic
films, such as iron-containing films, and potentially other metallic
alloy-containing films, therein faster than insulating films therein. For
example, this ion milling at a second angle ψ could be used to recess
the first shield 308, read sensor 312, second shield 316, first pole 320,
and/or second pole 324 faster than the insulating layers (e.g., 318, 322,
etc.) therebetween are recessed.

[0054]In other embodiments, the second angle ψ may be between about
0° and about 25°, preferably about 5° to about
15°, ideally about 15°.

[0055]With continued reference to FIG. 3c, the result of ion milling at
the second angle ψ according to one embodiment is shown, as the
magnetic films have been recessed by a distance ε more than the
insulating layers. The distance ε may be adjusted depending on
the desired effect of the method. The magnetic films were recessed faster
than the insulating films, resulting in more material being removed in
the same amount of exposure time to the ion milling. By leaving the
insulating films exposed above the upper surface of the magentic films,
conductive bridging between the films should be substantially reduced or
eliminated since the insulating layers should make it more difficult for
material from recessed films to form electrical connections between the
recessed films.

[0056]Now referring to FIG. 3D, an optional step according to one
embodiment is shown, where a protective coating 334 may be formed above
the media facing side 332 of the thin film region 300. This protective
coating 334 may also be applied to the media facing side 332 of the
substrate 204A and closure 204B. In addition, this protective coating 334
above the thin film region 300 may not be so thick as to extend to a
plane extending along a media facing side 332 of a substrate on which the
films are formed, as shown in FIG. 3D. In another approach, this
protective coating 334 may extend to a plane extending along a media
facing side 332 of a substrate on which the films are formed. For
example, the depth of the protective coating 334 may be such that the
coating fills the distance between the upper surface of the thin film
region 300 and the upper surface of the substrate 204A and closure 204B,
or to an additional height as determined by the protective coating 334
thickness on the upper surface of the substrate 204A and closure 204B.

[0057]In other embodiments, at least some of the metallic films may form
write poles or reader shields or both write poles and reader shields.

[0058]In one embodiment, the ion milling at the first angle φ may be
performed before the ion milling and/or sputtering at the second angle
ψ. Further, the ion milling and/or sputtering may be continuously
performed as the ion milling angle is transitioned from the first angle
φ to the second angle ψ.

[0059]In another embodiment, the ion milling and/or sputtering at the
second angle ψ may be performed before the ion milling at the first
angle φ. Further, the ion milling and/or sputtering may be
continuously performed as the ion milling angle is transitioned from the
second angle ψ to the first angle φ.

[0060]Moreover, a combination of the foregoing continuous milling and/or
sputtering may be performed such that the milling and/or sputtering is
performed in both forward and backward angular directions. Further,
continuous loops of milling between the first and second angles may be
performed, thereby milling or sputtering continuously and repeatedly,
back and forth, between the first and second angles.

[0061]In other approaches, the milling or sputtering is preformed in
alternating fashion in the first and second angles. The number of
repetitions, and the processing time at each angle can be selected to
achieve the desired profile.

[0062]In further approaches, milling and/or sputtering may be performed at
additional angles, e.g., a third angle between the first and second
angles.

[0063]In various approaches, the target may be stationary, rotating, or a
combination of both.

[0064]Keeping in mind that definitions from above may apply to the
descriptions below, and with continued reference to FIGS. 3A-3D, another
method, according to one embodiment, comprises ion milling at a first
angle φ of between about 50° and about 70° from normal
330 relative to a media facing side 332 of a thin film region 300 of a
magnetic head or component thereof positioned between a substrate 204A
and a closure 204B for recessing the thin film region 300 at about a
constant rate for the films of interest of the thin film region 300,
planes of deposition of the films being oriented about perpendicular to
the media facing side 332; and ion milling at a second angle ψ of
between about 0° and about 25° from normal 330 relative to
the media facing side 332 of the thin film region 300 for recessing
metallic films (e.g., 308, 316, 320, etc.) therein faster than insulating
films (e.g., 306, 318, 326, etc.) therein.

[0065]With reference to FIG. 3D, a structure, according to one embodiment,
may comprise a substrate 204A having a media facing side 332 (which is
sometimes called an ABS or TBS); and a thin film stack 300 formed on the
substrate 204A, the thin film stack 300 including magnetic and other
alloy-containing films (e.g., 308, 316, 320, etc.) and insulating films
(e.g., 306, 318, 326, etc.), wherein the thin film stack 300 is recessed
from a plane extending along the media facing side 332 of the substrate
204A (e.g., by a distance β'), wherein the magentic films are
recessed more than the insulating films (e.g., by a distance ε),
wherein the magnetic films each have a substantially flat media facing
surface, wherein the insulating films each have a substantially flat
media facing surface.

[0066]In one embodiment, milling atoms are not embedded in the magnetic or
transducing films other than those present immediately after formation of
the thin film stack 300, as well as possible oxidation or corrosion
products.

[0067]It will be clear that the various features of the foregoing
methodologies may be combined in any way, creating a plurality of
combinations from the descriptions presented above.

[0068]While various embodiments have been described above, it should be
understood that they have been presented by way of example only, and not
limitation. Thus, the breadth and scope of a preferred embodiment should
not be limited by any of the above-described exemplary embodiments, but
should be defined only in accordance with the following claims and their
equivalents.