A photoresist is a light-sensitive
material used in several industrial processes, such as photolithography and photoengraving to form a patterned coating on a
surface.

Photoresists are classified into two
groups: positive resists and negative resists.

A positive resist is a type of
photoresist in which the portion of the photoresist that is exposed
to light becomes soluble to the photoresist developer. The portion
of the photoresist that is unexposed remains insoluble to the
photoresist developer.

Positive resist has the advantages of
high contrast, good step coverage, and high
aspect ratios.

A negative resist is a type of
photoresist in which the portion of the photoresist that is exposed
to light becomes insoluble to the photoresist developer. The
unexposed portion of the photoresist is dissolved by the photoresist
developer.

Photoresists are photosensitive
materials which after photoimaging and subsequent processing, resist
action of certain chemicals in desired areas.

AZ® 9200 thick film photoresist is
designed for the more demanding
higher-resolution thick resist require-ments. It provides high
resolution with
superior aspect ratios, as well as wide focus and exposure latitude
and good
sidewall profiles.

Lithography is an old art. The
dictionary starts by saying that it is the art of drawing pictures
on a stone usually covered with a greasy substance. After the
picture was drawn in the “grease” exposing the underlying stone, the
exposed area could be etched with acid to form a groove. This held
ink that could be transferred to paper.

Similar technology was used for
etchings based on metal plates. The image was hand drawn before the
acid etch was carried out. In the 1930s Kodak introduced a
photosensitive material that could be coated on a metal plate to
form an image upon exposure to visible light. The exposed regions
became insoluble and the unexposed areas could be removed with an
organic solvent. The material was called a Photoresist.

Photoresist materials are used in
several industrial processes, such as photolithography and
photoengraving to form a patterned coating on a surface.

A novel technique of photoresist
coating, Dynamic Surface Tension (DST) coating, is presented.
This
technique is particularly well suited for surfaces with pre-existing
topography, which is often the case in micro-electro-mechanical
systems (MEMS) and integrated circuits packaging.

MEMS fabrication process of devices,
there are three main
different photoresist coating techniques: spin coating,
electrodeposition (ED) coating, and spray coating.

Photoresists are typically three
component systems made up of a phenolic novolak resin, a photoactive
diazoquinone ester and a solvent.

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