Technical Information

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CCS Technology
Conventional foam pads absorb polish too quickly. This reduces polish and pad performance because most of the polish is trapped below the working surface of the pad. CCS Technology™ solves this common problem using strategic patterns of partially closed foam cells.Download File (1.73 Mb)

Cool Wave CCS
Get the Best of Two Superior Designs - We’ve combined the proven benefits of CCS Technology™ with a new “cool wave” profile. Cool Wave is a series of mini-waves or ripples over the entire face of the pad along with strategic patterns of CCS pockets.Download File (3.11 Mb)

D.A. Foam Pads
Designed for use with D.A. orbital sanders and polishers to remove surface defects without creating swirl marks. Constructed with an advanced bonding system developed in Germany, the Velcro® loop withstands increased friction heat created by the orbital action of these tools.Download File (124 Kb)

HD Orbital Pads
Cool running Dual Density allows pads to run cooler while used on a long stroke machineDownload File (334 Kb)

System 3000 / System 3000D Padwasher
System 3000D™ is the first self-contained
pad cleaning system that filters and recycles
cleaning solution to continuously reduce
polish contaminantsDownload File (2.43 Mb)