Intel to reveal more about tri-gate and ultrabooks at IDF

EE Times writes Intel is expected to reveal more details about its 22nm tri-gate 3D transistor technology as well as ultrabooks at the IDF this week:

In May, Intel initially described its 22-nm process technology, with a surprise twist—the long awaited 3-D transistor design, dubbed tri-gate, that Intel has been developing since at least 2002. This week, Intel is expected to provide more detail about its first 22-nm chips, based on the Ivy Bridge architecture, expected to be in high-volume production by the end of the year.

According to Steven Smith, a vice president and director of netbook and tablet development and enabling at Intel, the firm will provide more technical details on the 22-nm the microarchitecture and process technology, as well as further discussion of the end-consumer benefits of the technology, which promises the potential to reduce power consumption by more than 50 percent compared to Intel's 32-nm processors. Intel will also talk about what it sees as its competitive advantages as an integrated device maker vis-à-vis fabless and fab-lite competitors, Smith said.