Constellation ES.3 Internals

The Seagate Enterprise Capacity Constellation ES.3 comes in a standard 3.5" form factor. The components face into the body of the drive to facilitate heat transfer into the case, which acts as a large heat sink.

Removing the PCB reveals a foam padding, drive controller and drive motor controller components. We can observe the two metal squares on the bottom of the HDD case that transfer the heat from the thermal pads into the case of the HDD.

The Winbond chip is a 128MB DDR2 component for caching, a Smooth chip to control the drive motor, and a LSI drive controller.

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