Master Bond has developed FLM36, a high-temperature-resistant B-staged adhesive film suitable for bonding and sealing applications in the aerospace, electronic, optoelectronic and speciality OEM industries.

The film has release paper on each side. After the substrates to be bonded are properly prepared, the release paper is removed to expose the adhesive. It is carefully placed onto the part and pressure is applied.

The assembly is lightly fixtured and cured for one to two hours at 350°F. The bonded parts should be returned to 75°F before the fixtures are removed.