New Devices Offer Unmatched Flexibility in Combining Densities for
Variety of Applications

SAN JOSE, Calif. & TAICHUNG, Taiwan — (BUSINESS WIRE) — March 24, 2016 —
Winbond Electronics Corporation, a leading global supplier of
semiconductor memory solutions, today announced a dramatic expansion of
its flash product portfolio with the introduction of a family of
stackable SpiFlash® memories. The new SpiStack® W25M Series is Winbond’s
first to allow the “stacking” of homogeneous or heterogeneous flash,
thus achieving memories of varying densities for code and/or data
storage, while providing designers with the flash solutions most
appropriate for their design requirements.

The W25M Series provides a wide range of densities in the
well-established 8-pin package to which designers are accustomed.
Additionally, W25M memories feature the popular, multi-IO SpiFlash
interface and command set.

“Stacking memories, both homogeneously and heterogeneously, is a
revolutionary method of creating optimal memory solutions,” said Mike
Chen, director of technical marketing at Winbond Electronics Corporation
America. “Winbond developed the SpiStack architecture to give designers
maximum flexibility in tailoring flash solutions to meet their specific
memory-density and -application requirements.”

SpiStack homogeneous memories are achieved by stacking SpiFlash dies –
for example, two 256Mb dies combining to form a single SpiFlash 512Mb
NOR memory -- in the industry-standard 8-pin 8x6mm WSON package. This
stacked product, W25M512JV, is also available in the widely used 16-pin
SOIC or 24-pad BGA packages and is sampling now. SpiStack heterogeneous
memories call for the stacking of a NOR memory with a NAND die, such as
a 64Mb SpiFlash NOR blended with a 1Gb Serial NAND die, which gives
designers the flexibility to store code in the NOR die and data in the
NAND memory.

SpiStack highlights:

Multiple SpiFlash dies, each with density ranging from 16Mb to 2Gb,
can be stacked with any combination of NOR and NAND dies.

Each die can be used according to its specifically beneficial
characteristics. A NOR die can be used to store the boot code, thanks
to its cell characteristics that deliver better endurance and
retention, and fast random access time. A NAND memory can be used to
store data and/or to back up the boot code.

A NAND die can also be used to upload the working memory data quickly
whenever the system power goes down, thanks to its programming time
that’s much faster than NOR. It improves the system quality by storing
up-to-date code residing in the working memory for later usage.

SpiStack supports concurrent operation so that code execution is not
interrupted for data updates.

All SpiStack features are supported in an 8-pin package along with the
standard QSPI command, so that backward compatibility is conserved.
This is done with the addition of a simple software die select
instruction (C2h) and a factory-assigned die ID number. The dies are
stacked based on Winbond’s unique stacking process technology.

Winbond SpiStack flash memory solutions are sampling now and being
designed-in, and will be available in volume production starting
2Q’2016. For specific combination of densities required and for pricing
on these products, please contact Winbond at
SalesSupport@winbond.com.

About Winbond

Winbond Electronics Corporation is a leading global supplier of
semiconductor memory solutions, headquartered in Taichung, Taiwan.
Winbond’s major products include Specialty DRAM, Mobile DRAM, and Code
Storage Flash Memory with Winbond’s memory business revenues in 2015
close to US$1 billion. Winbond has approximately 2,400 employees
worldwide, with offices in Taiwan, Hong Kong, China, Japan, Israel, and
the USA. For more information, please visit:
www.winbond.com.

SpiFlash and SpiStack are registered trademarks of Winbond
Electronics Corporation.All other product names that appear in
this material are for identification purposes only and are acknowledged
trademarks or registered trademarks of their respective companies.