EVG®150 Automated Resist Processing System up to 300mm

Designed as a fully modular platform, the EVG150 allows automated spray/spin/develop processess and high-thoroughput performance. The EVG150 produces highly uniform coats and improves repeatability to suit these needs. Wafers with high topography can be uniformly coated by EVG’s OmniSpray® technology, where traditional spin coating encounters limitations.

Features

OmniSpray® (x/y or rotational spray coating)

Spinner modules for coating (spin) or developing

Bake modules

Chill modules

Cost effective system for optimized production

Sophisticated field-proven wafer handling by robot

System customized for best benefit, including tooling (chucks), handling(robot endeffector, pre-aligner) and modules