Foam Gasketing and Potting on a Miniature Scale

Micro Sealing of Electronic Components under ESD-Compliant Conditions

At a time of Industry 4.0 and self-driving cars, the amount of complex, highly sensitive electronics packed into ever smaller components is increasing. To protect these components from adverse environmental influences and ensure the longest possible, fault-free operation, they are gasketed, glued or potted. Specific procedures are stored for ESD-compliant contract manufacture of each different component.