Automatic Silicon Photonics Packaging Systems from ficonTEC

Created June 17, 2016

The recent technology of Silicon Photonics impressively shows the evolution the optics market is undergoing. From bulky components to integrated optics the photonic sector experiences what the electronics market did decades ago. The miniaturisation and integration is essential for state-of-the-art products.

As the component density and complexity of optical modules increase the need for automated packaging becomes more and more obvious. Furthermore the hybrid integration with semi-conductor electronics can only keep up with the growing demand when being automated.