Jairus Legaspi Pisigan, Singapore SG

Jairus Legaspi Pisigan, Singapore SG

Patent application number

Description

Published

20080303122

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADED PACKAGE - An integrated circuit package system includes: providing a frame; attaching a leaded package having leads adjacent the frame wherein the leads extend towards a side opposite the frame; and applying a package encapsulant over the leaded package having the leads partially exposed opposite the frame.

12-11-2008

20080303123

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFINGER - An integrated circuit package system includes: providing a lead terminal; forming a dummy lead near the lead terminal; positioning a base integrated circuit adjacent the lead terminal and the dummy lead; connecting a die connector to the base integrated circuit and the dummy lead; mounting a stackable integrated circuit over the base integrated circuit; and connecting another of the die connector to the stackable integrated circuit and the dummy lead.

12-11-2008

20080315380

INTEGRATED CIRCUIT PACKAGE SYSTEM HAVING PERIMETER PADDLE - An integrated circuit package system comprising: forming a paddle having a hole and an external interconnect; mounting an integrated circuit device having an active side to the paddle with the active side facing the paddle and the hole; connecting a first internal interconnect between the active side and the external interconnect through the hole; and encapsulating the integrated circuit device, the paddle, the first internal interconnect, and the external interconnect with the external interconnect partially exposed.

12-25-2008

20090008761

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH FLEX BUMP - An integrated circuit package system includes: forming a flex bump over an integrated circuit device structure, the flex bump having both a base portion and an offset portion over the base portion; forming a first ball bond of a first internal interconnect over the offset portion; and encapsulating the integrated circuit device structure, the flex bump, and the first internal interconnect.

01-08-2009

20090072364

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADS SEPARATED FROM A DIE PADDLE - An integrated circuit package system is provided including forming a leadframe having a frame and a die paddle having leads thereon. The leads are held with respect to the die paddle. The leads are separated from the die paddle, and a die is attached to the die paddle. Bond wires are bonded between the leads and the die. The die and bond wires are encapsulated. The leadframe is singulated to separate the frame and the die paddle.

03-19-2009

20090072412

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE ENCAPSULATION HAVING RECESS - An integrated circuit package system includes: forming an external interconnect; connecting an integrated circuit die and the external interconnect; forming a package encapsulation, having a recess, covering the integrated circuit die with a portion of the external interconnect exposed by the recess; and connecting an integrated circuit device and the external interconnect in the recess.

03-19-2009

20090085177

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH LEADFRAME ARRAY - An integrated circuit package system includes providing an integrated circuit die; attaching the integrated circuit die over a lead grid having lead blocks; and connecting a die interconnect to the integrated circuit die and the lead blocks.

04-02-2009

20090085178

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BASE STRUCTURE DEVICE - An integrated circuit packaging system including: forming a base structure, having an opening; mounting a base structure device in the opening; attaching an integrated circuit device over the base structure device; and molding an encapsulant on the base structure, the base structure device, and the integrated circuit device.

04-02-2009

20090085181

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH MULTIPLE DIE - An integrated circuit package system includes providing die; forming leads adjacent the die; forming a die paddle adjacent the leads with the die thereover; and forming a cavity for isolating one of the die and a die attach segment of the die paddle.

04-02-2009

20090115032

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH DUAL CONNECTIVITY - An integrated circuit package system includes: forming a lead having a both top contact portion and a bottom contact portion; connecting an integrated circuit die and the lead; and forming a package encapsulation, having a top side and a bottom side, over the integrated circuit die. The forming the package encapsulation includes partially exposing the top contact portion at the top side, and partially exposing the bottom contact portion along the bottom side with the bottom contact portion extending beyond a nonhorizontal portion of the package encapsulation.

05-07-2009

20090121335

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH PACKAGE INTEGRATION - An integrated circuit package system comprising: providing a substrate having a cavity; sealing a package over the cavity of the substrate; and forming an encapsulant over the package and a portion of the substrate substantially preventing the encapsulant from forming in the cavity.

05-14-2009

20090166845

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH EXTENDED CORNER LEADS - An integrated circuit package system including: forming a die pad, wherein the die pad has a tiebar at a corner; forming a lead wherein the lead is connected to the tiebar; connecting an integrated circuit die to the die pad; and forming an encapsulation, having an edge, over the integrated circuit die with the lead extending from and beyond the edge.

07-02-2009

20090243064

Method and Apparatus For a Package Having Multiple Stacked Die - A method of manufacturing a semiconductor package involves providing a substrate having a window. The substrate may include a leadframe having half-etched leads. First and second semiconductor devices are mounted to a top surface of the substrate on either side of the window using an adhesive. A third semiconductor device is mounted to the first and second semiconductor devices using an adhesive. The third semiconductor device is disposed over the window of the substrate. A wirebond or other electrical interconnect is formed between the third semiconductor device and a contact pad formed over a bottom surface of the substrate opposite the top surface of the substrate. The wirebond or other electrical interconnect passes through the window of the substrate. An encapsulant is deposited over the first, second, and third semiconductor devices.

10-01-2009

20100025830

A METHOD FOR FORMING AN ETCHED RECESS PACKAGE ON PACKAGE SYSTEM - An integrated circuit package system includes: providing a die attach paddle with interconnection pads connected to a bottom surface of the die attach paddle; connecting a first device to the interconnection pads with a bond wire; connecting a lead to the interconnection pad or to the first device; encapsulating the first device and the die attach paddle with an encapsulation having a top surface; and etching the die attach paddle leaving a recess in the top surface of the encapsulation.

02-04-2010

20100025834

FAN-IN INTERPOSER ON LEAD FRAME FOR AN INTEGRATED CIRCUIT PACKAGE ON PACKAGE SYSTEM - An integrated circuit package on package system includes: providing a lead having a wire-bonded die with a bond wire connected thereto; mounting a fan-in interposer over the wire-bonded die and the bond wire; connecting the fan-in interposer to the lead with the bond wires; and encapsulating the wire-bonded die, bond wires, and the fan-in interposer with an encapsulation leaving a portion of the fan-in interposer exposed.

02-04-2010

20100025836

MULTI-LAYER PACKAGE-ON-PACKAGE SYSTEM - A package-on-package system includes: providing a bottom package module incorporating a bottom package substrate; attaching a central internal stacking module, incorporating a central interposer, on top of the bottom package module; placing a spacer on the top surface of the central internal stacking module; mounting a first top package module, incorporating a first top interposer with an opening, on the spacer; and enclosing at least portions of the bottom package module, the central internal stacking module, and the first top package module with an encapsulant.

02-04-2010

20100038761

INTEGRATED CIRCUIT PACKAGE SYSTEM - An integrated circuit package system includes: mounting a first integrated circuit over a carrier; mounting an interposer, having an opening, over the first integrated circuit and the carrier with the interposer having an overhang over the carrier; connecting an internal interconnect, through the opening, between the carrier and the interposer; and forming an encapsulation over the first integrated circuit, the internal interconnect, and the carrier.

02-18-2010

20100072591

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH ANTI-PEEL PAD - An integrated circuit package system includes: forming an anti-peel pad having both a concave ring and an external terminal with the concave ring, having a peripheral wall, surrounding the external terminal; connecting an integrated circuit with the anti-peel pad; and forming an encapsulation over the integrated circuit, the concave ring, and the external terminal with the encapsulation under the peripheral wall.

03-25-2010

20100078831

INTEGRATED CIRCUIT PACKAGE SYSTEM WITH SINGULATION PROCESS - An integrated circuit package system includes: providing a die attach pad; forming a package contact pad adjacent the die attach pad; attaching an integrated circuit over the die attach pad; attaching a die connector to the integrated circuit and the package contact pad; and forming an encapsulant over the die connector and the integrated circuit, the encapsulant having an encapsulant edge from a sawless singulation process.

04-01-2010

20100123229

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PLATED PAD AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming an external interconnect; forming a first planar terminal adjacent to the external interconnect and non-planar to a portion the external interconnect; mounting a first integrated circuit over the first planar terminal; connecting the first integrated circuit with the external interconnect; and forming an encapsulation over the first planar terminal covering the first integrated circuit and with the external interconnect extending from a non-horizontal side of the encapsulation and with the first planar terminal coplanar with the adjacent portion of the encapsulation exposing the first planar terminal.

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A DUAL SUBSTRATE PACKAGE AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a base substrate having a base conductive material on opposite sides of the base substrate; connecting an internal interconnect having a substantially spherical shape on the base substrate; forming a top substrate having a top conductive material on opposite sides of the top substrate with an upper component thereon facing the base substrate; and attaching the top substrate on the internal interconnect.

12-23-2010

20100320586

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED INTEGRATED CIRCUIT AND METHOD OF MANUFACTURE THEREOF - A method of manufacture an integrated circuit packaging system includes: providing a substrate; attaching a base component to the substrate by a first interconnect; attaching a stack component connected by a second interconnect to the substrate and partially over the base component, the second interconnect different from the first interconnect; molding an encapsulation over the base component, the first interconnect, the stack component, and the second interconnect; and removing the substrate to partially expose the first interconnect and the second interconnect from the encapsulation.

12-23-2010

20110101542

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED INTEGRATED CIRCUIT AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a base lead having an outer protrusion and an inner protrusion with a recess in between; forming a stack lead having an elongated portion; mounting a base integrated circuit over the inner protrusion or under the elongated portion; mounting the stack lead over the base lead and the base integrated circuit; connecting a stack integrated circuit and the stack lead with the stack integrated circuit over the base integrated circuit; and encapsulating at least a portion of both the base integrated circuit and the stack integrated circuit with the base lead and the stack lead exposed.

05-05-2011

20110127661

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH FLIP CHIP AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming external interconnects having bases of a first thickness and tips of a second thickness extending inwardly directly toward each other; connecting a first circuit device between the tips; attaching a second circuit device to the first circuit device with a combined thickness of the first circuit device and the second circuit device less than the first thickness; and forming an encapsulation of the first thickness between the bases and over the tips.

06-02-2011

20110140287

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BOND WIRE PADS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a device over a substrate including a bond wire pad row located between a perimeter of the substrate and the device; configuring the bond wire pad row to include three sided bond wire pads that horizontally overlap; and forming an interconnection between the device and the bond wire pad row.

06-16-2011

20110180928

ETCHED RECESS PACKAGE ON PACKAGE SYSTEM - An integrated circuit package system includes: interconnection pads; a first device mounted below the interconnection pads; a bond wire, or a solder ball connecting the first device to the interconnection pads; a lead connected to the interconnection pad or to the first device; an encapsulation having a top surface encapsulating the first device; and a recess in the top surface of the encapsulation with the interconnection pads exposed therefrom.

07-28-2011

20120064668

METHOD OF MANUFACTURE OF INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED INTEGRATED CIRCUIT - A method of manufacture of an integrated circuit packaging system includes: forming a base lead having an outer protrusion and an inner protrusion with a recess in between; forming a stack lead having an elongated portion; mounting a base integrated circuit over the inner protrusion or under the elongated portion; mounting the stack lead over the base lead and the base integrated circuit; connecting a stack integrated circuit and the stack lead with the stack integrated circuit over the base integrated circuit; and encapsulating at least a portion of both the base integrated circuit and the stack integrated circuit with the base lead and the stack lead exposed.

03-15-2012

20120241931

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a die paddle and a lead adjacent to the die paddle; mounting an integrated circuit, having a bond pad, over the die paddle; forming a bonding interconnect on the bond pad; embedding a circuit end of an internal interconnect in the bonding interconnect; and connecting a lead end of the internal interconnect to the lead.

09-27-2012

20120241968

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: forming a post of multiple plating layers having a base end with an inward protrusion, a connect riser, and a top end opposite the base end; positioning an integrated circuit device having a perimeter end facing the connect riser and the inward protrusion; attaching a bond wire directly on the inward protrusion and the integrated circuit device; and applying an encapsulation over the integrated circuit device, the bond wire, the inward protrusion, and around the post, the encapsulation exposing a portion of the base end and the top end of the post.

09-27-2012

20120241983

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A FLIP CHIP AND METHOD OF MANUFACTURE THEREOF - A method of manufacture of an integrated circuit packaging system includes: providing a lead; placing an integrated circuit device, having an external connector, adjacent to and electrically isolated from the lead; mounting an integrated circuit over the lead and the integrated circuit device with the integrated circuit electrically isolated from the integrated circuit device; and forming a package encapsulation, having an encapsulation base, over the lead, the integrated circuit, and the integrated circuit device with the lead and the external connector exposed from the encapsulation base.