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Thursday, January 31, 2013

Physical Access to Components on Board

Physical Access to Components on Board - Using BGA packages increases the difficulty of casual probing, manipulation, and attack, due to the fact that all die connections are located underneath the device packaging, It is also recommended to add some type of epoxy encapsulation or glue to help prevent easy removal of components. Another solution is to employ Chip-on-Board (COB) packaging, in which the silicon die of the integrated circuit is mounted directly to the PCB and protected by epoxy encapsulation.