This blog serves readers of ElectroIQ.com, the home for Solid State Technology (semiconductors), Photovoltaics World (photovoltaics), Advanced Packaging (packaging) and Small Times (nanotech/MEMS).

Tuesday, August 24, 2010

AMAT announces FCVD product for C-free gap fill

We've been waiting on Applied Materials' new product announcement today: a new flow chemical vapor deposition (FCVD) product for Eterna that aims to replace spin-on dielectric (SOD) films as those films’ extendibility to advanced nodes is being questioned. In particular, Applied is targeting 3D memory architectures, which are in solid-state drives (SSDs) that are used in products such as iPads, netbooks, and even server farms.