3D ICs Seminar with Free Download

Published on Mar 28, 2016

Abstract

Slide 1 :

WELCOME TO THE SEMINAR

ON

3D ICs

Slide 2 :

Introduction

==> 3-D ICs are an attractive chip architecture that can alleviate the interconnect related problems such as delay and power dissipation and can also facilitate integration of heterogeneous technologies in one chip ( SoC ).

==> The multi-layer chip industry opens up a whole new world of design.

==> With the Introduction of 3-D ICs, the world of chips may never look the same again

==> In the 3-Ddesign architecture, an entire chip is divided into a number of blocks, and each block is placed on a separate layer of Si that are stacked on top of each other.

Slide 8 :

Silicon Epitaxial Growth

==> Figure

Slide 9 :

Conclusion

==> The 3 D memory will just the first of a new generation of dense, inexpensive chips that promise to make digital recording media both cheap and convenient enough to replace the photographic film and audio tape.

==> We can understand that 3-D ICs are an attractive chip architecture, that can alleviate the interconnect related problems such as delay and power dissipation and can also facilitate integration of heterogeneous technologies in one chip.

==> The multilayer chip building technology opens up a whole new world of design like a city skyline transformed by skyscrapers