SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

21

Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

67

Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components

683

for supporting or gripping

H

ELECTRICITY

01

BASIC ELECTRIC ELEMENTS

L

SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

21

Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

02

Manufacture or treatment of semiconductor devices or of parts thereof

H

ELECTRICITY

05

ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

B

ELECTRIC HEATING; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR

3

Ohmic-resistance heating

10

Heating elements characterised by the composition or nature of the materials or by the arrangement of the conductor

(EN)This wafer holding body has: a loading stand provided with a surface for loading an object to be processed on an upper surface thereof; a supporting member that supports the loading stand from a lower surface side of the loading stand; a first cylindrical member one end of which is airtightly joined to the lower surface side of the loading stand; and a second cylindrical member disposed inside the first cylindrical member, and having one end airtightly joined to a lower surface side of the loading stand.(FR)La présente invention concerne un corps porte-plaquette qui a : un socle de charge comportant une surface de charge d’un objet à traiter sur sa surface supérieure ; un organe de support qui supporte le socle de charge depuis un côté de surface inférieure du socle de charge ; un premier organe cylindrique dont une première extrémité est jointe de manière étanche à l’air au côté de surface inférieure du socle de charge ; et un deuxième organe cylindrique disposé à l’intérieur du premier organe cylindrique, et ayant une extrémité jointe de manière étanche à l’air à un côté de surface inférieure du socle de charge.(JA)被処理物の載置面を上面に備えた載置台と載置台を下面側から支持する支持部材と、一方の端部が載置台の下面側に気密に接合されている第１筒状部材と、第1筒状部材の内側に配置され、かつ、一方の端部が載置台の下面側に気密に接合されている第２筒状部材と、を有するウエハ保持体。