TITEBOND SUBFLOOR CONSTRUCTION ADHESIVE

Titebond Solvent-Based Subfloor Construction Adhesive is a professional strength formula that is specifically designed for subfloor installations and general plywood use. It provides a permanent bond that remains flexible, reduces nailing and prevents squeaky floors. It offers a strong initial tack and excellent bond strength. It is...

Fills irregularities between materials to provide a more solid backup surface

Application Guidelines

Application Temperature:

0°F to 100°F

Service Temperature Range:

-20°F to 120°F

Working Time:

Approximately 10-20 minutes for a 1/4" bead

Prep:

Surfaces must be clean and free of any material that may prevent adequate adhesion.

Application:

Cut tip straight across for 1/4” to 3/8” bead. Puncture inner seal and place in cartridge gun. Apply adhesive to each furring strip, stud or floor joist to be covered. Adhere materials within 15 minutes. Position material to be bonded and press firmly for full contact with adhesive. Note: For subfloors, apply adhesive to joists for one sheet at a time. Nail or screw each sheet as recommended by the American Plywood Association.

Cleanup:

Tools and adhesive may be cleaned with acetone or mineral spirits. Follow solvent
vendor’s precautions.

Limitations:

Not designed for continuous submersion or for use on plastics, polystyrene or polyethylene foams. Do not adhere one non-porous material to another as this will slow or prevent drying.