Assembly of 3D-wares with the use of wire leadouts

Assembly of 3D-wares with the use of wire leadouts
Zenin, V.; Stoyanov, A.; Petrov, S.; Chistyakov, S.
2014-01-30 00:00:00
Some methods of the formation of microwelds, which are most acceptable for the assembly of 3D-wares with the use of wire leadouts, have been analyzed. Some peculiarities of the bonding of inner wirings on a die and a package by different welding methods, such as pressure welding with indirect pulsed heating and thermosonic, ultrasonic, and split-tip welding, have been considered. The effect of structural and technological factors on the quality of microwelds made by ultrasonic welding with the use of aluminum wire, aluminum metallization on a die, and gold, nickel, and nickel alloy coatings has been studied. Some information on microwelds made with the use of copper wire and copper metallization has been represented.
http://www.deepdyve.com/assets/images/DeepDyve-Logo-lg.pngRussian MicroelectronicsSpringer Journalshttp://www.deepdyve.com/lp/springer-journals/assembly-of-3d-wares-with-the-use-of-wire-leadouts-ZQgrNJB4qv