Welcome to Frontier Semiconductor

Frontier Semiconductor (FSM), offers a range of advanced metrology products and solutions for semiconductor, LED, Solar, FPD, Data Storage and MEMS applications. We have over 25 years experience in stress measurement, film adhesion testing, wafer topography metrology, and electrical characterization. Our latest offerings include unique technology to meet the metrology needs of 3DIC manufacturing and to monitor stress of large flat panels.

FSM has local sales and support offices in all major semiconductor clusters. Other areas are covered by a network of local representatives.

Applications domains & Technologies

FSM offers metrology and characterization systems for front-end, back-end, as well as research and development applications.

Frontier Semiconductor is the leading manufacturer of stress measurement tools for semiconductor, MEMS, optoelectronic, and flat panel applications. Stress and wafer bow maps can be acquired over the entire wafer surface, providing process engineers means to characterize and develop new processes using different thin film materials.

The FSM 128 Series systems are room temperature, full-wafer 2D/3D stress mapping systems. 128 systems use FSM's patented non-contact Opti-Lever dual-laser auto-switching technology featuring a micropositioning detector to measure the laser beam deflection with high precision over a large dynamic range of small to large bow or stress. FSM's stress gauges have the ability to scan 1000 points per inch in seconds for high resolution, high precision stress mapping on blanked and patterned wafers.

Substrate and tape total and individual thicknesses, warpage, and TTV Measurement. Able to measure with or without backing tape. For wafer back-grind and etch thinning processes control. Non-contact Echoprobe or VITE Technology. Thin film and surface roughness options.

Stress Hysteresis in vacuum or gas up to 900C for the study of annealing cycles. Thermal Desorption, Film Shrinkage, Reflectivity, and Resistivity options provide additional insight to causes of material changes with temperature. NEW: Optional wafer rotation offers unique 2D/3D mapping to study wafer deformation as a function of temperature.

Products

RMSRMS

The FSM RMS In-Situ Roughness Monitoring System is a compact, robust, and easy to use system to measure the roughness of very rough surfaces such as those of diffusers for LED and Laser light sources, as well as silicon and compound semiconductor solar cells. FSM’s proprietary non-contact grazing angle scattering technology makes the system immune to stray light and vibration and easy to integrate.

8108 VITEVIT(E) Series

New high speed, high accuracy non-contact characterization of thin wafers, through silicon vias (TSV), bumps, MEMS structures and novel materials. FSM 8108 VITE can be employed in the front-end and backend. It provides thickness, TTV, and topography of Si and compound materials, edge trim geometry, multilayer thickness and topography of wafers on tape, on sapphie,or on glass. Measurement of warp of highly warped wafers and measurement of thick films.