You select a replacement pad, land or conductor from a Circuit Frame and carefully scrape off the adhesive film from the solder joint area. Then you trim it out from the Circuit Frame.

Step 3.

You place the new pad, land or conductor in position using high temperature tape. Then apply heat to the tape for 5 seconds using a
Bonding Iron or Bonding System.
The heat transmits through the tape to quickly tack the pad, land or conductor in place.

Step 4.

Then you remove the high temperature tape and again apply heat using the Bonding Iron or Bonding System, but this time directly to the top surface of the pad, land or conductor.
You apply light pressure to permanently cure the adhesive. The bonding time to cure the dry-film adhesive is only 30 seconds.

To complete the procedure, if the new pad, land or conductor has a connecting circuit, apply liquid flux and the lap solder the connection.

1 year minimum. Each Circuit Frame package is stamped with the expiration date.

Plating Option - Bright Tin

.0001" (.0025 mm) Bright Tin (Lead Free)

Plating Option - Nickel/Gold

.000050" (.00127 mm) Gold over .000100" (.00254 mm) Nickel

Plating Option - Tin/Lead

.0001" (.0025 mm) 63/37 Tin/Lead

REACH

CircuitMedic Circuit Frames contain less than 0.1% by weight any substance listed as a very high
concern in Article 59 of REACH.

Outgassing

The Bonding Film used on Circuit Frames consistently meet the criteria for NASA applications.
Maximum 1.0% TML and a Maximum 0.10% CVCM. Samples have been submitted for testing to Goddard Space Flight Center and other facilities, and the results are;
Data Reference: GSC 17366; %TML: 0.94%; %CVCM: 0.06%

Circuit Frame List
* Stock - There is a minimum order and extended lead time for non-stock Circuit Frames.