Assuming that this will eventually be used to connect the processor to the heat spreader plate, we still need to develop methods for better transfer between the heat spreader and the actual cooler. Otherwise I can only see this being used in sealed units that won't be upgradeable or replaceable.

Assuming that this will eventually be used to connect the processor to the heat spreader plate, we still need to develop methods for better transfer between the heat spreader and the actual cooler. Otherwise I can only see this being used in sealed units that won't be upgradeable or replaceable.

As the thermal conductivity of carbon nanotubes exceeds that of diamond or any other natural material it would seem that the continued use of carbon nanotubes to connect the heat spreader to the cooler would be the ideal solution but the distances between processor and heat spreader are probably much smaller than the distances between heat spreader and cooler and I'm not sure if it's possible or financially viable to use carbon nanotubes for that purpose.

If carbon nanotubes could be used between heat spreader and cooler and were super efficient but could only be made using a sealed unit it wouldn't really matter, all though it would be very annoying for us modders who often find it hard to believe that a company spending £000,000's on development can make something better than we can in a shed with after market h/sinks and fans

Nanotubes aside, "Molecular Foundry" what a great phrase, I really need a Skyrim mod for a Molecular Foundry maybe the next great incarnation of The Elder Scrolls will have the option for nano technology, I can here the Skyrim Lore perfectionists sharpening their weapons already

The big question: how much does the process cost? Intel already switched from solder bonded IHS to a past TIM because it was fractionally cheaper (even though lower performing at higher voltages), so why would they switch to this, even if it performed significantly better, if it cost more?