FACT #1Nobody can create a FOLDER anywhere on the computer which can be named as "CON".This is something pretty cool...and unbelievable. ..At Microsoft the whole Team, couldn't answer why this happened!TRY IT NOW, IT WILL NOT CREATE "CON" FOLDER

FACT #3For those of you using Windows, do the following:1. Open an empty notepad file2. Type "Bush hid the facts" (without the quotes)3. Save it as whatever you want.4. Close it, and re-open it.Is it just a really weird bug?You can try the same thing above with another sentence "this app can break"

Explanation for fact #1:In windows the folder name and the special system variables share the same interface, so when you create a folder with a system variable name it will consider that folder already exist!!These special system variables are available irrespective of pathYou cannot create a folder with these names also:CON, NUL, COM1, COM2, COM3, LPT1, LPT2, LPT3,COM1 to COM9 and LPT1 to LPT9....CON means console, COM1 means serial port 1, LPT1 means parallel port 1

Explanation for fact #2:This is a trick which is used for testing of any application sftware of microsoft.This is an inbuild techical automatic fundamentals to check its feasibility.

Explanation for fact #3:Over at WinCustomize, someone thought they'd found an Easter Egg in the Windows Notepad application but It's not an Easter egg (even though it seems like a funny one), and as it turns out, Notepad writes the file correctly.Every file after its saving on the hard disk is first checked all its content before it is write on the disk, till then all of those content temporarily saved in a temp folder.

Do u know that windows XP is having a hidden "Star Wars Movie" inside it???You should be connected to the NET for using this.Go to Starts-->Programs-->RunTypetelnet towel.blinkenlights.nlAnd hit enter......... Enjoy the magic!!!!

THIS IS A VERY SIMPLE TRICK.....NO SOFTWARE REQUIRED......NO DL REQUIREDUnhidden1. Type "about:config" into the address bar and hit enter. Scroll down and look for the following entries:2. Alter the entries as follows:Set "network.http.pipelining" to "true"Set "network.http.proxy.pipelining" to "true"set "network.http.pipelining.maxrequests" to some number like 30. This means it will make 30 requests at once.3. Lastly right-click anywhere and select New-> Integer. Name it "nglayout.initialpaint.delay" and set its value to "0". This value is the amount of time the browser waits before it acts on information it recieves.NOTE:this trick only works for broadband users not for dialup

Sand. Made up of 25 percent silicon, is, after oxygen, the second most abundant chemical element that's in the earth's crust. Sand, especially quartz, has high percentages of silicon in the form of silicon dioxide (SiO2) and is the base ingredient for semiconductor manufacturing.

After procuring raw sand and separating the silicon, the excess material is disposed of and the silicon is purified in multiple steps to finally reach semiconductor manufacturing quality which is called electronic grade silicon. The resulting purity is so great that electronic grade silicon may only have one alien atom for every one billion silicon atoms. After the purification process, the silicon enters the melting phase. In this picture you can see how one big crystal is grown from the purified silicon melt. The resulting mono-crystal is called an ingot.

A mono-crystal ingot is produced from electronic grade silicon. One ingot weighs approximately 100 kilograms (or 220 pounds) and has a silicon purity of 99.9999 percent.

The ingot is then moved onto the slicing phase where individual silicon discs, called wafers, are sliced thin. Some ingots can stand higher than five feet. Several different diameters of ingots exist depending on the required wafer size. Today, CPUs are commonly made on 300 mm wafers.

Once cut, the wafers are polished until they have flawless, mirror-smooth surfaces. Intel doesn't produce its own ingots and wafers, and instead purchases manufacturing-ready wafers from third-party companies. Intel’s advanced 45 nm High-K/Metal Gate process uses wafers with a diameter of 300 mm (or 12-inches). When Intel first began making chips, it printed circuits on 50 mm (2-inches) wafers. These days, Intel uses 300 mm wafers, resulting in decreased costs per chip.

The blue liquid, depicted above, is a photo resist finish similar to those used in film for photography. The wafer spins during this step to allow an evenly-distributed coating that's smooth and also very thin.

At this stage, the photo-resistant finish is exposed to ultra violet (UV) light. The chemical reaction triggered by the UV light is similar to what happens to film material in a camera the moment you press the shutter button.

Areas of the resist on the wafer that have been exposed to UV light will become soluble. The exposure is done using masks that act like stencils. When used with UV light, masks create the various circuit patterns. The building of a CPU essentially repeats this process over and over until multiple layers are stacked on top of each other.

A lens (middle) reduces the mask's image to a small focal point. The resulting "print" on the wafer is typically four times smaller, linearly, than the mask's pattern.

In the picture we have a representation of what a single transistor would appear like if we could see it with the naked eye. A transistor acts as a switch, controlling the flow of electrical current in a computer chip. Intel researchers have developed transistors so small that they claim roughly 30 million of them could fit on the head of a pin.

After being exposed to UV light, the exposed blue photo resist areas are completely dissolved by a solvent. This reveals a pattern of photo resist made by the mask. The beginnings of transistors, interconnects, and other electrical contacts begin to grow from this point.

The photo resist layer protects wafer material that should not be etched away. Areas that were exposed will be etched away with chemicals.

After the etching, the photo resist is removed and the desired shape becomes visible.

More photo resist (blue) is applied and then re-exposed to UV light. Exposed photo resist is then washed off again before the next step, which is called ion doping. This is the step where ion particles are exposed to the wafer, allowing the silicon to change its chemical properties in a way that allows the CPU to control the flow of electricity.

Through a process called ion implantation (one form of a process called doping) the exposed areas of the silicon wafer are bombarded with ions. Ions are implanted in the silicon wafer to alter the way silicon in these areas conduct electricity. Ions are propelled onto the surface of the wafer at very high velocities. An electrical field accelerates the ions to a speed of over 300,000 km/hour (roughly 185,000 mph)

After the ion implantation, the photo resist will be removed and the material that should have been doped (green) now has alien atoms implanted.

This transistor is close to being finished. Three holes have been etched into the insulation layer (magenta color) above the transistor. These three holes will be filled with copper, which will make up the connections to other transistors.

The wafers are put into a copper sulphate solution at this stage. Copper ions are deposited onto the transistor through a process called electroplating. The copper ions travel from the positive terminal (anode) to the negative terminal (cathode) which is represented by the wafer.

The copper ions settle as a thin layer on the wafer surface.

The excess material is polished off leaving a very thin layer of copper.

Multiple metal layers are created to interconnects (think wires) in between the various transistors. How these connections have to be “wired” is determined by the architecture and design teams that develop the functionality of the respective processor (for example, Intel’s Core i7 processor). While computer chips look extremely flat, they may actually have over 20 layers to form complex circuitry. If you look at a magnified view of a chip, you will see an intricate network of circuit lines and transistors that look like a futuristic, multi-layered highway system.

This fraction of a ready wafer is being put through a first functionality test. In this stage test patterns are fed into every single chip and the response from the chip monitored and compared to "the right answer."

After tests determine that the wafer has a good yield of functioning processor units, the wafer is cut into pieces (called dies).

The dies that responded with the right answer to the test pattern will be put forward for the next step (packaging). Bad dies are discarded. Several years ago, Intel made key chains out of bad CPU dies.

This is an individual die, which has been cut out in the previous step (slicing). The die shown here is a die of an Intel Core i7 processor.

The substrate, the die, and the heatspreader are put together to form a completed processor. The green substrate builds the electrical and mechanical interface for the processor to interact with the rest of the PC system. The silver heatspreader is a thermal interface where a cooling solution will be applied. This will keep the processor cool during operation.

A microprocessor is the most complex manufactured product on earth. In fact, it takes hundreds of steps and only the most important ones have been visualized in this picture story.

During this final test the processors will be tested for their key characteristics (among the tested characteristics are power dissipation and maximum frequency).

Based on the test result of class testing processors with the same capabilities are put into the same transporting trays. This process is called "binning". Binning determines the maximum operating frequency of a processor, and batches are divided and sold according to stable specifications.

The manufactured and tested processors (again Intel Core i7 processor is shown here) either go to system manufacturers in trays or into retail stores in a box. Many thanks to Intel for supplying the text and photos in this picture story. Check out Intel's site for full size images of this entire process.

Let me Introduce you all about the brief history and evolution of the world most reputed software company named "Microsoft".

It all began in Plaza Hotel, New York City on the 10th of November 1983.. Two Microsoft founders Paul Allen and Bill Gates officially announced their corporationâ€™s first and next-generation graphical user interface operating system â€“ Microsoft Windows.

Despite the criticism on stability and constantly being compared to their rivals Apple Macintosh, Microsoft Windows is still the most widely used operating systems in the world.

Windows 1.01(1985)

Officially released on November 20, 1985, this 16-bit OS that cost less than 1MB in overall is Microsoftâ€™s very first operating system that allows multi tasking with graphical user interface on PC platform that runs on MS-DOS 5.0.

Windows 1..03(1986)

Introduced in 1986, Windows 1.03 is an upgrade to its previous predecessor Windows 1.01. Entire operating system cost about 2.2Mb hard disk space.

Windows 2.03(1987)

Taking advantage of the speed of Intel 286/386 processor at that time, Windows 2.03 is a replacement for Windows 1.x. It also starts the era where users are able to overlap windows, customize screens, etc. Still the entire operating system cost no more than 2.5Mb.

Windows 2.86(1989)

Windows 3.0(1990)

This is the third major released of Microsoft Windows with a improved set of Windows icons and applications like File Manager, Program Manager that is still being used in todayâ€™s Windows. This 22 May 1990 released operating system is then replaced by Windows 3.1 two years later.

Windows 3.1(1992)

Windows 3.1 is probably the earliest Windows most of us are familiar with. Windows 3.1 and later Windows 3.1x is an upgrade to Windows 3.0 with bug fixes and multimedia support.

Windows NT 3.1(1993)

The first Windows New Technology (NT) introduced. It maintains consistency with the Windows 3..1, a well-established home and business operating system at the time, the new Windows NT operating system began with version 3.1. Unlike Windows 3.1, however, Windows NT 3.1 was a 32-bit operating system.

Windows 3.11 (1993)

A superset of Windows 3.1, Windows for Workgroups 3.11 added peer-to-peer workgroup and domain networking support. For the first time, Windowsâ€“based PCs were network-aware and became an integral part of the emerging client/server computing evolution â€“ Microsoft

Windows NT 3.51 Workstation(1995)

The Windows NT Workstation 3.5 release provided the highest degree of protection yet for critical business applications and data. With support for the OpenGL graphics standard, this operating system helped power high-end applications for software development, engineering, financial analysis, scientific, and business-critical tasks â€“ Microsoft

Windows 95(1995)

Previously code-named Chicago, Windows 95 is a successor to all the existing Windows operating system so far. It gives full graphical user interface support, integrated a 32-bit TCP/IP (Transmission Control Protocol/Internet Protocol) stack for built-in Internet support, dial-up networking, and new Plug and Play capabilities that made it easy for users to install hardware and software.

Windows NT 4.0(1996)

Windows NT Workstation 4.0 included the popular Windows 95 user interface yet provided improved networking support for easier and more secure access to the Internet and corporate intranets â€“ Microsoft.

Windows NT Server 4.0(1996)

Windows 98(1998)

Windows 98 was the upgrade from Windows 95. Described as an operating system that "Works Better, Plays Better," Windows 98 was the first version of Windows designed specifically for consumers â€“ Microsoft.

Windows 2000(2000)

More than just the upgrade to Windows NT Workstation 4.0, Windows 2000 Professional was also designed to replace Windows 95, Windows 98, and Windows NT Workstation 4.0 on all business desktops and laptops. Built on top of the proven Windows NT Workstation 4.0 code base, Windows 2000 added major improvements in reliability, ease of use, Internet compatibility, and support for mobile computing â€“ Microsoft.

Windows 2000 Server(2000)

Windows ME(2000)

Windows XP(2001)

Windows XP Professional brings the solid foundation of Windows 2000 to the PC desktop, enhancing reliability, security, and performance. With a fresh visual design, Windows XP Professional includes features for business and advanced home computing, including remote desktop support, an encrypting file system, and system restore and advanced networking features â€“ Microsoft.

Windows Server 2003(2003)

Released on April 2003, and also known as Win2k3, this operating system is a sucessor to itâ€™s predecessor Windows Server 2000 (Win2k).

Windows Vista(2006)

Came more than 5 years after itâ€™s predecessor Windows XP, Vista is the longest timeline break for Microsoft between two operating system.

Windows 7(2009)

Codenamed Blackcomb, Windows 7 is one of the most anticipated operating system which should be available somewhere in Oct 2009.