CHANDLER, Ariz., Dec. 10-- Amkor Technology, Inc.,
(Nasdaq: AMKR) today announced that its semiconductor strip test production is
on pace to approach 300 million IC packages in 2003, more than double the
number of ICs Amkor strip tested in 2002. Overall, Amkor has tested more than
a half billion ICs in strip test format since the company introduced this
innovative testing technology four years ago. Strip test is a method of
testing large numbers of packaged ICs that both reduces test cost and
increases test yield. In strip test, electrically isolated packaged ICs are
tested in parallel, resulting in fast handler index times and high throughput
rates.

"Amkor's strip test platform provides integrated device manufacturers with
a compelling vehicle to reduce total costs by increasing outsourcing of low
lead count packages," said Joe Holt, Amkor's senior vice president of
worldwide test. "We believe Amkor's capability in strip test far exceeds that
of all other contract assembly and test companies. Our accelerating volume of
turnkey assembly and strip test business is additional evidence that our IDM
customers are taking a hard look at how they allocate resources -- even in
'legacy' packages where they have a manufacturing core competency."

Amkor began strip-test production in 1999 with SOIC packages. Today,
production also includes PDIP, TSSOP and Amkor's proprietary MicroLeadFrame®
packages. "The adoption of strip test has been particularly dramatic this
year as we have added package types and new customers," said Holt. "We've
even qualified our laminate-based ChipArray® ball grid array package on a
strip test format."

While a key attribute of strip test is lower test cost, the improvement in
test yield is often a more significant benefit for customers. Amkor's strip
testing typically increases test yield by 1% to 2% versus singulated test; in
some cases yield improvement has reached 9%. Strip test yields are higher
because the test probes touch all package leads while they are still uniformly
flat in leadframe format, whereas on singulated ICs the test probes touch
leads that have already been formed.

Through rigorous QA methodology and its production experience, Amkor
engineers have repeatedly validated the superior quality of its strip-tested
ICs compared to those tested using conventional singulated test methods.
"We've even had one customer experience a year of high volume production with
no quality failures," said Holt.

"Increasingly, our integrated strip-test technology is proving to be a
viable alternative for IDMs who are looking to further reduce product costs,
said Blake Gillett, senior director of strip test at Amkor. "In addition,
because we provide all the engineering resources for strip test, our customers
can easily move to strip test while allowing their own test developers to
focus on bringing more new products to market."

About Amkor

Amkor Technology, Inc. is a leading provider of contract semiconductor
assembly and test services. The company offers semiconductor companies and
electronics OEMs a complete set of microelectronic design and manufacturing
services. More information on Amkor is available from the company's SEC
filings and on Amkor's web site: www.amkor.com .