Session 4 – Advanced Metrology IChairs: Amiad Conley, Applied
Materials; Franz Heider, Infineon; Erin Lavigne, IBMNovel processes and complex materials are putting significant pressure on measurement tool-sets. As the time to develop upcoming process nodes and new semiconductor
architectures decreases there is a drive for ever more in-line Critical
Dimension and films metrology control for fast cycles of learning and process
control. This session will cover several key advancements in integrated
metrology module control and advances TSV films metrology and control.

Session 8 – Advanced Equipment
and Materials IChairs:
Scott Lantz, Intel Corporation; Anand Subramani, KLA-TencorAdvanced
memory, analog and logic manufacturers face daunting challenges as the next
generation device nodes come on line. These challenges are being met by the
development and applications of innovations in equipment, materials, and
processes. This session will focus on and will highlight some of the latest
innovations that are being implemented in leading edge high volume
manufacturing.

Session 9 - Advanced Metrology IIChairs: Janay Camp, KLA-Tencor; Dick James, Chipworks; Alok Vaid,
GLOBALFOUNDRIESNovel processes and complex materials are putting significant pressure
on measurement tool-sets. As the time to
develop upcoming process nodes and new semiconductor architectures decreases
there is a drive for ever more in-line Critical Dimension and films metrology
control for fast cycles of learning and process control. This session
will cover several key advancements in integrated metrology module control and
advances TSV films metrology and control.

Session 10 –
Advanced PatterningChairs: Oliver
Patterson, IBM; Jacek Tyminski, Nikon ResearchAdvanced
patterning is a key element of leading edge semiconductor fabrication. This session contains papers on the use of
inspection and metrology tools to characterize and improve on patterning
weaknesses. The final paper discusses
lithography tool improvements to enable complex MEMS part manufacture.

Panel DiscussionSemiconductor Manufacturing: Keeping the Silicon Magic AliveSince its inception, the semiconductor industry
has changed the way we live, work and play.
Our industry has fueled innovations that touch almost every device we
use today, in a way that can seem as if our devices run on magic. Those innovations were enabled by the almost-unimaginable
creativity and hard work of those of us in the semiconductor industry, and in
academia, driven by the economic support provided by manufacturing profits,
venture capital investments, and government-funded programs. While
it seems that the trajectory towards smaller, faster, cheaper will continue
indefinitely, the challenges posed today by technical showstoppers, lack of critical
investments, and failure to nurture a curious, well-educated workforce might cause
the semiconductor industry to falter.
How can industry, in concert with academia and government, keep silicon magic
alive?

Session 15 - Advanced Equipment and Materials IIChairs: Russell Dover, Lam Research; Leonard Olmer, Micron TechnologyAdvanced memory, analog and logic manufacturers face daunting
challenges as the next generation device nodes come on line. These challenges
are being met by the development and applications of innovations in equipment,
materials, and processes. This session will focus on and will highlight some of
the latest innovations that are being implemented in leading edge high volume manufacturing.﻿