Abstract Copper films were grown on 3-Mercaptopropyltrimethoxysilane MPTMS, 3-Aminopropyltriethoxysilane APTES and 6-3-triethoxysilylpropylamino-1,3,5- triazine-2,4-dithiol monosodium TES self-assembled monolayers SAMs modified acrylonitrile-butadiene-styrene ABS substrate via electroless copper plating. The copper films were examined using scanning electron microscopy SEM and X-ray diffraction XRD. Their individual deposition rate and contact angle were also investigated to compare the properties of SAMs and electroless copper films. The results indicated that the formation of copper nuclei on the TES-SAMs modified ABS substrate was faster than those on the MPTMS-SAMs and APTES-SAMs modified ABS substrate. SEM images revealed that the copper film on TES-SAM modified ABS substrate was smooth and uniform, and the density of copper nuclei was much higher. Compared with that of TES-SAMs modified resin, the coverage of copper nuclei on MPTMS and APTES modified ABS substrate was very limited and the copper particle size was too big. The adhesion property test demonstrated that all the SAMs enhanced the interfacial interaction between copper plating and ABS substrate. XRD analysis showed that the copper film deposited on SAM-modified ABS substrate had a structure with Cu111 preferred orientation, and the copper film deposited on TES-SAMs modified ABS substrate is better than that deposited on MPTMS-SAMs or APTES-SAMs modified ABS resins in electromigrtion resistance. View Full-Text