More Bonds of Citigroup Inc.

About the Citigroup Inc.-Bond (US172967LW98)

The Citigroup Inc.-Bond has a
maturity date of 4/23/2029 and offers a coupon of 4.0750%. The payment of the coupon will take place 2,0 times per biannual on the 23.10.. The Citigroup Inc.-Bond was issued on the 4/23/2018 with a volume of 2 B. USD.