Heat Dissipation patents

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Date/App#

List of recent Heat Dissipation-related patents

05/22/1420140140008

Heat dissipation material and manufacturing thereof, and electronic device and manufacturing thereofA heat dissipation material includes a plurality of linearly-structured objects of carbon atoms configured to include a first terminal part and a second terminal part; a first diamond-like carbon layer configured to cover the first terminal part of each of the plurality of linearly-structured objects; and a filler layer configured to be permeated between the plurality of linearly-structured objects.. .

05/01/1420140118948

Electronic deviceAn electronic device includes a housing, a heat source located inside a casing, and a heat dissipation device disposed inside a casing. The heat dissipation device is in thermal contact with the heat source.

05/01/1420140118945

Electronic deviceAn electronic device includes a housing, a heat source located in a casing, and a heat dissipation device disposed in a casing. The heat dissipation device is kept apart from the heat source.

05/01/1420140118943

Electronic deviceAn electronic device includes a housing, a heat source in the housing, and a heat dissipation device in the housing and separated from the heat source by a distance. The heat dissipation device includes a casing.

05/01/1420140118942

Electronic deviceAn electronic device includes a housing, a heat source located in the housing, and a heat dissipation device disposed in the housing. The heat dissipation device thermally contacts the heat source.

05/01/1420140118928

Electronic deviceAn electronic device comprises a case, a heat source and a radiator. The heat source is disposed inside the case.

10/03/1320130258641

Backplane and backlight module comprising backplaneThe invention provides a backplane and a backlight module including the backplane. The backplane is formed by joining a plurality of brackets; the plurality of brackets include light incident side bracket(s) for arranging the light source, and the structure part of the light incident side bracket for arranging the light source is coated with heat dissipation material.

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