Landless Via

Landless Via Technology

An exciting new technology that allows Design Engineers to resolve space restrictions by eliminating via pad requirements is called Landless Via.

How does Candor Produce Landless Via

Traditional PCB manufacturing processes required an annular ring to facilitate proper plating in the hole and on the surface. Our plating methods allow us to eliminate this requirement, giving our customers a design advantage when dealing with HDI PCBs.

Benefits

Benefits blind and buried vias

Impedance requirements and regular through holes. Consistent impedance records for repeatability are second to none.