This paper is the "Introductory Invited Paper" in the June 2003 issue of Microelectronics Reliability. (Vol. 43, Issue 6 , June 2003, Pages 879-894). The paper describes some details of the new technology introduced by Kulicke & Soffa's (K&S) Flip Chip Division (formerly Flip Chip Technologies) and marketed under the name of Spheron (TM). This WLP technology uses a polybenzoxazole (PBO). The selected polymer demonstrates not only excellent reliability but also provides exceptional manufacturability. The favorable mechanical toughness, high elongation, and excellent adhesion to organic and inorganic materials provides excellent performance in reliability tests.

If you would like to receive a copy of the paper, please send us a request by e-mail or use the feedback form