Could not complete qual as system overtemp'd after 3rd wafer (30 sec @1150C). QUAL requires 5 wafers. The area of the chamber monitored by the T1 sensor held around 30C during processing. The area monitored by T2 temperature climbed >20C for each wafer. While we are getting right at 2 gpm, it seems the T2 area does not have enough flow.