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Abstract

Disclosed is a process for making multilayer connections using compact disk stamping technology and excimer laser hole drilling.

Country

United States

Language

English (United States)

This text was extracted from an ASCII text file.

This is the abbreviated version, containing approximately
71% of the total text.

Method of Making Multilayer Packages by Stamping and
Laser Ablation

Disclosed is
a process for making multilayer connections
using compact disk stamping technology and excimer laser hole
drilling.

Stamping to
make compact disks reproduces the dots and dashes
of the master with a resolution of 100 Ao troughs in plastic 1/2
micron wide and 1/2 micron deep can be produced with excellent
fidelity. The troughs are generally 3 or
4 times longer than they
are wide, and it seems clear that long lines can be made by the same
technology. However, the material cannot
be "punched through" clear
to an underlying metal connection, because some material is always
left at the bottom of the hole.

Trenches in
plastic material can be etched by excimer laser
projection or contact mask technology.
If there is metal at the
bottom of the trench, the excimer laser etching stops and cleans the
metal well. However, the etching depth
is difficult to control if
there is no "etch stop," and uniform depth lines cannot be made by
this method.

The
combination of the stamping lines, which stops precisely at
the right depth, and the excimer laser ablation, which opens holes to
metal lines, use each others strengths and cancel the weaknesses. A
layer of conducting parallel lines can be made in just 5 process
steps, half the number needed for conventional processing where studs
must be built up for connections, then lines laid down using the same
set of p...