Rootline

Micro Assembly Day 2016

On March 10, 2016, Finetech will hold the Micro Assembly Day 2016. This one-day conference is a platform for active knowledge-sharing and networking, aimed at experts and interested professionals from industry and science. It highlights current advanced packaging technologies and applications and offers insight in the latest micro assembly trends and concepts. High-profile speakers from industry and science will provide in-depth information on the current state of technology as well as their actual implementation in current market applications.

As a long-standing technology partner for assembly and packaging, Finetech offers a wide range of expertise. Accordingly, the thematic agenda of the Micro Assembly Day is dedicated to a variety of trending topics, such as laser-assisted bonding, precision vacuum die bonding, ACF bonding or sinter process integration in high-accuracy assembly applications.

Please note: the Micro Assembly Day 2016 is already fully booked. Thanks for the great response!

Your benefits

» Insight in technology trends and latest applications» New contacts with potential partners» Inspiration and ideas for your own projects» Access to technological know-how» Overview of new product developments» Individual consultation on your application challenge (on March 11, 2016)

What can you expect?

» Presentations on innovative developments» Hands-on machine demos» Exciting discussions in a pleasant atmosphere» Guided tour of the new Finetech development and production center» Joint dinner on March 09, 2016

Location & Language

Location: Finetech Production & Development Center, Berlin-Marzahn

Language: Due to the international background of the participants, the official language for presentations and discussions is English.