Description:

The RTP 8108 is a rapid thermal processing tool capable of rapid thermal annealing and rapid thermal oxidation of 4" and 6" wafers at temperatures of up to 1150 degrees C. The tool is configured with Oxygen, Argon, Forming Gas (2.8% H2, balance Argon) and Nitrogen. Gas flow ranges are up to 10 SLPM.

Applications:

The RTP 8108 is a MOS compatible tool. This tool follows all of the same restrictions that pertain to the MOS diffusion furnaces with respect to cleanliness and materials.

This material is based upon work supported by the National Science Foundation under Grant No. ECCS-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.