AMD teaming up with Celsia for better passive cooling

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In systems where both energy limitations and heat flow are major considerations, passive cooling has been an increasingly popular solution, though not always the best one. Heatsinks are often just not enough to do the job, but as they become more sophisticated they are closing the performance gap with active heat reduction like fans or piping. Celsia has made the heatsink into something more complicated, with water vapor and micro-scale grilles aiding in spreading the heat around faster and better.

AMD is teaming up with these guys to make something nice for its high-end video cards. That’d be another leg up on NVIDIA, as they’ve already pretty much got them beat in price and performance; efficiency and low heat would be icing on the cake.

“Working with AMD, we were able to meet all of the design criteria for
a new GPU cooler. Namely, it had to be lighter, perform better and be lower
cost than the current heat pipe based design,” said Joe Formichelli,
Celsia’s CEO. “Unlike thermal modules using heat pipes, our two-phase
NanoSpreader comes in direct contact with the heat source whereby removing
costly, heavy base plates.”

As part of AMD’s technology development project, Celsia has been
invited to present at the 2008 AMD Technical Forum and Exposition tomorrow
in Taiwan. Additionally, a short video explaining Celsia’s NanoSpreader
vapor chamber technology will be shown as part of the conference’s opening
presentation.

OverviewAllegheny Technologies Incorporated is one of the largest and most diversified specialty materials and components producers in the world with revenues of approximately $3.9 billion for the last twelve months. ATI has approximately 9,500 full-time employees world-wide who use innovative technologies to offer global markets a wide range of specialty materials solutions.