Overseas

Removal of residues, surface reforming, and ashing of φ4 to 6 inch wafers is possible by using this new plasma cleaner.
The automatic conveying mechanism contributes to prevention of wafer cracking and reduction of personnel expenses and operation time due to wafer transfer.
In addition, the process chamber achieves high throughput by simultaneous processing of two wafers.
【Features】
■Compact design：1400(W)×3000(D)×1900(H)mm
■Distribution：± 5% or less in a wafer
■Ultra-thin piezoelectric wafers such as SAW device
■Ar plasma cleaning (option)
※Please see the document for details. Please do not hesitate to contact us.

ALD (Atomic Layer Deposition) forms a thin film by repeating cycles of the Atomic Layer Deposition method that forms a single atomic layer in one cycle.
Enabling uniform layer control at an atomic layer level can form a thin film with high quality as well as high step-coverage.

The new developed sputtering and polymerization system integrated with injection molding system SPP-SERIES enables fully automatic formation of metallic and protective films on resin substrates used in the automobile and decoration industries.