I didn’t think it could be done but there are simple tools available to downsize tempered glass for quality control or failure analysis. With a custom scribing mechanism our FlexScribe can be used to downsize tempered glass for quality control or failure analysis. Read More….

LatticeGear has you covered from all sides!

Booth 220, Phoenix Convention Center October 30-31

NEW FlexScribe topside scriber, it’s a MUST SEE (Monday October 29- 5-6pm)

The FlexScribe is LatticeGear’s latest sample preparation solution. It complements the patented FlipScribe® and LatticeAx® scribing and cleaving solutions.

The FlexScribe Station is a topside scriber, superfast, clean, simple station for downsizing by scribing. With a single platform, it scribes large samples up to 200 mm to samples down to 5 mm without restrictions on shape or thickness. Scribe a wide variety of crystalline and amorphous materials.

Learn how you can downsize wafers and prepare samples in the cleanroom—without compromising the cleanliness of the cleanroom or wafers. Contact lg@latticegear.com for a copy of the paper.

First you may ask “Why implement a cleaving process in the cleanroom?”:

Here is what the Operations Director of a National Nanofabrication Facility had to say,

“Here at our nanofabrication facility, we found that after installing the micro-indent [LatticeAx 420] in our cleanroom, users are no longer cleaving samples in the lithography area. Additionally, the “cleaner” cleaving process of the micro-indent creates very few shards and particles that are easily vacuumed. Users are motivated by the capabilities of the LatticeAx and rewarded with a cleaner process. It’s a win-win scenario”

LatticeGear presents a process and data showing how the LatticeAx 420 scribeless cleaving system was used to cleanly cleave wafers. To obtain statistics, 60 samples were cleaved out of 10 whole, 4” silicon wafers. The results showed no increase in particle count.

When cleaving pliers are used correctly they can produce long straight cleaves on crystalline substrates or wafers. When the wrong jaws are installed or the user tries to cleave with the sample in the wrong orientation disaster can occur!

The LatticeScriber uses an 8 pt diamond scribe for a scribing a wide range of electronic substrates. It is designed to allow scribing with both the facet edge and the facet flat to accommodate different scribing requirements.

Are you scribing with the LatticeScriber? Are you thinking about buying a LatticeScriber?

How to select the best scribing and cleaving methods, workflows, accessories, and tools to cross-section and downsize your samples? Even glass, silicon and sapphire without saws, lasers or lubricants. Learn and See the LatticeAx, FlipScribe, small sample cleaver (SSC) and new accessories in action. This workshop and live demonstration is offered at no cost. RSVP to: info@nt-s.com.au

Failure analysis (FA) on MEMS devices involves decapsulating the bonded MEMS device. If the decapsulation is destructive and/or contaminating, it will affect the analysis and lead to wrong conclusions.Therefore, it is of great importance to establish a reliable (with high success rate and least damages/risks) approach for MEMS decapsulation.

Download the Poster from IPFA 2107 and learn how engineers at Global Foundries developed a novel method, using the LatticeAx cleaving tool, to decapsulate their MEMS devices.

LatticeGear LLC Announces New Representation in China for Their Innovative Cleaving and Scribing Solutions for Electronics Failure Analysis and Materials Research

LatticeGear will introduce Hong Kong Guanghong International Co., Ltd. at the 24th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2017) in Chengdu, China, 4-7 July 2017.

“We are very excited to introduce our new partner at IPFA 2017,” said Efrat Moyal, Co-Founder of LatticeGear. “Hong Kong Guangdong International Co., Ltd. has a very strong background in both semiconductor failure analysis and electron microscopy. Their ability to relate to customer challenges when it comes to preparing a variety of samples will be a great asset for not only identifying the best solutions for a particular use case, but also for helping customers improve their sample preparation success rates.”

“It is our pleasure to cooperate with LatticeGear to bring high quality, high accuracy, yet very easy to use cleaving and scribing systems to China,” states Michael Heng, Sales Director at Hong Kong Guangdong International Co. Ltd. “We expect that the LatticeGear systems will be in demand in China for sample preparation because they are cleanroom compatible, high accuracy and offer reproducibility for routine tasks, all at a price that is affordable for most customers.”

Visit LatticeGear in Stand 40 at IPFA 2017, 4-7 July 2017, in Chengdu, China, to meet the team from Hong Kong Guangdong International, and see the innovative LatticeAx® scribeless cleaving system and FlipScribe® backside scriber, among other LatticeGear solutions.

About LatticeGear LLC

LatticeGear was founded in 2012 by two women with extensive experience in the semiconductor industry who believed passionately that materials cleaving and scribing should be easy and fast. LatticeGear specializes in cleaving and scribing solutions and the resources that enable their users to quickly achieve clean, straight cross sections and precision sample downsizing for materials characterization, research and development as well as failure analysis. The innovative LatticeAx® scribeless cleaving system and FlipScribe® back side scribing tool are easy to use, delivering the flexible, repeatable and high accuracy processes to meet stringent sample preparation requirements, even in the cleanroom. Learn more at http://www.latticegear.com/.

About Hong Kong Guanghong International Co., Ltd. (GHITC)
GHITC provides sales and service for nanotechnology-related equipment, supporting both semiconductor failure analysis and materials research applications from their headquarters in Shanghai. Their team includes experts in electron microscopy, as well as in the semiconductor industry. Within China, learn more at www.ghitcsh.com.

Scientists in the Quantum Photonics Group at the Niels Bohr Institute of the University of Copenhagen who are developing new technologies for photonic and quantum-information applications used the LatticeAx to alleviate one of their biggest sample preparation challenges: precise cleaves on small samples without damaging delicate fabricated nanostructures. Scientists are engaged in leading edge research to investigate the quantum interactions between light and nanophotonic semiconductor materials. They needed a way to cleave small sample without damaging the delicate devices. Cleaving using hand held scribers and cleaving tools did not produce the quality needed but the LatticeAx 420 cleaving system was able to do the job.

At ISTFA 2016 in Fort Worth, Texas LatticeGear presented customer results describing how the LatticeAx indenting and cleaving system was used for precise downsizing of a <100 micron thin die that was removed from its package prior to delayering. Delayering a thin, fragile die (layer by layer, edge to edge) is a manual process, an art. Typical downsizing methods such as sawing or manual cleaving can be difficult to control resulting in fractured die and lost targets. A LatticeAx tool owner developed an innovative downsizing solution using the micro line “indent to cleave” process. It is a hands free, 2 minute process. The application is most appealing when the target area is known and the sample thin <100 microns. The following images show the process. Contact lg@latticegear.com for more information on this application.

Recent Comments

About LatticeGear

LatticeGear has developed solutions for preparing the highest quality scribed and cleaved samples. Our smart mechanical solutions deliver samples with speed and simplicity at low startup cost and without service contracts. LatticeGear solutions enable you to get to the business of analysis faster. LatticeGear is a certified Emerging Small Business (ESB), Women Business Enterprise (WBE) and Minority Business Enterprise (MBE), Certification #10516.

Support and Help

Welcome to LatticeGear

LatticeGear has developed solutions for preparing the highest quality scribed and cleaved samples. Our smart mechanical solutions deliver samples with speed and simplicity at low startup cost and without service contracts. LatticeGear solutions enable you to get to the business of analysis faster.