The new optical modules join ColorChip’s multi-generational optical
engine platforms, based on proprietary SystemOnGlass™ technology.
ColorChip’s multi-generational optical engine platform has been refined
over several generations of transceivers and can truly cater to the
pressing challenges of massive data flows worldwide. ColorChip’s PAM4
100G and 400G optical interconnects based on MaxLinear’s Telluride
family are expected to be commercially available later this year.

MaxLinear’s MxL935xx Telluride family of SoCs are key components in the
development of high-speed mega-scale data centers based on 100Gbps
single lambda optical interconnects. The MxL935xx Telluride family of
chips are the world’s first DSP SoCs with integrated electro-absorption
modulated laser (EA-EML) drivers for 100/400Gbps optical interconnects
and breakout mode clocking support for 400Gbps DR4 optical modules. The
MxL935xx allows companies like ColorChip to develop a 100/400Gbps
optical interconnect module in a compact form factor for
intra-datacenter applications with a transmission distance up to 2
kilometers.

"We are excited to see the adoption of our Telluride product family by
ColorChip for their 100Gbps QSFP28 and 400Gbps QSFP-DD transceiver
modules,” said Will Torgerson, Vice President and General Manager of
MaxLinear’s High-Speed Interconnect Group. "We look forward to working
closely with ColorChip to take these designs to production later this
year and help address rapidly increasing data loads driving the
hyperscale datacenters of the future.”

“As the industry transitions to Single Lambda PAM4 based optical
solutions, MaxLinear’s highly integrated, high-performance PAM4 DSP SoCs
along with our ground-breaking uncooled and power efficient EML-based
optical engines enabled us to develop our 100G and 400G optical
interconnect modules,” commented Eli Arad, VP R&D of ColorChip. “We are
excited to partner with MaxLinear to support the immense and
ever-evolving mega-datacenter connectivity demands through a
cutting-edge family of high-speed optical transceivers.”

Technical Details

The Telluride family feature several operating modes allowing them to
interface with multiple generations of switch ASICs (128x25G NRZ,
256x25G NRZ or 256x50G PAM4). This versatility enables 3.2Tbps, 6.4Tbps
or 12.8Tbps front panel capacity per data center rack unit. These SoCs
are suitable for use within QSFP-DD, OSFP and COBO module form factors.

The integrated laser driver delivers greater than 1.8V of single-ended
driver output swing necessary for EA-EML lasers. This output swing
easily meets the optical modulation amplitude (OMA) specification
requirements across the wide operating temperature and bias ranges of
all EA-EML lasers. The chip package also includes all the high frequency
components required for driver and modulator biasing.

MaxLinear has engineered a very high-performance DSP engine in both the
transmit and receive data paths. The resulting superior link-margin
enables single-lane 100Gbps optical wavelength technology by mitigating
many of the limitations of mass production optical components.

The devices feature a comprehensive digital pre-distortion (DPD) engine
in the transmit direction to compensate for laser non-linearity and to
cancel packaging limitations that cause reflections and bandwidth
degradation at these extremely high signal frequencies. On the receive
path, the DSP includes an auto-adaptive signal enhancement engine, which
integrates a continuous time linear equalizer (CTLE), automatic gain
control (AGC), a feed forward equalizer (FFE), and a decision feedback
equalizer (DFE).

MaxLinear’s Telluride family and ColorChip’s new optical interconnect
modules will be on display at MaxLinear’s booth (6509) during the
Optical Fiber Communication Conference and Exhibition from March 5-7,
2019. For an appointment, please contact MaxLinear sales at sales@maxlinear.com.

About ColorChip

ColorChip (www.color-chip.com),
established in 2001, is a technology innovator in the field of photonic
integrated hybrids whose vision is to break open the optical
interconnect bandwidth barrier with high-speed optical transceiver
solutions to support the explosive bandwidth demand of the Datacom and
Telecom markets. Headquartered in Yokneam, Israel, ColorChip leverages
its fully owned, industrialized optics-based FAB dedicated to the
production of PLC based SystemOnGlass™ optical engines, whose glass
platform is the ideal medium for emerging PAM4 applications. ColorChip
has production facilities in Israel and Thailand, and offices in San
Jose, California.

About MaxLinear, Inc.

MaxLinear, Inc. (NYSE: MXL), is a leading provider of radio frequency
(RF), analog and mixed-signal integrated circuits for the connected
home, wired and wireless infrastructure, and industrial and multimarket
applications. MaxLinear is headquartered in Carlsbad, California. For
more information, please visit www.maxlinear.com.

MxL and the MaxLinear logo are trademarks of MaxLinear, Inc. Other
trademarks appearing herein are the property of their respective owners.

Cautionary Note About Forward-Looking Statements

This press release contains “forward-looking” statements within the
meaning of federal securities laws. Forward-looking statements include,
among others, statements concerning or implying future financial
performance, anticipated product performance and functionality, or
trends and growth opportunities affecting MaxLinear, in particular
statements relating to MaxLinear’s Telluride products, including but not
limited to potential market opportunities, functionality, and the
benefits of use of such products, alone and in connection with
ColorChip’s products. These forward-looking statements involve known and
unknown risks, uncertainties, and other factors that may cause actual
results to differ materially from any future results expressed or
implied by these forward-looking statements. We cannot predict whether
or to what extent the availability of our Telluride products will affect
our future revenues or financial performance. Forward-looking statements
are based on management’s current, preliminary expectations and are
subject to various risks and uncertainties that could cause actual
results to differ materially from those described in the forward-looking
statements. Forward-looking statements may contain words such as “will
be,” “will,” “expected,” “anticipate,” “continue,” or similar
expressions and include the assumptions that underlie such statements.
The following factors, among others, could cause actual results to
differ materially from those described in the forward-looking
statements: intense competition in our industry and product markets;
risks relating to the development, testing, and commercial introduction
of new products and product functionalities; the ability of our
customers to cancel or reduce orders; uncertainties concerning how end
user markets for our products will develop; our lack of long-term supply
contracts and dependence on limited sources of supply; potential
decreases in average selling prices for our products; and the potential
for intellectual property litigation, which is prevalent in our
industry. In addition to these risks and uncertainties, investors should
review the risks and uncertainties contained in MaxLinear’s filings with
the United States Securities and Exchange Commission, including risks
and uncertainties identified in our Annual Report on Form 10-K for the
year ended December 31, 2018. All forward-looking statements are
qualified in their entirety by this cautionary statement. MaxLinear is
providing this information as of the date of this release and does not
undertake any obligation to update any forward-looking statements
contained in this release as a result of new information, future events,
or otherwise.