Specifically, a highly specialized composition analysis of the OSP-coated PCB is employed to confirm that an authentic ENTEK OSP is being used as specified by the OEM. Upon confirmation, a detailed review of the PCB fabricator’s OSP process line, including chemistry (cleaning, topography enhancement, precoat, OSP), equipment, and operating parameters is undertaken with the objective of ensuring PCB performance, yields and quality at the lowest cost of ownership.

According to the International Electronics Manufacturing Initiative (iNEMI), "Counterfeit electronic components, materials and assemblies are not a new phenomenon; however, global trade of counterfeits has increased markedly in recent years. Electronic counterfeits affect every segment of the market, and the use of undetected counterfeits can lead to increased scrap rates, early field failures, and increased rework rates, and -- in high-reliability applications -- can have far more serious consequences with severe or lethal outcomes. Regardless of the nature of the counterfeits, whether cloned, skimmed or re-branded, these components and materials are too expensive and dangerous to be ignored." (iNEMI -September 16, 2013)