The United States of America

The Secretary of the Army

...other attempts to simplify the manufacturing process focused on the interconnection of components. In 1949 Danko and Abrahamson [sic] of the Signal Corps announced the "Auto-Sembly" process,4 in which component leads were inserted into a copper foil interconnection pattern and dip soldered. With the development of board lamination and etching techniques, this concept evolved into the standard printed circuit board fabrication process in use today.