DIE BONDING TOOLS

At PECO, we seek to satisfy every customer need from quality and specialization to design with our world-class manufacturing. From raw materials to final production, we control every part of the process for a product that is truly customized and state-of-the-art
Rubber collets are used to transfer the die from the wafer mounting tape to a substrate without damage or stress to the chip during the die bonding process. Our rubber tips feature a wide variety of designs and sizes to fit our customers’ individual needs. Available in Rectangular, Round, Flat, and Customized, our robber collets are both economical, reliable, and of the highest quality.