GEN 2 enhancements offers improved RF input performance to 5GHz for a 16×16 configuration and scalability from the base portfolio 16×16 solution. There are engineering samples available right now with production planned for June 2019 to meet China and Japan needs in 2020.

Coming in 2020, GEN 3 will feature extended RF performance including a full sub-6 GHz Direct-RF performance at 14 bits; a 20% power reduction in RF-DC for the TDD use case; and extended mmWave interfacing. The improvements over Gen 2 include increased ADC sample rate at 5 Gsps and DAC at 10 Gsps. The new generation will offer a reduced BOM, lower system cost, and simplified design with greater flexibility. Samples will be available in 2Q2019 with production in 3Q 2020.