Muhannad S. Bakir received the B.E.E. degree (summa cum laude) from Auburn University, Auburn, AL, in 1999 and the M.S. and Ph.D. degrees in electrical and computer engineering from the Georgia Institute of Technology (Georgia Tech) in 2000 and 2003, respectively.

He is currently an Associate Professor and the ON Semiconductor Junior Professor in the School of Electrical and Computer Engineering at Georgia Tech. He was a Research Engineer at the Nanotechnology Research Center/Microelectronics Research Center at Georgia Tech from 2003-2010. His areas of interest include three-dimensional (3D) electronic system integration, advanced cooling and power delivery for 3D systems, biosensors and their integration with CMOS circuitry, and nanofabrication technology. He is the editor of a book entitled Integrated Interconnect Technologies for 3D Nanoelectronic Systems (Artech House, 2009) and is the author/coauthor of more than 90 journal publications and conference proceedings, 6 book chapters, 14 US patents, multiple invited presentations, and the presenter of 2 conference tutorials, including an invited tutorial on 3D technology at the 2007 International Solid-State Circuits Conference (ISSCC).

Dr. Bakir is the recipient of the 2013 Intel Early Career Faculty Honor Award, the 2012 DARPA Young Faculty Award, the 2011 IEEE CPMT Society Outstanding Young Engineer Award, and was an Invited Participant in the 2012 National Academy of Engineering Frontiers of Engineering Symposium. He is also a recipient of the Semiconductor Research Corporation (SRC) Inventor Recognition Awards (2002, 2005, 2009). Dr. Bakir received the Best Invited Paper Award from the 2007 IEEE Custom Integrated Circuits Conference (CICC), the Best Paper Award from the 2002 Electronic Components and Technology Conference (ECTC), the Outstanding Paper Award from the 2007 Electronic Components and Technology Conference (ECTC), the co-recipient of the Outstanding Interactive Presentation Paper Award from the 2012 IEEE Electronic Components and Technology Conference (ECTC), the co-recipient of the First Place Best Paper Award from the 2012 IEEE Global Interposer Workshop, the co-recipient of the Best Student Paper Awards from the 2005, 2006, 2008 IEEE International Interconnect Technology Conference (IITC), the co-recipient of the Motorola Electronic Packaging Student Paper Award from the 2008 Electronic Components and Technology Conference (ECTC), the co-recipient of the SRC Best in Session Paper Award from the 2009, 2010, and 2011 TECHCON, the co-recipient of the Best Student Paper Award and the Best Paper in Session Award from the 2009 International Symposium on Microelectronics, and the co-recipient of the IETE-CDIL Award for Industry for the best 2010 journal paper award from IETE.

Dr. Bakir serves as a committee member for the IEEE Photonics Society Annual Meeting, the IEEE International 3DIC Conference, and the IEEE International Interconnect Technology Conference. He is an Associate Editor of IEEE Transactions on Components, Packaging and Manufacturing Technology, and was a Guest Editor of the June 2011 Special Issue of IEEE Journal of Selected Topics in Quantum Electronics. He is also a member of the International Technology Roadmap for Semiconductors (ITRS) technical working group for Assembly and Packaging (AP). Dr. Bakir is the Associate Director of the Georgia Tech Interconnect and Packaging Center (IPC).