The extension of scaling of advanced IC devices has required
the implementation of many new materials to optimize speed and thermal
characteristics. Starting with copper high-volume manufacturing (HVM) ramp to
the commercialization of high-k gate dielectrics and metal gates, more new
materials have been introduced over the last four nodes than in any other
comparable period of time. In addition to the implementation of these new
materials, many more materials have been proposed and evaluated for potential
use in HVM. Further complicating the emergence of these materials is the
development of new processing techniques such as ALD or porous SiCOH film
deposition. These new techniques further enhance the profound changes apparent
in the business model of materials suppliers to develop, evaluate, introduce,
source and supply to manufacturers, often in smaller volumes that have been
sent in the past.

This paper will examine technical and business aspects of
the materials business including the introduction of high-k dielectrics and
metal gates; novel processes in the front end; back end developments such as
the conversion of memory interconnect to copper; and developments in the
damascene interconnect schemes. In addition, we will review implications of the
troubles litho roadmap, and discuss the size and timing of business
opportunities for suppliers.