The behavior of transient charging processes at interfaces has become increasingly important in the manufacture of materials on the micron-scale and below. Herein, the modeling and simulation of processes occurring at liquid-solid and vacuum-solid interfaces are considered. For the liquid-solid interface, an electrochemical machining system is modeled using equivalent circuits. Comparisons are then made between experimental and model results for transient current response and machining resolution. Predictions are given regarding the use of complex electrode shapes. For the vacuum-solid interface, surface charging of dielectric under plasma bombardment is considered. A high aspect ratio structure with varying absolute dimension is used with a bimodal ion energy distribution, and the resulting fluxes and energies of ions investigated.2.1 Schematic of ECM-USVP system, indicating the different re- sistances
encountered by current pathways. Lines at the ... 6 2.2 Schematic of the
electrochemical double layer. ... For this calculation, j0 is 1 Am 10a3 A/m2, T is 300
K, and Ip is 0.5.