Intel® EP80579 Integrated Processor Product Line: Thermal Guide

Intel® EP80579 Integrated Processor Product Line: Thermal Guide

The power dissipation required for electronic components has risen along with the increase in complexity of computer systems. To ensure quality, reliability, and performance goals are met over a product's life cycle, the heat generated by the component must be properly dissipated. Typical methods to improve heat dissipation include selective use of airflow ducting, and/or the use of heatsinks.