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Abstract:

A pattern forming method includes: performing a first droplet ejection
step by ejecting droplets containing 0.1%-2% polysiloxane by mass onto a
substrate; performing a first layer forming step by solidifying the
droplets ejected onto the substrate so that a first layer is formed;
performing a second droplet ejection step by ejecting more droplets over
the first layer; and performing a second layer forming step by
solidifying the droplets ejected onto the first layer so that a second
layer is formed.

Claims:

1. A pattern forming method comprising: performing a first droplet
ejection step by ejecting droplets containing 0.1%-2% polysiloxane by
mass onto a substrate; performing a first layer forming step by
solidifying the droplets ejected onto the substrate so that a first layer
is formed; performing a second droplet ejection step by ejecting more
droplets over the first layer; and performing a second layer forming step
by solidifying the droplets ejected onto the first layer so that a second
layer is formed.

2. The pattern forming method according to claim 1, wherein a
hydrophilic-lipophilic balance value of the polysiloxane is 5 to 12.

3. The pattern forming method according to claim 1, wherein the second
droplet ejection step includes ejecting the droplets so that the droplets
do not protrude from over the first layer.

4. The pattern forming method according to claim 1, wherein the droplets
include a component that solidifies under active light, and the first
layer forming step and the second layer forming step include irradiating
the droplets with the active light.

5. The pattern forming method according to claim 4, wherein the active
light is ultraviolet light.

6. The pattern forming method according to claim 1, wherein the substrate
is a semiconductor substrate having a semiconductor device, and the first
droplet ejection step includes ejecting droplets on the semiconductor
device.

[0005] In recent years, droplet-ejecting apparatus that form an image or
pattern on a recording medium using UV-curable ink, which cures upon
irradiation with ultraviolet light, have been receiving attention.
UV-curable ink, which dries extremely slowly until irradiated with
ultraviolet light, at which point it rapidly cures, has properties
favorable for use as a printer ink. Because no solvent is evaporated when
it cures, this type of ink also has the advantage of placing little
burden upon on the environment.

[0006] UV-curable ink also demonstrates high bondability to a variety of
recording media depending on vehicle composition. It also possesses many
superior properties, such as chemical stability after curing,
adhesiveness, chemical resistance, weather resistance, friction
resistance, and the ability to withstand outdoor environments. For this
reason, along with thin, sheet-like recording media such as paper, resin
film, metal foil, and the like, UV ink can also form images on materials
with surfaces having some degree of three-dimensionality, such as
recording media labels, textile products, and the like. Techniques are
known in which a droplet ejection method is used to print attribute
information such as manufacturing number and manufacturer on an IC on a
substrate using a UV-curable ink as described above (see, for example,
Japanese Laid-Open Patent Application Publication No. 2003-080687).

SUMMARY

[0007] However, the following problem is present in the above described
prior art.

[0008] In recent years, ICs have become progressively smaller and thinner.
For this reason, the ability to form highly visible, fine patterns is
sought.

[0009] In light of the above circumstances, the present invention has as
an object thereof the provision of a pattern forming method capable of
forming highly visible, fine patterns.

[0010] The pattern forming method according to one aspect of the present
invention includes a first droplet ejection step of ejecting droplets
containing 0.1%-2% polysiloxane by mass onto a substrate, a first layer
forming step of solidifying the droplets ejected upon the substrate so
that a first layer is formed, a second droplet ejection step of ejecting
more droplets over the first layer, and a second layer forming step of
solidifying the droplets ejected upon the first layer so that a second
layer is formed.

[0011] Because the droplets of the present invention include 0.1%-2% by
mass of polysiloxane, the contact angle of the first layer and the
droplet ejected thereupon is greater than the contact angle of the
substrate and the droplets ejected thereupon. For this reason, it is
possible to prevent the second layer from spreading over the first layer
when forming, and to form a second layer that is finer than the first
layer. Because the first layer and second layer can be formed
three-dimensionally, it is possible to form highly visible, fine
patterns.

[0012] In the above pattern forming method, the HLB value of the
polysiloxane is preferably from 5 to 12.

[0013] Because the HLB value of the polysiloxane in the present invention
is from 5 to 12, it is possible to more reliably ensure that the contact
angle of the first layer and the droplets ejected thereupon is greater
than the contact angle of the substrate and the droplets ejected
thereupon.

[0014] In the above pattern forming method, it is preferable that the
second droplet ejection step include eject the droplets so as not to
protrude from over the first layer.

[0015] Because the droplets of the present invention are ejected so as not
to protrude from over the first layer, it is possible to form fine
patterns with high visibility.

[0016] In the pattern forming method, it is preferable that the droplets
include a component that solidifies under active light, and that the
first layer forming step and second layer forming step include
irradiating the droplets with the active light.

[0017] Because effective solidification of the droplets ejected onto the
substrate within the present invention is possible, reductions in the
size and price of an apparatus are aided.

[0018] In the above pattern forming method, it is preferable that the
active light be ultraviolet light.

[0019] Because effective curing of the droplets ejected onto the substrate
within the present invention is possible, reductions in apparatus size
and price are enabled.

[0020] In the above pattern forming method, it is preferable that the
substrate be a semiconductor substrate having a semiconductor device, and
that the first droplet ejection step include ejecting droplets upon the
semiconductor device.

[0021] When forming a layered pattern composed of a first layer and a
second layer upon the semiconductor device of the semiconductor substrate
having a semiconductor device according to the present invention, it is
possible to form a pattern with a high degree of adhesiveness displaying,
for instance, attribute information of the semiconductor device.

BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Referring now to the attached drawings which form a part of this
original disclosure:

[0023]FIG. 1A is a schematic overhead view of a semiconductor substrate,
and FIG. 1B is a schematic overhead view of a droplet ejecting apparatus.

[0024] FIGS. 2A to 2C are schematic illustrations of a feeding part.

[0025]FIG. 3A is an outline perspective view of the configuration of an
application part, and FIG. 3B is a schematic side view of a carriage.

[0026]FIG. 4A is an illustration of a head unit, and FIG. 4B is an
illustration of the structure of a droplet ejection head.

[0027] FIGS. 5A to 5C are schematic illustrations of a storage unit.

[0028] FIGS. 6A to 6C are illustrations of the configuration of a
transporting part.

[0029]FIG. 7 is an illustration of a detection light being shone upon a
semiconductor substrate 1 by a detection device.

[0033] An embodiment of a printing device according to the present
invention will be described below with reference to FIGS. 1 through 9.

[0034] The embodiment described below merely illustrates one aspect of the
present invention; the present invention is not limited thereto, and
various modifications within the technical scope of the invention may be
made as desired. In the below drawings, the scale and measurements of the
various structures are different from those used in actuality in order to
aid understanding of the various configurations thereof.

Semiconductor Substrate

[0035] First, a semiconductor substrate will be described as an example of
a target of drawing/printing using a printing device. FIG. 1A is a
schematic overhead view of a semiconductor substrate. As illustrated in
FIG. 1A, the semiconductor substrate 1 forming the substrate has a
substrate 2 and a semiconductor device 3. The substrate 2 need only be
heat resistant and capable of allowing the semiconductor device 3 to be
mounted thereupon, and a glass epoxy substrate, paper phenolic substrate,
paper epoxy substrate, or the like can be used as the substrate 2. The
semiconductor device 3, which acts as a recording medium, can be a
package substrate material or a semiconductor substrate material.

[0036] A semiconductor device 3 is mounted upon the substrate 2. Markings
such as a company logo 4, model code 5, manufacturing number 6, and the
like are present upon the semiconductor device 3 as printed or otherwise
delineated patterns. These markings are printed by a printing device
described below.

[0038] As shown in FIG. 1B, the printing device 7 is primarily constituted
of a plurality of processing devices that perform printing-related
processes, including a feeding part 8, a pre-processing part 9, an
application part (printing part) 10, a cooling part 11, a storage unit
12, a transporting part 13, a post-treatment part 14, and a controller
CONT (see FIG. 8).

[0039] In the following description, the direction in which the feeding
part 8 and storage unit 12 are aligned and the direction in which the
pre-processing part 9, cooling part 11, and post-treatment part 14 are
aligned will be referred to as the "X direction". The direction
perpendicular to the X direction will be referred to as the "Y
direction"; and the application part 10, cooling part 11, and
transporting part 13 are aligned in the Y direction. The vertical
direction will be referred to as the "Z direction".

[0040] The feeding part 8 has a container containing a plurality of
semiconductor substrates 1. The feeding part 8 has a relay position 8a,
and the semiconductor substrates 1 are supplied from the container to the
relay position 8a. The relay position 8a is provided with a pair of rails
8b extending in the X direction disposed at roughly the same height as
the semiconductor substrates 1 dispensed from the container.

[0041] The pre-processing part 9 has a function of heating and modifying
the surface of the semiconductor device 3. The pre-processing part 9
regulates the spreading of the droplets ejected onto the semiconductor
device 3 and the adhesiveness of the printed markings. The pre-processing
part 9 has a first relay position 9a and a second relay position 9b, and
takes in an unprocessed semiconductor substrate 1 from the first relay
position 9a or the second relay position 9b, and modifies the surface
thereof. Afterwards, the pre-processing part 9 transfers the processed
semiconductor substrate 1 to the first relay position 9a or the second
relay position 9b, and rests the semiconductor substrate 1 there. The
first relay position 9a and second relay position 9b together form a
relay position 9c. Processing position 9d is the position within the
pre-processing part 9 wherein the pre-processing is performed.

[0042] The cooling part 11 is disposed at the relay position of the
application part 10, and has the function of cooling the semiconductor
substrate 1 after the same has been heated and surface modified by the
pre-processing part 9. The cooling part 11 has processing positions 11a
and 11b that each retain and cool the semiconductor substrate 1. The
processing positions 11a and 11b are referred to collectively as
processing position 11c.

[0043] The application part 10 has the function of ejecting droplets onto
the semiconductor device 3 so as to mark out (print) a marking, and
solidifying or curing the delineated marking. The application part 10
transfers the unprinted semiconductor substrate 1 from the relay position
constituted by the cooling part 11 and performs marking and curing.
Afterwards, the application part 10 transfers the printed semiconductor
substrate 1 to the cooling part 11 and rests the semiconductor substrate
1 there.

[0044] The post-treatment part 14 performs post-processing by reheating
the semiconductor substrate 1 positioned on the cooling part 11 after
marking has been performed by the application part 10. The post-treatment
part 14 has a first relay position 14a and a second relay position 14b.
The first relay position 14a and second relay position 14b together form
a relay position 14c.

[0045] The storage unit 12 has a container capable of containing a
plurality of semiconductor substrates 1. The storage unit 12 has a relay
position 12a, and a semiconductor substrate 1 is transferred from the
relay position 12a into the container. The relay position 12a is provided
with a pair of rails 12b extending in the X direction disposed at roughly
the same height as the container containing the semiconductor substrates
1. An operator transports the container containing the semiconductor
substrates 1 out of the printing device 7.

[0046] A transporting part 13 is disposed in a central position of the
printing device 7. The transporting part 13 has a scalar robot equipped
with an arm 13b. A gripper 13a that grips the semiconductor substrate 1
in a cantilevered manner and supports it from its reverse side
(undersurface) is provided on a tip of the arm 13b. The relay positions
8a, 9c, 11, 14c, and 12a are positioned within the range of movement of
the gripper 13a. Thus, the gripper 13a is capable of transporting a
semiconductor substrate 1 between the relay positions 8a, 9c, 11, 14c,
and 12a. The controller CONT is a device for controlling the overall
operation of the printing device 7, and supervises the operating status
of each part of the printing device 7. The controller also issues a
command signal to the transporting part 13 to transport the semiconductor
substrate 1. In this way, the semiconductor substrate 1 passes through
each part in turn and is printed.

Feeding Part

[0047]FIG. 2A is a schematic front view of a feeding part, and FIGS. 2B
and 2C are schematic side views of a feeding part. As shown in FIGS. 2A
and 2B, the feeding part 8 has a base 15. A lift device 16 is provided
within the base 15. The lift device 16 has a direct actuation mechanism
that operates in the Z direction. Mechanisms such as a ball screw/rotary
motor combination, a hydraulic cylinder/oil pump combination, or the like
may be used as the direct actuation mechanism. In this embodiment, a
mechanism formed from, for example, a ball screw and a stepper motor is
employed. A lift platform 17 connected to the lift device 16 is provided
on an upper side of the base 15. The lift platform 17 is configured so as
to be able to ascend and descend only a predetermined distance using the
lift device 16.

[0048] A cuboidal container 18 is provided above the lift platform 17,
inside of which are contained a plurality of semiconductor substrates 1.
An opening 18a is formed on both surfaces of the container 18 in the X
direction, through which the semiconductor substrates 1 may enter and
exit. Convex rails 18c are formed on the interiors of two side surfaces
18b on both sides of the container 18 in the Y direction, and the rails
18c extend in the X direction. The rails 18c are arrayed in a plurality
of equidistant intervals in the Z direction. The semiconductor substrates
1 are inserted along the rails 18c in the X direction or the negative X
direction and are stored arranged in the Z direction.

[0049] An ejector 23 is provided on a side of the base 15 in the X
direction with a supporting member 21 and support platform 22 disposed
therebetween. An ejector pin 23a, provided on the ejector 23 is thrust
outwards in the X direction by a direct actuation mechanism similar to
that of the lift device 16 so as to push a semiconductor substrate 1 out
towards the rails 8b. As such, the ejector pin 23a is disposed at roughly
the same height as the rails 8b.

[0050] As illustrated in FIG. 2C, the ejector pin 23a of the ejector 23 is
projected in the positive X direction so that a semiconductor substrate 1
positioned slightly higher along the positive Z direction than the rails
18c is ejected from the container 18, moving onto and supported by the
rails 8b.

[0051] After the semiconductor substrate 1 has moved onto the rails 8b,
the ejector pin 23a returns to a standby position as shown in FIG. 2B.
Next, the lift device 16 lowers the container 18 so that the next
semiconductor substrate 1 to be processed arrives at a height level with
the ejector pin 23a. After this, the ejector pin 23a is projected
outwards as described above so as to move the semiconductor substrate 1
onto the rails 8b.

[0052] In this way, the feeding part 8 moves the semiconductor substrates
1 in order from the container 18 onto the rails 8b. After all the
semiconductor substrates 1 within the container 18 have been moved onto
relay positions 9a and 9b, an operator replaces the empty container 18
with another container 18 containing semiconductor substrates 1. In this
way, semiconductor substrates 1 can be fed into the feeding part 8.

Pre-Processing Part

[0053] The pre-processing part 9 performs pre-processing at processing
position 9d upon the semiconductor substrates 1 conveyed to the relay
positions 9a and 9b. Examples of such pre-processing include irradiation
of the heated substrate with active light generated by a low-pressure
mercury vapor lamp, hydrogen burner, excimer laser, plasma discharger, or
the like. Using a mercury vapor lamp enables the hydrophobicity of the
surface of the semiconductor substrate 1 to be modified by irradiating
the semiconductor substrate 1 with ultraviolet light. Using a hydrogen
burner enables the surface to be roughened by partially reducing the
oxidized surface of the semiconductor substrate 1. Using an excimer laser
enables the surface to be roughened by partially melting and solidifying
the surface of the semiconductor substrate 1. Using a plasma or corona
discharger enables surface roughening by mechanically abrading the
surface of the semiconductor substrate 1. In this embodiment, a mercury
vapor lamp is employed. After pre-processing is complete, the
pre-processing part 9 transfers the semiconductor substrate 1 to the
relay position 9c. Next, the transporting part 13 removes the
semiconductor substrate 1 from the relay position 9c.

Cooling Part

[0054] The cooling part 11 is provided with processing positions 11a and
11b, and has cooling platforms 110a and 110b that are heat sinks or the
like, the upper surfaces of which hold the semiconductor device 3 in
place using suction. The processing positions 11a and 11b (cooling
platforms 110a and 110b) are positioned within the range of motion of the
gripper 13a, and the cooling platforms 110a and 110b are exposed at the
processing positions 11a and 11b. Thus, the transporting part 13 is
capable of easily placing the semiconductor substrates 1 on the cooling
platforms 110a and 110b. After the semiconductor substrate 1 has been
cooled, the semiconductor substrate 1 is left resting on cooling platform
110a at processing position 11a or on cooling platform 110b at processing
position 11b. Thus, the gripper 13a of the transporting part 13 is
capable of easily gripping and transporting the semiconductor substrate
1.

Application Part

[0055] Next, the application part 10, which ejects droplets onto a
semiconductor substrate 1 to form markings, will be described with
reference to FIGS. 3 through 6. A variety of devices for ejecting
droplets are available, but a device using an inkjet method is preferred.
An inkjet method allows microscopic droplets to be formed, making it well
suited to fine processing.

[0056]FIG. 3A is an outline perspective view of the configuration of an
application part. Droplets are ejected onto the semiconductor substrate 1
by the application part 10. As illustrated in FIG. 3A, the application
part 10 has a cuboidal base 37. The direction in which the droplet
ejection head and the ejected material moves relative to each other when
droplets are ejected is the primary scanning direction. The direction
perpendicular to the primary scanning direction is the secondary scanning
direction.

[0057] The secondary scanning direction is the direction in which the
droplet ejection head and the ejected material move relative to each
other when shifting lines. In this embodiment, the Y direction (second
direction) is the primary scanning direction, and the X direction (first
direction) is the secondary scanning direction.

[0058] A pair of guide rails 38 extending in the X direction is provided
along the entire length of the X direction on an upper surface 37a of the
base 37. A stage 39 having a direct actuation mechanism not shown in the
drawings is attached to an upper side of the base 37 corresponding to the
pair of guide rails 38. A linear motor, screw-type direct actuation
mechanism, or the like may be used as the direct actuation mechanism of
the stage 39. In this embodiment, for example, a linear motor is
employed. The stage 39 is configured to travel and return at a
predetermined speed along the X direction. The repetition of traveling
and returning is referred to as scanning. A secondary scanning position
detector 40 is further disposed on the upper surface 37a of the base 37
in parallel with the guide rails 38; this secondary scanning position
detector 40 detects the position of the stage 39.

[0059] A rest surface (rest) 41 is formed on an upper surface of the stage
39, and the rest surface 41 is provided with a vacuum-type substrate
chuck mechanism not shown in the drawings. After a semiconductor
substrate 1 is placed upon the rest surface 41, the semiconductor
substrate 1 is held in place on the rest surface 41 by the substrate
chuck mechanism.

[0060] The position of the rest surface 41 when the stage 39 is positioned
in, for example, the positive X direction is a relay position for a
semiconductor substrate 1 loading or unloading position. The rest surface
41 is disposed so as to be exposed within the range of motion of the
gripper 13a. Thus, the transporting part 13 is capable of easily placing
a semiconductor substrate 1 on the rest surface 41. After the
semiconductor substrate 1 has been coated (markings have been applied),
the semiconductor substrate 1 rests upon the rest surface 41, which is a
relay position. Thus, the gripper 13a of the transporting part 13 is
capable of easily gripping and transporting a semiconductor substrate 1.

[0061] A pair of support platforms 42 is provided on both sides of the
base 37 in the Y direction, and a guide member 43 extending in the Y
direction is provided so as to bridge the pair of support platforms 42. A
guide rail 44 extending in the Y direction is provided along the entirety
of the X direction on the underside of the guide member 43. A roughly
cuboidal carriage (transport means) 45 capable of moving along the guide
rail 44 is formed. The carriage 45 has a direct actuation mechanism, and
the direct actuation mechanism may be one similar to that of, for
example, the stage 39. The carriage 45 scans along the Y direction. A
primary scanning position detector 46 that measures the position of the
carriage 45 is provided between the guide member 43 and the carriage 45.
A head unit 47 is provided on the lower edge of the carriage 45, and a
droplet ejection head not shown in the drawings is provided on the side
of the head unit 47 towards the stage 39.

[0062]FIG. 3B is a schematic side view of a carriage. As shown in FIG.
3B, the head unit 47 and a pair of curing units 48 acting as irradiators
are disposed on the side of the carriage 45 nearer the semiconductor
substrate 1 at equal respective distances from the center of the carriage
45 with respect to the Y direction. A droplet ejection head (ejection
head) 49 that ejects droplets is provided on the side of the head unit 47
nearer to the semiconductor substrate 1.

[0063] A container tank 50 is disposed on the upper side of the carriage
45 as viewed in the drawing; this container tank 50 contains a functional
fluid. The droplet ejection head 49 and container tank 50 are connected
by a tube not shown in the drawings, through which the functional fluid
within the container tank 50 is supplied to the droplet ejection head 49.

[0064] The primary components of the functional fluid are a resin, a
photopolymerization initiator as a curative, and a vehicle or dispersing
medium. A color agent such as a pigment or dye, a functional component
such as a hydrophilic or hydrophobic resurfacing agent, or the like may
be added to the primary components to obtain a functional fluid with
unique functionality. In this embodiment, for example, a white pigment is
added. The resin component of the functional fluid is for forming a resin
layer. There is no particular limitation upon the resin component as long
as it is liquid at room temperature and can be polymerized. Also, a resin
component with low viscosity is preferable, as is one that is an
oligomer. A monomer is especially preferable. The photopolymerization
initiator acts upon a cross-linkable group of the polymer to effect a
crosslinking reaction; an example of one such photopolymerization
initiator is benzyl dimethyl ketal or the like. The vehicle or dispersion
medium regulates the viscosity of the resin component. By adjusting the
functional fluid to a viscosity such that it is easily ejected from the
droplet ejection head, it is possible for the droplet ejection head to
stably eject functional fluid.

[0065] The specific composition of the functional fluid will be described
below.

[0066] An example of the functional fluid of this embodiment is a
radiation-curable inkjet ink composition. The ink composition contains a
polymerizing compound containing at least one compound having a
pentaerythritol skeleton, a photopolymerization initiator, and a
predetermined amount of polysiloxane having an HLB value falling within a
predetermined range. In this disclosure, "HLB" (hydrophilic-lipophilic
balance) is a quantification of the hydrophilic-lipophilic balance of the
polysiloxane. HLB value is as calculated according to the Griffin method.

[0067] The above ink composition has the characteristic of being suited
for use in recording upon a recording medium such as a package substrate
material or a semiconductor substrate material. The additives
(components) included in or capable of being included in the ink
composition of this embodiment will be described below.

Polymerizing Compound

[0068] The polymerizing compound included in the ink composition of this
embodiment is capable of being polymerized through the action of the
photopolymerization initiator described below upon photo-irradiation,
curing the printed ink.

Compound having Pentaerythritol Skeleton

[0069] The ink composition of this embodiment contains one or more types
of compound having a pentaerythritol skeleton (C(CH2O-)4) as a
polymerizing compound.

[0070] Including a compound having a pentaerythritol skeleton in the ink
composition especially improves friction resistance in the cured ink.

[0071] Examples of a compound having a pentaerythritol skeleton include at
least one of (meth)acrylate compounds such as pentaerythritol
tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol
ethoxy-tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate,
dipentaerythritol hexa(meth)acrylate, and polypentaerythritol
poly(meth)acrylate; oxetane compounds such as pentaerythritol
tris(3-ethyl-3-oxetanyl methyl)ether and pentaerythritol
tetrakis(3-ethyl-3-oxetanyl methyl)ether; and ethylene oxide (EO) adducts
and propylene oxide (PO) adducts thereof.

[0072] Of these, a multifunctional (meth)acrylate having a pentaerythritol
skeleton is preferable, and a multifunctional acrylate having a
pentaerythritol skeleton is more preferable. Among multifunctional
(meth)acrylates having a pentaerythritol skeleton, at least one of
pentaerythritol tri(meth)acrylate and pentaerythritol tetra(meth)acrylate
is preferable; one of pentaerythritol triacrylate and pentaerythritol
tetraacrylate is more preferable; and pentaerythritol triacrylate is
still more preferable. A compound such as those described above decreases
ink viscosity and increases ink cross-linkability.

[0073] The above compound having a pentaerythritol skeleton preferably
constitutes from 7 to 25% of the total mass of the ink composition
(100%), more preferably from 10 to 20% by mass. Including an amount of
compound having a pentaerythritol skeleton falling within the above range
yields superior visibility of the recorded image, ink ejection stability,
and friction resistance in the cured ink.

Compound having Both Vinyl Group and (Meth)Acrylate Group in Molecule
Thereof

[0074] The ink composition of this embodiment may contain a compound
("monomer A") expressed by formula (I) below.

CH2=CR1-COOR2-O--CH═CH--R3 (I)

[0075] (where R1 is a hydrogen atom or a methyl group, R2 is a bivalent
organic residue containing from 2 to 20 carbon atoms, and R3 is a
hydrogen atom or a monovalent organic residue having from 1 to 11 carbon
atoms)

[0076] The above monomer A is a compound having both a vinyl group and a
(meth)acrylate group in the molecule thereof, and can also be referred to
as a (meth)acrylate ester containing a vinyl ether group.

[0077] Including a monomer A in the ink composition yields improved ink
curability.

[0078] For the bivalent organic residue expressed by R2 in formula (I)
above, a straight-chain, branched, or cyclic alkylene group having from 2
to 20 carbon atoms; an alkylene group having from 2 to 20 carbon atoms
that has an oxygen atom in its structure with at least one of either an
ether bond or an ester bond; or a bivalent aromatic group having from 6
to 11 carbon atoms capable of substitution is preferable. Of these, an
alkylene group having from 2 to 6 carbon atoms such as an ethylene group,
n-propylene group, isopropylene group, or butylene group; or an alkylene
group having from 2 to 9 carbon atoms and containing an oxygen atom in
its structure through an ether bond, such as an oxyethylene group,
oxy-n-propylene group, oxyisopropylene group, or oxybutylene group is
preferable.

[0079] For the monovalent organic residue having from 1 to 11 carbon atoms
expressed by R3 in formula (I) above, a straight-chain, branched, or
cyclic alkyl group having from 1 to 10 carbon atoms; or a substitutable
aromatic group having from 6 to 11 carbon atoms is preferable. Of these,
an alkyl group that is a methyl group or an ethyl group containing 1 or 2
carbon atoms; or an aromatic group containing from 6 to 8 carbon atoms
such as an alkyl group, phenyl group, or benzyl group is preferable.

[0080] If the organic residue is substitutable, the substituents can be
divided into groups containing a carbon atom and groups not containing a
carbon atom. If the substituent is a group containing a carbon atom, the
carbon atom is counted towards the carbon atom number of the organic
residue. Examples of groups including a carbon atom include, but are not
limited to, a carboxyl group or an alkoxy group. Examples of groups not
including a carbon atom include, but are not limited to, a hydroxyl group
or a halo group.

[0083] Of these, (meth)acrylic acid 2-(vinyloxyethoxy)ethyl is preferable
because of its low viscosity, high flash point, and superior curability,
and 2-(vinyloxyethoxy)ethyl acrylate is more preferable because of its
lack of odor and irritation to the skin, and superior reactivity and
adhesiveness.

[0085] One type of monomer A may be used, or a combination of two or more
types may be used.

[0086] The monomer A preferably constitutes from 20 to 50% by mass of the
total mass (100%) of the ink composition. An amount of monomer A within
the range given above enables favorable friction resistance to be
obtained in the cured ink.

[0087] Methods of producing the monomer A represented by formula (I) above
include, but are not limited to, esterifying (meth)acrylic acid and a
vinyl ether containing a hydroxyl group (method B), esterifying a
(meth)acrylate halide and a vinyl ether containing a hydroxyl group
(method C), esterifying a (meth)acrylic anhydride and a vinyl ether
containing a hydroxyl group (method D), transesterifying a (meth)acrylate
ester and a vinyl ether containing a hydroxyl group (method E),
esterifying (meth)acrylic acid and a vinyl ether containing a halogen
(method F), esterifying a (meth)acrylic acid alkali (earth) metal salt
and a vinyl ether containing a halogen (method G), vinyl substituting a
(meth)acrylate ester containing a hydroxyl group and vinyl carboxylate
(method H) and transesterifying a(meth)acrylate ester containing a
hydroxyl group and an alkyl vinyl ether (method I).

[0088] Of these, method E is especially preferable, as it allows the
desired effects of this embodiment to be more greatly demonstrated.

Other Polymerizing Compounds

[0089] Examples of polymerizing compounds other than those described above
("other polymerizing compounds") include various publicly known monomers
and oligomers that are monofunctional, bifunctional, trifunctional, or
more. Examples of such monomers include unsaturated carboxylic acids such
as (meth)acrylic acid, itaconic acid, crotonic acid, isocrotonic acid,
and maleic acid or salts or esters thereof; urethane; amides and
anhydrides thereof; acrylonitrile; styrene; and various unsaturated
polyesters, unsaturated polyethers, unsaturated polyamides, and
unsaturated urethanes. Examples of oligomers include oligomers formed
from the above monomers, such as a straight-chained acryl oligomer;
epoxy(meth)acrylate; oxetane(meth)acrylate; aliphatic
urethane(meth)acrylate; aromatic urethane(meth)acrylate; and
polyester(meth)acrylate.

[0090] An n-vinyl compound may also be included as another mono- or
multifunctional monomer. Examples of such n-vinyl compounds include
n-vinylcaprolactam, n-vinylformamide, n-vinylacetamide,
n-vinylpyrrolidone, and acrylylmorpholine,as well as derivatives thereof.

[0091] Of these, n-vinylcaprolactam is preferable as it enables favorable
friction resistance in the cured ink.

[0092] Of these other polymerizing compounds, (meth)acrylic acid esters,
i.e., (meth)acrylates, are preferable; a multifunctional (meth)acrylate
that is at least bifunctional is more preferable; and a multifunctional
acrylate is still more preferable.

[0094] Of these, because they reduce viscosity and odor, at least one of
phenoxyethyl(meth)acrylate and isobornyl(meth)acrylate is preferable,
phenoxyethyl(meth)acrylate is more preferable, and phenoxyethyl acrylate
is even more preferable.

[0096] Of these, because they improve the friction resistance of the cured
ink, one or more selected from the group consisting of (meth)acrylates
having a dipentaerythritol skeleton, (meth)acrylates having a
tripentaerythritol skeleton, (meth)acrylates having a
tetrapentaerythritol skeleton, (meth)acrylates having a
pentapentaerythritol skeleton, and polypentaerythritol poly(meth)acrylate
is preferable.

[0097] One type of the above other polymerizing compounds may be used
singly, or a combination of two types or more may be used.

Leveling Agent

[0098] The ink composition of this embodiment contains polysiloxane as a
leveling agent, which is a type of surfactant, as an essential
ingredient. Including polysiloxane in the above ink composition enables
improved visibility of the recorded image, ink ejection stability, and
friction resistance in the cured ink.

[0099] The HLB value of the polysiloxane is from 5 to 12. An HLB value of
from 5 to 12 yields superior visibility of the recorded image, ink
ejection stability, and friction resistance in the cured ink, with
visibility and ejection stability being especially superior. In order to
further improve visibility and ejection stability, the HLB value is
preferably between 9 and 12.

[0100] The polysiloxane constitutes from 0.1 to 2% by mass, preferably
from 0.12 to 1.6% by mass, of the total mass (100%) of the ink
composition. Including an amount of polysiloxane falling within the above
range yields superior visibility of the recorded image, ink ejection
stability, and friction resistance in the cured ink.

Photopolymerization Initiator

[0101] The ink composition of this embodiment contains a
photopolymerization initiator. The photopolymerization initiator is used
to cure the ink present on the surface of the recording medium to form an
image by photopolymerization through irradiation. Examples of suitable
types of radiation include gamma waves, beta waves, electron beams,
ultraviolet (UV) light, visible light, and infra-red light. Of these,
ultraviolet light is preferable as it demonstrates superior stability and
enables light source costs to be reduced. While there is no limitation
upon the photopolymerization initiator as long as it uses light energy to
form active species such as radicals and cations to initiate
polymerization of the above polymerizing compound, a radical
photopolymerization initiator or cationic photopolymerization initiator
can be used; of these, a radical photopolymerization initiator is
preferably used.

[0103] Of these, because they especially improve ink curability, at least
one of an acyl phosphine oxide compound and a thioxantone compound is
preferable, and an acyl phosphine oxide compounds is more preferable.

[0106] One type of the above photopolymerization initiators may be used,
or a combination of two or more types may be used.

[0107] In order to increase irradiation curing speed and prevent
undissolved photopolymerization initiator or photopolymerization
initiator-induced staining, the photopolymerization initiator preferably
constitutes from 5 to 20% by mass of the total mass (100%) of the ink
composition.

[0108] By using a photopolymerizing compound as the polymerizing compound
described above, the addition of a photopolymerization initiator may be
omitted. However, including a photopolymerization initiator is preferable
as this allows polymerization initiation to be easily regulated.

[0113] As an organic pigment, an azo pigment such as an insoluble azo
pigment, a condensed azo pigment, an azo lake pigment, or a chelate azo
pigment; a phthalocyanine pigment; a perylene or perinone pigment; an
anthraquinone pigment; a quinacridone pigment a dioxane pigment; a
thioindigo pigment; an isoindolinone pigment; a quinophthalone pigment or
other polycyclic pigment; a dye chelate (e.g., a basic dye chelate, an
acidic dye chelate, or the like); a dye lake (basic dye lake, acidic dye
lake; a nitro pigment; a nitroso pigment; aniline black; or a daylight
fluorescent pigment can be used.

[0120] One type of the above pigments may be used singly, or a combination
of two types or more may be used.

[0121] If one of the above pigments is used, the average particle diameter
thereof is preferably 300 nm or less, and more preferably from 50 to 250
nm. An average particle size within the range given above further
improves reliability of ejection stability and dispersive stability of
the ink composition, and allows an image of superior quality to be
formed. For the purposes of this disclosure, the average particle
diameter referred to here is as determined by dynamic light scattering.

[0123] One type of the above dyes may be used singly, or a combination of
two types or more may be used.

[0124] In order to obtain superior masking effects and color reproduction,
the amount of colorant included in the ink composition is preferably from
1 to 20% by mass of the total mass thereof (100%).

Dispersing Agents

[0125] If the ink composition of this embodiment contains a pigment, a
dispersing agent may be further contained in order to further improve
pigment dispersibility. There is no particular limitation upon the
dispersing agent used; for example, a polymeric dispersing agent or other
dispersing agent commonly employed in preparing pigment dispersions may
be used. Specific examples include agents containing at least one of
polyoxyalkylene polyalkylene polyamine, a vinyl polymer or copolymer, an
acrylic polymer or copolymer, a polyester, a polyamide, a polyimide, a
polyurethane, an amino polymer, a silicon-containing polymer, a
sulfur-containing polymer, a fluorine-containing polymer, and an epoxy
resin as a primary component. Examples of commercially available
polymeric dispersing agents include the Ajisper Series, produced by
Ajinomoto Fine-Techno Co., Inc.; the Solsperse Series (Solsperse 36000,
etc.) available from Avecia Co.; the Disperbyk Series produced by BYK
K.K.; and the Disparlon Series produced by Kusumoto Chemicals, Ltd.

Slip Agents

[0126] The ink composition of this embodiment may include a slip agent,
which is a type of surfactant, in order to improve friction resistance in
the cured ink. There is no particular limitation upon the slip agent
used; for example, a silicone-based surfactant such as polyester-modified
silicone or polyether-modified silicone can be used; with a
polyether-modified polydimethyl siloxane or polyester-modified
polydimethyl siloxane being especially preferable. Specific examples
include BYK-347, BYK-348, and BYK-UV3500, 3510, 3530, and 3570 (all
produced by BYK K.K.).

Other Additives

[0127] The ink composition of this embodiment may include an additive
(component) other than the additives given above. There is no particular
limitation upon such components; the use of, for example, a known
polymerization accelerator, penetration enhancer, or wetting agent
(humectant), or other type of additive, is possible. Examples of such
other additives include known fixatives, anti-mold agents, preservatives,
antioxidants, radiation absorbers, chelating agents, pH adjusting agents,
and thickening agents.

[0128]FIG. 4A is a schematic overhead view of a head unit. As illustrated
in FIG. 4A, two droplet ejection heads 49 are disposed with an interval
therebetween in the secondary scanning direction (X direction) on the
head unit 47, and a nozzle plate 51 (see FIG. 4B) is disposed on the
surface of each droplet ejection head 49. A plurality of nozzles 52 are
disposed in rows on each nozzle plate 51. In this embodiment, nozzle rows
60b through 60e of 15 nozzles 52 are disposed arranged along the
secondary scanning direction with gaps therebetween in the Y direction on
each nozzle plate 51. The nozzle rows 60b through 60e disposed on the two
droplet ejection heads 49 are disposed along straight lines in the X
direction. Nozzle rows 60b and 60e are disposed at equal distances from
the center of the carriage 45 with respect to the Y direction. Likewise,
nozzle rows 60c and 60d are disposed at equal distances from the center
of the carriage 45 with respect to the Y direction. Thus, the distance
between the curing units 48 and nozzle row 60b in the positive Y
direction is equal to the distance between the curing units 48 and nozzle
row 60e in the negative Y direction. Likewise, the distance between the
curing units 48 and nozzle row 60c in the positive Y direction is equal
to the distance between the curing units 48 and nozzle row 60d in the
negative Y direction.

[0129]FIG. 4B is a schematic cross-section of the primary parts for
describing the construction of a droplet ejection head. As shown in FIG.
4B, the droplet ejection heads 49 has a nozzle plate 51, and nozzles 52
are formed on the nozzle plate 51. Cavities 53 communicating with the
nozzles 52 are formed on the upper side of the nozzle plate 51 in
positions corresponding to the nozzles 52. Functional fluid 54 is
supplied to the cavities 53 of the droplet ejection heads 49.

[0130] A vibrational plate 55 that vibrates up and down, and expands and
contracts the volume of the cavities 53, is provided on an upper side of
the cavities 53. Piezoelectric elements 56 that expand and contract
vertically and vibrate the vibrational plate 55 are disposed on an upper
side of the vibrational plate 55 in positions corresponding to the
cavities 53. The piezoelectric elements 56 expand and contract
vertically, placing pressure on the vibrational plate 55 and causing it
to vibrate, and the vibrational plate 55 expands and contracts the
volumes of the cavities 53, placing pressure upon the cavities 53. This
causes the pressure within the cavities 53 to vary, and the functional
fluid 54 within the cavities 53 to be ejected through the nozzles 52.

[0131] As shown in FIGS. 3B and 4A, the curing units 48 are disposed on
either side of the head unit 47 in the primary scanning direction
(relative movement direction). Within the curing units 48 are disposed
irradiating devices that cure the ejected droplets using ultraviolet
light irradiation. Each irradiating device is constituted by a
light-emitting unit and a heat sink. A plurality of LED (light emitting
diode) elements are arrayed upon the light-emitting unit. The LED
elements receive power and emit ultraviolet radiation in the form of
ultraviolet light. An irradiation aperture 48a is formed on the underside
of the curing unit 48. The ultraviolet light emitted by the irradiating
device radiates through the irradiation aperture 48a onto the
semiconductor substrate 1.

[0132] When the droplet ejection head 49 receives a nozzle drive signal
for driving the piezoelectric elements 56, the piezoelectric elements 56
expand, and the vibrational plate 55 decreases the volume of the cavities
53. As a result, an amount of the functional fluid 54 equal to the amount
of volume decrease is ejected from the nozzles 52 of the droplet ejection
heads 49 in the form of droplets 57. After the functional fluid 54 has
been applied thereto, the semiconductor substrate 1 is irradiated with
ultraviolet light from the irradiation aperture 48a, so the functional
fluid 54, which contains a curing agent, solidifies or cures.

Storage Unit

[0133]FIG. 5A is a schematic front view of a storage unit, and FIGS. 5B
and 5C are schematic side views of a storage unit. As shown in FIGS. 5A
and 5B, the storage unit 12 has a base 74. A lift device 75 is provided
within the base 74. A device similar to that used for the lift device 16
provided in the feeding part 8 can be used for the lift device 75. A lift
platform 76 connected to the lift device 75 is provided on an upper side
of the base 74. The lift platform 76 is raised and lowered by the lift
device 75. A cuboidal container 18 is provided above the lift platform
76, inside of which is contained a semiconductor substrate 1. The
container 18 is the same container 18 as provided in the feeding part 8.

[0134] A semiconductor substrate 1 placed on the relay position formed by
the rails 12b by the transporting part 13 is carried from the rails 12b
to the container 18 by the transporting part 13. Alternatively, a
configuration such as that shown in FIG. 5c may be adopted wherein, for
example, an ejector 80 having the same configuration as the ejector 23
above is provided underneath the rails 12b and positioned between the two
rails 12b in the Y direction and is capable, by means of a lift device
not shown in the drawings, of rising to a position level with the
semiconductor substrate 1 after the semiconductor substrate 1 has been
transported by the transporting part 13 from the rails 12b halfway to the
container 18; and, when the transporting part 13 places the semiconductor
substrate 1 on the rails 12b, the ejector 80 waits underneath the rails
12b, and, after the transporting part 13 has withdrawn from the rails
12b, the ejector 80 is raised to face the side of the semiconductor
substrate 1, the semiconductor substrate 1 is moved into the container 18
by an ejector pin 23a that projects in the positive X direction.

[0135] After a predetermined number of semiconductor substrates 1 have
been stored within the container 18 through repeatedly insertion of
semiconductor substrates 1 into the container 18 and moving in the Z
direction of the container 18 using the lift device 75 as described
above, an operator replaces the container 18 filled with semiconductor
substrates 1 with an empty container 18. In this way, an operator is able
to collectively transport a plurality of semiconductor substrates 1 to
the next process.

Transporting Part

[0136] Next, a transporting part 13 for transporting the semiconductor
substrate 1 will be described with reference to FIGS. 1, 6, and 7.

[0137] The transporting part 13 has a support 83 provided on a ceiling of
the device interior, with a rotation mechanism formed from a motor, an
angle detector, a decelerator, and the like provided within the support
83. An output shaft of the motor is connected to the decelerator, and an
output shaft of the decelerator is connected to a first arm 84 disposed
underneath the support 83. The angle detector is coupled to the output
shaft of the motor, and the angle detector detects the angle of rotation
of the output shaft of the motor. In this way, the rotation mechanism is
capable of detecting the angle of rotation of the first arm 84, and
rotating to a desired angle.

[0138] A rotation mechanism 85 is provided on the first arm 84 on an end
opposite to the support 83.

[0139] The rotation mechanism 85 is constituted by a motor, an angle
detector, a decelerator, and the like, and has a function similar to that
of the rotation mechanism provided in the support 83. An output shaft of
the rotation mechanism 85 is connected to a second arm 86. In this way,
the rotation mechanism 85 is capable of detecting the angle of rotation
of the second arm 86, and rotating to a desired angle.

[0140] A lift device 87 is provided on the second arm 86 on an end
opposite to the rotation mechanism 85. The lift device 87 has a direct
actuation mechanism, and is capable of extending and retracting by
driving the direct actuation mechanism. A mechanism similar to that of,
for example, the lift device 16 of the feeding part 8 may be used for the
direct actuation mechanism.

[0141]FIG. 6A is a frontal view of a gripper 13a disposed on a negative Z
direction side of an arm 13b, FIG. 6B is an overhead view of the same
(omitting the arm 13b), and FIG. 6c is a left side view of the same.

[0142] As the gripper 13a is provided so as to be rotatable in the
θZ direction (the direction around the Z axis) with respect to the
arm 13b, and its position in the XY plane varies, for convenience of
description, one direction parallel with the XY plane will be referred to
as the X direction, and a direction parallel with the XY plane and
perpendicular to the X direction will be referred to as the Y direction
(Z direction same for both).

[0143] The gripper 13a has a fixed part 100 rotatable in the θZ
direction with respect to the arm 13b and used in a fixed state when a
semiconductor substrate 1 is being gripped, and a moving part 110 freely
movable in the Z direction with respect to the fixed part 100.

[0144] The primary elements constituting the fixed part 100 are a Z axis
member 101, a suspension member 102, a linking member 103, a linkage
plate 104, a grip plate 105, and a fork 106. The Z axis member 101
extends in the Z direction and is rotatable about the Z axis around the
arm 13b. The suspension member 102 is formed as a strip extending in the
X direction, and is fixed to a lower end of the Z axis member 101 in a
central position along the X direction. The linkage plate 104 is disposed
parallel to the suspension member 102 so as to leave a gap therebetween,
and is linked with the suspension member 102 on both ends in the X
direction by the linking member 103. The grip plate 105 is formed as a
plate extending in the X direction, and, as shown in FIG. 6c, a positive
Z direction surface thereof is fixed to the lower side of the linkage
plate 104 on an edge thereof in the positive Y direction. Of the positive
Z direction surface of the grip plate 105, a negative Y direction edge
thereof acts as a gripping surface 105a when a semiconductor substrate 1
is being gripped.

[0145] The fork 106 supports from underneath the underside (negative Z
direction surface) of the semiconductor substrate 1 gripped by the
gripping surface 105a, and a plurality thereof (in this embodiment, four)
extending in the Y direction from a negative Y side surface of the grip
plate 105 are provided at intervals in the X direction. Even when the
length of the semiconductor substrate 1 varies depending according to
model, the spacing and number of the forks 106 are such that the
substrate is supported at one location along the lengthwise direction,
preferably at two locations.

[0146] The primary elements constituting the moving part 110 are an
ascending/descending part 111 and a grip plate 112. The
ascending/descending part 111 is constituted by an air cylinder mechanism
or the like, and ascends and descends along the Z axis member 101. The
grip plate 112 is capable of ascending and descending integrally with the
ascending/descending part 111, is shorter than the gap in the x direction
between the two linking members 103, and has a width less than the gap
between the suspension member 102 and the linkage plate 104; and is
formed from an inserted part 112a inserted movably in the Z direction in
the gap between the two linking members 103 and the gap between the
suspension member 102 and the linkage plate 104, and a grip plate 112b
formed integrally therewith positioned below the inserted part 112a and
extending in the X direction for roughly the same length as the grip
plate 105 underneath the suspension member 102.

[0147] The grip plate 112 constituted by the inserted part 112a and the
grip plate 112b move integrally in the Z direction in response to the
vertical motion of the ascending/descending part 111. When lowered, the
grip plate 112 is capable, along with the grip plate 115, of gripping an
end of the semiconductor substrate 1 therebetween; and when raised, the
grip plate 112 releases the grip on the semiconductor substrate 1 by
separating from the grip plate 115.

[0148] By inputting the data output by the detector provided on the
transporting part 13 and detecting the position and disposition of the
gripper 13a, and driving the rotation mechanism 85 so as to move the
gripper 13a to a specific position, it is possible to transport the
semiconductor substrate 1 being gripped by the gripper 13a to a specific
processing part.

[0149]FIG. 8 is a block diagram of a control system of a printing device
7.

[0150] As shown in FIG. 8, a controller CONT controls the overall
operation of the feeding part 8, pre-processing part 9, application part
10, post-treatment part 14, and storage unit 12 described above. A data
storage part 130 is connected to the controller CONT. Data for the
pattern formed on the surface 3a of the semiconductor device 3 by the
plurality of processing devices of the printing device 7 described above
is stored in the data storage part 130.

[0151] As an example of such pattern data, a first set of data 131 that
forms a pattern with thick lines in one shape and a second set of data
132 that forms a pattern with think lines in the same shape are stored.
In this embodiment, the pattern formed by the second set of data 132 is
configured so as not to protrude over the edges of the pattern formed by
the first set of data 131.

Printing Method

[0152] Next, a printing method utilizing the above printing device 7 will
be described with reference to FIG. 9. FIG. 9 is a flow chart
illustrating a printing method.

[0153] As illustrated in the flow chart of FIG. 9, the printing method is
primarily composed of an conveying step S1 of taking in a semiconductor
substrate 1 from a container 18, a pre-processing step S2 of performing
pre-processing on the surface of the semiconductor substrate 1 that has
been taken in, a cooling step S3 of cooling the semiconductor substrate 1
after being heated during the preceding pre-processing step S2, a
printing step S4 of printing various markings on the cooled semiconductor
substrate 1, a post-processing step S5 of performing post-processing on
the semiconductor substrate 1 printed with the markings, and a storage
step S6 of storing the semiconductor substrate 1 after post-processing
has been performed within a container 18.

[0154] Of the above steps, the printing step S4 is a characteristic of the
present invention, and will thus be described below.

[0155] The semiconductor substrate 1 upon which pre-processing was
performed during the pre-processing step and which was cooled during the
cooling step S3 is transported by the transporting part 13 to a stage 39
located at a relay position 10a of the application part 10. During
printing step S4, the application part 10 actuates the chuck mechanism to
hold the semiconductor substrate 1 resting on the stage 39 in place upon
the stage 39.

[0156] Next, the application part 10 ejects droplets 57 from the nozzles
52 formed on the droplet ejection heads 49 according to the first set of
data 131 stored in the data storage part 130 while moving the stage 39
and the carriage 45 in the scanning direction (first ejection step: S41).
Through this, a layer of droplets 57 ejected in the shape of a company
logo 4, model code 5, manufacturing number 6, or the like is formed on
the surface 3a of the semiconductor device 3, as shown in FIG. 10a. The
contact angle of the droplets 57 upon the surface 3a of the semiconductor
device 3 at this point will be designated alpha.

[0157] After the layer of droplets 57 has been formed, the droplets 57 are
irradiated with ultraviolet light by a curing unit 48 provided on the
carriage 45. Because the functional fluid 54 constituting the layer of
droplets 57 contains a photopolymerization initiator that initiates
polymerization in the presence of ultraviolet light, the surface of the
layer of droplets is instantly solidified or cured, as shown in FIG. 10b.
As a result, a first layer of markings R1 is formed on the surface of the
semiconductor device 3 (first layer forming step: S42).

[0158] After the first layer of markings R1 has been formed, the
application part 10 once again ejects droplets 57 from the nozzles 52
formed on the droplet ejection heads 49 onto the first layer R1 according
to the second set of data 132 stored in the data storage part 130 while
moving the stage 39 and the carriage 45 in the scanning direction (second
ejection step: S43). In this step, because the droplets 57 are ejected
according to the second set of data 132, the droplets 57 are disposed so
as not to protrude over the edges of the first layer R1. Through this
operation, a layer of droplets 57 is formed upon the first layer R1, as
shown in FIG. 10c.

[0159] In this embodiment, polysiloxane is included in the ink composition
as a leveling agent, a type of surfactant. The polysiloxane constitutes
from 0.1 to 2% by mass, preferably from 0.12 to 1.6% by mass, of the
total mass (100%) of the ink composition. For this reason, as shown in
FIG. 10c, the contact angle beta of the droplets 57 with respect to the
first layer R1 is greater than the contact angle alpha of the droplets 57
with respect to the surface 3a of the semiconductor device 3. Thus,
bleeding of the droplets 57 upon the first layer R1 is prevented.

[0160] After the layer of droplets 57 has been formed upon the first layer
R1, the droplets 57 are irradiated with ultraviolet light by a curing
unit 48 provided on the carriage 45. Because the functional fluid 54
constituting the layer of droplets 57 contains a photopolymerization
initiator that initiates polymerization in the presence of ultraviolet
light, the surface of the layer of droplets 57 is instantly solidified or
cured, as shown in FIG. 10d. As a result, a second layer of markings R2
is formed on the surface of the semiconductor device 3 (second layer
forming step: S44).

[0161] After the second layer R2 has been formed, the application part 10
moves the stage 39 upon which the semiconductor substrate 1 rests to
relay position 10a. This enables the transporting part 13 to more easily
grasp the semiconductor substrate 1. Then, the application part 10 stops
actuating the chuck mechanism, releasing the grip on the semiconductor
substrate 1. Then, in the storage step S6, the semiconductor substrate 1
is transported by the transporting part 13 to the storage unit 12, and
stored within the container 18.

[0162] Because the ink of this embodiment includes from 0.1 to 2% by mass
of polysiloxane, as described above, the contact angle of the first layer
R1 and the ink ejected thereupon is greater than that of the surface of
the semiconductor device 3 and the ink ejected thereupon. For this
reason, it is possible to prevent the second layer R2 from spreading over
the first layer R1 when being formed, and to form a second layer R2 that
is finer than the first layer R1, as shown, for example, in FIG. 10e.
Because the first layer R1 and second layer R2 can be formed
three-dimensionally, it is possible to form highly visible, fine
patterns.

[0163] The technical scope of the present invention is not limited to the
above embodiment, and various modifications within the spirit of the
present invention may be made.

[0164] In the above embodiment, a UV-curable ink was used as the UV ink,
but the present invention is not limited to this, and various active
light-curable inks using visible light or infra-red light to cure can be
used.

[0166] In the context of the present invention, there is no particular
limit upon the "active light" so long as it is capable of imparting
energy capable of generating initiating species in the ink via
irradiation, and broadly, alpha waves, gamma waves, X-rays, ultraviolet
light, visible light, and electron beams are included. Of these, from
considerations of curing sensitivity and ease of equipment procurement,
ultraviolet light or an electron beam are preferable, and ultraviolet
light is especially preferable. As such, it is preferable that the active
light-curable ink be a UV-curable ink that cures upon irradiation with
ultraviolet light, as in this embodiment.

[0167] In the above embodiment, the substrate constituted by the
semiconductor substrate 1 was a substrate 2 upon which a semiconductor
device 3 was mounted, but a substrate formed from a semiconductor such as
silicon is also acceptable. The semiconductor device 3 constituting the
recording medium can be a semiconductor device molded from resin, or
itself be a semiconductor device.

EXAMPLES

[0168] A working example of the present invention will be described below.

[0169] In this example, as described in the embodiment above, the
following materials were used as ink components, a first layer R1 was
formed on the surface 3a of the semiconductor device 3, and a second
layer R2 was formed on the first layer R1.

[0170] 4% by mass of IRGACURE 819 (bis(2,4,6-trimethylbenzoyl)-phenyl
phosphine oxide)and 5% by mass of TPO
(2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide) were used as
photopolymerization initiators.

[0171] 12% by mass of titanium oxide was used as a pigment.

[0172] 0.1% by mass of MEHQ (methyl hydroquinone) was used as a
polymerization inhibitor.

[0173] Polysiloxane and acetylene diol were used as leveling agents.

[0174] Suitable masses of VEEA, NVC, PEA, and PETA were used as
polymerizing compounds.

[0175] Table 1 shows the results yielded by combinations of the above
materials.

[0176] As shown by working examples 1 through 9 and comparative examples 1
and 2 in Table 1, the contact angle beta of the droplets 57 upon the
first layer R1 was greater than the contact angle alpha of the droplets
57 on the surface 3a when from 0.1 to 2% by mass polysiloxane was
included. Against this, as shown by comparative examples 3 through 5,
when no polysiloxane was included, or when the amount thereof was less
than 0.1% by mass or greater than 2% by mass, no particularly noticeable
difference between the contact angles alpha and beta was observed. This
shows that including from 0.1 to 2% by mass of polysiloxane allows highly
visible, fine patterns to be formed.

[0177] Also, as shown by working examples 1 through 9, when the HLB value
of the polysiloxane is from 5 to 12, the contact angle beta was more
noticeably greater than the contact angle alpha. Thus, when the HLB value
of the polysiloxane is from 5 to 12, more highly visible, fine patterns
can be formed.

General Interpretation of Terms

[0178] In understanding the scope of the present invention, the term
"comprising" and its derivatives, as used herein, are intended to be open
ended terms that specify the presence of the stated features, elements,
components, groups, integers, and/or steps, but do not exclude the
presence of other unstated features, elements, components, groups,
integers and/or steps. The foregoing also applies to words having similar
meanings such as the terms, "including", "having" and their derivatives.
Also, the terms "part," "section," "portion," "member" or "element" when
used in the singular can have the dual meaning of a single part or a
plurality of parts. Finally, terms of degree such as "substantially",
"about" and "approximately" as used herein mean a reasonable amount of
deviation of the modified term such that the end result is not
significantly changed. For example, these terms can be construed as
including a deviation of at least ±5% of the modified term if this
deviation would not negate the meaning of the word it modifies.

[0179] While only selected embodiments have been chosen to illustrate the
present invention, it will be apparent to those skilled in the art from
this disclosure that various changes and modifications can be made herein
without departing from the scope of the invention as defined in the
appended claims. Furthermore, the foregoing descriptions of the
embodiments according to the present invention are provided for
illustration only, and not for the purpose of limiting the invention as
defined by the appended claims and their equivalents.