Product Detail Information

For quality component proportion, the ideal contents of Sn(stannum) is 60~ 63% in the Sn-Pb type alloy. It has been used mainly for electric and electronic equipment, but due to negative effect to human body and global concern for environment-friendly policy, the use of Pb (lead) is restricted.

NANOTECH Co., Ltd supplies environment-friendly products of high reliability and workability. We promise to do our best for our customers based on our experience and expertise about problems that may arise when applying pb-free solder.

Alloy series

Alloy compositions

Melting points (℃)

BAR

WIRE

Flux contain

Paste

Solidus

Liquidus

Sn

Sn

232

○

○

○

Sn-Ag

Sn-3.5Ag

221

○

○

○

○

Sn-3.0Ag

221

222

○

○

Sn-Ag-Cu

Sn-3.5Ag-0.55Cu

217

220

△

△

○

△

Sn-3.0Ag-0.5Cu

217

220

○

○

○

○

Sn-Ag-Cu-Bi

Sn-1.5Ag-0.85Cu-2.0Bi

210

223

△

△

△

△

Sn-2.5Ag-0.5Cu-1.0Bi

214

219

△

△

△

○

Sn-58Bi

138

○

Sn-Cu

Sn-0.55Cu

226

○

○

○

Sn-0.55-0.3Ag

217

226

△

△

△

Sn-5.0Cu

227

358

○

○

Sn-3.0Cu-0.3Ag

217

312

○

Sn-Ag-Bi-in

Sn-3.5Ag-0.5Bi-3.0in

193

216

○

△

Sn-3.5Ag-0.5Bi-4.0in

192

211

△

△

Sn-3.5Ag-0.5Bi-8.0in

177

208

△

○

Sn-Zn

Sn-8.0Zn-3.0Bi

187

197

○

In the case of Pb Free Solder in which Tin is contained over 90%, the melting point is lowered, and a little proportion of Ag (Silver), Cu (Copper), In (Indium), and Zn (Zinc), considering their mechanical property is added. As Pb Free is about 15% lower than Sn-Pb Solder in Wettability and Spreadability, the soldering rate drops