Processes are disclosed which facilitate improved high density memory circuitry, most preferably dynamic random access memory (DRAM) circuitry. In accordance with aspects of the invention, considerably greater numbers of die sites per wafer are achieved for 6 inch, 8 inch and 12 inch wafers for 4 M, 16 M, 64 M and 256 M integration levels. Further, a semiconductor memory device includes, i) a plurality of functional and operably addressable memory cells arranged in multiple memory arrays formed on a semiconductor die; and ii) circuitry formed on the semiconductor die permitting data to be written to and read from one or more of the memory cells, at least one of the memory arrays containing at least 100 square microns of continuous die surface area having at least 170 of the functional and operably addressable memory cells.

Imágenes(25)

Reclamaciones(3)

What is claimed is:

1. A plurality of 16 M semiconductor memory devices comprising:

a processed semiconductor wafer ready for dicing having a major diameter of about 8 inches; and

a plurality of die sites on the processed wafer, the die sites being sized for respective receipt of from 16,000,000 to 17,000,000 functional and operably addressable memory cells arranged in multiple memory arrays within a respective die site, a predominate number of the total number of die sites on the processed wafer being occupied by memory devices having from 16,000,000 to 17,000,000 functional and operably addressable memory cells arranged in multiple memory arrays within a respective die site, the total number of die sites on the processed wafer being at least 700.

2. The plurality of semiconductor memory devices of claim 1 wherein the total number of die sites on the processed wafer is at least 800.

3. The plurality of semiconductor memory devices of claim 1 wherein the total number of die sites on the processed wafer is at least 855.

High density integrated circuitry is principally fabricated from semiconductor wafers. Upon fabrication completion, a wafer contains a plurality of identical discrete die areas which are ultimately cut from the wafer to form individual chips. Die areas or cut dies are tested for operability, with good dies being assembled into separate encapsulating packages which are used in end-products or systems.

One type of integrated circuitry comprises memory. The basic unit of semiconductor memory is the memory cell. Capable of storing a single bit of information, the memory cell has steadily shrunk in size to enable more and more cells per area of a semiconductor substrate or wafer. Such enables integrated memory circuitry to be more compact, as well as faster in operation.

Example semiconductor memories include ROMs, RAMs, PROMs, EPROMs and EEPROMs. Some emphasize compactness and economy over speed. Others focus on lightning-fast operation. Some store data indefinitely, while others are so temporary they must be refreshed hundreds of time every second. The smallest memory cell comprises the single transistor and single capacitor of a dynamic random access memory (DRAM).

One industry accepted manner of classifying a memory chip is by the number of final functional and operably addressable memory cells which are contained on a single chip. To maximize density, individual cells are arranged in multiple repeating memory arrays. DRAM fabrication has progressed to the point where millions of functional and operably addressable memory cells can be included in a single chip. Maximizing density of single transistor and other memory cells is a continuing goal in semiconductor memory fabrication.

With each new fabricating generation, the number of memory cells per die has historically increased by a factor or four. For example what is commonly referred to as the 256K generation (262,144 addressable DRAM cells per chip) led to the 1 M generation (1,048,576 addressable DRAM cells per chip). The 1 M generation led next to the 4 M generation (4,194,304 addressable DRAM cells per chip). The 4 M generation led to the 16 M generation (16,777,216 addressable DRAM cells per chip), which next led to the 64 M generation (67,108,864 addressable DRAM cells per chip). The industry is presently working on the next factor of four generation, referred to as 256 M (268,435,456 DRAM cells per chip), which has a memory cell pitch of 0.6 micron. Historically with each generation, the number of addressable memory cells per chip increases exactly by a factor of four with an attendant increase in chip area. However, the increase in chip area has not been directly proportional to the increase in cells due to improved processing techniques which enable the individual memory cell size to be shrunk and thereby density to increase. Nevertheless, each next generation puts four times the number of memory cells from the previous generation on a single chip.

BRIEF DESCRIPTION OF THE DRAWINGS

Preferred embodiments of the invention are described below with reference to the following accompanying drawings.

FIG. 1 is a diagrammatic sectional view of a semiconductor wafer fragment.

FIG. 2 is a view of the FIG. 1 wafer shown at a processing step subsequent to that shown by FIG. 1.

FIG. 3 is a view of the FIG. 1 wafer shown at a processing step subsequent to that shown by FIG. 2.

FIG. 4 is a view of the FIG. 1 wafer shown at a processing step subsequent to that shown by FIG. 3.

FIG. 5 is a view of the FIG. 1 wafer shown at a processing step subsequent to that shown by FIG. 4.

FIG. 6 is a view of the FIG. 1 wafer shown at a processing step subsequent to that shown by FIG. 5.

FIG. 7 is a view of the FIG. 1 wafer shown at a processing step subsequent to that shown by FIG. 6.

FIG. 8 is a view of the FIG. 1 wafer shown at a processing step subsequent to that shown by FIG. 7.

FIG. 9 is a view of the FIG. 1 wafer shown at a processing step subsequent to that shown by FIG. 8.

FIG. 10 is a diagrammatic top view of FIG. 9.

FIG. 11 is a view of the FIG. 1 wafer shown at a processing step subsequent to that shown by FIG. 9.

FIG. 12 is a view of the FIG. 1 wafer shown at a processing step subsequent to that shown by FIG. 11.

FIG. 13 is a diagrammatic sectional view of another semiconductor wafer fragment.

FIG. 14 is a view of the FIG. 13 wafer shown at a processing step subsequent to that shown by FIG. 13.

FIG. 15 is a view of the FIG. 13 wafer shown at a processing step subsequent to that shown by FIG. 14.

FIG. 16 is a diagrammatic sectional view of still another semiconductor wafer fragment.

FIG. 17 is a view of the FIG. 16 wafer shown at a processing step subsequent to that shown by FIG. 16.

FIG. 18 is a view of the FIG. 16 wafer shown at a processing step subsequent to that shown by FIG. 17.

FIG. 19 is a diagrammatic sectional view of yet another semiconductor wafer fragment.

FIG. 20 is a diagrammatic top view of FIG. 19.

FIG. 21 is a diagrammatic sectional view of yet still another semiconductor wafer fragment.

FIG. 22 is a diagrammatic top view of FIG. 21.

FIG. 23 is a view of the FIG. 21 wafer shown at a processing sequence subsequent to that shown by FIG. 21.

FIG. 24 is a diagrammatic sectional view of another semiconductor wafer fragment.

FIG. 25 is a diagrammatic top view of FIG. 24.

FIG. 26 is a diagrammatic top view of an alternate embodiment layout.

FIG. 27 is a perspective diagram illustrating digit line twist or swapping in a vertical plane.

FIG. 28 is a perspective diagram illustrating alternate digit line twist or swapping in a vertical plane.

FIG. 29 is a perspective diagram illustrating further alternate digit line twist or swapping in a vertical plane.

FIG. 30 is a perspective diagram illustrating still further alternate digit line twist or swapping in a vertical plane.

FIGS. 31 and 32 are top diagrammatic and schematic views of memory circuitry layouts.

FIG. 33 is a diagrammatic sectional view of a semiconductor wafer fragment as would be positionally taken along and through the digit line of FIG. 26.

FIG. 34 is a perspective view of a semiconductor package.

FIG. 35 is a diagrammatic view of circuitry layout for a semiconductor memory device.

FIG. 36 is a top view of a semiconductor wafer fragment comprising a plurality of semiconductor memory devices in accordance with the invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

This disclosure of the invention is submitted in furtherance of the constitutional purposes of the U.S. Patent Laws “to promote the progress of science and useful arts” (Article 1, Section 8).

Implementing memory and other electronic circuitry involves connecting isolated devices through specific electric paths. Further, it is necessary to electrically isolate devices built into the substrate from one another. Electrical isolation of devices as circuit density increases is a continuing challenge.

One method of isolating devices involves the formation of a semi-recessed or fully recessed oxide in the nonactive (or field) area of the substrate. These regions are typically termed as “field oxide” and are formed by LOCal Oxidation of exposed Silicon, commonly known as LOCOS. One approach in forming such oxide is to cover the active regions with a thin layer of silicon nitride that prevents oxidation from occurring therebeneath. A thin intervening layer of a sacrificial pad oxide is provided intermediate the silicon substrate and nitride layer to alleviate stress and protect the substrate from damage during subsequent removal of the nitride layer. The unmasked or exposed field regions of the substrate are then subjected to a wet H2O oxidation, typically at atmospheric pressure and at temperatures of around 1000° C., for two to four hours. This results in field oxide growth where there is no masking nitride.

However at the edges of the nitride, some oxidant also diffuses laterally. This causes the oxide to grow under and lift the nitride edges. Because the shape of the oxide at the nitride edges is that of a slowly tapering oxide wedge that merges into another previously formed layer of oxide, it has commonly been referred to as a “bird's beak”. The bird's beak is a lateral extension or encroachment of the field oxide into the active areas where the devices are formed. Although the length of the bird's beak depends upon a number of parameters, the length is typically 0.15 micron-0.5 micron per side.

This thinner area of oxide resulting from the bird's beak provides the disadvantage of not providing effective isolation in these regions, and as well unnecessarily consumes precious real estate on the semiconductor wafer. Further, as the circuit density (commonly referred to as minimum device pitch) falls below 1.0 micron, conventional LOCOS techniques fail due to excessive encroachment of the oxide beneath the masking stack. The closeness of the masking block stacks in such instances results in effective joining of adjacent bird's beaks, thus effectively lifting the stacks and resulting in no masking effect to the oxidation.

This disclosure provides an alternate technique which enables use of a dry, high pressure, O2 oxidizing ambient for oxidizing conditions to minimize bird's beak encroachment. This disclosure also provides an alternate technique of forming field oxide regions in a manner which favorably minimizes bird's beak size. This disclosure also provides an alternate technique enabling elimination of field oxide regions between certain adjacent memory cells.

Further, the reduction in memory cell size required for high density DRAMs results in a corresponding decrease in the area available for the storage node of the memory cell capacitor. Yet, design and operational parameters determine the minimum charge required for reliable operation of the memory cell despite decreasing cell area. Several techniques have been developed to increase the total charge capacity of the cell capacitor without significantly affecting the cell area. These include structures utilizing trench and container-shaped stacked capacitors.

This disclosure provides an alternate technique which enables capacitance to be maximized within a given area. This disclosure also provides an alternate technique enabling closer mask opening tolerances by reducing mask misalignment spacing between adjacent devices.

The area on a substrate consumed by memory integrated circuitry is impacted by the number of conductive layers which are provided for producing the circuitry. Generally, the lower the number of conductive line layers, the simpler the process but the greater the area consumed by the memory cell. The substrate area consumed by the memory cells can be reduced by providing more conductive line layers, but at the expense of process complexity.

This disclosure provides an alternate technique of using a comparatively larger number of conductive line layers enabling taking full advantage of the elimination of field oxide regions between certain adjacent memory cells as alluded to above.

One or more of the above described techniques, or other techniques, can be utilized in the production of 64 M, 16 M or 4 M memory chips in accordance with the invention, with the invention only being limited by the accompanying claims appropriately interpreted in accordance with the doctrine of equivalents.

The discussion initially proceeds with description of processes for forming field oxide regions in manners which minimize bird's beak encroachment into substrate active areas. FIG. 1 illustrates a semiconductor wafer fragment in process for formation of a pair of adjacent field oxide regions having a minimum pitch of less than or equal to 0.7 micron, and is indicated generally with reference numeral 10. Such is comprised of a starting bulk semiconductor silicon substrate 12. A sacrificial pad oxide layer 14 is thermally grown over semiconductor substrate 12 to a thickness of from 20 Angstroms to 100 Angstroms. A masking layer 15, preferably Si3N4, is provided over sacrificial pad oxide layer 14 to a thickness of from 500 Angstroms to 3000 Angstroms. The function of layer 14 is to cushion the transition of stresses between silicon substrate 12 and nitride layer 15. Nitride layer 15 will function as the masking layer for ultimate formation of the field oxide regions.

Referring to FIG. 2, first nitride layer 15 has been patterned and etched as shown to form nitride masking blocks 16, 17 and 18. A channel-stop implant can be conducted prior to removing the illustrated masking blocks. The etch to produce nitride blocks 16, 17 and 18 is substantially selective to oxide layer 14. However, the etch does result in removal of a portion of pad oxide layer 14 in an uneven manner due in part to the inherent preferred thinness of layer 14. Blocks 16, 17 and 18 are provided to define and thereby overlie desired active area regions on the substrate. The illustrated masking blocks provide an example preferred minimum pitch 20 of adjacent blocks of less than or equal to 0.7 micron, with 0.6 being a specific example.

Referring to FIG. 3, the wafer is preferably subjected to a wet isotropic etch to remove remaining portions of exposed sacrificial oxide layer 14 from the substrate. This also produces undercut etching of layer 14 beneath nitride blocks 16, 17 and 18, as shown.

Referring to FIG. 4, the wafer is subjected to oxidizing conditions to grow a preferred second sacrificial oxide layer 13 having a thickness of from 60 Angstroms to 120 Angstroms. Layer 13 will function as a silicon etch stop, as will be apparent subsequently. The thickness of layer 13 has an effect on the resultant bird's beak size. The thicker layer 13, the larger will be the bird's beak size after field oxidation.

Referring to FIG. 5, a layer 30 of silicon is provided over patterned masking nitride blocks 16, 17 and 18, and over second sacrificial oxide layer 13. A preferred material for layer 30 is polysilicon deposited to a thickness ranging from 200 Angstroms to 1000 Angstroms, Alternate materials, by way of example only, include amorphous silicon and porous silicon. Subsequently, a second masking layer 32 is provided over silicon layer 30 also to a preferred thickness of from 200 Angstroms to 1000 Angstroms. Layer 32 preferably constitutes a material which is selectively etchable relative to underlying silicon material 30. Example preferred materials include SiO2 and Si3N4, with SiO2 being more preferred. The thickness of layer 32 is used to set the length of the foot portion independent of the first spacer height, as will be apparent subsequently.

Referring to FIG. 8, second masking layer sidewall spacers 33, 34 and 31 are stripped from the substrate. Alternately, these spacers can remain at this point in the process and be stripped after field oxidation. Further as an alternate, spacers 33, 34 and 31 might remain after field oxidation. Most preferred is removal of such spacers now as shown in FIG. 8.

Referring to FIG. 9, the wafer is subjected to oxidizing conditions which oxidizes the silicon of bulk substrate 12 and silicon sidewall spacers 38, 40 and 42 to form the illustrated pair 44 and 45 of field oxide regions. Any of a number of oxidizing conditions might be used. One example includes oxidizing in an O2 ambient at a pressure of at least 15 atmospheres. The atmosphere will preferably be essentially void of H2O during the oxidizing, and constitutes essentially pure O2 or O2 injected into the reactor in combination with a carrier gas, such as N2 or Ar. The preferred upper pressure limit for such an oxidation is 50 atmospheres, with 25 atmospheres being a more preferred condition. The preferred temperature range during such an oxidation is from 950° C. to 1300° C. Growth rate in such a dry oxygen ambient at 25 atmospheres pressure at 1000° C. is 4000 Angstroms per 70 minutes. Such oxidation is preferably conducted to provide field oxide regions 44 and 45 to have a location of maximum thickness of from 1500 Angstroms to 3000 Angstroms. As depicted, field oxide regions 44 and 45 define substrate active area 25 therebetween. During field oxidation, a very thin layer of oxide (20-200 Angstroms, and not shown) may form atop masking blocks 16, 17 and 18 from transformation of the Si3N4 to SiO2.

Also during oxidation, silicon sidewall spacers 38, 40 and 42, being of a silicon material similar to substrate 12, are also oxidized and grow in volume to approximately twice their original size. This results in formation of what is referred to as “Mickey Mouse” ears 46. However, the preferred 200 Angstroms to 1000 Angstrom thin nature of silicon layer 30 which ultimately forms silicon spacers 35, 36 and 37 results in smaller (thinner) “Mickey Mouse” ears 46. This provides the subsequent advantage of minimizing upper topography of the resultant field oxide regions. Further, the elongated nature of foot portions 35, 36 and 37 (FIG. 8) advantageously provides adequate lateral displacement to prevent significant oxygen encroachment to minimize bird's beak formation beneath nitride blocks 16, 17 and 18.

FIG. 10 illustrates a diagrammatic top view of FIG. 9 emphasizing the illustrated field oxide regions 44 and 45, and active area 25 therebetween. A staggered layout of the active area regions is preferably utilized, with pitch 20 being the minimum pitch between the most closely adjacent field oxide regions. The staggering produces a wider pitch 21 (FIG. 10 only) between further spaced adjacent field oxide regions, as shown. During field oxidation, the location of maximum field oxide thickness typically occurs centrally relative to the respective widths of the regions along the wider pitch line 21. Field oxide thickness is typically less along pitch line 20, where substrate stress is greater due to closeness of the adjacent nitride masks.

FIG. 11 illustrates stripping of first masking layer material blocks 16, 17 and 18 from the substrate, and subsequent stripping of second sacrificial oxide layer material 13. Further, essentially any remnants of first sacrificial oxide layer 14 which might be remaining would also be removed. In the course of such removals, any oxide formed atop blocks 16, 17 and 18 would be removed, resulting in removal of oxide from atop field oxide regions 44 and 45 in a quanta of from 50 Angstroms to 250 Angstroms. Further, removal of layer 13 will preferably remove an additional 50 Angstroms to 500 Angstroms of oxide from the field regions. Such also advantageously results in reduced ears 46a. Subsequently, a third sacrificial oxide layer 48 is preferably grown (i.e., from 150 Angstroms to 350 Angstroms over the silicon substrate) to eliminate the undesired formation of the silicon-nitride during the field oxidation (commonly referred to as the “Kooi effect”). Such oxide growth results in an estimated growth of field oxide regions 44 and 45 of from 50 Angstroms to 200 Angstroms.

Referring to FIG. 12, third sacrificial oxide layer 48 is stripped from the substrate. Such also etches from 200 Angstroms to 400 Angstroms of field oxide regions 44 and 45, and desirably has the effect of essentially eliminating the remaining sharp points 46a to produce an upper smooth topography for such field oxide regions. Thus, bird's beak encroachment into active area is minimized. Field oxide regions 44 and 45 might also alternatively be provided to be recessed relative to bulk substrate 12.

The discussion next proceeds regarding improved techniques for roughening polysilicon surfaces for use in enhancing capacitance in capacitor constructions. More particularly and initially with reference to FIGS. 13-15, a semiconductor wafer fragment in process is indicated generally with reference numeral 50. Such comprises a bulk semiconductor substrate 52 (typically p-doped monocrystalline silicon) having an n-type diffusion region 54 provided therein. Diffusion region 54 comprises a node to which electrical connection to a capacitor plate is to be made. A layer 56 of insulative silicon dioxide is provided over bulk substrate 52, and provided with a container opening 58 therein to diffusion region 54. The wafer is placed within a chemical vapor deposition reactor, and a layer 60 of in situ conductively doped amorphous silicon is chemical vapor deposited over the depicted substrate at a first temperature, which is below 600° C.

An example preferred process for providing layer 60 would be to place the wafer in a six liter reactor with the wafer maintained at 560° C. and a reactor pressure at 80 Torr. SiH4 and phosphine are fed to the reactor at respective flow rates of 500 sccm and 300 sccm for 400 seconds. Such will produce a layer 60 having a thickness of approximately 1,000 Angstroms. By way of example only, disilane could be substituted for SiH4 at a flow rate of 300 sccm while the other parameters remain constant. Such will produce layer 60 to approximately 1,000 Angstroms in 15 seconds. For purposes of the continuing discussion, doped amorphous silicon layer 60 has an outer surface 62 of a first degree of roughness.

Referring to FIG. 14, the substrate temperature within the reactor is raised at a selected rate to an annealing second temperature which is between 550° C. and 950° C. The substrate is maintained at the second annealing temperature for a period of time sufficient to convert doped amorphous silicon layer 60 into a doped polysilicon layer 65 having an outer surface 64 of a second degree of roughness which is greater than the first degree of roughness. Substrate 50 is not removed from the reactor nor exposed to any oxidizing conditions between the time of deposition of amorphous silicon layer 60 and its conversion to polysilicon layer 65.

The selected ramp rate for the temperature increase is preferably less than or equal to 10° C./sec. Ramp rates of 30° C. and 40° C. were also utilized and while a roughness increase of surface 62 to surface 64 was observed, the increase was not as significant as where the ramp rate was kept at a lower rate of at or below 10° C./sec. The annealing second temperature is also kept at preferably below 700° C. to minimize the thermal budget on the wafer during processing.

The reactor ambient during the annealing process is preferably kept at a vacuum pressure. Alternately, an inert atmosphere of for example N2 can be utilized. Preferably, the reactor pressure during the amorphous silicon deposition and annealing steps is the same pressure, with such being greater than 0.01 Torr. Where an inert gas is provided within the reactor during the annealing step, reactor pressures of greater than or equal to 760 Torr can be utilized.

Example actual anneals were conducted at wafer temperatures of 650° C., 660° C., 670° C., 680° C., 700° C., 750° C., 800° C. and 850° C. Reactor pressures were varied from 400 mTorr to 80 Torr with and without N2. Deposition times ranged from 30 seconds to 900 seconds. Temperature ramp rates between the amorphous silicon deposition and the annealing ranged from 4° C./sec to 10° C./sec. The best results at producing maximized surface roughness of surface 64 as compared to original surface 62 occurred at 670° C. for between 30 and 60 seconds, where the ramp rate between deposition and anneal was approximately 5° C./sec.

Such a resultant surface is advantageously used in the formation of improved capacitor constructions in memory circuitry. FIG. 15 illustrates a dielectric layer 67 and subsequently deposited outer capacitor plate 68 (conductively doped polysilicon) provided to complete formation of a capacitor construction 59.

FIGS. 16-18 illustrate an alternate embodiment construction and process which incorporates at least one additional process step over that depicted by FIGS. 13-15. Like numbers from the FIGS. 13-15 embodiment are utilized where appropriate, with differences being indicated with the suffix “a” or with different numerals. FIG. 16 illustrates the same essential FIG. 13 wafer fragment 50a incorporating additional features and at a subsequent processing step to that shown by FIG. 13. Specifically and after provision of in situ doped amorphous silicon layer 60, the substrate temperature is raised at a selected rate to an intermediate silicon seeding temperature. At the seeding temperature, a discontinuous layer of silicon particles 69 is provided atop doped amorphous silicon layer 60. This occurs within the same reactor and without any intervening exposure of the wafer to oxidizing conditions between the time of amorphous silicon deposition and provision of the discontinuous seeding particles. The seeds constitute discrete clusters of silicon atoms.

A preferred process for providing the silicon particles is to feed a silicon source gas to the reactor which comprises a gaseous compound of the formula SinH2n+2, where “n” is an integer greater than or equal to 1. An example process in accordance with the above described embodiment would be to feed disilane gas to the reactor at a rate of 5 sccm to 10 sccm for from 30 to 60 seconds. Preferably, discontinuous silicon particles 69 are provided to have a particle diameter of from 10 Angstroms to 50 Angstroms. An example seeding temperature is 600° C., with the selected first ramp rate to the seeding temperature being at or below 10° C./sec. The silicon seeding temperature is preferably at or below 600° C. The result is production of an inherently rougher outer surface 62a than layer 62 of the previous embodiment.

Referring to FIG. 17, the substrate again within the same chemical vapor deposition reaction and without any intervening exposure of the wafer to oxidizing conditions, has its temperature raised at a second selected rate to the annealing temperature which is between 550° C. and 950° C. Again, the preferred rate is at or below 10° C./sec. The substrate is maintained at the annealing temperature for a period of time sufficient to convert the doped amorphous layer into a doped polysilicon layer 65a having outer surface 64a, with such outer surface having a second degree of roughness which is greater than the first degree of roughness of amorphous silicon layer outer surface 62a.

An advantageous phenomenon occurs in utilization of silicon particles 69. The amorphous silicon of layer 60 migrates on surface 62a and agglomerates onto the silicon seeds/particles 69, creating bumps and valleys and therefore an outer polysilicon surface having even greater roughness. FIG. 17 depicts the particles 69 as being discrete at the conclusion to the annealing processing step. More typically, such particles would no longer exist as discrete particles, and would rather constitute a part of the homogeneously formed polysilicon crystal lattice of layer 65a. An example annealing temperature wherein a silicon seeding temperature of 600° C. is utilized would be 630° C. Also possible in accordance with the invention, the annealing temperature and seeding temperature might be the same temperature, such that the second selected temperature ramp rate is 0° C./sec.

Referring to FIG. 18, a capacitor dielectric layer 67a and cell plate layer 68a are provided to produce a resultant capacitor construction 59a. Layers 67a and 68a will have slightly greater roughness than the first described embodiment due to the enhanced roughening produced by the silicon seeding process.

One additional problem associated with density maximization of memory circuitry concerns required spacing which is provided between adjacent devices, such as between a bit line contact and a capacitor construction. The problem is best understood with reference to FIGS. 19 and 20.

FIG. 19 illustrates a semiconductor wafer fragment comprising a pair of DRAM container capacitor constructions 72 and 74 having a bit contact plug 75 extending vertically therebetween. Other typical circuit components, such as field oxide regions, bulk substrate and an overlying bit line are not shown or described as such are not particularly pertinent to the points here being made. Each capacitor 72, 74 is formed within a respective container opening 76 within a previously provided insulating dielectric layer. Each comprises a storage node plate 78 and an overlying capacitor dielectric layer 80. A capacitor cell plate, common to both capacitors, is typically provided in the form of an electrically conductively doped polysilicon layer 82. Layer 82 effectively comprises a sheet as-deposited, with essentially all cell plates of the capacitors being electrically connected to or constituting a part of this sheet.

However, contact openings or holes are cut through the sheet at certain locations to enable electrical connection with areas lower in the substrate, such as for the illustrated bit plug 75. Such is accomplished by providing an opening in sheet 82, as is depicted by a mask opening outline 84. Subsequently, a bit contact 86 is provided laterally within the confines of sheet opening 84. Accordingly, the resultant bit line plug 75 will be effectively electrically isolated from cell plate 82.

The above illustrated openings 76, 84 and 86 are provided by three different and separate photolithographic masks. Due to the possibility of mask misalignment, tolerance for mask misalignment must be provided relative to each mask such that certain masks will not overlap with one another. For example, spacing “x” provides for an area for relative misalignment of the masks to produce openings 84 and 86 relative to one another. Further, spacing “y” is provided to assure misalignment tolerance for the storage node 76 container etch verses the cell plate sheet opening 84 etch. Typically, the misalignment tolerance for both spacings “x” and “y” is 0.15 micron, providing for a true spacing between bit plug 75 and storage node layer 78 of 0.3 micron. However, 0.3 micron is more than what is required to provide sufficient electrical isolation between the contact plug and the adjacent capacitors, resulting in greater real estate being consumed for a pair of adjacent memory cells that is otherwise required.

Such extra spacing can be overcome to a degree in a manner described with reference to FIGS. 21-23. Like numerals from the FIGS. 19 and 20 embodiment are utilized where appropriate, with differences being indicated by the suffix “b”, or with different numerals. Specifically, the lateral or horizontal misalignment tolerance between the respective container openings 76 and the adjacent sheet contact opening 84 are reduced on each side of bit plug opening 86 by a factor of the “y” spacing. Thus in connection with the described embodiment, the adjacent pair of containers 76 can be placed 0.3 micron closer to one another, thus increasing circuit density. Such is essentially accommodated for by allowing or providing for the misalignment tolerance of spacing “y” to be in a vertical direction as opposed to a horizontal direction.

Specifically, capacitor storage node containers 78b are recessed relative to the upper surface of the container dielectric layer at least by the misalignment tolerance distance “y”. Thereby, true mask misalignment tolerance for mask opening 84 is equal to twice the sum of the thicknesses of capacitor cell plate layer 82 and dielectric layer 80. FIG. 21 illustrates essential perfect alignment of mask opening 84 relative to the distance between containers 76, with mask opening 84 corresponding in lateral expanse to the distance between the closest distance between container openings 76.

FIG. 21 illustrates an example etch of 82 which would otherwise occur if an anisotropic etch were conducted through mask opening 84 relative to cell plate layer 82. However as shown in FIG. 23, the etch through mask opening 84 is conducted to be isotropic. This will undercut etch layer 82 beneath the photoresist to cause further displacement of the edge of cell poly layer 82 relative to the edge of bit contact opening 86. Thus adequate “x” and “y” misalignment spacing is provided relative to the storage node, sheet opening and bit line contacts by extending the “y” misalignment tolerance substantially vertically as opposed to horizontally. There will be an associated loss in capacitance due to recessing of storage node capacitor plates 78b, which effectively shrinks the size of plates 78b.

Example integration of one or more of the above processes is described with reference to FIGS. 24 and 25. Such illustrate a semiconductive wafer fragment 90 comprised of a bulk substrate 92 and field oxide regions 94. Preferably, field oxide regions 94 are produced in accordance with the above described processes to minimize bird's beak encroachment. The area between field oxide regions 94 constitutes active area 95. A series of four word lines 96, 97, 98 and 99 are illustrated in FIG. 24. Each is comprised of a composite of five layers, namely, a gate oxide layer, a conductively doped polysilicon layer, a WSix layer, an oxide layer, and a Si3N4 capping layer. Electrically insulative sidewall spacers, typically formed of Si3N4, are also provided relative to the respective word lines, as shown.

An insulating dielectric layer 100, typically borophosphosilicate glass (BPSG), is provided outwardly of the illustrated word lines. A pair of container capacitor constructions 102 and 104 is provided as shown. An intervening bit contact plug 106 extends vertically between capacitors 102 and 104. The illustrated construction constitutes two memory cells of a DRAM array, with such cells sharing a bit contact and an intervening substrate diffusion region (not shown). Contacts 107, 108, and 109 for the respective components to bulk substrate 92 are provided as shown.

Each capacitor 102, 104 is preferably constructed by a combination of the processes provided above. For example, each comprises a storage node 110 constituting conductively doped polysilicon preferably deposited to have a rough outer surface as described above. Further, each storage node layer 110 is preferably recessed relative to the outer surface of insulating dielectric layer 100 to enable the lateral expanse of the wafer consumed by mask misalignment tolerance to be reduced as described above. Such facilitates placing of capacitors 102, 104 and bit contact 106 closer to one another. A capacitor dielectric layer 112 and outer conductive cell polysilicon layer 114 are provided as shown.

Insulating dielectric layer 116 is provided with a planarized outer surface atop which a digit line 124 is provided. Such is illustrated as a simple line in FIG. 25 for clarity. Digit line 124 would typically comprise a composite of a lower adhesion layer 126 of titanium, a bulk mass conductive layer 128 of aluminum or an aluminum alloy, and an outer anti-reflective coating layer 130 of TiN. In this described embodiment, all digit lines of the array would be provided at the same essential level as digit line 124.

Another insulating dielectric layer 132 is provided outwardly of bit line 124, and provided with a planarized outer surface. Composite patterned electrically conductive runners 136 are shown outwardly of layer 132 (FIG. 24). Such conductive runners typically are not utilized as part of the DRAM memory array, but are utilized in the pitch and the peripheral circuitry of such arrays.

FIG. 25 illustrates, by dashed outline 140, the area which is consumed by a single memory cell in accordance with this embodiment. Such area can be considered or described as relative to a minimum capable photolithographic feature dimension “F”. As shown, a single memory area 140 is 4F wide by 2F deep, thus providing a consumed area for a single memory cell of 8F2.

The FIG. 24 circuit constitutes a die which is fabricated to include four composite conductive line layers. The first of those layers constitutes composite word lines 96, 97, 98 and 99 which are collectively formed from the same essential processing steps. The second composite conductive line layer constitutes cell plate polysilicon layer 114. Within the memory array, such a layer can be considered as constituting a sheet through which isolated waffle-like openings (i.e., the openings 84 of the previous described embodiment) are provided for provision of isolated bit plugs 106 therethrough. Yet in the area of the peripheral circuitry or the pitch circuitry to the memory array, layer 114 would be patterned to form one or more conductive lines to provide desired electrical interconnection.

The third composite conductive line layer constitutes digit lines 124, while the fourth conductive line layer constitutes the composite peripheral conductors 136.

This disclosure further provides an alternate process which enables elimination of field oxide regions within the memory array, thus facilitating greater circuit density. As background, field oxide regions provide electrical isolation between certain adjacent banks of memory cells within the array. Field oxide by definition defines breaks in the active area formed within the bulk substrate between adjacent cells. For example, see FIG. 25 which shows a break between the two adjacent active area regions 95. Such results from field oxide formed therebetween, with the illustrated word lines 99 and 96 running atop such field oxide region for gating a staggered set of memory cells within the array. The lateral expanse of the field oxide and word lines 96 and 99 for the staggered active area array constitute circuit area which is consumed on a semiconductor substrate. Specifically, each memory cell of a DRAM array has 1.5 times the minimum photolithographic feature size, F, of its lateral expanse consumed by field oxide and area for word lines 96 and 99. In accordance with one preferred aspect of this disclosure, memory cell area devoted to electrical isolation from an adjacent cell and to word lines 96 and 99 can be reduced from 1.5F to 0.5F.

Specifically, FIG. 26 illustrates a continuous active area 295 formed within the bulk substrate relative to the associated overlying bit line 224. A series of capacitor contacts 207 and a series of bit line contacts 208 are formed relative to continuous active area 295. Word line pairs 297 and 298 share an intervening bit contact of adjacent pairs of memory cells, which in turn share a diffusion region in the bulk substrate. Electrical isolation between the adjacent pairs of memory cells is provided by intervening isolating conductive lines 225 which are formed in conjunction with the formation of word lines 297 and 298. Lines 225 in operation are connected with ground or a suitable negative voltage, such as Vss or VBB, and effectively substitute for the electrical isolation formerly provided by field oxide.

The elimination of field oxide also enables elimination of conventional active area stagger within the array, thus eliminating area consumed by word lines 96 and 99 of the FIG. 25 embodiment. Thus the 4F lateral expanse consumed by a memory cell of FIG. 25 is capable of being reduced to 3F in the FIG. 26 embodiment (See dashed outline 240 in FIG. 26). This results in the area consumed by a single cell of 6F2, as compared to the 8F2 of the FIG. 25 embodiment.

However, bit line circuitry requirements and associated bit line spacing also play a role in the ability to shrink individual memory cell area within an array to a 6F2 level. Specifically, an actual bit line or data line structure is comprised of a pair of digit lines, namely D and D* (also referred to as “digit bar”), which connect with a single sense amplifier. Prior to the 256K memory cell level integration, D and D* ran in two separate, but adjacent, arrays with sense amplifiers being interposed between the arrays. This arrangement later came to be referred to as “open architecture”. However once DRAMs reached 256K density, the open architecture proved to be inadequate because of poorer signal to noise.

As a result, “folded bit line architecture” and improved cell designs were developed to overcome an unacceptable noise level. With a folded architecture, D and D* run sided by side in common horizontal planes, but swap horizontal positions at various locations within a single array, thus producing a noise canceling effect.

However with a smaller memory cell size of 6F2 or lower being available, the space consumed by D and D* and their associated circuitry becomes a limiting barrier to the 6F2 size. In accordance with another preferred aspect of this disclosure, D and D* are fabricated to lie adjacent one another in common vertical planes to facilitate folded architecture and density maximization.

For example, FIG. 27 illustrates one embodiment of a vertical three level twist or swap design of D and D* to facilitate achieving preferred equal bit line lengths running on the upper and lower levels of the design. As illustrated on the left side of FIG. 27, a digit D line 310 is on Level 1, while a complementary digit D* line 312 is on a Level 2 and directly beneath D line 310. D line 310 drops down to Level 2 at 314, then to a Level 3 where it is routed around the D* line by a conductive area 316, and is then elevated back up to Level 2 at 315. Accordingly, D line 310 has achieved a twist or a swap in the vertical direction, or Z-axis, from Level 1 to Level 2. A similar vertical twisting or swapping occurs for D* line 312. It drops down from Level 2 to Level 3, is routed around D line 310 and area 316 by a conductive area 318, and is then elevated to Level 2 at 313 and ultimately to Level 1 at 322. Accordingly, the twisting or swapping is relatively to the “z” direction, with attendant “x” and “y” area being consumed on Level 3 for areas 316 and 318.

FIG. 29 shows an alternate three level configuration. As shown, the twisting or swapping of D line 310 and D* 312 occurs relative to Level 2 and Level 3 within Level 1.

FIG. 30 shows another alternate configuration. Digit line D 330 is moved down one level to 336 via 332 and 334, while D* is twisted upward to 340 via 342. Region 342 extends outward in the x-y plane, while D line 330/336 stays in the same x-y configuration. Region 342 also extends into or within the vertical plane of an adjacent pair of digit lines D 346 and D* 348. To accommodate this extension of region 342, the bottom D* line 348 is moved to Level 3 along a region 350, and then brought back up to Level 2.

FIG. 31 is a rough diagrammatic view of a preferred memory array. The horizontal running lines principally comprise pairs of D and D* digit lines, with each pair extending relative to a shared sense amplifier 370. A series of word lines 373 extend from respective row decoders 372. Intervening electrically conductive isolation lines 374 are provided as shown, and connect relative to a common grounding node line 376 between the upper and lower illustrated sections of a memory array.

For ease of illustration in FIG. 31, the digit line pairs feeding the respective sense amps 70 appear as if they were horizontally spaced side-by-side relative to one another. In actuality, the subject digit line pairs are vertically oriented relative to one another in accordance with the above preferred described embodiments. For example with respect to the top illustrated pair on FIG. 31, a digit D line 360 and a digit D* line 364 are illustrated. Twisting or swapping relative to a vertical plane is indicated by the “x” crossing at location 368. Other staggered swapping of the other pairs are also shown. Most desirably, each line of each pair spends 50% of its length on each of the top and bottom portion of the vertical aligned orientation.

Referring to FIG. 32, a layout for a portion of a DRAM array having the preferred double-layer twisted digit lines is depicted. Six digit line pairs (DP0, DP2, DP2, DP3, DP4 and DP5) are shown in this abbreviated layout. Each pair consists of a D line and D* line aligned in a common vertical plane. The uppermost digit lines and lowermost digit lines are depicted as being of different widths for clarity in the drawings. In reality, they would be of the same width. The illustrated dashed rectangles comprise active area, with numerals 381 denoting bit contacts thereto. Lines 382 comprise word lines, while lines 383 are isolation lines substituting for field oxide as described above. Vertical contact vias (CV) are represented by the squares marked with an “X”.

In the depicted portion of the array, digit line pairs DP0, DP2 and DP4 undergo the preferred twist or swap within region 371 by S1, CV3 and CV4, and by S2, CV1 and CV2. Digit line pairs DP1, DP3 and DP5 are untwisted in this portion of the array. The alternating twist pattern not only provides for efficient reduction of capacitive coupling between adjacent digit line pairs, but it also provides room for the twisting operation.

It will be noted that portions of first conductive strip S1 and second conductive strip S2 are vertically aligned with portions of adjacent digit line pairs. This is possible because first and second conductive strips S1 and S2 are not on level with either of the adjacent double-layer digit lines. The interconnect pattern could be any of the patterns as depicted by FIGS. 27-31, or different patterns.

With the vertical twist or swap embodiment, the signal to noise ratios are kept acceptably low. Most preferably, the vertical arrangement and the crossing digit lines are provided to allow for equal top and bottom orientation and access to the appropriate memory cells. Additionally, the adjoining digit pair of lines are also switched appropriately to diminish signal to noise problems. Further, the vertical plane swapping facilitates 6F2 or smaller memory cell size.

Preferably, the twisting locations in the array are at quarter marks, either the first and third quarter, or at the halfway mark in the array. This allows for different digit line pair arrangements to be located next to each other. Further, the memory cells may be located between, along side, on top, or underneath the bit lines, thus accommodating for trench, stacked, or elevated designs.

FIG. 33 is an example cross sectional view of a wafer fragment 390 as would be positionally taken through and along the bit line of FIG. 26. It is similar to FIG. 24 but for two notable exceptions. Like numerals from FIG. 24 are utilized where appropriate with differences of any significance being indicated with different numerals. The first notable exception is absence of field oxide regions within the array, with conductive isolation lines 383 substituting therefor. Word lines of the array are designated with numerals 382.

The second notable exception concerns provision of the digit line as two composite lines, namely D line 394 and D* line 395 separated by an insulating dielectric layer 393. Each composite digit line is preferably of the same construction as composite line 124 of FIG. 24. An insulating dielectric layer 397 overlies composite D* line 395 intermediate patterned lines 136. Thus in this described embodiment, the circuitry constitutes a die which is fabricated to include five composite conductive line layers. The first of those layers constitutes composite lines 382 and 383 which are collectively formed in the same essential processing steps. The second composite conductive line layer constitutes cell plate polysilicon layer 114, which is patterned to form lines in the area peripheral to the array.

The third and fourth composite conductive line layers constitute D and D* 394 and 395, respectively. The fifth conductive line layer constitutes the composite peripheral conductors 136.

The above described constructions are advantageously utilized to produce semiconductor memory devices, such as depicted in FIGS. 34 and 35. Specifically, a semiconductor die 150 (FIG. 35) is encapsulated in a package 152 (FIG. 34). Such is shown in the form of a dual in-line package (DIP) constituting a ceramic encapsulating body 154 having a series of electrically conductive interconnect pins 156 extending outwardly therefrom (FIG. 34).

Die 150 (FIG. 35) is comprised of a series of 64 multiple memory arrays 160 arranged as shown. The area immediately surrounding the respective array areas 160, such as the illustrated areas 162, contain what is referred to as pitch circuitry, as such circuitry is “on pitch” with the conductive lines which extend outwardly from the associated memory arrays 160. Such pitch circuitry 162 would comprise, for example, sense amplifier circuitry, equilibration circuitry, bias devices, I/O decoders, and other circuitry.

Die areas 164, 166, 168, 170, 172 and 174 constitute what is referred to as peripheral circuitry. Pitch circuitry areas 162 would electrically connect with the peripheral circuitry areas, with the peripheral circuitry electrically interconnecting with the illustrated series of bond and probe pads 175. Suitable wires or other means would be utilized to connect with bond pads 175 to provide electrical connection to pins 156 of FIG. 34. The peripheral circuitry would preferably include the operably interconnected control and timing circuitry, address and redundancy circuitry, data and test path circuitry, and voltage supply circuitry which collectively enable full access to all addressable memory cells of the memory arrays. For example, peripheral circuitry region 164 would typically comprise global column decode and column addressing circuitry. Section 174 could include section logic, DC sense amps and write drivers. Peripheral circuitry regions 170 and 172 would include power amplifiers, power busing and chip capacitors. Regions 166 and 168 would include other logic circuitry.

One or more of the above described processes and die configuration can facilitate formation of 64 M, 16 M, and 4 M memory die or devices having smaller size or consumed monolithic die area than has heretofore been practically achieved. For example, at a 64 M memory cell integration level, a total of no more than 68,000,000 (typically exactly 67,108,864) functional and operably addressable memory cells are arranged within collective multiple memory arrays 160. The occupied area of all of the functional and operably addressable memory cells on the die consumed within the multiple memory arrays will have a total combined area which is no greater than 53 mm2.

In accordance with standard semiconductor memory fabrication, the respective memory arrays are provided with redundant memory cells which after test can be operably fused to replace inoperable memory cells created during fabrication. Where an inoperable memory cell is determined during tests, the entire respective row (word line) or column (bit line) is fused out of operation, and a substitute operable redundant row or column substituted in its place. Accordingly during fabrication, the individual respective memory arrays, such as in the above FIG. 35 example and for 16 M integration, are intended to be fabricated to include more than {fraction (1/64)}th of the total operable memory cells of the finished memory device to contend with inoperable circuitry undesirably fabricated within the arrays.

However upon final fabrication and assembly, the respective memory arrays are provided to contain {fraction (1/64)}th of the total memory cells of the memory device/chip. Accordingly, each array 160 would have an area which is greater than the sum of {fraction (1/64)}th of the area which would be taken up by the total functional and operably addressable memory cells within the respective sub-array. Regardless, that surface area of the die which is consumed by the memory cells which are finally functional and operably addressable through final fusing or other means will have a total combined area (although perhaps disjointed if internal inoperable cells are fused out) in this inventive example which is no greater than 53 mm2. However, the area consumed by a respective individual array 160 will be greater than {fraction (1/64)}th of the described 53 mm2 due to the redundant circuitry. Sixty four (64) sub-arrays is the preferred number for 16 M integration, while 256 sub-arrays would be more preferred and typical for 64 M integration.

There will be areas on die 150 within at least one array 160 where at least 100 square microns of continuous die surface area has a collection of all operable memory cells, with no inoperable memory cells being included within that particular 100 square micron area. In accordance with one aspect of the invention, there will be at least 128 memory cells within such 100 square microns of continuous die surface area.

The above described preferred maximum 53 mm2 area occupied by finally functional and addressable memory cells on a die for 64 M integration is with respect to the above described four or less composite conductive line layers construction of FIG. 24. With such four conductive line layers, the peripheral circuitry, the pitch circuitry and the memory arrays will have a total combined continuous surface area on the die which is less than or equal to 106 mm2.

Where five composite conductive line layers are utilized, the die area consumed by all of the functional and operably addressable memory cells will have a reduced total combined area (although again, most likely non-continuous/disjointed) which is no greater than 40 mm2 for 64 M integration. Further in such instance, the peripheral circuitry, the pitch circuitry and the memory arrays will have a total combined continuous surface area on the die which is less than or equal to 93 mm2.

Further for the example five composite conductive line layers construction, there will be areas on die 150 within at least one array 160 where at least 100 square microns of continuous die surface area has a collection of all operable memory cells, with no inoperable memory cells being included within that particular 100 square micron area. In accordance with an aspect of the invention, there will be at least 170 memory cells within such 100 square microns of continuous die surface area.

In accordance with another aspect of the invention and at the 16 M memory cell integration level, a total of no more than 17,000,000 (typically exactly 16,777,216) functional and operably addressable memory cells are provided by the multiple memory arrays 160. The occupied area of all of the functional and operably addressable memory cells on the die consumed within the multiple memory arrays will have a total combined area which is no greater than 14 mm2. Such is achievable, by way of example only and not by way of limitation, in the context of a four or less composite conductive line layers construction as described above with respect to example FIGS. 24 and 25. In such instance, the periphery circuitry, the pitch circuitry and the memory arrays have a total combined continuous surface area on the die which is less than or equal to 35 mm2. Also, at least one of the memory arrays which contain at least 100 square microns of continuous die surface area will have at least 128 functional and operably addressable memory cells.

Where five composite conductive line layers are utilized, the die area consumed by all of the functional and operably addressable memory cells will have a reduced total combined area (although again, most likely non-continuous/disjointed) which is no greater than 11 mm2 for 16 M integration. Further in such instance, the peripheral circuitry, the pitch circuitry and the memory arrays will have a total combined continuous surface area on the die which is less than or equal to 32 mm2. Further, at least one of the memory arrays which contain at least 100 square microns of continuous die surface area will have at least 170 functional and operably addressable memory cells.

For example with respect to the above described FIG. 35 depiction and a five composite conductive line layers construction, at the 16 M integration level, each of the 64 memory arrays 160 would include 256K (truly 262,144) functional and operably addressable memory cells. An example ultimate dimension for chip 150 is 3.78 mm by 8.20 mm, resulting in a total continuous die area of 31.0 mm2.

In accordance with another aspect of the invention and at the 4 M memory cell integration level, a total of no more than 4,500,000 (typically exactly 4,194,394) functional and operably addressable memory cells are provided by the multiple memory arrays 160. The occupied area of all of the functional and operably addressable memory cells on the die consumed within the multiple memory arrays will have a total combined area which is no greater than 3.3 mm2. Such is achievable, by way of example only and not by way of limitation, in the context of a four or less composite conductive line layers construction as described above with respect to example FIGS. 24 and 25. In such instance, the periphery circuitry, the pitch circuitry and the memory arrays have a total combined continuous surface area on the die which is less than or equal to 11 mm2. Also, at least one of the memory arrays which contain at least 100 square microns of continuous die surface area will have at least 128 functional and operably addressable memory cells.

Where five composite conductive line layers are utilized, the die area consumed by all of the functional and operably addressable memory cells will have a reduced total combined area (although again, most likely non-continuous/disjointed) which is no greater than 2.5 mm2 for 4 M integration. Further in such instance, the peripheral circuitry, the pitch circuitry and the memory arrays will have a total combined continuous surface area on the die which is less than or equal to 10.2 mm2. Further, at least one of the memory arrays which contain at least 100 square microns of continuous die surface area will have at least 170 functional and operably addressable memory cells.

The above described products provide example memory circuit integration at the 64 M, 16 M, and 4 M integration levels utilizing less die surface area than has previously been achieved at such integration levels. Such can facilitate making the ultimate size of the resultant package smaller by making the integrated dies potentially smaller. Further for the manufacturer, more dies per wafer are capable of being achieved thus increasing yield, thereby lowering manufacturing costs and increasing profitability. Further, the higher memory cell density enables lower operating power and greater speed with less parasitic capacitance. Further, the word lines and digit lines can be shorter, and lower overall voltages can be utilized.

In accordance with another aspect of the invention, a semiconductor memory device includes a plurality of functional and operably addressable memory cells arranged in multiple memory arrays formed on a semiconductor die; and circuitry formed on the semiconductor die permitting data to be written to and read from one or more of the memory cells, at least one of the memory arrays containing at least 100 square microns of continuous die surface area having at least 170 of the functional and operably addressable memory cells. Preferably, the total number of functional and operably addressable memory cells on the semiconductor die is between 256,000,000 and 275,000,000.

In accordance with yet another aspect, a 256 M semiconductor memory device comprises a semiconductor die encapsulated in a package, the package having an encapsulating body and electrically conductive interconnect pins extending outwardly from the body; a total of from 256,000,000 to 275,000,000 functional and operably addressable memory cells arranged in multiple memory arrays formed on the die, the individual functional and operably addressable memory cells occupying area on the die within the memory arrays, the occupied area of all functional and addressable memory cells on the die having a total combined area which is no greater than 157 mm2; and peripheral circuitry and pitch circuitry formed on the die relative to the memory arrays; the peripheral circuitry electrically interconnecting with the pins and including operably interconnected control and timing circuitry, address and redundancy circuitry, data and test path circuitry, and voltage supply circuitry which collectively enable full access to all addressable memory cells of the memory arrays. The above 157 mm2 is preferably for at least a five composite conductive line layer process. Further preferably the peripheral circuitry, the pitch circuitry and the memory arrays have a total combined continuous surface area on the die which is less than or equal to 262 mm2. The 262 mm2 is also preferably for at least a five composite conductive line layer process.

Semiconductor wafer fabrication to produce memory chips or dies strives to get as many dies from a wafer as possible. Such is approached by trying to maximize the number of available die sites per wafer for a given level of integration and still achieve acceptable overall yields of numbers of operable dies per wafer. Typically, not all of the wafer surface area is usable for fabrication of operable memory chips, nor are all die sites on a given wafer fabricated to have respective memory chips.

For example, most all of the outermost wafer edge area is not usable as such does not include sufficient respective surface area for individual memory chips. This is due to, for example in part, the rounded outer periphery of most of the wafer. Further, wafer mapping for dies typically starts at the very center and works outwardly, inherently leaving less than full desired area for memory chips around the outermost wafer area. Accordingly, memory circuitry fabricated in these outermost sites will be incomplete and not useable. Further, a small number of the available die sites on a wafer may not be designed to have memory circuitry therein. Such sites might, for example, be fabricated to have test circuitry to facilitate testing of all chips on the wafer for operability prior to dicing. Regardless, it is desirable for the fabricator to maximize available die sites on the wafer in an effort to maximize yield of operable product per wafer. In the context of this document, “die sites” refers only to those areas on the wafer of adequate size to enable retaining a fabricated memory chip of the selected integration, regardless of whether such area retains such a memory chip.

The size of the wafer of course impacts the number of die sites available for memory circuitry, as does scribe line width, circuit density, and the number of memory cells per chip/die area. Wafers can be purchased typically in 6″ and 8″, and soon 12″, major diameter sizes. The 6″ wafers have a single flat on the outermost peripheral wafer edge, whereas the 8″ wafer and the 12″ wafer in development have no flats. For example for a 6″ single-flat wafer at the 4 M integration level, the known prior art wafers have no more than 900 die sites per wafer. For an 8″ no-flat wafer, the known 4 M integration level prior art wafers have no more than 1650 die sites per wafer. For a 12″ no-flat wafer, the known 4 M integration level prior art proposed wafers have no more than 3900 die sites per wafer.

Further for a 6″ single-flat wafer at the 16 M integration level, the known prior art wafers have no more than 250 die sites per wafer. For an 8″ no-flat wafer, the known 16 M integration level prior art wafers have no more than 470 die sites per wafer. For a 12″ no-flat wafer, the known 16 M integration level prior art proposed wafers have no more than 1120 die sites per wafer.

Further for a 6″ single-flat wafer at the 64 M integration level, the known prior art wafers have no more than 70 die sites per wafer. For an 8″ no-flat wafer, the known 64 M integration level prior art wafers have no more than 135 die sites per wafer. For a 12″ no-flat wafer, the known 64 M integration level prior art proposed wafers have no more than 320 die sites per wafer.

In accordance with the invention, considerably greater numbers of die sites for wafers are achieved.

For example, a plurality of 4 M semiconductor memory devices in accordance with the invention comprises a processed semiconductor wafer ready for dicing having a major diameter of about 6 inches; and a plurality of die sites on the processed wafer, the die sites being sized for respective receipt of from 4,000,000 to 4,500,000 functional and operably addressable memory cells arranged in multiple memory arrays within a respective die site, a predominate number of the total number of die sites on the processed wafer being occupied by memory devices having a plurality of functional and operably addressable memory cells arranged in multiple memory arrays, the total number of die sites on the processed wafer being at least 1300. Actual number of die sites achievable with the above example preferred four composite conductive line layers process for a 6 inch wafer is 1382. Even more preferably, the number of die sites per processed 6 inch wafer is at least 1425, and still even more preferably at least 1490. Actual number of die sites achievable with the above example preferred five composite conductive line layers process for a 6 inch wafer is 1494.

Further, a plurality of 4 M semiconductor memory devices in accordance with the invention comprises a processed semiconductor wafer ready for dicing having a major diameter of about 8 inches; and a plurality of die sites on the processed wafer, the die sites being sized for respective receipt of from 4,000,000 to 4,500,000 functional and operably addressable memory cells arranged in multiple memory arrays within a respective die site, a predominate number of the total number of die sites on the processed wafer being occupied by memory devices having a plurality of functional and operably addressable memory cells arranged in multiple memory arrays, the total number of die sites on the processed wafer being at least 2500. Actual number of die sites achievable with the above example preferred four composite conductive line layers process for an 8 inch wafer is 2580. Even more preferably, the number of die sites per processed 8 inch wafer is at least 2700, and still even more preferably at least 2775. Actual number of die sites achievable with the above example preferred five composite conductive line layers process for a processed 8 inch wafer is 2778.

Further, a plurality of 4 M semiconductor memory devices in accordance with the invention comprises a processed semiconductor wafer ready for dicing having a major diameter of about 12 inches; and a plurality of die sites on the processed wafer, the die sites being sized for respective receipt of from 4,000,000 to 4,500,000 functional and operably addressable memory cells arranged in multiple memory arrays within a respective die site, a predominate number of the total number of die sites on the processed wafer being occupied by memory devices having a plurality of functional and operably addressable memory cells arranged in multiple memory arrays, the total number of die sites on the processed wafer being at least 5975. Actual number of die sites achievable with the above example preferred four composite conductive line layers process for a 12 inch wafer is 6005. Even more preferably, the number of die sites per processed 12 inch wafer is at least 6400, and still even more preferably at least 6450. Actual number of die sites achievable with the above example preferred five composite conductive line layers process for a processed 12 inch wafer is 6460.

Further, a plurality of 16 M semiconductor memory devices in accordance with the invention comprises a processed semiconductor wafer ready for dicing having a major diameter of about 6 inches; and a plurality of die sites on the processed wafer, the die sites being sized for respective receipt of from 16,000,000 to 17,000,000 functional and operably addressable memory cells arranged in multiple memory arrays within a respective die site, a predominate number of the total number of die sites on the processed wafer being occupied by memory devices having a plurality of functional and operably addressable memory cells arranged in multiple memory arrays, the total number of die sites on the processed wafer being at least 375. Actual number of die sites achievable with the above example preferred four composite conductive line layers process for a 6 inch wafer is 413. Even more preferably, the number of die sites per processed 6 inch wafer is at least 425, and still even more preferably at least 455. Actual number of die sites achievable with the above example preferred five composite conductive line layers process for a 6 inch wafer is 459.

Further, a plurality of 16 M semiconductor memory devices in accordance with the invention comprise a processed semiconductor wafer ready for dicing having a major diameter of about 8 inches; and a plurality of die sites on the processed wafer, the die sites being sized for respective receipt of from 16,000,000 to 17,000,000 functional and operably addressable memory cells arranged in multiple memory arrays within a respective die site, a predominate number of the total number of die sites on the processed wafer being occupied by memory devices having a plurality of functional and operably addressable memory cells arranged in multiple memory arrays, the total number of die sites on the processed wafer being at least 700. Actual number of die sites achievable with the above example preferred four composite conductive line layers process for an 8 inch wafer is 778. Even more preferably, the number of die sites per processed 8 inch wafer is at least 800, and still even more preferably at least 855. Actual number of die sites achievable with the above example preferred five composite conductive line layers process for a processed 8 inch wafer is 860.

Further, a plurality of 16 M semiconductor memory devices in accordance with the invention comprises a processed semiconductor wafer ready for dicing having a major diameter of about 12 inches; and a plurality of die sites on the processed wafer, the die sites being sized for respective receipt of from 16,000,000 to 17,000,000 functional and operably addressable memory cells arranged in multiple memory arrays within a respective die site, a predominate number of the total number of die sites on the processed wafer being occupied by memory devices having a plurality of functional and operably addressable memory cells arranged in multiple memory arrays, the total number of die sites on the processed wafer being at least 1780. Actual number of die sites achievable with the above example preferred four composite conductive line layers process for a 12 inch wafer is 1843. Even more preferably, the number of die sites per processed 12 inch wafer is at least 1980, and still even more preferably at least 2015. Actual number of die sites achievable with the above example preferred five composite conductive line layers process for a processed 12 inch wafer is 2019.

Further, a plurality of 64 M semiconductor memory devices in accordance with the invention comprises a processed semiconductor wafer ready for dicing having a major diameter of about 6 inches; and a plurality of die sites on the processed wafer, the die sites being sized for respective receipt of from 64,000,000 to 68,000,000 functional and operably addressable memory cells arranged in multiple memory arrays within a respective die site, a predominate number of the total number of die sites on the processed wafer being occupied by memory devices having a plurality of functional and operably addressable memory cells arranged in multiple memory arrays, the total number of die sites on the processed wafer being at least 100. Actual number of die sites achievable with the above example preferred four composite conductive line layers process for a 6 inch wafer is 126. Even more preferably, the number of die sites per processed 6 inch wafer is at least 130, and still even more preferably at least 145. Actual number of die sites achievable with the above example preferred five composite conductive line layers process for a 6 inch wafer is 146.

Further, a plurality of 64 M semiconductor memory devices in accordance with the invention comprises a processed semiconductor wafer ready for dicing having a major diameter of about 8 inches; and a plurality of die sites on the processed wafer, the die sites being sized for respective receipt of from 64,000,000 to 68,000,000 functional and operably addressable memory cells arranged in multiple memory arrays within a respective die site, a predominate number of the total number of die sites on the processed wafer being occupied by memory devices having a plurality of functional and operably addressable memory cells arranged in multiple memory arrays, the total number of die sites on the processed wafer being at least 200. Actual number of die sites achievable with the above example preferred four composite conductive line layers process for an 8 inch wafer is 244. Even more preferably, the number of die sites per processed 8 inch wafer is at least 250, and still even more preferably at least 280. Actual number of die sites achievable with the above example preferred five composite conductive line layers process for a processed 8 inch wafer is 282.

Further, a plurality of 64 M semiconductor memory devices in accordance with the invention comprises a processed semiconductor wafer ready for dicing having a major diameter of about 12 inches; and a plurality of die sites on the processed wafer, the die sites being sized for respective receipt of from 64,000,000 to 68,000,000 functional and operably addressable memory cells arranged in multiple memory arrays within a respective die site, a predominate number of the total number of die sites on the processed wafer being occupied by memory devices having a plurality of functional and operably addressable memory cells arranged in multiple memory arrays, the total number of die sites on the processed wafer being at least 525. Actual number of die sites achievable with the above example preferred four composite conductive line layers process for a 12 inch wafer is 585. Even more preferably, the number of die sites per processed 12 inch wafer is at least 625, and still even more preferably at least 670. Actual number of die sites achievable with the above example preferred five composite conductive line layers process for a processed 12 inch wafer is 674.

Still further, a plurality of 256 M semiconductor memory devices in accordance with the invention comprises a processed semiconductor wafer ready for dicing having a major diameter of about 6 inches; and a plurality of die sites on the processed wafer, the die sites being sized for respective receipt of from 256,000,000 to 275,000,000 functional and operably addressable memory cells arranged in multiple memory arrays within a respective die site, a predominate number of the total number of die sites on the processed wafer being occupied by memory devices having a plurality of functional and operably addressable memory cells arranged in multiple memory arrays, the total number of die sites on the processed wafer being at least 45. Actual number of die sites achievable with the above example preferred five composite conductive line layers process for a processed 6 inch wafer is 47.

Further, a plurality of 256 M semiconductor memory devices in accordance with the invention comprises a processed semiconductor wafer ready for dicing having a major diameter of about 8 inches; and a plurality of die sites on the processed wafer, the die sites being sized for respective receipt of from 256,000,000 to 275,000,000 functional and operably addressable memory cells arranged in multiple memory arrays within a respective die site, a predominate number of the total number of die sites on the processed wafer being occupied by memory devices having a plurality of functional and operably addressable memory cells arranged in multiple memory arrays, the total number of die sites on the processed wafer being at least 86. Actual number of die sites achievable with the above example preferred five composite conductive line layers process for a 8 inch wafer is 89.

Further, a plurality of 256 M semiconductor memory devices in accordance with the invention comprises a processed semiconductor wafer ready for dicing having a major diameter of about 12 inches; and a plurality of die sites on the processed wafer, the die sites being sized for respective receipt of from 256,000,000 to 275,000,000 functional and operably addressable memory cells arranged in multiple memory arrays within a respective die site, a predominate number of the total number of die sites on the processed wafer being occupied by memory devices having a plurality of functional and operably addressable memory cells arranged in multiple memory arrays, the total number of die sites on the processed wafer being at least 210. Even more preferably, the number of die sites per processed 12 inch wafer is at least 225. Actual number of die sites achievable with the above example preferred five composite conductive line layers process for a 12 inch wafer is 228.

In compliance with the statute, the invention has been described in language more or less specific as to structural and methodical features. It is to be understood, however, that the invention is not limited to the specific features shown and described, since the means herein disclosed comprise preferred forms of putting the invention into effect. The invention is, therefore, claimed in any of its forms or modifications within the proper scope of the appended claims appropriately interpreted in accordance with the doctrine of equivalents.