So far, LG has already defended the Snapdragon 810, also found inside the G Flex 2 smartphone announced at CES 2015. The company said it managed to work around the heat emissions for the G Flex 2, while Qualcomm is “is contending with reports that a new chip for smartphones generates too much heat,” without providing other details about it.

“Heat levels don’t depend entirely on the CPU (mobile processor) but also on how the phone’s internal cooling system is designed,” LG’s smartphone development vice president Choi Yong-su said.

The Snapdragon 810 SoC revision should be available to Samsung in March, the Journal said, although it’s not clear if that’s fast enough to meet Samsung’s Galaxy S6 launch needs. Recent reports revealed that the South Korean giant might revert to using its own chips inside the first versions of the Galaxy S6, with Qualcomm’s SoC to be used in future production runs.