OnScale Exits Stealth with $3M in Seed Funding and Unveils the Industry’s First Solver-as-a-Service Platform

Engineers can now benefit from OnScale’s proven solver technology
which has been validated by world-class engineering teams over decades.

Cupertino, CA – March 1, 2018 — Emerging from stealth today, OnScale announces $3 million in strategic seed funding and unveils the industry’s first Solver-as-a-Service platform that gives engineers the power to accelerate innovation in the $40 billion 5G, Biomedical, Internet of Things (IoT), and Driverless Car markets.

OnScale was co-founded by CEO Ian Campbell, VP of Product Development Dr. Robbie Banks, and VP of Engineering Dr. Gerry Harvey as a spin-off company from Thornton Tomasetti. Thornton Tomasetti, a global leader in science and engineering consulting services, led the seed round with participation from Silicon Valley investors like Michael Lehman, former CFO of Arista Networks, Palo Alto Networks, and Sun Microsystems, and CampbellKlein, an early stage high-tech venture fund.

Introducing the OnScale Solver-as-a-Service Platform

OnScale has built the world’s first Solver-as-a-Service platform with advanced computer-aided engineering (CAE) multi-physics solvers that are seamlessly integrated with a scalable Cloud High Performance Computing (HPC) platform. OnScale’s solvers have been carefully architected and maintained by the same expert team over decades. Combined with the limitless HPC resources available on the cloud, OnScale’s platform breaks cost and performance barriers for engineers solving tomorrow’s toughest engineering challenges.

The OnScale Solver-as-a-Service will be commercially available in Q2 2018.

Quotes

Tom Scarangello, CEO and Chairman of Thornton Tomasetti
“OnScale will help engineers deliver on the promise of future technologies like 5G and IoT that we’re all waiting for. Initiatives like 5G can only succeed through rapid innovation, and innovation happens only when engineers are unconstrained. OnScale has huge market potential because it makes world-class CAE solvers with unlimited Cloud HPC resources available to every engineer.”

Michael Palma, Research Director, Enabling Technologies and Semiconductors, IDC
“Engineers continue to design and build technology that will underpin the future of IoT, however design costs and the length of design cycles can hinder innovation in autonomous vehicles, biomedical devices and 5G. One possible solution to these design challenges is combining computer aided engineering (CAE) and cloud based high performance computing (HPC).”

“Our engineering design cycles come in bursts throughout the year. OnScale’s SaaS model helps us to best utilize our R&D expenses as demand for CAE and HPC fluctuates.”

Dr. Michael Weaver, CEO & Founder, Cenofex Innovations

“OnScale’s SaaS pricing model gives us access to CAE and HPC resources that would traditionally only be available to large companies with massive R&D budgets. OnScale gives our startup a competitive edge against giants in our industry.”

OnScale, the global leader in CAE and Cloud HPC, empowers engineers to accelerate innovation for next-generation products such as 5G smartphones, Internet of Things (IoT) and biomedical devices, and driverless car products. The company emerged from stealth in 2018 with $3 million in Seed funding to deploy the first and only Solver-as-a-Service platform. The OnScale Solver-as-a-Service Platform combines sophisticated Computer-Aided Engineering (CAE) multiphysics solvers with the limitless power of cloud High Performance Computing (HPC) to remove performance and cost constraints of legacy CAE/HPC, reduce design cycles from months to weeks or even days, and deliver unequaled solver performance that easily scales to meet ever-changing CAE workloads. The OnScale leadership team includes successful entrepreneurs and award-winning experts in MEMS, semiconductors, CAE, Cloud HPC, biomedical and 5G RF technologies. For More Information visit: http://onscale.com/

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