ProVIA Plasma Treatment System

Nordson MARCH’s ProVIA™ System is specifically configured to meet the demands of today’s high throughput PCB manufacturing operations. Plasma treatment uniformity is a key operational feature in desmear and etch back applications for HDI, flexible and rigid circuit board manufacturing technologies. The ProVIA system delivers!

Superior Plasma Uniformity for High Throughput PCB Treatment

The ProVIA system platform is completely self-contained, requiring minimal floor space. The vacuum system, plasma chamber, control electronics, and 40 kHz power supply are housed in a single enclosure. Full front and rear access allows for convenient service to all interior components. The pump is positioned on rollers for easy removal. No side access is required allowing for even greater floor space savings.

Application Specific Technology

The ProVIA system incorporates the best of Nordson MARCH’s market leading technology combined with novel application specific technology development based on our greater than 25 years of experience. Through extensive research and development, the ProVIA system presents unique vacuum and gas flow technology, new electrode designs, and superior temperature management. The careful balance of these critical design elements and process recipe parameters delivers a system that creates the most uniform PCB treatment for key applications like desmear and landing pad cleaning.

The ProVIA system’s superior performance capabilities are complemented by very attractive low-cost-of-ownership aspects. The system features a very compact and service-friendly design. The vertical loading concept and the use of easy loading carts minimizes any idle time which generates high levels of productivity. The fast vacuum pump down and greatly enhanced process cycle times further add to the throughput and productivity of the system.

Equipped with a touch-screen PC Operator Interface, the ProVIA system provides a wide breadth of control capability and data collection. Unlimited recipes can be stored for easy switching of plasma processes from batch to batch. Password protection ensures that no unauthorized entries can be made.

Features and Benefits

High throughput of HDI, flexible and rigid panels for maximum production flexibility

Accommodates multiple panel sizes within a small footprint to consume minimal floor space

Related Products

The completely redesigned PCB-800 plasma system maintains a perfect balance between its predecessor and its successor, the ProVIA™ plasma system. The chamber is still purely PCB Series inspired, but everything else has adopted VIA™ Series technology.

The completely redesigned PCB-1600 plasma system maintains a perfect balance between its predecessor and its successor, the ProVIA™ plasma system. The chamber is still purely PCB Series inspired, but everything else has adopted VIA™ Series technology.

Unlike the previous model, this updated version of the PCB-400 utilizes many of the VIA™ Series’ technologies. Most noticeable is the user interface, which is the .NET Via Series control system. Less obvious are the same MFCs, PLCs and controllers.

The MaxVIA™ System is specifically configured to meet the demands of high throughput PCB manufacturing where uniformity is a key operation in desmear and etch back applications for HDI, flexible and rigid circuit board manufacturing technologies.

The FlexVIA™ System from Nordson MARCH is a self-contained vacuum plasma system specifically designed for maximum efficiency and cost effective treatment of flexible materials with a space-saving, compact chassis and two easy-access, front-loading doors.

Specifically designed for the processing of flexible PCB substrates, the FlexVIA-Plus™ Plasma System from Nordson MARCH further extends the VIA™ technology platform into the field of flexible material application.

The MaxVIA-Plus™ System increases process capacity, while minimizing consumption of valuable production floor space. Similarly, the system provides uniform plasma to meet the rigorous requirements of the PCB manufacturing environment.