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Disclosed is a method for a staggered T-shaped pad to eliminate
bridging defects for ultra-fine-pitch leaded packages. Benefits
include improved functionality and improved performance.

Background

Finer pitch leaded
packages are required in high-density products, such as portable devices that
are lighter and smaller, faster, and integrated with more functions.
Conventionally, the most commonly used leaded packages are 0.5-mm pitch. Board
assembly is well established without major yield loss. However, the trend
towards finer pitches, such as 0.4 mm and 0.3 mm, creates challenges in board
assembly, especially the risk of connecting adjacent mounting pads (bridging,
see Figure 1). For example, recent builds with multiple 0.4-mm pitch leaded
devices in their products and reference design resulted in a high number of
solder bridging defects of ~20,000 dpm (~80% assembly yield loss). Multiple
engineering solutions, such as stencil aperture size/design, solder mask
between pads, and solder paste change, were assessed and evaluated but none of
the options resolved the problem (see Figure 2).

Conventionally, no solution exists to eliminate this
assembly defect. Process optimization in solder print processing minimizes the
problem but is not sustainable due to a narrow process margin. The failure is
detectable visually and is reworkable using a conventional rework process, such
as touch-up with a soldering iron. As a result, this defect is contained
through rework at most surface mount technology (SMT) manufacturing houses.

Typical pad design
for leaded packages is rectangular with the same dimensions for all the pads.
Stencil aperture is designed with similar pad dimensions but with a narrower
width to reduce the opportunity for bridging to occur. However, this solution
is not effective as the solder volume varies from the printing process or
stencil-to-stencil variation.