Gavin Moore of FTDI Chip explains to Brandon Lewis, Technology Editor at Embedded Computing Design, how the power and form factor constraints of USB-to-serial offerings can make or break a mobile design at embedded world 2017, Hall 4A, stand 326.

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embedded world 2017: Day Zero

Embedded Computing Design editors Rich Nass and Brandon Lewis preface the biggest show of the year - embedd...

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embedded world 2017: A DesignStart from ARM for SoC design

In the second of two video interviews at the ARM booth (Hall 3, Booth 342) at embedded world 2017, Embedded...