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Abstract:

In an embodiment, the present invention discloses a EUV cleaner system
and process for cleaning a EUV carrier. The euv cleaner system comprises
separate dirty and cleaned environments, separate cleaning chambers for
different components of the double container carrier, gripper arms for
picking and placing different components using a same robot handler,
gripper arms for holding different components at different locations,
horizontal spin cleaning and drying for outer container, hot water and
hot air (70C) cleaning process, vertical nozzles and rasterizing
megasonic nozzles for cleaning inner container with hot air nozzles for
drying, separate vacuum decontamination chambers for outgassing different
components, for example, one for inner and one for outer container with
high vacuum (e.g., <10-6 Torr) with purge gas, heaters and RGA
sensors inside the vacuum chamber, purge gas assembling station, and
purge gas loading and unloading station.

Claims:

1. A robot handler for holding a workpiece, wherein the workpiece
comprises a first component and a second component, wherein the first
component surrounds the second component, the robot handler comprising a
handle, wherein the handle comprises two arms, wherein the distance
between the two arms is adjustable to support the first and the second
components; a mechanism coupled to the two arms to adjust the distance
between the two arms; wherein each arm comprises a first portion for
gripping the first component and a second portion for gripping the second
component, wherein the first portion and the second portion are disposed
on different locations on the arm.

2. A system as in claim 1 wherein the mechanism comprises a motor.

3. A system as in claim 1 further comprising a feedback sensor for
controlling the force acting on the first or second components.

4. A system as in claim 1 wherein the first portion comprises a middle
portion of the arm.

5. A system as in claim 1 wherein the second portion comprises a top or
bottom portion of the arm.

6. A system as in claim 1 further comprising an insert coupled to the
arm, wherein the first portion comprises a middle portion of the insert.

7. A system as in claim 1 further comprising an insert coupled to the
arm, wherein the second portion comprises a top or bottom portion of the
insert.

8. A system as in claim 1 further comprising a pin for mating with a
recess on the first or second component.

9. A method for transferring a workpiece, wherein the workpiece comprises
a first component and a second component, wherein the first component
surrounds the second component, the method comprising enlarging a first
distance between two gripper arms to encompass the first component;
gripping the first component at a first portion on the gripper arms;
transferring the first component to a first destination; enlarging a
second distance between two gripper arms to encompass the second
component; gripping the second component at a second portion on the
gripper arms; transferring the second component to a second destination,
wherein the first portion and the second portion are disposed on
different locations on the arm.

10. A method as in claim 9 wherein the enlarging and gripping are
performed by a motor.

11. A method as in claim 9 wherein the gripping is controlled by a
feedback sensor

12. A method as in claim 9 wherein the first portion comprises a middle
portion of the arm.

13. A method as in claim 9 wherein the second portion comprises a top or
bottom portion of the arm.

14. A method as in claim 9 wherein an insert is coupled to the arm,
wherein the first portion comprises a middle portion of the insert.

15. A method as in claim 9 wherein an insert is coupled to the arm,
wherein the second portion comprises a top or bottom portion of the
insert.

16. A method as in claim 9 further comprising mating a pin on the arm
with a recess on the first or second component.

[0002] The production of semiconductor components requires cleanliness,
such as control of particles, impurities, or foreign matter. The presence
of these particulates can affect the yield of good devices within the
processed wafers. Thus the transport of these wafers is typically carried
out in special transport container, such as cassettes, carriers or trays,
as well as closable or sealable containers or boxes, including Front
Opening Unified Pod [FOUP], Front-Opening Shipping Box [FOSB], Standard
Mechanical Interface [SMIF] pods or boxes. The FOUP typically possesses
comblike guidance at two facing long sides for supporting the wafers, and
can be closed with a removable cover. Without the cover the FOUP is a
hollow container having a pot-like basic form with a rectangular surface
area. In addition to wafers, reticles are also stored in reticle
carriers, which are stored in a reticle stocker. The reticle carriers are
transported to the lithography tool when needed for mask exposure.

[0003] The FOUPs and reticle carriers need to be cleaned occasionally to
maintain the standard of cleanliness required in processing semiconductor
wafers. The cleaning process can be performed in special cleaning and
drying equipment. With increasing requirements for cleanliness, the
number of cleaning cycles in the modern semiconductor factories rises,
together with increased requirements for cleanliness. For example, it is
desirable to clean a FOUP after each individual use in order to prevent,
for example cross contamination from one wafer load to the next.

[0004] Thus it is desirable to shorten the time needed for a complete
cleaning of the FOUPs. Furthermore, it is also desirable to keep cleaning
consumption as small as possible, especially in view of the increased
cleaning cycles. On the other hand, the cleaning must be very thorough in
order to fulfill the cleanliness requirements of modern semiconductor
factories.

SUMMARY

[0005] In an embodiment, the present invention discloses a cleaner system
and process for cleaning a workpiece, such as a carrier. The cleaner
system comprises at least one of separate dirty and cleaned environments,
separate cleaning chambers for different components of the double
container carrier, gripper arms for picking and placing different
components using a same robot handler, gripper arms for holding different
components at different locations, horizontal spin cleaning and drying
for outer container, hot water and hot air (70C) cleaning process,
vertical nozzles and rasterizing megasonic nozzles for cleaning inner
container with hot air nozzles for drying, separate vacuum
decontamination chambers for outgassing different components, for
example, one for inner and one for outer container with high vacuum
(e.g., <10-6 Torr) with purge gas, heaters and gas monitor (e.g.,
RGA sensors) inside the vacuum chamber, purge gas assembling station, and
purge gas loading and unloading station.

BRIEF DESCRIPTION OF THE DRAWINGS

[0006] FIG. 1 illustrates an exemplary configuration of a EUV reticle
carrier to be cleaned.

[0007] FIG. 2 illustrates an exemplary configuration of a cleaning system
according to an embodiment of the present invention.

[0008] FIGS. 3A-3C illustrate different configurations for a cleaner
system according to an embodiment of the present invention.

[0009] FIGS. 4A-4B illustrate exemplary flow configurations for a dirty
and a cleaned environments according to an embodiment of the present
invention.

[0010] FIGS. 5A-5B illustrate exemplary configurations for purging the
cleaning chamber according to an embodiment of the present invention.

[0011] FIGS. 6A-6B illustrate exemplary flowcharts for cleaning objects
using separate dirty and cleaned environments according to an embodiment
of the present invention.

[0012] FIG. 7 illustrates another exemplary cleaning process using
separate dirty and cleaned environments according to an embodiment of the
present invention.

[0013] FIGS. 8A-8B illustrate exemplary separate cleaning chambers for
different components of an object according to an embodiment of the
present invention.

[0014] FIG. 9 illustrates an exemplary cleaner system using separate
cleaning chambers for different components of an object according to an
embodiment of the present invention

[0015] FIGS. 10A-10B illustrate exemplary flowcharts for cleaning objects
using separate cleaning chambers according to an embodiment of the
present invention.

[0016] FIG. 11 illustrates an exemplary flowchart for separately cleaning
objects using separate cleaning chambers according to an embodiment of
the present invention.

[0017] FIGS. 12A-12B illustrate an exemplary robot gripper according to an
embodiment of the present invention.

[0018] FIGS. 13A-13C illustrate exemplary gripping configurations of the
gripper arms according to an embodiment of the present invention.

[0019] FIGS. 14A-14B illustrate exemplary flowcharts for gripping objects
using the present gripper arms according to an embodiment of the present
invention.

[0020] FIG. 15 illustrates an exemplary flowchart for separately cleaning
objects using separate cleaning chambers according to an embodiment of
the present invention.

[0021] FIGS. 16A-16C illustrate exemplary cleaning sequence of an object
according to an embodiment of the present invention.

[0022] FIGS. 17A-17B illustrate exemplary flowcharts for cleaning objects
according to an embodiment of the present invention.

[0023] FIGS. 18A-18C and 19A-19B illustrate an exemplary cleaning chamber
employing ultrasonic or megasonic liquid spray according to an embodiment
of the present invention.

[0024] FIGS. 20A-20B illustrate exemplary flowcharts for cleaning objects
according to an embodiment of the present invention.

[0025] FIG. 21A illustrates an exemplary decontamination chambers
according to an embodiment of the present invention.

[0026] FIG. 21B illustrates another exemplary decontamination chambers
according to an embodiment of the present invention.

[0027] FIGS. 22A-22B illustrate exemplary flowcharts for decontaminating
objects according to an embodiment of the present invention.

[0028] FIGS. 23A-23B illustrate exemplary assembling station and processes
according to an embodiment of the present invention.

[0029] FIGS. 24A-24B illustrate exemplary flowcharts for assembling
objects according to an embodiment of the present invention.

[0030]FIG. 25 illustrates an exemplary transfer and/or storage station
having purge nozzles according to an embodiment of the present invention.

[0031] FIGS. 26A-26B illustrate examples of a cleaner according to some
embodiments of the present invention.

[0032] FIG. 27 illustrates an example of a hybrid cleaner system according
to some embodiments of the present invention.

[0033] FIG. 28 illustrates an example of a cleaner system according to
some embodiments of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0034] The present invention discloses methods and apparatuses for
integrated cleaning of objects, such as semiconductor workpiece
containers and reticle carriers. The cleaning process can include liquid
cleaning, drying, and vacuum decontamination.

[0035] Cleaning methods consist of ways to remove particles and/or
contamination such as organic, inorganic metals, native oxide and
particulate matters as well as removing water spots. Cleaning can be a
critical requirement for semiconductor articles such as cassettes, FOUP,
holders, carriers, etc. In the cleaning process, removal of particles in
the range of few microns down to sub-micron levels and reduction of trace
contaminants (metals or ions) have become part of the concerns of
semiconductor cleaning industry.

[0036] The cleaning process can provide effective object cleaning with
minimum liquid residue, which can assist in the subsequent drying
process. For example, the article to be cleaned is positioned with
minimum liquid traps, such as on horizontal or vertical surfaces. In
addition, at potential trap locations, gas nozzles can be located to blow
away any trapped liquid to help in minimizing liquid residue and
assisting the drying process. Gas nozzles preferably provide nitrogen or
filtered air, but can also provide liquid or aerated liquid. In an
aspect, gas nozzles can perform cleaning action, and liquid nozzles can
remove trapped liquid.

[0037] In an embodiment, the present invention discloses cleaning
processes and systems for high level cleanliness articles, such as
extreme ultraviolet (EUV) reticle carriers. The following description
uses EUV reticle carriers are example, but the invention is not so
limited, and can be applied toward any objects having stringent
cleanliness requirements, such as low particulate contaminations and low
outgassing components.

[0038] FIG. 1 illustrates an exemplary configuration of a EUV reticle
carrier 79 to be cleaned. A EUV reticle 70 is typically stored in
double-container carrier 79, together with having nitrogen in the space
77 between the inner container and the outer container. An inner
container is typically made of metal, comprising an upper lid 71 mated
with a lower support 72. An outer container is typically made of low
outgassing polymer, comprising an upper lid 73 mated with a lower support
74. Both containers can have handles for holding by an operator or by an
automatic transport system. A handle 75 is shown for the upper lid 73 of
the outer container. The support 74 of the outer container can have
inlets for accepting nitrogen purge to the inner volume 77 of the reticle
carrier.

[0039] The double container euv reticle carrier is an example of the high
level of cleanliness for semiconductor processing, where the reticle is
stored in two levels of container to prevent contamination. In addition,
the volume between the two levels is purged with nitrogen to avoid
bacteria growth, or to prevent outgassing particles from the outer
container to attach to the inner container. Thus a cleaner system for
such cleaned objects requires improved features to maintain the desired
level of cleanliness after being cleaned.

[0040] In an embodiment, the present invention discloses separating a
dirty environment before cleaning with a cleaned environment after
cleaning. The separation can maintain the cleanliness of the objects
after being cleaned, for example, by preventing the cleaned objects from
being contaminated with contaminants in the dirty environment. In the
following description, the term "dirty" is used to indicate a
relationship to the term "clean", and is meant to indicate a less clean
environment. For example, an object can be dirty, e.g., in need of
cleaning, in term of cleanliness levels required in semiconductor
processing, and not of everyday operation. After cleaning, the object can
be clean, e.g., cleaner than before, when the object is in the dirty
state.

[0041] In an embodiment, the cleaner system comprises one or more cleaning
chambers with separate input and output ports to communicate with
separated dirty environment and cleaned environment. For example, a
cleaning chamber has an input port coupled to a dirty environment for
accepting object to be cleaned. The cleaning chamber also has a separate
output port coupled to a cleaned environment for transferring the objects
after being cleaned in the cleaning chamber to a cleaned environment. The
cleaning chamber thus separates the cleaner system into an input dirty
environment and an output cleaned environment. The input and output ports
of the cleaning chamber are synchronized to prevent cross contamination
between the dirty and the cleaned environments. For example, only one
port is open at one time to prevent dirty air in the dirty environment
from entering the cleaned environment. In an embodiment, the cleaning
chamber has cleaned purge gas (either clean compressed air or nitrogen)
before opening the output port to the cleaned environment. In addition, a
positive pressure can be established in the cleaning chamber before
opening the input port to the dirty environment, thus minimizing any
backflow of dirty air from the dirty environment. A negative pressure can
be established in the cleaning chamber before opening the output port to
the cleaned environment, thus minimizing any backflow of dirty air to the
cleaned environment.

[0042] In an embodiment, different loading ports can be used. For example,
input loading ports are used in dirty environment for accepting objects
to be cleaned. Separate output unloading ports are used in cleaned
environment for outputting cleaned objects. Further, different robot
handling systems can be used. For example, a dirty robot is used in the
dirty environment and a separate cleaned robot is used in the cleaned
environment.

[0043] Different levels of cleanliness can be established in the dirty and
cleaned environments. For example, the dirty environment can have filter
laminar flow. The cleaned environment can have improved cleanliness, for
example, filtered recirculated air or nitrogen flow with raised floor and
chiller. The recirculation of flow in the cleaned environment can isolate
the cleaned chamber from the outside ambient, thus minimizing any
possible contamination from outside air. A chiller can be installed in
the recirculation path, cooling the air or nitrogen flow and preventing
thermal agitation of air molecules.

[0044] In addition, a clean air curtain comprising fans at a top ceiling
and fans at a bottom floor at the interface with the output port of
cleaning chamber can further isolate the cleaned environment from any
potential connection with the dirty environment.

[0045] In an embodiment, the serviceable components are preferably located
in dirty environment to minimizing access to the cleaned environment,
thus keeping the cleaned environment as clean as possible.

[0046] FIG. 2 illustrates an exemplary configuration of a cleaning system
according to an embodiment of the present invention. A cleaning chamber
14 separates the dirty environment 12 from the cleaned environment 16,
with a dirty robot 12B and an input loading port 12A located in the dirty
environment 12, and a cleaned robot 16B and an output unloading port 16A
located in the cleaned environment 16. In a typical workpiece flow, a
object to be cleaned, such as a euv reticle carrier, is loaded 11 to the
input loading port 12A, then is transferred 13 by the dirty robot 12B to
the cleaning chamber 14. After being cleaned in the cleaning chamber 14,
the cleaned object is transferred 15 by the cleaned robot 16B to the
output unloading port 16A to be unloaded 17. The cleaning chamber can
have separate input door and output door, with the dirty object entering
the dirty input door 13, and the cleaned object exiting the clean output
door 15. Further considerations can be included to prevent cross
contamination between the clean and dirty environment. For example,
higher pressure can be established in the clean environment during the
transfer of the clean object to generate a laminar flow away from the
clean environment, minimizing particles backflow from the dirty
environment. In addition, isolation can be established between the clean
and dirty environment, for example, by interlocking the cleaning chamber
doors, preventing the input door and the output door to be open at a same
time.

[0047] FIGS. 3A-3C illustrate different configurations for a cleaner
system according to an embodiment of the present invention. In FIG. 3A,
the dirty environment 22 and the cleaned environment 26 are located
side-by-side with the input loading port 21 and the output unloading port
27. An input loading door 21A is first opened to accept a dirty object to
the input loading port 21. After closing the input loading door 21A, the
output loading door 21B is opened, and the dirty object can be picked up
by the dirty robot. After closing the output loading door 21B, the input
chamber door 24A is opened, and the dirty object can be transferred to
the cleaning chamber 24. After cleaning, the object can be transferred to
the output chamber door 24B, which is then opened so that the cleaned
object can be picked up by the cleaned robot. The cleaned object is then
transferred to the output unloading port 27 and then to the outside
ambient through the doors 27B and 27A.

[0048] FIG. 3B illustrates another configuration where the cleaning
chamber 24 has two opposite input door 24A and output door 24B. FIG. 3C
illustrates another configuration where the cleaner system has a number
of cleaning chambers, where two cleaning chamber 24' and 24'' are shown.
Linear guides 22B and 26B in dirty and cleaned environments,
respectively, can transport dirty and cleaned robots 22A and 26A,
respectively, to and from different cleaning chambers 24' and 24''.

[0049] In addition to the separation of environments before cleaning and
after cleaning, the environments can be maintained at different
cleanliness. For example, at the input section where the object is dirty,
a dirtier environment can be established. At the output section where the
object has been cleaned and thus is cleaner, a clean environment can be
established.

[0050] FIGS. 4A-4B illustrate exemplary flow configurations for a dirty
and a cleaned environments according to an embodiment of the present
invention. FIG. 4A illustrates a laminar flow 32B in dirty environment
32, passing through the filter system 32A. Electronic equipment 31 can be
located in the dirty environment 32, which can be accessed through
service door 30. The cleaned environment 36 has recirculating flow 36B,
passing through raised floor 37, entering chiller 38, and filtered by
filter system 36A. The closed environment can isolate the cleaned
environment 36 from the outside ambient, further improving the
cleanliness of the cleaned environment. Sandwiching between the two
environments 32 and 36 is the cleaning chamber 34, which comprises purge
gas inlet 35A and purge gas outlet 35B.

[0051] FIG. 4B illustrates an exemplary curtain gas flow for the cleaned
environment according to an embodiment of the present invention. A fan
system 39C is located in front of the output port of the cleaning
chamber, thus modifying the flow 39B in the cleaned environment, so that
a curtain flow is established at the output door 34B. This curtain flow
can minimize any back flow from the cleaning chamber 34, thus preventing
any cross contamination to the cleaned environment.

[0052] In addition to maintaining different levels of cleanliness for the
input and output sections of the cleaning system, gas purging can be
provided during the communication between the sections to minimizing
cross contamination between the sections. For example, a positive
pressure or flow can be established from the clean environment to the
dirty environment during a door between the two sections is open.
Alternatively, negative pressure can be established in the dirty
environment to also form positive pressure or flow from the clean
environment to the dirty environment.

[0053] FIGS. 5A-5B illustrate exemplary configurations for purging the
cleaning chamber according to an embodiment of the present invention. In
FIG. 5A, cleaning chamber 34 is pressurized, or purged with cleaned gas
45A before opening the input door to the dirty environment 32. After the
input door is opened, a positive flow 42 can be established from the
cleaning chamber 34 to the dirty environment 32, thus minimizing any
cross contamination resulted from a back flow from the dirty environment.
The pressure in the cleaning chamber 34 can be equal or greater than the
pressure in the dirty environment 32.

[0054] In FIG. 5B, cleaning chamber 34 is evacuated, or pressure regulated
with cleaned gas inlet 45A and outlet 45B before opening the output door
to the cleaned environment 36. After the output door is opened, a
positive flow 43 can be established from the cleaned environment 36 to
the cleaning chamber 34, thus minimizing any cross contamination resulted
from a back flow to the cleaned environment. The pressure in the cleaning
chamber 34 can be equal or lower than the pressure in the cleaned
environment 36.

[0055] In some embodiments, the present invention discloses a system for
cleaning a workpiece, such as a reticle carrier. The system can include a
first station, wherein the first station comprises a first robotic
mechanism for transferring a workpiece. The first station can be an input
section of the cleaning system, which can be configured to accept a dirty
workpiece, e.g., a workpiece that is needed to be cleaned. The system can
include a second station, wherein the second station comprises a second
robotic mechanism for transferring a workpiece. The second station can be
an output section of the clean system, which can be configured to accept
a cleaned workpiece, e.g., a workpiece that has been cleaned by the
cleaning system. The system can include a chamber, wherein the chamber is
operable to clean a workpiece. The chamber can include an entrance,
wherein the entrance is operable for enabling a workpiece to be
transferred from the first station to the chamber by the first robotic
mechanism. The chamber can include an exit, wherein the exit is operable
for enabling a workpiece to be transferred from the chamber to the second
station by the second robotic mechanism. The chamber can include liquid
nozzles for delivering cleaning liquid, drying nozzles for delivering
drying gas, and optional heaters for heating the workpiece. The second
station can be isolated from the first station. In general, the first
station and the second station sandwich the cleaning chamber, and thus
are isolated from each other. In some embodiments, the first and second
stations are also isolated during the operation of the cleaning system.
For example, the cleaning chamber can be configured to isolate the
first/second station when the cleaning chamber is exposed to the
second/first station, respectively. A door facing the first station can
be close when a door facing the second station is open, thus isolating
the first and second stations. The environment of the second station is
cleaner than the environment of the first station. Since the first
station houses the dirty workpiece, and the second station houses the
cleaned workpiece, maintaining the second station cleaner than the first
station can be beneficial with regard to the workpiece cleanliness. For
example, the first station comprises filter laminar flow coupled to the
outside ambient. The second station comprises filter recirculation gas
flow with raised floor and chiller, which can maintain a much cleaner
ambient. The system can include a mechanism to establish a curtain flow
at the exit of the chamber.

[0056] In some embodiments, the cleaning system can include multiple
chambers for cleaning multiple workpieces. For example, a first chamber
can be used to clean a first component of the workpiece, and a second
chamber can be used to clean a second component of the workpiece. The
system can include an input load port coupled to the first station for
accepting a workpiece to be transferred to the chamber. The system can
include an output load port coupled to the second station for accepting a
workpiece from the chamber. For isolating the first and second stations,
in some embodiments, the entrance and exit of the chamber are not open at
a same time to provide isolation of the first station from the second
station. The system can include a mechanism to establish a flow from the
second station to the chamber during the opening of the entrance or from
the chamber to the first station during the opening of the exit.

[0057] During the transfer of object, e.g., from the input port (dirty) to
the cleaning chamber (for cleaning) to the output port (clean),
conditions can be established to minimizing recontamination of the
cleaned object.

[0058] FIGS. 6A-6B illustrate exemplary flowcharts for cleaning objects
using separate dirty and cleaned environments according to an embodiment
of the present invention. In FIG. 6A, operation 50 establishes two
environments with different cleanliness levels interfacing a cleaning
chamber. Operation 51 transfers objects to be cleaned from the dirtier
environment to the cleaning chamber to the cleaner environment, wherein
the cleaned objects are isolated from the dirtier environment to prevent
cross contamination.

[0059] In FIG. 6B, operation 54 brings an object to be cleaned to a dirty
environment. Operation 55 transfers the object from the dirty environment
to a cleaning chamber. Operation 56 cleans the object in the cleaning
chamber. Operation 57 transfers the cleaned object from the cleaning
chamber to a cleaned environment, wherein the cleaned environment is
isolated from the dirty environment to prevent cross contamination.
Operation 58 brings the cleaned object out of the cleaned environment.

[0060] FIG. 7 illustrates another exemplary cleaning process using
separate dirty and cleaned environments according to an embodiment of the
present invention. In FIG. 7, operation 60 establishes a dirty
environment for accepting objects to be cleaned, and a cleaned
environment for accepting the objects after being cleaned, wherein the
two environments interface a cleaning chamber for cleaning the objects.
Operation 61 establishes laminar flow in the dirty environment to reduce
contamination. Operation 62 brings an object to be cleaned to the dirty
environment. Operation 63 isolates the cleaning chamber and pressurizing
the cleaning chamber before open to the dirty environment to minimize
back flow from the dirty environment. Operation 64 transfers the object
to be cleaned from the dirty environment to the cleaning chamber.
Operation 65 cleans the object in the cleaning chamber. Operation 66
establishes recirculating flow in the cleaned environment to reduce
contamination. Operation 67 cools the recirculating flow in the cleaned
environment and/or establishing a flow curtain in front of the cleaning
chamber to reduce contamination. Operation 68 isolates the cleaning
chamber and lowering pressure in the cleaning chamber before open to the
cleaned environment to minimize back flow from the cleaning chamber.
Operation 69 transfers the cleaned object from the cleaning chamber to
the cleaned environment.

[0061] In some embodiments, the present invention discloses a method for
cleaning a workpiece. The method can include transferring a workpiece
from a first station to a chamber through an entrance of the cleaning
chamber. The method can include cleaning the workpiece in the cleaning
chamber. The method can include transferring the workpiece from the
chamber to a second station through an exit of the chamber. The second
station is isolated from the first station. The environment of the second
station is cleaner than the environment of the first station.

[0062] In some embodiments, the method can further include loading the
workpiece to an input load port to be transferred to the first station.
The method can also include unloading the workpiece from the second
station to an output load port. The method can also include closing the
exit of the chamber before transferring the workpiece from the first
station to the chamber. The method can also include pressurizing the
chamber before opening the entrance of the chamber for transferring the
workpiece from the first station to the chamber. The method can also
include closing the entrance of the chamber before transferring the
workpiece from the chamber to the second station. The method can also
include lowering a pressure in the chamber before opening the exit of the
chamber for transferring the workpiece from the chamber to the second
station. The method can also include establishing a recirculating gas
flow in the second station. The method can also include cooling the
environment of the second station. The method can also include
establishing a curtain flow at the exit of the chamber.

[0063] In some embodiments, the method can include establishing two
environments with different cleanliness levels interfacing a cleaning
chamber; transferring a workpiece from the dirtier environment to the
cleaning chamber for cleaning; transferring the workpiece from the
cleaning chamber to the cleaner environment, wherein the two environments
are isolated from each other during the transfer of the workpiece.

[0064] The above description describes a cleaning chamber between two
dirty and cleaned environments. However, the present invention is not so
limited, and can be equally applied to any processing chamber requiring a
level of cleanliness established by separating the input dirty with the
output cleaned environments.

[0065] Further, the cleaner system and method of cleaning a workpiece can
include other features, such as the features described in other sections.
For example, the features can include separate cleaning chambers, gripper
arms for picking and placing different components using a same robot
handler, gripper arms for holding different components at different
locations, horizontal spin cleaning and drying for outer container, hot
water and hot air cleaning process, vertical nozzles and rasterizing
megasonic nozzles for cleaning with hot air nozzles for drying, vacuum
decontamination chambers for outgassing different components, and purge
gas loading and unloading station.

[0066] In an embodiment, the present invention discloses separate cleaning
chambers for different components of an object. The separation can
prevent contamination of cleaner components by dirtier components during
the cleaning process. For example, the inner container of a double
container euv reticle carrier is cleaner than the corresponding outer
container, since it has been designed to be protected by both the outer
container and an inert gas ambient. Thus separate cleaning chambers for
the outer container components and for the inner container components can
minimize the contamination of the inner container, for example, by the
outer container during cleaning if the inner and outer components are
cleaned together.

[0067] In an embodiment, the number of cleaning chambers is determined
based on the levels of cleanliness. For example, a double container
carrier can have two levels of cleanliness: a dirtier level for the outer
container and a cleaner level for the inner container. Thus two separate
cleaning chambers can be used. A first cleaning chamber is used for
cleaning the outer container of a double container carrier, including the
upper lid and the lower support of the outer container. A second cleaning
chamber is used for cleaning the inner container of a double container
carrier, including the upper lid and the lower support of the inner
container.

[0068] In an embodiment, the levels of cleanliness can be further refined.
For example, four levels of cleanliness can be established, generating
two cleanliness levels for each outer and inner container, since the
upper lid and the lower support of a container can attract different
levels of contamination. Thus four separate cleaning chambers can be
used. First and second cleaning chambers are used for cleaning the upper
lid and the lower support of the outer container of a double container
carrier, respectively. Third and fourth cleaning chambers are used for
cleaning the upper lid and the lower support of the inner container of a
double container carrier, respectively.

[0069] In an embodiment, each component of the object is cleaned
separately in separate cleaning chambers. For example, a double container
carrier can be cleaned in four separate cleaning chambers, one for upper
lid of outer container, one for lower support for outer container, one
for upper lid of inner container, and one for lower support for inner
container.

[0070] FIGS. 8A-8B illustrate exemplary separate cleaning chambers for
different components of an object according to an embodiment of the
present invention. In FIG. 8A, four different cleaning chambers 83A-83D
are disposed next to each other for cleaning different components of an
object, for example, the four components 80A-80D of a double container
carrier 80. A carrier 80 is loaded to a loading station 81, and then the
components are picked up by the robot 82A having gripper arms 82B in a
transfer station 82. The robot 82A can travel between the multiple
cleaning chambers 83A-83D, for example, by a linear guide 82C.

[0071] In FIG. 8B, the cleaning chambers 83A-83D separate the input dirty
environment 82 from the output cleaned environment 86, thus providing an
additional level of cleanliness for the objects to be cleaned. An object,
such as a double container carrier 80, is loaded to an input loading
station 81, and is transferred by a robot 82A to the dirty environment
82. From there, the components of the carrier 80 are placed to different
cleaning chambers 83A-83D, to be cleaned separately. After being cleaned,
a cleaned robot 86A picks up the components, places into the cleaned
environment 86, and to the output unloading station 87.

[0072] FIG. 9 illustrates an exemplary cleaner system using separate
cleaning chambers for different components of an object according to an
embodiment of the present invention. An object, such as a double
container carrier 80, is loaded to an input loading station 91, and is
transferred by a robot to the dirty environment 92. From there, the
components of the carrier 80 are placed to different cleaning chambers
93, to be cleaned separately. After being cleaned, a cleaned robot picks
up the components to bring to the cleaned environment 96. Optional
outgassing chambers 95A-95B can be included to outgas the components
before assembling the components in an assembling station 98. After being
assembled, the assembled carrier is outputted to the output unloading
station 97.

[0073] In an embodiment, the present invention discloses separate
outgassing chambers 95A and 95B for decontaminating the components after
being cleaned. Four outgassing chambers can be used. Preferably, two
outgassing chambers are used, one for inner container components and one
for outer container components. For outgassing decontamination, the
levels of cleanliness can be accomplished by using two outgassing
chambers, in combination with four cleaning chambers for different parts
of the inner and outer containers. Details for the outgassing chamber
will be described in later sections.

[0074] In an embodiment, the present invention discloses an assembling
station 98 for assembling the components together after being cleaned and
outgassing decontaminated separately. The assembling station preferably
comprises a clean environment, as clean as the cleaned environment 96, or
even cleaner. For example, the assembling station can be filled with
nitrogen, to ensure that the volume inside the carrier is filled with
nitrogen, thus preventing any oxygen for potential oxidation or bacterial
growth. Details for the assembling station will be described in later
sections.

[0075] In some embodiments, the present invention discloses a system for
cleaning a workpiece, wherein the workpiece comprises a first component
and a second component, wherein the first component surrounds the second
component. The first component can be an outer box, made of a polymer
material, and including a lid and a body portions. The second component
can be an inner box, made of a metallic material, and including a lid and
a body portions. The system can include a first chamber, wherein the
first chamber is operable to clean the first component, a second chamber,
wherein the second chamber is operable to clean the second component, a
first station, wherein the first station is coupled to the first and
second chambers, wherein the first station comprises a first robotic
mechanism, wherein the first robotic mechanism is operable to transfer
the first component from the first station to the first chamber and to
transfer the second component from the first station to the second
chamber.

[0076] In some embodiments, the first component comprises a lid and a
body, and wherein the first chamber is operable to clean both the lid and
the body. The first component can include a lid and a body, and wherein
the first chamber can include a first lid chamber operable to clean the
lid and a first body chamber operable to clean the body. The second
component can include a lid and a body, and wherein the second chamber is
operable to clean both the lid and the body. The second component can
include a lid and a body, and wherein the second chamber can include a
second lid chamber operable to clean the lid and a second body chamber
operable to clean the body. The first chamber can include a first
entrance and a first exit, wherein the second chamber can include a
second entrance and a second exit, wherein the first station is coupled
to the first and second entrances, wherein the system further can include
a second station, wherein the second station is coupled to the first and
second exits, wherein the second station can include a second robotic
mechanism, wherein the second robotic mechanism is operable to transfer
the first component from the first chamber to the second station and to
transfer the second component from the second chamber to the second
station. The first station can be isolated from the second station. The
system can further include a load port coupled to the first station for
accepting a workpiece; one or more third chambers, wherein the third
chambers are operable to enable outgassing the first and second
components after cleaning; and a fourth chamber, wherein the fourth
chamber is operable to enable assembling of the first and second
components after cleaning.

[0077] FIGS. 10A-10B illustrate exemplary flowcharts for cleaning objects
using separate cleaning chambers according to an embodiment of the
present invention. In FIG. 10A, operation 100 receives an object to be
cleaned comprising a plurality of components, such as a double container
carrier. Operation 101 disassembles the object into individual
components. For example, a double container carrier can be disassembled
into an outer container and an inner container. Alternatively, the double
container carrier can be disassembled into a lid and a support of the
outer container and into a lid and a support of the inner container.
Operation 102 transfers individual components into separate cleaning
chambers for cleaning Operation 103 assembles the cleaned individual
components, preferably in cleaned ambient to preserve the cleanliness.
The assembling station is thus preferably integrated with the multiple
cleaning chambers to maintain the cleanliness level.

[0078] In FIG. 10B, separate environments are implemented together with
separate cleaning chambers. Operation 104 brings an object comprising a
plurality of components to a dirty environment. Operation 105
disassembles and transferring individual components from the dirty
environment to individually cleaning chambers to be cleaned separately to
prevent cross contamination. Operation 106 transfers the cleaned
components from the cleaning chambers to a cleaned environment, wherein
the cleaned environment is isolated from the dirty environment to prevent
cross contamination. Operation 107 conditions the cleaned components. For
example, the cleaned components can undergo vacuum decontamination, to
remove trapped gas within the components. Operation 108 assembles the
cleaned individual components.

[0079] FIG. 11 illustrates an exemplary flowchart for separately cleaning
objects using separate cleaning chambers according to an embodiment of
the present invention. Operation 110 establishes a dirty environment and
a cleaned environment, wherein the two environments interface a plurality
of cleaning chambers. Operation 111 brings a double-container carrier to
the dirty environment, wherein the double-container carrier comprises a
top and bottom inner container and a top and bottom outer container.
Operation 112 disassembles the double-container carrier into individual
components. Operation 113 transfers individual components into separate
cleaning chambers for cleaning. Operation 114 cleans the individual
components in the individual cleaning chambers. Operation 115 transfers
the individual components from the cleaning chambers to a cleaned
environment. Operation 116 outgases the individual components in a
plurality of separate outgassing chambers. Operation 117 assembles the
cleaned individual components to form the double-container carrier while
filling the inside of the outer container with inactive gas.

[0080] In some embodiments, the present invention discloses a method for
cleaning a workpiece, wherein the workpiece comprises a first component
and a second component, wherein the first component surrounds the second
component. The method can include transferring the first component of a
workpiece from a first station to a first chamber; transferring the
second component of the workpiece from the first station to a second
chamber; cleaning the first and second components in the first and second
chambers.

[0081] In some embodiments, the method can further include transferring
the first component from the first chamber to a second station through
the first exit; transferring the second component from the second chamber
to a second station through the second exit; transferring the first and
second components outgassing the first and second components after
cleaning; and transferring the first and second components to a fourth
chamber, wherein the fourth chamber is operable to assemble the first and
second components.

[0082] Further, the cleaner system and method of cleaning a workpiece can
include other features, such as the features described in other sections.
For example, the features can include separate environments, gripper arms
for picking and placing different components using a same robot handler,
gripper arms for holding different components at different locations,
horizontal spin cleaning and drying for outer container, hot water and
hot air cleaning process, vertical nozzles and rasterizing megasonic
nozzles for cleaning with hot air nozzles for drying, vacuum
decontamination chambers for outgassing different components, and purge
gas loading and unloading station.

[0083] In an embodiment, the present invention discloses a robot arm to
handle the object to be cleaned. A single robot handler can be used to
handle all components of the object. Alternatively, multiple robot
handlers can be used. In an embodiment, a gripper handler with adjustable
gripper arms is used to handle all different sizes of the components of
the double container carrier. For example, since the outer container is
larger than the inner container, the gripper arm can be enlarged to
handle the outer container and reduced to handle the inner container.
Thus a single robot handler having gripper arms can be used to handle all
different components of an object.

[0084] In an embodiment, the robot handler is further designed to avoid
cross contamination between the components of the object by contacting
different components having different cleanliness levels with different
parts of the robot handler. For example, the gripper arms grip different
components at different locations of the gripper arms. A top portion of
the gripper arms can be used to support the outer container portion. A
middle portion of the gripper arms can be used to support the inner
container portion.

[0085] In an embodiment, the robot handler is further designed to minimize
particle generation. For example, the gripper arms are controlled to grip
the components with minimum force to minimize friction which can generate
particles. Instead of using pneumatic control, motor control, with or
without feedback sensor, can be used to control the forces generated by
the gripper arms when holding the carrier components.

[0086] FIGS. 12A-12B illustrate an exemplary robot gripper according to an
embodiment of the present invention. The robot gripper comprises two
gripper arms 121A and 121B coupled to a handler 120. A movement mechanism
126, such as a motor, can move 127 the gripper arms, for enlarging or
narrowing the grip of the gripper arms to accommodate different sizes of
objects. The motor can have a controller component, such as a current
sensor (built in the motor, not shown) or pressure sensors 125A/125B to
control the forces from the gripper arms on the object to be gripped.
Optional inserts 122A/122B can be included for further reducing the
particle generation due to friction.

[0087] FIGS. 13A-13C illustrate exemplary gripping configurations of the
gripper arms according to an embodiment of the present invention. In FIG.
13A, the gripper arms 121 support a component 130 of an inner container
(an upper lid, for example) from the middle portion 131 of the gripper
arm inserts 122. Pins 135 can be used to lock the component 130, by
mating with a recess 137 of the component 130 (see FIG. 13C). In FIG.
13B, the gripper arms 121 support a component 132 of an outer container
(an upper lid, for example) from the top portion 133 of the gripper arm
inserts 122. Pins 135 can be used to lock the component 133, by mating
with a recess of the component (not shown, but similar to FIG. 13C). The
gripper arms thus grip different components of the objects at different
locations (middle portion 131 and top portion 133), thus can minimize
cross contamination between different components having different levels
of cleanliness. Other configurations can be used, such as gripper arm
supporting a component from the bottom of the insert, or the gripper arm
supporting a component directly by the gripper arm without the insert.

[0088] In some embodiments, the present invention discloses a robot
handler for holding a workpiece, wherein the workpiece comprises a first
component and a second component, wherein the first component surrounds
the second component. The robot handler can include a handle, wherein the
handle comprises two arms, wherein the distance between the two arms is
adjustable to support the first and the second components; a mechanism
coupled to the two arms to adjust the distance between the two arms;
wherein each arm comprises a first portion for gripping the first
component and a second portion for gripping the second component, wherein
the first portion and the second portion are disposed on different
locations on the arm.

[0089] In some embodiments, the mechanism can include a motor. The first
portion can include a middle portion of the arm. The second portion can
include a top or bottom portion of the arm. The robot handler can further
include a feedback sensor for controlling the force acting on the first
or second components. The robot handler can include an insert coupled to
the arm, wherein the first portion comprises a middle portion of the
insert. The robot handler can include an insert coupled to the arm,
wherein the second portion comprises a top or bottom portion of the
insert. The robot handler can include a pin for mating with a recess on
the first or second component.

[0090] FIGS. 14A-14B illustrate exemplary flowcharts for gripping objects
using the present gripper arms according to an embodiment of the present
invention. In FIG. 14A, operation 140 opens gripper arms to encompass a
work object. Operation 141 closes the gripper arms to hold the work
object. Operation 142 optionally senses the force on the gripper arms.
Operation 143 controls the forces of the gripper arms to minimize
particle generation due to contact.

[0091] In FIG. 14B, operation 144 provides an object comprising a
plurality of separatable components. Operation 145 opens gripper arms to
encompass a component of the object. Operation 146 moves the gripper arms
to contact the object component at a desired location of the gripper
arms, wherein the locations of the gripper arms are selected to minimize
cross contamination between components of the object. Operation 147
closes the gripper arms to hold the object component.

[0092] FIG. 15 illustrates an exemplary flowchart for separately cleaning
objects using separate cleaning chambers according to an embodiment of
the present invention. Operation 150 moves the gripper arms to contact
the top portion of the outer container at a first location of the gripper
arms. Operation 151 transfers the top portion of the outer container to a
first process chamber. Operation 152 moves the gripper arms to contact
the top portion of the inner container at a second location of the
gripper arms. Operation 153 transfers the top portion of the inner
container to a second process chamber. Operation 154 moves the gripper
arms to contact the bottom portion of the inner container at the second
location of the gripper arms. Operation 155 transfers the bottom portion
of the inner container to a third process chamber. Operation 156 moving
the gripper arms to contact the bottom portion of the outer container at
a first location of the gripper arms. Operation 157 transfers the bottom
portion of the outer container to a fourth process chamber.

[0093] In some embodiments, the present invention discloses a method for
transferring a workpiece, wherein the workpiece comprises a first
component and a second component, wherein the first component surrounds
the second component. The method can include enlarging a first distance
between two gripper arms to encompass the first component; gripping the
first component at a first portion on the gripper arms; transferring the
first component to a first destination; enlarging a second distance
between two gripper arms to encompass the second component; gripping the
second component at a second portion on the gripper arms; transferring
the second component to a second destination, wherein the first portion
and the second portion are disposed on different locations on the arm.

[0094] In some embodiments, the enlarging and gripping can be performed by
a motor. The method can further include mating a pin on the arm with a
recess on the first or second component.

[0095] In some embodiments, the robot handler can be used in transferring
a workpiece that has a first component surrounding a second component.
The robot handler can be used in other configurations described in the
present description.

[0096] In an embodiment, the present invention discloses different
cleaning chambers for cleaning different components of an object. To
clean the object, a plurality of liquid nozzles can be directed toward
the object surfaces. The liquid nozzles can deliver mixtures of cleaning
liquid, rinsing liquid (such as DI water), and other chemical liquid
designed for cleaning and decontaminating the object, such as surfactant
or metal removal agent. Ultrasonic or megasonic nozzles can deliver
energetic liquid to improve the cleaning power. The amount of liquid can
be carefully controlled, such as spraying with fine droplets and aerosol
gas bubbles together with carrier gas (such as nitrogen, air or inert
gas). The liquid nozzles can also be configured to deliver gas, such as
nitrogen or filtered air, or gas/liquid mixtures. Fast evaporating liquid
can be used, such as alcohol with low boiling temperature and high vapor
pressure. Hot carrier gas and hot liquid can also be utilized, for
example, to assist in fast drying by evaporation. In addition, the
chamber and the positioning of the object can be designed so that the
liquid can be removed by good drainage with no liquid retention and no
liquid dead spots. Further, the liquid vapor can be removed by fast
exhaust and low chamber pressure, for example, by purging with dry gas
and/or by maintaining a vacuum pressure inside the cleaning chamber
during the liquid cleaning cycle.

[0097] The nozzles can be designed to overlap the surface, providing a
complete coverage of the surface to ensure complete cleaning. The nozzles
can provide a small angle flow, for example, to have adequate cleaning
force. The angle of impact can be perpendicular to the surface for
greater force, or can be along the surface for higher surface coverage.
In an aspect, the object to be cleaned is a semiconductor container, thus
contamination tends to be small particulates or metal contamination, and
the present invention discloses cleaning nozzles having medium pressure
and low angle of impact of cleaning for higher coverage area.

[0098] In a typical cleaning process, cleaning liquid, such as cleaning
solution, is sprayed onto the object, such as the reticle carrier
components. Additives, such as surfactant, detergent, or
contamination/metal removal agents may be added into the water or other
liquid, for example, by aspiration or pumping. The contamination/metal
removal agent can be a metal removal agent such as a chelating agent. A
high alkaline detergent may be used in place of the surfactant. UV light
can be added, for example, to aid removal of contamination. After
completing cleaning and/or contamination removal, the object is then
rinsed by spraying with a rinsing liquid, such as DI water. Cyclic
cleaning/rinsing processes can be performed for effective cleaning. The
cleaning liquid can be collected for recycling.

[0099] In an embodiment, the cleaning process provides small liquid
droplets to aid in the subsequent drying process. In addition, purged gas
or liquid spray can be provided to break droplets into even smaller ones.
In the areas where the liquid is consolidated, for example, at the bottom
of the surfaces, gas or liquid spray can be provided to break the large,
consolidated liquid into small droplets, such as blowing the liquid away.

[0100] In an embodiment, the liquid can be heated to increase the
volatility, adding in the ease of liquid residue removal. In addition,
the object and the process chamber can also be heated, for example, by IR
or UV lamps.

[0101] In the cleaning chamber, the object can be positioned so that the
liquid can run down by gravity. After liquid cleaning, the object can be
dried by gas flow, for example, gas nozzles providing nitrogen, filtered
air, liquid or aerated liquid, can be directed toward the object to help
remove liquid residue trapped by surface tension. For example, a bottom
gas nozzle can be directed toward the bottom of the object, in addition
to a top gas nozzle can be directed toward the top surface, and other gas
nozzles directed toward irregular shapes of the object where liquid
residue can be trapped. Additionally, spin drying can be used.

[0102] In some embodiments, the present invention discloses a system for
cleaning a workpiece. The system can include a chamber; one or more first
nozzles, wherein the first nozzles are operable to deliver a cleaning
liquid; one or more second nozzles, wherein the second nozzles are
operable to deliver a megasonic liquid; one or more third nozzles,
wherein the third nozzles are operable to deliver a drying gas; a first
mechanism for moving the second nozzles in a first direction; a second
mechanism for moving the workpiece in a second direction, wherein the
second direction is different from the first direction.

[0103] In some embodiments, the first direction can be horizontal and the
second direction can be vertical. The second nozzles can move cyclically
from one side of the workpiece to an opposite side of the workpiece. The
workpiece can move vertically. The third nozzles can be disposed above
the first nozzles. The second nozzles can be disposed interspersed with
the first nozzles.

[0104] FIGS. 16A-16C illustrate exemplary cleaning sequence of an object
according to an embodiment of the present invention. In FIG. 16A, an
object, such as an upper lid of an outer container of a double container
carrier, is brought from a dirty environment 162 under laminar flow 161
to a cleaning chamber 164. The cleaning chamber is isolated from a
cleaned environment 166, for example, by closing access door to the
cleaned environment. In addition, purge gas 163 can be provided to the
cleaning chamber 164 to prevent contamination back flow from the dirty
environment to the cleaning chamber.

[0105] In FIG. 16B, the cleaning chamber is isolated, and liquid and gas
nozzles 165 can provide liquid and gas to clean the object. The object
can be disposed in a horizontal direction, and spin cleaning and drying
167 can be applied to improve the cleaning and drying processes. The
nozzles 165 can operate in sequence, for example, delivering liquid for
cleaning and subsequently delivering gas for drying. Hot liquid and hot
gas can be used. Heaters can be provided to provide thermal energy,
assisting in the cleaning and drying process.

[0106] In FIG. 16C, the outlet door is open and the object is brought to
the cleaned environment 166. Low pressure can be established in the
cleaning chamber, for example, through exhaust 169, to prevent any
contamination back flow to the cleaned environment. Curtain gas 168 can
be used to further minimize the contamination back flow.

[0107] FIGS. 17A-17B illustrate exemplary flowcharts for cleaning objects
according to an embodiment of the present invention. In FIG. 17A,
operation 170 rotates object to be cleaned. Operation 171 cleans the
object with hot liquid spraying. Operation 172 dries the object with hot
gas. Operation 173 equalizes pressure in a cleaning chamber with an input
environment to prevent cross contamination. In FIG. 17B, operation 174
transfers a component of the outer container of a double-container
carrier from the input environment to the cleaning chamber. Operation 175
rotatingly cleans the component with hot liquid spraying and hot gas
drying. Operation 176 equalizes pressure in the cleaning chamber with an
output environment to prevent cross contamination. Operation 177
transfers the cleaned component from the cleaning chamber to the output
environment.

[0108] In an embodiment, the present invention discloses a novel cleaning
chamber and process to clean components that require high level of
cleanliness, such as the inner container of a double container carrier.
The cleaning chamber employs rasterizing ultrasonic or megasonic liquid
spray to clean the object. In an embodiment, the ultrasonic or megasonic
nozzles travel in a horizontal direction while the object travels in a
vertical direction, thus covering all surface areas of the object with
the spray from the ultrasonic or megasonic nozzles. In addition, liquid
spray can be used for preclean, and drying nozzles can be used for
drying.

[0109] FIGS. 18A-18C and 19A-19B illustrate an exemplary cleaning chamber
employing ultrasonic or megasonic liquid spray according to an embodiment
of the present invention. An object is brought in to a cleaning chamber
184, preferably in a vertical direction and from a top portion of the
cleaning chamber. The object is then brought to a bottom portion, and
then slowly raised back 183 to the top portion, as shown in the sequence
in FIGS. 18A-18C and 19A-19B. At the bottom portion, liquid nozzles 181
deliver liquid to the object 180 for cleaning Liquid nozzles 181 are
preferably disposed a distance from the object, thus spraying at the
object surface through a large area 181A. Ultrasonic or megasonic nozzles
182 clean the top portion of the object, and with the object slowly
raised up, nozzles 182 continuously clean the whole object surface. In
addition, the ultrasonic or megasonic nozzles move in a horizontal
direction 191, thus can clean the object in a horizontal direction. The
ultrasonic or megasonic nozzles are preferably disposed close to the
object for effective cleaning, thus spraying at the object surface
through a small area 182A. With the rasterizing action, including
horizontal movement 191 of the ultrasonic or megasonic nozzles, and the
vertical movement 193 of the object, the ultrasonic or megasonic spray
can cover the whole surface of the object, providing an effective
cleaning process.

[0110] Above the ultrasonic or megasonic nozzles are a number of drying
nozzles 183, pointing down at the object for drying the object and for
blowing down the liquid. The drying nozzles 183 can be disposed to
deliver a downward area 183A. Hot liquid and hot gas, together with
heaters can be used. The combination of liquid spray, ultrasonic or
megasonic liquid spray, and drying spray can clean the object with high
level of cleanliness.

[0111] FIGS. 20A-20B illustrate exemplary flowcharts for cleaning objects
according to an embodiment of the present invention. In FIG. 20A,
operation 200 cleans an object with hot liquid spraying. Operation 201
rasterizingly cleans the object with megasonic spraying. Operation 202
dries the object with hot gas. In FIG. 20B, operation 203 equalizes
pressure in a cleaning chamber with an input environment to prevent cross
contamination before transferring a component of the inner container of a
double-container carrier from the input environment to the cleaning
chamber. Operation 204 linearly moves the component in a first direction.
Operation 205 sprays the component with hot liquid. Operation 206 sprays
the component with megasonic liquid having movements in a second
direction. Operation 207 dries the component with hot gas. Operation 208
equalizes pressure in the cleaning chamber with an output environment to
prevent cross contamination before transferring the cleaned component
from the cleaning chamber to the output environment.

[0112] In some embodiments, a method for cleaning a workpiece can include
providing a workpiece in a cleaning chamber; moving the workpiece in a
first direction; spraying the workpiece with a cleaning liquid; spraying
the workpiece with a megasonic liquid, wherein the megasonic liquid
comprises movement in a second direction, wherein the second direction is
different from the first direction; spraying the workpiece with a drying
gas. The megasonic nozzles can move cyclically from one side of the
workpiece to an opposite side of the workpiece. The drying gas can be
spraying above the cleaning liquid and the megasonic liquid. The cleaning
liquid can be spraying interspersed with the megasonic liquid. The method
can further include equalizing the pressure in the cleaning chamber
before transferring the workpiece to the cleaning chamber, and/or
equalizing the pressure in the cleaning chamber before transferring the
workpiece out of the cleaning chamber.

[0113] In an embodiment, the present invention discloses a decontamination
chamber to decontaminate the components after cleaning. The
decontamination can employ a vacuum chamber, with high vacuum preferred,
for example, less than 10-3 Torr, or preferably less than 10-6
Torr. The vacuum chamber can accelerate the outgassing of the components,
removing any trapped gas within the components.

[0114] The vacuum chamber can be designed to provide configurations with
effective pumping and high pumping conductance. The vacuum chamber can
further comprise a heating mechanism, such as IR heaters or chamber wall
heaters. The heaters can be heated to between 40 and 90C, and preferably
at about 70C. The heating temperature depends on the materials, for
example, low temperature of less than 100C is preferred for polymer
materials, and high temperature of above 100C can be used for metal.

[0115] In an embodiment, outgassing monitoring sensors, such as residue
gas analysis (RGA), can be provided to measure the release of
contaminants within the vacuum chamber, which then can be used to monitor
the decontamination process.

[0116] In an embodiment, inert purge gas is provided inside vacuum
chamber, such as nitrogen gas, to back fill any gap left by the
outgassing contaminants. Cyclic pressuring and vacuuming can be
performed, outgassing the contaminants and then back filling with inert
gas.

[0117] In an embodiment, after decontaminate the components with high
vacuum, the chamber is pressurized with nitrogen before opening,
effectively coating the surfaces (and filling the sub-surfaces) of the
components with nitrogen molecules, further improving the cleanliness and
preventing adhering particulates.

[0118] FIG. 21A illustrates an exemplary decontamination chambers
according to an embodiment of the present invention. Vacuum chamber 210
comprises a vacuum line 213 connected to a vacuum pump 219, such as a
turbo pump or a cryo pump, creating a high vacuum within the chamber 210.
A shut off valve 217A can be provided to isolate the vacuum pump line.
Heater 212 is disposed in the vacuum chamber for heating the chamber and
the components 211A and 211B. Sensors 215, such as a RGA for monitoring
the outgassing species, can be included. A shut off valve 217B can be
provided to isolate the gas monitor, e.g., sensor 215. Purge gas 214 can
provide an inert ambient to the vacuum chamber, for example, to prevent
back flowing of contamination before transferring the components to the
outside. A direct connection of the gas monitor 215 to the
decontamination chamber can be used if the components does not outgassing
too much. For example, for the inner box, which is made of a metallic
material, the outgassing contaminant can be much less than polymer
materials.

[0119] FIG. 21B illustrates another exemplary decontamination chambers
according to an embodiment of the present invention. Vacuum chamber 210
comprises a vacuum line 213 connected to a vacuum pump 219, such as a
turbo pump or a cryo pump, creating a high vacuum within the chamber 210.
A shut off valve 217A can be provided to isolate the vacuum pump line.
Heater 212 is disposed in the vacuum chamber for heating the chamber and
the components 211A and 211B. Sensors 215, such as a RGA for monitoring
the outgassing species, can be included. A shut off valve 217B can be
provided to isolate the gas monitor, e.g., sensor 215. Purge gas 214 can
provide an inert ambient to the vacuum chamber, for example, to prevent
back flowing of contamination before transferring the components to the
outside. Another vacuum pump 219A can be connected between the valve 217B
and the gas monitor 215, to maintain a vacuum level for the gas monitor.
A differential valve 218 can be included between the gas monitor and the
chamber. The differential valve can include a small hole (as compared to
the diameter of the conduit, so that the conductivity of the differential
valve is much less than the conductivity of the conduit), in order to
restrict a flow from the chamber to the gas monitor. Thus the
contaminants released from the components can be restricted from reaching
the gas monitor. A differential valve connection of the gas monitor 215
to the decontamination chamber can be used if the components can be
outgassing too much. For example, for the outer box, which is made of a
polymer material, the outgassing contaminant can be high, and can
saturate the gas monitor if not restricted from reaching the gas monitor.

[0120] In some embodiments, a system for cleaning a workpiece can include
a first chamber, wherein the first chamber is operable to clean a
workpiece, a second chamber, wherein the second chamber comprises a
vacuum ambient to outgassing the workpiece after being cleaned; a robotic
mechanism for transferring the workpiece between the first chamber and
the second chamber.

[0121] The system can further include a first vacuum pump coupled to the
second chamber; a first shut off valve connected between the first vacuum
pump and the second chamber; a gas monitor coupled to the second chamber;
a second shut off valve connected between the gas monitor and the second
chamber; a differential valve connected between the gas monitor and the
second chamber; a second vacuum pump connected between the differential
valve and the second chamber; a heater for heating the workpiece in the
second chamber; a nozzle for injecting an inactive gas to the second
chamber.

[0122] In some embodiments, the present invention discloses a system for
cleaning a workpiece, wherein the workpiece comprises a first component
and a second component, wherein the first component surrounds the second
component. The system can include a first chamber, wherein the first
chamber is operable for outgassing the first component of the workpiece;
a first vacuum pump coupled to the first chamber through a first shut off
valve; a first gas monitor coupled to the second chamber through an
assembly, wherein the assembly comprises a second shut off valve and a
differential valve; a second vacuum pump fluidly connected between the
first gas monitor and the assembly, wherein the second monitor is
operable to maintain a vacuum ambient at the gas monitor; a second
chamber, wherein the second chamber is operable for outgassing the second
component of the workpiece; a third vacuum pump coupled to the second
chamber through a third shut off valve; a second gas monitor coupled to
the second chamber through a fourth shut off valve.

[0123] The system can further include a third chamber for cleaning the
first component before transferring to the first chamber, and a fourth
chamber for cleaning the second component before transferring to the
second chamber; and a heater for heating the workpiece in the first or
second chamber, and a nozzle for injecting an inactive gas to the first
or second chamber.

[0125] In an embodiment, the present invention further discloses a process
for decontaminating an object by separating the components of the object
for outgassing. In FIG. 22B, operation 226 cleans separately the
components of a double-container carrier. Operation 227 groups similar
components for outgassing process. Operation 228 assembles the
double-container carrier.

[0126] In some embodiments, the present invention discloses a method for
cleaning a workpiece, wherein the workpiece comprises a first component
and a second component, wherein the first component surrounds the second
component. The method can include transferring the first component of a
workpiece to a first chamber; pumping the ambient within the first
chamber; coupling the first chamber to a first gas monitor through a
differential valve; transferring the second component of a workpiece to a
second chamber; pumping the ambient within the second chamber; coupling
the second chamber directly to a second gas monitor.

[0127] The method can further include coupling the first chamber directly
to a first gas monitor after a signal from the first gas monitor is
stable; stopping the pumping after a level of gaseous contaminants in the
first or second chamber reaches a desired level; cleaning the first
component before transferring to the first chamber; cleaning the second
component before transferring to the second chamber; injecting an
inactive gas to the first or second chamber during the pumping; heating
the first or second component in the first or second chamber during the
pumping; and pressurizing the first or second chamber before transferring
the first or second component out of the first or second chamber.

[0128] In an embodiment, the present invention discloses an assembling
station, preferably an integrated assembly station to assemble the
separately-cleaned components under a control environment. For high level
cleanliness, avoiding exposure to potential sources of contamination
should be considered. Thus, after being cleaned separately, the
components are assembled in a cleaned environment to maintain the level
of cleanliness, for example, to minimize any contamination of the inner
container by exposing to outside ambient.

[0129] In an embodiment, the assembling station is filled with nitrogen.
Thus after transferring from a vacuum decontamination chamber, which was
filled with nitrogen before open to the transfer process, the components
are transferred to the assembly station, which is filled with nitrogen.
The assembling station therefore can preserve the cleanliness of the
components after cleaning.

[0130] In an embodiment, the present invention discloses an assembling
station for assembling double container reticle carrier. The assembling
station can provide an assembling process in a clean environment
(preferably a nitrogen environment) with nitrogen purge between inner and
outer containers.

[0131] FIGS. 23A-23B illustrate exemplary assembling station and processes
according to an embodiment of the present invention. The components
231A/231B and 232A/232B to be assembled are transferred to the assembling
station 230, which comprises nitrogen purge gas inlet 234. A bottom
support 231B is placed on nitrogen nozzles. Bottom support 232B and top
lid 232A are then placed on the bottom support 231B. Top lid 231A is then
brought in the assembling station. With the nitrogen nozzles 235
providing nitrogen to the bottom support 231B, the top lid 231A is
assembled with the bottom support 231B, effectively purging and providing
nitrogen to the volume inside the outer container form by the bottom
support 231B and the top lid 231A. With the assembling station under
nitrogen ambient, an in some case, preferably slightly pressurized, the
assembling station is open and the assembled carrier is then transferred
to the outside.

[0132] In some embodiments, the present invention discloses a system for
cleaning a workpiece, wherein the workpiece comprises a first component
and a second component, wherein the first component surrounds the second
component. The system can include a first chamber, wherein the first
chamber is operable for cleaning the first component of the workpiece; a
second chamber, wherein the second chamber is operable for cleaning the
second component of the workpiece; a third chamber, wherein the third
chamber is operable for assembling the first and second components after
being cleaned; a first gas supply coupled to the third chamber, wherein
the first gas supply is operable to deliver an inactive gas to the third
chamber; a second gas supply coupled to the third chamber, wherein the
second gas supply is operable to deliver an inactive gas to an inside of
the first or second component. The second gas supply can protrude to
within the third chamber to couple with an opening of the first
component.

[0133] FIGS. 24A-24B illustrate exemplary flowcharts for assembling
objects according to an embodiment of the present invention. In FIG. 24A,
operation 240 brings components of an object to an assembling chamber.
Operation 241 pressurizes the assembling chamber with inactive gas.
Operation 242 assembles the components together while flowing inactive
gas to the inside of assembled object.

[0134] In FIG. 24B, operation 243 flows inactive gas in an assembling
chamber. Operation 244 transfers a bottom component of an outer container
of a double-container carrier to the assembling chamber and coupling the
bottom component with a nozzle of inactive gas. Operation 245 transfers a
top and a bottom components of an inner container to the assembling
chamber, coupling to the bottom component of the outer container.
Operation 246 transfers a top component of the outer container of a
double-container carrier to the assembling chamber. Operation 247 flows
inactive gas to the nozzle. Operation 248 assembles the top component of
the outer container to the bottom component of the outer container with
inactive gas filling the inside of the assembled outer container.

[0135] In some embodiments, the present invention discloses a method for
cleaning a workpiece, wherein the workpiece comprises a first component
and a second component, wherein the first component surrounds the second
component. The method can include cleaning the first component; cleaning
the second component; transferring the first component to a chamber;
transferring the second component to the chamber; pressurizing the
chamber with an inactive gas; assembling the first and second components
to form an assembled workpiece. The first component is disposed on a
conduit coupled to a gas supply outside the chamber. The method can
further include flowing inactive gas to the conduit.

[0136] In an embodiment, the present invention discloses loading and
unloading station for a cleaner system with nitrogen purge to the volume
inside the objects. To maintain a level of cleanliness for the object
inside a carrier, the inside volume is constantly purged with inert gas
such as nitrogen. Thus the present invention discloses an inert gas purge
for a transfer and/or storage station, ensuring a constant purge of the
inside volume.

[0137]FIG. 25 illustrates an exemplary transfer and/or storage station
having purge nozzles according to an embodiment of the present invention.
The double container carrier 250 is placed on nitrogen purge nozzles 254
in the station 252. With the nitrogen nozzles 234 providing nitrogen 255
to the bottom support of the double container carrier 250, the volume
inside the outer container is constantly purged with refreshed nitrogen.

[0138] In some embodiments, the present invention discloses a system for
cleaning a workpiece, wherein the workpiece comprises a first component
and a second component, wherein the first component surrounds the second
component. The system can include a first chamber, wherein the first
chamber is operable for cleaning the first component of the workpiece; a
second chamber, wherein the second chamber is operable for cleaning the
second component of the workpiece; a third chamber, wherein the third
chamber is operable for support an assembled workpiece; a gas supply
coupled to the third chamber, wherein the gas supply is operable to
deliver an inactive gas to an inside of the assembled workpiece. The gas
supply can protrude to within the third chamber to couple with an opening
of the first component.

[0139] In some embodiments, a method for cleaning a workpiece can include
cleaning the first component; cleaning the second component; assembling
the first and second components to form an assembled workpiece; flowing
inactive gas to an inside of the assembled workpiece. The first component
can be disposed on a conduit coupled to a gas supply outside the chamber.

[0140] In some embodiments, the present invention discloses a cleaner
system for EUV carrier, including separate environments for input (for
carriers to be cleaned) and output (for cleaned carriers), flow dynamics
for the separate environments, separate cleaning chambers for different
parts of the carriers, robot handlers for minimizing cross contamination
between the different parts of the carriers, degassing and
decontamination chamber for removing outgassing molecules, and purging
stations for providing purge gas to the interior of the carriers.

[0141] Different configurations of the cleaner system can be used,
including single throughput cleaner system, double throughput cleaner
system, hybrid cleaner system, and less clean cleaner system.

[0142] FIGS. 26A-26B illustrate examples of a cleaner according to some
embodiments of the present invention. FIG. 26A shows a standard cleaner
system, including an input environment 262, e.g., dirty or non-clean
environment for the carriers to be cleaned, multiple cleaning chambers
264A-264C, and an output environment 266, e.g., clean environment for the
cleaned carriers, together with an outgassing chamber 268 for removing
outgasable molecules.

[0143] FIG. 26B shows a cleaner system having double the throughput,
sharing a same input environment 261, two cleaning sections 263A-263C and
265A-265C, and two output environments 267 and 269, together with two
outgassing chamber 268. Carriers to be cleaned can be brought to the
input environment 261, transferred to either of the cleaning chamber
sections, and outputting to the output environments 267 or 269 after
being outgassed.

[0144] FIG. 27 illustrates an example of a hybrid cleaner system according
to some embodiments of the present invention. The hybrid cleaner system
can include cleaning chambers 271A-271C positioned between output clean
environment 276 and input non-clean environment 272, together with
cleaning chamber 273 sharing a same input and output environment 272.
Thus a conventional reticle box, such as a reticle SMIF pod can be
brought to the input environment 272, cleaned in cleaning chamber 273,
and outputted to the same input environment 272. A euv carrier can be
brought to the input environment 272, cleaned in separate cleaning
chambers 274A-274C, and outputted to the output environment 276 after
being outgassed in outgassed chamber 278.

[0145] FIG. 28 illustrates an example of a cleaner system according to
some embodiments of the present invention. The cleaner system can utilize
a same input and output environment 281, with separate cleaning chambers
284A-284C. A euv carrier can be brought to the input environment 281,
cleaned in separate cleaning chambers 284A-284C, and then outputted to
the same environment 281 to be outgassed in outgassed chamber 288.
Considerations can be applied to avoid contamination in the share
environment 281, such as locating the input and output in separate
portions of the environment 281, and to provide laminar flow from the
output portion to the input portion.