BOISE, Idaho and SHANGHAI, Feb. 7, 2013 (GLOBE NEWSWIRE) -- MicronTechnology, Inc. (Nasdaq:MU), one of the world's leading providers ofadvanced semiconductor solutions, and TE Connectivity (TE) (NYSE:TEL),a world leader in connectivity, announced today the availability of aSingle-Sided SODIMM and a low-profile single-sided, double data rate 3(DDR3) SODIMM connector solution to take advantage of the burgeoningmarket for Ultrabook(TM) devices, convertibles, tablets and other thinand light devices. Aimed at providing a reduced-height memory solutionfor the ultrathin computing market, the new Single-Sided SODIMM,developed by Micron, has components on either the front or back side ofthe module, but not both. When paired with the single-sided DDR3 SODIMMconnector from TE, the total z-height of the overall solution from themotherboard is just 3mm, a 35 percent savings compared to 4.6mm for astandard SODIMM solution.

Micron's Single-Sided SODIMM is available in a 4GB, single-rank, x8configuration. In addition to a reduced height, this new module isbuilt using 30nm DDR3L-RS components that consume less power in standbycompared to standard DDR3. Additionally, Single-Sided SODIMMs arepin-to-pin compatible with current DDR3 modules, making them backwardcompatible with existing DDR3 SODIMM connectors.

"Given the depth and breadth of ultrathin devices currently on themarket, coupled with consumer demands for sleek, lightweight designs,Micron's objective is to offer solutions that meet the specializedpower, portability and battery life needs," said Kris Kido, Micron'sDirector of Business Development, Computing Devices. "Micron's uniqueSingle-Sided SODIMM form factor meets those requirements and leads theway for future developments in this growing segment."

TE engineers designed the new single-sided DDR3 SODIMM connector todeliver peak performance with high-speed data applications. Theconnector features a 35 percent reduction in height, compared withsimilar low-profile connectors, which in turn, reduces the height ofthe end-product by 5 to 10 percent. It also reduces motherboard shadowarea by nearly 156 mm2, or 312 mm2 for common dual-socketimplementation. The DDR3 SODIMM connector accepts modules that meetJEDEC MO268 industry standards and is offered in both standard andreverse types.

Single-Sided SODIMM samples are available from Micron now, with massproduction scheduled for Spring, 2013.

Single-Sided SODIMM connector samples are available from TEConnectivity now, with mass production scheduled for June, 2013.

Micron Ultrathin Memory: Embracing the Future

With a global view of the mobile computing market, Micron is wellpositioned to support the growth of ultrathin applications. Our broadportfolio of industry-leading DRAM, SSD and NOR flash makehigh-performance, ultrathin computing come to life in the time it takesto snap your finger. Powerful, highly-responsive computing,instant-on/instant-off, rapid application load times, super slim andlight designs, longer battery life and better power savings are allpossible with Micron's memory and storage solutions.

About Micron

Micron Technology, Inc., is one of the world's leading providers ofadvanced semiconductor solutions. Through its worldwide operations,Micron manufactures and markets a full range of DRAM, NAND and NORflash memory, as well as other innovative memory technologies,packaging solutions and semiconductor systems for use in leading-edgecomputing, consumer, networking, embedded and mobile products. Micron'scommon stock is traded on the NASDAQ under the MU symbol. To learn moreabout Micron Technology, Inc., visit http://www.micron.com.