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Modular Organic Carrier

Publishing Venue

IBM

Related People

Arvanitikis, NC: AUTHOR

Abstract

A modular organic carrier, as shown in Fig. 1, provides a means of powering, cooling and communicating with a wafer. The package may contain chips 11 attached to a silicon wafer carrier 13, which could be a full wafer or a fraction of it in a silicon-on-silicon structure, or it may contain embedded circuitry, or a combination of the two. Power and communication are provided by the lead frames 15 which connect the pinned organic carrier 17 to the wafer 13.

Country

United States

Language

English (United States)

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Modular Organic Carrier

A modular organic carrier, as shown in Fig. 1, provides a means of powering,
cooling and communicating with a wafer. The package may contain chips 11
attached to a silicon wafer carrier 13, which could be a full wafer or a fraction of it
in a silicon-on-silicon structure, or it may contain embedded circuitry, or a
combination of the two. Power and communication are provided by the lead
frames 15 which connect the pinned organic carrier 17 to the wafer 13.

A good thermal path to the exterior of the package is provided by the wafer to
heat spreader interface 19, permitting the use of conduction cooling as well as
the more conventional convection cooling. As shown, the thermal interface is
connected directly to a heat sink 21.

A more detailed cross-sectional area of the package is shown in Fig. 2. The
pinned organic carrier 17 is connected via an organic spacer 23 to the heat sink 21. In the internal cavity of the pinned organic carrier is mounted the thermal
interface 19, which is soldered to the silicon carrier 13. Suitable chips 11 are
mounted on the carrier 13 and the lead frame 15 provides the interconnection
between the carrier 13 and the pinned organic carrier 17. A cap 25, which
covers the chips 11 on the carrier 13, may include an appropriate seal 27 to
hermetically seal the package.