Electromagnetic Parameters Extraction for Integrated-Circuit Interconnects for Open Three Conductors with Two Levels Systems

2D surface potential distribution of open three interconnected lines with two levels system with one conductor embedded in the substrate.

The accurate estimate of values of electromagnetic parameters are essential to determine the final circuit speeds and functionality for designing of high-performance integrated circuits and integrated circuits packaging. In this paper, a new quasi-TEM capacitance and inductance analysis of multiconductor multilayer interconnects is successfully demonstrated using the finite element method (FEM) with COMSOL multiphysics. We specifically illustrate two electrostatic models of open three interconnected lines with two levels system. Indeed, excellent agreement with results from the previous methods is demonstrated.