The new 20nm chips have the highest capacity for their form factor of any in the market today and are targeted for use in tablets, smartphones, and other consumer electronic devices.

The die doubles the capacity of the venture's 25nm lithography process, which has been used to make the 64Gbit dies used in today's SSDs (solid-state drives), tablets, and smartphones.

The company Tuesday also announced mass production of new 64Gbit dies using 20nm process technology.

Samples of the 128Gbit device will be available in January, closely followed by mass production later in the first half of 2012, IMFT stated.

The new 128Gbit dies will allow manufacturers to double the capacity of SSDs and other NAND-based storage products, enabling a single device to hold 16GB of data and an 8 die chip to hold 128GB of data.

"As portable devices get smaller and sleeker, and server demands increase, our customers look to Micron for innovative new storage technologies and system solutions that meet these challenges," Glen Hawk, vice president of Micron's NAND Solutions Group, said in a statement. "Our collaboration with Intel continues to deliver leading NAND technologies and expertise that are critical to building those systems."