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ACIDIC/ALKALINE DIAMOND SLURRY FOR USE IN CHEMCIAL / MECHANICAL PLANARIZATION OF SEMI-CONDUCTOR WAFERS

Publishing Venue

The IP.com Prior Art Database

Abstract

A stable, well-dispersed suspension formulation comprising diamond micron powder with a specially formulated mixture of water and organic compounds for use in lapping applications for semiconductor wafers / the chemical mechanical planarization of semiconductor circuits, for superior removal rates and surface finishes relative to the currently available silicon and alumina slurries.

Country

United States

Language

English (United States)

This text was extracted from a Microsoft Word document.

This is the abbreviated version, containing approximately
47% of the total text.

ACIDIC/ALKALINE DIAMOND SLURRY FOR USE IN CHEMCIAL / MECHANICAL
PLANARIZATION OF SEMI-CONDUCTOR WAFERS

BACKGROUND

� � � � � � � � � � � Current
CMP technology utilizes silica and alumina based slurries in high solids
concentrations.� Diamond particles are
much harder than those used in existing slurries.� Because of the increased hardness, the corresponding slurries will
result in improved material removal rates and surface finishes of the semi-conductor
wafer.

� � � � � � � � � � � There is a need for new slurries
comprising diamond micron powder, organic additives, and water to be used in
the chemical / mechanical planarization of integrated circuit wafers.� �

� � � � � � � � � � � We have found that the use of
diamond micron powder in the slurry provides superior removal rates and surface
finishes relative to the currently available silicon and alumina slurries.� Typically, diamond suspension under acidic
conditions is not stable.� The organic
additives stabilize the diamond dispersion and prevent the formation of diamond
aggregates which cause scratches in the IC / semiconductor wafer.� This helps improve process cycle times and
surface finish of semi-conductor wafers.

� � � � � � � � � � � �

DETAILED DESCRIPTION

� � � � � � � � � � � � � � � � � � � � � � �

� � � � � � � � � � � In
this paper, we will describe the process wherein diamond powder is combined
with a specially formulated mixture of water and organic compounds to produce a
stable, well-dispersed suspension.� When
used in lapping applications for semiconductor wafers, this formulation will
result in superior lapping rates and surface finishes.

� � � � � � � � � � � The
new slurry formulations contain diamond micron powder, two non-ionic
surfactants (one water soluble component, preferable polyethylene oxide
sorbitan monolaurate and one oil soluble component, preferable sorbitan monooleate),
and one polyglycol (preferably low molecular weight polypropylene glycol).� The formulation also includes a polymeric
component (preferably ethylene oxide propylene oxide block copolymer) for
better control of wettability.� The pH
is adjusted with small amounts of acetic acid.�
The invention produces a dispersible diamond slurry formulation with
improved stability against aggregation and separation and ease of
dispersibility.� It further increases
stability against aggregation during storage after dilution with water.� � �

� � � � � � � � � � � The
diamond powder used is less than 5 microns in size with a mean size less than 1
micron.� The weight percent of diamond
in the dilute slurry is between 0.1% and 5%.�
The pH of the dilute slurry is between 8 and 12.

� � � � � � � � � � � EXPERIMENTS.� � In the following experiment, the
preparation of the slurry involved four main steps: