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Crack Deflector Kerf Fills

Publishing Venue

Abstract

Disclosed is a novel, step-like kerf structure and that deflects an incoming crack above, away from the Si substrate and the weak point in the crackstop/moisture barrier.

Country

Undisclosed

Language

English (United States)

This text was extracted from a PDF file.

This is the abbreviated version, containing approximately
70% of the total text.

Title
Crack Deflector Kerf Fills
Abstract
Disclosed is a novel, step-like kerf structure that deflects an incoming crack above,
away from the Si substrate and the weak point in the crackstop/moisture barrier.
Problem
Advanced integrated circuits (ICs) using Copper (Cu) metallization along with low-k and
ultra-low-k (ULK) dielectrics are susceptible to fails due to weakness in
crackstop/moisture barrier integrity. The wafer singulation process often causes cracks
in the dielectric materials at the diced edge of the chip. These cracks may travel to the
crackstop/moisture barrier and cause delamination. If the crackstop is not mechanically
strong enough, then the delamination/crack can reach the chip interior and cause
device failure. Occasionally, the cracks may dive down into Silicon (Si) before reaching
crackstop. The crack can then break through the Si underneath the crackstop and fail
the chip.
Solution/Novel Contribution
The proposed solution is a novel kerf structure. A step-like fill structure deflects the
incoming crack above, away from the Si substrate and the weak point in the
crackstop/moisture barrier. The step-like fill structure starts from the lowest metallization
level and progressively stacks up high metallization levels to guide and deflect the crack
from Si and interfaces/areas.
Method/Process
Scattered fill structures (not a continuous wall) fill the kerf as much as possible. This
reduces the chance that the crack dives down into Si before reaching cracksto...