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CMP Consumables Market to Show Complete Recovery by 2011

Boston, MA, April 27, 2010 – After a disastrous 2009, the market for CMP slurry and pad consumables is expected to recover to pre-downturn peak levels by 2011, according to a new report from Linx Consulting, the foremost electronic materials consultant to the semiconductor industry.

The new report, entitled CMP TECHNOLOGIES AND MARKETS TO THE 22 nm NODE, forecasts the 2010 market for CMP consumables will be $1.3 billion overall. In 2009, the market for CMP consumables dropped by about 13% from the 2008 peak of $1.4 billion. While 2010 is showing extremely strong growth, the report indicates the market is not expected to catch up to previous highs due to the loss of 200mm wafer capacity, eliminating the demand for certain CMP consumables.

Linx Consulting still sees Dow Advanced Materials and Cabot Microelectronics as the leading suppliers, with two-thirds market share for all slurry and pad consumables between them. The next tier of suppliers includes Asahi Glass, DA Nanomaterials, Fujimi, Hitachi Chemical, Planar Solutions and Samsung Cheil, who comprise an additional 25% share of the slurry and pad consumables market.

CMP TECHNOLOGIES AND MARKETS TO THE 22nm NODE outlines market opportunities available to chemicals and materials suppliers as a result of strong growth of CMP. The report examines both current CMP applications as well as the emergence of new applications based on critical technologies around new transistor structures and FEOL materials and processes. In addition, the report looks at the impact of various technologies designed to utilize consumables more efficiently, including low slurry flow pads, longer-lived CMP pads and such new tools as the Reflexion® GT® from Applied Materials. The report also provides forecasts for CMP operations by devices type and process, detailed perspectives on CMP operations for 65, 45, 32 and 22nm process technologies, the impact of emerging technologies, and analyzes supplier positioning.