[Qualcomm to collaborate with Samsung on technology needs including the use of Samsung's 90 nm and sub-90 nm nodes in the manufacture of SOC products.]

San Diego -- QUALCOMM announces a new manufacturing partnership with Samsung Electronics Co., Ltd. Samsung will leverage its significant investments in process technology, development and capital in order to provide technology and manufacturing services in advanced CMOS-based processes to QUALCOMM.

"As a leading supplier of wireless chipsets, QUALCOMM is committed to not only delivering compelling performance and features to the market, but also supplying an ample quantity of chipsets to enable the rapid growth of this exciting market sector," said Dr. Sanjay K. Jha, president of QUALCOMM CDMA Technologies. "Our foundry agreement with Samsung will provide an additional source of supply and assist us in our strategy aimed to ensure capacity to support existing and anticipated business growth in both CDMA and WCDMA markets."

"Strong business and technology synergies between the two companies make this strategic foundry partnership the next logical step in a long-standing relationship," said Dr. Oh-Hyun Kwon, president of Samsung's System LSI business. "With a strong commitment to leading-edge technology and state-of- the-art 300mm wafer capacity, we expect to see our strategic foundry business grow with companies such as QUALCOMM."

QUALCOMM and Samsung's new foundry partnership expands on the two companies' existing relationship, and builds upon QUALCOMM's fabless business model of outsourcing foundry operations to partners such as Samsung. The companies will collaborate on current and future technology needs, with plans including the usage of Samsung's 90 nanometer (nm) and sub-90 nm nodes to enable manufacturing of leading-edge system-on-a-chip (SOC) products.