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3D Chip Stack Cooling of High Power Electronics

Keywords: Thermal Packaging , GaN Power Electronics , ICECool

Innovative methods for “thermal management” – High Power Electronics (microchips), especially for RF MMIC (GaN on SiC, Diamond) Amplifiers and Embedded Super Computers is the focus of current research efforts [1]. The electronics get hot by integration of thousands of components at the device level (miniaturization), increase in power amplification, and in efforts to address the goals of Size Weight and Power (SWaP) requirements [1]. The focus of current works is to “stack” microchips in a small footprint area, and apply microfluidics cooling to remove heat from multiple hotspots and background regions of the micro-chips. Also, a thin film of thermoelectrics is applied at top surface of substrate for heat pumping very high levels of heat density.
The “substrate” on back side of electronics device has – novel design of structures in