Resin Bond Diamond powder is used in applications
involving machining of materials such as tungsten carbide, glass, and ceramics.
Primarily used in resin bonded tools, and vitreous
bond systems, the unique property of this multicrystalline type of
diamond powder is its ability to microfracture. Thousands of minute,
tightly bonded crystals of diamond make up one grain of resin bond diamond
powder. These crystals are engineered to micro-fracture on loading to
continuously present sharp edges for cutting. This unique ability to micro-chip
drastically reduces machining time resulting in enormous cost-saving by
maximizing productivity while imparting exceptional finish to the workpiece.