Broadcom executives said the company is eyeing fresh potential targets for acquisition, just days after US President Donald Trump quashed the company's proposed $117 billion hostile takeover attempt of rival Qualcomm.

Talluri joins Micron after nine years at Qualcomm, where he most recently served as senior vice president of product management, responsible for the company's Internet of Things business and, before that, its mobile computing platform

President Donald Trump has blocked Singapore-based Broadcom's proposed US$140 billion takeover of rival US chipmaker Qualcomm on grounds of national security. His order cited "credible evidence" that a takeover "threatens to impair the national security of the US".

Qualcomm has introduced the new Qualcomm Snapdragon 700 Mobile Platform Series, designed to exceed what is expected from today's high-tier mobile experiences, with features and performance previously only available in the premium Snapdragon 800 Mobile Platform Series. Advances to be expected in the 700 Series include on-device AI supported by the Qualcomm Artificial Intelligence (AI) Engine, and improvements to camera, device performance and power.

Qualcomm has dropped its objections to being acquired by Singapore's Broadcom and is willing to agree a deal with its rival chipmaker if it raises its takeover offer to $160bn including debt, according to people involved in the negotiations.

Qualcomm and Broadcom plan to meet on Wednesday to talk about the latter's $121 billion acquisition offer, the first time the semiconductor companies will discuss the potential deal, people familiar with the matter said.

Samsung Electronics is launching a new chip for cars, tentatively called Exynos Auto, with aims to supply the chip first to Audi that has used chips mostly from Qualcomm, industry sources said on Feb. 5.

Broadcom plans to unveil a new approximately $120 billion offer for Qualcomm on Monday, aiming to ratchet up pressure on its US semiconductor peer to engage in negotiations, people familiar with the matter said on Sunday.

The European Commision (EC), the EU's legislative and regulatory arm, said its investigation, which lasted for more than two years, concluded that Qualcomm paid Apple billions of dollars to keep it from buying LTE baseband chips from Qualcomm's rivals, violating EU antitrust rules.

At CES 2018, Qualcomm Technologies International has announced that its Qualcomm Smart Audio Platform now supports Microsoft Cortana. The platform integrates the hardware and software required to help original equipment manufacturers (OEMs) reduce the time and cost of developing smart speakers with support for the intelligent digital assistance provided by Microsoft Cortana.

At Qualcomm's conference on Tuesday, AMD's corporate vice president and GM Kevin Lensing made a surprise guest appearance, announcing that the two companies were working together to power a new line of HP and Asus PCs, powered by Snapdragon 835. The Always Connected PCs are powered by gigabit LTE, to stay connected without relying on Wi-Fi.

Chipmaker Broadcom is considering raising its offer to buy rival Qualcomm by offering more of its own stock, following consultation with several of Qualcomm's top shareholders, according to people familiar with the matter.

Qualcomm may win European Union approval for its takeover of NXP Semiconductors by the end of the year after striking a final deal with regulators on patent licensing issues, according to people familiar with the review.

Apple continues to use a mix of Qualcomm and Intel cellular baseband processors in the iPhone X. Teardowns of the handsets also show that the company employed a combination of new and old tricks to pack features into its new flagship smartphone.

Richard Clemmer, CEO of NXP Semiconductors, during the company's third quarter financial results announcement, reversed a long-held position in conceding that Qualcomm's $38 billion acquisition of NXP will not happen - as promised - this year. The deal, Clemmer admitted, is likely to slip to "early 2018."

The Samsung Exynos 8895 processor is also going to be made on the 10nm manufacturing process like the Snapdragon 830. It's claimed that both Samsung and Qualcomm are working to produce FoPLP (fan-out panel level package) technology which will eliminate the need for a printed circuit board for the package substrate which will be used in both of their next-generation processors.

Qualcomm has announced that Derek Aberle will leave the company after a successful 17-year career during which he served as president of Qualcomm and helped drive the company's overall global strategy and vision as a member of Qualcomm's executive committee. His departure will be effective as of December 31, 2017.

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In 2018, global server shipments will grow 8.5% to reach 13.73 million units. Digitimes Research estimates server shipments worldwide will grow at a CAGR of 6.5% during the period 2017-2022, with growth mainly driven by large-scale data centers and the China market.

Digitimes Research estimates total shipments of smartphone APs worldwide will grow 1.5% on year to 1.67 billion units in 2018. The slowing growth in the smartphone market means global smartphone AP shipments will only grow at a mild pace in the next few years, reaching 1.77 billion units in 2021.