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Abstract

Roll-to-roll (R2R) flexible
electronics manufacturing technologies can enable
continuous production of flexible electronic devices
with a potential significant cost reduction. One of the
critical applications of R2R flexible electronic
technologies is the manufacturing of flexible display
backplanes. In the manufacturing process, multi-layer
device registration and overlay alignment is critical.
Typically used flexible polymer substrates, though,
compared with conventional glass substrates, have
relatively large dimensional instability. From the
authors' previous work, baseline data using a R2R
photolithography system has been reported for
fabrication, registration and overlay of micron-sized
patterns on both unsupported discrete plastic substrates
and carried by a web. Micron-sized features with 1micron
overlay accuracy have been achieved on unsupported
discrete 5 mil (125 micron) thick substrates of Dupont
Melinex® ST507 polyethylene terephthalate (PET)
coated with photoresist , . In this paper, a vector model based on
experimental results is designed to investigate and map
the substrate deformation and overlay alignment in a R2R
photolithography process. The vector model quantifies
the significance of distortion offsets caused by elastic
deformation in the overlay process on R2R based
substrates. Furthermore, the relationship between the
placement of the alignment fiducials and the local
overlay offsets is also initially investigated. Finally,
the overlay alignment processes and registration
capability are applied to dimensionally stable flexible
glass substrates.

References

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