Webinar - Do More with Power Modules

Hello, everyone. Welcome to today's webinar. My name is Randy from Element 14, and I'll be your host today. Today's presentation is from Texas Instruments. It's entitled, "Do More with Power Modules." This webinar will be presented by Stephen Ott. Stephen is a product marketer for Texas Instruments Portfolio of DC/DC Step-Down Power Modules.
He started his career at National Semiconductor and Power Management. He has a BSCE degree in electrical engineering from UC Santa Cruz. At the end of the presentation there will be a Q&A session. You can ask your questions in the Q&A window of the WebEx screen. So let me hand it over to Stephen for today's presentation.
All right. Thanks a lot. Yeah, welcome everyone. Thanks for joining in today. Like Randy mentioned, my name's Steven Ott. And I'm going to teach you guys how you can do more by using power modules in your designs. OK? Just so you know, our web page is ti.com/powermodules. And that's where you can find all information related to power modules from Texas Instruments.
So today, this webinar, it's going to provide an overview of buck power modules, their benefits over discrete converter-based solutions, and how you can use them to get to market faster. We'll go into a technology deep dive. And we'll look at the packaging, what's inside of these packages.
I'll talk about the design tools that we have to speed up your design, make things easier. And we'll just review our portfolio and some of our feature products and then finish up with some Q&A where you can ask me any question related to power modules. Also, before I started the webinar, I had my background showing. And that was a beautiful photo of Isle of Skye. So if you have any questions about Isle of Skye or Scotland, great place to visit. I can answer those questions too. All right, so let's get into this.
What is a power module? So power modules, historically, had a different form factor than what we consider a power-- not that those are not power modules-- but what we consider power modules. From TI, our power modules are mainly for embedded power. So we're primarily converting from intermediate rail within a system, down deploying a load voltages, generally powering up PGAs, processors, and other various analog loads.
So for us, a power module looks a lot like a standard IC package. In our power modules, we integrate at a minimum the DC/DC converter, the regulator IC, which includes a controller, FETs, and the inductor in a single package. That's on a minimum. We have a variety of products, depending on the input voltage, range, the output voltage, and in current rating, will integrate more or less. But at a minimum, they integrate the controller, FETs, and inductor in a single package.
Basically, simplifying or reducing the bill of materials, that's the name of the game is integration with power modules. And here's a couple examples. The top here is the LM46002. That's a discrete converter. And in this module, we're integrating the boot cap, the bias cap, the feedforward cap, VCC cap, obviously the inductor, and taking a design that looks like this into something like this, where you have the input cap, output cap, and a single resistor to set the voltage.
Another example is the TPS62085. That's the silicon within the TPS82085. In this case, we're integrating just the inductor here. And the module itself is just a little bit larger than the inductor case size itself, so very high dense solution.
So basically, a power module is your goal for simplifying power management. That can mean for you to get to market faster. Maybe you're not a power expert. It's going to allow you to do a design that's optimal and guarantee performance of critical specs. It's typically smaller because of the integration and the 3D packaging that we're using. And there's less parts to procure. And we provide more specs. And I'll get more into the details on that later.
OK. So here's an example of what a power model is internally. This is the LMZ36002 example. And so what we have here is a single copper Leadframe. And the integrated buck converter sits on This Leadframe. It's a package silicon. We mount passives on this Leadframe. And we use a high-performance inductor that's custom made for this package with special stilts to go over this inductor. So basically, we call it 3D packaging.
And with this package, it's a single copper Leadframe with large pads, copper pads connecting down to your printed circuit board, which delivers good thermal performance. And ease of use is something that we strive for in our products. So generally, with our packaging, all the signal pins are on the outside perimeter of package, makes it easy to access. And this is one of the power module packages that we have in our portfolio.
So why modules? You know, really, modules simplify our design considerably. There's a lot of factors that you might not think of when you're picking a module that a module is bringing to your design. And one of the big things is with the discrete converter design, you need to consider the architecture of the IC and its impact on your design and system. And with the module, you're selecting based on the specs and feature requirements.
Each converter architecture, whether it's the cost non-time, voltage mode, current mode, whatever that is, they're all going to have their own nuances in how they operate, what their influence is on the layout. We've taken all of that into consideration to make a module that works for the given architecture.
With a discrete converter, you need to take careful consideration in inductor and capacitor selection. I can't tell you how many times we've tried to use an inductor in our module. And then we go through our qualification and we find some issues or find something that we just don't feel comfortable with going to production. So we're taking all of that responsibility into our module. We're picking the right components that work the best with the converter. And we're doing extensive qualification that ensures reliability over time to temperature.
Layout is a very critical aspect of DC/DC converter design. And a poorly laid out DC/DC converter can be a source of EMI. And simply a worse case, it'll oscillate or not function. That can still happen with the module. But it is a lot more difficult for that to happen, as long as you follow some basic layout guidelines. The core layout of the DC/DC converter is internal to the package. And all that's required for a module is that you place an input and output capacitors close to the package.
And with a discrete design, you need to take careful consideration of your design across temperature range. I mentioned this before, but with the module, we fully characterize this solution over the full operating temperature range. We have some products that go down to minus 55 C up to 105 C ambient. So we're making sure our products operate in all those corner cases. And we provide safe operating area of the device. So you can check and make sure that the design works for your application with the amount of board space that you have.
Last thing you need to consider is the critical BOM components. Procurement, it's something that you might not consider at the beginning of your design. But especially today when wait times can be long, [INAUDIBLE] the components you're selecting, are they on your AVL, Approved Vendor List? If not, how much effort can it take to add them? Can you source the components? Do you have backup options in case your primary components are out of stock? This is all the stuff, though, all the challenges that we're taking on with our modules and adding value to our products through that, through managing the supply chain for you.
And I don't want you scare you too much about designing a discrete converter. TI has awesome discrete converters. And we have a great portfolio of them. And we use in our modules. But these are some of the things you need to take into consideration when you are designing discrete. Discrete have a lot of benefits, like higher flexibility. And you can really optimize specifically for your application. But if you need something that's general, fast, easy, small, a module is a great option to choose from.
So one of the big values of going to a module, especially in the new modules from our portfolio, is that they can save quite a bit of board area. In some instances, you can get up to 40% board area savings in a single layer of that PCB placement. You can kind of mimic and module, a 3D module if you're replacing the inductor on the back side of your PCB. Sometimes, that that's not possible. It really depends on your manufacturing. And there can be other noise issues with the VOs going through the layers and whatnot. So for single layer PCB placement, you can get really good board areas savings going to the [INAUDIBLE] our modules.
And here's a couple examples. The modules where you will get the most amount of savings in our board area savings is in our MicroSIP package. As I mentioned before, the package itself says the footprint of the inductor. And we can do this because we're using new technology that allows us to put the inductor over a bare die, basically. And our switchers, or IC converters are switching at much higher frequencies that reduces the amount of inductance required. There's been a lot of advancements in the DC/DC converter space to make this happen. I'll go into that more later.
For LMZ36002, so this is a higher voltage, more integration. And a lot of people think LDOs are the way to go for space savings because there's no inductor. Well, with the module, you can get similar, if not smaller size, as well as save a lot of area and cost on copper by going to the switch that has higher efficiency. Granted, you will have some ripple, though, with filtering. And LC culture, you can still get a very small solution and very low ripple.
Did I mention modules are easy to design? Well, they are very easy to design. The inductor is the most critical aspect of the design for DC/DC converters, selecting the inductor and then compensating the loop. Both of those aspects of the design are something that you do not need to do. And in the most extreme case, the TPSM84A21 is our easiest to use module. And this module integrates everything but one resistor, the R1 resistor to set the output voltage.
Looking at the discrete circuit, the TPS54A20, this is a really innovative DC/DC converter. It's a kind of converter that has two phases to combine to a single phase. And it switches at very high frequency, which allows the use of small chip inductors. And at this high frequency, we're able to integrate all of this in the package.
On the discreet side, the challenge is the layout. This is operating at very high frequency. So getting this circuit to work can be challenging. With a module, that's actually a benefit for us, having that high switching frequency, because that means we can integrate components easier in the module. As a result, we have no external components required in this.
And the LMZ36002, this is more like our standard module integration where it requires an input cap, output cap, and the resistor to set the voltage. There's also other programming components that typically, you can access, like setting a soft start time with the capacitor, a UVLO, and whatnot.
So EMI performance, that's another benefit of using a module. You can get very good EMI with a converter. With a module, because we are selecting the bill of materials, we have more control over what the EMI is, because we've defined the circuit. And in that case, we can provide radiated EMI plots in our data sheet showing the EMI performance of our modules.
And all of our modules are using shielded inductors. And we test them to EN55022 Class B, also known as CISPR 22 or CISPR 11. That's the new name for our Class B. And we provide this over the full frequency spectrum. And it gives you an idea of how the module itself performs with our layout on the EVM.
So thermals, thermals is something you need to pay a little bit more attention to when using a module because you are concentrating more power in a smaller board area. So the thermals in the module is critical. And the thermals of the module are going to be based on the packaging type. Is it a substrate? Is is a Leadframe? How much copper is being used? How well are the components transferring heat from the IC to the board or into the ambient air?
So not every module is equal. And we provide SOA curves, which are called Safe Operating Area curves, or thermal derating curves. And in this case, if you look on one of our modules, you'll find this SOA graph. And it's ambient temperature versus output current. And we test that natural convection, as well as we'll also test with air flow.
And in this case, basically, what this is showing is that this modules is rated to 85 degrees C ambient. And it can provide full rated current across the 85 degrees C ambient without derating. And this is based off of the EVM board area. And some of our modules, we are providing e-ratings curves for different board areas to give you an idea of how that will change, that your rating will change with different amounts or board area.
So in our portfolio we have our arsenal of different package technologies for reducing the solution size. Really, the core of it is 3D integration or over-the-top inductor placement. And we have this technology now in an Open Frame QFN package, Leaded package Overmold QFN package, and an Embedded package. And we'll go into more detail of that. I'm going to go into each of these packages and some of the trade-offs between the different packages. That's primarily what we're doing here to make our area smaller, relative to a discrete converter.
All right. Here's a quick look at our power module portfolio. On this slide I do have a few products that are in a prerelease on ti.com, so not fully released yet. And that's something that we're doing new now is once we feel confident in releasing the device, we'll get that up on TI, ti.com, so you can order pre [INAUDIBLE], prerelease samples and start prototyping with the device ahead of our full manufacturing release.
So here's a look at our portfolio. And this is color coded by package type. The dark blue is Embedded package. The aqua is the Leaded. Other blue is QFN. And green is Open Frame. Our portfolio ranges from 60 volts input, maximum input voltage in the Open Frame package up to Classical package up to 50 amps. And we've split up the portfolio here from less than 4 amps and up to 4 amps.
And you can see in our Embedded package, currently, we have products up to 17 volt 3 amps, TPSA2130 really a popular product, very dense. In the Leaded package we have up to 36 volt 10 amp and 42 volt 3 amp. In the QFN package, our highest rated product is LMZ36002, 60 volt 2 amp. Very popular products in the portfolio for the QFN package is the LMZ317 07, 10, and 04 series. These are pin 10, 10 amp to 4 amp, used a lot for point-of-load designs for powering up PGAs and processors.
And new to the portfolio, we'll have our first PMBus module with fault telemetry, TPSM846C23. It's a 35 amp module with PMBus. And we also have a pretty interesting device. I'll talk about this later, TPSM842 series. That's a drop-in to a standard TO220 3-pin LVO.
And another product-- actually, the advance info products, I think I've mentioned these, LMZM33602/3, 36 volt, 2 amp, 3 amp, 7 by 9 millimeter QFN package. And incredibly small, the TPSM82480, this is a 5 volt and 6 amp module that uses a dual-phased architecture to get that density, incredibly small. So go check those out on ti.com. These advanced products are up on the web.
All right. So now, let's go into more detail about the technology in our modules. So what I'd like to do now is talk a little bit about the evolution of power modules within the industry, how the products have gotten smaller and more cost effective. As you can see, the density is improving over time with our portfolio. And really, this is the result of a kind of a convergence of three technologies, the improved DC/DC process technology that we're using that's getting us better figure [INAUDIBLE] FETs, long it's a switch at higher frequencies, more inductors, smaller inductors, as well as advanced packaging. And combining all of these together is what's taking us to the point where the inductor is the largest volume of the module package itself.
And interesting enough, we've actually been developing power modules for many years. Back in 1999, TI acquired a company called Power Trends. And the PT6725 is the first module from Power Trends. The 14M module, you can see there's a lot of pins, a lot of circuitry, big inductor. It's a [INAUDIBLE] open inductor. Very popular, but it's also pretty big. It's 18 by 15 by 8.4.
Then a few years later, we released the PTH12050. Still, the inductor is a large percent of the volume. This is a 6 amp module using a powered iron inductor. So we are getting better inductors here, more simple, smaller.
Then we did take a break in the power modules. And we came back in 2010 and released the LMZ31506. The PTH12050, that's a 6 amp module. 1506 is a 6 amp modules. So going from 22 by 13 by 8.5 to 15 by 9 by 2.8 millimeter, higher switching frequency, less inductance, molded powdered iron inductor. That inductor was 25% of the volume.
And then the newest and highest density module for up to 17 volts is the TPS82130. Now, here we are, 2 megahertz frequency, 1 microhenry inductor. This is 3 amps. We're not at the full 6 amps yet. But we're drastically increasing the power density.
So you can see in this trend, we are getting big improvements in density and performance with our newer technology. And it's going to continue. We're not at the limits of physics yet. We are getting closer. But we still have a lot of room for innovation here.
OK. So now, let's take a deep dive into our embedded, what we call a MicroSIP or Nano package. And this package is really interesting. It's Open Frame. So you do see the component from the top of the package. This is using a FR laminate substrate. And we embed the IC, the converter, the die within the layers of this substrate.
You can see here in this diagram. Here's an exploded view to see that. In this case, the die is faced up. Here's the connections on the die. And then there's vias that connect through the layers to route the components on the top of the package and the footprint down to the bottom of the package to your PCB. And it is a very dense, very small MSL 2/3 rated, reflow to 260 C.
Theta JA is it's higher, relative to our other packages. It's going to depend on the package size, 70 degrees C per watt. So that does limit us in the terms of input voltage and output power and power capability and power dissipation within this package. So generally, you'll see us use this package more at the lower amp or voltages and lower currents. But I do see this technology advancing and getting increasing in capability, because it is a very flexible package to use and allows for some very innovative technology integration.
The Leaded package, this came out of National Semiconductor. And actually, I've worked on this definition back in National. And this is our Leaded package. And this is a dual Leadframe. So we make the package look really simple to you. It looks a lot like a TO263 package. But inside, it is quite complex. The foot chip die sits on the bottom Leadframe. Bump die connects at the top Leadframe where we mount the internal components. And then we mold over that. And so we do get that 3D package benefit.
We are sacrificing some area for these leads to make it really easy to probe and prototype with. So it's not the absolute smallest size. But it is pretty small and gets pretty good thermals. But it's very easy to use, easy for you to use, not as many pins for us to add features. So usually, these devices are minimal pin count, minimal features.
Then our workhorse package for the portfolio is the Leadframe based QFN. This is a single Leadframe. We don't have the passes on this. Use a package die. It's mounted underneath its inductor. Because of the single Leadframe and the way the package connects, we do get very good thermals. Theta JA is very good, very good thermals with his package. And density is good.
They are rated to MSL 3. The MSL rate, the reflow, max reflow temp is a little bit lower because of the volume of these packages. This conforms to the [INAUDIBLE] for the given package volume. Something to take into consideration is the surface mount capability of your manufacturing process.
And a new package that we're using, this is like the TPSM84A21 is a laminate-base QFN where instead if a Leadframe, we're using a laminate PCB And then we mount all the components on this. So the big advantage for us is that we can integrate more components and give more complex routing. So for you, you get a module with more integration, more features, and whatnot that we can't do in the Leadframe based module.
Theta JA is pretty good on this package. It's a little bit higher than our Leadframe based module, but still pretty good. And you get the integration of the components. And generally, in the Overmold QFN where we're doing a 2D package, a 2D design, we will mold over that when there's a lot of components that are visible. So they're designed for pick and place purposes.
And then the last package that we have in our portfolios is first product is going to release in Q1 2018, the TPSM846-- missing a digit here-- 6C23. This is a laminate QFN, really similar to how we make our copper Leadframe QFN. The inductor goes over the top, different inductor mounting for giving a more robust design for pick and place. So there's open.
The benefits of this is that we get the routing advantage of the substrate. Since there is no molding, we can reduce the size of the package, because with molding, we need to have a little bit area around here for the mold to adhere to. So this gets some space savings here for density. Theta JA is very competitive, even though it is a substrate because we have a lot of copper here. And given the package size, one of the benefits is it can be reflowed to higher because it's Open Frame, so up to 260 degrees C ambient.
So in summary, we have a range of module package options, some portfolio. That is one thing that's unique about TI's portfolio is the package options we have for our portfolio. And we had a lot of products in these different packages for a range of different applications for you to choose to find the most optimal solution.
And going into design tools, I mentioned earlier ti.com/powermodules is a great resource. We recently revamped the web page for making it easier to select the products for your portfolio or for your designs. So we have a graph showing a package by input voltage and output current. Or if you have a certain package in mind, you can click on here and just look at devices in that package style.
Or you can select based on input voltage, whether battery power. And a lot of our MicroSIP devices are made for portable handheld stuff. I've used a lot of consumer applications. So powering up lithium [INAUDIBLE] battery, or if you're line-powered off your 3/3 or 5 volt, 12 volt, 24 and plus, we've now have isolated modules. Also on our Landing page we have documentation app notes, design, TI designs, videos, and blogs, and all sorts of good stuff to help you out with your design.
And some tools, WEBENCH is obviously a key for our portfolio modules ease of use. You might think you don't need WEBENCH for doing the module design. You don't. But one of the benefits of WEBENCH is that you can do simulations. You can generate reports, schematic, export the schematic layout and design files that you can share with your other engineers and team members.
We also have PSPICE models available for transient models for all the LMZs. We also have these unencrypted. So if you search LMZ unencrypted or the first digits unencrypted, you'll find our unencrypted PSPICE models. And you can import those into whatever design tool that you like to use.
And we make really good quality EVMs for all of our modules. Our apps engineers spend a lot of time making these nice, very easy to work with and good documentation. Here's a few examples. So we'll have jumpers to set the output voltage, change to frequency, points where you can probe on and connect all of your input and output wires and all of that. Here's the example of a dual-phase, current-sharing EVM, LMZ317, parallelled for 20 amps output. Here's a MicroSIP module. All of them, we try to have the same look and feel across the portfolio.
And we also have a lot of reference designs you can find on the web. Maybe you're using a zinc processor, for example, and you need about 5 watts of output power. To power this design, we have a design that you could use as a reference to get going on your design. And have a bunch of different designs that we've created over the past several years for you to use.
OK. Now, I'm going to finish off with a look at a few of our key featured power modules. So I mentioned earlier the TPSM84205. At This is a pretty interesting device. This is a drop-in when your regulator replacement if you're using an old school 2T2310 LVO. And you want to get higher efficiency, but you don't necessarily want to go through a full redesign. This is pin-to-pin compatible, so you can drop that in and get an efficiency boost without doing a redesign.
TPS82130/40/50, really popular family for a 12 volt conversion, 5 volt conversion, 3 amp, 2 amp, 1 amp, incredibly small, very good efficiency at light load and full load. And LMZ31704/07/10, very popular family for FPGA power. This product family has a current mode. It has current sharing, sync, sync in, sync out capability, 10 by 10 by 4.3 millimeter package, pin-to-pin. I see it used a lot for FPGA power designs.
And TPSM84A21/2, one of the newest modules in the portfolio was released earlier this year, actually. Primarily because of the architecture of the converter, it's primarily for 12 volt input, up to 10 amps, in a 9 by 15 by 2.3 millimeter package, very dense and low height. I have some customers using this for backside PCB placement, and only one resistor to set the output voltage. And releasing next year in Q1 2018 is LMZM33603. This is our newest 36 volt QFN module. We'll offer 3 amp and 2 amp option in the 9 by 7 by 4 millimeter package. Then I mentioned this before, LMZ36002 60 volt, 2 amp module in the same 10 by 10 package here.
And just a quick detailed look at the TPSM84A21/2, it's set to 4 megahertz, 2 megahertz per phase on each of these internal inductors. And with this high switching frequency, one of the big benefits is that it's using all ceramic input and output caps. It's all integrated in the package. And the [INAUDIBLE] response is incredibly good, less than 3% total via deviation. So it's the trend units around plus/minus 1% with a half 5 amp load step. And we have an EMI tests of this. Also has a frequency sync pin. It covers the main point of load voltages down to 0.55 volts up to 2 volts, pretty cool product. Check that one out.
And LMZM33602/3, this was one of the products I was involved in the definition with. And this is going to RTN next quarter in 1Q '18, up to 3 amps, wide output voltage range, 1 volt to 18 volt output for 2 amps, up to 13.5 to 3 amps. Really, a 7 by 9 by 4 millimeter QFN package, and this is a new QFN package here. All the pins go out to the edge of the package, wider operating temperature range than the LMZ35003 to 105 C ambient, EMI tested, fixed frequency operation over the full load range with a sync pin.
And I mentioned before about the SOA curve, so ambient temperature versus output current, this is for the 3 amp. And we're writing this up the 105 C ambient. And you can see here, 24 volts, 3.3 volts output at 3 amps. It will derate based on this design here down to about 85 C ambient at 3 amps based on the EVM design. So something to take into consideration is the temperature range of the modules that even with this at the high power, we are getting a lot of power at our easable ambient temperature range.
Now, last product I want to talk about is the TPSM846C23. this is our first PMBus module. It's 35 amps stackable. Stack two together for 70 amps. This is geared towards high performance applications that are using high-power FPGAs or processors where you need AVS or PMBus in your design for setting values like the output voltage, soft start time, setting the AVS and the core voltage.
This does has telemetry. It has very good die temperature monitoring within plus/minus 5 degrees C at full load. You can read the output current and set the output voltage with 2 millivolt resolution. And this is over-the-top design, so you get a nice space savings, relative to a discrete converter. And this is going to also release in 1Q '18.
So to wrap things up, I hope I convince you that modules are very competitive and very useful for simplifying your designs, getting to market faster, as well as providing high performance in terms of EMI. We have a very large portfolio of products and it's growing every year. This is a big investment area for us. And we're continually pushing the envelope in terms of density with our module portfolio.
And I mentioned this already a couple of times, but ti.com/powermodules, check that out for finding all of the information related to modules. And do more with modules. Use modules and then you'll save time. You'll make your products more competitive and get that edge out in the marketplace. Thanks a lot for listening. And if you have any questions, just let me let me know, and I'll do my best try to answer them.
There are four questions in the Q&A window.
OK. Here we go here. Did I-- did I just close down the WebEx?
Yeah, I see your Ireland or Scotland.
OK. Why can't I see the-- this is weird. I don't see the WebEx interface. Huh.
OK. Let me-- the first question is, why do you--
OK, thanks for that.
OK. Why use 6 volt input?
Why use 6 volt input? So 6 volt input, we have products that are designed for 5 volt 3.3 volt input rails is a really common. So 6 volts is based on our process technology. And that gives a little bit of headroom for a loosely regulated 5 volt rail. And so a 6 volt rated product, the product that's specific to 6 volts, it's designed to a lower voltage. And generally, the efficiency will be higher because of the lower voltage rated process technology.
Are these power modules general purpose or do they need to be application dependent?
I would say our power modules are general purpose. In most cases, they are very general purpose devices. We are designing these in general for industrial and communication markets. Typically we are making these products for the mass market. So we were thinking more in terms of generally customers are doing multi-rail designs or using FPGAs. There's a lot of board, a lot of rails that are designs.
How do we make their design easier for them? How do we make the design more dense and easier for them to power these systems that require-- in some cases I've seen designs require 10 to 20 different power supplies on a single board. So that's our main goal is to solve density and design challenges. So I'd say yes. Our products are very general purpose. And the input voltage range, the output voltage range with our products cover a wide range of use cases.
Can the molded inductor be influenced by external magnetic fields or is it shielded?
Ah, here's the chat. OK. Can you repeat that question again, Randy? Sorry.
Sure. Can the molded inductor be influenced by external magnetic fields--
Mm.
--or is it shielded?
That's a good question. They are shielded. I haven't encountered a customer that has had an issue with the DC/DC becoming unstable as a result of the external EMI source. I know that's not exactly answering the question. But that's the best I can answer the question right now is that we haven't encountered a case where our power supply or module has gone unstable due to an external EMI source. But I can check with our apps engineers if you want to get in contact with me. I can send you a more detailed response.
Do the capacitors fail to short?
Do the capacitors fail to short? In our modules, we, through our qualification, that's something that we would catch in qualification if that would happen. But generally, no. Capacitors don't fail to short. They would generally fail to open.
Hey, does anyone else have any other questions? Another one. Is this an AEC=Q100 product?
No. Right now, our products are primarily for industrial communications and consumer markets. We do not have that AEC-Q qualified module in the portfolio yet. But we'd be interested in hearing about your requirements.
OK. If there are no other questions, if you do have a question, feel free to put it on the webinar comments section. I'll make sure to get the question answered. So that concludes today's webinar. I'd like to thanks Stephen for delivering a really great presentation. And I'd also like to thank everyone who has taken the time out of their day, afternoon, or evening to attend.
All right. Thanks a lot everyone. Thanks for joining in. Have a good one.

Description

November 10, 2017

This webinar provides an overview of buck power modules, their benefits over discrete converter based solutions and how designers can use power modules to build a robust designs and get to market faster. We'll discuss the various construction technologies for modules and how they provide higher density, ease of use and EMI benefits.

We'll also discuss some featured products for typical POL or intermediary rails and the tools and resources available to help do more with power modules. The webinar is intended primarily for designers who design systems for industrial (factory automation, medical, test and measurement, building automation, grid infrastructure etc.) and communications markets (wireless infrastructure, telecom infrastructure) and are looking for ways to simplify power design with dense, robust solutions to help reduce time to market.

What The Attendee Will Learn

The benefits of power modules vs discrete solutions in power design

The various construction technologies for modules and how they provide higher density, ease of use, and EMI benefits.

Typical POL or intermediary rails and the tools and resources available to help do more with power modules.

Q&A

TI has the most diverse portfolio of DC/DC power modules in the industry, covering a wide range of input voltages and output currents with a variety of package options.