The report segments the global SiC power devices market based on
application (EVs/HEVs, IMDs, PV Inverters, UPS & PS, and others),
product (diodes, modules, and transistors), and by geography (the
Americas, EMEA, and APAC). It provides a detailed illustration of the
major factors influencing the market, including drivers, opportunities,
trends, and industry-specific challenges.

Growing demand for power electronics is one of the major factors driving
the global SiC
power devices market. Power electronics help in
controlling and converting electrical power. The growing demand for
power electronics in several end-user industries is increasing the
adoption of SiC power devices. These devices play a vital role in
controlling automotive electronics such as modern electric power
steering, HEV main inverter, seat control, braking system, and others.
In automotive electronics, power electronics help in managing thermal
issues and improving fuel efficiency. These devices use components such
as SiC power MOSFETs and SiC SBDs in the powertrain systems to ensure
optimal operation of all components at high temperature.

According to a senior analyst at Technavio for semiconductor
equipmentresearch, “SiC power devices are used in
several power electronics systems since they are capable of withstanding
high temperatures, thereby, resulting in minimal power loss. For
instance, in 2017, Venturi Automobiles that designs, manufactures, and
sells luxury electric vehicles partnered with ROHM Semiconductor to
adopt SiC technology for increasing the power efficiency of its
electronic vehicles.”

In aerospace and defense, the demand for power electronics is high as
these are light-weight, easy to maintain and operate, and have fault
detection intelligence. SiC power electronic systems are used for energy
conversion in generators and actuators that are used in aircraft. In
2016, Northrop Grumman Corporation, an American aerospace and defense
technology company, announced its plans to increase the use of SiC power
electronic devices in light-weight shipboard power systems for the naval
application. The firm also plans to develop light-weight, compact, and
high-power electronic modules that will help in saving space in naval
vessels.

Technavio’s sample reports are free of charge and contain multiple
sections of the report including the market size and forecast, drivers,
challenges, trends, and more.

Transition toward larger SiC wafer: emerging market trend

The major trend identified by Technavio is the increasing interest in
large-sized SiC wafer. A six-inch wafer has a larger surface idea, which
ensures the manufacture of a higher number of chips at lower cost.
Larger wafer size reduces the manufacturing cost by 30% and device cost
by 20%-50%. In 2017, Norstel, a leading manufacturer of conductive and
semi-insulating SiC substrate, developed the six-inch SiC n-type wafers
to enhance the quality of SiC wafers. The expansion of the wafer size
from four inches to six inches is achieved by reducing the dislocation
density in the SiC wafers and expanding the diameter.

In addition to the above factors, manufacturers are entering several M&A
to increase the wafer size. For instance, in 2017, II-VI Incorporated,
an electronic component manufacturing company, acquired Kaiam, a
manufacturer of optical transceivers and photonic lightwave circuits
(PLCs). The acquisition aimed at expanding the in-house capacity to
provide six-inch wafers for GaAs, SiC, and InP-based devices. These
instances show the increasing interest of manufacturers to increase the
wafer size. This trend will enhance product development.

Global market opportunities

In terms of regional dominance, APAC dominated the global SiC
power devices market, followed by EMEA and the Americas in 2017.
APAC is also expected to emerge as the fastest growing market by
increasing its market share by close to 3% during the forecast period.
The other two regions are expected to witness a slight decline in their
market shares by 2022.

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