NXP Semiconductors announces partnership with Sonova NXP Semiconductors announced that as a result of a partnership with Sonova – the leading manufacturer of innovative hearing care solutions – they have collaboratively developed Venture, a landmark next-generation hearing instrument platform, which offers users exceptional performance. Using the advanced platform, Sonova has already introduced a first family of hearing aids, Phonak Audéo V, which launched in October 2014. Venture features an ultra-low power audio processing IC, incorporating a microcontroller and dual core DSP subsystem, maximizing computational power at minimal current consumption. The device's microphone inputs have a wide dynamic range, key for the device's sound quality. Wireless audio and data streaming are managed by a separate IC, built around a Near Field Magnetic Induction radio. This technology provides a tightly-contained Body Area Network, optimized for low power consumption and low latency. Besides its application in hearing instruments, the NFMI technology provides unique features for robust wireless earbuds applications and sensor networks in and around the body. Both ICs run from a battery voltage down to 1V, and will consume around 1mW for a typical hearing aid application.

Qualcomm calls active on speculation of an activist investor stakeQualcomm February 70 and 71 calls are active on 12K contracts (1K puts) on speculation of an activist investor stake. February call option implied volatility is at 20, March is at 19; compared to its 26-week average of 22 according to Track Data. Active call volume suggests traders taking positions for large near term price movement.