LED WAFER SCRIBING

JPSA Laser has announced 2.5-µm LED dicing kerfs that achieve a 50% reduction in cut widths to increase both die yield per wafer and throughput. The narrower scribe is characterized by a sharper V-groove profile that allows a shallower cut to break more readily and to increase the wafer-per-hour specification. Specially configured UV diode-pumped solid-state laser system optics are used to achieve the narrower cuts. The company says that process improvements are the result of the enhanced laser and optics, as well as the ability to manipulate subtle optical effects to achieve a small on-target energy distribution with a lower heat-affected zone, while maintaining a long working distance and depth of field.