RELIABILITY AND FAILURE ANALYSIS OF NO-CLEAN FLIP CHIP ASSEMBLY

Abstract: As the consumer demand for small, lightweight electronic communication products continues to grow, manufacturers must search for new and innovative connection technology, such as flip chip technology, that will accelerate product miniaturization.

The paper discusses the failure mode for thermal cycles of flip chip with eutectic solder interconnect. According to the reliability test result, we can verify the acceptance of used assembly process. For more details, failure mode analysis is made by cross-sections of the failed chips to see what happened in the solder joint.