HEICO’s Buc, France-based 3D-Plus provided multiple data memory modules,
as well as an amplifier for the Magnetometer, which will be used by the
French National Center for Scientific Research to measure magnetic field
changes. Historically, 3D-Plus’ parts have been relied on for many
high-profile space missions, such as: Juno, New Horizons, Dawn and Orion.

The Parker Solar Probe is tasked with traveling closer to the Sun’s
corona than any other human space mission has before. The spacecraft is
expected to reach the Sun over the next 7 years and will get within 3.83
million miles of the solar surface. At its closest approach, the Parker
Solar Probe will travel at a top speed of approximately 430,000 miles
per hour, making it the fastest human-made object ever. Additionally,
the spacecraft will have to withstand about 500 times the solar
radiation experienced on earth and will be heated to approximately 2,500
degrees Fahrenheit. Only recently has technology been developed to
withstand such a strenuous mission; according to Dr. Adam Szabo, NASA’s
mission scientist for the Parker Solar Probe, “NASA was planning to send
a mission to the solar corona for decades, however, we did not have the
technology that could protect a spacecraft and its instruments from the
heat.”

Major goals of the mission include: understanding coronal-heating
patterns, particle-acceleration dynamics, magnetic field changes, space
weather movements and star’s general behaviors and characteristics.

Laurans A. Mendelson, Chairman and Chief Executive Officer of HEICO
Corporation, along with Victor H. Mendelson, HEICO’s Co-President and
Chief Executive Officer of the Electronics Technologies Group, jointly
commented, “HEICO congratulates the entire NASA team and could not be
more proud that 3D-Plus helped make their mission possible. The Parker
Solar Probe is truly pushing mankind’s boundaries and frontiers into
uncharted territories. We thank the entire 3D-Plus team for their
continued hard work and commitment to unparalleled excellence.”

Pierre Maurice, 3D-Plus’ President and Co-Founder, stated, “Our team at
3D-Plus is honored to work with NASA and its suppliers to support such a
daring and meaningful mission. We look forward working with these
partners on ambitious, future endeavors. I also thank the world-class
team at 3D-Plus for their fantastic efforts.”

HEICO Corporation is engaged primarily in the design, production,
servicing and distribution of products and services to certain niche
segments of the aviation, defense, space, medical, telecommunications
and electronics industries through its Hollywood, Florida-based Flight
Support Group and its Miami, Florida-based Electronic Technologies
Group. HEICO’s customers include a majority of the world’s airlines and
overhaul shops, as well as numerous defense and space contractors and
military agencies worldwide, in addition to medical, telecommunications
and electronics equipment manufacturers. For more information about
HEICO, please visit our website at http://www.heico.com.