The AT-GDP Series SMD / BGA Rework Stations
feature the latest vision and thermal process
control technologies. Printed circuit boards and
substrates consisting of components such as BGA’s,
CSP’s, QFN’s, Flip Chips, PoP, Wafer Level Dies,
and many other SMD’s are processed with consistently
high quality results. Wafer Level Dies, and many other
SMD’s are processed with consistently high quality results.

PRO 1600 is a full forced air / nitrogen convection
reflow oven with only a 31" x 31" footprint of
floor space. It has been designed for reflow
soldering of even the most challenging applications
including metal core, high thermal mass, and ceramic
assemblies. PRO 1600 is very flexible in terms of
profile development and optimization. Sealed
heating chamber enables air ramp up rates of
up to 4° Celsius/second from ambient and programming
of up to 10 profile zones.