Technology Enabled Productivity Solutions for Advanced Packaging

Technology Enabled Productivity Solutions for Advanced Packaging

The adoption of TSV has been
limited to a few niche applications due to the high costs of TSV integrated
process. In this presentation, we will
propose a novel Barrier/Seed scheme that will significantly lower the costs of
barrier/seed deposition and reduce the CMP costs due to improved step coverage.
The bump electroplating processes in wafer level packaging are very cost driven
and require innovations to improve the on wafer performance without compromising
the capital productivity. We will present a few technology innovations such as
LAM’s Turbocell™ technology, Dynamic Edge tuning (DET) that has proven to
improve the on wafer performance and wafer yields while improving the capital
productivity and lowering the overall cost of ownership for the integrated
processes.