The EPIP Association and the STRIKE network will hold a workshop on the economic and statistical analysis of trade marks at the Organization for Economic Cooperation and Development (OECD) in Paris, France.

A first workshop on the “Economic Analysis of Trade Marks and Brands” was held in Alicante last year. This second workshop is intended to bring together researchers interested in empirical and theoretical research on trade marks and brands, as well as legal analysis of trade marks. At present much effort is going into the development and exploration of trade mark data so it is expected that the workshop will have one focus in this area. A second focus will be on the legal and economic foundations of trade marks. Scholars from
economics, business studies and the law are invited to submit papers.

The workshop is partly financed by STRIKE. Funding will cover travel and accommodation expenses of STRIKE participants. Other participants can apply for a refund of travel and accommodation expenses.

Keynote Speaker: Professor Stacey Dogan

Among the topics to be discussed are:
(a) Value of trade mark protection.
(b) Trademarks as indicators of innovation.
(c) Strategic effects of trade mark use and brand building.
(d) Normative goals of trademark law.

Call for Papers: For the 5th International Conference on Intellectual Property Protection of High Technology: Knowledge Sharing and Balanced IP Protection, The Research Center for Intellectual Property Law

Tsinghua University will host its 5th International Conference on Intellectual Property Protection of High Technology, on November 8-9, 2009, in Beijing, China. The theme of this conference is “Knowledge Sharing and Balanced Intellectual Property Protection”.

Scholars, legal practitioners, industry representatives and other interested participants are invited to submit papers on the theme. To be considered for presentation at the conference, submissions must be received by October 8, 2009. All submissions should be written in English and conform to academic citation standards. See attached URL for further information