20090191790 - Substrate polishing apparatus: A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090191791 - Polishing method and polishing apparatus: A polishing method can safely detach and lift up a workpiece from a polishing surface without carrying out the operation of making the workpiece overhang the polishing surface. The polishing method includes carrying out processing of a surface to be polished of a workpiece by supplying a liquid to a... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090191792 - Method for corrosion prevention during planarization: The present invention relates to the reduction or complete prevention of Cu corrosion during a planarization or polishing process. In one aspect of the invention, RF signal is used to establish a negative bias in front of the wafer surface following polishing to eliminate Cu+ or Cu2+ migrations. In another... Agent: HorizonIPPte Ltd

20090191793 - Method of and device for abrasive machining and abrasive tool provided therefor: Fine abrasive machining of a part includes providing a tool having a plurality of successive portions configured and arranged so that each preceding portion provides a coarser abrasive machining while each subsequent portion provides a final abrasive machining, and providing a relative movement of the abrasive tool relative to the... Agent: Iiya Zborovsky

20090191794 - Polishing method, polishing pad, and polishing system: A polishing method, a polishing pad, and a polishing system are described. The polishing pad with a plurality of grooves is provided. The width of each groove is W and the pitch between two adjacent grooves is P. An oscillatory movement distance of a workpiece on the polishing pad is... Agent: J C Patents, Inc.

20090191797 - Polishing apparatus: A polishing apparatus (1) has a polishing pad (22), a top ring (20) for holding a semiconductor wafer (W), a vertical movement mechanism (24) operable to move the top ring (20) in a vertical direction, a distance measuring sensor (46) operable to detect a position of the top ring (20)... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090191796 - Wafer processing method for processing wafer having bumps formed thereon: A wafer processing method for processing a wafer (20) having bumps (B) formed on a front surface (21) comprises the steps of: holding on a table (51), a bump region-conforming member (40) that has an outer shape conforming only to a bump region (25) where said bumps are formed in... Agent: Christie, Parker & Hale, LLP

20090191798 - Integrally molded brush and the method of manufacture and its uses thereof: An aspect of the present invention comprises an integrally molded brush comprising a base and bristles extending from said base, further comprising a moldable composition that includes a dispersed phase comprising ultra-high molecular weight polyethylene. Another aspect of the present invention is a method of making an integrally molded brush... Agent: 3m Innovative Properties Company

20090191800 - Method, system, and apparatus for modifying surfaces: The present disclosure is directed to method, apparatus, and system for uniformly supporting flexible surface modifying articles during surface modification as well as enabling replacing and repositioning thereof for improving their useful service life as well as improving dust and debris control management.... Agent: 3m Innovative Properties Company

07/23/2009 > patent applications in patent subcategories.

20090186556 - System for providing quantitative process control of finesse polishing: A system for providing quantitative process control of a finesse polishing based upon feedback to the operator as to whether he/she is meeting the one or more predetermined key control characteristics (KCCs). One or more sensors provide data to a controller, wherein the controller provides the operator feedback regarding his/her... Agent: General Motors Corporation Legal Staff

20090186557 - Method of operating substrate processing apparatus and substrate processing apparatus: A method of operating a substrate processing apparatus, upon the occurrence of a nonfatal failure in the apparatus, makes it possible to continue part of the apparatus operations for substrates to clean and recover a substrate or to easily discharge a substrate from the apparatus, without stopping an entire apparatus,... Agent: Wenderoth, Lind & Ponack, L.L.P.

20090186558 - Grinding method, grinding device and electrode therefor: A grinding device including a multi-wheel grindstone and an electrode arranged opposite to a grinding action surface of the multi-wheel grindstone with an interval, in which a work is ground and machined while the grinding action surface of the multi-wheel grindstone is electrolytic-dressed by supplying conductive machining fluid between an... Agent: Sughrue Mion, PLLC

20090186559 - Dust shroud with access hatch retention mechanism: A vacuum shroud for an angle grinder includes a removable hatch for grinding in a corner and provides a storage location on the shroud for the hatch in order to encourage use of the hatch when not grinding in a corner.... Agent: BatemanIPLaw Group

20090186560 - Wafer de-chucking: A carrier head (100) for a CMP tool, wherein the membrane (108) defining a chamber with a contact surface (102) of the carrier head (100) has a number of integral tubes (110) termining in openings coupled directly to the substrate (106), in addition to a main fluid flow passage (104)... Agent: Nxp, B.v. Nxp Intellectual Property Department

20090186562 - Method of grinding wafer: A method of grinding a wafer, including: a wafer holding step for holding a wafer on a conical holding surface of a chuck table having the holding surface; a rough grinding step for performing rough grinding of the wafer held on the holding surface of the chuck table by positioning... Agent: Greer, Burns & Crain

20090186563 - Wafer processing method: In a wafer processing method, rough grinding using a first grinding stone is divided into first and second steps. In the first step, a wafer is processed into a concave shape at a first transfer rate with a reinforcing rib area slightly left. Thereafter, as primary rough grinding in the... Agent: Greer, Burns & Crain

20090186564 - Spinner wheel housing: A spinner wheel housing (100) comprises an outer housing (10) having at least one covering element (15), at least one bottom element (16), two front wall elements (11, 12) and two trapezoidal lateral wall elements (13, 14) which are arranged at a distance from each other and encompassed by the... Agent: Milde & Hoffberg, LLP

20090186565 - Spool to spool continuous through feed system: A grinding machine has a machine bed, a first spool and a second spool mounted on the machine bed. The spools are capable of storing stock to be ground and are rotatable in a coordinated manner. A grinding wheel is mounted on the machine bed. The first spool is capable... Agent: Lerner, David, Littenberg, Krumholz & Mentlik

20090186566 - Sandpaper loading system and apparatus: A hand sander for attaching sandpaper thereto, the hand sander including a base having clamp ends; a handle for holding the sander in the hand; a clamping mechanism for clamping a sheet of sandpaper to each clamp end of the base wherein the clamping mechanism including a clamp pivoting between... Agent: Mark A. Koch Professional Corporation

20090186567 - Abrasive tool with mosaic grinding face: An abrasive tool includes a back plate with a first side and a second side, a plurality of segment mounts disposed in spaced relation along a majority of said first side, a plurality of abrasive segments engaged by the segment mounts, the second side being configured for attachment to a... Agent: Houston Eliseeva

07/16/2009 > patent applications in patent subcategories.

20090181601 - Methods and tools for controlling the removal of material from microfeature workpieces: Methods and apparatus for controlling the removal of material from microfeature workpieces in abrasive removal processes. An embodiment of such a method comprises irradiating a periodic structure of the workpiece and obtaining an intensity distribution of radiation returning from the periodic structure. The workpiece can be irradiated with a wide... Agent: Perkins Coie LLP Patent-sea

20090181602 - Apparatus for precision steeling/conditioning of knife edges: A knife edge enhancing apparatus includes a support having a support surface and knife blade clamping structure mounted to the support and located above the support surface. An object having a knife edge modifying surface which could be abrasive or non-abrasive is mounted to a holder which is freely slidable... Agent: Connolly Bove Lodge & Hutz LLP

20090181603 - Concrete polishing extension: A Concrete Polishing Extension device for treating hardened concrete surfaces and more specifically interior surfaces of countertop sinks made from decorative concrete. The extension device has features for use with grinding deep, contoured surfaces of concrete. The preferred embodiment is comprised of an extended shaft with connection features and other... Agent: John D. Ritchison Ritchison Law Offices, PC

20090181604 - Dust shroud for rotary tools: A dust shroud for rotary tools includes a front half and a back half which are attachable together along an axis thereof to form a dust shroud. The dust shroud is mountable to a rotary power tool after mounting a mandrel in the power tool, and includes one or more... Agent: BatemanIPLaw Group

20090181605 - Dust shroud with adjustable mounting mechanism: A universal dust shroud includes mounting brackets held above the shroud body by springs. The brackets move radially and vertically relative to the body to accommodate different angle grinders, and allow vertical movement of the shroud body relative to the grinding disk while using the grinder to allow the user... Agent: BatemanIPLaw Group

20090181606 - Vacuum shroud for use with drilling tools: A flexible vacuum shroud provides an improved seal to the work surface and allows for use on curved surfaces. The shroud incorporates support structures around the cutting tool hole which improve performance with different cutting tools and which prevent collapse of the shroud.... Agent: BatemanIPLaw Group

20090181607 - Drywall corner sanding tool: A sanding tool for sanding sheetrock corner joints is provided. The tool has an elongated mounting plate with a swivel handle attached to one side, and to the other side is attached one or more circular sanding disk holders to which disks of sanding medium are removably attached to a... Agent: Steven M. Clodfelter

20090181608 - Polishing pad and fabricating method thereof: A method of fabricating a polishing pad for polishing an article is described. The method includes providing a semi-finished polishing pad and then forming a moving track on the surface of the semi-finished polishing pad. The moving track substantially coincides with a polishing track of the article on the polishing... Agent: J C Patents, Inc.

07/09/2009 > patent applications in patent subcategories.

20090176441 - System and method for dressing a wafer polishing pad: A system for polishing a semiconductor wafer. The system includes a polishing apparatus having a rotatable polishing pad for polishing the wafer. A dressing apparatus is mounted adjacent the polishing pad for dressing the polishing pad. The dressing apparatus includes a dressing member engageable with the polishing pad. A cleaning... Agent: Richard A. Schuth (memc) Armstrong Teasdale LLP

20090176442 - Eyeglass lens processing apparatus: An eyeglass lens processing apparatus includes a processing control unit (50) which in the soft processing mode, roughs the lens such that the torque threshold value is set to a value Tθs lower than the threshold value TθN of a normal processing mode, and when torque detected by a sensor... Agent: Sughrue-265550

20090176444 - Wafer polishing method and apparatus: A wafer polishing method, in which the outer circumferential edge of a polishing member is first cut by a cutting tool fixed to a table base, thereby forming the polishing member into a completely round shape and also positioning the polishing member in a Y direction at a Y-directional reference... Agent: Greer, Burns & Crain

20090176445 - Flexible membrane assembly for a cmp system: A flexible membrane assembly for a wafer carrier in a CMP system. The flexible membrane assemble has a flat, flexible membrane joined to a rigid cylindrical sidewall.... Agent: Crockett & Crockett Suite 400

07/02/2009 > patent applications in patent subcategories.

20090170402 - Apparatus and method for grinding threaded portion of workpiece: An apparatus for grinding a threaded portion of a workpiece, is provided. The threaded portion has a spiral groove formed therein. The apparatus includes a motor, a grinding cord, a detector and a controller. The motor has a rotary portion for rotating the threaded portion of the workpiece about an... Agent: PCe Industry, Inc. Att. Steven Reiss

20090170403 - Eyeglass lens processing apparatus: An eyeglass lens processing apparatus includes: a setting unit which sets points on an edge of a lens, where a line on a target lens shape and passing through the first and second points intersects a line on the target lens shape and passing through the third and fourth points;... Agent: Sughrue-265550

20090170404 - Apparatus and method for polishing media discs: Disclosed is an apparatus for polishing media discs by removing or reducing scratches or substances from the surface of damaged discs, including computer data CDs, DVDs, gaming discs and other media discs. The apparatus enables removal or reduction of scratches and materials that prevent the information or data contained on... Agent: Inna Belopolsky

20090170405 - Assembly for manually grinding a face of a vehicle body part: An assembly for manually grinding a face of a motor vehicle body part, including a grinding mechanism, a moving carriage supporting the grinding mechanism, a mechanism to guide the carriage moving along the face to be ground, and a support guide held in position with respect to the body part... Agent: Oblon, Spivak, Mcclelland Maier & Neustadt, P.C.

20090170406 - Wafer production method: The present invention is a wafer production method at least comprising a chamfering step of chamfering a wafer sliced from an ingot using a grindstone for chamfering, and a step of obtaining a product wafer thinner than the chamfered wafer by performing at least one or more than one of... Agent: Oliff & Berridge, PLC

20090170407 - Pad conditioner dresser: Methods for extending the service life of a CMP pad dresser having a substrate and a plurality of superabrasive particles disposed thereon which is used to dress a CMP pad are disclosed and described. The method may include dressing the chemical mechanical polishing pad with the dresser; determining superabrasive particle... Agent: Thorpe North & Western, LLP.

20090170410 - Chemical-mechanical planarization pad: The present disclosure relates to a polishing pad including a chemical agent present in an amount sufficient to be released and dissolving into an aqueous abrasive particle polishing medium during chemical mechanical planarization and reducing abrasive particle agglomeration and a binder. The pad includes a surface such that as the... Agent: Grossman, Tucker, Perreault & Pfleger, PLLC

20090170408 - Integrated circuit package contact cleaning: The invention provides methods and apparatus for automated contamination removal in association with integrated circuit manufacturing and testing. Disclosed embodiments include methods for cleaning electrical contacts of integrated circuit packages with steps for transporting the package from a first position to a second position and, during the transit, bringing the... Agent: Texas Instruments Incorporated

20090170409 - Polishing pad and polishing method: A polishing pad and a polishing method are described. The polishing pad is made from a composition compresing a polymeric matrix, an additive, and a rheology altering agent. The rheology altering agent enables a uniform distribution of the additive in the polymeric matrix.... Agent: J C Patents, Inc.

20090170411 - Micropolishing assembly for micropolishing piston rings: A flexible micropolishing machine for micropolishing a piston ring comprising an arbor for accepting at least one piston ring, a means for rotating the arbor, a flexible roller arm located adjacent the arbor, and an indexable abrasive material located between the flexible roller arm and the at least one piston... Agent: Mick A. Nylander

20090170412 - Sanding device with detachably mounted sanding element: The invention relates to a grinding device, comprising a mounting body which is detachably connected to a grinding element, said detachable connection being designed such that the mounting body has a first adhering arrangement and the grinding element has a second adhering element and the adhering elements correspond in the... Agent: Michael J. Striker

20090170413 - Chemical-mechanical planarization pad: The present disclosure relates to a polishing pad. The polishing pad may include a polymer layer having a three-dimensional network therein and a composite layer having the ability to equalize pressure across the pad surface, including a first adhesive wherein the composite exhibits a hydrostatic modulus of 1 to 500... Agent: Grossman, Tucker, Perreault & Pfleger, PLLC

20090170414 - Cryogenic treatment processes for diamond abrasive tools: Embodiments of the invention can provide cryogenic treatment processes for diamond abrasive tools. One process in accordance with an embodiment of this invention can include introducing an abrasive tool into a cycling chamber, wherein the tool has a temperature of about ambient temperature; and introducing at least one cryogenic material... Agent: Sutherland Asbill & Brennan LLP

20090170416 - Methods and apparatus for forming a slurry polishing pad: Methods and apparatus for forming a semi-spherical polishing pad for polishing semiconductor surfaces, provide for: placing a polishing pad pre-form on a dome-shaped forming surface, the polishing pad pre-form including a circular body having a center and an outer peripheral edge, and a plurality of slots extending from the outer... Agent: Corning Incorporated

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