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Abstract

Numerous techniques have been employed for picking up semiconductor wafers and holding them without motion, while air or other fluid media is applied to the exposed surface of the wafer. This proposal illustrates an extremely simple and yet economical and reliable wafer pickup.

Country

United States

Language

English (United States)

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Mechanical Wafer Pickup

Numerous techniques have been employed for picking up semiconductor
wafers and holding them without motion, while air or other fluid media is applied
to the exposed surface of the wafer. This proposal illustrates an extremely simple
and yet economical and reliable wafer pickup.

In the drawing the wafer pickup 10 includes a substantially cylindrical two-
piece molding 11 and 12 which may be mated together in any convenient
manner. The material may be a plastic as long as it is somewhat resilient. The
lower portion 11 of the cylinder is provided with longitudinally extending, spaced
apart slots 13 and 14 which form flaps 15 intermediate the slots. The flaps 15
are secured, in the present instance, at their upper end 16 to form a hinge for the
flaps. The lower portion of the flaps may be provided with an inturned lip portion
17 to engage beneath, for example, a semiconductor wafer in a manner which
will be described subsequently.

An actuator 18, which may be an air actuator, a solenoid, etc., is mounted on
the upper portion 12 of the cylinder, and includes a shaft wafer pick-up device 10.
The shaft is coupled to radiantly extending fingers 19 which are hingedly
mounted on the extremity of the shaft 18a. The fingers 19 are connected to the
lower portion 15A of the flaps 15 whereby, upon reciprocation of the shaft 18A,
the flaps tend to move in and out (depending upon the direction of the stroke of
the shaft) effecting a lifting action by the l...