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Abstract

Disclosed is a bonding pedestal to facilitate leadframe attachment to semiconductor chips. The structure transforms standard semiconductor Input/Output (I/O) pads into gold-plated pedestals. The pedestal consists of a 100 micron diameter gold-plated aluminum sphere flattened at the top and bottom, attached to the semiconductor chip bonding pad.

Country

United States

Language

English (United States)

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Bonding Pedestal

Disclosed is
a bonding pedestal to facilitate leadframe
attachment to semiconductor chips. The
structure transforms standard
semiconductor Input/Output (I/O) pads into gold-plated pedestals.
The pedestal consists of a 100 micron diameter gold-plated aluminum
sphere flattened at the top and bottom, attached to the semiconductor
chip bonding pad.

Aluminum
spheres, easily obtainable from manufacturers of
powdered metals, are purchased in bulk.
The spheres are batch
processed as follows: First, the aluminum spheres are zincated by
means of a standard zincating process to provide an interface
metallurgy for gold plating. Next, the zincated spheres are placed
in an electroless gold plating
bath. The gold plated spheres are
then positioned on the semiconductor chip I/O pads and attached
through the application of a combination of two or more of heat,
pressure, and ultra-sonic energy. The
chips are then ready for lead
attachment.