In size, it is the first integrated technology platform to be announced below the 20 nm node, with key features including a 48-nm fin pitch and the smallest SRAM ever incorporated into an integrated process—a 128-Mb SRAM measuring 0.07 µm2 per bit. In performance, it demonstrated either a 35% speed gain or a 55% power reduction over TSMC’s existing 28-nm high-k/metal gate planar process, itself a highly advanced technology, and had twice the transistor density.Short-channel effects were well-controlled, with DIBL <30 mV/V, saturation current of 520/525 µA/µm at 0.75V (NMOS and PMOS, respectively) and off-current of 30 pA/µm. It incorporates seven levels of high-density copper/low k interconnect and high-density planar MIM devices for noise control.

Figure 1 shows that the 16 nm FinFET achieved either a >35% speed gain or >55% power reduction over TSMC’s planar process.

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As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineered to combine bond strength and electrical conductivity with other service-critical properties.November 11, 2016Sponsored by Master Bond, Inc.,

XwinSys recently launched the ONYX - a novel in-line and non-destructive hybrid metrology system, uniquely integrating advanced XRF, 2D and 3D optical technologies, designed to meet the current and future metrological challenges of the semiconductor industry. The unique hybrid configuration of the ONYX enables a solution to challenging applications through various analytical approaches and effective SW algorithms.July 06, 2016Sponsored by XwinSys Technology Development Ltd.

WEBCASTS

The smartphone market is expected to reach 1.5B units in 2016 consuming nearly 1/3 of the IC market as smartphones become the mini mobile computers in capabilities and the central hub/gateway for the Internet of Things (IoT) devices including wearables and home monitoring devices. This webcast will give an update to the previous April 30, 2015 Webinar on Smartphone as the Technology Driver.