Grenoble, France – August 1, 2014 -- As the time is ripe, Dolphin Integration announce their 28 nm offering at TSMC HPM, with a broad range of products to address the pending challenges of multimedia SoC. Based on 30 years of design experience, Dolphin Integration reveal their intent to support leading Fabless companies to reach their stringent objectives of very low power consumption, small silicon area and low Bill-of-Material.

Critical virtual components have been developed to address two principal markets:

For more information about Dolphin Integration's product portfolio, please visit their catalog.

About Dolphin Integration

Dolphin Integration contribute to "enabling mixed signal Systems-on-Chip". Their focus is to supply worldwide customers with fault-free, high-yield and reliable kits of CMOS Virtual Components of Silicon IP, based on innovative libraries of standard cells, flexible registers and low-power memories. They provide high-resolution converters for audio and measurement, regulators for efficient power supply networks, application optimized micro-controllers. They put emphasis on resilience to noise and drastic reductions of power-consumption at system level, thanks to their own EDA solutions missing on the market for Application Hardware Modeling as well as early Power and Noise assessment In addition strong experiences in ASIC/SoC design and fabrication, plus privileged foundry portal even for small or medium volumes, makes them a genuine one-stop shop covering all customers’ needs for specific requests.

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