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Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method that increases the wire bond surface area by applying metal over a non-planar patterned wire bond pad surface. Benefits include a solution that is easy to implement and increases wire bond strength.

Country

Undisclosed

Language

English (United States)

This text was extracted from a Microsoft Word document.

At least one non-text object (such as an image or picture) has been suppressed.

This is the abbreviated version, containing approximately
55% of the total text.

Disclosed is a method that increases the wire bond surface
area by applying metal over a non-planar patterned wire bond pad surface.
Benefits include a solution that is easy to implement and increases wire bond
strength.

Background

Currently, low wire bond strength is caused by the
following:

§
Using small-diameter bonding wires

§
Using a bond pad that is less than 75um in the x and y directions

§
Using wire bonding temperatures that are less
than 180°C

§
Using a bonding force that is less than 25g

This problem is currently solved by switching to specially
formulated gold wire bond metal alloys for lower temperature wire bonding, or
by using an aluminum wedge bonding method.
Currently, wire bond pads are designed to be flat (see Figure 1) for
conventional bonding pads. When a
redistribution layer is used on top of the original bonding pads (see Figure
2), the bonding area is also kept flat.

The problem of bond pad peel-off is partially addressed
through the use of specially formulated adhesion promoter chemicals and Argon
plasma surface treatments to help the bond pad metal adhere better to the
dielectric material that it rests upon. The problem is further solved by
increasing the thickness of the bond pad metal, and
the use of a titanium adhesion metal layer when aluminum bond pads are used.

General Description

The disclosed method increases the surface area of the
bonding pad, while using smaller diameter wires; this has the same effect as
using larger diameter wires.

One approach for locking the wire bond in place is shown in
Figure 3; the well is created by building up the side walls using a
non-conductive layer on either side of the original bond pads. This narrows the
dimension of the bond pad in the x
and y dimensions. The final metal is
then deposited on top.