Abstract: The present invention relates to lining carrier for a sanding pad lining, in particular for use with a sanding pad for pressing sanding surfaces against workplaces in segment-belt and wide-belt sanding machines. Here, the lining carrier has at least one recess, in particular a groove.

Abstract: An idler for a machine undercarriage includes a hub. The idler may also include a body extending radially outward from the hub, the body including a single solid disk with a first substantially planar side and a second substantially planar side opposite the first substantially planar side.

Abstract: The polishing apparatus has a polishing unit capable of forming a right-angled cross section by polishing a peripheral portion of the substrate. The polishing unit includes a polishing head having a pressing member configured to press a polishing tape against the peripheral portion of the substrate from above, a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and to recover the polishing tape from the polishing head, a first moving mechanism configured to move the polishing head in a radial direction of the substrate, and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate.

Abstract: The invention discloses an abrasive belt polishing finisher in the field of mechanical technology, which addresses inconvenient operation of the existing polishing finishers. The abrasive belt polishing finisher includes a motor and a connection support. The central section of the connection support is fixedly connected with the output shaft of the motor. Several self-rotable connection support finishing wheels are provided around the connection support. The curve surface of the rim of each of the support finishing wheels has a different curvature. Each connection support finishing wheel is distributed on the same circle centered on the output shaft of the motor. The connection support is driven by the motor into rotation to press and position one of the connection support finishing wheels against the back of the abrasive belt in the polishing finisher. The abrasive belt polishing finisher could satisfy continuous polishing treatment for different curved surfaces.

Abstract: The present disclosure describes a sanding device that has a motor coupled to a base plate for inducing vibration in the base plate. Further, the sanding device has a face plate that is coupled to the base plate, and the face plate has a plurality of sleeves for receiving a respective plurality of columns. The columns rotate and move longitudinally within the sleeves. Further, each column moves independent of the other columns and each column have an abrasive surface on a sanding end for contacting a sanding surface.

Abstract: A smoothing method and a smoothing apparatus has been achieved, which make it possible to automate smoothing of welded members that was formerly carried out manually. The method according to the present invention uses a belt grinding apparatus, which includes an endless grinding belt and a press pad that presses the grinding belt against a welded area, and uses this belt grinding apparatus in two different modes after obtaining information on heights of surfaces of two welded members along a weld bead of the two welded members. The first mode corresponds to a bead removing step in which the grinding belt is pressed against a welded area by the press pad to reduce the height of the weld bead. At this time, the grinding belt is made to run at a fixed position, while the press pad is made to move toward and away from the welded area (the surface thereof).

Abstract: The present invention relates to a lining carrier for a sanding pad lining, in particular for use with a sanding pad for processing sanding surfaces against workpieces in segment-belt and wide-belt sanding machines. Here, the lining carrier has at least one recess, in particular a groove.

Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Abstract: The invention discloses a transform mechanism of a finishing wheel for an abrasive belt polishing finisher in the field of mechanical technology. The invention is disposed on the inner side of the abrasive belt of the finisher, comprising several slide rails disposed on the side of the frame of the finisher and sliders on the slide rails. A finishing wheel is fixedly connected with each of the sliders. The curved surface of the rim of each of the said finishing wheels has a different curvature. A driving element connected with the slider is provided on the frame of the finisher close to each of the sliders. The finishing wheel corresponding to the driving element, driven by the said driving element, is pressed against the inner side of the abrasive belt. The transform mechanism of the invention could be widely applied and has a high polishing and finishing efficiency.

Abstract: A polishing device includes a reducer, a polishing mechanism, a rotatably driven mechanism, and a sliding driving mechanism. The polishing mechanism is connected to the reducer. The rotatably driven mechanism includes a first driving member and a transmission shaft, the first driving member includes a first main body and an output shaft rotatably connected to first main body, the transmission shaft is fixed to the output shaft. A sliding driving mechanism includes a second driving member, the second driving member includes a second main body and a driving shaft collar connected to the second main body, the second main body is fixed to the first main body. The second main body and driving shaft collar cooperatively define a through hole. The transmission shaft extends through the through hole and is connected to the reducer to enable the polishing mechanism to polish a workpiece. The driving shaft is fixed to the reducer.

Abstract: A polishing apparatus including a chuck for supporting a wafer while exposing a peripheral portion of the wafer, a polishing head for polishing the peripheral portion of the wafer, and a polishing solution supplying assembly provided above the chuck and configured to spray a polishing solution on the wafer and to form a liquid curtain on the chuck to protect the wafer when the wafer is polished may be provided.

Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Abstract: The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.

Abstract: The present invention discloses a grinding device and a grinding method. The grinding device for grinding a panel includes a grinding belt held between an upper surface and a bottom surface of the panel for grinding both surfaces of the panel simultaneously, a transferring mechanism for transferring the grinding belt and a belt pressing mechanism for pressing the grinding belt on the upper surface and the bottom surface of the panel. The grinding device and the grinding method in the present invention save manufacturing cost by reducing numbers of grinding belt in a grinding period because it uses one grinding belt to grind the upper surface and the bottom surface of the panel at the same time. Furthermore, the grinding belt exerting evenly on the upper and bottom surfaces of the panel in use of one grinding belt enhances flatness of two surfaces of the panel.

Abstract: A substrate polishing method includes starting to rotate a circular substrate and polishing an inner peripheral edge surface of a center circular hole formed in the circular substrate into a chamfered or rounded surface by pressing the inner peripheral edge surface against a bypass polishing part of a polishing tape that is conveyed intermittently or continuously and by oscillating the bypass polishing part of the polishing tape about a direction perpendicular to a direction that the center circular hole penetrates through the circular substrate. The polishing tape is guided so as to have an advancing portion advancing toward the circular substrate, a returning portion returning from the circular substrate, and a turning-back portion between the advancing portion and the returning portion guided along a side bypass. The bypass polishing part of the polishing tape is the turning-back portion of the polishing tape.

Abstract: An abrading device for abrading a floor structure comprises a first abrading assembly and a second abrading assembly. The first and second abrading assemblies each have a rotationally driven contact roll provided with a sleeve having a plurality of cutouts formed in a pattern thereon. An abrading belt is trained over the sleeve. A first oscillation assembly is connected to the first abrading assembly and oscillates the contact roll of the first abrading assembly in a first direction via a linear reciprocating motion. A second oscillation assembly is connected to the second abrading assembly and oscillates the contact roll of the second abrading assembly in a second direction via a linear reciprocating motion. The first and second abrading assemblies consecutively abrade a top surface of the floor structure with the pattern formed by the cutouts on the respective sleeves to form a distressed visible pattern thereon.

Abstract: The present invention relates to a method for manufacturing a flexible abrasive disc, and to such an abrasive disc. The abrasive disc comprises a backing with an upper side and a lower side. The upper side has an abrasive agent coating for forming a surface layer. In order to form a surface layer as specifically patterned as possible, the backing of each abrasive disc is coated separately. In this manufacturing method, the abrasive agent coating on the upper side of the backing is embossed with an embossing mold specially structured and to be pressed against the backing.

Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool.

Abstract: An embodiment wafer polishing tool includes an abrasive tape, a polish head holding the abrasive tape, and a rotation module. The rotation module is configured to rotate a wafer during a wafer polishing process, and the polish head is configured to apply pressure to the abrasive tape toward a first surface of the wafer during the wafer polishing process.

Abstract: An apparatus and method of polishing a substrate is described. The polishing includes: rotating a substrate; pressing a first polishing tool against an edge portion of the substrate to polish the edge portion; and pressing a second polishing tool against the edge portion of the substrate to polish the edge portion. The second polishing tool is located more inwardly than the first polishing tool with respect to a radial direction of the substrate. The first polishing tool has a polishing surface rougher than a polishing surface of the second polishing tool.

Abstract: In a continuous grinding machine for grinding the surface of flat workpieces (20) with at least one grinding station and a transport device (10) for moving the workpieces (20) relative to the grinding station, the grinding station having at least one grinding assembly (22) with a grinding belt (26) and a pressure device (34) for pressing the grinding belt (26) against the workpiece surface, and with a control device (38) for controlling the pressure device (34) depending on the workpiece contour, the transport device (10) is reversible with respect to its feed direction and the control device (38) has means (36) for detecting the workpiece contour depending on the feed direction.

Abstract: Various embodiments of the present invention are generally directed to an apparatus for sharpening a cutting tool. A tensioner assembly applies a biasing force to a roller to maintain a selected tension in a belt and to facilitate translational displacement of the roller during deflection of the belt. In some embodiments, the tensioner assembly includes a shaft with an L-shaped groove with an elongated portion and an offset portion to facilitate transition of the roller between an extended position and a retracted position. In related embodiments, the tensioner assembly comprises a shaft with an elongated groove to facilitate tracking alignment of the belt on the roller. In further related embodiments, a guide housing is provided adjacent an abrasive medium with a guide slot and magnet to facilitate presentation of a cutting tool against the abrasive medium.

Abstract: The invention relates to a device for sanding a predetermined impression into a workpiece. The device has a pattern belt positioned inside the area formed by a sanding belt. A pad is positioned inside the area formed by the pattern belt. A raised pattern is formed on the outer surface of the pattern belt. In use, the pad contacts the pattern belt, urging the raised pattern of the pattern belt to contact the sanding belt. The portion of the sanding belt contacted by the pattern belt is urged toward the workpiece so that the predetermined impression is sanded into the workpiece.

Abstract: The invention relates to an adjustable belt sander, comprising a continuous sanding belt (11) and a sanding module (4), which supports the sanding belt in the sanding region and has a profiled guide surface which faces the sanding belt back and represents a rounding radius to be sanded, wherein the sanding module has a disk shape, is mounted centrally rotatably about a pivot pin (5) on a main body (3) arranged transversely to the sanding direction and at the peripheral profile has at least two quadrant circle contours having different radii, which determine the respective guide surface for the sanding belt.

Abstract: A belt finishing device includes a finishing belt, two bearing surfaces that are spaced-apart in a running direction of the finishing belt, and a pressing device for pressing the finishing belt against a workpiece surface. The pressing device has a pressure belt that is supported on the two spaced-apart bearing surfaces. At least one of a bearing surface and the pressure belt have a profile that deviates in a width direction of the finishing belt from a straight course.

Abstract: A method of detecting an abnormality in polishing of a substrate is provided. The method includes: rotating the substrate; pressing a polishing tool against an edge portion of the substrate to polish the edge portion; measuring a position of the polishing tool relative to a surface of the substrate; determining an amount of polishing of the substrate from the position of the polishing tool; calculating a polishing rate from the amount of polishing of the substrate; and judging that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range.

Abstract: An object is to provide a burnishing method in which it is possible to reduce the flying height of a magnetic head by improving the smoothness of the surface of a magnetic disk while suppressing contamination of the magnetic disk due to falling-off or crushing of abrasive grains from a polishing tape. In the burnishing method, an alignment process of adjusting the position in a thickness direction of a magnetic disk 10 of an outer peripheral plate 75 installed outside an outer peripheral end 10c of at least one of the magnetic disk 10 and the magnetic disk 10 so as to make the surface of the outer peripheral plate 75 and the surface of the magnetic disk 10 become flush with each other is performed between a substrate installation process and a burnishing process.

Abstract: A finishing device for finishing a surface of a workpiece includes a finishing belt, and a guide unit for guiding the finishing belt. The guide unit has a cup-shaped guide surface which bounds a receiving zone for the workpiece and along which the finishing belt is guided or guidable between an entry zone and an exit zone. The guide unit includes at least two separate guide members which have each a surface area, with the surface areas of the guide members jointly defining the guide surface and being movable relative to one another.

Abstract: An apparatus for machining a planar metal workpiece, having at least one machining unit, with which a machining belt, which is driven in circulation, can be guided in an at least approximately linear manner past the region of the workpiece to be machined in an oblique or transverse manner with respect to a feed direction of the workpiece. A movable carrier element having pressure means acts on a rear side of the machining belt in order to influence contact, necessary for machining, between the working side of the machining belt and the workpiece. A drive arrangement, by way of which the carrier element can be motor-driven, is provided such that the carrier element moves substantially parallel to the direction of movement of the machining belt, at least in the working region of the machining belt.

Abstract: A glass edge finishing system, a belt assembly and a method are described herein for finishing an edge of a glass sheet. The glass edge finishing system comprises: (a) a base; and (b) one or more belt assemblies located on the base, where each belt assembly includes: (i) a support frame; (ii) a motor; (iii) a pair of pulleys rotatably mounted on the support frame and driven by the motor; (iv) a belt engaged to and driven by the pair of pulleys, where the belt contacts and finishes the edge of the glass sheet; (v) a belt cleaning device that removes glass debris from the belt as the belt moves past the belt cleaning device; and (vi) a cleaning containment enclosure within which there is located the belt cleaning device, where the cleaning containment enclosure contains the glass debris removed from the belt by the belt cleaning device.

Abstract: A method capable of quickly polishing an angular portion formed by a grinded back surface and a circumferential surface of a substrate without causing damages on the thin substrate is provided. The method includes rotating the substrate about its center, and pressing a polishing tape against the angular portion formed by the back surface and the circumferential surface of the substrate to polish the angular portion.

Abstract: A pressing device (50) for pressing cutting means onto circumferential surfaces (12) of substantially cylindrical workpiece portions (13) during a finishing operation is provided for pressing the cutting means onto a circumferential surface with a pressing force over a contact angle. The pressing device is steplessly adaptable for the machining of workpiece portions of differing diameters that have a diameter difference of at least 0.1 mm.

Abstract: The disclosure relates to a finishing apparatus for finish machining of rotationally symmetric workpiece surfaces having a finish belt guide which has a guiding body for guiding the finish belt, wherein the guiding body comprises a shell-like guiding surface along which the finish belt can be guided or is guided between an insertion end of the finish belt and a withdrawal end of the finish belt, wherein the guiding surface is mounted in a resiliently elastic manner in the radial direction, wherein, when seen in the circumferential direction, the guiding surface extends in a continuous manner between the insertion end of the finish belt and the withdrawal end of the finish belt over at least a part of the width of said guiding surface and is mounted in a resiliently elastic manner.

Abstract: A polishing apparatus polishes a periphery (a bevel portion, a notch portion, an edge-cut portion) of a substrate by bringing a polishing tool into sliding contact with the periphery of the substrate. The polishing apparatus includes a substrate holder configured to hold the substrate, and a polishing head configured to polish the periphery of the substrate held by the substrate holder using the polishing tool. The polishing head includes a press pad for pressing the polishing tool against the periphery of the substrate, and a linear motor configured to reciprocate the press pad.

Abstract: The present invention relates to a lining carrier for a sanding pad lining, in particular for use with a sanding pad for pressing sanding surfaces against workpieces in segment-belt and wide-belt sanding machines. Here, the lining carrier has at least one recess, in particular a groove.

Abstract: A method of form transfer grinding a three-dimensional shape utilizes a form transfer tool over which a belt is driven. The form transfer tool includes a shape that is desired in the finished part and guides a belt that grinds an area of a part to a finished or nearly finished condition.

Abstract: The invention relates to an orbital apparatus (20) for machining of a revolution metallic wall, of the type comprising a fixed annular plate (30) coaxially mounted on a universal support and having a peripheral annular electric collector (35) and an annular plate (50) rotationally mobile and coaxially mounted on the fixed annular plate (30). The mobile annular plate (50) carries a set of electrical contacts (55) cooperating with the electrical collector (35), means (60) for rotationally driving the plate (50), means (70) for machining the metallic wall and pneumatic feeder means (80) to apply and maintain the machining means (70) on the metallic wall.

Abstract: A belt sander includes a housing and an endless sanding belt supported by the housing. A first shaft is connected to the housing, and the housing is pivotable about the first shaft. A second shaft is connected to the housing and offset from the first shaft. The sander is mounted to the rotating portion of a rotary machining clam shell trackway and revolved around a pipe surface to be sanded while biasing the sander against the surface. The sander may also be pivotable to sand a tapered surface.

Abstract: The polishing apparatus has a polishing unit capable of polishing a peripheral portion of the substrate to form a right-angled cross section. The polishing apparatus includes: a substrate holder that holds and rotates the substrate; guide rollers that support a polishing tape; and a polishing head having a pressing member that presses an edge of the polishing tape against the peripheral portion of the substrate from above. The guide rollers are arranged such that the polishing tape extends parallel to a tangential direction of the substrate and a polishing surface of the polishing tape is parallel to a surface of the substrate. The substrate holder includes: a holding stage that holds the substrate; and a supporting stage that supports a lower surface of the peripheral portion of the substrate in its entirety. The supporting stage rotates in unison with the holding stage.

Abstract: A polishing apparatus polishes a periphery of a substrate. This polishing apparatus includes a rotary holding mechanism configured to hold the substrate horizontally and rotate the substrate, plural polishing head assemblies provided around the substrate, plural tape supplying and recovering mechanisms configured to supply polishing tapes to the plural polishing head assemblies and recover the polishing tapes from the plural polishing head assemblies, and plural moving mechanisms configured to move the plural polishing head assemblies in radial directions of the substrate held by the rotary holding mechanism. The tape supplying and recovering mechanisms are located outwardly of the plural polishing head assemblies in the radial directions of the substrate, and the tape supplying and recovering mechanisms are fixed in position.

Abstract: A method of form transfer grinding a three-dimensional shape utilizes a form transfer tool over which a belt is driven. The form transfer tool includes a shape that is desired in the finished part and guides a belt that grinds an area of a part to a finished or nearly finished condition.

Abstract: Disclosed herein is a wafer polishing device including: an abrasive member driving device adapted to run a belt-like abrasive member in a direction crossing an outer circumferential end-edge of a wafer which is a wafer to be polished while bringing a belt-like abrasive member into contact with outer circumferential end-edge of the wafer, the abrasive member having non-abrasive sections disposed on both sides of an abrasive grain section; and a guide member having two guide surfaces shaped to conform to the outer circumferential end-edge of the wafer, the two guide surface being adapted to press, from rear sides of the non-abrasive sections, the respective non-abrasive sections of the abrasive member run by the abrasive member driving device.

Abstract: A hair-line processing, and more particularly a sheet metal finished by continuous hair-line on its plane and curved surface, and apparatus and method for finishing by continuous hair-line on the same are disclosed, wherein the sandpaper curvaceously advances to form hairlines relative to curved surface of the sheet metal, and operation of a pressure unit can vary the curvaceous degree of the sandpaper to form a continuous hairline relative a sheet metal including curved surfaces each having a different curvature.

Abstract: A polishing system and associated methods are described for polishing a magnetic disk used in a disk drive system. The polishing system includes a polishing film that is used to polish the magnetic disk. The polishing system also includes an actuator operable to move the polishing film across a surface of the magnetic disk to polish the magnetic disk. The polishing system also includes a pad having at least one protrusion extending from a surface of the pad. The protrusion is configured to contact the polishing film and press the polishing film against the magnetic disk. The protrusion is operable to compress to about the surface of the pad when in contact with the polishing film. Once polishing is complete, the pad retracts from the polishing film and the protrusion extends from the pad, reducing the adhesion force between the pad and the polishing film.

Abstract: A pad for polishing media disks has an elastomeric body with a Shore A hardness of not greater than 20, and a coating of polystyrene (PS) and a flexible polymer. The elastomeric pad may comprise styrene-isoprene-styrene block copolymers, or a styrene-ethylene-butylene-styrene block copolymer. The pad may be viscoleastic with a particulate composite coating. The pad may be a styrenic block copolymer and the coating is a different type of styrenic block copolymer containing solid particles. The coating may have a binder with a mixture of PS and flexible styrenic block copolymers, and filler particles comprising cross-linked PS/divinylbenzene polymer microspheres.

Abstract: A wafer polishing apparatus includes a polishing tape extending between two guide rollers, a first surface of the polishing tape contacting a surface of a wafer to be polished, a polishing head including a pusher pad, the pusher pad adapted to push the polishing tape against the surface of the wafer to be polished, a color image sensor adjacent to the polishing tape, the color image sensor being adapted to detect a color image of the polishing tape and to output a signal corresponding to the detected color image, and a controller connected to the color image sensor, the controller being adapted to receive the signal output from the color image sensor and to determine when a color of the color image detected by the color image sensor changes, a change in the color image indicating a polishing end point.

Abstract: A device is described comprising: a segmented sanding pad having a plurality of segments, each segment having a longitudinal axis and corresponding to a respective contact roller having a longitudinal axis, wherein, when the sanding pad is moved obliquely, the segments align in accordance with a degree of oblique movement, characterized in that the longitudinal axes of the individual contact rollers and the respective segments are aligned with respect to each other when the gap between the segments is adjusted to the longitudinal axis of the contact rollers.

Abstract: A polishing apparatus is suitable for use in polishing a periphery of a substrate, such as a semiconductor wafer. The polishing apparatus includes a holding section configured to hold a workpiece and a polishing head configured to bring a polishing tape into contact with the workpiece. The polishing apparatus also includes a supply reel configured to supply the polishing tape to the polishing head, a rewind reel configured to rewind the polishing tape that has contacted the workpiece, and a swinging mechanism configured to cause the polishing head to perform a swinging motion with its pivot at a predetermined point.