iNEMI Webinar: Creep Corrosion Testing

Creep corrosion is the corrosion of metallization and the migration of that corrosion across printed circuit board (PCB) surfaces. Problems arise when the corrosion migrates to such an extent that it bridges features on PCBs, causing electrical short circuits. The elimination of lead in electronics and the expansion of markets in regions such as Asia, where environments are often humid and/or have high levels of sulfur-bearing pollution, has brought corrosion-related failures to the forefront in recent years.

The iNEMI Qualification Test Development for Creep Corrosion project team has developed an innovative flowers-of-sulfur (FoS) corrosion test that is inexpensive, easy to maintain and can be used to determine whether printed circuit board assemblies are likely to develop creep corrosion. The test has been very successful in accurately reproducing creep corrosion on PCBs and has the potential to be used as a general-purpose corrosion chamber for material and technology development to mitigate corrosion failures.

Join us for a free webinar— which is open to industry — to review the iNEMI team’s development of this innovative FoS test and discuss its adoption by the electronics manufacturing industry. Two sessions are scheduled:

iNEMI White Paper Now Available

If you are unable to join us for one of the webinars, check out the recently published white paper, “A Cost-Effective & Convenient Approach to Creep Corrosion Testing.” It highlights some of the key findings from the iNEMI team’s extensive testing, describes the FoS test chamber developed by the team and discusses how the chamber is used.

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