Soldering

Reflow Soldering

Reflow soldering is one of the easiest and most cost-effective ways of soldering components onto a printed circuit board.

Once the components have been lined up on the board in the correct position, a small amount of solder paste is applied to temporarily attach the electronic parts to their connecting pads. From this, the entire board is placed into a specialist reflow oven and subjected to a controlled heat, which melts the paste, securing each component in place and creating a permanent joint.

This process is the most common form of soldering and can be used for both conventional and surface mount assemblies.

We do the majority of our soldering with the aid of our ERSA Hotflow oven. This specialist reflow oven features four vertical heated zones and both top and bottom heaters, which helps create a smooth and secure solder without damaging or overheating either board or component.

The Hotflow oven can also accommodate a variety of board sizes and its speed can also be adjusted, which can help speed up production times without impacting quality.

Wave flow Soldering

Predominantly used for high volume production runs, wave flow soldering is a process that quickly and securely onto the board during assembly.

The procedure gains its name from the ‘wave’ of solder that the board and parts pass over. By mounting the components in this manner, the entire soldering process can take just a matter of seconds and is exponentially quicker than having each part manually soldered onto the board.

As well as cutting down production time, wave flow soldering offers a higher degree of accuracy and produces joints with a high degree of reliability.

Wave flow soldering can be used for through-hole (conventional) and surface mount assemblies alike.

At DJ Assembly, we can offer a RoHS compliant wave flow soldering process for large production runs.

All of our work is carried out by IPC-trained professionals and is done at our manufacturing facilities in York.