Title (de)

Title (fr)

Publication

Application

Priority

EP 94921509 A 19940713

US 9201293 A 19930715

Abstract (en)

[origin: WO9502499A1] A package (10) for a memory card (28) and the process by which the package is manufactured. The package comprises chiefly two stamped steel covers, (an upper (12) and a lower cover (14) half), each secured to a plastic frame element (16 and 18). The cover halves (16 and 18) are secured by extended fingers (26) which wrap around the plastic frame (16 and 18). This provides a double layer of metal at the perimeter of the frame. The two cover halves (12 and 14) are situated so as to encapsulate the subject PCB (28) and to affix it in its proper position. The two cover halves (12 and 14) are then welded together using sonic welding on the plastic frame. The package (10) has been designed to meet all PCMCIA standards, including polarizing keys and grounding points.