Silver-Filled Epoxy Adhesive/Sealant

Developed for rigorous bonding and sealing in demanding manufacturing applications, Master Bond EP3HTSMED epoxy system features a rapid cure schedule and a tensile shear strength exceeding 1,000 psi. It is 100% reactive and fully meets USP Class VI requirements for medical applications.

This silver-filled epoxy adhesive/sealant has remarkable electrical conductivity with a volume resistivity less than 0.001 ohm cm. Serviceable over the wide temperature range of -60°F to 400°F, EP3HTSMED is resistant to severe thermal cycling and many chemicals including water, fuels, oil, and most organic solvents.
EP3HTSMED is a thixotropic paste and has a specific gravity of 2.90 at 77°F. It requires no mixing and needs only contact pressure during a simple heat cure of 20 to 40 minutes at 300°F or 40 to 90 minutes at 250°F.

With minimal shrinkage during cure and a Shore D hardness of 60 to 80, EP3HTSMED bonds well to a variety of substrates including metals, glass, vulcanized rubbers, ceramics, and many plastics.
Silver in color, this one component adhesive is packaged in syringes or glass jars. EP3HTSMED has a shelf life of 6 months in a glass jar and a shelf life 3 months when stored in a syringe at room temperature.

Similar Products

Master Bond EP21TPFL-1AO is an electrically insulative, two part epoxy polysulfide system with a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m·K)]. As a polysulfide based system, it has very good chemical resistance, particularly to fuels, ...

Featuring special high thermal conductive fillers, Master Bond EP48TC is two part epoxy paste that can be applied in bond lines as thin as 10-15 microns. This material offers exceptionally low thermal resistance of 5-7 x 10-6 K•m2/W, which imparts impressi...

Master Bond EP62-1LPSP delivers an array of strength, electrical and handling properties that are well suited for bonding, sealing, coating and encapsulation applications. With a tensile lap shear strength exceeding 2,000 psi, it bonds well to a variety...

Connect

Company Whitepapers

Epoxies are versatile polymer systems that are “go-to materials” for electrical, electronic and microelectronic systems, especially in applications where outstanding electrical insulation properties are needed. Their wide usage is due to their excellent ad...

Many of today’s intricate electronic assemblies are highly sensitive to the effects of temperature excursions, shock and vibration. An effective design strategy for managing thermal stress is to use ...

Too hot, too cold or just right? it’s not just a question for Goldilocks. Engineers have to be even better judges of temperature when they select a materials system for the job at hand. And those jobs increasingly involve temperature conditions that are be...

Breakthroughs in adhesive technology enable light curing adhesives to cure under a visible light wavelength of 405 nanometers. Learn how these environmentally friendly adhesives can improve worker safety and lower production costs while offering a range...

Master Bond Inc. formulates a comprehensive range of epoxies, silicones and polysulfides to
meet the increasing demanding requirements of the oil and chemical processing industry,
specifically in areas such as:

Learn about the different functions epoxies perform in the manufacture and assembly of today’s electronic systems. From nanotechnology to enormous space systems, these versatile compounds meet a wide variety of conditions, lending to the reliability and...

Thermal cycling can create stresses on bonded parts that fluctuate vastly between different temperatures, from extreme cold to extreme heat, during regular intervals or on an intermittent basis. Adhesives have a proven track record for thermal applications...

Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today’s electronic circuitry. In tandem with the great growth of the technological sector comes the need for a new generation of innovat...

Adhesive products have different ease-of-use characteristics. Some must be precisely weighed and mixed prior touse. Some need a carefully controlled heat cycle to cure properly. Some have a precarious pot life. Some offer a narrow window of open time. And ...

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performa...

Silicone adhesive systems have several important performance characteristics that distinguish them from other adhesive families. Learn more about their unique combination of flexibility, high temperature resistance, and more specialized enginee...

Structural bonding is defined as the process of joining partstogether
using an adhesive as opposed to conventionalmechanical fasteners or
assembly methods such as soldering,brazing, or welding. Structural
adhesives are substancescapable of holding and bond...