Announced during Bandai's 2015 theme Gunpla 35th REVIVE presentation at the event is the upcoming GUNPLA BATTLE PROJECT type 絆 (Bond) contest in 2015 hosted by both Bandai and Bandai Namco Games.

This contest will gather mobile suit design entries submitted during the entry period in 2015, and the winning mobile suit designs will be announce in November 2015. The winning mobile suit designs will be made as playable units in the popular Japanese arcade game Mobile Suit Gundam Senjo no Kizuna (Bonds of the Battlefield).

A 90 sec promo video of the upcoming Mobile Suit Gundam THE ORIGIN I OVA series was shown during a live Bandai presentation. The presentation also included the introduction of the first 2 gunpla release from this series.