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Abstract

A method to apply solder in a high density pad area on a printed circuit board is described. One of the major efforts in today's electronics industry is to develop high circuit density components. There is no existing established method for reworking the component at the assembly level. The difficulties arise after the substrate gets removed. There is no way to reapply solder on the pads in the removed module area. The method consists basically of two parts: 1. Vacuum pulling and dropping system 2. Pin array As indicated in the figure, the pin array 11 is used to register the solder rings 12. When the vacuum is pulled, solder rings are lifted from the cartridge, inside the cartridge holder onto the registration pins.

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United States

Language

English (United States)

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Vacuum Solder Ring Application Fixture

A method to apply solder in a high density pad area on a
printed circuit board is described. One of the major efforts in
today's electronics industry is to develop high circuit density
components. There is no existing established method for reworking
the component at the assembly level. The difficulties arise after
the substrate gets removed. There is no way to reapply solder on the
pads in the removed module area.
The method consists basically of two parts:

1. Vacuum pulling and dropping system

2. Pin array As indicated in the figure, the pin array 11 is
used to register the solder rings 12. When the vacuum is pulled,
solder rings are lifted from the cartridge, inside the cartridge
holder onto the registration pins. The location of the registration
pins matches that of the pad pattern on the printed circuit board
(PCB). Thus, when the pin array vacuum block is moved onto the
corresponding pad area, the vacuum is then turned off. The solder
ring will sit on the corresponding pad and form a good seat for the
C-4 solder ball on the new component. Flux can be used in the module
area on the board to enhance the adhesion of the solder ring. The
pins are designed so that the solder ring will plug up the hole of
the pin array vacuum block once the vacuum is pulled. Thus, only one
ring gets picked up in each hole when the vacuum is turned on.