Metalink demos Ethernet first-mile chips at SuperComm

LONDON  Broadband access chip set specialist Metalink (Yakum, Israel) will demonstrate at next week's SuperComm what it said is the first combined Ethernet over SHDSL (EoSHDSL) and Ethernet over VDSL network using its devices and targeting Ethernet-in-the-first-mile applications.

Metalink's EoSHDSL 10 Mbit/s service configuration includes four pairs carrying 2.5 Mbit/s, each using PAM 16 modulation, or three pairs carrying 3.3 Mbit/s, each using PAM 32 modulation. The chip set makes use of enhanced bit rates that comply with the evolving G.SHDSL.bis ITU-T standard, and channel bundling already defined for four-pair wire applications.

This has been specified to carry full Ethernet speed to a distance of 12 kft (4 km) or greater, maximizing the coverage of Ethernet services deployment over copper networks.

The company said its EoVDSL technology achieves better spectrum efficiencies by adopting the latest additions to the VDSL QAM standards specifications and enables bit rates of 60 Mbit/s downstream and 40 Mbit/s upstream. The platform enables the delivery of Ethernet over either SHDSL or VDSL using the same architecture.

Howard Frazier, chairman of the IEEE 802.3ah EFM Task Force said "I am encouraged to see the introduction of new solutions supporting Ethernet in the first-mile applications. The support of long and short reach EFM copper technologies is a key contributor to the success of broadband Ethernet access evolution and the acceleration of broadband Ethernet deployment over public networks worldwide."