Overview

Features

The HSMS-282x family of schottky diodes are the best all-round choice for most applications. These products featuring low series resistance, low forward voltage at all current levels, and good RF characteristics. Applications include clamping, low frequency mixers, biased detectors, and large signal zero bias detectors. VBR=15 V, Ct=1.0pF, RD=10 Ohms, Vf @ 1 mA=340 mV

All Avago Technologies Surface Mount LEDs as stated in the attachment will have humidity indicator card and JEDEC moisture sensitive label on the moisture barrier bag. Please check full PCN document for more details and affected parts.

This change is being made to increase production capacity and improve customer deliveries. In the line of
zero defects, the conversion to laser marking will present better process and quality controls within
manufacturing. The SOT-323 and SOT-363 Surface Mount RF/mW Schottky and PIN Diodes are already being
laser marked. This change together with the future conversion of SOT-23 and 143 PIN diodes and other
products to laser mark will further standardize the whole line of Hewlett-Packard Surface Mount products.

SOT-23 and SOT-143 Diodes will no longer use option "#L30" to denote bulk packaging, and will no longer use
option "#L31" to denote tape-and-reel packaging. These options will be replaced by "-BLK" and "-TR1",
respectively. The marking on the diodes themselves will not change.

The following manufacturing processes will be transferred from the HP Malaysia manufacturing site to a Malaysian subcontractor. The subcontractor will be using HP equipment and procedures: Deflash, Lead Forming, Post Mold Cure, Marking & Curing, Dejunk/Dedambar, Singulation. This change will ensure optimum utilization of manufacturing capacity.

Several changes have been planned: (1) The manufacturing wafer fab location will be moving from San Jose, CA to Newark, CA, (2) The die size will be changed from 12 mil (300) by 12 mil (300) to 8 mil (200) by 8 mil (200), (3) The active area of the device will be move below the bonding pad (instead of being offset), (4) The nitride scratch protection layer will be removed.

While models in this library reflect close similarity to device performance, simulation is only a supplement to lab evaluation. Model performance in general will reflect typical specs for a device, but some aspects of performance may not be modeled fully. Care has been taken in their preparation, however, we cannot be responsible for correct application on any and all computer systems. Avago Technologies reserves the right to improve these models without prior notice. Refer to the datasheet for guaranteed performance and design guidelines.

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Language: English

02/25/2000

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