The Qualcomm RF360 solution is designed to reduce power consumption and improve radio performance while reducing the RF front-end footprint inside of a smartphone by up to 50 percent compared to the current generation of devices.

Additionally, the solution reduces design complexity and development costs, allowing OEM customers to develop new multiband, multimode LTE products faster and more efficiently.

Band fragmentation is the biggest obstacle to designing global LTE devices, with 40 cellular radio bands worldwide, according to Qualcomm.

The Qualcomm RF solution comprises a family of chips designed to mitigate this problem while improving RF performance and helping OEMs more easily develop multiband, multimode mobile devices supporting all seven cellular modes, including LTE-FDD, LTE-TDD, WCDMA, EV-DO, CDMA 1x, TD-SCDMA and GSM/EDGE.

June 12, 2013 -- Reporter Tierney Plumb speaks with Tim McDonough, vice president of marketing for Qualcomm CDMA Technologies, about the latest technologies at the E3 Expo at the Los Angeles Convention Center on Wednesday.