MRSI Systems

MRSI Systems, part of Mycronic Group, is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer “one-stop-shop” solutions for research and development, low-to-medium volume production, and high volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on- carrier (CoC), PCB, and gold-box packaging. For more information visit www.mrsisystems.com.

Press Releases

STOCKHOLM, Aug 29, 2018 -- MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3 micrometer high speed die bonder which will be the first of its kind to address the multi-die and multi-process requirements, delivering industry leading throughput, superior flexibility, and future-proven 3 micrometer placement accuracy.

The MRSI-H3TO is tailored for WDM/EML-TO or other multi-die multi-processing TO-can photonic devices to support the upcoming 5G wireless network. It enables our photonics customers to meet their manufacturing challenges, by allowing them to stay competitive in this high volume and high mix production environment.

The upcoming 5G wireless deployment will need higher bandwidth in signal transportation through front-haul and back-haul fiber optic systems within the fiber-to-home / premise network. As a result, WDM & EML types of lasers and other multi-die optical receivers in TO-can packages are required. These new TO-can based devices demand a new class of high speed die bonder that is capable of multi-die and multi-process production in one machine, in order to achieve the best throughput.

The new MRSI-H3TO builds on the key technological building blocks featured in our field proven high speed MRSI-HVM3 platform including a dual-head motion system that performs TO pick-and-place/handling and die bonding in parallel. In addition it encompasses our on the "on-the-fly" auto tool changer that has twelve vacuum tips/collets integrated on the bonding head for zero time tool change between dies.

"The new MRSI-H3TO is exactly the type of die bonder our customers were demanding to manufacture the next generation of TO-can photonic devices, such as WDM & EML-TOs. It has the industry leading throughput without sacrificing flexibility, accuracy or reliability," states Dr. Yi Qian, Vice President of Product Management of MRSI Systems. "MRSI is pleased to meet the new market needs to support 5G wireless deployment with the launch of our new high speed, flexible die bonder for high volume manufacturing of TO-can based photonic packaging," said Mr. Michael Chalsen, President of MRSI Systems.

MRSI Systems is exhibiting at China International Optoelectronic Expo (CIOE) with our partner CYCAD Century Science and Technology (Booth #1C66) in Shenzhen, September 5-8, 2018 and ECOC (Booth #577) in Rome, Italy, September 24-26, 2018.

BILLERICA, Massachusetts, Aug. 29, 2018 -- MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer configurations for active optical cable (AOC), gold-box packaging, and other applications in addition to chip-on-carrier (CoC).

This expansion is in response to our customer's request to take advantage of the field-proven performance of the flexible high speed MRSI-HVM3 platform, for their other essential packaging applications in photonics manufacturing which are high volume and high mix by nature.

The new MRSI-HVM3P is the first major extension to the HVM3 family, equipped with inline conveyor for single fixture or multiple cassette inputs that can automatically transport large forms of carriers of the dies. This configuration is targeted at AOC or similar die-to-printed circuit board (PCB) applications, gold-box packaging, and CoC in fixture. The processes include eutectic, epoxy stamping, UV epoxy dispensing, and in-situ UV curing.

"With these extensions to our successful HVM3 platform, MRSI Systems is now able to offer flexible high volume die bonding solutions, not just for CoC, but also for PCB and box levels of packaging to our customers in photonics, sensors and other advanced technology fields," said Dr. Yi Qian, Vice President of Product Management of MRSI Systems. "This is another demonstration of MRSI's commitment to provide critical solutions promptly in response to our customers' needs," concluded Mr. Michael Chalsen, President of MRSI Systems.

Both MRSI-HVM3 and MRSI-HVM3P now carry the following options inherited from our long proven MRSI-M3 family: localized heating, flip-chip bonding, and co-planarity bonding. These options are increasingly critical for new applications such as 400G transceivers and silicon photonics.

The launch of the MRSI-HVM3P builds on the success of our first configuration launched last year, the MRSI-HVM3 for CoC, Chip-on-Submount (CoS), and Chip-on-Baseplate (CoB) assembly using eutectic and/or epoxy stamping die bonding, which has proved to be the best-in-class die bonder with the leading speed, zero-time tool change between dies, and <3 micrometer accuracy. The superior performance was enabled by dual head, dual stage, integrated "on-the-fly" tool changer, ultrafast eutectic stage, and multi-levels of parallel processing optimizations (see product launch press release August 14, 2017).

MRSI Systems is exhibiting at China International Optoelectronic Expo (CIOE) with our partner CYCAD Century Science and Technology (Booth #1C66) in Shenzhen, September 5-8, 2018 and ECOC (Booth #577) in Rome, Italy, September 24-26, 2018.

This offers existing and prospective customers in China the opportunity to review the detailed performance capability of the MRSI-HVM3 in a local setting, supported by MRSI's world-class local application engineers for a quick turn-around of product demonstration and die bonding sample building. The MRSI-HVM3 product family delivers industry-leading speed, future-proof high precision (<3 micrometers), and superior flexibility for true multi-process, multi-chip, high-volume production. The superior performance is enabled by dual head, dual stage, integrated "on-the-fly" tool changer, ultrafast eutectic stage, and multi-levels of parallel processing optimizations.

The MRSI-HVM3 is designed for specific applications including Chip-on-Carrier (CoC), Chip-on-Submount (CoS), and Chip-on-Baseplate (CoB) assembly using eutectic and/or epoxy stamping die bonding. This also provides great opportunities to discuss with MRSI's local process experts for solutions within the extended product configurations of HVM3e, HVM3P, H3TO, and H3LD. These configurations are based upon the same design as HVM3 but configured specifically for local top heating, inline conveyor CoB, AOC and gold-box packaging, WDM & EML TO-can packaging and high power laser diode packaging, respectively.

Our customers need to scale up manufacturing capacity quickly to meet increasing business demands, recently driven by data center applications, telecommunication upgrades to 100G+, 5G wireless, and advanced optical sensors. Our new MRSI-HVM3 high speed, high precision, flexible, 3 micron die bonder, has been built to target this challenge. Today, high volume manufacturing of photonic, sensor, and semiconductor devices demands an automatic die bonding system that can deliver industry leading throughput without sacrificing high precision and superior flexibility.

MRSI-HVM3 leverages a well-defined set of MRSI core competencies, built up over 30 years, in system design, software development, machine vision, motion control, and industrial automation. Equipped with ultrafast-ramp eutectic stations, it deploys multiple levels of parallel processing utilizing dual gantries, dual heads, dual bonding stages, and “on-the-fly” tool changes. Used across all products, MRSI’s software platform makes it easy for users to change process settings on their own for new parts, new processes, and new products. These features provide our customers with best-in-class throughput for capacity expansion; high accuracy for high-density packaging; and unmatched flexibility for multi-chip multi-process production in one machine and manufacturing line optimization. Ultimately this system will enable customers to generate a great return on investment.

MRSI M-Series, 1-3 Micron Die Bonders

The MRSI M-Series, 1-3-Micron Die Bonders set the industry standard for ultra-precision, high-complexity die attach in high volume production environments.... More Info Less Info

The MRSI-M3 3-Micron Die Bonder sets the industry standard for ultra-precision, high-complexity die attach in high volume production environments. With features such as force control, ultra precise placements, and 360° die orientation, the MRSI-M3 die bonder ensures high yields, high quality and high reliability in advanced packaging.

From small dies to large sensors, the MRSI-M3 3-micron die bonder provides all the capability and flexibility to assemble the most advanced packages, without compromising on manufacturing efficiency, quality and reliability.

MRSI-705 5-Micron Die Bonder

The MRSI-705 5-Micron Die Bonder sets the mark for high-precision, high-speed component assembly. Engineered for manufacturing robustness, the MRSI-705 is a flexible configurable platform.... More Info Less Info

The MRSI-705 5-Micron Die Bonder sets the mark for high-precision, high-speed component assembly. Engineered for manufacturing robustness, the MRSI-705 is a flexible configurable platform, with the largest installed base in the industry in advanced packaging. Applications are found across a wide range of market segments, such as life & health sciences, aerospace, defense, automotive, lighting, communications, and more.

The MRSI-705 is built to meet the highest standards of reliability and dependability. It starts with an award-winning, industry standard platform with a day-in/day-out accuracy of 5 microns; achieved by leveraging the platform’s signature design features:

A solid granite platform supports the placement head from above, so that no mechanisms are cantilevered. All of this makes the MRSI-705 thermally and mechanically stable with extremely fast settling times and +/- 5 microns or better placement accuracy, a requirement for critical applications.
Minimized number of moving mechanical parts.
The major system X Y axes use zero force, ironless, actively cooled linear motors with high resolution linear encoders. Encoder scales have 0.1-micron resolution for fast, precise, closed-loop positioning. The linear motors deliver faster speeds (acceleration, deceleration and velocity), with better settling times and overall smoother motion.
Reliability is enhanced through the use of advanced air-bearing technology in the Z axis.

Benefits:

The MRSI-705 produces the following compelling business outcomes for customers:

Strongest ROIs in the industry – A well-established platform with an unmatched Cost of Ownership. Lifts up overall production efficiency.

Extended Machine Lifetime – Exceptional performance over time. Upgrade paths as new features are introduced.