Embedded computing OEMs are seeking ways to shorten their design cycles and save precious space inside their systems. Biwin, an industry leader in flash storage products, today announced an e-MMC SSD in a 169-ball BGA chip that addresses both those demands, enabling customers to design in a complete storage solution on a single chip with an industry standard interface.

Biwin's new e-MMC SSDs are offered in capacities from 2 GB to 64 GB. They integrate both flash and a full SSD controller into a single chip, featuring advanced SSD features such as ECC, wear leveling and bad block management. They also include two key new features for embedded memory applications: power-on boot and explicit sleep mode, which translate to significant benefits for the end-user.

Power-on boot defines a way for the boot-code to be accessed by the host controller without an upper-level software driver, speeding the time it takes for a controller to access the boot code. Explicit sleep mode enables the host controller to directly instruct e-MMC to enter power-saving sleep mode - an enhancement that has an immediate positive impact on power efficiency. These JEDEC compatible, e-MMC v4.4 compliant SSDs are ideal for use in a plethora of mobile gadgets requiring a ready-made storage solution.

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"These e-MMC SSDs leverage Biwin's core strengths in chip packaging and SSD design, and are produced in Biwin's own factory. SSD-on-a-chip technology will help embedded customers shorten their design cycles and get to market faster with new products, while offering a reliable long-range storage solution." - Joe James, Vice President of Worldwide Marketing, Biwin America.