nanoFIS 2017 - Main Topics

nanoFIS 2017 - Main Topics

Sophisticated sensors and devices based on Key Enabling Technologies ranging from nanotechnology, micro- and nanoelectronics to photonics, are presently being developed in many R&D labs worldwide for future high-performance products. 3D heterogeneous integration with CMOS-technology is the key for product implementation of those devices and for realizing complex integrated systems with significantly advanced functionalities. This integrated system approach is an essential element of the More-than-Moore Grand Challenge and is expected to create future business opportunities for European semiconductor industries.

ADVANCED FUNCTIONAL MATERIALSincluding materials such as

Nanowires, Carbon Nanotubes, Nanorods, Quantum Dots & Nanoparticles

2D-Materials (Graphene, MoS2, MnS2, WS2,…)

Electroceramic and Metal Oxide Materials

Organic and flexible Electronic Materials

Photonic Materials

NANODEVICES & NANOSYSTEMSincluding devices and systems such as

Nanowires, Carbon Nanotubes and Nanoparticles based Devices

Nanosensors and Quantum Sensors

2D-Material based Devices

Chemical and Particle Nanosensors

Nanoresonators & Nanogenerators

Nano Energy Harvesting & Energy Storage

Nanophotonic Devices

MEMS & NEMS Devices

Nanodevice Architecture & Design

SYSTEM INTEGRATION & PACKAGINGincluding technologies such as

Heterogeneous Integration

TSV Technologies and TVS based Devices

3D-Integration, 3D SoC and SiP Solutions

Advanced Wafer Bonding Technologies (W2W, D2W,…)

High Performance Integration

NANOANALYTICS & RELIABILITYincluding

Reliability Issues of Nanomaterials, Nanodevices and Nanosystems

Nanoanalytical Methods and Quantum Metrology

Material Properties Characterization in nm- and µm-Scale

Advanced Material Modelling and Simulation

Statistical Models for short, mid and long term Reliability Prediction