Post Japan based Renesas Electronics aquisition, the hatchet is on its own LTE design teams across the globe. The layoff started last week in San Diego, as well as in New Jersey, Colorado and India, sources say.

The figure could go substantially higher because the company expects to cut roughly $45 million in operating expenses relating to the deal between now and the next 12 months.

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Femtocells are small, low power cellular base stations that extend coverage indoors where signals are weak. Broadcom Corp. has signed a definitive agreement to acquire Percello Ltd., a privately-held company that develops system-on-a-chip (SoC) solutions for femtocells, for $86 million in cash.

Broadcom recently announced a single-chip HSUPA baseband processor that integrates key 3G mobile technologies and will improve smartphone performance and features. It also added that the processor is the first to combine high-speed upstream package applications with 3G connectivity and built-in graphics processing. Built with an integrated ARM11 core and capable of running Google's Android and Microsoft Windows Mobile, the BCM21553 baseband chip could pave the way for cheaper but much more sophisticated handsets. Other features include 5.8Mbps upstream and 7.2Mbps downstream bandwidth.

The official news is out!Broadcom has just announced a monolithic digital CMOS mobile TV receiver/demodulator, that reduces power consumption by up to 40 percent and physical dimensions by up to 30 percent from current handset design budgets. Designed for global digital TV reception on portable devices, the BCM2940 chip supports VHF III, UHF IV and V bands. It also supports the EU/US L-bands and integrates a 4-Mb MPE-FEC SRAM to handle DVB-H parallel/consecutive streams and services. The chip offers various physical interfaces including SPI, SDIO and USB 2.0.

Ok that sound great and appetizing, but is there a Market really?Sometime ago TI came up with its own single-chip DVB-H receiver, called the Hollywood using a 90-nm technology, but the company hasn't announced any major design wins.ST put its project on the back burner more than a year ago.Now noise from NXP or Infineon!!!!!!!

Infineon given it recent track record and recent aquisitions i would not be surprised if they throw one in pretty soon :-) it is more a speculation than prediction.Lets wait and watch and do Read on... this article on EE Times..

The new vice president of your company has set up a contest for ideas to reduce leakage power in the next generation of chips that the company fabricates. The prize for the person who submits the suggestion that makes the best tradeoff between leakage power and other design goals is to have a door installed on their cube. What is your door-winning idea, and what tradeoffs will your idea require in order to achieve the reduction in leakage power?

You're on the functional validation team for a chip that will control a simple portable CD-player. Your task is to create a plan for the functional validation for the signals in the entity cd digital. You've been told that the player behaves "just like all of the other CD players out there". If your test plan requires knowledge about any potential non-standard features or behaviour, you'll need to document your assumptions.

Describe five tests that you would run as soon as the VHDL code is simulatable. For each test: describe what your specification, stimulus, and check. Summarize the why your collection of tests should be the first tests that are run.

Describe five corner-cases or boundary conditions, and explain the role of corner cases and boundary conditions in functional validation.

Possible Solutions in order:

Increase transistor size so as to increase threshold voltage. This will require an increase in supply voltage, which will likely increase total power.