The series S114 Surface Mount Centigrid® Relay is an ultraminiature, hermetically sealed, armature relay. The low profile height (0.360") and 0.100" lead spacing make it ideal for applications where extreme packaging density and/or close PC board spacing are required. The specially formed leads are pre-tinned to make the relays ideal for most types of surface mount solder reflow processes. The basic design and internal construction are identical to the series 114 Centigrid® relays, and are capable of meeting Teledyne Relay's T2R® requirements.