An increasing number of applications such as automotive engine management require electronic systems which operate reliably at temperatures above 150°C. Designers are facing the challenges of dealing with changes in electrical characteristics, higher leakage current and thermally accelerated degradation.This webinar looks at the device physics, electrical properties of MOSFETs and NVMs, and degradation mechanisms at elevated temperatures up to 200°C. It will discuss the behaviour of CMOS when it is operated at higher temperatures and how the issues which arise can be mitigated by process architecture and design techniques. In addition, X-FAB’s broad portfolio of bulk and SOI CMOS processes for use at high temperatures up to 225°C will be presented.

To meet stringent quality requirements like 0 ppm, it's essential to build in robust quality and verify it during product design development. This webinar will review the impact of manufacturing variations and tolerances in semiconductor processes for zero-failure-quality targets. It will introduce countermeasures like six-sigma design practice, design centering, robustness indicator figures (RIF) and statistical reliability modeling. Quality verification and robustness validation concepts will be discussed, as well as selected quality assurance methods that can be applied in the manufacturing chain.

First-time-right in analog design depends not only on proper consideration of process variations and design sensitivities but also on device reliability. Device aging can jeopardize performance and long-term product success and therefore should be taken into account as early as possible in the development. This webinar provides an overview of reliability physics and considerations and gives guidance on reliability conscious circuit design. Critical issues are discussed and future options for a reliability-aware design flow are indicated.

The XH035 series is X-FAB’s 0.35-micron Modular RF capable Mixed Signal Technology. Main target applications are standard cell, semi-custom and full custom designs for Industrial, Automotive and Telecommunication products. Based on a single poly, triple metal 0.35-micron drawn gate length process for digital applications, process modules are available such as embedded Non-Volatile Memory, high voltage options, as well as standard or thick fourth layer metal, double-poly and MIM capacitor and high resistance polysilicon.

Is there magic that makes analog designs successful? How can designs achieve ESD (electro-static discharge) specifications? Do DFM methods make designs more robust? This webinar answers these questions and provides tips & tricks for analog design.

This webinar session provides guidance through the EDA environment and describes the interaction among EDA tools, design methodology and PDKs to optimize the design process. It uses selected reference flows and best practice examples for critical components during the design phase.

The XP018 series is X-FAB’s 0.18 micron Modular Mixed Signal CMOS High Performance Analog Mixed-Signal Technology. Based upon the industrial standard single poly with up to six metal layers 0.18-micron drawn gate length N-well process, integrated with high voltage and Non-Volatile-Memory modules, the platform is engineered for applications needing an integrated solution and cost efficient process for high performance analog ICs. Targeted applications are switching applications, lighting, display, etc; operating in temperature range of -40 to 175 °C.

The XH018 series is X-FAB’s 0.18 micron Modular Mixed Signal HV CMOS Technology. Based upon the industrial standard single poly with up to six metal layers 0.18 micron drawn gate length N-well process, integrated with highvoltage and Non-Volatile-Memory modules, the platform is ideal for SOC applications in the automotive market, as well as emdedded high-voltage applications in the communications, consumer and industrial market.Comprehensive design rules, precise SPICE models, analog and digital libraries, IPs and development kits support the process for major EDA vendors.

The XU035 series is X-FAB’s 0.35-micrometer Modular 700V Ultra-High-Voltage (UHV) Technology. Based upon the standard 1P3M process with single 5V gate oxide, 0.35-micron drawn gate length and metal design rules, the platform is engineered for applications needing an integrated power and startup device solution.

A study on the effect of process fabrication for MIM capacitors analog matching performance was carried out, impacts from the MIM dielectrics, capacitor top and bottom metal materials, capacitor metal etch, wet cleaning, annealing process will be revealed by comparing the Pelgrom coefficients, i.e. the dependence of difference in capacitance of the matching pairs with respect to their corresponding square root of capacitor areas, the smaller the difference the better the matching.