The mobile industry is definitely outpacing the manufacturing progress of both GPUs and CPUs and this is not going to change anytime soon. Apple lead the industry with millions of 7nm A12 SoCs, Huawei and Qualcomm are joining in, while the PC industry will get them slightly later with much smaller volumes and with the help of small AMD.

There is one big change that is happening in the manufacturing equipment industry and ARM used its ARMTechCon to educate us about the big change. Drew Henry, SVP of infrastructure at ARM, pointed out in its presentation that ARM silicon wafer production ends up in 35 million wafers.

Miguel Nunes, a senior director of product management at Qualcomm, took the stage at one of the ARM TechCon presentations and shared details about the 2019 always connected Snapdragon PC. ACPC stands for Always connected PC.

Drew Henry, an SVP and the general manager of the infrastructure line of business at ARM, went on stage at the San Jose ARM Tech 2018 conference and revealed a new roadmap featuring new codenames and plans all the way to 5nm Poseidon core in 2021. It will be branded as Neoverse.