After growing fast since Infineon's strong push for eWLB technology
commercialization, the FOWLP market activity reached the $100M market
valuation last year. This young industry will need to wait for the 2015
- 2016 time frame to reach $200M market as the demand will shift from
IDMs to leading fab-less wireless IC players (such as Qualcomm (News - Alert),
Broadcom, Mediatek, etc) and will be supported by the solid
infrastructure of top 4' major assembly houses.

TWO MAIN OSATs SUPPORTING FOWLP INFRASTRUCTURE TODAY. FOUR MORE PLAYERS
TO COME NEXT!

FOWLP is clearly the Middle-end platform of choice for packaging
assembly & test OSAT' suppliers f the IC industry, as all implies a
simplification and consolidation of the entire packaging, assembly &
test and supply chain inside one single factory.

Meanwhile, the embedded die in package industry has taken a giant step
forward in 2011 since AT&S (AT) and TI (US) started the
commercialization of microSiP DC/DC converter modules with critical mass
volume, production of >100M units this year, driven by the mobile
market. Rohm (JP) and Epcos-TDK (JP) would be the second source of the
same microSiP power conversion module in the mobile handset supply chain
of RIM (CA (News - Alert)). IC substrate suppliers Taiyo-Yuden (JP) and Fujikura (JP)
are also getting ready to ramp-up their internal assembly lines for
embedded die packaging. This will bring the total number of players to 4
in the near future, with separate supply chains able to support the
embedded die in package technology commercialization.