Lid Attach

APPLICATION NOTE :
SEC & SEC40 Package Covers

Cover Attachment Procedure. Lids supplied with the SEC packages are ceramic with an attached epoxy preform. The epoxy coated ceramic lids should be stored in a clean, dry environment. Covers have a shelf life of 6 months if stored at room temperature, and a shelf life of 12 months, if stored at +5°C, or lower (refrigerated). Ceramic lids are installed using the following steps:

1. Preheat oven to 150°C.
2. Allow lids to warm up to room temperature;
3. Handle lids with tweezers or finger cots in a clean area to avoid contamination;
4. Position cover on the package and secure with a spring clip, or weight (approximately 2 pounds of weight or clamp force);
5. Cure clamped parts for 15 minutes (at temperature) in the 150°C oven;
6. Remove the assembly from the oven and remove clips.

Cleaning of ceramic lids before assembly is not recommended!

For further assistance, contact Applications Engineering @ 858-569-5000, or by e-mail at Applications@StratEdge.com

Package Assembly

APPLICATION NOTE :
SEC & SEC40 Packages

Wire/Ribbon Bonding and Test. All circuit metallization is both wire and ribbon bondable. Gap welding is compatible with this material set, but soldering is not compatible with the I/O material. The plated metal base is solderable. StratEdge recommends using electrical test connectors or probes that make a pressure contact with the strip conductor of the substrate. Connectors that slide across the conductor are not recommended since they could damage the package. All unused RF I/Os should be terminated to the base to minimize coupling.

Cleaning: All circuit metallization is both wire and ribbon bondable. Gap welding is compatible with this material set, but soldering is not compatible with the I/O material. The plated metal base is solderable. StratEdge recommends using electrical test connectors or probes that make a pressure contact with the strip conductor of the substrate. Connectors that slide across the conductor are not recommended since they could damage the package. All unused RF I/Os should be terminated to the base to minimize coupling.

Rework: If components need to be removed from the package, the package should not be heated above 300°C.

For further assistance, contact Applications Engineering @ 858-569-5000, or by e-mail at Applications@StratEdge.com

About Us

StratEdge is a privately held company with worldwide headquarters in Santee, California, USA. Design, manufacturing, test, and assembly are located in the Santee Division's ISO 9001:2015 facility. StratEdge high performance semiconductor packages operate from DC to 50+ GHz for the high speed digital (OC-48, OC-192, OC-768), mixed signal, broadband wireless, satellite, point-to-point and point-to-multipoint, VSAT, and test and measurement industries.