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Abstract:

An organic EL device manufacturing method includes a step of supplying a
substrate, and while moving the substrate with a non-electrode-layer side
thereof in contact with a surface of a can roller, the
non-electrode-layer provided with no electrode layer, discharging a
material from a nozzle of a vapor deposition source to form an organic
layer on an electrode-layer side of the substrate, the electrode-layer
side provided with an electrode layer. The vapor deposition step includes
supplying a shadow mask including an opening portion to interpose the
shadow mask between the substrate contacting the can roller, and the
nozzle; and forming the organic layer corresponding to the opening
portion on the electrode-layer side of the substrate while moving the
substrate and the shadow mask with through holes included at each of the
substrate and the shadow mask engaged with projections included in the
can roller.

Claims:

1. An organic EL device manufacturing method including forming an organic
layer on an electrode-layer side of a strip-shaped substrate, while
moving the substrate, the electrode-layer side being provided with an
electrode layer, comprising: a vapor deposition step of supplying the
strip-shaped substrate, and while moving the substrate with a
non-electrode-layer side thereof in contact with a surface of a can
roller that rotates, discharging an evaporated organic layer forming
material from a nozzle of a vapor deposition source arranged so as to
face the can roller to form an organic layer on the electrode-layer side
of the substrate, the non-electrode layer side being provided with no
electrode layer, wherein the vapor deposition step further comprises:
supplying a shadow mask including an opening portion so as to interpose
the shadow mask between the substrate held in contact with the can
roller, and the nozzle; and by using a substrate and a shadow mask each
including a plurality of through holes arranged in a longitudinal
direction for the substrate and the shadow mask, respectively, and using
a can roller including projections that engage with the through holes for
the can roller, forming the organic layer corresponding to the opening
portion on the electrode-layer side of the substrate, while moving the
substrate and the shadow mask with the through holes of the substrate and
the shadow mask engaged with the projections.

2. The organic EL device manufacturing method according to claim 1,
wherein the projections each have a taper shape tapering from a can
roller side thereof toward a distal end thereof, and a diameter of the
through holes of the shadow mask is smaller than a diameter of the
through holes of the substrate.

3. An organic EL device manufacturing apparatus comprising: a substrate
supply section that supplies a strip-shaped substrate including an
electrode layer formed thereon; a can roller that rotates along with
movement of the substrate while being in contact with a
non-electrode-layer side of the supplied substrate, the
non-electrode-layer side being provided with no electrode layer; a vapor
deposition source arranged so as to face the can roller, the vapor
deposition source discharging an evaporated organic layer forming
material from a nozzle to form an organic layer on an electrode-layer
side of the substrate held in contact with the can roller, the electrode
layer side being provided with an electrode layer; and a shadow mask
supply section that supplies a shadow mask including an opening portion
so as to interpose the shadow mask between the substrate held in contact
with the can roller, and the nozzle, wherein the substrate and the shadow
mask each include a plurality of through holes arranged in a longitudinal
direction, and the can roller includes projections that engage with the
through holes to support the substrate and the shadow mask.

4. A method for manufacturing an organic EL device, comprising: preparing
a strip-shaped substrate having a first surface on which an electrode
layer is formed and a second surface on which an electrode layer is not
formed; supplying the substrate so that the second surface is in contact
with a can roller; and forming an organic layer on the first surface of
the substrate by discharging an evaporated organic layer forming material
from a nozzle of a vapor deposition source located so as to face the can
roller, while supplying a shadow mask including an opening portion so
that the shadow mask is interposed between the substrate and the nozzle,
wherein: each of the substrate and the shadow mask has a plurality of
through holes in a longitudinal direction; the can roll has projections
which engage with the through holes; and the organic layer is formed so
as to correspond to the opening portion on the first surface of the
substrate, while moving the substrate and the shadow mask so that the
through holes of the substrate and the shadow mask are engaged with the
projections.

Description:

CROSS REFERENCE TO RELATED APPLICATION

[0001] This application claims priority from Japanese Patent Application
No. 2010-286002, which is incorporated herein by reference.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to a method and apparatus for
manufacturing an organic EL device including an organic layer on an
electrode layer formed on a substrate and emitting light from the organic
layer.

[0004] 2. Description of the Related Art

[0005] In recent years, organic EL (electroluminescence) devices are
drawing attention as devices for use in next-generation
low-power-consumption light-emitting display apparatuses. Basically,
organic EL devices each include at least one organic layer including a
light-emitting layer made of an organic light-emitting material and a
pair of electrodes. Such organic EL devices emit light in various colors
depending on the organic light-emitting materials. Furthermore, because
of being self-light-emitting devices, the organic EL devices are drawing
attention for use in displays such as those of televisions (TV).

[0006] An organic EL device includes at least one organic layer including
a light-emitting layer, sandwiched between two electrode layers having
polarities opposite to each other (sandwich structure), and the at least
one organic layer includes an organic film having a thickness of several
nanometers to several tens of nanometers. Furthermore, the organic layer
sandwiched between the electrode layers is supported on a substrate, that
is, the anode layer (electrode layer), the organic layer and the cathode
layer are deposited on the substrate in this order to form an organic EL
device. In the case of a plurality of organic layers included in an
organic EL device, an anode layer is formed on a substrate, organic
layers are sequentially deposited on the anode layer, and then a cathode
layer is formed on the deposited organic layers, thereby forming an
organic EL device.

[0007] As methods for forming organic layers on an anode layer formed on a
substrate in manufacturing such organic EL device, vacuum vapor
deposition and film coating are generally known. Among these methods,
vacuum vapor deposition is mainly used because the purity of materials
for forming the organic layers (organic layer forming materials) can be
increased, facilitating provision of long-life products.

[0008] In vacuum vapor deposition as mentioned above, a vapor deposition
source is provided for each organic layer at a position facing a
substrate in a vacuum chamber of a vapor deposition apparatus for
performing vapor deposition. More specifically, each organic layer
forming material is heated and evaporated in a heating section located in
a vapor deposition source, and the evaporated organic layer forming
material (evaporated material) is radially discharged from a nozzle
provided at the vapor deposition source to deposit onto an anode layer
formed on the substrate. The organic layer forming material is thereby
vapor-deposited on the anode layer.

[0009] In such vacuum vapor deposition, what is called a batch process or
a roll process is employed. A batch process is a process in which an
organic layer is vapor-deposited on an anode layer for each of substrates
each including an anode layer formed thereon. Meanwhile, a roll process
is a process in which a strip-shaped substrate including an anode layer
formed thereon, which has been rolled up, is continuously unwound (what
is called a roll-to-roll manner), the unwound substrate is supported by a
surface of a can roller, which rotates, to move the substrate along with
the rotation to sequentially vapor-deposit respective organic layers on
the anode layer, and the substrate with the respective organic layers
vapor-deposited thereon is rolled up again. From among these processes,
it is desirable that organic devices be manufactured using the roll
process from the perspective of cost reduction.

[0010] For forming a plurality of layers on an anode layer when
manufacturing an organic EL device using the roll process in vacuum vapor
deposition as described above, in order to form respective organic layers
of desired patterns, the organic layers are sequentially deposited on the
anode layer via a what is called a shadow mask including opening
portions. Furthermore, in order to deposit the respective layers with
high position accuracy, alignment is required for the respective layers.
Accordingly, use of an alignment mechanism for adjusting displacements of
respective organic layers in the organic layer formation using such
shadow mask has been proposed (cf., Patent. Document 1)

[0011] Patent Document 1 discloses that a displacement in a direction
perpendicular to a direction of movement of a substrate (TD direction) is
detected by recognizing a pattern or alignment marks of an organic
light-emitting layer (organic layer) by means of an image recognition
camera and adjusted by adjusting the positions and angles of a pair or
guide rollers, while a displacement in the direction of movement of the
substrate (MD direction) is adjusted by adjusting the passage route of
the substrate by means of an accumulator.

[0013] However, for installing mechanisms such as an image recognition
camera and an accumulator in a vacuum chamber as in Patent Document 1, it
is necessary to secure a pressure resistance of the camera and increase
the volume of the chamber, which may result in an increase in size and
cost of the organic EL device manufacturing apparatus.

[0014] In addition, in order to sequentially form respective layers on an
anode layer without using the aforementioned accumulator, it is necessary
to synchronize the substrate and the shadow mask with each other in terms
of transport speed; however, it is extremely difficult to make both
transport speeds completely correspond to each other, and thus, the
amount of displacement in the MD direction may increase as the transport
of the substrate advances.

[0015] Furthermore, ordinarily, the substrate and the shadow mask are made
of different materials, and thus, have different linear expansion
coefficients depending on the difference in material. Thus, as the
temperature inside the vacuum chamber increases as a result of
evaporating a layer forming material, the accuracy of alignment between
the substrate and the shadow mask may be lowered.

[0016] In view of the aforementioned problems, an object of the present
invention is to provide an organic EL device manufacturing method and
apparatus capable of efficiently manufacturing organic EL devices by
suppressing displacements of respective layers formed on a substrate in a
direction of movement thereof and a direction perpendicular to the
direction of movement without a complicated configuration.

[0017] As a result of diligent study to achieve the above object, the
present inventors found that respective layers can be deposited without
displacements by forming through holes in a substrate and a shadow mask,
providing projections for alignment at a surface of a can roller on a
side supporting the substrate, and engaging the projections with the
through holes of the substrate and the shadow mask, thereby aligning the
substrate and the shadow mask with each other, and sequentially
vapor-depositing the respective layers on an anode layer via the shadow
mask in this state, and thereby completed the present invention.

[0018] In other words, an organic EL device manufacturing method according
to the present invention including forming an organic layer on an
electrode-layer side of a strip-shaped substrate, while moving the
substrate, the electrode-layer side being provided with an electrode
layer, including:

[0019] a vapor deposition step of supplying the strip-shaped substrate,
and while moving the substrate with a non-electrode-layer side thereof in
contact with a surface of a can roller that rotates, discharging an
evaporated organic layer forming material from a nozzle of a vapor
deposition source arranged so as to face the can roller to form an
organic layer on the electrode-layer side of the substrate, the
non-electrode layer side being provided with no electrode layer,

[0020] wherein the vapor deposition step further comprises:

[0021] supplying a shadow mask including an opening portion so as to
interpose the shadow mask between the substrate held in contact with the
can roller, and the nozzle; and

[0022] by using a substrate and a shadow mask each including a plurality
of through holes arranged in a longitudinal direction for the substrate
and the shadow mask, respectively, and using a can roller including
projections that engage with the through holes for the can roller,
forming the organic layer corresponding to the opening portion on the
electrode-layer side of the substrate, while moving the substrate and the
shadow mask with the through holes of the substrate and the shadow mask
engaged with the projections.

[0023] Consequently, mere engagement of the through holes of the substrate
and the shadow mask with the projections enables alignment between the
shadow mask and the substrate, enabling an organic layer to be deposited
on the electrode layer while such alignment is being made. Accordingly,
organic EL devices can efficiently be manufactured with alignment of
respective layers formed on the substrate in a direction of movement
thereof and a direction perpendicular to the direction of movement
adjusted without employing a complicated configuration.

[0024] Also, in the present invention, it is preferable that the
projections each have a taper shape tapering from a can roller side
thereof toward a distal end thereof, and a diameter of the through holes
of the shadow mask be smaller than a diameter of the through holes of the
substrate.

[0025] Consequently, the substrate and the shadow mask face each other
with a gap therebetween, enabling prevention of breakage of the substrate
resulting from contact with the shadow mask.

[0027] a substrate supply section that supplies a strip-shaped substrate
including an electrode layer formed thereon;

[0028] a can roller that rotates along with movement of the substrate
while being in contact with a non-electrode-layer side of the supplied
substrate, the non-electrode-layer side being provided with no electrode
layer;

[0029] a vapor deposition source arranged so as to face the can roller,
the vapor deposition source discharging an evaporated organic layer
forming material from a nozzle to form an organic layer on an
electrode-layer side of the substrate held in contact with the can
roller, the electrode layer side being provided with an electrode layer;
and

[0030] a shadow mask supply section that supplies a shadow mask including
an opening portion so as to interpose the shadow mask between the
substrate held in contact with the can roller, and the nozzle,

[0031] wherein the substrate and the shadow mask each include a plurality
of through holes arranged in a longitudinal direction, and the can roller
includes projections that engage with the through holes to support the
substrate and the shadow mask.

[0032] As described above, the present invention enables efficient
manufacturing of organic EL devices by suppressing displacements of
respective layers formed on a substrate in a direction of movement
thereof and a direction perpendicular to the direction of movement
without employing a complicated configuration.

BRIEF DESCRIPTION OF THE DRAWINGS

[0033]FIG. 1 is a schematic cross-sectional side view of an organic EL
device manufacturing apparatus according to a first embodiment of the
present invention;

[0034]FIG. 2 is a diagram schematically illustrating a substrate and a
shadow mask in the present embodiment;

[0035]FIG. 3 is a diagram schematically illustrating a state in which the
substrate and the shadow mask in the present embodiment have been put
together;

[0036]FIG. 4A is a schematic cross-sectional diagram of an example of a
configuration of layers of an organic EL device;

[0037]FIG. 4B is a schematic cross-sectional diagram of an example of a
configuration of layers of an organic EL device;

[0038]FIG. 4C is a schematic cross-sectional diagram of an example of a
configuration of layers of an organic EL device;

[0039]FIG. 5 is a schematic side view of an organic EL device
manufacturing apparatus according to a second embodiment of the present
invention;

[0040] FIG. 6 is a schematic side view of an alignment pin used in an
organic EL device manufacturing apparatus according to a third embodiment
of the present invention;

[0041]FIG. 7 is a schematic sectional side view of a configuration when
organic layers are formed in an organic EL device manufacturing apparatus
used in an example; and

[0042]FIG. 8 is a schematic sectional side view of a configuration when a
cathode layer is formed in the organic EL device manufacturing apparatus
used in the example.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0043] An organic EL device manufacturing method and apparatus according
to the present invention will be described below with reference to the
drawings.

[0044] First, an organic EL device manufacturing apparatus and method
according to a first embodiment of the present invention will be
described. FIG. 1 is a schematic cross-sectional side view of an example
of an organic EL device manufacturing apparatus according to a first
embodiment of the present invention, FIG. 2 is a diagram schematically
illustrating a substrate and a shadow mask in the present embodiment,
FIG. 3 is a diagram schematically illustrating a state in which the
substrate and the shadow mask in the present embodiment have been put
together, and FIGS. 4A, 4B and 4C are schematic cross-sectional diagrams
each illustrating a configuration of layers of an organic EL device.

[0045] As illustrated in FIG. 1, an organic EL device manufacturing
apparatus 1 is a vapor deposition apparatus including a vacuum chamber 3,
and in the vacuum chamber 3, roughly, a substrate supply device
(substrate supply section) 5a, a can roller 7 and a vapor deposition
source 9 are arranged. The inside of the vacuum chamber 3 is made to
enter a pressure-reduced state by a non-illustrated vacuum generator.

[0046] The substrate supply device 5a unwinds a rolled-up strip-shaped
substrate 21 to supply the substrate 21 to the can roller 7. After having
been supplied to the can roller 7, the substrate 21 unwound from the
substrate supply device 5a is wound up by a substrate collection device
5b. In other words, the substrate 21 is unwound and wound up in a
roll-to-roll manner.

[0047] A shadow mask supply device (shadow mask supply section) 6a unwinds
a rolled-up strip-shaped shadow mask (shadow mask) 31 to supply the
shadow mask 31 to the can roller 7 so as to interpose the shadow mask 31
between the substrate 21 and a nozzle 9a. After having been supplied to
the can roller 7, the shadow mask 31 unwound from the shadow mask supply
device 6a is wound up by a shadow mask collection device 6b. In other
words, the shadow mask 31 is unwound and wound up in a roll-to-roll
manner.

[0048] The can roller 7 is made of a stainless steel and is configured to
rotate. A plurality of alignment pins (projections) 11 are provided at
opposite end portions in a width direction of a circumferential surface
of the can roller 7. The alignment pins 11 each have a quadrangular prism
shape here, and are arranged at a predetermined interval in a
circumferential direction of the can roller 7.

[0049] The can roller 7 preferably includes a temperature control
mechanism such as a cooling mechanism inside, enabling a temperature of
the substrate 21 to be stabilized during formation of an organic layer on
the substrate 21, which will be described later. An outer diameter of the
can roller 7 may be determined in a range of, for example, 300 to 2000
mm.

[0050] Meanwhile, first through holes (through holes) 21a, which are to be
fitted around the respective alignment pins 11, are formed at opposite
end portions in a width direction of the substrate 21. Such first through
holes 21a are formed at an interval in the width direction and an
interval in a circumferential direction that are the same as those of the
alignment pins 11, and are formed so as to have a shape and a size that
are the same as those of it cross section of the respective alignment
pins 11. Consequently, upon the alignment pins 11 being inserted into the
first through holes 21a of the substrate 21, the first through holes 21a
and the alignment pins 11 are engaged with each other, and the substrate
21 moves along with rotation of the can roller 7 (in a clockwise
direction in FIG. 1).

[0051] Furthermore, in a state in which the alignment pins 11 and the
first through holes 21a are engaged with each other, the substrate 21 is
restricted from movement in a direction of movement of the substrate 21
(MD direction) and a direction perpendicular to the direction of movement
(TD direction). Also, at a region in which the substrate 21 faces the
vapor deposition source 9 and a region in vicinity of such region, a back
surface of the substrate 21 is brought into contact with a surface of the
can roller 7.

[0052] Second through holes (through holes) 31a, which are to be fitted
around the respective alignment pins 11, are firmed at opposite end
portions in a width direction of the shadow mask 31. Such second through
holes 31a are formed at an interval in the width direction and an
interval in a circumferential direction that are the same as those of the
alignment pins 11, and are formed so as to have a shape and a size that
are the same as those of the cross-section of the alignment pins 11.
Consequently, upon the alignment pins 11 being inserted into the second
through holes 31a of the shadow mask 31, the second through hole 31a and
the alignment pin 11 are engaged with each other, and the shadow mask 31
moves along with the rotation of the can roller 7 (in the clockwise
direction in FIG. 1).

[0053] Furthermore, in a state in which the alignment pins 11 and the
second through holes 31a are engaged with each other, the shadow mask 31
is restricted from movement in a direction of movement of the substrate
21 (MD direction) and a direction perpendicular to the direction of
movement (TD direction). Also, at a region in which the shadow mask 31
faces the vapor deposition source 9 and a region in the vicinity of such
region, a back surface of the shadow mask 31 is brought into contact with
a front surface of the substrate 21.

[0054] A plurality of opening portions 31b are longitudinally formed at a
center portion in the width direction of the shadow mask 31. When the
shadow mask 31 faces the substrate 21, the opening portions 31b allow an
organic layer forming material 22 discharged from the vapor deposition
source 9, which will be described later, to pass therethrough to form an
organic layer on an anode layer 23 formed on the substrate 21. Such
opening portions 31b each have a desired shape and the organic layer
corresponding to the opening portions 31b is formed on the anode layer
23.

[0055] Upon rotation of the can roller 7, the substrate 21 is
consecutively fed out from the substrate supply device 5a along with the
rotation, and the first through holes 21a of the fed-out substrate 21 are
fitted around the alignment pins 11. Simultaneously with that, the shadow
mask 31 is consecutively fed out from the shadow mask supply device 6a
along with the rotation of the can roller 7, and the second through holes
31a of the shadow mask 31 are fitted around the alignment pins 11, and
the shadow mask 31 is interposed between the substrate 21 and the nozzle
9a.

[0056] Then, the substrate 21 and the shadow mask 31 move in a direction
of the rotation of the can roller 7 while being supported by the can
roller 7, and when the substrate 21 and the shadow mask 31 move away from
the can roller 7, the first through holes 21a of the substrate 21 and the
second through holes 31a of the shadow mask 31 are disengaged from the
alignment pins 11. Next, the substrate 21 and the shadow mask 31, which
have been separated from the can roller 7, are wound up by the substrate
collection device 5b and the shadow mask collection device 6b,
respectively.

[0057] The interval in the circumferential direction and the interval in
the width direction of the alignment pins 11 are not specifically limited
as long as an evaporated organic layer forming material 22 can be
deposited on the substrate 21 via the opening portions 31b of the shadow
mask 31 with the substrate 21 and the shadow mask 31 aligned with each
other. However, a decrease in number of alignment pins 11 in the
circumferential direction may result in displacements in position of the
substrate 21 and the shadow mask 31.

[0058] Meanwhile, an increase in number of alignment pins 11 in the
circumferential direction can more reliably suppress misalignment, but
may result in breakage of the substrate 21 and the shadow mask 31 because
the interval of the first through holes 21a and the interval of the
second through holes 31a are made to be small due to the increase.
Accordingly, the number of alignment pins 11 in the circumferential
direction can be determined, for example, taking the aforementioned
points into consideration, and for example, twelve alignment pins 11 can
be arranged at an equal pitch of 30°, or 36 alignment pins 11 can
be arranged at an equal pitch of 10°.

[0059] For a material for forming the substrate 21, a flexible material
that is not damaged when looped over the can roller 7 is used, and
examples of such material can include metal materials, non-metal
inorganic materials and resin materials.

[0060] Examples of the metal materials include stainless steels, alloys
such as iron-nickel alloys, copper, nickel, iron, aluminum and titanium.
Furthermore, examples of the aforementioned iron-nickel alloys can
include alloy 36 and alloy 42. From among these materials, it is
preferable that the metal material be a stainless steel, copper, aluminum
or titanium, from the perspective of ease of application of the metal
material to the roll process. Furthermore, the substrate made of such
metal material preferably has a thickness of 5 to 200 μm from the
perspective of ease of handling and winding up the substrate.

[0061] Examples of the non-metal inorganic materials can include glass. In
this case, as the substrate made of a non-metal inorganic material, a
flexible thin-film glass can be used. Furthermore, the substrate made of
such non-metal material preferably has a thickness of 5 to 500 μm from
the perspective or sufficient mechanical strength and moderate
plasticity.

[0062] Examples of the resin materials can include synthetic resins such
as thermosetting resins and thermoplastic resins. Examples of such
synthetic resins can include polyimide resins, polyester resins, epoxy
resins, polyurethane reins, polystyrene resins, polyethylene resins,
polyamide resins, acrylonitrile butadiene styrene (ABS) copolymer resins,
polycarbonate resins, silicone resins and fluorine resins. Furthermore,
for the substrate made of such resin material, a film of any of the
aforementioned synthetic reins can be used, for example. Furthermore, the
substrate made of such resin material preferably has a thickness of 5 to
500 μm from the perspective of sufficient mechanical strength and
moderate plasticity.

[0063] For a material forming the shadow mask 31, a flexible material that
is not damaged when looped over the can roller 7 is used, and examples of
such material can include metal materials, non-metal inorganic materials
and resin materials.

[0064] Examples of the metal materials include stainless steels, alloys
such as iron-nickel alloys, copper, nickel, iron, aluminum and titanium.
Furthermore, examples of the aforementioned iron-nickel alloys can
include alloy 36 and alloy 42. From among these materials, it is
preferable that the metal material be a stainless steel, copper, aluminum
or titanium, from the perspective of sufficient mechanical strength,
moderate flexibility and ease of application of the metal material to the
roll process. Furthermore, the substrate made of such metal material
preferably has a thickness of 5 to 200 μm from the perspective of ease
of handling and winding up the substrate.

[0065] Examples of the non-metal inorganic materials can include glass. In
this case, as the substrate made of a non-metal inorganic material, a
flexible thin-film glass can be used. Furthermore, the substrate made of
such non-metal material preferably has a thickness of 5 to 500 μm from
the perspective of sufficient mechanical strength and moderate
plasticity.

[0066] Examples of the resin materials can include synthetic resins such
as thermosetting resins and thermoplastic resins. Examples of such
synthetic resins can include polyimide resins, polyester resins, epoxy
resins, polyurethane reins, polystyrene resins, polyethylene resins,
polyamide resins, acrylonitrile butadiene styrene (ABS) copolymer resins,
polycarbonate resins, silicone resins and fluorine resins. Furthermore,
for the substrate made of such resin material, a film of any of the
aforementioned synthetic reins can be used, for example. Furthermore, the
substrate made of such resin material preferably has a thickness of 5 to
500 μm from the perspective of sufficient mechanical strength and
moderate plasticity.

[0067] Furthermore, the shadow mask 31 is preferably made of a material
that is the same as that of the substrate 21. Consequently, the shadow
mask 31 and the substrate 21 have linear expansion coefficients equal to
each other, enabling suppression of misalignment attributable to the
difference in linear expansion coefficient.

[0068] In the present embodiment, as a specific example of the substrate
21, one with an anode layer 23 (cf. FIGS. 4A to 4C) formed thereon in
advance by means of sputtering can be used.

[0069] For a material for forming the anode layer 23, any of various
transparent conductive materials such as indium zinc oxide (IZO) and
indium tin oxide (ITO), metals such as gold, silver or platinum and alloy
materials can be used.

[0070] The vapor deposition source 9 is provided for each of the organic
layers in at least one organic layer including a light-emitting layer 25a
(cf. FIGS. 4A to 4C). Each vapor deposition source 9 is arranged at a
position facing a region of the circumferential surface of the can roller
7 that supports the substrate 21, and vapor-deposits a material for
forming an organic layer (organic layer forming material 22) on the
substrate 21, thereby sequentially forming organic layers (cf. FIGS. 4A
to 4C) on the substrate 21. A configuration of such vapor deposition
sources 9 is not limited as long as the configuration includes a nozzle
capable of discharging an evaporated organic layer forming material 22
toward the substrate 21. For example, a vapor deposition source 9
configured to heat and evaporate an organic layer forming material 22 in
its inside can be employed.

[0071] Each vapor deposition source 9, which can accommodate an organic
layer forming material 22, and includes a nozzle 9a and a heating section
(not illustrated). The nozzle 9a is arranged so as to face the region of
the can roller 7 that supports the substrate 21. The heating section is
configured to heat and evaporate the organic layer forming material 22,
and the evaporated organic layer forming material 22 is discharged to the
outside from the nozzle 9a.

[0072] Then, upon the organic layer forming material 22 being heated in
the vapor deposition source 9, the organic layer forming material 22 is
evaporated, the evaporated organic layer forming material 22 is
discharged from the nozzle 9a toward the substrate 21, and the discharged
organic layer forming material 22 passes through an opening portions 31b
of the shadow mask 31 and deposited on the anode layer 23 formed on the
substrate 21. As a result of the evaporated organic layer forming
material 22 being deposited on the anode layer 23, an organic layer is
formed on the anode layer 23.

[0073] The organic layers are not specifically limited as long as the
organic layers include an organic layer that is the light-emitting layer
25a, and for example, as illustrated in FIG. 4B, a hole injection layer
(organic layer) 25b, a light-emitting layer 25a and an electron injection
layer (organic layer) 25c can be deposited in this order to provide a
three-layer structure. Alternatively, as necessary, a hole transport
layer (organic layer) 25d (cf. FIG. 4C) can be interposed between the
light-emitting layer 25a and the hole injection layer 25b illustrated in
FIG. 4B or an electron transport layer (organic layer) 25e (cf. FIG. 4C)
can be interposed between the light-emitting layer 25a and the electron
injection layer 25c to provide a four-layer structure of organic layers.

[0074] Furthermore, as illustrated in FIG. 4C, a hole transport layer 25d
can be interposed between the hole injection layer 25b and the
light-emitting layer 25a, and an electron transport layer 25e can be
interposed between the light-emitting layer 25a and the electron
injection layer 25c to provide a five-layer structure of organic layers.
Although each organic layer is ordinarily designed to have a thickness of
around several nanometers to several tens of nanometers, such thickness
is not specifically limited because the thickness is arbitrarily
determined depending on, e.g., the organic layer forming material 22
and/or the light emitting property.

[0075] For a material for forming the light-emitting layer 25a, for
example, tris(8-hydroxyquinoline)aluminum (Alq3), and
4,4'-N,N'-dicarbazolyl biphenyl (CBP) with iridium complex (Ir(ppy)3)
doped therein, can be used.

[0076] For a material for forming the hole injection layer 25b, for
example, copper phthalocyanine (CuPc) or
4,4'-bis[N-4-(N,N-di-m-tolylamino)phenyl]-N-phenylamino]biphenyl (DNTPD)
can be used.

[0077] For a material for forming the hole transport layer 25d, for
example, 4,4'-bis[N-(1-naphthyl)-N-phenylamino]biphenyl (α-NPD) or
N,N'-diphenyl-N,N'-bis(3-methylphenyl)-1,1'-biphenyl 4,4'-diamine (TPD)
can be used.

[0078] For a material for forming the electron injection layer 25c, for
example, lithium fluoride (LiF), cesium fluoride (CsF) or lithium oxide
(Li2O) can be used.

[0079] For a material for forming the electron transport layer 25e, for
example, tris(8-hydroxyquinoline)aluminum (Alq3),
bis(2-methyl-8-quinolinolato)-4-phenylphenolate-aluminum (BAlq) or
OXD-7(1,3-bis[5-(p-tert-butylphenyl)-1,3,4-oxadiazole-2-yl]benzene can be
used.

[0080] A plurality of vapor deposition sources 9 can be arranged according
to the configuration and/or number of organic layers formed on the
substrate 21 as described above. For example, as illustrated in FIG. 4B,
where three organic layers are deposited, three vapor deposition sources
9 can be arranged for the respective layers. Where a plurality of vapor
deposition sources 9 are provided as described above, a first organic
layer is vapor-deposited on the anode layer 23 by a vapor deposition
source 9 arranged at a most upstream position in a direction of rotation
of the can roller 7 and then, a second organic layer is sequentially
vapor-deposited on the first organic layer by means of a vapor deposition
source 9 on the downstream side.

[0081] Upon an evaporated organic layer forming material 22 being
discharged from a vapor deposition source 9 to the substrate 21 and the
shadow mask 31 supported by the can roller 7 while the substrate 21 and
the shadow mask 31 are aligned by engagement between the alignment pins
11 formed on the can roller 7 and the first through hole 21a and the
second through hole 31a (alignment adjustment), the material 22 that has
passed through the opening portions 31b of the shadow mask 31 is
vapor-deposited on the anode layer 23 formed on the substrate 21.
Consequently, an organic layer corresponding to the shape and size of the
opening portions 31b is formed on the anode layer 23. As a result of such
vapor-deposition, which is sequentially performed for each of the organic
layers, the respective organic layers are deposited on the anode layer
23.

[0082] After the formation of the organic layers on the anode layer 23
formed on the substrate 21 as described above, for example, the substrate
21 is wound up, and a vapor deposition source for forming a cathode layer
27 is arranged in place of the vapor deposition sources 9 for forming the
aforementioned organic layers (cf. FIG. 8). Then, a cathode layer (layer)
27 is formed on the organic layers while the substrate 21 and the shadow
mask 31 are aligned with each other in a manner similar to the above, and
consequently, an organic EL device 20 with the anode layer 23, the
organic layer and the cathode layer 27 deposited in this order on the
substrate 21 as illustrated in FIGS. 4A to 4C is manufactured. It should
be noted that when forming the cathode layer 27, a shadow mask for
forming the cathode layer 27 can be used instead of the shadow mask 31
for forming the organic layers.

[0083] For the cathode layer 27, e.g., aluminum (Al), silver (Ag), ITO, an
alkali metal or an alloy containing an alkali earth metal can be used.
Alternatively, a vacuum film forming device such as a sputtering device
can be arranged in place of the vapor deposition sources 9 for forming
the organic layers to deposit (form) the cathode layer 27 on the organic
layers while the substrate 21 and the shadow mask 31 are aligned with
each other as described above. Alternatively, the vapor deposition source
for forming the cathode layer 27 can be arranged downstream of a most
downstream vapor deposition source 9 to form the cathode layer 27 on the
organic layers following the formation of the organic layers.
Furthermore, the cathode layer 27 can be deposited on the organic layers
in a conventionally known method that is different from the
aforementioned methods.

[0084] Also, at the position in the vacuum chamber 3 that faces the region
of the can roller 7 that supports the substrate 21, a vacuum film forming
device for forming the anode layer 23 such as a sputtering device can be
arranged upstream of the vapor deposition sources 9, which are to form
the organic layers, with respect to the direction of rotation of the can
roller 7 to form the anode layer 23 on the substrate 21, which moves
while being supported by the can roller 7, before vapor deposition of the
organic layers.

[0085] Otherwise, where a material that can be vapor-deposited by a vapor
deposition source is used for a material for the anode layer 23, a vapor
deposition source for the anode layer 23 can be arranged in the vacuum
chamber 3 to successively vapor-deposit the anode layer 23, the organic
layers and the cathode layer 27 on the substrate 21 in this order,
thereby forming the organic EL device 20.

[0086] Diameters (sizes) of the first through holes 21a of the substrate
21 and the second through holes 31a of the shadow mask 31 are not
specifically limited as long as the alignment of the substrate 21 and the
shadow mask 31 can be adjusted. However, there is a tendency for a region
in which the organic layers can be formed to be narrower in the width
direction of the substrate 21 as these first through holes 21a and the
second through holes 31a are larger. Accordingly, for example, taking
such point into consideration, the sizes of the first and second through
holes 21a and 31a are preferably not more than 10 mm, more preferably not
more than 5 mm, and further preferably not more than 2 mm in the width
direction (TD direction). Also, the sizes are preferably not more than 10
mm, more preferably not more than 5 mm and further preferably not more
than 2 mm in the MD direction. Methods for forming the first through
holes 21a and the second through holes 31a are not specifically limited
however, the first through holes 21a and the second through holes 31a can
be formed by, for example, punching or photo-etching.

[0087] An outer diameter of the quadrangular prism-shaped alignment pins
11 is not specifically limited as long as the alignment pins 11 can
engage with the first through holes 21a and the second through holes 31a
and such engagement enables alignment between the substrate 21 and the
shadow mask 31, and thus, can be arbitrarily determined according to the
shapes of the first through holes 21a and the second through holes 31a.

[0088] Next, an organic EL device manufacturing method according to the
first embodiment using the above-described manufacturing apparatus will
be described.

[0089] An organic EL device manufacturing method according to the present
embodiment, which includes forming an organic layer on an electrode-layer
side of a strip-shaped substrate, while moving the substrate, the
electrode-layer side being provided with an electrode layer, includes: a
vapor deposition step of supplying the strip-shaped substrate, and while
moving the substrate with a non-electrode-layer side thereof in contact
with a surface of a can roller that rotates, discharging an evaporated
organic layer forming material from a nozzle of a vapor deposition source
arranged so as to face the can roller to form an organic layer on the
electrode-layer side of the substrate, the non-electrode layer side being
provided with no electrode layer, wherein the vapor deposition step
further includes: supplying a shadow mask including an opening portion so
as to interpose the shadow mask between the substrate held in contact
with the can roller, and the nozzle; and by using a substrate and a
shadow mask each including a plurality of through holes arranged in a
longitudinal direction for the substrate and the shadow mask,
respectively, and using a can roller including projections that engage
with the through holes for the can roller, forming the organic layer
corresponding to the opening portion on the electrode-layer side of the
substrate, while moving the substrate and the shadow mask with the
through holes of the substrate and the shadow mask engaged with the
projections.

[0090] In the present embodiment, in the vacuum chamber 3, the rolled-up
substrate 21 on which the anode layer 23 has been formed by, e.g.,
sputtering is unwound from the substrate supply device 5a, the first
through holes 21a of the unwound substrate 21 are engaged with the
alignment pins 11 of the can roller 7, which rotates in the clockwise
direction in FIG. 1, the substrate 21 is thereby supported by the
circumferential surface of the can roller 7, and the substrate 21 is
moved together with the can roller 7 and then wound up, whereby unwinding
and winding-up of the substrate 21 are performed.

[0091] Also, the rolled-up shadow mask 31 is unwound from the shadow mask
supply device 6a, the second through holes 31a of the unwound shadow mask
31 are engaged with the alignment pins 11 of the can roller 7, which
rotates in the clockwise direction in FIG. 1, so that the unwound shadow
mask 31 faces the substrate 21, the shadow mask 31 is thereby supported
by the front surface of the substrate 21, and the shadow mask 31 is moved
together with the can roller 7 and the substrate 21 and then wound up,
whereby unwinding and winding-up of the shadow mask 31 are performed.

[0092] As a result of the substrate 21 and the shadow mask 31 being moved
together with the can roller 7 in a state in which the first through
holes 21a and the second through holes 31a are engaged with the alignment
pins 11, the substrate 21 and the shadow mask 31 can be moved from a
position upstream of the vapor deposition sources 9 to a position
downstream of the vapor deposition sources 9 in the direction of the
movement while the substrate 21 and the shadow mask 31 are aligned with
each other.

[0093] An organic layer forming material 22 is evaporated by each vapor
deposition source 9, and the evaporated organic layer forming material 22
is discharged toward the substrate 21 and the shadow mask 31, which are
moving in the aligned state as described above, and passes though the
opening portions 31b of the shadow mask 31 to form an organic layer,
which corresponds to the opening portions 31b, on the anode layer 23
formed on the substrate 21. Consequently, the organic layer corresponding
to the shape and size of the opening portions 31b is formed on the
substrate 21. Here, as described above, the substrate 21 and the shadow
mask 31 are aligned with each other, enabling the organic layer to be
formed on the anode layer 23 with good positional accuracy.

[0094] Furthermore, as described above, for example, the vapor deposition
source for forming the cathode layer 27 can be arranged in place of the
vapor deposition sources 9 for forming the organic layers after the
substrate 21 with the organic layers formed thereon being wound up, to
unwind the substrate 21 from the substrate supply device 5a again and
form the cathode layer 27 on the organic layers while the substrate 21
and the shadow mask 31 are aligned with each other in the same manner as
above. Alternatively, the vapor deposition source for forming the cathode
layer 27 can be arranged at a position downstream of the most downstream
vapor deposition source 9 to form the cathode layer 27 on the organic
layers following the formation of the organic layers.

[0095] As described above, the present embodiment; includes a vapor
deposition step of supplying the strip-shaped substrate 21 including the
anode layer 23 (electrode layer) formed thereon, and while moving the
substrate 21 with a non-anode layer side thereof in contact with a
surface of the can roller 7 that rotates, the non-electrode layer side
being provided with no anode layer 23, discharging an evaporated organic
layer forming material 22 from the nozzle 9a of each vapor deposition
source 9 arranged so as to face the can roller 7 to form an organic layer
on an anode-layer side of the substrate 21, the anode-layer side being
provided with the anode layer 23, and the vapor deposition step further
includes supplying the shadow mask 31 including the opening portions 31b
so as to interpose the shadow mask 31 between the substrate 21 held in
contact with the can roller 7, and the nozzle 9a, and by using a
substrate and a shadow mask each including a plurality of first and
second through holes 21a and 31a arranged in a longitudinal direction for
the substrate 21 and the shadow mask 31, respectively, and using a can
roller including alignment pins 11 (projections) that engage with the
first and second through holes 21a and 31a for the can roller 7, forming
the organic layer corresponding to the opening portions 31b on the
anode-layer side of the substrate 21, while moving the substrate 21 and
the shadow mask 31 with the first and second through holes 21a and 31a of
the substrate 21 and the shadow mask 31 engaged with the alignment pins
11.

[0096] Consequently, mere engagement of the first and second through holes
21a and 31a with the alignment pins 11 enables alignment between the
shadow mask 31 and the substrate 21, enabling vapor deposition of the
respective layers on the anode layer 23 while the alignment is being made
as described above. Accordingly, organic EL devices can effectively be
manufactured by suppressing displacements in the MD direction (movement
direction) and the TD direction (direction perpendicular of the movement
direction) of the respective layers formed on the substrate 21 without
employing a complicated configuration.

[0097] Next, an organic EL device manufacturing method and apparatus
according to a second embodiment of the present invention will be
described. FIG. 5 is a diagram illustrating an organic EL device
manufacturing apparatus according to a second embodiment of the present
invention.

[0098] The manufacturing apparatus according to the present embodiment
uses a circular (endless) shadow mask 31 instead of a rolled-up
strip-shaped shadow mask 31, and such circular shadow mask 31 is looped
around a plurality of rollers including a drive roller 41, and is rotated
by rotating the drive roller 41 to supply the shadow mask 31 so as to
face a substrate 21.

[0099] Furthermore, along with the employment of such shadow mask 31, a
vapor deposition source 9 is arranged in an inner space of the shadow
mask 31. The shadow mask 31 has second through holes 31a and opening
portions 31b at a surface thereof, as in the first embodiment. The rest
of configuration is similar to that of the manufacturing apparatus
according to the first embodiment, and a description thereof will be
omitted.

[0100] Also, the manufacturing method according to the present embodiment
using such manufacturing apparatus is similar to the manufacturing method
according to the first embodiment except the vapor deposition step is
performed using the aforementioned circular shadow mask 31.

[0101] According to the manufacturing apparatus and method of the present
embodiment, as in the first embodiment, the first through holes 21a of
the substrate 21 and the second through holes 31a of the circular shadow
mask 31 are fitted around alignment pins 11, and thus, an organic layer
forming material 22 can be vapor-deposited on an anode layer 23 formed on
the substrate 21 with alignment of the substrate 21 and the shadow mask
31 adjusted in the MD direction and the TD direction, enabling an organic
layer to be formed on the anode layer 23 with good positional accuracy.
Also, a cathode layer 27 can be formed on the organic layer in a manner
similar to the above, while the alignment is being made as described
above.

[0102] Next, an organic EL device manufacturing method and apparatus
according to a third embodiment of the present invention will be
described. FIG. 6 is a schematic side view of an alignment pin 11
provided at a can roller 7 used in an organic EL device manufacturing
apparatus according to a third embodiment of the present invention.
Components that are common in FIGS. 1 to 3 are provided with common
reference numerals and a description thereof will be omitted.

[0103] As illustrated in FIG. 6, in the manufacturing apparatus according
to the present embodiment alignment pins 11 each have a rectangular shape
in a cross section, and a taper shape tapering from the can roller 7 side
(the base end side) toward a distal end thereof. In other words, the
alignment pins 11 each have a quadrangular pyramid shape. Meanwhile,
first through holes 21a of a substrate 21 each have a shape and size that
are the same as those of base end portions of the alignment pins 11, and
a diameter of second through holes 31a of a shadow mask 31 is smaller
than a diameter of the first through holes 21a.

[0104] Consequently, upon the first through holes 21a being fitted around
the alignment pins 11, a back surface of the substrate 21 is brought into
contact with a circumferential surface of the can roller 7. Also, upon
the second through holes 31a being fitted around the alignment pins 11,
the shadow mask 31 is supported by the alignment pins 11 with a gap
between the shadow mask 31 and the substrate 21. While the shadow mask 31
and the substrate 21 are aligned with the shadow mask 31 separated from
the substrate 21 as described above, an evaporated organic layer forming
material 22 is discharged from a vapor deposition source 9, passes
through opening portions 31b and is deposited on an anode layer 23.
Furthermore, while the alignment is being made as described above, a
cathode layer 27 can be formed on the organic layer in such a manner as
described above. The rest of configuration is similar to that of the
manufacturing apparatus and method according to the first embodiment, and
thus, a description thereof will be omitted.

[0105] Furthermore, the manufacturing method according to the present
embodiment using such manufacturing apparatus is similar to the
manufacturing method according to the first embodiment except that a
vapor deposition step is performed using the aforementioned tapered
alignment pins 11, the first through holes 21a, and the second through
hole 31a having a diameter smaller than that of the first through holes
21a, and thus, a description thereof will be omitted.

[0106] In the manufacturing apparatus and method according to the present
embodiment, the substrate 21 and the shadow mask 31 face each other with
a gap therebetween, enabling prevention of breakage of the substrate 21
resulting from contact with the shadow mask 31.

[0107] An angle of tapering of the alignment pins 11 and the diameter of
the second through holes 31a can arbitrarily be determined so that a
desired gap can be formed between the substrate 21 and the shadow mask
31. Also, such gap can arbitrarily be determined according to, e.g., the
state of formation of the organic layer on the anode layer 23.

[0108] Furthermore, in the present embodiment, when a pitch of the
alignment pins 11 is large, the shadow mask 31 may be brought into
contact with the substrate 21. Accordingly, taking such point into
consideration in addition to the points described in the first embodiment
above, the number and pitch of alignment pins in the MD direction can be
determined: for example, twelve alignment pins 11 can be arranged at an
equal pitch of 30° or 36 alignment pins 11 can be arranged at an
equal pitch or 10°.

[0109] Although organic EL device manufacturing methods and apparatuses
according to the present invention have been described above, the present
invention is not limited to the above embodiments, and alterations can
arbitrarily be made within the intended scope of the present invention.
For example, in the first and second embodiments, the alignment pins 11
each have a quadrangular prism shape; however, the shape of the alignment
pins 11 is not specifically limited to such shape and the alignment pins
11 can be designed to have any other shape that allows the first through
holes 21a and the second through holes 31a to be engaged with each other
to adjust alignment between the substrate 21 and the shadow mask 31, such
as a triangular prism shape, a circular column shape or a column shape
having a star shape in a cross section, for example.

[0110] Also, in the third embodiment, the alignment pins 11 each have a
quadrangular pyramid shape; however, in this case, also, the shape of the
alignment pins 11 is not specifically limited to such shape, and any
other shape that allows the first through holes 21a and the second
through holes 31a to be fitted therearound to adjust alignment between
the substrate 21 and the shadow mask 31 and a gap to be formed between
the substrate 21 and the shadow mask 31, such as a triangular pyramid
shape, a circular cone shape, or a column shape having a star shape in a
cross section and a cross-sectional area decreasing toward a distal end
thereof, for example.

[0111] Furthermore, in the above embodiments, vacuum vapor deposition has
been used as a method for forming an organic layer on the anode layer 23
formed on the substrate 21; however, the layer formation method is not
specifically limited to those in the above embodiments, and another
method such as electron beam (EB) vapor deposition, sputtering or
chemical vapor deposition, for example, can be employed.

[0112] Furthermore, in the above embodiments, one shadow mask supply
device 6a is arranged in the vacuum chamber 3 to supply one shadow mask
31 from the shadow mask supply device 6a so that the shadow mask 31
overlaps the substrate 21 in a roll-to-roll manner: however, otherwise, a
plurality of shadow mask supply devices can be arranged in the vacuum
chamber 3 to supply a plurality of shadow masks 31 from the respective
shadow mask supply devices so as to face the substrate 21.

Example

[0113] Next, the present invention will be described in further detail
taking an example; however, the present invention is not limited to such
example.

Example

[0114] The manufacturing apparatus 1 according to the first embodiment,
which is illustrated in FIG. 1, was used. For a substrate 21, a rolled-up
SUS 304 (with a width of 50 mm, a length of 1000 m and a thickness of
0.05 mm) was used, and as a material for forming an anode layer 23, IZO
was used. A resin layer (JEM-477 manufactured by JSR Corporation) was
coated onto the substrate 21, and then dried and cured to form an
insulating layer with a thickness of 3 μm, and then, an IZO layer with
a thickness of 100 nm was formed by sputtering on the entire insulating
layer, and a photolithographic process was performed so as to leave
pieces of 35 mm×102.62 mm of the IZO layer at an interval of 2.1 mm
in a longitudinal direction (MD direction) at positions in a range of 5
mm to 10 mm from opposite ends in a width direction (TD direction),
thereby forming a pattern of the anode layer 23 including the IZO layer
(patterning).

[0115] Furthermore, using etching, first through holes 21a of 2.1
mm×2.1 mm (R: 0.5 mm) each having a corner-rounded square shape
were formed in the longitudinal direction at opposite end portions in the
width direction of the substrate 21 so that centers of the corner-rounded
square shapes are arranged 3 mm from the respective ends in the width
direction (TD direction) at a pitch of 104.72 mm in a direction of
movement of the substrate 21 (MD direction), and each of the first
through holes 21a is arranged between respective pieces in the pattern of
the anode layer 23.

[0116] For the shadow mask 31, two rolled-up SUSs 304 (with a width of 50
mm a length of 1000 mm and a thickness of 0.05 mm) (referred to as
"shadow masks 31A and 31B") were used. In the shadow mask 31A, using
photo-etching, second through holes 31a each having a corner-rounded
square shape of 2.1 mm×2.1 mm (R: 0.5 mm) were formed in the
longitudinal direction at opposite ends in a width direction of the
shadow mask 31A so that centers of the corner-rounded square shapes are
arranged 3 mm from the respective ends in the width direction (TD
direction) at a pitch of 104.72 mm in a direction of movement of the
shadow mask 31A (MD direction). Furthermore, simultaneously with the
formation of the second through holes 31a, an opening portion 31b of 36
mm×102.62 mm was formed by photo-etching at a center of each space
formed by four second through holes 31a including two in the TD direction
and two in the MD direction, thereby forming the shadow mask 31A.

[0117] For the shadow mask 31B, using photo-etching, second through holes
31a were formed at positions like those of the shadow mask 31A, and
simultaneously with the formation of the second through holes 31a, an
opening portion 31b of 30 mm×90 mm was formed by photo-etching at a
center of each space between the respective second through holes 31a in
the MD direction at a position in a range of 10 mm to 5 mm from
respective ends in the TD direction, thereby forming the shadow mask 31B.

[0118] On each of three can rollers 7 each having a diameter of 1200 mm,
36 alignment pins 11 of a corner-rounded regular quadrangular pyramid
shape each having a corner-rounded square bottom surface of 2 mm×2
mm (R: 0.5 mm), a corner-rounded square upper surface of 1.5 mm×1.5
mm (R: 0.5 mm) and a height of 3 mm were formed at a pitch of 10°
with reference to a rotation axis of the can roller 7.

[0119] Also, as illustrated in FIG. 7, at a position facing a region of
each can roller 7 that supports the substrate 21, a vapor deposition
source 9A for vapor-depositing a CuPc layer, which is a hole injection
layer, a vapor deposition source 9B for vapor-depositing an α-NPD
layer, which is a hole transport layer, a vapor deposition source 9C for
vapor-depositing an Alq3 layer, which is a light-emitting layer, and a
vapor deposition source 9D for vapor-depositing an LiF layer, which is an
electron injection layer, are arranged in this order from the upstream
side to the downstream side in a direction of rotation of the can roller
7.

[0120] Then, as described above, after plasma processing of the substrate
21, the first through holes 21a of the substrate 21 and the second
through holes 31a of the shadow mask 31A were fitted around the alignment
pins 11 to align the substrate 21 and the shadow mask 31A, respective
organic layer forming materials 22 were evaporated and discharged by the
vapor deposition sources 9A to 9D to sequentially deposit a CuPc layer,
an α-NPD layer an Alq3 layer and an LiF layer on the substrate 21
to form a four-layer structure of organic layers, and then, the substrate
21 and the shadow mask 31A were wound up. It should be noted that
vapor-deposition of a cathode layer 27 can be performed following the
vapor deposition of the organic layers without winding the shadow mask
31A up.

[0121] Next, as illustrated in FIG. 8, a vapor deposition source 9E for
vapor-depositing aluminum (Al), which is a cathode, was arranged in place
of the vapor deposition sources 9A to 9D at the position facing the
region of the can roller 7 that supports the substrate 21 in the vacuum
chamber 3, and the first through holes 21a of the substrate 21 and the
second through holes 31a of the shadow mask 31B were fitted around the
alignment pins 11 to align the substrate 21 and the shadow mask 31B, and
a cathode layer forming material 26 was evaporated and discharged by the
vapor deposition source 9E to deposit an Al layer on the organic layers,
and then, the substrate 21 and the shadow mask 31B were wound up.

[0122] Upon an electric field being applied to the anode layer 23 and the
cathode layer 27 of the wound-up substrate 21, the organic layer emitted
light. Also, when the amounts of displacement of the organic layers and
the cathode layer 27 from respective design values are measured every 10
mm in the MD direction using a laser measurement system unit (LV-9300
manufactured by Ono Sokki, Co. Ltd.), it has been found that the amount
of displacement is a maximum of 0.2 mm regardless of the length of
transport (position in the MD direction) and thus, the displacement
amount is small. It has also been found that the displacement amount is
small regardless of the materials of the layers formed on the substrate
21.

Comparative Example

[0123] Organic layers and a cathode layer were formed on a substrate in a
manner similar to that of the example except use of can rollers including
no alignment pins, and a substrate and a shadow mask each including no
through holes. Also, the amount of displacement of the organic layers and
the cathode layer from respective design values were measured as in the
example. As a result, the amounts of displacement of the organic layers
and the cathode layer were a maximum of 500 mm in the MD direction.

[0124] As a result of the above, it has been found that an organic EL
device manufacturing method and apparatus according to the present
invention enables efficient manufacture of organic EL devices by
adjusting the alignment of respective layers formed on a substrate in a
direction of movement thereof and a direction perpendicular to the
direction of movement without employing a complicated configuration.

[0125] This specification is by no means intended to restrict the present
invention to the preferred embodiments set forth therein. Various
modifications to the organic EL device manufacturing method and
apparatus, as described herein, may be made by those skilled in the art
without departing from the spirit and scope of the present invention as
defined in the appended claims.