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Deposition and Growth

Deposition and Growth

Sputtering

Sputtering is a physical deposition technique that relies on the removal of a material from a target by energetic ion bombardment in order to coat a substrate with the target material. The technique can be combined with reactive gases to form oxides and nitride films. The Penn State Nanofab currently maintains 5 sputtering systems.

ITO Sputter Thin Films

ITO 3000 A Sputter thin filmsIndium tin oxide is a widely used transparent conducting oxide. Its electrical conductivity and optical transparency make this a desirable material for several applications. In thin film form ITO has been used in liquid crystal displays, flat panel displays, plasma displays, touch panels, organic light-emitting diodes, solar cells, antistatic coatings and EMI shielding.

ITO sputter thin films have been deposited in the Kurt J. Lesker CMS-18 sputtering system. The film displayed in the image was deposited onto a standard microscope slide at 300 C to a thickness of 3000 angstroms. The sheet resistance was measured with a four point probe and found to be 10 ohm-square.

Techniques

Nobel metals and adhesion promoter combinations such as titanium/platinum (Ti/Pt) and Cr/Au are deposited in Kurt Lesker Sputter #2

Reactive sputtering of oxides and nitrides as well as metals/semi-metals (including nobel metals) and metal compounds is done in Kurt Lesker Sputter #1 and #4

An additional system from 4Wave is a unique blend of ion beam deposition and sputtering. Up to three source materials can be deposited simultaneously or in succession to deposit mixtures or multi-layered materials. The system offers the ability to precisely control the oxygen (or other reactive gas) content of the deposited film with the use of a fully integrated residual gas analyzer. (RGA) This has enabled better control of vanadium oxide deposition. Other materials will be added in the future.

Equipment/Systems

Four Wave Reactive Physical Vapor Deposition

The 4-Wave ion beam deposition system employs a low energy ion source to generate Ar ions. By applying a bias to the target or targets, the ions are accelerated to initiate the sputtering process. The flux of ions generated by the source aids in directing the sputtered material. The sputtered material is subsequently deposited down stream from the ion source.

Capabilities:

Can run three sources simultaneously or pulsed in a sequence

Excellent control of reactive sputtering processes are achievable with the RGA of partial pressures of reactant gases

Substrate is grounded

Pressure range is in the mid 10-4Torr

Well designed for the deposition of magnetic materials

Target utilization is very good

4" substrates and smaller may be processed

RIMS Name:

Sputter: 4Wave Ion Beam Deposition System

Training:

Please contact William Drawl for training.

Kurt J Lesker CMS-18 Sputter #1 (Reactive)

The CMS-18 is an extremely flexible three target reactive sputtering system with a load lock capable of small parts through 6" wafers. The system is capable of depositing multilayer film stacks, alloys, and reactively sputtered oxides and nitrides. The system is also setup for substrate heating as well as RF biasing and sample pre-cleaning.

RIMS Name:

Training:

Kurt J Lesker CMS-18 Sputter #2 (nobel metals)

Description:

The CMS-18 is an extremely flexible four target reactive sputtering system with a load lock capable of small parts through 6" wafers. The system is capable of depositing multilayer film stacks, alloys, and complex oxides such as PZT (lead zirconate titanate). The system is also setup for substrate heating as well as RF biasing and sample pre-cleaning.

Films Deposited:

RIMS Name:

Training:

Kurt J Lesker CMS-18 Sputter #3 (Complex oxides)

Description:

The CMS-18 is an extremely flexible four target reactive sputtering system with a load lock capable of small parts through 6" wafers. The system is capable of depositing multilayer film stacks, alloys, and complex oxides such as PZT (lead zirconate titanate). The system is also setup for substrate heating as well as RF biasing and sample pre-cleaning.

Training:

Kurt J Lesker CMS-18 Sputter #4 (Reactive/Metals)

Description:

The CMS-18 is a flexible two target sputtering system with a load lock capable of small parts through 6” wafers. The system is capable of depositing multilayer film stacks and alloys. The system is also setup for substrate heating as well as RF biasing and sample pre-cleaning.