MKS SBASE V1.3 change Stepper Drivers

Hello guys,
i am planning on building a Hypercube EVO.
I want to use a 32 Bit Board with TMC2100 for at least X- and Y.

I found The MKS SBASE v1.3 for really good prices (a smoothieboard clone: [de.aliexpress.com])
It comes with preinstalled DRV8825 drivers but as i said i want to use TMC drivers.

Is there a way to run them anyway?
I noticed a 4 Pin Output on the board in front of every driver, is this to attach another Stepper driver?
If not, is it possible to unsolder the installed drivers and solder TMCs?
When i do that, can i only switch the X- and Y drivers to TMC or do i have to change them all?

I also found the AZSMZ ARM pretty cheap, is this board good (maybe better?) and can it be used with the TMCs? (https://de.aliexpress.com/item/New-Version-AZSMZ-32bit-ARM-based-controller-3D-printers-CNC-Machines-Laser-cutters-Like-Azteeg-x5/32421892934.html)

I tried to google for a long time but did not find anything at all. I hope some of you can help me.

TMC2100 drivers are excellent in many respects (e.g. high microstepping and microstep interpolation), but the maximum current they can handle is lower than for many other drivers. That's why we chose the TMC2660 for the Duets rather than the TMC2130 (which is essentially a TMC2100 with SPI interface). Also the cooling of the driver chips is inadequate on all plug-in stepper driver modules, because there is far too little PCB area - hence you won't achieve the theoretical maximum current of any driver chip if you use it in the form of a plug-in module.

A proper heatsink with TIM should help greatly with the thermal capacity in place of the lack of pcb.

I would actually prefer that as a means of dissipating heat as relying on the pcb alone means that heat can spread to other components on the board which over time can cause erratic issues. Not to mention that it is still a passive cooling solution.

Now a combination of both would be the better solution. I do view the loss of modularity as a potential drawback however as it's nice to have the option to upgrade potions of my hardware.

The problem with using a heatsink and very little PCB area is getting the heat out of the chip and into the heatsink. Whereas a 4-layer PCB with 2oz copper on top and bottom can be very effective at removing the heat from the chip if designed properly, and a fan used to help remove the heat from the PCB if convention alone isn't sufficient.

Modularity of drivers is useful if you have very basic drivers to begin with, but not needed if the controller board has good drivers in the first place.

There was a time when 4988's were the driver of choice, then 8825's and then TMC2100s. Times change, being able to adapt your hardware at relatively low cost has merit. Your approach does too. Neither is the clear best solution.

Placing the heatsink directly on the chip or underside of the pcb will absorb heat, the increased surface area with a fan could also compensate for lack of convection. Again, both approaches have merit and can be deemed effective if planned accordingly.

Placing a heatsink on top of the chip does seem to help, however the plastic top of the chip does not conduct heat very well. With the exception of the chips used in RAPS128 drivers, all these chips have a metal slug on the bottom, intended to transfer heat to the PCB. So if you are stuck with insufficient PCB area, it's probably better to use thermal vias to transfer the heat to the other side of the PCB and put the heatsink there. This requires the plug-in driver module to be designed with the driver chip on the underside. I have seen some DRV8125 and TMC2208 plug-in drivers that are designed this way.