A leading supplier of precision cleaning chemistries to the worldwide electronics, metal finishing, medical, semiconductor, and optical industries.

Founded in Nashville, Tennessee, KYZEN is the worldwide leader in the precision cleaning industry. Kyzen provides award winning cleaning chemistries for electronics and advanced packaging applications. We offer a broad range of process solutions ranging from sprayable aqueous cleaning formulations to engineered vapor degreasing solvents. Kyzen also has a fully equipped applications lab staffed with experts to help with customer process development. All of our products are environmentally friendly and effective in virtually all cleaning systems available today. Our goal is to provide our customers with integrated cleaning SOLUTIONS!

KYZEN’s Nashville, Tennessee USA Operation is unique with extensive Research and Developmental, Applications Testing, manufacturing and Global Headquarters functions. These best in the world facilities are complemented by our Applications and Engineering Laboratory in Manchester, New Hampshire, USA. These laboratories are fully equipped to support product development, analytical services, process development and customer process support challenges.

KYZEN Corporation Postings

AQUANOX® A4241 is an aqueous cleaning solution designed with revolutionary inhibition technology to be effective on the toughest soils while protecting even the most sensitive parts from etch or darkening. AQUANOX® A4241can be used in mult...

AQUANOX® A4625B is an innovative aqueous chemistry designed for optimum effectiveness in batch washers.
This easy to use product will remove all types of electronic flux residues including the latest lead free. AQUANOX® A4625B ...

Concentrated Aqueous Electronics Cleaner
AQUANOX® A4633 was designed to clean flux residues from electronic assemblies in high and medium pressure batch and in-line spray washers having short wash zones. The ingredients used in A46...

AQUANOX® A4651US is a low pH aqueous cleaning solution designed exclusively for use in ultrasonic immersion cleaning systems.
AQUANOX® A4651US will provide brilliant solder joints with no sump side additives and cleans exceptio...

AQUANOX® A4708 is a neutral range pH chemistry designed to rapidly clean under densely populated low-gap PWB assemblies.
AQUANOX® A4708 is effective on all flux types including no-clean and water soluble residues. AQUANOX® ...

Aqueous Cleaner for Flip Chips and Advanced Packaging
AQUANOX® A4520 is an aqueous blend designed to remove re-flowed pastes, tacky, no clean and a majority of lead free residues while exceeding industry standards for worker and en...

Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance drops on both cleaned and non-cleaned circuit assemblies. It is well documented in the literature that SIR detects ionic residue and the potential of this residue to cause leakage currents in the presence of humidity and bias. Residues under leadless components are hard to inspect for and to ensure flux residue is totally removed. The question many assemblers consider is the risk of residues that may still be present under the body of components....

Packaging trends enable disruptive technologies. The miniaturization of components reduces the distance between conductive paths. Cleanliness of electronic hardware based on the service exposure of electrical equipment and controls can improve the reliability and cost effectiveness of the entire system. Problems resulting from leakage currents and electrochemical migration lead to unintended power disruption and intermittent performance problems due to corrosion issues.

Solvent cleaning has a long history of use for cleaning electronic hardware. Limitations with solvent based cleaning agents due to environmental effects and the ability to clean new flux designs commonly used to join miniaturized components has limited the use of solvent cleaning processes for cleaning electronic hardware. To address these limitations, new solvent cleaning agents and processes have been designed to clean highly dense electronic hardware.

The research study will evaluate the cleaning and electrical performance using the IPC B-52 Test Vehicle. Lead Free noclean solder paste will be used to join the components to the test vehicle. Ion Chromatography and SIR values will be reported....

The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller components, no-clean lead-free solder technologies, competitive forces and automated assembly create process challenges. Cleanliness under the bottom terminations must be maintained in harsh environments. Residues under components can attract moisture and lead to leakage currents and the potential for electrochemical migration (...)

The purpose of this research study is to evaluate innovative spray and soak methods for removing low residue flux residues and thoroughly rinsing under Bottom Termination and Leadless Components...

High density and miniaturized circuit assemblies challenge the solder paste printing process. The use of small components such as 0201, 01005 and μBGA devices require good paste release to prevent solder paste bridging and misalignment. When placing these miniaturized components, taller paste deposits are often required. To improve solder paste deposition, a nano-coating is applied to laser cut stencils to improve transfer efficiency. One concern is the compatibility of the nano-coating with cleaning agents used in understencil wipe and stencil cleaning. The purpose of this research is to test the chemical compatibility of common cleaning agents used in understencil wipe and stencil cleaning processes.Compatibility of Cleaning Agents With Nano-Coated Stencils...

This paper researches the effectiveness of the R.O.S.E. cleanliness testing process for dissolving and measuring ionic contaminants from boards soldered with no-clean and lead-free flux technologies....

Jan 28, 2018 | KYZEN cleaning experts have created the world’s first Cleaning IQ Test to be introduced at the 2018 IPC APEX EXPO, scheduled to take place Feb. 27 - March 1, 2018 at the San Diego Convention Center in Ca. Inspired by KYZEN’s commitment to industry education and technical support, it is easy to test your knowledge in Booth #3449 at the show. You may even win a reward for your skills. “KYZEN loves to make technical learning friendly, fun and efficient,” said Sherry Stepp, Global Segment Leader for Electronic Manufacturing at KYZEN. “It is part of our commitment to constantly improving cleaning process performance through the convergence of Science and Care.”

Jan 18, 2018 | KYZEN just announced the opening of a new state-of-the-art Applications Lab by its Philippine Distributor, Aurotech. The Lab assists KYZEN customers with smaller-scale cleaning evaluations.

Nov 15, 2017 | KYZEN announces that it was awarded a 2017 Global Technology Award in the category of Cleaning Equipment for the KYZEN ANALYST™. The award was presented to the company during a Tuesday, Nov. 14, 2017 ceremony that took place during productronica in Munich, Germany. Launched in the fall of 2016, the KYZEN ANALYST received instant acceptance and broad adoption, closely followed by now three prestigious industry awards for innovation for its breakthrough features and technology. This award also marks KYZEN’s 60th industry award for its cleaning chemistries and process monitoring and control equipment.

Sep 28, 2017 | KYZEN was honored with multiple industry awards during a busy week at the Surface Mount Technology Association (SMTA) International trade event in Chicago, IL, the week of Sept. 18, 2017. The SMTA made time to celebrate corporate and chapter accomplishments, as well as individual contributions.

Sep 05, 2017 | KYZEN is pleased to announce that Dr. Mike Bixenman will conduct a special workshop during the SMTA International Technical Conference, scheduled to take place Sept. 17-21, 2017 at the Donald E. Stephens Convention Center in Rosemont, IL. The workshop, entitled “Characterization of Soldering Materials, Contaminants, Cleaning Processes and Process Control for Building Reliable Electronic Assemblies,” is scheduled to take place Monday, Sept. 18 from 1:30-5 p.m.

Aug 30, 2017 | KYZEN is proud to announce that it is sponsoring the Women’s Connection Reception to be held at SMTA International on Monday, Sept. 18, 2017 at 5 p.m. in Room 44 at the Donald E. Stephens Convention Center. This is the fifth consecutive year that KYZEN has sponsored this event in support of women in science.

Aug 29, 2017 | KYZEN is pleased to announce that Dr. Mike Bixenman, DBA, has co-authored three papers that will be presented during the technical conference at SMTA International. The SMTA International Technical Conference is scheduled to take place Sept. 17-21, 2017 at the Donald E. Stephens Convention Center in Rosemont, IL.

Aug 15, 2017 | The KYZEN ANALYST™, launched in the fall of 2016, received almost instant market penetration, as well as two prestigious industry awards for innovation for its breakthrough features and technology. The original KYZEN ANALYST delivers real-time analytics and trending data for wash bath concentration monitoring and managing systems. Now, KYZEN announces the expansion of the KYZEN ANALYST enabled Process Control System (PCS) for in-line cleaning processes. It offers the same detailed data delivery and custom dashboards, viewable in real-time from anywhere in the world.