R5F21276SNXXXFP Datasheet PDF

These MCUs are fabricated using a high-performance silicon gate CMOS process, embedding the R8C CPU core, and are packaged in a 32-pin molded-plastic LQFP. It implements sophisticated instructions for a high level of instruction efficiency. With 1 Mbyte of address space, they are capable of executing instructions at high speed.

Furthermore, the R8C/27 Group has on-chip data flash (1 KB × 2 blocks). The difference between the R8C/26 Group and R8C/27 Groupis only the presence or absence of data flash. Their peripheral functions are the same.

R5F21276SNXXXFP Datasheet PDF Download

Other data sheets within the file : R5F21262SDFP,R5F21262SDXXXFP,R5F21262SNFP,R5F21262SNXXXFP,R5F21264JFP