LED Journal's "Innova Award", for Heat-Spring® thermal interface material. This award recognizes, "leading companies within the LED market which have shown, through their products and services, the most innovative and advanced technology breakthroughs in LEDs.", May 2010.

Frost & Sullivan Award

According to Frost & Sullivan, awards are presented to companies "for exhibiting a superior knowledge of
customer needs and the ability to exceed customer expectations." Indium Corporation was chosen to receive
the award based on an in-depth analysis of market competitors, and interviews with companies that make up
the SMT soldering materials industry.

"These awards are special because they are presented by the largest and most respected research firm
in the world," said Rick Short, Director of Corporation Communications. "It is truly a tribute to the
global Indium Corporation team."

Previous Frost & Sullivan Awards include:

2003: Product Innovation Award for the development of NC-SMQ230 Pb-Free Solder Paste

2000: Market Engineering Customer Service Leadership Award for developments in the solder paste and adhesive markets

1998: Market Engineering Customer Service Leadership Award for developments in the solder paste and adhesive markets

Triple Awards for NF260 No-Flow Underfill

Indium Corporation’s introduced the world’s first Pb-Free, Reworkable, Air-Reflowable, No-Flow Underfill, called NF260, in 2005. Since its introduction Indium’s NF260 No-Flow Underfill has won awards on three continents for its quality and innovation, as well as its ability to enhance customers’ finished goods reliability and cost savings.