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1. A thermal management and/or electromagnetic interference (EMI)
mitigation material comprising one or more exterior surfaces, wherein one
or more portions of the one or more exterior surfaces are modified so as
to be distinguishable from and/or have one or more colors different than
a pre-existing color of the thermal management and/or EMI mitigation
material, and wherein: the one or more portions of the one or more
exterior surfaces include one or more colorants to thereby cause the one
or more portions of the one or more exterior surfaces to have one or more
colors different than the pre-existing color of the thermal management
and/or EMI mitigation material; and/or the one or more portions of the
one or more exterior surfaces include one or more laser markings that are
distinguishable from the pre-existing color of the thermal management
and/or EMI mitigation material.

2. The thermal management and/or EMI mitigation material of claim 1,
wherein the one or more portions of the one or more exterior surfaces
define one or more of a company name, a product name, a part number, a
barcode, a universal product code (UPC), a quick response (QR) code, a
logo, or one or more alphanumeric characters distinguishable from the
pre-existing color of the thermal management and/or EMI mitigation
material.

3. The thermal management and/or EMI mitigation material of claim 1,
wherein the one or more portions of the one or more exterior surfaces
include the one or more colorants to thereby cause the one or more
portions of the one or more exterior surfaces to have one or more colors
different than the pre-existing color of the thermal management and/or
EMI mitigation material, and wherein the one or more colorants are
applied to the one or more portions of the one or more exterior surfaces
without adding pigment to or altering an original formulation of the
thermal management and/or EMI mitigation material, whereby the
pre-existing color of the thermal management and/or EMI mitigation
material remains unchanged.

4. The thermal management and/or EMI mitigation material of claim 1,
wherein the one or more colorants comprise a silicone based ink.

5. The thermal management and/or EMI mitigation material of claim 4,
wherein after the silicone based ink is cured, each of the one or more
portions of the one or more exterior surfaces to which the silicone based
ink was applied includes a layer of color formed by the cured silicone
based ink; and wherein: the layer of color is stretchable and moveable
along with the corresponding one or more portions of the one or more
exterior surfaces; and/or the layer of color is dielectric; and/or the
layer of color is naturally non-tacky such that the one or more portions
of the one or more exterior surfaces are releasable easily and cleanly
from another surface.

6. The thermal management and/or EMI mitigation material of claim 1,
wherein the one or more colorants comprise a colored film or an ink.

7. The thermal management and/or EMI mitigation material of claim 1,
wherein the one or more colorants form a layer of color: having a
thickness less than 1 mil along each of the one or more portions of the
one or more exterior surfaces to which the one or more colorants were
applied; and/or that is stretchable and moveable along with the
corresponding one or more portions of the one or more exterior surfaces;
and/or that is dielectric; and/or that is naturally non-tacky such that
the one or more portions of the one or more exterior surfaces are
releasable easily and cleanly from another surface.

8. The thermal management and/or EMI mitigation material of claim 1,
wherein the one or more portions of the one or more exterior surfaces are
detectable by an automated visual detection system; and/or wherein: the
one or more portions of the one or more exterior surfaces define a single
solid color across at least one entire exterior surface of the thermal
management and/or EMI mitigation material; or the one or more portions of
the one or more exterior surfaces define a pattern of different colors;
or the one or more portions of the one or more exterior surfaces
cooperate with the pre-existing color of the thermal management and/or
EMI mitigation material to define a pattern of colors including the one
or more colors of the one or more portions of the one or more exterior
surfaces and the pre-existing color of the thermal management and/or EMI
mitigation material; and/or the one or more portions of the one or more
exterior surfaces include one or more laser markings, ink, and/or
colorants that define a company name, a product name, a part number, a
barcode, a universal product code (UPC), a quick response (QR) code, a
logo, or one or more alphanumeric characters.

9. The thermal management and/or EMI mitigation material of claim 1,
wherein the pre-existing color of the thermal management and/or EMI
mitigation material is a natural color of the thermal management and/or
EMI mitigation material without any pigment added to the thermal
management and/or EMI mitigation material, or a color determined by one
or more pigments added to the thermal management and/or EMI mitigation
material; and wherein: only a top exterior surface of the thermal
management and/or EMI mitigation material is modified so as to be
distinguishable from and/or have one or more colors different than the
pre-existing color of the thermal management and/or EMI mitigation
material; or at least two exterior surfaces of the thermal management
and/or EMI mitigation material are modified so as to be distinguishable
from and/or have one or more colors different than the pre-existing color
of the thermal management and/or EMI mitigation material.

11. A method of providing color to a pre-existing thermal management
and/or EMI mitigation material having a pre-existing color, the method
comprising modifying one or more portions of one or more exterior
surfaces of the pre-existing thermal management and/or EMI mitigation
material, such that the one or more portions are distinguishable from
and/or have one or more colors different than the pre-existing color of
the pre-existing thermal management and/or EMI mitigation material,
wherein modifying one or more portions of one or more exterior surfaces
of the pre-existing thermal management and/or EMI mitigation material
comprises applying one or more colorants to the one or more portions of
the one or more exterior surfaces of the pre-existing thermal management
and/or EMI mitigation material such that the one or more portions have
one or more colors different than the pre-existing color of the
pre-existing thermal management and/or EMI mitigation material.

12. The method of claim 11, further comprising making a thermal
management and/or EMI mitigation material using an original formulation
without adding pigment to the original formulation to thereby provide the
pre-existing thermal management and/or EMI mitigation material, and then
applying the one or more colorants to the one or more portions of the one
or more exterior surfaces of the pre-existing thermal management and/or
EMI mitigation material.

14. The method of claim 11, wherein applying one or more colorants
comprises applying silicone based ink to the one or more portions of the
one or more exterior surfaces of the pre-existing thermal management
and/or EMI mitigation material.

15. The method of claim 14, further comprising allowing the silicone
based ink to cure and form a layer of color along each of the one or more
portions of the one or more exterior surfaces to which the silicone based
ink was applied, and wherein: the layer of color is stretchable and
moveable along with the corresponding one or more portions of the one or
more exterior surfaces; and/or the layer of color is dielectric; and/or
the layer of color is naturally non-tacky such the one or more portions
of the one or more exterior surfaces are releasable easily and cleanly
from another surface.

17. The method of claim 11, wherein the one or more colorants form a
layer of color: having a thickness less than 1 mil along each of the one
or more portions of the one or more exterior surfaces to which the one or
more colorants were applied; and/or that is stretchable and moveable
along with the corresponding one or more portions of the one or more
exterior surfaces; and/or that is dielectric; and/or that is naturally
non-tacky such that the one or more portions of the one or more exterior
surfaces are releasable easily and cleanly from another surface.

18. The method of claim 11, wherein modifying one or more portions of one
or more exterior surfaces of the pre-existing thermal management and/or
EMI mitigation material comprises defining one more of a company name, a
product name, a part number, a barcode, a universal product code (UPC), a
quick response (QR) code, a logo, or one or more alphanumeric characters
along the one or more portions and distinguishable from the pre-existing
color of the thermal management and/or EMI mitigation material.

19. The method of claim 11, wherein the one or more portions of the one
or more exterior surfaces are detectable by an automated visual detection
system; and/or wherein: the one or more portions of the one or more
exterior surfaces define a single solid color across at least one entire
exterior surface of the thermal management and/or EMI mitigation
material; or the one or more portions of the one or more exterior
surfaces define a pattern of different colors; or the one or more
portions of the one or more exterior surfaces cooperate with the
pre-existing color of the thermal management and/or EMI mitigation
material to define a pattern of colors including the one or more colors
of the one or more portions of the one or more exterior surfaces and the
pre-existing color of the thermal management and/or EMI mitigation
material; and/or the one or more portions of the one or more exterior
surfaces define a company name, a product name, a part number, a barcode,
a universal product code (UPC), a quick response (QR) code, a logo, or
one or more alphanumeric characters.

20. The method of claim 11, wherein modifying one or more portions of one
or more exterior surfaces of the pre-existing thermal management and/or
EMI mitigation material comprises applying a colored film or an ink to
the one or more portions of the one or more exterior surfaces of the
pre-existing thermal management and/or EMI mitigation material.

21. The method of claim 11, wherein: the pre-existing color of the
thermal management and/or EMI mitigation material is a natural color of
the thermal management and/or EMI mitigation material without any pigment
added to the thermal management and/or EMI mitigation material, or a
color determined by one or more pigments added to the thermal management
and/or EMI mitigation material; and modifying one or more portions of one
or more exterior surfaces of the pre-existing thermal management and/or
EMI mitigation material comprises: modifying only a top exterior surface
of the pre-existing thermal management and/or EMI mitigation material; or
modifying at least two exterior surfaces of the pre-existing thermal
management and/or EMI mitigation material.

23. A method of providing color to a pre-existing thermal management
and/or EMI mitigation material having a pre-existing color, the method
comprising modifying one or more portions of one or more exterior
surfaces of the pre-existing thermal management and/or EMI mitigation
material, such that the one or more portions are distinguishable from
and/or have one or more colors different than the pre-existing color of
the pre-existing thermal management and/or EMI mitigation material, and
wherein modifying one or more portions of one or more exterior surfaces
of the pre-existing thermal management and/or EMI mitigation material
comprises applying a laser to the one or more portions; and/or using a
fiber laser technique; and/or laser marking the one or more portions;
and/or wherein the method further comprises making a thermal management
and/or EMI mitigation material using an original formulation without
adding pigment to the original formulation to thereby provide the
pre-existing thermal management and/or EMI mitigation material, and then
modifying the one or more portions of the one or more exterior surfaces
of the pre-existing thermal management and/or EMI mitigation material.

[0001] This application is a U.S. continuation application that claims
priority to and the benefit of PCT International Application No.
PCT/US2016/041891 filed Jul. 12, 2016 (published as WO 2017/011453
published Jan. 19, 2017, which, in turn, claims priority to and the
benefit of U.S. Provisional Patent Application No. 62/191,876 filed Jul.
13, 2015 and U.S. Provisional Patent Application No. 62/214,080 filed
Sep. 3, 2015. The entire disclosures of the above applications are
incorporated herein by reference.

[0003] This section provides background information related to the present
disclosure which is not necessarily prior art.

[0004] Electrical components, such as semiconductors, integrated circuit
packages, transistors, etc., typically have pre-designed temperatures at
which the electrical components optimally operate. Ideally, the
pre-designed temperatures approximate the temperature of the surrounding
air. But the operation of electrical components generates heat. If the
heat is not removed, the electrical components may then operate at
temperatures significantly higher than their normal or desirable
operating temperature. Such excessive temperatures may adversely affect
the operating characteristics of the electrical components and the
operation of the associated device.

[0005] To avoid or at least reduce the adverse operating characteristics
from the heat generation, the heat should be removed, for example, by
conducting the heat from the operating electrical component to a heat
sink. The heat sink may then be cooled by conventional convection and/or
radiation techniques. During conduction, the heat may pass from the
operating electrical component to the heat sink either by direct surface
contact between the electrical component and heat sink and/or by contact
of the electrical component and heat sink surfaces through an
intermediate medium or thermal interface material (TIM). The thermal
interface material may be used to fill the gap between thermal transfer
surfaces, in order to increase thermal transfer efficiency as compared to
having the gap filled with air, which is a relatively poor thermal
conductor.

[0006] In addition, a common problem in the operation of electronic
devices is the generation of electromagnetic radiation within the
electronic circuitry of the equipment. Such radiation may result in
electromagnetic interference (EMI) or radio frequency interference (RFI),
which can interfere with the operation of other electronic devices within
a certain proximity. Without adequate shielding, EMI/RFI interference may
cause degradation or complete loss of important signals, thereby
rendering the electronic equipment inefficient or inoperable.

[0007] A common solution to ameliorate the effects of EMI/RFI is through
the use of shields capable of absorbing and/or reflecting and/or
redirecting EMI energy. These shields are typically employed to localize
EMI/RFI within its source, and to insulate other devices proximal to the
EMI/RFI source.

[0008] The term "EMI" as used herein should be considered to generally
include and refer to EMI emissions and RFI emissions, and the term
"electromagnetic" should be considered to generally include and refer to
electromagnetic and radio frequency from external sources and internal
sources. Accordingly, the term shielding (as used herein) broadly
includes and refers to mitigating (or limiting) EMI and/or RFI, such as
by absorbing, reflecting, blocking, and/or redirecting the energy or some
combination thereof so that it no longer interferes, for example, for
government compliance and/or for internal functionality of the electronic
component system.

DRAWINGS

[0009] The drawings described herein are for illustrative purposes only of
selected embodiments and not all possible implementations, and is not
intended to limit the scope of the present disclosure.

[0017] Conventionally, a thermal interface material (TIM) may be provided
or made in only one color, which is set by either a pigment in the TIM
formulation or by the natural color of the filler(s) (e.g.,
thermally-conductive filler, etc.) used in the TIM formulation.
Similarly, a conventional EMI shielding material or absorber may also be
provided or made in only one color, which is also set by either a pigment
in the formulation or by the natural color of the filler(s) (e.g.,
electrically-conductive fillers, EMI absorbing particles, etc.) used in
the formulation.

[0018] The inventors have recognized an increased use of automated visual
detection systems to confirm whether or not a material, such as a thermal
interface material, has been correctly installed or placed in an
application. This increased use may be due in part to how easily human
eyes may become fatigued when used instead of an automated vision system.

[0019] For example, an automated vision system works most effectively when
there is a significant difference in color and/or contrast between the
thermal interface material and the substrate on which the thermal
interface material is placed. An automated vision system may not be able
to detect a thermal interface material and its relative positioning on a
substrate if the exterior surface(s) of the thermal interface material
(e.g., an exposed, upwardly facing exterior surface, etc.) is the same
color as the exterior surface(s) of the substrate (e.g., an exposed,
upwardly facing portion of the substrate surface adjacent the thermal
interface material, etc.). If a thermal interface material is missing or
incorrectly placed, this could result in overheating of and damage to the
electronic device. The vision system may instead just be human eyes, in
which case the difference in color and/or contrast may advantageously
allow a person to more easily and quickly determine at a glance that all
thermal interface materials are in place.

[0020] In addition to colored materials (e.g., thermal management and/or
EMI mitigation materials, etc.) being more easily detected by an
automated vision detection system, the inventors hereof have also
recognized other reasons why their custom colored thermal management
and/or EMI mitigation materials may be requested or desired. For example,
custom coloration of a thermal management and/or EMI mitigation material
may be requested purely for aesthetic reasons. By way of further example,
customized colorization of a thermal management and/or EMI mitigation
material may also be useful for differentiating different materials from
each other, matching a competitor's material, differentiating thicknesses
to avoid confusion, differentiating one face of the thermal management
and/or EMI mitigation material from the other, making counterfeiting
activity more difficult, etc. Moreover, sometimes a commercially
available color is not acceptable.

[0021] After recognizing the above, the inventors hereof developed and
disclose exemplary embodiments of thermal management and/or EMI
mitigation materials having custom colored exterior surfaces. The thermal
management and/or EMI mitigation materials disclosed herein may have
exterior surfaces that are customized, tailored, or custom colored to
have one or more predetermined colors (e.g., one or more colors different
than a pre-existing color of the thermal interface material, etc.). For
example, a thermal interface material may have a natural grey color
without any coloring pigment added (e.g., thermal interface material 100
shown in FIG. 1, etc.). According to exemplary embodiments disclosed
herein, one or more portions of (or the entirety of) of one or more of
(or all of) the thermal interface material's grey colored exterior
surface(s) may be modified or custom colored, e.g., green (e.g., thermal
interface material 200 shown in FIG. 2, etc.), blue (e.g., thermal
interface material 300 shown in FIG. 3, etc.), black (e.g., thermal
interface material 400 shown in FIG. 4, etc.), pink (e.g., thermal
interface material 500 shown in FIG. 5, etc.), etc.

[0023] In exemplary embodiments, coloring or colorant (e.g., ink, film,
dielectric material, other coloring substance, etc.) is provided on one
or more exterior surfaces of an existing thermal management and/or EMI
mitigation material. For example, an exemplary method generally includes
providing color to or coloring only one or more exterior surfaces (or one
or more surface portions thereof) of a thermal interface material instead
of changing the color of an entire thermal interface material by altering
the TIM formulation, e.g., adding pigment to the formulation, etc.

[0024] In exemplary embodiments, a thermal management and/or EMI
mitigation material has one or more exterior surfaces that are customized
by applying one or more colorants to the one or more exterior surfaces.
For example, only the top surface may be modified or colored so as to
have one or more colors different than the material's pre-existing color
(e.g., a natural color of the thermal management and/or EMI mitigation
material without any pigment added to the formulation, or a color that is
determined by one or more pigments added to the formulation, etc.). Or,
for example, either or both of the material's oppositely facing upper and
lower surfaces may be modified or colored so as to have one or more
colors different than a pre-existing color of the thermal management
and/or EMI mitigation material. As yet another example, all exterior
surfaces of the thermal management and/or EMI mitigation material may be
modified or colored so as to have one or more colors different than a
pre-existing color of the thermal management and/or EMI mitigation
material. In a further example, all of the exterior surfaces except
either or both of the opposite exterior end surfaces may be modified or
colored so as to have one or more colors different than a pre-existing
color of the thermal management and/or EMI mitigation material.

[0025] The particular color(s) or pattern of colors provided to an
exterior surface(s) may vary, for example, depending on the particular
automated visual equipment that will be used to detect the presence of
the material and its proper placement (e.g., relative to a printed
circuit board, electronic components, heat sink, heat spreader, etc.),
preferences of the customer and/or end user, a particular application in
which the material will be used, etc. By way of example, an entire
exterior surface may be modified or colored so as to have the same or
consistent color (e.g., same even or solid color that is not shaded or
variegated, etc.) or substantially the same color (e.g., a substantially
same even or solid color with at least some shading, variegation, or
color variation, etc.). By way of further example, only a portion or less
than all of an exterior surface may be modified or colored such that the
remainder of the exterior surface remains the pre-existing color of the
thermal management and/or EMI mitigation material. As yet another
example, an exterior surface may be modified to have a pattern of one or
more colors (e.g., striped pattern, polka dot pattern, etc.), such as a
pattern of two or more custom colors, a pattern defined by the
pre-existing color of the thermal management and/or EMI mitigation
material and one or more other colors, etc.

[0026] A further example includes an exterior surface(s) of a thermal
management and/or EMI mitigation material that may be modified using a
laser (e.g., a fiber laser technique, etc.) to provide a laser marking
along the exterior surface, such as a laser marking that defines a
company name, a product name, a part number, a barcode, a universal
product code (UPC), a quick response (QR) code, a logo, one or more
alphanumeric characters, etc. The laser marking may be distinguishable
from the pre-existing color of the thermal management and/or EMI
mitigation material. For example, a laser marking may be dark black or
gray, and the pre-existing color may be green. In addition, the thermal
management and/or EMI mitigation material may have one or more laser
markings on a first side that are different than laser markings on the
other sides of the thermal management and/or EMI mitigation material. In
addition, or alternatively, other means besides laser markings (e.g.,
silicone-based ink, etc.) may be used along an exterior surface of a
thermal management and/or EMI mitigation material to define a company
name, a product name, a part number, a barcode, a universal product code
(UPC), a quick response (QR) code, a logo, one or more alphanumeric
characters, etc. may be provided on a surface of a of a thermal
management and/or EMI mitigation material.

[0027] In an exemplary embodiment, a fiber laser is used to provide one or
more laser markings along an exterior surface(s) of a thermal management
and/or EMI mitigation material. Advantageously, the fiber laser may be
capable of creating the laser marking without excessively gouging the
exterior surface(s), without making excessively deep marks in the
exterior surface, and without creating too much surface debris. A laser
also may provide the ability to raster over a relatively large area
compared to some continuous inkjet marking systems.

[0028] In another exemplary embodiment, a thermal management and/or EMI
mitigation material comprises a compliant or conformable
thermally-conductive silicone pad having exterior surfaces. A thin layer
of color may be provided only on the top exterior surface of the silicone
pad. For example, a silicone based ink may be applied to the top exterior
surface, which ink will adhere to the silicone pad. After the ink is
cured, a relatively tough, thin layer of color is formed by the cured ink
along the top surface of the silicone pad. The thin layer of color is
stretchable and moveable along with the silicone pad. In some exemplary
embodiments, the thin layer of color may be dielectric and not
electrically conductive.

[0029] Various methods may be used for applying a silicone based ink or
other ink to an exterior surface(s) of a thermal management and/or EMI
mitigation material in exemplary embodiments. For example, a silicone
based ink may be applied via spray coating, ink jet printing, a print
nozzle, brushing, screen printing, pad printing, stencil printing, roller
coating, printing through mesh, other printing methods, etc. The ink may
be deposited, dispensed, or applied before or after die cutting the
thermal management and/or EMI mitigation material. In other exemplary
embodiments, a thin continuous colored film may be applied to an exterior
surface(s) of a thermal management and/or EMI mitigation material. The
ink or film may be applied so as to provide a color in a pattern, to
provide a color that defines a logo, company name, product name, part
number, barcode, universal product code (UPC), quick response (QR) code,
one or more alphanumeric characters, etc., or to provide a color
consistent across an entire exterior surface, etc.

[0030] By way of example, an exemplary embodiment may include a CHT
silicone ink available from AIM Screenprinting Supply that is printed
through mesh (e.g., mesh ranging from 86 to 160 threads per inch. (32-64
threads per centimeter), etc.) onto an exterior surface(s) of a thermal
management and/or EMI mitigation material and then flash cured (e.g., at
a temperature no higher than 140 degrees Fahrenheit and for no longer
than 3 seconds, etc.). By way of background, CHT silicone ink is a two
part system that includes a white, neutral Base, 12 opaque pigments, and
four fluorescent pigments. The system is polyvinyl chloride (PVC) and
phthalate free. The silicone ink may include one or more additives, such
as a catalyst, a thickener for increasing viscosity or a thinner for
decreasing viscosity, and an anti-migration additive.

[0031] Also by way of example, another exemplary embodiment may include a
SYLUB Ink System available from Silicone Inks Ltd. In this example, the
ink may be screen printed or applied by pad printing, spraying, etc. to
an exterior surface(s) of a thermal management and/or EMI mitigation
material. The ink may comprise vinyl polydimethylsiloxane with platinum
catalyst and pigments.

[0032] As yet another example, a further exemplary embodiment may include
a colored polyurethane or silicone transfer film, where the colored film
is laminated to an exterior surface of a thermal management and/or EMI
mitigation material before or after curing of the silicone body of the
thermal management and/or EMI mitigation material. Alternative
embodiments may include other suitable inks and/or other suitable colored
films.

[0033] In exemplary embodiments, the color(s) (e.g., colorants, etc.)
and/or markings (e.g., laser markings, etc.) may be added to exterior
surface(s) of a thermal management and/or EMI mitigation material without
significantly impacting the thermal resistance (e.g., less than 10%
increase in thermal resistance, etc.). For example, an exemplary
embodiment includes adding a very thin layer so as to not significantly
impact thermal resistance. By way of example, a silicone based ink may be
applied to an exterior surface(s) of a thermal management and/or EMI
mitigation material such that the cured ink forms a colored layer less
than 1 mil thick on the exterior surface. Or, for example, a colored film
having a thickness less than 1 mil may be applied to an exterior
surface(s) of a thermal management and/or EMI mitigation material. As a
further example, an exterior surface(s) of a thermal management and/or
EMI mitigation material may be coated with a colorant such that the
resultant coating has a thickness less than 1 mil thick. As yet another
example, an exterior surface(s) of a thermal management and/or EMI
mitigation material may be modified to include one or more laser markings
thereon.

[0034] Furthermore, it is sometimes beneficial that a thermal management
and/or EMI mitigation material be non-tacky on one side for handling and
easy release during rework. As disclosed herein for exemplary
embodiments, colorant (e.g., an ink, a film, a dielectric material, etc.)
may be applied directly to an exterior surface(s) of a thermal management
and/or EMI mitigation material. The colorant may be naturally non-tacky.
In which case, the colored exterior surface of the thermal management
and/or EMI mitigation material is less tacky than the underlying thermal
management and/or EMI mitigation material, which, in turn, may then allow
the thermal management and/or EMI mitigation material to release easily,
e.g., cleanly, during rework. For example, the colored exterior surface
may allow the thermal management and/or EMI mitigation material to be
readily removed from another component, e.g., without adhering to and
leaving a residue on the other component at room temperature, etc. In an
exemplary embodiment, an exterior surface(s) of a thermal management
and/or EMI mitigation material may have a non-tacky colorant in a pattern
(e.g., lines, dots, stripes, polka dots, etc.) that would allow for
custom tack level of the thermal management and/or EMI mitigation
material, e.g., 50% of the exterior surface may be covered with non-tacky
colorant (e.g., in lines or dots, etc.) to thereby reduce the surface
tack of the thermal management and/or EMI mitigation material by 50%,
etc.

[0035] Although the colorant may be non-tacky in some exemplary
embodiments, the colorant may be put down in such a thin layer that the
colored surface may still remain tacky due to the oils of the underlying
gap filler coming through in some exemplary embodiments. This may be
advantageous in some cases where natural tack is desired. Also, this may
advantageously allow for low thermal resistance because the interfacial
contact resistance is still low because the pad surface still wets the
substrates effectively. The colorant and/or exterior surface of the
thermal management and/or EMI mitigation material provided with the
colorant may be naturally tacky or non-tacky depending on the particular
embodiment, e.g., materials selected, thickness of the color layer, etc.

[0036] A thermal interface material may have a natural grey color (e.g.,
thermal interface material 100 shown in FIG. 1, etc.) such as when no
pigments have been added. According to exemplary embodiments disclosed
herein, a thermal interface material may have one or more exterior
surface(s) that are modified or custom colored according to exemplary
embodiments. For example, one or more portions of (or the entirety of) of
one or more of (or all of) a thermal interface material's naturally grey
colored exterior surface(s) may be modified or custom colored to be green
(e.g., thermal interface material 200 shown in FIG. 2, etc.), blue (e.g.,
thermal interface material 300 shown in FIG. 3, etc.), or black (e.g.,
thermal interface material 400 shown in FIG. 4, etc.). Table 1 below
provides thermal resistance measurements obtained from four exemplary
thermal interface materials 100, 200, 300, 400 shown in FIGS. 1, 2, 3,
and 4. These test specimens and test data, however, are illustrative only
and do not limit this disclosure as other exemplary embodiments may be
configured differently, e.g., in different colors, have different thermal
resistances, etc.

[0037] More specifically, all four thermal interface materials 100, 200,
300, 400 shown in FIGS. 1 through 4 were Tflex.TM. 700 thermal gap filler
from Laird. By way of background, the Tflex.TM. 700 thermal gap filler is
a filled silicone sheet having a thermal conductivity of about 5 W/mK,
high compliancy, and other properties shown in Table 2 below. The thermal
interface material 100 labeled Tflex.TM. 700 Control in Table 1 below did
not have any coloring pigment added and had a natural grey color as shown
in FIG. 1. The three other thermal interface materials 200, 400, 300
respectively labeled Tflex.TM. 700 Green Coating, Tflex.TM. 700 Black
Coating, and Tflex.TM. 700 Blue Coating in Table 1 below had exterior
surfaces custom colored with respective green, black, and blue
silicone-based ink according to exemplary embodiments.

[0038] Thermal resistance was measured for each of the four thermal
interface materials 100, 200, 300, 400 having the respective thickness
dimensions in millimeters (mm) and mils set forth in the table below. The
testing was performed using a LonGwin test stand at a temperature of 50
degrees Celsius (.degree. C.) and constant pressure of 10 pounds per
square inch (psi). As shown by the testing, the thermal resistance in
degrees Celsius inch squared per Watt (.degree. C.in.sup.2/W) did not
increase significantly due to the addition of color to the Tflex.TM. 700
thermal interface material. Moreover, some of the increase in thermal
resistance for the coated pads is due to the pads being thicker and not
just because they have a color on their exterior surfaces.

[0039] Green, blue, and black as used in the examples and Table 1 above
are only examples of colors that may be used in exemplary embodiments.
Alternative embodiments may include any of wide range of other colors,
e.g., pink, violet, etc. For example, FIG. 5 shows a thermal interface
material 500 having a natural grey color when no pigments have been
added. In this exemplary embodiment, one or more portions 508 of (or the
entirety of) of one or more of (or all of) the thermal interface
material's naturally grey colored exterior surface(s) 512 may be modified
or custom colored with pink silicone-based ink, such as a CHT silicone
ink described above, etc. In this example, the thermal interface material
500 shown in FIG. 5 was Tflex.TM. HR6100 thermal gap filler from Laird.
By way of background, the Tflex.TM. HR6100 thermal gap filler is a filled
silicone elastomer that has a thermal conductivity of about 3 W/mK, is
compliant, has a low modulus, and other properties shown in Table 3
below.

[0040] Exemplary embodiments may provide one or more (but not necessarily
any or all) of the following advantages. As just noted, the added
coloring to a thermal management and/or EMI mitigation material may allow
for an easy and clean release of the material during rework, repair,
replacement, etc. This may also allow for easier handling and
installation by inhibiting adherence, stickiness or tacky surface tack,
such as to the hands of the installer or to a surface of a component.
Adding color and/or markings (e.g., laser marking, ink, colored film,
etc.) to only the exterior surfaces of thermal management and/or EMI
mitigation materials (e.g., thermally-conductive gap fillers or pads, EMI
absorbers, etc.) also allows color specifications or requirements (e.g.,
requested by a customer, etc.) to be met without having to modify the
original material formulation. Because the original formulation does not
need to be modified by pigments, exemplary embodiments disclosed herein
allow greater flexibility in terms of the range of colors that may be
provided to exterior surfaces of thermal management and/or EMI mitigation
materials. In contrast, a conventional method of changing the color of a
thermal interface material requires the addition of pigment or
replacement of a pigment in a TIM formulation. Because pigments contain
particles, the addition or replacement of pigments in a TIM can impact
the particle packing of the system and is not a trivial matter.
Furthermore, maintaining stock of one formulation in several colors is
not efficient business.

[0041] In some exemplary embodiments, the color (e.g., violet, etc.) added
to the material's exterior surface(s) may allow a visual or automated
detection system to more readily confirm the presence and placement of
the material. For example, some visual or automated detection systems can
more easily detect certain colors like violet rather than grey. A
coloring scheme applied to the exterior surface(s) of a thermal
management and/or EMI mitigation material may also allow an installer to
more quickly and easily determine the proper orientation for installing
the material, such as which side of the material should be placed in
contact with a heat sink and which side should be placed in contact with
a heat source or heat-generating electronic component.

[0045] In an exemplary embodiment, the thermal management and/or EMI
mitigation material comprises a RFRET.TM. reticulated foam based
absorber. The RFRET.TM. reticulated foam based absorber may have the
properties listed in Table 6 below.

[0050] By way of further example, a thermal management and/or EMI
mitigation material may comprise an elastomer and/or ceramic particles,
metal particles, ferrite EMI/RFI absorbing particles, metal or fiberglass
meshes in a base of rubber, gel, or wax, etc. A thermal management and/or
EMI mitigation material may include compliant or conformable silicone
pads, non-silicone based materials (e.g., non-silicone based gap filler
materials, thermoplastic and/or thermoset polymeric, elastomeric
materials, etc.), silk screened materials, polyurethane foams or gels,
thermally-conductive additives, etc. A thermal management and/or EMI
mitigation material may be configured to have sufficient conformability,
compliability, and/or softness (e.g., without having to undergo a phase
change or reflow, etc.) to adjust for tolerance or gaps by deflecting at
low temperatures (e.g., room temperature of 20.degree. C. to 25.degree.
C., etc.) and/or to allow the material to closely conform (e.g., in a
relatively close fitting and encapsulating manner, etc.) to a mating
surface when placed in contact with the mating surface, including a
non-flat, curved, or uneven mating surface. For example, the thermal
management and/or EMI mitigation material may have very high compliancy
such that the thermal management and/or EMI mitigation material will
relatively closely conform to the size and outer shape of an electrical
component when the thermal management and/or EMI mitigation material is
along an inner surface of a cover of an EMI shield (e.g., a one-piece or
two board level shield, etc.) and the thermal management and/or EMI
mitigation material is compressed against the electrical component when
the EMI shield is installed to a printed circuit board over the
electrical component.

[0051] A thermal management and/or EMI mitigation material may comprise a
soft thermal interface material formed from elastomer and at least one
thermally-conductive metal, boron nitride, and/or ceramic filler, such
that the soft thermal interface material is conformable even without
undergoing a phase change or reflow. The thermal management and/or EMI
mitigation material may be a non-metal, non-phase change material that
does not include metal and that is conformable even without undergoing a
phase change or reflow. A thermal management and/or EMI mitigation
material may comprise a thermal interface phase change material. A
thermal management and/or EMI mitigation material may comprise a ceramic
filled silicone elastomer, boron nitride filled silicone elastomer,
fiberglass reinforced gap filler, or a thermal phase change material that
includes a generally non-reinforced film.

[0052] A thermal management and/or EMI mitigation material may be a
non-phase change material and/or be configured to adjust for tolerance or
gap by deflection. In some exemplary embodiments, the thermal management
and/or EMI mitigation material may comprise a non-phase change gap filler
or gap pad that is conformable without having to melt or undergo a phase
change. The thermal management and/or EMI mitigation material may be able
to adjust for tolerance or gaps by deflecting at low temperatures (e.g.,
room temperature of 20.degree. C. to 25.degree. C., etc.). The thermal
management and/or EMI mitigation material may have a Young's modulus and
Hardness Shore value considerably lower than copper or aluminum. The
thermal management and/or EMI mitigation material may also have greater
percent deflection versus pressure than copper or aluminum.

[0054] In some exemplary embodiments, the thermal management and/or EMI
mitigation material may comprise a thermally-conductive microwave/RF/EMI
absorber that includes silicon carbide. For example, the thermal
management and/or EMI mitigation material may include silicon carbide,
carbonyl iron powder, and alumina. In some exemplary embodiments, the
thermal management and/or EMI mitigation material may further include
manganese zinc (MnZn) ferrite and magnetic flakes. The resulting
thermally-conductive EMI absorber may have a high thermal conductivity
(e.g., at least 2 Watts per meter per Kelvin (W/m-K) or higher, etc.) and
high EMI absorption or attenuation (e.g., at least 9 decibels per
centimeter (dB/cm) at a frequency of at least 1 GHz, at least 17 dB/cm at
a frequency of at least 15 GHz, etc.). In other exemplary embodiments,
the thermal management and/or EMI mitigation material may comprise a
thermally-conductive EMI absorber that includes one or more other
ceramics, and/or other EMI absorbing materials.

[0055] Exemplary embodiments may include a thermal management and/or EMI
mitigation material having a high thermal conductivity (e.g., 1 W/mK
(watts per meter per Kelvin), 1.1 W/mK, 1.2 W/mK, 2.8 W/mK, 3 W/mK, 3.1
W/mK, 3.8 W/mK, 4 W/mK, 4.7 W/mK, 5 W/mK, 5.4 W/mK, 6 W/mK, etc.)
depending on the particular materials used to make the material and
loading percentage of the thermally conductive filler, if any. These
thermal conductivities are only examples as other embodiments may include
a thermal management and/or EMI mitigation material with a thermal
conductivity higher than 6 W/mK, less than 1 W/mK, or other values
between 1 and 6 W/mk. Accordingly, aspects of the present disclosure
should not be limited to use with any particular thermal management
and/or EMI mitigation material as exemplary embodiments may include a
wide range of thermal management and/or EMI mitigation materials.

[0056] In exemplary embodiments, a thermal interface material may be used
to define or provide part of a thermally-conductive heat path from a heat
source to a heat removal/dissipation structure or component. A thermal
interface material disclosed herein may be used, for example, to help
conduct thermal energy (e.g., heat, etc.) away from a heat source of an
electronic device (e.g., one or more heat generating components, central
processing unit (CPU), die, semiconductor device, etc.). A thermal
interface material may be positioned generally between a heat source and
a heat removal/dissipation structure or component (e.g., a heat spreader,
a heat sink, a heat pipe, a device exterior case or housing, etc.) to
establish a thermal joint, interface, pathway, or thermally-conductive
heat path along which heat may be transferred (e.g., conducted) from the
heat source to the heat removal/dissipation structure or component.
During operation, the thermal interface material may then function to
allow transfer (e.g., to conduct heat, etc.) of heat from the heat source
along the thermally-conductive path to the heat removal/dissipation
structure or component. In exemplary embodiments in which the thermal
interface material is also an EMI absorber, the thermal interface/EMI
absorbing material may also be operable for absorbing a portion of the
EMI incident upon the thermal interface/EMI absorbing material.

[0057] Example embodiments of thermal management and/or EMI mitigation
materials disclosed herein may be used with a wide range of heat sources,
electronic devices, and/or heat removal/dissipation structures or
components (e.g., a heat spreader, a heat sink, a heat pipe, a device
exterior case or housing, etc.). For example, a heat source may comprise
one or more heat generating components or devices (e.g., a CPU, die
within underfill, semiconductor device, flip chip device, graphics
processing unit (GPU), digital signal processor (DSP), multiprocessor
system, integrated circuit, multi-core processor, etc.). Generally, a
heat source may comprise any component or device that has a higher
temperature than the thermal management and/or EMI mitigation material or
otherwise provides or transfers heat to the thermal management and/or EMI
mitigation material regardless of whether the heat is generated by the
heat source or merely transferred through or via the heat source.
Accordingly, aspects of the present disclosure should not be limited to
use with any single type of heat source, electronic device, heat
removal/dissipation structure, etc.

[0058] Example embodiments are provided so that this disclosure will be
thorough, and will fully convey the scope to those who are skilled in the
art. Numerous specific details are set forth such as examples of specific
components, devices, and methods, to provide a thorough understanding of
embodiments of the present disclosure. It will be apparent to those
skilled in the art that specific details need not be employed, that
example embodiments may be embodied in many different forms, and that
neither should be construed to limit the scope of the disclosure. In some
example embodiments, well-known processes, well-known device structures,
and well-known technologies are not described in detail. In addition,
advantages and improvements that may be achieved with one or more
exemplary embodiments of the present disclosure are provided for purpose
of illustration only and do not limit the scope of the present
disclosure, as exemplary embodiments disclosed herein may provide all or
none of the above mentioned advantages and improvements and still fall
within the scope of the present disclosure.

[0059] Specific dimensions, specific materials, and/or specific shapes
disclosed herein are example in nature and do not limit the scope of the
present disclosure. The disclosure herein of particular values and
particular ranges of values for given parameters are not exclusive of
other values and ranges of values that may be useful in one or more of
the examples disclosed herein. Moreover, it is envisioned that any two
particular values for a specific parameter stated herein may define the
endpoints of a range of values that may be suitable for the given
parameter (i.e., the disclosure of a first value and a second value for a
given parameter can be interpreted as disclosing that any value between
the first and second values could also be employed for the given
parameter). For example, if Parameter X is exemplified herein to have
value A and also exemplified to have value Z, it is envisioned that
parameter X may have a range of values from about A to about Z.
Similarly, it is envisioned that disclosure of two or more ranges of
values for a parameter (whether such ranges are nested, overlapping or
distinct) subsume all possible combination of ranges for the value that
might be claimed using endpoints of the disclosed ranges. For example, if
parameter X is exemplified herein to have values in the range of 1-10, or
2-9, or 3-8, it is also envisioned that Parameter X may have other ranges
of values including 1-9, 1-8, 1-3, 1-2, 2-10, 2-8, 2-3, 3-10, and 3-9.

[0060] The terminology used herein is for the purpose of describing
particular example embodiments only and is not intended to be limiting.
As used herein, the singular forms "a", "an" and "the" may be intended to
include the plural forms as well, unless the context clearly indicates
otherwise. The terms "comprises," "comprising," "including," and
"having," are inclusive and therefore specify the presence of stated
features, integers, steps, operations, elements, and/or components, but
do not preclude the presence or addition of one or more other features,
integers, steps, operations, elements, components, and/or groups thereof.
The method steps, processes, and operations described herein are not to
be construed as necessarily requiring their performance in the particular
order discussed or illustrated, unless specifically identified as an
order of performance. It is also to be understood that additional or
alternative steps may be employed.

[0061] When an element or layer is referred to as being "on", "engaged
to", "connected to" or "coupled to" another element or layer, it may be
directly on, engaged, connected or coupled to the other element or layer,
or intervening elements or layers may be present. In contrast, when an
element is referred to as being "directly on," "directly engaged to",
"directly connected to" or "directly coupled to" another element or
layer, there may be no intervening elements or layers present. Other
words used to describe the relationship between elements should be
interpreted in a like fashion (e.g., "between" versus "directly between,"
"adjacent" versus "directly adjacent," etc.). As used herein, the term
"and/or" includes any and all combinations of one or more of the
associated listed items.

[0062] The term "about" when applied to values indicates that the
calculation or the measurement allows some slight imprecision in the
value (with some approach to exactness in the value; approximately or
reasonably close to the value; nearly). If, for some reason, the
imprecision provided by "about" is not otherwise understood in the art
with this ordinary meaning, then "about" as used herein indicates at
least variations that may arise from ordinary methods of measuring or
using such parameters. For example, the terms "generally", "about", and
"substantially" may be used herein to mean within manufacturing
tolerances. Or for example, the term "about" as used herein when
modifying a quantity of an ingredient or reactant of the invention or
employed refers to variation in the numerical quantity that can happen
through typical measuring and handling procedures used, for example, when
making concentrates or solutions in the real world through inadvertent
error in these procedures; through differences in the manufacture,
source, or purity of the ingredients employed to make the compositions or
carry out the methods; and the like. The term "about" also encompasses
amounts that differ due to different equilibrium conditions for a
composition resulting from a particular initial mixture. Whether or not
modified by the term "about", the claims include equivalents to the
quantities.

[0063] Although the terms first, second, third, etc. may be used herein to
describe various elements, components, regions, layers and/or sections,
these elements, components, regions, layers and/or sections should not be
limited by these terms. These terms may be only used to distinguish one
element, component, region, layer or section from another region, layer
or section. Terms such as "first," "second," and other numerical terms
when used herein do not imply a sequence or order unless clearly
indicated by the context. Thus, a first element, component, region, layer
or section discussed below could be termed a second element, component,
region, layer or section without departing from the teachings of the
example embodiments.

[0064] Spatially relative terms, such as "inner," "outer," "beneath",
"below", "lower", "above", "upper" and the like, may be used herein for
ease of description to describe one element or feature's relationship to
another element(s) or feature(s) as illustrated in the figures. Spatially
relative terms may be intended to encompass different orientations of the
device in use or operation in addition to the orientation depicted in the
figures. For example, if the device in the figures is turned over,
elements described as "below" or "beneath" other elements or features
would then be oriented "above" the other elements or features. Thus, the
example term "below" can encompass both an orientation of above and
below. The device may be otherwise oriented (rotated 90 degrees or at
other orientations) and the spatially relative descriptors used herein
interpreted accordingly.

[0065] The foregoing description of the embodiments has been provided for
purposes of illustration and description. It is not intended to be
exhaustive or to limit the disclosure. Individual elements, intended or
stated uses, or features of a particular embodiment are generally not
limited to that particular embodiment, but, where applicable, are
interchangeable and can be used in a selected embodiment, even if not
specifically shown or described. The same may also be varied in many
ways. Such variations are not to be regarded as a departure from the
disclosure, and all such modifications are intended to be included within
the scope of the disclosure.