MEMS, packaging groups to support others’ efforts

November 19, 2007 – The MEMS Industry Group, a trade association representing MEMS and microstructure industries, and the MicroElectronics Packaging and Test Engineering Council (MEPTEC) have formed a strategic alliance to support each other’s goals and industry events, through a variety of marketing programs.

MEMS device manufacturing presents special challenges, including the ability to withstand electromechanical, thermomechanical and other stressors and still remain robust and reliable, noted MEPTEC president Bette Cooper, in a statement. “Bridging the gap between standard semiconductor packaging and MEMS packaging is one way to address these challenges, and it is this convergence that has been our focus,” she said. “Our collaboration with MEMS Industry Group will help us to further explore this promising technology.”

MIG, “the unifying voice” of the commercial MEMS industry, and MEPTEC, which is “committed to enhancing the competitiveness of the backend portion of the semiconductor business,” will join forces “to address the packaging issues that can further enhance the adoption and commercialization of MEMS,” added MIG managing director Karen Lightman.

Among the joint efforts, the two groups will support each other’s upcoming events. MIG cosponsored MEPTEC’s recent substrates symposium (Nov. 8, Santa Clara, CA). And MIG will conduct a packaging survey at its annual membership’s technical event, METRIC (May 7-9, 2008), and reveal the results at MEPTEC’s annual MEMS Symposium on May 22. Both firms also will cross-promote each other’s events to their respective memberships.

FEATURED PRODUCTS

TECHNOLOGY PAPERS

Keysight Technologies’ popular 276-page Parametric Measurement Handbook is an invaluable reference tool for anyone performing device or process characterization. It is filled with tips to help both novice and advanced users, and the latest edition (Rev 4) includes an entirely new section devoted to power device test.February 27, 2019Sponsored by Keysight Technologies

Traditional root cause analysis in manufacturing uses summary data, which is ineffective in the face of complex issues stemming from subtle defects in a process. Full trace analytics, backed by powerful Artificial Intelligence (A.I.) algorithms, uses the entirety of all the sensor and tool data available in a production line for analysis, enabling fabrication engineers to quickly and accurately focus on the causes of issues that negatively affect yield, large and small.February 07, 2019Sponsored by BISTel

WEBCASTS

The semiconductor industry is an acknowledged global leader in promoting environmental sustainability in the design, manufacture, and use of its products, as well as the health and safety of its operations and impacts on workers in semiconductor facilities (fabs). We will examine trends and concerns related to emissions, chemical use, energy consumption and worker safety and health.

Extension Media websites place cookies on your device to give you the best user experience. By using our websites, you agree to placement of these cookies and to our Privacy Policy. Please click here to accept.