The world's two leading centers for next-generation
nanoelectronics research and development - the College
of Nanoscale Science and Engineering (CNSE)
of the University at Albany in Albany, NY and IMEC
in Leuven, Belgium - announced plans to jointly perform
extreme ultraviolet lithography (EUVL) experiments in order to
accelerate the introduction of EUVL into manufacturing. The first set
of collaborative experiments will be carried out at CNSE's Albany
NanoTech Complex, with future joint studies to be conducted at CNSE and
IMEC, depending on throughput and/or availability of the tools.

This groundbreaking collaboration between CNSE and IMEC will
also involve scientists from IBM and ASML, which has built the world's
first full-field EUVL R&D tool, the Alpha Demo Tool
(ADT). The majority of activities will focus on the advanced
imaging capabilities of the EUVL system, with additional effort devoted
to the understanding of new materials and various aspects of equipment
technology.

The collaboration between CNSE, IMEC, IBM and ASML is expected
to further advance the learning on EUVL technology and the associated
infrastructure required to support it. Ultimately, this alliance is
intended to effectively demonstrate the practical feasibility of EUVL
and build confidence in the technology for the 32nm half pitch device
node and below.

CNSE Vice President and Chief Administrative Officer Dr. Alain
E. Kaloyeros said, "The UAlbany NanoCollege is pleased to partner with
IMEC, the leading European R&D organization, and welcome our
IMEC colleagues to CNSE's Albany NanoTech Complex, where together with
our partners from IBM and ASML, we have a unique opportunity to enable
significant advances in EUVL technology that are vital to the
manufacturing of future generations of nanoelectronics devices. This
pioneering initiative, made possible through the investments of the New
York Assembly in the International Venture for Nanoelectronics
Technologies (INVENT), further illustrates the success of the vision
and leadership of Speaker Silver and the New York Assembly, whose
investment and support have been critical in building a globally
recognized centerpiece for high-tech research and development in the
Empire State."

Luc Van den hove, Executive Vice President and Chief Operating
Officer at IMEC said, "EUV lithography is a promising solution to
further scale CMOS beyond the 32nm but still major challenges need to
be overcome. As a leading nanoelectronics R&D center, IMEC sets
up collaborations to enhance further semiconductor development. This
collaboration between IMEC and the UAlbany NanoCollege proves again
that joint R&D is a major benefit for the semiconductor
industry worldwide. We look forward to building a great
partnership with the UAlbany NanoCollege to advance the state of the
art in nanoscale lithography."

CNSE Associate Vice President of Technology and Professor of
Nanoscience Dr. James G. Ryan said, "Faculty, scientists and
researchers at CNSE look forward to working with researchers from IMEC,
IBM and ASML as part of this unique effort, which further reinforces
our commitment to the development and commercialization of EUVL
technology. This joint program gives us another opportunity to advance
EUVL in support of the needs of our corporate partners and the
nanoelectronics industry, and we anticipate a successful and fruitful
collaboration."

Kurt Ronse, Lithography Program Director at IMEC added, "We
are pleased with this collaboration which is a win-win situation for
both IMEC and CNSE and the nanoelectronics industry. Since EUV is still
in a development phase, the alpha demo tools have to be upgraded
occasionally. By opening our facilities for each others EUV
experiments, we can guarantee acceleration of EUV research to our
industrial partners."