The applications for optoelectronic integrated circuits demand high performance optoelectronic devices or smart pixels. The stringent requirements on these smart pixels require that packaging technology be developed concurrently to the development of the optoelectronic components. We discuss the packaging requirements of smart pixels based on vertical-cavity microlasers. We present a novel microlens/macrolens combination which allows high power densities to be focused to a diffraction-limited spot using present VCSEL technology. Finally, we discuss the applications for microlaser-based spatial light source arrays.