KIC today announced plans to introduce its new thermal profiler. This new reflow profiler transforms thermal process data collection from a costly chore to a value-added function. The core function of a reflow oven is to produce an acceptable profile on each PCB. The new KIC SPS smart profiler collects the profile data and compares it to the process specifications. Within seconds, our new smart profiler also suggests an improved reflow oven setup.

One of the exciting new aspects of this release is KIC’s new ecosystem, where the profile data automatically gets uploaded to a central database model for storing, retrieval and sharing. This allows for factory-wide soldering optimization and management.

The new smart profiler features a slick compact design made with an LCP (Liquid Crystal Polymer) enclosure for better heat protection & faster cool-down between profiles. It utilizes a rechargeable battery, profile stacking, Wi-Fi and Bluetooth for wireless data communication plus much more. This all new smart thermal profiler design has been optimized for maximum thermal protection plus robust long-term operation.

KIC President Bjorn Dahle states, “There are very few machines in the factory exposed to the kind of harsh environment that a thermal profiler has to endure – going through thousands of heating and cooling cycles. Not only did we need to develop an easy-to-use accurate profiler, but we also wanted to make sure the profiler was robust enough to last for years to come.

That however, was the easy part. We also are turning data collection into additional value for companies. This is done by generating data for true insight into the thermal process and to enable immediate storing, sharing and analysis on each soldering machine as well as factory-wide, or worldwide.”

The new KIC SPS smart profiler enables technicians and engineers to run their reflow ovens, wave solder and selective soldering machines more efficiently for improved uptime & consistent quality.