Chicago, IL — Electronic Interconnect (EI) has introduced Powerlink PLPCB constructions for electronic assemblies where thermal management/heat dissipation capabilities are desired. PowerLink technology enables power and control circuits, both heavy copper and standard copper, to reside on the same layer with interconnection between the circuits. Bus bars with multi-copper weights handle the heat dissipation in the PCB, enabling extended PCB life and safety in overall functioning. The bus bars allow heat to dissipate more efficiently due to their high surface area to cross-sectional area ratio.

In PowerLink PLPCB, low-power circuits are combined with high-power bus bars using two or more copper weights on the same external layer to increase system reliability and power. This breakthrough can greatly reduce total system size while reducing assembly time and cost. Multiple layers are possible, with high and low current-carrying capacity on the same trace. Outer layer copper weights up to 50-oz/ft2 are usable. The technology can be used with through-hole and/or SMT technology.