Abstract

In this study, we performed structural and thermal analyses on the image processing units of satellites. The image processing unit is a major satellite payload weighing 15 kgf with an aluminum frame structure. Owing to modal analysis, the first mode of the structure was 393 Hz, and it met the payload design requirement of exceeding 100 Hz. Quasi-static analysis was conducted by applying a gravitational acceleration of 28 g. The maximum stress of the structure was 14.9 MPa, and all the parts of structure had a safety margin of 12.9-18.9 compared to the ultimate strength of Al6061 and FR4. Additionally, the highest temperature of the IC Chip was 85.7℃ and all the components of the payload had thermal margins based on temperature derating.