These encapsulants are novel, epoxy-based 100% solids, single component liquid semiconductor encapsulants designed for devices requiring high toughness, flame retardancy and strong adhesion to various substrates such as metal, ceramic and organic. LoSTRESS™ is especially suitable for SAW filter applications.

LoSTRESS™ can virtually eliminate warp on ceramic substrates due to the low cure stress. Dam and fill and glob top versions are available.

Key Benefits:
• Very little warpage on HTC and LTCC substrates for easy downstream process
• Minimal cure stress on sensitive devices such as SAW filters
• High adhesion to die, substrates and most other interfacing materials