“RF and microwave hybrid circuits, electronic interposers and interconnects, mandates high levels of electrical and thermal performance on various alumina ceramic based substrates,” says Casper.

Kevin Callery, Director of Business Development, went on to explain that solid filled vias provides a low inductance, microwave grounding path, allowing high performance RF circuits to be assembled in a thermally efficient surface mount configuration.

“CopperVia is being offered to provide engineers additional design flexibilities in meeting all of their requirements while simultaneously lowering the costs of multilayer designs. The CopperVia enables a lower cost thin film structure than using other precious metals for making a signal or power interconnect between planar layers of high frequency circuits and meets reliability requirements for harsh environment applications such as defense and security systems, fiber optic transceivers, infrared detection, radar, and medical applications,” said Callery.

CopperVia added to Technology Platform

The CopperVia provides designers a cost effective technology to enable high performance DC, RF and microwave, optical structures, thin film planar and multilayer circuits, and passive component structures. The CopperVia has been added as an integral part of the UltraSource Technology Platform, providing designers the most comprehensive suite of thin film solutions available anywhere. The UltraSource Technology Platform offers competitive advantages for designers looking to break through to new levels of performance in the areas of integration and miniaturization, speed and signal integrity, power dissipation, reduced cost, and increased bandwidth.