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Microelectronic piece-part component obsolescence problems are prevalent and costly across all Department of Defense (DoD) weapon systems, both new and legacy. The issue is driven by the high turnover in electronic components, limited DoD influence upon component manufacturers, poor obsolescence management at both Program Office and Command levels, and a lack of understanding of the analysis tools and design techniques available to the Program Manager (PM) to help mitigate problems. The issue of microcircuit obsolescence affecting a pre-production, Acquisition Category (ACAT)-ID, Missile program is of particular interest due to their inability to transition from pre-production into full rate production, without a major redesign due to microcircuit obsolescence. The DoD and other Governmental agencies, along with commercial industries, are investigating numerous ways to reduce the increasing costs associated with obsolescence. This thesis incorporates this information to provide both the pre-production ACAT-ID Missile Weapon System Program Managers and the U.S. Army Aviation and Missile Command (AMCOM) guidance in addressing microcircuit obsolescence challenges from a management perspective.

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The purpose of this project was to explore the benefits of using a combination of additive manufacturing (AM), performance-based logistics (PBL), and open systems architecture (OSA) to mitigate the risks of limited key ...

The purpose of this project was to explore the benefits of using a combination of additive manufacturing (AM), performance-based logistics (PBL), and open systems architecture (OSA) to mitigate the risks of limited key ...