Also buy a graphics card? AMD Ruilong 2200G APU depth evaluation

In 2018, there was a major reversal in the graphics card market. The miners were crazy to scan the goods first. After the Chinese New Year, the mine disaster started. Now it is the mine car slag flying around. Now it's still a while before A/N releases a new generation of graphics cards. It's a black fight.

Fortunately, AMD has updated a wave of APUs. Is it possible to eat Ryzen APU as a transition? Today brings the R3 2200G test report.

Product Specifications:

Let's take a brief look at the specifications of the product. This time AMD's newly released APU contains R5 2400G and R5 2200G. Today's test is 2200G.

The CPU part of the 2200G is quad-core and four-threaded, with a frequency of 3.2~3.6GHz, and the specification is between R3 1200 and R3 1300X. The GPU part code of 2200G is VEGA 8, which is VEGA of 8*64=512 stream processors. Architecture.

X470 motherboard platform introduction:

Now the 400 series motherboards that natively correspond to Ryzen APU only released the X470. Today's introduction is ASUS ROG's STRIX X470F-GAMING.

The CPU power supply is 8+2 phase and the overall layout is L-shaped.

From the solution point of view, the PWM chip is ASUS's best-selling ASP14051; the input capacitor for power supply is three Nichicon MIL solid capacitors (16V 270 microfarads); the power MOS is one IR 3555M per phase; the power inductor is a closed inductor (no The output capacitance is 12 Nichicon MIL solid capacitors (6.3V 560 microfarads). For the power supply solution, In addition to the PWM chip is a bit weak, MOS used in the IR 3555M can be said to have been very conscience.

The motherboard supports four DDR4 memories and can form a dual channel array.

The memory power supply is a phase. From the solution perspective, the input side is a closed inductor (unsigned) and a Nisconn MIL solid-state capacitor (6.3V 560 microfarad); MOS is two up, two down and four are ON Semiconductor. The 4C10N; output side is a closed inductor (unsigned) and a Nisicon MIL solid-state capacitor (6.3V 560 microfarad). Memory power supply overall program quite satisfactory.

The PCI-E slot of the motherboard is configured to X16/X1/X1/X8/X1/X4Which with a metal vest is the recommended slot for installing graphics cards.

Four ASM1480 chips can be seen between the two main graphics card slots, which are used to switch the PCI-E channel of the graphics card slot. Therefore, the X470F can support dual-card arrays of SLI and CF.

This time, ROG chose to use the spirit-pollution style of the motherboard coating. Various ROG markings can be seen on the heat sink and the motherboard PCB.

ASUS's Cheung Shuo assists AMD's development of the X470 chipset. It can be said that AM4 Asus is very much at home.

The chipset also provides independent power supply design. This part is still relatively solid.

The main audio chip of the motherboard's audio system is Crab's ALC1220. The capacitor is Nichicon's audio capacitor. The whole audio section also has isolation lines to do the cutting. More interesting is that Asus has added two op-amp chips in the audio system, namely the TI 4580I and TI 01688A.

In the current era when motherboard makers rely on the ALC1220's internal op amp function to cut off the op amp chip, ROG will be conscientious.

The network card chip is INTEL 211AT, it seems that few manufacturers are still using the killer.

Motherboard rear window USB 3.1 is bridged by the chip, using ASUS's own ASM1142.

The USB 3.0 A+C interface on the mainboard is powered independently by the circuit behind it. Each interface corresponds to a Nichicon MIL solid-state capacitor (16V 100μF) and an EM 5102A power chip. The design is still relatively conscience. However, ASUS did not mention this in official data.

The first M.2 SSD slot on the motherboard occupies the position of PCI_1 and has a heat sink over it.

If you want to remove the heat sink of M.2, you need to remove the decorative board across the chipset and M.2 heat sink first.

The second M.2 SSD slot is between PCI-E X8 and X4. There is no heatsink support for this slot.

The mainboard SATA 3.0 interface is 6, not too much is quite satisfactory.

Between the CPU base and the graphics card slot there are several sockets, from the top down in the figure are the pump power supply, system fan, radiator RGB light strips, BIOS maintenance. Combine the BIOS chip under the BIOS maintenance socket, you can see the ASUS also Abandon the past pluggable BIOS design, similar to MSI's burning socket.

Motherboard memory slot on this side can see the main power supply of the motherboard 24PIN, a system fan socket and a USB 3.1 TYPE-C socket. Personally still can not understand why motherboard manufacturers will be so fond of for USB TYPE-C Interfaces without use scenarios invest so much money, looking forward to the future?

Finally, the socket on the bottom of the motherboard is briefly introduced. It depends on the half of the SATA interface. The right side of the figure is the chassis panel control, the system fan*2, the RGB light strip (4PIN), the digital light strip (3PIN), and the front USB 3.0.

Rely on the audio system half, from the left are the front audio, COM, TPM, 2PIN by the graphics card slot is the chassis temperature sensor, the front of the 5PIN Asus did not explain, front USB 2.0*2.

Between the PCI-E X8 and X4 you can see the motherboard's TPU chip. This is one of Asustek's selling points. From the chip point of view, it should be a high-level motherboard monitoring chip. It is said that it can improve the motherboard's overclocking ability.

Finally on a dismantling chart, the X470F has a lot of gadgets.

Personally think that ROG this X470F is a product that is in force regardless of horizontal comparison of his brand of 2,000-level products, vertical portrait of ASUS's own X470 no lack of highlights.