FREE WDD Email Newsletter

At IMS booth #1129 in Montreal, Canada, Vaunix Technology Corporation will be offering demos of their new LSW Series Switches and new models in their family of LDA Series Digital Attenuators. The switch line is a new Lab Brick product family offering 10 W power handling capability and reliable, high isolation, low power solid state switching in both single pole double throw (SPDT) and single pole four throw (SP4T) configurations.

At the IEEE MTT-S International Microwave Symposium today, Infineon Technologies AG launched a new SiGe:C (Silicon-Germanium: Carbon) HBT (hetero-junction bipolar transistor) device series for Low Noise Amplifier (LNA) applications. The new BFx840xESD series is particularly well-suited for design of consumer wireless products operating in the 5-6 GHz range, including current and next generation WiFi® access points and modules.

RF power market leader Freescale Semiconductor has introduced new Airfast™ transistors engineered to boost the efficiency, peak power and signal bandwidth of next-generation base stations. With the new offerings, Freescale’s flagship Airfast RF power product line now includes at least one solution for each cellular band and supports both small and large cell base station deployments.

Avnet Electronics Marketing Americas today announced that order entry is now open for the Zynq™-7000 Extensible Processing Platform (EPP) and Analog Devices, Inc.(NASDAQ: ADI) Software-Defined Radio Kit . Designed by Avnet and Analog Devices engineers, this kit offers engineers a proven platform to test, design and deliver a wide range of wireless communication functions; from baseband to radio-frequency (RF).

At this year's IEEE MTT-S International Microwave Symposium (IMS2012) held June 17-22 in Montreal, Canada, Analog Devices, Inc . (ADI), will present the newest members of its portfolio of RF ICs designed to advance radio architectures in a broad array of applications. At Booth #1725 , Analog Devices will demonstrate a complete line-up of high-performance RF ICs, including data converters, amplifiers, phase-locked loops (PLLs) direct digital synthesis (DDS) ICs, integrated RF ICs, microwave technology as well as a new Software Defined Radio (SDR) FPGA mezzanine card (FMC) that allow engineers to quickly combine high-speed analog and high-performance digital circuitry.

In IMS booth #3513 in Montreal, Canada this week, KCB, an AS-9100 certified designer and manufacturer of hi-rel SMT devices, is introducing some of their most recent semiconductor packaging techniques. One such technique, recently employed for a military customer in the AESA radar market, was a custom hermetic device that included two chips, a driver, on-board DPS, a DVA capability, and a PA stage.

More than 560 companies from all over the world will convene in Montreal June 17-22 for the IEEE MTT-S 2012 International Microwave Symposium (IMS2012) . IMS2012’s theme, “Microwaves without Borders” is evident through the diversity in the exhibiting organizations, which hail from 21 different countries.

Vishay Intertechnology, Inc today introduced a new series of surface-mount multilayer ceramic chip capacitors (MLCCs) offering high self resonance, a high Q factor of ? 2000, and a low dissipation factor of ? 0.05 % for operation in high-frequency commercial applications.
With their low dissipation factor, devices in the VJ HIFREQ series are optimized for filter and matching networks, and amplifier and DC blocking circuits.

IMS2012 is a unique opportunity for us to show you our fantastic city. Montreal is an international metropolis, the world’s second-largest French-speaking city after Paris, and home to 3.7 million people representing no fewer than 80 cultural groups. Each year, this compact and green island gem welcomes thousands of visitors who come here to enjoy its combination of old world charm and new world verve.

Vishay Intertechnology announced that it will be showcasing the company's latest industry-leading wire-bondable and ceramic thin film products, as well as its multi-layer ceramic chip capacitors (MLCCs), at the 2012 IEEE MTT-S International Microwave Symposium (IMS), being held from June 19-21 at the Montreal Convention Center.

Averna announces the availability of a field-ready multi-channel RF Recorder for RF applications covering 330 MHz to 2.5 GHz.
The Averna RP-5300 RF Recorder is an advanced tool for both field testing and performance testing. With 50 MHz of recording bandwidth at 16-bits, it can record multiple GNSS signals in up to two bands (L1, L2, L5), such as GPS or GLONASS.

Cree introduces the new 40 Volt, 0.25um GaN-on-SiC HEMT process die product family to deliver revolutionary power and bandwidth capabilities through Ku Band. The innovative product family enables the replacement of Travel-Wave Tubes with solid-state amplifiers for improved efficiency and reliability.

Hittite Microwave Corporation will feature 24 new products at the 2012 IEEE MTT-S International Microwave Symposium (IMS 2012) and Exhibition held at the Palais des Congres, Montreal, Canada, June 19-21 2012. During the exhibition, these and other Hittite Microwave products will be on display. A live product demonstration area will showcase some of the company’s latest products in our 20’ x 30’ corporate exhibit, booth #1701.

Anritsu Company announces it will demonstrate the world’s only broadband Vector Network Analyzer (VNA) system that can conduct single sweeps from 70 kHz to 140 GHz in its booth (#807) at the International Microwave Symposium (IMS), to be held June 19-21, in Montreal. The on-wafer device characterization is one in a series of demonstrations to be conducted in Anritsu’s booth that will highlight test solutions for high-frequency designs, including E-band applications and high-speed signal integrity measurements.

Teseq Holding AG intends to acquire New York-based Instruments for Industry (IFI). By combining the competencies of IFI and the recently acquired MILMEGA with its own capabilities, Teseq will expand its capabilities and broaden its product line in the RF amplifier market, providing its customers with the best possible solutions in variety of applications including commercial, industrial automotive, military, defense and communications.

Agilent Technologies Inc. today announced a new release of SystemVue , Agilent’s premier platform for designing communications systems.
Agilent will demonstrate SystemVue 2012.06 along with a range of solutions for everything from circuit-level modeling through system verification for general RF, microwave, 4G communications, and aerospace/defense applications at DAC2012 (Booth 313), June 3-7, in San Francisco.