What:
AWR Corporation, the innovation leader in high-frequency EDA software, will showcase in Booth #7 at IEEE Radio Wireless Week 2013 the latest version of its AWR Design Environment™ with many new features and enhancements specifically developed for high-frequency wireless design. This latest version includes updates and innovative new technologies for Microwave Office®/Analog Office® circuit design software and Visual System Simulator™ (VSS) system design software, as well as AXIEM® 3D planar electromagnetic (EM) software and Analyst™ 3D finite element method (FEM) EM software. AWR will also be partnering with parent company National Instruments to demonstrate joint hardware/software solutions in NI’s Booth #8.

Dr. Jaakko Juntunen shows how shape modifiers can be utilized in Analyst to create a parameterized EM problem. Moreover, when the model is used in circuit design, the EM results are interpolated, enabling an incredibly fast yield analysis and optimization with the full EM accuracy.

Dr. Mark Pierpoint delivers the IMS2012 MicroApps Keynote address:
As global competition increases, the need to produce the next state-of-the-art product faster has driven changes in how EDA and test instrumentation work together. Gone are the days when a design could be thrown over the wall to production. The next generation of communications protocols have barely been labeled "standards" when products using them have hit the streets. To produce better communications products faster requires that the line between EDA and test be blurred and new synergies between them created...

The problem comes in when you are not a software-centric company. The 2012 UBM Embedded Market Survey showed that, for the first time, QA engineers are becoming a significant portion of embedded software teams, and while the quality of debugging tools is still the top area for improvement, engineers seem to be getting more confident with what is available. However...

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