Summary of meeting activities:The working group reviewed the status of ESD WIP5.6 and proposed changes from the 2009 version to better reflect expected usage of the document. There was also a discussion on the working group’s status and future direction. There was general agreement that there is a need for a standardized method for stressing semiconductor devices with an IEC 61000-4-2 current stress and an updated version of ANSI/ESD SP5.6 will fill that need. In the near future the working group will conduct a single lab experiment on a TSPD sample to determine if the same samples, which yielded poor results in the original round robin, can provide repeatable results when the experiments are conducted at a single laboratory with multiple ESD guns and HMM pulse sources.

Agenda items for the meeting on April 13, 3:00 – 5:00 PM PT are:

Discussion of TAS comments on WIP SP 5.6-2018

Next steps in WG 5.6

Other business

Winter 2018 Virtual MeetingAn introduction to the working group was presented for guests including the history and latest achievements. The working group discussed the changes to ESD WIP5.6 that were completed between meeting series by the writing team.

September 2017 Face-to-Face Meeting

Agenda items for the meeting on September 8, 2017, 1:00 pm – 3:00 pm MST are:a. SP 5.6 - Vote on document for re-affirmationb. Single Site testing – Results from German sitec. Presentations/any other business

Summer 2017 Virtual MeetingSummary of meeting activitiesAn introduction of the working group’s documents and on-going activities was presented. A short update on single lab testing at a German lab and planned edits to ANSI/ESD SP5.6 during the five-year review cycle was also discussed. A presentation was given on source impedance measurements with a 50-ohm HMM pulser based tester.

Summary of meeting activitiesThe committee discussed the next steps and changes needed to reaffirm ANSI/ESD SP5.6 prior to the completion of the round robin testing. The WG decided to address only the most serious issues with the current ANSI/ESD SP5.6. A presentation was given on a comparison of HMM stressing of TVS devices at two locations using three ESD guns of two types. It was found that the difference in the failure levels between the two types of guns could be explained by the difference in energy deposited in the TVS from calculations based on the current waveforms.

Agenda items for the meeting on April 28, 2017, 3:00 – 5:00 PM MT are:a. Presentation on “Variability of HMM results on TVS diodes”b. Status of single lab testingc. Suggested revisions to ANSI/ESD SP5.6 for five year reaffirmation

Winter 2017 Virtual MeetingSummary of meeting activities

The committee reviewed a brief history of activities and development of ANSI/ESD SP5.6-2009. The progress of current single lab testing was discussed; there is one site that needs to complete testing. The committee discussed the next steps and changes needed to reaffirm ANSI/ESD SP5.6 prior to the completion of the round robin testing.

The committee discussed what is required to elevate ANSI/ESD SP5 to a standard test method; this will increase user confidence in the HMM test method. A new round robin will need to be completed with six or more labs. The committee also discussed if system-level failure levels should be added on datasheets and what would the information look like. It was decided that the round robin needs to be successfully completed first before the information is placed on a datasheet.

September 8, 2016, 3 – 5 pm PDT meeting agenda items:

How to continue with SP 5.6?

How to include HMM failure level in datasheets?

Other discussion topics?

Summer 2016 Virtual MeetingSummary of meeting activitiesThe past and current WG activities and documents were introduced to the new participants. The draft presentation for the 2016 EOS/ESD Symposium was presented to the attendees. Discussions were held on the practical issues that the working group is facing in the effort to redesignate ANSI/ESD SP5.6 to a standard test method.

Wednesday, July 13, 12:00 to 1:00 pm meeting agenda items:

Welcome

ESDA standards meetings policy

Anti-trust policy

Confidentiality

IP rules

Introduction to activities of WG 5.6

ESD Symposium paper and presentation

5. Any other presentation?

April 2016 Face-to-Face MeetingSummary of meeting activitiesThe WG reviewed the status of the accepted 2016 Symposium paper being presented by committee members. Testing will continue in an effort to identify the variables that affected the original round robin testing.

AgendaFriday, April 15, 3 to 5 PM meeting agenda items are:a. Presentation of working group abstract for 2016 ESD Symposiumb. Discussion on next steps in working group and how to continue with the HMM document

Winter 2016 Virtual MeetingSummary of meeting activitiesThe reviewed the current status of an EOS/ESD Symposium paper abstract being written on the test results of the single site/lab testing that has been completed by WG members. Current testing data was reviewed and discussed as well.