Patent No. U.S. 7,026,398 B2
Degussa AG has obtained a patent for a one-component water-free composition in package form comprised of a mixture of at least one epoxy resin, at least one acrylic resin, at least one acrylic resin monomer, at least one copolymer based on an acrylic monomer, at least one copolymer based on an epoxy monomer, or a mixture thereof; at least one aminoalkylsilane and at least one fluoroalkylalkoxysilane, condensates thereof, or cocondensates thereof, wherein the molar ratio of the amino groups of the aminoalkylsilane to the functional acrylate groups of the acrylic resin in the case of an acrylate-containing coating composition is less than 7:1; optionally at least one of a silicic ester and an alkyl silicate; and optionally at least one organosilane, a mixture of organosilanes, condensates thereof, or cocondensates thereof, wherein the fraction of Si-bonded fluoroalkyl functions is from 0.001-5% by weight, based on the composition.