COMPANY

Lab Circuits in November 2007 organized the first Technical Conference of Design and manufacture of High Density Interconnect Boards (HDI)

The new requirements and needs in equipment with high level of integration, like components with higher number of I/O pins per cm², is requiring a higher density of interconnection in the boards. The analysis of this situation and how to face these challenges are the reason of this Technical Day.For seeing the presentation you can unload the attached documents