The second session will build on the basic topologies discussed with the integrated regulation solutions, expanding the scope to larger power systems where the analog controller is a separate component requiring external or programmed compensation. This will include discussing analog and hybrid analog/digital controller capabilities, system tradeoffs, stability concerns, and best layout practices.

Putting together the various pieces of an IoT system is like assembling a jigsaw puzzle. But it's a finite task that most engineers can get through. When it comes to the operating system, other runtime software and the development tools available, here are seemingly endless possibilities. Hence, on Day 3 of this three-day class, we'll help you figure out what software is needed for your system, where you can find that software, how you can evaluate the software, what tools are available to help assemble the pieces and build your applications, and how to test it after it's been deployed. Day 3 sponsored by Intel.

While we can't build your complete system, we can take you through some of the key stages that'll put you well on the way toward finishing your design. In Day 2 of this three-day class, we'll look at the common subsystems with an IoT edge device and what you need to know to connect to the Fog and the Cloud. We'll also show you what some of the typical hurdles/stumbling blocks are, and most importantly, we'll show you how to navigate that slippery slope using an Intel Atom processor as our design example. Day 2 sponsored by Intel.

All processors are the same, right? Well, not exactly. In fact, they vary greatly in terms of price, performance, power consumption, and a host of other features that can make or break your design. In Day 1 of this three-part class, we will go over different design requirements and where the Intel Atom processor fits. Then we'll get into the feature set that's best for your specific IoT application: performance, security, media processing, image processing, time coordinated, computing, etc. Day 1 sponsored by Intel.

Class 3 will delve into mitigating software supply-chain risk by implementing a thorough security audit process of one’s software, which has become more critical as more code is being “leveraged” as opposed to written. We will discuss potential risks of leveraged code: previously trusted legacy code, commercial third-party code, and open-source code. We will discuss binary analysis technologies for efficiently assessing risk. This need is growing as too often this code isn’t properly tested, especially with the specific target hardware. The instructor will be covering both the technical aspects and the process that should be followed, with special attention paid to software that’s written for the IoT. Day 3 sponsored by GrammaTech.

Class 2 will be a follow-on topic to class 1, where we will discuss the concept of concurrency. It’s clear that today’s developers need to be designing more efficient and higher performing applications using multi-threading, and testers need to understand how to efficiently pinpoint potential race conditions caused by concurrency defects that will lead to system failure. This is especially true when it comes to programming for multicore processors. Within the class, we will provide key insights and techniques for identifying concurrency defects, key to quality and safety, particularly as it pertains to the Internet of Things (IoT). Day 2 sponsored by GrammaTech.

In this class, we will teach software developers, testers, and analysts how taint analysis can identify exploitable areas within an application and/or system that could be used as an entry point by a hacker. Using IoT as our example, we will help perform proper taint analysis, evaluating how data modified purposely by a user or system (such as a variable set by a field in a web form or a package of information send across an automotive CAN bus) poses a potential security risk. With the continuing surge in code and data spawned by the IoT’s popularity, this is especially needed to maximize security and maintain an efficient data flow, regardless of whether it’s data within an application or data that’s transferred between applications. Given the enormous increase in application and system connectivity, all software should be analyzed for taint defects. Day 1 sponsored by GrammaTech.

What's coming down the road, what to expect and what is just a myth?. This will cover where things will go including 4d printing, conductive materials, bionic applications, accessible metal printing, true mass customization and if there will ever be a 3d printer in every home. You'll walk away with some ideas on what to look out for in technological advancements and how you can put yourself in a position to take advantage of these coming advancements. Day 3 sponsored by Stratasys

Advanced processes and practices that show the value of 3d printing as a process and production aide. We will discuss the more cutting edge applications, who is advancing these methods and why? Also we will explore the less complex but most impactful applications being used in industry. This will help you understand what is possible when you start to really dive into how the technologies can be used. Day 2 sponsored by Stratasys

Coverage of how additive manufacturing processes work and what that means in terms of where the technology should or should not be applied. This will also overview how the technology has been used over the past 30 years, how it came into the limelight recently and why some may think the industry is waning. The goal of this segment is to create a realistic depiction of the state of the industry.? Day 1 class sponsored by Stratasys.

For the third and final class in this series, we will look at the specific applications that make the most sense for 3D printing, and show you some of the secrets that you don’t learn simply by following the supplied instructions. And we’ll make sure to amplify any of the key questions that arose during the first two classes.

Now that you know the basics of 3D printing (covered in the Day 1 class), we can dive deeper into the various types of 3D printing technologies, as there are many, and the number continues to grow as the technology continues to evolve. There are different types of printers and there are different types of materials. And there are lots of different software packages available to create and print your design. Matching the right printer to the right material to the right software is easy, once you understand the principles. And that’s exactly what we’ll cover in Day two of this class.

3D printing is all the rage. The printers are becoming affordable at all levels and design engineers are finding new and better ways to use them in their prototypes. If you’re on the verge of developing a product, this is likely a technology that you can use to lower your costs and get your product to market (much) quicker. In this first of three classes, we’ll go over the basics of 3D printing and show engineers just what they need to make to make use of the technology.

Digital power was just a buzzword not too long ago, but today it’s a viable technology. Do you understand the gains that can be had by implementing this technology, or the losses that can be suffered by not implementing it correctly? Attend Day 3 of the three-part series Embedded University: Analog/Power and you’ll find out. Sponsored by Intersil.

The functionality required by systems continues to increase and the digital semiconductor vendors are doing a pretty good job keeping the power requirements stable. In some cases, they’re even dropping the voltage levels to what considered at one time to be noise. From a power-management perspective, how do system designers deal with this need to squeeze every watt from the shrinking battery cells? That’s what will be covered on Day 2 in the three-part series of Embedded University: Analog/Power. Sponsored by Texas Instruments

Regulators, converters, boosters, mixed-signal, logic, drivers, and so on. The list seems to go on endlessly. Are you afraid to admit that you need a 101 course for analog/power? We can help. Day 1 of the three-day class, Embedded University: Analog/Power, will give you what you need to start your design, put you on the right track, and arm you with the tools necessary to design the analog and/or power subsystem within your design. Sponsored by Microchip.

What good is great secure code if it if it isn’t part of a great application? Day 3 of our three-day class “Secure Code — Now and in the Future" will take the valuable insights learned on Days 1 and 2 and apply them to a real-world automotive application. If that's the area you're designing for, great. But if not, don't despair, as the expert instructor will point out how the variables that apply directly to an automotive application correlate to other applications.

Day 2 of our three-day class “Secure Code — Now and in the Future” will start with an overview of relevant certifications, look at chain of control and deployment issues (including secure boot and update), and proceed through tools that are available and in place to help develop secure code.

"Managing the process of writing secure code in a timely manner" is the first class in our series “Secure Code — Now and in the Future."

Writing secure code is a constant challenge. You must have the right policies, processes, and tools in place. Day 1 of this three-day class will start from the beginning, ensuring that your first step is in the right direction, then outline how security touches each point in the product life cycle, some of the pitfalls you will likely encounter and how to steer clear, and survey existing standards and guidelines with examples of good, bad, and ugly code.

In the final session, the analog control system will be converted into digital control system. Digital filtering algorithms will replace the analog compensation components, and the control considerations using digital signal processing chips. The final session will also include a full session question and answer period at the end.

The second session will build on the basic topologies discussed with the integrated regulation solutions, expanding the scope to larger power systems where the analog controller is a separate component requiring external or programmed compensation. This will include discussing analog and hybrid analog/digital controller capabilities, system tradeoffs, stability concerns, and best layout practices.