PHOTO-06: EVG 501 Bonder

The EVG 501 is used to bond 4" silicon wafers together using a combination of pressure and heat.
Patterned wafers can be pre-aligned in the EVG 620 Mask Aligner using a special fixture which facilitates precise
registration of two wafers in the aligner prior to using the EVG 501 Wafer Bonder. Once the wafers are aligned,
the fixture is moved to the bonding station.