According to the new market research report "MEMS Oscillator Market by Packaging Type (Surface-Mount Device Package and Chip-Scale Package), Band (MHz and kHz), General Circuitry (SPMO, TCMO, VCMO, FSMO, DCMO, and SSMO), Application, and Geography - Global Forecast to 2022", published by MarketsandMarkets, the overall MEMS oscillator market was valued at USD 79.2 Million in 2016 and is expected to reach USD 802.8 Million by 2022, at a CAGR of 46.08% between 2017 and 2022.
Browse 67 market data Tables and 61 Figures spread through 152 Pages and in-depth TOC on "MEMS Oscillator Market"
http://www.marketsandmarkets.com/Market-Reports/mems-oscillator-market-225020975.html
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The rapid growth of mobile infrastructure, electronic wearables, and Internet of Things; and the rising need for electronic device miniaturization, improved performance, and increased functionality are the factors driving the growth of the MEMS oscillator market. The market is further driven by its standardized supply chain with high ramp rates and short lead times.
"TCMOs are expected to cross SPMOs in terms of market share by 2022"
SPMOs held the largest share of the MEMS oscillator market in 2016. However, the market for TCMOs is expected to grow at the highest rate during the forecast period. Growing requirement of high-precision timing components with small size and low cost for portable device applications is expected to drive the market for TCMOs during the forecast period. This market is further driven by the increasing adoption of TCMOs in applications such as networking, industrial GPS, satellites, mobile phones, tablets, data cards, and wearables where dynamic performance is required under environmental stressors.
"MEMS oscillator market for wearables and Internet of Things application expected to grow at the highest CAGR during the forecast period"
Explosive growth in interconnected devices and increasing adoption of wearable technology where MEMS oscillator is a preferred timing component, owing to its inherent advantages such as small size, low power consumption, and high reliability, are expected to drive the MEMS oscillator market.
"APAC expected to be the largest and fastest-growing market for MEMS oscillators during the forecast period"
The increasing penetration of MEMS oscillators in growing applications, such as wearables and Internet of Things and mobile devices, in APAC is expected to drive the market. This increasing penetration is mainly because of their inherent advantages such as small size, high reliability, and low power consumption. Along with this, the high growth of the market in APAC can be attributed to the relentless LTE activity in China and rapid growth of mobile infrastructure in APAC.
The major companies involved in the development of MEMS oscillators are SiTime Corporation (U.S.), Microchip Technology Inc. (U.S.), Vectron International, Inc. (U.S.), Abracon Holdings, LLC (U.S.), Daishinku Corp. (Japan), Ecliptek Corporation (U.S.), Jauch Quartz GmbH (Germany), IQD Frequency Products Limited (U.K.), ILSI America LLC (U.S.), and Raltron Electronics Corporation (U.S.), among others.
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http://www.marketsandmarkets.com/Market-Reports/crystal-oscillator-market-943.html
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A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

In a MEMS device having a substrate and a moveable micromachined member, a mechanical structure secures the moveable micromachined member to the substrate, thermally isolates the moveable micromachined member from the substrate and provides a conduction path to enable heating of the moveable micromachined member to a temperature of at least 300 degrees Celsius.

After forming a microelectromechanical-system (MEMS) resonator within a silicon-on-insulator (SOI) wafer, a complementary metal oxide semiconductor (CMOS) cover wafer is bonded to the SOI wafer via one or more eutectic solder bonds that implement respective paths of electrical conductivity between the two wafers and hermetically seal the MEMS resonator within a chamber.

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The rapid growth of mobile infrastructure, electronic wearables, and Internet of Things; and the rising need for electronic device miniaturization, improved performance, and increased functionality are the factors driving the growth of the MEMS oscillator market. However, high R&D costs and low profit margins act as restraints for the market.
Complete report on global MEMS oscillator market spread across 152 pages, profiling 10 companies and supported with 67 tables and 61 figures is now available at http://www.rnrmarketresearch.com/mems-oscillator-market-by-packaging-type-surface-mount-device-package-and-chip-scale-package-band-mhz-and-khz-general-circuitry-spmo-tcmo-vcmo-fsmo-dcmo-and-ssmo-application-and-geography-global-for-st-to-2022-market-report.html .
The increasing adoption of TCMOs, especially for products that require higher accuracy and longer battery life such as wearables, smart energy applications, mobile phones, tablets, and data cards, is expected to drive the market for TCMOs during the forecast period. In addition, TCMOs, with their excellent dynamic performance under stressful environmental conditions, are able to solve the deep-rooted timing problems in telecom and networking.
The market for the wearables and Internet of Things application is expected to grow at the highest rate during the forecast period, owing to the increasing penetration of MEMS oscillators in wearables and Internet of Things where legacy quartz technology is no longer used due to its technological limitations in size for low-frequency products. Along with this, explosive growth in Internet-connected devices and increasing adoption of wearable technology where MEMS oscillator is a preferred timing component, owing to its inherent advantages such as small size, low power consumption, and high reliability, are expected to drive the MEMS oscillator market.
The key market players profiled in this report such as SiTime Corporation (U.S.) , Microchip Technology Inc. (U.S.), Vectron International, Inc. (U.S.), Abracon Holdings, LLC (U.S.), Daishhinku Corp. (Japan), Ecliptek Corporation (U.S.), Jauch Quartz GmbH (Germany), IQD Frequency Products Limited (U.K.), ILSI America LLC (U.S.) and Raltron Electronics Corporation (U.S.). Order a copy of MEMS Oscillator Market by Packaging Type (Surface-Mount Device Package and Chip-Scale Package), Band (MHz and kHz), General Circuitry (SPMO, TCMO, VCMO, FSMO, DCMO, and SSMO), Application, and Geography - Global Forecast to 2022 research report at http://www.rnrmarketresearch.com/contacts/purchase?rname=894314 .
The market in APAC is expected to grow at the highest rate during the forecast period. The market in APAC is further subsegmented into China, Japan, Taiwan, South Korea, and Rest of APAC. The increased demand for MEMS oscillators in wearables and Internet of Things and the rapid growth of Internet of Things in APAC are the two crucial factors encouraging the market growth in this region.
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In a packaging structure for a microelectromechanical-system (MEMS) resonator system, a resonator-control chip is mounted on a lead frame having a plurality of electrical leads, including electrically coupling a first contact on a first surface of the resonator-control chip to a mounting surface of a first electrical lead of the plurality of electrical leads through a first electrically conductive bump. A MEMS resonator chip is mounted to the first surface of the resonator-control chip, including electrically coupling a contact on a first surface of the MEMS resonator chip to a second contact on the first surface of the resonator-control chip through a second electrically conductive bump. The MEMS resonator chip, resonator-control chip and mounting surface of the first electrical lead are enclosed within a package enclosure that exposes a contact surface of the first electrical lead at an external surface of the packaging structure.

A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.

Phase-locked loop circuitry to generate an output signal, the phase-locked loop circuitry comprising oscillator circuitry, switched resistor loop filter, coupled to the input of the oscillator circuitry (which, in one embodiment, includes a voltage-controlled oscillator), including a switched resistor network including at least one resistor and at least one capacitor, wherein an effective resistance of the switched resistor network is responsive to and increases as a function of one or more pulsing properties of a control signal (wherein pulse width and frequency (or period) are pulsing properties of the control signal), phase detector circuitry, having an output which is coupled to the switched resistor loop filter, to generate the control signal (which may be periodic or non-periodic). The phase-locked loop circuitry may also include frequency detection circuitry to provide a lock condition of the phase-locked loop circuitry.

A cavity is formed within a first substrate together with trenches that separate first and second portions of the first substrate from each other and from the remainder of the first substrate. The first portion of the first substrate is disposed within the cavity and constitutes a microelectromechanical structure, while the second portion of the substrate is disposed at least partly within the cavity and constitutes a first portion of an electrical contact. A second substrate is secured to the first substrate over the cavity to define a chamber containing the microelectromechanical structure. The second substrate has a first portion that constitutes a second portion of the electrical contact and is disposed in electrical contact with the second portion of the first substrate such that the electrical contact extends from within the chamber to an exterior of the chamber.

A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.