The Plansee Group, trading name: "Plansee Holding AG", is an Austrian company which has its head office in Breitenwang (in the district of Reutte). The group of companies focuses on manufacturing powder metallurgical materials which it also processes to produce tools and formed parts. The Plansee Group is a private company, now in its third generation of ownership, that is managed by Dr. Michael Schwarzkopf. Wikipedia.

The invention is related to a heating element (10) comprising a heating body (20) which is directly covered at least partly with a porous sintered coating (30), wherein the heating body (20) the porous sintered coating (30) each comprises at least 90 % by weight of tungsten.

Contact pin (2) and pipe contact for high- and/or medium-voltage switches and method for producing a contact pin and pipe contact, wherein the contact pin (2) has: a contact tip (4) which is composed of a fire-resistant material, and a tubular carrier sleeve (6) which is connected to the contact tip (4), a carrier core (8) which is moulded into the carrier sleeve (6), wherein the contact tip (4) is arranged in a front region of the contact pin (2), in which front region arcs occur when the contact pin (2) is in use, and wherein the carrier sleeve (8) is arranged in a rear region of the contact pin (2), which rear region adjoins the front region and in which rear region no arcs occur when the contact pin (2) is in use, wherein the pipe contact has: a fire-resistant contact ring, and a carrier pipe which is connected to the contact ring, wherein the contact ring is arranged in a front region of the pipe contact, in which front region arcs occur when the pipe contact is in use, and wherein the carrier pipe is arranged in a rear region of the pipe contact, which rear region adjoins the front region and in which rear region no arcs occur when the pipe contact is in use.

The invention relates to a metallization for a thin film component and to a method for producing a metallization. The invention further relates to a sputtering target made of a Mo-based alloy, containing Al and Ti and the usual impurities, and to a method for producing a sputtering target from an Mo-based alloy.

The invention relates to a method for producing a component from refractory metal or a refractory metal alloy having a refractory metal content of > 50 At.%.Said method consists of the following steps; a powder formed from particles is provided and said powder is hardened under the effect of a laser or electron beam. Said powder has a laser-optically measured particle size d50 of > 10 m and an average surface of > 0,08 m2/g measured by means of BET.

The invention relates to a method for producing a layer or a body that is composed of stacked layers, wherein a process gas having a pressure of > 10 bar is accelerated in a convergent-divergent nozzle and a coating material, which is formed from particles and made of Mo, W, a Mo base alloy or a W base alloy, is injected into the process gas. The particles are, at least partially, in the form of aggregates and/or agglomerates. It is thus possible to produce density layers and components. The invention further relates to layers and components having a microstructure, which comprises cold-formed grains having a high degree of expansion.

The invention relates to a target (2a) and a method for producing a target, said target comprising: a target plate (14a) and a stabilizing layer (16a) that is joined to the rear side of the target plate (14a); the stabilizing layer (16a) is created by spraying stabilizing material in a highly kinetic manner onto the target plate (14a).

The invention relates to a supporting system for support of a heating element which comprises a supporting member and a base member. The supporting member has a main extension direction extending substantially in a height direction and a proximal and distal end whereas the proximal end is adapted to support the heating element. The base member is connected via at least one hinge to a distal portion of the supporting member which distal portion is arranged distal from the proximal end. The supporting member is pivotable relative to the base member about a rotation axis which is oriented parallel to a substantially rigid direction.

The key objective of PowerBase Enhanced substrates and GaN pilot lines enabling compact power applications is to ensure the availability of Electronic Components and Systems (ECS) for key markets and for addressing societal challenges, aiming at keeping Europe at the forefront of the technology development, bridging the gap between research and exploitation, creating economic and employment growth in the European Union. The project PowerBase aims to contribute to the industrial ambition of value creation in Europe and fully supports this vision by addressing key topics of ECSEL multi annual strategic plan 2014. By positioning PowerBase as innovation action a clear focus on exploitation of the expected result is primary goal.
To expand the limits in current power semiconductor technologies the project focuses on setting up a qualified wide band gap GaN technology Pilot line, on expanding the limits of todays silicon based substrate materials for power semiconductors, improving manufacturing efficiency by innovative automation, setting up of a GaN compatible chip embedding pilot line and demonstrating innovation potential in leading compact power application domains.
PowerBase is a project proposal with a vertical supply chain involved with contributions from partners in 7 European countries. This spans expertise from raw material research, process innovation, pilot line, assembly innovation and pilot line up to various application domains representing enhanced smart systems. The supporting partners consist of market leaders in their domain, having excellent technological background, which are fully committed to achieve the very challenging project goals.
The project PowerBase aims to have significant impact on mart regions. High tech jobs in the area of semiconductor technologies and micro/nano electronics in general are expressed core competences of the regions Austria: Carinthia, Styria, Germany: Sachsen, Bavaria and many other countries/ regions involved.

The COMPASS project is a collaborative effort of AVL, Plansee, Nissan and Research Center Jlich to develop advanced SOFC APU systems for range extender applications in passenger cars. The consortium is perfectly integrated from powder-, cell-, stack-, APU system technology providers to vehicle manufacturer and an academic partner. The project will use innovative metal supports SOFC stack technology, which enables key features like rapid start up and mechanic robustness for this application. Within the project advanced APU systems will be developed with electrical efficiency above 50%, a start up time below 15min and a small packaging size suitable for integration into battery electrical vehicles. Under the lead of NISSAN also a prototype vehicle will be build up, where an APU system will be completely integrated into the electrical powertrain. A major focus of the project is technology validation and systematic durability/reliability development. Therefore in a specific workpackage all validation activities are concentrated. The validation testing includes tests on stack, APU system and vehicle level. The APU system will furthermore undergo automotive testing like vibration, altitude, climate chamber and salt spray. In an additional dedicated workpackage manufacturing cost and business case analyses will be performed. These analyses will help to reduce the technology cost by design-to-cost and design-to-manufacture measures and show the business case of this new powertrain concept compared to other alternative and conventional propulsion concepts. This project is worldwide the first approach to integrate SOFC APU systems into electrical powertrains and will help to significantly improve APU systems also for other applications like heavy duty trucks, marine and leisure/camping.

Addressing European Policies for 2020 and beyond the Power Semiconductor and Electronics Manufacturing 4.0 (SemI40) project responds to the urgent need of increasing the competitiveness of the Semiconductor manufacturing industry in Europe through establishing smart, sustainable, and integrated ECS manufacturing. SemI40 will further pave the way for serving highly innovative electronic markets with products powered by microelectronics Made in Europe.
Positioned as an Innovation Action it is the high ambition of SemI40 to implement technical solutions on TRL level 4-8 into the pilot lines of the industry partners. Challenging use cases will be implemented in real manufacturing environment considering also their technical, social and economic impact to the society, future working conditions and skills needed.
Applying Industry 4.0, Big Data, and Industrial Internet technologies in the electronics field requires holistic and complex actions.
The selected main objectives of SemI40 covered by the MASP2015 are: balancing system security and production flexibility, increase information transparency between fields and enterprise resource planning (ERP), manage critical knowledge for improved decision making and maintenance, improve fab digitalization and virtualization, and enable automation systems for agile distributed production.
SemI40s value chain oriented consortium consists of 37 project partners from 5 European countries. SemI40 involves a vertical and horizontal supply chain and spans expertise and partners from raw material research, process and assembly innovation and pilot line, up to various application domains representing enhanced smart systems. Through advancing manufacturing of electronic components and systems, SemI40 contributes to safeguard more than 20.000 jobs of people directly employed in the participating facilities, and in total more than 300.000 jobs of people employed at all industry partners facilities worldwide.