Pre-Layout Analysis

This is a predictive analysis phase wherein Signal-Integrity and EMC problems are predicted early for corrective action. Routing constraints, stack-up topologies, device speeds and net terminations are specified before the layout, the following are done as a part of the pre-layout analysis with the tool:

Form the simulation results (waveforms and spectrum result display), analyze reflections, distortions, crosstalk, and electromagnetic compliance

HyperLynx LineSim is used for various pre-layout analysis configurations. The tool allows for easy instantiation any mixture of HSPICE, ELDO, AMS, S-parameter, IBIS models. The HyperLynx LineSim tool offers a 18,000 IC model library, We also a maintains a custom library with many more models built from the datasheets.

Post-Layout Analysis

This is a corrective analysis phase wherein Signal-Integrity and EMC problems are for corrective action. The following is executed as a part of the post-layout analysis chain:

Import Physical net topologies and stack-up information from layout

Create impedance models of complex board traces for each segment, including vias

HyperLynx BoardSim is used for post-layout analysis. BoardSim comes with a 7000 component library including IC, ferrite bead and connector models. An In-house library is maintained a custom library with many more models built from the datasheets.

Thermal Analysis

Thermal analysis is a critical phase especially in mil-grade system and systems expected to work in extreme weather conditions. The following are provided as a part of the thermal analysis offering: