Angstrom Sputter System

The Angstrom system is a load locked sputtering deposition system. It can be used to deposit thin metal
or dielectric films. This system has three MAK 3” sputterings power by two 1000W RF
and one 1000W DC power supplies. The MAK guns are also capable of sputtering magnetic
materials such as Iron.

Vacuum is provided by a Bosch dry pump and a CTI cryo pump capable of creating a vacuum
of 1e-7 or better.

Available gases are:

MFC 1: ArMFC 3: N2, O2, Ar+5% O2

Available sputter targets:

Gold*ChromeAluminumTitaniumSilicon DioxideIronPermalloy

*Additional usage fees exist for precious metal targets.

At this time other targets available from MMF users are Indium Tin Oxide and Nickel.