In this episode of the Tinker's Toolbox we talk to Matt Williams of TE Circuit Protection about their latest circuit protection devices based upon Hybrid PPTC (MHP) and Reflowable Thermal Protection (RTP) technology.

In this episode of the Tinker's Toolbox we talk to Sriram Peruvemba of E Ink about their technology and how it stands in the marketplace. We discuss related bistable technologies as well as E Ink's endeavors in the LCD space.

In this episode of the Tinker's Toolbox we talk to Dr Arnon Friedmann of Texas Instruments about one of their latest devices, a new small cell base-station platform focused on 3G and 4G high speed data systems.

In this episode of the Tinker's Toolbox we talk to Jim Templeton at the recent APEC event. Jim is one of the first advocates of digital power, first as a founder of Zilker Labs and currently as a director of Maxim's digital power effort.

In this episode of the Tinker's Toolbox we talk to Jim Nohrden of Black Sand about their 3G CMOS RF power amplifier (PA) products. The devices promise to significantly improve the reliability and data throughput of mobile products, and are designed as a drop-in replacement for existing 3G GaAs RF PAs.

In this episode of the Tinker's Toolbox we talk to Jeff Miles, the Director of Mobile Transactions at NXP about their work in the Near Field Communications space and their collaborative efforts with product manufacturers to integrate that functionality into their devices.

In this episode of the Tinker's Toolbox we talk to Sherif Hanna of Atmel about their the maXTouch E Series of single-chip capacitive touchscreen controllers for touchscreens from 2 to 12 inches, a sweet spot in the tablet device category.

In this episode of the Tinker's Toolbox, we talk to Geoff Lees from NXP about their latest device, presented as the industry’s first integrated high-speed CAN Physical Layer transceiver and microcontroller with on-chip CANopen drivers.