COB Sensor Packaging (PLCC and CLCC)

Due to our COB (Chip On Board) process and the vertical integration of key components including VCM & lenses, we are able to offer production services for Sensor Packaging (PLCC, CLCC), as well as for complete module heads to sensor makers and camera module makers.

We also offer turn-key solutions including

Optical Lens Design

Circuit Design & Schematics Layout

Mechanical Design

Image Tuning Support

CCM Test Specification Definition

Production

Our manufacturing service is highly efficient in terms of cost and quality due to extra-high production yield rates we reach through the automated production and inspection line technology developed by Suyin.

Suyin supports a rapid time to market：
Sensor packaging and module heads: From design to mass production ramp-up: 2 months.