L'entreprise

MicroChem PermiNex™ 1000 and 2000 resists are epoxy based, photo-imageable bonding resists used as an adhesive layer for the definition and capping of cavity structures such as BAW, SAW, microfluidic devices, and others, where critical alignment, low temperature processing and high bond quality are desired.

Material Attributes:

Negative tone, photo-imageable adhesives

Alkaline and solvent developable series

High resolution patterning

Low temperature processing (< 200°C)

High quality, void-free bonding

Superb adhesion to Silicon and Glass

Good process compatibility (dicing, soldering) and high reliability (HAST, TCT)

Resolution Capability

5µm features in 15µm thick PermiNex™ 1000Source: MicroChem

Bonding Capability

Test cavity structures

Adhesive cavity wall

• High seal integrity after bonding• High edge acuity• No cracking or defects at corners• Void free, conformal interface