EP 0898443 A4 2000-01-19 - REFLOW SOLDERING DEVICE

Title (en)

Title (de)

Title (fr)

Publication

Application

Priority

JP 9701608 W 19970512

JP 12037196 A 19960515

Abstract (en)

[origin: EP0898443A1] A reflow soldering device by which a vaporized component of a contaminative material such as flux can be sufficiently removed from the exhaust gas from the reflow furnace is provided. The device comprises a conveyor means (2) for transferring a circuit substrate (3), a heating means (4) for heating the transferred circuit substrate (3), a cooling means (5) for cooling the circuit substrate (3) which has been reflow soldered by the heating means (4), discharge pipes (6a, 6b, 6c) and a discharge blower (8) for discharging an exhaust gas of high temperature escaped from the heating means (4) to the outside of the device (1), and a flux removing means (7) mounted in the discharge pipes (6a, 6b, 6c) which cools the exhaust gas to 70 DEG C and below, preferably 60 DEG C and below, so as to cause a vaporized component such as flux contained in the exhaust gas to become liquid or solid and to be removed. <IMAGE>