By Joseph S. Bubel, Hesse & Knipps, Inc.How can you keep up with these demands for your heavy wire bonding production? If your manufacturing equipment is not on ? or perhaps more importantly ? above par, it may be time to take a look at the latest heavy wire bonding manufacturing equipment innovations.

By Iris Labadie, Market Development Specialist, Dr. Jerry Aguirre, and Paul Garland, Kyocera America, Inc., San Diego, CA In the electronics industry's headlong rush to shrink everything, everything is smaller, even though the components and circuits are far more complex than ever. The overall trend has been an increase in functionality and a decrease in size. Improvements in radar and communications technology ...

By Ken Kuang, Joyce Zhang and Bill Ishii, Torrey Hills Technologies, LLC, San Diego, CA The trend in packaging has shown a serious shift: attendance at assembly and packaging conferences has been dwindling over the past few years. At the same time, solar power shows have been celebrated with lots of fanfare, aisles crowded. More and more electronics assembly and packaging ...

By Eric Klaver, Commercial Product Manager, Assembléon Netherlands B.V., Veldhoven, NetherlandsThe electrical connections between a semiconductor die and its package — and hence the outside world — are today made using wire (or flip-chip) bonders. Because of the repeatability accuracy needed for this operation — down to 10µ — the machines are expensive and have ...

By Brian Toleno, Ph.D., Henkel Corporation, Irvine, CAThe electronics industry has had concerns about tin whiskers for at least 60 years — often discussed in frightened, whispered voices. Tin whiskers certainly aren't a new problem. In fact, some of the first published reports of the occurrence date back to the 1940s and 1950s. But ...