Instructor Class Description

Mechanics of Thin Films

Provides an overview of the thin film deposition processes; the stress and microstructure development during film growth; the mechanisms of adhesion; delamination and fracture; and the state-of-the-art characterization techniques for the microstructure and mechanical properties of thin films, coatings, and nanomaterials. Offered: A.

Class description

Thin films play important roles in many technological applications including microelectronics devices, magnetic storage media and surface coatings. Although the principal function of thin films in these applications may not be structural, and consequently the load carrying capacity of the thin films may not be the major factor for design and material selection, the fabrication of thin film configuration often results in internal stress in the film of a magnitude sufficient to induce mechanical deformation, damage or failure, which may eventually affect the electrical or magnetic properties in the functional devices. This course aims to provide an overview of the thin film deposition processes, the stress and microstructure development during film growth, the mechanisms of adhesion, delamination and fracture. And the state-of-the-art characterization techniques for the microstructure and mechanical properties for thin film and small-scale materials and structures.

Student learning goals

General method of instruction

Powerpoint, Boardwriting, Discussion and Lab Demo
Both traditional and non-traditional

Recommended preparation

Undergraduate senior or graduate students standing

Class assignments and grading

4-5 homeworks
one midterm exam
one course project

Hw, project and exam

The information above is intended to be helpful in choosing courses. Because the instructor may further develop his/her plans for this course, its characteristics are subject to change without notice. In most cases, the official course syllabus will be distributed on the first day of class.
Last Update by Junlan Wang
Date: 09/21/2012

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Modified:April 23, 2014