02/21/2018 Nordson Corporation announces that the SEMI Foundation has appointed Joseph Stockunas, Corporate Vice President for Electronics Systems at Nordson Corporation and the immediate past chair of the SEMI North America Advisory Board, to the SEMI Foundation Board of Trustees in accordance with the association's by-laws.

02/16/2018 Since Apple unveiled iPhone X with face-recognition functionality in early November 2017, interest in 3D sensing technology has reached fever pitch and attracted huge investments across the related supply chains.

02/14/2018 Yawning differences between cultures, economic systems and rules of law stand as barriers for many China- and US-based technology companies to do business on each other’s soil, making it imperative for both countries to work together to bridge the gaps that make it harder for tech businesses in each country to find partners and open markets in the other, SEMI China president Lung Chu said at a recent conference.

02/13/2018 CEA-Leti's chief scientist today issued a forward-looking call to action for the microelectronics industry to create a radically new, digital-communication architecture for the Internet of Things in which "a great deal of analytics processing occurs at the edge and at the end devices instead of in the Cloud".

02/09/2018 Samsung Electronics Co., Ltd. today announced that it has begun mass production of a 256-gigabyte (GB) embedded Universal Flash Storage (eUFS) solution with advanced features based on automotive specifications from the JEDEC UFS 3.0 standard, for the first time in the industry.

02/06/2018 These awards honor the distributor in each region that led overall channel sales, grew market share, captured increased sales of products from ON Semiconductor’s acquisitions and scored highly on overall process excellence.

02/02/2018 Nordson MARCH, a Nordson company introduces the MesoSPHERE Plasma System for very-high throughput processing of 3D and wafer-level packaging processes such as fan-in, fan-out, wafer-level, and panel-level – handling wafers up to 450mm and panels up to 480mm.

02/01/2018 Driven by emerging technologies like Artificial Intelligence (AI), Internet of Things (IoT), machine learning and big data, the digital transformation has become an irreversible trend for the electronics manufacturing industry. The global market for smart manufacturing and smart factory technologies is expected to reach US$250 billion in 2018.

TWITTER

WEBCASTS

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.

This webcast will examine the state-of-the-art in conductors and dielectrics, -- including contacts and Metal1 through global level -- pre-metal dielectrics, associated planarization, necessary etch, strip and cleans, embedded passives, global and intermediate TSVs for 3D, as well as reliability, system, and performance issues.

TECHNOLOGY PAPERS

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018Sponsored by Mentor Graphics

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017Sponsored by National Instruments

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. Download this white paper to learn the basics of testing RF PAs and FEMs via an interactive white paper with multiple how-to videos.May 22, 2017Sponsored by National Instruments