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Screening Test of Multichip Module Without Recalculation of Serial Number Dependent Test Values

Publishing Venue

IBM

Related People

Barbash, WA: AUTHOR

Abstract

Because of the repair status of a multichip module, it is improbable that modules with the same part number will have the same nets to chip-in-place test (CIPT). The screening tests prior to CIPT can be done without recalculation of the expected measurement values for each serial number of the module.

Country

United States

Language

English (United States)

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Screening Test of Multichip Module Without Recalculation of Serial Number
Dependent Test Values

Because of the repair status of a multichip module, it is improbable that
modules with the same part number will have the same nets to chip-in-place test
(CIPT). The screening tests prior to CIPT can be done without recalculation of
the expected measurement values for each serial number of the module.

Prior to chip-in-place test (CIPT) of a multichip module (MCM), the MCM can
be screened for gross degradation resulting from chip mounting. The following
tests can presently be done without placing the MCM in a cooling environment as
required for CIPT: 1) nodal conductance with low power applied, 2) impedance
measurement with power off.

A problem arises with these tests in that the measurements to be made on
the tested MCM are serial-number dependent, because of the repairs that must
be made to the module substrate. The repair wires that do not affect CIPT are
applied after CIPT. However, the measurements to be made in either Test 1 or 2
are dependent upon the net configuration, as seen at any chip-to-substrate
connection redistribution pad (EC pad).

The expected measurements can be pre-computed for each serial number by
examining the design and repair history files, and calculating the loading for the
actual connections.

It is proposed that the calculation of the loading be eliminated and, in its
place, that comparative measurements be made on a module Unit Under Test
(U...