In comparison to the substantially rougher gold surfaces created by other methods, (left), the flip-chip lamination method creates an ultra-smooth gold surface, (right), which allows the organic molecules to form a thin yet even layer between the gold and silicon (Photo: Coll Bau, NIST)

Article Summary

Researchers have found a way of sandwiching organic molecules between silicon and metal that could allow the creation of electronic switches made from individual molecules. Using molecules as switches carries the promise of even smaller electronic components that can be produced cheaply in huge numbers, perform faster than their larger silicon brethren, and use only a fraction of their energy.