We'd like to help you, but we don't have a clue of what you're talking about. * Which 'heatseal' machine are you using? Is that a reflow soldering machine? See, we think of a heatsealing machine as one that bond the two sides of a plastic bag together * Traditionally, 'LEADFLOAT , OPEN, BRIDGE/SHORTED' are soldering defects

So that we can help, here's what you need to do to help us understand your situation better. Describe: * Defect, defect rate, breadth, scope etc. * Process machine and settings * Process materials: solder alloy, board soldermask, board solderability protection, etc * Pictures * All the other stuff you know

*We are using "HOT BAR SOLDERING" we are bonding "FFC" and "PCB" at 0.5mm pitch. Machine settings: Heating Temp. 310º, Colling Temp. 190º Delay Time 1sec We also using "BECKLITE" as Soldering Jig that can resist up to 400º.

We are using 1 is to 1 meaning 0.5mm PCB pad and 0.5mm FFC pad @ 0.5mm pitch using also .10 Metal mask Hieght.