Yasuhiro Yoshitake, Yokohama JP

Yasuhiro Yoshitake, Yokohama JP

Patent application number

Description

Published

20080239289

METHOD AND APPARATUS FOR INSPECTING A SEMICONDUCTOR DEVICE - A semiconductor defect inspection apparatus using a method of comparing an inspected image with a reference image includes the following: (1) a light source and an illuminating optical system, (2) plural defect optical imaging systems and photo detectors for scattered light detection, (3) a substrate holder and a stage for a scan, (4) means for obtaining the misalignment information on an adjacent die image using the inspection image of a defect optical imaging system with the highest spatial resolution, and means for transmitting the misalignment information to all the defect inspection image processing units, (5) means for correcting misalignment information so that a design and adjustment condition of each optical imaging system may be suited, and means for calculating a difference image between dies based on the corrected misalignment information, and (6) a defect detection and image processing unit for performing defect determination and detection processing based on the difference image between the dies.

10-02-2008

20090002695

Method and Apparatus for Reviewing Defect - The present invention provides an apparatus and a method for reviewing a defect with high throughput by detecting the defect to be reviewed with high sensitivity, comprising: an optical microscope; a correction means; and a scanning electron microscope which reviews the defect existed on the sample; wherein the optical microscope has: an optical height detection system which optically detects a vertical position of an upper surface of the sample placed on the stage; an illumination optical system which illuminates the defect with light; an image detection optical system which converges and detects reflected light or scattered light generated from the defect illuminated by the illumination optical system to obtain an image signal; and a focus adjusting means which adjusts a focus position of the optical microscope based on the vertical position of the upper surface of the sample, which is detected by the optical height detection system.

01-01-2009

20090161244

Method and apparatus for inspecting defects of patterns formed on a hard disk medium - If an inspection method for inspecting a patterned medium is intended for the nanoimprint process control, it is necessary to measure a correct shape of each pattern element. On the other hand, if the inspection method is intended for the quality control of products, it is necessary to inspect the products on a 100 percent basis. However, the conventional method which uses SEM or AFM could not satisfy these requirements.

06-25-2009

20090213215

DEFECT INSPECTION APPARATUS AND METHOD - In a defect inspection apparatus for inspecting a wafer provided with a circuit pattern for defects, the illuminating direction of illuminating light rays is selectively determined such that an area containing a defect that scatters light of high intensity coincides with the aperture of a dark-field detecting system, and such that regularly reflected light regularly reflected by a pattern, which is noise to defect detection, does not coincide with the aperture of the dark field detecting system.

08-27-2009

20090257647

Method and Apparatus for Inspecting Defects - A two-dimensional sensor is installed inclining at a predetermined angle to a moving direction of a stage on which an object to be inspected is mounted and, in synchronism with the movement of the stage, a picked up image is rearranged so that there can be obtained an image in high-density sampling with a picture-element size or less of the two-dimensional sensor with respect to a wafer. Thus, interpolation calculation during position alignment becomes unnecessary, and size calculation and classification of a defect can be performed with high accuracy.

10-15-2009

20090279079

METHOD AND APPARATUS FOR INSPECTING DEFECTS - To provide a defect inspection apparatus for inspecting defects of a specimen without lowering resolution of a lens, without depending on a polarization characteristic of a defect scattered light, and with high detection sensitivity that is realized by the following. A detection optical path is branched by at least one of spectral splitting and polarization splitting, a spatial filter in the form of a two-dimensional array is disposed after the branch, and only diffracted light is shielded by the spatial filter in the form of a two-dimensional array.

11-12-2009

20100014075

Method and Apparatus for Inspecting Defects - An apparatus for inspecting a substrate surface is provided, which includes illumination optics for irradiating the substrate surface linearly with rectilinearly polarized light from an oblique direction, detection optics for acquiring images of the substrate surface, each of the images being formed by the light scattered from the light-irradiated substrate surface, and means for comparing an image selected as an inspection image from the plurality of substrate surface images that the detection optics has acquired to detect defects, and another image selected from the plural images of the substrate surface as a reference image different from the inspection image; the illumination optics being formed with polarization control means for controlling a polarizing direction of the light according to a particular scanning direction of the substrate or a direction orthogonal to the scanning direction.

01-21-2010

20100014083

Method and Apparatus for Inspecting Defects - An apparatus for inspecting a substrate surface is provided, which includes illumination optics for irradiating the substrate surface linearly with rectilinearly polarized light from an oblique direction, detection optics for acquiring images of the substrate surface, each of the images being formed by the light scattered from the light-irradiated substrate surface, and means for comparing an image selected as an inspection image from the plurality of substrate surface images that the detection optics has acquired to detect defects, and another image selected from the plural images of the substrate surface as a reference image different from the inspection image; the illumination optics being formed with polarization control means for controlling a polarizing direction of the light according to a particular scanning direction of the substrate or a direction orthogonal to the scanning direction.

01-21-2010

20100039652

METHOD AND APPARATUS FOR MEASURING DISPLACEMENT OF A SAMPLE - In a displacement measurement apparatus using light interference, a probe light path is spatially separated from a reference light path. Therefore, when a temperature or refractive index distribution by a fluctuation of air or the like, or a mechanical vibration is generated, an optical path difference fluctuates between both of the optical paths, and a measurement error is generated. In the solution, an optical axis of probe light is brought close to that of reference light by a distance which is not influenced by any disturbance, a sample is irradiated with the probe light, a reference surface is irradiated with the reference light, reflected light beams are allowed to interfere with each other, and a displacement of the sample is obtained from the resultant interference light to thereby prevent the measurement error from being generated by the fluctuation of the optical path difference.

02-18-2010

20100182589

SPECTRAL DETECTION METHOD AND DEVICE, AND DEFECT INSPECTION METHOD AND APPARATUS USING THE SAME - In spectral detection for detecting the shape of repeating pattern structures uniformly formed on a surface of a test object, it is advantageous to use light having a wide wavelength range in a short wavelength region. However, it is not easy to realize a relatively simple optical system capable of spectral detection of light having a wide wavelength range in a short wavelength region, namely in ultraviolet region. The present invention provides an inspection apparatus for detecting pattern defects. The inspection apparatus includes a spectral detection optical system capable of spectral detection of light in a wavelength range from deep ultraviolet to near infrared. The spectral detection optical system includes a spatially partial mirror serving as a half mirror and a reflecting objective provided with an aperture stop for limiting the angle and direction of light to be applied to and reflected by a test object.

07-22-2010

20110020956

METHOD OF MEASURING PATTERN SHAPE, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND PROCESS CONTROL SYSTEM - A method of measuring a pattern shape of performing a shape measurement of a semiconductor pattern at a high accuracy even when a process margin is narrow with respect to miniaturization of a semiconductor device is provided. In the method of measuring a pattern shape, when a best-match calculated waveform cannot be selected, at least one parameter among shape parameters is set as a fixed value based on information obtained by another measurement apparatus that uses a measurement method independent to the pattern shape measurement, a matching of a library and a detected waveform is performed again, a best-match calculated waveform is selected, and shape information of an object pattern is obtained from the best-match calculated waveform.

01-27-2011

20110069895

DEFECT INSPECTION SYSTEM - The present invention relates to a defect inspection system which can perform inspection condition setting easily in a relatively short period of time, can examine the inspection condition setting even when there is no sample, and further can provide an inspection condition and a defect signal intensity to a person, who sets the inspection condition, to assist the inspection condition setting. In the defect inspection system, a defective image, which is an inspection image, and a reference image corresponding thereto and a mismatched portion of the defective image and the reference image are digitalized as a defect signal intensity and accumulated in association with the inspection condition, and the inspection conditions are changed to repeat evaluations while repeating accumulating works until the evaluation of all the inspection conditions in a set range is completed. After all the evaluations are completed, if there are a plurality of defects to be inspected, the work is repeated by times corresponding to the number of kinds of the defects and a recipe file including the accumulated conditions having the high defect signal intensity and an inspection condition item distribution as a inspection condition recipe is automatically outputted and is provided to the person who sets the inspection condition. And, appearance inspection for detecting a pattern defect or a foreign material defect on a substrate is performed.

03-24-2011

20110279820

DUV-UV BAND SPECTROSCOPIC OPTICAL SYSTEM AND SPECTROMETER USING SAME - Disclosed are a spectroscopic optical system and a spectrometer both enabling vertical illumination by means of an optical system using only refractive lenses and enabling wide-band color correction in the DUV-UV (190 to 400 nm) range. The spectroscopic optical system and spectrometer each comprise a light source (

11-17-2011

20120008132

METHOD AND APPARATUS FOR REVIEWING DEFECT - The present invention provides an apparatus and a method for reviewing a defect with high throughput by detecting the defect to be reviewed with high sensitivity, comprising: an optical microscope; a correction means; and a scanning electron microscope which reviews the existing defect on the sample; wherein the optical microscope has: an optical height detection system which optically detects a vertical position of an upper surface of the sample placed on the stage; an illumination optical system which illuminates the defect with light; an image detection optical system which converges and detects reflected light or scattered light generated from the defect illuminated by the illumination optical system to obtain an image signal; and a focus adjusting means which adjusts a focus position of the optical microscope based on the vertical position of the upper surface of the sample, which is detected by the optical height detection system.

WAVEFRONT ABERRATION MEASURING METHOD AND DEVICE THEREFOR - Measurement cannot be made when trying to measure a wavefront aberration of a wide-angle lens, being wide in a field of view, comparing to a focus distance, by a Shack-Hartmann sensor, since an inclination of the wavefront exceeds an allowable value of inclination of the Shack-Hartmann sensor.

01-26-2012

20120019816

DEFECT INSPECTION METHOD AND DEFECT INSPECTION APPARATUS - The present invention provides a spatial filtering technology for exposing a defect image independently of polarization properties of defect scattered light, a defect inspection method for increasing a defect capture rate by suppressing the brightness saturation of a normal pattern, and a defect inspection apparatus that uses the defect inspection method. An array of spatial filters is disposed in one or more optical paths, which are obtained by polarizing and splitting a detection optical path, to filter diffracted light and scattered light emitted from the normal pattern. An image whose brightness saturation is suppressed is obtained by controlling an illumination light amount and/or detection efficiency during image detection in accordance with the amount of scattered light from the normal pattern.

01-26-2012

20120062903

METHOD AND APPARATUS FOR MEASURING DISPLACEMENT OF A SAMPLE TO BE INSPECTED USING AN INTERFERENCE LIGHT - In a displacement measurement apparatus using light interference, a probe light path is spatially separated from a reference light path. Therefore, when a temperature or refractive index distribution by a fluctuation of air or the like, or a mechanical vibration is generated, an optical path difference fluctuates between both of the optical paths, and a measurement error is generated. In the solution, an optical axis of probe light is brought close to that of reference light by a distance which is not influenced by any disturbance, a sample is irradiated with the probe light, a reference surface is irradiated with the reference light, reflected light beams are allowed to interfere with each other, and a displacement of the sample is obtained from the resultant interference light to thereby prevent the measurement error from being generated by the fluctuation of the optical path difference.

03-15-2012

20120236296

METHOD AND APPARATUS FOR INSPECTING DEFECTS - To provide a defect inspection apparatus for inspecting defects of a specimen without lowering resolution of a lens, without depending on a polarization characteristic of a defect scattered light, and with high detection sensitivity that is realized by the following. A detection optical path is branched by at least one of spectral splitting and polarization splitting, a spatial filter in the form of a two-dimensional array is disposed after the branch, and only diffracted light is shielded by the spatial filter in the form of a two-dimensional array.

09-20-2012

20120281207

DEFECT INSPECTION DEVICE USING CATADIOPTRIC OBJECTIVE LENS - A defect inspection device comprises an inspection optical system including a light source, a half mirror for reflecting illumination light emitted from the light source, a catadioptric objective lens for collecting reflected light from the sample by illumination light reflected by the half mirror, an imaging lens for focusing the reflected light transmitted through the catadioptric objective lens, a relay lens having a blocking member provided at a position at which specularly reflected light from the sample is focused by the imaging lens, and a detector for defecting the reflected light of the specularly deflected light blocked by the blocking member; and a computation processing unit for detecting defects of the sample on the basis of the signals detected by the detector.

11-08-2012

20130003038

Distance Measuring Device and Distance Measuring Method - Disclosed is a distance measuring device using an optical comb. In order for the absolute distance to an object to be measured which has a surface with low reflection ratio or a scattering surface and is approximately 10 m apart, to be easily measured with accuracy of 0.1 mm or more using an optical and contactless method, the distance measuring device which measures the distance to the object to be measured is configured such that the distance to the object to be measured is measured by comparing the phase of the beat signal between a light source and a plurality of CW lasers which are reflected or scattered by the object with the phase of the beat signal between the light source and a plurality of CW lasers prior to being irradiated onto the object.

01-03-2013

20130058558

DEFECT INSPECTION SYSTEM - A defect inspection system is disclosed for easily setting inspection conditions and providing an inspection condition and a defect signal intensity to an operator. The defect inspection system digitizes a defective image, and a reference image corresponding thereto and a mismatched portion of the defective image and the reference image as a defect signal intensity and accumulates them in association with the inspection condition. The inspection conditions are changed to repeat evaluations while repeating accumulating works until the evaluation of all the inspection conditions in a set range is completed. A recipe file including the accumulated conditions having the high defect signal intensity and an inspection condition item distribution as a inspection condition recipe is automatically outputted and provided to the operator.