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Abstract

In the packaging of modules, it is desirable to provide a cover member which will allow for access to the module for any necessary reworking, e. g., replacing a defective chip. Such a cover member is shown in combination with a substrate and chip in Fig. 1, an exploded, longitudinal sectional view.

Country

United States

Language

English (United States)

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Removable Cap For Modules

In the packaging of modules, it is desirable to provide a cover member which
will allow for access to the module for any necessary reworking, e. g., replacing a
defective chip. Such a cover member is shown in combination with a substrate
and chip in Fig. 1, an exploded, longitudinal sectional view.

A module comprising a substrate 10 mounting a semiconductor chip 12 by
means of solder connections 13 is shown. A cover 14 is formed from any
conventional material, such as light gauge steel. and is formed with an upwardly
extending lip 16 defining a central opening 18. (This opening can be any desired
shape, but normally rectangular or round is preferred.) A flat soldering surface
19 surrounds the lip 16.

A solder preform ring 20 is formed to surround the lip 16 which ring conforms
to and rests on the surface 19. The ring 20 is used to attach a cap 22 to the
cover 14. The solder preform 20 is formed of a solder material which has a
liquidus temperature lower than the liquidus temperature of the solder connection
13 which connect the chip to the substrate. Thus, the cover 14 attached to the
substrate with the cap 22 and solder preform 20 in place can be introduced into a
furnace and the solder preform 20 allowed to flow without disturbing the solder
connections 13 connecting the chip 12 to the substrate 10. An assembled
structure is shown in Fig. 2.

In order to rework the substrate and/or chip, the whole assembly can be
placed in an oven heate...