The 16nm Porrima platform represents what is claimed to be the first sampling platform that includes field-proven PAM4 DSP technology, a linear transimpedance amplifier (TIA) and driver for up to 400G client optical modules. Leveraging experience from five generations of DSP development, each of which have been field deployed starting in 2016, Inphi says it has developed optical platform expertise and an API-based DSP software suite that can achieve quick time to market with the right trade-offs in power and performance for data-center optical interconnects. The Porrima platform also supports a wide range of 25/50/100/400Gbps optical interconnects for hyperscale cloud data-center, service provider and enterprise networks.

The growth of hyperscale cloud networks is at an inflection point, with the number of cloud data centers expected to more than double by 2021, and the amount of traffic within such data centers expected to quadruple over that period, according to Cisco’s 2018 Global Cloud Index Forecast. The existing megatrends of cloud services, Big Data and Internet of Things (IoT) are now being overlaid with a new set of trends like the transition to 5G, autonomous vehicles, artificial intelligence and augmented reality (AR) and virtual reality (VR) that demands a major leap in bandwidth to 400GbE PAM4 optical interconnects.

“The latest generation of 12.8Tb/s Ethernet switch silicon will support 32 ports of 400GbE and is expected to ship in late 2018,” comments Andrew Schmitt, lead analyst at Cignal AI. “These advanced switches require 400GbE DR4/FR4 optical modules built from reliable, low-power PAM4 silicon. The arrival of Inphi’s 400G PAM4 platform solution will boost the 400GbE market and allow optical components vendors and their customers to successfully transition to 400G speeds,” he adds.

optimally designed DSP and TIA receive chain for power-performance trade-offs;

enables customers to develop a 400Gbps optical interconnects in a compact form factor for applications with up to 10km;

the supporting IN563x linear driver and IN566x linear TIA provide packaging flexibility for linearity, high bandwidth, adjustable gain to optimize the PAM4 system performances and wide dynamic range to meet the different performance and link requirements for optical applications; and

implemented in small form factor and power efficiency on proven, high-volume 16nm process technology node, ensuring fastest time to production.

Porrima 16nm product family:

Porrima PAM4 DSP IC provides a full bi-directional interface with host ASICs that have 28GBaud PAM4and NRZ electrical interfaces while bridging to 56GBaud optics. The product family can support PAM4 or NRZ signaling, and both retiming and gearbox functionality with packaging specifically designed for the following optics modules:

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