In assembly the bare board is populated with electronic components, called a "printed circuit board assembly" (PCBA). In through-hole technology, the component leads are inserted in holes surrounded by conductive pads; In surface-mount technology (SMT), the component is placed on the PCB so that the pins line up with the conductive pads or lands on the surfaces of the PCB.

I am working with fine pitch components (15-20 mil) and having soldering problems and would appreciate some opinions. 1) How much of an effect does pad size have on bridging? 2) How much of an effect does solder paste grain size have? What is the recommended size for these applications

Our pre-reflow inspections look ok but after the oven it is shorts galore....any help would be appreciated