Equipment

About Beneq TFS 500

"Our ALD research spans a broad range of applications requiring numerous ALD processes to coat wafers as well as nanoporous and high surface area substrates.

We selected the Beneq TFS 500 for our laboratory, because it affords tremendous flexibility in precursor selection and can quickly be configured for different substrates by swapping the inner reactor. Moreover, the large substrate size and batch capability of this tool are ideal for performing the pilot scale coating required by our industrial partners."

About Beneq nSILVER® anti-tarnish application

"nSILVER has brought about many benefits for both Kalevala Jewelry and Lapponia Jewelry. Compared with other methods available on the market today, we found in our screening that nSILVER alone could offer the combination of premium quality anti-tarnish properties and easy integration into our existing production lines. Together with Beneq, and I stress the word together, we set up an implementation project that lead to us acquire a Beneq TFS 500 ALD system dedicated to nSILVER for our production. Today, with five years of continuous production with nSILVER behind us, our customers and our own production team alike are very satisfied. nSILVER enables premium anti-tarnish properties at the same time as it reduces the need for harmful chemicals in our plant."

We have compiled a list of select references for the following equipment: TFS 200, TFS 200R, TFS 500, WCS 500 and ACS 200. It is an impressive review of the world's best laboratories in materials science, thin films, photovoltaics, barriers and much more.

TFS 500

Thin Film System TFS 500 for ALD research and batch production

The TFS 500 is designed for diverse use in thin film coating applications. Being the first Beneq reactor model, has proven its case as a versatile tool for both in-depth thin film research and robust batch processing. The TFS 500 is an ideal tool for multi-project environments.

The TFS 500 can handle several types of substrates; wafers, planar objects, particles and porous bulk materials, as well as complex 3D objects with high aspect ratio features. It can further be equipped with a manually operated load lock for increased wafer processing capabilities. Different types of reaction chambers can easily be fitted inside the vacuum chamber, which in turn enables optimizing each reaction chamber for each customer application.

The TFS 500 meets both the stringent requirements of industrial reliability and the need for flexibility of R&D operations. Process components are off-the-shelf articles, which ensures spare parts availability. All precursor containers can easily be changed, at short notice. The precursor readiness includes gases, liquids and solid materials. For full flexibility in precursor selection, we have additionally included a 500 °C hot source option.

Performance highlights

Process cycle time predominantly less than 2 seconds. In many cases, less than 1 second (with uniformity variation < ±1% for, e.g., Al2O3).