The new chipsets, designed to deliver performance and power efficiency, dual camera photography, dual SIM and dual 4G VoLTE capabilities, and support innovation in the midmarket,” MediaTek in a statement said.

The company said that developed and emerging markets, P23 and P30, both 16nm chipsets, deliver powerful combinations of premium photography experiences with outstanding connectivity, power-savings with better performance, and simultaneous 4G on dual SIM cards.

The new chipsets come with MediaTek’s Imagiq 2.0 technology suite, the chipsets are equipped to minimize aliasing, grain and noise, reduce chromatic aberration and more – resulting in clear, crisp, high-quality images across a number of lighting conditions.

“Reaching the midmarket means bringing people affordable devices that power and perform with the latest features, like dual-cameras and 4G LTE connectivity,” TL Lee, General Manager of MediaTek’s Wireless Communication business unit said.

Lee added that in the rapidly growing area of new premium mid-range devices, mobile technology innovators know they need to stand out in a crowded field and P23 and P30 enable them to do that.

MediaTek’s Helio P23 will be available globally in Q4 of 2017 and the company plans to launch Helio P30 first in Chinese market.

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