Somerset, NJ — Alpha Assembly Solutions has introduced its ALPHA® TrueHeight® solder preforms, which are engineered with embedded spacer technology. This technology is designed to address all major applications that require bondline thicknesses of 3 mil (75 µm) and greater.

San Diego, CA — AMETEK Engineered Solutions Group (ESG), the power and automated test solutions unit of AMETEK Programmable Power, has introduced its first scaleable, integrated test and measurement systems. The FlexSys systems are designed for use in medium- to high-mix production environments ...

Austin, TX — Banner Engineering has completed the implementation of Optimal Electronics' Optel software for production, scheduling and materials management at facilities in Minneapolis, Minnesota, and Suzhou, China. The company operates a high-mix production environment and its ASM lines are frequently ...

Acton, MA — CAMI Research has released a high-voltage QuickMount housing for its CableEye® automation-ready cable and wire harness testing systems. As a freestanding, quick-release board fixture, it allows users to connect CAMI's test interface boards to the 64-pin headers of any expansion ...

Minneapolis, MN — CyberOptics has introduced its SE3000 SPI system, which is the first SPI system to incorporate the company's multiple reflection suppression (MRS) technology. MRS boosts the system's accuracy, repeatability and reproducibility, for even small paste deposits.

McHenry, IL — Dispense Works has introduced its RD 2500, a flexible, large-format dispensing table. It combines a smart workbench with a built-in, precision, overhead servo, x/y/z gantry system. Mechanisms are neatly tucked in and do not add to the width of the bench. This provides easy access to ...

Cranston, RI — Epoxies, Etc., has added new products that are packaged in the company's TriggerBond® system. TriggerBond cartridges are a convenient, cost-effective way to dispense two-component epoxies, urethanes and silicones for bonding, sealing or potting applications.

Easton, MD — JTAG Technologies has released the latest version of its Visualizer graphical viewing tool for board (PCB) layouts and schematics. The software allows users to assess fault coverage data and pinpoint production test faults quickly.

Deurne, Netherlands — Nordson DIMA has created a standardized, automated, inline concept for heat seal bonding, called C-Quence. The line includes three modules for alignment, ACF laminating and final bonding. Additional modules can be added for more process options.