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San Jose, CA. February 2018 – Yamaichi Electronics USA, a leading supplier of high speed connector and cable assembly products introduces its QSFP-DD (Double Density) high speed connector solution for future Datacom/Telecom demands. QSFP-DD is a much-anticipated form factor to provide optimal density to support the lane count in a 1RU box while maintaining compatibility with QSFP56 module.

QSFP-DD supports 56Gb/s x 8 channels for the latest 400 GbE technology. It has the potential to provide 16.1Tb/s capacity from a single slot switch with 36 QSFP-DD modules. The QSFP-DD connector is designed to meet the future signal requirement that has the potential to reach 112Gb/s per lane channel. Yamaichi's QSFP-DD family offers various port designs (1x1~1x6, 2x1, etc…).

The double-density connector has a challenge to dissipate heat of high energy module to drive the upsurging signal. Yamaichi offers customized heat sink as part of the solution to address the thermal issue and support 12W/port at dual stack cage configuration. Yamaichi QSFP-DD is MSA design compliant. The connector solution comes with QSFP-DD host connector, cage, heat sink and heat sink clip.

ABOUT Yamaichi Electronics USA:Yamaichi Electronics USA, Inc. (YEU) is a wholly owned subsidiary division of Yamaichi Electronics Company, LTD. (YEC). This sub-division, referred to as “YEU”, serves as a Corporate Sales Office representing Yamaichi products in North America. Yamaichi’s parent corporation has subsidiaries and manufacturing plants in over 11 different countries. YEU was founded and incorporated as a business on November 1, 1983, when it opened its first office in Palo Alto, California. Steady growth of the Yamaichi products line in the United States includes our Test & Burn-In sockets and production connectors, as well as standard and high-density connectors. In addition to our Headquarters in San Jose, California, YEU has a number of sale offices and representatives at key locations throughout the United States.