Daily Reviews Summary 06/04/07

LAN parties and events have becoming more and more popular. I remember going to my first LAN event over 5 years ago. I think there were around 10 of us, but it still was great fun. Now LAN events have attendances of over 1000 gamers. The biggest problem I had with going to LAN events was lugging all my gear there. I often ended up breaking something on my case or something inside of it. Well Thermaltake is here to make things easy for you. They have recently released the LanBox case, which is a small form factor (SFF) case that is made just for LAN parties. Let's take a look!

Computex hasn't officially started just yet, but our crew has already spent some time on the inside looking for some early info. We've got some early pictures from the show floor showing the current build-up and some preliminary information regarding some new Shuttle XPCs based upon Intel's upcoming X38 and G33 chipsets. Head on over to the site and take a look.

I'm not going to lie. Even from the outside of the box, this cooler reminds me of a clam. Thanks to the see-through box, you can already tell what the product inside looks like. The front of the box displays all the processor series and motherboard sockets for which this V1 cooler is compatible with. The back of the box has some close-up pictures of the cooler to give you an idea of what you're about to experience. The sides of the box have the specifications of the cooler, as well as a few diagrams of how this cooler dissipates heat from your CPU.

Looking for a portable mouse pad to take to lan parties? The QPAD UC is 3-millimeters thick, uncoated, wide yet portable. Whether you're on the go or sitting at home, the QPAD UC is versatile enough to handle the task.

Intel's P35 chipset was only just released, but ASUS already has seven motherboards which utilize it. We are taking a look at one of their top models, the P5K3 Deluxe. This board utilizes DDR3 memory and has WiFi capabilities built-in. It also turns out to be a great overclocker.

OCZ has taken a new approach at lowering noise and improving cooling capacity. Borrowing a page from CPU and GPU cooling solutions, we now have heatpipe technology being used on memory modules. The principal is the same as other heatpipe coolers - heat is transferred from the base of the cooler (in this case, the memory modules) to the upper deck of aluminum fins via the copper heatpipes on either side of the module. Heatpipe technology has worked wonders for CPU coolers, but is it really functional and even necessary for memory modules? What are the pros and cons of such a system?

SilverStone's product literature calls the SG03 the "SFF enclosure of the future" which is a bold claim, but they correctly identified some of the most important trends happening with enclosures right now. These can be seen in aspects of the SG03's design including use the of lots of quiet cooling, an aluminum chassis, and a cool-but-classy exterior.