Intrduction of thermal interface materials:
Exquisite, low-weight, thin and multi-functionality are the critical tendencies found in the research and development (R&D) of modern electronic products. However, the heat dissipating efficiency issue may exist in these high-tech products, thereby may cause the undesired issues about increases in manufacture cost and damages in lifetime of products.

Figure 1 shows the development trend of CPU which increases sequentially the cost of heat sink. A usage of thermal interface material with high thermal conductivity (such as thermal grease) can improve the heat transfer efficiency, decrease cost of cooler, reduce power consumption and extend products' lifetime.

EPORITE series thermal grease and thermal adhesive (figure 1) can fill the random pores exist between heat sink and cooler (figure 2). They can increase the area of heat conduction and decrease the thermal resistance to reach high efficiency of heat transfer. Using EPORITE thermal interface material is one of the best options to achieve the cost down and elongate lifetime of products.

2. Thermal adhesive
Description:
It is suitable for heat-sink, brass instrument, aluminum and other metals required good thermal conductivity and adhesion.