USMRP10005040BOW-5W-130 13Ω, 65.03GHz 5W BERYLLIUM OXIDE POWER CHIP RESISTORS Microwave power resistors on Beryllium Oxide BeO 5W 99.47 3dB 50 x 100 mils manufactured by US Microwaves
USMRP10005040BOW-5W-130 13Ω, 65.03GHz 5W BERYLLIUM OXIDE POWER CHIP RESISTORS Microwave power resistors on Beryllium Oxide BeO 5W 99.47 3dB 50 x 100 mils manufactured by US Microwaves US MICROWAVES 13Ω, 65.03GHz 5W BERYLLIUM OXIDE POWER CHIP RESISTORS Advanced Microwave Components USMRP10005040BOW-5W-130 FEATURES APPLICATIONS 65.03GHz BeO POWER CHIP RESISTOR High power dissipation while working up to GHz range frequencies Low insertion loss High reliability and ruggedness Small chip size with reduced stray capacitance per unit area Low temperature coefficient Wide operating temperature range Microwave and RF high power terminations Resistive microwave power dividers Wilkinson power dividers Power attenuators Microwave power amplifiers 13Ω, 65.03GHz 5W BERYLLIUM OXIDE POWER CHIP RESISTORS USMRP10005040BOW-5W-130 PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE USMRP10005040BOW-5W-130, 5W, 65.03GHz, Beryllium Oxide (BeO) flange less power chip resistors are designed to be used in chip and wire hybrid circuits as microwave and RF power resistors, power terminations, Wilkinson power dividers, power attenuators, microwave power amplifiers, etc. Flange less thin film power chip resistors and terminations have low temperature coefficients, low noise and increased long term stability compared to their thick film counterpart (see app note 110). In high power applications, temperature coefficient of resistance and long term stability have to be the best available. TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity, performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range of resistive films with sheet resistance films from 1Ω/sq to 10,000Ω/sq. All US Microwaves products are available in die form and are ideal for high reliability hybrid and multi chip module applications. All US Microwaves products are manufactured using GOLD CHIP TECHNOLOGY™ a trade mark of Semiconix Corporation. ELECTRICAL/MECHANICAL CHARACTERISTICS PARAMETER VALUE UNITS Resistance value 13.0 Ω Maxim Power 5 W Maxim Capacitance 0.032 pF 3dB frequency 65.03 GHz Temperature Coefficient -55C to 150C 100 ppm/°C Tolerances available 1 % Operating Temperature range -65 to +200 °C Working voltage (Vw) 9.09 V Peak voltage at 25C, 5 sec 13.635 V Insulation resistance at 25 C 1013 Ω Rth thermal resistance between the resistive layer and the solder joint 1.36 °C/W Note: Power dissipation is provided for a temperature difference of 10°C above ambient between substrate and solder joint. ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device. GENERAL DIE INFORMATION Substrate Thickness [mils] Size [mils] Bonding Pads Backside metal Beryllium Oxide (BeO) 40±3 100x50±2 Top Pad size is Min [W-2]x4 mils, X=17, 3um thick, 99.99% electroplated gold with a TiW barrier. Available different dimensions for X for custom orders (may affect rated power). Keeping X1 as close as possible to X is recommended. Wrap around resistors available with soldable or weldable terminations. X=17 mils for standard products. All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). 65.03GHz BeO POWER CHIP RESISTOR DIE LAYOUT / MECHANICAL SPECIFICATIONS 13Ω, 65.03GHz 5W BERYLLIUM OXIDE POWER CHIP RESISTORS USMRP10005040BOW-5W-130 POWER CHIP RESISTORS - POWER DERATING DIAGRAM 13Ω, 65.03GHz 5W BERYLLIUM OXIDE POWER CHIP RESISTORS USMRP10005040BOW-5W-130 Power Derating POWER CHIP RESISTORS S PARAMETERS 13Ω, 65.03GHz 5W BERYLLIUM OXIDE POWER CHIP RESISTORS USMRP10005040BOW-5W-130 RETURN LOSS S-PARAMETERS STANDARD PRODUCTS ORDERING INFORMATION USM P/N WAFFLE PACK R [Ω] MIN. QTY U/P [$] USMRP10005040BOW-5W-130 -WP 13.0 101 25.34 Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements, different packaging or custom configurations, contact sales department. INSTANT QUOTE US Microwaves P/N Quantity E-mail ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts. DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week. SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF). SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application. GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met. U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves. Home Product Tree Tech. 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US MICROWAVES

13Ω, 65.03GHz 5W BERYLLIUM OXIDE POWER CHIP RESISTORS

Advanced Microwave Components

USMRP10005040BOW-5W-130

FEATURES

APPLICATIONS

65.03GHz BeO POWER CHIP RESISTOR

High power dissipation while working up to GHz range frequencies

Low insertion loss

High reliability and ruggedness

Small chip size with reduced stray capacitance per unit area

Low temperature coefficient

Wide operating temperature range

Microwave and RF high power terminations

Resistive microwave power dividers

Wilkinson power dividers

Power attenuators

Microwave power amplifiers

PRODUCT DESCRIPTION AND SHORT APPLICATION NOTE

USMRP10005040BOW-5W-130, 5W, 65.03GHz, Beryllium Oxide (BeO)
flange less power chip resistors are designed to be used in chip and wire hybrid circuits as microwave and RF power resistors, power terminations,
Wilkinson power dividers, power attenuators, microwave power amplifiers, etc. Flange less thin film power chip resistors and terminations have
low temperature coefficients, low noise and increased long term stability compared to their thick film counterpart (see app note 110). In high
power applications, temperature coefficient of resistance and long term stability have to be the best available.

TECHNOLOGY DESCRIPTION: SEMICONDUCTOR-THIN FILM MANUFACTURING

All thin film microwave products are manufactured using advanced semiconductors and thin film technologies including ultra-stable and self
passivating Tantalum Nitride resistors, gold interconnect metallization and reliable MNOS capacitors to achieve excellent uniformity,
performance and reliability. Thin film technology is the preferred solution for all applications that require low noise, long term stability
and excellent performance at very high frequencies. US Microwaves employs proprietary thin film technologies for deposition of a wide range
of resistive films with sheet resistance films from 1Ω/sq to 10,000Ω/sq. All US Microwaves products are available in die form and are
ideal for high reliability hybrid and multi chip module applications.
All US Microwaves products are manufactured using GOLD CHIP TECHNOLOGY™ a trade mark of
Semiconix Corporation.

ELECTRICAL/MECHANICAL CHARACTERISTICS

PARAMETER

VALUE

UNITS

Resistance value

13.0

Ω

Maxim Power

5

W

Maxim Capacitance

0.032

pF

3dB frequency

65.03

GHz

Temperature Coefficient -55C to 150C

100

ppm/°C

Tolerances available

1

%

Operating Temperature range

-65 to +200

°C

Working voltage (Vw)

9.09

V

Peak voltage at 25C, 5 sec

13.635

V

Insulation resistance at 25 C

1013

Ω

Rth thermal resistance between the resistive layer and the solder joint

1.36

°C/W

Note: Power dissipation is provided for a temperature difference of 10°C above ambient between substrate and solder joint.

ONLY Proper die handling equipment and procedures should be employed. Stresses beyond listed absolute maximum ratings may cause permanent damage to the device.

GENERAL DIE INFORMATION

Substrate

Thickness [mils]

Size [mils]

Bonding Pads

Backside metal

Beryllium Oxide(BeO)

40±3

100x50±2

Top Pad size is Min [W-2]x4 mils, X=17, 3um thick, 99.99% electroplated gold with a TiW barrier. Available different dimensions for X for custom orders (may affect rated power). Keeping X1 as close as possible to X is recommended.

Wrap around resistors available with soldable or weldable terminations. X=17 mils for standard products.

All US Microwaves products are available in die form. Typical delivery for die products is 2-3 weeks ARO. For
Custom designs, delivery is 3-4 weeks ARO. Certain items may be available from stock. Inventory is periodically updated. All devices for chip
and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP).

List prices are for standard products, available from stock.
List prices for other quantities and tolerances are available on line through Instant Quote.
For standard products available from stock, there is a minimum line item order. For custom products
please inquire by contacting US Microwaves technical sales. No rights can be derived from pricing
information provided on this website. Such information is indicative only, is showed for budgetary
use only and subject to change by US MICROWAVES at any time and without notice.

Products sold for space, military or medical applications, element evaluation and/or level K or S qualification are
subject to minimum order levels to be established on a case by case basis. For any special applications, die level KGD qualification requirements,
different packaging or custom configurations, contact sales department.

INSTANT QUOTE

US Microwaves P/N

Quantity

E-mail

ORDERING: Order on line at: http://www.usmicrowaves.com/porder.htm. A copy of the order along with an order confirmation receipt is issued instantly for all orders placed on line. On line Orders have to be verified, accepted and acknowledged by US Microwaves sales department in writing before, becoming non cancelable binding contracts.
DELIVERY: Typical delivery for die products packaged in waffle packs is 2-4 weeks ARO. For Custom designs, delivery is 3-5 weeks ARO. Certain items may be available from stock with delivery up to 1 week.
SHIPPING/PACKAGING: All devices for chip and wire applications are 100% tested, visual inspected and shipped in waffle packs (WP). For larger orders,>10k pc, devices can be shipped on film frame. For smaller quantities, it may vary. For high volume automated assembly, devices may be supplied as 4" wafers 100% tested, inked and diced on expanded film frame (FF).
SAMPLES: Samples are available only for customers that have issued firm orders pending qualification of product in a particular application.

GUARANTEED SUPPLY! US Microwaves guarantees continuous supply and availability of all standard products provided minimum order quantities are met.

U.S. Microwaves has made every effort to have this information as accurate as possible. However, no responsibility is assumed by U.S. Microwaves for its use, nor for any infringements of rights of third parties which may result from its use. U.S. Microwaves reserves the right to revise the content or modify its product line without prior notice. U.S. Microwaves products are not authorized for and should not be used within support systems which are intended for surgical implants into the body, to support or sustain life, in aircraft, space equipment, submarine, or nuclear facility applications without the specific written consent of U.S. Microwaves.