Telink in January announced the, claiming it to be “the world’s first all-in-one system-on-chip (SoC) for the Internet of Things,” that “redefines the IoT landscape by combining the features and functions needed for all 2.4GHz IoT standards into a single SoC.” The company also claims to produce the world’s cheapest IoT chips.

The company said that “With the ability to integrate security, voice search, touch control and other factors, the TLSR8269 is an ideal single-chip solution for human interface devices ranging from smart home applications to wireless toys.”

Telink was founded in 2010 and received venture capital backing from Intel Capital in 2015. According to Xped it has more than 10 chipset designs and is on target to deliver over 100,000,000 units to customers in 2016.

Bluetooth Low Energy leader

Xped says Telink is one of the only companies with true mature Bluetooth Low Energy (BLE) mesh technology and has a number of key patents that cover BLE. “Telink currently supplies its chips to leading customers, including GE, who have adopted Telink’s BLE mesh and produces in excess of 5m chips a month,” Xped said.

The agreement covers:

the marketing of Telink chips and ADRC technology;

work on porting or adapting the current build of the ADRC technology so that it operates or is otherwise able to be used in specific Telink semiconductors;

joint development of a new series of chips based on, incorporating or embedded with the ADRC technology.

The agreement will see each party cross license relevant intellectual property a non-exclusive, worldwide and non-transferable license to the other party.