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Weld Stress Evaluation — Electronic Modules 650856

Welded joints of electronic modules are ad­versely stressed by some encapsulants, especially when subjected to temperature cycling. Weld joints of specific tensile strengths were developed, encap­sulated with various resins, and temperature-cycled to determine failure caused by internal stress. Resins with high coefficients of thermal expansion and high shrinkage values caused weld failures after cure. Furthermore, stress reduction can be accom­plished by proper spacing of weld interconnects.