Abstract:

A surface mount LED assembly (10) comprises a substrate (11), a bonding
pad, an LED chip (12) and a lens package (13). The bonding pad, the LED
chip and the lens package are positioned on the substrate. The LED chip
is electrically connected with the bonding pad. The lens package covers
the LED chip. The lens package comprises a light emitting surface (132)
located away from the LED chip. The light emitting surface is a curved
surface protruding away from the substrate.

Claims:

1. A surface mount LED assembly comprising:a substrate;a bonding pad
formed on the substrate;an LED chip electrically connected with the
bonding pad; anda lens covering the LED chip;wherein the lens comprises a
first light emitting surface facing away from the LED chip, and the first
light emitting surface is a curved surface protruding in a direction away
from the substrate.

2. The surface mount LED assembly as described in claim 1, wherein the
curved surface has a spherically-shaped profile or a
paraboloidally-shaped profile.

3. The surface mount LED assembly as described in claim 2, wherein the
curved surface is a hemispherical surface.

4. The surface mount LED assembly as described in claim 1, wherein the
lens comprises a second light emitting surface and a third light emitting
surface located at two opposite sides of the first light emitting
surface, and the second emitting surface and the third light emitting
surface are selected to be two curved surfaces each having a different
radius of curvature from the first light emitting surface, or one plane
surface and one curved surface having a different radius of curvature
from the first light emitting surface, or both plane surfaces.

5. The surface mount LED assembly as described in claim 1, wherein the
lens is comprised of a transparent material selected from the group
consisting of resin, glass and silicone.

6. A backlight module comprising:a surface mount LED assembly; anda light
guiding plate;wherein the light guiding plate comprises a first surface,
the surface mount LED assembly comprises a substrate, a bonding pad
formed on the substrate, an LED chip electrically connected with the
bonding pad and a lens covering the LED chip, the lens comprises a first
light emitting surface facing away from the LED chip, the light emitting
surface is a curved surface protruding in a direction away from the
substrate, the light guiding plate comprises a recess defined in the
first surface, and the lens package is received in the recess.

7. The backlight module as described in claim 6, wherein the curved
surface has a spherically-shaped profile or a paraboloidally-shaped
profile.

8. The backlight module as described in claim 7, wherein the curved
surface is a hemispherical surface.

9. The backlight module as described in claim 6, wherein the lens
comprises a second light emitting surface and a third light emitting
surface located at two opposite sides of the first light emitting
surface, and the second emitting surface and the third light emitting
surface are selected to be two curved surfaces each having a different
radius of curvature from the first light emitting surface, or one plane
surface and one curved surface having a different radius of curvature
from the first light emitting surface, or both plane surfaces.

10. The backlight module as described in claim 6, wherein the lens is
comprised of a transparent material selected from the group consisting of
resin, glass and silicone.

11. The backlight module as described in claim 6, wherein an inner surface
in the recess of the light guiding plate is a curved surface, a radius of
curvature of the inner surface of the receiving groove is larger than or
equal to that of the first light emitting surface of the lens.

12. The backlight module as described in claim 11, wherein a light
permeable material is arranged between the first light emitting surface
of the lens and the inner surface in the receiving groove of the light
guiding plate.

13. The backlight module as described in claim 12, wherein the light
permeable material is selected from the group consisting of colloid,
gelatin, epoxy, glass and silicone.

14. The backlight module as described in claim 12, wherein a refractive
index of the light permeable material is equal to that of the lens and
the light guiding plate.

15. The backlight module as described in claim 12, wherein a refractive
index of the padding is in a range between a refractive index of the lens
package and a refractive index of the light guiding plate.

16. The backlight module as described in claim 15, wherein the refractive
index of the light permeable material is in a range of 1.4.about.1.5.

17. The backlight module as described in claim 12, wherein the light
permeable material comprises a fluorescent powder mixed therein or a
fluorescent powder layer formed on a surface thereof.

18. A backlight module comprising:a light guiding plate having a light
incident surface with a recess defined in the light incident surface, the
light guiding plate having an inner concave surface in the recess;a
substrate;an LED chip electrically mounted on the substrate;a lens
attached on the substrate, the lens and the substrate cooperatively
enveloping the LED chip therein, the lens being received in the recess of
the light guide plate, the LED chip being located outside the recess of
the light guide plate, the lens comprising a convex surface facing toward
the inner concave surface of the light guide plate, a radius of curvature
of the inner concave surface of the light guide plate being greater than
that of the convex surface of the lens; anda light permeable material
filled between the inner concave surface of the light guide plate and the
convex surface of the lens.

19. The backlight module as described in claim 18, wherein a refractive
index of the light permeable material is in the range from the minimum of
that of the light guide plate and the lens to the maximum of that of the
light guide plate and the lens.

Description:

BACKGROUND OF THE INVENTION

[0001]1. Field of the Invention

[0002]The present invention relates to a surface mount light emitting
diode assembly and a backlight module using the surface mount light
emitting diode assembly, and more particularly to a surface mount light
emitting diode assembly having a high light emitting efficiency.

[0003]2. Description of Related Art

[0004]Light emitting diode (LED) has many advantages, such as high
luminance, low power consumption, good matching with integrated circuit,
long-term reliability and environment friendliness. LED has been widely
used as backlight source in liquid crystal display (LCD), as described in
an article entitled "Sequential Color LED Backlight Driving System for
LCD Panels" cited in a publication of IEEE Transactions on power
electronics, Vol. 22, No. 3 May 2007, authored by Chien-Chih Chen.

[0005]A backlight source using LED normally includes a light guiding plate
having a light incidence surface and a plurality of surface mount LEDs
disposed adjacent to the light incidence surface. Each of the surface
mount LEDs includes a substrate, an LED chip on the substrate and a lens
package arranged on the substrate for covering the LED chip. The lens
package has a light emitting surface away from the substrate. Normally,
the light emitting surface is a plane surface. Light rays emitted by the
LED chip transmit to ambient air through the light emitting surface. As a
refractive index of the lens package is larger than that of the ambient
air, the light rays pass from an optically denser medium to an optically
thinner medium when transmitted from the lens package to the ambient air
through the light emitting surface. Accordingly, a total reflection of
the light rays tends to occur so that part of the light rays can not
reach the outside of the lens package to cause light energy loss of the
surface mount LED assembly.

[0006]Accordingly, what is needed is a surface mount LED assembly which
can reduce light energy loss.

SUMMARY OF THE INVENTION

[0007]In accordance with an embodiment, a surface mount LED assembly
comprises a substrate, a bonding pad, an LED chip and a lens package. The
bonding pad, the LED chip and the lens package are positioned on the
substrate. The LED chip is electrically connected with the bonding pad.
The lens package covers the LED chip. The lens package comprises a light
emitting surface located away from the LED chip. The light emitting
surface is a curved surface protruding away from the substrate.

[0008]Other advantages and novel features of the present invention will
become more apparent from the following detailed description of preferred
embodiment when taken in conjunction with the accompanying drawings, in
which:

BRIEF DESCRIPTION OF THE DRAWINGS

[0009]FIG. 1 is an isometric view of a surface mount LED assembly in
accordance with a preferred embodiment of the present invention;

[0010]FIG. 2 is a cross-sectional view of the surface mount LED assembly
shown in FIG. 1 along a line II-II;

[0011]FIG. 3 is a cross-sectional view of a backlight module using the
surface mount LED assembly of FIG. 1;

[0012]FIG. 4 is an isometric view of a surface mount LED assembly in
accordance with a second embodiment of the present invention; and

[0013]FIG. 5 is a top plan view of the surface mount LED assembly shown in
FIG. 4.

DETAILED DESCRIPTION OF THE INVENTION

[0014]Referring to FIG. 1 and FIG. 2, a surface mount LED assembly 10 in
accordance with a preferred embodiment of the present invention is shown.
The surface mount LED assembly 10 comprises a substrate 11, an LED chip
12 mounted on the substrate 11 and a lens package 13 covering the LED
chip 12.

[0015]The substrate 11 is used for holding the LED chip 12 and can be
comprised of III-IV group compounds semiconductor material, such as GaN.
The substrate 11 has an inverted, cone-shaped recess 115 defined in a top
surface thereof. The substrate 11 comprises a first electrode 110 and a
second electrode 112 for providing power supply for the LED chip 12. The
electrodes 110, 112 are electrically connected with the LED chip 12 so as
to form two bonding pads for the surface mount LED assembly 10.

[0016]The LED chip 12 is received in the cone-shaped recess 115 of the
substrate 11 and can be a GaN LED chip, InGaN LED chip or AlInGap LED
chip, etc.

[0017]The lens package 13 is positioned to cover the LED chip 12. The lens
package 13 is preferably made of a transparent material selected from the
group consisting of resin, glass and silicone. In the present embodiment,
the lens package 13 is made of a resin, such as epoxy resin or polymethyl
methacrylate (PMMA). The lens package 13 has a hemispherical outer
surface and has a stuffing material (not shown) fully receiving in a room
covered by the lens package 13 and the recess 115. The stuffing material
may be resin as mentioned above. The hemispherical outer surface of the
lens package 13 is a light emitting surface 132 and located away from the
LED chip 12. Light rays emitted by the LED chip 12 passes through an
inside of the lens package 13 and reaches an outside of the lens package
13 through the light emitting surface 132. A sphere centre of the light
emitting surface 132 is superposed with a center of the LED chip 12
thereby any part of the light emitting surface 132 having a substantially
identical distance from the LED chip 12, so that most of the light rays
emitted from the LED chip 12 can radiate on respective parts of the light
emitting surface 132 at an approximately zero incident angle.
Accordingly, a total reflection caused by the lens package 13 can be
reduced greatly, and a light emitting efficiency of the surface mount LED
assembly 10 can be greatly improved. That is, most of the light rays
emitted from the LED chip 12 can be extracted and transmitted to an
outside of the lens package 13.

[0018]It is easily understood that the light emitting surface 132 is not
limited to a hemispherical surface. Fox example, the light emitting
surface 132 can also be one third of a spherical surface, one fourth of a
spherical surface or a paraboloidal surface so long as the incidence
angel of the light rays at the light emitting surface 132 can be reduced
to a low numerical value in order to reduce the total reflection in the
light emitting surface 132. Accordingly, the light emitting efficiency of
the surface mount LED assembly 10 can be greatly improved. Therefore, the
surface mount LED assembly 10 is provided with a light emitting surface
132 which protrudes away from the substrate 11 and has a curved surface.
The incidence angel of the light rays casting on the light emitting
surface 132 is limited to a low numerical value by the curved surface so
that the total reflection can be greatly reduced and the light emitting
efficiency of the surface mount LED assembly 10 can be improved.

[0019]Referring to FIG. 3, a backlight module 20 using the surface mount
LED assembly 10 is shown. The backlight module 20 comprises the surface
mount LED assembly 10 and a light guiding plate 22. The light guiding
plate 22 can be made by a transparent material selected from the group
consisting of plastic material, resin, glass and silicone. The light
guiding plate 22 has a first surface 220. A receiving groove 222 having a
hemispherical inner surface is defined in the first surface 220 of the
light guiding plate 22. The surface mount LED assembly 10 is positioned
abutting to the first surface 220 as the lens package 13 is received in
the hole of the receiving portion 222.

[0020]The inner surface of the receiving groove 222 of the light guiding
plate 22 is a curved surface and is used for receiving the light rays out
of the lens package 13 of the LED chip 10. A radius of curvature of the
inner surface of the receiving groove 222 is larger than that of the
light emitting surface 132 of the lens package 13. A padding 24 is
sandwiched between the light emitting surface 132 of the lens package 13
and the inner surface of the receiving groove 222 of the light guiding
plate 22 for filling a gap therebetween and securing the surface mount
LED assembly 10 to the light guiding plate 22. The padding 24 can be
solidified by heating under a pressure applied on the surface mount LED
assembly 10 towards the light guiding plate 22.

[0021]For reducing a difference between the refractive indexes of the
padding 24, the lens package 13 and the light guiding plate 22, and
accordingly eliminating an optical interference, the refractive index of
the padding 24 is preferably limited to a range between the refractive
index of the lens package 13 and the refractive index of the light
guiding plate 22. For example, if the refractive index of each of the
lens package 13 and the light guiding plate 22 is in a range from 1.4 to
1.5, the refractive index of the padding 24 is preferably in a range of
1.4˜1.5. In the present embodiment, the refractive indexes of the
padding 24, the lens package 13 and the light guiding plate 12 are same.

[0022]The padding 24 in the present embodiment is made of silicone which
is a soft, transparent material. The soft padding 24 can make an intimate
contact between the lens package 13 and the light guiding plate 22. It is
also easy to clean up the silicone of the padding 24 so that maintenance
and repair work on the backlight module 20 become simple. The padding 24
can also use a liquid material having a high cohesive coefficient which
is more easy for maintenance and repair than silicone. The padding 24 can
also be made by a material selected from the group consisting of colloid,
gelatin, epoxy and glass. The padding 24 can further comprise a
fluorescent powder mixed therein or a fluorescent powder layer covered on
a surface thereof.

[0023]It is understood that the lens package 13 is not limited to have a
hemispherical shape. Referring to FIG. 4 and FIG. 5, a surface mount LED
assembly 30 in accordance with a second embodiment of the present
invention is shown. The surface mount LED assembly 30 has a similar
configuration with the surface mount LED assembly 10 and comprises a
substrate 31, an LED chip 32 secured on the substrate 31 and a lens
package 33. The difference between the surface mount LED assembly 10 and
the surface mount LED assembly 30 is that the surface mount LED assembly
30 has a first light emitting surface 3321, a second light emitting
surface 3322 and a third light emitting surface 3323. The first light
emitting surface 3321 is positioned in a middle of the lens package 33
and the second light emitting surface 3322 and the third light emitting
surface 3323 are respectively positioned at two opposite lateral sides of
the first light emitting surface 3321. The light emitting surface 3322,
3323 are approximately, symmetrically with respect to the first light
emitting surface 3321. The first light emitting surface 3321 is curved
upwardly, and each of the second and third light emitting surfaces 3322,
3323 is curved outwardly. The light emitting surface 3322, 3323 are
respectively, perpendicular to the first light emitting surface 3321. The
second light emitting surface 3322 has a same radius of curvature as that
of the third light emitting surface 3323. The first light emitting
surface 3321 has a larger radius of curvature than that of each of the
light emitting surfaces 3322, 3323.

[0024]Because the first light emitting surface 3321 has a larger radius of
curvature than that of each of the light emitting surfaces 3322, 3323,
light rays transmitted to the first light emitting surface 3321 have a
smaller incidence angle than light rays transmitted to the light emitting
surfaces 3322, 3323. Thus, a total reflection occurring in the first
light emitting surface 3321 is less than that occurring in the light
emitting surfaces 3322, 3323. A light emitting efficiency of the first
light emitting surface 3321 is higher than that of the light emitting
surfaces 3322, 3323. The light rays casting on the light emitting
surfaces 3322, 3323 can be reflected to the first light emitting surface
3321 so that a light emitting intensity of the first light emitting
surface 3321 of the lens package 33 is strengthened. Therefore, light
emitting intensity of different light emitting surfaces of the lens
package 33 can be adjusted by changing radiuses of curvature of the light
emitting surfaces according to need in applications. In other embodiments
of the present invention, the third light emitting surface 3323 and the
second light emitting surface 3322 can be selected to be two curved
surfaces having different radiuses of curvature, or one plane surface and
one curved surface, or both plane surfaces.