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Agilent Technologies Inc. (NYSE:A) today announced the latest version of its flagship RF and microwave design and simulation platform, Advanced Design System 2011. The new platform will debut on YouTube and in an "Innovations in EDA" webcast with Microwave Journal, scheduled for March 1.

Advanced Design System 2011 delivers exciting new features for new and existing Advanced Design System users, including electromagnetic technologies for faster, more accurate simulations; a new use model that makes electromagnetic simulation easy for all engineers; and layout improvements for easier physical design. Advanced Design System 2011 also features dozens of new capabilities and improvements designed to enhance the platform's functionality and usability.

Also being introduced today is a breakthrough capability in Advanced Design System 2011 for multi-technology co-design, like that inherent in RF modules and system-in-package designs. With this capability, Advanced Design System 2011 becomes the industry's first and only true multi-technology design environment. Using it, engineers can do the following:

Uncover 3-D electromagnetic interactions of bondwires, solder balls, packages, including traces and spiral inductors on the integrated circuits and laminates.

Designs that work when isolated may experience electromagnetic interactions when mounted, packaged, flipped, and placed on laminate or printed circuit board. That is when engineers often see, for the first time, the impact of spiral inductors' mutual inductance, non-ideal ground planes/paths, via placement, and complex trace-routing interactions.

Advanced Design System 2011 features capabilities that help uncover and resolve integration issues early in the design process, before fabrication of wireless components like power amplifiers and RF front-end modules. It also offers engineers the ability to design multiple RF and microwave integrated circuits (implemented with a variety of technologies), assemble them in a package or on a multilayer laminate, and simulate electrical and 3-D electromagnetic performance - all within a single platform. Together, these capabilities represent a significant breakthrough in electronic design automation. With Advanced Design System 2011, design verification no longer needs to stop at the boundary of a single integrated circuit's or module's technology.

See Agilent's newest design and test innovations for advanced RF and microwave research, development and manufacturing at the 2011 IEEE MTT-S International Microwave Symposium, June 7-9, at the Baltimore Convention Center, Booth 813. Join Agilent and its solution partners on Agilent Avenue to connect expert to expert with leaders in the industry.

Agilent Technologies Inc. (NYSE: A) is the world's premier measurement company and a technology leader in chemical analysis, life sciences, electronics and communications. The company's 18,500 employees serve customers in more than 100 countries. Agilent had net revenues of $5.4 billion in fiscal 2010. Information about Agilent is available at www.agilent.com.