CARY, NC – July 5, 2016 – Coventor®, Inc., the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced it will be exhibiting at the 46th annual SEMICON West conference in San Francisco, CA from July 12 – 14, 2016. Coventor will showcase SEMulator3D® 6.0 – the latest version of its semiconductor virtual fabrication platform, which has also been named a finalist in the Best of the West awards. Along with software demonstrations highlighting the newest features of SEMulator3D 6.0 in its booth # 2622, Coventor will showcase how its virtual fabrication environment has been used to help understand and resolve issues in adopting new lithography technologies. read more…

Posted in: Press Releases by Marketing | Comments Off on Coventor to Showcase Lithography Research at SPIE 2016Monday, February 8, 2016

CARY, NC– February 8, 2016 – Coventor®, Inc., the leading supplier of virtual fabrication solutions for semiconductor devices and micro-electromechanical systems (MEMS), today announced it will be exhibiting at the SPIE Advanced Lithography Conference in San Jose, CA from February 21 – 25, 2016. Coventor will highlight how its SEMulator3D virtual fabrication environment has been used to help understand and resolve issues in adopting new lithography technologies in its booth (#227) and in a series of technical papers. read more…

SPIE Advanced Lithography is the world’s premier semiconductor lithography event. For over 40 years, SPIE has brought together industry leaders to solve the latest challenges in lithography and patterning in the semiconductor industry.

Posted in: Press Coverage by Marketing | Comments Off on Package-Level Integration of MEMS in IoT DevicesFriday, October 2, 2015

By Dr. Stephen Breit | Vice President of Engineering, Coventor

ChipScale ReviewSeptember – October 2015

The trend of integrating heterogeneous technologies at the package level is now well underway, and includes MEMS sensors. Heterogeneous package-level integration arguably reached a new level with the release of the Apple Watch. A Chipworks teardown shows more than 30 die in Apple’s S1 package. Curiously, among the few components that are not included in the S1 package are a MEMS inertial measurement unit (IMU) by ST Microelectronics and MEMS microphones by Knowles. Surely Apple and other IoT device makers will strive to achieve higher-density, package-level integration of MEMS sensors in the future, but will need to overcome specific packaging challenges associated with MEMS.

Posted in: Press Releases by Marketing | Comments Off on Coventor Improves Speed and Compatibility of MEMS and IC Co-Design With New Release of Industry-Leading MEMS Design SuiteMonday, October 28, 2013

CARY, North Carolina – October 28, 2013 – Coventor®, Inc., the leading supplier of design automation solutions for micro-electromechanical systems (MEMS), today announced its MEMS+® 4.0 software suite for accelerating development of advanced MEMS devices and systems. The MEMS+ suite enables MEMS and IC designers to rapidly explore and optimize designs in parallel in the MathWorks MATLAB® and Cadence Virtuoso® environments. The MEMS+ 4.0 release features a new capability to export models in Verilog-A format and a full 64-bit implementation that allows more accurate modeling of complex MEMS sensors and actuators.

The MEMS+ 4.0 suite is a key part of Coventor’s platform for MEMS development, which also includes the CoventorWare® and SEMulator3D® software suites. The platform provides a complete solution for designing and verifying state-of-the-art accelerometers, gyroscopes, microphones and many other types of MEMS. This latest release of the MEMS+ suite extends the scope of the platform by providing a ‘tunable’ accuracy-versus-speed approach for co-designing MEMS and integrated circuits (ICs) and compatibility with more EDA analog/mixed-signal simulation environments. read more…

By Mike Jamiolkowski, CEO, Coventor, Inc. (as appeared in the July 2012 e-newsletter: Assembling the Future)

The MEMS market is exploding as smart phones, tablets, games and other mobile devices swallow billions of components. Motion processing and location sensing technologies are central to the functionality of today’s handheld products that most of us find indispensable. Indeed, the merging of sensing with computing power and communications is transforming the MEMS market. But, if it is to meet consumer demand for the fastest growing products, the MEMS industry will need to see the design ecosystem supporting it evolve. read more…

There’s little doubt that the MEMS ecosystem is changing quickly as these devices become ubiquitous, especially in consumer products. The cost and time pressures involved in developing cell phones, games, tablets and other high-growth and emerging MEMS-enabled products are re-shaping the traditional landscape of the MEMS business.

Pure play foundries like TSMC are transforming the MEMS landscape

The most recent report from market research firm IHS on the MEMS manufacturing industry underscores the pace and significance of this evolution. The report counts a dozen pure-play foundries now offering MEMS manufacturing services, a dramatic difference than a decade ago when MEMS manufacturing was done almost entirely in-house at captive MEMS suppliers.

Posted in: Press Coverage by Marketing | Comments Off on A*Star Institute of Microelectronics Announces MEMS Consortium Phase II to Pave Way for High Volume ManufacturingThursday, June 28, 2012

Singapore, 6 June 2012
A*STAR Institute of Microelectronics (IME) has announced the launch of its Micro-Electro-Mechanical-Systems (MEMS) Consortium Phase II, to accelerate MEMS technology into markets driven by strong demand for next generation mobile devices. The second phase of the MEMS Consortium will build on the work accomplished in Phase I to develop 3 product-oriented (PO) devices, namely, the Oscillator, Magnetometer and Energy Harvester, which are among the fastest growing MEMS devices in the next five years.

Phase I has successfully established common MEMS technology platforms for Silicon-On-Insulator (SOI) MEMS, aluminum nitride radio frequency (AIN RF) MEMS and wafer-level packaging (WLP) with solder hermetic bonding. Phase II will focus on establishing MEMS process modules and MEMS-CMOS integration methodologies for the chosen PO devices based on IME’s advanced through-silicon-via (TSV) technology. With the devices as demonstration vehicles, Phase II also aims for developing a process design kit (PDK) for MEMS, paving the way for standardization and cost-effective MEMS solutions for high volume manufacturing.read more…