The USB 3.0 Promoter Group today announced development of a SuperSpeed
USB (USB 3.0) enhancement that will add a much higher data rate,
delivering up to twice the data through-put performance of existing
SuperSpeed USB over enhanced, fully backward compatible USB connectors
and cables. This supplement to the USB 3.0 specification is anticipated
to be completed by the middle of this year.

Compatible with both existing 5 Gbps and new 10 Gbps USB 3.0 hubs and
devices, as well as USB 2.0 products

“With USB technology continuing to be the data and power delivery path
of choice across personal computing and consumer electronics, we are
always looking ahead to how to best improve user experience and
connectivity performance,” said Brad Saunders, USB 3.0 Promoter Group
Chairman. “Doubling SuperSpeed USB performance will be especially
beneficial for emerging USB docking and storage applications.”

“For our customers, 10 Gbps USB represents an important evolution in
this ubiquitous I/O standard,” said Mark VandenBrink, Vice President and
Chief Technology Officer, PC Global Business Unit, HP. “By doubling the
bandwidth while maintaining full backwards compatibility with the broad
ecosystem of USB peripherals and software, we will be able to better
meet the needs of our customers with this high-speed technology.”

“We recognize that more mainstream client computing applications are
going to need higher through-put to user-connected peripherals and
devices,” said Alex Peleg, Vice President, Intel Architecture Group.
“Intel is fully committed to delivering 10 Gbps USB performance to these
platforms while retaining compatibility with the existing USB ecosystem
to help to satisfy user demand for low-cost, higher-performance
solutions.”

“Microsoft has been a strong supporter of the USB community where we
have advocated balancing innovation and compatibility. The planned
updates to USB 3.0 are consistent with our views," said Dennis Flanagan,
General Manager, Windows Ecosystem Engagement. "These updates will
enable higher data rates and allow combining of disk, high-definition
audio/video and networking traffic on a single cable — all while
maintaining compatibility with billions of existing devices.”

“This enhancement builds on the tremendous success of USB and expands
its capability by doubling the data rate,” said Roland Sperlich, TI
Consumer and Computing Interface Product Line Manager. “While
maintaining backward compatibility, the 10 Gbps data rate allows users
to do more with a universal standard that can be leveraged by many
industries.”

The 10 Gbps SuperSpeed USB update is targeted for industry review during
the first quarter of this year. Further information regarding the
specification and plans for pre-release industry reviews will be
provided via the USB Implementers Forum (USB-IF) website at http://www.usb.org/developers/USB-Futures.pdf.

About the USB 3.0 Promoter Group

The USB 3.0 Promoter Group, comprised of Hewlett-Packard Company, Intel
Corporation, Microsoft, Renesas Electronics, ST-Ericsson and Texas
Instruments, developed the USB 3.0 Specification that was released in
November 2008. In addition to maintaining and enhancing this
specification, the USB 3.0 Promoter Group develops specification
addendums to extend or adapt its specifications to support more platform
types or use cases where adopting USB 3.0 technology will be beneficial
in delivering a more ubiquitous, richer user experience.

About the USB-IF

The non-profit USB Implementers Forum, Inc. was formed to provide a
support organization and forum for the advancement and adoption of USB
technology. The USB-IF facilitates the development of high-quality
compatible USB devices through its logo and compliance program, and
promotes the benefits of USB and the quality of products that have
passed compliance testing. Further information, including postings of
the most recent product and technology announcements, is available by
visiting the USB-IF website at www.usb.org.