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� � � � � Inconsistent slurry
delivery or quality to CMP tools is one of the leading causes for polishing
problems. Micro scratches can occur because of changes in the colloidal
suspension (slurry particle agglomeration). Polishing rates and uniformity can
be affected by changes in slurry chemistry. In conventional slurry delivery
systems, the slurry remains stagnant in the line when wafers are not being
polished. Each wafer is not treated with the same slurry quality as the others.
This variation leads to differences in polish quality.

� � � � � Conventionally, the slurry
is delivered to the system using pumps, which control the flow rate. A valve
shuts off flow to the CMP tool when wafers are not being polished.

General description

� � � � � The disclosed method
delivers slurry to CMP systems. This delivery system solves the problems with
slurry aging, particulate agglomeration, and chemical changes in the slurry.

� � � � � The disclosed method
is a slurry delivery system that keeps the slurry in continuous motion and
prevents stagnation (see Figure 1). Most of the issues with slurry aging,
alteration of chemistry and agglomeration of particles occur because the slurry
remains stagnant in the line when wafers are not being polished on the CMP
tool. Particle agglomeration or changes in particle suspens...