The MM-1 Mini Mirror allows the user to inspect solder joints of a BGA component before and after the reflow at the BGA rework process. The operator will be able to visually inspect the outer row of solder joints to determine proper wetting, and alignment. The MM-1 Mini Mirror is a great tool for PCB rework and prototype printed circuit board assembly.

Flip-Up Handle

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Price : $59.00

SH-1 Handheld printing tool for use with Flip-Up Stencils

Flip-up stencils are small solder paste stencils typically used to print a single component a printed circuit board.
They were designed to be used with the MSP 100/300/400 and SH-1 printers though they can be used manually.
They come with a holder and a squeegee blade. A flip-up stencil is a great tool for PCB rework and printed circuit board assembly.

Flip-up Stencils are custom made for any component and can be customized with relief areas, to eliminate removing neighboring components.
They have the same footprint and aperture sizes used in a regular production stencil.
They can be made in BGA, QFP, PLCC, SOIC, and connector patterns.