Sign up to receive free email alerts when patent applications with chosen keywords are publishedSIGN UP

Abstract:

An organic packaging carrier is provided. The organic packaging carrier
includes an organic substrate, a conductive circuit layer, and a sealing
metal layer. The organic substrate has a first surface. The conductive
circuit layer is located on the first surface and includes at least a
conductive layer and a sealing ring. The sealing ring is a closed ring.
The sealing metal layer is located on the sealing ring, wherein a
meterial of the sealing metal layer includes AgSn and is lead-free.

Claims:

1. An organic packaging carrier, comprising: an organic substrate having
a first surface; a conductive circuit layer, located on the first surface
and comprising at least a conductive layer and a sealing ring, wherein
the sealing ring is a closed ring; and a sealing metal layer, located on
the sealing ring, wherein a meterial of the sealing metal layer includes
AgSn and is lead-free.

2. The organic packaging carrier as claimed in claim 1, wherein the
conductive layer and the sealing ring are in the same material layer.

3. The organic packaging carrier as claimed in claim 1, wherein the
organic substrate comprises a polyimide substrate or a printed circuit
board reinforced by fiber.

4. The organic packaging carrier as claimed in claim 1, wherein a portion
of the first surface is exposed by the conductive circuit layer.

5. The organic packaging carrier as claimed in claim 4, further
comprising an inorganic hermetic insulation film, at least covering the
exposed first surface to achieve an effect of hermetically sealing the
organic packaging carrier.

6. The organic packaging carrier as claimed in claim 5, wherein the
inorganic hermetic insulation film is extended and covers a portion of
the conductive circuit layer.

8. The organic packaging carrier as claimed in claim 5, further
comprising a metal reinforcement layer located on a surface of the
inorganic hermetic insulation film to improve toughness of the inorganic
hermetic insulation film and to block moisture.

9. The organic packaging carrier as claimed in claim 8, wherein a
material of the metal reinforcement layer is the same as the meterial of
the sealing metal layer.

10. The organic packaging carrier as claimed in claim 8, wherein a
material of the metal reinforcement layer is different from the material
of the sealing metal layer.

11. The organic packaging carrier as claimed in claim 8, further
comprising a metal adhesive layer located between the inorganic hermetic
insulation film and the metal reinforcement layer.

Description:

CROSS-REFERENCE TO RELATED APPLICATION

[0001] This application is a continuation-in-part of and claims the
priority benefit of U.S. patent application No. 13/111,960, filed on May
20, 2011, now pending, which is a divisional of U.S. application Ser. No.
12/850,643, filed on Aug. 5, 2010, now patent No. 7,973,454, which claims
the priority benefit of Taiwan application serial no. 99118186, filed on
Jun. 4, 2010. The entirety of each of the above-mentioned patent
applications is hereby incorporated by reference herein and made a part
of this specification.

TECHNICAL FIELD

[0002] The technical field relates to an organic packaging carrier.

BACKGROUND

[0003] In recent sensor packaging technology, the correlation between
vibration damping of sensors and vibration frequency as well as a sensing
signal-to-noise ratio is taken into account, so the sensors need to be
driven under a high negative pressure environment. Therefore, power
consumption caused by collision of gas molecules can be reduced, and then
the quality factor of the motion sensors can be improved and the sensing
signal-to-noise ratio can be increased. As such, a sensor device package
should provide the sensor device a stable, high negative pressure
environment. That is, gas leakage must be prevented, and the pressure
environment in a sensing space in the sensor device package cannot be
changed as time goes on. Accordingly, the design need of such a sensor
device (e.g. a vibrator, a radio frequency switch, a gyroscope, and so
on) must comply with a hermetic sealing requirement.

[0005] However, when the LTCC carrier is applied, each sensor device
package needs to be formed individually.

SUMMARY

[0006] One of exemplary embodiments comprises an organic packaging
carrier. The organic packaging carrier includes an organic substrate, a
conductive circuit layer, and a sealing metal layer. The organic
substrate has a first surface. The conductive circuit layer is located on
the first surface and includes at least a conductive layer and a sealing
ring. The sealing ring is a closed ring. The sealing metal layer is
located on the sealing ring, wherein a meterial of the sealing metal
layer includes AgSn and is lead-free.

[0007] Several exemplary embodiments accompanied with figures are
described in detail to further describe the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

[0008] The accompanying drawings are included to provide a further
understanding of the disclosure, and are incorporated in and constitute a
part of this specification. The drawings illustrate embodiments of the
disclosure and, together with the description, serve to explain the
principles of the disclosure.

[0009]FIG. 1A is a schematic cross-sectional view illustrating a sensor
device package according to a first exemplary embodiment.

[0010]FIG. 1B is a schematic cross-sectional view illustrating another
sensor device package according to the first exemplary embodiment.

[0012]FIG. 3 is a schematic cross-sectional view illustrating a sensor
device package according to a second exemplary embodiment.

[0013]FIG. 4 is a schematic cross-sectional view illustrating a sensor
device package according to a third exemplary embodiment.

[0014]FIG. 5A and FIG. 5B are enlarged views respectively illustrating a
portion A and a portion B depicted in FIG. 4.

[0015]FIG. 6A to FIG. 6c are schematic views illustrating a process
flowchart of fabricating an organic packaging carrier according to an
exemplary embodiment.

[0016]FIG. 7 is a three-dimensional simplified view illustrating mass
production of a sensor device package according to an exemplary
embodiment.

[0017] FIG. 8A is a top view illustrating an organic packaging carrier
according to a fourth exemplary embodiment.

[0018]FIG. 8B is a schematic cross-sectional view taken along a line
II-II' depicted in FIG. 8A.

[0019]FIG. 9 is a schematic cross-sectional view illustrating an organic
packaging carrier according to a fifth exemplary embodiment.

DETAILED DESCRIPTION

[0020]FIG. 1A is a schematic cross-sectional view illustrating a sensor
device package according to a first exemplary embodiment. FIG. 1B is a
schematic cross-sectional view illustrating another sensor device package
according to the first exemplary embodiment.

[0021] In FIG. 1A, an organic packaging carrier 100, a conductive cap 102,
a sensor device 104, and a metal bonding material 106 are shown. The
organic packaging carrier 100 is also shown in FIG. 2, which is an
enlarged view illustrating a portion II depicted in FIG. 1A.

[0022] The organic packaging carrier 100 includes an organic substrate
108, a conductive circuit layer 110, and an inorganic hermetic insulation
film 112. The organic substrate 108 has a first surface 108a and a second
surface 108b. The conductive circuit layer 110 is located on the first
surface 108a and exposes a portion of the first surface 108a. Besides,
the conductive circuit layer 110 includes at least a conductive layer 114
and a sealing ring 116. The conductive layer 114 and the sealing ring 116
are basically in the same material layer, while the locations and the
functions of the conductive layer 114 and the sealing ring 116 on the
organic substrate 108 are different. The sensor device 104, for example,
is a vibrator device, a sensing chip, and so on. The inorganic hermetic
insulation film 112 at least covers the exposed first surface 108a to
achieve an effect of completely hermetically sealing the organic
packaging carrier 100.

[0023] In the disclosure, the so-called "inorganic hermetic insulation
film" is made of a dense material capable of reducing the transmission
rate of gas molecules, applying electrical insulation, and blocking
moisture. For instance, the material of the inorganic hermetic insulation
film 112 can be inorganic glass, ceramics, aluminum nitride, silicon
oxide, aluminum oxide, and so forth. In addition, the inorganic hermetic
insulation film 112 can be further extended and cover a portion of the
conductive circuit layer 110, so as to ensure accomplishment of the
hermetic sealing effect.

[0024] With reference to FIG. 1A, the conductive cap 102 covers the first
surface 108a of the organic substrate 108 to achieve the effect of
hermetically sealing the organic packaging carrier 100. Here, the
conductive cap 102, for example, is a metal cap. The sensor device 104 is
disposed within the hermetic space 118 and electrically coupled to the
conductive layer 114 of the conductive circuit layer 110. For instance,
when the sensor device 104 is the vibrator device, the sensor device 104
can be electrically connected to the conductive layer 114 of the
conductive circuit layer 110 through a conductor 120. The conductor 120,
for example, is a conductive adhesive (e.g. a silver adhesive). Besides,
the organic substrate 108 and the conductive cap 102 are bonded together
by the metal bonding material 106 disposed therebetween, and the metal
bonding material 106, the sealing ring 116, and the conductive cap 102
can seal the hermetic space 118, so as to prevent gas from entering into
or escaping from the hermetic space 118 through the space between the
organic substrate 108 and the conductive cap 102. Here, the metal bonding
material 106 includes pure metal or an alloy.

[0025] In the exemplary embodiment, the organic substrate 108 is, for
example, a printed circuit board (PCB) reinforced by fiber or a flexible
substrate, e.g. a polyimide (PI) substrate. It is optional to form
circuits such as back wires 122 and conductive through holes 124
penetrating through the organic substrate 108 on the second surface 108b
of the organic substrate 108. Nevertheless, the organic packaging carrier
100 is not limited to the PCB. As long as the inorganic hermetic
insulation film 112 is formed to cover the first surface 108a of the
organic substrate 108 exposed by the conductive circuit layer 110, the
hermetically sealing effect can be accomplished. Given the surface of the
organic substrate 108 is covered by a composite layer including an
organic polymer material and an inorganic material, moisture may escape
from a junction between the organic polymer material and the inorganic
material to the hermetic space 118, and thereby the hermetic sealing
effect cannot be achieved.

[0026] It should be noted that the same reference numerals in FIGS. 1B and
1A represent the same components. As indicated in FIG. 1B, the sensor
device 104 is the sensing chip, and therefore the sensor device 104 can
be electrically connected to the conductive layer 114 of the conductive
circuit layer 110 through metal wires 126 (e.g. Au wires, Al wires, or Cu
wires).

[0027]FIG. 3 is a schematic cross-sectional view illustrating a sensor
device package according to a second exemplary embodiment. It should be
noted that the same reference numerals as in the first exemplary
embodiment are used in FIG. 3 to represent the same components.

[0028] With reference to FIG. 3, the difference between the first
exemplary embodiment and the second exemplary embodiment rests in that
the conductive cap includes a cover substrate 300 and a metal coating
layer 302 in the second exemplary embodiment. The cover substrate 300 has
a recess 300a, and the cover substrate 300 and the organic packaging
carrier 100 together form the hermetic space 118. The metal coating layer
302 at least covers a surface of the cover substrate 300, and the surface
has the recess 300a. As such, gas cannot enter into or escape from the
hermetic space 118 through the cover substrate 300. Here, a base material
of the cover substrate 300 includes polymer, and the cover substrate 300,
for example, is a PCB reinforced by fiber.

[0029]FIG. 4 is a schematic cross-sectional view illustrating a sensor
device package according to a third exemplary embodiment. Note that the
same reference numerals as in the first exemplary embodiment are used in
FIG. 4 to represent the same components.

[0030] With reference to FIG. 4, the difference between the first
exemplary embodiment and the third exemplary embodiment rests in that an
organic packaging carrier 400 in the third exemplary embodiment further
includes a metal reinforcement layer 402 located on a surface of the
inorganic hermetic insulation film 112, so as to improve toughness of the
inorganic hermetic insulation film 112. The metal reinforcement layer 402
itself is also conducive to accomplishment of the hermetic sealing
effect. The metal reinforcement layer 402 does not come into contact with
and is electrically insulated from the conductive circuit layer 110.
Besides, a metal adhesive layer 404 (e.g. Ni/Au) can be formed between
the inorganic hermetic insulation film 112 and the metal reinforcement
layer 402 to enhance adhesion between the inorganic hermetic insulation
film 112 and the metal reinforcement layer 402. The metal adhesive layer
404, the inorganic hermetic insulation film 112, and the metal
reinforcement layer 402 can all block moisture.

[0031] The organic packaging carrier described in the previous exemplary
embodiments not only can serve as the packaging carrier of the sensor
device but also can be applied to other packages in compliance with the
hermetic sealing requirement.

[0032]FIG. 5A and FIG. 5B are enlarged views respectively illustrating a
portion A and a portion B depicted in FIG. 4. In FIG. 5A, the inorganic
hermetic insulation film 112 is extended and covers a portion of the
conductive layer 114, and the inorganic hermetic insulation film 112 is
sandwiched between the metal reinforcement layer 402 and the conductive
layer 114, so as to simultaneously accomplish the hermetic sealing effect
and improve toughness. By contrast, in FIG. 5B, the inorganic hermetic
insulation film 112 is extended and covers a portion of the sealing ring
116, and the organic substrate 108 and the conductive cap 102 are sealed
by the metal bonding material 106, so as to prevent gas from entering
into or escaping from the hermetic space through the space between the
organic substrate 108 and the conductive cap 102.

[0033] The afore-mentioned drawings are cross-sectional views, and the
disclosure is further provided in detail with reference to FIG. 6A to
FIG. 6c that are schematic views illustrating a process flowchart of
fabricating an organic packaging carrier according to an exemplary
embodiment. In FIG. 6A, the section (1) is a top view, and the section
(2) is a cross-sectional view taken along a line II-II' depicted in the
section (1). As indicated in FIG. 6A, conductive circuit layers 602 and
604 are respectively formed on a first surface 600a and a second surface
600b of the organic substrate 600, and a portion of the first surface
600a is exposed. Here, the conductive circuit layer 602 includes
conductive layers 606a and 606b and a sealing ring 608. In addition,
conductive through holes 610 can be formed in the organic substrate 600,
such that the conductive circuit layers 602 and 604 are electrically
coupled to each other. The conductive through holes 610 and the
conductive circuit layer 604 on the second surface 600b of the organic
substrate 600 are formed according to the circuit design and thus are not
necessary components.

[0034] In FIG. 6B, the section (1) is a top view, and the section (2) is a
cross-sectional view taken along a line II-II' depicted in the section
(1). As indicated in FIG. 6B, an inorganic hermetic insulation film 612
is formed on the exposed first surface 600a. Besides, the inorganic
hermetic insulation film 612 is extended and covers parts of the
conductive layers 606a and 606b of the conductive circuit layer 602 and
the sealing ring 608. A material of the inorganic hermetic insulation
film 612 is described in the previous exemplary embodiments.

[0035] In FIG. 6c, the section (1) is a top view, and the section (2) is a
cross-sectional view taken along a line II-II' depicted in the section
(1). As shown in FIG. 6c, a metal adhesive layer 614 and a metal
reinforcement layer 616 can be selectively formed on the inorganic
hermetic insulation film 612 sequentially. Moreover, to ensure the metal
reinforcement layer 616 and the metal adhesive layer 614 do not come into
contact with the conductive circuit layer 602, a dimension of the metal
reinforcement layer 616 and a dimension of the metal adhesive layer 614
can be slightly smaller than a dimension of the inorganic hermetic
insulation film 612.

[0036] The detailed structure of the organic packaging carrier is
elaborated with reference to the aforesaid process, while the aforesaid
process poses no limitation to the fabrication process described in this
disclosure.

[0037] In addition, given the conductive cap described in the first or the
third exemplary embodiment is a metal cap, a plurality of square caps 702
can be formed by exemplarily performing a pressing process on an entire
metal piece 700, as shown in FIG. 7. A plurality of sensor devices (not
shown) are then formed on the organic packaging carrier 704. After
sealing, the entire metal piece 700 and the organic packaging carrier 704
can be cut off along the dashed lines in FIG. 7, such that the sensor
device packages are directly formed. As exemplarily shown in FIG. 7, nine
sensor device packages can be formed in a single manufacturing process.
Hence, the manufacturing time of forming the sensor device packages
through mass production can be significantly reduced in comparison with
the manufacturing time of forming the conventional sensor device packages
with use of ceramic substrates or glass substrates. To achieve the
hermetic sealing effect, the cutting process should be performed on
regions of the metal piece 700 which contain the metal bonding material
and are located among the square caps 702. After the cutting process is
carried out, the individual sensor device package is as shown in FIG. 1
or FIG. 4.

[0038] FIG. 8A is a top view illustrating an organic packaging carrier
according to a fourth exemplary embodiment. FIG. 8B is a schematic
cross-sectional view illustrating an taken along a line II-II' depicted
in FIG. 8A.

[0039] In FIGS. 8A and 8B, the organic packaging carrier 800 includes an
organic substrate 802, a conductive circuit layer 804, and a sealing
metal layer 806. The organic substrate 802 has a first surface 802a and a
second surface 802b opposit to the first surface 802a. The conductive
circuit layer 804 is located on the first surface 802a and includes at
least a conductive layer 808 and a sealing ring 810 that is a closed
ring. In the fourth exemplary embodiment, the sealing ring 810 is
disposed along the edge 802c of the organic substrate 802, but the
disclosure is not limited thereto. The conductive layer 808 and the
sealing ring 810 may be in the same material layer, while the locations
and the functions of the conductive layer 808 and the sealing ring 810 on
the organic substrate 802 are different. The sealing metal layer 806 is
located on the sealing ring 810, wherein a meterial of the sealing metal
layer 806 includes AgSn and is lead-free. Since the sealing metal layer
806 is made of AgSn, there is no need to add flux during manufacture
process, and the manufacture cost can be saved in comparison with
conventonal sealing metal (i.e. AuSn).

[0040] In the exemplary embodiment, the organic substrate 802 is, for
example, a printed circuit board (PCB) reinforced by fiber or a flexible
substrate, e.g. a polyimide (PI) substrate. It is optional to form
circuits such as back wires 812 on the second surface 802b and conductive
through holes 814 penetrating through the organic substrate 802.

[0041]FIG. 9 is a schematic cross-sectional view illustrating an organic
packaging carrier according to a fifth exemplary embodiment. It should be
noted that the same reference numerals as in the fourth exemplary
embodiment are used in FIG. 8 to represent the same components.

[0042] In the organic packaging carrier 900 as shown in FIG. 9, the
difference between the fourth exemplary embodiment and the fifth
exemplary embodiment rests in that an inorganic hermetic insulation film
902 at least covers the exposed first surface 802a due to the hermetic
sealing requirement. If the organic packaging carrier 900 is utilized for
sensor device, a conductive cap (not shown) may be bonded to the organic
substrate 802 by the sealing metal layer 806 disposed on the sealing ring
810. The inorganic hermetic insulation film 902, as discussed above, is
made of a dense material capable of reducing the transmission rate of gas
molecules, applying electrical insulation, and blocking moisture. For
example, a material of the inorganic hermetic insulation film 902
includes inorganic glass, ceramics, aluminum nitride, silicon oxide, or
aluminum oxide. Morever, the inorganic hermetic insulation film 902 may
be further extended and cover a portion of the conductive circuit layer
804, so as to ensure accomplishment of the hermetic sealing effect. The
sealing metal layer 806 on the sealing ring 810 may cover a portion of
the inorganic hermetic insulation film 902, alternatively.

[0043] In the exemplary embodiment, a metal reinforcement layer 904 may be
located on a surface of the inorganic hermetic insulation film 902, so as
to improve toughness of the inorganic hermetic insulation film 902. The
metal reinforcement layer 904 itself is also conducive to accomplishment
of the hermetic sealing effect. The metal reinforcement layer 904 does
not come into contact with and is electrically insulated from the
conductive circuit layer 804. A material of the metal reinforcement layer
904 may be the same as that of the conductive circuit layer 804, and
alternatively, the material of the metal reinforcement layer 904 may be
different from that of the conductive circuit layer 804.

[0044] In additions, a metal adhesive layer 906 may be formed between the
inorganic hermetic insulation film 902 and the metal reinforcement layer
904 to enhance adhesion therebetween. The metal adhesive layer 906, the
inorganic hermetic insulation film 902, and the metal reinforcement layer
904 can all block moisture. The organic packaging carrier 900 not only
can serve as the packaging carrier of the sensor device but also can be
applied to other packages in compliance with the hermetic sealing
requirement.

[0045] In light of the foregoing, the sealing metal layer is made of AgSn,
and thus it can reduce the manufacture cost. Furthermore, since the
organic substrate itself is not equipped with the gas-blocking function,
the surface of the organic substrate exposed by the metal layer is
covered by the hermetic insulation film, and therefore gas can be
prevented from entering into the surface of the entire carrier. In
addition, the metal reinforcement layer capable of improving toughness
can also cover the hermetic insulation film. After the organic packaging
carrier that can block entry of gas is formed, the sensor device package
complying with the hermetic sealing requirement can be further formed.

[0046] Although the disclosure has been described with reference to the
above exemplary embodiments, it will be apparent to one of the ordinary
skill in the art that modifications to the described exemplary
embodiments may be made without departing from the spirit of the
disclosure. Accordingly, the scope of the disclosure will be defined by
the attached claims not by the above detailed descriptions.