French website Nowhereelse [translated] posted more part leaks for the next-generation iPhone this morning, and while we get a new glimpse at the front screen, neither of the pictures show anything terribly new. The bronze piece pictured was originally thought to be an NFC chip, but more conventional wisdom suggests it is a speaker for the headset.

We also received an image of 4 iPhone motherboards before being chip loaded:

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…And, perhaps our most sketchy image:

Thanks, Sonny!

Adding to the slew of alleged leaks, a new image of a purported logic board for the next-generation iPhone has surfaced. The crisp picture shows the logical board without any protective EMI shielding for an internal look at the A6 chip that supposedly sits inside. We are a bit wary about the authenticity of this picture, as its originator, Sonny Dickson, said it needed to be “enhanced with Photoshop.”

It is speculated the A6, or a variant of the A5X chip, would appear in the next iPhone, and many thought Taiwanese Semiconductor Manufacturing Company’s 28nm process would manufacturer the quad-core chip, but the latest reports claimed Apple is stuck with Samsung for at least CPU and/or baseband chip building after TSMC rebuffed an exclusive bid.