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SMT-Sept2017

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36 SMT Magazine • September 2017
by Joerg Nolte
ERSA GMBH
Introduction
Rising customer demands in the field
of PCB repair are a daily occurrence as the
rapidly evolving electronics industry follows
new trends in a blink of an eye. New strategies
and technologies are required to fulfill those
demands.
Out of the long list of today's customer
demands for efficient BTC and SMT PCB repair,
some subjects show up on a daily basis and
are generally agreed upon as relevant for the
coming years:
• BTC types with new effects: voidless
treatment
• Smaller components: miniaturization
(01005 capability)
• Large board handling: dynamic
preheating for large board repair
• Repeatable processes: flux and paste
application (dip and print), residual solder
removal (scavenging), dispensing, multiple
component handling, and traceability
• Operator support: higher automation,
software guidance (human computer
interface)
• Cost effectiveness: rework systems for
different budgets and ROI situations
Some of the listed topics above have not
shown their practical relevance yet. There have
been a number of discussions about 01005
rework capabilities, but up to now there is no
proven evidence that those technologies that
claim to be capable, can truly run successful
rework processes on this tiny component in
a daily real-world rework situation. Many
parameters need to be observed and controlled
in precision line-production, including:
• desoldering and lifting of component
without affecting very close neighbouring
components
• new selective solder paste supply for the
small joints
• picking, adjustment and placement of the
component
• PCB coating
• PCB cleaning and others
BTC and SMT Rework Challenges
FEATURE