S3X70-M500D Sn 3.0Ag 0.5Cu

Solder the right “Spot”.Not “Area” soldering.

Uniformly spherical solder powder

The reason why graping often occurs while using fine particle solder paste is an increase in the amount of oxide layers due to a larger amount of fine particles printed. S3X70-M500D minimizes the amount of oxide layers by selecting fine and spherical solder powders under strict quality checks, in order to retain high meltability.