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LAMINATE FILM AND ELECTRODE SUBSTRATE FILM, AND METHOD OF MANUFACTURING
THE SAME

Abstract

[Object] Provided are an electrode substrate film in which a circuit
pattern formed of a metal thin line is less visible even under highly
bright illumination, and a laminate film applied to the same.
[Solving Means] An electrode substrate film with a transparent substrate
52 and a metal laminate thin line includes a metal absorption layer 51
with a film thickness of 20 nm to 30 nm inclusive as a first layer, and a
metal layer 50 as a second layer, counted from the transparent substrate
side, the laminate thin line having a line width of 20 .mu.m or less.
Optical constants of the metal absorption layer in a visible wavelength
range (400 to 780 nm) satisfy conditions that a refractive index is 2.0
to 2.2 and an extinction coefficient is 1.8 to 2.1 at a wavelength of 400
nm, the refractive index is 2.4 to 2.7 and the extinction coefficient is
1.9 to 2.3 at a wavelength of 500 nm, the refractive index is 2.8 to 3.2
and the extinction coefficient is 1.9 to 2.5 at a wavelength of 600 nm,
the refractive index is 3.2 to 3.6 and the extinction coefficient is 1.7
to 2.5 at a wavelength of 700 nm, and the refractive index is 3.5 to 3.8
and the extinction coefficient is 1.5 to 2.4 at a wavelength of 780 nm.
An average reflectance in the visible wavelength range attributed to
reflection at an interface between the transparent substrate and the
metal absorption layer is 20% or less, and a difference between a highest
reflectance and a lowest reflectance in the visible wavelength range is
10% or less.

1: A laminate film including a transparent substrate formed of a resin
film and a layered film provided on the transparent substrate,
characterized in that the layered film includes a metal absorption layer
with a film thickness of 20 nm to 30 nm inclusive as a first layer, and a
metal layer as a second layer, counted from the transparent substrate
side, optical constants of the metal absorption layer in a visible
wavelength range (400 to 780 nm) satisfy conditions that a refractive
index is 2.0 to 2.2 and an extinction coefficient is 1.8 to 2.1 at a
wavelength of 400 nm, the refractive index is 2.4 to 2.7 and the
extinction coefficient is 1.9 to 2.3 at a wavelength of 500 nm, the
refractive index is 2.8 to 3.2 and the extinction coefficient is 1.9 to
2.5 at a wavelength of 600 nm, the refractive index is 3.2 to 3.6 and the
extinction coefficient is 1.7 to 2.5 at a wavelength of 700 nm, and the
refractive index is 3.5 to 3.8 and the extinction coefficient is 1.5 to
2.4 at a wavelength of 780 nm, and an average reflectance in the visible
wavelength range (400 to 780 nm) attributed to reflection at an interface
between the transparent substrate and the metal absorption layer and an
interface between the metal absorption layer and the metal layer is 20%
or less, and a difference between a highest reflectance and a lowest
reflectance in the visible wavelength range (400 to 780 nm) is 10% or
less.

2: The laminate film according to claim 1, characterized in that the
layered film includes a second metal absorption layer with a film
thickness of 20 nm to 30 nm inclusive as a third layer, counted from the
transparent substrate side, and optical constants of the second metal
absorption layer in the visible wavelength range (400 to 780 nm) satisfy
conditions that a refractive index is 2.0 to 2.2 and an extinction
coefficient is 1.8 to 2.1 at a wavelength of 400 nm, the refractive index
is 2.4 to 2.7 and the extinction coefficient is 1.9 to 2.3 at a
wavelength of 500 nm, the refractive index is 2.8 to 3.2 and the
extinction coefficient is 1.9 to 2.5 at a wavelength of 600 nm, the
refractive index is 3.2 to 3.6 and the extinction coefficient is 1.7 to
2.5 at a wavelength of 700 nm, and the refractive index is 3.5 to 3.8 and
the extinction coefficient is 1.5 to 2.4 at a wavelength of 780 nm.

3: The laminate film according to claim 1, characterized in that the
metal absorption layer is formed of a deposition material of Ni alone or
a Ni-based alloy containing at least one element selected from Ti, Al, V,
W, Ta, Si, Cr, Ag, Mo, and Cu, or Cu alone or a Cu-based alloy containing
at least one element selected from Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, and
Ni, and also by a vacuum deposition method in which a reactive gas is
introduced into a deposition apparatus.

4: The laminate film according to claim 1, characterized in that a film
thickness of the metal layer ranges from 50 nm to 5000 nm inclusive.

5: An electrode substrate film including a transparent substrate formed
of a resin film and a mesh circuit pattern provided on the transparent
substrate and formed of a metal laminate thin line, the electrode
substrate film characterized in that the metal laminate thin line has a
line width of 20 .mu.m or less and includes a metal absorption layer with
a film thickness of 20 nm to 30 nm inclusive as a first layer, and a
metal layer as a second layer, counted from the transparent substrate
side, optical constants of the metal absorption layer in a visible
wavelength range (400 to 780 nm) satisfy conditions that a refractive
index is 2.0 to 2.2 and an extinction coefficient is 1.8 to 2.1 at a
wavelength of 400 nm, the refractive index is 2.4 to 2.7 and the
extinction coefficient is 1.9 to 2.3 at a wavelength of 500 nm, the
refractive index is 2.8 to 3.2 and the extinction coefficient is 1.9 to
2.5 at a wavelength of 600 nm, the refractive index is 3.2 to 3.6 and the
extinction coefficient is 1.7 to 2.5 at a wavelength of 700 nm, and the
refractive index is 3.5 to 3.8 and the extinction coefficient is 1.5 to
2.4 at a wavelength of 780 nm, and an average reflectance in the visible
wavelength range (400 to 780 nm) attributed to reflection at an interface
between the transparent substrate and the metal absorption layer and an
interface between the metal absorption layer and the metal layer is 20%
or less, and a difference between a highest reflectance and a lowest
reflectance in the visible wavelength range (400 to 780 nm) is 10% or
less.

6: The electrode substrate film according to claim 5, characterized in
that the metal laminate thin line includes a second metal absorption
layer with a film thickness of 20 nm to 30 nm inclusive as a third layer,
counted from the transparent substrate side, and optical constants of the
second metal absorption layer in the visible wavelength range (400 to 780
nm) satisfy conditions that a refractive index is 2.0 to 2.2 and an
extinction coefficient is 1.8 to 2.1 at a wavelength of 400 nm, the
refractive index is 2.4 to 2.7 and the extinction coefficient is 1.9 to
2.3 at a wavelength of 500 nm, the refractive index is 2.8 to 3.2 and the
extinction coefficient is 1.9 to 2.5 at a wavelength of 600 nm, the
refractive index is 3.2 to 3.6 and the extinction coefficient is 1.7 to
2.5 at a wavelength of 700 nm, and the refractive index is 3.5 to 3.8 and
the extinction coefficient is 1.5 to 2.4 at a wavelength of 780 nm.

7: The electrode substrate film according to claim 5, characterized in
that the metal absorption layer is formed of a deposition material of Ni
alone or a Ni-based alloy containing at least one element selected from
Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, and Cu, or Cu alone or a Cu-based alloy
containing at least one element selected from Ti, Al, V, W, Ta, Si, Cr,
Ag, Mo, and Ni, and also by a vacuum deposition method in which a
reactive gas is introduced into a deposition apparatus.

8: The electrode substrate film according to claim 5, characterized in
that a film thickness of the metal layer ranges from 50 nm to 5000 nm
inclusive.

9: A method of manufacturing a laminate film which includes a transparent
substrate formed of a resin film and a layered film provided on the
transparent substrate, characterized in that the method comprises: a
first step of forming, by a vacuum deposition method, a metal absorption
layer a film thickness of which ranges from 20 nm to 30 nm inclusive and
optical constants of which in a visible wavelength range (400 to 780 nm)
satisfy conditions that a refractive index is 2.0 to 2.2 and an
extinction coefficient is 1.8 to 2.1 at a wavelength of 400 nm, the
refractive index is 2.4 to 2.7 and the extinction coefficient is 1.9 to
2.3 at a wavelength of 500 nm, the refractive index is 2.8 to 3.2 and the
extinction coefficient is 1.9 to 2.5 at a wavelength of 600 nm, the
refractive index is 3.2 to 3.6 and the extinction coefficient is 1.7 to
2.5 at a wavelength of 700 nm, and the refractive index is 3.5 to 3.8 and
the extinction coefficient is 1.5 to 2.4 at a wavelength of 780 nm, the
metal absorption layer being a first layer, counted from the transparent
substrate side of the layered film; and a second step of forming a metal
layer by the vacuum deposition method, the metal layer being a second
layer, counted from the transparent substrate side of the layered film,
wherein an average reflectance in the visible wavelength range (400 to
780 nm) attributed to reflection at an interface between the transparent
substrate and the metal absorption layer and an interface between the
metal absorption layer and the metal layer is 20% or less, and a
difference between a highest reflectance and a lowest reflectance in the
visible wavelength range (400 to 780 nm) is 10% or less.

10: The method of manufacturing a laminate film according to claim 9,
characterized in that the method further comprises: a third step of
forming, by the vacuum deposition method, a second metal absorption layer
a film thickness of which ranges from 20 nm to 30 nm inclusive and
optical constants of which in the visible wavelength range (400 to 780
nm) satisfy conditions that a refractive index is 2.0 to 2.2 and an
extinction coefficient is 1.8 to 2.1 at a wavelength of 400 nm, the
refractive index is 2.4 to 2.7 and the extinction coefficient is 1.9 to
2.3 at a wavelength of 500 nm, the refractive index is 2.8 to 3.2 and the
extinction coefficient is 1.9 to 2.5 at a wavelength of 600 nm, the
refractive index is 3.2 to 3.6 and the extinction coefficient is 1.7 to
2.5 at a wavelength of 700 nm, and the refractive index is 3.5 to 3.8 and
the extinction coefficient is 1.5 to 2.4 at a wavelength of 780 nm, the
second metal absorption layer being a third layer, counted from the
transparent substrate side of the layered film.

11: The method of manufacturing a laminate film according to claim 9,
characterized in that the metal absorption layer with adjusted optical
constants, which is the refractive index and the extinction coefficient,
is formed by introducing the deposition material of Ni alone or a
Ni-based alloy containing at least one element selected from Ti, Al, V,
W, Ta, Si, Cr, Ag, Mo, and Cu, or Cu alone or a Cu-based alloy containing
at least one element selected from Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, and
Ni, and also by a vacuum deposition method in which a reactive gas is
introduced into a deposition apparatus and a reactive gas into a
deposition apparatus in which the vacuum deposition method is carried
out, and by controlling a deposition condition inside the deposition
apparatus.

12: The method of manufacturing a laminate film according to claim 11,
characterized in that the reactive gas includes oxygen or nitrogen gas
alone, a gas mixture thereof, or a gas mixture with oxygen and nitrogen
as main components.

13: A method of manufacturing an electrode substrate film which includes
a transparent substrate formed of a resin film and a mesh circuit pattern
provided on the transparent substrate and formed of a metal laminate thin
line, characterized in that the metal laminate thin line with a line
width of 20 .mu.m or less is formed by etching the layered film of the
laminate film according to claim 1.

14: The laminate film according to claim 2, characterized in that the
second metal absorption layer is formed of a deposition material of Ni
alone or a Ni-based alloy containing at least one element selected from
Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, and Cu, or Cu alone or a Cu-based alloy
containing at least one element selected from Ti, Al, V, W, Ta, Si, Cr,
Ag, Mo, and Ni, and also by a vacuum deposition method in which a
reactive gas is introduced into a deposition apparatus.

15: The electrode substrate film according to claim 6, characterized in
that the second metal absorption layer is formed of a deposition material
of Ni alone or a Ni-based alloy containing at least one element selected
from Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, and Cu, or Cu alone or a Cu-based
alloy containing at least one element selected from Ti, Al, V, W, Ta, Si,
Cr, Ag, Mo, and Ni, and also by a vacuum deposition method in which a
reactive gas is introduced into a deposition apparatus.

16: The method of manufacturing a laminate film according to claim 10,
characterized in that the second metal absorption layer with adjusted
optical constants, which is the refractive index and the extinction
coefficient, is formed by introducing the deposition material of Ni alone
or a Ni-based alloy containing at least one element selected from Ti, Al,
V, W, Ta, Si, Cr, Ag, Mo, and Cu, or Cu alone or a Cu-based alloy
containing at least one element selected from Ti, Al, V, W, Ta, Si, Cr,
Ag, Mo, and Ni, and also by a vacuum deposition method in which a
reactive gas is introduced into a deposition apparatus and a reactive gas
into a deposition apparatus in which the vacuum deposition method is
carried out, and by controlling a deposition condition inside the
deposition apparatus.

17: The method of manufacturing a laminate film according to claim 16,
characterized in that the reactive gas includes oxygen or nitrogen gas
alone, a gas mixture thereof, or a gas mixture with oxygen and nitrogen
as main components.

18: A method of manufacturing an electrode substrate film which includes
a transparent substrate formed of a resin film and a mesh circuit pattern
provided on the transparent substrate and formed of a metal laminate thin
line, characterized in that the metal laminate thin line with a line
width of 20 .mu.m or less is formed by etching the layered film of the
laminate film according to claim 2.

19: A method of manufacturing an electrode substrate film which includes
a transparent substrate formed of a resin film and a mesh circuit pattern
provided on the transparent substrate and formed of a metal laminate thin
line, characterized in that the metal laminate thin line with a line
width of 20 .mu.m or less is formed by etching the layered film of the
laminate film according to claim 3.

20: A method of manufacturing an electrode substrate film which includes
a transparent substrate formed of a resin film and a mesh circuit pattern
provided on the transparent substrate and formed of a metal laminate thin
line, characterized in that the metal laminate thin line with a line
width of 20 .mu.m or less is formed by etching the layered film of the
laminate film according to claim 14.

21: A method of manufacturing an electrode substrate film which includes
a transparent substrate formed of a resin film and a mesh circuit pattern
provided on the transparent substrate and formed of a metal laminate thin
line, characterized in that the metal laminate thin line with a line
width of 20 .mu.m or less is formed by etching the layered film of the
laminate film according to claim 4.

Description

TECHNICAL FIELD

[0001] The present invention relates to a laminate film which includes a
transparent substrate formed of a resin film and a layered film provided
on the substrate, and an electrode substrate film which is manufactured
using the laminate film and is applied to a touch panel or the like, and
particularly to a laminate film, an electrode substrate film in which a
circuit pattern of electrodes and the like is less visible even under
highly bright illumination, and a method of manufacturing the same.

BACKGROUND ART

[0002] In late years, "touch panels" have come to be widely used which are
installed on surfaces of flat panel displays (FPD) included in a mobile
phone, a portable device for electronic documents, a vending machine, a
car navigation system, and the like.

[0003] The "touch panels" described above are largely divided into
resistive ones and capacitive ones. The "resistive touch panel" has a
main part which includes a transparent substrate formed of a resin film,
an X-coordinate-(or Y-coordinate-) detecting electrode sheet and a
Y-coordinate- (or X-coordinate-) detecting electrode sheet provided on
the substrate, and an insulating spacer provided between these sheets.
Here, although the X-coordinate-detecting electrode sheet and the
Y-coordinate-detecting electrode sheet described above are spatially
separated, both coordinate-detecting electrode sheets are configured to
come into electrical contact with each other when pressed by a pen or the
like, and to detect the position (X-coordinate and Y-coordinate) which
the pen touched. The sheets are designed to trace the movement of the pen
and recognize its coordinates, making it possible for the character to be
inputted as a result. On the other hand, the "capacitive touch panel" has
a structure where an X-coordinate- (or Y-coordinate-) detecting electrode
sheet and a Y-coordinate- (or X-coordinate-) detecting electrode sheet
are laminated with an insulating sheet in between, and an insulator such
as glass is dispose on these. With this setup, when a finger approaches
the above-described insulator such as glass, the sheets detect the
position because electric capacitances of the X-coordinate-detecting
electrode and the Y-coordinate-detecting electrode change.

[0004] Conventionally, transparent conductive films formed of ITO (indium
oxide-tin oxide) and the like have been widely used as a conductive
material for a circuit pattern of electrodes and the like (see Patent
Document 1). Along with an increase in size of touch panels,
mesh-structure metal thin lines as disclosed in Patent Document 2, Patent
Document 3, and the like are beginning to be used.

[0005] Here, comparison between the transparent conductive film and the
metal thin line described above shows the transparent conductive film has
an advantage that, due to its excellent transmittance in a visible
wavelength range, the circuit pattern of electrodes and the like is less
visible, but the transparent conductive film has a disadvantage that it
is unsuitable for the purpose of increasing the size and response speed
of touch panels because its electrical resistance value is higher than
that of the metal thin line. The metal thin line, on the other hand, is
suitable for the purpose of increasing the size and response speed of
touch panels because of its low electrical resistance value, but has a
disadvantage that, due to a high reflectance in the visible wavelength
range, the circuit pattern may be visible under highly bright
illumination even if the metal thin line is formed into a fine mesh
structure, which results in a decrease in product value.

[0006] A possible method of reducing the reflectance of the metal thin
line in the visible wavelength range is to combine a metal film and a
dielectric multilayered film to create an anti-reflective film. However,
the method of combining the metal film and the dielectric multilayered
film is not preferable because the metal thin line for the circuit
pattern of electrodes and the like is formed by etching.

[0007] In such a technical background, a method has been proposed which
reduces reflection on the metal film observed from the resin film side
by, for example, forming a blackened layer between the resin film and the
metal film by electrolytic plating or the like (see Patent Document 4),
or providing a light absorbing layer (metal absorption layer) made of a
metal oxide between the resin film and the metal film (see Patent
Document 5).

[0009] However, there is a problem that provision of a blackened layer and
a metal absorption layer may adversely increase reflection depending on
the spectral optical characteristics of the blackened layer and the metal
absorption layer proposed in Patent Documents 4 and 5, making it
difficult to select a constituent material and a deposition condition.

[0010] The present invention has been made in view of this problem, and an
object thereof is to provide an electrode substrate film in which a
circuit pattern formed of the metal thin line described above is less
visible even under highly bright illumination, to provide a laminate film
used for the manufacture of this electrode substrate film, and to provide
a method of manufacturing these laminate film and electrode substrate
film.

Means for Solving the Problems

[0011] Given the above situation, the present inventor repeatedly carried
out deposition experiments and optical thin-film simulations for the
metal absorption layer to solve the above-described problem, and has
found there exist an optimum optical constants (refractive index and
extinction coefficient) and film thickness condition of the metal
absorption layer which make a spectral reflectance uniform and make the
spectral reflectance low in a visible wavelength range (400 to 780 nm).
Furthermore, it was also confirmed that it is possible to increase a line
width of a metal thin line for a circuit pattern of electrodes and the
like because the reflectance in the visible wavelength range can be
reduced. The present invention has been completed based on such technical
findings.

[0012] In summary, a first aspect of the present invention is

[0013] a laminate film including a transparent substrate formed of a resin
film and a layered film provided on the transparent substrate,
characterized in that

[0014] the layered film includes a metal absorption layer with a film
thickness of 20 nm to 30 nm inclusive as a first layer, and a metal layer
as a second layer, counted from the transparent substrate side,

[0015] optical constants of the metal absorption layer in a visible
wavelength range (400 to 780 nm) satisfy conditions that

[0016] a refractive index is 2.0 to 2.2 and an extinction coefficient is
1.8 to 2.1 at a wavelength of 400 nm,

[0017] the refractive index is 2.4 to 2.7 and the extinction coefficient
is 1.9 to 2.3 at a wavelength of 500 nm,

[0018] the refractive index is 2.8 to 3.2 and the extinction coefficient
is 1.9 to 2.5 at a wavelength of 600 nm,

[0019] the refractive index is 3.2 to 3.6 and the extinction coefficient
is 1.7 to 2.5 at a wavelength of 700 nm, and

[0020] the refractive index is 3.5 to 3.8 and the extinction coefficient
is 1.5 to 2.4 at a wavelength of 780 nm, and

[0021] an average reflectance in the visible wavelength range (400 to 780
nm) attributed to reflection at an interface between the transparent
substrate and the metal absorption layer and an interface between the
metal absorption layer and the metal layer is 20% or less, and a
difference between a maximum transmittance and a minimum transmittance in
the visible wavelength range (400 to 780 nm) is 10% or less.

[0022] A second aspect of the invention is

[0023] the laminate film described in the first aspect, characterized in
that

[0024] the layered film includes a second metal absorption layer with a
film thickness of 20 nm to 30 nm inclusive as a third layer, counted from
the transparent substrate side, and

[0025] optical constants of the second metal absorption layer in the
visible wavelength range (400 to 780 nm) satisfy conditions that

[0026] a refractive index is 2.0 to 2.2 and an extinction coefficient is
1.8 to 2.1 at a wavelength of 400 nm,

[0027] the refractive index is 2.4 to 2.7 and the extinction coefficient
is 1.9 to 2.3 at a wavelength of 500 nm,

[0028] the refractive index is 2.8 to 3.2 and the extinction coefficient
is 1.9 to 2.5 at a wavelength of 600 nm,

[0029] the refractive index is 3.2 to 3.6 and the extinction coefficient
is 1.7 to 2.5 at a wavelength of 700 nm, and

[0030] the refractive index is 3.5 to 3.8 and the extinction coefficient
is 1.5 to 2.4 at a wavelength of 780 nm.

[0031] In addition, a third aspect of the invention is

[0032] the laminate film described in the first aspect or the second
aspect, characterized in that

[0033] each of the metal absorption layer and the second metal absorption
layer is formed of a deposition material of Ni alone or a Ni-based alloy
containing at least one element selected from Ti, Al, V, W, Ta, Si, Cr,
Ag, Mo, and Cu, or Cu alone or a Cu-based alloy containing at least one
element selected from Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, and Ni, and also
by a vacuum deposition method in which a reactive gas is introduced into
a deposition apparatus.

[0034] A fourth aspect of the invention is

[0035] the laminate film described in the first aspect, characterized in
that

[0036] a film thickness of the metal layer ranges from 50 nm to 5000 nm
inclusive.

[0037] Next, a fifth aspect of the present invention is

[0038] an electrode substrate film including a transparent substrate
formed of a resin film and a mesh circuit pattern provided on the
transparent substrate and formed of a metal laminate thin line, the
electrode substrate film characterized in that

[0039] the metal laminate thin line has a line width of 20 .mu.m or less
and includes a metal absorption layer with a film thickness of 20 nm to
30 nm inclusive as a first layer, and a metal layer as a second layer,
counted from the transparent substrate side,

[0040] optical constants of the metal absorption layer in a visible
wavelength range (400 to 780 nm) satisfy conditions that

[0041] a refractive index is 2.0 to 2.2 and an extinction coefficient is
1.8 to 2.1 at a wavelength of 400 nm,

[0042] the refractive index is 2.4 to 2.7 and the extinction coefficient
is 1.9 to 2.3 at a wavelength of 500 nm,

[0043] the refractive index is 2.8 to 3.2 and the extinction coefficient
is 1.9 to 2.5 at a wavelength of 600 nm,

[0044] the refractive index is 3.2 to 3.6 and the extinction coefficient
is 1.7 to 2.5 at a wavelength of 700 nm, and

[0045] the refractive index is 3.5 to 3.8 and the extinction coefficient
is 1.5 to 2.4 at a wavelength of 780 nm, and

[0046] an average reflectance in the visible wavelength range (400 to 780
nm) attributed to reflection at an interface between the transparent
substrate and the metal absorption layer and an interface between the
metal absorption layer and the metal layer is 20% or less, and a
difference between a maximum transmittance and a minimum transmittance in
the visible wavelength range (400 to 780 nm) is 10% or less.

[0047] A sixth aspect of the invention is

[0048] the electrode substrate film described in the fifth aspect,
characterized in that

[0049] the metal laminate thin line includes a second metal absorption
layer with a film thickness of 20 nm to 30 nm inclusive as a third layer,
counted from the transparent substrate side, and

[0050] optical constants of the second metal absorption layer in the
visible wavelength range (400 to 780 nm) satisfy conditions that

[0051] a refractive index is 2.0 to 2.2 and an extinction coefficient is
1.8 to 2.1 at a wavelength of 400 nm,

[0052] the refractive index is 2.4 to 2.7 and the extinction coefficient
is 1.9 to 2.3 at a wavelength of 500 nm,

[0053] the refractive index is 2.8 to 3.2 and the extinction coefficient
is 1.9 to 2.5 at a wavelength of 600 nm,

[0054] the refractive index is 3.2 to 3.6 and the extinction coefficient
is 1.7 to 2.5 at a wavelength of 700 nm, and

[0055] the refractive index is 3.5 to 3.8 and the extinction coefficient
is 1.5 to 2.4 at a wavelength of 780 nm.

[0056] Moreover, a seventh aspect of the invention is

[0057] the electrode substrate film described in the fifth aspect or the
sixth aspect, characterized in that

[0058] each of the metal absorption layer and the second metal absorption
layer is formed of a deposition material of Ni alone or a Ni-based alloy
containing at least one element selected from Ti, Al, V, W, Ta, Si, Cr,
Ag, Mo, and Cu, or Cu alone or a Cu-based alloy containing at least one
element selected from Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, and Ni, and also
by a vacuum deposition method in which a reactive gas is introduced into
a deposition apparatus.

[0059] An eighth aspect of the invention is

[0060] the electrode substrate film described in the fifth aspect,
characterized in that

[0061] a film thickness of the metal layer ranges from 50 nm to 5000 nm
inclusive.

[0062] Next, a ninth aspect of the present invention is

[0063] a method of manufacturing a laminate film which includes a
transparent substrate formed of a resin film and a layered film provided
on the transparent substrate, characterized in that the method comprises:

[0064] a first step of forming, by a vacuum deposition method, a metal
absorption layer a film thickness of which ranges from 20 nm to 30 nm
inclusive and optical constants of which in a visible wavelength range
(400 to 780 nm) satisfy conditions that

[0065] a refractive index is 2.0 to 2.2 and an extinction coefficient is
1.8 to 2.1 at a wavelength of 400 nm,

[0066] the refractive index is 2.4 to 2.7 and the extinction coefficient
is 1.9 to 2.3 at a wavelength of 500 nm,

[0067] the refractive index is 2.8 to 3.2 and the extinction coefficient
is 1.9 to 2.5 at a wavelength of 600 nm,

[0068] the refractive index is 3.2 to 3.6 and the extinction coefficient
is 1.7 to 2.5 at a wavelength of 700 nm, and

[0069] the refractive index is 3.5 to 3.8 and the extinction coefficient
is 1.5 to 2.4 at a wavelength of 780 nm, the metal absorption layer being
a first layer, counted from the transparent substrate side of the layered
film; and

[0070] a second step of forming a metal layer by the vacuum deposition
method, the metal layer being a second layer, counted from the
transparent substrate side of the layered film, wherein

[0071] an average reflectance in the visible wavelength range (400 to 780
nm) attributed to reflection at an interface between the transparent
substrate and the metal absorption layer and an interface between the
metal absorption layer and the metal layer is 20% or less, and a
difference between a maximum transmittance and a minimum transmittance in
the visible wavelength range (400 to 780 nm) is 10% or less.

[0072] Furthermore, a tenth aspect of the invention is

[0073] the method of manufacturing a laminate film described in the ninth
aspect, characterized in that the method further comprises:

[0074] a third step of forming, by the vacuum deposition method, a second
metal absorption layer a film thickness of which ranges from 20 nm to 30
nm inclusive and optical constants of which in the visible wavelength
range (400 to 780 nm) satisfy conditions that

[0075] a refractive index is 2.0 to 2.2 and an extinction coefficient is
1.8 to 2.1 at a wavelength of 400 nm,

[0076] the refractive index is 2.4 to 2.7 and the extinction coefficient
is 1.9 to 2.3 at a wavelength of 500 nm,

[0077] the refractive index is 2.8 to 3.2 and the extinction coefficient
is 1.9 to 2.5 at a wavelength of 600 nm,

[0078] the refractive index is 3.2 to 3.6 and the extinction coefficient
is 1.7 to 2.5 at a wavelength of 700 nm, and

[0079] the refractive index is 3.5 to 3.8 and the extinction coefficient
is 1.5 to 2.4 at a wavelength of 780 nm, the second metal absorption
layer being a third layer, counted from the transparent substrate side of
the layered film.

[0080] An eleventh aspect of the invention is

[0081] the method of manufacturing a laminate film described in the ninth
aspect or the tenth aspect, characterized in that

[0082] the metal absorption layer and the second metal absorption layer
with adjusted optical constants, which are the refractive index and the
extinction coefficient, are formed by introducing the deposition material
according to the third aspect of the invention and a reactive gas into a
deposition apparatus in which the vacuum deposition method is carried
out, and by controlling a deposition condition inside the deposition
apparatus.

[0083] A twelfth aspect of the invention is

[0084] the method of manufacturing a laminate film described in the
eleventh aspect, characterized in that

[0085] the reactive gas includes oxygen or nitrogen gas alone, a gas
mixture thereof, or a gas mixture with oxygen and nitrogen as main
components.

[0086] Furthermore, a thirteenth aspect of the present invention is

[0087] a method of manufacturing an electrode substrate film which
includes a transparent substrate formed of a resin film and a mesh
circuit pattern provided on the transparent substrate and formed of a
metal laminate thin line, characterized in that

[0088] the metal laminate thin line with a line width of 20 .mu.m or less
is formed by etching the layered film of the laminate film according to
any one of the first to fourth aspects of the invention.

Effects of the Invention

[0089] The electrode substrate film of the present invention including a
transparent substrate formed of a resin film and a mesh circuit pattern
provided on the transparent substrate and formed of a metal laminate thin
line, is characterized in that

[0090] the metal laminate thin line has a line width of 20 .mu.m or less
and includes a metal absorption layer with a film thickness of 20 nm to
30 nm inclusive as a first layer, and a metal layer as a second layer,
counted from the transparent substrate side,

[0091] optical constants of the metal absorption layer in a visible
wavelength range (400 to 780 nm) satisfy conditions that

[0092] a refractive index is 2.0 to 2.2 and an extinction coefficient is
1.8 to 2.1 at a wavelength of 400 nm,

[0093] the refractive index is 2.4 to 2.7 and the extinction coefficient
is 1.9 to 2.3 at a wavelength of 500 nm,

[0094] the refractive index is 2.8 to 3.2 and the extinction coefficient
is 1.9 to 2.5 at a wavelength of 600 nm,

[0095] the refractive index is 3.2 to 3.6 and the extinction coefficient
is 1.7 to 2.5 at a wavelength of 700 nm, and

[0096] the refractive index is 3.5 to 3.8 and the extinction coefficient
is 1.5 to 2.4 at a wavelength of 780 nm, and

[0097] an average reflectance in the visible wavelength range (400 to 780
nm) attributed to reflection at an interface between the transparent
substrate and the metal absorption layer and an interface between the
metal absorption layer and the metal layer is 20% or less, and a
difference between a maximum transmittance and a minimum transmittance in
the visible wavelength range (400 to 780 nm) is 10% or less.

[0098] Moreover, the average reflectance in the visible wavelength range
(400 to 780 nm) attributed to reflection at an interface between the
transparent substrate and the metal absorption layer and an interface
between the metal absorption layer and the metal layer is a low value of
20% or less, and the difference between the maximum transmittance and the
minimum transmittance in the visible wavelength range is a uniform value
of 10% or less. For this reason, it is possible to provide an electrode
substrate film in which the circuit pattern of electrodes and the like
provided on the transparent substrate is less visible under highly bright
illumination. Furthermore, a metal laminate thin line with a larger line
width compared to a conventional one can be applied. Thus, the present
invention has an effect that it can provide an electrode substrate film
with a low electrical resistance value.

[0099] Further, the laminate film according to the present invention
including a transparent substrate formed of a resin film and a layered
film provided on the transparent substrate, is characterized in that

[0100] the layered film includes a metal absorption layer with a film
thickness of 20 nm to 30 nm inclusive as a first layer, and a metal layer
as a second layer, counted from the transparent substrate side,

[0101] optical constants of the metal absorption layer in a visible
wavelength range (400 to 780 nm) satisfy conditions that [0102] a
refractive index is 2.0 to 2.2 and an extinction coefficient is 1.8 to
2.1 at a wavelength of 400 nm, [0103] the refractive index is 2.4 to 2.7
and the extinction coefficient is 1.9 to 2.3 at a wavelength of 500 nm,
[0104] the refractive index is 2.8 to 3.2 and the extinction coefficient
is 1.9 to 2.5 at a wavelength of 600 nm, [0105] the refractive index is
3.2 to 3.6 and the extinction coefficient is 1.7 to 2.5 at a wavelength
of 700 nm, and [0106] the refractive index is 3.5 to 3.8 and the
extinction coefficient is 1.5 to 2.4 at a wavelength of 780 nm, and

[0107] an average reflectance in the visible wavelength range (400 to 780
nm) attributed to reflection at an interface between the transparent
substrate and the metal absorption layer and an interface between the
metal absorption layer and the metal layer is 20% or less, and a
difference between a maximum transmittance and a minimum transmittance in
the visible wavelength range (400 to 780 nm) is 10% or less.

[0108] Additionally, the present invention has an effect which makes it
possible to manufacture easily and reliably the electrode substrate film
of the present invention by forming the layered film of the laminate film
according to the present invention, by etching, into the metal laminate
thin line with a line width of 20 .mu.m or less.

BRIEF DESCRIPTION OF THE DRAWINGS

[0109] FIG. 1(A) is a cross-sectional view illustrating a structure of a
laminate film according to the present invention, FIG. 1(B) is a
partially enlarged view of FIG. 1(A), and FIG. 1(C) is a cross-sectional
view illustrating a structure of an electrode substrate film according to
the present invention.

[0110] FIG. 2 is a graph diagram illustrating a relationship between a
wavelength (nm) and a refractive index (n) for each of metal absorption
layers formed under deposition conditions A to E.

[0111] FIG. 3 is a graph diagram illustrating a relationship between a
wavelength (nm) and an extinction coefficient (k) for each of the metal
absorption layers formed under the deposition conditions A to E.

[0112] FIG. 4 is a graph diagram illustrating a relationship between a
wavelength (nm) and a reflectance (%) for each of metal absorption layers
of film thicknesses 0 nm, 5 nm, 10 nm, 15 nm, 20 nm, 25 nm, and 30 nm
formed under the deposition condition A (oxygen concentration of 0%).

[0113] FIG. 5 is a graph diagram illustrating a relationship between a
wavelength (nm) and a reflectance (%) for each of the metal absorption
layers of film thicknesses 0 nm, 5 nm, 10 nm, 15 nm, 20 nm, 25 nm, and 30
nm formed under the deposition condition B (oxygen concentration of 11%).

[0114] FIG. 6 is a graph diagram illustrating a relationship between a
wavelength (nm) and a reflectance (%) for each of the metal absorption
layers of film thicknesses 0 nm, 5 nm, 10 nm, 15 nm, 20 nm, 25 nm, and 30
nm formed under the deposition condition C (oxygen concentration of 23%).

[0115] FIG. 7 is a graph diagram illustrating a relationship between a
wavelength (nm) and a reflectance (%) for each of the metal absorption
layers of film thicknesses 0 nm, 5 nm, 10 nm, 15 nm, 20 nm, 25 nm, and 30
nm formed under the deposition condition D (oxygen concentration of 28%).

[0116] FIG. 8 is a graph diagram illustrating a relationship between a
wavelength (nm) and a reflectance (%) for each of the metal absorption
layers of film thicknesses 0 nm, 5 nm, 10 nm, 15 nm, 20 nm, 25 nm, and 30
nm formed under the deposition condition E (oxygen concentration of 33%).

[0117] FIG. 9 is an explanatory diagram of a deposition apparatus
(sputtering web coater) which carries out a vacuum deposition method of
forming a metal absorption layer and a metal layer on a transparent
substrate formed of a resin film.

MODES FOR PRACTICING THE INVENTION

[0118] An embodiment of the present invention is described below in detail
with reference to the drawings.

[0120] (1-1) In a case of forming a metal absorption layer by a sputtering
method as an example of a vacuum deposition method, the metal absorption
layer mentioned above is formed while introducing a reactive gas such as
oxygen or nitrogen gas into an apparatus (which is referred to as a
sputtering web coater, and a sputtering target, a deposition material, is
attached to a cathode inside a deposition apparatus) which carries out
the sputtering method. Here, it is difficult to automatically determine a
deposition condition (added amount of reactive gas such as oxygen or
nitrogen gas) because it is affected by, for example, a shape of the
deposition apparatus, a conveyance speed of a resin film being a
transparent substrate, a deposition rate at the sputtering cathode, and a
positional relationship among reactive gas discharge pipes, the
sputtering cathode, and the resin film. The deposition condition
described above is derived for every deposition apparatus from the added
amount of reactive gas introduced and characteristic results of the
deposited metal absorption layer.

[0121] (1-2) As a result of deposition experiments and optical thin-film
simulations repeatedly carried out, the present inventor has found that
there exist the optimum optical constants (refractive index and
extinction coefficient) and film thickness condition of the metal
absorption layer which make a spectral reflectance uniform and make the
spectral reflectance low in a visible wavelength range (400 to 780 nm),
as described above.

[0122] (1-3) A graph diagram of FIG. 2 illustrates a relationship between
a wavelength (nm) and a refractive index (n) for each of metal absorption
layers subjected to oxygen reactive sputter deposition under deposition
conditions A to E to be described later with use of a Ni-based alloy
(Ni--W) target, and a graph diagram of FIG. 3 illustrates a relationship
between a wavelength (nm) and an extinction coefficient (k) for each of
the metal absorption layers deposited under the deposition conditions A
to E described above.

[0124] The graph diagrams of FIG. 2 and FIG. 3 show a drastic change in
the optical constants (refractive index and extinction coefficient)
depending on the degree of oxidation of the Ni-based alloy (Ni--W). The
oxidation state is lowest for deposition condition A (oxygen
concentration of 0%), and the oxidation state tends to be high toward the
deposition condition E (oxygen concentration of 33%).

[0125] Hence, it is difficult to identify a metal absorption layer to be
formed by the deposition material (metal material such as the Ni-based
alloy) and the deposition condition (added amount of reactive gas such as
oxygen or nitrogen gas). It is desirable to specify the metal absorption
layer based on the optical constants thereof.

[0126] (1-4) Next, graph diagrams of FIG. 4 to FIG. 8 illustrate a
spectral reflectance property attributed to reflection at an interface
between a resin film (PET: polyethylene terephthalate film) and the metal
absorption layer and an interface between the metal absorption layer and
the metal layer (copper) for each of laminate films which are fabricated
by depositing, for example, copper (metal layer) with a film thickness of
80 nm on the metal absorption layer formed on the PET film under the
deposition conditions A to E. Note that the film thickness of the metal
absorption layer is changed at intervals of 5 nm within a range from 0 nm
(without the metal absorption layer) to 30 nm.

[0127] From the graph diagram of FIG. 4, it can be said that, regarding
the spectral reflectance property, an average reflectance is high under
the deposition condition A (oxygen concentration of 0%) with the lowest
oxidation state of the metal absorption layer, and a rate of change in
reflectance decreases with an increasing film thickness. On the other
hand, from the graph diagram of FIG. 8, it can be said that, regarding
the spectral reflectance property, although the average reflectance is
low under the deposition condition E (oxygen concentration of 33%) with
the highest oxidation state of the metal absorption layer, a flatness of
the spectral reflectance property (difference between the highest
reflectance and the lowest reflectance) is large.

[0128] (1-5) In view of the above, when choosing, from the graph diagrams
of FIG. 4 to FIG. 8, a metal absorption layer which satisfies the
condition that the average reflectance in a visible wavelength range (400
to 780 nm) is 20% or less and the flatness of the spectral reflectance
property (difference between the highest reflectance and the lowest
reflectance) is 10% or less (i.e., a metal absorption layer which
satisfies the condition that the spectral reflectance is low and the
spectral reflectance in the visible wavelength range is uniform), a metal
absorption layer is selected which is deposited under the deposition
condition C (oxygen concentration of 23%) or the deposition condition D
(oxygen concentration of 28%), and the film thickness thereof ranges from
20 nm to 30 nm inclusive.

[0129] Thereafter, when determining, from the graph diagrams of FIG. 2 and
FIG. 3, the optical constants (refractive index and extinction
coefficient) in the visible wavelength range (400 to 780 nm) of the metal
absorption layer deposited under each of the deposition condition C
(oxygen concentration of 23%) and the deposition condition D (oxygen
concentration of 28%), the results follow that

[0130] the refractive index is 2.0 to 2.2 and the extinction coefficient
is 1.8 to 2.1 at a wavelength of 400 nm,

[0131] the refractive index is 2.4 to 2.7 and the extinction coefficient
is 1.9 to 2.3 at a wavelength of 500 nm,

[0132] the refractive index is 2.8 to 3.2 and the extinction coefficient
is 1.9 to 2.5 at a wavelength of 600 nm,

[0133] the refractive index is 3.2 to 3.6 and the extinction coefficient
is 1.7 to 2.5 at a wavelength of 700 nm, and

[0134] the refractive index is 3.5 to 3.8 and the extinction coefficient
is 1.5 to 2.4 at a wavelength of 780 nm.

[0135] (1-6) Then, in a case where the film thickness of the metal
absorption layer deposited on the PET film ranges from 20 nm to 30 nm
inclusive, and the optical constants (refractive index and extinction
coefficient) in the visible wavelength range (400 to 780 nm) of the metal
absorption layer described above satisfies the above-mentioned
conditions, i.e.,

[0136] the refractive index is 2.0 to 2.2 and the extinction coefficient
is 1.8 to 2.1 at a wavelength of 400 nm,

[0137] the refractive index is 2.4 to 2.7 and the extinction coefficient
is 1.9 to 2.3 at a wavelength of 500 nm,

[0138] the refractive index is 2.8 to 3.2 and the extinction coefficient
is 1.9 to 2.5 at a wavelength of 600 nm,

[0139] the refractive index is 3.2 to 3.6 and the extinction coefficient
is 1.7 to 2.5 at a wavelength of 700 nm, and

[0140] the refractive index is 3.5 to 3.8 and the extinction coefficient
is 1.5 to 2.4 at a wavelength of 780 nm,

the metal absorption layer satisfies the condition that the average
reflectance in the visible wavelength range (400 to 780 nm) attributed to
reflection at an interface between the PET film and the metal absorption
layer and an interface between the metal absorption layer and the metal
layer (copper, for example) is 20% or less, and the flatness of the
spectral reflectance property (difference between the highest reflectance
and the lowest reflectance) is 10% or less. Thus, reflection on the metal
layer observed on the resin film (PET film) side is reduced.

[0141] Here, the material for the metal absorption layer which possesses
the property that the spectral reflectance becomes low and the spectral
reflectance in the visible wavelength range becomes uniform when the
metal absorption layer has a film thickness of 20 nm to 30 nm inclusive
and satisfies the above-described conditions for the optical constants
(refractive index and extinction coefficient) is not limited to the
Ni-based alloy (Ni--W) mentioned above. For example, it has been
demonstrated that the above property can also be achieved by a metal
absorption layer formed of Ni alone or a Ni-based alloy containing at
least one element selected from Ti, Al, V, Ta, Si, Cr, Ag, Mo, and Cu,
and Cu alone or a Cu-based alloy containing at least one element selected
from Ti, Al, V, W, Ta, Si, Cr, Ag, Mo, and Ni.

[0142] (2) Laminate Film and Electrode Substrate Film According to Present
Invention

[0143] (2-1) Laminate Film according to Present Invention

[0144] As illustrated in FIG. 1(A), the laminate film according to the
present invention including a transparent substrate 42 formed of a resin
film and a layered film provided on the transparent substrate 42 is
characterized in that

[0145] the layered film includes a metal absorption layer 41 with a film
thickness of 20 nm to 30 nm inclusive as a first layer, and a metal layer
40 as a second layer, counted from the transparent substrate 42 side,

[0146] the optical constants of the metal absorption layer 41 in the
visible wavelength range (400 to 780 nm) satisfy the conditions that

[0147] the refractive index is 2.0 to 2.2 and the extinction coefficient
is 1.8 to 2.1 at a wavelength of 400 nm,

[0148] the refractive index is 2.4 to 2.7 and the extinction coefficient
is 1.9 to 2.3 at a wavelength of 500 nm,

[0149] the refractive index is 2.8 to 3.2 and the extinction coefficient
is 1.9 to 2.5 at a wavelength of 600 nm,

[0150] the refractive index is 3.2 to 3.6 and the extinction coefficient
is 1.7 to 2.5 at a wavelength of 700 nm,

[0151] and the refractive index is 3.5 to 3.8 and the extinction
coefficient is 1.5 to 2.4 at a wavelength of 780 nm, and

[0152] as illustrated in FIG. 1(B), the average reflectance in the visible
wavelength range (400 to 780 nm) attributed to reflection at the
interface between the transparent substrate 42 and the metal absorption
layer 41 and the interface between the metal absorption layer 41 and the
metal layer 40 is 20% or less, and the difference between a maximum
transmittance and a minimum transmittance in the visible wavelength range
(400 to 780 nm) is 10% or less.

[0153] In addition, the laminate film described above is characterized in
that

[0154] the layered film includes a second metal absorption layer with a
film thickness of 20 nm to 30 nm inclusive as a third layer, counted from
the transparent substrate 42 side, and

[0155] the optical constants of the second metal absorption layer in the
visible wavelength range (400 to 780 nm) satisfy the conditions that

[0156] the refractive index is 2.0 to 2.2 and the extinction coefficient
is 1.8 to 2.1 at a wavelength of 400 nm,

[0157] the refractive index is 2.4 to 2.7 and the extinction coefficient
is 1.9 to 2.3 at a wavelength of 500 nm,

[0158] the refractive index is 2.8 to 3.2 and the extinction coefficient
is 1.9 to 2.5 at a wavelength of 600 nm,

[0159] the refractive index is 3.2 to 3.6 and the extinction coefficient
is 1.7 to 2.5 at a wavelength of 700 nm, and

[0160] the refractive index is 3.5 to 3.8 and the extinction coefficient
is 1.5 to 2.4 at a wavelength of 780 nm.

[0161] (2-2) Electrode Substrate Film According to Present Invention

[0162] As illustrated in FIG. 1(C), the electrode substrate film according
to the present invention including a transparent substrate 52 formed of a
resin film and a mesh circuit pattern provided on the transparent
substrate 52 and formed of a metal laminate thin line is characterized in
that

[0163] the metal laminate thin line has a line width of 20 .mu.m or less
and includes a metal absorption layer 51 with a film thickness of 20 nm
to 30 nm inclusive as a first layer, and a metal layer 50 as a second
layer, counted from the transparent substrate 52 side,

[0164] the optical constants of the metal absorption layer 51 in the
visible wavelength range (400 to 780 nm) satisfy the conditions that

[0165] the refractive index is 2.0 to 2.2 and the extinction coefficient
is 1.8 to 2.1 at a wavelength of 400 nm,

[0166] the refractive index is 2.4 to 2.7 and the extinction coefficient
is 1.9 to 2.3 at a wavelength of 500 nm,

[0167] the refractive index is 2.8 to 3.2 and the extinction coefficient
is 1.9 to 2.5 at a wavelength of 600 nm,

[0168] the refractive index is 3.2 to 3.6 and the extinction coefficient
is 1.7 to 2.5 at a wavelength of 700 nm, and

[0169] the refractive index is 3.5 to 3.8 and the extinction coefficient
is 1.5 to 2.4 at a wavelength of 780 nm, and

[0170] the average reflectance in the visible wavelength range (400 to 780
nm) attributed to reflection at the interface between the transparent
substrate 52 and the metal absorption layer 51 and the interface between
the metal absorption layer 51 and the metal layer 50 is 20% or less, and
the difference between the maximum transmittance and the minimum
transmittance in the visible wavelength range (400 to 780 nm) is 10% or
less.

[0171] In addition, the electrode substrate film is characterized in that

[0172] the metal laminate thin line includes a second metal absorption
layer with a film thickness of 20 nm to 30 nm inclusive as a third layer,
counted from the transparent substrate 52 side, and

[0173] the optical constants of the second metal absorption layer in the
visible wavelength range (400 to 780 nm) satisfy the conditions that

[0174] the refractive index is 2.0 to 2.2 and the extinction coefficient
is 1.8 to 2.1 at a wavelength of 400 nm,

[0175] the refractive index is 2.4 to 2.7 and the extinction coefficient
is 1.9 to 2.3 at a wavelength of 500 nm,

[0176] the refractive index is 2.8 to 3.2 and the extinction coefficient
is 1.9 to 2.5 at a wavelength of 600 nm,

[0177] the refractive index is 3.2 to 3.6 and the extinction coefficient
is 1.7 to 2.5 at a wavelength of 700 nm, and

[0178] the refractive index is 3.5 to 3.8 and the extinction coefficient
is 1.5 to 2.4 at a wavelength of 780 nm.

[0179] (3) Constituent Materials for Laminate Film and Electrode Substrate
Film According to Present Invention

[0180] (3-1) Resin Film Constituting Transparent Substrate

[0181] The material for the resin film applied to the laminate film and
the electrode substrate film according to the present invention is not
particularly limited, and its specific examples include a resin film
alone selected from polyethylene terephthalate (PET), polyethersulfone
(PES), polyarylates (PAR), polycarbonate (PC), polyolefins (PO),
triacetyl cellulose (TAC), and a resin material of norbornene, or a
composite material of a resin film alone selected from the
above-mentioned resin materials and an acrylic organic film covering one
or both of the surfaces of this resin film alone. In particular, typical
examples of the norbornene resin material include Zeonoa (trade name)
manufactured by Zeon Corporation, ARTON (trade name) manufactured by JSR
Corporation, and the like.

[0182] Note that since the electrode substrate film according to the
present invention is used for "touch panels" and the like, it desirably
has excellent transparency in the visible wavelength range, among the
resin films described above.

[0183] (3-2) Metal Absorption Layer

[0184] As described earlier, the film material for the metal absorption
layer according to the present invention is preferably Ni alone or a
Ni-based alloy containing at least one element selected from Ti, Al, V,
W, Ta, Si, Cr, Ag, Mo, and Cu, and Cu alone or a Cu-based alloy
containing at least one element selected from Ti, Al, V, W, Ta, Si, Cr,
Ag, Mo, and Ni.

[0185] Besides, the metal absorption layer has a deposition material of Ni
alone or the Ni-based alloy, or Cu alone or the Cu-based alloy described
above, and is formed by the vacuum deposition method in which reactive
gas is introduced into the deposition apparatus. The vacuum deposition
method mentioned above includes magnetron sputtering, ion-beam
sputtering, vacuum vapor deposition, ion plating, and CVD. In addition,
the above-described reactive gas includes oxygen or nitrogen gas alone, a
gas mixture of these, or a gas mixture containing argon or the like with
oxygen and nitrogen as the main components.

[0186] What is more, the optical constants (refractive index and
extinction coefficient) of the metal absorption layer at various
wavelengths are greatly affected by the degree of reaction, i.e. the
oxidation state or the degree of nitration, and are not determined only
by the constituent material of the metal absorption layer.

[0187] (3-3) Metal Layer

[0188] The constituent material for the metal layer according to the
present invention is not particularly limited as long as the material is
a metal with a low electrical resistance value, and its examples include
Cu alone or a Cu-based alloy containing at least one element selected
from Ti, Al, V, W, Ta, Si, Cr, and Ag, or Ag alone or a Ag-based alloy
containing at least one element selected from Ti, Al, V, W, Ta, Si, Cr,
and Cu. Cu alone is particularly desirable in terms of the formability
and resistance value of the circuit pattern.

[0189] In addition, although the film thickness of the metal layer depends
on its electrical characteristics and is not determined by optical
factors, it is usually set to a film thickness at a level where
transmitted light cannot be measured.

[0190] Moreover, a desirable film thickness of the metal layer is
preferably 50 nm or more, and more preferably 60 nm or more in terms of
electrical resistance. On the other hand, the film thickness is
preferably 5 .mu.m (5000 nm) or less, and more preferably 3 .mu.m (3000
nm) or less in terms of formability of forming the metal layer into a
wiring pattern.

[0193] The sputtering method is taken as an example of the vacuum
deposition method, and its deposition apparatus is described.

[0194] Here, this deposition apparatus is referred to as a sputtering web
coater and is used in a case where a surface of a long resin film being
conveyed in a roll-to-roll manner is subjected to a deposition treatment
continuously and efficiently.

[0195] To be more specific, the deposition apparatus (sputtering web
coater) for the long resin film conveyed in a roll-to-roll manner is
provided inside a vacuum chamber 10 as illustrated in FIG. 9. The
structure is such that the long resin film 12 unwound from an unwind roll
11 is subjected to a prescribed deposition treatment, and is thereafter
wound by a wind roll 24. A can roll 16 rotationally driven by a motor is
disposed in the middle of a conveyance path from the unwind roll 11 to
the wind roll 24. Circulating inside this can roll 16 is a coolant the
temperature of which has been adjusted outside the vacuum chamber 10.

[0196] Inside the vacuum chamber 10, for sputter deposition, pressure is
reduced to an ultimate pressure of approximately 10.sup.-4 Pa and is
thereafter adjusted to approximately 0.1 to 10 Pa by introducing
sputtering gas. The sputtering gas used is a known gas such as argon and
is further containing a gas such as oxygen or nitrogen depending on the
purpose. The shape and the material for the vacuum chamber 10 are not
particularly limited and various options can be adopted as long as it can
withstand such a reduced pressure state. In addition, the vacuum chamber
10 has various apparatuses (not illustrated) integrated thereto such as a
dry pump, turbomolecular pump, and cryocoil for reducing the pressure
inside vacuum chamber 10 and maintaining the reduced pressure state.

[0197] A free roll 13 which guides the long resin film 12 and a tension
sensor roll 14 which measures a tension of the long resin film 12 are
disposed in this order on the conveyance path from the unwind roll 11 to
the can roll 16. Meanwhile, the long resin film 12 forwarded from the
tension sensor roll 14 toward the can roll 16 is adjusted relative to a
peripheral speed of the can roll 16 by an upstream feed roll 15 which is
driven by a motor and is provided near the can roll 16. This makes it
possible to bring the long resin film 12 into close contact with an outer
peripheral surface of the can roll 16.

[0198] In the same manner as described above, a downstream feed roll 21
which is driven by a motor and performs adjustment relative to the
peripheral speed of the can roll 16, a tension sensor roll 22 which
measures the tension of the long resin film 12, and a free roll 23 which
guides the long resin film 12 are disposed in this order also on the
conveyance path from the can roll 16 to the wind roll 24.

[0199] At the unwind roll 11 and the wind roll 24 described above, the
tension balance of the long resin film 12 is maintained through torque
control by a powder clutch or the like. Additionally, the long resin film
12 is unwound from the unwind roll 11 and wound by the wind roll 24
through the rotation of the can roll 16, and the upstream feed roll 15
and the downstream feed roll 21 which are driven by motors and rotate in
synchronization with the can roll 16.

[0200] Provided near the can roll 16 are magnetron sputtering cathodes 17,
18, 19, and 20 as a means of deposition at positions facing the
conveyance path (i.e., a region of the outer peripheral surface of the
can roll 16 around which the long resin film 12 is wound) defined on the
outer peripheral surface of the can roll 16. Reactive gas discharge pipes
25, 26, 27, 28, 29, 30, 31, and 32 which discharge reactive gas are
installed in this vicinity.

[0201] When sputter deposition is to be carried out for the
above-described metal absorption layer and the metal layer, a
plate-shaped target can be used as illustrated in FIG. 9. In the case
where a plate-shaped target is used, however, a nodule (growth of an
unwanted matter) may be produced on the target. In a case where this
gives rise to a problem, it is preferable to use a cylindrical rotary
target, with which nodules are not produced and the usage efficiency of
the target is high.

[0202] (4-2) Reactive Sputtering

[0203] In a case where an oxide target or a nitride target is used for the
purpose of forming the metal absorption layer described above, they are
not suitable for mass production because the deposition rate is slow. For
this reason, a metal target is employed which enables fast deposition and
a method is adopted in which the above-described reactive gas is
controlled when being introduced during the deposition.

[0204] Below are four known methods of controlling the reactive gas
mentioned above:

[0205] (4-2-1) a method of discharging reactive gas at a constant flow
rate.

[0206] (4-2-2) a method of discharging reactive gas so as to maintain a
constant pressure.

[0207] (4-2-3) a method of discharging reactive gas such that the
impedances of the sputtering cathodes are constant (impedance control).

[0208] (4-2-4) a method of discharging reactive gas such that the
sputtering plasma intensity is constant (plasma emission control).

[0209] (5) Method of Manufacturing Electrode Substrate Film

[0210] (5-1) It is possible to obtain the electrode substrate film
according to the present invention by etching the layered film of the
laminate film according to the present invention and forming the layered
film into a metal laminate thin line with a line width of 20 .mu.m or
less. Then, an electrode (wiring) pattern of the electrode substrate film
is formed into a stripe shape or a grid shape for a touch panel. Thereby,
the electrode substrate film according to the present invention can be
used for a touch panel.

[0211] Moreover, since the metal laminate thin line formed into the
electrode (wiring) pattern maintains a laminate structure of the laminate
film according to the present invention, the average reflectance in the
visible wavelength range (400 to 780 nm) attributed to reflection at an
interface between the transparent substrate and the metal absorption
layer and an interface between the metal absorption layer and the metal
layer is a low value of 20% or less, and the difference between the
maximum transmittance and the minimum transmittance in the visible
wavelength range is a uniform value of 10% or less. As a result, it is
possible to provide an electrode substrate film in which the circuit
pattern of electrodes and the like provided on the transparent substrate
is very less visible even under highly bright illumination.

[0212] (5-2) Furthermore, for forming the laminate film according to the
present invention into an electrode substrate film, a known subtractive
method can be used.

[0213] The subtractive method is a method of creating a wiring pattern by
forming a photoresist film on the surface of the layered film of the
laminate film, performing exposure and development so that the
photoresist film remains at an area where the wiring pattern is wished to
be created, and removing, by chemical etching, the layered film at an
area without the photoresist film on the surface of the layered film
described above.

[0214] A hydrogen peroxide-based etching liquid and an aqueous solution of
ceric ammonium nitrate can be used as an etching liquid for the chemical
etching mentioned above. Furthermore, an aqueous solution of ferric
chloride, an aqueous solution of copper(II) chloride, a hydrochloric acid
acidified aqueous solution of permanganate salt, and an acetic acid
acidified aqueous solution of permanganate salt can also be used. Note
that it may be necessary to adjust the concentrations of the aqueous
solution of ferric chloride, the aqueous solution of copper(II) chloride,
the hydrochloric acid acidified aqueous solution of permanganate salt,
and the acetic acid acidified aqueous solution of permanganate salt
described above, depending on the metal absorption layer to be
chemical-etched.

Example

[0215] Hereinbelow, an example of the present invention is described in
detail.

[0216] Note that an ellipsometer was used in the measurement of optical
characteristics (refractive index and extinction coefficient) of the
metal absorption layer, and a self-recording spectrophotometer was used
in the measurement of the spectral reflectance property.

Example 1

[0217] The deposition apparatus (sputtering web coater) illustrated in
FIG. 9 was used and oxygen gas was employed as the reactive gas. The
amount of reactive gas was controlled through the impedance control
described above.

[0218] Note that the can roll 16 is made of stainless steel with a
diameter of 600 mm and a width of 750 mm, and a surface of the roll is
plated with hard chrome. Each of the upstream feed roll 15 and the
downstream feed roll 21 is made of stainless steel with a diameter of 150
mm and a width of 750 mm, and a surface of each roll is plated with hard
chrome. Besides, the reactive gas discharge pipes 25, 26, 27, 28, 29, 30,
31, and 32 are installed on the upstream side and the downstream side of
the cathodes 17, 18, 19, and 20. Moreover, a Ni--W target for the metal
absorption layer was attached to the cathode 17, and a Cu target for the
metal layer to the cathodes 18, 19, and 20.

[0219] In addition, a PET film with a width of 600 mm was used for the
resin film constituting the transparent substrate, and the temperature of
the can roll 16 was controlled and cooled to be at 0.degree. C. What is
more, the pressure inside the vacuum chamber 10 was reduced to 5 Pa by
exhausting the gas therein through multiple dry pumps, and was further
reduced to 3.times.10.sup.-3 Pa using multiple turbomolecular pumps and
cryocoils.

[0220] (1) Manufacture of Laminate Film for Manufacturing Electrode
Substrate Film

[0221] Thereafter, the conveyance speed of the resin film was set to 4
m/min. After that, 300 sccm of argon gas (sputtering gas) was introduced
through the reactive gas discharge pipes 25 and 26 described above, and
the power for the cathode 17 was controlled such that metal absorption
layers (oxide films of Ni--W) with film thicknesses of 0 nm, 5 nm, 10 nm,
15 nm, 20 nm, 25 nm, and 30 nm would be deposited. Here, the reactive gas
(oxygen gas) was introduced as a gas mixture to the reactive gas
discharge pipes 25 and 26.

[0222] The above-mentioned oxygen gas was used as the reactive gas, and
the oxygen gas was controlled to a prescribed concentration using a piezo
valve. The concentration conditions for the oxygen gas to be introduced
were the deposition condition A (oxygen concentration of 0%), the
deposition condition B (oxygen concentration of 11%), the deposition
condition C (oxygen concentration of 23%), the deposition condition D
(oxygen concentration of 28%), and the deposition condition E (oxygen
concentration of 33%).

[0223] Note that since the deposition rate is expected to decrease
depending on the amount of oxygen gas introduced, it is necessary to
adjust sputtering power in order to obtain the intended film thicknesses
of the metal absorption layer.

[0224] On the other hand, 300 sccm of argon gas (sputtering gas) was
introduced through the reactive gas discharge pipes 27, 28, 29, 30, 31
and 32 described above, and the power for the cathodes 18, 19, and 20 was
controlled such that a metal layer (Cu layer) with a film thickness of 80
nm would be formed. The laminate films of multiple kinds according to the
example were manufactured by depositing the metal layer (Cu layer) with a
film thickness of 80 nm on each of the metal absorption layers with film
thicknesses of 0 nm, 5 nm, 10 nm, 15 nm, 20 nm, 25 nm, and 30 nm, which
were deposited under the deposition condition A (oxygen concentration of
0%) to the deposition condition E (oxygen concentration of 33%).

[0225] (2) Manufacture of Electrode Substrate Film

[0226] Next, the electrode substrate films according to the example were
manufactured by the known subtractive method using the obtained laminate
films of multiple kinds.

[0227] To be more specific, the electrode substrate films according to the
example were manufactured by forming a photoresist film on the surface of
the layered film of the laminate film described above (layered film
formed of the metal absorption layer and the metal layer), performing
exposure and development so that the photoresist film would remain at an
area where a wiring pattern was wished to be created, and removing, by
chemical etching, the layered film at an area without the photoresist
film on the surface of the above-described layered film.

[0228] The circuit pattern of electrodes and the like was a stripe one
with a wiring width of 5 .mu.m and an interval of 300 .mu.m.

[0229] Incidentally, an aqueous solution of ceric ammonium nitrate was
used as the etching liquid for the chemical etching in this example.
Besides, in the chemical etching, the laminate film with the photoresist
film after the development was immersed in the etching liquid.

Confirmation

[0230] (1) Spectral reflectances of the laminate films of multiple kinds
according to the example in the visible wavelength range (400 to 780 nm)
attributed to reflection at an interface between the PET film and the
metal absorption layer and an interface between the metal absorption
layer and the metal layer were measured from the PET film side using a
self-recording spectrophotometer, the laminate films being obtained by
depositing metal absorption layers on the PET films so that their film
thicknesses were 0 nm, 5 nm, 10 nm, 15 nm, 20 nm, 25 nm, and 30 nm under
the deposition conditions A to E described above, and thereafter
depositing the metal layers (Cu layers) with a film thickness 80 nm.

[0231] The results are shown in the graph diagrams of FIG. 4 to FIG. 8.

[0232] (2) On the other hand, the optical constants (refractive index and
extinction coefficient) of the laminate films of 5 kinds according to the
example in the visible wavelength range (400 to 780 nm) under the
deposition conditions A to E were measured from the PET film side using
an ellipsometer, the laminate films being obtained by depositing the
metal absorption layers with a film thickness of 20 nm under the
deposition conditions A to E, and thereafter depositing the metal layers
(Cu layers) with a film thickness of 80 nm on these metal absorption
layers.

[0233] The results are shown in the graph diagrams of FIG. 2 to FIG. 3.

[0234] Note that since the optical constants are constants independent of
the film thickness, the optical constant were measured for the laminate
films of 5 kinds in which the metal absorption layers with a film
thickness of 20 nm are deposited, as described above.

[0235] (3) When choosing, from the graph diagrams of FIG. 4 to FIG. 8, the
laminate films according to the example which satisfy the condition that
the average reflectance in the visible wavelength range (400 to 780 nm)
is 20% or less and the flatness of the spectral reflectance property
(difference between the highest reflectance and the lowest reflectance)
is 10% or less (i.e., the laminate films which satisfy the condition that
the spectral reflectance is low and the spectral reflectance in the
visible wavelength range is uniform), the laminate films are selected
which include metal absorption layers deposited under the deposition
condition C (oxygen concentration of 23%) and the deposition condition D
(oxygen concentration of 28%), and the film thicknesses thereof range
from 20 nm to 30 nm inclusive.

[0236] (4) Thereafter, when determining, from the graph diagrams of FIG. 2
and FIG. 3, the optical constants (refractive index and extinction
coefficient) in the visible wavelength range (400 to 780 nm) of the
laminate film deposited under each of the deposition condition C (oxygen
concentration of 23%) and the deposition condition D (oxygen
concentration of 28%), the following results were confirmed:

[0237] the refractive index is 2.0 to 2.2 and the extinction coefficient
is 1.8 to 2.1 at a wavelength of 400 nm,

[0238] the refractive index is 2.4 to 2.7 and the extinction coefficient
is 1.9 to 2.3 at a wavelength of 500 nm,

[0239] the refractive index is 2.8 to 3.2 and the extinction coefficient
is 1.9 to 2.5 at a wavelength of 600 nm,

[0240] the refractive index is 3.2 to 3.6 and the extinction coefficient
is 1.7 to 2.5 at a wavelength of 700 nm, and

[0241] the refractive index is 3.5 to 3.8 and the extinction coefficient
is 1.5 to 2.4 at a wavelength of 780 nm.

[0242] (5) Moreover, the aqueous solution of ceric ammonium nitrate
described above was utilized as the etching liquid to examine an "etching
quality" of the laminate films of multiple kinds. The metal absorption
layer with a film thickness of 20 nm was etched and thereafter the
periphery of the wiring pattern was checked for the "etching quality"
with an optical microscope.

[0243] Etching was successfully performed for the metal absorption layers
formed under the deposition condition A (oxygen concentration of 0%), the
deposition condition B (oxygen concentration of 11%), the deposition
condition C (oxygen concentration of 23%), and the deposition condition D
(oxygen concentration of 28%) without etching residues on the periphery
of the wiring pattern. However, the metal absorption layer formed under
the deposition condition E (oxygen concentration of 33%) was not suitable
for practical use because there were etching residues on the periphery of
the wiring pattern.

[0244] Furthermore, visual check was carried out from the metal absorption
layer side for the conductive substrate films including the metal
absorption layers with a film thickness of 20 nm formed under the
deposition conditions A, B, C, and D described above. In the checking, a
conductive substrate film was placed such that a surface on the opposite
side from where the conductive substrate film was visually checked was in
contact with a liquid crystal display panel.

[0245] The circuit pattern of electrodes and the like was visible in the
conductive substrate film with the metal absorption layer formed under
the deposition condition A described above. On the other hand, the
circuit pattern of electrodes and the like was less visible in the
conductive substrate films with the metal absorption layers formed under
the deposition conditions B, C, and D described above.

[0246] The circuit pattern of electrodes and the like was much less
visible in the conductive substrate films with the metal absorption
layers having a film thickness of 20 nm formed under the deposition
conditions C and D described above compared to the conductive substrate
film with the metal absorption layer having a film thickness of 20 nm
formed under the deposition condition B described above.

[0247] It was confirmed that a conductive substrate film can be obtained
in which the circuit pattern of electrodes and the like is hardly visible
in an ideal case where the metal absorption layer is formed under the
deposition condition C or the deposition condition D, and the its film
thickness is set to 20 nm or more.

[0248] (6) Note that while the metal absorption layers according to the
example are formed using the Ni--W target, they are not limited to the
film material of the target as long as the optical constants are within
the ranges described above, even in a case where a different Ni alloy or
Cu alloy target is used.

POSSIBILITY OF INDUSTRIAL APPLICATION

[0249] An electrode substrate film according to the present invention is
industrially applicable to a "touch panel" installed on a surface of an
FPD (flat panel display) because a circuit pattern of electrodes and the
like provided on a transparent substrate is less visible even under
highly bright illumination.