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Utilizing
current packaging integrated heat spreader (IHS) assembly technology several
challenges have been encountered when building large packages with an off
center die and large 38.5-mm heat spreader (see Figure 1). The substrate with
the die attached is bowed with the substrate edged deflected below the
die. The IHS is attached and the
substrate bow turns into a “W”, causing the die - to bow upward at the
center. The heat spreader has a slight
defection due to the substrate warpage.
The substrate has a tendency to flatten out post bake. This causes the die to flatten and the
TIM BLT to increase requiring the polymeric TIM to elongate. Typically the
greatest BLT changes post reliability are observed in the corners or center.
The increased warpage has led to increased post reliability corner thermal
degradation.

The
stress is greater for large and/or off center die due to increased substrate
deflection. The increased warpage has increased shear stress concentration at
the sealant to substrate and sealant to IHS interface leading to an increase in
sealant delamination and decreased yield.

Products
designed with two or more die that are not centered can undergo greater stress
than measured on single die flip-chip products. Constraining the heat spreader
and substrate and minimizing the strain improves reliability. By attaching the heat spreader closer
to the substrate the warpage is reduced, as well as the stress at the TIM
interface.