The XM1L is a Computer-On-Module of the ESMexpress®
family in accordance with a proposed ANSI standard
currently under development (ANSI-VITA 59, RSE
Rugged System-On-Module Express). Together with an
application-specific carrier board it forms a semicustom
solution for industrial, harsh, mobile and
mission-critical environments.

The XM1L is controlled by the Intel® Atom™ XL
processor, an IA-32 core based on 45nm process
technology which is qualified for the industrial
temperature range. Due to the power architecture of
the Intel® Atom™ CPU, the XM1L has a total power
consumption of max. 5 to 7 Watts, while having a
clock frequency of up to 1.6 GHz. The XM1L accommodates up to 2 GB of directly soldered main memory and supports other memory like USB Flash on the carrier board.

Interfaces from the Intel® System Controller Hub
US15WP are optimized using exclusively modern serial
standards and are all routed from the XM1L for
availability on any ESMexpress® carrier board.
Depending on the version of XM1L, those interfaces
include a combination of PCI Express® links, LVDS,
SDVO, high-definition audio, SATA, Ethernet with wakeon-
LAN functionality, and USB. Additional COM
interfaces can be made available on the carrier board
via USB to COM conversion.

The XM1L is completed by a board management
controller for temperature and power supervision. It
comes with a Phoenix® Award BIOS configurable for
the final application.

The XM1L is screened or qualified for operation in a
-40°C to +85°C conduction or convection cooled
environment. As all ESMexpress® modules it is
embedded in a covered frame. This ensures EMC
protection and allows efficient conductive cooling.

Air cooling is also possible by applying a heat sink
on top of the cover. Where operation temperatures are
moderate, the module may even do without the frame
and cover, with a suitable low-power processor and
airflow. ESMexpress® modules are firmly screwed to a
carrier board and come with rugged industry-proven
connectors supporting high frequency and
differential signals. Only soldered components are
used to withstand shock and vibration, and the
design is optimized for conformal coating. All
ESMexpress® modules support a single 95x125mm form
factor.

For evaluation and development purposes an ATX carrier
board is available. The ESMexpress® module can be
evaluated on a COM Express™ carrier board via an
adapter from ESMexpress® to COM Express™.