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Disclosed is a method for a multi-mode/multi-slot PCI/PCI-X
hot-plug at 800-mils pitch. Benefits include improved functionality and
improved support for future technology.

Background

� � � � � Conventionally, a
PCI/PCI-X hot-plug design with multi-node/multi-slots bus has been achieved
with a PCI/PCI-X connector center-to-center spacing of >= 960 mils (0.96
inch). In server platforms not supporting a PCI/PCI-X hot-plug, connector center-to-center
spacing is typically 800 mils. Achieving the same spacing is not possible if
hot-plug is supported on multiple slots on a PCI/PCI-X bus. Hot-plug support
requires bus isolation circuitry (transmission gates), power isolation
circuitry, plus a hot-plug controller. Additionally, a large portion of the
circuitry must be placed between the PCI/PCI-X connectors. The spacing between
the connector must be increased to >=960 mils to accommodate the required
circuitry.

� � � � � Conventionally,
platforms supporting hot-plug use 20-bit bus-switches for bus isolation logic
that are bigger in size and cannot be accommodated with 800-mils
center-to-center spacing between connectors. (A 20-bit bus switch is an example
of a bus isolation component with 20 transmission gates, which are typically
used for hot-plug.) Ten-bit bus switches are smaller in physical size. Ten-bit
bus switches required for bus isolation logic can be accommodated within the
800-mils center-to-center spacing between connectors. The overall silicon surface
area required (in sq...