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A series of fine-grained porous alumina samples, with and without a liquid phase, were fabricated in compositions matched closely to commercially available alumina used as a microelectronic substrates. Hertzian indentation on monolithic specimens of the glass-containing samples produced a greater quasi-ductile stress-strain response compared to that observed in the pure alumina. Maximum residual indentation depths, determined from surface profilometry, correlated with the stress-strain results. Moreover, microstructural observations from bonded interface specimens revealed significantly more damage in the form of microcracking and under extreme loading, pore collapse, in the glass-containing specimens. The absence of the typical twin faulting mechanism observed for ...
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Description

A series of fine-grained porous alumina samples, with and without a liquid phase, were fabricated in compositions matched closely to commercially available alumina used as a microelectronic substrates. Hertzian indentation on monolithic specimens of the glass-containing samples produced a greater quasi-ductile stress-strain response compared to that observed in the pure alumina. Maximum residual indentation depths, determined from surface profilometry, correlated with the stress-strain results. Moreover, microstructural observations from bonded interface specimens revealed significantly more damage in the form of microcracking and under extreme loading, pore collapse, in the glass-containing specimens. The absence of the typical twin faulting mechanism observed for larger-grained alumina suggests that the damage mechanism for quasi-ductility in these fine-grained porous alumina derived from the pores acting as a stress concentrator and the grain boundary glass phase providing a weak path for short crack propagation.

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