ELECTRONIC DEVICE HOUSING AND METHOD OF MANUFACTURING THE SAME - An electronic device housing includes a bottom layer, a adhesion layer and a protection layer. The adhesion layer is located on the bottom layer. The protection layer is located on the adhesion layer. The electronic device housing has excellent appearance and high durability. The present disclosure also provides a method of manufacturing the electronic device housing.

09-27-2012

20120244321

METHOD FOR MANUFACTURING A PRODUCT SHELL AND STRUCTURE - The disclosure provides a method for manufacturing a product shell. A diaphanous mold with a recess and a coating layer located inside the recess are provided. A substrate is disposed inside the recess. The coating layer is located between the recess and the substrate. The coating layer is cured to combine with the substrate by a curing device through the diaphanous mold. The substrate is then removed from the diaphanous mold to form the product shell.

09-27-2012

20120244385

METAL HOUSING AND SURFACE TREATING METHOD THEREOF - A surface treating method of a metal housing includes the following steps. First, a workpiece is provided. The workpiece includes a surface formed by a metal material. Thereafter, the workpiece is pre-treated to clean the surface of the metal material. Next, a titanium diffusion treating is performed on the workpiece to form a titanium-containing diffusion layer on the surface of the metal material.

09-27-2012

20120251828

SHELL AND MANUFACTURING METHOD - A method for manufacturing a shell includes the following steps. A diaphanous mold having a cavity is provided. A plastic layer is disposed on a surface of the cavity of the diaphanous mold. A glue layer is disposed on the plastic layer. A substrate is disposed on and contacting the glue layer. The glue layer is solidified such that the substrate is adhered on the plastic layer by the solidified glue layer. The shell which comprises the substrate, the glue layer, and the plastic layer is separated from the diaphanous mold.

10-04-2012

20120275130

ELECTRONIC DEVICE HOUSING AND METHOD OF MANUFACTURING THEREOF - An electronic device housing and a method of forming the housing are disclosed. The electronic device housing, comprises a bottom layer defining a though hole; an adhesion layer on the bottom layer defining a through hole; and a protection layer on the adhesion layer defining a through hole, wherein the adhesion layer is cured by ultraviolet (UV) rays, the adhesion layer is adapted to tightly combine the bottom layer and the protection layer.