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Thermo-sensitive copper/paraffin nanocomposites were prepared by high energy ball milling. Fourier transform infrared spectrometer (FTIR), x-ray diffraction (XRD) and transmission electron microscopy (TEM) were used to analyze the composition, phase and microstructure of the composites. Furthermore, their thermal sensitivity was investigated. Results reveal that the phase of composites is mainly composed of copper, paraffin and a small amount of cuprous oxide copper. Nanoparticles homogeneously covered by paraffin form the similar core-shell structure. The mass ratio of copper to paraffin has an obvious influence on the thermal sensitivity.

Abstract: The Al-7%Si /9% Al63Cu25Fe12 composites were fabricated by mechanical stirring method. The composite took Al-7%Si as matrix, Al63Cu25Fe12 icosahedral quasicrystal as reinforced particles. The microstructure and chemical composition of composites were investigated by means of SEM and energy dispersive spectrum (EDS) analysis and the mechanical properties was also measured. The results showed that Al63Cu25Fe12 particles were fractured and passivated after added into the Al-7%Si matrix, and distributed homogeneously along the crystal boundaries.The quasicrystal was not decomposed. Mechanical properties of the as-castand alloy were improved obviously.

Abstract: SiCp/Al composites were fabricated by ceramic mold freedom infiltration and pressureless infiltration, respectively. The microstructure and phases are analyzed by metallurgical microscope and coefficient of thermal expansion of SiCp/Al composites were tested by thermal dilatometer. The results show that SiCp/Al composites are compact and uniform. SiC particles were dispersed uniformly in Al matrix, and SiCp segregation was not found in composites. Under a certain SiCp size range, space between SiCp decreases with decreasing of SiCp size, and CTE of SiCp/Al composites also decreases with decreasing of particles size. Compared with CTE of composite with pure aluminum as matrix, CTE of composite with ZL101 as matrix is less. Under the annealing process, CTE of SiCp/Al composites with ZL101 as matrix is less than that with the solution and aging, which indicated that its dimensional stability of resisting to temperature fluctuation is better, and thermal expansion behavior and characteristic of SiCp/Al composites are also better.

Abstract: ZrO2-ZrW2O8 diphasic composites with controllable coefficients of thermal expansion (CTEs) are synthesized by rapid in-situ reactive sintering with ZrO2 and WO3 as reactants. High density of ZrO2-ZrW2O8 composites without decomposition of ZrW2O8 is obtained with Y2O3 sintering additive. The CTEs of specimen with ZrO2 to ZrW2O8 mass ratio 1:1.0, 1:1.3, 1:1.5 and 1:2.0 are measured to be about 1.20×10−6, 0.31×10−6, -0.78×10−6 and -1.13×10−6 K−1, respectively. Raman mappings demonstrate homogenous dispersions of ZrO2 and ZrW2O8 in the ZrO2-ZrW2O8 composites. In addition to the role as sintering additive, some Y3+ cations enter the lattice to substitute Zr4+ in ZrW2O8, leading to an increase in disorder and a decrease in phase transition temperature of ZrW2O8 in the composites.

Abstract: In the present study, the glass microsphere dispersed Bi-Sb thermoelectric materials have been fabricated through mechanical alloying followed by pressureless sintering. The phase composition and the microstructure were investigated by X-ray diffraction (XRD) and scanning electron microscopy (SEM) analysis. Electrical conductivity, Seebeck coefficient and thermal conductivity were measured in the temperature range of 77~300 K. The ZT values were calculated according to the measurement results. The results showed that the electrical conductivity, Seebeck coefficient and thermal conductivity decreased by adding glass microsphere into Bi-Sb thermoelectric materials. However, the optimum ZT value of 0.24 was obtained at 260 K, which was increased 10% than that of the Bi-Sb matrix. So it is confirmed that the thermoelectric performance of Bi-Sb-based materials can be improved by adding moderate glass microspheres.