Encapsulants

Potting Compound 6805

Potting Compound 3450

Encapsulants face a unique combination of challenges once in-service. Thermal cycling can cause mechanical stress via high rates of expansion and contraction. In high temperature environments, an encapsulant’s mass can trap heat leading to premature thermal degradation. Our range of encapsulants deliver the ‘toughness’ to withstand thermal cycling, and where needed, the measure of thermal conductivity to allow for proper heat flow.

Beyond the effects of temperature, high voltage applications place a demand for high dielectric performance. Caustic and explosive environments can require strong chemical resistance, while process and dispensing constraints may necessitate a certain viscosity, from very thick materials that resist ‘sag’ to pourable options that flow easily, in order to fill voids around objects of varying shapes and orientations. We address all of these challenges and more when reviewing your material needs.