The bonding interface between the specific semiconductor absorber and the CMOS readout is made with the modified EVG®580 ComBond® system. The system was modified by G-ray to obtain a low-energy Argon plasma chamber that enables to clean the wafer surface at the atomic scale, without damaging the crystalline structure, before the bonding process takes place. Additional modifications of the system are explored to optimize both the bonding strength and the electrical charge collection across the bonded interface and reduce costs while improving quality.

Manufacturing Equipment

About us

G-Ray Industries SA was created in December 2015, as a spin-off company of G-ray Switzerland SA. The company has validated core competences in monolithic CMOS integrated pixel array detector technology, applicable to a wide range of industrial fields including Aerospace, Automotive and High-Energy Physics. Collaborative agreements are in place between G-ray Switzerland SA and G-ray Industries SA about G-ray’s IP and unique technological knowhow.