the semiconductor chip terminal section is pressed and bonded to the package carrier terminal section

la sec.ion de borne de puce semi-conductrice est pressée et liée à la sec.ion de borne de support de boîtier

brevets / patents
- wipo.int

and a conductive porous material intervenes between a first electrode layer that is the negative-electrode side of aforementioned supporting section of aforementioned macromolecule actuator, and the terminal section.