A major Korean memory manufacturer and a Korea-based IC packaging
foundry have placed orders for a total of six Raider systems that will
be used for electroplating, metal etch and photoresist stripping as
well as advanced bumping, Cu Pillar, UBM Etch and resist strip
applications. Specialty chip interconnect metals used in 3D-TSV
(through silicon via) applications are further uses for the tools,
Semitool said.

"Wafer-level packaging, specifically associated with advanced copper
devices and memory applications, is one of the fastest growing segments
in semiconductor industry today," said Dan Schmauch, Director of
Semitool's Advanced Packaging Division. "These bookings represent
follow-on orders and add to our base of more than 85 Asia Pacific
Raider tools installed over the last four years. WLP Raider tools alone
account for more than 50 tools in the Asia Pacific region."