Hot Bar Bonding

Hot Bar Bonding is a general expression for a variety of process technologies such as Hot Bar Reflow Soldering, Heat Staking, ACF Laminating/pre-Bonding and Heat-Seal/ACF Final bonding. The Hot Bar Bonding process is done using a 'thermode' or "Hot Bar" which, through a closed-loop controlled process is heated and cooled creating an electrical interconnection between the materials. The electrical resistance and design of the thermode produces the energy necessary to heat the joining area and to create the inter-connection. As the electricity flows through the thermode, the heat generated is conducted directly into the product.

Hot Bar Bonding Techniques:

Hot Bar Reflow Solderingis a selective soldering process where two pre-soldered parts are heated to a temperature that causes the solder to flow and re-solidify forming a permanent bond between the parts

ACF Laminating/pre-Bondingis a Hot bar Bonding technique for attaching PCB's to displays using a conductive adhesive and flex foils using a electrical-conductive-adhesive material. The ACF Laminating/pre-Bonding process is the first step to apply the adhesive material to the part(s)

Heat-Sealing/Final bonding is a Hot bar Bonding technique for final bonding attaching PCB's to displays using a conductive adhesive and flex foils using a electrical-conductive-adhesive material.

Heat Staking is an assembly process where two materials with at least one plastic part are moulded together through a temperature controlled process. This type of application can be processed with a piece protruding from one part that fits into the hole of the second part. The piece is then deformed by applying heat and force through the thermode forming a head which locks the two pieces together. Visit our specific page on Heat Staking to find more detailed information on the process.

Hot Bar Bonding Applications
Hot Bar Bonding Techniques are reproducible, quantifable, and traceable to quality standards such as ISO / NIST. Typical applications are connecting flex-foils to printed circuit boards (PCB) or LCD glass-panels, wires, coax cables and many other materials such a very light or small components.