High Density Interconnect (HDI)

High Density Interconnect (HDI) flexible circuits offer increased design, layout and construction options over typical flexible circuits. Each High Density Interconnect incorporates microvias and fine features to achieve highly dense flex circuitry, smaller form factor and increased functionality. This technology offers better electrical performance, access to advanced integrated circuit (IC) package use and improved reliability through the use of microvias and thinner materials.

Minco’s state-of-the-art facility and equipment can provide you with unmatched HDI features and performance, and our IPC-certified designers can assist you with improving reliability and help make your designs easier to build—without sacrificing performance.

Benefits of HDI

Lower cost and smaller size

Use advanced component packaging

More design options and flexibility

Improved electrical performance and signal integrity

Improved thermal performance and reliability

Features and Performance

Description

Capability

Minimum drilled via finished diameter

.008"

Minimum laser via formed diameter

.003"

Minimum line and spacing

.003"/.003"

Minimum copper thickness

9 micron

Maximum copper thickness

<1 oz

Minimum pad size for thru-hole vias

Via diameter +.015”

Minimum pad size for micro vias

Via diameter +.006”

Panel size

18” by 24”

Thru hole plating aspect ratio

4:1

Blind micro via minimum plating aspect ratio

1:1

Panel plating

Yes

Selective plating
(pads only or button plating)

Yes

Number of layers

2-6

Via fill

Copper filled

Reliable Quality and Consistency

HDI Flex circuits have been demonstrated to withstand in excess of 500HATS cycles ( -65C to 125C).