Call for Papers

IEEE EMBS Biomedical and Health Informatics 2017 CFP

The IEEE International Conference on Biomedical and Health Informatics (BHI) is the flagship conference of IEEE Engineering in Medicine and Biology Society (IEEE-EMBS) on the specific topic of informatics and computing in healthcare and life sciences. BHI-2017 will be held in Orlando, Florida, USA, Feb. 16-19, 2017 and is co-located with the annual HIMSS Conference & Exhibition in Orlando. The main theme of the BHI-2017 is the “Informatics for smart, precision and preventive medicine.” Advancing health informatics has been identified as a grand challenge for engineering in the 21st century by the National Academy of Engineering. Managing and improving human health and curing complex diseases will require novel and creative informatics methods and solutions to accelerate scientific discovery, translate discoveries into successful treatments, re-engineer care practices and infrastructure for precision and preventive medicine, and harvest big data to improve care, save lives and lower costs.

The BHI-2017 will provide a unique forum to showcase enabling technologies of computing, databases, devices, imaging, sensors, and systems that optimize the acquisition, transmission, processing, monitoring, storage, retrieval, analysis, visualization and interaction of vast volumes and different modalities of biomedical data and related social, behavior, environmental, and geographical information. In addition, it will share how BHI informatics solutions can be used in novel applications to improve human health, and how the deployment of bioinformatics, digital imaging, artificial intelligence, Internet of Things (IoT), m-Health, e-Health, and telemedicine can enable precision and preventive medicine in the era of digital health.

Networking is one of the most interesting facets of the IEEE BHI 2017 conference and we have dedicated part of the program to social events and special topics workshops, which are going to provide the BHI-2017 participants opportunities to make personal contacts and cultivate collaborations. We are looking forward to seeing you in Orlando!

Full paper for BHI 2017 is 4 pages including references. Submitted manuscripts should use the IEEE template.