"The BVA platform provides smartphone and tablet makers with a roadmap
to much higher bandwidth and lower power consumption, enabling high
definition mobile gaming, multi-channel video, and a host of new
data-rich applications on next generation mobile devices," said Simon
McElrea, president of Invensas Corporation. "With greater than 1,000
interconnects, twice that of the current competition, in a tiny 14x14mm
package-on-package form factor, BVA is by far the mobile industry's
highest bandwidth solution."

Invensas will display the technology in Booth #114 at the 2013 ECTC in
the Cosmopolitan Hotel, Las Vegas, NV, on May 28 - 31, 2013. In
addition, Invensas will present a white paper "Package-on-Package with
Very Fine Pitch Interconnects for High Bandwidth" on Thursday May 30,
2013 at 4:45pm PT. More details on BVA and additional Invensas mobility
solutions can be found at www.invensas.com.

Safe Harbor Statement

This press release contains forward-looking statements, which are made
pursuant to the safe harbor provisions of the Private Securities
Litigation Reform Act of 1995. Forward-looking statements involve risks
and uncertainties that could cause actual results to differ
significantly from those projected, particularly with respect to the
features, performance, characteristics and benefits of Invensas products
and technology, the participation by Invensas at the IEEE Electronic
Components & Technology Conference, the subject matter of the
presentations by Invensas at that event, the characteristics, benefits,
and features of BVA and the business relationships and collaborations
between Invensas and third parties. Material factors that may cause
results to differ from the statements made include the plans or
operations relating to the businesses of Tessera Technologies, Inc. (the
"Company"); market or industry conditions; changes in patent laws,
regulation or enforcement, or other factors that might affect the
Company's ability to protect or realize the value of its intellectual
property; the expiration of license agreements and the cessation of
related royalty income; the failure, inability or refusal of licensees
to pay royalties; initiation, delays, setbacks or losses relating to the
Company's intellectual property or intellectual property litigations, or
invalidation or limitation of key patents; the timing and results, which
are not predictable and may vary in any individual proceeding, of any
ICC ruling or award, including in the Amkor arbitration; fluctuations in
operating results due to the timing of new license agreements and
royalties, or due to legal costs; the risk of a decline in demand for
semiconductor and camera module products; failure by the industry to use
technologies covered by the Company's patents; the expiration of the
Company's patents; the Company's ability to successfully complete and
integrate acquisitions of businesses; the risk of loss of, or decreases
in production orders from, customers of acquired businesses; financial
and regulatory risks associated with the international nature of the
Company's businesses; failure of the Company's products to achieve
technological feasibility or profitability; failure to successfully
commercialize the Company's products; changes in demand for the products
of the Company's customers; limited opportunities to license
technologies and sell products due to high concentration in the markets
for semiconductors and related products and camera modules; the impact
of competing technologies on the demand for the Company's technologies
and products; and the reliance on a limited number of suppliers for the
components used in the manufacture of DOC products. You are cautioned
not to place undue reliance on the forward-looking statements, which
speak only as of the date of this release. The Company's filings with
the Securities and Exchange Commission, including its Annual Report on
Form 10-K for the year ended Dec. 31, 2012, and its Quarterly Report on
Form 10-Q for the quarter ended March 31, 2013, include more information
about factors that could affect the Company's financial results. The
Company assumes no obligation to update information contained in this
press release. Although this release may remain available on the
Company's website or elsewhere, its continued availability does not
indicate that the Company is reaffirming or confirming any of the
information contained herein.

About Invensas Corporation

Invensas Corporation, a wholly owned subsidiary of Tessera Technologies,
Inc. ,
is a global leader in semiconductor interconnect solutions and
intellectual property. Invensas innovates in areas such as mobile
computing and communications, memory and data storage, and 3-D
Integrated Circuit (3DIC) technologies. Headquartered in San Jose,
California, Invensas licenses these solutions to Original Equipment
Makers, Original Design Manufacturers, and Integrated Device
Manufactures and delivers the products to market through collaborative
engineering partnerships and strategic business alliances. Learn more at www.interconnectology.com
or www.invensas.com,
or contact Invensas
PR at +1 408 324 5105.

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