Wafer Management

Reclaim

Process Flow

Pure Wafer is the largest reclaim service company in the United States, offering the highest quality reclaim
in the industry. Wafer reclaiming helps semiconductor manufacturers reduce their materials cost by maximizing
the full life potential of their wafers.

The reclaim process starts with a refined wafer inspection, presorting wafers by type, thickness and resistivity.
Each wafer is then lapped and/or etched to remove patterns, scratches and other surface defects, resulting in
is a clean, high-quality wafer ready for polishing. Once a wafer is finished polishing, it gets a final cleaning.
At the conclusion of the reclaim process, to verify that the finished wafers fully comply with customer standards
and specifications, we perform a final quality inspection prior to packaging.

Finished wafers are transferred into cassettes that are free of contaminants, the cassettes are then double-bagged
and labeled. As a final step, we provide a Certificate of Conformance and/or Certificate of Analysis, as required,
to verify product quality. To assist customers in tracking the life cycle of their wafers, we also offer a laser
marking service.