IWLPC 2013 - International Wafer-Level Packaging Conference

Overview

Overview:

SMTA and Chip Scale Review are pleased to announce the 10th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.

Exhibitors:

Why Exhibit at IWLPC? * Reach a focused international audience * Generate Exposure in this highly competitive marketplace * Share New Products and concepts to the market * Enhance Relationships with existing customers and generate new leads

About SMTA:

The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

About the Chip Scale Review:

The International Magazine for Device and Wafer-Level Test, Assembly, and Packaging Addressing High-density Interconnection of Microelectronic IC's including 3D packages, MEMS, MOEMS, RF/Wireless, Optoelectronic and Other Wafer-fabricated Devices for the 21st Century.

Notes:

Sponsorship Details:

Command the Attention of the IC Packaging Community!
Become a sponsor of the International Wafer-Level Packaging Conference
Our broad range of sponsorship opportunities are a great way to maximize your company's exposure at the IWLPC and in the advanced packaging industry.
Email your completed form to: Kim Newman at Chip Scale Review knewman@chipscalereview.com or fax to 408-429-8605
Questions? Contact Kim Newman at 408-429-8585