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Abstract:

There are provided an optical semiconductor sealing curable composition
that provides a cured material having excellent transparency, and an
optical semiconductor apparatus having an optical semiconductor device
sealed using the cured material obtained by curing the optical
semiconductor sealing curable composition. There is provided an optical
semiconductor sealing curable composition containing: (A) a linear
polyfluoro compound; (B) cyclic organosiloxane having an SiH group and a
fluorine-containing organic group; (C) a platinum group metal catalyst;
(D) cyclic organosiloxane having an SiH group, fluorine-containing
organic group, and an epoxy group; and (E) cyclic organosiloxane having
an SiH group, a fluorine-containing organic group, and a cyclic
carboxylic acid anhydride residue.

Claims:

1. An optical semiconductor sealing curable composition, wherein the
optical semiconductor sealing curable composition contains: (A) 100 parts
by mass of a linear polyfluoro compound represented by the following
general formula (1),
CH.sub.2.dbd.CH--(X)a--Rf1--(X')a--CH═CH2 (1)
wherein X represents a group represented by any one of --CH2--,
--CH2O--, --CH2OCH2--, and --Y--NR1--CO-- (Y
represents --CH2-- or an o, m, or p-dimethylsilylphenylene group
represented by the following structural formula (2), ##STR00044## and
R1 represents a hydrogen atom or an unsubstituted or substituted
monovalent hydrocarbon group), X' represents a group represented by any
one of --CH2--, --OCH2--, --CH2OCH2--, and
--CO--NR1--Y'-- (Y' represents --CH2-- or an o, m, or
p-dimethylsilylphenylene group represented by the following structural
formula (3), and R1 represents the same group as above, and
##STR00045## a represents independently 0 or 1, Rf1 represents a
divalent perfluoropolyether group represented by the following general
formula (4) or (5), ##STR00046## wherein each of p and q represents an
integer of 1 to 150, and an average of sums of p and q is 2 to 300,
further, r represents an integer of 0 to 6, and t represents 2 or 3,
##STR00047## wherein u represents an integer of 1 to 300, s represents
an integer of 1 to 80, and t represents the same as above; (B) cyclic
organopolysiloxane which is represented by the following general formula
(6) and has a hydrogen atom directly bonded to a silicon atom and a
monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group
bonded to the silicon atom through a divalent hydrocarbon group which is
allowed to contain an oxygen atom or a nitrogen atom per molecule, and
whose amount allows the hydrogen atom directly bonded to the silicon atom
to be 0.5 to 2.0 mole with respect to 1 mole of the alkenyl group in the
component (A), ##STR00048## wherein a represents an integer of 3 to 6,
b represents an integer of 1 to 4, a+b represents an integer of 4 to 10,
R2 represents a substituted or unsubstituted monovalent hydrocarbon
group, and A represents a monovalent perfluoroalkyl group or a monovalent
perfluorooxyalkyl group bonded to a silicon atom through a divalent
hydrocarbon group that is allowed to contain an oxygen atom or a nitrogen
atom; (C) 0.1 to 500 ppm of a platinum group metal catalyst when
converted into a platinum group metal atom; (D) 0.1 to 10.0 parts by mass
of cyclic organopolysiloxane which is represented by the following
general formula (7) and has a hydrogen atom directly bonded to a silicon
atom, a monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl
group bonded to a silicon atom through a divalent hydrocarbon group that
is allowed to contain an oxygen atom or a nitrogen atom, and an epoxy
group bonded to a silicon atom through a divalent hydrocarbon group that
is allowed to contain an oxygen atom per molecule, ##STR00049## wherein
i represents an integer of 1 to 6, j represents an integer of 1 to 4, k
represents an integer of 1 to 4, i+j+k represents an integer of 4 to 10,
R3 represents a substituted or unsubstituted monovalent hydrocarbon
group, L represents a monovalent perfluoroalkyl group or a monovalent
perfluorooxyalkyl group bonded to a silicon atom through a divalent
hydrocarbon group that is allowed to contain an oxygen atom or a nitrogen
atom, and M represents an epoxy atom bonded to a silicon atom through a
divalent hydrocarbon group that is allowed to contain an oxygen atom; and
(E) 0.01 to 5.0 parts by mass of cyclic organopolysiloxane which is
represented by the following general formula (8) and has a hydrogen atom
directly bonded to a silicon atom, a monovalent perfluoroalkyl group or a
monovalent perfluorooxyalkyl group bonded to a silicon atom through a
divalent hydrocarbon group that is allowed to contain an oxygen atom or a
nitrogen atom, and a cyclic carboxylic acid anhydride residue bonded to a
silicon atom through a divalent hydrocarbon group per molecule,
##STR00050## wherein x represents an integer of 1 to 6, y represents an
integer of 1 to 4, z represents an integer of 1 to 4, x+y+z represents an
integer of 4 to 10, R4 represents a substituted or unsubstituted
monovalent hydrocarbon group, Q represents a monovalent perfluoroalkyl
group or a monovalent perfluorooxyalkyl group bonded to a silicon atom
through a divalent hydrocarbon group that is allowed to contain an oxygen
atom or a nitrogen atom, and T is a cyclic carboxylic acid anhydride
residue bonded to a silicon atom through a divalent hydrocarbon group.

2. The optical semiconductor sealing curable composition according to
claim 1, wherein a transmittance for linear light having a wavelength of
450 nm in a cured material having a thickness of 2 mm after curing is not
lower than 80%.

3. The optical semiconductor sealing curable composition according to
claim 1, wherein a refractive index of the cured material after curing at
25.degree. C. and 589 nm (a D line of sodium) is 1.30 to 1.39.

4. The optical semiconductor sealing curable composition according to
claim 2, wherein a refractive index of the cured material after curing at
25.degree. C. and 589 nm (a D line of sodium) is 1.30 to 1.39.

5. The optical semiconductor sealing curable composition according to
claim 1, wherein content of the alkenyl group in the linear polyfluoro
compound in the component (A) is 0.005 to 0.100 mole/100 g.

6. The optical semiconductor sealing curable composition according to
claim 2, wherein content of the alkenyl group in the linear polyfluoro
compound in the component (A) is 0.005 to 0.100 mole/100 g.

7. The optical semiconductor sealing curable composition according to
claim 3, wherein content of the alkenyl group in the linear polyfluoro
compound in the component (A) is 0.005 to 0.100 mole/100 g.

8. The optical semiconductor sealing curable composition according to
claim 4, wherein content of the alkenyl group in the linear polyfluoro
compound in the component (A) is 0.005 to 0.100 mole/100 g.

9. The optical semiconductor sealing curable composition according to
claim 1, wherein the monovalent perfluoroalkyl group or the monovalent
perfluorooxyalkyl group included in each cyclic organopolysiloxane in the
component (B), the component (D), and the component (E) is represented by
the following general formula (9) or general formula (10),
CfF2f+1-- (9) wherein f represents an integer of 1 to 10,
##STR00051## wherein g represents an integer of 1 to 10.

10. The optical semiconductor sealing curable composition according to
claim 2, wherein the monovalent perfluoroalkyl group or the monovalent
perfluorooxyalkyl group included in each cyclic organopolysiloxane in the
component (B), the component (B), and the component (E) is represented by
the following general formula (9) or general formula (10),
CfF2f+1-- (9) wherein f represents an integer of 1 to 10,
##STR00052## wherein g represents an integer of 1 to 10.

11. The optical semiconductor sealing curable composition according to
claim 3, wherein the monovalent perfluoroalkyl group or the monovalent
perfluorooxyalkyl group included in each cyclic organopolysiloxane in the
component (B), the component (D), and the component (E) is represented by
the following general formula (9) or general formula (10),
CfF2f+1-- (9) wherein f represents an integer of 1 to 10,
##STR00053## wherein g represents an integer of 1 to 10.

12. The optical semiconductor sealing curable composition according to
claim 4, wherein the monovalent perfluoroalkyl group or the monovalent
perfluorooxyalkyl group included in each cyclic organopolysiloxane in the
component (B), the component (D), and the component (B) is represented by
the following general formula (9) or general formula (10),
CfF2f+1-- (9) wherein f represents an integer of 1 to 10,
##STR00054## wherein g represents an integer of 1 to 10.

13. The optical semiconductor sealing curable composition according to
claim 5, wherein the monovalent perfluoroalkyl group or the monovalent
perfluorooxyalkyl group included in each cyclic organopolysiloxane in the
component (B), the component (D), and the component (E) is represented by
the following general formula (9) or general formula (10),
CfF2f+1-- (9) wherein f represents an integer of 1 to 10,
##STR00055## wherein g represents an integer of 1 to 10.

14. The optical semiconductor sealing curable composition according to
claim 6, wherein the monovalent perfluoroalkyl group or the monovalent
perfluorooxyalkyl group included in each cyclic organopolysiloxane in the
component (B), the component (D), and the component (E) is represented by
the following general formula (9) or general formula (10),
CfF2f+1-- (9) wherein f represents an integer of 1 to 10,
##STR00056## wherein g represents an integer of 1 to 10.

15. The optical semiconductor sealing curable composition according to
claim 7, wherein the monovalent perfluoroalkyl group or the monovalent
perfluorooxyalkyl group included in each cyclic organopolysiloxane in the
component (B), the component (D), and the component (E) is represented by
the following general formula (9) or general formula (10),
CfF2f+1-- (9) wherein f represents an integer of 1 to 10,
##STR00057## wherein g represents an integer of 1 to 10.

16. The optical semiconductor sealing curable composition according to
claim 8, wherein the monovalent perfluoroalkyl group or the monovalent
perfluorooxyalkyl group included in each cyclic organopolysiloxane in the
component (B), the component (D), and the component (E) is represented by
the following general formula (9) or general formula (10),
CfF2f+1-- (9) wherein f represents an integer of 1 to 10,
##STR00058## wherein g represents an integer of 1 to 10.

17. An optical semiconductor apparatus comprising: an optical
semiconductor device; and a cured material which is obtained by curing
the optical semiconductor sealing curable composition according to claim
1 configured to seal the optical semiconductor device.

18. An optical semiconductor apparatus comprising: an optical
semiconductor device; and a cured material which is obtained by curing
the optical semiconductor sealing curable composition according to claim
16 configured to seal the optical semiconductor device.

19. The optical semiconductor apparatus according to claim 17, wherein
the optical semiconductor device is a light-emitting diode.

20. The optical semiconductor apparatus according to claim 18, wherein
the optical semiconductor device is a light-emitting diode.

Description:

BACKGROUND OF THE INVENTION

[0001] 1. Field of the Invention

[0002] The present invention relates to an optical semiconductor sealing
curable composition and an optical semiconductor apparatus using this.

[0003] 2. Description of the Related Art

[0004] There has been suggested obtaining an excellent cured material
having well-balanced properties such as heat resistance, chemical
resistance, solvent resistance, mold releasability, water-repellent
properties, oil-repellent properties, a low-temperature properties, and
others from a composition consisting of a linear fluoropolyether compound
which has at least two alkenyl groups per molecule and a
perfluoropolyether structure in a main chain, a fluorine-containing
organohydrogen siloxane having two or more hydrogen atoms directly bonded
to a silicon atom per molecule, and a platinum group compound (Japanese
Patent No. 2990646).

[0005] Further, there has been suggested a composition which has
self-adhesiveness with respect to a metal or a plastic base material by
adding organopolysiloxane having a hydrosilyl group, an epoxy group,
and/or a trialkoxysilyl group to the above-described composition
(Japanese Patent No. 3239717).

[0006] Furthermore, there has been suggested a composition having improved
adhesiveness with respect to various base materials, especially, a
polyphenylene sulphide resin (PPS), a polyamide resin, and a polyimide
resin by adding organosiloxane having a cyclic carboxylic acid anhydride
residue to the above-described composition (Japanese Patent No. 3562578).

[0007] However, when a cured material obtained by curing each of such
compositions actually prepared according to these conventional
technologies is used as a sealing medium of a light-emitting diode (which
will be referred to as an "LED" hereinafter unless if not otherwise
specified), there occurs a problem that this cured material becomes
turbid and transparency is degraded. When the transparency of the sealing
medium is degraded, efficiency of enabling taking light emitted from the
LED to the outside (which will be referred to as "light taking-out
efficiency" hereinafter) is lowered, whereby brightness of an optical
semiconductor apparatus using the LED as a light source is also
decreased.

SUMMARY OF THE INVENTION

[0008] In view of the above-described problems, it is an object of the
present invention to provide an optical semiconductor sealing curable
composition which provides a cured material having excellent transparency
and an optical semiconductor apparatus having an optical semiconductor
device sealed by a cured material obtained by curing the optical
semiconductor sealing curable composition.

[0009] To achieve this aim, according to the present invention, there is
provided an optical semiconductor sealing curable composition,

[0011] (A) 100 parts by mass of a linear polyfluoro compound represented
by the following general formula (1),

CH2═CH--(X)a--Rf1--(X')a--CH═CH2 (1)

wherein X represents a group represented by any one of --CH2--,
--CH2O--, --CH2OCH2--, and --Y--NR1--CO-- (Y
represents --CH2-- or an o, m, or p-dimethylsilylphenylene group
represented by the following structural formula (2),

##STR00001##

and R1 represents a hydrogen atom or an unsubstituted or substituted
monovalent hydrocarbon group), X' represents a group represented by any
one of --CH2--, --OCH2--, --CH2OCH2--, and
--CO--NR1--Y'-- (Y' represents --CH2-- or an o, m, or
p-dimethylsilylphenylene group represented by the following structural
formula (3), and R1 represents the same group as above, and

##STR00002##

a represents independently 0 or 1, Rf1 represents a divalent
perfluoropolyether group represented by the following general formula (4)
or (5),

##STR00003##

wherein each of p and q represents an integer of 1 to 150, and an average
of sums of p and q is 2 to 300, further, r represents an integer of 0 to
6, and t represents 2 or 3,

##STR00004##

wherein u represents an integer of 1 to 300, s represents an integer of 1
to 80, and t represents the same as above;

[0012] (B) cyclic organopolysiloxane which is represented by the following
general formula (6) and has a hydrogen atom directly liked with a silicon
atom and a monovalent perfluoroalkyl group or a monovalent
perfluorooxyalkyl group bonded to the silicon atom through a divalent
hydrocarbon group which is allowed to contain an oxygen atom or a
nitrogen atom per molecule, and whose amount allows the hydrogen atom
directly bonded to the silicon atom to be 0.5 to 2.0 mole with respect to
1 mole of the alkenyl group in the component (A),

##STR00005##

wherein a represents an integer of 3 to 6, b represents an integer of 1
to 4, a+b represents an integer of 4 to 10, R2 represents a
substituted or unsubstituted monovalent hydrocarbon group, and A
represents a monovalent perfluoroalkyl group or a monovalent
perfluorooxyalkyl group bonded to a silicon atom through a divalent
hydrocarbon group that is allowed to contain an oxygen atom or a nitrogen
atom;

[0013] (C) 0.1 to 500 ppm of a platinum group metal catalyst when
converted into a platinum group metal atom;

[0014] (D) 0.1 to 10.0 parts by mass of cyclic organopolysiloxane which is
represented by the following general formula (7) and has a hydrogen atom
directly bonded to a silicon atom, a monovalent perfluoroalkyl group or a
monovalent perfluorooxyalkyl group bonded to a silicon atom through a
divalent hydrocarbon group that is allowed to contain an oxygen atom or a
nitrogen atom, and an epoxy group bonded to a silicon atom through a
divalent hydrocarbon group that is allowed to contain an oxygen atom per
molecule,

##STR00006##

wherein i represents an integer of 1 to 6, j represents an integer of 1
to 4, k represents an integer of 1 to 4, i+j+k represents an integer of 4
to 10, R3 represents a substituted or unsubstituted monovalent
hydrocarbon group, L represents a monovalent perfluoroalkyl group or a
monovalent perfluorooxyalkyl group bonded to a silicon atom through a
divalent hydrocarbon group that is allowed to contain an oxygen atom or a
nitrogen atom, and M represents an epoxy atom bonded to a silicon atom
through a divalent hydrocarbon group that is allowed to contain an oxygen
atom; and

[0015] (E) 0.01 to 5.0 parts by mass of cyclic organopolysiloxane which is
represented by the following general formula (8) and has a hydrogen atom
directly bonded to a silicon atom, a monovalent perfluoroalkyl group or a
monovalent perfluorooxyalkyl group bonded to a silicon atom through a
divalent hydrocarbon group that is allowed to contain an oxygen atom or a
nitrogen atom, and a cyclic carboxylic acid anhydride residue bonded to a
silicon atom through a divalent hydrocarbon group per molecule,

##STR00007##

wherein x represents an integer of 1 to 6, y represents an integer of 1
to 4, z represents an integer of 1 to 4, x+y+z represents an integer of 4
to 10, R4 represents a substituted or unsubstituted monovalent
hydrocarbon group, Q represents a monovalent perfluoroalkyl group or a
monovalent perfluorooxyalkyl group bonded to a silicon atom through a
divalent hydrocarbon group that is allowed to contain an oxygen atom or a
nitrogen atom, and T is a cyclic carboxylic acid anhydride residue bonded
to a silicon atom through a divalent hydrocarbon group.

[0016] Such an optical semiconductor sealing curable composition as
addition-cure type fluoroether based curable composition containing all
of the components (A) to (E) exercise the excellent adhesiveness with
respect to various base materials, especially polyphthalic amide (PPA)
and provides a cured material having the excellent transparency.
Therefore, the cured material of the optical semiconductor sealing
curable composition is suitable for a sealing medium for an optical
semiconductor device, especially a sealing medium used for protecting an
LED.

[0017] Further, in the optical semiconductor sealing curable composition,
a transmittance for linear light having a wavelength of 450 nm in a cured
material having a thickness of 2 mm after curing is preferably not lower
than 80%.

[0018] As described above, when the transmittance for the linear light
having the wavelength of 450 nm in the cured material having the
thickness of 2 mm after curing is not lower than 80%, the light
taking-out efficiency of the optical semiconductor apparatus having the
optical semiconductor device sealed by the cured material obtained by
curing the optical semiconductor sealing curable composition according to
the present invention is not decreased, which is preferable.

[0019] Furthermore, in the optical semiconductor sealing curable
composition, a refractive index of the cured material after curing at
25° C. and 589 nm (a D line of sodium) is preferably 1.30 to 1.39.

[0020] When the refractive index falls within this range, the light
taking-out efficiency of the optical semiconductor apparatus having the
optical semiconductor device sealed by the cured material obtained by
curing the composition according to the present invention is not
decreased by design of the optical semiconductor apparatus, which is
preferable.

[0021] Moreover, content of the alkenyl group in the linear polyfluoro
compound in the component (A) is preferably 0.005 to 0.100 mole/100 g.

[0022] As described above, when the content of the alkenyl group in the
component (A) is less than 0.005 mole/100 g, a degree of cross-linkage
becomes insufficient, and a curing defect may possibly occur, which is
not preferable. When the content of the alkenyl group exceeds 0.100
mole/100 g, mechanical characteristics of this cured material as a rubber
elastic body may be possibly degraded.

[0023] Additionally, the monovalent perfluoroalkyl group or the monovalent
perfluorooxyalkyl group included in each cyclic organopolysiloxane in the
component (B), the component (D), and the component (E) is preferably
represented by the following general formula (9) or general formula (10),

CfF2f+1-- (9)

wherein f represents an integer of 1 to 10,

##STR00008##

wherein g represents an integer of 1 to 10.

[0024] As described above, it is preferable for the monovalent
perfluoroalkyl group or the monovalent perfluorooxyalkyl group to be
represented by general formula (9) or general formula (10).

[0026] Since the optical semiconductor sealing curable composition
according to the present invention can provide the cured material having
the excellent transparency, the optical semiconductor apparatus having
the optical semiconductor device sealed by this cured material has the
excellent light taking-out efficiency (efficiency of enabling taking
light emitted from the optical semiconductor device to the outside).

[0028] As described above, the cured material of the optical semiconductor
sealing curable composition according to the present invention is
suitable as the sealing medium configured to protect a light-emitting
diode in particular.

[0029] According to the optical semiconductor sealing curable composition
of the present invention, combining the components (A) to (E) enables the
cured material to have the excellent transparency, whereby the optical
semiconductor apparatus having the sealed optical semiconductor device
has the excellent light taking-out efficiency (the efficiency of enabling
taking light emitted from the optical semiconductor device to the
outside). Moreover, since the optical semiconductor sealing curable
composition exercises the excellent adhesiveness with respect to various
base materials, especially a polyphthalate amide (PPA), it is suitable as
the sealing medium configured to protect an LED.

DESCRIPTION OF THE DRAWINGS

[0030] FIG. 1 is a schematic cross-sectional view showing an example of an
optical semiconductor apparatus according to the present invention; and

[0031] FIG. 2 is a schematic cross-sectional view showing another example
of the optical semiconductor apparatus according to the present
invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

[0032] The present invention will now be described hereinafter in more
detail.

[0033] As described above, there have been demanded an optical
semiconductor sealing curable composition which provides a cured material
having excellent transparency and has excellent adhesiveness with respect
to various base materials, especially PPA, and an optical semiconductor
apparatus having an optical semiconductor device sealed by the cured
material obtained by curing the composition.

[0034] To achieve the above-described object, the present inventors
devoted themselves to conduct examinations, and they thereby found out
that a composition containing all of the following components (A) to (E)
can turn to an optical semiconductor sealing curable composition which
provides a cured material having excellent transparency as an effect
obtained by combining the following components (A) to (E), and brought
the present invention to completion. The present invention will now be
described hereinafter in detail.

[Component (A)]

[0035] The component (A) according to the present invention is a linear
polyfluoro compound represented by the following general formula (1),

CH2═CH--(X)a--Rf1--(X')a--CH═CH2 (1)

wherein X represents a group represented by any one of --CH2--,
--CH2O--, --CH2OCH2--, and --Y--NR1--CO-- (Y
represents --CH2-- or an o, m, or p-dimethylsilylphenylene group
represented by the following structural formula (2),

##STR00009##

R1 represents a hydrogen atom or an unsubstituted or substituted
monovalent hydrocarbon group), X' represents a group represented by any
one of --CH2--, --OCH2--, CH2OCH2--, and
--CO--NR1--Y'-- (Y' represents --CH2-- or an o, m, or
p-dimethylsilylphenylene group represented by the following structural
formula (3), and R1 represents the same group as above, and

##STR00010##

a represents independently 0 or 1, Rf1 represents a divalent
perfluoropolyether group represented by the following general formula (4)
or (5),

##STR00011##

wherein each of p and q represents an integer of 1 to 150, and an average
of sums of p and q is 2 to 300, further, r represents an integer of 0 to
6, and t represents 2 or 3,

##STR00012##

wherein u represents an integer of 1 to 300, s represents an integer of 1
to 80, and t represents the same as above.

[0036] Here, when R1 is other than a hydrogen atom, a monovalent
hydrocarbon group having carbon atom numbers 1 to 12, especially 1 to 10
is preferable, and there are specifically an alkyl group such as a methyl
group, en ethyl group, a propyl group, a butyl group, a hexyl group, a
cyclohexyl group, or an octyl group; an aryl group such as a phenyl group
or a tolyl group; an aralkyl group such as a benzyl group or a
phenylethyl group, and a substituted monovalent hydrocarbon group
obtained by substituting some or all of hydrogen atoms in each of such
groups by a halogen atom of fluorine and the like.

[0037] Rf1 in general formula (1) represents a divalent
perfluoropolyether structure represented by the following general formula
(4) or (5),

##STR00013##

wherein each of p and q represents an integer of 1 to 150 or preferably
an integer of 1 to 100, and an average of sums of p and q represents 2 to
300, preferably 2 to 200, or more preferably 10 to 150. r represents an
integer of 0 to 6, and t is 2 or 3,

##STR00014##

wherein u represents an integer of 1 to 300, preferably an integer of 1
to 200, or more preferably an integer of 10 to 150, s represents an
integer of 1 to 80 or preferably an integer of 1 to 50, and t represents
the same as above.

[0038] As referred examples of the Rf1 group, there are ones
represented by the following formula (i) to (iii). More preferably, there
is a divalent group having a structure represented by formula (i),

##STR00015##

wherein each of p' and q' represents an integer of 1 to 150 or preferably
an integer of 1 to 100, and p'+q' (average) is 2 to 300, preferably 2 to
200, or more preferably 10 to 150,

##STR00016##

wherein u' represents an integer of 1 to 300, preferably an integer of 1
to 200, or more preferably an integer of 10 to 150, and s' represents an
integer of 1 to 80, preferably an integer of 1 to 50, or more preferably
an integer of 1 to 30.

[0039] As a preferred example of the component (A), there is a compound
represented by the following general formula (11),

##STR00017##

wherein X1 represents a group represented as --CH2--,
--CH2O--, --CH2OCH2--, or --Y--NR1'--CO-- (Y
represents --CH2-- or an o, m, or p-dimethylsilylphenylene group
represented by the following structural formula (2), and R1'
represents a hydrogen atom, a methyl group, a phenyl group, or an allyl
group,

##STR00018##

wherein X1' represents a group represented as --CH2--,
--OCH2--, --CH2OCH2--, or --CO--NR1'--Y''-- (Y'
represents --CH2-- or an o, m, or p-dimethylsilylphenylene group
represented by --CH2-- or the following structural formula (3), and
R1' represents the same as above,

##STR00019##

wherein a represents independently 0 or 1, d represents an integer of 2
to 6, each of b and c represents an integer of 0 to 200, preferably an
integer of 1 to 150, or more preferably an integer of 1 to 100, and b+c
(average) is 0 to 300, preferably 2 to 200, or more preferably 10 to 150.

[0040] Specific examples of the linear polyfluoro compound represented by
general formula (11) are as follows,

##STR00020##

wherein each of m1 and n1 represents an integer of 1 to 150 or preferably
an integer of 1 to 100, and m1+n1 represents an integer meeting 2 to 300
or preferably 6 to 200.

[0041] In addition, it is desirable for viscosity (23° C.) of the
linear polyfluoro compound represented by general formula (1) to fall
within the range of 100 to 100,000 mPas, preferably 500 to 50,000 mPas,
or more preferably 1,000 to 20,000 mPas in viscometric measurement
conforming to JIS K6249 since a cured material has appropriate physical
properties when this composition is used for sealing, potting, coating,
or immersion. The most appropriate viscosity can be selected within this
viscosity range depending on the intended use.

[0042] The content of the alkenyl group contained in the linear polyfluoro
compound represented by general formula (1) is preferably 0.005 to 0.100
mole/100 g or more preferably 0.008 to 0.050 mole/100 g. When the content
of the alkenyl group contained in the linear fluoropolyether compound is
not lower than 0.005 mole/100 g, a degree of cross-linkage is sufficient,
and there is no possibility that a curing defect occurs, which is
desirable. When the content of the alkenyl group is not greater than
0.100 mole/100 g, there is no possibility that the mechanical
characteristic of this cured material as a rubber elastic body are not
degraded, which is preferable.

[0043] One type of such a linear polyfluoro compound can be solely used,
or two or more types of the same can be combined and used.

[Component (B)]

[0044] The component (B) is cyclic organopolysiloxane which is represented
by the following Generation formula (6) and has a hydrogen atom directly
bonded to a silicon atom and a monovalent perfluoroalkyl group or a
monovalent perfluorooxyalkyl group bonded to a silicon atom through a
divalent hydrocarbon group which may contain an oxygen atom or a nitrogen
atom per molecule, and it functions as a cross-linker or a chain
lengthener of the component (A).

##STR00021##

[0045] In general formula (6), a represents an integer of 3 to 6 or
preferably an integer of 3 to 5, b represents an integer of 1 to 4 or
preferably an integer of 1 to 3, and a+b represents an integer of 4 to 10
or preferably an integer of 4 to 8.

[0046] Further, R2 represents a substituted or unsubstituted
monovalent hydrocarbon group, and there is the same group as the
substituted or unsubstituted monovalent hydrocarbon group of R1.

[0047] Furthermore, A represents a monovalent perfluoroalkyl group or a
monovalent perfluorooxyalkyl group coupled with a silicon atom through a
divalent hydrocarbon group which may contain an oxygen atom or a nitrogen
atom. These are groups which are introduced in terms of compatibility
with the component (A), dispersibility, homogeneity after curing, and
others.

[0048] As the monovalent perfluoroalkyl group or the monovalent
perfluorooxyalkyl group, there are groups represented, by the following
general formula (9) and (10),

CfF2f+1-- (9)

wherein f represents an integer of 1 to 10 or preferably 3 to 7,

##STR00022##

wherein g represents an integer of 1 to 10 or preferably integer of 2 to
8.

[0049] Moreover, the monovalent perfluoroalkyl group or the monovalent
perfluorooxyalkyl group is bonded to a silicon atom through a divalent
hydrocarbon group which may contain an oxygen atom or a nitrogen atom
and, as a divalent linking group, there are an alkylene group having a
carbon atom number of 2 to 12, the same group having, e.g., an
ether-linked oxygen atom, amide linkage, or carbonyl linkage, and others,
and there are the following groups.

[0051] As such a component (B), for example, there are the following
components. It is to be noted that, in the following formula, Me is a
methyl group, and Ph is a phenyl group.

##STR00023## ##STR00024##

[0052] One type of the component (B) alone may be used, or two or more
types of the component (B) may be used at the same time.

[0053] As a compounding amount of the component (B), an SiH group (a
hydrogen atom directly bonded to a silicon atom) in the component (B) is
0.5 to 2.0 mole or preferably 0.7 to 1.5 mole with respect to 1 mole of
the alkenyl group contained in the component (A). A degree of
cross-linkage becomes insufficient and hence a cured material may not be
obtained when the SiH group is less than 0.5 mole, and foam may be
possibly formed at the time of curing when the SiH group exceeds 2.0
mole.

[Component (C)]

[0054] A platinum group metal catalyst which is the component (C)
according to the present invention is a hydrosilylation reaction
catalyst. The hydrosilylation reaction catalyst is a catalyst that
facilitates an addition reaction of an alkenyl group contained in a
composition, especially an alkenyl group in the component (A) and an SiH
group contained in the composition, especially an SIR group in the
component (B). Since this hydrosilylation reaction catalyst is generally
a noble metal or its compound and expensive, platinum or a platinum
compound which is relatively easily available is often used.

[0055] As the platinum compounds, for example, there are a chloroplatinic
acid or a complex of a chloroplatinic acid and olefin such as ethylene, a
complex of an alcohol or vinylsiloxane, a metal platinum supported by
silica, alumina, or carbon, and others. As platinum group metal catalysts
other than platinum and its compounds, rhodium, ruthenium, iridium, and
palladium based compounds are known and, for example, there are
RhCl(PPh3)3, RhCl(CO)(PPh3)2, Ru3(CO)12,
IrCl(CO)(PPh3)2, Pd(PPh3)4, and others. It is to be
noted that Ph is a phenyl group in the above formula.

[0056] When using each of these catalysts, although the catalyst can be
used in the form of a solid if it is a solid catalyst, in order to obtain
a more homogeneous cured material, it is preferable to compatibilize a
material obtained by dissolving a chloroplatinic acid or a complex with
an appropriate solvent such as toluene or ethanol with respect to a
linear polyfluoro compound of the component (A).

[0057] A compounding amount of the component (C) is an effective amount as
a hydrosilylation reaction catalyst, and it is 0.1 to 500 ppm or
preferably 0.5 to 200 ppm (converted into a mass of a platinum metal
atom) with respect to the component (A), but it can be appropriately
increased or decreased with respect to a desired curing rate.

[Component (D)]

[0058] The component (D) according to the present invention is a cyclic
organopolysiloxane which is represented by the following general formula
(7) and has: a hydrogen atom directly bonded to a silicon atom and a
monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group
bonded to a silicon atom through a divalent hydrocarbon group that may
contain an oxygen atom or a nitrogen atom; and an epoxy group bonded to a
silicon atom through a divalent hydrocarbon group which may contain an
oxygen atom per molecule, and it is an adhesion provider which provides
self-adhesiveness to the composition according to the present invention.

##STR00025##

[0059] In general formula (7), i represents an integer of 1 to 6 or
preferably an integer of 1 to 5, j represents an integer of 1 to 4 or
preferably an integer of 1 to 3, k represents an integer of 1 to 4 or
preferably an integer of 1 to 3, i+j+k represents an integer of 4 to 10
or preferably an integer of 4 to 8.

[0060] Moreover, R3 represents a substituted or unsubstituted
monovalent hydrocarbon group, and there is the same group as the
substituted or unsubstituted monovalent hydrocarbon group of R1.

[0061] Additionally, L is a monovalent perfluoroalkyl group or a
monovalent perfluorooxyalkyl group bonded to a silicon atom through a
divalent hydrocarbon group which may contain an oxygen atom or a nitrogen
atom, and there is the same group as A described above. Each of these
groups is a group that is introduced in terms of compatibility with the
component (A), dispersibility, homogeneity after curing, and others.

[0062] Further, M represents an epoxy group bonded to a silicon atom
through a divalent hydrocarbon group which may contain an oxygen atom
and, specifically, there is the following group,

##STR00026##

wherein R5 represents a divalent hydrocarbon group having a carbon
atom number of 1 to 10, especially 1 to 5, and there are specifically an
alkylene group such as a methylene group, an ethylene group, a propylene
group, a butylene group, a hexylene group, or an octylene group, a
cycloalkylene group such as a cyclohexylene group, an oxyalkylene group
such as an oxyethylene group, an oxypropylene group, or an oxybutylene
group, and others.

[0063] As M, there are specifically the following groups.

##STR00027##

[0064] As such a component (D), for example, there are the following
compounds. It is to be noted that Me represents a methyl group in the
following formula.

##STR00028## ##STR00029##

[0065] One type of the component (D) may be solely used, or two or more
types of the component (D) may be used at the same time. Furthermore, an
amount of the component (D) used is 0.1 to 10.0 parts by mass or
preferably 0.5 to 7.0 parts by mass with respect to 100 parts by mass of
the component (A). Sufficient adhesiveness cannot be obtained when this
mount is less than 0.1 part by mass, or flowability of the composition
becomes poor and obtained physical strength of the cured material is
lowered when this amount exceeds 10.0 parts by mass.

[Component (E)]

[0066] The component (E) according to the present invention is a cyclic
organopolysiloxane which is represented by the following general formula
(8) and has: a hydrogen atom directly bonded to a silicon atom, a
monovalent perfluoroalkyl group or a monovalent perfluorooxyalkyl group
bonded to a silicon atom through a divalent hydrocarbon group that may
contain an oxygen atom or a nitrogen atom; and a cyclic carboxylic acid
anhydride residue bonded to a silicon atom through a divalent hydrocarbon
group per molecule, and it improves adhesion providing capability of the
component (D) according to the present invention and facilitates
development of self-adhesiveness of the composition according to the
present invention.

##STR00030##

[0067] In general formula (8), x represents an integer of 1 to 6 or
preferably an integer of 1 to 5, y represents an integer of 1 to 4 or an
integer of 1 to 3, z represents an integer of 1 to 4 or an integer of 1
to 3, and x+y+z represents an integer of 4 to 10 or preferably an integer
of 4 to 8.

[0068] Further, R4 represents a substituted or unsubstituted
monovalent hydrocarbon group, and there is the same group as the
substituted or unsubstituted monovalent hydrocarbon group of R1.

[0069] Furthermore, Q represents a monovalent perfluoroalkyl group or a
monovalent perfluorooxyalkyl group bonded to a silicon atom through a
divalent hydrocarbon group that may contain an oxygen atom or a nitrogen
atom, and there is the same group as A described above. Each of these
groups is a group that is introduced in terms of compatibility with the
component (A), dispersibility, homogeneity after curing, and others.

[0070] Moreover, T represents a cyclic carboxylic acid anhydride residue
bonded to a silicon atom through a divalent hydrocarbon group, and it can
be exemplified as follows,

##STR00031##

wherein R5 represents an alkylene group having a carbon atom number
of 2 to 12.

[0071] As such a component (E), there are the following compounds, for
example. It is to be noted that Me represents a methyl group in the
following formula.

##STR00032##

[0072] One type of the component (E) may be solely used, or two or more
types of the component (E) may be used at the same time.

[0073] A compounding amount of the component (E) is 0.01 to 5.0 parts by
mass or preferably 0.05 to 2.0 parts by mass with respect to 100 parts by
mass of the component (A). A sufficient adhesion facilitating effect
cannot be obtained when this mount is less than 0.01 part by mass, or
preserving properties of the composition is degraded and obtained
physical strength of the cured material is lowered when this amount
exceeds 5.0 parts by mass.

[Any Other Component]

[0074] In the optical semiconductor sealing curable composition according
to the present invention, to enhance its practicality, various
compounding agents such as a plasticizing agent, a viscosity modifier
agent, a flexibility providing agent, an inorganic filler, a reaction
controlling agent, an adhesion prompter, and others can be added as
required besides the components (A) to (E). A compounding amount of each
of these additives is arbitrary.

[0075] As the plasticizing agent, the viscosity modifier agent, and the
flexibility providing agent, a polyfluoromonoalkenyl compound represented
by the following general formula (13) and/or a linear polyfluoro compound
represented by the following general formula (14) and (15) can be used,

Rf2--(X')aCH═CH2 (13)

wherein X' and a represent the same as those described in formula (1),
and Rf2 represents a group represented by the following general
formula (16),

##STR00033##

wherein f' represents an integer that is not smaller than 1, preferably
an integer of 1 to 100, or more preferably an integer of 1 to 50, h' is 2
or 3 and smaller than each of p+q (average) concerning the Rf1 group
of the component (A), a sum of u and s, and a sum of b to d.

D--O--(CF2CF2CF2O)c'-D (14)

wherein D represents a group represented as Cb,F2b'+1--(b'
represents 1 to 3), c' represents an integer of 1 to 200 or preferably an
integer of 2 to 100 and smaller than each of p+q (average) concerning the
Rf1 group of the component (A), a sum of u and s, and a sum of b to
d,

D-O--(CF2O)d'(CF2CF2O)e'-D (15)

wherein D represents the same as above, each of d' and e' represents an
integer of 1 to 200 or preferably an integer 1 to 100, and a sum of d'
and e' represents smaller than each of p+q (average) concerning the
Rf1 group of the component (A), a sum of u and s, and a sum of b to
d.

[0076] Specific examples of a polyfluoromonoalkenyl compound represented
by general formula (13) are as follows (it is to be noted that m2 meets
the above requirements in the following formula).

##STR00034##

[0077] As specific examples of the linear polyfluoro compound represented
by general formula (14) and (15) are as follows (it is to be noted that
n3 or a sum of n3 and m3 meet the above requirements),

CF3O--(CF2CF2CF2O)n3--CF2CF3

CF3--[(OCF2CF2)n3(OCF2)m3]--O--CF3

wherein m3+n3=2 to 201, m3=1 to 200, and n3=1 to 200.

[0078] Further, it is desirable for viscosity (23° C.) of the
polyfluoro compound represented by each of general formula (13) to (15)
to fall within the range of 5 to 100,000 mPas, especially 50 to 50,000
mPas in the same measurement as that for the component (A).

[0079] Furthermore, a compounding amount when adding the polyfluoro
compound represented by each of general formula (13) to (15) is
preferably 1 to 100 parts by mass or more preferably 1 to 50 parts by
mass with respect to 100 parts by mass of the component (A).

[0080] As the inorganic filler, for example, it is possible to add a
reinforcement or quasi-reinforcement filler such as fumed silica,
colloidal silica, quartz powder, fused quartz powder, diatom earth, or
calcium carbonate [it is preferable to set a compounding amount of 0.1 to
30 parts by mass, especially 1 to 20 parts by mass with respect to 100
parts by mass of the component (A)], an inorganic pigment such as
titanium oxide, iron oxide, or cobalt aluminate, heat-resistant improver
such as titanium oxide, iron oxide, carbon black, cerium oxide, cerium
hydroxide, zinc carbonate, magnesium carbonate, or manganese carbonate,
or a thermal conductivity provider such as alumina, boron nitride,
silicon carbide, or metal powder having a specific surface area of 50
m2/g or above (which is usually 50 to 400 m2/g), especially
approximately 100 to 350 m2/g based on a BET method.

[0081] As examples of the control agent for the hydrosilylation reaction
catalyst, there are acetylene alcohol such as
1-ethynyl-1-hydroxycyclohexane, 3-methyl-1-butyne-3-ol,
3,5-dimethyl-1-hexene-3-ol, 3-methyl-1-pentene-3-ol, or phenylbutynol, a
reactant of chlorosilane having the same monovalent perfluoroalkyl group
or monovalent perfluorooxyalkyl group as A described above and acetylene
alcohol, 3-methyl-3-pentene-1-yne, 3,5-dimethyl-3-hexene-1-yne,
triallylisocyanurate, polyvinylsiloxane, an organic phosphorous compound,
and others, and adding such control agents enables adequately maintaining
curing reactivity and maintenance stability.

[0082] A manufacturing method of the optical semiconductor sealing curable
composition according to the present invention is not restricted in
particular, and manufacture is enabled by kneading the components (A) to
(E) and any other arbitrary components. At this moment, a mixing
apparatus such as a planetary mixer, a Ross mixer, or a Hobart mixer, or
a kneading apparatus such as a kneader or a three-roll mill can be used
as required.

[0083] In regard to the configuration of the optical semiconductor sealing
curable composition according to the present invention, this composition
may be configured as a so-called one-liquid type that all of the
components (A) to (E) and any other arbitrary components are treated as
one composition or a two-liquid type that both types of components are
mixed at the time of use.

[0084] The optical semiconductor sealing curable composition according to
the present invention is cured and has high transparency when heated, it
excellently adheres to a package material such as polyphthalic amide
(PPA) or a liquid crystal polymer (LCP) or a metal substrate, and hence
this composition is useful as a sealing medium that protects an optical
semiconductor device such as an LED, a diversion diode, an LSI, or an
organic EL. Although a curing temperature of the optical semiconductor
sealing curable composition is not restricted in particular, it is
usually 20 to 250° C. or preferably 40 to 200° C. Moreover,
as a curing time in this case, although a time that a cross-linking
reaction or an adhesive response with respect to various semiconductor
package materials is finished can be appropriately selected, the curing
time is generally preferably 10 minutes to 10 hours, and it is more
preferably 30 minutes to 8 hours.

[0085] Further, as a transmittance for linear light of 450 nm in a cured
material obtained by curing the composition according to the present
invention into a sheet form having a thickness of 2 mm, 80% or above is
preferable, and 85% or above is more preferable. When the transmittance
is 80% or above, light taking-out efficiency of the optical semiconductor
apparatus in which the optical semiconductor device is sealed by the
cured material obtained curing the composition according to the present
invention is not lowered, which is preferable.

[0086] Furthermore, it is preferable for a refractive index of the cured
material obtained by curing the composition according to the present
invention at 25° C. and 589 nm (a D line of sodium) to be 1.30 to
1.39. When the refractive index falls within this rage, the light
taking-out efficiency of the optical semiconductor apparatus having the
optical semiconductor device sealed by the cured material obtained by
curing the composition according to the present invention is not lowered
by design of the optical semiconductor apparatus, which is preferable.

[0087] It is to be noted that, when using the composition according to the
present invention, the composition may be dissolved with desired
concentration to an appropriate fluorinated solvent, e.g.,
1,3-bis(trifluoromethyl)benzene, Fluorinert (manufactured by 3M),
perfluorobutylmethylether, or perfluorobutylethylether and then used.

[0088] The optical semiconductor apparatus that can use the optical
semiconductor sealing curable composition according to the present
invention is not restricted in particular, and a known optical
semiconductor apparatus may be adopted. The optical semiconductor
apparatus according to the present invention has the optical
semiconductor device and the cured material obtained by curing the
optical semiconductor sealing curable composition according to the
present invention configured to seal the optical semiconductor device,
and FIG. 1 and FIG. 2 show a typical cross-sectional configuration.

[0089] In an optical semiconductor apparatus (a light-emitting apparatus)
10 shown in FIG. 1, a mortar-shaped concave portion 2' whose bore
diameter gradually increases from a bottom surface toward the upper side
is provided at a distal end portion 2a of a first lead frame 2, an LED
chip 1 is connected to and fixed on the bottom surface of the concave
portion 2' through a silver paste or the like by die bonding, whereby the
first lead frame 2 is electrically connected to one electrode (not shown)
on a bottom surface of the LED chip 1. Moreover, a distal end portion 3a
of a second lead frame 3 is electrically connected to the other electrode
(not shown) on an upper surface of the LED chip 1 through a bonding wire
4.

[0090] Additionally, in the concave portion 2', the LED chip 1 is coated
with a sealing member 5.

[0091] Further, the LED chip 1, the distal end portion 2a and an upper end
of a terminal portion 2b of the first lead frame 2 and the distal end
portion 3a and an upper end of a terminal portion 3b of the second lead
frame 3 are coated with/sealed by a translucent resin portion 7 having a
convex lens portion 6 at a distal end thereof. Furthermore, a lower end
of the terminal portion 2b of the first lead frame 2 and a lower end of
the terminal portion 3b of the second lead frame 3 are protruded toward
the outside through a lower end portion of the translucent resin portion
7.

[0092] In an optical semiconductor apparatus (a light-emitting apparatus)
10' in FIG. 2, a mortar-shaped concave portion 8' whose bore diameter
gradually increases from a bottom surface toward the upper side is
provided in an upper portion of a package substrate 8, an LED chip 1 is
bonded to and fixed on a bottom surface of the concave portion 8' by
using a die bonding material, and an electrode of the LED chip 1 is
electrically connected to an electrode 9 provided to the package
substrate 8 through a bonding wire 4.

[0093] Moreover, in the concave portion 8', the LED chip 1 is coated with
a sealing member 5.

[0094] Here, the LED chip 1 is not restricted in particular, and a
light-emitting device which is used for a conventionally known LED chip
can be adopted. As such a light-emitting device, there is one fabricated
by laminating a semiconductor material on a substrate having a buffer
layer of GaN or AlN provided thereon as required by various methods such
as an MOCVD method, an HDVPE method, or a liquid phase growth method. As
the substrate in this case, various materials can be used, and there are,
e.g., sapphire, spinel, SiC, Si, ZnO, GaN single crystal, and others. In
these materials, using sapphire is preferable since GaN having excellent
crystallinity can be easily formed and an industrial utility value is
high.

[0095] As the semiconductor material to be laminated, there are, e.g.,
GaAs, GaP, GaAlAs, GaAsP, AlGaInP, GaN, InN, AlN, InGaN, InGaAlN, SiC,
and others. Of these materials, in terms of the fact that high luminance
can be obtained, a nitride based compound semiconductor
(InxGayAl.sub.zN) is preferable. Such a material may contain an
activator and the like.

[0096] As the configuration of the light-emitting device, there are, e.g.,
MIS junction, pn junction, homo junction having PIN junction, hetero
junction, double hetero junction, and others. Further, a single or
multiple quantum well structure can be adopted.

[0097] A passivation layer may be or may not be provided to the
light-emitting device.

[0098] Although various kinds of emission wavelength from an ultraviolet
region to an infrared region can be used, the effect of the present
invention is considerable when the light-emitting device having a main
emission peak wavelength that is not greater than 550 is used.

[0099] One type of light-emitting device 1 may be used to effect
single-color emission, or a plurality of types of light-emitting device 1
may be used to effect multicolor emission.

[0100] An electrode can be formed to the light-emitting device by a
conventionally known method.

[0101] The electrode on the light-emitting device can be electrically
connected to a lead terminal by various methods. As an electrical
connection member, a member having, e.g., excellent ohmic mechanical
connection properties with respect to the electrode of the light-emitting
device is preferable and, for example, there is such a bonding wire 4
using gold, silver, copper, platinum, aluminum, or an alloy of these
materials as depicted in FIG. 1 or FIG. 2. Moreover, it is possible to
use, e.g., a conductive adhesive having a conductive filler such as
silver or carbon filled with a resin. Of these materials, using an
aluminum wire or a gold wire is preferable in terms of excellent
operability.

[0102] It is to be noted the first lead frame 2 and the second lead frame
3 are made of copper, a copper-zinc alloy, a nickel-iron alloy, or the
like.

[0103] Additionally, as a material making the translucent resin portion 7,
a material having translucency is not restricted in particular, but an
epoxy resin or a silicone resin is mainly used.

[0104] Further, the package substrate 8 can be fabricated using various
kinds of materials and, there are, e.g., polyphthalate amide (PPA), a
polycarbonate resin, a polyphenylene sulfide resin, a polybutylene
terephthalate resin, a polyamide resin, a liquid crystal polymer, an
epoxy resin, an acrylic resin, a silicone resin, a modified silicone
resin, an ABS resin, a BT resin, ceramic, and others. Of these materials,
in terms of heat resistance, strength, and a cost, polyphthalate amide
(PPA) is preferable. Furthermore, for the package substrate 8, it is
preferable to mix a white pigment such as barium titanate, titanium
oxide, zinc oxide, or barium sulfate and thereby improve light
reflectance.

[0105] Then, the sealing member 5 coating the LED chip 1 allows light from
the LED chip 1 to be efficiently transmitted therethrough toward the
outside and also protects the LED chip 1 or the bonding wire 4 from
external force or dust. As the sealing member 5, the composition
according to the present invention is used. The sealing member 5 may
contain a fluorescent material or a light diffusion member.

[0106] In the optical semiconductor sealing curable composition according
to the present invention, since the cured material has excellent
transparency, the optical semiconductor apparatus 10 or 10' according to
the present invention having the optical semiconductor device sealed by
using the composition has excellent light taking-out efficiency.

EXAMPLES

[0107] Although the present invention will now be specifically explained
hereinafter by using examples and comparative examples, the present
invention is not restricted to the following examples. It is to be noted
that a part in the following examples represents a part by mass, and Me
represents a methyl group. Further, viscosity represents a measured value
at 23° C. (conforming to JIS K6249).

Example 1

[0108] 7.6 parts of cyclic organopolysiloxane (an amount of SiH group:
0.00394 mole/g) represented by the following formula (17), 2.0 parts of
cyclic organopolysiloxane represented by the following formula (18), 0.50
part of cyclic organopolysiloxane represented by the following formula
(19), and 0.05 part of a toluene solution (concentration of platinum: 0.5
mass %) of a platinum-divinyltetramethyldisiloxane complex were
sequentially added to 100 parts of a polymer (viscosity: 4010 mPas, an
amount of a vinyl group: 0.030 mole/100 g) represented by the following
formula (16), and these materials are uniformly mixed. Then, a degassing
operation is performed to prepare a composition.

##STR00035##

Example 2

[0109] In Example 1, a composition was prepared like Example 1 except that
6.0 parts of cyclic organopolysiloxane represented by the following
formula (20) were added in place of cyclic organopolysiloxane represented
by formula (17).

##STR00036##

Example 3

[0110] In Example 1, a composition was prepared like Example 1 except that
4.0 parts of cyclic organopolysiloxane represented by the following
formula (21) were added in place of cyclic organopolysiloxane represented
by the above formula (18).

##STR00037##

Example 4

[0111] In Example 1, a composition was prepared like Example 1 except that
3.0 parts of cyclic organopolysiloxane represented by the following
formula (22) were added in place of cyclic organopolysiloxane represented
by the above formula (18).

##STR00038##

Example 5)

[0112] In Example 1, a composition was prepared like Example 1 except that
4.0 parts of cyclic organopolysiloxane represented by the following
formula (23) were added in place of cyclic organopolysiloxane the above
formula (18).

##STR00039##

Example 6)

[0113] In Example 1, a composition was prepared like Example 1 except that
0.05 part of cyclic organopolysiloxane represented by the following
formula (24) was added in place of cyclic organopolysiloxane represented
by the above formula (19).

##STR00040##

Comparative Example 1)

[0114] In Example 1, a composition was prepared like Example 1 except that
4.1 parts of linear organopolysiloxane (an amount of an SiH group:
0.00727 mole/g) represented by the following formula (25) were added in
place of cyclic organopolysiloxane represented by the above formula (17).

##STR00041##

Comparative Example 2)

[0115] In Example 1, a composition was prepared like Example 1 except that
5.0 parts of linear organopolysiloxane represented by the following
formula (26) were added in place of cyclic organopolysiloxane represented
by the above formula (18).

##STR00042##

Comparative Example 3)

[0116] In Example 1, a composition was prepared like Example 1 except that
2.0 parts of linear organopolysiloxane represented by the following
formula (27) were added in place of cyclic organopolysiloxane represented
by the above formula (19).

##STR00043##

[0117] In regard to each composition, the following items were evaluated.
It is to be noted that a curing condition is 150° C.×5
hours. Table 1 shows a result.

1. Appearance: a sheet-like cured material having a thickness of 2 mm was
fabricated, and its appearance was visually observed. 2. Light
transmittance: a sheet-like cured material having a thickness of 2 mm was
fabricated, and a transmittance (%) for linear light of 450 nm was
measured by using a 0-3310 type spectrophotometer manufactured by
Hitachi, Ltd. 3. Refractive index: a sheet-like cured material having a
thickness of 2 mm was fabricated, and a refractive index for 589 nm (a D
line of sodium) at 25° C. was measured by a multiwavelength Abbe
refractometer DR-M 2/1550 manufactured by Atago Co., Ltd. 4. Adhesiveness
for polyphthalic amide (PPA): two test panels of PPA having a size of 100
mm×25 mm were laminated to sandwich a layer of each prepared
composition having the thickness of 80 μm so that respective terminals
can overlap 10 mm, and they are heated at 150° C. for 5 hours to
cure the composition, thereby fabricating a bonded test piece. Then, a
tensile shear bond test (a pulling rate: 50 mm/minute) was performed with
respect to this test piece, and adhesion strength (shear bonding force)
and a cohesive failure ratio were evaluated. 5. Luminosity of the optical
semiconductor apparatus: in the optical semiconductor apparatus having
the same configuration as that of the embodiment shown in FIG. 2, each
composition obtained to form the sealing member 5 was put into the
concave portion 8' so that the LED chip 1 capable of emitting blue light
(450 nm) can be immersed, and heating was performed at 150° C. for
5 hours, whereby the optical semiconductor apparatus having the LED chip
1 sealed with the cured material of each composition was fabricated.
Further, the optical semiconductor apparatus was lighted based on the
rating, and the luminosity was measured. A result is represented in the
form of a relative value when the luminosity in Example 1 is determined
as 1.00.

[0118] Based on the result shown in Table 1, it was revealed that the
cured material obtained by curing the optical semiconductor sealing
curable composition (Examples 1 to 6) according to the present invention
containing all of the components (A) to (E) has excellent transparency as
compared with Comparative Examples 1 to 3, and hence the optical
semiconductor apparatus having the optical semiconductor device sealed
therein has the excellent light taking-out efficiency.

[0119] It is to be noted that the present invention is not restricted to
the foregoing embodiment. The foregoing embodiment is just an
illustration, and any examples that have substantially the same
configuration and exercise the same operations and effects as the
technical concept described in claims of the present invention are
included in the technical scope of the present invention.