Kyzen Sdn Bhd

KYZEN has been pioneering award-winning environmentally responsible advanced cleaning technologies since 1990 by fusing our commitment to groundbreaking science in cleaning chemistries and research with the care we have for your manufacturing cleaning process and your success. That means we continuously improve our cleaning agents and problem solve to create the most effective cleaning products and solutions to suit your specific needs. And, we are meticulous in our attention to detail in meeting those manufacturing cleaning needs, tackling it head on and sticking with it until it is successfully resolved.

Products

Micronox® MX2708 was formulated for the demanding cleaning challenges presented within leadless devices such as low standoff gaps and fine pitches of BGAs, flip chips, QFNs, LGAs and passives. MX2708 completely removes organic acid residues of all kinds at low, safe operating concentrations all while having no effect on exposed metal and intermetallic alloys including Cu, Al, Sn, Pb, Ni, Ag and Au finishes. Micronox MX2708 is a balanced cleaning agent designed around the critical process conditions that match the cleaning agent with water soluble flux pastes.

Micronox® MX2322 is a semiconductor grade engineered semi aqueous solvent and designed to clean all types of paste fluxes common in wafer bumping, wafer level packaging, die attach, flipchip and SiP that contain copper pillar. Micronox MX2322 has a wide process window, as well as a long bath life, to remove tough flux residue at a fast rate and is compatible with all sensitive metals. Micronox MX2322 demonstrates its excellent cleaning performance and benefits in single-wafer spray-in-air tools as well as all immersion cleaning systems.

Effective in Single Wafer SIA, Ultrasonic and all Immersion Cleaning Systems