General Information and Usage

The Angstrom E-beam is a dual-chamber system for thin-film evaporation. The upper chamber is a load lock for increased pumping speed. A maximum of six different materials can be evaporated in one pump-down cycle, from the six pocket electron gun. The thickness of the metal is monitored in-situ by a thickness monitor. Substrates up to 6 inch diameter can be attached to the substrate holder. The sample temperature usually does not exceed 50 °C. Only the following materials are available: Au, Pd, Ge, Ni, Pt, and Ti.

Process Control Charts

Process: 1000 A of Ti is deposited at a rate of 8 A/s on a Silicon test wafer using a Kapton mask across the center, and is measured using a KLA Tencor P15 Profilometer. The starting base pressure is 5e-7 torr.