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Xilinx Expands its 16nm UltraScale+ Product Roadmap to Include Acceleration Enhanced Technologies for the Data Center

SAN JOSE, Calif., May 23, 2016 /PRNewswire/ -- Xilinx, Inc. (NASDAQ:XLNX) today announced expansion of its 16nm UltraScale+™ product roadmap with new acceleration enhanced technologies for the Data Center. The resulting products will deliver the powerful combination of Xilinx's industry-leading 16nm FinFET+ FPGAs with integrated High-Bandwidth Memory (HBM), and support for the recently announced Cache Coherent Interconnect for Acceleration technology (CCIX). CCIX is initially driven by a group of seven companies to enable an acceleration framework that works with multiple processor architectures. These acceleration enhanced technologies will enable efficient heterogeneous computing for the most demanding data center workloads. The new products will also be highly leveraged in many other compute intensive applications requiring high memory bandwidth.

"Having already delivered 19 billion transistors on a chip at 20nm leveraging our second generation 3D IC technology, we are creating a third generation 3D IC breakthrough for data center acceleration and other compute intensive designs," said Victor Peng, executive vice president and general manager, Programmable Products at Xilinx. "When combined with next generation CCIX acceleration framework and our software defined SDAccel™ development environment, this technology will enable a new breed of high-density, flexible platforms for accelerating compute, storage and networking applications."

Xilinx is already collaborating with leading hyperscale data center customers to create optimized configurations and products.

About XilinxXilinx is the leading provider of All Programmable FPGAs, SoCs, MPSoCs, and 3D ICs. Xilinx uniquely enables applications that are both software defined and hardware optimized – powering industry advancements in Cloud Computing, Embedded Vision, Industrial IoT, and 5G Wireless. For more information, visit www.xilinx.com.

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