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Method for a lifted compliant die-package interconnect

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a structure for a lifted compliant die-package interconnect along with a method for creating it. Benefits include improved reliability and improved ease of manufacturing over other proposed compliant interconnects.

Country

United States

Language

English (United States)

This text was extracted from a Microsoft Word document.

At least one non-text object (such as an image or picture) has been suppressed.

This is the abbreviated version, containing approximately
50% of the total text.

Method for a lifted compliant die-package interconnect

Disclosed is a structure for a lifted compliant die-package
interconnect along with a method for creating it. Benefits
include improved reliability and improved ease of manufacturing over other proposed
compliant interconnects.

Background

� � � � � Coefficient for
thermal expansion (CTE) mismatch between the die and the package substrate
induces large stresses in on-die structures. With the introduction of low
dielectric constant (k) and ultra-low k interlayer dielectric (ILD) materials,
these forces are large enough to cause fracture and delamination unless an
architectural or process change is made. This problem does not conventionally
exist because low k and ultra-low k materials are not in production. Proposed
solutions include:

1. � � Low CTE substrates

2. � � Changing the assembly
process

3. � � Other varieties of
compliant interconnects

� � � � � These possible
solutions are not ideal due to the following reasons respectively:

1. � � Moves the CTE mismatch
to the package/motherboard interface

2. � � May not be possible or
sufficient
3. � � Can be relatively complicated and
expensive to manufacture

General description

� � � � � The disclosed method is a thin film
die-package interconnect that stands off the surface of the die, making it highly
compliant (see Figure 1).

� � � � � The disclosed method
solves the CTE mismatch-induced stress problem without adding cost. The
fabrication process of the proposed compliant interconnect is much simpler than
other types of compliant interconnects.