Good information, still sad that you compare BFL (A company that has NEVER created an ASIC before) with OrSoC (A company that has been doing it for 10 years) and suggest they will have similar issues.

So we know KnC didn't design their ASIC, ORSoC did. Want to know another neat fact? BFL didn't design their ASIC, Chronicle Tech. did. Guess how long Chronicle has been in business?

Did you know that Orsoc, Kennmar & Cole, and KncMiner all share directors?, are partners? All this is in the knc threads....post your proof please. I don't think it's beneficial anymore to even read this thread anymore, since so much misinformation is flying around. BTW, Chronicle Tech is a software company, not an ASIC designer.

I want to be clear that I WANT KNC to come to market. The more manufacturers the merrier and the better for all of us.

Just when we dig into the nuts and bolts, there are some things that really bug me.1) Chip design appears to be huge - my main concern.2) Chip has never been shown (ok, it's in manuf, but they have to have prototypes by now - you don't order up 1 mil chips unless you have validated the hardware)3) Chip details like number of SHA256 "cores" has never been released.

All we have are some demos with FGPA hardware, nothing here.

Until I see more, my money goes behind chips we have actually seen: Avalon and Bitfury. BFL's business practices are so bad I'm marking them off my (personal) list.

By this mistake I will not say "Please don't comment when it is clear you have @#$% for brains", a lapsus what has anyone.

Those a PGA SOCKETED chips.

KNC is using BGA UNSOCKETED chips.

PGA vs. BGA is not so big as the Socketed part. You create a socket so that you give people an upgrade path or choice of different CPUs to plug into a universal board that can be used among different CPUs. THIS IS AN EXTRA EXPENSE, so you only do it if you want to cover the market in different tiers of performance (and price) for your product.

KNC is soldering their chips directly to the mainboard - NO SOCKET. Why does this matter? If you don't use a Socket, then your "package" does not need to be nearly as big.

Plus P3/P4 is over a decade old. You don't don't make packages that big anymore. It costs more money over a smaller, compact package.

The fanboys here keep missing the point: EVEN IF 75% of this package is just wasted space, that leaves a die size of 750mm2. That would make this one of, if not the largest, mass-produced dies ever. If true, that's just asking for trouble.

Would love for KNC to post some screens of the wafers or dies and more technical info. IMO you only stay this quiet when you are up a creek without a paddle.

Has anyone made profitability calculations based on projected difficulty by the time these come out? These look like a fantastic deal now, but will they be in September, October, November. If they are released by then that is.

I am also curious about this quoted from their website.

Quote

Why are you selling the Miners and don’t mine yourself (will you use the miners for mining yourself)?

We are mining ourselves, but we believe in the bitcoin project and a diversified market is the best for all parties. We will continue to mine but we do not believe in a monopoly of miners.

They say here that they are currently mining, yet they only show 3d sketches of their product which leads to the assumption that it is not even produced yet. I do get why people that make ASICs would want to spread them around, especially since one can only cash out so many bitcoins per day/month, but it only makes sense that anyone creating these would want to mine for at least a couple months before releasing them, and if they are not even made yet is it really safe to believe these will be released this fall as they say?

And what are they mining with now, FPGAs, XFX cards?

Or maybe, they are mining with them right now (this being the couple months prior) and not releasing a photo because then they would have to come up with a reason for why they are not shipping yet.

Bkpduke and erk, view this short video from open day at KnC: https://www.youtube.com/watch?v=by-je8XRCdYThey (KnC) stated quite clearly, the chip (the package) would be around the size shown (about 60 mm x 60 mm) not the die, which will be much smaller.(That worries me, because while the yield will be higher, the heat density will be quite higher too.)

By this mistake I will not say "Please don't comment when it is clear you have @#$% for brains", a lapsus what has anyone.

Those a PGA SOCKETED chips.

KNC is using BGA UNSOCKETED chips.

PGA vs. BGA is not so big as the Socketed part. You create a socket so that you give people an upgrade path or choice of different CPUs to plug into a universal board that can be used among different CPUs. THIS IS AN EXTRA EXPENSE, so you only do it if you want to cover the market in different tiers of performance (and price) for your product.

KNC is soldering their chips directly to the mainboard - NO SOCKET. Why does this matter? If you don't use a Socket, then your "package" does not need to be nearly as big.

Plus P3/P4 is over a decade old. You don't don't make packages that big anymore. It costs more money over a smaller, compact package.

The fanboys here keep missing the point: EVEN IF 75% of this package is just wasted space, that leaves a die size of 750mm2. That would make this one of, if not the largest, mass-produced dies ever. If true, that's just asking for trouble.

Would love for KNC to post some screens of the wafers or dies and more technical info. IMO you only stay this quiet when you are up a creek without a paddle.