Norio Chujo, Tokyo JP

Norio Chujo, Tokyo JP

Patent application number

Description

Published

20080231330

RAMP GENERATOR AND CIRCUIT PATTERN INSPECTION APPARATUS USING THE SAME RAMP GENERATOR - The present invention provides a ramp generator capable of appropriately setting a rise starting point of an output voltage of a ramp waveform and an output voltage at the time of stable output. A current adjustment unit including a differential pair of transistors and an amplifier constitute a feedback circuit. By controlling the charging/discharging of an integration capacitor by ON/OFF of a discharge current source connected to a common emitter terminal of the current adjustment unit, an output of the ramp waveform outputted from an output terminal disposed at the connection end of the integration capacitor is controlled.

OUTPUT BUFFER CIRCUIT, SIGNAL TRANSMISSION INTERFACE CIRCUIT AND APPARATUS - An output buffer circuit which transmits a logic signal to a transmission line includes a transmission pre-emphasis output circuit and a transmission pre-emphasis amount determination circuit. The transmission pre-emphasis output circuit controls a pre-emphasis amount according to an output signal from the transmission pre-emphasis amount determination circuit. The transmission pre-emphasis amount determination circuit adjusts a pre-emphasis amount and the number of pre-emphasis taps according to a pseudo loss control signal, controls a pre-emphasis amount of a transmission signal so that a signal amplitude is made smaller in a signal component with a high frequency than that of a signal component with a low frequency, and imparts signal degradation to a received waveform to realize transmission loss in a pseudo manner.

01-01-2009

20090027867

High-speed signal transmission apparatus - A high-speed signal transmission apparatus comprises: a housing; a plurality of daughter boards juxtaposed to one another in the housing; board-side connectors each provided on corresponding each of the juxtaposed daughter boards; and cable-side connectors fixed in the housing; wherein each of the board-side connectors is insertable/removable into/from corresponding each of the cable-side connectors, and wherein a cable group whose impedance matching can be achieved makes connection between the predetermined cable-side connectors.

01-29-2009

20090085688

Semiconductor Circuit, and Computing Device and Communications Device Using the Same - In a semiconductor circuit, an impedance adjustment circuit having the characteristics same as those of a circuit having the nonlinear resistance characteristics is configured to include an operating point calculation circuit automatically calculating an operating point with a reference resistance through feedback control, and an impedance calculation circuit calculating the impedance at the operating point found by the operating point calculation circuit. The impedance adjustment circuit is also provided with an impedance determination circuit that determines whether or not the impedance found by the impedance calculation circuit is in a predetermined range. These components, i.e., the operating point calculation circuit, the impedance calculation circuit, and the impedance determination circuit, are provided each two for High-side and Low-side impedance adjustment use.

04-02-2009

20100209041

PHOTOELECTRIC COMPOSITE WIRING MODULE AND METHOD FOR MANUFACTURING THE SAME - A photoelectric composite wiring module includes a circuit substrate, an optical device, an LSI having a driver and an amplifier for the optical device, and a thin film wiring layer having an electrical wiring. The optical device is connected with the LSI by means of the electrical wiring. The optical device is formed on the circuit substrate and optically coupled to an optical waveguide formed in the circuit substrate. The thin film wiring layer is formed on the optical device to ensure that the optical device is electrically connected with the electrical wiring of the thin film wiring layer. The LSI is mounted on and electrically connected with the thin film wiring layer.

Variable Gain Circuit - There is provided a variable gain circuit system which is inductorless and capable of achieving a high gain and a wide band by elements for achieving variable gain to prevent decreasing a gain or deteriorating the band. The variable gain circuit includes: transistors; a resistor connected as a load of each transistor; a voltage source applying a bias voltage to each gate of the transistors; a switch selectively connecting the voltage source or a ground potential to each gate of the transistors in accordance with gain setting; and a current source connected to a common input. A drain of each transistor is connected to an input of a circuit in a subsequent stage.

12-16-2010

20110026878

Optical I/O Array Module and Its Fabrication Method - In fabricating an optical I/O array module, an optical waveguide provided with mirror parts, each having a tapered face, is formed on a substrate, a convex shaped member or a concave shaped member is placed at spots above the respective mirror parts of the optical waveguide, and laser diode arrays and photo diode arrays, provided with either a concave shape, or a convex shape, are mated with, or into the convex shaped member or the concave shaped member before being mounted. Further, there are formed multiple filmy layers, on which an LSI where a driver IC LSI of optical elements, and an amplifier LSI of the optical elements are integrated.

OUTPUT BUFFER CIRCUIT AND DIFFERENTIAL OUTPUT BUFFER CIRCUIT, AND TRANSMISSION METHOD - An output buffer includes inverters, a delay circuit for delaying an input signal, buffers and switches. The output buffer transmits a logic signal to a transmission path and, in accordance with an amount of signal attenuation in the transmission path, creates a waveform including four or more kinds of signal voltages. The buffers are redundantly connected in parallel, and the number of buffers concurrently turn ON is controlled by respective switches provided in series with output resistors of the buffers. By selecting the buffers of switches which are turned ON, the preemphasis amount and a number of preemphasis taps are adjusted through a selector logic selection signal so that the preemphasis amount is made variable and the ON resistance of the buffers is made constant.

09-08-2011

20110241778

PEAKING CIRCUIT, METHOD FOR ADJUSTING PEAKING CIRCUIT, DIFFERENTIAL AMPLIFIER INSTALLING PEAKING CIRCUIT, LASER DIODE DRIVING CIRCUIT INSTALLING PEAKING CIRCUIT, AND DATA PROCESSING UNIT INSTALLING PEAKING CIRCUIT - A peaking circuit for adjusting peaking of a high-frequency signal, comprises: a first inductor; a second inductor which is electromagnetically coupled with the first inductor; a signal input section which receives an input signal; a transistor which adjusts electric current passing through the second inductor according to the input signal inputted via the signal input section; and a signal output section which outputs a signal whose peaking has been adjusted by the first inductor. Mutual inductance of the electromagnetically coupled first and second inductors is changed by the adjustment of the electric current passing through the second inductor, according to the input signal inputted via the signal input section, with the use of the transistor, thereby adjusting the peaking of signal waveform of electric current passing through the first inductor, and the signal subjected to the peaking adjustment is outputted from the signal output section.

Optical Module and a Mounting Structure Thereof - An optical module achieving optical coupling at a low cost and by a simple and convenient process is intended to be provided. For attaining the purpose, a transparent member sealing an optical device and an optical transmission channel are connected as an optical coupling structure. Specifically, optical coupling is achieved in an optical module having an optical device, a first substrate having the optical device mounted thereon, and a second substrate or a transparent resin provided over the first substrate so as to hermetically seal the optical device by connecting an optical transmission channel over the second substrate or the transparent resin at a portion in which light from the optical device is transmitted.

01-23-2014

20140125398

Driver Integrated Circuit - Provided is a configuration of a driver integrated circuit that can output a voltage exceeding the withstand voltage of a process, and that satisfies required apparatus performance (high speed and high voltage). A differential input circuit, a level shift circuit, and an output circuit are manufactured by the same process and divided and disposed on three or more chips with different substrate potentials (sub-potentials). By setting different applied voltages to the substrates of the chips, an output voltage greater than the process withstand voltage can be provided (see FIG.