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Abstract

Input/output (I/O) pins are welded to I/O pads on ceramic semiconductor chip carriers by an automated process. Pins are preformed, e.g., by punching a metal tape. During welding to chip carriers, the pins remain attached to selvage strips which are perforated to allow accurate, automatic feeding in alignment with chip carriers. Roller electrodes are in contact with pin material over I/O pads on chip carriers and pulses of welding current are programmed to result in multiple, overlapping welds of pin material to pad material. An example is given wherein pins are welded to one edge of each of two sets of chip carriers in a continuous process.

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United States

Language

English (United States)

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Automated Pin Attachment by Welding

Input/output (I/O) pins are welded to I/O pads on ceramic semiconductor chip
carriers by an automated process. Pins are preformed, e.g., by punching a metal
tape. During welding to chip carriers, the pins remain attached to selvage strips
which are perforated to allow accurate, automatic feeding in alignment with chip
carriers. Roller electrodes are in contact with pin material over I/O pads on chip
carriers and pulses of welding current are programmed to result in multiple,
overlapping welds of pin material to pad material. An example is given wherein
pins are welded to one edge of each of two sets of chip carriers in a continuous
process. Referring to the figure, two sets of chip carriers 2 are preheated (150 to
250 degrees Celsius) and continuously fed with the pads of the carriers 6 in
alignment with punched and preformed metal tape 4 under a set of roller welding
electrodes 8. The metal tape 4 is punched to create the pins to be welded to the
chip carrier pads 6. Holes 10 are provided in the selvage of the metal tape 4 for
accurate positioning and movement of the tape relative to the chip carriers. The
punched metal tape 4 is formed into an appropriate shape, such as that shown in
Sec. A-A End View, to provide wide tolerance in roller positioning and of punched
tape width dimensions, and to allow large thermal expansion excursions of the
metal tape without creating stress at the weld points. Welding current pulses are
prog...