Wednesday, 1 November 2017

Neffos with 18:9 screen and Snapdragon 835 leaks

TP-Link might be
famous with their networking solutions, but the company also outs smartphones
from time to time. You may remember the X1 and the X1 Max, but now a flagship
is on its way. According to sources, it will have top notch specs like
Snapdragon 835 and dual camera setup.

The yet unnamed phone is coming with an 18:9
screen with curved edges on the front. This will means there is no room for a
home button or a fingerprint scanner, so the latter moves to the back, right
below the dual cameras.

One of the sensors is 16 MP, while the other
is 20 MP and is said to offer 2x optical zoom. The selfie snapper is also 16
MP. The RAM is expected to be 6 GB.

TP-Link usually manufacturers low-end and
mid-tier smartphones, so a Snapdragon 835 device could indicate a major shift
in strategy. We are waiting for an official announcement from TP-Link and when
we have one, we’ll let you know more about the details.