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Abstract:

In this thesis, electronic packaging technology was introduced and discussed from
the device level to system level, followed by a review of crosstalk suppression,
thermal management and electro-thermal modelling of electronic packages.
The first dynamic electro-thermal UCSD HBT model for the OMMICTM DH15IB
InP process was developed in an electro-thermal simulator fREEDATM. Simulations
were performed for the devices and a demonstrator amplifier in fREEDATM and
AgilentÃ‚Â™ ADS. The results showed how the thermal effects influenced the electrical
behaviour. Static DC IV measurements and S parameter measurements were applied
to verify the simulation results.
At package level, a transmitter System-in-Package (SiP) demonstrator was developed.
It was modelled and analyzed with a multi-physics simulator COMSOL
MultiphysicsÃ‚Â™. A Low Temperature Co-fired Ceramic (LTCC) antenna array at
65GHz was designed for this SiP package demonstrator. Thermal vias were
demonstrated to have positive effects on the package thermal management by
simulation.
An embedded chip package based on a new die attachment method was also electrothermally
modelled and simulated with COMSOL MultiphysicsÃ‚Â™. The results have
a good agreement with the measurement results based on a Temperature Co-efficient
of Resistance (TCR) technique. Hypodermic thermocouples were also used for direct
temperature measurement. Impact of different numbers of contact windows and different sizes of outer guard
rings in the Ground Plane Silicon-on-Insulator (GPSOI) crosstalk suppression test
structures were studied for the first 'time. Measurements, modelling and simulations
were performed for a series of test structures in this work. An equivalent lumped
circuit model for the test structure was developed for further investigation of
crosstalk isolation. Conclusions were drawn that more contact windows on the GSG
ground rails can generate better crosstalk reduction and that guard rings should have
appropriate sizes and not be positioned far away from the devices in order to be
effective on the crosstalk isolation.