The 3D-DRAM stacked over the processor is a vibrant technique in order to overcome the memory wall as well as the bandwidth wall problems. We considered a system with two DRAM dies over a single processor die. We assumed the decoupling capacitors to be placed on each DRAM die and connected to the power distribution TSV pairs, where the TSVs pass through the DRAM stack. In this paper we proposed a mathematical model for the optimum value of the decoupling capacitance on each DRAM die along with the optimum values of the effective resistance of the interconnecting power distribution TSV pairs in order to ensure the power integrity of the logic load during switching. The proposed model has a maximum of 1.1% error as compared to the Ansoft Nexxim4.1.

In this article we propose an efficient and accurate model to estimate peak-to-peak core switching noise, caused by simultaneous switching of logic loads along a vertical chain of power distribution TSV pairs in a 3D stack of dies interconnected through TSVs. The proposed model is accurate with only a 2–3% difference in peak-to-peak core switching noise as compared to the Ansoft Nexxim4.1 equivalent model. The proposed model is 3–4 times faster than Ansoft Nexxim4.1 and uses two times less memory as compared to the Ansoft Nexxim4.1 equivalent model. In this article we also thoroughly establish design guidelines for almost flat output impedance magnitude at each stage of a vertical chain of power distribution TSV pairs to realize a resonance free scenario over a wide operating frequency range. We also establish decoupling capacitance design guidelines based on the optimum output impedance and critically damped supply voltage for the core logic for each stage of a vertical chain of power distribution TSV pairs.

On-chip power supply noise has become a bottleneck in 3D ICs as scaling of the supply network impedance has not been kept up with increasing device densities and operating currents with each technology node due to limited wire resources. In this paper we proposed an efficient and accurate model to estimate peak-to-peak switching noise, caused by simultaneous switching of logic loads along a vertical chain of power distribution TSV pairs in a 3D stack of ICs. The proposed model is quite accurate with only 2-3% difference from Ansoft Nexxim4.1 equivalent model. The proposed model is 3-4 times faster than Nexxim4.1 as well as consumes two times less memory as compared to Nexxim4.1equivalent model. We analyzed peak-to-peak switching noise along a vertical chain of power distribution TSV pairs by varying physical dimensions of TSVs and value of decoupling capacitance. We also thoroughly investigated the peak-to-peak noise sensitivity to TSV effective inductance and decoupling capacitance.

How peak-to-peak switching noise as well as the LC resonance term varies by varying different circuit parameters of a power distribution TSV pair (having decoupling capacitance and logic load), within a 3D stack of ICs interconnected through TSVs.

Extensive transient simulations for on-chip power delivery networks are required to analyze power delivery fluctuations caused by dynamic IR and Ldi/dt drops. Speed and memory has become a bottleneck for simulation of power distribution networks in modern VLSI design where clock frequency is of the order of GHz. The traditional SPICE based tools are very slow and consume a lot of memory during simulation. The problem is further aggravated for huge networks like power distribution network within a stack of ICs inter-connected through TSVs. This type of 3D power distribution network may contain billions of nodes at a time. In this paper we proposed a faster transient simulation algorithm using visual C++. First we reduce 3D power distribution bus containing n nodes to a two terminal 7 network. Then we solve this two terminal reduced network for voltages and currents. After this, we apply back solving algorithm to the network to solve it for each of the intermediate nodes using visual C++. The proposed algorithm is quite accurate with 1-2% error when compared with Ansoft Nexxim4.1. The proposed algorithm is several times faster than Ansoft Nexxim as well as consumes significantly less memory as compared to Nexxim.

Size of on-chip interconnects as well as the supply voltage is reducing with each technology node whereas the operating speed is increasing in modern VLSI design. Today, the package inductance and resistance has been reduced to such an extent that core switching noise caused by on-chip inductance and on-chip resistance is gaining importance as compared to I/O drivers switching noise. Both on-chip inductance and skin effect are prime players at frequencies of the order of GHz. The problem is further aggravated when chips are interconnected through TSVs to form a 3D integrated stack in order to achieve low form factor and high integration density. In this paper we analysed peak core switching noise in a 3D stack of integrated chips interconnected through power distribution TSV pairs, through our comprehensive mathematical model which has been proved to be quite accurate as compared to SPICE. We analysed the effect of number of chips in a 3D stack, rise time, decoupling capacitance, and skin effect on power distribution TSVs induced core switching noise in this paper.

Supply grids of integrated chips are interconnected through through-silicon vias (TSVs) in modern design techniques to form a 3-D stack in vertical direction. The load on each chip is supplied through (power/ground) TSV pairs. Accurate estimation of power/ground noise on each TSV pair of a 3-D power distribution network is necessary for a robust power supply design. The worst case noise obtained with fast switching characteristics may not be significantly accurate. The behavior of power/ground noise as a function of rise time for an inductive power distribution TSV pair with decoupling capacitance, is investigated in this paper. An equivalent rise time corresponding to resonance is presented to accurately estimate the worst case power/ground noise in the time domain. In addition noise sensitivity to decoupling capacitance and TSV inductance is evaluated as a function of rise time. We also discuss noise accumulation as a result of worst case damping factor in this paper.

On-chip power distribution network model for simultaneous switching of 3D ICs stacked through TSVs to choose TSV pattern, maximum number of chips in a stack and location of the decoupling capacitor for early design trade-offs.

9.

Amin, Yasar

et al.

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.

Chen, Qiang

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.

Shao, Botao

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.

Hållstedt, Julius

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Tenhunen, Hannu

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.

Zheng, Li-Rong

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.

Paper substrate is one of the paramount nominees for Radio Frequency Identification (RFID) tags but at the same time it is extremely prone towards environmental changes. In this paper, antennas for UHF RFID tags on paper based substrate are investigated and analyzed for the first time to evaluate the effect of change in dielectric constant on the antenna parameters and performance. On the basis of analysis a concrete meander line antenna is proposed, designed and evaluated which has tremendous immunity towards variation in dielectric constant.

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Chen, Qiang

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Tenhunen, Hannu

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Zheng, Lirong

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Chen, Qiang

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Tenhunen, Hannu

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Zheng, Li-Rong

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Fully integrated printed RFID antennas show potential solution for item level labeling applications. In order to accommodate the antenna during the package printing process, it is vastly preferred that antenna structures are printed on paper substrates. However, the electromagnetic properties and thickness of paper substrates are susceptible to change due to various environmental effects. Thus, adequately consistent in performance and material insensitive printed Quadrate Bowtie RFID antennas are proposed. This paper presents an in-depth efficient optimization for high performance tag antenna designs for operability in frequencies 866-868MHz & 902-928MHz. It is demonstrated that the proposed antennas can tolerate a considerable variation in the permittivity on thin paper substrates, and present benchmarking results when n across metal and water containing objects.

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Chen, Qiang

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Zheng, Lirong

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Tenhunen, Hannu

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

A parametric analysis is performed for a wideband Archimedean spiral antenna in recognition of an emerging concept to integrate RFID along with several applications by using a single antenna. The antenna is fabricated using state-of-the-art inkjet printing technology on various commercially available paper substrates to provide the low-cost, flexible RF modules for the next generation of "green" electronics. The effects on electromagnetic characteristics of the planar Archimedean spiral antenna, due to the use of paper are investigated besides other parameters. The proposed antenna is evaluated and optimized for operational range from 0.8-3.0GHz. It exhibits exceptional coverage throughout numerous RFID ISM bands so do for other wireless applications.

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Chen, Qiang

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Zheng, Lirong

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Tenhunen, Hannu

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

In this paper, novel Bowtie antennas which cover complete UHF RFID band (860-960MHz), fabricated on various ultra-low-cost substrates using state-of-the-art printing technologies are investigated as an approach that aims to accommodate the antenna during the package printing process whilst faster production on commercially available paper. The proposed antenna structures are evaluated in reference to circuit and field concepts, to exhibit extreme degree of functional versatility. These antennas are developed to cater the variations which appear in electromagnetic properties and thickness of paper substrate due to various environmental effects. Computed (simulated) and well-agreed measurement results confirm a superior performance of the tag modules while stepping towards next generation of "green" tags.

KTH, School of Information and Communication Technology (ICT), Electronic Systems.

Chen, Qiang

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Zheng, Lirong

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Tenhunen, Hannu

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

The novel idea of integrating RFID with sensors along with other wireless applications by using single tag antenna is implemented, by fabricating proposed antenna using state-of-the-art inkjet printing technology on commercially available paper substrates. For the first time, a parametric analysis is performed for realization of planar log-spiral antenna on paper for operational range from 0.8-3.0GHz, which also exhibits excellent coverage throughout numerous RFID ISM bands, and for other wireless applications. The ANSYS HFSS tool is used to design and predict the performance of the proposed antenna in terms of radiation pattern and input impedance.

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Chen, Qiang

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Zheng, Lirong

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Tenhunen, Hannu

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

For the first time, two-arm planar sinuous antenna is demonstrated to realize the emerging concept of integrating RFID functionalities along with sensors and other wireless applications for "green" electronics. In-depth, parametric analysis is performed for the proposed antenna which is fabricated on a paper substrate using revolutionary inkjet printing technology to develop a system-level solution for ultra-low-cost mass production of multipurpose wireless tags in an approach that could be easily expanded to other microwave and wireless "cognition" applications. The proposed antenna exhibits excellent performance throughout several RFID ISM bands and for other wireless applications in its operational range from 0.8 to 3.0 GHz.

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Feng, Yi

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Chen, Qiang

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Zheng, Lirong

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Tenhunen, Hannu

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

We demonstrate for the first time an RFID tag antenna which itself is humidity sensor and also provides calibration functionality. The antenna is comprised of T-matching network and horizontally meandered lines for impedance matching and reliable near-field communication. The novel contour design provides humidity sensing, and calibration functions whilst concurrently acts as a radiating element along with quadrangular capacitive tip-loading with covered middle portion for far-field communication. The inkjet printed prototypes of the antenna provide effective ambient humidity sensing while demonstrating stable RFID communication. The antenna has a compact size of 1.1 x 10.2 cm for 902-928MHz band.

This paper describes a novel Flexo, Screen and Inkjet printed rounded edges bowtie antenna with T-matching stubs on paper, Kapton (HN) and Teonex Q51 substrate. Paper is one of the paramount nominees for Radio Frequency Identification (RFID) tags, for the reason that it is one of the widely and the cheapest available substrates. Kapton (HN) and Teonex Q51 are distinguished for their flexibility and reliability. The antenna exhibits compact size with outstanding read range of 4 meters and complete coverage of UHF RFID band (860-960 MHz). The results show extreme immunity of versatile antenna against harsh environments. These antennas are flexible which give autonomy for their applications.

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.

Hållstedt, Julius

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Tenhunen, Hannu

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.

Zheng, Li-Rong

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.

This paper presents a novel inkjet printed rounded corner bowtie antenna with T-matching stubs on paper substrate which is the cheapest and widest available substrate. The antenna exhibits compact size with outstanding read range and complete coverage of UHF RFID band (860-960 MHz). The results show extreme immunity of proposed antenna against paper dielectric constant variation.

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Kanth, R. K.

Liljeberg, P.

Akram, A.

Chen, Qiang

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Zheng, Lirong

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Tenhunen, Hannu

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

An RFID antenna with integrated humidity sensor and calibration functionality for wireless sensor network is proposed. The antenna is composed of series and shunt stubs for impedance matching and reliability for near-field communication. The innovative ladder contour structure plays the key role for humidity sensing, and sensor calibration. The quadrangular end-tip loading is employed to offer capacitance and stability for far-field communication. The prototypes of the antenna are fabricated and tested: antenna effectively senses the ambient humidity levels while demonstrating stable behavior for RFID communication. The antenna has a compact size of 1 × 10cm for 902-928 MHz RFID band.

20.

Amin, Yasar

et al.

KTH, School of Information and Communication Technology (ICT), Electronic Systems.

Kanth, Rajeev Kumar

Turku Centre for Computer Science (TUCS).

Liljeberg, Pasi

Turku Centre for Computer Science (TUCS).

Chen, Qiang

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Zheng, Lirong

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Tenhunen, Hannu

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

In this paper, we demonstrate an RFID tag antenna manufactured by advanced inkjet printing technology on paper substrate using novel hole-matching technique for reducing the consumption of substrate material and conductive ink while attaining green RFID tags. In-depth electromagnetic analysis is performed methodologically for optimizing the parameters that effectuate the antenna dimensions. The antenna design is optimized for consistent wideband performance and extended read range throughout the complete UHF RFID band (860-960MHz), while exhibiting benchmarking results when n across cardboard cartons filled with metal or water containing objects.

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Kumar Kanth, Rajeev

University of Turku, Finland.

Liljeberg, Pasi

University of Turku, Finland.

Chen, Qiang

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Zheng, Lirong

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Tenhunen, Hannu

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

This paper presents performance optimized RFID tag antenna, developed by using commercially accessible paper substrates and advanced inkjet printing process to guarantee mechanical flexibility and ultra-low production costs. The proposed antenna structure can endure the variations which emerge in electromagnetic properties of paper substrate due to varying environmental effects. Hole-matching technique is implemented to eliminate the matching network for reducing the consumption of conductive ink. The proposed structure is uniquely evaluated by demonstrating, sustainability and environmental impact analysis that validate the potential for ultra-low cost mass production of RFID tags for future generation of organic electronics. The antenna performance is assessed for cardboard cartons exclusively containing metal cans and water bottles. The experimental characterization of the proposed antenna endorses the wider bandwidth to cover UHF RFID ISM band (860-960MHz), which empowers its usage throughout the globe for supply chain applications. The improved design effectuates return loss of better than -15dB over a wide frequency range while exhibiting outstanding readability from 10.1 meters.

22.

Amin, Yasar

et al.

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.

Prokkola, Satu

Shao, Botao

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.

Hållstedt, Julius

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Chen, Qiang

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.

Radio frequency identification (RFID) antenna's versatility in terms of complete coverage of UHF RFID band (860-960 MHz), while keeping the cost factor low, is an important aspect of today's growing demand for security and tracking of multiple objects in a very short time in addition to tag's readability across the globe. This paper presents a novel inkjet printed rounded corner bowtie antenna with T-matching stubs on paper substrate which is the cheapest and widest available substrate. The antenna exhibits compact size with outstanding read range.

23.

Amin, Yasar

et al.

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.

Prokkola, Satu

Shao, Botao

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.

Hållstedt, Julius

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Microelectronics and Applied Physics, MAP.

Tenhunen, Hannu

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.

Zheng, Li-Rong

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS.

Paper substrate is one of the paramount nominees for Radio Frequency Identification (RFID) tags, for the reason that it is one of the widely and the cheapest available substrates. In this paper, for the first time quadrate bowtie antennas with round corners [1] are realized and analyzed on paper substrate for UHF RFID tags. These inkjet printed antennas exhibit high performance which give freedom for their applications. Their area is smaller than the general triangle bowtie antenna and have advantages of smaller area, better return loss in high frequency and higher gain in normal direction of antenna plane compared with general triangular bowtie antenna.d

24.

Amin, Yasar

et al.

University of Engineering and Technology, Taxila, Punjab, Pakistan.

Shao, Botao

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Chen, Qiang

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Zheng, Li-Rong

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Tenhunen, Hannu

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

This article demonstrates in-depth electromagnetic analysis of a radio frequency identification tag antenna manufactured by inkjet printing technology on different paper substrates to achieve ultra-low cost flexible radio frequency identification tags using a novel hole-matching technique for reducing the consumption of substrate material, and conductive ink. Nevertheless, the electromagnetic properties of the paper substrate are vulnerable to various environmental effects. Thus, the proposed antenna design is optimized for consistent wideband performance throughout the complete UHF radio frequency identification band (860960 MHz) while presenting a greater degree of material insensitivity. An advanced antenna design methodological analysis is performed to accomplish an extended read range, while exhibiting benchmarking results when across cardboard cartons filled with metal or water containing objects.

In this paper meander line antennas with end tip loading, designed for UHF RFID tags are presented. These novel antennas are screen printed on Kapton HN for European frequency band (866-868 MHz) and for North American frequency band (902-928 MHz). Asahi ink is used for screen printing of 25 mu m thick antenna traces which remains conductive even after several times sharp bending of these tag antennas. The results show that the antennas exhibit high performance regarding smaller area, high realized gain and better return loss in the frequency band of interest. These antennas are extremely flexible which give autonomy for their applications.

Next generation wireless communications terminals will demand the use of advanced component integration processes and high density packaging technologies in order to reduce size and to increase performance. This paper presents high density multilayer interconnects and integrated passives used to design high performance prototype filter for 5GHz wireless LAN receiver realized on MCM-D substrate. The thin film implementation of Multichip Module technology is identified as a useful platform for the integration of GaAs MMIC and silicon device technologies for microwave applications where performance, size and weight are critical factors. The ability of the MCM-D technology to provide controlled impedance, microstrip structures and integrated thin film passive components with useful performance in the microwave frequency regime has now been demonstrated.

27.

Amin, Yasar

et al.

KTH, School of Information and Communication Technology (ICT), Microelectronics and Information Technology, IMIT.

Tenhunen, Hannu

KTH, School of Information and Communication Technology (ICT), Microelectronics and Information Technology, IMIT.

Jamal, Habibullah

Zheng, Li-Rong

KTH, School of Information and Communication Technology (ICT), Microelectronics and Information Technology, IMIT.

Duo, Xinzhong

KTH, School of Information and Communication Technology (ICT), Microelectronics and Information Technology, IMIT.

Next generation wireless communications terminals will demand the use of advanced component integration processes and high density packaging technologies in order to reduce size and to increase performance. This paper presents highdensity multilayer interconnects and integrated passives used to design high performance prototype filter for 5GHz wireless LAN receiver realized on liquid crystal polymer (LCP) substrate. The thin film implementation of Multichip Module technology is identified as a useful platform for the integration of GaAs MMIC and silicon device technologies for microwave applications where performance, size and weight are critical factors. The ability of the MCM-D technology to provide controlled impedance, microstrip structures and integrated thin film passive components with useful performance in the microwave frequency regime has now been demonstrated.

29.

Ansari, Muhammad Adeel

et al.

KTH, School of Information and Communication Technology (ICT).

Ahmad, Waqar

KTH, School of Information and Communication Technology (ICT), Electronic Systems.

Chen, Qiang

KTH, School of Information and Communication Technology (ICT), Electronic Systems.

Zheng, Lirong

KTH, School of Information and Communication Technology (ICT), Electronic Systems.

A high voltage charge pump design is being presented in this paper. The design is based on Dickson charge pump, constructed with diodes by using AMS 0.35μm technology. The innovation is made in Dickson charge pump i.e. charge control PMOS transistor is used in each stage of charge pump. PMOS transistor is used in series with charging capacitor which reduces the power consumption during the clock transition by controlling the time constant of each stage. The resistance between drain to source of PMOS transistor increases the time constant during the charging of the capacitor placed in each stage of charge pump. The output voltage of about 5.693V is achieved by the six stages of Dickson charge pump at no-load which reduces to 5.537V with the six stages of proposed charge pump but the power during the input clock transition is reduced from 340.5μw (consumed by Dickson charge pump) to 28.85 μW (consumed by the proposed modified charge pump). Some other results are also discussed in this paper, which are achieved on different load resistances.

This paper presents a direct conversion RF receiver front-end supporting the WiMAX standard. The front-end is implemented in 0.18um CMOS technology and designed using the ARCHER software. It shows how the design flow can be accelerated starting from the standard specifications and going down to schematics. All this is accompanied by test benches to extract the relevant metrics. This front-end provides a total gain of 31dB, a noise figure of 3.3dB, an IIP2 of 49.5dBm, and an IIP3 of -13.8dBm.

In this work, a 10 Mb/s impulse UWB RFID tag in 0.18 mum CMOS is presented. The tag is remotely powered by a UHF signal with a minimum input RF power as low as 14.1 muW. The primary innovation is to employ two different communication links (UWB and UHF) respectively in the uplink and downlink of the tag. This is because the amount of data or instructions from a reader to a tag is small and as a result a conventional UHF-RFID link at 900MHz can be used as the downlink. The UHF signal also provides remote power to the tag. The uplink requires higher data rates and precise positioning capability therefore an l-UWB transmitter is employed.

In this paper, we describe an impulse-based ultra wideband (UWB) radio system for wireless sensor network (WSN) applications. Different architectures have been studied for base station and sensor nodes. The base station node uses coherent UWB architecture because of the high performance and good sensitivity requirements. However, to meet complexity, power and cost constraints, the sensor module uses a novel non-coherent architecture that can autonomously detect the UWB signals. The radio modules include a transceiver block, a baseband processing unit and a power management block. The transceiver block includes a Gaussian pulse generator, a multiplier, an integrator and timing circuits. For long range applications, a wideband low noise amplifier (LNA) is included in the transceiver of the sensor module, whereas in short range applications it is simply eliminated to further reduce the power consumption. In order to verify the proposed system concept, circuit level implementation is studied using 1.5 V 0.18 mu m CMOS technology. Finally, the UWB radio modules have been designed for implementation in liquid-crystal-polymer (LCP) based System-on-Package (SOP) technology for low power, low cost and small size integration. A small low cost, double-slotted, Knight's helm antenna is embedded in the LCP substrate, which shows stable characterization and a return loss better than -10 dB over the UWB band.

In this paper we present a self-powered CMOS ultra wideband radio transmitter integrated in a Liquid-Crystal Polymer (LCP) based System on Package (SoP) module with an embedded small antenna. Chip-package-antenna co-design is performed for this module in the presence of unwanted packaging parasitic effects and optimizes the transmission efficiency. Our contribution includes new modeling of the RF-package and antenna and co-optimizing the chip and package design with on-chip versus off-chip passives trade-offs. The Sop module consists of an innovative tunable low power CMOS transmitter for IR-UWB communication, a double-slotted small-size embedded UWB antenna, and a power converter. The output amplitude and duration of the transmitter can be tuned to transmit a signal meeting the FCC mask in different pulse repetition rate for long and short range applications. This ability can also be used to compensate the process and temperature variations as well as the parasitic effects of packaging and antenna. The antenna has a return loss of better than -10dB. The power converter consists of a chain of surface mounted shottkey diodes and capacitors, which converts incident electromagnetic waves to DC supply and thus power up the transmitter. The final module is implemented in LCP substrate with integrated passive components and embedded antenna. The chip part is implemented in 0.18um CMOS process.

In this paper, the benefit of a co-design between a modified small-size Printed Tapered Monopole Antenna (PTMA) and an Impulse Ultra Wideband transmitter Is Investigated for the 3.1-10.6GHz bond. A comparison is given between a 50 Omega design and a co-designed version. The simulation results show that with the co-design method the tunable UWB transmitter can reach the bandwidth regulation for a much smaller antenna.

Ultra wideband radio is an emerging wireless standard that uses sub-nanosecond pulses to transmit data, resulting in several GHz bandwidths. The problem of generating a synchronized template respect to the received signal grows in complexity as the signal bandwidth increases. In this paper, an innovative, low cost, non-coherent receiver architecture is proposed for autonomous detection of ultra wideband signals. The new receiver will self-generate a synchronous template and hence, no transmitter-reference synchronizer is required. We validate its performance via simulations compared with coherent receivers and conventional non-coherent receivers, the new architecture is found much more robust to timing noise and hence greatly facilitates the synchronise problem in UWB receiver.

In this paper, we present a novel passive CMOS module which uses two different standards in uplink and downlink. It can be used in many applications such as Radio Frequency Identification (RFID), and ubiquitous wireless sensing. Such as conventional RFID systems, the module captures power supply from received RF signal transmitted by a reader and extracts data and clock by using an envelope detector and PIE encoder. However, in uplink instead of back scattering, an Impulse-UWB transmitter is used to improve the system performance and throughput. The UWB communication offers several advantages to the system. A new communication protocol is proposed for the system based on slotted-ALOHA anti-collision algorithm. The module consisting of a power management unit, an RF narrowband receiver, a clock management unit, an IR-UWB transmitter, and a digital baseband are designed in 0.18 CMOS process.

In this paper, we present a radio-powered module with asymmetric wireless link utilizing ultra wideband radio system for RFID and wireless sensor applications. Our contribution includes using two different standards in uplink and downlink. Such as conventional RFIDs, incoming RF signal transmitted by reader is used to power the internal circuitry and receive the data. However, in upstream link, an IR-UWB transmitter is utilized. Unlike traditional RFID systems, due to great advantages of UWB communication, this tag is very robust to multi-path fading and collision problem and it is more secure against eavesdropping or jamming. The module consists of a power scavenging unit, a RF receiver, an IR-UWB transmitter, digital baseband controller, and an embedded UWB antenna are designed for integration on Liquid-Crystal Polymer (LCP) substrate, using 0.18um CMOS process technology.

39.

Baghaei-Nejad, Majid

et al.

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.

Radiom, S.

Vandenbosch, G.

Zheng, Li-Rong

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.

In this paper we present a power management and a clock generator for a novel passive UWB tag. It can be used in many applications such as Radio Frequency Identification (RFID), and ubiquitous wireless sensing. As same as conventional RFID, the tag captures the power from the incoming RF signal, converts to DC and stores it in a relatively big capacitor. A voltage sensor and a regulator provide stable voltage for the whole circuitry during operation mode. A clock circuitry generates a low jitter and low skew clock for ultra wideband transmitter to transmit data. In such passive system the power consumption of each block should be as low as possible. On the other hand, performance degradation across process, voltage, and temperature variation (PVT) is another problematic challenge in low power and low cost circuit implementation. In this work, the power management unit including of an RF power scavenging, a voltage sensor, a low drop out regulator and a clock generator are designed and their performance across PVT variation are analyzed. The module is designed and is fabricated in CMOS 0.18 mu m technology.

41.

Baghaei-Nejad, Majid

et al.

Sabzevar Tarbiat Moallem University, Sabzevar, Iran.

Zheng, Li-Rong

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.

A low cost and precise localization system based on a remote-powered UWB-RFID tag is presented for wireless identification, sensing, positioning and tracking. Our contribution is to utilize the Impulse Radio Ultra wideband (IR-UWB) communication in aRFID system. Such as conventional RFIDs, a tag captures energy from the received RF signal transmitted by a reader which also carries data and clock. However, instead of backscattering, an Impulse-UWB transmitter is used. By a low power design operation distance of 13.9 meters is achieved. A network consist of several readers provide power and retrieve data from the tags in a wide area. Due to the fine time resolution of the ultra-short pulse in IR-UWB, the UWB receiver in the readers are able to accurately approximate the time of arrival of the signal and based on the time-difference-of-arrival algorithm the position of the tag can be estimated precisely. In the line-of-sight scenario by a two-step acquisition system, ±16.8cm accuracy can be achieved. By a new communication protocol proposed based on slotted-ALOHA anti-collision algorithm, 2000 tags per second can be read. The tag circuitry is designed and implemented in CMOS 180nm technology in a single chip solution.

42. Bao, D.

et al.

Zou, Zhuo

KTH, School of Information and Communication Technology (ICT), Industrial and Medical Electronics. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Huan, Y.

Zhai, Chuanying

KTH, School of Information and Communication Technology (ICT), Industrial and Medical Electronics. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Bagaian, T.

Tenhunen, Hannu

KTH, School of Information and Communication Technology (ICT), Industrial and Medical Electronics. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Källbäck, B.

Zheng, Lirong

KTH, School of Information and Communication Technology (ICT), Industrial and Medical Electronics. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. State Key Laboratory of ASIC and System, Fudan University, Shanghai, China .

This paper demonstrates a smart catheter system with intracranial pressure (ICP) and temperature sensing capability which is designed for real-time monitoring in traumatic brain injury (TBI) therapy. It uses a single flexible catheter with a 1 mm (3 Fr) diameter that integrates electrodes and sophisticated silicon chip on flexible substrates, enabling multimodality monitoring of physiological signals. A micro-electromechanical-system (MEMS) catheter pressure sensor is mounted on the distal end. It can be used for detecting both pressure and temperature by different switch configurations, which minimizes the size of catheter and reduces the cost. The interconnects (signalling conductors) are printed on a bio-compatible flexible substrate, and the sensor is interfaced with an embedded electronic system at the far-end. The electronic system consists of analog front end with analog-to-digital converter (ADC), a microcontroller, and data interface to the hospital infrastructure with a graphical user interface (GUI). The overall smart catheter system achieves a pressure sensing root mean square error (RMSE) of ±1.5 mmHg measured from 20 mmHg to 300 mmHg above 1 atm and a temperature sensing RMSE of ±0.08°C measured from 32°C to 42°C. The sampling rate can be up to 10S/s. The in vivo performance is demonstrated in laboratory animals.

KTH, School of Information and Communication Technology (ICT), Industrial and Medical Electronics. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Wang, Q.

Nejad, Majid Baghaei

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Zheng, Li-Rong

KTH, School of Information and Communication Technology (ICT), Industrial and Medical Electronics. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. Fudan University, China.

This paper presents a wirelessly-powered sensor tag with a time-domain sensor interface for wireless sensing applications. The tag is remotely powered by RF wave. Instead of traditional approaches employing conventional ADCs for quantization and transmitter for data communication, in this work, a Pulse Position Modulator incorporating simple impulse radio UWB (IR-UWB) transmitter is proposed to convert and transmit the analog sensing information in time domain. The analog signal is compared with an adjustable triangular wave for analog to time conversion in signal-varying environments. Then a UWB transmitter converts the PPM signal to very short pulses and sends it back to the reader. The time interval of UWB pulses represents the original input signal in time domain which can be measured on the reader side by a time-to-digital conversion. This approach not only simplifies the ADC design but also relaxes the number of bits transmitted on the tag side. The sensor tag is designed in 180nm CMOS process. Simulation results demonstrate that the proposed approach reduce transmission power consumption by nearly 3 orders of magnitude over traditional approaches, while consuming only 85 μW for 1.5 MS/s sampling rate.

This paper presents a wirelessly powered radio frequency identification sensor tag with an analog-to-information interface. A time-domain interface, incorporating an ultra-lowpower impulse radio ultra-wideband (IR-UWB) transmitter (TX), is employed. The analog signal from the sensor is compared with a triangular waveform, resulting in a pulse-position modulation signal to trigger UWB pulses. Thanks to the high time-resolution IR-UWB radio, time intervals of the impulses can be used to represent the original input value, which is measured remotely on the reader side by a time-of-arrival estimator. This approach not only eliminates the analog-to-digital converter (ADC) but also significantly reduces the number of bits to be transmitted for power saving. The proposed tag is fabricated in a 0.18-mu m CMOS process with an active area of 2.5 mm(2). The measurement results demonstrate that a 300-kS/s sampling rate with a 6.7-bit effective number of bits (ENOB) is obtained via a UWB receiver with a sensitivity of -93 dBm and an integration window of 10 ns. The ENOB is improved to 7.3 bits when the integration window is reduced to 2 ns. The tag can be powered up by a -18-dBm UHF input signal. The power consumption of the proposed tag is 41.5 mu W yielding a 1.3-pJ/conv.step figure of merit, offering 9x and 67x improvements compared with the state of the art based on an ADC and a backscattering TX, and the tag based on an ADC and a narrowband TX, respectively.

This paper is an investigation of off-chip solution of power converters for passive UHF RFID transponders. The power converter, consisting of a chain of schottky diodes and capacitors, is designed and then implemented on Rogers4350 PCB substrate. The ISM unlicensed frequency bands 915 MHz is used for RF signal. The deembedded measurement results show that with minimum input power of -4.7dBm, the power converter achieves 1.8V/5 mu A output driving capability, which is sufficient for the transponder operation. It corresponds to a 3.6m operating distance when 4-W EIRP radiation is allowed.

This paper is an investigation of off-chip solution of power converters for passive UHF RFID transponders. The power converter, consisting of a chain of schottky diodes and capacitors, is designed and then implemented on Rogers4350 PCB substrate. The ISM unlicensed frequency bands 915 MHz is used for RF signal. The measurement results show that with minimum input power of -4.7dBm, the power converter achieves 1.8V/ 5 mu A output driving capability, which is sufficient for the transponder operation. It corresponds to a 3.6m operating distance when 4-W EIRP radiation is allowed.

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.

Jonsson, Fredrik

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.

Carlsson, Mats

Hedenas, Charlotta

Zheng, Li-Rong

KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK. KTH, School of Information and Communication Technology (ICT), Electronic Systems.

A low power and robust class-C voltage-controlled oscillator (VCO) is presented in this letter. It features 1) an automatic startup loop to achieve the optimal point and address the inherent risk of startup failure and 2) a digital amplitude control loop to stabilize amplitude and enhance the PVT ( process, voltage and temperature) tolerance. The design is implemented in a 0.18 mu m CMOS process. Measurement demonstrates the VCO has a 20% tuning range and phase noise of -123.0 dBc/Hz at 1 MHz offset from a 3.1 GHz carrier while consuming 1.57-mW power from a 1 V supply, yielding a Figure-of-Merit (FoM) of 191.1. While operating under the minimum power of 560 mu W, it produces -111.3 dBc/Hz phase noise at 1 MHz offset from a 3.1 GHz carrier showing a 183.8 FoM.

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Jonsson, Fredrik

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Carlsson, Mats

Hedenäs, Charlotta

Zheng, Li-Rong

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Flicker noise upconversion mechanisms in oscillators have been acquired in the literature, however their relative weights are still under investigation. It is desirable to find the dominant one, since a certain noise suppression method reduces one mechanism but may increase another. In this work, we propose a systematic simulation method to distinguish their relative impacts. The outcome indicates parasitic capacitance is the dominant factor for both tail 1/f noise and switch pair 1/f noise upconversions, implying to use small dimension core devices. Design guidelines on sizing devices are presented and two suppression techniques are compared. Two voltage-controlled oscillators (VCOs) with these suppression techniques are fabricated in a 0.18 mu m CMOS process, allowing us to compare their performance. The two VCOs can be Focused-Ion-Beam (FIB) trimmed to change the width of switch pair FETs. The fair comparison of measurement results among them verify the dominant role of parasitic capacitance in 1/f noise upconversion. The measurement results also confirm the design guidelines and demonstrate the difference of two suppression methods.

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Jonsson, Fredrik

Carlsson, Mats

Hedenäs, Charlotta

Zheng, Li-Rong

KTH, School of Information and Communication Technology (ICT), Electronic Systems. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

This work investigates the impact of device sizingon phase noise in CMOS LC-tank oscillators, based on specificdesigns and careful measurements. It experimentally verified thepreviously published equations and clarified some conflictingdesign guidelines. The conclusions are grounded on the faircomparison of seven VCOs with the core device width varyingfrom 40 um to 280 um. These VCOs are originated from the samedie by using Focused Ion Beam (FIB), guaranteeing the sameorder of process variation. With the aid of a switched capacitorbank, they are able to operate at practically same oscillationfrequency under the same bias. These conditions assure the faircomparison. It validated that phase noise from tail devices isstrongly dependent to core device size (14 dB from measurements)while phase noise from core devices themselves shows smallerdependence (4 dB). Design guidelines, applying to different tailnoise cases, are concluded and generally advise the minimumcore device width especially when tail noise is dominant.

50.

Chen, Jian

et al.

KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.

Jonsson, Fredrik

KTH, School of Information and Communication Technology (ICT), Electronic, Computer and Software Systems, ECS. KTH, School of Information and Communication Technology (ICT), Centres, VinnExcellence Center for Intelligence in Paper and Packaging, iPACK.