The ConFab 2017 announces leading semiconductor industry keynotes

The ConFab – an exclusive conference and networking event for semiconductor manufacturing and design executives from leading device makers, OEMs, OSATs, fabs, suppliers and fabless/design companies – announces Keynotes in the May 14-17 event being held at the Hotel del Coronado in San Diego.

The ConFab 2017 is excited to welcome these distinguished Keynote speakers: Hans Stork, Senior Vice President and Chief Technical Officer at ON Semiconductor; Mohan Trivedi, Distinguished Professor of Electrical and Computer Engineering and founding director of the Computer Vision and Robotics Research Laboratory, as well as the Laboratory for Intelligent and Safe Automobiles at the University of California San Diego; Dr. Alissa Fitzgerald, Founder and Managing Member of A.M. Fitzgerald & Associates, and Bill McClean, President of IC Insights.

Hans Stork, Senior Vice President and Chief Technical Officer at ON Semiconductor

Mohan Trivedi, Distinguished Professor of Electrical and Computer Engineering and founding director of the Computer Vision and Robotics Research Laboratory

Mohan Trivedi, Distinguished Professor of Electrical and Computer Engineering and founding director of the Computer Vision and Robotics Research Laboratory

“The five hottest areas for semiconductor growth in the coming years are the Internet of Things (IoT), automotive, 5G, virtual reality/augmented reality (VR/AR), and artificial intelligence (AI). The ConFab 2017 program will take a close look at the challenges of these applications in the semiconductor industry, not just on the microprocessor and memory side, but on the MEMS, sensor, display, power and analog side. Many new innovations in packaging will also addressed,” said Pete Singer, Conference Chair of The ConFab and Editor-in-Chief of Solid State Technology.

In addition to our great Keynotes, the 2017 Agenda brings together sessions on heterogeneous integration and advanced packaging, starting with a talk from Islam Salama, Director with Intel, followed by Bill Chen, ASE Fellow, and Jan Vardaman, President of TechSearch. Siemens will speak on Smart Manufacturing, which will encompass the Industrial Internet of Things (IIoT). A panel discussion on Advanced Packaging will be moderated by Vinayak Pandey, Vice President of STATS ChipPAC with additional sessions that will focus on MEMS and sensors. Speakers include Kevin Shaw, CTO and Founder of Algorithmic Intuition and J.C. Eloy, President and CEO of Yole Développement. Another panel will look into the coming opportunities and changes in a range of diverse markets, including MEMS and Sensors, power electronics, biomedical, LEDs, displays and more. Those panelists include Valerie Marty of Connected Micro, Laura Rothman Mauer of Veeco, David Butler of SPTS and Mike Rosa of Applied Materials. Jason Marsh of NextFlex will provide an update on flexible electronics on Wednesday.

The ConFab is a high-level conference for decision-makers and influencers to connect, innovate and collaborate in multiple sessions, one-on-one private business meetings, and other networking activities. For more information, visit www.theconfab.com.

About The ConFab

The ConFab is the premier semiconductor manufacturing conference and networking event bringing over 200 notable industry leaders together. The ConFab is owned and produced by Extension Media and hosted by Pete Singer, Solid State Technology’s Editor-in-Chief, and Conference Chair. To inquire about participating – if you represent an equipment, material or service supplier, contact Kerry Hoffman, Director of Sales, at khoffman@extensionmedia.com. To inquire about attending, contact Sally Bixby, Sr. Events Director at sbixby@extensionmedia.com

FEATURED PRODUCTS

TECHNOLOGY PAPERS

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018Sponsored by Mentor Graphics

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017Sponsored by National Instruments

WEBCASTS

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.