SMART Modular Technologies announces its load-reduced 64GB DDR3 DIMM

The 64GB LRDIMM will launch sometime during Q2’12 and will be aimed to be used for scientific, engineering and financial computing applications that require high memory capacity and performance. Not only is it optimized for high-end server use, this product is specifically targeting next-generation Intel Sandy Bridge and Ivy Bridge server platforms for high-performance computing applications.

Combining innovative module packaging technology, the new LRDIMM leverages off-the-shelf commodity DRAMs to provide the industry’s highest density LRDIMM at the lowest possible cost. Thanks to the company’s design expertise, this product uses a single JEDEC-compliant memory buffer chip, a dual PCB structure as well as a leading edge interconnect technology in order to give maximum performance and density while achieving server-grade quality and reliability.

“We are very pleased to offer OEMs an industry-standard 64GB LRDIMM solution that enables them to run their servers at the maximum memory capacity and performance,” said Mike Rubino, SMART Modular’s VP of Engineering. “We are equally pleased to offer this solution at a competitive price by combining best-of-class technology with commodity DRAM components.”

With this solution, designers can populate all of the memory sockets in a system up to their maximum density while operating at the highest data rates. SMART Modular’s 64GB LRDIMM is configured as 4Gx72 with eight ranks using 8Gb x4 DDP DRAMs running at DDR3-1333. Through rank multiplication, the LRDIMM can enable more ranks of DRAMs to be populated on the memory module and be seamlessly accessed by the CPU memory controller.

Currently under evaluation by multiple OEMs, the new LRDIMM’s volume production is expected to start in Q2’12, joining SMART Modular’s DDR3 product lineup, one of the most comprehensive in the industry.