Tue, 08.02.11

Texas Instruments announces OMAP 5 processors

Texas Instruments has announced the OMAP 5 platform. And it's "not just a faster horse", it transforms the concept of 'Mobile'. The OMAP 5 platform sports an impressive list of features and benefits supporting everything from open source platforms to complementary TI technologies, including:

Two ARM Cortex-A15 cores, up to 2 GHz each - 3x higher performance to deliver the promise of mobile computing

The 28 nanometer OMAP 5 applications processors carry on the OMAP family tradition of delivering significant increases in performance and functionality, while lowering power consumption compared to their predecessors. Specifically, they offer up to 3x processing performance and five-fold 3D graphics improvement, yet provide a nearly 60 percent average power reduction compared to a sample user experience on the OMAP 4 platform. Additionally, the OMAP 5 platform's software is designed for maximum reuse to ease migration from the OMAP 4 platform.

The OMAP 5 processor leverages two ARM Cortex-A15 MPCores – the most advanced ARM architecture to date – capable of speeds of up to 2 GHz per core in the OMAP 5 implementation. With a 50 percent boost in performance over the Cortex-A9 core (at the same clock frequency), combined with up to 8 GB of dynamic memory access and hardware virtualization support, the Cortex-A15 core can enable true mobile computing experiences, such as the ones referenced above.

The OMAP 5 architecture utilizes an intelligent combination of many different processing cores – each tailored and power-optimized for specific functions – and all harmonized to provide the best possible user experience. In addition to the two Cortex-A15 cores, the OMAP 5 processor includes individual, dedicated engines for: video, imaging and vision, DSP, 3D graphics, 2D graphics, display and security. The processor also includes two ARM Cortex-M4 processors for offloading real-time processing from the Cortex-A15 cores to improve low-level control and responsiveness of mobile devices.

The OMAP 5 processor can support up to four cameras in parallel, as well as record and play back S3D video in 1080p quality, and perform real-time conversion of 2D content to S3D at 1080p resolution. The new processor can also deliver advanced short- and long-range gesturing applications, as well as full-body and multi-body interactive gestures, utilizing either 2D or S3D cameras. The OMAP 5 processor, coupled with a TI DLP Pico projector and a camera, can also enable interactive projection where the user can actually "touch and drag" projected images on both a table top or wall.

Additionally, the OMAP 5 processor can interface with and leverage a wide variety of sensor technologies to enable touchless sensing, such as proximity sensing, capacitive sensing and ultrasonic sensing.

Today, most mobile devices are equipped with built-in cameras; however, due to the physical limitations of the device, picture and video quality is not on par with stand-alone consumer electronic products, such as digital SLR cameras. In order to close this quality gap, computational algorithms are used to compensate for these limitations. The OMAP 5 processor includes hardware and software resources that enable the development and deployment of such algorithms, such as camera stabilization, motion blur reduction, noise reduction, high dynamic range and face-based processing. The new processor also goes a step further by using the same OMAP 5 hardware resources with vision algorithms to extract features and data from the picture, in order to implement applications such as face recognition, object recognition and text recognition. These vision capabilities can also be used as the foundation for many different and exciting augmented reality applications.

TI's OMAP 5 platform is expected to sample in the second half of 2011, with devices on the market in the second half of 2012. The OMAP5430 processor is offered in a 14x14mm Package-on-Package (PoP) with LPDDR2 memory support. The OMAP5432 processor is offered in a 17x17mm BGA package with DDR3/DDR3L memory support.

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