For further information please email the company at info@htmicro.com.
It is the policy of HT Micro to provide equal employment opportunity (EEO) to all persons regardless of age, color, national origin, citizenship status, physical or mental disability, race, religion, creed, gender, sex, sexual orientation, gender identity and/or expression, genetic information, marital status, status with regard to public assistance, veteran status, or any other characteristic protected by federal, state or local law.

Products

HT Micro is leading the way to replace conventionally manufactured switches, connectors, and machined parts with the smallest, most reliable metal microfabricated products in the world. The Company’s array of integrated micro-devices employ proprietary LIGA processes, metal materials, high aspect ratio manufacturing, and wafer level parallel processing to achieve rugged, high performance, miniaturized solutions for the medical, military, industrial, and consumer electronics applications.

HT's inertial sensors passively sense acceleration thresholds. The HT sensor is the smallest of its type and can withstand over 100,000 Gs of acceleration. While this extreme shock resilience is the hallmark of the devices reliability, the sensor also boasts a sensitivity range for acceleration ranges of 2 to 5,000 Gs.
The primary application for the inertial sensor is in aerospace and defense applications. In particular, the sensor is a key component in the Department of Defense objective to supply a portfolio of precision munitions that are reliable and safe to the warfighter, results in less collateral damage, and eliminates unexploded ordnance (UXO).
HT's inertial switch is qualified for DoD applications and, with an area of 3.4 mm2, replaces conventional products that are significantly larger.

Application Notes

Rosenberger and HT Micro teamed up in 2013 to develop the next generation of connectors that will power the increasing demands for high fidelity, high bandwidth data transmission. HT offers several interposer products that help customers enable high speed connections for RF solutions. HT's innovative and advanced technology delivers reduced form factor while maintaining the standard performance requirements related to compression and retention forces, RF fidelity, and carry current requirements.

Product Information

Technology

Precision

The ability to maintain tolerances at small dimensions is at the core of HT's products and processes. HT's expertise is in developing fabrication processes for precision with critical dimensions while maintaining a low cost process. Milling, drilling, and other machining techniques are being replaced with HT's core microfabrication techniques - lithography, thick plating, batch processing, wafer level packaging and testing.

High Aspect Ratio Manufacturing

HT Micro employs high aspect ratio, metal based processes, to fabricate MEMS sensors, switches, and components that are made of metal. These processes enable production of complex three dimensional mechanisms while maintaining tolerances in the sub-millimeter range. The technology's advantage comes from the ability to perform wafer level processing within a very broad range of materials. The technology for wafer level processing is well known in the IC industry; however, precision mechanical fabrication in a wide variety of metals is not. HT Micro has advanced processes that enable miniaturization of magnetic and mechanical switch components without sacrificing performance. HARM allows for designs with an out of the plane feature height considerably greater than the width of the feature. This aspect ratio creates more area for flexures employed in mechanical designs. Reliability is the benefit of the high aspect ratio fabrication.

Wafer Level Packaging

HT's processes enable product designs with the unique value-added benefit of directly packaging on the wafer. The self packaging methodology lends itself directly to hermetically sealed components which are rugged enough for many military and industrial applications. The components have the ability to withstand extreme temperature variations, vibration, and g-forces.
Batch microfabrication supports wafer level packaging, avoiding expensive and time consuming back end of line assembly and testing. The costs of microfabricating a device is highly dependent on device footprint and final packaging.

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