Sputtering process can be used for depositing thin films from a wide range of materials on to different substrates. Although process parameters make sputtering a complex process, they allow a greater degree of control over the film’s growth and structure.

Radio frequency (RF) sputtering is a technique that is used to create thin films, such as those found in the computer and semiconductor industry

DC magnetron sputtering is one of several types of sputtering, which is a method of physical vapor deposition of thin films of one material onto another material

Magnetron sputtering is a type of physical vapor deposition, a process in which a target material is vaporized and deposited on a substrate to create a thin film

Plasma sputtering is a technique used to create thin films of various substances. During the plasma sputtering process, a target material, in the form of a gas, is released into a vacuum chamber and exposed to a high intensity magnetic field.

Reactive sputtering for compound thin films: The sputtering process is often used to deposit metal thin films.To make sputtered metal thin films we just run the sputtering process in an inert gas (usually Argon).To make a compound thin film (such as SiO2, AlN, TiC) by reactive sputtering we add the appropriate reactive gas to the sputtering process.

There are many different ways to deposit materials such as metals, ceramics, and plastics onto a surface (substrate) and to form a thin film. Among these is a process called “SPUTTERING” that has become one of the most common ways to fabricate thin films. Sputtering is a physical vapor deposition (PVD) process used for depositing materials onto a substrate, by ejecting atoms from such materials and condensing the ejected atoms onto a substrate in a high vacuum environment.

What is Sputtering Targets ?

A sputtering target is a material that is used to create thin films in a technique known as sputter deposition, thin film deposition. During this process the sputtering target material, which begins as a solid, is broken up by gaseous ions into tiny particles that form a spray and coat another material, which is known as the substrate. Sputter deposition is commonly involved in the creation of semiconductors and computer chips. In order to obtain the required characteristics in a sputter deposited thin film, the production process utilized to build the sputtering target can be of significant importance. Regardless of the fact that the target material has an element, mixture of elements, compound, or alloys are available that create hardened thin coatings for various tools. the process undertaken to create that defined material, which is ideal for sputtering thin films of uniform quality, is equally important as the deposition run parameters perfected by scientists and engineers dealing in thin film processes.

Depending on the nature of the thin film being created, sputtering targets can very greatly in size and shape. The smallest targets can be less than one inch (25.4mm) in diameter, while the largest rectangular targets reach well over 1500mm in length. Some sputtering equipment will require a larger sputtering target and in these cases, manufacturers will create segmented targets that are connected by special joints.

The designs of sputtering systems, the machines that conduct the thin film deposition process, have become much more varied and specific. Accordingly, target shape and structure has begun to widen in variety as well. The shape of a sputtering target is usually either rectangular or circular, but our TYR (allelem76@gmail.com) can create additional special shapes upon request. Certain sputtering systems require a rotating target to provide a more precise, even thin film. These targets are shaped like long cylinders, and offer additional benefits including faster deposition speeds, less heat damage, and increased surface area, which leads to greater overall utility.

Thin films that require pure metals for the target material will usually have more structural integrity if the target is as pure as possible, TYR (allelem76@gmail.com) can supply high pure metal targets purity as to 99.9999% for some material. The ions used to bombard the sputtering target are also important for producing a decent quality thin film. Generally, argon is the primary gas chosen to ionize and initiate the sputtering process, but for targets that have lighter or heavier molecules a different noble gas, such as neon for lighter molecules, or krypton for heavier molecules, is more effective. It is important for the atomic weight of the gas ions to be similar to that of the sputtering target molecules to optimize the transfer of energy and momentum, thereby optimizing the evenness of the thin film.