H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters

Abstract

PURPOSE: To mount a large number of elements having a low calorific value in three dimensions,and to ensure the cooling performance of a high-density integrated element by constructing the circuit of a substrate for a sidewall and a substrate for a ceiling as a rectangular tunnel and mounting the elements having the low calorific value to the substrate for the sidewall and the substrate for the ceiling.

CONSTITUTION: Both sides of a high heating element 2, to which a cooling pipe 4 and a cooling path are set up by a spring 4-1, are provided vertically with substrates 12 for sidewalls in parallel, and a substrate 13 for a ceiling is connected to the upper sections of the substrates 12 with solder 16, thus constructing a tunnel. The substrates 12 for the sidewalls and the substrate 13 for the ceiling are connected by flexible printed plates 14, and low heating elements 3 are mounted onto both surfaces of the substrates 12 for the sidewalls and the substrate 13 for the ceiling. Accordingly, the high heating element 2 is cooled by cold air in the tunnel into which the cooling path and the cooling pipe 4 shaped by the spring 4-1 are penetrated, and the low heating elements 3 can be mounted in three dimensions adjacent to the upper section and both side faces of the high heating element 2, thus allowing the miniaturization of a mother board 1 and cooling having excellent efficiency.