Operating Procedures

The YES prime oven dehydrates the wafers at 150ºC and primes the wafers using HMDS allowing better coverage and adhesion between oxides and resists.

It replaces the use of the 150ºC
singe oven and the HMDS step on the SVG track!

Wafers with resist, polymer, or any
organic film are NOT allowed!

You can use the YES oven if the sign reads EMPTY and the display RESET.

Don’t change the temperature! It should be 150ºC! Don’t change the program!

Don’t make reservations, first come first serve.

Wafers should be very dry prior going into the oven!

Check the maintenance page for comments, problems, or shutdown.

Check HMDS liquid level, the HMDS
tank is on the left side of the oven:

If less than three inches, report it and contact maintenance.

If less than two inches, shut it down and contact maintenance.

General Operating Procedure

Enable YES oven, light changes from red to green.

Use only the Teflon cassettes
with the two brown buttons!
There are two 4” cassettes in blue boxes, especially labeled for the Yes oven.
For pieces use the Teflon dish. There are 3“ and 6“ cassettes available too, one each, in white boxes.

NO boxes go into the oven!

Place the Teflon cassette in the oven and close the door.

Make sure the door is closed properly!

Turn
the sign around to read: IN USE

Press the START button.

The program runs for approximately 35 minutes.

If the pressure does not reach the set-point (1 to 1.2 Torr) within the first 13 to 15 minutes, there will be an alarm at Step 6.

Press the RESET button to silence the alarm, shutdown the YES oven, and contact Maintenance.

The door will be automatically blocked, don’t attempt to open it.

After the YES oven has finished running the program, there will be the final alarm: press RESET

The alarm will sound for five minutes if RESET is not pressed!

Open the door and carefully remove the Teflon cassette using a heat resistant glove!

The Teflon cassette expands a little
bit, it will not fit into the blue box right away. Place the cassette carefully in the box; the cassette will shrink within 2 to 3 minutes.

Close the oven door properly!

Turn the sign around to read: EMPTY

Disable YES oven, light changes from green to red.

Don’t remove the Teflon cassettes from this station.

If you are going to use the SVG coater, bring a metal
cassette to this station and transfer your wafers into the metal cassette.

If you plan to coat the wafers later, let the wafers cool down for 20 minutes before transferring them into a plastic storage cassette.

Problems & Emergencies

Report as problem:

broken wafer, particles

door seal comes off

Possible emergencies, shutdown:

pressure did not reach 1.2 Torr within 15 minutes (there will be an alarm)

something melted inside of oven (wafer box)

smell: HMDS, oil burning

unknown smell

N2 leak

YES Oven Process Programs

YES
Oven Process Program (
Do not change the following program! )

Step

Function

Data

Output

Operation / Comments

Process Description

01

L =

0003

Loop
Statement- Loop 3 times

Dehydration steps. The vacuum/nitrogen
steps ensure that the chamber is free of oxygen and humidity. This provides
an inert environment for vapor priming

02

M =

02:00

02

2 minutes
of vacuum

03

M =

01:07

01

67
seconds of nitrogen

04

L >

2

Loop
Statement- Loop back to step 02

05

M =

05:00

02

5 minutes
of vacuum

5 minutes of vacuum. This provides a stable
vacuum environment and allows the HMDS to vaporize into the chamber and
prime the wafers

06

IF D >

21

Vacuum
checkpoint- Did chamber reach setpoint?

Note: If the vacuum pressure does not
reach the setpoint, there will be an alarm. Press the RESET button and call
Maintenance!!! Do not try to open the door

07

L =

300

Loop
Statement- Loop 300 times

08

S =

01:00

03

1 second
pulse of HMDS valve

09

L >

8

03

Loop
Statement- Loop back to step 8

10

L =

0004

Loop
Statememt- Loop 4 times

These 4 vacuum/nitrogen cycles safely
removes any residual HMDS vapors and by-products. The process chamber returns
to a vented state which allows the door to open for substrate removal

11

M =

02:00

02

2 minutes
of vacuum

12

M =

01:09

01

67
seconds of nitrogen

13

L >

11

Loop
statement- Loop back to step 11

14

M =

03:00

00

End of
program routine

The end of cycle light and alarm are
initiated. Press reset and remove work from chamber

Inhalation:
Inhalation of vapors may be irritating to the nose and throat. Inhalation
of high concentrations may result in nausea, vomiting, headache, ringing in
the ears, and severe breathing difficulties which may be delayed in onset.
Substernal pain, cough, and hoarseness are also reported. High vapor
concentrations are anesthetic and central nervous system depressants.
Ingestion:
Ingestion causes burning sensation in mouth and stomach, nausea, vomiting
and salivation. Minute amounts aspirated into the lungs can produce a
severe hemorrhagic pneumonitis with severe pulmonary injury or death.
Skin Contact:
Skin contact results in loss of natural oils and often results in a
characteristic dermatitis. May be absorbed through the skin.
Eye Contact:
Vapors cause eye irritation. Splashes cause severe irritation, possible
corneal burns and eye damage.
Chronic Exposure:
Chronic inhalation can cause headache, loss of appetite, nervousness and
pale skin. Repeated or prolonged skin contact may cause a skin rash.
Repeated exposure of the eyes to high concentrations of vapor may cause
reversible eye damage. Repeated exposure can damage bone marrow, causing
low blood cell count. May damage the liver and kidneys.
Aggravation of Pre-existing Conditions:
Persons with pre-existing skin disorders or eye problems, or impaired
liver, kidney, blood, or respiratory function may be more susceptible to
the effects of the substance.

4. First Aid Measures

Inhalation:
Remove to fresh air. If not breathing, give artificial respiration. If
breathing is difficult, give oxygen. Call a physician immediately.
Ingestion:
Aspiration hazard. If swallowed, vomiting may occur spontaneously, but DO
NOT INDUCE. If vomiting occurs, keep head below hips to prevent aspiration
into lungs. Never give anything by mouth to an unconscious person. Call a
physician immediately.
Skin Contact:
Immediately flush skin with plenty of soap and water for at least 15
minutes while removing contaminated clothing and shoes. Get medical
attention. Wash clothing before reuse. Thoroughly clean shoes before
reuse.
Eye Contact:
Immediately flush eyes with plenty of water for at least 15 minutes,
lifting lower and upper eyelids occasionally. Get medical attention
immediately.

6. Accidental Release Measures

Ventilate area of leak or spill. Remove all sources of ignition. Wear
appropriate personal protective equipment as specified in Section 8.
Isolate hazard area. Keep unnecessary and unprotected personnel from
entering. Contain and recover liquid when possible. Use non-sparking tools
and equipment. Collect liquid in an appropriate container or absorb with an
inert material (e. g., vermiculite, dry sand, earth), and place in a
chemical waste container. Do not use combustible materials, such as saw
dust. Do not flush to sewer! If a leak or spill has not ignited, use water
spray to disperse the vapors, to protect personnel attempting to stop leak,
and to flush spills away from exposures. US Regulations (CERCLA) require
reporting spills and releases to soil, water and air in excess of
reportable quantities. The toll free number for the US Coast Guard National
Response Center is (800) 424-8802.

J. T. Baker SOLUSORB�
solvent adsorbent is recommended for spills of this product.

7. Handling and Storage

Protect against physical damage. Store in a cool, dry well-ventilated
location, away from any area where the fire hazard may be acute. Outside or
detached storage is preferred. Separate from incompatibles. Containers
should be bonded and grounded for transfers to avoid static sparks. Storage
and use areas should be No Smoking areas. Use non-sparking type tools and
equipment, including explosion proof ventilation. Containers of this
material may be hazardous when empty since they retain product residues
(vapors, liquid); observe all warnings and precautions listed for the
product. Do Not attempt to clean empty containers since residue is
difficult to remove. Do not pressurize, cut, weld, braze, solder, drill,
grind or expose such containers to heat, sparks, flame, static electricity
or other sources of ignition: they may explode and cause injury or death.

8. Exposure Controls/Personal Protection

Airborne Exposure Limits:
-OSHA Permissible Exposure Limit (PEL): 100 ppm (TWA) xylene 100 ppm (TWA) ethylbenzene -ACGIH Threshold Limit Value (TLV): xylene: 100 ppm (TWA) 150 ppm (STEL), A4 - Not classifiable as a human carcinogen. ethyl benzene: 100 ppm (TWA) 125 ppm (STEL), A3 - Confirmed Animal Carcinogen with Unknown Relevance to Humans.
Ventilation System:
A system of local and/or general exhaust is recommended to keep employee
exposures below the Airborne Exposure Limits. Local exhaust ventilation is
generally preferred because it can control the emissions of the contaminant
at its source, preventing dispersion of it into the general work area.
Please refer to the ACGIH document, Industrial Ventilation, A Manual of
Recommended Practices, most recent edition, for details. Use
explosion-proof equipment.
Personal Respirators (NIOSH Approved):
If the exposure limit is exceeded and engineering controls are not
feasible, a half-face organic vapor respirator may be worn for up to ten
times the exposure limit, or the maximum use concentration specified by the
appropriate regulatory agency or respirator supplier, whichever is lowest.
A full-face piece organic vapor respirator may be worn up to 50 times the
exposure limit, or the maximum use concentration specified by the
appropriate regulatory agency or respirator supplier, whichever is lowest.
For emergencies or instances where the exposure levels are not known, use a
full-face piece positive-pressure, air-supplied respirator. WARNING:
Air-purifying respirators do not protect workers in oxygen-deficient
atmospheres. Where respirators are required, you must have a written
program covering the basic requirements in the OSHA respirator standard.
These include training, fit testing, medical approval, cleaning,
maintenance, cartridge change schedules, etc. See 29CFR1910.134 for
details.
Skin Protection:
Wear impervious protective clothing, including boots, gloves, lab coat,
apron or coveralls, as appropriate, to prevent skin contact.
Eye Protection:
Use chemical safety goggles and/or a full face shield where splashing is
possible. Maintain eye wash fountain and quick-drench facilities in work
area.

12. Ecological Information

Environmental Fate:
Following data for xylene: When released into the soil, this material may
evaporate to a moderate extent. When released into the soil, this material
is expected to leach into groundwater. When released into the soil, this
material may biodegrade to a moderate extent. When released into water,
this material may evaporate to a moderate extent. When released into water,
this material may biodegrade to a moderate extent. When released into the
air, this material may be moderately degraded by reaction with
photochemically produced hydroxyl radicals. When released into the air,
this material is expected to have a half-life of less than 1 day. This
material is not expected to significantly bioaccumulate. (mixed xylenes:
octanol / water partition coefficient 3.1 - 3.2; bioconcentration factor =
1.3, eels)
Environmental Toxicity:
For xylene: This material is expected to be slightly toxic to aquatic life.
The LC50/96-hour values for fish are between 10 and 100 mg/l.

13. Disposal Considerations

Whatever cannot be saved for recovery or recycling should be handled as
hazardous waste and sent to a RCRA approved incinerator or disposed in a
RCRA approved waste facility. Processing, use or contamination of this
product may change the waste management options. State and local disposal
regulations may differ from federal disposal regulations.
Dispose of container and unused contents in accordance with federal, state
and local requirements.

WARNING: THIS PRODUCT CONTAINS A CHEMICAL(S) KNOWN TO THE STATE OF
CALIFORNIA TO CAUSE CANCER.

Australian Hazchem Code: 3[Y]
Poison Schedule: None allocated.
WHMIS: This MSDS has been prepared according to the hazard criteria of
the Controlled Products Regulations (CPR) and the MSDS contains
all of the information required by the CPR.

16. Other Information

NFPA Ratings:
Health: 2 Flammability: 3 Reactivity: 0Label Hazard Warning:
DANGER! HARMFUL OR FATAL IF SWALLOWED. VAPOR HARMFUL. AFFECTS CENTRAL NERVOUS
SYSTEM. CAUSES SEVERE EYE IRRITATION. CAUSES IRRITATION TO SKIN AND
RESPIRATORY TRACT. MAY BE HARMFUL IF ABSORBED THROUGH SKIN. CHRONIC EXPOSURE
CAN CAUSE ADVERSE LIVER, KIDNEY, AND BLOOD EFFECTS. FLAMMABLE LIQUID AND
VAPOR.
Label Precautions:
Keep away from heat, sparks and flame. Avoid contact with eyes, skin and clothing. Keep container closed. Use only with adequate ventilation. Avoid breathing vapor. Wash thoroughly after handling.
Label First Aid:
Aspiration hazard. If swallowed, vomiting may occur spontaneously, but DO
NOT INDUCE. If vomiting occurs, keep head below hips to prevent aspiration
into lungs. Never give anything by mouth to an unconscious person. Call a
physician immediately. If inhaled, remove to fresh air. If not breathing,
give artificial respiration. If breathing is difficult, give oxygen. In case
of contact, immediately flush eyes or skin with plenty of water for at least
15 minutes while removing contaminated clothing and shoes. Wash clothing
before reuse. In all cases get medical attention immediately.
Product Use:
Laboratory Reagent.
Revision Information:
No Changes.
Disclaimer:
************************************************************************************************
Mallinckrodt Baker, Inc. provides the information contained herein in
good faith but makes no representation as to its comprehensiveness or accuracy.
This document is intended only as a guide to the appropriate precautionary
handling of the material by a properly trained person using this product.
Individuals receiving the information must exercise their independent judgment
in determining its appropriateness for a particular purpose. MALLINCKRODT
BAKER, INC. MAKES NO REPRESENTATIONS OR WARRANTIES, EITHER EXPRESS OR IMPLIED,
INCLUDING WITHOUT LIMITATION ANY WARRANTIES OF MERCHANTABILITY, FITNESS FOR A
PARTICULAR PURPOSE WITH RESPECT TO THE INFORMATION SET FORTH HEREIN OR THE
PRODUCT TO WHICH THE INFORMATION REFERS. ACCORDINGLY, MALLINCKRODT BAKER, INC.
WILL NOT BE RESPONSIBLE FOR DAMAGES RESULTING FROM USE OF OR RELIANCE UPON THIS
INFORMATION.
************************************************************************************************
Prepared by: Environmental Health & SafetyPhone Number: (314) 654-1600 (U.S.A.)

Inhalation:
Inhalation of vapors may be irritating to the nose and throat. Inhalation
of high concentrations may result in nausea, vomiting, headache, ringing in
the ears, and severe breathing difficulties which may be delayed in onset.
Substernal pain, cough, and hoarseness are also reported. High vapor
concentrations are anesthetic and central nervous system depressants.
Ingestion:
Ingestion causes burning sensation in mouth and stomach, nausea, vomiting
and salivation. Minute amounts aspirated into the lungs can produce a
severe hemorrhagic pneumonitis with severe pulmonary injury or death.
Skin Contact:
Skin contact results in loss of natural oils and often results in a
characteristic dermatitis. May be absorbed through the skin.
Eye Contact:
Vapors cause eye irritation. Splashes cause severe irritation, possible
corneal burns and eye damage.
Chronic Exposure:
Chronic inhalation can cause headache, loss of appetite, nervousness and
pale skin. Repeated or prolonged skin contact may cause a skin rash.
Repeated exposure of the eyes to high concentrations of vapor may cause
reversible eye damage. Repeated exposure can damage bone marrow, causing
low blood cell count. May damage the liver and kidneys.
Aggravation of Pre-existing Conditions:
Persons with pre-existing skin disorders or eye problems, or impaired
liver, kidney, blood, or respiratory function may be more susceptible to
the effects of the substance.

4. First Aid Measures

Inhalation:
Remove to fresh air. If not breathing, give artificial respiration. If
breathing is difficult, give oxygen. Call a physician immediately.
Ingestion:
Aspiration hazard. If swallowed, vomiting may occur spontaneously, but DO
NOT INDUCE. If vomiting occurs, keep head below hips to prevent aspiration
into lungs. Never give anything by mouth to an unconscious person. Call a
physician immediately.
Skin Contact:
Immediately flush skin with plenty of soap and water for at least 15
minutes while removing contaminated clothing and shoes. Get medical
attention. Wash clothing before reuse. Thoroughly clean shoes before
reuse.
Eye Contact:
Immediately flush eyes with plenty of water for at least 15 minutes,
lifting lower and upper eyelids occasionally. Get medical attention
immediately.

6. Accidental Release Measures

Ventilate area of leak or spill. Remove all sources of ignition. Wear
appropriate personal protective equipment as specified in Section 8.
Isolate hazard area. Keep unnecessary and unprotected personnel from
entering. Contain and recover liquid when possible. Use non-sparking tools
and equipment. Collect liquid in an appropriate container or absorb with an
inert material (e. g., vermiculite, dry sand, earth), and place in a
chemical waste container. Do not use combustible materials, such as saw
dust. Do not flush to sewer! If a leak or spill has not ignited, use water
spray to disperse the vapors, to protect personnel attempting to stop leak,
and to flush spills away from exposures. US Regulations (CERCLA) require
reporting spills and releases to soil, water and air in excess of
reportable quantities. The toll free number for the US Coast Guard National
Response Center is (800) 424-8802.

J. T. Baker SOLUSORB�
solvent adsorbent is recommended for spills of this product.

7. Handling and Storage

Protect against physical damage. Store in a cool, dry well-ventilated
location, away from any area where the fire hazard may be acute. Outside or
detached storage is preferred. Separate from incompatibles. Containers
should be bonded and grounded for transfers to avoid static sparks. Storage
and use areas should be No Smoking areas. Use non-sparking type tools and
equipment, including explosion proof ventilation. Containers of this
material may be hazardous when empty since they retain product residues
(vapors, liquid); observe all warnings and precautions listed for the
product. Do Not attempt to clean empty containers since residue is
difficult to remove. Do not pressurize, cut, weld, braze, solder, drill,
grind or expose such containers to heat, sparks, flame, static electricity
or other sources of ignition: they may explode and cause injury or death.

8. Exposure Controls/Personal Protection

Airborne Exposure Limits:
-OSHA Permissible Exposure Limit (PEL): 100 ppm (TWA) xylene 100 ppm (TWA) ethylbenzene -ACGIH Threshold Limit Value (TLV): xylene: 100 ppm (TWA) 150 ppm (STEL), A4 - Not classifiable as a human carcinogen. ethyl benzene: 100 ppm (TWA) 125 ppm (STEL), A3 - Confirmed Animal Carcinogen with Unknown Relevance to Humans.
Ventilation System:
A system of local and/or general exhaust is recommended to keep employee
exposures below the Airborne Exposure Limits. Local exhaust ventilation is
generally preferred because it can control the emissions of the contaminant
at its source, preventing dispersion of it into the general work area.
Please refer to the ACGIH document, Industrial Ventilation, A Manual of
Recommended Practices, most recent edition, for details. Use
explosion-proof equipment.
Personal Respirators (NIOSH Approved):
If the exposure limit is exceeded and engineering controls are not
feasible, a half-face organic vapor respirator may be worn for up to ten
times the exposure limit, or the maximum use concentration specified by the
appropriate regulatory agency or respirator supplier, whichever is lowest.
A full-face piece organic vapor respirator may be worn up to 50 times the
exposure limit, or the maximum use concentration specified by the
appropriate regulatory agency or respirator supplier, whichever is lowest.
For emergencies or instances where the exposure levels are not known, use a
full-face piece positive-pressure, air-supplied respirator. WARNING:
Air-purifying respirators do not protect workers in oxygen-deficient
atmospheres. Where respirators are required, you must have a written
program covering the basic requirements in the OSHA respirator standard.
These include training, fit testing, medical approval, cleaning,
maintenance, cartridge change schedules, etc. See 29CFR1910.134 for
details.
Skin Protection:
Wear impervious protective clothing, including boots, gloves, lab coat,
apron or coveralls, as appropriate, to prevent skin contact.
Eye Protection:
Use chemical safety goggles and/or a full face shield where splashing is
possible. Maintain eye wash fountain and quick-drench facilities in work
area.

12. Ecological Information

Environmental Fate:
Following data for xylene: When released into the soil, this material may
evaporate to a moderate extent. When released into the soil, this material
is expected to leach into groundwater. When released into the soil, this
material may biodegrade to a moderate extent. When released into water,
this material may evaporate to a moderate extent. When released into water,
this material may biodegrade to a moderate extent. When released into the
air, this material may be moderately degraded by reaction with
photochemically produced hydroxyl radicals. When released into the air,
this material is expected to have a half-life of less than 1 day. This
material is not expected to significantly bioaccumulate. (mixed xylenes:
octanol / water partition coefficient 3.1 - 3.2; bioconcentration factor =
1.3, eels)
Environmental Toxicity:
For xylene: This material is expected to be slightly toxic to aquatic life.
The LC50/96-hour values for fish are between 10 and 100 mg/l.

13. Disposal Considerations

Whatever cannot be saved for recovery or recycling should be handled as
hazardous waste and sent to a RCRA approved incinerator or disposed in a
RCRA approved waste facility. Processing, use or contamination of this
product may change the waste management options. State and local disposal
regulations may differ from federal disposal regulations.
Dispose of container and unused contents in accordance with federal, state
and local requirements.

WARNING: THIS PRODUCT CONTAINS A CHEMICAL(S) KNOWN TO THE STATE OF
CALIFORNIA TO CAUSE CANCER.

Australian Hazchem Code: 3[Y]
Poison Schedule: None allocated.
WHMIS: This MSDS has been prepared according to the hazard criteria of
the Controlled Products Regulations (CPR) and the MSDS contains
all of the information required by the CPR.

16. Other Information

NFPA Ratings:
Health: 2 Flammability: 3 Reactivity: 0Label Hazard Warning:
DANGER! HARMFUL OR FATAL IF SWALLOWED. VAPOR HARMFUL. AFFECTS CENTRAL NERVOUS
SYSTEM. CAUSES SEVERE EYE IRRITATION. CAUSES IRRITATION TO SKIN AND
RESPIRATORY TRACT. MAY BE HARMFUL IF ABSORBED THROUGH SKIN. CHRONIC EXPOSURE
CAN CAUSE ADVERSE LIVER, KIDNEY, AND BLOOD EFFECTS. FLAMMABLE LIQUID AND
VAPOR.
Label Precautions:
Keep away from heat, sparks and flame. Avoid contact with eyes, skin and clothing. Keep container closed. Use only with adequate ventilation. Avoid breathing vapor. Wash thoroughly after handling.
Label First Aid:
Aspiration hazard. If swallowed, vomiting may occur spontaneously, but DO
NOT INDUCE. If vomiting occurs, keep head below hips to prevent aspiration
into lungs. Never give anything by mouth to an unconscious person. Call a
physician immediately. If inhaled, remove to fresh air. If not breathing,
give artificial respiration. If breathing is difficult, give oxygen. In case
of contact, immediately flush eyes or skin with plenty of water for at least
15 minutes while removing contaminated clothing and shoes. Wash clothing
before reuse. In all cases get medical attention immediately.
Product Use:
Laboratory Reagent.
Revision Information:
No Changes.
Disclaimer:
************************************************************************************************
Mallinckrodt Baker, Inc. provides the information contained herein in
good faith but makes no representation as to its comprehensiveness or accuracy.
This document is intended only as a guide to the appropriate precautionary
handling of the material by a properly trained person using this product.
Individuals receiving the information must exercise their independent judgment
in determining its appropriateness for a particular purpose. MALLINCKRODT
BAKER, INC. MAKES NO REPRESENTATIONS OR WARRANTIES, EITHER EXPRESS OR IMPLIED,
INCLUDING WITHOUT LIMITATION ANY WARRANTIES OF MERCHANTABILITY, FITNESS FOR A
PARTICULAR PURPOSE WITH RESPECT TO THE INFORMATION SET FORTH HEREIN OR THE
PRODUCT TO WHICH THE INFORMATION REFERS. ACCORDINGLY, MALLINCKRODT BAKER, INC.
WILL NOT BE RESPONSIBLE FOR DAMAGES RESULTING FROM USE OF OR RELIANCE UPON THIS
INFORMATION.
************************************************************************************************
Prepared by: Environmental Health & SafetyPhone Number: (314) 654-1600 (U.S.A.)

The Xactix e-1 is a XeF2 (xenon difluoride)
isotropic silicon etcher. XeF2
is a vapor phase etch, which exhibits nearly very high selectivity of silicon
to photo-resist, silicon dioxide, silicon nitride and aluminum. The e-1 Series can be used to etch silicon wafers, up to
6” in diameter, wafer pieces, die, or other structure into the etch
chamber. Details of the process sequence
are controlled and captured by the control software. The etch progress can be
monitored through the transparent chamber lid.

The tool is located in the first aisle upon entering the SNF from the gowning room left to the wbflexcorr-3and-4.

Processing Tid-Bits

XeF2
etching is a chemical diffusion process.
The etch rate and etch profiles can be highly dependent on loading
effects. For example, etch rate
differences can be observed between the center and the edge for wafers with
high open areas.

Exposed silicon at the
edge of the wafer can lead to more etch rate non-uniformity. This can be from photoresist edge bead
removal or simply form loss of photoresist on the vertical edge of the wafer.

Patterns with
differences in feature sizes can show different etch rates dependant on the
feature size or to the proximity of two adjacent features.

The surface
preparation prior to etch is important in achieving smooth etch surfaces. Etch
roughness occurs through a mechanism similar to micromasking in dry etch.

XeF2
etches native silicon dioxide, but at a much lower rate than silicon. Any surface contamination or variation in
removal of the native oxide can lead to surface roughness.

The XeF2-Si
reaction is exothermic. A delay step can
be used to cool the wafer between etch cycles to minimize any observed thermal
issues.

Operating Procedure

Initial System Check List

Since
the standby state does not have the vacuum pump running, you will need to wait
until systems reaches base pressure once you have enabled the tool on Badger.

If
the system goes in to a gauge calibration routine, the total time is just over
one hour.

It
is best to let the system complete the gauge calibration. Contact the SNF staff and they can adjust
your time to remove the gauge calibration charges.

Status
Check:

Do
not use if an IN USE sign or MAINTENANCE sign is present.

Check for reservations, problems notes, and to see if it is already enabled by
another user.

The
system is available if the initial system and status checks are good.

Enable
the system on Badger.

Logging on the System

Each user is required to log in to the system using their Badger ID.

Input your Badger ID and password.

The KB button beside the Username and Password field can be used
to access the on-screen keyboard.

Press the LOGIN button to access the MAIN MENU screen.

Loading a Sample

Press Load/Unload
sample on the Main Menu screen.

Press
YES if you’re sure, NO if you’re not. The system begins chamber purges and
flushing cycles to evacuate the chamber, shown below.

NOTE: If the chamber ventilation shroud covering the chamber is not pulled fully forward, a request to close the shroud will be displayed before venting the chamber. Move the shroud forward and acknowledge the prompt.

When the chamber is vented, the
dialog box below will appear and you can open the chamber lid. The lid will
rest open on the stop behind chamber.

Be sure to use the correct substrate holder according to the rating of your wafer (clean, semi-clean, gold).

Place your sample on the substrate holder.

Inspect
the O-ring. If necessary, wipe down the
O-ring with a dry wipe.

Close the lid.

Make sure
the lid is fully closed and the lid is seated against the O-ring.

Press Done on Pop-up screen.

The
system will go through a purging cycle prior to chamber pump-down. As a side
note, the Examine button only pumps the chamber down, without purges, so that
the system can be quickly vented to load the sample. This is very useful when
examining a sample away from the system to prevent moisture from accumulating
in the chamber. However, it is always necessary to press Done before etching the sample.

During
the pumping cycle, a “click” sound will be heard that indicates that the
ventilation shroud can be moved.

Running
a Recipe

Select
ETCH MENU from the Main Menu Screen

A
prompt asking for a lot number will appear.

Enter
an alpha-numerical lot number which will be recorded with your etch data.

Press
the DONE Button.

The
following Etch Menu will appear.

3. Under
the CURRENT RECIPE pull-down, select the required recipe.

4. Verify
the # of Cycles, Etch Time and XeF2
Pressure values are correct.

If any
values are not correct change them by either moving the slider or typing in the
correct value in the required field.

Useful observation: Use has shown that after about 30s, the XeF2 is depleted.

5. Select between NORMAL and NORMAL WITH DELAY under the ETCH MODE pull-down (normal with delay allows the user to add a delay time between cycles so the wafer can cool down).

6. Press
the START ETCH Button.

7. Progress
of the etch can be monitored following the Etch Time Completed and Cycles
Completed bars along with the Elapsed Cycle Time and the ETA.

Changing
the Number of Cycles During an Etch.

The CHANGE CYCLES button can be used at any time during the etch
to modify the number of cycles to the etch.

The top row of arrows will add cycles in this order, (right to
left); ones, tens, hundreds, and thousands; the lower row of arrows, having the
same values, will remove cycles.

Click
on the designated arrow for the desired number of cycles needed to be added to
the etch in-progress.

Example,
an extra 125 cycles have been added to the etch by clicking the right most
arrow (ones) five times, the next right most arrow (tens) twice, and the 2nd
from left most arrow (hundreds) once.

Press OK to return to the ETCH MENU screen.

Unloading
a Sample

Press Load/Unload
sample on Main Menu screen.

Press
YES if you’re sure, NO if you’re not. The system begins chamber purges and
flushing cycles to evacuate the chamber, shown below.

NOTE: If the chamber
ventilation shroud covering the chamber is not pulled fully forward, a request
to close the shroud will be displayed before venting the chamber. Move the
shroud forward and acknowledge the prompt.

When the chamber is vented, the
dialog box below will appear and you can open the chamber lid. The lid will
rest open on the stop behind chamber.

Unload your sample.

Inspect
the O-ring. If necessary, wipe down the
O-ring with a dry wipe.

Close the lid.

Make
sure the lid is fully closed and the lid is seated against the O-ring.

Press Done on the Pop-up screen.

The
system will go through a purging cycle prior to chamber pump-down.

NOTE: Examine button only pumps the chamber down,
without purges, so that the system can be quickly vented to load the sample.
This is very useful when examining a sample away from the system to prevent
moisture from accumulating in the chamber. However, it is always necessary to
press Done before etching the
sample.

8.
During
the pumping cycle, a “click” sound will be heard that indicates that the
ventilation shroud can be moved.

Viewing
Detailed Etch Information

The Detailed Etch
Information log may be viewed by clicking on the VIEW LOG button on the Main
Menu.

The log
file is a database that is queried by beginning date and ending date. The
“Today”: button will automatically set the dates to the current month, day, and
year. The lot number, username, recipe, note’s keyword(s) and/or etching mode
used can further specify your search. Wildcard characters (*,?) may be used to
fully specify the search criteria.

Creating
or Changing a Recipe

Creating or changing
recipes is done from the ETCH MENU screen.

Make the appropriate
recipe changes

Save the recipe by
clicking on the save button located near the top of the “perform etch screen”.

The save new recipe screen will appear.

5.
Global Recipes are
starting recipe templates available to all users.

6.
Use the toggle switch
in the middle of the screen users can save the new recipe to their Personal
Directory or the accessible Global Recipes.

7.
Type in the name of
your new recipe and Click on the SAVE button.

A Note on Etch Recipe Parameters

Number of cycles

Since
the e1 Series is primarily a pulsed xenon difluoride etching system, the
duration of etching is controlled by the number of cycles. A cycle consists of
the xenon difluoride sublimating to the set pressure in the expansion chamber,
etching for a set amount of time and evacuation of the main chamber and
expansion chamber.

Etch Time

When
the valve between the main chamber and expansion chamber is opened the pressure
equilibrates and the etching process begins. The etch time is the time between
the opening of the valve between the expansion chamber and the process chamber
and the opening of the valve between the process chamber and the pump.

XeF2 Pressure

In
order to introduce the proper amount of xenon difluoride into the main chamber
a set pressure charge of xenon difluoride must be delivered to the expansion
chamber. Because xenon difluoride has a vapor pressure of ~4T at room
temperature the upper limit for the XeF2 pressure is approximately 4T. Due to
the slightly elevated temperature inside of the etcher cabinet, you may be able
to get considerably higher XeF2 pressures, however.

N2 Pressure

Nitrogen can be added into a recipe to improve
selectivity. The pressure obtained in the expansion chamber likewise controls
the amount of nitrogen introduced into the process chamber. The above variables
can be set either by moving the white slider on the scroll bar or by tapping or
depressing on the arrows at the top and bottom of the scroll bar to increment
each value or by direct entry through the keyboard. Additionally, a range
button is included for the number of cycles, etch time and nitrogen pressure so
that the user can input higher values than the default range allows. Due to equipment characteristics, it is necessary to add at least 4.0 Torr.

How to become a qualified user

Read all material on the SNF website concerning the wet bench,
including Background, Process Capabilities, Operating Procedures
and
Process Monitoring.

Contact a qualified user of the Xactix to arrange to ‘shadow’
them while they use the tool before requesting the final session.
You are responsible to be with that labmember for the full time
they are operating the tool, and it would be intelligent to ask
questions and try to become as familiar as possible with the tool
during this ‘shadowing.’ You may have to shadow the qualified
user more than one time.

If you do not know a Xactix user, contact the user list (xactix
at snf dot stanford dot edu) or check Badger for upcoming user
reservation. It is up to the user if they are willing to have
you shadow them. If you have trouble finding someone to shadow,
please feel free to contact the SNF training contact.

Contact the SNF training contact on the Equipment
Summary page to schedule a final session.
At this session, typically lasting 30 minutes, you are expected to demonstrate your
ability to run the tool safely and appropriately without any
input.

*** THIS PART IS UNDER CONSTRUCTION- DATA COLLECTION WILL BE STARTED AND GRAPHS WILL BE POPULATED IN FALL 2016****

Process Monitoring and Machine Qualification

Process

The
qualification process takes place to ensure the equipment is functioning
properly and works to test its accuracy for etching, based on the inputted
desired process.

Frequency

These qualification
runs are to be completed on
a monthly basis, and information regarding the results of such shall be posted
for the public to review.

Monitoring
may also occur as needed/requested by user reports and concerns or after major
repairs.

Procedure

Wafers For Processing

Start with two L test Si wafers with 1um of 3612 photoresist patterned with the SUMO mask.

Measure the Wafers Before Etching

Measure
photoresist thickness using one of the Nanospecs. Be sure to use reference wafer before testing
to calibrate the tool.

Take readings for the Center, Top, Flat,
Right and Left positions of the wafer.

Use the statistics option to get
averages.

Readings should be taken about 15mm from
the edge.

Record results.

Etch Process

Run 20 cycles of 30 seconds each with no added N2 and no delay as the standard process.

Run two wafers sequentially.

Analyzing the Resulting Etched Wafer

After the wafer has run through its process and removed from the
machine, it must be analyzed to observe the etching patterns.

Measure
photoresist thickness using the same Nanospec.
Be sure to use reference wafer before testing to calibrate the
tool.

Take
readings for the Center, Top, Flat, Right and Left positions of the wafer.

Take note of the amount of photoresist etching that occurred on
the wafer through measurements using Nanospec. Record these measurements from
several etching areas on the wafer.

Using an optical microscope with measurement capability (such as
the one in the lithography area near the karlsuss) measure the lateral etching
of the silicon.

This can be
done by measuring the distance from the edge of the photoresist to the edge of
the underlying silicon (we’ll save an image from the first qual).

Make
measurements at 5 points on the wafer (flat, top, left, right, and
center).

Record the etch distance at each location.

Announce the etch results on badger and update the trend chart on
the tool’s website.

A
further look into the etching pattern can be determined by use of SEM. This can
help analyze the shapes of which the etching process allowed to take shape on
the wafer.

Responsibility

This monitoring will be handled on a monthly
basis by the students of SUMO, but users are encouraged to run a qualification
process if they feel the tool is not in good running order. The staff should be
informed of the results retrieved from such a run so as to add to the
previously collected data.

]]>No publisherjprovine2009-12-04T21:25:00ZPageXactix Etchhttps://snf.stanford.edu/SNF/equipment/chemical-vapor-deposition/pecvd/plasmatherm-ccp-dep/characterization/pinhole-testing/xactix-etch
Study of the presence and density of pinholes in ccp films through measurements made on the Xactix etching of the underlying silicon exposed by pinholes.Procedure

The wafers were prepared through the following steps (certain steps were not performed on specific control wafers):

Wafers

The measurement wafers and the control wafers are described in the table below.

ID

Type

Recipe

Thickness

Xactix

41

Measurement

SiO 300-1

0.8 um

30 cycles

42

Measurement

SiO 350-1

0.8 um

30 cycles

43

Measurement

SiN 300-1

0.09 um

30 cycles

44

Measurement

SiN 350-1

0.09 um

30 cycles

45

Control

no film

0

no

46

Control

SiO 300-1

0.8 um

no

47

Control

SiO 300-1

0.8 um

no

48

Control

SiN 300-1

0.09 um

no

49

Control

SiN 350-1

0.09 um

no

50

Measurement

SiO 300-1

0.09 um

20 cycles

51

Measurement

SiO 350-1

0.09 um

20 cycles

52

Measurement

SiN 300-1

0.09 um

20 cycles

54

Measurement

SiN 350-1

0.09 um

20 cycles

Steps

1. Film deposition

Test waferswith 100nm thermal oxide and 1um Al were used.

The films were deposited with the recipes on the table below. The specific thickness of each wafer is given on the table of wafer IDs.

Recipe

Substrate Temp

Heat Exchanger Temp

SiO 300-1

300C

60C

SiO 350-1

350C

60C

SiN 300-1

300C

60C

SiN 350-1

350C

60C

2. Xactix Etch

The wafers were etched according with cycles of 30 at 3Torr of XeF2. The number of cycles of each wafer is given on the table of wafer IDs.

3. Visual Analysis

The wafers were analyzed with the assistance of a microscope.

Results

The results of the first Xactix etch (wafers 41, 42, 43, 44)
demonstrated a higher presence of pinholes on the nitride films (wafers 43,
44), indicating that they present pinholes for films thinner than 0.09 µm. The
results for the oxide films (wafers 41, 42) with 0.8 µm thickness indicated
there was not a relevant amount of pinholes in the film due to the CCP
deposition. This motivated the second Xactix etch.On the second etch (wafers 50, 51, 52, 54), the nitride films presented
significantly less etched spots compared to the amount from the first etch. The
SiO 300-1 film still presented no relevant amount of pinholes. However, the SiO
350-1 film presented a very large amount of pinholes across the whole surface.

Discussion

The experiment points to
the idea that the structure for nitride films is less stable, since there was a
great variance between the results from each etch. The second etch (wafers 50,
51, 52, 54) demonstrated that there may be irregularities on the films deposited
for the first etch, which caused the high area of undercut. This could have
happened for different reasons, which include an irregularity of the machine in
depositing films that resulted in films with different characteristics; the
presence of alien substances inside the CCP deposition chamber during the
deposition of the films for the first etch, which could have fallen on the
wafers and created an anomalous amount of pinholes; different handling and
ambient exposure of the wafers from the first etch compared to the second etch,
since the wafers on the first run were stored for a longer time between they
were cleaned and had the films deposited.

Moreover, the experiment
demonstrated that oxide films may only present pinholes for films thinner than
0.09 µm. For nitride films, on the other hand, it is not safe to conclude a
film thickness that would be free from pinholes due to the limited data
collected.

Once finished, user is able to toggle between Data screen and Graph (Figures 2 and 3)

Figure 2

Figure 3

The data or any of the charts can be saved to your USB drive

Copy data to clipboard in order to save into excell or word

Paste the data in either Excel or Word and save the file to your USB drive

When finished, close VASE Manager (do not log off)

Click "OK"

Turn off the lamp by depressing the Lamp Power button TWICE

Disable Woollam on Coral

]]>No publisherdgrbovic2008-11-11T21:55:00ZPageWoollam M2000 Spectroscopic Ellipsometer, woollamhttps://snf.stanford.edu/SNF/equipment/characterization-testing/woollam-m2000/Woollam%20M2000
The Woollam M2000 is a spectrometer which will measure phase changes in polarized light to estimate the thickness and optical constants of films. Picture and Location

Background

The Woollam tool uses ellipsometry to characterize thin
films. Ellipsometry detects the phase change in polarized light as
it reflects from or transmits through samples.
The Woollam does not directly measure thickness
and optical constants, but rather uses collected data to solve models which
estimate the thickness and optical parameters of interest. The general sequence of operation is: 1) Measure, 2) Create Model, 3) Fit, 4) Results.

The Woollam measures Ψ and Δ which characterize the change in polarization as the light is reflected from the surface. Ψ characterizes the amplitude and Δ characterizes the phase difference.

Process Capabilities

Cleanliness Standard

Performance of the Tool

What the Tool CAN do

Measure reflected polarized light.

Fit models of optical constants with the measured data to determine thickness and optical constants of films.

Complex modeling of optical data is possible with the powerful Woollam software. The basics are covered here but the tool manual for advanced use is available to be checked out. Contact Michelle Rincon (mmrincon@stanford.edu) if you would like to check out the manual.

What the Tool CANNOT do

Directly measure thickness or optical constants.

The Woollam is capable of using variable angles of incidence. In order to optimize the reflection from the surface only (and not the substrate), measurements around the Brewster angle of the substrate is recommended to enhance sensitivity to film parameters. Multiple angle measurements can be used to improve confidence in the final answer.

The Woollam measures reflected light across the 210-1600 nm spectrum. The spot size varies with angle of incidence from 1.1-11.5mm (It is 2mm normal to the surface).

The System

The SNF Woollam uses a Xe Arc Lamp as the light source.

The SNF Woollam has an 8-in chuck. The standard
set up for the guide pins is to accommodate a 4-in wafer. Please contact staff if 8-in wafer set up is needed. Wafer pieces can be used with
both 4-in and 8-in set up.

Contact List and How to Become a User

Contact List

The following people make up the Tool Quality Circle:

Process Staff: Michelle Rincon (mmrincon@stanford.edu)

Maintenance: Gary Sosa (gsosa@stanford.edu)

Super-Users:

Training to Become a Tool User

Read all material on the SNF website concerning the Woollam M2000 Spectroscopic Ellipsometer.

Shadow lab users on Woollam. After this step, the user should be familiar enough with the equipment to be able to run the equipment on their own.

Contact Michelle Rincon (mmrincon@stanford.edu) for qualification. The final certification will consist of 2 tests: 1) written quiz, and 2) in-lab oral exam.

Operating Procedures

The software has uses 6 different windows to perform different functions. First, the Hardware window is used to collect the data. After data collection the Hardware window can be closed and the general work flow is in a counter clockwise direction starting in the upper right hand corner of the screen with the Data window. As you click on each window, a different set of menu instructions is shown. Right clicking in any window also shows the
list of menu options for that window.

Typical work flow:

Enable in Badger.

Turn on the lamp with “Lamp Ignition” button.

Load wafer on chuck. Turn on vacuum switch.

Logon to computer screen.

Open WVase32 software.

In Hardware Window:

Initialize (NEVER calibrate the system. This function requires a calibration wafer which is not available to users.)

Acquire data using Spectroscopic Scan.

Align Sample- this will find the center of a 4-in wafer.

Translator move- if you wish to measure a different spot on the wafer, use the arrows to jog the sample table. The default movement is 1mm per
click, but there is a window available to change the distance/click.

Select angle(s) for measurement. In order to reduce the
polarization shifts from the substrate it is best to chose angles near the
Brewster Angle for your substrate. (Typical selection for Si is 65-75 degrees).

Select angle step size for measurement. More angles will give you
more data and improve confidence in the results, but will also take more
time. (Typical selection for a single
thin film on silicon is 3 angles, so the angle step size would be 5 to measure
at 65, 70, and 75 degrees).

Select revs/measurement. The default setting is 5. More revs/measurement will decrease the
amount of noise in the data collection but will also take longer. (Typical value is 40 revs/measurement)

DO NOT CHANGE POLARIZER SETTING. This is a hardware setting that is fixed.

Close Hardware Window after data is collected.

Verify Data is visible in Data window and curves displayed in Graph Window. Default settings for graph are Ψ and Δ on the y-axes and nm on the x. Right clicking on the graph will show options for changing the data that is graphed and the axes.

Create model.

Click in Model Window to select the window.

Select Add layer. For Si wafers, use Si.mat, 1mm default thickness.

Add layers as required for your sample. Select parameters for fitting in the pop up box. Note some layers will not have data
for the entire range of the Woollam spectrum.
Data outside of the range will be extrapolated. If you do not wish to have the data extrapolated, go back to the Data window and use the menu options to select the range desired.

Modify model if necessary, then repeat steps 8 and 9 until you are satisfied with the answer.

Turn off vacuum and remove wafer.

Turn off lamp by powering down system, waiting for lights to go off, then turning power back on. Lamp ignition light will remain off.

Close Vase software and lock computer screen.

Some options (more frequently used options - many more exist and please feel free to document any helpful procedures that might be useful to lab members!):

Transmission Scan instead of Spectroscopic Scan. Transmission
scans require that the wafer be set perpendicular to the chuck. SNF does not have a jig available for users but many users fashion their own out of lab-approved materials.

Some films will not have the optical constants in any of the tool databases. Modeling of the films as Cauchy layers, EMA layers or GENOSC layers can be done as well. Please contact staff for training if you need help.

Process Monitoring and Tool Qualification

A calibration wafer is run after lamp changes and for error recovery. Monthly calibration checks are to be scheduled.