Authors:

Yonuk Chong(KRISS)

Paul D Dresselhaus(NIST)

Samuel P Benz(NIST)

We report a method for improving heat exchange between cryo-
cooled high power consuming devices and coolant. We fabricated a
micro-machined monolithic heat sink structure on a high
integration density superconducting Josephson device, and
studied the effect of the heat sink on cooling of the device in
detail. The monolithic heat sink structure showed a significant
enhancement of cooling efficiency, which markedly improved the
chip operation. The detailed mechanism of the enhancement still
needs further modeling and study in order to optimize the design
of the heat sink structure.

To cite this abstract, use the following reference: http://meetings.aps.org/link/BAPS.2007.MAR.R1.256