Available Versions

The following product versions or modules are available:

ERSASCOPE 2 XL inspection system

Inspektion system for large PCBs.

Application

Inspection of hidden solder joints and more

Extreme flexibility due to seven movement axes for the inspection of BGA, µBGA, CSP, Flip Chip, CGA and throughput for THT connections. Enables the evaluation of heel filling for QFP, SOIC and other components with gull wing connections, wetting length and inner wetting for PLCC and other components with J connections. The most various viewing angles through tilting, rotating, inclining - even in case of large rebuilding by neighbouring components! The wide angle view enables the inspection of VIA walls, sockets etc. without tilting the optics (through the shift method)! Consistently create sharp images from several individual images with various focus settings using the ImageDoc v3 EXP FocusFusion function (option)!

Options

Ersa recommends the following accessories:

Purchase key to activate the full range of functions of the ImageDoc v3 inspection software

Article No.: 0VSID300L

Article No.: 0VSID300L

ImageDoc v3 EXP

Purchase key to activate the full range of functions of the ImageDoc v3 inspection software

Licence key for the expert functions of ImageDoc v3. You will receive a purchase key, which can activate the full range of functions of ImageDoc v3 through a computer-bound registration. Without an EXP licence, only the basic function of the professional inspection software can be used.