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History Of Development Of Copper Foil

Jan 14, 2017

Copper foil English as electrodepositedcopperfoil, is a copper clad laminate (CCL) and the printed circuit board (PCB) manufacturing of important materials. In today's electronic information industry development, electrolytic copper foil is known as: signal and power transmission, communication, electronics, "neural network". In 2002, China's printed circuit board production values have been more into 3rd place in the world, as the PCB substrate material – CCL has also become the world's 3rd largest producer. It also brings China's electrolytic copper foil industry has made rapid progress in recent years. In order to understand and know the world and development of electrodeposited copper foil industry in China in the past, the present, and look to the future, according to experts on the development of China's epoxy resin Industry Association for review.From the production of electrolytic copper foil industry and market development point of view, its history can be divided into 3 periods: the United States create an initial enterprise and electrolytic copper foil copper foil industry in the world starting period Japan corners the world market of copper foil enterprises; a multipolar world markets.United States create an initial enterprise and electrolytic copper foil copper foil industry in the world start times (1955 ~ in the 1970 of the 20th century)The year in the 1930 of the 20th century1922 United States Edison invention patent for continuous manufacturing of thin nickel sheet of foil, became the forerunner of the modern continuous manufacture technology of electrolytic copper foil. Chinese epoxy trade association experts, this patent is in the lower section by cathode revolving rollers through the electrolyte, anode after half an arc-shaped, by electrolysis nickel foil. His foil on the cathode surface, when the rollers out of liquid surface outside, continuous strip coiling get nickel foil.1937 United States PerthAmboy Anaconde bronze company of New Jersey uses the Edison patent principles and process, successfully developed for industrial production of electroplated copper foil products. Using insoluble anode "acid electrolysis" "dissolved copper on the copper" to achieve continuous production of electrolytic copper foil of copper ion balance. This method of creation, to be more convenient than rolling production of copper foil, therefore, at that time in large quantities as building materials, moisture, on the building for decoration.The year in the 1950 of the 20th century1955 in the Anaconda company has development, design of electrolytic copper foil equipment Yates engineers, Dr Adler and away from the company, independently established Circuitfoil company (abbreviated CFC, later known as Yates's manufacturer). Yates is also in the United States, New Jersey, California, and United Kingdom set up a plant for the production of electrolytic copper foil. Gould and 1957 and derived from the Anaconda company Clevite company. They also began production of electrolytic copper foil used for printed circuit boards. Later Gould company in Germany (then West Germany), Hong Kong, United States Ohio, United States Arizona, United Kingdom electrolytic copper foil plant was established in order to supply printed circuit board, PCB production. Late in the 1950 of the 20th century, Gould has become the world's largest manufacturer of electrolytic copper foil.1958 Japan's Hitachi Chemical Company and Sumitomo bakelite company (the two companies are Japan CCL mainly suppliers), have established a joint venture Japan electrolytic company. Japan Industrial Fukuda metal foil powder company (referred to as Futian company), Furukawa Electric Industrial Company (referred to as Furukawa Electric Company), Mitsui mining company (referred to as Mitsui company) have set of electrolytic copper foil production plant. Building Japan electrolytic copper foil for PCB industry. Japan plant uses a continuous-type electrolytic copper foil: electroforming, copper cyanide plating bath, polarity-roll stainless steel, electrolytic copper as a soluble-positive. This low efficiency of production, Japan can produce thousands of metres of thin copper sheets a month.The year in the 1960 of the 20th centuryIn the 1960 of the 20th century, the PCB has gradually spread to all areas of the electronics industry, demand for copper is growing rapidly. According to China's epoxy resin industry association experts, 1968 Mitsui (Mitsui) from the United States first introduced the Anaconda company continuous manufacturing technology of copper foil, and in the town of Saitama Prefecture ageo plant in this kind of electrolytic copper foil production.Furukawa Electric Company (Furukawa) from the United States of CFC company introduced a production technology of copper foil. Furukawa Electric company in Japan, Tochigi-establishment of the copper foil production plant was completed in 1972. In addition, Japan electrolytic company and Futian company (Fukuda) alone development of surface treatment technology for continuous technology of electrolytic copper foil, and copper foil, also established in the 1970 of the 20th century, began the industrial production of electrolytic copper foil. Japan all copper foil plant in terms of technology and production, and in the early 70 's, been rapid progress.