The evolution of sensors and data storage possibilities has created possibilities for more precise data collection in processes. However, process capability analysis has become more difficult. Traditional methods, such as ...

Size reduction is the first step for manufacturing biofuels from woody biomass. It is usually performed using milling machines and the particle size is controlled by the size of the sieve installed on a milling machine. ...

Two different sugar yield definitions (cellulose-based and biomass-based) were used in reported studies investigating the relationship between biomass particle size and enzymatic hydrolysis sugar yield. It is noticed that ...

Knowing cutting force in rotary ultrasonic machining(RUM)can help optimizing input variables.RUM of brittle materials has been investigated both experimentally and theoretically.However,there are no reports on cutting force ...

Titanium has a wide variety of applications, particularly in the aerospace industry. However, because of its low thermal conductivity and high strength, machining of titanium is very difficult. The heat generated in machining ...

Rotary ultrasonic machining (RUM) is one of the machining processes for advanced ceramics. Edge chipping (or chamfer), commonly observed in RUM of ceramic materials, not only compromises geometric accuracy but also possibly ...

Silicon wafers are the most widely used substrates for fabricating integrated circuits. There have been continuous demands for higher quality silicon wafers with lower prices, and it becomes more and more difficult to meet ...

Because of its unique properties, potassium dihydrogen phosphate (KDP) crystals are widely used for electro-optical applications. Slicing is needed to make KDP crystal lens with desired shapes. However, reported studies ...

Ultrasonic-vibration-assisted grinding (UVAG), a hybrid machining process combining material removal mechanisms of diamond grinding and ultrasonic machining, has been used to machine various hard-to-machine materials. Large ...

Femtosecond laser ablation of gold thin film on the front and backside of silicon substrate is investigated, with backside ablation being the focus and front side ablation for comparison. The experiments are performed using ...

Using pump-probe measurements, we characterize carrier decay time inside fused silica and measure deeply bound self-trapped excitons. With pump-probe delay, we also control free carrier injection and the subsequent avalanche ...

The majority of semiconductor devices are built on silicon wafers. Manufacturing of high quality silicon wafers involves several machining processes including grinding. This review paper discusses historical perspectives ...

Grinding is an important process for manufacturing of silicon wafers. The demand for silicon wafers with better quality and lower price presents tremendous challenges for the grinding wheels used in the silicon wafer ...