1. (WO2017032763) DEVICE AND METHOD FOR MACHINING A SEMICONDUCTOR SUBSTRATE BY MEANS OF LASER RADIATION

Pub. No.:

WO/2017/032763

International Application No.:

PCT/EP2016/069867

Publication Date:

Fri Mar 03 00:59:59 CET 2017

International Filing Date:

Wed Aug 24 01:59:59 CEST 2016

IPC:

H01L 31/18B23K 26/364H01L 21/20

Applicants:

FRAUNHOFER-GESELLSCHAFT ZUR FÖRDERUNG DER ANGEWANDTEN FORSCHUNG E. V.

Inventors:

NEKARDA, JanBRAND, AndreasGRAF, Martin

Title:

DEVICE AND METHOD FOR MACHINING A SEMICONDUCTOR SUBSTRATE BY MEANS OF LASER RADIATION

Abstract:

The invention relates to a method for machining a semiconductor substrate, in particular a semiconductor substrate for producing a photovoltaic solar cell. Said method comprises a laser machining step in which the semiconductor substrate is locally subjected to machining laser radiation from a machining laser radiation source in a machining area. The invention is characterised in that before and/or during the laser machining step, the semiconductor substrate is subjected to an illumination intensity greater than 50,000 w/m2 in a conditioning area by means of conditioning laser radiation from a conditioning laser radiation source.