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High-Frequency (RF) Test Sockets for IC Package Styles:

CSP, µBGA, Bump-Array, QFN, QFP, MLF, DFN, SSOP, TSSOP, TSOP, SOP, SOIC, LGA, LCC, PLCC, TO and Any and All SMT Package Styles made With or Without Leads. Can also be compatible with PGA packaged devices.

Now you can get the best of both worlds! The Kapton Interposer socket gives
you the high-frequency characteristics of our Microstrip™ Contact Socket
combined with the close component placement of our Spring-Probe Sockets. Signal
paths can be as short as 0.008" [0.203mm] while the pad layouts can be identical
to the package footprint with an operating range -40°C to 150°C.

For test & dynamic burn-in of CSP, µBGA, DSP, LGA, SRAM, DRAM and
Flash devices on any pitch of 0.20mm pitch or higher. This socket is easily mounted
and removed to & from the PCB due to solderless pressure-mount compression
Spring-Probes.

For high-frequency testing of CSP, BGA, DSP, LGA, SRAM, DRAM, and Flash devices
on any pitch of 0.20mm or larger. The four-point crown insures “scrubbing” of
solder oxides, while pointed probe works with LGA’s, MLF’s, etc.

Low resistance testing using dual, independent Spring-Probe Technology for testing of MLF, QFN, LGA and other leadless devices. Socket is easily mounted and removed to and from the test board via solderless pressure mount compression Spring-Probes, accurately located by two molded plastic alignment pins and mounted with four stainless steel screws.