Rung-An Chen, Tu-Cheng TW

Rung-An Chen, Tu-Cheng TW

Patent application number

Description

Published

20090268392

NOTEBOOK COMPUTER HAVING HEAT PIPE - A notebook computer includes a heat-generating component, a keyboard frame made of a heat conductive material and a heat pipe having an evaporator and a condenser. The evaporator of the heat pipe is in thermal communication with the heat-generating component and the condenser is attached to the keyboard frame and away from the heat-generating component.

10-29-2009

20090284912

NOTEBOOK COMPUTER WITH THERMAL MODULE - A notebook computer (1000) includes a base (100), a cover (300), a computer printed circuit board (PCB) (200) and a centrifugal fan (40). The cover covers the base, and cooperates with the base to form a receiving space (500) therebetween. The computer PCB is received in the receiving space and mounted on the base. The centrifugal fan is received in the receiving space, and includes a stator (401) and an impeller (402), rotatable with respect to the stator. The stator includes a motor (415) and a fan PCB (405) directly attached to the base. The motor electrically connects to the fan PCB. When the impeller rotates, airflow enters the receiving space through top and bottom air inlets (304,104). The fan PCB is integrally formed with the computer PCB and has a height less than the computer PCB.

HEAT DISSIPATION DEVICE - A heat dissipation device includes a heat sink having a first fin unit and a second fin unit adjoining each other. The first fin unit includes a plurality of parallel stacked first fins each including a main body and two flanges extending perpendicularly from two opposite sides of the main body. The second fin unit includes a plurality of parallel stacked second fins each including a main body and two flanges extending perpendicularly from two opposite sides of the main body. The first fin unit and the second fin unit are arranged back-to-back. The main body of an outmost first fin adjacent to the second fin unit abuts the main body of an outmost second fin adjacent to the first fin unit. An interval between two neighboring first fins is smaller than that between two neighboring second fins.

01-28-2010

20100025018

HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a heat pipe and a plurality of fins. Each fin includes a main body and two edges bent from the main body. The edges of a rear fin contact a front adjacent fin. The main body defines a through hole receiving the heat pipe and a flange extends outwardly from a periphery of the through hole. A portion of the flange along a circumferential direction is shorter than the edge. A gap between the portion of the flange of the rear fin and the front adjacent fin receives excess solder forced out between the flanges of the fins and the heat pipe.

FAN AND SPEED CONTROL CIRCUIT THEREOF - A fan includes a speed control circuit and a motor electrically connected with the speed control circuit. The speed control circuit includes an inputting circuit and a transforming circuit electrically connected with the inputting circuit. The inputting circuit supplies a constant current to the transforming circuit. The transforming circuit transforms the constant current to a fluctuating current and outputs the fluctuating current to the motor of the fan. The fluctuating current causes a rotation with a fluctuating speed to the motor of the fan.

06-10-2010

20100181049

HEAT DISSIPATION MODULE - A heat dissipation module includes a first substrate, a second substrate spaced from the first substrate, a heat pipe and three resilient flakes, i.e., a first resilient flake, a second resilient flake and a third resilient flake. The heat pipe connects with the first and second substrates. The first resilient flake forms a securing portion connecting with the first substrate and a locking portion extending outwardly beyond an outer edge of the first substrate. The second resilient flake forms a securing portion connecting with the second substrate and a locking portion extending outwardly beyond an outer edge of the second substrate. The third resilient flake includes a locking portion located at a middle and two securing portion at two opposite ends thereof. The two securing portions of the third resilient flake connect with the first and second substrates, respectively.

07-22-2010

20110042043

HEAT DISSIPATION MODULE - A heat dissipation module includes a heat pipe having a condensing section, a centrifugal fan defining an air outlet and a fin assembly. The fin assembly includes a plurality of fins stacked together and is thermally attached to the condensing section of the heat pipe. The fin assembly is located at the air outlet of the centrifugal fan. At least some fins of the fin assembly have a height decreasing along the condensing section of the heat pipe. The fin assembly defines a spared space at a bottom side of the fin assembly corresponding to the at least some fins.

02-24-2011

20110048680

HEAT DISSIPATION MODULE - A heat dissipation module includes a centrifugal fan, a fin assembly and a heat pipe. The centrifugal fan defines an air outlet and a cutout at the air outlet of the centrifugal fan. The fin assembly includes a plurality of fins arranged together and is located at the air outlet of the centrifugal fan. The fin assembly defines a first air inlet communicating with the air outlet of the centrifugal fan. The fin assembly forms a protruding portion being located at the cutout of the centrifugal fan. The protruding portion defines a second air inlet communicating with the air outlet of the centrifugal fan. The heat pipe is thermally attached to the fin assembly.

03-03-2011

20110058938

CENTRIFUGAL FAN - A centrifugal fan includes an impeller and a housing receiving the impeller therein. The impeller includes a hub and blades extending radially from the hub. The housing includes a bottom wall, a sidewall extending upwardly from the bottom wall and a bracket for supporting the impeller thereon. The bottom wall defines an air inlet therein. A plurality of protruding posts extend downwardly from a bottom surface of the bottom wall around the air inlet. Each of the protruding posts defines a screw hole therein. The bracket is located in the air inlet. The bracket defines a plurality of through holes corresponding to the protruding posts respectively. The protruding posts of the bottom wall are respectively inserted into the through holes of the bracket. A plurality of bolts are respectively screwed into the screw holes of the protruding posts to connect the bracket and the bottom wall together.

03-10-2011

20110279971

PORTABLE COMPUTER - An exemplary portable computer includes a casing and temperature control unit received in the casing. The casing includes a first outer portion and a second outer portion having different surface temperatures. The temperature control unit includes a controller, two temperature sensing wires and a heater. The heater is located at the first outer portion and coupled to the controller. The temperature sensing wires each includes a first end and a second end. The first ends are coupled to the controller, and the second ends respectively attaches the first and second outer portions for detecting the surface temperatures thereof. During operation, the controller reads the surface temperatures of the first and second outer portions via the temperature sensing wires, respectively, and outputs a control signal to the heater, thereby controlling operation of the heater to reduce a temperature difference between the first and second outer portions.

11-17-2011

20120018132

HEAT DISSIPATION DEVICE - An exemplary heat dissipation device includes a centrifugal fan and a fin assembly. An air outlet is defined in the centrifugal fan. The fin assembly is located at the air outlet of the centrifugal fan. The fin assembly includes a first fin unit and two second fin units. The first fin unit includes a plurality of first fins made of a first material. Each of the second fin units includes a plurality of second fins made of a second material. A heat conductive efficiency of the first material exceeds that of the second material.

01-26-2012

20120075804

PORTABLE ELECTRONIC DEVICE AND THERMAL MODULE THEREOF - A thermal module includes a centrifugal fan and a circuit board. The circuit board defines a through hole therein. The centrifugal fan includes a top plate located above the circuit board and aligned with the through hole, a first sidewall extending from a circumferential edge of the top plate toward the circuit board, a bottom plate located below the circuit board and aligned with the through hole, a second sidewall extending from a circumferential edge of the bottom plate toward the circuit board, and an impeller. The first sidewall abuts a top surface of the circuit board around the through hole. The second sidewall abuts a bottom surface of the circuit board around the through hole. The impeller is smaller than the through hole. The impeller extends through to be located in the through hole.

03-29-2012

20120099278

ELECTRONIC APPARATUS WITH HEAT DISSIPATION DEVICE - An exemplary electronic apparatus includes a casing, and an electronic component and a heat dissipation device received in the casing. The casing includes a bottom plate and an opposite top plate. The heat dissipation device includes a centrifugal fan defining an air outlet for airflow out, a heat sink arranged at the air outlet, and a heat pipe. A height of the heat sink along a direction parallel to a rotation axis of the centrifugal fan is less than that of the air outlet. The heat pipe includes an evaporation section thermally attached to the electronic component and a condensation section thermally attached to the heat sink.

04-26-2012

20140016267

ELECTRONIC DEVICE WITH HEAT INSULATION LAYER - An exemplary electronic device includes an electronic component, a heat dissipation device, a casing, and a heat insulation layer. The heat dissipation device is positioned on the electronic component for dissipating heat generated by the electronic component. The electronic component and the heat dissipation device are located at an inner side of the casing. The heat insulation layer is located on the heat dissipation device and is close to the casing. The heat insulation layer is made of aerogel material.

01-16-2014

20140054814

METHOD FOR MANUFACTURING ELECTRONIC DEVICE CASING - An exemplary method for manufacturing a thermally insulating electronic device casing includes the following steps. First, a cover and a mold are provided. The cover includes a top surface. The mold includes a bottom surface, and the bottom surface of the mold is depressed inwardly thereby defining a recess. Next, the mold is arranged to cover the cover, with the bottom surface of the mold attached on the top surface of the cover. Thereby, a room is cooperatively defined by the recess and the top surface of the cover. Then the room is filled with aerogel solution. After that, the aerogel solution in the room is dried. Finally, the mold is and removed from the cover.