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Wayne Lam

Wayne Lam is principal analyst within the wireless communications team and is responsible for research related to the market tracking, forecast and supply chain analysis of mobilized devices.

Prior to joining the wireless group, Wayne served as a hardware analyst within the renowned IHS Teardown Services team, focusing on mobile handset designs. Wayne began his career as a process engineer at Intel Corp., starting with the 0.25um process technology through to the 300mm wafer manufacturing transition. He later took on the role of technical consultant at Symbian Inc., pioneering there in the smartphone operating systems space with leading handset OEMs.

More recently, Wayne has worked with firms like Qualcomm and Aerovironment in developing new business models and opportunities after graduating from business school. His research has been featured in various articles in major newspapers and magazines, such as The Wall Street Journal, Bloomberg/BusinessWeek, and The Economist.

Wayne graduated with an MBA from the Marshall School of Business at the University of Southern California (USC). He also earned two engineering degrees from Cornell University and the Massachusetts Institute of Technology (MIT).

Within the realm of smartphone electronics design, the emergence of 5G RF front-end complications are presenting a new set of challenges. The demands for multiple 5G frequencies, TDD and FDD flavors and even multiple millimeter wave antenna modules within the finite space of the humble smartphone form-factor has pushed the industry to look for a solution to tame that complexity.

Apple’s now 12-year-old iPhone franchise has just been shaken up. Without much fanfare and in the mist of the COVID-19 global crisis, Apple released an updated SE model referred to as iPhone SE (2nd Gen).