21st June 2018, 16:00 BST

Semiconductor failure analysis (FA) requires painstaking detective work to understand the source of failures so that they can be removed from volume production. This can include: understanding the chemistry of defects and why they formed; analysing the strain within a solder joint to pre-empt critical failures and mapping changes in dopant distribution through device lifetimes. This webinar will expand on how Oxford Instruments solutions can enable you to detect and help overcome these and other challenges currently faced during semiconductor device production including: