Based on the growing importance of EDA solutions for the automotive safety market, both TÜV SÜD and Cadence determined that it was necessary to add a new certification level to further ease the automotive chip designer’s process for achieving ISO 26262 compliance. The Cadence flow-level certification is verifiable via the TÜV SÜD certification database. Under this new certification model, certificates have been issued for each tool flow documentation kit and have a five-year validity. TÜV SÜD plans to review updates to the tool flows and their impact on ISO 26262 compliance at least once a year.

The tool flow documentation that achieved the TÜV SÜD “Fit for Purpose - TCL1” certification and is included with Cadence Automotive Functional Safety Kits is as follows:

PCB design and verification flow: This new certification for PCB design includes everything from design authoring to simulation to physical realization and verification using the Cadence OrCAD, PSpice and Allegro product suites. The high-performance design entry, simulation and layout editing tools included with these suites provide an integrated environment for design engineers to validate the safety specifications against individual circuit specifications for design confidence.

In this video Infineon explains their new family of configurable industrial drive boards at SPS-IPC Drives 2017. Intended to enable easy setup and deployment, the XMC-based automation boards can handl...

In this video STMicroelectronics explains their STSPIN single-chip motor drivers at SPS-IPC Drives 2017. The STSPIN family embeds can drive motors efficiently and with high accuracy, with an advanced ...

Since 1964, Littelfuse has brought its legacy of stability and reliability in circuit protection to the power semiconductor space. Now, the company is pioneering a series of in-house technology breakt...

WSI are the PMOLED manufacturer and our factory located in Chun-Nan in Taiwan. Our products are the market leader and pioneer in PMOLED module, including the monochrome, area colors and full color one...

SKIPPER UBT21 is a Bluetooth 4.0 USB serial adapter for industrial and medical use. It incorporates a Bluetooth Dual-Mode Stack, supports ranges of up to 300 meters and transferrates of 720 kbit/s (ne...

Eurotech, a long-time leading provider of embedded systems and a global leader in IoT enablement, showed its new modules and Multi-service IoT Gateways at Embedded World 2017. The newly introduced Eu...

The new Universal Debug Engine 4.8 from PLS Development Tools offers a bunch of new and improved features for trace analysis of embedded multicore systems. With the new access device UAD2next PLS cont...

Latest Webinars, White Papers & more

Standards like COM Express exist for making customer-specific small form factor solutions. These are used to reduce the user‘s development time and costs. Is it possible to reduce the user‘s development costs even further? This white paper describes how this can be done with a modular approach to the carrier, enclosure and cooling using pre-qualified components.

Operating temperature fluctuations in medical diagnostic and analytical instrumentation equipment can significantly affect the test results and shorten the life of reagents or samples. The use of space-saving thermoelectric assemblies can solve this problem and provide temperature stability and condensation protection for analytical and medical instrumentation.

In this webinar, you will get an overview of the different cooling technologies for power semiconductor devices. The benefits and drawbacks of each technology will be highlighted in order to provide guidance for the selection of the best one for your application.

In this webinar about High-Power Charging solutions for the future of e-mobility you will learn about: Application trends in DC-EV-Charging, why battery charging seems to remain the most efficient solution and about the difference between AC- and DC-Charging.

Thermal management of medical imaging systems is more challenging than ever. Given the complexity of some PET and SPECT systems, the use of a custom designed liquid cooling systems with plug-and-play components may be a good solution.

Today’s state of the SiC MOSFET indicates resolution on major commercial impediments including price, reliability, ruggedness, and diversification of suppliers. In spite of a price premium over Si IGBTs, the SiC MOSFET has already seen success due to cost-offsetting system-level benefits; the market share for this technology will increase sharply over the next few years as materials costs fall.

Selecting the right coding standard is an essential building block for safe and secure coding. This white paper looks more closely at the details that need to be considered so that the coding standard chosen is fit for purpose.

Winbond’s ultra-low voltage serial NOR Flash memory can work between 1.14V to 1.60V, which covers most of the single AA battery operation voltage range. The lower Vcc can reduce the power consumption in read operation, improve the system BOM cost and reduce the noise coupling in data bus.

Many companies do not want to see their entire production data and know-how to be stored and processed outside the companies’premises. The proven solution to this challenge are approaches like edge and fog computing. In this webinar you will learn how modular systems based on the well-established and tested COM Express modules provide an efficient solution.

This webinar will review laminated busbar designs and advise some techniques on how to optimize design by avoiding common mistakes. The webinar is beneficial for mechanical and electrical engineers involved in developing inverters, battery systems and other critical applications.

Supporting safety critical applications is at the core of car-to-car communication, and for years, the technology of choice has been IEEE802.11p. Recently, a new standard has started evolving: LTE-V2V. This White Paper compares the two standards on which the safety of millions of road users will depend on.

In this webinar we discuss three TI reference designs that help designers create smart technology that can be integrated into smart home ecosystems. These designs are easy to retrofit into existing homes.

This webinar will show how advanced magnetic components help to realize product safety, reliability and high performance for the evolving electric vehicle charging infrastructure. The focus will be on all relevant EV charging modes covering AC charging via IC-CPD or wall box (Modes 2 & 3), as well as DC fast charging (Mode 4) and Inductive charging.