Hermetic Encapsulation

Our ceramic encapsulation technology is the first packaging solution for implants with a very high channel count available on the market. Designed according to your requirements it ensures a long-term protection of the implant electronics.

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Key Winning Features

The ceramic encapsulation is transparent to electromagnetic waves facilitating communication via radio frequency or infrared as well as inductive powering.

Mechanical Robustness

CorTecÂ´s ceramic packages are designed to survive mechanical impact as for example required for cochlear implants according to EN 45502-2-3:2010 and ISO 14708-7:2013.

Superior Hermeticity

Protection of electronics against moisture works 10 times longer compared to standard titanium packages â€” even for small implant volumes below 1 cm3. Lifetime is extendable by additional application of desiccants.

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With our patented Â°AirRay electrode technology we have overcome current limitations of electrodes.

Based on our laser-aided manufacturing process we can design and manufacture electrodes according to your actual requirements â€“ in any geometrical shape, with hundreds of contacts, and for numerous applications.