The existing metal getters are invariably covered with thin oxide layers in air and the native oxide layer must be dissolved into the getter materials for activation. However, high temperature is needed for the activation, which leads to unavoidable deleterious effects on the devices. Therefore, to improve the device efficiency and gas-adsorption properties of the device, it is essential to synthesize the getter with a method that does not require a thermal activation temperature. In this study, getter material was synthesized using palladium oxide (PdOx) which can adsorb gas. To enhance the efficiency of the hydrogen and moisture absorption, a porous layer with a large specific area was fabricated by an etching process and used as supporting substrates. It was confirmed that the moisture-absorption performance of the was characterized by water vapor volume with relative humidity. The gas-adsorption properties occurred in the absence of the activation process.

To synthesize Sn nanoparticles (NPs) less than 30 nm in diameter, a modified polyol process was conducted at room temperature using a reducing agent, and the effects of different pH values of the initial solutions on the morphology and size of the synthesized Sn NPs were analyzed. tin(II) 2-ethylhexanoate, diethylene glycol, sodium borohydride, polyvinyl pyrrolidone (PVP), and sodium hydroxide were used as a precursor, reaction medium, reducing agent, capping agent, and pH adjusting agent, respectively. It was found by transmission electron microscopy that the morphology of the synthesized Sn NPs varied according to the pH of the initial solution. Moreover, while the size decreased to 11.32 nm with an increase up to 11.66 of the pH value, the size increased rapidly to 39.25 nm with an increase to 12.69. The pH increase up to 11.66 dominantly promoted generation of electrons and increased the amount of initial nucleation in the solution, finally inducing the reduced-size of the Sn particles. However, the additional increase of pH dominantly induced a decrease of PVP by neutralization, which resulted in acceleration of the agglomeration by collisions between particles.

Microstructural evolution in the thickness direction of an oxygen free copper processed by accumulative rollbonding (ARB) is investigated by electron back scatter diffraction (EBSD) measurement. For the ARB, two copper alloy sheets 1 mm thick, 30 mm wide and 300 mm long are first degreased and wire-brushed for sound bonding. The sheets are then stacked and roll-bonded by about 50% reduction rolling without lubrication at an ambient temperature. The bonded sheet is then cut to the two pieces of the same dimensions and the same procedure was repeated on the sheets up to eight cycles. The specimen after 1 cycle showed inhomogeneous microstructure in the thickness direction so that the grains near the surface were finer than those near the center. This inhomogeneity decreased with an increasing number of ARB cycles, and the grain sizes of the specimens after 3 cycles were almost identical. In addition, the aspect ratio of the grains decreased with an increasing number of ARB cycles due to the subdivision of the grains by shear deformation. The fraction of grains with high angle grain boundaries also increased with continuing process of the ARB so that it was higher than that of the low angle grain boundaries in specimens after 3 cycles. A discontinuous dynamic recrystallization occurred partially in specimens after 5 cycles.

In this research, magnesium powder was prepared by gas atomizing. Refinement behaviors of magnesium powder produced under different conditions were investigated using a mechanical milling (attrition milling) process. Analyses were performed to assess the characterization and comparison of milled powder with different steel ball sizes and milling times. The powders were analyzed by field emission scanning electron microscope, apparent density and powder fluidity. The particle morphology of the Mg powders changed from spherical particles of feed metals to irregular oval particles, then plate type particles, with an increasing milling time. Because of the HCP structure, deformation occurs due to the existence of the easily breakable C-axis perpendicular to the base, which results in producing plate-type powders. An increase in ball size and the impact energy of the magnesium powder maximizes the effect of refinement. Furthermore, it is possible to improve the apparent density and fluidity according to the smoothness of the surface of the initial powder.

In this study, we investigated the precipitation behavior of the R-phase precipitated at the initial stage of aging and its effect on the pitting corrosion of 25%Cr-7%Ni-4%Mo super duplex stainless steel. The R-phase in super duplex stainless steel was mainly precipitated at the interface of ferrite/austenite phases and inside of the ferrite phase during the initial stage of aging, and it was transformed into the -phase with an increase in aging time. The ferrite phase was decomposed into a new austenite phase and -phase. The R phase was an intermetallic compound, which represented a lower Ni and higher Mo than the matrix, and also had a higher Mo and Cr concentration than the phase. With an increasing aging time, the pitting potential was increased slowly by the precipitation of the R-phase, and it was then steeply decreased by the precipitation of the -phase. The R-phase was decreased the pitting potential, but its effect was smaller than effect of -phase.

To elucidate the effects of a pretreatment process on the uniformity of Ag electroless plating on Cu flakes, pretreatment time was mainly considered with a mixed solution of 0.15 M ammonium hydroxide and 0.0375 M ammonium sulphate. Optical inspection of Ag-coated Cu flakes determined that the optimal pretreatment time is 120 s. Repetition of the sequence in which Ag plating was done immediately after the pretreatment of 120 s clearly enhanced the plating uniformity. Scanning electron microscopy revealed that holes were formed irregularly on some Cu flakes during the period from the asdropping of an Ag precursor solution to 5 min. The hole formation was judged to be due to continuous removal of Cu on the local surfaces by the repetitive formation and elimination of or layers. However, the increase of the amount of Ag coating suppressed the hole creation and increasingly enhanced the antioxidant property.

To investigate the deformation properties of TiC-(5-20) mol% Mo solid solution single crystals at high temperature by compression testing, single crystals of various compositions were grown by the radio frequency floating zone technique and were deformed by compression at temperature from 1250K to 2270K at strain rates from to . The plastic flow property of solid solution single crystals was found to be clearly different among a three-temperature range (low, intermediate and high temperature ranges) whose boundaries were dependent on the strain rate. From the observed property, we conclude that the deformation in the low temperature range is controlled by the Peierls mechanism, in the intermediate temperature range by the dynamic strain aging and in the high temperature range by the solute atmosphere dragging mechanism. The work softening tends to become less evident with an increasing experimental temperature and with a decreasing strain rate. The temperature and strain rate dependence of the critical resolved shear stress is the strongest in the high temperature range. The curves are divided into three parts with different slopes by a transition temperature. The critical resolved shear stress () at the high temperature range showed that Mo content dependence of with temperature and the dependence is very marked at lower temperature. In the higher temperature range, increases monotonously with an increasing Mo content.

We investigated the effects of DMAB (Borane dimethylamine complex, C2H10BN) in electroless Ni-B film with addition of DMAB as reducing agent for electroless Ni plating. The electroless Ni-B films were formed by electroless plating of near neutral pH (pH 6.5 and pH 7) at . The electroless plated Ni-B films were coated on screen printed Ag pattern/PET (polyethylene terephthalate). According to the increase of DMAB (from 0 to 1 mole), the deposition rate and the grain size of electroless Ni-B film increased and the boron (B) content also increased. In crystallinity of electroless Ni-B films, an amorphization reaction was enhanced in the formation of Ni-B film with an increasing content of DMAB; the Ni-B film with < 1 B at.% had a weak fcc structure with a nano crystalline size, and the Ni-B films with > 5 B at.% had an amorphous structure. In addition, the Ni-B film was selectively grown on the printed Ag paste layer without damage to the PET surface. From this result, we concluded that formation of electroless Ni-B film is possible by a neutral process (~green process) at a low temperature of .

Hydrophilic layers were obtained by the atmospheric-pressure plasma treatment. Superhydrophobic layers were first deposited by the electrospray deposition method. The electrospunable solution that was prepared based on the solgel method was sprayed on Si (100) substrates. The surface of the electrosprayed layers consisted of the agglomeration of nano-sized grains, which led to a very high roughness and revealed a very high contact angle to water droplets over . After having been exposed to the atmospheric plasma, the observed superhydrophobicity of the layers were greatly changed: a dramatic variation of the water contact angle from to , namely realization of superhydrophillicity. Interestingly, the surface microstructure was almost preserved. According to the XPS analysis, it is more likely that thanks to the plasma exposure, the surface of layers will be cleaned in terms of organic species that are hydrophobic-inducing, consequently leading to the hydrophilic nature observed for the plasma-exposed layers.