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Fully automatic solder inspection of area array components - and with CT scanning precision - can now be realized with SAKI''s BF-X2 Inline Automated X-ray Inspection System. Employing its unique "Planar CT Technology", the system''s detector moves parallel to the planar object, capturing images from various directions. Data produced by this method enables accurate measurements of size and cubic volume, as well as the exact point of the defect in a object. For hidden solder joints, this means pinpointing voids and "head-in-pillow" ball joint defects.

The OLYMPUS CIX100 inspection system is a dedicated, turnkey solution for manufactures who maintain the highest quality standards for the cleanliness of manufactured components. Quickly acquire, process, and document technical cleanliness inspection data to comply with company and international standards. The system’s intuitive software guides users through each step of the process so even novice operators can acquire cleanliness data quickly and easily.

Our inspection system TAURUS is used for detection of cracks and inclusions in complete wafer stacks. The lateral direction of view (parallel to wafer surface) has the advantage that this concept is not disturbed by the natural structure of grain boundaries. With the help of the exact determination of the positions of defect wafers in a stack they can be separated afterwards easily.

‘Micro3Dslices’ gives operators one of the most accurate Laminography solutions in the market today, surpassing the current market benchmark. Bernhard Muerkens, VP Electronics said: “This exciting technology takes Laminography to a whole new level and gives clearly superior results much faster, really moving this technology into the semiconductor area. The new virtual rotation axis and unprecedented precision of the new manipulator assembly provide unrivalled inspection results, simplified operation and higher inspection throughput.” This solution is much more accurate than previous versions, due, in part, to the quality of design and engineering in the new manipulator assembly, allowing smaller and less dense features to be imaged than it was previously possible. This new technology produces vastly superior laminography results, when compared to other systems which revolve the detector or use inferior manipulators.

Automatic appearance inspection systems are evolving in response to ever-evolving mounted PCBs. However, there is little major change in visual inspection process. Rather, it eseems that burden on visual inspection work is ever-increasing due to the miniaturizaiton of mounted components.

Airfield Technology is pleased to announce the availability of a new product, the AT-920DG Automatic Flight Inspection System. The new AT-920DG system combines the unique groundbased inspection capability of our original AT-920 with the proven DGPS positioning system and WinFIS flight inspection software from our larger, dual equipment AT-930DG system.

We are offering inline solutions for the integration into production lines and as well stand-alone systems for the labatory or incoming inspection in the warehouse. Our Solutions can be integrated into sun simulators. In addition we have systems specialized for thin film inspection.

The QuadTech Inspection System with SpectralCam is the only system that provides 100% defect inspection and true spectral color measurement, providing defect-free printing and accurate, high-quality color packaging.

112A: The automatic meter inspection system 112A, which is the most appropriate for the inspection of remote watt-hour meters, 12B: The automatic meter inspection system 112B collects watt-hour meter signals and sends the data to personal computers through a two-wire circuit.

A high performance real-time X-ray inspection system designed for inspection of multi-layer, assembled printed circuit boards, with dense metal BGAs, and recommended for lead free inspection requirements. Our RTX-113HV system meets all your needs for inspecting BGA packages.