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Abstract

This article describes an electro-discharge machining for cutting slots in conductive materials, such as silicon wafers.

Country

United States

Language

English (United States)

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Multiwire Slab Cutting Tool for Silicon Wafers

This article describes an electro-discharge machining for cutting slots in
conductive materials, such as silicon wafers.

Specifically, the cutting tool includes an aluminum cylindrical block 10 having
a series of external threads cut as V-shaped grooves around the perimeter of the
block 1, such that an electrical wire 14 is wrapped and retained in such grooves.
Prior to the wrapping of the wires 14, a rectangular slot 16 is cut along the
longitudinal rim of block 10 such that the wires 14 extend across the slot 16. A
conductive epoxy line 18 is applied longitudinally in one or two strips along the
external surface of the block 10 so as to hold down the wires 14.

The cutting tool is engaged with a wafer (not shown) such that the electrical
discharge of the wires 14 extending across the slot 16 will cut a multiplicity of
lines into the wafer. Additionally, an axial feed hole 20 extends through the block
10 and has a plurality of side passages 22 extending down into the rectangular
slot 16 for spraying oil from a supply into the passages 22 and, thereby, flushing
eroded particles away from the cutting areas.