Speaking at the Fujitsu Forum trade fair event in Munich, Fujitsu’s Duncan Tait insisted the company was still in the PC business and it was just looking for a friend to scale up.

He didn’t say much more but said an agreement was expected either way in the next two weeks. Fujitsu flogged 5.2 million PCs worldwide in 2014, 3.74 million in 2015 and 1.84 million in the first half of this year. The outfit transferred its Japan PC business into a new subsidiary called FCCL back in February 2016.

It was supposed to be in talks to merge its PC operations with Toshiba and VAIO to take on HP, Lenovo, Dell and Apple.

Michael Keegan, UK and Ireland told the assembled throngs that Fujitsu remained in the PC business, it is not exiting the PC business it is going to collaborate in the PC business. We guess be means that they are staying in the PC business.

"We will use our own brand and designs. We are hoping it will be a case of one plus one equals three. But that deal has not yet completed so that's not much more I can say at this point."

He said that there was no chance of an HP-like break-up of Fujitsu, even though outside of Japan, Fujitsu's sales have not been that great. Tait added that the cunning plan was to rebalance the company's revenue from 60 percent in Japan and 40 percent in the rest of the world to a 50/50 split

The dark satanic rumour mill has manufactured a hell on earth yarn which claims that the maker of the Thinkpad, Lenovo, is about to swallow up Fujitsu.

Nikkei Asian Review claims Lenovo is in talks with Fujitsu to acquire its PC division, which would make the largest computer maker worldwide even bigger.

The two companies aim to reach a deal this month. One proposal would have the Fujitsu group transfer its PC design, development and manufacturing operations to a Lenovo-led joint venture. Another option involves Lenovo taking a majority stake in Fujitsu's PC subsidiary. About 2,000 Fujitsu employees likely would shelter under Lenovo's umbrella.

Japan-based Fujitsu shipped four million PCs worldwide in its last fiscal year, but that division of the company also lost $96.5 million during that time period as well. A proposal to merge Fujitsu's PC business with Vaio and Toshiba's computer division fell apart earlier this year.

Fujitsu's ARM-powered supercomputer, the Post-K, is not going to be ready for 2020 as planned.

Apparently there are a few design issues with the $910m project and engineers need to get under the bonnet and tinker a bit more.

Japan’s RIKEN research group hired Fujitsu to come up with a 1,000 peta-FLOPS supercomputer to supersede the nation's K Computer.

Post-K was supposed to be eight times faster than today's most powerful known supercomputer in the world, China's Sunway TaihuLight. It would be used to model climate change without cross referencing its results with the Bible, and run scientific simulations.

What was more interesting was the fact that it was using ARMv8-A architecture rather than the SPARC64 VIIIfx chips in the older machine. Rumours are though that it will be one to two years late.

ARM and Fujitsu were flat out working out the large vector instructions to ARMv8, bringing the architecture up to scratch for supercomputer applications. However not it seems that the delays are caused by using the new CPU semiconductor technology. As a result, the time required for making system prototypes and detailed designs has been extended. It is not clear if the issue is the move from SPARK to ARM or if it is shrinking designs down to 10nm.

The ARM processors were supposed to be the 10nm FinFET chips fabricated by TSMC, and will feature high-bandwidth memory and the Tofu 6D interconnect mesh [PDF] that's used in the K Computer. It could be that getting decent yields of processors including all these bells and whistles is going to be harder than expected.

This design work was supposed to have been done and dusted by early 2018 and some executive was supposed to throw the switch in 2020. This would have hacked off the US government which was not expecting to be able to build an exascale supercomputer: the US government didn’t expect to be able to build one until 2023.

Its boffins have come up with a 1mm thick heat pipe that can spread heat around mobile devices, reducing extremes of temperature. The device can transfer about 20W, about five times more heat than current thin heat pipes or thermal materials, the company said.

The technology could improve smartphones' performance by helping cool their CPUs and other heat-producing components, spreading that heat more evenly across other parts of the phone.

Overheating has been an issue with some Samsung Galaxy smartphones, and the Korean manufacturer apparently dropped Qualcomm's Snapdragon 810 processor from the Galaxy S6 due to excessive heat concerns.

Heat pipes are common in laptops, but smartphones have sheets of metal or graphite have been used instead. Fujitsu said its pipe is the first of its kind under 1 mm thick that can be used in thin electronic devices.

The pipe consists of a stack of 0.1mm-thick copper sheets containing channels through which water circulates by capillary action, meaning it will work regardless of a smartphone's orientation. One part of the heat pipe sits over a heat source such as a CPU, which evaporates the water. Another part, a thermal diffusion plate, acts as a condenser, turning the vapour back into liquid and returning it to the evaporator part.

FujitsuLabs have worked out a way to improve vibration feedback when typing on a virtual keyboard. The prototype haptic sensory tablet emits ultrasonic vibrations under the surface of the tablet's display.

The company says that although producing ultrasonic vibrations would generally require a good deal of power, its engineers have come up with a way of shrinking down the tech and allowing a tablet prototype to run its haptic feedback system. Essentially, the vibrations create a layer of high pressure air between a user's fingertips and the surface of the screen, resulting in reduced friction so the fingers can skate across the screen. This alternates between high and low friction to create the illusion of a textured surface.

It is possible to feel a CD beneath the fingers while spinning and scratching like a DJ, as well as physically feeling and manipulating the deck controls. Research continues to improve the technology, but the company is looking to commercialise the development by next year.

Fujitsu has announced that it will use ARM’s big.LITTLE architecture in upcoming SoC designs for consumer devices and industrial systems.

Fujitsu will make quasi quad cores, with two A15 and two A7 cores and Mali-T624 graphics. In a statement executive veep of Fujitsu’s Advanced Products Business Unit Mitsugu Naito said big.LITTLE will allow the company to come up with chips that best suit their customers’ needs, both from a performance and efficiency perspective.

“The energy-efficient pairing of ARM Cortex CPUs in a big.LITTLE configuration with the market-leading performance and GPU Compute functionality offered by the Mali-T624 GPU opens up a wide range of opportunities for the features offered to end consumers and industrial applications,” he said.

It is still unclear when the new chips will launch and what sort of consumer products Fujitsu has in mind.

Nvidia is not showing Tegra 3 phones on its booth but just a few hundred feet from their booth, Fujistu decided to showcase a Tegra 3 phone with Raptide GP THD game.

You can tell by the splash effects that the phone does have a Tegra 3 chip, as these splash effect only work on quad core Tegra 3. The girl next to the phone told us that it’s a 1.2GHz clocked chip and the spec sheet next to the device confirms it.

The phone is water and dust proof, has a 4.6 inch high quality liquid crystal screen, and a 13.1 Megapixel high sensitivity camera (ISO 25600). The specs claim the phone is LTE compatible and due its 1.2GHz clock, it should be quite fast.

Unfortunately the phone is for the Japanese market, and we were not allowed to touch the demo. However, the nice girl that was guarding the phone said that we'll have a chance to play with it in about two months at Barcelona Mobile World congress.

Fujitsu Tegra 3 phone should launch this summer in Japan, but there are no direct plans to launch it in Europe or USA as of yet. At least we know that Tegra 3 phones are real but HTC might be the first to launch at MWC late February 2012.

Nintendo's 3D-capable handheld game player is packed full of hardware made by Toshiba, Fujitsu and Invensense according to a tear down carried out by iFixit.

The flash memory chip was provided by Japan's Toshiba, the world's second-largest NAND chip maker after South Korea's Samsung Electronics. The CPU was designed by British firm ARM Holdings and the gyroscope was supplied by U.S.-based Invensense, iFixit said.

But the site had some problems working out the purpose of chips provided by Fujitsu and Texas Instruments. It was impossible to find out what they were. It was not possible to work out who the manufacturers of the lithium ion battery and the 3D liquid crystal display screen were either.

Sharp showed off small 3D screens for glasses-free use at an event last year and this is believed to be the hardware in the 3DS.

Hardware maker Fujitsu has decided that cloud computing and middleware is the place where it wants to be and it is going to be starting to buy up other companies to put it there. Cloud computing is normally seen as the domain of IBM and HP so having Fujitsu in the market is interesting.

Fujitsu boss Masami Yamamoto told Bloomberg that the outfit will be targeting companies that have technologies that Fujitsu doesn’t have or that have big customers who have not been wowed by things Japanese.

Yamamoto, who took over as president in April, said Fujitsu wants companies in the cloud-computing and middleware markets. Fujitsu has been moving away from unprofitable hardware businesses and thinks that it is going to be the service market which is going to make it lots of cash.

Fujitsu Semiconductor, which makes chips for cell phones, computers and cars, has contracted more production to Taiwan Semiconductor Manufacturing and shut three production lines to help save an estimated 80 billion yen in the two years ended March 2011.

In July, Fujitsu announced an alliance with Microsoft which means that Fujitsu could flog cloud-based applications running on Microsoft’s Azure platform.