Epoxy resins are widely used in various industries such as oilfields, electronics and more playing significant roles in the modern world. However uncured epoxy resins are characterized by poor mechanical and chemical properties as well as low thermal resistance. Curing agents impart different properties to epoxy resins. As a result, curing agents are in wide circulation in the epoxy resin industry. Curing agents may require high temperatures, or may be exothermic during the curing process.

The global epoxy curing agents market is segmented according to type and end users in this report. According to types, epoxy curing agents can be categorized as amines, polyamide resins, anhydrides, phenols and thiols. Further sub-segments have been made to enhance the comprehension of the market. The epoxy curing agents market has also been analyzed by end user industry. The report primarily segregates the global market into construction, automotive, adhesive, electrical & electronics, oilfields/refineries and aerospace & defense sectors. The forecast period for this report is 2016-2021.

The global revenue for the epoxy curing agents market has also been segregated geographically, with insights on the biggest revenue generator countries. APAC leads the world in the market on account of large numbers of assembly plants situated in economies with relaxed trade laws, especially China. Americas follow closely with a little less than a third of the market revenue in their hold. Europe lies third, with Germany as the largest revenue holder on account of its extensive manufacturing industry. RoW keeps the minimum share of the global epoxy curing agents market. Sample Companies Profiled in this Report are:

BASF SE (Germany)

The Dow Chemical Company (U.S.)

Gabriel Performance Products (U.S.)

Royce International (The U.S.)

Chemtura Corporation (The U.S.).

10+.

Which account for xx% of the global market revenue. The market is fairly consolidated with renowned companies holding considerable percentages of market revenue and volume.