deposition technique in which liquid precursor is delivered to the substrate in the form of a very fine mist (submicron droplets); in semiconductor manufacturing used to deposit very thin photoresist films and dielectrics; very useful in those applications in which spin-on process cannot be used, e.g. depositions on very large and/or heavy substrates.

process used to coat the wafer with material which is originally in the liquid form; liquid is dispensed onto the wafer surface in predetermined amount and the wafer is rapidly rotated (up to 6000 rpm; during spinning liquid is uniformly distributed on the surface by centrifugal forces; material is then solidified by low temperature (typically <200 oC) bake; in semiconductor processing commonly used to apply photoresist.