Ultra Precision Excise and Attach Machine

Attach small, flexible parts with 1.5-micron accuracy at 1.5 seconds per part

This system precisely excises small plastic parts from supply reels and attaches them to silicon wafers using a UV curable adhesive. High-performance machine vision and precision motion components enable ultra-precision alignments between the parts and wafer. A robot with a dual wafer gripper automatically moves wafers between the processing table, input cassette, and a UV flood station. The machine is fully guarded with two zones of HEPA filtration.

Technical Specifications

Control System:

Custom real time software written in C running on Windows XP. Two industrial PCs.

An ISEL robot with a custom gripper and an ISEL Wafer Aligner are used to manipulate the wafers in process. Custom hardware and precision Primatics motion stages are used to transfer parts from the punch to the wafer.

Parts are aligned to the wafer within /- 1.5um with Cpk of 1.5. The parts are accurately punched to within /- 10um of ideal.

Throughput:

1.5 seconds per attach. With wafer handling and other machine overhead, yields more than 21,000 parts per 10 hour shift.

Optics:

Precision high-magnification telecentric optics with coaxial lighting. Dual cameras are used for imaging two separate optical targets through a single lens. Long working (standoff) distance enhances depth-of-field. Quick-change optical fixturing provides for product reconfiguration.

Custom software written in C# and coupled with a wafer ID station. Once the wafer ID is found, a map of the locations to be processed is downloaded from a central database and associated with that wafer throughout the process.

Inspection:

Parts are inspected at the excise station and checked again at a prealign station for punch quality. The alignment of the attached parts is checked after every attach and can also be inspected after the wafer has been processed in a dedicated inspection mode.

Pick and Place:

A compliant pick head transfers parts to the attach location and provides inherent product damage protection. Dynamic feedback from the placement head provides data for measuring the height of the attachment location on every placement.

Safety:

Fully guarded and interlocked. CE certified.

Adhesive Dispensing:

Simultaneous deposit of two 150-400um diameter adhesive drops (product dependent) one die ahead of the part at the attach location. Drop diameter and position controlled to better than ± 20 microns.

Quality:

No physical damage to wafer or part. Statistical accuracy data on every part.