Dicing Tapes

SUMILITE®FSL

Products

UV tape for dicing process in semiconductor and related field. UV dicing tape which Sumitomo Bakelite has developed is designed to meet variety of customers' requirements by balancing out the 3 elements of "Cohesion", "Adhesion" and "Tack strength". It is UV curing type which can perfectly hold silicon wafer, resin substrate and other kinds of adherend.