3D-IC, LED and 450 mm Update

By James Amano, director, SEMI International Standards

The SEMI International Standards Program brings together industry experts to exchange ideas and work towards developing globally accepted technical standards. SEMI provides a forum for the essential collaborations that must be achieved to move new and existing markets forward efficiently and profitably. Here are the latest updates on 3D-IC, HB-LED, and 450 mm.

3D-IC

Multiple manufacturing challenges must be solved, as 3D-ICs’ increased design and mechanical complexity can lead to increased manufacturing defects, as well as thermal management issues and signal interference. While 3D integration using through-silicon vias (TSVs) promise a fundamental shift for current multi-chip integration and packaging approaches, cost-effective, high-volume manufacturing will be difficult to achieve without standardized equipment, materials, and processes.

The needs and opportunities for 3D-IC manufacturing standards were first explored at SEMICON West in 2010, and the first 3DS-IC SEMI Standards Committee was formed in North America late last year. After a kick-off meeting in January, the 3DS-IC committee met again during the recent NA Spring 2011 meetings and made further progress in targeting the Committee’s initial priorities. At the conclusion of the meetings, activities had been organized into three Task Forces (TFs): Thin Wafer Handling, Bonded Wafer Stacks, and Inspection and Metrology.

The activities are just the beginning of what promises to be a global, industry-wide effort. Over 125 technologists from industry, research institutes, and academia around the world have already joined the SEMI 3DS-IC Standards Committee and are at work on these critical standards. The committee and task force will next be meeting at SEMICON West 2011 in July, and the Standards Program will also present a 3DS-IC Workshop to introduce the development and commercialization status of key aspects of TSV manufacturing and TSV integration. If you aren’t involved, now’s the perfect time — see you at SEMICON West!

Meetings at SEMICON West 2011
3D-IC technology is in the spotlight at SEMICON West 2011, with technical sessions, keynote presentations, and exhibitors all dedicated to products, technologies, and solutions for 3D-IC, including design, device fabrication, packaging, and test. For information, visit www.semiconwest.org/Segments/3DIC.

SEMI HB-LED

The SEMI North America (NA) HB-LED Standards Committee met on March 31 in conjunction with the NA Standards Spring 2011 meetings in San Jose, California. The all-day event was held at SEMI Headquarters and included meetings of the committee’s three chartered task forces: Wafer TF, Equipment Automation Interfaces TF, and Assembly TF. Prior to the NA Spring meetings, the HB-LED task forces met in conjunction with the Strategies in Light Conference (February 23, 2011) in Santa Clara, CA.

The HB-LED Wafer Task Force was chartered to define physical geometry of wafers used in HB-LED manufacturing starting with 150 mm diameter sapphire wafers. In early March, the task force deployed a survey to gather industry inputs on these identified priorities.
The task force reviewed the preliminary survey results at the NA Spring meetings which included responses from sapphire wafer producers/growers, equipment suppliers (including MOCVD tools), and end users.

The Equipment Automation Task Force includes the development of both software and hardware requirements for the HB-LED manufacturing automation system. For automation software, presentations were provided on the benefits of Equipment Data Acquisition and how it compares to (and possibly complement with) SECS/GEM implementation. Aixtron also presented on existing SEMI Standards (e.g., SEMI E5, SEMI E30, SEMI E37/E37.1) currently used on MES interfaces for MOCVD equipment, but also emphasized the need for additional SEMI Standards for future fully automated tools.

The HB-LED Committee is also discussing a proposal to establish an EHS standardization activity with regard technology in fabs for III/V process operation because different technical understanding of safety technology exists on silicon customer side and MOCVD tool vendor side.

Meetings at SEMICON West 2011
The next NA HB-LED Standards meetings will take place on Thursday, July 14 in conjunction with SEMICON West 2011.

450 mm

There is a good level of enthusiasm for 450 mm from SEMI Standards volunteers which has translated to progress on multiple 450 mm standards document activities including the publication of SEMI 450 mm specifications for FOUPs, loadports and interfaces.

With the publication of these specifications, the industry can now focus on initial research and development of interfaces, processes, materials, and equipment which would be ultimately required for semiconductor manufacturing on 450 mm wafers.

Also, there has been progress in both front-opening shipping box (FOSB) and Assembly and Packaging. A FOSB specification has been completed (Draft Document 4760), along with a specification for a new carrier for 450mm wafers, the Multi-Application Carrier (MAC) (Draft Document 4770). And in Assembly and Packaging SEMI G88-0211 a Specification for Tape Frame for 450 mm Wafer was published.

The Physical Interfaces & Carriers Committee develops specifications to specifically addressing mechanical, electrical, and special equipment specifications; and material movement integration, including substrate support and containment structures. For information contact Ian McLeod at imcleod@semi.org or Hiro’fumi Kanno at hkanno@semi.org.

The Silicon Wafer Committee develops international standards fulfilling the requirements for commercial silicon wafers. For information contact Kevin Nguyen at knguyen@semi.org or Akiko Yamamoto at ayamamoto@semi.org.

The Assembly & Packaging Committee develops specifications for materials, piece parts, and interconnection schemes, and unique packaging assemblies that provide for the communication link between the semiconductor chip and the next level of integration.