Shared Equipment Authority (SEA)

We provide sophisticated research equipment and facilities to all members of the Rice University community, as well as support and open instrumentation usage to outside companies, nano/bio/enviro start-ups and other universities upon availability.

Shared Equipment Authority (SEA)

We provide sophisticated research equipment and facilities to all members of the Rice University community, as well as support and open instrumentation usage to outside companies, nano/bio/enviro start-ups and other universities upon availability.

Contacts

Description

USAGE OF THIS INSTRUMENT IS NOW LOGGED EXCLUSIVELY THROUGH FOM: https://fom.rice.edu/fom/ The die bonder is a walk-up tool; no reservation required. The Fineplacer Lmabda is a flip-chip die bonder made by Finetech and is used for precise placement of dies and components for bonding to device substrates. It can provide sub-micron placement accuracy and can accommodate custom tooling for handling a variety of materials. Standard tooling for the instrument is capable of handling dies as small as 2-3 mm and substrates up to 50 mm square. A heated stage and a heated placement tool option are available to facilitate bonding processes. This instrument is not currently reservable (walk-up usage by qualified persons welcome), but that may change if demand for it increases sufficiently.