A director of Chinese studies at analyst firm IHS, Wang Yang, a member of the IHS Technology team, made the reported leak on an Asian social network, Weibo.

The ultrasound Sense ID system, which can work through glass, could integrate well with the smartphone’s Qualcomm Snapdragon 821 chipset, which boasts 6GB of RAM.

In addition, a presentation slide has also surfaced, which reveals how this feature will be implemented on the upcoming Xiaomi smartphone.

Qualcomm’s ultrasonic fingerprint sensor is an innovative solution that recognises the user’s fingerprint using ultrasonic waves to scan and create a 3D model of it. But this isn’t the most attractive part of this tech – the sensor can work through different materials like steel, sapphire, glass, and plastic. The LeEco Le Max Pro (first impressions) was the first smartphone to utilise this technology.

As per the presentation slide, the Xiaomi Mi 5s will not sport a physical button in the front – instead it will feature a capacitive key like the one found on the Mi Max