Thermal Gap Filler Liquid Dispensed Pad

Momentive’s thermally conductive gap fillers are non-slumping, dispensable materials that can be applied to gaps to create a heat path. These non-adhesive curing type TIMs form a soft, stress-absorbing thermal interface. In addition to filling gaps in electronic components, they can be applied to flat or high-profile 3-dimentional surfaces as a cure-in-place thermal pad or as a pump-out resistant alternative to greases.

Key Features of Momentive's Thermal Gap Fillers

Good thermal conductivity

Fast, low temperature cure

Helps provide stress relief during thermal cycling

Conforms to complex, 3-dimensional designs

Non-adhesive, repairable

Product Details

Properties

TIS420C

TIA225F

TIA241GF

Mixing Ratio ((A):(B) by weight)

-

100:100

100:100

Property (uncured)

Non-Flowable

Non-Flowable

Non-Flowable

Color

Gray

Gray

Blue

Viscosity (23°C)

Pa.s

300

90

130

Workable Life (23°C)

h

-

4

3

Tack Free Time

min

30

-

-

Cure Condition (heat)

°C/h

-

70/0.5

70/0.5

Specific Gravity (23°C)

3.2

2.9

3.14

Thermal Conductivity1

W/m.K

4.2

2.5

4.1

Thermal Resistance2 (BLT)

mm2.K/W

20 (50μm)

35 (50μm)

30 (80μm)

Volume Resistivity

MΩ.m

3.0x103

6.0x106

1.0x104

Volatile Siloxane (D4-D10)

ppm

100

200

150

1Hot wire method, 2Laser flash analysis on Si-Si sandwiched material

Typical property data values should not be used as specifications

More Information

* Silplusは、新日鉄住金化学株式会社の商標であり、許可を得て使用しています。

*The marks followed by an asterisk (*) are trademarks of Momentive Performance Materials Inc.