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A method of encapsulating a panel of electronic components such as power
converters reduces wasted printed circuit board area. The panel, which
may include a plurality of components, may be cut into one or more
individual pieces after encapsulation. The mold may be used to form part
of the finished product, e.g. providing heat sink fins or a surface mount
solderable surface. Interconnection features provided along boundaries of
individual circuits are exposed during the singulation process providing
electrical connections to the components without wasting valuable PCB
surface area. The molds may include various internal features such as
registration features accurately locating the circuit board within the
mold cavity, interlocking contours for structural integrity of the
singulated module, contours to match component shapes and sizes enhancing
heat removal from internal components and reducing the required volume of
encapsulant, clearance channels providing safety agency spacing and
setbacks for the interconnects. Wide cuts may be made in the molds after
encapsulation reducing thermal stresses and reducing the thickness of
material to be cut during subsequent singulation. External mold features
can include various fin configurations for heat sinks, flat surfaces for
surface mounting or soldering, etc. Blank mold panels may be machined to
provide some or all of the above features in an on-demand manufacturing
system. Connection adapters may be provided to use the modules in
vertical or horizontal mounting positions in connector, through-hole,
surface-mount solder variations. The interconnects may be plated to
provide a connectorized module that may be inserted into a mating
connector. Reuseable plates may be used instead of the heat sink panels.
Alternatively the panel may be encapsulated in and separated from a
re-useable mold after curing.

146. A method of making a plurality of electronic devices, comprising:
providing a printed circuit board (PCB) panel including a PCB having a
plurality of conductive traces and a plurality of components electrically
connected to form a plurality of circuits, the PCB having a plurality of
embedded conductive features for making electrical connections to the
plurality of circuits; enclosing the PCB panel, including the PCB,
components, and embedded conductive features in a mold cavity; filling
the mold cavity with mold compound; curing the mold compound; and cutting
the encapsulated PCB panel to expose at least a portion of the plurality
of embedded conductive features and form respective exposed contacts.

147. The method of claim 165 further comprising: mating the PCB panel
with a center plate having an opening for receiving the PCB panel;
covering the opening of the center plate with at least one plate; and
wherein the enclosing comprises closing the mold against the center plate
and exerting pressure to force the at least one plate against the center
plate; and wherein the removing comprises removing the at least one plate
from the encapsulated assembly.

148. The method of claim 165 further comprising: mating the PCB panel
with a center plate; and wherein the enclosing comprises closing the mold
against the center plate; wherein the curing bonds the PCB panel to the
center plate; wherein the removing comprises removing the bonded
centerplate and PCB panel.

149. The method of claim 146 further comprising: providing one or more
registration features for positioning the panel assembly in the mold
cavity; creating voids in the mold compound with one or more of the
registration features by displacing uncured mold compound for reference
after the encapsulated PCB panel is removed from the mold.

150. The method of claim 146 further comprising: making holes in the
cured mold compound to expose portions of the PCB.

151. The method of claim 146 further comprising removing a layer of
material from a first surface of the encapsulated panel assembly.

152. The method of claim 151 further comprising removing a layer of
material from a second surface of the encapsulated PCB panel.

153. The method of claim 151 wherein the components include a magnetic
core and the removing a layer of material exposes a surface of the
magnetic core.

154. The method of claim 153 wherein the removing a layer of material
from the top surface of the encapsulated panel assembly provides finished
surfaces and reduces the encapsulated panel assembly to a controlled
thickness.

155. The method of claim 146 wherein the cutting divides the PCB panel
producing at least one module having a plurality of layers including
respective portions of the PCB panel and the encapsulant on each side of
the PCB panel, and the module contains at least one of the circuits.

156. The method of claim 155 further comprising providing an adapter
having at least one electrical terminal; and attaching the at least one
electrical terminal to the exposed contact.

157. The method of claim 156 wherein the at least one contact comprises a
plurality of contacts; the module comprises a plurality of exposed
contacts; the adapter has a plurality of electrical terminals arranged to
match respective ones of the plurality of exposed contacts; and the
adapter is mechanically secured to the module.

158. The method of claim 155, wherein the traces and components are
electrically connected to form a plurality of separable circuits arranged
in a pattern on the PCB; and the cutting divides the PCB panel along
spaces between the separable circuits into a plurality of modules each
containing at least one respective circuit.

159.-164. (canceled)

165. The method of claim 146, comprising removing the encapsulated PCB
panel from the mold.

166. The method of claim 146, comprising forming a panel assembly
including mold panels having interior surfaces that define the mold
cavity, in which the mold compound fills spaces between the PCB and the
interior surfaces.

167. The method of claim 146, comprising cutting the mold panels along
with cutting the encapsulated PCB panel to form individual modules, in
which for each module, an exterior surface of a portion of one of the
mold panels forms an exterior surface of the module.

168. The method of claim 167 in which the exterior surface of the mold
panel comprises a plurality of fins.

169. The method of claim 167 in which the exterior surface of the mold
panel comprises a flat surface.

170. The method of claim 169 in which the flat surface is adapted for a
solder joint.

171. The method of claim 167 in which one or more pins protrude from the
flat surface.

172. The apparatus of claim 167 in which the exterior surface of the mold
panel comprises a flat surface having one or more holes in the flat
surface.

173. The apparatus of claim 172, further comprising inserting a pin into
a respective one of the one or more holes.

174. The method of claim 146 in which some components are distributed
symmetrically between both surfaces of the PCB.

175. The method of claim 146 in which the PCB includes a top surface and
a bottom surface and the plurality of components comprise a set of
top-side components mounted on the top surface and a set of bottom-side
components mounted on the bottom surface, the top-side components include
a number, T, of large-footprint components, the bottom-side components
include a number, B, of large-footprint components, and the number T is
approximately equal to the number B.

176. The method of claim 175 in which each of most of the top-side
large-footprint components shares a respective set of conductive vias
with a corresponding one of the bottom-side large-footprint components.

177. The method of claim 175 in which each of most of the top-side
large-footprint components is located in a respective footprint shared by
a corresponding one of the bottom-side large-footprint components.

178. The method of claim 146 in which some components are distributed
symmetrically on a surface of the PCB.

179. The method of claim 146 in which the PCB includes a top surface and
the plurality of components comprises a number of large-footprint
components mounted on the top surface, and most of the large-footprint
components are distributed symmetrically in relation to an axis on the
top surface.

180. The method of claim 179 in which the axis is along a midline of the
top surface.

181. The method of claim 179 in which the axis is defined in relation to
a predetermined component.

Description

CROSS-REFERENCE TO RELATED APPLICATION

[0001] This is a continuation-in-part of U.S. patent application Ser. No.
13/105,696, filed on May 11, 2011, the entire disclosure of which is
incorporated herein by reference.

FIELD OF THE INVENTION

[0002] This invention relates to the field of encapsulating electronic
assemblies and more particularly to encapsulated power converters.

BACKGROUND

[0003] Contemporary electronic power systems require power converters
capable of deployment at the point of load. Competing considerations
require increasing power density, decreasing mounting area on customer
motherboard, and lower cost.

[0004] An encapsulated electronic module, such as an electronic power
converter module for example, may comprise a printed circuit assembly
over-molded with an encapsulant to form some or all of the package and
exterior structure or surfaces of the module. Encapsulation in this
manner may aid in conducting heat out of the over-molded components,
i.e., components that are mounted on the printed circuit assembly and
covered with encapsulant. In the case of an electronic power converter
module, the printed circuit assembly may include one or more inductive
components, such as inductors and transformers. Encapsulated electronic
power converters capable of being surface mount soldered to a customer
motherboard are described in Vinciarelli et al., Power Converter Package
and Thermal Management, U.S. Pat. No. 7,361,844, issued Apr. 22, 2008,
(the "SAC Package Patent") (assigned to VLT, Inc. of Sunnyvale, Calif.,
the entire disclosure of which is incorporated herein by reference).
Encapsulated electronic modules having at least one surface of a magnetic
core structure exposed and methods for manufacturing the same are
described in Vinciarelli et al., Encapsulation Method and Apparatus for
Electronic Modules, U.S. patent application Ser. No. 12/493,773, filed
Jun. 29, 2009, (the "Exposed Core Application") (assigned to VI Chip Inc.
of Andover, Mass., the entire disclosure of which is incorporated herein
by reference).

[0006] Leads for connecting the encapsulated power converter substrate to
the customer motherboard are described in Vinciarelli et al., Surface
Mounting A Power Converter, U.S. Pat. No. 6,940,013, issued Sep. 6, 2005
(the "J-Lead Patent") (assigned to VLT, Inc. of Sunnyvale, Calif., the
entire disclosure of which is incorporated herein by reference).

SUMMARY

[0007] In general, in one aspect, a method of making a plurality of
electronic devices is provided. The method includes providing a plurality
of mold panels, which when assembled, form an internal chamber; providing
a substrate having a plurality of conductive traces and a plurality of
components electrically connected to form at least one circuit, the
substrate having at least one contact for making an electrical connection
to the circuit; forming a panel assembly including the mold panels
assembled with the substrate in the internal chamber and an encapsulant
filling spaces between the substrate and interior surfaces of the
chamber; curing the encapsulant; and cutting the panel assembly to expose
at least a portion of the at least one contact and form a respective
exposed contact.

[0008] Implementations of the method may include one or more of the
following features. The cutting can include making a first cut in at
least one of the mold panels, and in the first cut, making a second
narrower cut through the panel assembly. The curing can include raising
the temperature of the panel assembly and the first cut is made before
the panel assembly cools after the curing. The cutting can divide the
panel assembly producing at least one module having a plurality of layers
including respective portions of each of the panel molds, the substrate,
and the encapsulant, and the module can contain the at least one circuit.
The cutting can define at least one side of the module. The cutting can
defines two or more sides of the module. The method can further include
treating the exposed contact to protect against oxidation. Treating the
exposed contact can include applying a removable conformal coating to the
exposed contact. Treating the exposed contact can include applying a
layer of metal to the exposed contact. The metal applied to the exposed
contact can include solder or a precious metal. Applying a layer of metal
can include plating. The method can further include providing an adapter
having at least one electrical terminal; and attaching the at least one
electrical terminal to the exposed contact. The at least one contact can
include a plurality of contacts; the module can include a plurality of
exposed contacts; the adapter can have a plurality of electrical
terminals arranged to match respective ones of the plurality of exposed
contacts; and the adapter can be mechanically secured to the module. The
mold panels can be metal. The respective portions of the mold panels can
provide heat sink surfaces for the module. Contours can be provided in an
internal surface of one or more of the mold panels. Providing the
contours can include matching depths of portions of the internal surface
to heights of one or more selected components. The selected components
can include at least one magnetically permeable core and at least one
semiconductor device. The traces and components can be electrically
connected to form a plurality of separable circuits arranged in a pattern
on the substrate; and the cutting can divide the panel assembly along
spaces between the separable circuits into a plurality of modules each
containing at least one respective circuit. The spaces between the
separable circuits can have dimensions approximately matching a width of
cuts produced by equipment used to cut the panel assembly. The at least
one contact can include a plurality of contacts located in the spaces
between the separable circuits. The plurality of contacts can be formed
in the substrate. The plurality of contacts can be formed and buried
below at least one surface of the substrate. The method can include
treating at least one exterior surface of at least one of the mold panels
for solderability. Forming the panel assembly can include dispensing
encapsulant into a bottom panel mold; assembling the substrate into the
bottom panel mold; dispensing encapsulant onto a top of the substrate;
and assembling a top panel mold onto the substrate. The method can
include centrifuging the assembly before curing the encapsulant. Forming
the panel assembly can include assembling the substrate with a first
substrate surface facing into a first panel mold, closing a second panel
mold onto the substrate covering a second substrate surface, providing
one or more conduits to the internal chamber, and forcing encapsulant
through the one or more conduits into the chamber. The method can further
include centrifuging the assembly before curing the encapsulant. The
method can further include providing a connector for removably mating
with and providing electrical connection to the metal. The method can
further include providing a center plate having an opening to accommodate
the substrate. Forming a panel assembly can include positioning the
substrate in the opening of the center plate and closing the mold panels
against the center plate. The method can further include providing at
least one opening in the center plate connected to the internal chamber
by at least one conduit; and forcing the encapsulant through the at least
one opening and at least one conduit into the internal chamber. Forming a
panel assembly can include securing the mold panels together prior to
curing the encapsulant.

[0009] In general, in another aspect, a method of forming an electrical
contact is provided. The method includes assembling a panel including a
substrate having one or more conductive features enclosed within the
panel and unexposed to an exterior surface of the panel, the one or more
conductive features being located along a cut line; cutting the panel
along the cut line exposing portions of the one or more conductive
features for use as electrical connections to the substrate; and treating
the portions of the one or more conductive features exposed from the
cutting for preservation as electrical connections.

[0010] Implementations of the method may include one or more of the
following features. The treating can include applying solder to the
portions of the one or more conductive features exposed from the cutting.
The treating can include applying a conformal coating to the portions of
the one or more conductive features exposed from the cutting to protect
against oxidation. The treating can include applying a metal layer to the
portions of the one or more conductive features exposed from the cutting.
The treating can include soldering a lead of an adapter to the portions
of the one or more conductive features exposed from the cutting. The
method can further include covering at least one surface of the substrate
in an area including the cut line and the conductive features prior to
cutting the substrate. The covering can include encapsulating the
substrate with a molding compound. The method can further include
providing a registration feature having a predetermined relationship to
the substrate, and using the registration feature to align the cutting
relative to the cut line. The method can further include establishing a
pattern including at least one conductive layer in the substrate along
the cut line to form the conductive features. The substrate can include a
multilayer printed circuit board, and the pattern can include a plurality
of conductive layers that are established along the cut line to form the
conductive features. The method can further include establishing a
pattern including at least one conductive via in the substrate along the
cut line to form the conductive features. The conductive via can be
filled with a conductive material. The conductive via can be buried in
the substrate. The conductive via can be a through hole contacting the
surfaces of the substrate. The through hole can be filled with a
conductive material. The conductive features can be covered at the
surfaces of the substrate by an insulative layer.

[0011] In general, in another aspect, an apparatus including a first mold
panel is provided. The first mold panel includes an exterior surface, an
interior surface defining an internal cavity, a clamp region located at
points along a circumference of the internal cavity, and an opening. The
first mold panel is adapted to (a) be engaged by pressure in the clamp
region, (b) receive in the cavity a circuit panel containing a plurality
of components and mold compound to fill empty spaces in the internal
cavity, and (c) be cut after curing of the mold compound.

[0012] Implementations of the apparatus may include one or more of the
following features. The interior surface in the region of the internal
cavity can be adapted to adhere to the mold compound. The apparatus can
further include a second mold panel. The second mold panel can include an
exterior surface, an interior surface, and a clamp region, in which the
second mold panel can be adapted to (a) close against and mate with the
first mold panel, (b) be engaged by pressure in the clamp region, and (c)
be cut after curing of the mold compound. The interior surface of the
second mold can further define a second internal cavity, the clamp region
of the second mold panel can be located at points along a circumference
of the second internal cavity, and the internal cavity of the first mold
panel can be adapted to receive a first side of the circuit panel and the
second internal cavity can be adapted to receive a second opposite side
of the circuit panel. The apparatus can further include contours formed
in the interior surface of at least one of the mold panels. The contours
can be adapted to match predetermined characteristics of selected ones of
the plurality of components. The internal surface of the mold panel can
be adapted to adhere to the molding compound. The contours can form
interlocking features with cured mold compound. One or more of the mold
panels can include a non-ferrous metal, aluminum, or a thermally
conductive material. One or more of the mold panels can include a
non-metallic substance. The apparatus can further include at least one
channel connected to the internal cavity for allowing expansion of the
mold compound. The apparatus can further include at least one channel
connected to the internal cavity for injecting mold compound into the
internal cavity. The exterior surface of the mold panel can include a
plurality of fins. The exterior surface of the mold panel can include a
flat surface. The flat surface can be adapted for a solder joint. The
internal cavity can include features formed in the interior surface and
arranged in a predetermined pattern. The internal cavity can include
features formed in the interior surface along lines through which the
mold panel maybe cut to establish a setback from a cut edge of the mold
panel. The mold panel can include at least one registration feature
adapted to engage and establish a predetermined relationship with the
circuit panel. One or more selected portions of the mold panel can be
adapted for incorporation into one or more products, the products being
formed by a process which uses the mold panel to contain the molding
compound. The exterior surface of the mold panel can include a flat
surface with one or more pins protruding from the flat surface. The
exterior surface of the mold panel can include a flat surface having one
or more holes in the flat surface. The apparatus can further include a
pin inserted into a respective one of the one or more holes.

[0013] In general, in another aspect, an apparatus including a panel
assembly having external surfaces defined by a first mold panel and a
second mold panel is provided. The first and second mold panels form an
internal cavity enclosing an internal circuit board, the internal circuit
board having a first surface and second surface and a plurality of
components in an active circuit area on at least one of the surfaces, the
components being electrically connected to interconnects contained within
the internal cavity. The internal cavity is filled with mold compound in
spaces unoccupied by the circuit board and components, and the panel
assembly is adapted to have first selected portions of the first and
second mold panels cut away to expose the interconnects and to have
second selected portions of the respective mold panels situated near the
active circuit area remain attached to the assembly following the cut.

[0014] Implementations of the apparatus may include one or more of the
following features. The panel assembly can include a clamp region located
at points along a circumference of the first and second internal
cavities, and the first selected portions can include the clamp region.

[0015] In general, in another aspect, an apparatus including a panel
assembly having external surfaces defined by a first mold panel and a
second mold panel is provided. The first and second mold panels form an
internal cavity enclosing an internal circuit board, the internal circuit
board having a first surface and second surface and a plurality of
components electrically connected to form a plurality of individual
circuits, each individual circuit being electrically connected to
respective interconnects located along a respective circuit perimeter,
the interconnects being contained within the cavity.

[0016] Implementations of the apparatus may include one or more of the
following features. The panel assembly can be adapted to be cut along the
circuit perimeter separating the individual circuits, dividing the panel
assembly into individual circuit modules, and exposing selected portions
of the interconnects. The panel assembly can be constructed to retain an
integral layered structure after being filled with mold compound which is
subsequently cured, the layered structure comprising a first layer
including a portion of the first mold, a second layer including a portion
of the mold compound, a third layer including a portion of the circuit
board, a fourth layer including a portion of the mold compound, and a
fifth layer including a portion of the second mold. The internal circuit
board can include a plurality of circuits having the same functionality.
The apparatus can further include one or more conduits connecting the
internal cavity to an external opening. Spaces unoccupied by the circuit
board, components, and interconnects in the internal cavity can be filled
with mold compound. The mold compound has been cured. Selected portions
of at least one of the mold panels have been removed, the selected
portions being located near the circuit perimeters.

[0017] In general, in another aspect, an apparatus including a modular
package is provided. The modular package has a first external surface, a
second external surface opposite the first external surface, and a side
wall extending along the perimeter of and connecting with the first and
second external surfaces. The modular package includes a first layer
defining the first external surface and a second layer defining the
second external surface, the first and second layers being separated by
and in contact with cured mold compound. An electrical circuit is located
between the first and second layers and within the cured mold compound
and including at least one electrical component electrically connected to
a plurality of interconnects. The side wall includes a strip formed by
the first layer, a strip formed by the second layer, and a strip formed
by the cured mold compound. The interconnects are disposed within the
side wall.

[0018] Implementations of the apparatus may include one or more of the
following features. The first and second layers can include a non-ferrous
metal or aluminum. The first external surface can include a plurality of
fins. The first external surface can include an essentially flat area.
The essentially flat area can be adapted for a solder joint. The
electrical circuit can include a circuit board, and the side wall can
include a strip formed by the circuit board and an additional strip
formed by cured mold compound. The interconnects can include conductive
features in the circuit board. The circuit board can include a multilayer
printed circuit board ("PCB") and each of the interconnects can include a
plurality of conductive layers in the PCB. Each of the interconnects can
include a plurality of conductive vias in the circuit board. The
apparatus can further include interlocking features. The interlocking
features can include a contour formed in an interior surface of the first
layer, the contour being filled with cured mold compound. The circuit
board can include a top surface and a bottom surface and the at least one
electrical component can include a set of top-side components mounted on
the top surface and a set of bottom-side components mounted on the bottom
surface. The top-side components can include a number, T, of
large-footprint components, the bottom-side components can include a
number, B, of large-footprint components, and the number T can be
approximately equal to the number B. Each of most of the top-side
large-footprint components can share a respective set of conductive vias
with a corresponding one of the bottom-side large-footprint components.
Each of most of the top-side large-footprint components is located in a
respective footprint shared by a corresponding one of the bottom-side
large-footprint components. The circuit board can include a top surface
and a bottom surface, the at least one electrical component can include a
number, T, of large-footprint components mounted on the top surface, and
most of the large-footprint components can be distributed symmetrically
in relation to an axis on the top surface. The axis can be along a
midline of the top surface. The axis can be defined in relation to a
predetermined component. The apparatus can further include an adapter for
providing mechanical and electrical connections between the modular
package and an external mounting surface, the adapter having a body and a
plurality of electrical terminals supported by the body; and electrical
connections formed between the adapter terminals and respective
interconnects on the modular package. The adapter body can be
mechanically secured to the modular package, and the adapter terminals
can be arranged to mate with the external mounting surface. The external
mounting surface can be a circuit board and the terminals can include
ends constructed and arranged to be inserted into conductive holes in the
circuit board. The external mounting surface can be a circuit board and
the terminals can include ends constructed and arranged to be surface
mount soldered to the circuit board. The external mounting surface can
include a connector and the terminals can include ends constructed and
arranged to mate with the connector. The interconnects can be disposed
along a long edge of the modular package, the adapter can be secured to
the long edge of the modular package, and the first and second layers of
the modular package can be oriented perpendicular to the mounting
surface. The interconnects can be disposed along opposite edges of the
modular package, the adapter can be secured to the opposite edges, and
the first and second layers of the modular package can be oriented
essentially parallel to the mounting surface. The adapter can be
constructed and arranged to maintain one of the first or second layers in
contact with the mounting surface. The interconnects can include a
surface constructed and arranged for engagement with a connector
terminal. The interconnects can include a layer of metal plating.

[0019] In general, in another aspect, an apparatus includes a modular
package having a first external surface, a second external surface
opposite the first external surface, and a side wall extending along the
perimeter of and connecting with the first and second external surfaces,
the modular package including a first layer of metal defining the first
external surface and a second layer of metal defining the second external
surface, the first and second layers being separated by and in contact
with cured mold compound; and an electrical circuit for converting power,
including a printed circuit board ("PCB"), a plurality of components
including semiconductors mounted to the PCB, and a plurality of
interconnects electrically connected to the components, the electrical
circuit being located between the first and second layers and within the
cured mold compound. The side wall includes a strip formed by the first
layer, a strip formed by the second layer, a strip formed by the PCB, and
one or more strips formed by the cured mold compound. The interconnects
are disposed within the side wall.

[0020] Implementations of the apparatus may include one or more of the
following features. The first and second layers can include aluminum, and
the first external surface can include a plurality of fins. The first and
second layers can include aluminum, and the first external surface can
include an essentially flat area. The essentially flat area can be
adapted for a solder joint. The PCB can include a top surface and a
bottom surface, the semiconductors can include large-footprint switches.
A number, T, of top-side large-footprint switches can be mounted on the
top surface, a number, B, of bottom-side large-footprint switches can be
mounted on the bottom surface, and the number T can be approximately
equal to the number B. Each large-footprint switch can be connected to
one or more other components by a respective set of conductive vias in
the PCB, and each of a plurality of the top-side large-footprint switches
can share its respective set of conductive vias with a corresponding one
of the bottom-side large-footprint switches. Most of the large-footprint
switches can be positioned on one surface in a location substantially
overlapping a location on the other surface occupied by another
large-footprint switch. The apparatus of claim 151 wherein the PCB
includes a top surface and a bottom surface, the semiconductors include
large-footprint switches mounted on the top surface, most of the
large-footprint components are distributed symmetrically between a left
side of the top surface and an opposite right side of the top surface.
The PCB can include a top surface and a bottom surface, the
semiconductors can include large-footprint switches mounted on the top
surface, and most of the large-footprint components can be distributed
symmetrically between quadrants on the top surface. The components can
include a transformer core. The quadrants can surround the transformer
core. The PCB can include a top surface and a bottom surface, and the
components can include a set of high-profile components having similar
heights. A number, T, of the high-profile components can be mounted on
the top surface, a number, B, of the high-profile components can be
mounted on the bottom surface, and the number T can be approximately
equal to the number B. A spatial distribution of the high-profile
components on the top surface can roughly match a spatial distribution of
the high-profile components on the bottom surface. The apparatus can
further include an adapter for providing mechanical and electrical
connections between the modular package and an external mounting surface,
the adapter having a body and a plurality of electrical terminals
supported by the body; and electrical connections formed between the
adapter terminals and respective interconnects on the modular package.
The adapter body can be mechanically secured to the modular package, and
the adapter terminals can be arranged to mate with the external mounting
surface. The external mounting surface can be a circuit board and the
terminals can include ends constructed and arranged to be inserted into
conductive holes in the circuit board. The external mounting surface can
be a circuit board and the terminals can include ends constructed and
arranged to be surface mount soldered to the circuit board. The external
mounting surface can include a connector and the terminals can include
ends constructed and arranged to mate with the connector. The
interconnects can be disposed along a long edge of the modular package,
the adapter can be secured to the long edge of the modular package, and
the first and second layers of the modular package can be oriented
perpendicular to the mounting surface. The interconnects can be disposed
along opposite edges of the modular package, the adapter can be secured
to the opposite edges, and the first and second layers of the modular
package can be oriented essentially parallel to the mounting surface. The
adapter can be constructed and arranged to maintain one of the first or
second layers in contact with the mounting surface. The interconnects can
include a surface constructed and arranged for engagement with a
connector terminal. The interconnects can include a layer of metal
plating. The first layer can include contours formed in an interior
surface of the first layer, the contours including a first feature having
a shape and an elevation to accommodate a first component on the PCB, the
first component having a height greater than or less than other
components on the PCB. The first component can include a magnetic core
structure and the elevation can be a recess in the interior surface. The
first component can include a semiconductor switch and the elevation can
be a protrusion from the interior surface. The apparatus can further
include interlocking features having a contour formed in an interior
surface of the first layer, the contour being filled with cured mold
compound. The modular package can include a recess formed in the first
layer adjacent one or more of the interconnects providing a setback
between the first layer and the one or more interconnects.

[0021] In general, in another aspect, an apparatus includes a power
converter is provided. The power converter includes a printed circuit
board ("PCB") having a plurality of conductive layers and having a top
surface and a bottom surface; a magnetic core structure magnetically
coupled to a winding formed by traces in one or more of the conductive
layers in the PCB; and a plurality of power semiconductor devices. A
first set of the power semiconductor devices is mounted on the top
surface and electrically connected to dissipate power at a level, Pt,
during operation of the converter, and a second set of the power
semiconductor devices is mounted on the bottom surface and electrically
connected to dissipate power at a level, Pb, during operation of the
converter. The power semiconductor devices are distributed between the
first and second sets to distribute heat generation during operation of
the converter such that each level Pt, Pb is less than 150% of the other
level Pb, Pt.

[0022] Implementations of the apparatus may include one or more of the
following features. A plurality of the power semiconductor devices in the
first set can each be positioned in a location on the top surface
substantially overlapping a location on the bottom surface occupied by a
power semiconductor device in the second set. The power semiconductor
devices can be electrically connected using a respective set of
conductive vias in the PCB, and a plurality of the power semiconductor
devices in the first set can share their respective sets of conductive
vias with corresponding power semiconductor devices in the second set.
The power converter can include circuitry having a pair of cells that
have a common circuit topology and each including power semiconductor
switches from each of the first and second sets. Each cell can have its
respective components arranged in a pattern, in which the pattern of
components of one cell is substantially a mirror image of the pattern of
components in the other cell. A component from one of the cells can be
located on an opposite surface of a respective component from the other
one of the cells. The cells can include input cells. The power
semiconductor devices can include output switches.

[0023] In general, in another aspect, a method of manufacturing a
plurality of products is provided. The method includes inserting a
plurality of components into a cavity formed by one or more molds;
closing the one or more molds to form a seal around the cavity; filling
the cavity with mold compound; curing the mold compound in the cavity to
secure the components, cured mold compound, and molds together into an
assembly; and cutting the assembly to separate the plurality of products
from the assembly, the products each including a respective section of
the one or more molds which remains as an integral part of each
respective product.

[0024] Implementations of the method may include one or more of the
following features. The method can further include maintaining a
predetermined alignment between the plurality of components and the one
or more molds. The plurality of components can include a substrate having
conductive features. The cutting can include exposing portions of the
conductive features in each respective product.

[0025] In general, in another aspect, a method of making a plurality of
electronic devices is provided. The method includes providing a PCB panel
including a PCB having a plurality of conductive traces and a plurality
of components electrically connected to form a plurality of circuits, the
PCB having a plurality of contacts for making an electrical connections
to the plurality of circuits; enclosing the PCB panel, including the PCB,
components, and contacts in a mold cavity; filling the mold cavity with
mold compound; curing the mold compound; removing the encapsulated PCB
panel from the mold; and cutting the encapsulated PCB panel to expose at
least a portion of the plurality of contacts and form respective exposed
contacts.

[0026] Implementations of the method may include one or more of the
following features. The method can include mating the PCB panel with a
center plate having an opening for receiving the PCB panel; covering the
opening of the center plate with at least one plate; and wherein the
enclosing comprises closing the mold against the center plate and
exerting pressure to force the at least one plate against the center
plate; wherein the removing comprises removing the at least one plate
from the encapsulated assembly. The method can include mating the PCB
panel with a center plate; and wherein the enclosing comprises closing
the mold against the center plate; wherein the curing bonds the PCB panel
to the center plate; wherein the removing comprises removing the bonded
centerplate and PCB panel. The method can include providing one or more
registration features for positioning the panel assembly in the mold
cavity; creating voids in the mold compound with one or more of the
registration features by displacing uncured mold compound for reference
after the encapsulated PCB panel is removed from the mold. The method can
include making holes in the cured mold compound to expose portions of the
PCB. The method can include removing a layer of material from a first
surface of the encapsulated panel assembly. The method can include
removing a layer of material from a second surface of the encapsulated
PCB panel. The components can include a magnetic core and the removal of
a layer of material may expose a surface of the magnetic core. The
removal of a layer of material from the top surface of the encapsulated
panel assembly can provide finished surfaces and reduce the encapsulated
panel assembly to a controlled thickness. The cutting can divide the
substrate producing at least one module having a plurality of layers
including respective portions of the substrate and the encapsulant on
each side of the substrate, and the module can contain at least one of
the circuits. The method can include providing an adapter having at least
one electrical terminal, and attaching the at least one electrical
terminal to the exposed contact. The at least one contact can include a
plurality of contacts; the module can include a plurality of exposed
contacts; the adapter can have a plurality of electrical terminals
arranged to match respective ones of the plurality of exposed contacts;
and the adapter can be mechanically secured to the module. The traces and
components can be electrically connected to form a plurality of separable
circuits arranged in a pattern on the PCB; and the cutting can divide the
PCB panel along spaces between the separable circuits into a plurality of
modules each containing at least one respective circuit.

[0027] In general, in another aspect, an apparatus includes a modular
package having a first external surface, a second external surface
opposite the first external surface, and a side wall extending along the
perimeter of and connecting with the first and second external surfaces,
the first and second external surfaces each being defined at least in
part by a respective layer of cured mold compound; and an electrical
circuit for converting power, including a printed circuit board ("PCB"),
a plurality of components including semiconductors mounted to the PCB and
a plurality of interconnects electrically connected to the components,
the electrical circuit being located within the cured mold compound. The
side wall includes a strip formed by the PCB between strips formed by the
layers of cured mold compound defining the first and second external
surfaces; and the interconnects are disposed within the side wall.

[0028] Implementations of the apparatus may include one or more of the
following features. The electrical circuit can include a magnetic core,
and at least one of the first and second external surfaces can also be
defined by a surface of the magnetic core. The apparatus can include an
adapter for providing mechanical and electrical connections between the
modular package and an external mounting substrate, the adapter having a
body and a plurality of electrical terminals; and electrical connections
formed between the adapter terminals and respective interconnects on the
modular package. The adapter body can be mechanically secured to the
modular package and covering the electrical connections; and the adapter
terminals can be arranged to mate with the external mounting substrate.

[0029] In general, in another aspect, a method of manufacturing a
plurality of products is provided. The method includes inserting a
printed circuit board including a plurality of components into a mold
cavity; closing the mold to form a seal around the cavity; filling the
cavity with mold compound; curing the mold compound in the cavity to form
an encapsulated panel assembly; and cutting the encapsulated panel
assembly to separate the plurality of products from the encapsulated
panel assembly, the products each including a respective section of the
printed circuit board.

[0030] In general, in another aspect, an apparatus includes a panel
assembly having external surfaces defined at least in part by cured mold
compound; the panel assembly including an internal circuit board, the
internal circuit board having a first surface and second surface and a
plurality of components electrically connected to form a plurality of
individual circuits, each individual circuit being electrically connected
to respective interconnects located along a respective circuit perimeter,
the interconnects being contained within the cured mold compound.

[0031] Implementations of the apparatus may include the following feature.
The panel assembly can be adapted to be cut along the circuit perimeter
separating the individual circuits, dividing the panel assembly into
individual circuit modules, and exposing selected portions of the
interconnects.

[0032] The details of one or more embodiments of the invention are set
forth in the accompanying drawings and description below. Other features,
objects, and advantages of the invention will be apparent from the
description and drawings, and from the claims.

[0081] Like references symbols in the various drawings indicate like
elements.

DETAILED DESCRIPTION

I. Vertical PCB Package.

[0082] Referring to FIG. 1, an electronic module 100, e.g. a power
converter, is shown having a generally rectangular form factor with two
large faces 114A, 114B covered by heat sinks 101, 102. As shown between
the heat sinks 101 and 102, the module 100 includes a printed circuit
board ("PCB") 104 having its large faces arranged generally coplanar to
the two large faces 114A, 114B of the electronic module 100. Electronic
components (FIGS. 3, 5, 6) may be mounted to one or both sides of the PCB
104 and electrically interconnected, e.g. by conductive traces on or in
the PCB 104 to form the module circuitry. Using a power converter as an
example, the electronic components may include power transistors, control
ICs, and discrete resistors and capacitors. One or more magnetic core
structures may be provided, which in combination with conductive traces
on PCB 104, may form planar magnetic components such as inductors and
transformers.

[0083] The electronic components may protrude from one or both sides of
the PCB 104 to varying degrees depending upon component size. Spaces
between the faces of PCB 104 and the components on the PCB on one hand
and the interior surfaces of the heat sinks on the other hand may be
filled with molding compound, which when cured may form integral
structural layers 105, 106 as shown in FIG. 1 and further provides a
thermally conductive medium in which heat may be readily conducted away
from the PCB and components to the heat sinks 101, 102. The interior
surfaces of the heat sinks may be contoured to match the height of one or
more of the components while maintaining an appropriate clearance for
insulation and safety agency requirements. Contouring the heat sinks 101,
102 in this way: (1) to match the height of the magnetic core structure
may be used as an alternate approach to the exposed core encapsulation
method described in Vinciarelli, Encapsulation Method and Apparatus for
Electronic Modules, U.S. patent application Ser. No. 12/493,773 filed
Jun. 29, 2009 (assigned to VI Chip Corp. of Andover, Mass., the entire
disclosure of which is incorporated herein by reference); (2) to match
the height of lower profile components, such as power semiconductors, may
(a) increase thermal performance in the case of heat dissipating
components by replacing molding compound with heat sink metal; and (b)
reduce cost generally by reducing the volume of molding compound
required; and (c) further reduce cost by allowing less expensive molding
compound to be used because of reduced thermal pathways through the
encapsulant, easing the thermal conductivity requirements of the
encapsulant (e.g., an encapsulant having a 1 degree Celsius per watt
thermal resistance may be used with the contoured heat sink instead of an
encapsulant having a 3 degrees Celsius per watt thermal resistance used
without the contoured heat sink).

[0084] A connector 103, including terminals 108, 109, 110 and standoffs
107, may be provided as shown along an edge of the PCB 104 to make
electrical connections between the electronic module 100 and external
circuitry. As shown in FIG. 1 with the connector 103 situated along one
edge of the module 100, preferably one of the longest edges, the module
100 may be mounted vertically, i.e. with its internal PCB 104
perpendicular to a chassis or another circuit board such as a
motherboard. Using the vertical mount module construction illustrated in
FIG. 1 for a power converter may provide advantages over the more
conventional horizontal mounting technique. For example, using the
vertical PCB arrangement may allow use of a magnetic core structure that
is thicker than in a horizontal PCB configuration, e.g. because of height
restrictions, enabling increased power throughput, as compared to a
similar converter using a horizontal PCB orientation. The length of the
magnetic path may be also reduced in the vertical PCB configuration
further reducing losses in the magnetic components. Shorter windings may
also be used further reducing transformer or inductor losses. Further
details and variations of, and a process for making, the electronic
module will be discussed below in connection with a panel molding
process.

II. Panel Molding Process Integrated Mold

[0085] A. Overview

[0086] The electronic module 100 shown in FIG. 1 may be fabricated using a
panel molding process described with reference to FIGS. 2-9. The panel
molding process may be used to produce a multiplicity of modules at a
time. A PCB panel 124 may be provided with a plurality of individual
circuits for building the electronic modules. FIGS. 3, 4, and 5 show the
PCB panel 124 populated with electronic components revealing a 3-by-4
pattern of twelve circuits to make twelve individual modules 115 (labeled
115A through 115L in FIG. 5). The illustrative example of FIGS. 3-5,
being for power converters, includes magnetic core structures 131 (FIG.
3) in addition to electronic components 132. As shown in FIG. 5, the
pattern of individual circuits 115A-115L are arranged close together and
separated by small spaces 135 preferably sufficient to allow the PCB
panel to be cut during the singulation process without necessitating two
cuts between modules or unnecessary waste of PCB material. The spacing
may be adjusted based upon the cut dimensions produced by the equipment
used to make the cuts.

[0087] The PCB panel 124 containing the multiplicity of the electronic
circuits (115A-115L in FIG. 5) may be assembled with matching heat sink
panels 121, 122 as shown in FIG. 3 to form a panel assembly 120 (FIG. 2).
As shown in FIGS. 3 and 6, the two heat sink panels 121 and 122 when
assembled together may form an internal cavity 146, which completely
encloses the populated PCB panel 124. FIGS. 2 and 6 show that the heat
sink panels 121 and 122 may be pressed together (e.g. by a mold press
161, 162 as shown in FIG. 7) to form a seal 123 (FIGS. 2, 6-8) around the
perimeter of the internal cavity 146. In this example, the heat sink
panels 121 and 122 also function as mold panels by forming a mold cavity
(e.g., the internal cavity 146) that may be filled at least in part by an
encapsulant encapsulating the surfaces of the PCB panel 124 and the
electronic components on the PCB panel 124.

[0088] B. Heat Sink Panels

[0089] Referring to FIG. 2, the heat sink panels 121, 122 may include fins
on the exterior surfaces as shown. The fins may be arranged in any
direction relative to the panel or in any pattern and may vary in height,
thickness, and spacing as required for the particular application. For
example, modules 115 and 115B shown in FIGS. 10A and 10B respectively
illustrate longitudinal and transverse fin orientations. Alternatively,
one or both of the heat sink panels may have a generally flat exterior
surface omitting the fins altogether. For example, FIGS. 17 and 25 show
modules 315 and 615 produced when both heat sink panel exterior surfaces
are flat and one is flat and one is finned, respectively. The thickness
of the panels between the internal cavity and the external surface may be
varied to suit the particular requirements of the application.

[0090] C. Heat Sink Internal Contours

[0091] Referring to FIG. 3, the contoured interior surface of the bottom
heat sink panel 122 is shown including a 3-by-4 repeating pattern of
twelve (A through L) prominent recesses 141 and shallower recesses 142
and 143. Recesses 141 may be matched to the downward protruding portion
of magnetic core structures 131. Similarly, recesses 142 and 143 may be
matched to other downwardly protruding components on the PCB panel 124.
Note that in the example of FIG. 3, because the core structure 131
protrudes from the PCB 124 more than the other components, the recesses
141 are deeper than recesses 142, 143. Although not visible in FIG. 3,
the interior surface of heat sink panel 121 may similarly include contour
features to match the components and core structure on the upward facing
side of the PCB panel 124 (e.g. as shown in the cross-section of FIGS. 6,
7). Although the interior contour of panel 122 in FIG. 3 is shown
including three recesses 141, 142, 143 repeated for each circuit (A
through L in the 3-by-4 pattern), the interior contours of the heat sink
panels 121 and 122 may range from simple flat surfaces (accommodating the
height of the tallest component) to a complex arrangement of a
multiplicity of recessed and protruding features (accommodating a
multiplicity of component heights) which at the extreme could match every
component individually.

[0092] Additional features may be provided in the heat sink panels to
facilitate the panel molding process, to enhance the mechanical integrity
or performance of the finished module 100, or to satisfy safety agency
clearance requirements for the finished product. By way of example
undercut features, such as undercuts 148 shown in FIGS. 6, 7, and 12 may
be provided at each circuit site (i.e. within each individual module
location) in the heat sink panels 121, 122. As shown the undercuts 148
may be provided in selected recesses, such as recesses 143-1 and 143-2,
and may be dispersed along one or more of the boundary lines of each
circuit 115. During encapsulation, molding compound fills the recesses
and trenches and their respective undercuts 148. When cured, the hardened
molding compound in the undercuts forms a dovetail-like joint securing
the heat sinks to the encapsulated PCB 124. When provided at each circuit
site, the undercuts secure the heat sinks 101, 102 to the PCB 104 in the
individual module 115 providing mechanical integrity after singulation.
Referring to the cross-section of a singulated module 115 in FIG. 12,
dovetail interfaces 149-2 and 149-1 are shown securing the top and bottom
heat sinks 101, 102 to the encapsulated PCB assembly.

[0093] Additionally, clearance features may be provided in the heat sink
panels to satisfy minimum safety agency clearances between electrical
contacts on the PCB 124 and the metal heat sinks 121, 122. As shown in
FIGS. 6 and 7, trenches 147 may be provided in heat sink panels 121 and
122 along the side of each module 115 (the long side as shown in FIGS. 6
and 7) where electrical contacts (discussed in more detail below) are
exposed in or on the PCB 124. The trenches 147 may also include the
undercut features 148 discussed above. For example, cut trench 147 in
FIG. 12 results in a recess 150 of the heat sink 101 away from the edge
104E of the PCB 104 after singulation.

[0094] D. PCB-Heat Sink Registration

[0095] Registration features may be provided in one or both of the heat
sink panels 121, 122 helping to correctly position the PCB panel 124 in
the cavity 146 relative to the heat sink panels 121, 122 (which is
particularly important when the panel is cut during the singulation
process) and to correctly position the heat sink panels relative to each
other during assembly and during subsequent molding processes. Referring
to FIGS. 3 and 4, beveled corners 144 may be provided in heat sink panel
122 to interface with matching indentations 133 which may be provided in
PCB panel 124 for registration when assembled together (FIGS. 4 and 5).
FIG. 5, which is a top plan view of the PCB panel 124 assembled with the
bottom heat sink 122, shows the beveled corners 144 interfacing with the
indentations 133.

[0096] Referring to FIG. 4A, a modified version of the assembly is shown.
As shown, a registration pin 151 is press fit into a registration hole
152 in the lower heat sink panel 122 and a matching registration hole 134
is provided in the PCB panel 124. The completed panel assembly, including
the lower heat sink panel 122, PCB panel 124, and upper heat sink panel
121, is shown in FIG. 4B in cross-section taken along the broken lines
4B-4B in FIG. 4A. As shown in FIG. 4B, the registration pin 151, which
fits snugly in registration holes 152 and 134, provides registration for
the PCB panel 124 relative to the lower heat sink panel 122. An
indentation 153 may be provided in the opposite heat sink panel (121) to
accommodate protrusion of the pin 151 past the PCB 124. As shown
generally at 154 in FIG. 4B, the heat sink panels may include additional
features to provide registration between the top and bottom heat sink
panels. Although a registration pin is shown at one corner of the panel
122 in FIG. 4A, it will be appreciated that additional pins may be used
at other locations. For example, FIG. 4 shows two registration holes 134,
one on a corner and another in the middle of the opposite side of the PCB
panel 124.

[0097] E. Encapsulation

[0098] FIG. 6 shows a cross-sectional view (through lines 6-6 in FIG. 5)
of the panel 120 through an opening 125 and a conduit 145 in the heat
sink panels. The openings 125, which may be slot shaped as shown (FIGS.
2, 3, 4, 5, 9), may be connected to the interior cavity 146 of the panel
assembly 120 by conduits 145 for conveying molding compound or venting
during the panel molding process. The openings may be formed in one of
the heat sink panels, e.g. openings 125 in the top heat sink panel 121 as
shown in FIGS. 2, 3, 4, 5, and 9, or in both heat sink panels, e.g.
openings 125B in the top and bottom heat sink panels 121, 122 as shown in
FIGS. 6 and 7. Referring to FIG. 6, the conduits 145 may be formed by
recesses in the interior surfaces of heat sink panels 121 and 122,
connecting the openings 125 to the interior cavity 146. The recesses
forming the conduit 145 may be situated near the edge 124C of PCB panel
124 to allow the molding compound to flow over both top 124A and bottom
124B surfaces of the PCB 124.

[0099] FIG. 7 shows an enlarged cross-section of one end of the panel
assembly 120 closed between an upper mold press 161 and lower mold press
162 taken through some of the smaller components, e.g. components 132-1,
132-2, i.e. through lines 6-6 in FIG. 5. A channel 163 may be provided,
e.g. between the upper mold press 161 and lower mold press 162 as shown,
to interface with openings 125. Molding compound may be forced through
the channel 163 under pressure after the panel assembly 120 is closed in
the mold presses 161, 162. The dashed line 167 with directional arrows in
FIGS. 7 and 8 illustrates the flow of molding compound through the
channel 163 into openings 125 through conduits 145 over the top 124A and
bottom 124B surfaces of the PCB panel 124 during encapsulation. The
molding compound may be forced into the internal cavity 146 to fill all
of the unoccupied spaces between the heat sinks 121, 122 and the PCB
panel 124.

[0100] FIG. 8 shows an enlarged cross-section of one end of the panel
assembly 120 closed between an upper mold press 161 and lower mold press
162 taken through the magnetic core structures, i.e. through lines 8-8 in
FIG. 5. Each magnetic core 131 is shown having an upper E-core 131-2 and
a lower E-core 131-1 separated by a gap 131-3. The cores have openings
131-4 to accommodate windings formed on the PCB 124. As shown, the lower
core 131-1 and upper core 131-2 are accommodated by recesses 141-1 and
141-2 in the lower heat sink 122 and upper heat sink 121, respectively.
As shown, compliant pads 136 may be provided on the surfaces of the cores
131-1 and 131-2 or in recesses 141-1, 141-2 to accommodate dimensional
differences in the components. The compliant pads may be chosen for good
thermal conduction and optionally adhesive properties facilitating heat
removal from the cores into the heat sink while optionally providing
structural integrity to the assembly. Gap Pad A2000 available from the
Bergquist Company, 18930 West 78th St, Chanhassen, Minn. 55317 is one
example of the type of compliant pad that may be used. Alternatively and
perhaps depending upon the tolerances involved, a phase change material
may accommodate the dimensional difference during assembly and when cured
afterward provide structural integrity between the heat sinks and the
cores.

[0101] Molding compound may be deposited in one or more of the recesses,
e.g. recesses 141-1 or 141-2, in the internal cavity prior to assembly of
the PCB panel 124 into one or both of the heat sink panels 121, 122 to
ensure that the molding compound fills narrow spaces between the heat
sink and the components, e.g. the cores 131-1, 131-2. One or more vent
openings (not shown) may be provided in the heat sink panels, preferably
at an end opposite the fill openings 125, to allow the molding compound
to flow completely through the internal cavity 146. The cavity may be
filled with encapsulant either (1) by transfer through one or more
conduits, (2) by measured deposition of encapsulant during assembly of
the panels, or (3) by both measured deposition during assembly and
transfer through conduits.

[0102] As shown in FIGS. 4, 5, and 6, the border areas between the modules
and around the periphery of the PCB panel 124 may be minimized to avoid
wasted PCB material. Because the heat sink panels 121 and 122 close
against each other rather than the PCB panel 124, areas on the PCB
normally reserved for closing the mold may be eliminated further reducing
PCB waste and thus overall cost.

[0103] After the panels are assembled together and the interior cavities
are filled with molding compound, the panel assembly 120 may be cured,
e.g. by elevating the temperature.

[0104] F. Singulation

[0105] Singulation is the process by which individual modules, e.g.
singulated module 115 in FIG. 10A, are separated from the panel assembly
120, e.g. by cutting. The panel assembly 120 may be singulated after the
molding compound is cured. The panel assembly 120 is separated from the
upper and lower mold presses 161, 162 and may be cut, e.g. along lines
128, 129 as shown in FIG. 9A, to singulate the modules 115A-115L. For
example, a narrow saw may be used to cut through the layers (e.g. as
shown in FIGS. 1, 10A, 10B, 12) of panel 120, which may include heat sink
101, cured molding compound 105, PCB 104, cured molding compound 106, and
heat sink panel 102. For example, a 0.025 inch thick saw such as model
number EAD-3350 available from Disco Corp., Ota-ku, Tokyo, Japan may be
used. Referring to the cross-sectional views of FIGS. 6 and 7, dashed
lines 129 illustrate the lines along which the panel 120 may be cut to
singulate modules 115D, 115E, and 115F. As shown, the cuts 129 (along the
long side of the individual modules 115) go through the middle of the
trenches 147. The trenches 147 may be made wide enough and the cuts 129
may be made at an appropriate distance from the edges of the trench 147
to ensure that a minimum thickness of cured molding compound remains in
the trench after singulation to be mechanically robust. The trenches 147
may also be used to reduce the thickness of metal through which the saw
must cut during singulation, e.g. by optionally providing trenches along
the perimeter of each module.

[0106] G. Electrical Connections

[0107] Interconnection features may be embedded in the PCB panel 124,
preferably along the boundaries of the individual circuits, so that
electrical contacts are at least in part formed by or exposed during
singulation. To maximize the area on a PCB panel 124 available for
circuitry, the interconnection features may preferably be buried in the
PCB panel 124 below the top and bottom surface layers. For example, the
interconnection features may be formed in the inner conductive layers but
not occupying valuable area on the surface conductive layers, potentially
reducing setback and other spacing requirements. The interconnect
features therefore are preferably formed in the PCB panel 124 before the
panel 120 is assembled and exposed when the panels are cut, e.g. during
singulation. The interconnection features may comprise a pattern of
conductive layers or buried vias (frequently used to form connections
between internal conductive layers) or both in the PCB situated along the
circuit boundary, i.e. lying in the cut line, e.g. cut line 129 (FIG.
9A).

[0108] Referring to FIG. 10A, a module 115 is shown after singulation.
Exposed interconnects 111, 112, and 113 are shown embedded in the edge of
the PCB 104 along one of the edges 116 of the module 115. As shown in
FIG. 10A, longer connections 111 and 113 provide greater interconnect
surface area and higher current carrying capacity, making them amenable
for use as power connections, than shorter connections 112 which have
less interconnect area and lower current carrying capacity, making them
useful for control signal connections. FIG. 11 shows an enlarged view of
a portion of the module 115 along edge 116 revealing detail of the two
interconnections 111 after singulation. The width along the boundary and
number of the conductive features arranged vertically through the PCB
layers may be adjusted to provide the requisite contact area for each
connection. In the example of FIG. 11, conductive features, e.g.
conductive lands 111A through 111L, formed along the cut line on a
plurality of the conductive layers of the PCB form a stack of conductive
strips resembling a bar code after singulation. The stack of conductive
lands may provide more contact area than possible with a single buried
via. In FIG. 11, each interconnect 111 is made up of twelve lands, each
land being formed on a respective one of twelve inner conductive layers.
Note that FIG. 11 shows the twelve lands (111A through 111L) buried below
the top 124A and bottom 124B surfaces of the PCB, i.e. not occupying
surface area on those layers. During singulation, the saw cuts through
the buried embedded lands, exposing the edges of the remaining conductive
material forming the interconnects 111A through 111L shown in FIG. 11.
Note that the buried embedded lands may be shared between two adjacent
modules 115 on the panel 120, e.g. where the PCB patterns are laid out in
mirror image to each other, allowing the modules to be laid out on the
PCB panel close to a singulation cut width apart. Also, the interconnect
features may be aligned along a single module boundary as shown or may
occupy two or more boundaries of each individual module in the panel. The
exposed edges may then be used to form electrical connections immediately
after singulation, i.e. before the cut interconnects oxidize or may be
protected against oxidation, e.g. with a conformal coating, such as an
organic solderability preservative ("OSP"), applied after singulation, to
ensure subsequent ability to form electrical connections to the edges.
For example, Entek Plus HT available from Enthone, Inc., a Division of
Cookson Electronics, West Haven, Conn. 06516 may be used as an OSP to
protect the interconnects.

[0109] The number of lands, i.e. conductive layers, used to form each
interconnect may be increased for better electrical connections or
reduced for less critical connections. Although embedded conductive lands
are shown in the example of FIGS. 10A, 11, additional or alternative
conductive features may be used to form the interconnects. For example,
buried conductive vias located along the cut line may be used, either
alone or in combination with the lands. The buried vias may be located so
that the singulation cut leaves the walls of the conductive vias exposed
resulting in vertical conductive strips, i.e. generally perpendicular to
the PCB top and bottom surfaces 124A, 124B, in the PCB edge. Buried
conductive vias may tend to fill with adhesive during fabrication of the
PCB panel 124. Empty conductive vias, i.e. free of non-conductive
adhesives, may be preferable for the resulting concave conductive
features, i.e. embedded conductive half cylinders. Similarly, solid
buried conductive vias or conductive vias filled with conductive material
during the PCB manufacturing process may be preferable for the resulting
continuous flat conductive surface.

[0110] In the alternative to buried conductive features, conductive
through-holes, which are generally free of adhesives following
fabrication of the PCB panel 124 may be used along the cut line to form
interconnects extending through the thickness of the PCB from top surface
to bottom surface providing generally half-cylindrical interconnects. A
penalty of using through-holes for the interconnects is the loss of
surface area on the top and bottom of the PCB which may otherwise be used
for setback or other safety and agency approval requirements. Preferably,
the through-holes may be filled, for example with a conductive material
such as solder or silver paste, or conductive pins may be inserted into
through holes and soldered to the through holes, to prevent molding
compound from filling the through hole during the encapsulation process
and to provide a greater contact surface area yielding generally flat
conductive interconnects following singulation.

[0111] The exposed interconnect features, e.g. 111A through 111L may be
used to make a variety of electrical connections. For example, the
exposed interconnects may be solder plated and then subsequently soldered
to a motherboard, e.g. using surface mount soldering techniques. The
interconnects may be soldered to a connector, such as connector 103 shown
in FIGS. 1, 13, 14. Alternatively, a lead frame or PCB may be soldered to
the exposed interconnects 111, 112, 113 of the module quickly after
singulation. Yet another alternative includes a precious metal such as
gold or silver or other suitable conductive material deposited to the
exposed contacts, e.g. by plating, to build up the contacts into a larger
area, e.g. continuous conductive contacts, well suited to connectorized
modules described in more detail below.

[0112] G1. Vertical Mount Connector

[0113] Referring to FIGS. 1, 13 and 14, a connector 103 suitable for
attachment to the edge 116 of the module 115 is shown having a connector
body 118 with a plurality of recesses 117 and a plurality of holes 119A,
119B, and 119C. A plurality of connector pins 108, 109, 110 may be
inserted into holes 119A, 119B, 119C, respectively, from the top 118A. As
shown, the holes may be contoured to provide a pressure fit having a
gripping force suitable for retaining the pins. The broad top surfaces
108A, 109A, 110A of the pins are suitable for making solder connections
to the exposed interconnects 111, 113, 112, respectively on the edge 116
of the PCB 104 of module 115. As shown, the recesses 117 provide
countersinking for the top portions of the pins allowing the connector
body to mount flush to the edge 116 of module 115 and allowing space for
a solder joint between the pin and the respective interconnect. The
interconnection features may preferably be provided along a long edge of
the module 115 yielding a more stable vertical mount module 100 such as
shown in FIG. 1. However, the interconnection features may be deployed
along any or all of the edges of the module 115 for different mounting
configurations as discussed more fully below.

[0114] G2. Horizontal Through-Hole Mount

[0115] Referring to FIGS. 15 and 16, a horizontal mount component 200
suitable for through hole mounting in a motherboard is shown including a
singulated module 215 and through-hole adapters 203A, 203B. The
horizontal mount module 200 may be constructed in the same manner as
described above for the module 100, except that the interconnects are
preferably disposed along two edges of the module PCB and connectors
adapted for horizontal mounting may be used. As shown in FIG. 16, the
interconnects are disposed along the two shorter edges of the PCB 204 in
module 215. However, the longer edges may be used instead of, or in
addition to, the shorter edges for the interconnects. Although only one
set of the interconnects 211, 212 is visible in the perspective view of
FIG. 16, it will be understood that a second set, including two
additional power interconnects, is disposed along the opposite hidden
edge of the PCB.

[0116] Through-hole adapters 203A and 203B, suitable for attachment to the
edges of the singulated module 215 are shown having adapter bodies 218
supporting conductive terminals 208, 210 and 209, respectively. A portion
of each terminal may be exposed on an internal surface via an opening in
the adapter body optionally providing a small recess. In FIG. 16 for
example, adapter 203B is shown having two power terminals 209, each
having an exposed areas 209A recessed in openings in surface 218A of the
adapter body 218. The exposed areas 209A align with their respective
interconnects when the adapters 203A, 203B are assembled onto the module
215. The recesses provide countersinking for the exposed terminals
allowing the internal surface 218A of the adapter body 218 to mount flush
to the edge of module 215 and allowing space for a solder joint between
the terminal and the respective interconnect. The adapter body 218 may
include a flange 218B which may form a pressure fit with the adjacent
edges of the modules 25. Additional features may be provided for
maintaining the structural integrity of the module and connectors.

[0117] As shown in FIG. 16, epoxy may be deposited along an internal edge
of the connector body, e.g. in the shaded area 219 preferably aligned
with the encapsulant layer 206 to secure the adapters 203A, 203B to the
module 215. The horizontal mount module 200 may be readily adapted to
match industry standard brick footprints for power converters, in
particular the module 200 may fit within the standard 1/8.sup.th brick
footprint.

[0118] G3. Horizontal Surface-Mount

[0119] Referring to FIGS. 17 and 18, a horizontal-mount component 300
suitable for surface-mount soldering to a motherboard is shown including
a singulated module 315 and surface-mount adapters 303A and 303B. The
horizontal-mount module 300 may be constructed in the same manner as
described above for the module 200 (FIGS. 15, 16) substituting surface
mount adapters 303A, 303B for through-hole adapters 203A, 203B. As shown
in FIG. 17, the singulated module 315 may have flat heat sinks 301, 302
instead of the finned heat sinks (shown in FIGS. 1-4, 6-12, 15-16).
Although shown disposed along the two shorter edges in FIGS. 17 and 18,
the interconnects may be deployed along the longer edges of the PCB 304
in the singulated module 315 instead of, or in addition to, the longer
edges.

[0120] In FIGS. 17 and 18, the surface-mount adapters are shown with
smaller bodies 318 than the through-hole adapters (218: FIG. 15, 16)
exposing the connections between the terminals and their respective
interconnects during assembly and for post assembly inspection. The
terminals 308, 309, 310 each may include a portion, e.g. solder pads
308A, 310A, 309A, adapted for connection, such as a solder joint, to a
respective interconnect on the module, e.g. interconnect 311, 312, and
313 (not visible in FIGS. 17 and 18). Holes 308B, 309B, 310B may be
provided in solder pads 308A, 309A, 310A for better solder joints. Each
terminal 308, 309, 310 may include a bend (e.g. 308C) to produce a
surface-mount pad (e.g. 308D) for attachment, e.g. by surface-mount
soldering, to a customer motherboard.

[0121] The adapter bodies 318 may include flanges 318B, preferably along
two or more sides to form a pressure fit with the adjacent edges of the
modules 315. Additional features may be provided for maintaining the
structural integrity of the module and adapters. As shown in FIG. 18,
epoxy may be deposited along an internal edge of the connector body, e.g.
in the shaded area 319 preferably aligned with the encapsulant layer 306
to secure the adapters 303A, 303B to the module 315.

[0122] G4. Surface-Mount Lead Frame

[0123] An alternate embodiment of a horizontal-mount component 400
suitable for surface-mount soldering to a motherboard is shown in FIGS.
19 and 20 including a singulated module 415. The horizontal-mount module
400 may be constructed in the same manner as described above for the
module 300 (FIGS. 17, 18) substituting lead frame adapter 403 for the
surface-mount adapters 303A, 303B. Like module 315 (FIG. 17), the
singulated module 415 may have flat heat sinks 301, 302 instead of the
finned heat sinks of the previous examples. However, in the example of
FIGS. 19 and 20, the interconnects are shown deployed along the longer
sides of the singulated module 415. However, as noted above the
interconnects may be deployed along any edges of the PCB 404 as desired
in the singulated module 415.

[0124] The surface-mount adapter is shown in FIGS. 19 and 20 having a
unitary rectangular frame-like body 418 supporting a plurality of
terminals 408. The profile of the frame body 418 may as shown leave a
portion of the terminals exposed for making connections to their
respective interconnects during assembly and for post assembly
inspection. The terminals 408 each may include a portion, e.g. solder pad
408A, adapted for connection, such as a solder joint, to a respective
interconnect on the module (not visible in FIGS. 19, 20). Although shown
without holes in FIG. 19, the solder pads may optionally include holes
such as those shown in FIGS. 17 and 18. Each terminal 408 may include a
bend (e.g. 408C) to produce a surface-mount pad (e.g. 408D) for
attachment, e.g. by surface-mount soldering, to a customer motherboard.

[0125] The opening in the frame body 418 may be sized to accommodate the
perimeter edges of the singulated module 415 and optionally form a
pressure fit. The frame body 418 may include recesses 417 for
accommodating the terminals 408, allowing the interior surface 418A of
the frame body 418 to rest flush against the module 415 surface.
Additional features may be provided for maintaining the structural
integrity of the module and adapters. Gaps may be provided in the
interior surface 418A to allow the application of epoxy to secure the
frame body 418 to the module 415.

[0126] G5. Connectorized Module

[0127] The modules 100, 200, 300, and 400 discussed above in connection
with FIGS. 1, and 15-20 are all examples in which connectors or adapters
are mechanically and electrically connected to the interconnects on the
singulated modules forming an integral modular component. Yet another
option is to adapt the module to be removably mated with a connector that
may be mounted on a customer circuit board. For example, the module
interconnects may be plated up with an appropriate conductive material,
such as silver or gold, to form contacts that may be reliably engaged
with connector contacts, i.e. "connectorized." Referring to FIGS. 21 and
22, a module-connector set 500 is shown including a connectorized module
515 in exploded view with a mating connector 503 into which the module
515 may be removably inserted.

[0128] The connector 503 as shown includes a body 518 having side walls
518B creating an opening 518C adapted to receive the connectorized module
515. Terminals 508 formed, e.g. bends 508B (FIG. 22), to provide a
pressure fit between a contact area 508A of each terminal 508 and a
respective interconnect 511. The terminals as shown may be retained in
recesses 517 in the interior surface 518A of the side walls 518B. The
recesses 517 may provide support to keep the terminals 508 in place and
allow the interior surfaces to engage the surfaces of the module 515. The
terminals 508 may include a flat portion 508D (FIGS. 22, 23) adapted for
making a solder connection to surface contacts on a customer circuit
board (not shown). The connector body may include a bottom surface 518D
enhancing the structural integrity of the connector walls 518B which are
subjected to the forces exerted by the terminals 508 against the
interconnects 511. The bottom 518D may include openings as shown in FIG.
23 through which the terminals may be inserted during assembly of the
connector 503. The bottom 518D may provide electrical insulation between
the metal heat sink 502 and the customer circuit board (not shown) on
which the connector 503 may be mounted. Alternatively, the bottom may be
partially or completely removed to allow better conduction of heat from
the module 515 out through the customer circuit board. Yet another
alternative is to use a thermally conductive material in the bottom 518D
of the connector 503. FIG. 24 shows the connectorized module 515 inserted
into the connector 503.

[0129] As shown, the connector terminals 508 exert inward pressure from
opposing ends of the module, however, the contacts may be arranged along
a single side of the module with the connector body providing the
necessary resistive force for the pressure fit. Although the
connectorized module is shown having plated interconnects 511 forming
contacts for engagement with the connector terminals, it should be
appreciated by those of skill in the art that many variations are
possible. For example, adapters of the type illustrated in connection
with FIGS. 15-20 may be used to provide contacts for a hybrid
connectorized module allowing other orientations of the module relative
to the connector and to the customer circuit board.

[0130] G6. Flush Mount

[0131] A flush-mount technique may be used with the horizontal
PCB-mounting techniques discussed above in connection with FIGS. 15-24 to
allow the bottom heat sink to come into contact with the customer PCB,
e.g. for heat removal. As shown in FIGS. 25 and 26, a through-hole mount
module 600 is shown adapted for flush-mounting to a customer PCB 900. The
module 600 as shown includes two through-hole adapters 603A, 603B
attached to the singulated module 615. The singulated module 615 may, as
shown, have a finned top heat sink 601 and a generally flat bottom heat
sink 602 for flush mounting against the PCB 900. Similar to the adapters
discussed above in connections with FIGS. 16-20, through-hole adapters
603A, 603B have terminals, 608, 609, 610 which include features, such as
solder pad 608A, adapted to be attached, e.g. by solder, to respective
interconnects on the module 615. The terminals 608, 609, 610 may be
adapted to be soldered into through holes 908, 909, 910, respectively, in
the customer PCB 900. As shown in FIGS. 25 and 26, the generally flat
heat sink 602 may include recesses 602B to accommodate flanges 618B of
the adapter bodies 618 allowing most of the surface of heat sink 602 to
rest flush against the surface of the PCB 900. Epoxy or other adhesive
may be used in the recess to secure the adapter body to the module. The
recesses may be an integral feature of the heat sink panel or may be
added at an appropriate point during the manufacturing process,
preferably before singulation.

[0132] A thermally conductive material 901, e.g. thermal adhesive, may be
applied between the PCB 900 and the module heat sink 602 to facilitate
removal of heat through the PCB 900. Additionally, the PCB surface may
include thermally conductive features to conduct heat away from the
module 615. For some applications particularly involving smaller module
sizes, it may be desirable to solder the bottom heat sink 602 to one or
more pads on the PCB 900, in which case the heat sink may include a
solderable finish, applied for example by plating. Threaded holes may be
provided, preferably in the flush mount heat sink panel, allowing the
module to be secured using screws to a customer board or cold plate. The
flush-mount modification may allow taller heat sink fins to be used on
the top of the module without increasing the module profile above the
customer PCB which may provide better thermal management in some
environments. Additionally, the flush-mount may provide a more robust
shock and vibration resistant mechanical solution.

[0133] Another flush mount module 650 may include a plurality of pins 661
protruding from the bottom heat sink 652 for engagement in through holes
911 in the customer mother board 900 as shown in FIG. 25A. Similar to the
flush mount module 600 of FIGS. 25 and 26, the flush mount module 650 may
include adapters 653A and 653B adapted for making electrical connections
with through holes on the customer mother board 900. Instead of fins, the
top heat sink 651 may include a flat surface to create a low-profile
package as shown in FIG. 25A. The pins 661 may be formed as an integral
part of the bottom heat sink panel instead of fins. Alternatively, blind
holes may be provided in the heat sink panel into which the pins may be
press fit at any suitable stage of the fabrication process. The pins 661
may be used to electrically connect the bottom heat sink 652 to the
customer board, e.g. to ground, conduct heat out of the module into the
customer board 900, and provide mechanical support. The through holes
908, 909, 910, 911 in the customer board may be sized to provide
clearance between the hole and the respective pin to compensate for any
dimensional variations. The pins 661 may optionally protrude beyond the
bottom surface of the customer board 900 into forced air along the bottom
surface of the board for additional heat removal. Additionally, a heat
sink component (not shown) may be fitted onto the protruding pins to help
dissipate heat.

[0134] H. Heat Sink Setback

[0135] As internal components are reduced in height, e.g. reducing the
thickness of the magnetic core, the depth of the interior cavity may be
decreased bringing the heat sink panels closer together, reducing the
encapsulant thickness and the resulting module thickness. However,
reduction of the encapsulant thickness has the potentially undesirable
effect of reducing the spacing between the electrical interconnects and
the edges of the heat sink panels in the finished module. When desirable,
e.g. to satisfy safety agency requirements, the separation between the
exposed interconnects, e.g. interconnects 111, 112, 113, and the edge of
the heat sink, e.g. heat sink 101B, may be increased using a setback,
e.g. setback 155, between the edges of the heat sink panels and the edges
of the module 115B as shown in FIG. 10B. The setback 155 may be created
by making wide cuts through the heat sink panels 121, 122 along the
singulation lines prior to singulation. The wide cuts preferably extend
through the heat sink material, e.g. aluminum, and partially into the
encapsulation material to form channels 128A and 129A in the panel
assembly 120A as shown in FIGS. 9B and 9C. If machined while the assembly
is still hot from the encapsulation process, the channels 128A and 129A
may be used to divide the heat sink panels into singulated module
dimensions reducing stresses due to differential contraction between the
heat sink and the encapsulant due to differences in thermal coefficients
of expansion while the panel assembly cools. Stresses on the narrow saw
may also be reduced by eliminating the heat sink metal through which the
saw must cut during singulation as a result of the channels 128A, 129A.

[0136] I. Process Efficiencies

[0137] Using interconnection features that may be exposed during
singulation allows the PCB panel 124, containing a plurality of modules,
to be molded as a single unit. Providing embedded interconnects along the
perimeter of the circuit that occupy little or no PCB surface area help
reduce wasted PCB area that would otherwise be cut away, allowing close
to full utilization of the PCB for product which may save on cost.
Encapsulating the PCB panel with the heat sink panels simplifies the
structural aspects of the modules. Using interior contours in the heat
sink to match component heights helps reduce the amount of molding
compound required for encapsulation. Furthermore, controlling the
distance between the magnetic cores and the internal surface of the heat
sink can be used as an alternative to and eliminating the complications
of the exposed core molding process described in the Exposed Core
Application.

[0138] Furthermore, using the mold panels to form the mold cavity for
encapsulating the PCB panel helps free the molding equipment from product
specific requirements that may otherwise require customized molds,
allowing a single piece of molding equipment to be used for a wide
variety of product mixes. The finished products, e.g. modules 115 made
using a standard panel size, may have diverse dimensions not only in the
lateral (length and width) directions, but also in the vertical
(thickness) direction (e.g. due to heat sink fin height or component
thickness). However, because the lateral panel dimensions remain the
same, and variations in thickness from panel to panel may be accommodated
by the molding press, the same general purpose molding equipment may be
used for a wide variety of products of diverse dimensions. Using power
converters as an example, the same mold press may be used to encapsulate
panels of power converters ranging in (1) footprint size from full size,
to half, to quarter, to eighth size (or any other size), and in (2)
thickness (height), and in (3) topology, e.g. isolated DC-DC regulating
converter, non-isolated buck regulator, DC transformer, etc. to produce a
large mix of products.

[0139] A panel molding manufacturing process for a mix of products may
include some or all of the following steps. Select a specific product to
build. Select the requisite blank heat sink panels, e.g. based upon fin
orientation, spacing, and height for the specific product. Alternatively,
machine the exterior of the heat sink blank panels to produce the
requisite external surface (heat sink surface, mounting features such as
threaded holes, fin orientation, thickness, and spacing). Machine the
interior surfaces of the heat sink blanks to form the recesses and other
features (i.e. the contours of interior cavity to match some or all
component locations, size, and height), of the finished heat sink panels
required for the specific product, preferably under computer control.
Select the appropriate PCB panel for the specific product. Select and
assemble the magnetic cores and other components onto the PCB panel, e.g.
by surface mount soldering, etc. Dispense a measured quantity of molding
compound into the bottom heat sink panel. Press the bottom side of PCB
panel up against bottom heat sink panel. Dispense a measured quantity of
molding compound on the top side of the PCB panel. Press top heat sink
panel into place on the PCB panel. Place the panel assembly on a rotary
table away from the axis of rotation, preferably a large distance from
the axis, and spin the rotary table and panel assembly to evacuate air
bubbles in the interior cavity to achieve essentially void free fill of
panel assembly with molding compound. Cure the molding compound. Cut the
panel along the cut lines for singulation. Apply a conformal coating to
protect the interconnects, or plate the interconnects, or attach a lead
frame, motherboard, or connector to the exposed interconnects.

[0140] J. PCB Symmetries

[0141] The components may be symmetrically arranged on the PCB such as
shown in the power converter example of FIG. 27. The top 104-2 and bottom
104-1 faces of a populated PCB 104 from an individual power converter
module are shown in plan view in FIG. 27. The populated PCB 104 is shown
rotated along the vertical axis 27 in FIG. 27 to show the symmetry of the
components.

[0142] J1. Symmetrical Distribution Between PCB Surfaces

[0143] Many of the larger components may be distributed equally between
both faces of PCB 104 as shown in FIG. 27. For example, the four input
field effect transistors (FETs) 132-2D, 132-2E, 132-1D, 132-1E are shown
equally distributed between the top 104-2 and bottom 104-1 surfaces with
two FETs on each surface. Similar equal distribution between the top
104-2 and bottom 104-1 surfaces of the PCB 104 are shown for the eight
output FETs 132-2B, 132-2C, 132-1B, 132-1C with four output FETs on each
surface; the twelve input capacitors, 132-2F, 132-2G, 132-1F, 132-1G,
with six input capacitors on each surface; and twenty four output
capacitors 132-2A, 132-1A with twelve output capacitors on each surface.
Some of the FETs can function as switches. Distributing larger components
between the two surfaces of the PCB may decrease stresses on the PCB,
e.g. due to differences in the coefficient of expansion of the
encapsulant, e.g. while curing, which may improve the co-planarity and
mechanical integrity of the device.

[0144] J2. Symmetrical Distribution on a PCB Surface

[0145] On each surface of the PCB, components having similar
characteristics, such as size or in-circuit power dissipation, may be
arranged symmetrically for example as shown in FIG. 27 with respect to
horizontal axis 28. It can be seem that relative to the horizontal axis
28, which is drawn longitudinally through the midline of the top and
bottom surfaces of PCB 104, many of the components are arranged
symmetrically. For example, the six input capacitors 132-1F and 132-1G on
the bottom surface 104-1 are symmetrically distributed in a mirror-image
relationship to each other relative to longitudinal midline axis 28. The
same basic mirror image relationship is true for the six input capacitors
132-2F and 132-2G on the top 104-2 surface of the PCB. Similarly, the
mirror image relationship is shown for the following pairs of components:
bottom-side input FETs 132-1D and 132-1E, topside input FETs 132-2D and
132-2E, bottom-side output FETs 132-1B and 132-1C, topside output FETs
132-2B and 132-2C and also within the bottom-side and top-side banks of
output capacitors 132-1A and 132-2A.

[0146] Distributing larger components symmetrically on a surface
especially with respect to the longitudinal axis of the PCB may also
decrease stresses on the PCB, e.g. due to differences in the coefficient
of expansion of the encapsulant, e.g. while curing, which may also
improve the mechanical integrity of the device. Additionally, spreading
the components out symmetrically on each surface helps to spread the heat
produced by power dissipating devices using a greater surface area for
heat extraction improving the thermal performance.

[0147] J3. Symmetrical Footprints Between PCB Surfaces

[0148] In addition to being equally distributed between the top and bottom
surfaces and being symmetrically distributed on each PCB surface, the
components may also be situated such that pairs of components (wherein
each component on one surface has a respective counterpart on the other
surface) may be arranged to occupy essentially the same space on the PCB,
i.e. a component may occupy a space on one surface that substantially
overlaps with the footprint of a component on the other surface. For
example, input capacitors 132-1F on the bottom surface are in the same
position as their counterparts 132-2F on the top surface, i.e. they share
the same footprint on the PCB. The same relationship is generally true
for: input capacitors 132-1G and 132-2G; output capacitors 132-1A and
132-2A; input FETs 132-1D and 132-2D; input FETs 132-1E and 132-2E;
output FETs 132-1B and 132-2B; output FETs 132-1C and 132-2C; in which
the pairs of components occupy the same basic footprint, albeit on
opposite surfaces, of the PCB. One benefit of sharing footprints allows
the pair of components to share a common set of conductive vias used to
electrically connect the components on the PCB surfaces to internal
conductive layers, e.g. used to form the windings of the transformer.
Because each via is used for both components in the pair, the total
number of vias for making connections to the pair of components may be
reduced (by as much as a factor of two) increasing the area of conductive
layers useable for making connections and thus reducing resistance. For
example, assuming 6 vias are required for each output FET (a total of 12
vias for two FETs), using symmetrical footprint approach, the pair of
FETs can share the same 6 vias (without increasing the via resistance)
and because the number has been reduced the useable area for conductors
may be increased. Alternatively, while reducing the total number of vias
from 12 to some intermediate number, e.g. 8, the resistance of the vias
may be decreased because of the increase in effective vias per FET while
still increasing the area useable for conductors.

[0149] J4. Symmetrical Power Dissipation Between PCB Surfaces

[0150] The components may be arranged between the PCB surfaces according
to heat dissipated during operation. For example, the heat dissipative
components may be arranged in a manner that distributes the heat evenly
between the two PCB surfaces allowing heat produced by power dissipating
devices to be extracted from both surfaces of the PCB improving the
thermal performance. This type of heat dissipation symmetry is also
factored into the component layout shown in the power converter of FIG.
27. For example, two input cells each using the same basic circuit
topology are shown, one above and another below axis 28. As shown, the
components of each input cell occupy both sides of the PCB in observance
of other factors influencing component layout such as winding locations,
etc. In this example, the upper input cell includes the two input FETs
132-1D and 132-2D, and the six input capacitors 132-1F and 132-2F. The
lower input cell includes the two input FETs 132-1E and 132-2E, and the
six input capacitors 132-1G and 132-2G. To ensure heat dissipation
symmetry between the two surfaces, the cells may be arranged in mirror
image layouts as shown. In FIG. 27, input FET 132-2E (top surface) in the
lower cell corresponds to input FET 132-1D (bottom surface) in the upper
cell. Similarly, lower cell input FET 132-1E (bottom surface) corresponds
to upper cell input FET 132-2D (top surface). As can be seen, the
significant power dissipative components of the input cells are arranged
to have one component of one cell mounted on one surface with the
respective component from the other cell mounted on the other surface.
This type of symmetry may be seen in FIG. 27 with lower cell component
132-2H mounted on the top surface and the respective upper cell component
132-1H mounted on the bottom surface. In some examples, the FETs are
arranged such that during operation, the power FETs on the top surface
dissipate power at a level that is comparable to the level of power
dissipated by the power FETs on the bottom surface. Also, the level of
power dissipated by the power FETs in the upper input cell is comparable
to the level of power dissipated by the power FETs in the lower input
cell. For example, the level of power dissipated by the power FETs on one
surface is less than 150% of the level of power dissipated by the power
FETs on the other surface. The level of power dissipated by the power
FETs in the upper cell is less than 150% of the level of power dissipated
by the power FETs in the lower cell, and vice versa.

[0151] Laying out the components using any or all of the above symmetries
produces several key benefits including, enhanced thermal performance,
reducing top to bottom and side to side imbalances during encapsulation
caused by asymmetrical distribution of components may enhance the
co-planarity and structural integrity, and shared component footprints on
top and bottom PCB surfaces may help reduce conduction losses and
increase efficiency.

[0152] K. Center Plate Panel Assembly

[0153] In an alternate embodiment, an optional center plate 727 may be
used between the top 721 and bottom 722 heat sink panels as illustrated
in FIG. 28 through FIG. 32. The center plate 727, which may be made from
aluminum, a molded high temperature plastic or any other material
suitable for the molding process, includes an opening 729 in which the
populated PCB panel 724 may sit during the panel molding process. As
shown in the side view of FIG. 29 and the cross-sectional view of FIG.
32, the PCB panel 724 may sit entirely within the opening 729 and may
have some high profile components, such as magnetic cores 131 and
capacitors 132 (continuing with the power converter example), extending
beyond the planar surfaces of the center plate. Alternatively, the center
plate may be made thick enough, or include a ridge around the periphery
tall enough, such that the PCB panel and all components sit entirely
within the opening allowing a flat surface (heatsink panel or mold panel)
to close against the center plate. The recesses formed in the interior
surfaces of the heat sink panels 721, 722 (described above) may
accommodate portions of the components extending beyond the center plate
surface. Conversely, protrusions from the interior surface of the heat
sink panels may be used to reduce the distance between the heat sink and
lower profile components. However, it may be preferable for ease of
fabrication and tolerance control to avoid protrusions of the heat sink
beyond the surface of the center plate which may put an upper limit on
the thickness of the center plate in some embodiments.

[0154] As shown in the exploded perspective view of FIG. 28 and the top
plan view of FIG. 31, registration features may be provided in the center
plate 727. For example, registration pins 728 may mate with corresponding
holes 734 in the PCB 724 to establish the horizontal position, i.e. in
the X and Y directions, of the PCB relative to the center plate 727.
Additional registration features such as the illustrated horizontal shelf
728A (FIG. 28), may be provided to establish the vertical position, i.e.
in the Z direction, of the PCB relative to the center plate. The
registration pins 728 may be long enough to extend beyond the upper
surface of the PCB panel 724 in the upward direction and beyond the
horizontal shelf in the downward direction to mate with holes (analogous
to holes 152 and 153 in FIG. 4B) which may be provided in the top and
bottom heat sink panels 721, 722 establishing the horizontal positions of
the mold panels relative to the center plate 727. Provision of the
registration features in the center plate may help relax certain
precision requirements, the complexity, and thus the cost of the heat
sink panels.

[0155] A cross-section of the panel assembly 720 closed in a mold press
taken through line 32-32 in FIGS. 30 and 31 is shown in FIG. 32. As
shown, the upper mold press 761 engages the center plate 727 directly
along its perimeter in regions 768 and engages the heat sink panels
directly along their perimeters in regions 769. Preferably the mold press
includes recessed surfaces 766 providing cavities 765 large enough to
accommodate a full range of fin heights (or other heat sink panel
features) supporting a diverse range of products. To compensate for
dimensional differences between the thickness of the heat sink panels in
regions 769 and the difference in elevation between interface regions 768
and 769 in the mold press, one or more compressible features may be
provided at the interface between the heat sink panels 721, 722 and the
center plate 727. For example, a small crushable feature 723 may be
formed along the perimeter of and as an integral part of the heat sink
panels as illustrated in FIG. 32. Alternatively a gasket may be used
between the center plate and one or both of the heat sink panels. As the
press closes on the panel assembly 720 the crushable features 723 are
compressed until the press is closed securely against both the center
plate 727 and the heat sink panels 721, 722. As shown in FIG. 31, the
crushable features may extend along the perimeter of the interior cavity
forming a seal between each heat sink panel and the center plate.

[0156] The center plate may preferably include an extension, e.g.
extension 730, to at least one side of opening 729 providing space for
one or more chambers 725 as shown in FIGS. 30, 31, and 32. During the
transfer molding process, encapsulation material may be forced from the
chambers through one or more channels 726 (as shown in FIGS. 28 and 32)
in the center plate into opening 729 and thus the cavity in which the
populated PCB panel 724 is enclosed. An example of encapsulant flow
through a chamber 725, channel 726, and into the interior cavity 746 is
illustrated by the arrows 767 shown in FIG. 32.

[0157] In the center plate panel mold assembly, the top and bottom mold
panels (i.e., heat sink panels 721, 722) close against the center plate
instead of each other, reducing the thickness of the top and bottom mold
panels, increasing the symmetry between, and reducing the complexity of,
the top and bottom heat sink panels 721, 722, potentially simplifying the
molding press, eliminating critical tolerance accumulations in the
assembly, simplifying the process and reducing cost. For example,
provision of the chambers 725 and conduits 726 in the center plate 727
eliminates the need for sealing along a second axis, e.g. in a horizontal
direction and allows for use of a simpler cull-on-plate molding press.
Critical tolerances are reduced to the one vertical dimension of the heat
sink panels which can be relaxed using a crushable feature or a compliant
material on the surface that interfaces with the center plate.
Additionally, the center plate 727 may be standardized allowing a single
configuration to be used with a large variety of heat sink panels such
that the center plate may be cost-effectively molded.

III. Molding Process Non-Integrated Re-Useable Mold

[0158] A. Components without Heatsinks

[0159] In some applications it may be desirable to use the panel-molding
process to produce components, such as power converters, without the flat
heat sink surfaces (FIGS. 17-24, 25, 26), finned heat sinks (FIGS. 1, 10,
12, 15-16, 25, 26), or pinned heat sink (FIG. 25A) features described in
the above embodiments. Referring to FIGS. 33 and 34, a horizontal-mount
component 840 is shown including a singulated module 815 and two adapters
803A, 803B, suitable for through-hole mounting to a motherboard.
Comparing the singulated module 815 (FIG. 33) with the singulated modules
215 (FIG. 16) and 315 (FIG. 17) reveals that the integral heat sink
surfaces of the previous examples are omitted in the singulated module
815. As shown in FIGS. 33 and 34 and described in greater detail below,
the top 815A and bottom 815B surfaces of the singulated module 815 are
defined by the cured encapsulant 805, 806 in which the magnetic core
surfaces 815C, 815D are exposed.

[0160] Like the singulated modules with heat sinks, various types of
connectors or adapters may be coupled to the exposed interconnects 811,
812 at the edges of the singulated module 815. All of the variations
described above in connection with the heat-sink versions may be adapted
for use with the singulated module 815. As shown in FIGS. 33 and 34,
adapters 803 having terminal portions 808 and interconnect portions 808A
may be formed for example by a precision metal stamping process.
Initially, the terminal portions 808 may be coupled to a lead frame 808B
as shown in FIGS. 35 and 36 forming a unitary unit for ease of assembly.
The interconnect portions 808A may be soldered to the exposed
interconnects 811, 812 in the manner described above, and protective caps
818 may be attached, e.g. with epoxy, covering the interconnect portions
808A, to provide structural integrity, and exposing only the terminals
808. The lead frame 808B may be separated from the terminals 808 after
the terminals are attached to the exposed contacts.

[0161] B. Center Plate Molding

[0162] The above-described panel molding process may be adapted to produce
the heat-sinkless modules 815 shown in FIGS. 33 through 36. Referring to
the exploded view of FIG. 37, re-useable flat top and bottom plates 834
may be used in place of the top and bottom heat sink panels of the
previous examples. The center plate 827, which like the center plate 727
in FIG. 28 may be made from aluminum, a molded high temperature plastic
or any other material suitable for the molding process, includes an
opening 829 in which the populated PCB panel 824 may sit during the
molding process. Like the example of FIG. 28, the center plate 827 may
include an extension, e.g. extension 830 in FIG. 38, to at least one side
of opening 829 providing space for one or more chambers 825 (shown in
FIGS. 37, 39, and 40).

[0163] The center plate 827 may include a sealing ridge 823 along the
periphery of the opening 829 to provide a total thickness of the center
plate 827 sufficient to accommodate the PCB panel 824 and all of the
components, including for example the magnetic cores 131, while
minimizing waste material in the center plate. Referring to the side view
of FIG. 38, the thickness of the manifold provides adequate clearance for
all of the components on the PCB panel 824. As shown in the cut away
section 827A-827A in FIG. 38, the space between the cores and the plates
821, 822 may preferably be minimized, reducing the volume of encapsulant
required. The plate registration pins 828 are shown in FIG. 38 protruding
above and below the centerplate sufficiently to engage mating openings
834 provided in the top and bottom plates, 821, 822.

[0164] The PCB panel 824 may be seated on registration shelves 828B (FIG.
37) for establishing the correct vertical positioning of the PCB panel
with respect to the manifold 827. The horizontal position of the PCB
panel may be established using the registration pins shown in the
previous example (e.g. pins 728 in FIG. 28), or may be accurately placed
in the opening, e.g. using pick and place equipment or a fixture, and
affixed to the center plate, e.g. using epoxy, e.g. deposited on the
registration shelves 828B prior to placement of the PCB panel. The use of
an adhesive such as epoxy helps to prevent bowing of the PCB panel as
mold compound is forced into the cavity during the molding process.
Venting features 823A may be provided in the sealing ridges 823 along the
side opposite where the mold compound is injected into the cavity as
shown in FIGS. 37 and 39.

[0165] Referring to the FIG. 40, a section of the panel assembly 820
(taken along lines 40-40 shown in FIG. 39) is shown closed in a mold
press. The mold press includes an upper press 861 and a lower press 862
which close directly against the center plate 827 along its perimeter
forming seals 868 as shown. The mold presses 861, 862 may include
recessed surfaces 864 creating cavities 865 large enough to accommodate a
full range of PCB panel heights, supporting a diverse range of products.
Shim plates 863 may be used between the recessed surfaces 864 of the mold
presses 861, 862 and the top and bottom plates 821, 822 to force the
plates against and form a seal with the center plate 827, e.g. along
sealing ridges 823. For example, mold-to-shim-plate interface 869A and
shim-plate-to-plate interface 869B are shown in FIG. 40. Variations in
thickness of the center plates 827 are accommodated by the mold press
closing directly against the center plate 827. Variations in the height
of the top or bottom plate from the respective center plate surface may
be accommodated by varying the thickness of the respective shim plate. In
this way, components of varying thicknesses may be produced using an
center plate 827 having the appropriate thickness for the desired
component height and using thicker or thinner shim plates 863 as
necessary to adjust for any difference in height between the center plate
827 and the top and bottom plates 821, 822. Alternatively, one or both of
the shim plates may be omitted completely allowing the mold presses to
press directly against the respective top and/or bottom plates.

[0166] During the transfer molding process, encapsulation material may be
forced from the chambers 825 through one or more channels 826 (FIG. 40)
in the center plate into opening 829 (FIG. 37) and thus the cavity in
which the populated PCB panel 824 is enclosed. An example of encapsulant
flow through a chamber 825, channel 826, and into the cavity is
illustrated by the arrows 867 shown in FIG. 40. After the encapsulant is
cured, e.g., by heating, the manifold plate 827 and the encapsulated PCB
panel may be separated from the upper and lower mold presses 861, 862.
During or after the cooling process, the top and bottom plates may be
removed from the panel assembly. The surfaces of the top and bottom
plates 821, 822 are relatively smooth and separate easily from the
encapsulant as the panel assembly cools due to differences in thermal
expansion coefficients of the materials.

[0167] FIG. 41 shows a top plan view of the encapsulated panel assembly
820A separated from the upper and lower mold presses after removal of the
top and bottom plates 821, 822. The center plate 827 may include
registration features 828A (FIGS. 37, 39, 41) for positional accuracy in
pre- and post-encapsulation processing of the panel. For example, the
registration features 828A may be used to accurately position the PCB
panel with respect to the center plate during installation or may be
engaged by pins in the mold to accurately position the center plate in
the mold. Greater positional accuracy may be achieved by making one or
more holes 871 through the encapsulant in predetermined regions of the
encapsulated PCB to expose corresponding fiducial marks 872 incorporated
in the PCB panel. The center plate 827 and its registration features 828A
thus may be used to establish an approximate horizontal position (of the
PCB panel) for making the holes 871 which preferably would be larger than
the fiducial marks 872. The exposed fiducial marks may be used to
register the position of the PCB panel with greater accuracy for precise
singulation. FIG. 42 shows a cross-sectional view of the encapsulated
panel assembly through one of the holes 871 in the encapsulant exposing
the fiducial mark 872 on the PCB panel.

[0168] Preferably before singulation, the encapsulated panel assembly may
be lapped to expose the magnetic cores, finish the surface, and
accurately establish the thickness of the panel-molded components. After
singulation, the interconnects may be processed and connectors, terminals
or adapters may be attached to the components as described above.

[0169] C. Direct Molding

[0170] Alternatively, the panel molding process may be further adapted to
encapsulate the PCB panel directly within the mold cavity without using a
center plate (such as center plates 727 in FIGS. 28 and 827 in FIG. 37),
heat sink panels (such as panels 721, 722 in FIG. 28) or top and bottom
plates (such as plates 821, 822 in FIG. 37). In the direct-mold
embodiment, the PCB panel may be placed in the bottom mold, with the top
mold closing against the bottom (instead of each mold closing against the
center plate). The depth of the mold cavity may be set to match the
overall height of the PCB panel and components with a custom mold for
each product thickness. Alternatively, the mold cavity may have moveable
interior surfaces that may be adjusted for the selected product or
changeable shim plates designed for each product may be used with a
standardized mold to adjust the depth of the mold cavity and thus the
encapsulation thickness.

[0171] The mold may include fixed or movable registration supports (e.g.
similar to registration shelves 828A provided in the center plate 827 in
FIG. 37) preferably along the periphery of the mold cavity. The PCB panel
may be seated on the supports to establish the appropriate vertical
position in the mold cavity and which may also be used to reduce
(displace) the volume of encapsulant in selected regions of the panel.
Referring to FIGS. 43 and 44 for example, an encapsulated PCB panel 890
produced using the direct mold technique is shown after removal from the
mold cavity. FIG. 43 shows a bottom view as molded (component top view)
of the panel revealing indentations in the cured encapsulant 805,
indentations 891 along the sides, indentations 891B at the corners, a
large indentation 891A at one end, and circular indentations 891C and
891D at each end of the panel 890. The large indentation 891A may be used
to expose identifying features on the PCB such as a bar code used during
manufacture to identify the panel. Similarly, the circular indentations
891C and 891D may be used to expose positional information on the PCB,
such as the fiducial markings described above.

[0172] The PCB panel may be placed in the bottom mold cavity, and the
upper mold press may be pressed against the lower mold forming a seal
around the cavity. As the upper mold is closed against the lower mold,
preferably moveable pins within the upper mold may make contact with the
PCB in the regions of the supports to bias the PCB against the
registration supports in the lower mold and securing the PCB panel. For
example, the top view as molded (component bottom view) of FIG. 44 shows,
additional circular indentations 891E in the cured encapsulant 806
located within the indentations 891 and 891B revealing potential
locations at which moveable pins may be deployed in the top mold section.
It may be advantageous to locate the movable pins within other support
features to limit the exposed length of the pin.

[0173] With the mold closed and the PCB panel secured, molding compound
may be injected into the mold cavity and cured, e.g. by elevating the
temperature. After the molding compound is cured, the encapsulated PCB
panel may be separated from the upper and lower mold presses, and any
encapsulant remaining on the PCB in the region of holes 891A, 891C, 891D
may be removed as described above (e.g., by drilling or laser ablation)
to expose the identifying features (bar code and fiducial marks) on the
PCB panel 124. The PCB panel may be lapped, and singulated as required.

[0174] In some implementations, after singulation, a portion of the top
encapsulant 822 can be removed by mechanical lapping to expose a top
surface of a magnetic core structure 826. Similarly, a portion of the
bottom encapsulant material 824 can be removed by mechanical lapping to
expose a bottom surface of the magnetic core structure 826. The lapping
process provides great dimensional control of the finished product.

[0175] As described above in connection with the heat sink panel versions,
the finished products, e.g. modules made using a standard panel size, may
have diverse dimensions not only in the lateral (length and width)
directions, but also in the vertical (thickness) direction (e.g. due to
component thickness). However, because the lateral PCB panel dimensions
remain the same, and variations in component thickness from panel to
panel may be accommodated by the molding press, the same general purpose
molding equipment may be used for a wide variety of products of diverse
dimensions to produce a large mix of products.

[0176] In some implementations, a panel molding manufacturing process for
a mix of products may include some or all of the following steps. Select
a specific product to build. Select the requisite mold presses, e.g.
based upon spacing and height for the specific product. Select the
appropriate PCB panel for the specific product. Select and assemble the
magnetic cores and other components onto the PCB panel, e.g. by surface
mount soldering, etc. Dispense a measured quantity of molding compound
into the bottom mold press. Press the bottom side of PCB panel up against
bottom mold press. Dispense a measured quantity of molding compound on
the top side of the PCB panel. Press top mold press into place on the PCB
panel. Inject additional molding compound into the cavity between the top
and bottom mold presses and the PCB panel through a channel formed
between the top and bottom mold presses. Cure the molding compound.
Remove the encapsulated PCB panel from the mold presses. Form holes in
the encapsulant to expose fiducial marks to facilitate alignment. Cut the
encapsulated PCB panel along the cut lines for singulation. Apply a
conformal coating to protect the interconnects, or plate the
interconnects, or attach a lead frame, motherboard, or connector to the
exposed interconnects.

[0177] In some implementations, a panel molding manufacturing process for
a mix of products may include some or all of the following steps. Select
a specific product to build. Select the requisite mold presses, e.g.
based upon spacing and height for the specific product. Select the
appropriate PCB panel for the specific product. Select and assemble the
magnetic cores and other components onto the PCB panel, e.g. by surface
mount soldering, etc. Position the PCB panel in a manifold plate (e.g.,
827 in FIGS. 37-42). Press top and bottom mold presses against the
manifold plate. Inject molding compound into the cavity between the top
and bottom mold presses and the PCB panel through chambers and channels
formed in the manifold until the PCB panel is entirely enclosed by the
molding compound. Cure the molding compound. Remove the manifold plate
and the encapsulated PCB panel from the mold presses. Form holes in the
encapsulant to expose fiducial marks to facilitate alignment.
Mechanically lap one or both surfaces of the panel. Cut the encapsulated
PCB panel along the cut lines for singulation. Apply a conformal coating
to protect the interconnects, or plate the interconnects, or attach a
lead frame, motherboard, or connector to the exposed interconnects.

[0178] A number of embodiments of the invention have been described.
Nevertheless, it will be understood that various modifications may be
made without departing from the spirit and scope of the invention. For
example, non-metallic mold panels may be used. The center plate may be
provided as a single-use consumable or may be modified to be used as a
reusable fixture in the molding process. The center plate may be provided
with or without the encapsulation channels. The registration holes in the
heat sink panels may extend completely through the heat sink panels
similar to hole 152 shown in FIG. 4B and the registration pins, e.g. pins
728 (FIGS. 28 and 31), may extend completely through each of the heat
sink panels allowing fasteners to be used in conjunction with the pins to
hold the panel assembly together before and after the encapsulation
process. The fasteners may function as or be used in conjunction with a
seal around the pin to contain any encapsulant. Throughput through the
mold press may be increased by using panel assemblies that are secured
together and removed from the mold press before the panel has cooled or
the encapsulant has set or both. The registration pins 728 and
corresponding holes 734 may be used to align the panel assembly during
the singulation process. In some examples, a panel assembly (e.g., 120)
may be formed by dispensing encapsulant into a bottom panel mold (e.g.,
heat sink panel 122), assembling a substrate (e.g., PCB panel 124) into
the bottom panel mold, dispensing encapsulant onto a top of the
substrate, and assembling a top panel mold (e.g., heat sink panel 121)
onto the substrate. In some examples, the surfaces of the PCB panel 124
may have conductive features that are covered by an insulative layer.
Blank mold panels may be machined to provide some or all of the various
features described above in an on-demand manufacturing system.

[0179] In some examples, the upper and lower heat sinks 121, 122 are
clamped together by the upper and lower mold presses 161, 162 at
respective clamp regions of the upper and lower heat sinks 121, 122. The
clamp region of the upper heat sink 121 can be located at points along a
circumference of an internal cavity defined by the interior surface of
the upper heat sink 121. The clamp region of the lower heat sink 122 can
be located at points along a circumference of an internal cavity defined
by the interior surface of the lower heat sink 122. In some examples, the
clamp regions are cut away from the panel assembly 120 to expose the
interconnects 111, 112, and 113. After the cut, portions of the upper and
lower heat sinks 121, 122 near an active circuit area remain attached to
the panel assembly 120, allowing heat from the active circuit area during
operation to be dissipated through the remaining portions of the upper
and lower heat sinks 121, 122. The active circuit area can be, e.g., an
area of the PCB panel 124 having active components, such as magnetic core
structures 131 and electronic components 132. Interlocking contours,
other than the undercuts 148 shown in FIGS. 6, 7, and 12, can also be
formed in the interior surface of the mold panel, the contour being
filled with cured mold compound enhancing the structural integrity of the
singulated module. In some examples, most of the large-footprint
components (e.g., 132-2D, 132-2E, 132-2B, 132-2C) are distributed
substantially symmetrically between quadrants surrounding the transformer
core (e.g., 131-2) on a surface of the PCB panel 124. For example, in
FIG. 27, the input FETs 132-2D and 132-2E are distributed substantially
symmetrically between the upper-right and lower-right quadrants
surrounding the transformer core 131-2. The output FETs 132-2B and 132-2C
are distributed substantially symmetrically between the upper-left and
lower-left quadrants surrounding the transformer core 131-2.

[0180] Accordingly, other embodiments are within the scope of the
following claims.