Abstract

We have demonstrated great improvement in the smoothness and defect density of GaAsfilms on Si by lowering the arsenic overpressure during growth of the initial layer (the first 500 Å) of GaAs. We have studied the morphology and defect density of GaAs on Si films in which the initial layers were grown under either low As4 overpressure (7As4:1Ga, beam equivalent pressure) or high As4 overpressure (15As4:1Ga) conditions, with a constant gallium flux. In the early stages of growth there is a significant change in island morphology depending on the As4 overpressure. There is dramatic improvement of surface smoothness and crystal quality with reduced arsenic overpressure for 500‐Å‐thick layers both immediately after growth at 350 °C and after heating to 580 °C. Diodes fabricated in 3.5‐μm‐thick filmsgrown on initial layers that were grown under low arsenic overpressure have a very sharp reverse breakdown at voltages as high as 45 V, whereas diodes fabricated in filmsgrown on initial layers that were grown under high arsenic overpressure have a soft reverse breakdown at about 5 V. This demonstrates a significant reduction in the density of electrically active defects in the thick GaAsfilms with decreasing arsenic overpressure conditions during growth of the initial 500 Å of GaAs on Si. The improvement in film quality for low As4 overpressures is discussed in terms of the observed changes in island morphology.