Tag Archives: LVDS

In August, Commell launched the LV-67X, one of the first industrial Mini-ITX boards with Intel’s 8th Gen “Coffee Lake” CPUs. Now, it has followed up with a Coffee Lake based 3.5-inch LS-37L board. The SBC has the same FCLGA1151 socket, supporting up to 6-core, 65W TDP Coffee Lake S-series processors such as the 3.1GHz/4.3GHz Core i5-8600.

Commell lists only Windows drivers on the product page, but the user manual notes support for Linux. The company also recently announced a Coffee Lake based, PICMG 1.3 form factor FS-A79 board.

LS-37L and block diagram
(click images to enlarge)

The only other 3.5-inch (146 x 101mm) Coffee Lake board we’ve seen is Avalue’s ECM-CFS. Like that board, the LS-37L has a 0 to 60°C range and supports up to 16GB DDR4 (2666MHz). Other features are very close, with the main difference being the LS-37L’s wide-range 9-25V supply in place of a standard 12V input. The LS-37L also offers more USB and serial headers and adds a PS/2 interface, an RTC with battery, an LCD inverter, and a SIM slot. However, it lacks the Avalue board’s ACPI power management and optional TPM.

Like the ECM-CFS, Commell’s board features triple display support, but instead of dual HDMI ports plus LVDS you get a choice of two configurations. The standard LS-37L model supplies an HDMI port, a DisplayPort, and internal DVI, VGA, and LVDS interfaces. The LS-37LT SKU replaces the DisplayPort with a second VGA or LVDS header.

LS-37L detail views
(click images to enlarge)

The LS-37L is equipped with 2x GbE, 2x SATA III, 4x USB 3.1, and a single RS-232 COM port. Internal I/O includes 3x RS232/422/485, 2x RS-232, and GPIO. Like the Avalue SBC, Commell’s board provides a mini-PCIe slot with mSATA support. Yet, the slot also supports other mini-PCIe cards, and there’s a SIM slot for wireless.

ADLINK has introduced its latest COM Express Type 6 modules. According to the company, Express-CF modules are equipped with the 8th generation Intel Core processor family and Intel Xeon processor E-2100M family, and are the first Type 6 modules to support both Xeon and Core i7 Hexa-core (6-core) CPUs. These Hexa-core processors support up to 12 threads and a turbo boost of up to 4.4 GHz. Compared to earlier mobile quad-core Xeon and Core i7 CPUs, the additional two cores of the new Hexa-core CPUs results in more than 25% performance boost at no significant cost increase.ADLINK’s Express-CF provides standard support for up to 48GB non-ECC DDR4 in three SO-DIMMs (two on the top side, one on the bottom), while complying with PICMG COM.0 mechanical specifications. Modules equipped with the Xeon Hexa-core processor support both ECC and non-ECC SODIMMs.

System integrators will value having a single off the shelf module to provide multiple I/O with standard high density connector for ease of cabling and differential signaling between the transceivers on the FMC and the FPGA on the carrier for optimal signal integrity across the FMC connector. The flexibility provided by the cross bar switch eases integration with programmable LVDS termination and routing.

Winsystems has announced Its new PPM-C412 series for demanding environments and applications. It offers a broad spectrum of I/O features and the ability to expand functionality in a densely populated, standalone SBC solution. The board delivers greater performance and a clear upgrade path for current PPM-LX800 users while providing full ISA-compatible PC/104-Plus expansion.

At the heart of the board is a Vortex DX3 System on Chip (SOC), which offers a 32-bit x86 architecture with a dual-core microprocessor. The PPM-C412 incorporates dual Ethernet ports coupled with four serial ports, four USB channels and an LPT port for myriad communications options. It also includes dual simultaneous display outputs, one LVDS and one VGA, for Human Machine Interface (HMI) displays. Further, It provides 24 GPIO for monitoring and control, resulting in an I/O-rich, rugged SBC occupying minimal space. The PPM-C412 can be used on its own or in combination with the PC/104-Plus bus to expand functionality and capitalize on its full ISA compatibility, averting the need to re-engineer system architectures.

The PPM-C412 is specifically built for rugged industrial environments, with low power requirements, up to 2 GB RAM and an operating temperature range of -40ºC to +85ºC. With a 10-year availability, this new SBC also extends the product life of systems using commercial off the shelf (COTS) and proprietary PC/104 expansion modules.

AAEON has launched the EPIC-BT07W2 SBC that supports the EPIC form factor and features an industrial-grade thermal range of -40°C to 85°C. The EPIC-BT07W2 is a fanless solution like the rest of AAEON’s EPIC line, and provides high environmental resilience with its wide-temperature design. The CPU is located at the solder side of the board to facilitate further thermal solutions, and comes with a rugged aluminum heat spreader that provides maximum airflow and temperature control. A heatsink is also available as an accessory.

PCI-104 architecture expansion enables daughter boards to be stacked atop on the main board, minimizing lateral space and facilitating maximum flexibility, as well as supporting legacy IO. The EPIC-BT07W2 can be seamlessly integrated into pre-existing hardware such as panel screens and mini PCs. It is also ideal for IoT uses, and is designed for minimum maintenance and maximum ruggedness.

The BIS-3922 improves on HABEY’s BIS-6922 system by offering additional I/O for more applications and solutions. The system is well suited for automation, digital signage, network security, point of sale, transportation, and digital surveillance applications.
The BIS-3922 system includes six DB9 COM ports on the front panel, one of which supports RS-232/-422/-485. HABEY’s proprietary ICEFIN design ensures maximum heat dissipation and a true fanless system.

The BIS-3922 system is built with the Intel QM77 chipset and is compatible with the third-generation Ivy Bridge Core processors. The BIS-3922 system’s additional features include a HM77 chipset that supports third-generation Intel Core i3/i5/i7 processors; dual gigabit Ethernet ports; High-Definition Multimedia Interface (HDMI), video graphics array (VGA), and low-voltage differential signaling (LVDS) display interfaces; one mini-PCI Express (PCIe) and one mSATA expansion; and a 3.5” single-board computer (SBC) form factor.

The ECM-DX2 is a highly integrated, low-power consumption micromodule. Its fanless operation and extended temperature are supported by the DMP Vortex86DX2 system-on-a-chip (SoC) CPU. The micromodule is targeted for industrial automation, transportation/vehicle construction, and aviation applications.
The ECM-DX2 withstands industrial operation environments for –40-to-75°C temperatures and supports 12-to-26-V voltage input. Multiple OSes, including Windows 2000/XP and Linux, can be used in a variety of embedded designs.

The micromodule includes on-board DDR2 memory that supports up to 32-bit, 1-GB, and single-channel 24-bit low-voltage differential signaling (LVDS) as well as video graphics array (VGA) + LVDS or VGA + TTL multi-display configurations. The I/O deployment includes one SATA II interface, four COM ports, two USB 2.0 ports, 8-bit general-purpose input/output (GPIOs), two Ethernet ports, and one PS/2 connector for a keyboard and a mouse. The ECM-DX2 also provides a PC/104 expansion slot and one MiniPCIe card slot.

The CPU-162-14 is a high-performance COM Express module based on the Intel Core i7 Processor. The COM is designed to work in harsh environments. It includes features to provide extra resilience to vibrations, making it well suited for transportation applications.

The PDI Model LV5 and PE5 Series of oscillators provide precision timing in a 3.2-mm × 5-mm ceramic hermetically sealed package. The LV5 is a low-voltage differential signaling (LVDS) ocsillator. The PE5 is a PECL oscillator.

These high-performance clock oscillators offer low integrated phase jitter (0.2 pS for the LV5 and 0.3 pS for the PE5). They are available in frequencies up to 200 MHz and feature a –40°C to 85°C industrial temperature range. Stabilities can be held down to ±25 ppm (depending on temperature range).

The M-5360A is an application-ready solution for multimedia and machine-to-machine (M2M) applications. The credit card-size System on Module (SOM) is powered by a Freescale 800-MHz i.MX537 ARM Cortex A8 processor with 1-GB DDR3 RAM and 4-GB eMMC flash.

The M-5360A also provides powerful communication functionality (e.g., Ethernet, RS-232, RS-485, CAN 2.0, 1-Wire, and USB). This makes the SOM suitable for multimedia applications as well as embedded networking devices.

The M-5360A uses 128-pin 2-mm pin headers, which simplifies application board design. The SOM includes a preinstalled Ubuntu OS. Android and Windows CE are available by request. In addition to the hardware building blocks, software utility and device drivers are available for user applications.