2nd Optical Inspection System

DIS8000

DIS8000 is designed to handle the frame wafers post wafer dicing process. It is able to inspect defects that are observable prior to dicing and also die defects resulted from post dicing process. It’s equipped with two types of defect identification methods, inking on the defective die and wafer map containing locations of the defective die with classification. The system is capable of performing wafer backside inspection.