Research Triangle Park, NC — Ziptronix Inc., a provider of patented, low-temperature direct bonding technology for 3D integration, has provided a limited exclusive patent licensing agreement with IO Semiconductor (IOsemi) for application of its ZiBond technology for use in RF front-end devices for consumer mobile products.

The agreement also marks a new high-volume application market for Ziptronix's proprietary ZiBond technology. "This license agreement with IOsemi is an exciting win for us because it extends our reach into rapidly growing mobile markets by opening up a new high-volume application space for us," noted Dan Donabedian, CEO and president of Ziptronix. "It also demonstrates the value of licensing established technologies like ZiBond, which in this case enables IOsemi to deliver innovative RF front-end solutions with improved performance and lower cost."