Joseph Stockunas appointed to SEMI Foundation Board of Trustees

Nordson Corporation (NASDAQ: NDSN) announces that the SEMI Foundation has appointed Joseph Stockunas, Corporate Vice President for Electronics Systems at Nordson Corporation and the immediate past chair of the SEMI North America Advisory Board, to the SEMI Foundation Board of Trustees in accordance with the association’s by-laws.

“We are excited to leverage Joe’s passion for innovation and his desire to help young people make thoughtful education and career choices,” said Leslie Tugman, Executive Director of the SEMI Foundation. “As the Foundation’s vision is expanding to address the larger industry workforce development pipeline and leadership in the area of women’s issues, Joe’s talent, industry insight, and commitment will be a great asset.”

The mission of the SEMI Foundation is to support education and career awareness in the field of high technology. The SEMI Foundation produces SEMI High Tech U (HTU), a three-day interactive program that encourages high school students to pursue academic paths that emphasize science, technology, engineering, and math (STEM) and to expose them to high technology careers such as semiconductor manufacturing.

The Nordson Corporation Foundation sponsored its first HTU program February 12 – 15, 2018 at the Nordson facility in Carlsbad, California. This was one of the first HTU events to be held in Southern California. Forty high school students from five local high schools, including Carlsbad, Sage Creek, San Marcos, Rancho Buena Vista, and Mission Hills, attended the program, where they learned from industry instructors and visited the UC San Diego campus for a look at college life. The Nordson Corporation Foundation is dedicated to improving the quality of life in its communities by improving educational outcomes that enable individuals to become self-sufficient, active participants in the community.

Stockunas has a long history of engaging and supporting STEM activities and the workforce development pipeline. Stockunas sponsored SEMI High Tech U at Air Products in Pennsylvania where he had previously worked for 30 years. In 2013, he joined Nordson Corporation, and has helped facilitate the company’s sponsorship of SEMI High Tech U in 2018.

“I have been a long-time supporter of the SEMI Foundation’s High Tech U program, which helps students make the connection between familiar electronic products and future career choices in high tech,” said Joe Stockunas. “I look forward to working with the Board to help drive new initiatives to support young people and strengthen the industry workforce.”

FEATURED PRODUCTS

TECHNOLOGY PAPERS

As IP and IC designers and verification teams tackle increased complexity and expectations, reliability verification has become a necessary ingredient for success. Automotive, always-on mobile devices, IOT and other platforms require increasingly lower power envelopes and reduced device leakage while maintaining overall device performance. Foundries have also created new process nodes targeted for these applications. Having the ability to establish baseline checks for design and reliability requirements is critical to first pass success. January 08, 2018Sponsored by Mentor Graphics

The power amplifier (PA) – as either a discrete component or part of an integrated front end module (FEM) – is one of the most integral RF integrated circuits (RFICs) in the modern radio. In Part 2 of this white paper series, you will learn different techniques for testing PAs via an interactive white paper with multiple how-to videos.September 06, 2017Sponsored by National Instruments

WEBCASTS

Since 2006, many of new 3D NAND Flash cells have been proposed and commercialized on the market. Already, we have seen 3D NAND cell structure up to 64L/72L with single or multi-stack NAND string architecture. The memory density on Micron/Intel’s 64L 3D NAND 256 Gb/die reached 4.40 Gb/mm2 (256 Gb/die). In this session, we’ll overview 3D NAND Flash roadmap, products, cell design, structure, materials and process integration. The 3D NAND cell architecture from major NAND manufacturers including Samsung TCAT V-NAND, Toshiba/Western Digital BiCS, SK Hynix P-BiCS and Micron/Intel FG CuA will be reviewed and compared. Current and future technology challenges on 3D NAND will be discussed as well.

MEMS have quite different process and material requirements compared to mainstream microprocessor and memory types of devices. We will explore the latest trends in MEMS devices – including sensor fusion, biosensors, energy harvesting – new manufacturing challenges and potential equipment and materials solutions to those challenges.