Title (fr)

Publication

Application

Priority

US 11008098 A 19980702

Abstract (en)

A method is disclosed for preparing an electronic assembly using a reworkable underfill encapsulant in which the underfill encapsulant is cured in situ from a curable composition comprising one or more mono-functional maleimide compounds, or one or more mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers or adhesion promoters.