RMP354 MLB Multilayer PCB Press

This High performance RMP354 multi layer PCB press designed to allow PCB labs to rapidly prototype multi layer PCBs according to industry standards. The number of circuit board layers is only limited by the maximum lift of the press compartment.

The requirement for MLB multilayer printed circuit boards is rapidly growing as the solution to meet the growing need for the use of high density packages such as BGA mircochips. MLBs overcome interconnection problems associated with high-density packaging. Multilayer boards are used to:

The number of circuit board layers is only limited by the maximum lift of the Multilayer PCB press compartment.

A compact and floor standing aluminium rack contains all parts of the Multi layer PCB Press unit including pressure supply, press plates and heaters. The large loading door that allows quick and easy access to the pressure system is of course security switch interlock protected.

A compressor, which is integral part of RMP series of Multilayer PCB presses is stored in the back of the machine. In the front, you will find additional storage room for tools or boards (lower door). the unit is controlled by two digital and adjustable thermostats, one digital timer as well as a pressure valve with pressure meter. Two powerful air ventilators activated automatically during cooling cycle.

Features

Steps of multilayer PCB MLB production with the RMP 150:

Boards are pinned and stack is inserted into press plates

Pressure is created (This is completely adjustable to suit the type of boards being processed)

Heater is activated

Heating up procedure

Press procedure at preset temperature

Cooling down under pressure

PCB stack is taken out of the Multi Layer PCB press machine

The sequence will take all in total approximately. 3 hours. Gross size of the PCBs is 350 x 450 mm which will result in a Multilayer PCB net size of 300 x 400 mm.

A full range of supporting consumables such as an Artwork Film registration punch and Chemistry for hole desmearing (Cleaning and Conditioning hole walls after drilling) and bonding of the layers are also available by request.

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