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Improved Adhesion for Additive Circuitry Fabrication

Publishing Venue

IBM

Related People

Angelo, RW: AUTHOR

Abstract

Additive circuitry processes depend upon the deposition of metal in selected areas of a circuit substrate by electroless and electrolytic techniques. One objective of such processes is a strong adhesive bond between the circuit substrate and the metal deposited thereon. Various surface preparation techniques function to improve the bond strength between the substrate and the deposited metal.

Country

United States

Language

English (United States)

This text was extracted from a PDF file.

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Improved Adhesion for Additive Circuitry Fabrication

Additive circuitry processes depend upon the deposition of metal in selected
areas of a circuit substrate by electroless and electrolytic techniques. One
objective of such processes is a strong adhesive bond between the circuit
substrate and the metal deposited thereon. Various surface preparation
techniques function to improve the bond strength between the substrate and the
deposited metal.

Test samples of KAPTON* have been prepared by sandblasting the
KAPTON, then electroless plating with nickel, and electroplating with copper to
an over-all thickness of approximately 1 mil. The electro-plated samples were
then placed in a field of an induction heater for approximately 30 seconds. The
products obtained by submission to a field of induction heating materially
improved the adhesion between metal circuit line fabrications and the substrate. *
Trademark of the E. I. du Pont de Nemours & Co.