Porous Chuck (Vacuum Chuck) is a part implemented in Inspection Equipment and Dicing Saw used in manufacturing process of Semiconductors.
This is a product that can hold a thin Silicon Wafer flat on the table surface by using the porous structure on table surface and negative pressure. High flatness and high parallelism are required for the vacuum surface as Dicing Saw cuts Silicon Wafer at the width of about 20ﾂε確.