Intel® Edison Board Support Package

Last updated on September 25, 2015

This document is for software and system engineers who are building and customizing images, kernels, and native SDKs for the Intel® Edison Development Platform. Precompiled versions of the BSP are available on the Intel website. Users who don’t want to modify the default images don’t need to read this document.

The Intel® Edison Board Support Package offers these features:

Kernel image based on Linux* kernel 3.10.17

U-boot second stage bootloader

Bluetooth® and Wi-Fi connectivity

Intel cloud connectivity middleware

Many base Linux packages provided by the Yocto Project*

1.1 – The Yocto Project*

The standard Linux OS shipped on the Intel® Edison platform is based on Yocto. The Yocto Project is an open source collaboration project that provides templates, tools, and methods to help you create custom Linux-based systems for embedded products.

Figure 1 – Building an Image

The Intel® Edison BSP source package is the set of Yocto source files necessary to generate a Linux image ready to run on the Intel® Edison board. It contains:

The set of Yocto recipes describing the process for building a Linux kernel, a bootloader, and a rootfs, which together form the bootable images ready to flash on a device.

The set of Yocto recipes necessary for creating a Software Developer Kit (SDK) and a cross-compiling tool chain that developers can use to create native applications for the Intel® Edison board.

For details on the Yocto project, consult the documentation on the Yocto website.)