SAN JOSE, Calif. — (BUSINESS WIRE) — November 12, 2013 —
Power
Integrations (Nasdaq:
POWI),
the leader in high-voltage integrated circuits for energy-efficient
power conversion, today announced the
HiperTFS™-2
family of ICs, combining two-switch-forward and flyback power-supply
controller ICs with integrated high-voltage MOSFETs. This high level of
integration saves more than 20 components, resulting in a smaller form
factor and higher power density. The main converter provides a
selectable switching frequency between 66 kHz and 132 kHz, which reduces
system cost by enabling the use of very small magnetics.

HiperTFS-2
ICs enable efficiencies of more than 90% at full load. They also provide
175% peak power, a requirement of next-gen Intel CPUs. This single-chip
implementation of a two-switch-forward main (66/132 kHz) and flyback
(132 kHz) standby power supply delivers up to 364 W total output power
(586 W peak) in a compact, two-row eSIP™ power package. Safety features
include undervoltage, overvoltage, over-temperature, overcurrent and
short-circuit protection. A transformer-reset control function prevents
saturation under all conditions.

Comments Chris Lee, product marketing manager at
Power
Integrations: “
HiperTFS-2
ICs enable power supply miniaturization in applications including 80
PLUS® Bronze and 80 PLUS® Silver PCs, gaming-console adapters and
industrial products. The inclusion of the high-side MOSFET driver allows
designers to eliminate the pulse transformer and many other supporting
components, simplifying design and reducing the size (and cost) of the
magnetics.”

Power
Integrations, Inc., is a Silicon Valley-based supplier of
high-performance electronic components used in high-voltage
power-conversion systems. The company’s integrated circuits and diodes
enable compact, energy-efficient AC-DC power supplies for a vast range
of electronic products including mobile devices, TVs, PCs, appliances,
smart utility meters and LED lights. CONCEPT IGBT driver systems
enhance the efficiency, reliability and cost of high-power applications
such as industrial motor drives, solar and wind energy systems, electric
vehicles and high-voltage DC transmission. Since its introduction in
1998, Power Integrations’ EcoSmart® energy-efficiency
technology has prevented billions of dollars’ worth of energy waste and
millions of tons of carbon emissions. Reflecting the environmental
benefits of the company’s products, Power Integrations’ stock is
included in the NASDAQ® Clean Edge® Green Energy
Index, The Cleantech Index®, and the Ardour Global IndexSM.
For more information, including design-support tools and resources,
please visit
www.powerint.com;
visit Power Integrations’
Green
Room for a comprehensive guide to energy-efficiency standards around
the world.

Power Integrations, HiperTFS, EcoSmart, and the Power Integrations
logo are trademarks or registered trademarks of Power Integrations, Inc.
All other trademarks are the property of their respective owners.