The Virtex UltraScale VU440 3D IC extends Xilinx's industry lead from 2x at 28nm to 4x at 20nm using advanced 3D IC technology to deliver an extra node worth of customer value and offer greater capacity than any other programmable device. (PRNewsFoto/Xilinx, Inc.)

Xilinx is the worldwide leader of programmable logic solutions. (PRNewsFoto/Xilinx)

SAN JOSE, Calif., Dec. 10, 2013 /PRNewswire/ -- Xilinx, Inc. (NASDAQ: XLNX) today announced availability of its 20nm All Programmable UltraScale™ portfolio with product documentation and Vivado® Design Suite support. Xilinx shipped its first 20nm silicon in early November 2013, continuing to execute on an aggressive UltraScale device rollout. These devices deliver an ASIC-class advantage with the industry's only ASIC-class programmable architecture coupled with the Vivado ASIC-strength design suite and UltraFast™ design methodology.

The new Xilinx® UltraScale product portfolio extends Xilinx's market leading Kintex® and Virtex® FPGA and 3D IC families, based on the UltraScale architecture and the superior gate density of TSMC's 20SoC process. UltraScale devices enable 1.5x to 2x realizable system performance and integration, and consume up to half the power, relative to currently available solutions. These devices deliver next generation routing, ASIC-like clocking, and enhancements to logic and fabric to eliminate interconnect bottlenecks while supporting consistent device utilization of more than 90% without performance degradation.

"Xilinx continues to lead in technology innovation and ground breaking product offerings that enable fastest time to market," said Moshe Gavrielov, president and CEO at Xilinx. "UltraScale devices bring our customers ASIC-class capabilities by coupling our UltraScale ASIC-class architecture with our Vivado ASIC-strength design suite and UltraFast methodology. The combination of these silicon and design solutions enable the fastest path to achieve significant systems differentiation for our customers, and enables a far superior alternative to ASICs and ASSPs."

"Our collaboration with Xilinx has resulted in the development and deployment of many new technologies and methodologies," said TSMC President and Co-CEO, Dr. Mark Liu. "With the introduction of the first 20nm UltraScale Architecture products, Xilinx and TSMC demonstrate how the synergy between silicon process and device architecture extracts maximum product performance and results in the highest system value."

Kintex UltraScale FamilyThe new Kintex® UltraScale™ FPGAs deliver up to 1.16M logic cells, 5,520 optimized DSP slices, 76 Mbits of BRAM, 16.3Gbps backplane-capable transceivers, PCIe® Gen3 hard blocks, integrated 100Gb/s Ethernet MAC and 150Gb/s Interlaken IP Cores, and DDR4 memory interfaces. Initially introduced as part of the 28nm Xilinx 7 series family, Kintex devices established the new mid-range category of best price-performance at the lowest power. Kintex UltraScale devices are designed to continue leadership in this category to meet the requirements for the growing number of key applications including:

8K/4K Super High Vision Displays and Equipment

256-channel Ultrasound

8X8 Mixed Mode LTE and WCDMA radio with smart beamforming

100G Traffic Management/NIC

DOCSIS 3.1 CMTS equipment

Virtex UltraScale Family Also setting new industry standards, the new Virtex® UltraScale™ devices provide unprecedented levels of performance, system integration and bandwidth on a single chip. The largest family member delivers 4.4M logic cells, 1,456 user I/Os, 48 x 16.3 Gb/s backplane-capable transceivers and 89 Mbits of Block RAM, breaking previous records by more than doubling Xilinx's industry's highest capacity Virtex-7 2000T device and delivering a staggering 50M equivalent ASIC gates. Virtex UltraScale devices include 28Gb/s backplane-capable and 33Gb/s chip-to-optics transceivers, in addition to integrated PCIe Gen3, 100Gb/s Ethernet MAC and 150Gb/s Interlaken IP cores, and DDR4 memory interfaces to support multi-hundred gigabit-per-second levels of system performance with smart processing at full line rates.

The system performance and capacity delivered with the Virtex UltraScale family makes these devices the logical choice for the most challenging applications such as:

Single chip 400G MuxSAR

400G Transponder

400G MAC-to-Interlaken bridge

Emulation and Prototyping

Xilinx® UltraScale™ devices provide the same performance of the logic fabric and key architectural blocks across the entire UltraScale portfolio, enabling a scalable and optimized architecture. Moreover, with footprint compatibility between families, Kintex UltraScale FPGAs provide a clear migration path to Virtex UltraScale devices. To learn what Xilinx Alliance Program members are saying about the new UltraScale products, read quotes below.

About Xilinx Xilinx is the world's leading provider of All Programmable FPGAs, SoCs, and 3D ICs. These industry-leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information, visit www.xilinx.com.

"Alpha Data is excited to feature off-the-shelf solutions based on the latest Xilinx UltraScale™ devices. Our next generation of rugged embedded and data center boards will have unprecedented throughput speed and performance. The enhanced features of UltraScale such as hardened PCIe® Gen3 and 100G EMAC blocks will provide leading edge solutions without compromising power efficiency." Adam Smith, CEO, Alpha Data

"As a Xilinx Premier Design Services Alliance Member, Fidus is often working on the leading edge of technology to accelerate new product development schedules for our OEM customers. We are extremely impressed with Xilinx's UltraScale™ architecture, coupled with the productivity provided by Vivado®, and see great opportunities for our clients to realize uniquely advanced systems with this technology in our primary markets of Wired Comms, Aerospace & Defense, Test & Measure, and Broadcast Video. And as a participant in Xilinx's UltraScale Early Access program, Fidus will be introducing a JESD204B prototyping solution concurrent with Xilinx's UltraScale platform rollout."John Bobyn, VP Engineering, Fidus Systems, Inc.

"Helion has been a long-term established member of the Xilinx Alliance Program, providing highly optimized cryptography and loss-less compression IP for Xilinx customers worldwide. We are very impressed with Xilinx's UltraScale™ architecture. In particular, the new fabric performance will enable our already optimized solutions to run at even higher data rates and with fewer FPGA resources. Helion is committed to a broad rollout of our IP cores on Xilinx UltraScale in early 2014."Graeme Durant, CEO, Helion Technology Limited

"As a Xilinx Premier IP Alliance Member, Northwest Logic and Xilinx collaborate closely on connectivity solutions for Xilinx OEMs worldwide. The new clocking architecture is particularly impressive, and we appreciate the ease of migrating our IP from Kintex® UltraScale™ to Virtex® UltraScale in the same high-performance fabric. Northwest Logic is already working to release its DMA core and other IPs on Xilinx UltraScale, packaged for the Vivado IP Integrator flow, and we look forward to continued synergies with Xilinx." Brian Daellenbach, President, Northwest Logic, Inc.

"Tokyo Electron Device believes that Xilinx's UltraScale™ FPGA is the perfect solution for high performance applications, such as 8K4K video, which requires the enhanced logic blocks, high performance fabric, 100G EMAC, DDR4 memory support, and other advanced features of this new 20nm platform. TED, as a Xilinx Premier Alliance Member, will be introducing UltraScale FPGA development platforms including FMC interface cards such DisplayPort1.2, 6/12G-SDI, and VxOne in order to accelerate design productivity for our mutual customers." Yasuo Hatsumi, Vice President & General Manager of EC Product Business, Tokyo Electron Device