Installation of ELP300 Excimer Laser Stepper and Joint Development Agreement with IBM for Advanced Packaging and 3D Integration

Garching, January 29, 2014 – SUSS MicroTec, a global supplier of equipment and process solutions for the semiconductor industry and related markets, announces the extension of a joint development agreement (JDA) with the IBM Corporation. SUSS MicroTec Photonic Systems Inc, a subsidiary of SUSS MicroTec, recently installed a ELP300 Excimer laser stepper system at IBM. The installation of the Excimer laser system, and the JDA extension under this alliance, will serve to further develop, enhance and propel the application of Excimer laser technologies in the realm of advanced semiconductor packaging – including 3D systems integration.

The Excimer laser process offers extended process capability beyond traditional manufacturing approaches, while at the same time providing a lower cost of ownership potential with extendibility to both current and future applications. In the program, both IBM and SUSS MicroTec will continue collaboration on the development of Excimer laser processes and process systems for two distinct roles; Seed Layer Removal for UBM (under bump metallization) and micro-structuring organic dielectrics (Vias and RDL trenches) for system interconnects.

This joint development effort will leverage joint resources from IBM’s packaging expertise and SUSS MicroTec Photonic Systems’ 24 years of Excimer laser processing and tool development to create leading-edge packaging and enable higher performance back end of line materials for the semiconductor back-end.

"We see high growth potential for this technology and continue contributing to the development of alternative manufacturing processes that address existing manufacturing challenges and continued cost reductions.“ says Frank P. Averdung, President and CEO of SUSS MicroTec. “Together with IBM, we intend to extend these capabilities to meet industry needs.”