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Attenuated Phase Shift Mask Method

Karl Mautz and John Maltabes

Reticle manufacturing is challenged by the reduction of
feature size variation, increased resolution, and improved overlay control for
positioning of features on the reticle substrate. These become increasingly difficult in manufacturing
reticles for sub-0.35um device technologies. Other reticle manufacturing techniques such as optical
proximity correction or phase shift masks adds additional complexity and cost
to the reticles.

Phase shift masks are difficult to produce due to
the custom manufacturing procedures on the substrate and masking
materials. The masking materials
include molybdenum and chrome materials on quartz substrate plates. Attenuation plates are used to lower
the intensity of the radiation going through the mask. Combining these two masks produces an
effect that can uniformly adjust the CD (critical dimensions) produced by the
mask combination. By changing the
attenuation plate, variation in the CDs without either: 1) adjusting the lithography tool
exposure energy (that can lead to scumming or overexposure effects if the
adjustment is outside the control zone of the Bolson curve), or 2) by producing
another reticle with a different CD feature sizing. This allows experimentation on the process and tool
capabilities without producing many expensive reticles to test this. Reticles typically are expensive to
produce ($50,000) and can take 2-4 weeks to complete.