In the KABRA (Key Amorphous-Black Repetitive Absorption) slicing process, by continuously irradiating the laser vertically from the upper surface of the ingot, a separating layer that absorbs light is formed into a flat shape at the desired depth, enabling peeling and formation of wafers from this point.

In response to this, as well as strong demand from wafer manufacturers, the DAL7440 laser saw (which measures 750mm x 1350mm x 1800mm) has been developed, to support KABRA processing of 8-inch wafers.

Maximum ingot thickness is 40mm (with a function for measuring ingot thickness). The system is alignment-free, thanks to an orientation flat detection function using auto alignment. A wafer printing function tracks the total number of processed wafers. In addition to 8-inch diameter ingots, the DAL7440 also supports future increases in ingot diameter.

In March, the DAL7440 will be set up in DISCO’s North Carolina office (Disco Hi-Tec America Inc) to more flexibly handle requests for processing tests in the USA.

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