Sporting Corsair's signature fin memory heat sink and patented heat-removing printed circuit board design, the new XMS3 DHX products feature DDR3 performance while promoting increased stability. DHX technology allows this memory to have superior thermal characteristics to enable it to run cooler than a module with stamped or mesh heat spreaders. The result is enabled superior reliability, stability and performance capability.

Heat is the enemy of your computer's key components. And the more you tweak components for performance, the more heat is generated. Heat will slow down your system and impact long term reliability. With traditional DDR2 memory, the standard method of chip packaging involves a BGA (Ball Grid Array). In a BGA, small balls of solder, organized as a grid, are the leads that connect the device to the module circuit board. A Micron Semiconductor study shows that in a BGA memory device as much as 50% of the heat generated by the chip is actually conducted into the circuit board. Since traditional heat sinks are only attached to the front surface of memory chips, there's no easy thermal path for the heat coming from the back of the chips.

Corsair's engineers have developed a unique technology that maximizes heat dissipation while improving reliability, even in the most extremely overclocked memory module. Dual-Path Heat Exchange (DHX) technology utilizes two methods to effectively remove heat from the memory circuit board - Convection and Conduction.
DOMINATOR is the industry's performance and award leader. It has won numerous honors to date including various Editor's Choice awards and several "Memory of the Year" honors.