VIA Technologies has announced the EPIA-P910 Pico-ITX motherboard, the first VIA motherboard to feature the latest VIA VX11H MSP in combination with a VIA QuadCore E-series processor.

The VIA EPIA-P910 Pico-ITX provides a platform for a wide array of next-generation ultra compact devices for applications in health-care, logistics, fleet management and other vertical market segments.

The VIA EPIA-P910 Pico-ITX is the first VIA motherboard to include the VIA VX11H MSP which provides the latest in graphic capabilities, including DirectX 11 support, and 3D stereoscopic display. In combination with a 1.0GHz VIA QuadCore E-series processor, the VIA EPIA-P910 offers high performance computing in an ultra compact, low power design with today's latest connectivity options including HDMI and USB 3.0.

The VIA EPIA-P910 Pico-ITX supports up 8GB of 1333MHz DDR3 memory, HD audio, HDMI, VGA and LVDS display connectivity as well as a high performance hardware HD video decoder in the shape of the latest VIA Chromotion 5.0 video processor.

On board pin headers and an extension board to board connector provide support for an additional 6 USB 2.0 ports, an LPC connector, SMBus connector, PS/2 support, audio jacks, LVDS, four pairs of DIO and two UART ports. Rear I/O includes one HDMI port, one VGA port, two USB 3.0 ports and one GigaLAN port.

This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.