32nm Planar transistor on the left versus 22nm 3D Tri-Gate transistor on the right. The yellow dots represent current flow. (Source: Intel)

The 22nm 3D tri-gate transistor (Source: Intel)

New 22nm 3D Tri-Gate transistors will boost performance by up to 37 percent compared to existing 32nm technology

When it
comes to making advances in manufacturing technologies for semiconductors, we
can always look to Intel to lead the way. Today is no exception as the Santa
Clara, California-based company announced today that it will incorporate 3D
transistors into its upcoming 22nm microprocessors.

"Intel's
scientists and engineers have once again reinvented the transistor, this time
utilizing the third dimension," said Intel President and CEO Paul
Otellini. "Amazing, world-shaping devices will be created from this
capability as we advance Moore's Law into new realms."

Intel goes on to describe 3D Tri-Gate as follows:

The traditional "flat" two-dimensional
planar gate is replaced with an incredibly thin three-dimensional silicon fin
that rises up vertically from the silicon substrate. Control of current is
accomplished by implementing a gate on each of the three sides of the fin – two
on each side and one across the top -- rather than just one on top, as is the
case with the 2-D planar transistor. The additional control enables as much
transistor current flowing as possible when the transistor is in the
"on" state (for performance), and as close to zero as possible when
it is in the "off" state (to minimize power), and enables the
transistor to switch very quickly between the two states (again, for
performance).

Just as skyscrapers let urban planners optimize
available space by building upward, Intel's 3-D Tri-Gate transistor structure
provides a way to manage density. Since these fins are vertical in nature,
transistors can be packed closer together, a critical component to the
technological and economic benefits of Moore's Law. For future generations,
designers also have the ability to continue growing the height of the fins to
get even more performance and energy-efficiency gains.

Tri-Gate
will provide unprecedented levels of performance and power savings according to
Intel. The technology will allow processors to run at lower voltages while at
the same time limiting the amount of leakage current. In fact, Intel says that
processors using 22nm Tri-Gate transistors offers up to a whopping 37 percent performance
boost at low voltages.

"The
low-voltage and low-power benefits far exceed what we typically see from one
process generation to the next," said Intel Senior Fellow Mark Bohr.
"It will give product designers the flexibility to make current devices
smarter and wholly new ones possible. We believe this breakthrough will extend
Intel's lead even further over the rest of the semiconductor industry."

Ivy Bridge processors using Intel's
3D Tri-Gate technology will enter production later this year. You can watch a YouTube clip on 3D Tri-Gate here.

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This article is over a month old, voting and posting comments is disabled

And there is a lot of difference in making a singe device in a lab and making a stable manufacturing process to mass produce millions of chips (serving 80% of the market)......

The whole engineering challenge apart, it is a supply chain and logistics nigtmare (I am assuming Intel would manufacture it across the globe eventually and also sources stuff from all over the world)........ and Intel is the only manufacturer in the planet that can do it at such a scale with such a machine like efficiency.......I am more amazed by that than the physics of it (which is very impressive too).....