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MediaTek CEO Invited To Speak At 2014 ISSCC: With Eight Papers To Be Published

HSINCHU, Nov. 8, 2013 /PRNewswire/ -- MediaTek Incorporation (TT: 2454), is honored to announce that Ming-Kai Tsai, Chairman and CEO at MediaTek, has been invited to deliver a keynote speech at the 2014 IEEE International Solid-State Circuits Conference (ISSCC), along with eight technical papers accepted. The speech will focus on the latest trends in technology and challenges faced during the transition into a new cloud era - Cloud 2.0.

Tsai, a dedicated, long-time supporter of the ISSCC, has devoted his life to developing inclusive semiconductor solutions and has recently been recognized as one of the "100 Best-Performing CEOs in the World" by Harvard Business Review in 2012.

"It's a great honor for me to be invited by ISSCC to speak at the premier solid-state circuits conference and have MediaTek recognized as a proactive contributor, innovator and disruptor of the semiconductor industry," said Tsai.

Further legitimizing MediaTek's continuous technological breakthrough, ISSCC has accepted eight technical papers from MediaTek for February 2014 publication, including one titled "Cloud 2.0 Clients and Connectivity - Technology and Challenges" by Tsai himself. Over the span of 10 years, MediaTek has had more than 30 papers published at the ISSCC Conference, showcasing MediaTek's commitment to technological innovation and to the semiconductor industry.

Additionally, another paper titled "Heterogeneous Multi-Processing (HMP) Quad-core CPU and Dual-GPU Design for Optimal Performance, Power and Thermal Tradeoffs in a 28nm Mobile Application Processor" was accepted. The acceptance reinforces MediaTek's strong industry position and technology leadership on the topics of HMP, CPU and Thermal Optimization.

Other papers to have recently been accepted showcase MediaTek's relentless innovation, in the area of high speed memory interfaces, high-performance frequency synthesizers for 802.11ac WiFi application, self-charged real-time clock generation, all-digital PLLs with supply noise cancellation and temperature compensation techniques, and near field communication (NFC) self-calibration.