Super Microleaf – 5805 Series

Features & Benefits

Kyocera Connector Products’ original S-shaped spring is adopted for the spring structure, which realizes a low profile

Connectors with or without boss are available

Contact Material: Copper alloy

Insulator Material: Heat-resistant plastic

Operating Temperature Range: -40 to +85°C

Typical Applications

Mobile phones

PHSs

Digital AV equipment

The 5805 Series are low profile, 0.4mm pitch Board to Board Connectors with a stacking height of 1.0mm designed to meet market needs for downsized and thinner mobile phones, PHSs, and digital AV equipment. A pinching structure (two-point contact design) is adopted to enhance resistance to vibrations or drop shocks . The Twin-rib structure of the contact on the plug side eliminates foreign matters such as scattered flux and chips from board separation and ensures high contact reliability. An original locking structure is adopted for the mating lock structure, which generates a firm “click” sound and enhances the retention force when connectors are removed despite the low profile. A checker (inspection jig) connector is also available for carrying out easy checks on conductivity and short circuits in connectors under mated conditions. There is little dead space as metal is not exposed on the back of the connector. Thus, it is possible to form wiring patterns on the substrate area which is positioned between the terminals, realizing a suitable structure for high-density packaging.