"While Taiwan-based cooling module makers have been developing 0.6-0.8mm ultra-thin heat-pipes for smartphones, China-based makers have brought continued competitive pressure through upgrading technology and are expected to surpass Taiwan makers in two years, according to sources from cooling module makers.

Production of notebook cooling modules in 2014 are also mostly being done by China makers.

Japan-based cooling module maker Furukawa has outsourced close to 50% of its shipments to China and the outsourcing is also expected to assist China makers advance their technology, the sources added."

FULL STORY @ DIGITIMES(http://www.digitimes.com/news/a20140523PD204.html?mod=2)