Winbond has announced that the firm will provide its TS16949-certified AEC-Q100-qualified serial flash memory devices - featuring densities from two megabits to 256 megabits - to global equipment makers in the automotive-electronics market.

Winbond's 90nm AEC-Q100 qualified automotive grades SpiFlash memories are available now in densities up to 128Mb. Industrial Grade Plus is also available for less stringent automotive applications. A 58nm family of SpiFlash starting with densities up to 256Mb will be introduced later in 2012, as will Winbond's 90nm parallel NOR flash memories, also up to 256Mb.

In 2018, global server shipments will grow 8.5% to reach 13.73 million units. Digitimes Research estimates server shipments worldwide will grow at a CAGR of 6.5% during the period 2017-2022, with growth mainly driven by large-scale data centers and the China market.

Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.