Today, at Mobile World Congress (MWC), Qualcomm announced a new mobile chipset, the MDM8225. The MDM8225 brings full support for HSPA+ Release 9 aka HSPA+ 84Mbps. If you may recall, T-Mobile had plans for HSPA+ 84Mbps and even HSPA+ 168Mbps when they first rolled out their 4G campaign last November. The new chipset will use “dual-carrier” technology, which will utilize multiple frequencies at the same time. Since T-Mobile’s 3G/4G network … [read full article]

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