IBM releases Power ISA v3.1. Among the new instructions, there is new bfloat16 support, new reduced-precision outer-product operations including 4-bit integers, and new instruction prefixes. IBM plans on presenting POWER10 at Hot Chips 32.

A look at ODI, a new family of packaging interconnect technologies that bridges the gap between Intel’s EMIB (2.5D) and Foveros (3D) by providing the flexibility of an EMIB in 3D with additional benefits of thermal & power.

TSMC reports a flat Q1 amid the COVID-19 pandemic, ramps its 5nm node with good yield and discloses key 3-nanometer (N3) details. N3 will be a full node jump over N5 and is expected to offer over a quarter-billion transistors per each millimeter square of silicon.

Ranovus launches its Odin platform, a multi-wavelength Quantum Dot Laser (QDL) based silicon photonic engine which includes 800Gbps to 3.2Tbps single-chip engines as well as co-packaged optics scaling up to 51.2Tbps for next-generation data center switches and other HPC compute chips that require high bandwidth capacity.