Every lab can now produce accurate, reproducible, thinned and perfectly polished dice for backside analysis. Flip-chip and power chip mechanical decap. is now straightforward and accurate.

Thinned and polished die in a PQFP package, backside imaged using an Emission Microscope with NIR Illumination, with 20X objective.

The die, whether in packaged or wafer form, is mounted on a specially designed traveling table oscillates in the X and Y directions

A rotating tool, controlled in the Z-Direction, means reproducible grinding can be carried out to a specific thickness (routinely to less than 50mm of remaining silicon), finishing with a scratch-free mirror polish. This yields a surface ready for NIR imaging and backside analysis.

By changing tools, in conjunction with loose or fixed abrasives, a scratch-free surface is produced. Heating of the substrate is minimal during processing due to the low damage nature of the process.