Co/Cu and Ni/Cu multilayers fabricated by electroplating technique were annealed at
various temperatures in order to investigate thermal stability of multilayered structures. Vickers
hardness tests on the annealed Co/Cu and Ni/Cu multilayers were conducted at room temperature. It
was recognized that after the annealing at 1023K the Co/Cu multilayer still maintained the hardness
of as-deposited state. On the other hand, the hardness of Ni/Cu multilayer was almost identical to
copper substrate after the annealing at 903K.