Statistics

Surface roughness effect on copper–alumina adhesion

Author

Lim, Ju Dy

Yeow, Su Yi Susan

Rhee, MinWoo Daniel

Leong, Kam Chew

Wong, Chee Cheong

Date of Issue

2013

School

School of Materials Science and Engineering

Version

Accepted version

Abstract

The surface roughness of the substrate itself could play an important role for the bonding at the interface. In this paper, a correlation of the surface roughness of a rigid alumina substrate and its 2D model of estimated surface area has been studied using Atomic Force Microscopy (AFM). With rougher surface, the adhesive strength between a deposited copper film and the alumina substrate is higher due to the larger contact area at the interface. For 99.99% pure copper–96% pure alumina, this effect can account for an adhesive strength increment of more than 50%.