Laser Dicing Solutions

DISCO's Strength

DISCO makes the proposal best suitable for your processing needs from the lineup of various oscillators with different output, frequency width and pulse width.

Originally developed optical system.

Dicing engine developed by Hamamatsu Photonics.- The stealth dicing engine developed for DISCO under the license agreement by Hamamatsu Photonics, which is well known for its highly sophisticated optics related technology, is installed.

Sold more than 200 laser saws worldwide (as of January 2010).
Many of the world’s leading semiconductor production facilities.
(e.g., major semiconductor and LED manufacturers, universities and research laboratories) use DISCO laser saws.

Reliable mechatronics cultivated through our blade dicing saws and grinders which proudly occupy a 70% share in the global market.

Product supply speed

Close relationship between R&D and production divisions realizes speedy product delivery.

DISCO can cope with the urgent startup of production line.

Worldwide support system

Engineers are constantly present at 48 locations in 15 countries.
Speedy response is ensured, while collaborating with the Tokyo Head Office, from equipment installation to after sales follow-up.