Karch was awarded “Best Presentation” for the session New Solder Material Technology in the Manufacturing Process of IGBT Modules, which discussed a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.

PLYMOUTH, WI - Kurtz Ersa North America, a leading supplier of electronics production equipment, recently held its first process seminar at its new facility in Guadalajara. The local seminar allowed surrounding customers to attend and advance their knowledge and understanding about why selecting a proper flux for the specific process they are using is so important.

WALDENBURG, GERMANY - Würth Elektronik eiSos and Modelithics proudly present the results of their cooperation project: with immediate effect, Microwave Global Models™ products are now available for three product families of SMT high-frequency inductors. HF developers now have the opportunity to test the 0402 and 0603 designs of the WE-MK, WE-KI, and WE-TCI coil families in simulations.

BLAUBEUREN, GERMANY - Circuit board coating is not just about complete reliability. Precise application procedures are required to cope with the constant miniaturisation in the electronics industry and the associated narrower tolerances between the areas to be lacquered and the areas which must remain free of lacquer. Electronics manufacturers are increasingly confronted with an ever-growing range of product and material mixes.

TORRINGTON, CT - Dymax Multi-Cure® 9-20557 is designed for rapid conformal coating of printed circuit boards and other electronic assemblies. This MIL-I-46058C listed product is especially formulated to remain on the edges of difficult-to-wet components and sharp leads, while its low modulus allows it to excel in coating applications where thermal shock performance is critical.

Multi-Cure® 9-20557, which is UL approved and meets the IPC –CC-830 standard, has been optimized for coating thicknesses between 51 mic [0.002 in] and 510 mic [0.020 in].

Fontana, CA - Everett Charles Technologies (ECT) will exhibit its leading Contacting and Compliant Connector Solutions at the upcoming BIOMEDevice Show scheduled to take place December 7 - 8, 2016 at the San Jose Exhibition Center, California.

WATERLOO, ONTARIO - Teledyne DALSA, a Teledyne Technologies company and global leader in digital X-Ray image sensing technology, will display its Xineos family of CMOS dynamic flat X-Ray detectors at the RSNA 2016 Technical Exhibition, November 27 to December 2, at McCormick Place in Chicago.