Equipment Training
Training is offered weekly on a per need basis especially when there are new users. Please check the Training Schedule or contact the tool manager. Make sure before you request contact aligner training you have completed “General Lithography Training” since it is a prerequisite.

Description:

This contact aligner uses 280-350 nm light to expose wafers up to 150 mm diameter. The system features an infrared camera for alignment to patterns on the backside of the wafer. The versatile mask holder allows both round and square plates as masks, and the sample plate accommodates small and odd-shaped substrates.

Alignment Mark Placement for Bottom Side Alignment (BSA)

* BSA objective have a range of travel 24 to 95mm apart.

* The 100mm and 150mm substrate chuck have two rectangles for objectives to view the substrate.

This material is based upon work supported by the National Science Foundation under Grant No. ECCS-1542081. Any opinions, findings, conclusions or recommendations expressed in this material are those of the author(s) and do not necessarily reflect the views of the National Science Foundation.