Bill Infantolino is the Associate Director of the Integrated Electronics Engineering Center at Binghamton University. He has over 30 years of experience in electronics packaging including nearly 25 years with IBM. He held a variety of engineering and management positions in the area of electronic packaging. The primary focus of his work was in the area of thermal and mechanical simulation and testing in support of product development, reliability evaluation, and solving manufacturing concerns. Bill also has held a variety of positions in laminate, module, and assembly product and process development. His experience spans a broad range of technologies in first level through system level packaging. Bill holds 11 patents in the area of electronic packaging and has over 15 papers published in journals and conference proceedings.

Program Co-Chair:

Kaustubh Nagarkur, GE Global Research, Systems Engineer

Kaustubh Nagarkar is a Senior Engineer at GE Global Research. His research has focused on packaging and systems development/reliability in the areas of high temperature downhole electronics, subsea sensing, photovoltaics, and medical electronics. Kaustubh has 27 publications and 19 filed/issued patents. He is a member of ASME and IEEE. He completed his MS ('03) & PhD ('06) from Binghamton University.

Co-Chair:

Shan Gao - Global Foundries

Shan Gao is the senior member of technical staff in Packaging technology and integration, Globalfoundries. He has over 15 years of experience in electronics packaging industry as well as research organization, including advanced packaging, bumping, CPI, 2.5D/3D TSV, etc. He has published over 100 scientific papers and filed/awarded 17 patents. He received his Ph.D in Material Science from Technical Univeristy Munich.

Co-Chair:

Mike Delaus, Analog Devices , Wafer-Level Package Development Manager

Mike Delaus manages the Wafer-Level Package Development Group at ADI. He received his B.S. degree in Materials Science Engineering from MIT in 1982. He joined the Advanced Process Development Group at Analog Devices as a front-end process development engineer in 1988. Since 2005, he has managed ADI's wafer-level package development activities, responsible for wafer-level and flip chip packaging as well as Through-Silicon Vias (TSVs) and 3D technologies.

Co-Chair:

David Milnes, IBM

Dr. Milnes P. David is a Development Engineer in the Advanced Thermal Energy Efficiency Lab., led by Dr. Roger Schmidt, in IBM's Systems & Technology Group. He conducts research and development of advanced methods and technologies to improve the thermal management and cooling energy use of servers, mainframes and data centers. Milnes received his doctoral degree in Mechanical Engineering from Stanford University where he studied and developed novel two-phase microfluidic heat sinks for the cooling of high performance microprocessors.

Co-Chair:

Paul Chiarot - Binghamton University

Paul Chiarot is an assistant professor in the Department of Mechanical Engineering at the State University of New York at Binghamton where he directs the Microfluidics and Multiphase Flow Laboratory. He received a PhD in Mechanical Engineering from the University of Toronto and has worked as a post-doctoral researcher at the University of Rochester.

Co-Chair:

Jeff Erlbaum - GE

Jeff Erlbaum is a Systems Engineer at GE's Global Research Center. His research is focused on packaging and reliability for electronic systems. Past development experience has been in, but not limited to, the areas of diagnostic imaging, functional textiles, conformal, multi-axial, 3D medical electronics, photovoltaics, silicon carbide power electronics, radiation detection, and high temperature assemblies for downhole drilling. Jeff has authored several technical reports, and holds 9 filed or issued patents. He earned his B.S. and M.S. degrees in System Science and Industrial Engineering from Binghamton University.

Co-Chair:

Tim Singler - Binghamton University

Dr. Timothy J. Singler is a Professor of Mechanical Engineering/Materials Science and Engineering at SUNY Binghamton. His background is fluid dynamics, thermodynamics and applied mathematics. His research falls in the gray area between fluid physics and materials science, involving the fundamental phenomena of wetting, interface physics and assembly. Applications include reactive wetting in metal systems relevant to joining processes and the printing of functional materials for electronics, sensing and biological purposes.

Co-Chair:

Ertugrul Berkcan - GE

Ertugrul Berkcan is a principal scientist at GE Global Research where he joined in 1986; since then, he has been carrying out research and development of MEMS, sensors, sensor-electronics interface, and sensor system architecture. His current research interests lie in mircoelectromechanical systems and devices, remotely powered wireless sensors, passive energy coupled sensors, and harsh environment sensors systems. His research has included the areas of MEMS sensors and actuators, low cost high accuracy sensors, current and magnetic field sensing, sensors for smart appliances, smart networked sensors for automation, and low cost diagnostic sensor systems, wireless and self-powered sensor platforms, high capacity, low latency control/monitoring, and microprognostic system development for structural health monitoring. Ertugrul's designs have been commercialized into several GE products. He has authored more than 40 papers and has been awarded more than 100 patents.

Co-Chair:

Sherry Towfighian - BU

Dr. Towfighian earned her PhD in Mechanical Engineering from the University of Waterloo (Canada) in 2011. She joined the department of Mechanical Engineering at Binghamton University in 2013. Her research interests are application of Micro-Electro-Mechanical Systems (MEMS) in medical devices, and energy harvesting from mechanical vibration. Her expertise is on linear and nonlinear dynamics, vibration and control systems for electromechanical systems. Her current projects include nonlinear resonators for broadband energy harvesting; triboelectric nano-generators; bi-axial micro-mirror for endoscopic application, and locomotion systems for capsule endoscopy. She is the session organizer at ASME IMECE 2014 and has been the technical reviewer for conferences of IEEE CDC 2013 and ACC 2013.

Co-Chair:

Jeff Leal - Speedline Technologies

JeffLeal earned his BS in Electronics at the U Latina from Costa Rica. With over 15 years in semiconductor packaging, he has worked in both Capital Equipment companies as well as Semiconductor. His body of work ranges from C4 process improvements to new product development and IP for 3D stacked packages. His experience in both Capital Equipment Development and Semiconductor Package Development has given him a unique perspective to tackle industry challenges generating new IP in various fields ranging from 3D packaging to EMI shielding. He currently works with Speedline Management devising corporate strategy to tackle new industry challenges.

Co-Chair:

Liang Yin, GE

Liang Yin is an Electronic Packaging Engineer at GE Global Research. His research interests include electronic packaging related materials, processes, and reliability. Liang Yin received the Ph.D. in Materials Science and Engineering and M.S. in Mechanical Engineering, both from Binghamton University. Before joined GE, he worked at the AREA Consortium at Universal Instruments. Dr. Yin has authored 50+ peer-reviewed manuscripts and served as a reviewer for several journals in the area of electronic materials. Dr. Yin is a member of TMS and IMAPS.

Co-Chair:

Junghyun Cho, SUNY Binghamton University, Associate Professor

Dr. Junghyun Cho is currently an Associate Professor, a Director of Graduate Studies in the Department of Mechanical Engineering, and a Director of the Materials Engineering Program at the State University of New York (SUNY) at Binghamton. He joined the University as an Assistant Professor in Fall 2001 after finishing a postdoctoral research appointment at the University of California, Santa Barbara. He received his B.S. in Metallurgical Engineering from Yonsei University (Seoul, Korea) in 1991, M.S. in Materials Science and Engineering from Northwestern University in 1993, and Ph.D. in Materials Science and Engineering from Lehigh University in 1998. Before starting his graduate studies, Dr. Cho had worked at Samsung Semiconductor R&D Center (Kihung, Korea) in the area of electronics packaging materials and processes (1990-91). His research interests include microstructure design and characterization of materials, ceramic thin films, processing science, and mechanical behavior of materials.

Co-Chair:

Christine Kallmayer - Fraunhofer Institute

Christine Kallmayer received her diploma in experimental physics at the University of Kaiserslautern in 1994. Afterwards she worked as a research scientist at the Microperipheric Center of the Technical University of Berlin. Her main field of activity was the development and investigation of packaging technologies with the Au-Sn metallurgy for different applications and the reliability of the metallurgical system. Since 1998 she is responsible for the group „System on Flex" at Fraunhofer IZM. The main working areas are flip chip soldering and adhesive bonding on flex (e.g. for transponder applications) and reliability investigations for different interconnects. Since 2001 the group is also developing technologies for the integration of electronics in textiles.

Mark D. Poliks is a Professor of Systems Science and Industrial Engineering and Technical Director of the Center for Advanced Microelectronics Manufacturing (CAMM) at the State University of New York at Binghamton. He holds joint faculty appointments in the Department of Chemistry and the Materials Science and Engineering Program at Binghamton. His research is in the areas of high performance electronics packaging, flexible electronics, materials, processing, roll-to-roll manufacturing, in-line quality control and reliability. He has authored numerous technical papers and invited presentations. He holds over forty US patents.

He has held senior technical management positions at Endicott Interconnect Technologies, Inc. and IBM Microelectronics. He was a founding member of the IBM Materials Research Community and received an IBM award for "Excellence in Technical Management." Poliks received his Ph.D. in materials science and engineering from the University of Connecticut and held a McDonnell-Douglas postdoctoral fellowship at Washington University in St. Louis.

Co-Chair:

Dave Shaddock, GE Global Research, Electronics Packaging Engineer

Dave Shaddock is an Electronics Packaging Engineer at the General Electric Global Research. He received a B.S.M.E. degree from Carnegie-Mellon University and M.S.Eng. Sci. in Microelectronics Manufacturing from Rensselear Polytechnic Institute. His research interests are in harsh environment electronics, thermal management, electronics manufacturing and reliability. He has 30 years of experience in electronics manufacturing and packaging at GE, Rockwell, and Motorola.

Nancy Stoffel has 20+ years of experience in materials and process development in the electronics packaging field. She currently manages the Advanced Packaging Fabrication and Processes Group at GE Global Research. Prior to joining GE, she was the Director of Microsystems Packaging at STC-CNSE a MEMS fabrication facility . She also held technical and management positions at Xerox Corporation and IBM, working on materials research and process development for electronic packaging and MEMS/microfluidic applications. Nancy received a PhD in Materials Science from Cornell University, and an MS from Columbia in chemical engineering. She is active in the IEEE ECTC, with the Emerging Technologies Subcommittee.

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