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Micro-e Wafer Processing (POU) solutions

Wafer processing steps can be separated into four categories: modification of electrical properties, patterning (or lithography), deposition and removal. With more than 300 sequenced processing steps to create a single chip, even if we only applied the four categories to wafer processing equipment, it is actually regrouping a very large number of different processes. It is critical to understand and address each of these processes has a specific requirement in order to provide customized products such as manifold that will allow premium yield and ensure stability in our customer’s process; among these we can specifically highlight Chemical mechanical planarization (CMP); Wet etching, Electrochemical deposition (ECD), and Cleaning.

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About Saint-Gobain

Saint-Gobaindesigns, manufactures and distributes materials and solutions which are key ingredients in the wellbeing of each of us and the future of all. They can be found everywhere in our living places and our daily life: in buildings, transportation, infrastructure and in so many industrial applications.

Saint-Gobain Performance Plastics' group of businesses gather solutions to save energy, provide protection, improve comfort and sustain the environment for a variety of markets.