Tuning the band structure and, in particular, gap opening in 1D and 2D materials through
their deformation is a promising approach for their application in modern semiconductor
devices. However, there is an essential breach between existing laboratory scale methods
applied for deformation of low-dimensional materials and the needs of large-scale
production. In this work, we propose a novel method which is potentially well compatible
with high end technological applications: single-walled carbon nanotubes (SWCNTs) first
deposited on the flat surface of a supporting wafer, which has been pre-implanted with H+
and He+ ions, are deformed in a controlled and repetitive manner over blisters formed
after subsequent thermal annealing. By using resonant Raman spectroscopy, we
demonstrate that the SWCNTs clamped by metallic stripes at their ends are deformed over
blisters to an average tensile strain of 0.15 ± 0.03%, which is found to be in a good
agreement with the value calculated taking into account blister's dimensions. The principle
of the technique may be applied to other 1D and 2D materials in perspective.