Circuit Card Inspection

Automated Optical Inspection (AOI)

We utilize a Mirtec MV-2HTL Automated Optical Inspection System to inspect the quality of bonds between the components and the printed circuit board. The Mirtec system has proven to be a simple, flexible, universal inspection system with outstanding results. A variety of surface feature defects can be identified and corrected with AOI such as:

Scratches and Stains

Open circuits, Short circuits

Thinning of the solder

Missing components

Incorrect components

Incorrectly placed components.

X-Ray Inspection

Increasing use of the Ball Grid Array ( BGA ) technology has required the mplementation of a X-ray inspection systems. This system utilizes x-ray rather than visible light allowing for a comprehensive inspection of all the bonds on BGA components. At CMI we have chosen the Glenbrook Technologies 80KVA system. We have found it to be accurate and flexible.