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ASE Group (Taiwan) and Amkor Technology (US) are the Leading Players in the System in Package Market

The system in package (SiP) process includes several IC packaging technologies, such as 2D IC, 2.5D IC, and 3D IC. The system in package market is expected to be valued at USD 9.07 Billion by 2023, growing at a CAGR of 9.4% between 2017 and 2023. The growth of this market is propelled by the growing demand for miniaturization of electronic devices, impact of Internet of Things (IoT), and reduced time-to-market.

ASE Group (Taiwan), Amkor Technology (US), SPIL (Taiwan), Powertech Technology (Taiwan), UTAC (Global A&T Electronics) (Singapore) are the leading players in the system in package market. Product launches and developments, mergers and acquisitions, expansions, agreements, collaborations, joint ventures, and partnerships are some of the key strategies adopted by the major players to gain a competitive edge in this market.

ASE Group offers a complete packaging and testing services for the semiconductor IC packaging market. The company’s service portfolio includes substrate design services, characterization services, and e-Services. These services help end users to improve the IC packaging development process as well as allow circuit designers to achieve maximum flexibility in the designing process. ASE Group offers a real-time web-based status to its customers. The real-time web-based packaging service is referred to as e-Service. To grow in the system in package market, the company has adopted organic and inorganic growth strategies. For instance, in March 2016, the company successfully developed system in package solutions for consumer and automotive applications. It has dedicated its R&D efforts toward advanced IC packaging technologies such as 3D TSV and wafer-level integration passive device technology to leverage the opportunities in next-generation of heterogeneous integration modules and miniaturized electronic systems.