Abstract:

A manufacturing method of a semiconductor package structure includes the
following steps. Firstly, a carrier having an adhesion tape is provided.
Next, a plurality of chips are disposed on the adhesion tape. Then, a
molding compound is dispensed on the adhesion tape, so that the molding
compound covers the chips. Afterwards, a heat spreader is disposed on a
plurality of chips. Then, the molding compound is solidified as an
encapsulant to fix the heat spreader on the chips. After that, the
carrier and the adhesion tape are removed to expose the active surfaces
of the chips. Then, a redistribution layer is formed adjacent to the
active surfaces of the chips. Next, a plurality of solder balls are
disposed on the redistribution layer. Lastly, a plurality of packages are
formed by cutting the redistribution layer, the encapsulant and the heat
spreader according to the positions of the chip.

Claims:

1. A semiconductor package structure, comprising:a chip having an active
surface and a rear surface;a heat spreader disposed adjacent to the rear
surface of the chip;an encapsulant for covering the chip and fixing the
heat spreader on the chip;a redistribution layer (RDL) disposed adjacent
to the active surface of the chip; anda plurality of solder balls
disposed on the redistribution layer.

2. The package structure according to claim 1, wherein the heat spreader
has a heat-spreading surface and a bonding surface opposite to the
heat-spreading surface.

3. The package structure according to claim 2, wherein the bonding surface
is a rough surface, so that the heat spreader, the encapsulant and the
chip are tightly bonded.

4. The package structure according to claim 2, wherein the heat-spreading
surface of the heat spreader is exposed in the air.

5. The package structure according to claim 2, wherein the encapsulant
comprises a first encapsulant and a second encapsulant respectively
disposed on the bonding surface and the heat-spreading surface of the
heat spreader.

6. The package structure according to claim 5, wherein the heat-spreading
surface is a rough surface, so that the heat spreader and the second
encapsulant are tightly bonded.

7. The package structure according to claim 6, wherein both the
heat-spreading surface and the bonding surface are a rough surface, so
that the second encapsulant, the heat spreader, the first encapsulant and
the chip are tightly bonded in sequence.

8. The package structure according to claim 1, wherein the heat spreader
is fixed on the rear surface of the chip.

9. The package structure according to claim 8, wherein a bonding surface
of the heat spreader faces the rear surface of the chip, and an area of
the bonding surface is larger than that an area of the rear surface.

10. The package structure according to claim 1, further comprising:a
plurality of solder pads disposed on the active surface of the chip.

11. A manufacturing method of a semiconductor package structure, wherein
the method includes the following steps:providing a carrier having an
adhesion tape;disposing a plurality of chips on the adhesion
tape;disposing a molding compound on the adhesion tape, so that the
molding compound covers the chips;disposing a heat spreader on the
chips;solidifying the molding compound to be an encapsulant so as to fix
the heat spreader on the chips;removing the carrier and the adhesion tape
to expose the active surfaces of the chips;forming a redistribution layer
adjacent to the active surfaces of the chips;disposing a plurality of
solder balls on the redistribution layer; andforming a plurality of
packages by cutting the redistribution layer, the encapsulant and the
heat spreader according to positions of the chips.

12. The manufacturing method according to claim 11, wherein the
solidifying step comprises:heating the molding compound to semi-solidify
the molding compound; andcontinuously heating the molding compound to
completely solidify the molding compound to be the encapsulant.

13. The manufacturing method according to claim 12, wherein the heat
spreader is disposed on the chips when the molding compound is heated to
be semi-solidified.

14. The manufacturing method according to claim 12, wherein the
encapsulant firmly fixes the heat spreader on the chips when the molding
compound is heated and solidified to be the encapsulant completely.

15. The manufacturing method according to claim 11, wherein in the step of
disposing the heat spreader, the method further comprises:providing a
mold;aligning the mold with the carrier, so that the mold covers the
molding compound and the heat spreader;pressing the mold downwardly, so
that the molding compound is spread over a bonding surface of the heat
spreader and fills a heat-spreading surface of the heat spreader;
andapplying mold releasing process for releasing the mold.

16. The manufacturing method according to claim 15, wherein the method
further comprises:grinding the molding compound left on the
heat-spreading surface for exposing the heat-spreading surface in the
air.

17. The manufacturing method according to claim 11, wherein the heat
spreader has a bonding surface facing the chips, and the bonding surface
is a rough surface for providing a force so that the heat spreader, the
encapsulant and the chips are tightly bonded after the step of
solidifying the molding compound.

18. The manufacturing method according to claim 17, wherein the heat
spreader has a heat-spreading surface opposite to the bonding surface,
and the heat-spreading surface is another rough surface, so that the heat
spreader and the encapsulant are tightly bonded after the step of
solidifying the molding compound.

19. The manufacturing method according to claim 11, wherein the step of
disposing the molding compound is performed by way of dispensing.

20. The manufacturing method according to claim 11, further
comprising:disposing a plurality of solder pads on the active surfaces of
the chips.

[0003]The disclosure relates in general to a semiconductor package
structure and a manufacturing method thereof, and more particularly to a
semiconductor package structure having a heat spreader and a
manufacturing method thereof.

[0004]2. Description of the Related Art

[0005]In recent years, electronic devices are widely used in people's
daily lives, and the manufacturers are dedicated to provide miniaturized
and multi-functional electronic products to meet the market demands.
Currently, wafer level package (WLP) is a package structure commonly used
in the semiconductor elements of an electronic product.

[0006]The dimension of the product becomes smaller and smaller but the
function is more and more diversified. To make the chip function
properly, the heat generated during the operation of the chip must be
dissipated effectively to avoid the internal circuits being damaged and
prevent the efficiency and the function of the chip from being affected
when the temperature of the chip is too high.

SUMMARY

[0007]The disclosure is directed to a semiconductor package structure and
a manufacturing method thereof. The encapsulant is used for fixing the
heat spreader on the chip directly during a solidifying process.

[0008]According to a first aspect of the present disclosure, a
semiconductor package structure is provided. The semiconductor package
structure includes a chip, a heat spreader, an encapsulant, a
redistribution layer, and a plurality of solder balls. The encapsulant
covers the chip and fixes the heat spreader on the chip. The chip has an
active surface and a rear surface, the heat spreader is disposed adjacent
to the rear surface of the chip, and the redistribution layer is disposed
adjacent to the active surface of the chip. The solder balls are disposed
on the redistribution layer.

[0009]According to a second aspect of the present disclosure, a
manufacturing method of a semiconductor package structure is provided.
The method includes the following steps. Firstly, a carrier having an
adhesion tape is provided. Next, a plurality of chips are disposed on the
adhesion tape. Then, a molding compound is dispensed on the adhesion
tape, so that the molding compound covers the chips. Afterwards, a heat
spreader is disposed on a plurality of chips. Then, the molding compound
is solidified as an encapsulant to fix the heat spreader on the chips.
After that, the carrier and the adhesion tape are removed to expose the
active surfaces of the chips. Then, a redistribution layer is formed
adjacent to the active surfaces of the chips. Next, a plurality of solder
balls are disposed on the redistribution layer. Lastly, a plurality of
packages are formed by cutting the redistribution layer, the encapsulant
and the heat spreader according to the positions of the chips.

[0010]The disclosure will become apparent from the following detailed
description of the preferred but non-limiting embodiments. The following
description is made with reference to the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0011]FIG. 1A shows a semiconductor package structure according to a first
embodiment of the disclosure;

[0012]FIG. 1B shows a semiconductor package structure according to a
second embodiment of the disclosure;

[0013]FIG. 2A˜2L show a manufacturing method of a semiconductor
package structure according to a first embodiment of the disclosure; and

[0014]FIG. 3A˜3K show a manufacturing method of a semiconductor
package structure according to a second embodiment of the disclosure.

DETAILED DESCRIPTION

First Embodiment

[0015]Referring to FIG. 1A, a semiconductor package structure according to
a first embodiment of the disclosure is shown. The semiconductor package
structure of FIG. 1A includes a chip 210, a heat spreader 230, an
encapsulant 220, a redistribution layer 240, a plurality of solder balls
250 and a plurality of solder pads 260. The encapsulant 220 covers the
chip 210 and fixes the heat spreader 230 on the chip 210. The chip 210
has an active surface 210a and a rear surface 210b. The redistribution
layer 240 is disposed adjacent to the active surface 210a of the chip
210. The heat spreader 230 is disposed adjacent to the rear surface 210b
of the chip 210, and preferably is fixed on the rear surface 210b of the
chip 210. The solder balls 250 are disposed on the redistribution layer
240. The solder pads 260 are disposed on the active surface 210a of the
chip 210.

[0016]The heat spreader 230 has a heat-spreading surface 230a and a
bonding surface 230b opposite to the heat-spreading surface 230a. As
indicated on FIG. 1A, the bonding surface 230b is a rough surface for
increasing the adhesion between the bonding surface 230b and the
encapsulant 220 so that the heat spreader 230, the encapsulant 220 and
the chip 210 are tightly bonded. The bonding surface 230b of the heat
spreader 230 faces the rear surface 210b of the chip 210, and the area of
the bonding surface 230b is larger than that of the rear surface 210b. In
the present embodiment of the disclosure, the heat-spreading surface 230a
of the heat spreader 230 is exposed in the air for increasing heat
dissipation efficiency and facilitating the subsequent printing or
coating process.

[0017]FIG. 2A˜2L show a manufacturing method of a semiconductor
package structure according to a first embodiment of the disclosure.
Firstly, in FIG. 2A, a carrier 200 having an adhesion tape 205 is
provided. Both surfaces of the adhesion tape 205 have adhesion, and one
of the two surfaces is pasted on the carrier 200.

[0018]Next, in FIG. 2B, a plurality of chips 210 are disposed on the
adhesion tape 205. As the other surface of the adhesion tape 205 also has
adhesion, a plurality of chips 210 are directly pasted on the other
surface of the adhesion tape 205.

[0019]As indicated on FIG. 2c, a molding compound 220m is disposed on the
adhesion tape 205, so that the molding compound 220m covers a plurality
of chips 210. The step of disposing the molding compound 220m is
preferably performed by way of dispensing.

[0020]FIG. 2c and FIG. 2D show a practical method of fixing a heat
spreader 230 on a package structure. The heat spreader 230 is disposed on
a plurality of chips 210. The molding compound 220m is solidified to be
an encapsulant 220 so as to fix the heat spreader 230 on a plurality of
chips 210. The solidifying process can be further divided into a first
solidifying stage and a second solidifying stage.

[0021]In the first solidifying stage, the molding compound 200 is heated
so that the molding compound 220m is in a semi-solidified state. When the
molding compound 220m is heated and becomes semi-solidified, the heat
spreader 230 is disposed on a plurality of chips 210. In the step of
disposing the heat spreader 230, the present method further includes the
following sub-step. A mold 235 is provided and is further aligned with
the carrier 200, so that the mold 235 covers the molding compound 200m
and the heat spreader 230. Meanwhile, the mold 235 is pressed downwardly,
so that the molding compound 200m is spread over the bonding surface 230b
of the heat spreader 230 and a part of the molding compound 200m fills
the heat-spreading surface 230a of the heat spreader 230. Then, a mold
releasing process is performed for releasing the mold 235.

[0022]In the second solidifying stage, the molding compound 220m is
continually heated to completely solidify the molding compound 220m to be
an encapsulant 220. The molding compound 220m, once solidified to be an
encapsulant, is capable of firmly fixing the heat spreader 230 on the
chips 210. As indicated on FIG. 2E, the encapsulant 220 is disposed under
the bonding surface 230b of the heat spreader 230, and the molding
compound 220f which is already solidified and left on the heat-spreading
surface of the heat spreader 230a fills to the molding compound 220m of
the heat-spreading surface 230a during the manufacturing process.

[0023]Next, in FIG. 2F, the manufacturing method of the present embodiment
of the disclosure further includes the sub-step of grinding the molding
compound 220f left on the heat-spreading surface 230a by the grinding
facility 270. After the grinding process is completed, the heat-spreading
surface 230a is exposed in the air as indicated on FIG. 2G. Then, the
carrier 200 and the adhesion tape 205 are subsequently remove to expose
the active surfaces 210a of a plurality of chips 210 as indicated on FIG.
2H.

[0024]In FIG. 2I, the entire structure is turned over upside down so as to
form a redistribution layer 240 adjacent to the active surfaces of 210a
of the chip 210 in FIG. 2J. Next, in FIG. 2K, a plurality of solder balls
250 are disposed on the redistribution layer 240.

[0025]Lastly, in FIG. 2L, a plurality of packages P1 are formed by cutting
the redistribution layer 240, the encapsulant 220 and the heat spreader
230 with the cutting tool 280 according to a plurality of the chip 210.

Second Embodiment

[0026]The present embodiment of the disclosure mainly differs with the
first embodiment in the space relationship between the molding compound
and the heat spreader and in the omission of the grinding process.

[0027]Referring to FIG. 1B, a semiconductor package structure according to
a second embodiment of the disclosure is shown. The semiconductor package
structure of FIG. 1B includes a chip 310, a heat spreader 330, an
encapsulant 320, a redistribution layer 340, a plurality of solder balls
350 and a plurality of solder pads 360. The encapsulant 320 covers the
chip 310 and fixed the heat spreader 330 on the chip 310. The encapsulant
320 includes a first encapsulant 320a and a second encapsulant 320b
respectively disposed on the bonding surface 330b and the heat-spreading
surface 330a of the heat spreader 330. The chip 310 has an active surface
310a and a rear surface 310b. The redistribution layer 340 is disposed
adjacent to the active surfaces 310a of the chip 310. The heat spreader
330 is adjacent to the rear surface 310b of the chip 310 and preferably
is fixed on the rear surface 310b of the chip 310. A plurality of solder
balls 350 are disposed on the redistribution layer 340. The solder pads
360 are disposed on the active surface 310a of the chip 310.

[0028]The heat spreader 330 has a heat-spreading surface 330a and a
bonding surface 330b opposite to the heat-spreading surface 330a. As
indicated on FIG. 1B, the bonding surface 330b is a rough surface for
increasing the adhesion between the bonding surface 330b and the first
encapsulant 320a so that the heat spreader 330, the first encapsulant
320a and the chip 310 are tightly bonded. Besides, the heat-spreading
surface 330a of the heat spreader 330 can also be a rough surface for
increasing the adhesion between the heat-spreading surface 330a and the
second encapsulant 320b so that the heat spreader 330 and the second
encapsulant 320b are tightly bonded. The bonding surface 330b of the heat
spreader 330 faces the rear surface 310b of the chip 310, and the area of
the bonding surface 330b is larger than that of the rear surface 310b.
Compared with the first embodiment, the heat-spreading surface 330a of
the heat spreader 330 of the present embodiment of the disclosure further
covers a second encapsulant 320b, not only enhancing the encapsulant 320
in fixing the heat spreader 330 but also omitting the subsequent printing
or coating process in the manner that a cutting process is directly
applied to the second encapsulant 320b by way of laser.

[0029]FIG. 3A˜3L shows a manufacturing method of a semiconductor
package structure according to a second embodiment of the disclosure.
Firstly, in FIG. 3A, a carrier 300 having an adhesion tape 305 is
provided. Both surfaces of the adhesion tape 305 have adhesion, and one
of the two surfaces is pasted on the carrier 300.

[0030]Next, in FIG. 3B, a plurality of chips 310 are disposed on the
adhesion tape 305. As the other surface of the adhesion tape 305 also has
adhesion, a plurality of chips 310 are directly pasted on the other
surface of the adhesion tape 305.

[0031]As indicated on FIG. 3c, a molding compound 320m is disposed on the
adhesion tape 305, so that the molding compound 320m covers a plurality
of chips 310. The step of disposing the molding compound 320m is
preferably performed by way of dispensing.

[0032]FIG. 3c and FIG. 3D show a practical method of fixing a heat
spreader 330 on a package structure. A heat spreader 330 is disposed on a
plurality of chips 310, the molding compound 320m is solidified to be an
encapsulant 320 so as to fix the heat spreader 330 on the chips 310. The
solidifying process can be further divided into a first solidifying stage
and a second solidifying stage.

[0033]In the first solidifying stage, the molding compound 300 is heated
so that the molding compound 320m is in a semi-solidified state. When the
molding compound 320m is heated and becomes semi-solidified, the heat
spreader 330 is disposed on a plurality of chips 310. In the step of
disposing the heat spreader 330, the present method further includes the
following sub-step. A mold 335 is provided and is further aligned with
the carrier 300, so that the mold 335 covers the molding compound 300m
and the heat spreader 330. Meanwhile, the mold 335 is pressed downwardly,
so that the molding compound 300m is spread over the bonding surface 330b
of the heat spreader 330 and a part of the molding compound 300m fills
the heat-spreading surface 330a of the heat spreader 330. Then, a mold
releasing process is performed for releasing the mold 335.

[0034]In the second solidifying stage, the molding compound 320m is
continually heated to completely solidify the molding compound 320m to be
an encapsulant 320. The molding compound 320m once solidified to be an
encapsulant is capable of firmly fixing the heat spreader 330 on the chip
310. As indicated on FIG. 3E, the encapsulant 320 includes a first
encapsulant 320a disposed under the bonding surface 330b of the heat
spreader 330 and a second encapsulant 320b disposed on the heat-spreading
surface of the heat spreader 330a. The second encapsulant 320b is formed
by the molding compound 320m which fills the heat-spreading surface 330a
during the manufacturing process.

[0035]Compared with the first embodiment, the present embodiment of the
disclosure omits the grinding process but reserves the second encapsulant
320b formed by the molding compound 320m when filling the heat-spreading
surface 330a. Thus, both the heat-spreading surface 330a and the bonding
surface 330b of the heat spreader 330 cover the solidified molding
compound so that the heat spreader 330 is more firmly fixed.

[0036]Then, the carrier 300 is removed in FIG. 3E and the adhesion tape
305 is removed in FIG. 3F to expose the active surfaces of 310a of a
plurality of chips 310 as indicated on FIG. 3G.

[0037]Then, in FIG. 3H, the entire structure is turned upside down so as
to form a redistribution layer 340 adjacent to the active surfaces 310a
of a plurality of chips 310 in FIG. 3I. Next, in FIG. 3J, a plurality of
solder balls 350 are disposed on the redistribution layer 340.

[0038]Lastly, in FIG. 3K, a plurality of packages P2 are formed by cutting
the redistribution layer 340, the first encapsulant 320a, the heat
spreader 330 and the second encapsulant 320b with the cutting tool 380
according to the positions of a plurality of chips 310.

[0039]According to the semiconductor package structure and the
manufacturing method thereof disclosed in the above embodiments of the
disclosure, an encapsulant is used for fixing the heat spreader on the
chip directly in a solidifying process, so that there is no need to bond
the heat spreader and the chip together with a heat-dissipating adhesive.
Thus, the manufacturing cost is reduced as the adhering process is
avoided. Moreover, the rough surface of the heat spreader increases the
adhesion between the surface and the encapsulant, and this is conducive
for the subsequent cutting process. Besides, by fixing the heat spreader
with an encapsulant directly, the thickness of the entire package is
reduced by the thickness of the heat-dissipating adhesive, further
increasing product competiveness.

[0040]While the disclosure has been described by way of example and in
terms of a preferred embodiment, it is to be understood that the
disclosure is not limited thereto. On the contrary, it is intended to
cover various modifications and similar arrangements and procedures, and
the scope of the appended claims therefore should be accorded the
broadest interpretation so as to encompass all such modifications and
similar arrangements and procedures.