ADLINK Technology, Inc.

ADLINK’s Application Ready Intelligent Platforms (ARIPs) and AdvancedTCA® technologies provide complete solutions that keep global OEMs competitive in the telecommunications arena, optimized for long-term deployment of traditional local and long-distance service, video on demand (VOD), and a spectrum of broadband communications services such as high-speed Internet access and video conferencing.

High availability, standards-based systems are vital for each of these applications, integrating advanced performance features with efficient cooling designs and providing dedicated computing power for uninterrupted around-the-clock service meeting uptime of five nines (99.999%).

Headquartered in Taiwan, ADLINK has operations in America, Germany, France, Singapore, Beijing, Shanghai, and Shenzhen (China), Japan, Korea, and India. ADLINK products are currently available in over 40 countries across 5 continents, with worldwide distribution networks and offices and over 1200 employees. ADLINK is proud to be associated with many major technology leaders and Fortune 500 companies. With design and technology centers in the US and the Pacific Rim regions, ADLINK is becoming a technology-leading platform provider across markets.

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ADLINK works closely with Intel® to ensure that we develop and introduce innovative computing technologies by implementing embedded computing roadmaps and selecting computer solutions that best fit our target markets. This enables ADLINK to provide the highest quality and performance products with the long life cycles required by our embedded and applied computing customers. With the acquisition of Ampro Computers and LiPPERT Embedded Computers, ADLINK also provides a wide range of rugged by design Extreme Rugged and industrial product lines including single board computers, COMs and systems.

Commercial Off-The-Shelf (COTS) products have become commonplace in many domains, including telecom, network and defence, as they can provide standardized functionality and shorter time-to-market at lower cost than custom made solutions. In response to this industry trend, ADLINK has released its own ATCA Application-Ready Intelligent Platforms (ARIPs) to meet the various needs of demanding customers. ADLINK ARIPs are a set of validated integratable building blocks, including hardware, OS, and software components (firmware & middleware).

ADLINK ARIPs provide hardware level integration and validation using building blocks from ADLINK's standard product lines; OS validation performance tuning, and virtualization certification; as well as a variety of toolkits for system & power management and application control including Fastpath modules for data plane and signaling process functions, such as the ADLINK Data Plane Development Kit (DPDK), Media SDK, System Management Toolkit. ADLINK ARIPs also provide Active Power Management, System Management, and Service Availability Framework to enable ADLINK products as a “Green”, “Smart”, and “Robust” platforms. With ADLINK's proven platforms and applications, customer applications can reduce dependence on lower level services, and enable self forming and self healing capability of final products, thus saving valuable resources to support innovation of products and solutions.

A constant battle being fought by embedded developers everywhere is the balance between designing for low power consumption and designing for high performance. Power management and workload consolidation are two areas of technology focus that have emerged to help vendors address these causes.

In recent years, there has been a market and technology trend towards the convergence of network infrastructure to a common platform or modular components that support multiple network elements and functions such as application processing, control processing, packet processing and signal processing. In addition to cost savings and reduced time-to-market, this approach provides the flexibility of modularity and the ability to independently upgrade system components where and when needed, using a common platform or modular components in shelf systems and networks of varying sizes. In traditional networks, switching modules would be used to route traffic between in-band system modules and out-of-band systems; processor modules used for applications and control plane functions; packet processing modules used for data plane functions; and DSP modules used for specialized signal plane functions.

By utilizing the Intel® Data Plane Development Kit (Intel® DPDK), Intel® x86 architecture-based processor modules can not only handle traditional processing applications and control functions, but they can also capably and efficiently perform packet processing functions.

In recent years, there has been a market and technology trend towards the convergence of network infrastructure to a common platform that supports multiple network elements and functions such as application processing, control processing, packet processing and signal processing. In addition to cost savings and reducing time-to-market, this approach also provides the flexibility of modularity and the capability for customers to independently upgrade system components when and where they are needed by using modular components in a shelf system.

Commercial-Off-The-Shelf (COTS) products have become commonplace in many domains, including telecom, network and defense, as they can provide standardized functionality and shorter time-to-market at lower cost than custom made solutions. In response to this industry trend, ADLINK has released its own ATCA Application-Ready Intelligent Platforms (ARIP) to meet the various needs of demanding customers.