For Preheat, Rework and Reflow!
Used for a variety of heating applications which include preheat, rework, reflow and curing of printed circuit board assemblies. The GF-SL-HT is capable of lead and lead free, high temperature applications, with a programmable, digital controller for precise temperature regulation.

3/4" (19mm) thick aluminum heat plates for precise, even heating

temperatures up to 600° F - 315°C for use with lead-free solder alloys