Gold-Based Solder Paste

Gold-tin solder paste is used in a variety of high-reliability applications, where its high melting point, non-creep, high-tensile stress,
thermal and electrical conductivity, as well as proven usage life makes it a standard "known-good" material.

In step soldering or processes that may require rework, soldering to gold plated surfaces results in an intermetallic that melts at a higher temperature than the original alloy. When using the AuSn alloy, this can be addressed by using high tin-containing alloys.

Alternative methods, such as scrubbing, forming gas or formic acid, may be needed for oxide removal of the soldered surface.

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