More Bonds of Telefonica Emisiones S.A.U.

About the Telefonica Emisiones S.A.U.-Bond (US87938WAU71)

The Telefonica Emisiones S.A.U.-Bond has a
maturity date of 3/8/2047 and offers a coupon of 5.2130%. The payment of the coupon will take place 2,0 times per biannual on the 08.09.. At the current price of 110.936 USD this equals a annual yield of 4.62%. The Telefonica Emisiones S.A.U.-Bond was issued on the 3/8/2017 with a volume of 2 B. USD.