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Abstract

The process of developing a coordinated system that encloses and protects products during their lifecycle of production, storage, transportation and sale is called packaging. During this lifecycle, packages are always under the risk of being damaged or spoiled due to unexpected changes in environmental factors such as changing temperature, humidity and vibration etc. The goal of this project is to develop a highly efficient and low cost real-time package monitoring system that could facilitate to timely locate and detect the abnormal environmental issues such as high temperature and high vibration of packages while in storage and in transportation. The research uses the technology of Radio-Frequency Identification (RFID) and Global Positioning System (GPS) to timely obtain the vital parameters of a package to help maintain the quality and keep track of packages adhering to the legal requirement from the government. The system could therefore significantly minimize the loss that the packaging industry faces due to damage/spoilage during the product lifecycle and also assist in developing enhanced package designs to prevent such damage in the future. Extensive experiments and testing were also performed to evaluate the feasibility and performance of the system.

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