Abstract:

A soldering system includes a circuit board having first soldering
terminals, a soldering object having second soldering terminals,
soldering blocks disposed between the circuit board and the soldering
object for electrically interconnecting the first soldering terminals and
the second soldering terminals respectively, and a supporting structure
supporting the soldering object and having a height that determines the
height of the solder blocks. A related soldering method is also provided.

Claims:

1. A soldering system comprising:a circuit board comprising a plurality of
first soldering terminals;a soldering object comprising a plurality of
second soldering terminals;a plurality of soldering blocks disposed
between the circuit board and the soldering object, the soldering blocks
electrically interconnecting the first soldering terminals and the second
soldering terminals, respectively; anda supporting structure supporting
the soldering object, the supporting structure having a height that
determines the height of the solder blocks.

2. The soldering system of claim 1, wherein the supporting structure
comprises a first spacer disposed on one side of the first terminals and
a second spacer disposed on another side of the first terminals.

3. The soldering system of claim 2, wherein the first spacer and the
second spacer superpose the first terminals in part, respectively.

4. The soldering system of claim 2, wherein the first spacer and the
second spacer are longitudinal.

5. The soldering system of claim 2, wherein the first spacer and the
second spacer are parallel to each other.

6. The soldering system of claim 5, wherein the first terminals and the
second terminals are longitudinal and parallel, and intersect the first
spacer and the second spacer.

7. The soldering system of claim 2, wherein the soldering object comprises
a bending portion disposed on the surface away from the circuit board,
the bending portion superposing the soldering blocks.

8. The soldering system of claim 7, wherein the height of the soldering
blocks is less than that of the first spacer and the second spacer.

9. The soldering system of claim 1, wherein the supporting structure is
insulating tape or paint.

10. The soldering system of claim 1, wherein the soldering object is a
flexible printed circuit board (FPCB).

11. The soldering system of claim 10, wherein the thickness of the FPCB is
less than 300 μm.

12. A soldering method comprising:providing a circuit board comprising a
soldering region;forming a supporting structure on the soldering
region;coating solder on the soldering region;providing a soldering
object, and arranging the soldering object to be supported by the
supporting structure; andsoldering the soldering object on the soldering
region via the solder.

14. The soldering method of claim 13, further comprising cooling the
solder so as to form a plurality of soldering blocks.

15. The soldering method of claim 14, wherein the soldering region
comprises a plurality of first terminals, the soldering object comprises
a plurality of second terminals, the first terminals being connected to
the second terminals via the soldering blocks respectively.

16. The soldering method of claim 15, wherein the supporting structure
comprises a first spacer disposed on one side of the first terminals and
a second spacer disposed on another side of the first terminals.

17. The soldering method of claim 16, wherein the first spacer and the
second spacer superpose the first terminals in part respectively.

18. The soldering method of claim 16, wherein the first spacer and the
second spacer are longitudinal and parallel.

19. The soldering method of claim 18, wherein the first terminals and the
second terminals are longitudinal and parallel, and intersect the first
spacer and the second spacer.

20. The soldering method of claim 12, wherein the supporting structure is
insulating tape on the soldering region or insulating paint on the
soldering region.

Description:

BACKGROUND

[0001]1. Technical Field

[0002]The present invention relates to soldering systems and methods, and
more particularly to a soldering system and method using a supporting
structure.

[0003]2. Description of Related Art

[0004]Electronic devices typically employ printed circuit boards (PCBs) to
carry electronic elements and function circuits therein. For example, a
power supply circuit, a driving circuit, and other circuits may be
accommodated in an electronic device. Moreover, a flexible printed
circuit board (FPCB) enables electrical communication between two
function circuits respectively disposed on different PCBs.

[0005]Generally, a PCB includes a plurality of parallel elongate metal
terminals (herein called gold fingers) configured for soldering to a
corresponding FPCB. The FPCB includes a plurality of soldering spots,
each of which corresponds to a respective gold finger of the PCB. The
gold fingers can be attached to the soldering spots by solder material.

[0006]In a typical soldering process, solder balls are attached on the
golden fingers of the PCB, and the FPCB is aligned with the PCB so as to
be sandwiched between the golden fingers and the corresponding soldering
spots. The solder balls are heated and melt, and external force is
applied at the same time to maximize contact between the FPCB and PCB.
After the heating is finished, the melted solder balls re-solidify as
solder bumps. Thereby, the golden fingers are attached to the
corresponding soldering spots, with electrical connection between the
FPCB and the PCB formed as a result.

[0007]During this soldering process, the applied external force must be
controlled accurately. Otherwise, the melted solder ball on a golden
finger may extend to an adjacent melted solder ball and result in
unwanted connection. However, due to trends toward compactness in
electronic device development, spaces between adjacent golden fingers are
becoming smaller. Thus, accurate control requirements are increased,
creating difficulty in most manufacturing environments and inflating
costs.

[0008]What is needed is a soldering method which can overcome the above
deficiencies, and a soldering system using the same.

BRIEF DESCRIPTION OF THE DRAWINGS

[0009]The components in the drawings are not necessarily drawn to scale,
the emphasis instead being placed upon clearly illustrating the
principles of at least one embodiment. In the drawings, like reference
numerals designate corresponding parts throughout the various views.

[0010]FIG. 1 is a cross-section of part of a first embodiment of a
soldering system according to the present disclosure, including a circuit
board and a soldering object.

[0011]FIG. 2 is an isometric view of an entire circuit board of the
soldering system of FIG. 1.

[0012]FIG. 3 is an isometric view of an entire soldering object of the
soldering system of FIG. 1.

[0013]FIG. 4 is a flowchart of a soldering method using, as an example,
the soldering system of FIG. 1.

[0014]FIGS. 5-10 are cross-sections (or top views) of successive steps in
the soldering method of FIG. 4.

[0015]FIG. 11 is a cross-section of part of a second embodiment of a
soldering system according to the present disclosure.

DETAILED DESCRIPTION

[0016]Reference will now be made to the drawings to describe exemplary
embodiments of the present disclosure in detail.

[0017]FIG. 1 is a cross-section of a first embodiment of a soldering
system 200 of the present disclosure. The soldering system 200 includes a
circuit board 210, a soldering object 220, a plurality of solder blocks
230 (only one is shown), and a supporting structure 270. The soldering
object 220 is electrically connected to the circuit board 210 by the
solder blocks 230. The supporting structure 270 supports the soldering
object 220, providing a gap between the circuit board 210 and the
soldering object 220.

[0018]FIG. 2 is an isometric view of the circuit board 210 of the
soldering system 200. The circuit board 210 can be a PCB. A main region
218 is located at a substantial center of the circuit board 210, and a
soldering region 219 located at an edge of the circuit board 210. The
main region 218 includes a plurality of electronic elements (not shown)
cooperatively forming a function circuit. These electronic elements can
be mounted on the main region 218 via surface mount technology (SMT). The
soldering region 219 includes a plurality of first terminals 211
connected to the electronic elements. The first terminals 211 are
longitudinal and parallel. The first terminals 211 can be metal.

[0019]The supporting structure 270 includes a first spacer 271 away from
the main region 218 and a second spacer 272 adjacent to the main region
218. The first spacer 271 and the second spacer 272 are longitudinal and
parallel, and intersect the first terminals 211. The first spacer 271 and
the second spacer 272 superpose the first terminals 211 in part,
respectively. The material of the first spacer 271 and the second spacer
272 can be insulating tape or paint.

[0020]FIG. 3 is an isometric view of the soldering object 220 of the
soldering system 270 of FIG. 1. The soldering object 220 can be an FPCB
with a thickness less than 300 microns (μm). The soldering object 220
includes a plurality of second terminals 222 corresponding to the first
terminals 211 respectively. The second terminals 222 are longitudinal and
parallel. The second terminals 222 can also be metal.

[0021]The soldering object 220 is soldered on the circuit board 210 via
the solder blocks 230. In particular, each first terminal 211 is soldered
to a corresponding second terminal 222 via a respective solder block 230.
The first spacer 271 and the second spacer 272 correspondingly support
the soldering object 220, such that the -solder blocks 230 are
approximately the same height as the first spacer 271 and the second
spacer 272, and the depth of the gap between the circuit board 210 and
the soldering object 220. In the illustrated embodiment, a height of each
of the solder blocks 230 is slightly less than a common height of the
first and second spacers 271, 272, and slightly less than a height of the
gap between each first terminal 211 and the soldering object 220.

[0022]The disclosed soldering system 200 can be used, as an example, in a
disclosed soldering method as shown in FIG. 4. In step S11, a circuit
board is provided, including a soldering region. In step S12, a
supporting structure is formed on the surface of the soldering region. In
step S13, solder paste is applied to the surface of the soldering region.
In step S14, a soldering object is provided. In step S15, the solder
paste is heated to melting, and the soldering object is soldered to the
soldering region. In step S16, the solder paste cools to form a plurality
of solder blocks.

[0023]In step S11, referring to FIG. 5, a circuit board 210 including a
soldering region 219 is provided. The soldering region 219 includes a
plurality of first terminals 211.

[0024]In step S12, referring to FIG. 6, a first spacer 271 and a second
spacer 272 superposing two ends of the first terminals 211 respectively
are formed on the circuit board 210. The first spacer 271 and the second
spacer 272 can be insulating tapes pasted on the soldering region 219 or
insulating paint printed on the soldering region 219.

[0025]In step S13, referring to FIGS. 7-8, solder paste 290 is provided
and coated on the first terminals 211 between the first spacer 271 and
the second spacer 272. The solder paste 290 presents as a plurality of
adhesive strips including tin powder and soldering flux. The soldering
flux includes colophony and chemical solvent for controlling the
viscosity and the fluidity of the tin powder.

[0026]In step S14, referring to FIG. 9, a soldering object 220 is
provided. The soldering object 220 can be an FPCB, which includes a
plurality of second terminals 222.

[0027]Referring to FIG. 10, the details of step S15 is as follows.
Firstly, align the soldering object 220 with the circuit board 210.
Secondly, exert external force to the soldering object 220 for pressing
the solder paste 290. During this process, the first spacer 271 and the
second spacer 272 support the soldering object 220 for maintaining a
predetermined distance between the solder object 220 and the circuit
board 210. Thirdly, heat the solder paste 290 till the solder paste 290
is melted. Due to the greater adhesive attraction between the solder
paste 290, the first terminal 211, and the second terminal 222, the
melted solder paste 290 is divided into a plurality of portions, each of
which is concentrated to a gap between a respective pair of the first
terminal 211 and the second terminal 222.

[0028]In step S16, the solder paste 290 is cooled, thereby forming a
plurality of solder blocks 230. The first terminals 211 and the second
terminals 222 are electrically connected by the solder blocks 230
respectively, such that the soldering object 220 is soldered on the
circuit board 210. A height of the solder blocks 230 is approximately the
same as that of the first spacer 271 and the second spacer 272.

[0029]The soldering method of the soldering system 200 includes forming a
supporting structure 270, and maintaining the depth of the gap between
the soldering object 220 and the circuit board 210 during soldering the
soldering object 220 to the circuit board 210. As a result, the height of
the solder blocks 230 can be controlled. Thus, the electrical connection
of the first terminals 211 and the second terminals 222 is reliable, and
the productivity of the soldering method is also improved.

[0030]FIG. 11 is a cross-section of part of a second embodiment of a
soldering system 300 according to the present disclosure, differing from
the soldering system 200 only in that a surface away from a circuit board
310 of a soldering object 310 comprises a bending portion 313. The
bending portion 313 superposes the soldering blocks 330, causing the
height of the soldering block 330 to be somewhat less than a common
height of a first spacer 371 and a second spacer 372. Electrical
connection of the circuit board 310 and the soldering object 320 is
further improved.

[0031]It is to be understood, however, that even though numerous
characteristics and advantages of the present embodiments have been set
out in the foregoing description, together with details of the structures
and functions of the embodiments, the disclosure is illustrative only;
and that changes may be made in detail, especially in matters of
arrangement of parts within the principles of the disclosure to the full
extent indicated by the broad general meaning of the terms in which the
appended claims are expressed.