INPAQ TECHNOLOGY CO., LTD.

INPAQ TECHNOLOGY CO., LTD. Patent applications

Patent application number

Title

Published

20150162121

SMD TRANSFORMER STRUCTURE AND SMD TRANSFORMER ARRAY - A SMD transformer structure includes a substrate unit, a magnetic unit, a coil unit and a shielding unit. The substrate unit includes a support substrate. The magnetic unit includes at least one magnetic material core bar disposed on the support substrate. The coil unit includes at least one transformer coil assembly wound around the magnetic material core bar. The transformer coil assembly includes a plurality of transformer coils wound around the magnetic material core bar, and each transformer coil has two opposite end portions respectively and electrically connected to the corresponding first electrode and the corresponding second electrode of the substrate unit. The shielding unit includes at least one magnetic shielding board disposed on the magnetic material core bar. Whereby, the SMD transformer structure not only can be simplified to reduce its size, but also can be automatically manufactured to increase its production efficiency and product yield (reliability).

06-11-2015

20150138034

ANTENNA STRUCTURE - An antenna structure includes a radiation module and a metal board. The radiation module has a first coil unit and a second coil unit. The first coil unit is coupled to the second coil unit. The first coil unit and the second coil unit have opposite direction of current. The metal board is disposed at one side of the radiation module. The metal board has an enclosed slot which has a first slot portion and a second slot portion.

05-21-2015

20140347772

OVER-VOLTAGE PROTECTION DEVICE AND METHOD FOR PREPARING THE SAME - An over-voltage protection device includes a substrate, an insulation layer having a depression over the substrate, a conductor layer having a first electrode and a second electrode over the insulation layer, wherein the first electrode and the second electrode form a discharge path, and the depression is under the discharge path. A method for preparing the over-voltage protection device includes the steps of forming an insulation layer over a substrate; forming a depression in the insulation layer; forming a photoresist pattern filling the depression and protruding the insulation layer; forming a conductor layer over the insulation layer; and removing the photoresist pattern, wherein the photoresist pattern divides the conductor layer into a first electrode and a second electrode that form a discharge path, and the depression is under the discharge path after the removal of the photoresist pattern.

11-27-2014

20140292462

POWER INDUCTOR AND METHOD FOR FABRICATING THE SAME - A power inductor and its fabrication method are disclosed. The power inductor comprises a lower substrate, a coil provided on the lower substrate, and an intermediate layer which encloses the coil, wherein the lower substrate can be a soft magnetic entrainer or a non-magnetic entrainer. The coil is made of a conductive wire coated with insulated layer, and the intermediate layer is a material consisting of magnetic properties. The steps of fabrication consists of: forming a base conductive pole on the upper surface of the lower substrate, putting the coil connected to said base conductive pole, and enveloping said coil with magnetic material.

10-02-2014

20140266504

WIDE-BAND COMMON MODE FILTERING APPARATUS - A wide-band common mode filtering apparatus includes at least two cascaded common mode filters with different noise-filtering responses, wherein the cut-off frequency of the wide-band common mode filtering apparatus is at the lowest cut-off frequency of the common mode filters, and the noise-filtering response of the wide-band common mode filtering apparatus is the superposition of the noise-filtering responses of the common mode filters. In one embodiment of the present invention, the wide-band common mode filtering apparatus includes a first common mode filter having a first filtering band, and a second common mode filter having a second filtering band different from the first filtering band. The disclosure of the present technique allows the cascaded common mode filters with different filtering bands to form the wide-band common mode filtering apparatus having an overall filtering band to meeting a new demand.

09-18-2014

20140264888

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A semiconductor package structure includes a chip unit, a package unit and an electrode unit. The chip unit includes at least one semiconductor chip. The semiconductor chip has an upper surface, a lower surface, and a surrounding peripheral surface connected between the upper and the lower surfaces, and the semiconductor chip has a first conductive pad and a second conductive pad disposed on the lower surface thereof. The package unit includes a package body covering the upper surface and the surrounding peripheral surface of the semiconductor chip. The package body has a first lateral portion and a second lateral portion respectively formed on two opposite lateral sides thereof. The electrode unit includes a first electrode structure covering the first lateral portion and a second electrode structure covering the second lateral portion. The first and the second electrode structures respectively electrically contact the first and the second conductive pads.

09-18-2014

20140247575

ELECTRONIC STRUCTURE AND ELECTRONIC PACKAGE COMPONENT FOR INCREASING THE BONDING STRENGTH BETWEEN INSIDE AND OUTSIDE ELECTRODES - An electronic structure includes a substrate body, an electronic package structure and a conductive unit. The electronic package structure is disposed on the substrate body. The electronic package structure includes a first inner electrode portion, a second inner electrode portion, a first outer electrode portion electrically connected to the first inner electrode portion, and a second outer electrode portion electrically connected to the second inner electrode portion. The conductive unit includes a first conductive body and a second conductive body respectively electrically contacting the first and the second outer electrode portions. The electronic package structure has a first notch and a second notch, the first outer electrode portion is extended into the first notch to contact the top surface of the first inner electrode portion, and the second outer electrode portion is extended into the second notch to contact the top surface of the second inner electrode portion.

09-04-2014

20140217563

MULTIFUNCTION SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A multifunction semiconductor package structure includes a substrate unit, a circuit unit, a support unit, a semiconductor unit, a package unit and an electrode unit. The substrate unit includes a substrate body and a first electronic element having a plurality of conductive contact portions. The circuit unit includes a plurality of first conductive layers disposed on the substrate body. The semiconductor unit includes a plurality of second electronic elements. Each second electronic element is electrically connected between two corresponding first conductive layers. The package unit includes a package body disposed on the substrate body to enclose the second electronic elements. The electrode unit includes a plurality of top electrodes, a plurality of bottom electrodes, and a plurality of lateral electrodes electrically connected between the top electrodes and the bottom electrodes. Each lateral electrode is electrically connected to the corresponding first conductive layer and the corresponding conductive contact portion.

08-07-2014

20140186526

COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - A common mode filter having heterogeneous laminates includes a first magnetic layer, a nonmagnetic insulating substrate, a second magnetic layer, a first coil layer, and a second coil layer. The second magnetic layer is formed on the nonmagnetic insulating substrate, between the nonmagnetic insulating substrate and the first magnetic layer. The first coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a first coil. The second coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a second coil. The first and second coil layers are separated from each other, and the first and second coils are magnetically coupled to each other.

07-03-2014

20140097989

PLATE ANTENNA MODULE AND METHOD OF MANUFACTURING THE SAME - A plate antenna module includes a first substrate unit, a second substrate unit, an adhesive unit and a pin unit. The first substrate unit including a first substrate body and a first electrode layer disposed on the top side of the first substrate body. The second substrate unit including a second substrate body disposed on the bottom side of the first substrate body, and the second substrate body has a second dielectric constant different from the first dielectric constant of the first substrate body. The adhesive unit includes a first adhesive sheet adhesively disposed between the first substrate body and the second substrate body and a second adhesive sheet adhered to the bottom side of the second substrate body. The pin unit includes a feeding pin electrically contacting the first electrode layer and sequentially passing through the first substrate unit, the second substrate unit and the adhesive unit.

04-10-2014

20140015727

ALL-METAL CASING STRUCTURE AND ANTENNA STRUCTURE - An all-metal casing structure includes a casing unit, a first substrate unit, a second substrate unit, an antenna unit and a conductive unit. The casing unit includes at least one metal casing having at least one through opening. The first substrate unit includes at least one first substrate body disposed in the metal casing and neighboring to the through opening. The second substrate unit includes at least one second substrate body disposed in the metal casing and neighboring to the first substrate body. The antenna unit includes at least one antenna module disposed on the first substrate body and corresponding to the through opening, and the antenna module is electrically connected to the second substrate body. The conductive unit includes at least two conductive elements separated from each other by a predetermined distance and electrically connected between the metal casing and the first substrate body.

01-16-2014

20140015714

PORTABLE ELECTRONIC DEVICE AND HINGE MECHANISM - A portable electronic device includes a casing unit, a first support unit, a second support unit, a first antenna unit, a second antenna unit, a first conducting unit and a second conducting unit. The casing unit includes a first outer casing and a second outer casing pivotally connected with the first outer casing. The first outer casing includes a hinge structure pivotally connected with the second outer casing. The first support unit includes a first support body disposed in the hinge structure, and the second support unit includes a second support body disposed in the hinge structure. The first antenna unit includes a first antenna structure disposed on the first support body and separated from the second outer casing. The second antenna unit includes a second antenna structure disposed on the second support body and separated from the second outer casing.

01-16-2014

20130244343

METHOD FOR PREPARING A THIN FILM DEVICE AND METHOD FOR PREPARING A COMMON MODE FILTER USING THE SAME - One aspect of the present invention provides a method for preparing a thin film device with an insulation layer from a dry polyimide film and a method for preparing a common mode filter using the same. A method for preparing a thin film device according to this aspect of the present invention includes the steps of forming at least one first conductive pattern on a substrate; placing a dry polyimide film on the first conductive pattern; applying a force to the dry polyimide film such that the dry polyimide film fills spaces in the first conductive pattern; and forming at least one second conductive pattern on the dry polyimide film.

09-19-2013

20130169486

COMPOSITE ANTENNA STRUCTURE - A composite antenna structure includes a dielectric main body, a covering layer and a metallic transmission line structure. The dielectric constant of the dielectric main body is ranged from 1 to 200. The covering layer is disposed on the dielectric main body and has a pattern area defined thereon. The metallic transmission line structure is formed on the pattern area of the covering layer.

07-04-2013

20130076474

COMMON MODE FILTER WITH MULTI-SPIRAL LAYER STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A common mode filter includes a first coil, a second coil, a first insulating layer separating the first coil from the second coil, a third coil serially connected with the first coil, a second insulating layer separating the second coil from the third coil, a fourth coil serially connected with the second coil, and a third insulating layer separating the third coil from the fourth coil. The second coil is between the first and third coils, and the third coil is between the second and fourth coils. At least one of the first insulating layer, the second insulating layer and the third insulating layer may include magnetic material.

03-28-2013

20130076456

COMMON MODE FILTER WITH MULTI SPIRAL LAYER STRUCTURE AND METHOD OF MANUFACTURING THE SAME - A common mode filter with a multi spiral layer structure includes a first coil, a second coil, a third coil connected in series with the first coil, a fourth coil connected in series with the second coil, a first material layer and a second material layer. The second coil is disposed between the first and third coils, and the third coil is disposed between the second and fourth coils. At least one of the first and second material layers comprises magnetic material. The first, second, third, and fourth coils are disposed between the first and second material layers.

03-28-2013

20130062656

THERMALLY ENHANCED OPTICAL PACKAGE - A thermally enhanced optical package includes a heat conducting module configured to dissipate the heat generated from an optical device, a plurality of insulating pads disposed on a heat conducting substrate, and at least one electrical conducting pad disposed on the insulating pads. The heat conducting module includes a heat conducting substrate and a plurality of heat conducting pillars, and the optical device is a light emitting diode chip or a light emitting diode die in the present embodiments. The thermally enhanced optical package is further characterized in a simple manufacturing procedure, including substantially an electrical or electroless plating process, a metal foil laminating process, a thick film printing process, and a patterning and etching process.

SOLID CAPACITOR AND MANUFACTURING METHOD THEREOF - A manufacturing method of solid capacitors includes the following steps. First step is forming a plurality of separated adhesive layer on an insulating substrate. Next step is disposing valve-metal wires on the adhesive layers. Next step is forming a conductive layer on the adhesive layer and the valve-metal wires. Next step is forming a dielectric structure on the exposed surface of the valve-metal wires and the conductive layer. Next step is forming a hydrophobic layer and a conductive unit. Next step is separating the formed structures as individual capacitors. Next step is packaging the formed structures and forming terminals connected to the formed structures.

01-10-2013

20130009740

COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - A common mode filter having heterogeneous laminates includes a first magnetic layer, a nonmagnetic insulating substrate, a second magnetic layer, a first coil layer, and a second coil layer. The second magnetic layer is formed on the nonmagnetic insulating substrate, between the nonmagnetic insulating substrate and the first magnetic layer. The first coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a first coil. The second coil layer is disposed between the first magnetic layer and the second magnetic layer, and includes a second coil. The first and second coil layers are separated from each other, and the first and second coils are magnetically coupled to each other.

01-10-2013

20120300369

CONDUCTIVE STRUCTURE HAVING AN EMBEDDED ELECTRODE, AND SOLID CAPACITOR HAVING AN EMBEDDED ELECTRODE AND METHOD OF MAKING THE SAME - A solid capacitor having an embedded electrode includes a substrate unit, a first conductive unit, a second conductive unit, a first insulative unit, a third conductive unit, a second insulative unit, and an end electrode unit. The substrate unit includes a substrate body and a conductive body embedded into the substrate body. The substrate body has a lateral opening and a plurality of top openings, and the conductive body has a lateral conductive area exposed from the lateral opening and a plurality of top conductive areas respectively exposed from the top openings. The first conductive unit includes a plurality of first conductive layers respectively covering the top conductive areas. The second conductive unit includes a second conductive layer covering the first conductive layers. The porosity rate of the second conductive layer is larger than that of each first conductive layer.

11-29-2012

20120281338

ALUMINUM ELECTROLYTIC CAPACITOR AND METHOD OF MANFACTURING THE SAME - An aluminum electrolytic capacitor includes an aluminum foil substrate, a porous aluminum layer, an insulating layer, an electrically conductive polymer material, an electrically conductive material, and at least two terminal electrodes. The porous aluminum layer is attached to the aluminum foil substrate. The insulating layer is formed on the porous aluminum layer. The electrically conductive polymer material overlays the insulating layer. The terminal electrodes respectively connect to the aluminum foil and the electrically conductive material.

11-08-2012

20120119863

COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - A common mode filter includes at least two inductance unit sets. Each inductance unit set includes a coil leading layer, an insulating substrate, at least two electrically conductive columns, and a coil main body layer. The coil leading layer is disposed on a first surface of the substrate, and includes at least two leading wires, at least four leading terminals, and at least two contacts. Each leading wire respectively connects one leading terminal and one contact. The coil main body layer is disposed on a second surface of the substrate, and includes a coil lead and two end portions thereof. Each electrically conductive column extends through the substrate, connecting one contact and one end portion. The two substrates and two coil main body layers of the at least two inductance unit sets are bonded by an electrically insulating layer. The two coil main body layers are electrically isolated from each other by the electrically insulating layer.

THIN TYPE COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME - A thin type common mode filter includes an insulating flexible substrate, a first magnetic material layer, a first coil leading layer, a coil main body multi-layer, a second coil leading layer, and a second magnetic material layer. The first coil leading layer is formed on a first surface of the flexible substrate, and the first coil leading layer is formed on a second surface of the flexible substrate opposite to the first surface. The coil main body multi-layer, the second coil leading layer, and the second magnetic material layer are sequentially stacked on the first coil leading layer.

12-29-2011

20110204521

CHIP-SCALE SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME - A chip-scale semiconductor device package includes a die, an insulating substrate having a through hole, a first metal layer, a second metal layer, and an insulating layer. The first metal layer is on a first surface of the insulating substrate and a first side of the through hole. The insulating layer is overlaid on a second surface of the insulating substrate and surrounds a second side of the through hole. The second metal is on the insulating layer and the second side of the through hole. The die is in the through hole and includes a first electrode and a second electrode. The first electrode is electrically connected to the first metal layer, and the second electrode is electrically connected to the second metal layer.

08-25-2011

20110025442

COMMON MODE FILTER AND METHOD FOR MANUFACTURING THE SAME - A common mode filter comprises an insulating substrate, a lower coil leading layer, a coil main body multilayer, and an upper coil leading layer. The upper coil leading layer comprises at least one upper lead, at least one upper terminal, and at least one upper contact, and the lower coil leading layer comprises at least one lower lead, at least one lower terminal, and at least one lower contact. The two ends of the upper lead are respectively connected to the upper terminal and the upper contact, and the upper lead surrounds the upper contact. The two ends of the lower lead are respectively connected to the lower terminal and the lower contact, and the lower lead surrounds the lower contact. The upper coil leading layer and the lower coil leading layer sandwich the coil main body multi-layer, and the lower coil leading layer is disposed on the insulating substrate.

02-03-2011

20100309087

Chip antenna device - A chip antenna device includes a single or multi-layer dielectric substrate, a radiator body, one or a plurality of first coupling electrodes formed on the radiator body, and a ground radiator formed on the upper or lower surface or inter-layer in another end of the substrate. It is designed by using loops and coupling concepts. The chip antenna device does not require large areas and clear space but has high radiation efficiency. It adjusts the impedance matching and operation frequency by changing the signal feed position, so that low frequency operation can be achieved without increasing the area of said antenna meeting the requirements of compact size for electronic products.

12-09-2010

20100182121

OVER-CURRENT PROTECTION DEVICE AND MANUFACTURING METHOD THEREOF - An over-current protection device comprises a PTC material layer, a first electrode layer, a second electrode layer, a first side electrode and a second side electrode. The PTC material layer is sandwiched between the first electrode layer and the second electrode layer. The first side electrode and the second side electrode are respectively disposed on two opposite side surfaces of the PTC material layer, and are respectively connected to the first electrode layer and the second electrode layer. Furthermore, the first side electrode and the second side electrode are respectively extended to four surfaces adjacent and perpendicular to the two side surfaces.

07-22-2010

20100164809

CIRCULAR POLARIZATION ANTENNA STRUCTURE WITH A DUAL-LAYER CERAMIC AND METHOD FOR MANUFACTURING THE SAME - A circular polarization antenna structure with a dual-layer ceramic includes a first hard dielectric body, a first metal layer, a grounding layer, an antenna feed pin, a second hard dielectric body, a second metal layer and an adhesive element. The first metal layer and the grounding layer dispose on a top surface and a bottom surface of the first hard dielectric body. The antenna feed pin passes through the through hole of the first hard dielectric body, the top side of the antenna feed pin is fixed on the top surface of the first hard dielectric body, and the bottom side of the antenna feed pin extends outwards from the bottom surface of the first hard dielectric body. The second hard dielectric body disposes above the top side of the first hard dielectric body. The second metal layer disposes on the top surface of the second hard dielectric body.

07-01-2010

20100078798

INSULATION COVERING STRUCTURE FOR A SEMICONDUCTOR ELEMENT WITH A SINGLE DIE DIMENSION AND A MANUFACTURING METHOD THEREOF - An insulation covering structure for a semiconductor element with a single die dimension includes: a semiconductor element with a single die dimension and an insulation covering layer. The semiconductor element has a front side surface, a rear side surface, a left side surface, a right side surface, a bottom surface, and a top surface. The top surface of the semiconductor element has two metal pads. The insulation covering layer covers the front side surface, the rear side surface, the left side surface, the right side surface, and the bottom surface of the semiconductor element. A manufacturing process for covering the semiconductor element with a single die dimension is also disclosed.

04-01-2010

20090296294

ELECTRO-STATIC DISCHARGE PROTECTION DEVICE WITH LOW TEMPERATURE CO-FIRE CERAMIC AND MANUFACTURING METHOD THEREOF - The present invention relates to an electro-static discharge (ESD) protection device with a low temperature co-fire ceramic (LTCC) and a manufacturing method thereof. The ESD protection device comprises a low temperature co-fire ceramic film having a first patterned conductive electrode material layer and a second patterned conductive electrode material layer therein. The low temperature co-fire ceramic film has at least one via exposing a portion of the first patterned conductive electrode material layer and a portion of the second patterned conductive electrode material layer simultaneously.

12-03-2009

20090128281

COMPOSITE CHIP VARISTOR DEVICE AND METHOD OF MANUFACTURING THE SAME - A composite chip varistor device includes a body; at least one inner varistor, disposed in the body; and a plurality of end electrodes, disposed at two sides of the inner varistor. The body is a highly insulative and imporous mono-material. The body of the present invention provides protection for the inner varistor to avoid being damaged by external factors and the manufacturing cost of the varistor device is effectively reduced.

05-21-2009

20090002911

OVER VOLTAGE PROTECTION DEVICE WITH AN AIR-GAP - The present invention relates to an over voltage protection device with an air gap and a manufacturing method thereof. The over voltage protection device provides over voltage protection by using an air gap extending into a first substrate and a second substrate. The air gap is formed by a first trench of the first substrate and a second trench of the second substrate.

01-01-2009

20090002910

OVER VOLTAGE PROTECTION DEVICE WITH AN AIR-GAP - The present invention relates to an over voltage protection device with an air gap and a manufacturing method thereof. The over voltage protection device provides over voltage protection by using an air gap extending into a first substrate and a second substrate. The air gap is formed by a first trench of the first substrate and a second trench of the second substrate.

01-01-2009

20090002906

OVER VOLTAGE PROTECTION DEVICE WITH AN AIR-GAP - The present invention relates to an over voltage protection device with an air gap and a manufacturing method thereof. The over voltage protection device provides over voltage protection by using an air gap extending into a first substrate and a second substrate. The air gap is formed by a first trench of the first substrate and a second trench of the second substrate.

01-01-2009

20080239600

LOW TRIGGER VOLTAGE ESD PROTECTION DEVICE - The present invention is an electrostatic discharge protection device having a low trigger voltage. The device can utilize a process of manufacturing a PCB to minimize costs and manufacturing time. The device comprises: a discharge area, which is essentially a space within the device and can be filled by a material having a desired breakdown voltage, and at least two electrode areas, wherein the two electrode areas are substantially electrically isolated from each other and simultaneously adjacent to or within the discharge area. When an electric potential difference between the electrode areas exceeds a predetermined value, a conductive path between the electrode areas will be created by discharging through the discharge area. The device is characterized in that each of the two electrodes is a part of a conductive plate, and the two conductive plates become a part of the device by pressing or adhering so that a gap for electric isolation exists between the two electrode areas.