Patent application title: HYBRID ANTENNA STRUCTURE

Abstract:

An electrical component is provided that provides at least a two shot
injection molding structure. One of the at least two shots of plastic
comprises a laser direct structuring material. Another of the at least
two shots of plastic comprises a non-platable plastic. The laser direct
structuring material is selectively activated such that a conductive
trace can be plated on the laser direct structuring material.

Claims:

1. A method of forming an electrical component comprising the steps
of:providing a first mold to accept a first shot of a first type of
plastic;injecting a first shot of the first type of plastic into the
first mold provided for the first shot of plastic to obtain a first
structural component;transferring the first structural component to a
second mold to accept a second shot of a second type of plastic;injecting
a second shot of the second type of plastic into the second mold provided
for the second shot of plastic to couple the first type of plastic to the
second type of plastic, the coupling of the first type of plastic and the
second type of plastic forming a second structural component wherein at
least one of the first type of plastic or the second type of plastic
comprises a laser direct structuring material;painting the laser direct
structuring material with a laser to activate a portion of the laser
direct structuring material; andplating the activated portion of the
laser direct structuring material such that a conductive trace resides on
the activated portion.

2. The method according to claim 1, wherein the first type of plastic
comprises the laser direct structuring material.

3. The method according to claim 2, wherein the second type of plastic
comprises a non-platable plastic.

4. The method according to claim 1, further comprising the step
of:transferring the second structural component to a third mold to accept
a third shot of a third type of plastic; andinjecting a third shot of the
third type of plastic to the couple the third type of plastic to at least
one of the first type of plastic or the second type of plastic,wherein
the third type of plastic comprises a platable plastic and wherein the
plating step further plates the platable plastic such that the conductive
trace resides on the platable plastic.

5. A method of forming an electrical component comprising the steps
of:providing a first mold to accept a first shot of a laser direct
structuring material;injecting a shot of laser direct structuring
material into the first mold to obtain a first structural
component;transferring the first structural component to a second mold to
accept a non-platable plastic;injecting a shot of non-platable plastic
into the first mold to couple with the laser direct structuring material
to form a second structural component;painting the laser direct
structuring material with a laser to activate a portion of the laser
direct structuring material; andplating the activated portion of the
laser direct structuring material such that a conductive trace resides on
the activated portion.

6. The method according to claim 5, further comprising the step
of:transferring the second structural component to a third mold to accept
a third shot of a platable plastic; andinjecting a shot of platable
plastic into the third mold to the couple the platable plastic to at
least one of the laser direct structuring material or the non-platable
plastic,wherein the plating step further plates the platable plastic such
that the conductive trace resides on the platable plastic

10. The electrical component according to claim 7, wherein the base
section comprises at least one prong to couple the base section to a
mounting surface.

11. The electrical component according to claim 10, wherein each of the at
least one prongs comprise a shaft portion and a protrusion portion.

12. The electrical component according to claim 10, wherein each of the at
least one prongs comprises a shaft portion and a snap portion.

13. The electrical component according to claim 7, further comprising a
second conductive trace carrying section comprising a platable plastic
and the conductive trace is plated to the platable plastic.

14. The electrical component according to claim 1, wherein the electrical
component comprises an antenna.

16. The apparatus according to claim 15, wherein the electrical component
further comprises a second conductive trace carrying section comprising a
platable plastic and the conductive trace is plated to the platable
plastic.

17. The apparatus according to claim 15, wherein the base section
comprises at least one prong having a shaft and a protrusion to couple a
detent having a lip in the mounting surface.

18. The apparatus according to claim 15, wherein the mounting surface
comprises a sidewall having a lip and the at least one prong comprises a
shaft and a protrusions where the protrusions couples to the lip.

19. The apparatus according to 18, wherein the sidewall comprises a recess
into which the protrusion extends.

20. The apparatus according to claim 15, wherein the apparatus comprises a
wireless device and the electrical component comprises an antenna.

Description:

BACKGROUND

[0001]1. Field

[0002]The technology of the present application relates generally to
antenna structures and, and more specifically to a hybrid antenna
structure combining laser direct structuring material and a two shot
molding process.

[0003]2. Background

[0004]Wireless devices use a variety of different types of antennas. The
styles can be classified in two generic categories: external and
internal. External antennas are generally more efficient than internal
antennas. But internal antennas are less prone to damage and usually more
aesthetically pleasing. The technology of the present application
generally relates to metalized plastics and has specific utility with
electronic components such as internal antennas.

[0005]Internal antenna can be made using a number of different
methodologies. One method of making internal antennas is a stamped metal
or embossing technique. The stamped metal technique uses thin metal that
is stamped and formed into the size and shape needed to form the needed
radiator design. This piece of metal is then connected to a
non-conductive carriage to form the antenna assembly. Another technique
used to manufacture antennas is the flexible film approach. This
technique uses a thin layer of conductive material such as copper
attached to a think non-conductive substrate such as Capton or Mylar. The
substrate has a thin layer of adhesive on the back surface. To form the
radiator geometry, the copper that is not needed is removed by using
conventional printed circuit board manufacturing methods. This flexible
film is then attached to a rigid structure such as the antenna carriage
or the handset housing wall.

[0006]One popular method of manufacturing an antenna involves a multi-shot
injection molded, selectively plated technique. The multi-shot technique
typically provides an injection molded base of non platable plastic with
a platable plastic injection molded onto selective portions of the base.
The antenna base is formed by a first injection mold process of a base
layer or carrier. The base layer typically is a plastic, composite, or
synthetic material that has positive strength, durability, and ductility
characteristics. However, the base layer also is a non-platable plastic.
In other words, conductive traces necessary to form the radiator cannot
be adhered or plated to the non-platable plastic. Thus, the base layer is
placed into a second injection mold and a platable substrate is molded to
the base layer. The platable substrate is typically a plastic, composite,
or synthetic material to which conductive traces (most typically copper)
can be adhered or plated to form the radiator. Once the base layer and
platable substrate layer are formed by the two shot molding process, the
structure is plated using, for example, an electroplating technique to
plate conductive material to the platable plastic. The conductive
material plates substantially all the exposed surface area of the
platable plastic to form the radiating structure for the antenna.
Generally, the non-platable base and the platable substrate are selected
to provide a good mechanical and chemical bond to inhibit the plating
process from interfering with the bond between the non-platable and
platable parts.

[0007]Multi-shot molding, selectively plating methods to form antennas has
numerous advantages. For example, the manufacturing of the final design
is relatively repeatable and low cost. Other advantages are generally
known in the art. However, the process also has numerous disadvantages.
For example, the tooling for the process is expensive and the molds
frequently need to be changes as the antenna design changes (particularly
to accommodate variations in the radiator).

[0008]Recently, another popular method of manufacturing an antenna
involves using a laser direct structuring process. The laser direct
structuring process provides an injection molded base of a material that
can be selectively activated by a laser (a.k.a laser drawing on the
material). The selectively activated portions of the base are platable.
Thus, the laser would be used to selectively activate the material with
the radiation pattern desired. The material is plated such that
conductive traces plate to the activated portions. One type of material
usable for this process is generally known as VECTRA® liquid Crystal
polymer from Ticona Engineering Polymers, a business of Celanese, but
other materials as a generally know in the art are possible. Generally, a
laser direct structuring material includes a plastic that includes a
laser sensitive metal complex that may be activated when exposed to the
laser light. The metal complex is such that it does not drastically
affect the polymer's dielectric properties.

[0009]The laser direct structuring method of forming antenna structures
also provides numerous advantages. For example, the production is
repeatable and flexible. The portion of the material to be activated for
the radiator can be varied by reprogramming the laser structure. The
laser direct structuring method also has some disadvantages. For example,
laser direct structuring material is relatively expensive and has less
advantageous material properties.

[0010]Thus, against this background, it would be desirous to develop and
improved antenna structure.

SUMMARY

[0011]Embodiments disclosed herein address the above stated needs by
method of forming an electrical component comprising a combination of
steps. The steps including providing a first mold to accept a first shot
of a first type of plastic and injecting a first shot of the first type
of plastic into the first mold provided for the first shot of plastic to
obtain a first structural component. Then transferring the first
structural component to a second mold to accept a second shot of a second
type of plastic and injecting a second shot of the second type of plastic
into the second mold provided for the second shot of plastic to couple
the first type of plastic to the second type of plastic, the coupling of
the first type of plastic and the second type of plastic forming a second
structural component wherein at least one of the first type of plastic or
the second type of plastic comprises a laser direct structuring material.
A laser paints a portion of the laser direct structuring material to
activate a portion thereof. The activated portion of the material is
plated such that a conductive trace resides on the activated portion.

[0012]Other embodiments disclosed herein address the above stated needs by
providing an electrical component. The electrical component comprises a
first conductive trace carrying section comprising a laser direct
structuring material having an activated portion and a non-activated
portion coupled to a base section comprising a non-platable plastic. A
conductive trace is plated to the activated portion of the conductive
trace carrying section.

BRIEF DESCRIPTION OF THE DRAWINGS

[0013]FIG. 1A shows a perspective view of an electronic component using
technology associated with the present application;

[0014]FIGS. 1B and 1C show perspective views of the electronic component
of FIG. 1A partially exploded;

[0015]FIGS. 2A-2E show coupling the electrical device of FIG. 1 to a
mounting surface;

[0016]FIG. 3 is a perspective view of an electronic component using
technology associated with the present application; and

[0017]FIG. 4 is an illustrative methodology of making the electronic
components of FIGS. 1 and 3.

DETAILED DESCRIPTION

[0018]The technology of the present application will now be explained with
reference to the figures. The technology of the present application will
be described with specific reference to providing a hybrid antenna
structure for a wireless device, but one of ordinary skill in the art
will recognize on reading the disclosure that the technology may be used
in a variety of applications where conductive material is to be plated on
a plastic substrate, such as, for example, printed circuit boards or the
like. Moreover, the technology of the present application will be
explained with reference to particular exemplary embodiments. The word
"exemplary" is used herein to mean "serving as an example, instance, or
illustration." Any embodiment described herein as "exemplary" is not
necessarily to be construed as preferred or advantageous over other
embodiments. All embodiments described herein should be construed as
exemplary unless otherwise indicated.

[0019]Referring first to FIGS. 1A, 1B, and 1C, an electrical component 100
is provided. FIG. 1A shows electrical component 100 in a first
perspective view, FIG. 1B shows electrical component 100 in a second
perspective view and partially exploded, and FIG. 1C shows electrical
component 100 if the first perspective view and partially exploded.
Electrical component 100 comprises a base section 102 and a conductive
trace carrying section 104. A conductive trace 106 resides on over an
area on conductive trace carrying portion 104. Conductive trace 106 may
be contiguous or non-contiguous as shown depending on the design choice
and functional requirements of electrical component 100.

[0020]Conductive trace carrying section 104 would comprise a laser direct
structuring material, such as, for example, VECTRA® Liquid Crystal
Polymer or the like described above. Conductive trace carrying section
104 includes an activated portion 104a and a non-activated portion 104n.
The activated portion 104a has been painted with a laser as is generally
known in the art. Conductive trace 106 is plated onto activated portion
104a using a conventional plating process as will be explained further
below.

[0021]Base section 102 comprises a conventional plastic used for
electrical devices as is generally known in the art. One useful plastic
is polycarbon. Base section 102 and conductive trace carrying section 104
may be molded together using a two shot molding process as will be
explained further below. Base section 102 mechanically couples electrical
component 100 to a mounting surface 108. Mounting surface 108 may be any
number of conventional structures such as, for example, a housing of an
electrical device, a printed circuit board, or the like.

[0022]Base section 102 may be coupled to mounting surface 108 as shown in
more detail in FIGS. 2A-2E. As shown in FIG. 2A, shows a perspective view
of one prong 110 extend from base 102 towards mounting surface 108.
Coupling base section 102 to mounting surface 108 may comprise one or
more prongs however. Prong 110 includes a shaft portion 112 and a
protrusion portion 114. Protrusion portion 114 may be wedge shaped as
shown (a.k.a a cantilever latch system). As shown best in the cross
sectional view of FIG. 2B, mounting surface 108 may a bore 116 with a lip
118 into which prong 110 fits. Wedge shaped protrusion 114 engages an
edge 120 of lip 118 causing prong 110 to elastically deform as shown in
FIG. 2B. When protrusion 114 extends past lip 118 into bore 116, prong
110 rebounds such that protrusion 114 and lip 118 cause a coupling
between base section 102 and mounting surface 108 as shown in FIG. 2C.
Bore 116 should be construed broadly to include detents, channels, and
through holes whether circular, square or other shapes.

[0023]Alternatively as shown in FIG. 2D, mounting surface 108 may have a
sidewall 122 with a lip 118. Sidewall and lip 118 would function
similarly to the above. Sidewall and lip 118 may form a recess 124 in
sidewall into which protrusion 114 may fit as a matter of design choice
and as shown in phantom in FIG. 2D.

[0024]Referring to FIG. 2E another prong 110 is provided. Prong 110
includes a shaft portion 112 and a snap portion 126. Snap portion 126
extends from a base 128 of prong 110 towards base section 102 and removed
from shaft portion 112 to provide a gap G between shaft portion 112 and
snap portion 124. As snap portion 124 moved past an edge, such as edge
120, snap portion 124 would deform into gap G as shown by directional
arrow A. Once extended past the edge, snap portion 124 would return to
the undeformed state causing the coupling between base section 102 and
mounting surface 108.

[0025]As can be appreciated, one advantage of molding base section 102
onto conductive trace carrying section 104 is that base section 102 can
be formed from a material more ductile than typical laser direct
structuring material. This facilitates the mechanical coupling of the
electrical component to the device.

[0026]Referring now to FIG. 3, an electrical component 300 is provided.
Electrical component 300. Electrical component 300 comprises a base
section 302, a first conductive trace carrying section 304 and a second
conductive trace carrying section 306. As shown for component 300, there
exist multiple second conductive trace carrying sections 306; however,
depending on the component design there may be only a single second
conductive trace carrying section. Moreover, while only one first
conductive trace carrying section 304 is shown, multiple first conductive
trace carrying sections 304 are possible depending on the component
design. A conductive trace 308 resides on a first conductive trace
carrying section 304 and on second conductive trace carrying portion 306.
Conductive trace 308 may be contiguous or non-contiguous depending on the
design choice and functional requirements of electrical component 300.

[0027]First conductive trace carrying section 304 would comprise a laser
direct structuring material, such as described above. First conductive
trace carrying section 304 includes an activated portion 304a and a
non-activated portion 304n. The activated portion 306a has been painted
with a laser as is generally known in the art.

[0029]First conductive trace carrying section 304 may be a contiguous
section as shown or broken into non-contiguous sections as necessary.
While all areas likely to carry conductive traces may comprise laser
direct structuring material, the use of laser direct structuring material
is expense. Thus, less expensive platable plastics may be used for those
portions of the electrical design unlikely to change. Base section 302,
first conductive trace carrying section 304, and second conductive trace
carrying section 306 may be formed using a three shot molding process.
Conductive trace 308 is plated onto activated portion 304a and second
conductive trace carrying section 306 using a conventional plating
process as will be explained further below.

[0030]Base section 102 comprises a conventional plastic used for
electrical devices as is generally known in the art. One useful plastic
is polycarbon. Base section 102 and conductive trace carrying section 104
may be molded together using a two shot molding process as will be
explained further below. Base section 102 couples electrical component
100 to a mounting surface 108. Mounting surface 108 may be any number of
conventional structures such as, for example, a housing of an electrical
device, a printed circuit board, or the like.

[0031]While the above technology can be used with any number of electronic
components using the laser direct structuring material is particularly
useful in antenna design. In particular, the specifics of the device and
the configuration thereof, frequently require the conductive traces
associated with the radiator to change in some fashion throughout the
product development. Using the laser direct structuring material allows
the radiator change to be accomplished via reprogramming the laser to
activate alternative portions of the material. Conversely, providing a
platable plastic molded to a non-platable plastic as is known with
conventional two shot molding selectively plating process requires making
a new mold for every change to the radiator design. Thus, the laser
direct structuring material provides increased flexibility for the
engineers to change the design of the radiator. However, laser direct
structuring material does not provide the same beneficial material
characteristics to facilitate connection of the electrical component to a
device. Thus, providing a base section using, for example, Polycarbon,
provides material will more beneficial characteristics, such as, for
example, being less brittle, more ductile, stronger, to name but a few
examples of different material properties. However, the base material can
be chosen based specifically on required material, dielectric, cost, or
other characteristics.

[0032]Referring now to FIG. 4, an exemplary methodology 400 of forming an
electrical component using the technology of the present application is
provided. While the methodology 400 provides particular steps and actions
in a particular order, one of ordinary skill in the art would now
recognize on reading the disclosure that the illustrated steps and
actions may be performed in alternative order without departing from the
spirit and scope of the present invention. First, laser direct
structuring mold is provided, step 402. The laser direct structuring
mold, receives a first shot of injection molded plastic comprising laser
direct structuring material, step 404. The mold should provide a
sufficient surface for activation to accommodate the probably radiator
design and at least the probably radiator design subject to change. The
first shot of injection molding provides a conductive trace carrying
section 104 (or first conductive trace carrying section 304 if three or
more shots of plastic are provided) described above that is transferred
to a second mold, step 406. The second mold receives a second shot of
injection molded plastic comprising a suitable plastic for the base
section 102 (or base section 302 if three or more shots of plastic are
provided) described above, step 408. One conventional base material is
polycarbon. The base section plastic should be a non-platable plastic as
is generally known in the art. Optionally, electronic component 300
including base section 302 and conductive trace carrying section 304 is
transferred to a third mold, step 410. The third mold receives a third
shot of injection molded plastic comprising a suitable, platable plastic
for second conductive trace carrying section, which would be similar to
second conductive trace carrying section 306. Next, the laser direct
structuring material is selectively activated by a laser, step 414.
Finally, the electronic component 100 (or 300) is plated to deposit
conductive traces 106 (or 308) on the activated portion 104a of
conductive trace carrying portion 104 (or deposited on activated portion
304a and platable plastic 306), step 416.

[0033]The previous description of the disclosed embodiments is provided to
enable any person skilled in the art to make or use the present
invention. Various modifications to these embodiments will be readily
apparent to those skilled in the art, and the generic principles defined
herein may be applied to other embodiments without departing from the
spirit or scope of the invention. Thus, the present invention is not
intended to be limited to the embodiments shown herein but is to be
accorded the widest scope consistent with the principles and novel
features disclosed herein.