Participate with SAE

Donate

Adhesive Compound, Epoxy, Room Temperature Curing
AMS3690

This specification covers a two-component compound, an epoxy resin base and a hardener, in the form of a paste.
This adhesive compound has been used typically for nonstructural bonding of metallic alloys and thermosetting plastics to themselves and to each other; it is intended primarily as an adhesive for electrical components operating at not higher than 185 °F (85 °C), but usage is not limited to such applications.

SAE MOBILUS

Special Offer:
Purchase more aerospace standards and aerospace material
specifications and save! AeroPaks offer a customized subscription plan that lets you pay for just the documents
that you need, when you need them.