Thick (up to 5 mm) Ni electrodeposits were produced by the pulsed electrodeposition (PED) technique. The PED-Ni was investigated in planar and cross-sections using high resolution scanning electron microscopy. Grain size and local texture were studied by electron backscatter diffraction. Thermal stability and grain growth behaviour were investigated using in-situ annealing in the transmission electron microscope. It is observed that columnar grains are present in the material and that the orientation of grains is not uniform. Textures and in-situ annealing behaviour are compared to previous data on nanocrystalline PED-Ni and Ni-Fe, where a subgrain coalescence model adopted from recrystallization is used to describe the occurrence of abnormal grain growth
upon annealing and where twinning was found to be responsible for the texture development.

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BibTeX @article{Klement2010,author={Klement, Uta and Hollang, Lutz and Dey, Suhash and Battabyal, Manjusha and Mishin, Oleg and Skrotzki, Werner},title={Effect of Annealing on Microstructural Development and Grain Orientation in Electrodeposited Ni},journal={Solid State Phenomena},issn={1012-0394 },volume={160},pages={235-240},abstract={Thick (up to 5 mm) Ni electrodeposits were produced by the pulsed electrodeposition (PED) technique. The PED-Ni was investigated in planar and cross-sections using high resolution scanning electron microscopy. Grain size and local texture were studied by electron backscatter diffraction. Thermal stability and grain growth behaviour were investigated using in-situ annealing in the transmission electron microscope. It is observed that columnar grains are present in the material and that the orientation of grains is not uniform. Textures and in-situ annealing behaviour are compared to previous data on nanocrystalline PED-Ni and Ni-Fe, where a subgrain coalescence model adopted from recrystallization is used to describe the occurrence of abnormal grain growth
upon annealing and where twinning was found to be responsible for the texture development.},year={2010},keywords={Nickel, electrodeposition, texture development, thermal stability, EBSD, in-situ TEM},}

RefWorks RT Journal ArticleSR ElectronicID 110841A1 Klement, UtaA1 Hollang, LutzA1 Dey, SuhashA1 Battabyal, ManjushaA1 Mishin, OlegA1 Skrotzki, WernerT1 Effect of Annealing on Microstructural Development and Grain Orientation in Electrodeposited NiYR 2010JF Solid State PhenomenaSN 1012-0394 VO 160SP 235OP 240AB Thick (up to 5 mm) Ni electrodeposits were produced by the pulsed electrodeposition (PED) technique. The PED-Ni was investigated in planar and cross-sections using high resolution scanning electron microscopy. Grain size and local texture were studied by electron backscatter diffraction. Thermal stability and grain growth behaviour were investigated using in-situ annealing in the transmission electron microscope. It is observed that columnar grains are present in the material and that the orientation of grains is not uniform. Textures and in-situ annealing behaviour are compared to previous data on nanocrystalline PED-Ni and Ni-Fe, where a subgrain coalescence model adopted from recrystallization is used to describe the occurrence of abnormal grain growth
upon annealing and where twinning was found to be responsible for the texture development.LA engDO 10.4028/www.scientific.net/SSP.160.235LK http://dx.doi.org/10.4028/www.scientific.net/SSP.160.235 OL 30