Board Level Heatsinks

Bluecore offer a wide range of board level heat sinks all of which are designed to cool specific product packages. These heat sinks are widely used in electronics, and are specific to JEDEC packages such as TO220, TO247, TO202 and TO218. Our stamped heat sinks provide highly effective cooling for small packages whilst our efficient manufacturing techniques mean they meet market demands for cost effective thermal solutions.

We also offer a complimentary range of mounting methods and thermal compounds to maximise heat dissipation.

Our competitor cross reference service helps to simplify your choice, simply send us a comparable part number and we will do the rest.