Event Advisory: Semiconductor Industry Leaders to Examine the Future of Interconnects at December 11th Event

SANTA CLARA, CA, Dec 3, 2012 - (ACN Newswire) - The 14 nanometer node is expected to be an inflection point for the chip industry, beyond which the resistivity of copper interconnects will increase exponentially and may become a limiting factor in chip design. On December 11, 2012, Applied Materials, Inc. will host an important forum in San Francisco to explore the path that interconnect technology must take to keep pace with transistor scaling and the transition to new 3D architectures.

The discussion will address critical questions for the semiconductor industry, including the possibility of replacing copper as the material of choice for interconnect structures. If not, will new circuit designs and system architectures be able to address future limitations in interconnect performance? The complexity of multi-patterning and EUV timing may also impact chipmakers' interconnect pitch scaling roadmaps.

Guest speakers from across the industry will provide insights on these critical issues in a panel titled "Interconnect Performance - Overcoming the Impact of Transistor Scaling." To register for this exceptional event, please visit www.appliedmaterials.com/interconnect-panel .

Applied Materials, Inc. (Nasdaq:AMAT) is the global leader in providing innovative equipment, services and software to enable the manufacture of advanced semiconductor, flat panel display and solar photovoltaic products. Our technologies help make innovations like smartphones, flat screen TVs and solar panels more affordable and accessible to consumers and businesses around the world. Learn more at www.appliedmaterials.com .

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