Minco Technology Labs, LLC Launches a Family of Power MOSFETs in Hermetic Packaging for High Reliability, High-Temperature Applications

Minco introduces the power MOSFET product line, servicing high reliability applications, in direct response to customer demand and diminishing sources of supply in through-hole hermetic packaging.

Minco Introduces the Power MOSFET product line, servicing High Reliability applications, in direct response to customer demand and diminishing sources of supply in through-hole hermetic packaging.

Minco’s through-hole, Hermetic Power MOSFET standard product introduction was driven by continued demand and diminishing source availability from the original semiconductor manufactures (OSM)...

Austin, TX (PRWEB) August 21, 2014

Minco Technology Labs, LLC announces the introduction of a family of hermetically packaged, Power MOSFET devices. This new product grouping will be added to their portfolio of standard products, servicing end user demand of targeted MOSFET devices from Original Semiconductor Manufacturers (OSM). The first MOSFET product grouping is targeted at the supply of popular IRF, FF & FY9xxx series MOSFET devices originally manufactured and sourced to the industry by International Rectifier. The product family members will meet or exceed the original manufacturer’s device specification thereby offering equal or improved figure of merit (FOM). This product family will be based on silicon from one of Minco’s premiere silicon technology partners, based on Fairchild Semiconductor’s Power MOSFET silicon.

“Minco’s through-hole, Hermetic Power MOSFET standard product introduction was driven by continued demand and diminishing source availability from the original semiconductor manufactures (OSM). This product family fits nicely with Minco’s Linear and Mixed-Signal product groupings, all servicing the same customer base and many of the same applications,” stated David Harrison, Vice President of Engineering at Minco Technology Labs.

Minco’s first Power MOSFET products to be introduced are a group of P-Channel devices, package in various three pin, metal matrix tab and transistor outline can packages, all hermetically sealed. Minco will in the future offer additional package options including the SMD 0.5, 1.0 or 2.0 surface mount package options. The family will offer the designer a wide selection of components with varying Voltage, Current, Switching, and Recovery characteristics. The packages, as well as the assembly methods, are chosen for each product offered based on the devices maximum Voltage and Current while maintaining a maximum thermal relief profile, improving operational performance. Minco will follow the initial release with an additional grouping of N-Channel products.

Minco’s target markets for this High Reliability group of hermetic products is Military Navel, Air, Ground platforms and in the Heavy Industrial market, extreme environment Energy platforms. Platform and application of use for these products requires they withstand temperatures of -55°C to +125°C and be hermetic. Military platforms also require they be manufactured compliant to QML Class Q, qualified to MIL-PRF-38535 requirements.

“Minco Technology Labs is an innovative solutions provider with a longstanding reputation for quality and service in the global die processing, distribution and high reliability components market. The team at Minco is pleased to continue to develop innovative solutions to better serve our customers,” said Jeffrey Weiss, Vice President of Sales of Minco Technology Labs, LLC.