Apple will probably preview its next-generation modular Mac Pro along with a standalone 6K display at the upcoming WWDC 2019 on June 3. Today, someone leaked a supposed slide from allegedly internal documents for the upcoming machine. However, eagle-eyed folks have already spotted a number of inconsistencies making us question this supposed leak.

The image was posted to Imgur and appears to be from a presentation for the “Mac Pro 7.1”.

The Mac Pro is claimed to have an Intel Xeon W Cascade Lake-X processor with the Apple T2 security chip, ‘Apple X2 Accelerator’, and DDR5 SO-DIMM memory. The RAM claim is unlikely as the first commercial DDR5 releases have yet to occur and aren’t expected in any volume until well into 2020, making the inclusion of the immature technology on such a high-profile product an unwise decision.

There also has yet to be any formal announcements regarding DDR5 in a SO-DIMM format, doubly making the claim iffy, let alone the lack of detail about ECC versions, especially for a slide updated in November 2018.

The size of the box in the illustrations doesn’t lend itself well to three dual-width PCIe 4 slots. The relative newness of PCIe 4 also makes it an unlikely inclusion, again for maturity at launch, and a lack of available cards that will be able to use it.

It’s entirely possible that whoever put together this document was working with older specs or simply made errors intentionally so that Apple could track down leaks—the company does this all the time. Specs also mention eight Thunderbolt 3 ports with support for the unreleased Thunderbolt 4 standard, two HDMI 2.1 ports, 10-gigabit Ethernet and Bluetooth 5.1.

Considering the current Mac Pro is anything but modular—and given the criticism over lack of expandability coming from its pro users—Apple would be wise to come up with a solution that would permit customers to easily swap the CPU, change the graphics card, install more memory and upgrade their machine much like owners of the older tower Mac Pro models can.