Our investigation focuses on the effect of bulk hydrogenation in mc-Si via PECVD SiNx deposition at low temperatures, so without a subsequent firing step. In a recent publication we have shown that bulk lifetime improvement in mc-Si takes place during PECVD SiNx deposition at 450°C in a PECVD furnace with direct plasma and low plasma generator frequency. In this work we study the bulk hydrogenation of mc-Si during SiNx deposition in different PECVD systems with direct and remote plasma. Tests were performed on p-type and n-type wafers from mc-Si ingots, p-type String Ribbon wafers and p-type EFG ribbon wafers. Neighbouring and adjacent wafers respectively are used to compare bulk lifetimes after single and double sided SiNx deposition on wafers as grown and after P-gettering. Bulk lifetime was measured spatially resolved with μ-PCD. Surface passivation was provided with an iodine-ethanol solution. Significant bulk lifetime improvement in mc-Si takes place during SiNx deposition at low temperatures in PECVD systems with direct and remote plasma, without additional firing step. The effect varies for different mc-Si materials, however, a general statement for all mc-Si materials is difficult.