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H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

H01L23/00—Details of semiconductor or other solid state devices

H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames

H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates

H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures

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H01—BASIC ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof

H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof

H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer

H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container

H01L21/56—Encapsulations, e.g. encapsulation layers, coatings

H01L21/561—Batch processing

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H01—BASIC ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips

H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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H01—BASIC ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

H01L2224/02—Bonding areas; Manufacturing methods related thereto

H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process

H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages

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H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto

H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process

H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector

H01L2224/321—Disposition

H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive

H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked

H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation

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H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71

H01L2224/732—Location after the connecting process

H01L2224/73251—Location after the connecting process on different surfaces

H01L2224/73267—Layer and HDI connectors

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H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected

H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector

H01L2224/92144—Sequential connecting processes the first connecting process involving a layer connector the second connecting process involving a build-up interconnect

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H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00

H01L2224/93—Batch processes

H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips

H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting

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H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/01—Chemical elements

H01L2924/01029—Copper [Cu]

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H01—BASIC ELECTRIC ELEMENTS

H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715

H01L2924/097—Glass-ceramics, e.g. devitrified glass

H01L2924/09701—Low temperature co-fired ceramic [LTCC]

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H01L—SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR

H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00

H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected

H01L2924/181—Encapsulation

Abstract

A semiconductor device and a fabricating method thereof are provided. In one exemplary embodiment, a plurality of semiconductor dies are mounted on a laminating member, for example, a copper clad lamination, having previously formed conductive patterns, followed by performing operations of encapsulating, forming conductive vias, forming a solder resist and sawing, thereby fabricating a chip size package in a simplified manner. Fiducial patterns are further formed on the laminating member, thereby accurately positioning the semiconductor dies at preset positions of the laminating member.

Description

TECHNICAL FIELD

The present application relates to a semiconductor device and a fabricating method thereof.

BACKGROUND

In general, a chip size package refers to a package having the same size as or slightly bigger than a chip. The chip size package has a compact, lightweight and thin profile. In the related art, a package in which an area occupied by chips exceeds 80% of a total package area has been defined as the chip size package. However, there has no standardized definition been hitherto.

To minimize the fabrication cost of the chip size package, it is desirable to avoid the use of expensive material and to maximize the yield.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross-sectional view of a semiconductor device according to one embodiment;

Common reference numerals are used throughout the drawings and the detailed description to indicate the same elements.

DETAILED DESCRIPTION

Referring to FIG. 1, a cross-sectional view of a semiconductor device according to one embodiment is illustrated.

As illustrated in FIG. 1, the semiconductor device 100 includes a semiconductor die 110, an adhesive member 120, a lamination member 130, an encapsulant 140 and a solder resist 150.

The semiconductor die 110 includes a plurality of bond pads 111 on its bottom, e.g., first, surface. In another embodiment, bond pads 111 are derived from a redistribution layer formed on the bottom surface of the semiconductor die 110.

The top, e.g., first, surface of the adhesive member 120 is attached to the bottom surface of the semiconductor die 110. The adhesive member 120 is wider than the semiconductor die 110. Here, the adhesive member 120 may be a common die attach film. In addition, the adhesive member 120 may be at least one selected from an adhesive tape, an adhesive agent, and equivalents thereof.

The top, e.g., first, surface of the lamination member 130 is attached to a bottom, e.g., second, surface of the adhesive member 120. The lamination member 130 includes an insulation layer 131, a plurality of conductive patterns 132 formed on a bottom, e.g., first, surface of the insulation layer 131, and a plurality of fiducial patterns 133 formed on a top, e.g., second, surface of the insulation layer 131. Here, a width of the insulation layer 131 may be equal to that of the adhesive member 120. In addition, conductive vias 134 are formed to pass through the adhesive member 120 and the lamination member 130. The conductive vias 134 electrically connect the bond pads 111 to the conductive patterns 132, respectively. In addition, the plurality of the fiducial patterns 133 pass through the adhesive member 120. Further, even when the fiducial patterns 133 do not pass through the adhesive member 120, they are formed to be visible from above the adhesive member 120. To this end, the adhesive member 120 may be a semi-transparent or transparent material. The fiducial patterns 133 are formed to be spaced apart from the semiconductor die 110 and used as alignment marks when the semiconductor die 110 is attached onto the adhesive member 120. Meanwhile, the lamination member 130 may be a copper clad lamination, but aspects of the present embodiment are not limited thereto.

The encapsulant 140 encapsulates the semiconductor die 110 disposed on the adhesive member 120. That is to say, the encapsulant 140 encapsulates the top, e.g., second, and side surfaces of the semiconductor die 110. In addition, the encapsulant 140 encapsulates the top surface of the adhesive member 120 corresponding to an outer periphery of the semiconductor die 110. The encapsulant 140 may be an epoxy molding compound used in the general transfer molding method or a UV curable glob top used in the general dispensing method, but aspects of the present embodiment are not limited thereto.

The solder resist 150 is formed on a bottom, e.g., second, surface of the lamination member 130. Of course, the land region of the conductive patterns 132 to which solder balls (not shown) are to be connected in a later operation is exposed through the solder resist 150. The land region will further be described below.

Referring to FIGS. 2A through 2G, cross-sectional views illustrating a fabricating method of the semiconductor device 100 illustrated in FIG. 1 are illustrated.

As illustrated in FIGS. 2A through 2G, the fabricating method of the semiconductor device 100 according to one embodiment includes operations of laminating, encapsulating, forming via holes, forming conductive vias, forming solder resist, and separating.

As illustrated in FIG. 2A, in the operation of laminating, the plurality of semiconductor dies 110 having the bond pads 111, the adhesive member 120 and the lamination member 130 having the plurality of conductive patterns 132 are laminated together. Here, the lamination member 130 includes the plurality of conductive patterns 132 and the plurality of fiducial patterns 133 formed on the bottom and top surfaces of the insulation layer 131, respectively. The lamination member 130 may be a copper clad lamination, but aspects of the present embodiment are not limited thereto.

In addition, the semiconductor dies 110 are mounted on the adhesive member 120 such that the bond pads 111 face downward. Further, the semiconductor dies 110 are positioned accurately without errors on predefined regions based on positions of the fiducial patterns 133. Of course, the fiducial patterns 133 are formed to be visible from above the adhesive member 120 irrespective of whether or not they pass through the adhesive member 120.

As illustrated in FIG. 2B, in the operation of encapsulating, the semiconductor dies 110 mounted on the adhesive member 120 are encapsulated by the encapsulant 140. The encapsulant 140 may be an epoxy molding compound used in the general transfer molding method or a UV curable glob top used in the general dispensing method, but aspects of the present embodiment are not limited thereto. In addition, as illustrated in FIG. 2B, the plurality of semiconductor dies 110 are positioned inside the encapsulant 140 using a gang molding method. Alternatively, each of the plurality of semiconductor dies 110 may also be positioned inside an independently corresponding encapsulant 140 by an independent molding method (not shown).

As illustrated in FIG. 2C, in the via hole forming operation, via holes 134a passing through the adhesive member 120 and the lamination member 130 are formed. That is to say, in the via hole forming operation, the via holes 134a that pass through the conductive patterns 132 and the insulation layer 131 of the lamination member 130 and then pass through the adhesive member 120 are formed. The via holes 134a allow the bond pads 111 of the semiconductor dies 110 to be exposed downward. The via holes 134a may be formed by common laser beams or etching solutions, but aspects of the present embodiment are not limited thereto.

As illustrated in FIGS. 2D and 2E, in the conductive via forming operation, a conductor is plated in the via holes 134a to form conductive vias 134. To this end, as illustrated in FIG. 2D, photoresist 160 is first laminated and openings 161 are formed at portions corresponding to the via holes 134a using conventional photolithography. Next, the conductor is plated into the via holes 134a through the openings 161 by an electroless plating and/or an electroplating method, thereby forming conductive vias 134 connecting the bond pads 111 and the conductive patterns 132 to each other. Next, as illustrated in FIG. 2E, the photoresist 160 is removed to allow the conductive patterns 132 to be exposed downward from the lamination member 130.

As illustrated in FIG. 2F, in the operation of forming the solder resist 150, the solder resist 150 is laminated on the bottom surface of the lamination member 130 to allow the conductive patterns 132 to be covered by the solder resist 150. Here, a predetermined portion of the solder resist 150 is removed by drilling or etching in a subsequent operation to selectively expose the conductive patterns 132. The exposed (removed) portion of the solder resist 150 may be particularly referred to as a land region.

As illustrated in FIG. 2G, in the operation of separating, the encapsulant 140, the adhesive member 120, the lamination member 130 and the solder resist 150 are separated, sometimes called singulated, by sawing using a sawing tool 170, thereby forming the single semiconductor device 100. Of course, the sawing may be performed in the reverse order to the above.

The via hole forming operation may not be performed. That is to say, in the laminating operation, the lamination member 130 having via holes 134a previously formed therein may be provided. In this case, the conductive via forming operation may be immediately performed without performing the via hole forming operation. Therefore, the use of the lamination member 130 having via holes 134a previously formed therein can noticeably reduce the number of processing operations in the manufacture of the semiconductor device 100.

Therefore, according to the semiconductor device 100 of the present embodiment and the fabricating method thereof, since the lamination member 130 has the via holes 134a previously formed therein, the number of processing operations of photolithography, dielectric layer formation, and plating can be reduced, thereby improving the yield of the semiconductor device 100.

In addition, according to the semiconductor device 100 of the present embodiment and the fabricating method thereof, the fiducial patterns 133 are formed in the semiconductor device 100, mounting errors of the semiconductor dies 110, which may be produced in the attaching operation of the semiconductor dies 110, may be reduced.

Further, since costly thermosensitive sheets are not used, the manufacturing cost of the semiconductor device 100 can further be reduced.

Referring to FIG. 3, a partially plan view of a conductive pattern illustrated in FIG. 1 is illustrated.

As illustrated in FIG. 3, conductive patterns 132 may include a via region 132a having conductive vias 134 formed therein, a land region 132b that is relatively wide so that solder balls are mounted thereon, and a connecting region 132c connecting the via region 132a and the land region 132b to each other. The via region 132a and the connecting region 132c are covered by the solder resist 150 while the land region 132b is exposed outside through the solder resist 150. In addition, via holes are formed in the via region 132a during the fabrication process, and the conductive vias 134 are formed in the via holes.

The via region 132a makes drill positioning for via hole formation easily controllable. Accordingly, via hole diameters can also be controlled to be uniform. In addition to the drill positioning, the via region 132a can considerably reduce a deviation between each of the via hole diameters.

Further, in a case where the via holes have been formed at an initial operation of forming the lamination member, a lead time of the overall semiconductor devices can considerably be reduced, which is because the plating operation can be performed immediately after the operations of attaching the semiconductor dies and encapsulating. In addition, since the conductive patterns 132 are formed on the bottom surface of the lamination member, fiducial marks can be set during laser drilling. Accordingly, drill positions can be easily determined during laser drilling.

Referring to FIG. 4A, a cross-sectional view of a semiconductor device 200 according to another embodiment is illustrated. Referring to FIG. 4B, a partially plan view of the semiconductor device illustrated in FIG. 4A is illustrated.

As illustrated in FIG. 4A, the semiconductor device 200 according to another embodiment includes a semiconductor die 210, encapsulant 220, a dielectric 230 and conductive patterns 240.

The semiconductor die 210 includes a plurality of bond pads 211 on its top, e.g., first, surface 212. Of course, bond pads 211 may be derived from a redistribution layer formed on top surface 212 of the semiconductor die 210.

The encapsulant 220 encapsulates the semiconductor die 210. The encapsulant 220 encapsulates only bottom, e.g., second, and lateral surfaces of the semiconductor die 210. That is to say, a top, e.g., first, surface 222 of the encapsulant 220 and a top surface 212 of the semiconductor die 210 are coplanar and the top surface 212 is exposed from the encapsulant 220.

The dielectric 230 is formed on and encloses the top surfaces 212 and 222 of the semiconductor die 210 and the encapsulant 220. The dielectric 230 may be at least one selected from the group consisting of phenolic resin, polyimide (PI), benzocyclobutene (BCB), polybenzoxazole (PBO), epoxy, and equivalents thereof, but aspects of the present embodiment are not limited thereto in view of the material of the dielectric 230. Here, openings 231 are formed in the dielectric 230. The openings 231 include first openings 231a, second openings 231b and a bottom, e.g., first, surface 231c. The first openings 231a are formed at positions corresponding to the bond pads 211. The second openings 231b are connected to the first openings 231a and are formed to have diameters larger than those of the first openings 231a. In addition, the second openings 231b are formed to slant, i.e., are non perpendicular to a top surface 232 of the dielectric 230. Further, the bottom surface 231c formed between the first openings 231a and the second openings 231b is planar.

The conductive patterns 240 are plated on the bond pads 211 and are mounted in the openings 231 of the dielectric 230 at the same time. That is to say, the conductive patterns 240 are formed in and fill the first openings 231a, the second openings 231b and on the bottom surface 231c. Further, a top, e.g., first, surface 242 of the conductive patterns 240 and the top surface 232 of the dielectric 230 are coplanar.

As illustrated in FIG. 4B, the conductive patterns 240 may include a via region 240a connected to bond pads 211, a land region 240b on which solder balls are to be mounted in a later operation, and a connecting region 240c connecting the via region 240a and the land region 240b. Since the solder balls or the like to be electrically connected to external devices are provided at the land region 240b, a diameter of the land region 240b is larger than that of the via region 240a.

Referring to FIGS. 5A through 5F, cross-sectional views illustrating a fabricating method of the semiconductor device illustrated in FIG. 4A are illustrated.

Referring to FIGS. 5A through 5F, the fabricating method of the semiconductor device 200 includes operations of encapsulating, removing an adhesive tape, forming a dielectric, plating a conductor, grinding, and separating.

As illustrated in FIG. 5A, in the operation of encapsulating, the plurality of semiconductor dies 210 having the bond pads 211 are attached to the adhesive tape 250, and the semiconductor dies 210 are encapsulated by an encapsulant 220. Here, the bond pads 211 of the semiconductor dies 210 are allowed to face the adhesive tape 250. Here, the encapsulant 220 may be an epoxy molding compound used in the general transfer molding method or a UV curable glob top used in the general dispensing method, but aspects of the present embodiment are not limited thereto. In addition, the adhesive tape 250 may be at least one selected from a UV sensitive tape, a general insulating tape, and equivalents thereof, but aspects of the present embodiment are not limited thereto in view of the material thereof.

As illustrated in FIG. 5B, in the operation of removing an adhesive tape, the adhesive tape 250 is removed from the semiconductor dies 210 and the encapsulant 220. In such a manner, the bond pads 211 of the semiconductor dies 210 are exposed outside. Further, a top surface 212 of the semiconductor dies 210 and a top surface 222 of the encapsulant 220 are coplanar.

As illustrated in FIG. 5C, in the operation of forming a dielectric, a dielectric 230 having a predetermined pattern is formed on the semiconductor dies 210 and the encapsulant 220. Here, openings 231 through which the bond pads 211 are exposed upward are formed in the dielectric 230. The openings 231 include first openings 231a formed at positions at which they overlap with the bond pads 211, second openings 231b led from the first openings 231a and formed to have diameters larger than those of the first openings 231a and to be slanted, and a bottom surface 231c formed between the first openings 231a and the second openings 231b to be planar. The dielectric 230 may be at least one selected from the group consisting of phenolic resin, polyimide (PI), benzocyclobutene (BCB), polybenzoxazole (PBO), epoxy, and equivalents thereof, but aspects of the present embodiment are not limited thereto in view of the material of the dielectric 230.

As illustrated in FIG. 5D, in the operation of plating a conductor, a conductor 240 having a predetermined thickness is plated on the semiconductor dies 210 and the dielectric 230. In such a manner, the conductor 240 is electrically connected to the bond pads 211 of the semiconductor dies 210. Here, the conductor 240 is formed thickly enough to cover the dielectric 230.

As illustrated in FIG. 5E, in the operation of grinding, the conductor 240 formed on the dielectric 230 is subjected to grinding using a grinding tool 260, thereby removing unnecessary portions of the conductor 240. Finally, the conductive patterns 240 connected to the bond pads 211 and positioned in the openings 231 of the dielectric 230 are formed in the operation of grinding. Here, the second openings 231b of the openings 231 are formed to slant, thereby accurately controlling widths of the conductive patterns 240. That is to say, grinding amounts of the conductor 240 and the dielectric 230 can be controlled by adjusting a grinding depth of the grinding tool 260. Accordingly, the widths of the conductive patterns 240 exposed through the second openings 231b can be controlled. For example, when the grinding depth by the grinding tool 260 is relatively small, the widths of the conductive patterns 240 become increased. On the other hand, when the grinding depth by the grinding tool 260 is relatively large, the widths of the conductive patterns 240 are reduced.

As illustrated in FIG. 5F, in the operation of separating, the dielectric 230 and the encapsulant 220 are separated by sawing using a sawing tool 270, thereby forming the single semiconductor devices 200.

As described above, in the semiconductor device 200 according to another embodiment and the fabricating method thereof, a chip size package can be realized in a simplified manner, and sizes (widths) of the conductive patterns 240 can be accurately controlled.

Referring to FIG. 6, a cross-sectional view of a semiconductor device 300 according to still another embodiment is illustrated.

As illustrated in FIG. 6, the semiconductor device 300 according to still another embodiment includes a dummy wafer 310, a semiconductor die 320, a dielectric 330 and conductive patterns 340.

The dummy wafer 310 may be a functionless wafer. The dummy wafer 310 has the same coefficient of thermal expansion as that of the semiconductor die 320. Thus, during operation of the semiconductor device 300, the semiconductor die 320 is not peeled off from the dummy wafer 310. Of course, in addition to the functionless wafer, glass, ceramic, or an equivalent thereof having substantially the same coefficient of thermal expansion as that of the semiconductor die 320 may be used as the dummy wafer 310.

The semiconductor die 320 may be formed on the dummy wafer 310. In this embodiment, the bottom, e.g., second, surface of the semiconductor die 320 is mounted to the top, e.g., first, surface of the dummy wafer 310. In addition, the semiconductor die 320 includes a plurality of bond pads 321 on the top, e.g., first, surface thereof. In one embodiment, the bond pads 321 are derived from a redistribution layer formed on the top surface of the semiconductor die 320.

The dielectric 330 surrounds the semiconductor die 320 and the dummy wafer 310. That is to say, the dielectric 330 surrounds not only lateral and top surfaces of the semiconductor die 320 but also the top surface of the dummy wafer 310 corresponding to an outer periphery of the semiconductor die 320. The dielectric 330 may be at least one selected from the group consisting of phenolic resin, polyimide (PI), benzocyclobutene (BCB), polybenzoxazole (PBO), epoxy, and equivalents thereof, but aspects of the present embodiment are not limited thereto in view of the material of the dielectric 330. Here, openings 331 are formed in the dielectric 330. The openings 331 include first openings 331a formed at positions at which they overlap with the bond pads 321, second openings 331b led from the first openings 331a and formed to have diameters larger than those of the first openings 331a and to be slanted, and a bottom, e.g., first, surface 331c formed between the first openings 331a and the second openings 331b to be planar.

The conductive patterns 340 are plated on the bond pads 321 and are mounted in the openings 331 of the dielectric 330 at the same time. That is to say, the conductive patterns 340 are formed in the first openings 331a, the second openings 331b and on the bottom surface 331c. In addition, a top, e.g., first, surface 342 of the conductive patterns 340 and a top, e.g., first, surface 332 of the dielectric 330 are coplanar.

Referring to FIGS. 7A through 7E, cross-sectional views illustrating a fabricating method of the semiconductor device 300 illustrated in FIG. 6 are illustrated.

As illustrated in FIGS. 7A through 7E, the fabricating method of the semiconductor device 300 includes operations of mounting semiconductor dies, forming a dielectric, plating a conductor, forming conductive patterns, and separating.

As illustrated in FIG. 7A, in the operation of mounting semiconductor dies, a plurality of semiconductor dies 320 each having bond pads 321 are mounted on a dummy wafer 310. Here, the semiconductor dies 320 are mounted on the dummy wafer 310 such that the bond pads 321 face upward. In addition, an adhesive may further be interposed between the semiconductor dies 320 and the dummy wafer 310.

As illustrated in FIG. 7B, in the operation of forming a dielectric, a dielectric 330 having a predetermined pattern is formed on the dummy wafer 310 and the plurality of semiconductor dies 320. Here, openings 331 through which the bond pads 321 are exposed upward are formed in the dielectric 330. The openings 331 include first openings 331a, second openings 331b and a bottom surface 331c. The first openings 331a are formed at positions corresponding to the bond pads 321. The second openings 331b are connected to the first openings 331a and are formed to have diameters larger than those of the first openings 331a. In addition, the second openings 331b are formed to slant. Further, the bottom surface 331c formed between the first openings 331a and the second openings 331b is planar. Here, the dielectric 330 may be at least one selected from the group consisting of phenolic resin, polyimide (PI), benzocyclobutene (BCB), polybenzoxazole (PBO), epoxy, and equivalents thereof, but aspects of the present embodiment are not limited thereto in view of the material of the dielectric 330.

As illustrated in FIG. 7C, in the operation of plating a conductor, a conductor 340 having a predetermined thickness is plated on the semiconductor dies 320 and the dielectric 330. In such a manner, the conductor 340 is plated on the bond pads 321 of the semiconductor dies 320 and the openings 331 of the dielectric 330 to form conductive vias. Here, the conductor 340 is formed thickly enough to cover the dielectric 330.

As illustrated in FIG. 7D, in the operation of forming conductive patterns, the conductor 340 formed on the dielectric 330 is subjected to grinding using a grinding tool 350, thereby removing unnecessary portions of the conductor 340. Finally, the conductive patterns 340 connected to the bond pads 321 and positioned in the openings 331 of the dielectric 330 are formed in the operation of grinding. Here, the second openings 331b of the openings 331 are formed to slant, thereby accurately controlling widths of the conductive patterns 340. That is to say, grinding amounts of the conductor 340 and the dielectric 330 can be controlled by adjusting a grinding depth of the grinding tool 350. Accordingly, the widths of the conductive patterns 340 exposed through the second openings 331b can be controlled. Accordingly, the widths of the conductive patterns 340 exposed through the second openings 331b can be controlled. For example, when the grinding depth by the grinding tool 350 is relatively small, the widths of the conductive patterns 340 become increased. On the other hand, when the grinding depth by the grinding tool 350 is relatively large, the widths of the conductive patterns 340 are reduced.

As illustrated in FIG. 7E, in the operation of separating, the dielectric 330 and the dummy wafer 310 are cut by sawing using a sawing tool 360, thereby separating into the single semiconductor devices 300.

As described above, in the semiconductor device 300 according to still another embodiment and the fabricating method thereof, sizes (widths) of the conductive patterns 340 can be accurately controlled.

In addition, since the dummy wafer 310 is attached to the semiconductor dies 320, dissipation efficiency of the semiconductor dies 320 is improved.

Further, since the dummy wafer 310 having the same coefficient of thermal expansion as that of the semiconductor dies 320, the semiconductor dies 320 are not peeled off from the dummy wafer 310 during operation of the semiconductor device 300.

Although specific embodiments were described herein, the scope of the invention is not limited to those specific embodiments. Numerous variations, whether explicitly provided for by the specification or implied by the specification, such as variations in structure, dimension, type of material and manufacturing process, may be implemented by one skilled in the art in view of this disclosure.

Claims (18)

1. A semiconductor device comprising:

a semiconductor die comprising a first surface comprising a bond pad;

a dielectric directly covering at least the first surface of the semiconductor die, wherein the bond pad is exposed to the outside through an opening in the dielectric, the opening comprising:

a first opening formed at a position corresponding to the bond pad;

a second opening coupled to the first opening and having a diameter larger than the first opening; and

a first surface of the dielectric between the first opening and the second opening; and

a conductive pattern plated on the bond pad and filling the opening of the dielectric, wherein a first surface of the conductive pattern and a first exposed outer surface of the dielectric are coplanar.

2. The semiconductor device of claim 1 further comprising an encapsulant encapsulating the semiconductor die.

3. The semiconductor device of claim 2 wherein the encapsulant encapsulates a second surface and lateral surfaces of the semiconductor die and exposes the first surface of the semiconductor die.

4. The semiconductor device of claim 3 wherein a first surface of the encapsulant and the first surface of the semiconductor die are coplanar.

5. The semiconductor device of claim 4 wherein the dielectric encloses the first surface of the encapsulant and the first surface of the semiconductor die.

6. The semiconductor device of claim 1 wherein the second opening is slanted.

8. The semiconductor device of claim 1 further comprising a dummy wafer comprising a first surface, a second surface of the semiconductor die being coupled to the first surface of the dummy wafer.

9. The semiconductor device of claim 8 wherein the dielectric encloses lateral surfaces of the semiconductor die and the first surface of the dummy wafer.

10. A semiconductor device comprising:

a semiconductor die comprising a first surface comprising a bond pad;

a dielectric directly covering at least the first surface of the semiconductor die, wherein the bond pad is exposed to the outside through an opening in the dielectric, the opening comprising:

a first opening formed at a position corresponding to the bond pad;

a second opening coupled to the first opening and having a diameter larger than the first opening; and

a first surface of the dielectric between the first opening and the second opening; and

a conductive pattern filling the opening of the dielectric, wherein a first surface of the conductive pattern and a first exposed outer surface of the dielectric are coplanar.

11. The semiconductor device of claim 10 wherein the second opening is slanted.

12. The semiconductor device of claim 10 wherein the second opening is non-perpendicular to the first exposed outer surface of the dielectric.

13. The semiconductor device of claim 10 wherein the first surface of the opening is planar.

14. A semiconductor device comprising:

a semiconductor die comprising a first surface comprising a bond pad;

a dielectric directly covering at least the first surface of the semiconductor die;

a conductive pattern in an opening of the dielectric, wherein a first surface of the conductive pattern and a first exposed outer surface of the dielectric are coplanar, the conductive pattern comprising:

Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom

Semiconductor device having first and second semiconductor chips with a gap therebetween, a die stage in the gap and associated lead frames disposed in a package, the lead frames providing electrical connections from the chips to an exterior of the packag

Chip on board package for integrated circuit devices using printed circuit boards and means for conveying the heat to the opposite side of the package from the chip mounting side to permit the heat to dissipate therefrom

Semiconductor device having first and second semiconductor chips with a gap therebetween, a die stage in the gap and associated lead frames disposed in a package, the lead frames providing electrical connections from the chips to an exterior of the packag