Abstract : The present invention relates generally to compounds terminated with substituted silyl groups, to oligomers formed from such compounds, to polymerceramic networks formed from such oligomers and compounds, and to processes for forming such compounds, oligomers, and polymers. High-temperature adhesives, coating, and encapsulants are used for a variety of aerospace applications, such as aircraft, missile, and spacecraft structures, where materials must survive temperatures as high as 1000 C. Presently used materials with high temperature capability are generally brittle and very difficult to process, and many degrade in the presence of atmospheric moisture.