Optomec announced today that Dr. Mike Renn, Optomec Advanced
Applications Lab Director, will give a presentation titled "Aerosol Jet
Printing of Conductive Epoxy for 3D Packaging" in the Advanced Materials
track at the Pan Pacific Microelectronics Symposium in Hawaii. The
conference will be held January 22-24 at the Makena Beach and Golf
resort in Maui.

Dr. Renn will discuss how traditional dispensing technologies are
typically limited to feature sizes above 100 microns and have limited 3D
capability due to near or direct-surface contact with the substrate.
Conductive adhesives for these systems typically contain large metallic
flakes which lead to inconsistent conductivity in small features such as
dots. The presentation will explain how a new, nanoparticle conductive
adhesive, when dispensed with an Aerosol Jet Printer, demonstrated
non-contact printing over 3D surfaces and into recesses such as through
silicon vias (TSV). The conductive adhesive, manufactured by Resin
Designs, is a high-solids, nanoparticle system with resistivity as
low at 5 μW-cm at 150º C cure temperatures. The adhesive has superior
thermal conductivity, adhesion, and elasticity, which are desirable for
fabricating heterogeneous connections, such as between IC chips and
circuit boards. The material can be Aerosol Jet dispensed with dot sizes
down to 25 μm, which enables high-density die attach. Similarly, TSV
filling has been demonstrated with via diameters down to 50 μm and
depths of 300 μm. The high-solids formulation reduces the material
shrinkage during curing resulting in a dense conductive plug.

Aerosol Jet printing has mainly been used for dispensing nanosilver inks
for photovoltaics, printed circuits, and printed antenna. One major
advantage of this system is that fine feature printing, down to 10 μm
feature size, can be achieved with a surprisingly large standoff height
(up to 10 mm). This capability allows for printing in recessed regions
such as vias, over step edges such as SMT devices, and over non-planar
substrates such as populated boards. In contrast to other jetting
techniques, the ink droplets in the Aerosol Jet system do not actually
interact with the surfaces of the nozzle. This feature results in
greatly reduced frequency of clogging and less sensitivity to specific
ink rheologies, such as viscosity, surface tension and solids loading.
For more information on Aerosol Jet printing, click
here.

The Pan Pacific Microelectronics Symposium promotes international
technical interchange and provides a premier forum for networking among
microelectronics professionals and business leaders throughout the
world. Conference sessions include Failure Analysis Tools and
Techniques, Strategic Directions, 3D Structures, Advanced Materials,
Advanced Manufacturing Challenges, Trends, Roadmaps, and more. For
details on the conference, go to http://www.smta.org/panpac/.

Optomec is a privately-held, rapidly growing supplier of Additive
Manufacturing systems. These solutions utilize Optomec’s patented
Aerosol Jet Printed Electronics technology and LENS Printed Metal
technology to reduce costs and improve performance. Together, these
unique 2D and 3D printing solutions work with the broadest spectrum of
functional materials, ranging from electronic inks to structural metals
and even biological matter. Optomec has more than 150 marquee customers
around the world, targeting production applications in the Electronics,
Energy, Life Sciences and Aerospace industries.

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