packaging

Contract packaging services for ICs and discrete semiconductor devices are available at Mikron manufacturing facilities in Moscow, Russia and in Shenzhen, China.

IC PACKAGING

Contract packaging services for ICs and discrete semiconductor devices are available at Mikron manufacturing facilities in Moscow, Russia and in Shenzhen, China.
Standard analog ICs are packaged into the following package types:

• SOP-8/14/16/28L
• SSOP-24L
• SOT-23
• TSSOP-20L

Shenzhen assembly fab possesses high-end ASM and Kulicke&Soffa packaging equipment with the capacity of up to 140 million plastic packages per month, including:

The production cycle includes all steps that begin with the chip design and continue through wafer production and into inlay / label / smart-card assembly and personalization. Both contact and dual interface smart-cards can be assembled by Mikron.