1. The machine was designed to depanel pre-scored panelboards carefully, without bending or tension stress.
2. Even sensitive SMD-Components like ceramic capacitors, will not be
damaged by the depaneling process, or thin board even to 0.3mm cab be
worked

3 . Separates boards up to 2.0 mm thick ( with minimum 0.5 mm scoring depth )
4 . Can be used with aluminum , FR4 , CEM3 and other substrates , including substrates with metal inner layers
5 . Separates PCBs with components located up to 0.5 mm from the score line
6 . Safe for use with flexible and thin PCBs
7 . Smooth , quiet pneumatic-powered unit with foot-pedal activation
8 . Wedge-shaped linear blades contour to v-groove score lines and operate in a rocking motion
9. Boards are separated without bending or breaking
10 . No safety risks to operator since there is never a gap greater than 4 mm between the upper and lower blades
11 . Adjust blades to PCB score line using rotary knob