Heraeus Launches Low-Temp Lead-Free Solder Paste

Heraeus Electronics has announced a new addition to its popular family of low-temperature solder pastes. The recently-developed Heraeus F 498 solder paste is designed for extremely low mid-chip balling and features the BiSn57Ag1 alloy for higher reliability in a variety of applications, including automotive, LED Level 2 and consumer electronics.

The newest addition to the Heraeus series of lead-free solder pastes is designed to address the challenges manufacturers face.

"Lead-free applications typically require higher processing temperatures, but many of the components in the assembly process can tolerate those higher temperatures. Our F 498 solder paste is the answer to that issue," said Mark Challingsworth, Global Head of Marketing for Heraeus Electronics.

Developed to help manufacturers address the competitive cost challenges of the market while delivering superior performance, Heraeus F 498 lead-free, low-temperature solder paste is specifically designed for step-soldering when a second, lower temperature reflow process is needed. It is ideal for temperature-sensitive components as well as low-melting, flexible circuitry used in smart devices. It offers excellent wetting performance on iSn and NiAu, provides extremely low beading and is RoHS compliant. Additionally, the paste supports the switch from wave-soldering to SMT with higher product quality, and operating temperatures up to 110°C are achievable.

The F 498 paste also delivers reduced energy consumption in the reflow process due to lower reflow temperature and less requirements for production floor and PCB cooling. In a high-volume factory, low-temperature solding can utilize a single-pass process, producing significant savings in direct operational costs in electrical usage and CO2 emission reduction.

Challingsworth added, "The F 498 solder paste is a win-win solution for manufacturers using a single-pass process. It can lower per-component costs without sacrificing reliability and joint strength. Further, manufacturers can increase the lifetime of their equipment as well as reduction in associated maintenance costs, since longer maintenance periods will be possible due to reduced contamination of equipment."

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Heraeus Launches Low-Temp Lead-Free Solder Paste

Heraeus Electronics has announced a new addition to its popular family of low-temperature solder pastes. The recently-developed Heraeus F 498 solder paste is designed for extremely low mid-chip balling and features the BiSn57Ag1 alloy for higher reliability in a variety of applications, including automotive, LED Level 2 and consumer electronics.

The newest addition to the Heraeus series of lead-free solder pastes is designed to address the challenges manufacturers face.

"Lead-free applications typically require higher processing temperatures, but many of the components in the assembly process can tolerate those higher temperatures. Our F 498 solder paste is the answer to that issue," said Mark Challingsworth, Global Head of Marketing for Heraeus Electronics.

Developed to help manufacturers address the competitive cost challenges of the market while delivering superior performance, Heraeus F 498 lead-free, low-temperature solder paste is specifically designed for step-soldering when a second, lower temperature reflow process is needed. It is ideal for temperature-sensitive components as well as low-melting, flexible circuitry used in smart devices. It offers excellent wetting performance on iSn and NiAu, provides extremely low beading and is RoHS compliant. Additionally, the paste supports the switch from wave-soldering to SMT with higher product quality, and operating temperatures up to 110°C are achievable.

The F 498 paste also delivers reduced energy consumption in the reflow process due to lower reflow temperature and less requirements for production floor and PCB cooling. In a high-volume factory, low-temperature solding can utilize a single-pass process, producing significant savings in direct operational costs in electrical usage and CO2 emission reduction.

Challingsworth added, "The F 498 solder paste is a win-win solution for manufacturers using a single-pass process. It can lower per-component costs without sacrificing reliability and joint strength. Further, manufacturers can increase the lifetime of their equipment as well as reduction in associated maintenance costs, since longer maintenance periods will be possible due to reduced contamination of equipment."