Polyteknik AS

Polyteknik AS is an innovative technology based company with more than twenty years in business. An excellent platform of technology, a global reference list, and highly skilled personnel makes Polyteknik AS an appreciated partner on deposition technlogy.

Our deposition systems are designed for production and R&D facilities within the semicon, MEMS and electronic industries. We supply high quality PVD systems covering DC/RF/HIPIMS sputtering, e-beam deposition, thermal evaporation, organic deposition (OLED/OPV)

It is a single wafer process module including an electrostatic chuck (ESC) with backside gas cooling and a special protection ring for the wafer edge. The chuck is placed on a moving stage that can both rotate (0-40 rpm) and tilt (0-180°) the substrate during deposition – providing you with the full package for exploring the GLAD parameters and creating the desired film properties. To increase throughput, it is equipped with a special engineered 12x60cc crucible.

The module however also brings several benefits for more traditional ebeam evaporation processes like multilayer metallization and lift-off processes. Due to the automated handling directly from cassette it is fully compliant with strict CMOS cleanroom conditions and loading of wafers is well known to any operator. The cassette loading, a very small footprint combined with efficient backside gas cooling makes is an excellent choice also for medium volume liftoff processes.

As an alternative to the single wafer GLAD process module we offer a batch process (5pcs 200mm wafers). Connected to the Flextura PVD Cluster is a very cost effective solution for a cassette-to-cassette evaporation process with an absolute minimum footprint.

*GLAD: Glancing angle deposition (GLAD) is a process where deposition, typically evaporation, is done under a controlled/varied angle while rotating the wafer. Depending on materials and process conditions a number of different and well-controlled nanostructures can be achieved, the structures can have zig-zig, helices, spring- or rod-like forms. This provides possibilities for creating thin film layers with very unique properties for use in especially MEMS, imaging and sensor applications.

Products

Flextura PVD

The Flextura platform is best described as Flexible Production | Flexible Processes | Flexible Investment. From a single chamber with evaporation or sputtering processes as a standalone system to an efficient cluster tool with multiple advanced processes.... More Info Less Info

Volume Production Applications

High yield production by PVD: Metallisation, TCOs, AlN, optical reflectors and absorbers.

Market leading process software technology for accurate real time control of deposition.

Process Modules:

High temperature deposition chamber up to 1000°C

Increased layer quality

Epitaxial growth

HiPIMS sputtering (highly ionised) chamber

High aspect ratio metallisation

Layer property tuning

Direct magnetron sputtering (DC, RF and pDC)

Multi-magnetron chamber (Co-sputtering)

Ebeam evaporation

RF/ICP etch, degass, cooling, alignment station

Single wafer or batch processing directly from cassette to casette

Flexible investment – scalable capacity

The Flextura PVD platform is truly almost Plug&Play and you may add process modules as your need for capacity or new processes increase. The modules function as stand alone units – seeFlextura Sputter or Flextura Evaporator – which may be connected to a Flextura PVD Cluster.

The Flextura way of thinking is giving you the possibility to let the capital investment follow increasing demands of your facility.