ELECTROSTATIC DISCHARGE PROTECTION CIRCUIT - A ESD protection circuit includes: a first clamp connected between a first power line and a ground line; a second clamp connected between the ground line and a second power line; a first output buffer connected between the first power line and the ground line, and providing a first operating voltage; a second output buffer connected between the ground line and the second power line, and providing a second operating voltage; a first switch unit configured to transfer the first operating voltage to an I/O pad; a second switch unit configured to transfer the second operating voltage to the I/O pad; a first transfer unit comprising one or more diodes connected in series between the first power line and the I/O pad; and a second transfer unit comprising one or more diodes connected in series between the I/O pad and the second power line.

2010-06-24

20100157495

CIRCUITS AND METHODS FOR PROTECTION OF BATTERY MODULES - A circuit includes multiple battery modules and protection circuits respectively coupled to the battery modules. Each protection circuit includes a controller and a shunt circuit. The controller is coupled to one of the battery modules and detects a fault associated with the battery module. The shunt circuit is coupled to the battery module and the controller, and shunts a current around the battery module if the fault associated with the battery module is detected by the controller.

2010-06-24

20100157496

ESD protection device and composite electronic component of the same - The present invention provides an ESD protection device and the like having improved durability against repeated use. An ESD protection device includes a base having an insulating surface, electrodes disposed on the insulating surface and facing but spaced apart from each other, and a functional layer 4-disposed on at least between the electrodes. The electrodes have a multistage structure in which a gap between the electrodes is narrower toward the base.

2010-06-24

20100157497

FIELD CONFIGURABLE RATING PLUG USING COMMUNICATION AND CONTROL SIGNAL - A circuit breaker apparatus is provided and includes a trip mechanism which is coupled to an electrical circuit and which is configured to interrupt an operation of the electrical circuit when the trip mechanism is actuated, an electronic trip unit in signal communication with and configured to actuate the trip mechanism when pre-selected conditions are satisfied, and a rating plug coupled to the electronic trip unit and configured to operate in a first mode in response to a receipt of a transmitted control signal at the rating plug, and to otherwise operate in a second mode, the first and second modes being respectively associated with first and second ones of the pre-selected conditions to be correspondingly transmitted to the electronic trip unit by which the electronic trip unit determines whether to actuate the trip mechanism.

2010-06-24

20100157498

Current Detection and Limiting Method and Apparatus - An apparatus for detecting and controlling current. A current detector for generating a first value that represents an amount of current being delivered to a device. A current limit circuit for generating a second value that represents a maximum permitted current level from a current source. A current controller for controlling the amount of current drawn by the device if the first value exceeds the second value.

COMPUTER SYSTEM AND POWER CONTROL APPARATUS THEREOF - A power control apparatus is disclosed. The power control apparatus includes a temperature sensor, a first voltage converter, an over-temperature protection, a reset unit and a second voltage converter. The temperature sensor is for sensing a measured temperature to output a sensing signal. The first voltage converter converts the power voltage of a computer system into a first voltage. The over-temperature protection unit receives the first voltage and decides whether or not outputting the first voltage according to the sensing signal. When the reset unit has received the first voltage from the over-temperature protection unit, the reset unit decides whether or not to produce a reset signal according to the level of the power voltage. The second voltage converter is for producing a start signal to enable the embedded controller according to the reset signal.

System for decoupling a power source from a load - A relay switch decoupler is disclosed. The relay switch decoupler may include a first contact, and a second contact selectively coupled to the first contact. The relay switch decoupler may further include an insulating decoupler situated proximate to the first contact and the second contact. The relay switch decoupler may further include an actuator coupled to the insulating decoupler and configured to cause the insulating decoupler to decouple the first contact from the second contact in response to a control signal.

2010-06-24

20100157503

Fine Electrode Body, Ion Generator Using Same and Neutralization Apparatus - Disclosed is a fine electrode body which is good in ion generation efficiency, maintenancability and handleability, and enables to reduce cost and the required installation space. Also disclosed are an ion generator using such a fine electrode body and a neutralization apparatus. Specifically disclosed is a fine electrode body wherein a discharge electrode, which is composed of a linear conductive member having a plurality of fine projections, and an induction electrode, which is composed of a linear conductive member arranged opposite to the discharge electrode, are arranged on a dielectric body. One or more of such fine electrode bodies are arranged on a sheet-like or film-like supporting body. Also specifically disclosed are an ion generator using such a fine electrode body and a neutralization apparatus.

2010-06-24

20100157504

ELECTROSTATIC BLOWER SYSTEMS - Embodiments of electrostatic blower system for use in computer systems or other electronic device, e.g., in inkjet printers for cooling or drying operations, are disclosed. An exemplary method may include arranging a plurality of electrostatic blowers together to increase output pressure. The method may also include positioning the arranged electrostatic blowers directly adjacent a point of use in a printer device. The method may also include directing and accelerating airflow using a corona discharge in each of the plurality of electrostatic blowers for cooling or drying operations in the printer device.

2010-06-24

20100157505

Multilayer Electrical Component - A multilayer electrical component is presented having at least one base body, which includes a stack of dielectric layers and electrode layers arranged one upon the other, wherein the multilayer component additionally has a resistor and a decoupling layer, wherein the decoupling layer chemically isolates the resistor from at least one portion of a multilayer element.

2010-06-24

20100157506

MULTILAYER CAPACITOR - Each of second terminal portions of a first terminal electrode has a wide part a width of which is larger than a first lead width of lead portions in each first internal electrode, and a narrow part a width of which decreases from the wide part toward the second terminal electrode and toward the first or second side face side. In a multilayer capacitor, the wide part causes an electric current to flow in the lead portions of the first internal electrodes in a direction opposite to that of an electric current flowing in the first terminal electrode, so as to cancel magnetic field thereof each other and thereby reduce ESL, and the narrow part prevents a solder bridge from occurring between the first terminal electrode and the second terminal electrode in a work of mounting the terminal electrodes of the multilayer capacitor on a circuit board or the like.

2010-06-24

20100157507

ELECTRONIC COMPONENT AND PRODUCING METHOD THEREOF - A region where a plating film constituting an external electrode is formed can be accurately controlled in an electronic component in which the external electrode is formed by directly plating a particular region in a surface of a component body. In a component body, a bump is provided in a position in which a region where an external electrode should be formed is partitioned. In a plating process, growth of the plating film constituting the external electrode is substantially stopped or delayed in the bump. As a result, a termination point of the growth of the plating film constituting the external electrode can be accurately controlled in the position of the bump.

2010-06-24

20100157508

METHOD OF MANUFACTURING COMPLEX OXIDE NANO PARTICLES AND COMPLEX OXIDE NANO PARTICLES MANUFACTURED BY THE SAME - A method of manufacturing complex oxide nano particles includes preparing a mixed solution including at least one metal salt selected from the group consisting of aluminum salt, manganese salt and barium salt, impregnating an organic polymer having nano-sized pores with the mixed solution, and calcining the organic polymer impregnated with the mixed solution. Accordingly, complex oxides with particle sizes on the nanoscale can be prepared, and the kind and composition ratio of metal elements contained in the complex oxides can be facilitated. Also, a multilayer ceramic capacitor including the complex metal oxides manufactured by this method can ensure a super slim profile and high capacity.

2010-06-24

20100157509

High Temperature Boron Oxynitride Capacitor - A method for storing energy in a capacitor includes connecting a first conductor to a first electrode and a second conductor to a second electrode. The second electrode is separated from the first electrode by a dielectric layer. The dielectric layer includes a layer of boron oxynitride, BON. The conductivity of the dielectric layer is lower than the conductivity of the first electrode or the second electrode. A voltage of at least 5 volts is applied between the first electrode and the second electrode by means of the first and second conductors.

2010-06-24

20100157510

SOLID ELECTROLYTIC CAPACITOR - A solid electrolytic capacitor includes a capacitor element including: an anode body; a dielectric coating film deposited on a surface of the anode body; a conductive polymer layer deposited on the dielectric coating film; and a mixture layer deposited on the conductive polymer layer and containing a conductive matrix and carbon nanotubes, the anode body, the dielectric coating film, the conductive polymer layer and the mixture layer being deposited in sequence.

2010-06-24

20100157511

ADAPTER RETROFIT BY REPLACEMENT COMPONENT - An appliance having various mechanical components that can be replaced with a component that provides power or data to the appliance. The component being replaced includes handles, trim pieces, face plates, or the like. The source of power to the new mechanical component comes from an external source which can also provide data.

2010-06-24

20100157512

MOTOR CONTROL CENTER SUBUNIT HAVING MOVEABLE LINE CONTACTS AND METHOD OF MANUFACTURE - A system and method for connecting supply power to motor control components includes use of a motor control center subunit with moveable supply power contacts. After a motor control center subunit is secured into a motor control center compartment, the supply power contacts may be advanced to engage supply power buses. For disconnection, the supply power contacts may be refracted and isolated from the buses before physical removal of the subunit.

2010-06-24

20100157513

SUPPORT STRUCTURE FOR DISPLAY DEVICE AND DISPLAY DEVICE USING SAME - A support structure for supporting a display panel includes a rotatable base, a first supporting assembly, a second supporting assembly, and a connecting portion. The first supporting assembly includes a first sleeve and a first connector moveably coupled to the first sleeve along a first direction. The first sleeve is fixed to the rotatable base. The second supporting assembly includes a second sleeve and a second connector moveably coupled to the second sleeve along a second direction. The second direction is perpendicular to the first direction. The second connector is slidably coupled to the display panel along a third direction. The third direction is perpendicular to a plane cooperatively defined by the first direction and the second direction. The connecting portion fixedly connects the first connector to the second sleeve. A display panel using the support structure is also provided.

2010-06-24

20100157514

DISPLAY APPARATUS AND DISPLAY MODULE INCLUDING THE SAME - A display apparatus includes a substrate including an effective display region and a non-effective display region, and a sealing member covering at least the effective display region. A colored member is provided from a region on the sealing member over the non-effective display region to a region on the substrate outside the sealing member.

2010-06-24

20100157515

PORTABLE ELECTRONIC DEVICE WITH AN IMPACT-PROTECTION FUNCTION - A portable electronic device includes a housing, a gasbag module installed on the housing in an expansible manner, and a pressure module connected to the gasbag module for conducting air outside the gasbag module into the gasbag module so as to expand the gasbag module.

2010-06-24

20100157516

PHYSICAL INFRASTRUCTURE MANAGEMENT SYSTEM - Systems and methods of the present invention allow for the discovery of physical location information about network assets and the delivery of that information to network administrators. In addition, environmental and other information about network asset locations can be provided to an administrator. Intelligent patch panels and power outlet units are installed in network cabinets to facilitate the acquisition and reporting of physical infrastructure information, including information about network resource availability.

2010-06-24

20100157517

Apparatus with Sliding Housing Parts - An apparatus with a central housing, a top housing slidably movable relative to the central housing and a bottom housing slidably movable relative to the central housing is provided. The central housing is provided with an area for user input. A first portion of the area for user input is concealed by the top housing when it is in its retracted position and a second portion of the area for user input is concealed by the bottom housing when it is in its retracted position. The first portion of the area for user input is unconcealed when the top housing is in its extended position and the second portion of the area for user input is unconcealed when the bottom housing is in its extended position. The top housing and the optimum housing move in unison between their retracted and extended positions.

2010-06-24

20100157518

MULTIPLE-FOLD PORTABLE ELECTRONIC DEVICE - A multiple-fold portable electronic device is provided. The portable electronic device in one embodiment includes a first, second and third planar sections. The first and second planar section are connected by a first joint and foldable in relation to each other The second and third planar sections are connected by a second joint and foldable in relation to each other. Each planar section can include an input device or an output device or both.

2010-06-24

20100157519

PERIPHERAL DEVICE CARRIER - Peripheral device carrier. At least some of the illustrative embodiments are systems including a screen portion with a display device viewable on one surface, a base portion hinged to the screen portion and having a keyboard, a peripheral device carrier mounted at least partially within an internal volume defined by the base portion, and a peripheral coupled within the carrier. The peripheral device carrier includes a top wall and a bottom wall coupled by two side walls, and the walls define a volume with a quadrilateral cross-section. The walls comprise a metallic material, and the walls are seamless along the quadrilateral cross-section.

2010-06-24

20100157520

MODULAR STORAGE SYSTEM FOR STORING A DISK ARRAY - A modular storage system is provided for storing a disk array consisting of multiple hard disks. Each hard disk is provided with a terminal set. The modular storage system includes a casing having a plurality of disk compartments for receiving the hard disks respectively, a front end defining a front opening and a rear end defining a rear opening; a rear cover for covering the rear opening of the casing; and a plurality of connectors mounted on the rear cover via a coupling mechanism so that each of the connectors is aligned with a respective one of the disk compartments. Once the hard disks are installed respectively in the disk compartments, the terminal set of each of the hard disks is coupled electrically to a respective one of the connectors on the rear cover.

2010-06-24

20100157521

Blocking device adapted in a blade server and blade server - A blocking device adapted in a blade server and a blade server are provided. The blade server comprises a chassis and a plurality of blocking devices. The chassis comprises an opening, a plurality of connecting interfaces and a plurality of convection holes. The connecting interfaces are placed in parallel to connect a CPU blade respectively. Each convection holes are corresponding to a connecting interface. Each of the blocking devices is corresponding to a convection hole and comprises two blocking plates and a pushing means. The two blocking plates blocks the convection hole and comprises a hinge and a torsion spring. When a CPU blade is connected to the connecting interface, the pushing means displaces to make the two blocking plates rotate about the hinge to expose the convection hole. When the CPU blade is removed, the torsion springs make the two blocking plates rotate back to block the convection hole.

2010-06-24

20100157522

Alternative Form Factor Computing Device with Cycling Air Flow - Various apparatus and methods of removing heat from devices in a computing device. In one aspect, a method of removing heat from a semiconductor chip in an enclosure of a computing device is provided. Heat from the semiconductor chip is transferred using a heat sink that is thermally coupled to the semiconductor chip. Air is moved using an air mover positioned in the enclosure. The air mover is operable to move the air past the heat sink and recycle at least a portion of the air to again pass the heat sink.

2010-06-24

20100157523

ELECTRONIC APPARATUS AND METHOD FOR PRODUCING AN ELECTRONIC APPARATUS - An electronic apparatus includes an accommodation plate, a first exterior member, and a second exterior member. The accommodation plate accommodates a plurality of components except at least a keyboard component. The first exterior member holds the keyboard component and constitutes a first exterior surface of the electronic apparatus. The second exterior member constitutes a second exterior surface as an opposite surface of the first exterior surface. The accommodation plate is disposed between the first exterior member and the second exterior member.

2010-06-24

20100157524

WALL MOUNTED SYSTEM WITH INSERTABLE COMPUTING APPARATUS - The present invention is directed to provide a computing system comprises plurality of apparatii mounted on the wall or floor adjacent to or embedded inside the LAN jack or a main power outlet. The apparatii are connected at the back side through Ethernet cable, optical fiber or main lines to the building LAN and connected at the front side through cables or wirelessly to display, keyboard, mouse or other peripheral devices. In a typical embodiment of the present invention power to the computing apparatus is supplied through the LAN cable. Another embodiment of the present invention utilizes a wall or floor mounted housing part comprising of an integrated LAN connector. This common housing enables easy installation of the said computing apparatus module and plurality of other compatible devices that may be plugged into that same housing.

2010-06-24

20100157525

PHASE CHANGE MATERIAL COOLING SYSTEM - A cooling system may comprise an array of plates, an array of channels, a conduit system, and a phase change material. The array of channels may have a number of a first type of channels alternating with a number of a second type of channels. The conduit system may be capable of circulating coolant through the number of the first type of channels. The phase change material may be located within the number of the second type of channels.

2010-06-24

20100157526

Low cost anufacturing of micro-channel heatsink - A cooling device includes a ceramic substrate with a metal layer bonded to an outer planar surface. The cooling device also includes a channel layer bonded to an opposite side of the ceramic substrate and a manifold layer bonded to an outer surface of the channel layer. The substrate layers are bonded together using a high temperature process such as brazing to form a single substrate assembly. A plenum housing is bonded to the single substrate assembly via a low temperature bonding process such as adhesive bonding and is configured to provide extended manifold layer inlet and outlet ports.

2010-06-24

20100157527

High-Power Ultracapacitor Energy Storage Pack and Method of Use - In an energy storage cell pack including at least one energy storage cell that radiates heat in a longitudinal axial direction outwards, towards opposite electrically conductive and heat conductive terminals, a terminal heat sink includes a receiving section for structurally receiving a terminal of the opposite electrically conductive and heat conductive terminals, and more than one heat conductive cooling fin radiating outwardly from the receiving section, wherein the more than one cooling fin radiates outwardly from the terminal when the receiving section structurally receives the terminal for dissipating heat from the terminal to cool the at least one energy storage cell.

2010-06-24

20100157528

Secure transparent enclosure for communication device - An enclosure comprises first and second sections formed of a transparent material, a plurality of wall sections, a plurality of vent holes, a hinge, a cable access and a lock. The wall sections are joined to the first section to form the enclosure. The vent holes are formed in the wall sections to provide thermal flow through the enclosure. The hinge connects the second section to one of the plurality of wall sections to form a door in the enclosure. The cable access is located to allow authorized power and data connections within the enclosure when the door is in an open position, and sized to prevent unauthorized data connections within the enclosure when the door is in a closed position. The lock secures the enclosure by locking the door in the closed position.

2010-06-24

20100157529

Image reading device - An image reading device, and more particularly an image reading device having a cooler capable of preventing introduction of impurities and reducing vibration and noise. The image reading device includes a body having a reading unit, and a cooler disposed in the body cooling the reading unit. The cooler includes a housing, a cooling unit disposed in the body and moving air into the body, a filter member disposed apart from the cooling unit and removing dust contained in the air, and a damper member having one side supported by the filter member and the other side supported by the cooling unit.

2010-06-24

20100157530

ELECTRONIC DEVICE WITH HEAT DISSIPATION MECHANISM - An electronic device with a heat dissipation mechanism includes a main body, at least one supporting member, at least one driving device, a temperature sensor, and a controller. The main body defines a plurality of heat dissipation holes and at least one through hole. The heat dissipation holes are configured for dissipating heat of the electronic device. The supporting member passes through the through hole, and one end of the supporting member protrudes from the bottom of the main body. The driving device is configured for driving the supporting member to move along its axis, causing the electronic device to be kept in a flat state or in an inclined state. The temperature sensor is for sensing the temperature of the electronic device. The controller is for driving the driving device, causing the supporting member to move a predetermined distance along its axis, according to the sensed temperature.

2010-06-24

20100157531

Air Cooling for a Phased Array Radar - In certain embodiments, a structure for electronic components includes a baseplate having a substantially planar shape. The baseplate defines one or more openings allowing air flow. The structure includes a frame coupled to the baseplate. The frame includes a planar support with a substantially planar shape that is substantially parallel to the baseplate. Then planar support and baseplate at least partially defines one or more plenums. The planar support is also configured to support one or more transmit/receive integrated microwave modules. The frame also includes a plurality of frame supports that define one or more channels for air flow. Each channel corresponds to one of the plenums. Additionally, the frame includes a ventilated panel with a surface defining a plurality of air inlets. The air inlets allow air into one of the one or more plenums. Also, the frame includes one or more thermal interfaces configured to dissipate heat.

2010-06-24

20100157532

ENERGY STORAGE PACK COOLING SYSTEM AND METHOD - An energy storage pack cooling system including upper and lower respective terminal heat sinks thermally connected to respective upper and lower terminals of energy storage cells above and below upper and lower ends of an enclosure of an energy storage cell pack; and a blower and cooling assembly that circulates a heat transfer fluid past the upper and lower respective terminal heat sinks outside of the enclosure to cool the energy storage cells without circulating the heat transfer fluid past energy storage cell bodies of the energy storage cells enclosed within the enclosure.

2010-06-24

20100157533

HEAT-TRANSPORTING DEVICE, ELECTRONIC APPARATUS, AND METHOD OF PRODUCING A HEAT-TRANSPORTING DEVICE - A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, and a liquid-phase flow path. The working fluid transports heat using a phase change. The vessel seals in the working fluid. The vapor-phase flow path causes the working fluid in a vapor phase to circulate inside the vessel. The liquid-phase flow path includes a laminated body and causes the working fluid in a liquid phase to circulate inside the vessel, the laminated body including a first mesh member and a second mesh member and being formed such that the first mesh member and the second mesh member are laminated while weaving directions thereof differ relatively.

2010-06-24

20100157534

HEAT-TRANSPORTING DEVICE AND ELECTRONIC APPARATUS - A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, and a liquid-phase flow path. The working fluid transports heat using a phase change. The vessel seals in the working fluid. The vapor-phase flow path includes a first mesh member and causes the working fluid in a vapor phase to circulate inside the vessel, the first mesh member including a through-hole larger than a mesh thereof. The liquid-phase flow path causes the working fluid in a liquid phase to circulate inside the vessel.

2010-06-24

20100157535

HEAT-TRANSPORTING DEVICE AND ELECTRONIC APPARATUS - A heat-transporting device includes a working fluid, a vessel, a vapor-phase flow path, a liquid-phase flow path, and an intermediate layer. The working fluid transports heat using a phase change. The vessel seals in the working fluid. The vapor-phase flow path causes the working fluid in a vapor phase to circulate inside the vessel. The liquid-phase flow path includes a first mesh member having a first mesh number and causes the working fluid in a liquid phase to circulate inside the vessel. The intermediate layer includes a second mesh member and is interposed between the liquid-phase flow path and the vapor-phase flow path, the second mesh member being laminated on the first mesh member and having a second mesh number smaller than the first mesh number.

2010-06-24

20100157536

HEAT RADIATING MEMBER MOUNTING STRUCTURE - A heat radiating member mounting structure for enabling multiple heat radiating members to be fastened together in a stack without tools is disclosed. Each heat radiating member has convex portions and lugs formed on each of two upright side flanges at two sides of a flat base thereof such that multiple heat radiating members can be fastened together by means of engaging protruding portions of the lugs of one heat radiating member into locating grooves in the convex portions of another heat radiating member.

2010-06-24

20100157537

FIN-TYPE HEAT SINK AND ELECTRONIC DEVICE USING SAME - A heat sink includes two heat spreaders spaced from each other and a heat dissipation fin disposed and connected between the two heat spreaders. The heat dissipation fin includes a plurality of hollow tubular heat dissipation units arranged linearly from one of the heat spreaders to the other one of the heat spreaders. The heat dissipation units are connected together with their axes along length directions thereof being parallel to each other. Each of the heat dissipation units can resiliently deform to change a distance between the two heat spreaders. The present disclosure also discloses an electronic device incorporating such a heat sink.

2010-06-24

20100157538

THERMAL INTERFACE MATERIAL AND METHOD OF USING THE SAME AND ELECTRONIC ASSEMBLY HAVING THE SAME - An electronic assembly includes a heat source having a maximum operating temperature, a heat dissipating device, a thermal interface material sandwiched between the heat source and the heat dissipating device. The thermal interface material includes a base and a plurality of first thermally conductive particles dispersed in the base. The first thermally conductive particles have a size monotonically changing from a first size less than 100 nanometers and a first melting temperature below the maximum operating temperature, to a second size larger than 100 nanometers and a second melting temperature above the maximum operating temperature when the heat source operates at a temperature above the first melting temperature and at or below the maximum operating temperature.

FIN-TYPE HEAT SINK AND ELECTRONIC DEVICE USING SAME - A heat sink includes two heat spreaders spaced from each other and a plurality of heat dissipation fins connected between the two heat spreaders. The heat dissipation fin is wave-shaped from one of the heat spreaders to the other one of the heat spreaders. The heat dissipation fins are spaced from each other. When a force is applied to two heat spreaders of the heat sink, the heat dissipation fin is resiliently deformed to change a distance between the two heat spreaders. The present disclosure also discloses an electronic device incorporating the heat sink and the heat dissipation fin.

2010-06-24

20100157541

HEAT SINK AND ELECTRONIC DEVICE USING SAME - An electronic device includes a shell, an electronic component received in the shell, and a heat sink arranged between the electronic component and the shell. The heat sink includes a first heat spreader attaching to the electronic component, a second heat spreader spaced from the first heat spreader, and a plurality of fins between the first and second heat spreaders. Each fin includes a pair of contacting portions, a pair of bending portions and a connecting portion each of which being flat. The contacting portions are respectively connected to the two heat spreaders. The bending portions respectively extend from the contacting portions towards each other. Each bending portion forms a rear end adjacent to the other bending portion. The connecting portion interconnects the rear ends of the bending portions at opposite ends thereof.

2010-06-24

20100157542

POWER DEVICE PACKAGE HAVING ENHANCED HEAT DISSIPATION - A power device package controls heat generation of a power device using a semi-permanent metal-insulator transition (MIT) device instead of a fuse, and emits heat generated by the power device through a small-sized heat sink provided only in one region on the power device, thereby ensuring excellent dissipation of heat. Therefore, the power device package can be usefully applied to any electric/electronic circuit that uses a power device.

2010-06-24

20100157543

TELEPHONY AND DIGITAL MEDIA SERVICES DEVICE - An electronic device includes a housing, a printed circuit board, a first heat sink and a second heat sink. The printed circuit board is disposed internal to the housing and supports at least one integrated circuit (IC) chip. The first heat sink is also disposed internal to the housing and is thermally connected to the at least one IC chip. The second heat sink is connected to the housing such that at least a portion thereof is externally disposed to the housing. The second heat sink is thermally connected to the first heat sink via an aperture in the housing.

2010-06-24

20100157544

ELECTROMAGNETIC SHIELDING DEVICE WITH HEAT DISSIPATING FUNCTION - An electromagnetic shielding device with a heat dissipating function for shielding at least one electronic element on a circuit board is provided. The electromagnetic shielding device includes a frame, a cover, and a heat dissipating element. The frame is disposed on the circuit board and surrounds the electronic element, and the frame is one-piece and seamless. The cover has a top portion and a side portion bent from borders of the top portion. The heat dissipating element is disposed on the top portion. The top portion of the cover is connected to borders of the frame, and the side portion is tightly combined with the frame so that the cover, the frame and the circuit board form a shielding space to surround the electronic element.

2010-06-24

20100157545

INTERFERENCE SHIELDED ELECTRONICS MODULE AND METHOD FOR PROVIDING THE SAME - An interference shielded, for example a RFI and/or EMI shielded, for an electronics module which forms a contact with at least one edge zone of a circuit board, is provided. The contact functions in the electronics module as a ground. The circuit board includes an outermost electrically conductive layer providing the interference shield of the electronics module; at least one circuit card layer unit comprising electronics components and a wiring pattern embedded into a filling material of the circuit board layer; and encapsulating activation material layer. The activation material layer is advantageously a substrate layer or a resin layer, and which overlays above the topmost circuit board layer, and which is arranged into a space between the outermost layer and topmost circuit board layer to be therein conformingly against the inner surface of the outermost layer for isolating the electronic components and the wiring pattern from outermost layer.

2010-06-24

20100157546

Connecting a Plurality of Chassis Using a Rigid Connection - Connecting a plurality of chassis using a rigid connection. A first coupling element of a first chassis may be mated with a first rigid connection. The first coupling element may be positioned on an exterior housing of the first chassis. A second coupling element of a second chassis may be mated with the first rigid connection. The second coupling element may be positioned on an exterior housing of the second chassis. Connecting the first chassis and the second chassis may allow the first and second chassis to communicate.

2010-06-24

20100157547

ELECTRONIC DEVICE MODULE - An electronic device module comprises a carrier and first and second device regions. The first device region comprises a plurality of serially-connected devices deposited on the carrier, and the second device region is adjacent to the first device region and comprises a plurality of serially-connected devices. The voltage potential of the plurality of the serially-connected devices in the first device region is substantially the same as that of the plurality of the serially-connected devices in the second device region whereby damage due to short circuit of the adjacent plurality of serially-connected devices is avoided.

Image sensor module - A image sensor module having a double-sided flexible printing circuit board (FPCB) having a window formed; an image sensor attached on one side of the double-sided FPCB so as to cover the window; and at least one electric part attached on the other side of the double-sided FPCB having the image sensor attached thereto.

2010-06-24

20100157550

MEMORY CARD AND MEMORY CARD MANUFACTURING METHOD - A memory card includes a first circuit board, a first semiconductor chip mounted to a top face of the first circuit board with a part of its under face confronting the first circuit board, a second circuit board of which a top face is bonded to a under face of the first circuit board, a second semiconductor chip mounted to the top face of the second circuit board with at least a part of the second semiconductor chip confronting a part of another part other than the part of the under face of the first semiconductor chip, and a cover disposed over the top face of the second circuit board for covering the first semiconductor chip, the first circuit board and the second semiconductor chip.

2010-06-24

20100157551

SWITCH MODULE - A switch module comprising: a first body ; a first switching circuit contained within the first body; a first set of connector ports electrically coupled to the first switching circuit; a second body ; a second switching circuit contained within the second body; a second set of connector port electrically coupled to the second switching circuit; a plurality of first cables fixedly attached to and extending from the first body, each cable in the plurality of first cables having an USB connector plug; and a plurality of second cables fixedly attached to and extending from the second body, each cable in the plurality of second cables having a video connector plug; wherein the first switching circuit and the second switching circuit switch to connect each of the first set of connector ports to one of the plurality of first cables and the second set of connector port to one of the plurality of second cables, respectively.

2010-06-24

20100157552

INPUT/OUTPUT SYSTEMS AND DEVICES FOR USE WITH SUPERCONDUCTING DEVICES - Systems and devices for providing differential input/output communication with a superconducting device are described. Each differential I/O communication is electrically filtered using a respective tubular filter structure incorporating superconducting lumped element devices and high frequency dissipation by metal powder epoxy. A plurality of such tubular filter structures is arranged in a cryogenic, multi-tiered assembly further including structural/thermalization supports and a device sample holder assembly for securing a device sample, for example a superconducting quantum processor. The interface between the cryogenic tubular filter assembly and room temperature electronics is achieved using hermetically sealed vacuum feed-through structures designed to receive flexible printed circuit board cable.

2010-06-24

20100157553

Portable Electronic Device - Provided is a portable electronic device wherein breakage due to stress concentration at a portion of a housing in a connecting part side is suppressed. A second housing

2010-06-24

20100157554

FIXING MECHANISM CAPABLE OF REDUCING ELECTROMAGNETIC RADIATION INTERFERENCE - A fixing mechanism capable of reducing electromagnetic radiation interference includes a fixing component passing through a first hole on a circuit board and a second hole on a casing so as to fix the circuit board on the casing, and a conductive film covering the fixing component for contacting the circuit board and the casing so as to ground the circuit board via the casing.

2010-06-24

20100157555

Process to Allow Electrical and Mechanical Connection of an Electrical Device with a Face Equipped with Contact Pads - A method of manufacturing an electrical device that is electrically and mechanically connectable to another electrical device is presented. The electrical device includes a face equipped with contact pads. The method includes applying an adhesive layer on the face equipped with contact pads. The adhesive layer is composed of a substance with adhesive properties. The method further includes creating a plurality of openings through the adhesive layer over each contact pad, and growing electrolessly or electrochemically, small metal sticks in the areas where the openings have been created to form a plurality of conductive paths over each contact pad, the volume of which is defined by the openings.

2010-06-24

20100157556

Surface mounting lug terminal and method for mounting the same - A surface mounting lug terminal formed of a metallic plate having terminal leads and positioning projections can readily be positioned on a printed board with high precision by fitting the positioning projections into positioning cutouts formed in the printed board. The terminal leads of the surface mounting lug terminal can easily be soldered to land patterns on the printed board to secure the surface mounting lug terminal onto the printed board irrespective of the number of terminal leads. The surface mounting lug terminal can be reduced in size, thus to contribute miniaturization of electronic circuits.

2010-06-24

20100157557

CONDUCTIVE WIRE PATTERN AND METHOD OF MONITORING THE BONDING ERROR OF A FILM - A conductive line pattern of a pad area includes a plurality of terminals arranged side by side. Each terminal includes an opening portion with a side edge and a line portion connecting with the side edge of the corresponding opening portion. The relative position of each line portion and the corresponding opening portion varies according to the location of the terminal in the pad area.

2010-06-24

20100157558

Sensor device for occupant protection system - A sensor device includes a communication line having a high-level line and a low-level line, and printed wiring layers. The printed wiring layers are connected to the communication line so as to have a differential communication with an electronic control unit of an occupant protection system. First and second layers are ungrounded, and have a low-level conduction pattern connected to the low-level line and a circuit element having a standard corresponding to the low-level line. Third printed wiring layer is arranged between the first and second layers through insulations, and has a high-level conduction pattern connected to the high-level line.

2010-06-24

20100157559

PRINTED CIRCUIT BOARD AND METHOD FOR MOUNTING ELECTRONIC COMPONENTS - In a case where the first component and the third component are mountable on the first circuit board pattern of the first individual board and the second component is mountable on the second circuit board pattern of the first individual board, or in a case where the first component is mountable on the first circuit board pattern of the second individual board, and the second component and the third component are mountable on the second circuit board pattern of the second individual board, in the first and second individual boards, traces for the third component are provided so that electrical connections between the third component and the other components are identical between the case where the third component is mounted on the first circuit board pattern, and the case where the third component is mounted on the second circuit board pattern.

2010-06-24

20100157560

Wired circuit board and connection structure between wired circuit boards - A wired circuit board for electrically connecting a suspension board with circuit comprising a metal supporting layer, an insulating base layer, a conductive layer, and an insulating cover layer, and an external circuit, includes a first wired circuit board electrically connected with the suspension board with circuit; and a second wired circuit board for electrically connecting with the external circuit. The first wired circuit board and the second wired circuit board are electrically connected through a preamplifier. The first wired circuit board includes a first metal supporting layer; a first insulating base layer; a first conductive layer and a first insulating cover layer.

2010-06-24

20100157561

Holder for electrical component and electrical device including the holder and component - This holder includes a conductor metal part designed to be warmed for assembly of the electrical component on the metal part. It also includes a part made of synthetic material, jointed with the metal part, guaranteeing cohesion of the holder. This part made out of synthetic material contains a mass with a low melting point and a mass with a high melting point, inserted between the mass with a low melting point and the metal part. More specifically, the mass with the high melting point is made in a material with a melting point greater than the melting point of the mass with a low melting point.

2010-06-24

20100157562

SYSTEMS AND METHODS FOR AFFIXING A SILICON DEVICE TO A SUPPORT STRUCTURE - A plurality of ribbon suspenders affix a device to a support structure. Each ribbon suspender is defined by a thickness and a width that is greater than the thickness, and has a first connection portion affixed to the support structure, a second connection portion affixed to the device, and a support portion between the first and second connection portions. The support portion is elastic and flexes to accommodate thermal expansion and contraction of the support structure. A first bond affixes the first connection portion to the support structure and a second bond affixes the second connection portion to the device.

2010-06-24

20100157563

TWO PIECE WIRE BALE INDEPENDENT LOAD MECHANISM - Electronic assemblies are described. One embodiment includes a circuit board, a socket coupled to the circuit board, and a device positioned in the socket. The embodiment also includes a load mechanism including first and second components, the first component pivotally coupled to the circuit board, the first component including first and second lever arms and an axle region therebetween, the first component also including a load arm region extending from the axle region and adapted to transmit a load when a force is applied to the first component lever arms. The load mechanism also includes a second component pivotally coupled to the circuit board, the second component including first and second lever arms and an axle region therebetween, the second wire component also including a load arm region extending from the axle region and adapted to transmit a load when a force is applied to the second wire component lever arms. The first and second wire components are positioned so that when a force is applied to the first component lever arms, the first lever arm of the first component engages the first lever arm of the second component and applies a force thereto, and the second lever arm of the first component engages the second lever arm of the second component and applies a force thereto. Other embodiments are described and claimed.

2010-06-24

20100157564

ADJUSTMENT MODULE - An adjustment module includes a frame, a sliding member, at least one coiled spring, a pair of guide rails, and a supporting member. The frame includes a main plate. The at least one coiled spring includes an extending portion and a sleeved coiled portion. The guide rails are positioned on opposite sides of the frame. The supporting member is fixed on the frame and has at least one supporting surface. The sliding member is slidably positioned between the guide rails. The coiled portion of the at least one coiled spring is positioned on the at least one supporting surface. An end of the extending portion of the at least one coiled spring is fixed on the sliding member, and an axis of the coiled portion of the at least one coiled spring is substantially perpendicular to the main plate.

2010-06-24

20100157565

ELECTRONIC COMPONENT AND MANUFACTURING METHOD OF ELECTRONIC COMPONENT - A manufacturing method of electronic components includes forming a first insulation layer on a substrate, forming a plurality of passive elements on the first insulation layer, forming a second insulation layer on the passive elements, forming a plurality of conductor layers electrically connected to the respective passive elements, on the outer side of the second insulation layer to be exposed to an upper surface of each electronic component, and forming grooves between the electronic components including the respective passive elements to expose side surfaces of each electronic component and parts of the conductor layers from the side surfaces of each electronic component. The manufacturing method further including plating a plurality of external electrodes on the respective conductor layers exposed to the upper surface and the side surfaces of each electronic component, and cutting the substrate to completely separate into individual electronic components.

2010-06-24

20100157566

Electronic shield assembly and methods - A shield assembly useful in the attenuation of electronic noise or spurious electric signals. In one embodiment, the shielding assembly comprises a metallic component that is encapsulated with an electronic component to be shielded, such as an integrated circuit. A conductive coating is applied to an exterior surface of the encapsulated metallic and electronic components so that it is in contact with the metallic component. The metallic component is formed using a selective metal deposition process (e.g., electroforming) and a laser-cutting process that increase manufacturing efficiency and provide enhanced mechanical and structural features, including especially the ability to make the shield very thin, have a high degree of co planarity, and maintain a low profile for the shielded electronic component as a whole (i.e., add very little height to that of the electronic component). Methods of manufacturing and utilizing the shielding assembly in designs are also disclosed.

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - One aspect is a method of manufacturing a semiconductor device and semiconductor device. One embodiment provides a plurality of modules. Each of the modules includes a carrier and at least one semiconductor chip attached to the carrier. A dielectric layer is applied to the modules to form a workpiece. The dielectric layer is structured to open at least one of the semiconductor chips. The workpiece is singulated to obtain a plurality of devices.

2010-06-24

20100157569

METHOD OF IMAGING A SUBJECT USING A LIGHT DIFFUSION BALLOON - A method of using a light diffusion balloon to image a subject is shown and described. The balloon is inflated with a balloon gas that is lighter than air and is placed between a source of light such as the sun and a subject to be imaged. When inflated, the balloon has a length, width, and thickness, and the thickness is less than both the length and the width. The balloon gas has a molecular weight less than that of air, and in one example is helium.

2010-06-24

20100157570

ILLUMINATION LAMP AND ROTATABLE LIGHT-EMITTING MODULE THEREOF - An illumination lamp includes a mounting frame and at least a rotatable light-emitting module. The at least a rotatable light-emitting module includes at least one bracket with one end securely mounted on the mounting frame, a heat sink being pivotally connected with the other end of the at least one bracket, and a light source mounted on the heat sink.

2010-06-24

20100157571

ILLUMINATION DEVICE WITH SELECTIVE COLOR OUTPUT - An exemplary illumination device includes a light source and a light-pervious optical wavelength converting barrel. The light source is configured for emitting monochromatic light. The light-pervious optical wavelength converting barrel includes a plurality of optical wavelength converting regions. The optical wavelength converting regions are sequentially arranged to cooperatively form an accommodating space receiving the light source. In operation, the barrel is rotatable relative to the light source, such that each of the optical wavelength converting regions is capable of being selectively positioned to receive the light from the light source. Thereby, the illumination device emits light with a converted wavelength.

2010-06-24

20100157572

ILLUMINATING APPARATUS WITH PHOSPHOR FILMS - An exemplary illuminating apparatus includes a light source, a supporting member, a first film and a second film. The light source includes a substrate and a plurality of light emitting diode arranged on the substrate. The supporting member connected to the substrate. The supporting member includes a light emitting surface at a side thereof distant from the light emitting diodes. The first film and the second film attached to each other and arranged at the light emitting surface of the supporting member. The first film includes a first phosphor doped therein, and the second film includes a second phosphor doped therein. Each of the first phosphor and the second phosphor is capable of being excited by light emitted from the light-emitting diodes and converting a wavelength of the light into a desired wavelength.

2010-06-24

20100157573

Light source apparatus - A light source apparatus includes a first light emitter, a second light emitter, and a third light emitter. The first light emitter has a peak wavelength within the range from 600 nm to 660 nm and a wavelength range at half peak intensity wider than the range from 600 nm to 660 nm, the second light emitter has a peak wavelength within the range from 530 nm to 570 nm and a wavelength range at half peak intensity wider than the range from 530 nm to 570 nm, and the third light emitter which a peak wavelength is 420 nm-470 nm in a spectral power distribution thereof.

2010-06-24

20100157574

DISPLAY DEVICE - A display device includes a display panel displaying an image, a light source generating light, a light guide plate guiding the light and supplying the light to the display panel, a receiving container receiving the light source and the light guide plate, the receiving container including a sidewall portion adjacent to the light guide plate and a bottom portion extending from the sidewall portion, a photosensor coupled to the receiving container, the photosensor sensing the light, and a light receiving hole formed in the receiving container, the light receiving hole comprising a first end and a second end, the first end being closer to the light guide plate and the second end being closer to the photosensor, wherein a height of the first end is smaller than a thickness of the light guide plate, and the second end overlaps the photosensor.

ILLUMINATION APPARATUS FOR DISPLAY DEVICE, DISPLAY DEVICE USING THE SAME, AND TELEVISION RECEIVER APPARATUS COMPRISING THE DISPLAY DEVICE - In a backlight apparatus, laminated optical sheets are housed in a tray such that a wall portion thereof surrounds their circumferences so that the optical sheets receive light from fluorescent lights. Tips of one corner portion A of optical sheets preferably have a shape in which the tips are trimmed by line segments extending between two edges defining the corner portions. At the wall portion of the tray, an opposing surface is formed along the line segments of the corner portions so as to correspond to the shape of the corner portions having tips trimmed off. The opposing surface restrains the line segments.

2010-06-24

20100157577

BACKLIGHT AND DISPLAY - A backlight is provided for a transmissive spatial light modulator such as a liquid crystal device (

BEVERAGE CONTAINER ILLUMINATION DEVICE - A device for illuminating a beverage container, the beverage container having a substantially transparent side wall, a base and an indent configured within the base. The device includes a light source and, a power supply for activating the light source, the device sized to reside within the indent or upon a support surface to which the base is applied. The device causes the indent to be illuminated to such an extent that the illumination is visible through the substantially transparent side wall of the beverage container.

2010-06-24

20100157580

SUSPENSION BRACKET FOR LIGHTING FIXTURES - A suspension bracket for a lighting fixture of the type used in residential or commercial buildings. The bracket provides a center mounting point for a shade while allowing a lighting element to be positioned in the center of the fixture, rather than to the side of the shade mounting point.

2010-06-24

20100157581

FLASHLIGHT WITH CLIP INTERFACE - A lighting assembly is provided that includes a novel modular interface arrangement that allows the flashlight to be interfaced with a variety of different equipment or reconfigured in order to facilitate use for different functionality such as a marker light, a runway indicator light or a weapon mounted light.

2010-06-24

20100157582

MULTIPURPOSE WATERPROOF LIGHTING DEVICE WITH ELECTRONIC GLOW STICK - A lighting device comprises an elongated assembly forming a water-tight chamber adjacent a first end of the lighting device, where the first end includes a transparent face along a long axis of the elongated assembly. A lighting module, having a first light source and a second light source positioned on opposite ends of the lighting module, is positioned within the water-tight chamber so that the first light source is adjacent to and is configured to project light out the transparent face in a first direction along the long axis of the elongated assembly. The second light source is configured to illuminate along an elongated portion of the elongated assembly, where the elongated portion extends from the water-tight chamber in a second direction along the long axis of the elongated assembly opposite from the first direction, and out translucent circumferential sides of the elongated portion. A button on the module allows one to selectively alternate between the first and second light sources.

2010-06-24

20100157583

LED DEVICE AND LED LIGHTING APPARATUS - An LED device and an LED lighting apparatus using the same can include a casing including a cavity and at least one pair of LED chips including a first and second LED chips. The LED chips can be adjacently located in the cavity, and an encapsulating resin including a phosphor can be disposed in the cavity so as to encapsulate the LED chips. A light-emitting surface of the first LED chip can be covered with a transparent resin, and therefore color temperatures of light emitted from the first and second LED chips can be located on a substantially black body due to a difference between their distances to the encapsulating resin. Thus, the LED lighting apparatus using the LED device can selectively emit white light having a preferable color temperature that is close to a natural color between the color temperatures by adjusting current applied to the LED chips.

2010-06-24

20100157584

Light-emitting strip structure with light guiding effect - A light-emitting strip structure with light guiding effect, which is a hollow light guide strip body made of transparent material. The light guide strip body is formed with at least one axial internal chamber. Recessed/raised sections are formed on a wall of the internal chamber for changing light path. When a light source projects light into the internal chamber, the recessed/raised sections will deflect or reflect the projected light, whereby the light guide strip body can emit light outward. A color bar or a light reflection strip is implanted in the internal chamber. In addition, a light absorption material is sprayed on the wall of the internal chamber or a photosensitive gas is filled in the internal chamber. Accordingly, the light guide strip body can emit colorful light in various patterns so as to provide enhanced decorative or warning effect. The light guide strip body is flexible and antishock.

2010-06-24

20100157585

Organic Lighting Device and Lighting Equipment - An organic luminous means and an illumination device comprising such a luminous means are described. An optical display apparatus, emergency lighting, motor vehicle interior lighting, an item of furniture, a construction material, a glazing and a display comprising such a luminous means and, respectively, comprising an illumination device having such a luminous means are also described.

2010-06-24

20100157586

Illuminative module for emitting white light via mixing the primary colors with fourth color - Disclosed is an illuminative module for enhancing the white balance while reducing thermal drift and color spots. The illuminative module includes a substrate and light-emitting elements provided on the substrate to emitting light of the primary colors and a fourth color, respectively, so that the light of the primary colors is mixed with the light of the fourth color to provide white light.

LED STRING LIGHT - A light-emitting diode (LED) string light includes at least two conductive wires, a plurality of LED units, and a plurality of enclosures. The LED string light is characterized in that each of the LED units has leads inserted perpendicularly into the conductive wires to establish electrical connection therebetween and allow the bottom of the LED unit to abut against ends of the conductive wires. Each of the enclosures has two through holes formed therein for the conductive wires to pass through, respectively, and an upper end provided with an accommodating space for receiving and enclosing a lower portion of the LED unit and part of the conductive wires. Thus, the LED string light can be manufactured easily and efficiently with low labor cost.

2010-06-24

20100157589

ROTATING LIGHT - The present disclosure provides a lighting device that includes an array of LEDs arranged on a circuit board with a reflector that rotates relative to the LEDs to reflect the light in various directions. The reflector according to the present disclosure includes a compact construction that allows for effective light reflection. A related lighting system and method is also provided.

2010-06-24

20100157590

CONDENSING ELEMENT SYSTEMS AND METHODS THEREOF - A condensing element system and method thereof includes a first section for each of one or more condensing elements and a second section for each of the one or more condensing elements. The first section for each of one or more condensing elements provides substantially total internal reflection of light entering at a base of the first section. Each of the second sections is optically coupled to one of the first sections and has an output surface with one or more peaks and one or more troughs. The first and second sections for each of the condensing elements are each configured so a half-power angle of the light output from the second section is less than the half-power angle of the light entering the first section.

2010-06-24

20100157591

Flourescent Lamp Whose Ballast and Reflective Shade are Detachable From Each Other - A fluorescent lamp includes a reflective shade, a hollow base mounted on the reflective shade, a ballast detachably mounted on the base, at least one fluorescent tube detachably mounted on the ballast, and a mounting seat mounted on an opened end of the reflective shade and combined with the base to detachably clamp the reflective shade between the base and the mounting seat. Thus, the ballast is detachably mounted on the base, and the reflective shade is detachably mounted between the base and the mounting seat so that the ballast and the reflective shade are separated from each other and can be repaired and replaced individually.

2010-06-24

20100157592

LED LAMP - An LED lamp includes a heat sink, a plurality of LED modules and a reflector. The heat sink has a conical wall. The LED modules are attached to an inner surface of the wall. The reflector is engaged in the heat sink. The reflector has an outer surface facing and angled with the LED modules. Light generated by the LED modules is reflected by the outer surface of the reflector to radiate out of the LED lamp.

2010-06-24

20100157593

LED LAMP - An LED lamp includes a bracket, a supporting plate mounted on the bracket, and a plurality of LED modules mounted on the supporting plate. The bracket includes a bottom plate, two sidewalls and two engaging portions. The two sidewalls respectively connect to two opposite sides of the bottom plate and extend upwardly from the bottom plate. Two protruded portions respectively obliquely extend from inner surfaces of the two sidewalls to define two grooves therebelow, respectively. The supporting plate has two opposite sides respectively slidably received in the grooves. A bottom surface of the supporting plate thermally contacts with a top surface the bottom plate. The LED modules are mounted on a top surface of the supporting plate.