Focuses on the wire bonding process of chip-on-board (COB) and integrated circuit packaging in the U.S. Description of COB technologies; Use of ribbon bonding of gallium-arsenide devices in the radio frequency modules; Types of wire bonding.

Focuses on thermosonic wirebonding and the challenges it face in the integrated circuits (IC) industry. Uses of gold ball wirebonding; History of thermosonic wirebonding technology; Implications of interconnect development for wirebonding.

Presents information on the software analysis that has made possible capillary designs which improve wire bond quality. Details on the effects of capillary geometry; Details on Capdesign software; Challenges of bonding at reduced temperatures to wire bond integrity; Conclusion.