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A thermal pad and an electronic device comprising the thermal pad
includes a first heat conducting layer and a second heat conducting
layer. The first heat conducting layer is deformable under compression,
and a heat conduction capability of the first heat conducting layer in a
thickness direction of the first heat conducting layer is greater than a
heat conduction capability of the first heat conducting layer in a plane
direction of the first heat conducting layer. The second heat conducting
layer is not deformable under compression, and a heat conduction
capability of the second heat conducting layer in a plane direction of
the second heat conducting layer is greater than or equal to a heat
conduction capability of the second heat conducting layer in a thickness
direction of the second heat conducting layer.

1. A thermal pad for a heat emitting component, comprising: a first heat
conducting layer comprising a first surface and a second surface, wherein
the first heat conducting layer is deformable through compression,
wherein a first heat conduction capability in a first thickness direction
of the first heat conducting layer is greater than a second heat
conduction capability in a plane direction of the first heat conducting
layer, and wherein the first thickness direction of the first heat
conducting layer is perpendicular to the first planar direction of the
first heat conducting layer; and a second heat conducting layer
comprising a third surface and a fourth surface, wherein the second heat
conducting layer is not deformable through compression, wherein the third
surface of the second heat conducting layer is configured to contact an
exterior surface of the heat emitting component, wherein the fourth
surface of the second heat conducting layer is in contact with the first
surface of the first heat conducting layer, wherein a third heat
conduction capability in a second plane direction of the second heat
conducting layer is greater than or equal to a fourth heat conduction
capability in a second thickness direction of the second heat conducting
layer, wherein the third heat conduction capability is greater than or
equal to the first heat conduction capability, and wherein the second
thickness direction of the second heat conducting layer is perpendicular
to the second plane direction of the second heat conducting layer.

2. The thermal pad according to claim 1, wherein the first heat
conducting layer is deformable under a first pressure with a ratio of
compression to deformation from 5% to 90%, and wherein the first pressure
is in a range between 0 Newton (N) and 5000 N.

3. The thermal pad according to claim 2, wherein the second heat
conducting layer is not deformable under the first pressure, and wherein
a ratio of compression to deformation of the second heat conducting layer
is less than or equal to 5%.

4. The thermal pad according to claim 1, wherein a first thickness of the
first heat conducting layer is 0.2 millimeter (mm) to 5 mm and a second
thickness of the second heat conducting layer is 0.1 mm to 5 mm.

5. The thermal pad according to claim 1, further comprising a third heat
conducting layer configured to be disposed between the heat emitting
component and the second heat conducting layer, wherein a fifth surface
of the third heat conducting layer is in contact with the exterior
surface of the heat emitting component, wherein a sixth surface of the
third heat conducting layer is in contact with the third surface of the
second heat conducting layer, and wherein the third heat conducting layer
is configured to fill in a micro void on the exterior surface of the heat
emitting component.

6. The thermal pad according to claim 5, wherein a third thickness of the
third heat conducting layer is less than or equal to 0.2 mm, and wherein
the third heat conducting layer is either a prepreg or gel-like.

7. The thermal pad according to claim 1, wherein the first heat
conducting layer further comprises an organic matrix and a heat
conducting filler, and wherein the heat conducting filler is oriented in
the first thickness direction of the first heat conducting layer.

9. The thermal pad according to claim 1, wherein a material of the second
heat conducting layer comprises metal, graphite, or a combination of
metal and graphite.

10. The thermal pad according to claim 1, wherein the second surface of
the first heat conducting layer is in contact with a heat sink.

11. An electronic device, comprising: a thermal pad; and a heat emitting
component, wherein a surface of the thermal pad is in contact with an
exterior surface of the heat emitting component, wherein the thermal pad
is configured to dissipate heat generated by the heat emitting component,
and wherein the thermal pad comprises: a first heat conducting layer
comprising a first surface and a second surface, wherein the first heat
conducting layer is deformable through compression, wherein a first heat
conduction capability in a first thickness direction of the first heat
conducting layer is greater than a second heat conduction capability in a
first planar direction of the first heat conducting layer, and wherein
the first thickness direction of the first heat conducting layer is
perpendicular to the first plane direction of the first heat conducting
layer; and a second heat conducting layer comprising a third surface and
a fourth surface, wherein the third surface of the second heat conducting
layer is in contact with the exterior surface of the heat emitting
component, wherein the fourth surface of the second heat conducting layer
is in contact with the first surface of the first heat conducting layer,
wherein the second heat conducting layer is not deformable through
compression, wherein a third heat conduction capability in a second plane
direction of the second heat conducting layer is greater than or equal to
a fourth heat conduction capability in a. second thickness direction of
the second heat conducting layer, wherein the third heat conduction
capability in the second plane direction of the second heat conducting
layer is greater than or equal to the first heat conduction capability in
the first thickness direction of the first heat conducting layer, and
wherein the second thickness direction of the second heat conducting
layer is perpendicular to the second plane direction of the second heat
conducting layer.

12. The electronic device according to claim 11, wherein the first heat
conducting layer is deformable under a first pressure with a ratio of
compression to deformation of about 5% to 90%, and wherein the first
pressure is in a range between 0 Newton (N) and 5000 N.

13. The electronic device according to claim 12, wherein the second heat
conducting layer is not deformable under the first pressure, wherein a
ratio of compression to deformation of the second heat conducting layer
is less than or equal to 5%.

14. The electronic device according to claim 11, wherein a first
thickness of the first heat conducting layer is 0.2 millimeter (mm) to 5
mm and a second thickness of the second heat conducting layer is 0.1 mm
to 5 mm.

15. The electronic device according to claim 11, further comprising a
third heat conducting layer comprising a fifth surface and a sixth
surface, wherein the third heat conducting layer is configured to be
disposed between the heat emitting component and the second heat
conducting layer, wherein the fifth surface of the third heat conducting
layer is in contact with the exterior surface of the heat emitting
component, wherein the sixth surface of the third heat conducting layer
is in contact with the third surface of the second heat conducting layer,
and wherein the third heat conducting layer is configured to fill in a
micro void on the exterior surface of the heat emitting component.

16. The electronic device according to claim 15, wherein a third
thickness of the third heat conducting layer is less than or equal to 0.2
mm, and wherein the third heat conducting layer is either a prepreg or
gel-like.

17. The electronic device according to claim 11, wherein the first heat
conducting layer further comprises an organic matrix and a heat
conducting filler, and wherein the heat conducting filler is orientated
in the third thickness direction of the first heat conducting layer.

19. The thermal pad according to claim 7, wherein the heat conducting
filler comprises both a sheet-like heat conducting filler and a
fiber-like heat conducting filler.

Description

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is a continuation application of international
patent application number PCT/CN2016/073612 filed on Feb. 5, 2016, which
claims priority to Chinese patent application number 201510368581.9 filed
on Jun. 29, 2015. The disclosures of the aforementioned applications are
hereby incorporated by reference in their entireties.

TECHNICAL FIELD

[0002] Embodiments of the disclosure relate to the field of electronic
device technologies, and in particular, to a thermal pad and an
electronic device.

BACKGROUND

[0003] Heat generated when a chip in an electronic device works generally
needs to be dissipated to the outside by using a heat sink. From a
microscopic perspective, contact interfaces of the chip and the heat sink
are both rough, and a thermal pad needs to be made out of a thermal
interface material to fill between the contact interfaces of the chip and
the heat sink, to reduce contact thermal resistance. The thermal
interface material generally includes thermally conductive silicone, a
thermally conductive pad, thermal gel, a phase-change thermally
conductive material, a thermally conductive double-sided tape, and the
like. Thermal interface materials of different types with different
coefficients of thermal conductivity may be used according to different
application scenarios.

[0004] As a power density of a chip in an electronic device continuously
increases, for heat dissipation of a high-power chip, because a problem
of a partial hotspot occurs during packaging of the chip, and an existing
thermal pad has a high coefficient of thermal conductivity only in a
thickness direction, heat of the partial hotspot cannot be dissipated in
time, and a service life of the chip is affected.

SUMMARY

[0005] Embodiments of the disclosure provide a thermal pad and an
electronic device, to effectively relieve a heat dissipation difficulty
caused by a problem of a partial hotspot of a heat emitting component.

[0006] According to a first aspect, an embodiment of the disclosure
provides a thermal pad configured to perform heat dissipation for a heat
emitting component, where the thermal pad includes a first heat
conducting layer and a second heat conducting layer, a first surface of
the second heat conducting layer is in contact with a surface of the heat
emitting component, and a second surface of the second heat conducting
layer is in contact with a first surface of the first heat conducting
layer; the first heat conducting layer is a heat conducting layer that
can be compressed to deform, a heat conduction capability of the first
heat conducting layer in a thickness direction of the first heat
conducting layer is higher than a heat conduction capability of the first
heat conducting layer in a plane (also referred to as planar herein)
direction of the first heat conducting layer, and the thickness direction
of the first heat conducting layer is perpendicular to the planar
direction of the first heat conducting layer; and the second heat
conducting layer is a heat conducting layer that cannot be compressed to
deform, a heat conduction capability of the second heat conducting layer
in a planar direction of the second heat conducting layer is higher than
or equal to a heat conduction capability of the second heat conducting
layer in a thickness direction of the second heat conducting layer, the
heat conduction capability of the second heat conducting layer in the
planar direction of the second heat conducting layer is higher than or
equal to the heat conduction capability of the first heat conducting
layer in the thickness direction of the first heat conducting layer, and
the thickness direction of the second heat conducting layer is
perpendicular to the planar direction of the second heat conducting
layer.

[0007] With reference to the first aspect, in a first possible
implementation manner of the first aspect, that the first heat conducting
layer is a heat conducting layer that can be compressed to deform
specifically refers to a ratio of compression and deformation of the
first heat conducting layer under the action of first pressure is 5
percent (%) to 90%, where the first pressure ranges between 0 Newton (N)
and 5000 N.

[0008] With reference to the first possible implementation manner of the
first aspect, in a second possible implementation manner of the first
aspect, that the second heat conducting layer is a heat conducting layer
that cannot be compressed to deform specifically refers to a ratio of
compression and deformation of the second heat conducting layer under the
action of the first pressure is less than or equal to 5%.

[0009] With reference to the first aspect, the first possible
implementation manner of the first aspect, or the second possible
implementation manner of the first aspect, in a third possible
implementation manner of the first aspect, a thickness of the first heat
conducting layer is 0.2 mm to 5 mm, and a thickness of the second heat
conducting layer is 0.1 mm to 5 mm.

[0010] With reference to the first aspect or any one of the first possible
implementation manner of the first aspect to the third possible
implementation manner of the first aspect, in a fourth possible
implementation manner of the first aspect, the thermal pad further
includes a third heat conducting layer, where the third heat conducting
layer is disposed between the heat emitting component and the second heat
conducting layer, a first surface of the third heat conducting layer is
in contact with the surface of the heat emitting component, a second
surface of the third heat conducting layer is in contact with the first
surface of the second heat conducting layer, and the third heat
conducting layer is configured to fill in a micro void on the surface of
the heat emitting component.

[0011] With reference to the fourth possible implementation manner of the
first aspect, in a fifth possible implementation manner of the first
aspect, a thickness of the third heat conducting layer is less than or
equal to 0.2 mm, and the third heat conducting layer is a prepreg or the
third heat conducting layer is gel-like.

[0012] With reference to the first aspect or any one of the first to fifth
possible implementation manners of the first aspect, in a sixth possible
implementation manner of the first aspect, the first heat conducting
layer includes an organic matrix and a heat conducting filler, and the
heat conducting filler is orientated in the first heat conducting layer
in the thickness direction of the first heat conducting layer.

[0013] With reference to the sixth possible implementation manner of the
first aspect, in a seventh possible implementation manner of the first
aspect, the heat conducting filler includes a sheet-like heat conducting
filler or the heat conducting filler includes a fiber-like heat
conducting filler; or the heat conducting filler includes a sheet-like
heat conducting filler and a fiber-like heat conducting filler.

[0014] With reference to the first aspect or any one of the first to
seventh possible implementation manners of the first aspect, in an eighth
possible implementation manner of the first aspect, a material of the
second heat conducting layer includes at least one of a metal or a
graphite.

[0015] With reference to the first aspect or any one of the first to
eighth possible implementation manners of the first aspect, in a ninth
possible implementation manner of the first aspect, a second surface of
the first heat conducting layer is in contact with a heat sink.

[0016] According to a second aspect, an embodiment of the disclosure
provides an electronic device, including the thermal pad provided in the
first aspect of the disclosure or the possible implementation manners of
the first aspect and a heat emitting component, where a surface of the
thermal pad is in contact with a surface of the heat emitting component;
and the thermal pad is configured to perform heat dissipation processing
on heat generated by the heat emitting component.

[0017] According to a third aspect, an embodiment of the disclosure
provides a method for manufacturing a thermal pad, where the method
includes providing a viscous organic composite; providing a second heat
conducting layer, where the second heat conducting layer is a heat
conducting layer that cannot be compressed to deform, a heat conduction
capability of the second heat conducting layer in a planar direction of
the second heat conducting layer is higher than or equal to a heat
conduction capability of the second heat conducting layer in a thickness
direction of the second heat conducting layer, and the thickness
direction of the second heat conducting layer is perpendicular to the
planar direction of the second heat conducting layer; coating the viscous
organic composite on a surface of the second heat conducting layer; and
performing solidification processing on the organic composite, so as to
form a first heat conducting layer on the surface of the second heat
conducting layer, where the first heat conducting layer is a heat
conducting layer that can be compressed to deform, a heat conduction
capability of the first heat conducting layer in a thickness direction of
the first heat conducting layer is higher than a heat conduction
capability of the first heat conducting layer in a planar direction of
the first heat conducting layer, the heat conduction capability of the
second heat conducting layer in the planar direction of the second heat
conducting layer is higher than or equal to the heat conduction
capability of the first heat conducting layer in the thickness direction
of the first heat conducting layer, and the thickness direction of the
first heat conducting layer is perpendicular to the planar direction of
the first heat conducting layer.

[0018] According to a fourth aspect, an embodiment of the disclosure
provides a method for manufacturing a thermal pad, where the method
includes providing a viscous organic composite; performing solidification
processing on the organic composite, so as to form a first heat
conducting layer, where the first heat conducting layer is a heat
conducting layer that can be compressed to deform, a heat conduction
capability of the first heat conducting layer in a thickness direction of
the first heat conducting layer is higher than a heat conduction
capability of the first heat conducting layer in a planar direction of
the first heat conducting layer, and the thickness direction of the first
heat conducting layer is perpendicular to the planar direction of the
first heat conducting layer; and providing a second heat conducting
layer, and attaching a surface of the second heat conducting layer to a
surface of the first heat conducting layer, so as to form the thermal
pad, where the second heat conducting layer is a heat conducting layer
that cannot be compressed to deform, a heat conduction capability of the
second heat conducting layer in a planar direction of the second heat
conducting layer is higher than or equal to the heat conduction
capability of the first heat conducting layer in the thickness direction
of the first heat conducting layer, the heat conduction capability of the
second heat conducting layer in the planar direction of the second heat
conducting layer is higher than or equal to a heat conduction capability
of the second heat conducting layer in a thickness direction of the
second heat conducting layer, and the thickness direction of the second
heat conducting layer is perpendicular to the planar direction of the
second heat conducting layer.

[0019] It can be known that the thermal pad provided in the embodiments of
the disclosure includes a second heat conducting layer that is in contact
with a surface of a heat emitting component, and a first heat conducting
layer that is in contact with a surface of the second heat conducting
layer. Because a heat conduction capability of the second heat conducting
layer in a planar direction of the second heat conducting layer is higher
than or equal to a heat conduction capability of the second heat
conducting layer in a thickness direction of the second heat conducting
layer, after the second heat conducting layer receives heat transferred
by the heat emitting component, for the heat, a dissipation capability in
the planar direction of the second heat conducting layer is higher than a
conduction capability in the thickness direction of the second heat
conducting layer, and because the heat conduction capability of the
second heat conducting layer in the planar direction of the second heat
conducting layer is higher than a heat conduction capability of the first
heat conducting layer in a thickness direction of the first heat
conducting layer, the second heat conducting layer can fully dissipate
the heat in the planar direction of the second heat conducting layer, and
then conduct the heat to the first heat conducting layer, thereby
avoiding that when the heat emitting component partially emits excessive
heat and causes an excessively high temperature, a partial hotspot
appears on the second heat conducting layer that is in contact with the
heat emitting component, and a device is damaged because heat of the
partial hotspot cannot be conducted out in time. Then, because the heat
conduction capability of the first heat conducting layer in the thickness
direction of the first heat conducting layer is higher than a heat
conduction capability of the first heat conducting layer in a planar
direction of the first heat conducting layer, the first heat conducting
layer can conduct the heat out in time. When heat dissipation processing
is performed on a heat emitting component by using the thermal pad
provided in the embodiments of the disclosure, a phenomenon that the heat
emitting component of a device is damaged because the heat emitting
component partially emits excessive heat and forms a partial hotspot, and
the heat of the partial hotspot cannot be conducted out in time can be
avoided.

BRIEF DESCRIPTION OF DRAWINGS

[0020] To describe the technical solutions in the embodiments of the
disclosure more clearly, the following briefly introduces the
accompanying drawings required for describing the embodiments. The
accompanying drawings in the following description show some embodiments
of the disclosure, and a person of ordinary skill in the art may still
derive other drawings from these accompanying drawings without creative
efforts.

[0021] FIG. 1 is a schematic structural diagram of Embodiment 1 of a
thermal pad according to the disclosure;

[0022] FIG. 2 is a schematic structural diagram of Embodiment 2 of a
thermal pad according to the disclosure;

[0023] FIG. 3 is a schematic structural diagram of Embodiment 1 of a first
heat conducting layer in a thermal pad according to the disclosure;

[0024] FIG. 4 is a schematic structural diagram of Embodiment 3 of a
thermal pad according to the disclosure;

[0025] FIG. 5 is a schematic structural diagram of Embodiment 1 of an
electronic device according to the disclosure;

[0026] FIG. 6 is a flowchart of Embodiment 1 of a method for manufacturing
a thermal pad according to the disclosure; and

[0027] FIG. 7 is a flowchart of Embodiment 2 of a method for manufacturing
a thermal pad according to the disclosure.

DESCRIPTION OF EMBODIMENTS

[0028] To make the objectives, technical solutions, and advantages of the
embodiments of the disclosure clearer, the following clearly describes
the technical solutions in the embodiments of the disclosure with
reference to the accompanying drawings in the embodiments of the
disclosure. The described embodiments are some but not all of the
embodiments of the disclosure. All other embodiments obtained by a person
of ordinary skill in the art based on the embodiments of the disclosure
without creative efforts shall fall within the protection scope of the
disclosure.

[0029] FIG. 1 is a schematic structural diagram of Embodiment 1 of a
thermal pad according to the disclosure. As shown in FIG. 1, the thermal
pad in this embodiment is configured to perform heat dissipation for a
heat emitting component 30 (See FIG. 5), and includes a first heat
conducting layer 11 and a second heat conducting layer 12. A first
surface of the second heat conducting layer 12 is in contact with a
surface of the heat emitting component 30 (FIG. 5), and a second surface
of the second heat conducting layer 12 is in contact with a first surface
of the first heat conducting layer 11. The first heat conducting layer 11
is a heat conducting layer that can be compressed to deform, and a heat
conduction capability of the first heat conducting layer 11 in a
thickness direction of the first heat conducting layer 11 is higher than
a heat conduction capability of the first heat conducting layer 11 in a
planar direction of the first heat conducting layer 11. It should be
noted that the thickness direction of the first heat conducting layer is
perpendicular to the planar direction of the first heat conducting layer.
Because the heat conduction capability of the first heat conducting layer
11 in the thickness direction of the first heat conducting layer 11 is
higher than the heat conduction capability of the first heat conducting
layer 11 in the planar direction of the first heat conducting layer 11,
the thermal pad in this embodiment has a high heat conduction capability
in a thickness direction of the thermal pad. In addition, the second heat
conducting layer 12 in this embodiment is a heat conducting layer that
cannot be compressed to deform, a heat conduction capability of the
second heat conducting layer 12 in a planar direction of the second heat
conducting layer 12 is higher than or equal to a heat conduction
capability of the second heat conducting layer 12 in a thickness
direction of the second heat conducting layer 12, and the heat conduction
capability of the second heat conducting layer 12 in the planar direction
of the second heat conducting layer 12 is higher than or equal to the
heat conduction capability of the first heat conducting layer 11 in the
thickness direction of the first heat conducting layer 11. It should be
noted that the thickness direction of the second heat conducting layer 12
is perpendicular to the planar direction of the second heat conducting
layer 12. Therefore, the thermal pad in this embodiment has a higher heat
conduction capability in a planar direction of the thermal pad. Thus, the
thermal pad in this embodiment not only has a high heat conduction
capability in the thickness direction, but also has a higher heat
conduction capability in the planar direction.

[0030] The first heat conducting layer 11 can be compressed to deform to a
ratio of compression and deformation of the first heat conducting layer
11 under the action of first pressure is 5% to 90%, where the first
pressure ranges between 0 N and 5000 N. Preferably, the first pressure
ranges between 0 N to 200 N.

[0031] The second heat conducting layer 12 is a heat conducting layer that
cannot be compressed to deform to a ratio of compression and deformation
of the second heat conducting layer 12 under the action of the first
pressure is 0% to 5%.

[0032] Optionally, a thickness of the first heat conducting layer 11 is
0.2 mm to 5 mm, and a thickness of the second heat conducting layer 12 is
0.1 millimeter (mm) to 5 mm.

[0033] The thermal pad in this embodiment includes a second heat
conducting layer 12 that is in contact with a surface of a heat emitting
component 30 (FIG. 5), and a first heat conducting layer 11 that is in
contact with a surface of the second heat conducting layer 12. Because a
heat conduction capability of the second heat conducting layer 12 in a
planar direction of the second heat conducting layer 12 is higher than or
equal to a heat conduction capability of the second heat conducting layer
12 in a thickness direction of the second heat conducting layer 12, after
the second heat conducting layer 12 receives heat transferred by the heat
emitting component 30 (FIG. 5), for the heat, a dissipation capability in
the planar direction of the second heat conducting layer 12 is higher
than a conduction capability in the thickness direction of the second
heat conducting layer 12, and because the heat conduction capability of
the second heat conducting layer 12 in the planar direction of the second
heat conducting layer 12 is higher than a heat conduction capability of
the first heat conducting layer 11 in a thickness direction of the first
heat conducting layer 11, the second heat conducting layer 12 can fully
dissipate the heat in the planar direction of the second heat conducting
layer 12, and then conduct the heat to the first heat conducting layer
11, thereby avoiding that when the heat emitting component 30 (FIG. 5)
partially emits excessive heat and causes an excessively high
temperature, a partial hotspot appears on the second heat conducting
layer 12 that is in contact with the heat emitting component 30 (FIG. 5),
and a device is damaged because heat of the partial hotspot cannot be
conducted out in time. Then, because the heat conduction capability of
the first heat conducting layer 11 in the thickness direction of the
first heat conducting layer 11 is higher than a heat conduction
capability of the first heat conducting layer 11 in a planar direction of
the first heat conducting layer 11, the first heat conducting layer 11
can conduct the heat out in time. When heat dissipation processing is
performed on a heat emitting component 30 (FIG. 5) by using the thermal
pad provided in this embodiment of the disclosure, a phenomenon that a
device is damaged because the heat emitting component 30 (FIG. 5)
partially emits excessive heat and forms a partial hotspot, and the heat
of the partial hotspot cannot be conducted out in time can be avoided.

[0034] FIG. 2 is a schematic structural diagram of Embodiment 2 of a
thermal pad according to the disclosure. As shown in FIG. 2, based on
Embodiment 1 of the disclosure, the thermal pad in this embodiment may
further include a third heat conducting layer 13, where the third heat
conducting layer 13 is disposed between the heat emitting component 30
(See FIG. 5) and the second heat conducting layer 12, a first surface of
the third heat conducting layer 13 is in contact with the surface of the
heat emitting component 30, a second surface of the third heat conducting
layer 13 is in contact with the first surface of the second heat
conducting layer 12, the third heat conducting layer 13 is configured to
fill in a micro void on the surface of the heat emitting component 30 and
a thickness of the third heat conducting layer 13 is greater than 0 and
is less than the thickness of the first heat conducting layer 11.
Therefore, when the thermal pad in this embodiment is disposed between
the heat emitting component 30 and a heat sink 20 (See FIG. 5), the third
heat conducting layer 13 is in contact with the heat emitting component.
30, and the third heat conducting layer 13 can reduce contact thermal
resistance between the second heat conducting layer 12 and the heat
emitting component 30, which further improves a heat dissipation effect.

[0035] Based on Embodiment 2 of the disclosure, optionally, the thickness
of the third heat conducting layer 13 is less than or equal to 0.2 mm.
The third heat conducting layer 13 is made relatively thin, so as to
reduce the contact thermal resistance. In addition, the third heat
conducting layer 13 is a prepreg or the third heat conducting layer 13 is
gel-like.

[0036] Based on Embodiment 1 or 2 in the disclosure, optionally, as shown
in FIG. 3, the first heat conducting layer 11 includes an organic matrix
111 and a heat conducting filler 112, and the heat conducting filler 112
is orientated in the first heat conducting layer 11 in the thickness
direction of the first heat conducting layer 11. Because the heat
conducting filler 112 is orientated in the first heat conducting layer 11
in the thickness direction of the first heat conducting layer 11, the
heat conduction capability of the first heat conducting layer 11 in the
thickness direction of the first heat conducting layer 11 is higher than
the heat conduction capability of the first heat conducting layer 11 in
the planar direction of the first heat conducting layer 11. Optionally,
the organic matrix 111 may include ethylene-containing organopolysiloxane
and hydride terminated polydimethylsiloxane-containing
organopolysiloxane. The heat conducting filler 112 includes a sheet-like
heat conducting filler, or the heat conducting filler 112 includes a
fiber-like heat conducting filler, or the heat conducting filler 112
includes a sheet-like heat conducting filler and a fiber-like heat
conducting filler. For example, the heat conducting filler 112 may
include spherical alumina particles (having a particle size of 2
micrometer (.mu.m) to 50 .mu.m) and pitch-based carbon fibers (having an
axial length of 60 .mu.m to 180 .mu.m and an axial diameter of 5 .mu.m to
15 .mu.m), or the heat conducting filler 112 may include spherical
alumina particles (having a particle size of 2 .mu.m to 50 .mu.m) and
sheet-like boron nitride (having a particle size of 5 .mu.m to 15 .mu.m).

[0037] Optionally, the heat conducting filler 112 is a heat conducting
fiber, and the heat conducting fiber may be a carbon fiber or a carbon
nanotube.

[0038] Optionally, a material of the second heat conducting layer 12
includes a material that has high thermal conductivity in a planar
direction, such as metal, or graphite, or metal and graphite, or a
graphene film, or a carbon nanotube film. Optionally, the metal may be
copper. A coefficient of thermal conductivity of the second heat
conducting layer 12 in the planar direction in this embodiment is
hundreds of Watts per meter Kelvin (W/mk), and even thousands of W/mk,
which can effectively reduce planar extension thermal resistance.

[0039] FIG. 4 is a schematic structural diagram of Embodiment 3 of a
thermal pad according to the disclosure. As shown in FIG. 4, based on the
foregoing thermal pad embodiments in the disclosure, in the thermal pad
in this embodiment, further, the second surface of the first heat
conducting layer 11 of the thermal pad is in contact with a heat sink 20.

[0040] FIG. 5 is a schematic structural diagram of Embodiment 1 of an
electronic device according to the disclosure. As shown in FIG. 5, a heat
dissipation apparatus in this embodiment may include a thermal pad 10 and
a heat emitting component 30, where the thermal pad 10 is the thermal pad
provided in the foregoing thermal pad embodiments in the disclosure, and
the implementation principles and technical effects thereof are similar,
and are not described herein again. It should be noted that, in this
embodiment, a surface of the thermal pad 10 is in contact with a surface
of the heat emitting component 30, and the thermal pad 10 performs heat
dissipation processing on heat generated by the heat emitting component
30. If the thermal pad 10 is further in contact with a heat sink 20, a
surface of a first heat conducting layer of the thermal pad 10 is in
contact with the heat sink 20.

[0041] FIG. 6 is a flowchart of Embodiment 1 of a method for manufacturing
a thermal pad according to the disclosure. As shown in FIG. 6, the method
in this embodiment may include the following steps.

[0042] S101: Provide a viscous organic composite.

[0043] S102: Provide a second heat conducting layer, where the second heat
conducting layer is a heat conducting layer that cannot be compressed to
deform, a heat conduction capability of the second heat conducting layer
in a planar direction of the second heat conducting layer is higher than
or equal to a heat conduction capability of the second heat conducting
layer in a thickness direction of the second heat conducting layer, and
the thickness direction of the second heat conducting layer is
perpendicular to the planar direction of the second heat conducting
layer.

[0044] For example, the second heat conducting layer is a graphite sheet
whose thickness is 0.9 mm, 0.5 mm, or 1 mm.

[0045] S103: Coat the viscous organic composite on a surface of the second
heat conducting layer.

[0046] S104: Perform solidification processing on the organic composite,
so as to form a first heat conducting layer on the surface of the second
heat conducting layer, where the first heat conducting layer is a heat
conducting layer that can be compressed to deform, a heat conduction
capability of the first heat conducting layer in a thickness direction of
the first heat conducting layer is higher than a heat conduction
capability of the first heat conducting layer in a planar direction of
the first heat conducting layer, and the thickness direction of the first
heat conducting layer is perpendicular to the planar direction of the
first heat conducting layer.

[0047] In an implementation manner of this embodiment, a viscous organic
composite is provided, where the organic composite may include a heat
conducting filler. For example, ethylene-containing organopolysiloxane,
hydride terminated polydimethylsiloxane-containing organopolysiloxane,
spherical alumina particles (having a particle size of 2 .mu.m to 50
.mu.m), and pitch-based carbon fibers (having an axial length of 60 .mu.m
to 180 .mu.m and an axial diameter of 5 .mu.pm to 15 .mu.m) are mixed
evenly according to a particular proportion (18:18:34:30) (of percents in
volume), and are stirred to disperse into the viscous organic composite;
or ethylene-containing organopolysiloxane, hydride terminated
polydimethylsiloxane-containing organopolysiloxane, spherical alumina
particles (having a particle size of 2 .mu.m to 50 .mu.m), and sheet-like
boron nitride (having a particle size of 5 .mu.m to 15 .mu.m) are mixed
evenly according to a particular proportion (50:50:80:150) (of percents
in weight), and are stirred to disperse into the viscous organic
composite; or ethylene-containing organopolysiloxane, hydride terminated
polydimethylsiloxane-containing organopolysiloxane, spherical alumina
particles (having a particle size of 2 .mu.m to 50 .mu.m), sheet-like
boron nitride (having a particle size of 5 .mu.m to 15 .mu.m), and
nanographene sheets (a thickness is 0.4 nm to 4 nm and a length is 5
.mu.m to 20 .mu.m) are mixed evenly according to a particular proportion
(50:50:80:60:1.5) (of percents in weight), and. are stirred to disperse
into the viscous organic composite.

[0048] Then, the viscous organic composite provided in step S101 is coated
on a surface of a second heat conducting layer provided in step S102.
Then, the heat conducting filler in the organic composite is orientated,
and the organic composite is solidified. The organic composite forms a
first heat conducting layer after the orientation processing and the
solidification processing. Therefore, the first heat conducting layer is
formed on the second heat conducting layer. In addition, the heat
conducting filler after the orientation processing is orientated in a
thickness direction of the first heat conducting layer. In this way, a
heat conduction capability of the formed first heat conducting layer in
the thickness direction of the first heat conducting layer is higher than
a heat conduction capability of the first heat conducting layer in a
planar direction of the first heat conducting layer. The orientation
processing may be magnetic field orientation processing, electric field
orientation processing, or stress orientation processing.

[0049] For example, the second heat conducting layer may be first placed
in an orientation mold, the viscous organic composite is then poured on a
surface of the second heat conducting layer in the orientation mold, and
a magnetic field or an electric field is applied to the orientation mold,
so as to implement magnetic field orientation processing or electric
field orientation processing on the heat conducting filler in the organic
composite, or stress is applied so as to implement stress orientation
processing on the heat conducting filler in the organic composite, so
that the heat conducting filler is orientated in a direction
perpendicular to the planar direction of the second heat conducting
layer; and the organic composite is heated and solidified in a heating
furnace at 100 degree Celsius (.degree. C.) to 120.degree. C. for four
hours to six hours to form a shape, so as to form the first heat
conducting layer.

[0050] In this embodiment, in the thermal pad obtained in the foregoing
manner, because a heat conduction capability of a second heat conducting
layer in a planar direction of the second heat conducting layer is higher
than or equal to a heat conduction capability of the second heat
conducting layer in a thickness direction of the second heat conducting
layer, after the second heat conducting layer receives heat transferred
by a heat emitting component, for the heat, a dissipation capability in
the planar direction of the second heat conducting layer is higher than a
conduction capability in the thickness direction of the second heat
conducting layer, and because the heat conduction capability of the
second heat conducting layer in the planar direction of the second heat
conducting layer is higher than a heat conduction capability of a first
heat conducting layer in a thickness direction of the first heat
conducting layer, the second heat conducting layer can fully dissipate
the heat in the planar direction of the second heat conducting layer, and
then conduct the heat to the first heat conducting layer, thereby
avoiding that when the heat emitting component partially emits excessive
heat and causes an excessively high temperature, a partial hotspot,
appears on the second heat conducting layer that is in contact with the
heat emitting component, and a device is damaged because heat of the
partial hotspot cannot be conducted out in time. Then, because the heat
conduction capability of the first heat conducting layer in the thickness
direction of the first heat conducting layer is higher than a heat
conduction capability of the first heat conducting layer in a planar
direction of the first heat conducting layer, the first heat conducting
layer can conduct the heat out in time. When heat dissipation processing
is performed on a heat emitting component by using the thermal pad
provided in this embodiment of the disclosure, a phenomenon that a device
is damaged because the heat emitting component partially emits excessive
heat and forms a partial hotspot, and the heat of the partial hotspot
cannot be conducted out in time can be avoided.

[0051] FIG. 7 is a flowchart of Embodiment 2 of a method for manufacturing
a thermal pad according to the disclosure. As shown in FIG. 7, the method
in this embodiment may include the following steps.

[0052] S201: Provide a viscous organic composite.

[0053] S202: Perform solidification processing on the organic composite,
so as to form a first heat conducting layer, where the first heat
conducting layer is a heat conducting layer that can be compressed to
deform, a heat conduction capability of the first heat conducting layer
in a thickness direction of the first heat conducting layer is higher
than a heat conduction capability of the first heat conducting layer in a
planar direction of the first heat conducting layer, and the thickness
direction of the first heat conducting layer is perpendicular to the
planar direction of the first heat conducting layer.

[0054] S203: Provide a second heat conducting layer, and attach a surface
of the second heat conducting layer to a surface of the first heat
conducting layer, so as to form the thermal pad, where the second heat
conducting layer is a heat conducting layer that cannot be compressed to
deform, a heat conduction capability of the second heat conducting layer
in a planar direction of the second heat conducting layer is higher than
or equal to the heat conduction capability of the first heat conducting
layer in the thickness direction of the first heat conducting layer, the
heat conduction capability of the second heat conducting layer in the
planar direction of the second heat conducting layer is higher than or
equal to a heat conduction capability of the second heat conducting layer
in a thickness direction of the second heat conducting layer, the
thickness direction of the second heat conducting layer is perpendicular
to the planar direction of the second heat conducting layer.

[0055] In an implementation manner of this embodiment, a viscous organic
composite is provided, where the organic composite may include a heat
conducting filler. For example, ethylene-containing organopolysiloxane,
hydride terminated polydimethylsiloxane-containing organopolysiloxane,
spherical alumina particles (having a particle size of 2 .mu.m to 50
.mu.m), and. pitch-based carbon fibers (having an axial length of 60
.mu.m to 180 .mu.m and an axial diameter of 5 .mu.m to 15 .mu.m) are
mixed evenly according to a particular proportion (18:18:34:30) (of
percents in volume), and are stirred to disperse into the viscous organic
composite.; or ethylene-containing organopolysiloxane, hydride terminated
polydimethylsiloxane-containing organopolysiloxane, spherical alumina
particles (having a particle size of 2 .mu.m to 50 .mu.m), and sheet-like
boron nitride (having a particle size of 5 .mu.m to 1.5 .mu.m) are mixed
evenly according to a particular proportion (50:50:80:150) (of percents
in weight), and are stirred to disperse into the viscous organic
composite; or ethylene-containing organopolysiloxane, hydride terminated
polydimethylsiloxane-containing organopolysiloxane, spherical alumina
particles (having a particle size of 2 .mu.m to 50 .mu.m), sheet-like
boron nitride (having a particle size of 5 .mu.m to 15 .mu.m), and
nanographene sheets (a thickness is 0.4 nm to 4 nm and a length is 5
.mu.m to 20 .mu.m) are mixed evenly according to a particular proportion
(50:50:80:60:1.5) (of percents in weight), and are stirred to disperse
into the viscous organic composite.

[0056] Then, the organic composite is solidified, so as to form a first
heat conducting layer, and the heat conducting filler is orientated in a
thickness direction of the first heat conducting layer. In this way, a
heat conduction capability of the formed first heat conducting layer in
the thickness direction of the first heat conducting layer is higher than
a heat conduction capability of the first heat conducting layer in a
planar direction of the first heat conducting layer. The orientation
processing may be magnetic field orientation processing, electric field
orientation processing, or stress orientation processing.

[0057] For example, the viscous organic composite is poured into an
orientation mold, and a magnetic field or an electric field is applied to
the orientation mold, so as to implement magnetic field orientation
processing or electric field orientation processing on the heat
conducting filler in the organic composite, or stress is applied so as to
implement stress orientation processing on the heat conducting filler in
the organic composite, so that the heat conducting filler is orientated
in a direction perpendicular to the thickness direction of the first heat
conducting layer; and the organic composite is heated and solidified in a
heating furnace at 100.degree. C. to 120.degree. C. for four hours to six
hours to form a shape, so as to form the first heat conducting layer.

[0058] For example, the second heat conducting layer is a graphite sheet
whose thickness is 0.9 mm, 0.5 mm, or 1 mm. After step S202, a surface of
the second heat conducting layer is attached to a surface of the first
heat conducting layer on which orientation processing and solidification
processing are performed, so as to form the thermal pad.

[0059] For example, a surface of the second heat conducting layer may be
coated with a heat conducting pressure-sensitive adhesive layer whose
thickness is 10 .mu.m, a separation film is added, and a surface of the
first heat conducting layer is recombined with the second heat conducting
layer whose surface has a heat conduction pressure-sensitive adhesive
layer, so that the second heat conducting layer is attached to the first
heat conducting layer, to form the thermal pad.

[0060] In this embodiment, in the thermal pad obtained in the foregoing
manner, because a heat conduction capability of a second heat conducting
layer in a planar direction of the second heat conducting layer is higher
than or equal to a heat conduction capability of the second heat
conducting layer in a thickness direction of the second heat conducting
layer, after the second heat conducting layer receives heat transferred
by a heat emitting component, for the heat, a dissipation capability in
the planar direction of the second heat conducting layer is higher than a
conduction capability in the thickness direction of the second heat
conducting layer, and because the heat conduction capability of the
second heat conducting layer in the planar direction of the second heat
conducting layer is higher than a heat conduction capability of a first
heat conducting layer in a thickness direction of the first heat
conducting layer, the second heat conducting layer can fully dissipate
the heat in the planar direction of the second heat conducting layer, and
then conduct the heat to the first heat conducting layer, thereby
avoiding that when the heat emitting component partially emits excessive
heat and causes an excessively high temperature, a partial hotspot
appears on the second heat conducting layer that is in contact with the
heat emitting component, and a device is damaged because heat of the
partial hotspot cannot be conducted out in time. Then, because the heat
conduction capability of the first heat conducting layer in the thickness
direction of the first heat conducting layer is higher than a heat
conduction capability of the first heat conducting layer in a planar
direction of the first heat conducting layer, the first heat conducting
layer can conduct the heat out in time. When heat dissipation processing
is performed on a heat emitting component by using the thermal pad
provided in this embodiment of the disclosure, a phenomenon that a device
is damaged because the heat emitting component partially emits excessive
heat and forms a partial hotspot, and the heat of the partial hotspot
cannot be conducted out in time can be avoided.

[0061] Optionally, based on Method Embodiment 1 or 2 in the disclosure,
the method further includes forming a third heat conducting layer on the
other surface opposite the surface, which is combined with the first heat
conducting layer, of the second heat conducting layer, where the third
heat conducting layer is configured to fill in a micro void on the
surface of the heat, emitting component. For example, a layer of
thermally conductive silicone whose thickness is 0.05 mm to 0.15 mm is
applied to the surface of the second heat, conducting layer by using a
printing process. The thermal pad obtained by using the method in this
embodiment further includes the foregoing third heat conducting layer,
which can reduce contact thermal resistance of the thermal pad.

[0062] Finally, it should be noted that the foregoing embodiments are
merely intended for describing the technical solutions of the disclosure,
but not for limiting the disclosure. Although the disclosure is described
in detail with reference to the foregoing embodiments, persons of
ordinary skill in the art should understand that they may still make
modifications to the technical solutions described in the foregoing
embodiments or make equivalent replacements to some or all technical
features thereof, without departing from the scope of the technical
solutions of the embodiments of the disclosure.