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HS6206

HS6206P/HS6206Q

名称2.4G无线收发

型号HS6206

规格SOC, 内嵌MCS51, PWM输出8路；16K ROM, 2K RAM; SOP16/QFN40;

详细描述

HS6206

HS6206 2.4G Wireless SOC

1.IntroductionThe HS6206 is a member of the low-cost, high-performance family of intelligent 2.4 GHz RF transceivers with embedded microcontrollers. The HS6206 is optimized to provide a single chip solution for Ultra Low Power (ULP) wireless applications. The combination of processing power, memory, low power oscillators, real-time counter and a range of power saving modes provides an ideal platform for implementation of RF protocols. Benefits of using HS6206 include tighter protocol timing, security, lower power consumption and improved co-existence performance. For the application layer the HS6206 offers a rich set of peripherals including: SPI (master and slave), UART, PWM, USB, and so on.

1.1 Pad assignment

Figure1.1 HS6206pad assignment

1.2 Pad functionTable1.1 HS6206 pad function

Pin#

Name

Description

1

P1.2

General purpose IO

2

P2.1

General purpose IO

3

P2.0

General purpose IO

4

P1.3

General purpose IO

5

OUT3V

3.3V supply output for de-coupling, for USB dongle

6

VBUS

USB 5V power

7

D-

USB data-

8

D+

USB data+

9

DVSS

digital ground

10

P0.4

General purpose IO

11

P0.3

General purpose IO

12

P0.2

General purpose IO

13

VSSIO

IO ground

14

VDDIO

IO power

15

P1.0

General purpose IO

16

P1.4

General purpose IO

17

P1.5

General purpose IO

18

P1.6

General purpose IO

19

P1.7

General purpose IO

20

DVSS

Digital ground

21

VDET

Battery voltage detection

22

VDDVCO

VCO power

23

VSSPLL

PLL ground

24

VSSVCO

VCO ground

25

AVSS

Analog ground

26

XTALP

Crystal+

27

XTALN

Crystal-

28

VDDPA

PA power

29

RFN

RF-

30

RFP

RF+

31

VSSRF

RF ground

32

AVSS

Analog ground

33

AVCC

Analog power

34

ADCREF

ADC reference, connected to de-coupling capacitor

35

VSSADC

ADC ground

36

DVSS

digital ground

37

OUT2V

1.9V supply output for de-coupling, for low voltage sensor

38

CP_EN

Tie high: enable charge pump; tie low: disable charge pump

39

DVDD

Digital power

40

RESET

Reset for MCU, active low

41

CDVDD

Internal digital supply output for de-coupling

42

CP3

charge pump output for de-coupling

43

CP1

CP1 and CP2 connected to fly capacitor of charge pump

44

CP2

CP1 and CP2 connected to fly capacitor of charge pump

45

VSSCP

Charge pump ground

46

VDDIO

IO power

47

VSSIO

IO ground

48

TEST

Weak pull down in the PAD;1 for OTP write & test mode; floating for normal work

49

P1.1

General purpose IO

50

P0.1

General purpose IO

51

P0.0

General purpose IO

52

P0.7

General purpose IO

53

P0.6

General purpose IO

54

P0.5

General purpose IO

Note: CP1， CP2， CP3 and CP_EN have different bonding and off-chip device for different applications:（ 1） If the power supply is higher than 3.0v, the internal charge pump is not needed, CP1 and CP2 can be floating, CP3 should be connected to power, CP_EN is bonded to ground;（ 2） If the power supply is lower than 3.0v, the internal charge pump is needed for OTP, 1uF capacitor should be put between CP1 and CP2, 10uF capacitor should be put between CP3 and ground, CP_EN is bonded to power; If a unified off-chip circuit is needed for all applications, the way of (2) can be used.