So, what’s unique about the new LPC family? First, the LPC1500 was designed to simplify motor control for the masses. It has the flexibility to drive various types of motors, such as ACIM, PMSM, BLDC, etc. The LPC1500 can also drive multiple motors simultaneously.

These aren’t all! The hardware interconnection between the SCTimer/PWM, ADCs and comparators allow the motor to be driven with little CPU intervention. It has free LPCXpresso IDE and free FOC firmware for sensored and sensorless motors that reduces cost and improves time to market.

Looking at the unique features and benefits, the Switch Matrix allows any function to be routed out to any pin making schematic capture and board layout simpler and faster. The SCTimer/PWM block is unique to NXP.

Benefits are, it can run independently of the CPU and generate extremely precise PWM waveforms for quiet, smooth, efficient motor drive. The 2x 2Msps 12b,12ch ADCs can measure simultaneous phase currents to determine precise motor position and speed. There are four comparators for fast system shutdown upon fault detection.

How will the LPC1500 aid embedded engineers? According to NXP, it saves time to market using the free FOC firmware and GUI tuning tool. It also saves system cost by using only one system MCU, e.g., HVAC typically has one MCU for fan control and one MCU for the compressor. LPC1500 can control both.

The LPC1500 feature set makes it ideal for sensorless motor control removing the need for sensored motors and allowing customers to switch to cheaper sensorless motors. As the SCTimer/PWM can run independently of the CPU, the freed up CPU bandwidth can be used to control other parts of the system for example the LPC1500 can be used for both the control and motor board in a washing machine.

NXP is currently working with customers to understand their future requirements and developing the roadmap to match their needs.

When a new year approaches, we start analyzing the year gone by and try to gauge what could happen in the coming year. This really holds true, as far as the technology industry is concerned.

It’s been a week since I’ve been mulling over these myself, especially, pondering over developments in the global semiconductor and electronics industries, as well as what could happen in India during 2009. Well, lots will happen, and I can’t wait for the new year to start!

I caught up with Rajeev Mehtani, vice president and managing director, NXP Semiconductors, India, and discussed in depth about the trends for 2009. Here’s a look at that discussion.

INDIA — ELECTRONICS & SEMICONDUCTORS

1. The DTH story will continue to increase in India with companies such as Tata Sky, DISH TV, BIG TV, etc., gaining market share. Owing to these challenges, there would be significant consolidation among the cable operators. Digitalization will also be seen in 2009.

2. The slowdown will affect growth across all sectors. Our view is that LCD TVs as well as STBs will continue to grow.

3. The year 2009 will witness e-commerce revolution and the RFID sector will grow at a 40-50 percent clip. The government has been sponsoring a lot of projects, which include RFID in the metros, e-passport cards and national ID cards. By mid-2009, we can expect a mass deployment of these projects as well as micro payments.

4. Manufacturing in India will continue to grow; EMS or OEMs, such as Samsung, Nokia, Flextronics, etc.

5. There could be a move from services to products in electronics and semiconductor spaces. The number of funded startups has grown significantly over the last years and more and more ideas are coming on the table.

6. The solar/PV sector will grow in India. High entry cost of capital for panels will be a barrier for this sector. Government enhancement is necessary. India will be different than other countries as people won’t push energy back into the grid; it will be used more for household consumption. The India grid is unstable. Tracking it requires a lot of expensive electronic switching. Solar deployment could be at the micro level, and also community level, where it makes more sense.

7. The startups in India are mostly Web 2.0 based, although there aren’t many hardware startups.

GLOBAL — ELECTRONICS & SEMICONDUCTORS

1. The semiconductor industry is truly global, That is mostly because it is a very expensive industry.

2. Things are a bit murky in the semiconductor industry. It would probably be dipping 10-15 percent next year.

3. Globally, energy management and home automation will start to take off in 2009. Satellite broadcasters will also continue to gain more strength.

4. On a worldwide scale, 3G will win. You will have 3G phones, and you’d add LTE to those. India is slightly different. Only 20 percent of Indian households are ready for broadband access. In India, WiMAX could be a way to have wireless broadband at home.

5. Industries moving to 300mm fabs will be making up only 20-25pc of the market. Not many need 45nm or 40nm chips. People will question any major capex, until there’s a big return and wait for recession to end. The bright spot is solar!

6. The fabless strategy would be the only way to go forward. While MNCs with fabless strategy are present in India, Indian startups in this space are quite few.

I’ve been blogging on semicon for some time now, and it is also going to be a year since the CIOL Semicon site was launched.

This special edition looks at the global semiconductor scenario — how is the industry dealing with the ‘deep trauma’ it finds itself in, along with certain forecasts. Will the recession bring the industry down, or is there light at the end of the tunnel? We also look at some predictions made in the past and evaluate where the semiconductor industry stands today.

In the Indian context, the special analyzes India’s growing might in the global semiconductor market, the emergence of India as an embedded superstar, the growing strength of the Indian design services segment, and a quick look at how planners need to take the semicon policy forward.

The special also addresses some leading design trends, such as the use of graphical system design for embedded control systems, trends in video compression, and why designers and developers need to go parallel. It also touches on some recent developments in 22nm.

All articles can be found on the CIOL Semicon site. Some of the posts are available on my blog as well. Enjoy!

Global Semiconductor Market Scenario

1. Top 10 global semicon predictions: where are we todayWhile the chip industry is equipped to take on the challenges ahead, do watch out for weaker DRAM and NAND markets.

2. Semicon likely to grow 12pc in 2008 If there will be an economic recession, the chip industry (but not all firms) is in the best shape possible to weather the ensuing storm.

3. Semi trends 2008: Fab spend lower, ASPs stabilizing The call on global fab spend was for a 10 percent reduction, and this is now getting to be closer to 20 percent.

4. Global semicon to grow 4.9pc These forecasts are based on April’s WSTS sales numbers, as per the Cowan LRA (Linear Regression Analysis) model.

A very kind reader left a comment yesterday that he (or she?) spent three hours on my blog! I am simply overwhelmed and humbled!!

It has really been a pleasure writing and maintaining a semicon blog! Plenty such are around carrying very valuable information, and I salute those bloggers.

It is really tough to contend with all the other technology-related information, but then, semicon has its own charm, and its own set of dedicated readers — who DO go on to become extremely loyal.

I am even more touched by another request by a friend to list all the top articles I’ve written this year. Wow!!

It is very difficult for me to say, which ones are the best! However, I am listing the articles here. They all link back to CIOL. Of course, I’ve blogged here first, so, those who are familiar with my blog pieces, will identify them immediately.

Here goes then — starting from the latest back down to very late last year — in terms of relevance. Enjoy!

Semi trends 2008: Fab spend lower, ASPs stabilizingThe call on global fab spend was for a 10 percent reduction, and this is now getting to be closer to 20 percent.

Here are the top 25 global suppliers of semiconductors, according to iSuppli. First up, there are no surprises in the top 5 — Intel, Samsung, Texas Instruments, Toshiba and STMicroelectronics retain their spots for this year too. The surprises occur in the second rung — or, in the next five spots.

Renasas and Hynix exchanged places, with Hynix moving up from 7th position in 2006 to 6th position in 2007, and Renasas dropping from 6th last year to 7th. This is very interesting, because, despite memory market pains during 2007, South Korea’s Hynix Semiconductor and Japan’s Toshiba and Elpida Memory achieved memory-chip revenue growth of 15, 14.5 and 8.8 percent respectively in 2007, as per iSuppli.

Infineon, Sony major moversThe next three positions are the major surprises of the year. Well, the 10th position was no surprise to me — AMD, dropping from 8th in 2006 to 10th in 2007. Sony and Germany’s Infineon Technologies have been the biggest gainers of the year!

According to iSuppli, Infineon acquired TI’s DSL CPE chip business and its wireless baseband semiconductor unit, boosting its revenue. Qimonda, which spun off Infineon, dropped from 12th in 2006 to 16th this year. This split had seen Infineon go out of the top 10 last year.

As per iSuppli, logic application specific integrated circuits (application specific standard products and ASICs) enjoyed the strongest performance among all semicon segments in 2007. Sony and Toshiba were key drivers of growth in this segment due to their sales of semiconductors for the PS3.

Fabless is surely inThe presence of Qualcomm and nVidia in the top 25 list speaks volumes of the power of fabless companies. Qualcomm moved up from 16th to 13th position this year, while nVidia moved up from 25th to the 20th position this year. There is every chance that we will see a fabless company in the top 10 next year! There is an even better chance that more fabless companies will make it to the top 25 companies next year and in future.

All other key players dropped in their rankings. NXP dropped from 9th to 11th; NEC dropped from 11th to 12th; Freescale from 10th to 14th; Micron from 13th to 15th; Elpida moved up from 19th to 17th; while Matsushita and Broadcom dropped a place each.

An iSuppli release says: “Overall, the top 25 semiconductor suppliers significantly outperformed the combined performance of companies ranked lower than them in 2007. The Top-25 as a group achieved revenue growth of 4.5 percent in 2007 while the combined growth of all other semiconductor suppliers was only 0.8 percent.”

On a personal note, I would love to see names like SemIndia and HSMC making it to the list. If not now, then at least sometime in the near future. However, it seems from certain published reports that the Indian fab story has gone all wrong. I’ll take up this topic in a future blog for sure!

NXP Semiconductors India has developed the PNX4902, an ultra low-cost GSM/GPRS single chip, which was announced this February. The highlight — the entire analog and RF work done has been in Bangalore! You might wonder what’s so unique about this!

Well, let’s start with what is tough about RF CMOS in single chip! CMOS is primarily a digital process. The analog circuit design in CMOS is tough, and the RF circuit design in CMOS is even tougher. Now, the co-existence of RF CMOS circuits with noisy digital in a single chip was (and is) considered the holy grail of chip design.

Next, cellular standards (such as GSM, EDGE) and specs are much tougher than other comparable standards like FM, Bluetooth, etc. Also, some key cellular parameters like RX sensitivity become tougher for single chips aimed at emerging markets. Especially, we all know that base stations are sparse in rural areas. Taking all of these as a whole — RF design in presence of digital noise is the biggest challenge in a single chip!

Factors enabling single chip designThere are said to be three factors. One, RF CMOS is the high quality analog/RF design in CMOS. The high-performance RF blocks like LNA, mixers, etc., used to be the domain of BiCMOS, a higher cost technology. Next, fine-line CMOS (0.18mm and lower) provide high fT and lower noise.

Two, there are new architectures that minimize analog signal processing. Chip designers to convert the analog signal to digital — so they might as well do it early — analog-to-digital conversion at the IF, instead of at DC. There’s also a need to move the final down-conversion and filtering into digital domain.

Three, the use of DSP to calibrate the analog performance. Things like temperature and process sensitivities in analog circuits need adjustments. Also, the digital engines can provide the ability to ‘lock-in’ the performance. Finally, a strong ‘engineering culture’ is a MUST to execute on complex chips.

Factors enabling AeroFone single chip designNXP had acquired Silicon Labs Wireless group in 2007. Silicon Labs was a leader in RF CMOS, and so it also acquired numerous patents and trade secrets. Trade secrets for integration of RF CMOS circuits with noisy digital provide an edge over competitors as the integration intensifies.

Thereafter, NXP went on to form the NXP India single-chip design team. As single chip products are designed for emerging economies, NXP India invested heavily to develop the design expertise in Bangalore. The seed group of chip leads and system leads relocated from USA to India to start an analog/RF competency center for developing highly integrated chips.

The NXP India single chip design team has the vision to be the best center of competence in architecture and design of highly integrated circuits (ICs) for emerging market products. It is building the best analog/RF group in India.

Vendor performances were mixed with two vendors in the top 10 that experienced double-digit growth and two vendors that showed declines in revenue.

“Semiconductor vendors need to watch the performance of their end customers even closer as a major part of the industry becomes increasingly tied to consumer spending patterns,” said Andrew Norwood, research vice president at Gartner. “Loss of market share in an end-user application, such as a mobile phone, by a customer (a mobile phone manufacturer) can have a dramatic effect on a vendor’s business.”

Intel grew revenue more than twice as fast as the semiconductor market average, and it is likely to edge up its market share to 12.2 percent in 2007 from 11.6 percent in 2006.

Intel’s growth came primarily from strong shipments of mobile PCs. Armed with a strong product lineup for enthusiast desktops and servers, Intel regained lost share in those markets from AMD.

While the global market for dynamic random-access memory (DRAM) is expected to decline in 2007 due to a severe drop in prices caused by oversupply, Samsung Electronics is likely to increase its revenue by slightly higher than the overall global semiconductor market growth rate (DRAM is one the firm’s main products).