Leading-Edge Semiconductor Technology Featured at SEMICON West

SAN JOSE, Calif. — March 29, 2012 — The latest developments in <22nm
process development and lithography will be featured in keynote presentations
and free on-floor TechXPOT sessions during SEMICON West, July 10-12. Shekhar Borkar, director of Extreme-scale
Technologies at Intel Labs, will provide the technology keynote at 9:00am on
Tuesday, July 10, discussing Intel’s mid- and long-term IC development efforts
in scaling, power reduction, and performance improvements. Separate two-hour TechXPOT sessions will be
held on the latest technical achievements, challenges and barriers in
photolithography, and advanced materials and processes for <22nm production.

Mobile and
cloud computing are among the key drivers of the semiconductor industry. With conventional scaling approaching its
physical limits, the challenge falls to advanced materials and processes — and
transistor architectures — to continue the drive to faster/smaller/thinner
devices. The SEMICON West South Hall TechXPOT
session at 10:30am on Tuesday, July 10 will examine trends and issues with
fully-depleted devices (e.g., FDSOI, FinFETs, tri-gate, etc.) and the use of III-V channel materials The speakers will discuss the latest
developments, continued challenges, and ongoing research efforts in advanced
process technology:

Raj
Jammy, VP, Materials and Emerging Technologies, SEMATECH

Carlos
Mazuré, EVP and CTO, Soitec

Kaizad
Mistry, VP, director of Logic Technology Integration, Intel

Aaron
Thean, director, Logic Program, imec

Lithography
challenges represent the single biggest threat to the continuation of Moore’s
law. The latest achievements, technology
roadmaps and development efforts will be discussed on Wednesday, July 11 at
10:30am in the South Hall TechXPOT session.
Industry experts will examine continued efforts to commercialize EUVL,
including productivity improvements, EUV transmission and conversion
efficiency, and input power progress. Additionally,
EUV mask and resist infrastructure readiness activities, extension of
double-patterning and the role of complementary technologies, such as e-beam
lithography, will be addressed by the following speakers:

This year, SEMICON
West is integrating the International Technology Roadmap for Semiconductors
(ITRS) sessions into the TechXPOT and Extreme Electronics platforms on
Thursday, July 12. The Test Vision 2020
Conference will be held in conjunction with SEMICON West, on July 11-12. In addition, a special session on supply
chain opportunities in 450mm wafers will be held on Thursday, July 12. Other TechXPOT sessions, yet to be announced,
will address new materials, advances in 3D-IC, MEMS, test, advanced packaging,
LEDs, OLEDs, and productivity solutions for 200mm and 300mm fabs.

Over 31,000
people attended last year’s SEMICON West to learn, evaluate, and specify the
latest in micro- and nanoelectronics manufacturing and development solutions.

Companies
with innovative technologies and solutions for advanced microelectronics
manufacturing are invited to exhibit at SEMICON West. Great opportunities are
still available — learn more about
exhibiting at SEMICON West.

About SEMI

SEMI is the global
industry association serving the nano- and microelectronics manufacturing
supply chains. SEMI member companies are the engine of the future, enabling
smarter, faster and more economical products that improve our lives. Since
1970, SEMI has been committed to helping members grow more profitably, create
new markets and meet common industry challenges. SEMI maintains offices in
Beijing, Bengaluru, Berlin, Brussels, Grenoble, Hsinchu, Moscow, San Jose,
Seoul, Shanghai, Singapore, Tokyo, and Washington, D.C. For more information,
visit www.semi.org