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Abstract

Described is a method and an apparatus for forming defect-free headed I/O pins from coiled wire for use in semiconductor packages. The disclosed apparatus shapes the pin's head in a closed die cavity, employing partial pre-ejections of the partially formed head prior to the final forming step to facilitate final ejection of the finished pin. (Image Omitted) The machine has a rotatable table that incorporates four dies that are sequentially indexed through four stations. At the first station, wire from a coil is fed into the die and cut into the proper length, as indicated in Fig. 1. At the second station, the pin head is formed to its initial shape through the action of two opposed punches that interact with the carbide die, as indicated in Fig. 2.

Country

United States

Language

English (United States)

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Machine to Manufacture Headed Pins

Described is a method and an apparatus for forming defect-free headed I/O
pins from coiled wire for use in semiconductor packages. The disclosed
apparatus shapes the pin's head in a closed die cavity, employing partial pre-
ejections of the partially formed head prior to the final forming step to facilitate
final ejection of the finished pin.

(Image Omitted)

The machine has a rotatable table that incorporates four dies that are
sequentially indexed through four stations. At the first station, wire from a coil is
fed into the die and cut into the proper length, as indicated in Fig. 1. At the
second station, the pin head is formed to its initial shape through the action of
two opposed punches that interact with the carbide die, as indicated in Fig. 2. At
the third station, the partially shaped pin is pre-ejected from the die, the pin head
brought into its final dimensions, and subsequently partially ejected from the die,
as indicated in Fig. 3. At the fourth station, the completed pin is ejected from the
die by the upper punch as indicated in Fig. 4.