3M Expands U.S. Development Laboratory for Semiconductor CMP Products

SAN FRANCISCO – SEMICON West, Booth #6656 North – July 12-14, 2011 - 3M, the world's leading supplier of chemical mechanical planarization (CMP) Pad Conditioners and Fixed Abrasives for semiconductors, announces the completion of a major expansion of 3M's development laboratory and cleanroom located at its headquarters in Saint Paul, Minn. The expansion includes a 300mm CMP tool and defect metrology for product and application development. This makes 3M the only pad conditioner supplier to have in-house capabilities for 300mm wafer testing and wafer defect inspection.

"The addition of the 300mm CMP tool and the Surfscan SP2 wafer inspection tools demonstrate 3M's continued commitment to providing the semiconductor industry with new and innovative materials," said Dr. Philip Clark, laboratory manager for 3M. "With these new capabilities we are able to help customers implement process enabling pad conditioner solutions faster for even the most advanced process nodes."

For more information about 3M CMP Pad Conditioners and Fixed Abrasives or other products and services from 3M Electronics Markets Materials Division visit www.3M.com/electronics.

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