Aix-en-Provence, France
11. - 13. May 2011
Further information can be found on the symposium homepage

OUR CONTRIBUTION

Wafer-Level Glass-Caps for Advanced Optical Applications

Abstract - A novel process flow to manufacture miniaturized optical
windows on wafer-level is presented. Those windows can be
used for miniaturized optical products like high-brightness
LEDs (HB-LED) and digital projection (DLP) as well as more
complex optical data-communication, since integrated optical
functions can be implemented with low tolerances.
We explain the fabrication of cap-wafers having a shallow
cavity with a depth of typically 10 μm used in photo sensors
and a unique manufacturing process for cap-wafers with a
deep cavity of e.g. 300 μm used in LED packaging.
Those cap-wafers are used in wafer-level integration of
advanced, miniaturized optical products. We discuss two
options for wafer bonding i.e. bonding using adhesive as well
as anodic bonding.
As an example on product level a miniaturized photo
sensor package, a pressure sensor package as well as a LED
package is discussed.