Share your insights and expertise at SEMICON West 2018

SEMICON West is proud to have played a critical role in driving last year’s momentum, which saw near-record growth across every industry sector. This year we’re adding programs on Smart Transportation, Smart Manufacturing, MedTech, IoT, Big Data, AI, and the cognitive learning technologies that are taking our industry and the world BEYOND SMART. We’ll showcase the latest innovations in semiconductor equipment, materials, design, manufacturing, packaging, test, and system integration, as well as Flexible Hybrid Electronics, MEMS & Sensors, blockchain technology, and more.

Smart Manufacturing Meet the Experts Theater

SEMI invites submission of abstracts for our expanded Meet the Experts program on emerging IC manufacturing technologies to handle the explosive growth of data, and on leveraging connected intelligence in the manufacturing of electronics. Talks should address technology of wide interest to a broad audience of electronics manufacturing managers and technologists, with evidence of developments on the leading/bleeding edge of commercial. Topics of interest include:

Applications of artificial intelligence or machine learning in IC manufacture

Applications of data sharing, security solutions, virtual wafers and simulation, EHS, automation, and experience with the digital thread connecting data across the gaps between sectors anywhere in the supply chain from design and materials through final systems assembly

New memory technology

Silicon photonics

Innovations in 3D stacking

New metrology solutions

Test Vision 2020: The Next Step to Intelligent Test

SEMI invites submission of abstracts for Test Vision 2020: The Next Step to Intelligent Test. The growth in autonomous driving and the “connected everything” is spurring the demand for semiconductors. This trend is putting more pressure on test costs because of higher coverage requirements or lower average selling prices. Test must become even smarter to address the increased quality demands, while at the same time remain economical. Greater computational power coupled with increased analog and sensor content will force changes in test strategies due to more advanced packaging, heterogeneous integration, higher performance analog, and increasing RF complexity. To address those challenges, all the tools in the arsenal must be brought to bear; increasing test instrumentation integration, smarter test strategies, self-test, adaptive test, system level test, and more sophisticated test hardware.

At Test Vision 2020, we’ll ask questions like: What can we do differently to provide testing cost effectively with dppm rates approaching zero? What R&D tools are needed for today’s and tomorrow’s devices? What will test cell (ATE, fixtures, handlers or probers and probe cards) look like beyond 2018? How can test be more integrated into the manufacturing process?