Introduction:The micro mechanical device embedded with electronics/electrical
system fabricated through a mix of integrated circuit manufacturing
and micro-machining process where material is shaped by
etching away micro layers is called Micro Electro Mechanical
System (MEMS). The intelligent electronic system part is
integrated in the same way of IC device fabrication. The
most popular material used for MEMS is Silicon for it's
semiconductor , physical and commercial properties.

Micro-Electro-Mechanical Systems consists of mechanical
elements, sensors, actuators, and electrical and electronics
devices on a common silicon substrate.

The sensors in MEMS gather information from the environment
through measuring mechanical, thermal, biological, chemical,
optical, and magnetic phenomena. The electronics then process
the information derived from the sensors and through some
decision making capability direct the actuators to respond
by moving, positioning, regulating, pumping, and filtering,
thereby controlling the environment for some desired outcome
or purpose. The advantages of semiconductor IC manufacturing
such as low cost mass production, reliability are also integral
to MEMS devices.
The size of MEMS sub-components is in the range of 1 to
100 micrometers and the size of MEMS device itself measure
in the range of 20 micrometers to a millimeter.

There are plenty of applications for MEMS. As a breakthrough
technology, MEMS is building synergy between previously
unrelated fields such as biology and microelectronics, many
new MEMS and Nanotechnology applications will emerge, expanding
beyond that which is currently identified or known.

1. Inkjet printers, which use piezo-electrics or thermal
bubble ejection to deposit ink on paper.
2. Accelerometers in modern cars for a large number of purposes
including airbag deployment in collisions.
3. Accelerometers in consumer electronics devices such as
game controllers, personal media players /
cell phones and a number of Digital Cameras.
4. In PCs to park the hard disk head when free-fall is detected,
to prevent damage and data loss.
5. MEMS gyroscopes used in modern cars and other applications
to detect yaw; e.g. to deploy a roll over
bar or trigger dynamic stability control.
6. Silicon pressure sensors e.g. car tire pressure sensors,
and disposable blood pressure sensors.
7. Displays e.g. the DMD chip in a projector based on DLP
technology has on its surface several hundred
thousand micromirrors.
8. Optical switching technology, which is, used for switching
technology and alignment for data communications.
9. Interferometric modulator display (IMOD) applications
in consumer electronics (primarily displays for mobile
devices).
10. Improved performance from inductors and capacitors due
the advent of the RF-MEMS technology