Rectangular Filtered Arc Plasma Source - Patent 5997705 by Patents-30

This invention relates to vapor deposition apparatus for depositing a coating on a substrate. More particularly it relates to cathodic arc evaporation apparatus.BACKGROUND OF THE INVENTIONCathodic arc evaporation has during the last two decades come into wide commercial use for deposition of metal, alloy, and metal compound coatings. Cathodic arc discharges can also be used as plasma sources for ion processing operations such asimplantation, sputter etching, reactive etching, and diffusion. A cathode of the material to be deposited is vaporized by a high current, low voltage arc plasma discharge in a vacuum chamber which has been evacuated to a pressure of typically less than0.001 mbar. Typical arc currents range between 25 and 1000 amperes, with voltages between 15 and 50 volts. An undesirable side effect of cathodic arc evaporation is the generation of molten droplets of cathode material. These droplets are commonlycalled macroparticles, and range in diameter from sub-micron to tens of microns. The macroparticles can become embedded in the coating when they land on the substrate or can stick and later fall off, causing surface defects in either case.Strategies for reducing the number of macroparticles reaching the substrate fall generally into two categories. The first is those using some form of magnetic field to control and accelerate the arc, in order to reduce macroparticle generation. The second category is those using a filtering apparatus between the cathode and the substrates which transmits at least part of the ionized vapor but blocks at least some of the molten droplets. The magnetic methods are generally simpler but do notcompletely eliminate macroparticle generation. The filtering methods are generally more effective at removing macroparticles, but require complex apparatus and reduce the source output significantly.Rectangular plasma sources are desirable for the coating or ion processing of large substrates, sheet material in roll form, an

United States Patent: 5997705
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( 1 of 1 )
United States Patent
5,997,705
Welty
December 7, 1999
Rectangular filtered arc plasma source
Abstract
An apparatus is disclosed for generating oppositely directed streams of
plasma for the purpose of depositing a coating or performing ion
processing. The plasma comprises ionized vapor of a cathode material,
generated by vacuum arc evaporation from a linear magnetron cathode. The
plasma is diverted by a deflection electrode to a substrate region, while
the macroscopic droplets of cathode material also generated by the arc are
intercepted and prevented from reaching the substrate. Magnetic means are
disclosed for controlling the arc motion on the cathode surface while
simultaneously deflecting and guiding the plasma. The source may be
extended indefinitely in length, permitting coating or ion processing of
large substrates.
Inventors:
Welty; Richard P. (Boulder, CO)
Assignee:
Vapor Technologies, Inc.
(Boulder,
CO)
Appl. No.:
09/291,455
Filed:
April 14, 1999
Current U.S. Class:
204/298.41 ; 204/192.12; 204/192.38; 204/298.02; 204/298.08; 204/298.11; 204/298.14; 204/298.17
Current International Class:
C23C 14/32&nbsp(20060101); H01J 37/32&nbsp(20060101); C23C 014/32&nbsp()
Field of Search:
204/298.08,298.14,298.16,298.17,298.41,298.02,298.11,192.38,192.12
References Cited [Referenced By]
U.S. Patent Documents
3783231
January 1974
Sablev et al.
3793179
February 1974
Sablev et al.
4031424
June 1977
Penfold et al.
4116806
September 1978
Love et al.
4194962
March 1980
Cambers et al.
4404077
September 1983
Fournier
4428259
January 1984
Kubo et al.
4430184
February 1984
Mularie
4448659
May 1984
Morrison, Jr.
4452686
June 1984
Axenov et al.
4486289
December 1984
Parsons et al.
4492845
January 1985
Kluchko et al.
4515675
May 1985
Kieser et al.
4559121
December 1985
Mularie
4581118
April 1986
Class et al.
4600489
July 1986
Lefkow
4717968
January 1988
Painton et al.
4749587
June 1988
Bergmann et al.
4801217
January 1989
Goldberg
4812217
March 1989
George et al.
4849088
July 1989
Veltrop et al.
4933064
June 1990
Geisler et al.
4994164
February 1991
Bernardet
5133850
July 1992
Kukla et al.
5160585
November 1992
Berg
5262028
November 1993
Manley
5266178
November 1993
Sichmann
5269898
December 1993
Welty
5277778
January 1994
Daube et al.
5277779
January 1994
Henshaw
5279723
January 1994
Falabella et al.
5282944
February 1994
Sanders et al.
5317235
May 1994
Treglio
5364518
November 1994
Hartig et al.
5380421
January 1995
Gorokhovsky
5387326
February 1995
Buhl et al.
5403457
April 1995
Nago et al.
5404017
April 1995
Inuishi et al.
5433836
July 1995
Martin et al.
5433838
July 1995
Martin et al.
5435900
July 1995
Gorokhovsky
5451308
September 1995
Sablev et al.
5480527
January 1996
Welty
5482611
January 1996
Helmer et al.
5512156
April 1996
Yamanishi et al.
5518597
May 1996
Storer et al.
5531877
July 1996
Latz et al.
5587207
December 1996
Gorokhovsky
5589039
December 1996
Hsu
5597459
January 1997
Atshuler
5730847
March 1998
Hanaguri et al.
5804041
September 1998
Hurwitt
5840163
November 1998
Welty
Primary Examiner: Diamond; Alan
Attorney, Agent or Firm: Kapustij; Myron B.
Doigan; Lloyd D.
Claims
What I claim is:
1. An apparatus for generating oppositely directed plasma streams comprising ionized vapor of a cathode material, said apparatus comprising cathode means, filter means, magnetic
means, arc power supply means, and anode means; said apparatus having oppositely facing output apertures from which said plasma streams are emitted;
said cathode means being connected to the negative output of said arc power supply means and functioning to emit material comprising plasma and macroparticles of said cathode material; said cathode means having an evaporable surface from which
said emission occurs; said cathode having substantially the shape of a rectangular bar having four long sides and two ends; said evaporable surface consisting of two opposite long sides and both ends of said bar;
said filter means comprising deflector means and cathode side shield means; said filter means functioning to transmit at least part of said plasma to said substrate region while preventing or reducing transmission of said macroparticles;
said deflector means comprising at least two deflector surfaces; each of said deflector surfaces mounted parallel to and facing one of said long sides of said evaporable surface; said deflector means functioning to deflect said plasma emitted
by said cathode into two directions parallel to said deflector surfaces;
said side shield means comprising at least two surfaces mounted on opposite sides of said evaporable surface and projecting outward from said evaporable surface by a selected distance; said side shield means functioning to prevent at least a
portion of said macroparticles emitted from said evaporable surface from reaching said output apertures;
said magnetic means comprising at least one permanent magnet or electromagnet and functioning to generate a magnetic field in the region between said cathode means and deflector means, said magnetic field having flux lines substantially parallel
to said evaporable surface and said deflector surfaces;
said anode means comprising at least one surface in electrical contact with said plasma, said anode means being connected to the positive output of said arc power supply means.
2. The apparatus as in claim 1 in which said magnetic means comprises at least 2 magnet assemblies, each assembly comprising at least 2 permanent magnets separated by at least one magnetically permeable pole piece; said magnet assemblies being
disposed parallel to each other and to said deflector means; and in which said cathode means and deflector means are disposed between said magnet assemblies.
3. The apparatus as in claim 1 or 2 further comprising a deflector bias power supply having its positive output connected to said deflector surfaces and its negative output connected to said anode means.
Description
FIELD OF THE INVENTION
This invention relates to vapor deposition apparatus for depositing a coating on a substrate. More particularly it relates to cathodic arc evaporation apparatus.
BACKGROUND OF THE INVENTION
Cathodic arc evaporation has during the last two decades come into wide commercial use for deposition of metal, alloy, and metal compound coatings. Cathodic arc discharges can also be used as plasma sources for ion processing operations such as
implantation, sputter etching, reactive etching, and diffusion. A cathode of the material to be deposited is vaporized by a high current, low voltage arc plasma discharge in a vacuum chamber which has been evacuated to a pressure of typically less than
0.001 mbar. Typical arc currents range between 25 and 1000 amperes, with voltages between 15 and 50 volts. An undesirable side effect of cathodic arc evaporation is the generation of molten droplets of cathode material. These droplets are commonly
called macroparticles, and range in diameter from sub-micron to tens of microns. The macroparticles can become embedded in the coating when they land on the substrate or can stick and later fall off, causing surface defects in either case.
Strategies for reducing the number of macroparticles reaching the substrate fall generally into two categories. The first is those using some form of magnetic field to control and accelerate the arc, in order to reduce macroparticle generation.
The second category is those using a filtering apparatus between the cathode and the substrates which transmits at least part of the ionized vapor but blocks at least some of the molten droplets. The magnetic methods are generally simpler but do not
completely eliminate macroparticle generation. The filtering methods are generally more effective at removing macroparticles, but require complex apparatus and reduce the source output significantly.
Rectangular plasma sources are desirable for the coating or ion processing of large substrates, sheet material in roll form, and for quantities of smaller substrates on a linear conveyor or circular carousel. Bi-directional sources are desirable
since they increase the area over which the emitted plasma is distributed and can provide additional substrate capacity.
A publication by Aksenov, et al. ("Transport of plasma streams in a curvilinear plasma-optics system", Soviet Journal of Plasma Physics, 4(4), 1978) describes the use of a cylindrical plasma duct having a 90 degree bend, with electromagnet coils
to create a solenoidal magnetic field through the duct. U.S. Pat. Nos. 5,279,723 (Falabella et al., 1994) and U.S. Pat. No. 5,433,836 (Martin, 1995) describe similar devices with cylindrical ducts with having 45 and 90 degree bends respectively.
U.S. Pat. No. 4,492,845 (Kljuchko, 1985) describes a coaxial filtered arc evaporation apparatus having an annular cathode, with substrates to be coated disposed within the radius of the annular cathode. U.S. Pat. No. 4,452,686 (Axenov et al., 1984)
and U.S. Pat. No. 5,282,944 (Sanders, et al., 1994) describe straight cylindrical filtering ducts with no bend, and with circular cathodes located at one end of the duct. U.S. Pat. No. 5,435,900 (Ghorokhovsky, 1995) and U.S. Pat. No. 5,840,163
(Welty, 1999) both describe filtered sources having a rectangular duct with a 90 degree bend with a cathode at one end. Sputtering cathodes having the shape of a bar of substantially rectangular cross-section, having erosion surfaces wrapping around a
lengthwise periphery of the bar and having substantially bi-directional deposition distributions are disclosed in U.S. Pat. No. 4,194,962 (Chambers et al., 1980), 4,486,289 (Parsons et al., 1984) and U.S. Pat. No. 4,812,217 (George et al., 1989).
Means for containing an arc on an evaporable surface are described in U.S. Pat. No. 3,793,179 (Sablev, 1974), U.S. Pat. No. 4,430,184 (Mularie, 1984), U.S. Pat. No. 5,387,326 (Buhl, 1995).
SUMMARY OF THE INVENTION
The present invention generates oppositely directed plasma streams over an extended length for purposes of forming a coating or performing ion processing of a substrate. The plasma is generated by means of a cathodic arc discharge using a linear
magnetron cathode. The cathode has the shape of a rectangular bar as shown in FIG. 1. The evaporable surface wraps around a lengthwise periphery consisting of two opposite long sides and both ends of the bar. Plasma is emitted from the cathode in
directions approximately perpendicular to all four faces of the evaporable surface. For a long cathode, most of the plasma is emitted in the two directions perpendicular to the long sides of the evaporable surface.
Macroparticles also emitted from the evaporable surface are prevented from reaching the substrate by a filtering apparatus comprising cathode side shields and deflection electrodes. The side shields are mounted along both edges of the evaporable
surface, and project outward by a selected distance from the surface in order to block macroparticles emitted at low angles to the evaporable surface. The deflection electrodes are mounted parallel to and facing at least the long sides of the evaporable
surface, and optionally facing the cathode ends as well. The deflection electrodes have a selected width and are mounted at a selected distance from the evaporable surface. The deflection electrodes function to split and redirect plasma stream from the
evaporable surface into two opposite directions parallel to the electrodes and evaporable surface. The deflection electrodes also function to block macroparticles emitted at higher angles to the evaporable surface. The width of the deflection
electrodes and their distance from the evaporable surface, as well as the distance by which the side shields project outward from the evaporable surface, are selected such that there is no line of sight from the evaporable surface to the substrate, i.e.
a macroparticle emitted from any point on the evaporable surface and traveling in any direction toward the substrate will be blocked by either a cathode side shield or a deflection electrode.
Magnetic means are provided to generate a magnetic field parallel to both the deflection electrode and the evaporable surface of the cathode, and perpendicular to the cathode length. The magnetic field serves both to make arc discharge spots
circulate continuously around the evaporable surface of the cathode and to increase the effectiveness of the deflection electrode. Redirection of the plasma by the deflection electrodes is accomplished by means of an electric field near the electrode
surface. The electric field is of the polarity which repels positive ions from the electrode (i.e. the potential becomes increasingly positive for an ion approaching the electrode). At an electrically isolated deflection electrode an electric field
develops spontaneously due to the different arrival rates of ions and electrons in the impinging plasma. A magnetic field parallel to the electrode surface reduces the electron arrival rate much more than the ion arrival rate (due to the electrons much
smaller mass), causing the electrode potential to become more positive and hence more effective at repelling ions. The effectiveness of the deflection electrodes may be further increased by applying a positive bias voltage (with respect to the anode) to
at least a portion of each deflection electrode by means of an additional power supply. The entire deflection electrode may be biased, or e.g. only a center segment facing the evaporable surface directly may be biased while the remainder of the
deflector surface is connected to the anode or electrically floating.
The magnetic means may comprise electromagnets or permanent magnets. A simple solenoid coil wound around the outside of the deflection electrodes and cathode, as shown in FIG. 1, can provide a suitable field configuration. Two or more smaller
solenoids may be used in order to shape the magnetic field or for convenience in fabrication and mounting as shown in FIG. 2. Alternatively the field may be generated by means of permanent magnets as shown in FIGS. 3 and 4. Electromagnets have the
advantage that the magnetic field strength can be easily varied. They have the disadvantages of large size and weight, relatively high cost (including a power supply), and the requirement for cooling to prevent heat buildup during operation. Permanent
magnets have the advantages of smaller size and lower cost, and require no cooling or power supply. The have the disadvantage that the magnetic field strength can be varied only by replacing the magnets.
The strength of the magnetic field and the deflection electrode bias voltage may be chosen to optimize plasma transmission for the particular material vaporized (atomic weight and average charge state). Magnetic field strengths in the range
20-100 gauss with electrode bias voltages in the range 5-50 volts are suitable for a variety of materials, although higher and lower field strengths and voltages may be employed within the scope of this invention. The deflection electrode width and
spacing and the distance by which the side shield projects can vary within the limits imposed by the line-of-sight requirement. A shorter side shield projection distance requires a wider deflection electrode, and vice versa. Shorter side shields are
desirable to maximize the amount of plasma escaping the cathode region and minimize coating buildup on the side shields. Wider deflection shields however occupy more space in the processing chamber, require larger magnetic assemblies, and may suffer
increased transmission losses. Water cooling of the deflection electrodes and side shields may be necessary for continuous operation at high power. Bouncing of macroparticles off the deflection electrode can be reduced by means of multiple parallel
baffles mounted perpendicular to the electrode as shown in FIG. 2. The height, spacing, number, and location of the baffles may be selected to ensure that macroparticles must make at least two bounces to exit the output aperture.
The anode of the discharge may comprise an electrically isolated structure within the vacuum chamber or may comprise one or more structures electrically grounded to the (metal) vacuum chamber or system ground. The anode must be in electrical
contact with the plasma (i.e. impinged upon by a sufficient number of plasma particles to support the discharge) and is preferably a surface through which at least some of the magnetic flux lines parallel to the deflection electrodes pass.
The present invention differs from prior art filtered arc sources in its bi-directional output distribution, in the use of a linear magnetron cathode, in the general arrangement of deflection electrodes and substrate mounting areas, and in the
novel permanent magnet arrangement. The features of the present invention make it possible to construct a compact and efficient rectangular plasma source which can be made as long as desired. The bi-directional output is well suited for a central
source inside a rotating array of substrates, for example, or between two linear conveyors carrying substrates.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is a schematic drawing of a filtered arc plasma source of the present invention using an electromagnet, showing arc, deflector bias, and magnet power supply connections;
FIG. 2 is a cross-sectional drawing through a preferred embodiment of the invention using electromagnetic means, showing magnetic flux lines and macroparticle trajectories;
FIG. 3 is a schematic drawing of a plasma source using permanent magnetic means; and
FIG. 4 is a cross-sectional drawing through a preferred embodiment of the invention using permanent magnetic means, showing magnetic flux lines.
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
In FIG. 1 a schematic drawing of the invention is shown in which the cathode 1 has an evaporable surface wrapping around the periphery consisting of long side 2, end 3, and their opposite surfaces. Cathode side shields 4 are disposed
perpendicular to the evaporable surface along both edges, and projecting a distance "d" outward from the evaporable surface all around. Arc power supply 5 is connected at its negative terminal to cathode 1 and at its positive terminal to side shield 4
which also serves as an anode. Side deflection electrodes 6 are disposed parallel to the sides of the cathode 1. End deflection electrodes 7 may also be disposed parallel to the ends of the cathode to reduce end losses. An electromagnet coil 8 is
disposed around the outside of the deflection electrodes 6 and 7 and is connected to coil power supply 9. The coil is aligned such that the solenoidal magnetic field generated is substantially parallel to all four faces of the evaporable surface and to
the deflection electrodes. The apparatus may be operated coil current, and hence the magnetic field, in either polarity.
The deflection electrodes 6 and 7 may be connected to the positive output of deflection bias supply 15, the negative output of which is connected to the anode (side shield anode 4). Arrows 10 indicate the general direction of the plasma flow as
it is emitted approximately perpendicular to the evaporable surface (i.e. in an angular distribution falling off as angle away from the surface normal increases). Arrows 11 and 12 indicate the oppositely-directed streams into which the plasma is split
as it is redirected by deflection electrodes 6. Plasma streams 11 and 12 exit the source through oppositely facing output apertures 13 and 14.
In FIG. 2 a cross section of a preferred embodiment is shown in which electromagnet coils 19 and 20 are disposed around the outside of deflection electrodes 6. Magnetic flux lines 21 generated by current in coils 19 and 20 are substantially
parallel to evaporable surface faces 2 and to deflection electrodes 6. The shape and location of coils 19 and 20 were chosen by means of computer modeling to provide the desired magnetic field shape for the particular electrode geometry shown. The
magnetic flux lines shown in FIGS. 2 and 4 were generated by a commercially available finite element magnetic analysis program ("Maxwell" from Ansoft Corporation, Pittsburgh, Pa.). For coils 19 and 20 carrying a current density of 1000 amperes/cm.sup.2
and having relative dimensions as shown with respect to the electrodes, independent of actual scale, the field strength in the region adjacent to evaporable surfaces 2 is about 25 gauss.
The anode comprises side shields 4, which are connected to the positive output of the arc power supply and may preferably also be connected to the system ground. Deflection electrodes 6 may preferably be connected to the positive output of a
deflection bias power supply, the negative output of which is connected to the anode. Baffles 17 are disposed perpendicular to electrodes 6 to reduce bouncing of macroparticles toward the output apertures 13 and 14. Arrow 15 shows a trajectory for a
macroparticle 30 emitted at angle a from evaporable surface 2. Macroparticles emitted below angle a are blocked by side shields 4, while those above angle a are blocked by deflection electrodes 6.
In FIG. 3, permanent magnet assemblies 22 are disposed parallel to each other, to deflection electrodes 6 disposed between them. The magnet assemblies comprise permanent magnets 23 separated by pole pieces 24. The direction of magnetization of
all magnets 23 is the same, parallel to the deflection electrodes and perpendicular to the long direction of the cathode as indicated by the small arrows "M". Magnet assemblies 22 may preferably be longer than cathode 1 and more preferably longer than
deflection electrodes 6 in order to provide a uniform magnetic field over cathode ends 3 and end deflection electrodes 7.
In FIG. 4, a cross section of a preferred embodiment is shown in which permanent magnet assemblies 22 are disposed parallel to each other and outside deflection electrodes 6. Assemblies 22 comprise permanent magnets 23 separated by permeable
pole pieces 24. The anode comprises side shields 4 and anode segments 16. Magnetic flux lines 21 generated by assemblies 22 are substantially parallel to evaporable surface faces 2 and deflection electrode 6. The shape and location of magnets and pole
pieces were chosen by means of computer modeling to provide the desired magnetic field shape for the particular electrode geometry shown. For neodymium-iron-boron magnets (35 megagauss-oersted energy product) having relative dimensions as shown with
respect to the electrodes, independent of actual scale, the field strength in the region adjacent to evaporable surfaces 2 is about 70 gauss.
In reference to all figures, mounting and cooling of the cathode, anode, and filtering apparatus can be accomplished by known methods not shown. Some blockage of plasma flow due to cooling and power connections and mechanical supports is
unavoidable, however the connections may preferably be made at the ends of the cathode, leaving the sides unobstructed along their entire length. The cathode has the general shape of a rectangular bar, but may comprise multiple segments or replaceable
elements for convenience in operation and maintenance. The arc may be prevented from moving laterally off the edge of the evaporable surface by known means, e.g. insulators, shields, conductive rings, or permeable rings.
This invention may be further developed within the scope of the following claims. Accordingly, the above specification is to be interpreted as illustrative of only a single operative embodiment of the present invention, rather than in a strictly
limited sense.
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