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Abstract

The thermal performance of a Thermal Conduction (TCM) cooling scheme can be increased by providing a joint at the interface between the chip and piston having the reflow material leave the surface of the

Country

United States

Language

English (United States)

This text was extracted from an ASCII text file.

This is the abbreviated version, containing approximately
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Mechanically Controlled Thermal

The thermal
performance of a Thermal Conduction (TCM)
cooling scheme can be increased by providing a joint at the interface
between the chip and piston having the reflow material leave the
surface of the

As shown in
the figures, prior to assembly, reflow 1 is
deposited onto either the face of the piston 2 or the back side of
the chip 3. Microspacers 4 protrude from
the face of the piston are
used to fix final gap between the chip 5 and the piston 6. The and
chips are brought together such that the reflow is sandwiched between
the piston and the chip and there is a resulting force acting in
compression the chip and the piston. At
this time the thickness the
reflow material is greater than the height of the

Once assembled, the system is brought up in
temperature order
to liquify the reflow material. The
composition of reflow material
would be such that the liquidus of the material would be greater than
the allowable operating temperature of the chip, yet than the solidus
temperature of the controlled collapse connections (C4's) 7. Once
liquified, the gap material be squeezed out by the compression force
and fill the gap established when the microspacer bottoms out the
chip. The amount of reflow material
present at the is to be selected
such that it is sufficient to the resulting volume while insuring
that none of the material leaves the surface of the chip.