Dear Colleagues,
Is there any bonding technique for bonding pyrex glass and silicon
coated with a thick thermal oxide layer(oxide is 4 to 5 microns thick)
which does not involve any wet agenst like Epoxy ?
I have a silicon substrate which has 20 microns deep and 20 microns
wide isotropic channels etched in it. The whole surface was then
covered with a 5 micron thick thermal oxide layer. I am trying
to bond this with a Pyrex glass cover on top of the channels.
The glass piece is bigger than the Si piece. The Si piece is placed
on top of the glass piece with the channels on the bottom side of
the Si piece. A weight is placed on the Si piece to prevent the
epoxy from flowing inside the channels when it softens and cures.
Then a drop of epoxy is placed on one corner and the part is cured
at 60 degrees celcius for 10 minutes and the at 135 degrees celcius
for 30 minutes. On observing the channels, I found that most of the
channels had the epoxy inside it inspite of the weight placed
on the Si piece.
The flat surface outside the channels had bonded very well with the
glass.
I would be most grateful for any tips to solve this problem. Also does
anyone know of other more effective bonding techniques between
pyrex glass and Silicon oxide ?
Thank you very much for your patience.
Sincerely,
============================
Manish Mehta
IC Sensors
1701 McCarthy Blvd.
Milpitas
CA 95035
Tel: (408) 955 1276
email: mehta@cs.sfu.ca
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