Low temperature metallization paste is a silver- or silver/copper-filled front side current collector material used on thin-film solar cells. It gets its low-temperature label because it is processed at lower-than-traditional glass frit temperatures of ~1,000°C.

Product Benefits

Flexibility - flexible after drying; used to interconnect both rigid and flexible cells

Strong adhesion to a variety of TCOs

Passes IEC testing requirements

Superior 85°C/85% RH stability

Silver and silver-plated copper available

Drying temperatures as low as 120°C

Stable at room temperature

Designed by Award-Winning Chemists

Indium Corporation’s low-temperature metallization paste, LT-918, is designed by the same award-winning chemists who also developed the industry-leading printing solder pastes and conductive epoxies for the SMT and semiconductor industries.

Metallization Paste Blog Posts

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Folks, Richard asks: Dear Dr. Ron, Recently we had a solderability problem with tin-finished component leads and SAC305 solder paste. One of our engineers claimed that the problem was that the tin finish melts at too high a temperature (Tm= 232°C) for the SAC305 solder paste (Tm = 219°C) to melt...

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