At the Faraday Discussions

Multimedia

Mar 3, 2010

EV Group (EVG)

Solutions for 3D Integration and TSV (Through-Silicon Via)

Wafer level packaging employs specific alignment and wafer bonding techniques as enabling solutions for the stacking of wafers and three-dimensional integration of devices. This video features typical wafer processing steps and results, showing equipment from EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets.