AMD announced several new products at the Consumer Electronics Show (CES) in Las Vegas last week, including updates to it processor lineup. Among the new products on tap from AMD is a 2nd generation Ryzen line of chips based on the company's 12-nanometer Zen+ architecture. One of those processors, the Ryzen 5 2600, has been leaked in a SiSoftware SANDRA database entry, along with a next generation X470 chipset motherboard from ASUS.

The Ryzen 5 2600, with codename ZD2600BBM68AF_38/34_Y in the SANDRA database, is meant to replace 1st generation Ryzen 5 1600. It has 6 physical cores and 12 threads, and based on the codename, is clocked at 3.4GHz (base) to 3.8GHz (boost). The upcoming chip also features 16MB of L3 cache and 3MB of L2 cache, along with a 65W TDP.

Those specs are mostly similar to the Ryzen 5 1600, save for the clockspeeds—the Ryzen 5 1600 has a 3.2GHz base clock and 3.6GHz boost clock. Assuming the leaked information is correct, the Ryzen 5 2600 will have slightly higher clocks, and of course it will benefit from architectural optimizations, the latter of which may have led to AMD being able to goose the base and boost clock speeds.

As you can see in the results above, performance may not be scaling properly in the result perhaps due to lack of optimization in BIOS settings and turbo speed characteristics in these very early database entries.

According to the listing, the chip was plopped into an ASUS Crosshair VII Hero motherboard based on AMD's X470 chipset. AMD has not provided a bunch of details about X470 yet, though the company did say it is optimized for 2nd generation Ryzen processors, and that it will offer lower power characteristics and somewhat better performance. AMD also mentioned there being some features as well.

In case you haven't been following, Zen+ is not the same as Zen 2, the latter of which will represent a move to a 7nm manufacturing process. AMD said at CES that Zen 2's design is complete and that it improves on Zen in multiple dimensions. The company also said that Zen 3, which will be built on a 7nm+ process, is on track for 2020.