1. Using the new SAMSUNG microcomputer processor PID programmable temperature control technology and uses an infrared source and optics to target heat to individual components without dislodging other SMT parts by way of eddies air currents.

6.It has External Sensor Temperature control mode , that is detected by the sensor IC surface temperature control temperature , this function is good for freshman operation , it’s safe way protect components .

11. This machine also has soldering iron function , if you have the device , you can used for all of the components solder , desoldering , preheating , repair all components , especially Micro BGA components.

Technical Data

Voltage AC220V±10%

Max power consumption 715W

Preheating station parts

Max power consumption 540W

Light-emitting components Far infrared heating plate

Temperature Range 50°C-200°C

Display Type LED

Preheating area 120*120mm

Infrared lamp part

Max power consumption 150W

Light-emitting components Infrared emission lamp

Temperature Range 100°C-350°C / 212°F~662°F

Temperature Stability ±1°C

Display Type LED

Effective irradiation area 35*35mm

Come with 2 lens cup , you can be choice two of lens cup from 28mm / 38mm / 48mm.

2)Ensure that no combustible fusible explosive components in Infrared light can shine on the area , If you can not avoid , Must use reflective paper keep out that. like Plastic , Display , Phone camera , LED , Electrolytic capacitors.

3. Ensure that the working environment is no greater airflow to prevent heat loss , well sheltered measures when necessary.

4. Apply solder paste to the IC before the desoldering , also you can early preheat then Apply solder paste , Especially BGA package IC , should be early preheat then apply solder paste , the can make solder paste penetrate into the bottom of the IC.

5. Wear heat protective gloves and goggles. Place the visor , good shading measures to protect the eyes.

6. Turn on the Infrared light power , set the temperature to about 280°C . Make the appropriate adjustments based on the size of the IC and circuit board . IC by infrared light irradiation will be rapidly warming ( generally 1 to 3 minutes ) .

7. Just started using this product , it is best to try to use the abandoned circuit board rework a few times. and so familiar with the use of this product , then carry out normal maintenance work.