Plasma Enhanced Atomic Layer Deposition - Products

Plasma Enhanced Atomic Layer Deposition (PEALD) uses chemical precursors just like in thermal ALD but it also cycles an RF-plasma creating the necessary chemical reactions in a highly controlled manner.

XP8 HIGH CAPACITY PLATFORM

XP8 is the latest in ASM’s XP family of standard platforms for 300mm wafers, and accommodates up to eight chambers for PEALD or PECVD, which can also be integrated on the same platform.

MAJOR FEATURES ​

A central robot designed to move two wafers simultaneously to dual chamber modules (DCMs) makes XP8 the highest-productivity single-wafer process tool in the industry. A total of four dual chamber modules (DCMs) can be integrated with the XP8 platform to minimize footprint and maximize productivity for an industry-leading low cost of ownership (CoO) solution.