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Reliability Challenges for Large ASICs

In this talk, Yongsheng Sun(孙 永生), will introduce HiSilicon (海思) and describe their cutting edge products. HiSilicon is one of the largest fabless companies and currently ships chips in the most advanced process technologies. Due to their success and huge number of products being shipped, reliability is a top concern. Sarinda Wang will describe the key challenges when designing highly reliable, silicon intenstive products. Specific issues will also be discussed to sensitisize the audience to the real-world reliability problems faced when shipping products in the most advanced technologies.

About the Speaker

Yongsheng Sun received the B.S and M.S degree in Microelectronics from the University of Electronic Science and Technology of China in 2003 and 2006, respectively. In 2006, he joined Hisilicon Technologies Co., LTD. as a quality and reliability engineer, responsible for supplier’s quality and reliability management. His current work is focus on Design for Reliability since 2011.