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Automation of Die Attach using BondFoil™

Keywords: BondFoil, Die Attach, Automation

BondFoil™ is a new die attach material that is comprised of a metal foil coated on both faces with a silver-filled, B-staged adhesive. The adhesive is thermoplastic polyimide (TPI) which is thermally stable in air to 400˚C for an extended time period. Previous research has demonstrated that BondFoil™ enables the bonding of a silicon die directly to aluminum despite the severe CTE mismatch. Like solder, BondFoil™ can be stamped into preforms. It also has a long shelf life and is not tacky. The purpose of this study is to develop a method for using BondFoil™ preforms with a commercially available, high volume automatic die attach system.
An MRSI production die attach system was used for this investigation. The MRSI system was capable of preheating the substrate and controlling the downward pressure of the collet onto the preform and Si chip. The heated bonding stage was fixed at a temperature of 250˚C; the effects of time and pressure on the BondFoil™ and Si die were investigated. The quality of the bond was measured by C-SAM imaging and by die shear. The suitability of BondFoil for high volume die attach was quantified. The relative advantages of BondFoil™ relative to other die attach materials (including solder, epoxy and sintered nanosilver) will be discussed.