Useful links

Development of a One Time Deformable Microsystem with Integrated Sensor Network

Development of a One Time Deformable Microsystem with Integrated Sensor Network

Problem Definition:

Wearable and implantable electronics have drawn much attention since
last decades. Very often wearable and implantable circuits require non-flat assemblies,
because preferably the circuit must follow the irregular shapes of body parts,
garments and etc. Conventional electronic circuits, which are fabricated and
assembled from a rigid (or ultimately flexible) board, become difficult or problematic
for use in these cases.

Objectives:

In the
master thesis, the student will apply and optimize the stretchable technology
in CMST and develop a one time deformable microsystem with integrated sensor
network for a novel application. The student is free to define an application
where the technology will be used, and will make a demonstrator out of it. The
starting point is the existing technology developed at CMST. Fig. 1 illustrates
an example of our technology. The principle
behind is that an electronic circuit is divided into functional islands
(containing the electronic components), which are interconnected by meander shaped,
stretchable interconnects. During the thermoforming, the stretchable interconnect
deforms and prevent the functional islands from being broken.

Fig. 1: a 2D flat
circuit is thermoformed to a 3D circuit without losing its electrical
functionalities

As a summary, the student will

-Define
and develop an application to demonstrate the stretchable technology

-Design
and implement a microsystem with integrated sensor network (from available
sensors)

-Apply
and optimize the available technology for one time deformable microsystem