TS9000 Series Options

MTA Option (Mold Thickness Analysis)

The MTA option generates terahertz pulses which are partially reflected by the surface of the package, and partially by layers within the package. Their reflections are detected, and the times taken for these reflections to return are computed, enabling the system to measure the thickness of the mold.

TDR Option (Time Domain Reflectometry)

High resolution TDR/TDT utilizing terahertz technology locates wiring errors in IC packages, printed boards, and electronic components. Errors can be pinpointed and mapped on the CAD data of the item under analysis.