NH 1

NEW

Interflux® NH 1 is a no-clean colophony free activated solder wire that gives fast and repeatable soldering results on a wide range of surfaces including brass, in lead-free alloys.

Interflux® NH 1 is a no-clean colophony free activated solder wire that gives fast and repeatable soldering results on a wide range of surfaces including brass, in lead-free alloys.
NH 1 can be used in both hand soldering and auto-mated soldering processes
RE L1 to IPC and EN standards.

RosIX 705

NEW

Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability on surfaces that are difficult to solder in lead-free alloys.

Interflux® RosIX 705 is an activated rosin based, no-clean solder wire with increased wetting ability on surfaces that are difficult to solder in lead-free alloys.
RosIX 705 can be used on surfaces that are difficult
to solder, e.g. OSP, Ni, Zn, brass, German silver, etc.. as well
as on degraded and oxidized surfaces.
RO L1 to IPC and EN standards.

Timah solder berbasis timbal

RosIX 705 SnPb(Ag)

NEW

Interflux® RosIX 705 SnPb(Ag) is an activated rosin based, no-clean solder wire with increased wetting ability on surfaces that are difficult to solder in SnPb(Ag) alloys.

Interflux® RosIX 705 SnPb(Ag) is an activated rosin based, no-clean solder wire with increased wetting ability on surfaces that are difficult to solder in SnPb(Ag) alloys.
RosIX 705 SnPb(Ag) can be used on surfaces that are difficult to solder, e.g. OSP, Ni, Zn, brass, German silver,... as well as on degraded and oxidized surfaces.
RO L1 to IPC and EN standards.