Abstract

We study the performance and reliability of carbon nanofiber (CNF) interconnects under high-current stress by examining CNF breakdown for four test configurations, suspended/supported with/without tungsten deposition. The use of W is to improve the CNF-electrode contact. The supported cases show a larger current density just before breakdown than the suspended ones, suggesting an effective heat dissipation to the substrate. The W-deposited contacts reduce the initial total resistance from megaohm range without W to kilo-ohms. High-current stress does not change the total resistance of the test structures with W unlike those without W deposition.

Received 22 July 2008Accepted 19 August 2008Published online 10 September 2008

Acknowledgments:

We are grateful to Kevin Mcilwrath and Xiao Feng Zhang of Hitachi High-Technologies America for their expert technical support. This work was supported by the United States Army Space and Missile Defense Command (SMDC) and carries Distribution Statement A, approved for public release, distribution unlimited.