The study demonstrates the possibility of using laser radiation for the ceramic bracket removing. Three laser radiations
were examined for this effect and the removing possibility and velocity together with enamel and root damage were
investigated. A diode pumped Tm:YAP microchip laser generating a wavelength 1.9 μm, diode pumped Nd:YAG laser
with 1.44 μm wavelength, GaAs diode with 0.808 μm were used for the debonding purpose. The measurement of
transmission and absorption of the basic element - bracket, adhesive resin, and enamel was also made with the goal to
explain the source of the heat and bracket debonding. The explanation of the debonding effect is also presented.
From the results it is possible to conclude that continuously running diode pumped microchip Tm:YAP laser having
output power 1W can be a good candidate for ceramic bracket debonding procedure.