GF-B-HT Shuttle Batch Ovens

The Gold-Flow™ GF-B-HT Shuttle Batch oven was designed for prototyping printed circuit board assembly and batch production runs. Capable for lead or lead-free soldering.
While one PCB is being processed, another circuit board can be cooled and off-loaded, then a third board can be loaded and shuttled into the chamber for reflow

Lead Free (RoHS compliant)
Cost-effective batch reflow oven utilizing forced air convection heating technology with individual time and temperature controls makes profile set up quick and easy. The GF-B-HT is a high temperature model capable of lead and lead-free soldering. This unique shuffle system enables a higher throughput than standard batch ovens. Both sides of the SMT reflow oven have a cooling station. While one printed circuit board is being processed, another circuit board can be cooled and off-loaded, then a third board can be loaded and shuttled into the chamber for reflow.