Electron Scattering at Copper Surfaces

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As interconnects are scaled to smaller dimensions, the resistivity of the copper lines increases above the bulk resistivity due to a phenomena known as the size effect. Three components are known to contribute to the size effect: surface roughness, grain boundary scattering, and surface scattering. Of these, surface roughness and grain boundary scattering have been researched previously, and methods to minimize the resistivity increase due to these mechanisms have been proposed. The focus of this thesis research was to address the issue of surface scattering, which is the least understood component of the size effect. In particular, little is known about the materials and surface structure which lead to completely specular scattering (i.e. no increase in resistivity for thin layers).6 Keithley Instruments, Application Note #2615, Measuring the Resistivity and
Determining the Conductivity Type of Semiconductor Materials Using a Four-
Point Collinear Probe and the model 6221 DC and AC Current Source, (Keithley
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Title

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Electron Scattering at Copper Surfaces

Author

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Jaya Murli Purswani

Publisher

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ProQuest - 2008

ISBN-13

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