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Abstract:

Attachment devices and methods for use with light emitting devices are
provided. In one aspect, the light emitting device can include a submount
and a light emission area disposed over the submount. The device can
further include at least one attachment member provided on the submount.
The attachment member can engage an electrical component thereby
providing a gas-tight, solder free connection between the attachment
member and electrical component.

Claims:

1. A light emitting device comprising: a submount; a light emission area
disposed over the submount; and at least one attachment member provided
on the submount for engaging an electrical component and providing a
solder free connection for attachment of the electrical component to the
attachment member.

2. The light emitting device of claim 1, wherein the attachment member
comprises an insulated housing and one or more openings within the
housing for receiving the electrical component.

3. The light emitting device of claim 2, wherein the openings comprise a
grip member for physically securing the electrical component within the
attachment member.

6. The light emitting device of claim 1, wherein the light emission area
comprises one or more light emitting diodes (LEDs) disposed under a
filling material.

7. The light emitting device of claim 1, wherein a retention material is
provided about the light emission area.

8. The light emitting device of claim 7, wherein the retention material
is dispensed about the light emission area.

9. The light emitting device of claim 1, wherein the attachment member is
adapted to physically and electrically connect the electrical component
to the light emitting device.

10. The device of claim 1, wherein the attachment member comprises an
insulation displacement connector (IDC) having at least one set of blade
portions for electrically communicating with electrical component.

11. The device of claim 10, wherein the IDC comprises a double contact
connector having more than one set of blade portions.

12. The device of claim 1, wherein the attachment member comprises an
insulated housing with one or more pins extending from housing.

13. The device of claim 12, wherein the pins are configured to physically
and electrically connect to a female terminal of electrical component
thereby providing the solder free connection.

14. The device of claim 1, wherein the attachment member physically and
electrically connects to submount via solder, adhesive, or electrically
conductive tape.

15. The device of claim 1, wherein the attachment member comprises a
first channel for crimping about a bare portion of electrical component.

16. The device of claim 15, wherein the attachment member comprises a
second channel for crimping about an insulated portion of electrical
component.

17. A method of providing external electrical current to a light emitting
device, the method comprising: providing the light emitting device, the
device comprising: a submount; a light emission area disposed over the
submount; and at least one attachment member on the submount, wherein the
attachment member releasably engages an electrical component thereby
providing a solder free connection; attaching the electrical component
into the attachment member of the device to physically and electrically
connect the electrical component to the device.

18. The method of claim 17, wherein attaching the electrical component
comprises inserting the electrical component into an opening of a housing
of the attachment member to physically and electrically connect the
electrical component to the device.

19. The method of claim 17, further comprising releasing the electrical
component from the attachment member to physically and electrically
disconnect the electrical component from the device.

20. The method of claim 19, wherein releasing the electrical component
comprises depressing a tab of the attachment member to physically and
electrically disengage the electrical component from the attachment
member.

21. The method of claim 17, wherein attaching the electrical component
comprises positioning the electrical component between at least one set
of blade portions of an insulation displacement connector (IDC).

22. The method of claim 21, wherein attaching the electrical component
comprises positioning the electrical component between at least two set
of blade portions of the IDC.

23. The method of claim 17, wherein attaching the electrical component
comprises inserting one or more pins extending from a housing of the
attachment member into a female terminal of an external housing.

24. The method of claim 23, wherein the pins are configured to physically
and electrically connect to the female terminal of electrical component.

25. The method of claim 17, further comprising electrically and
physically connecting the attachment member to the submount via
soldering.

26. The method of claim 17, wherein attaching the electrical component
comprises crimping a bare portion of the electrical component in a first
channel.

27. The device of claim 26, wherein attaching the electrical component
further comprises crimping an insulated portion of the electrical
component in a second channel.

28. A light emitting device comprising: a submount; a light emission area
disposed over the submount; and at least one attachment member attached
to the submount, the attachment member comprising a portion for receiving
an electrical connector and maintaining the electrical connector a
distance spaced apart from the submount.

29. The light emitting device of claim 28, wherein the light emission
area comprises one or more light emitting diodes (LED) at least partially
disposed under a filling material.

30. The light emitting device of claim 28, further comprising a retention
material disposed about at least a portion of the light emission area.

31. The light emitting device of claim 31, wherein the retention material
comprises a dispensed retention material on the submount.

32. The light emitting device of claim 29, wherein the filling material
comprises an encapsulant having at least one phosphor.

33. The light emitting device of claim 28, wherein the attachment member
comprises a central body portion disposed between one or more raised
portions.

34. The light emitting device of claim 33, wherein the one or more raised
portions comprise an attachment portion spaced apart the distance from
the submount for electrically connecting to at least a portion of an
electrical wire.

35. The light emitting device of claim 33, wherein the central body
portion comprises an attachment portion spaced apart the distance from
the submount for electrically connecting to at least a portion of an
electrical wire.

36. The light emitting device of claim 28, wherein the distance the
attachment member is spaced apart from the submount is greater than 0
millimeters (mm) from the submount.

37. The light emitting device of claim 28, wherein the distance the
attachment member is spaced apart from the submount is less than a height
of a retention material disposed about at least a portion of the light
emission area.

39. The light emitting device of claim 28, wherein the electrical
connector is crimped between upper body portions of the attachment
member.

40. The light emitting device of claim 39, wherein a plastic housing is
disposed about the area where the wire is crimped.

41. A light emitting device comprising: a submount; at least one
electrical trace electrically connected with the submount; an array of
LEDs electrically connected with the at least one electrical trace; and
at least one attachment member attached to the submount, the attachment
member comprising a portion for receiving an electrical connector and
maintaining the electrical connector a distance spaced apart from the
submount.

42. The light emitting device of claim 41, further comprising a retention
material at least partially disposed about the array of LEDs.

43. The light emitting device of claim 42, wherein the retention material
is adapted for retaining a fill material for covering the LEDs.

44. The light emitting device of claim 43, wherein the fill material at
least partially comprises a phosphor or other material for affecting
light color from light emitted from the LEDs.

45. The light emitting device of claim 42, wherein the retention material
is disposed over at least a portion of the at least one electrical trace.

46. The light emitting device of claim 42, wherein the retention material
is disposed over at least a portion of the at least one electrical trace
to which at least one of the LEDs is connected.

47. The light emitting device of claim 41, wherein the attachment member
comprises at least one attachment portion spaced apart the distance from
the submount.

48. The light emitting device of claim 47, wherein the attachment portion
is disposed at least partially along a central body portion.

49. The light emitting device of claim 48, wherein the attachment portion
is disposed at least partially along at least one raised portion of the
attachment member.

50. The light emitting device of claim 47, wherein an electrically
conductive wire is positioned and attached at least partially over the at
least one attachment portion.

51. The light emitting device of claim 41, wherein the distance the
attachment member is spaced apart from the submount is greater than 0
millimeters (mm) from the submount.

52. The light emitting device of claim 41, wherein the electrical
connector is crimped between upper body portions of the attachment
member.

53. The light emitting device of claim 52, wherein a plastic housing is
disposed about the area where the wire is crimped.

54. A method for fabricating a light emitting device, the method
comprising: providing a submount comprising one or more light emitting
diodes (LEDs) disposed over the submount, the submount comprising an
attachment member in electrically communication with the one or more
LEDs; and electrically connecting the attachment member to an external
electrical component such that the electrical component is maintained a
distance spaced apart from the submount.

55. The method of claim 54, wherein electrically connecting the
attachment member to the external electrical component comprises
soldering the electrical component to the attachment member.

56. The method of claim 55, wherein soldering the electrical component to
the attachment member comprises soldering the electrical component at the
distance greater than 0 mm spaced apart from the submount.

57. The method of claim 54, wherein electrically connecting the
attachment member to the external electrical component comprises
receiving the external electrical component into an opening of the
attachment member.

58. The method of claim 54, wherein electrically connecting the
attachment member to the external electrical component comprises
positioning the external electrical component within a set of blades
disposed on the attachment member.

59. The method of claim 54, wherein electrically connecting the
attachment member to the external electrical component comprises
inserting pins of the attachment member into a female terminal disposed
on the electrical component.

60. The method of claim 54, wherein providing a submount comprises
providing a submount with a retention material dispensed on the submount,
the retention material at least partially dispensed about the one or more
LEDs.

61. The method of claim 60, further comprising providing a fill material
at least partially over the one or more LEDs, wherein the fill material
is retained in place at least partially by the retention material.

62. The method of claim 54, wherein electrically connecting the
attachment member comprises crimping the external electrical component
between upper body portions of the attachment member.

63. A device comprising: a wire attachment surface on a device surface
comprising an attachment member spaced apart from the device surface to
receive a wire for bonding to the wire attachment surface and
electrically coupling the wire to the device.

64. The device of claim 63, wherein the attachment member comprises a
reduced area portion relative to a pad portion of the wire attachment
surface directly on the device surface.

65. The device of claim 63, wherein the reduced area portion is adapted
to reduce the thermal conductivity of the attachment member relative to
the pad portion.

66. The device of claim 63, wherein the attachment member comprises a
reduced thermal conductivity portion relative to the pad portion.

67. The device of claim 63, where the attachment member is adapted to
maintain the wire spaced apart from the device surface.

68. The device of claim 63, wherein the attachment member is adapted to
retain the wire prior to bonding.

69. A device comprising: a wire attachment surface on a device surface
comprising an attachment member adapted to receive a wire for bonding and
a pad portion electrically coupled to the device, the attachment member
providing electrical connection between the wire and the device while
reducing the thermal coupling between the wire and the pad portion
relative to the pad portion and the device surface.

Description:

CROSS REFERENCE TO RELATED APPLICATION

[0001] This application claims the benefit of and priority to U.S.
Provisional Patent Application Ser. No. 61/416,184 filed Nov. 22, 2010,
the disclosure of which is incorporated by reference herein in its
entirety.

[0003] Light emitting devices, such as light emitting diodes (LEDs), may
be utilized in packages for providing white light (e.g., perceived as
being white or near-white), and are developing as replacements for
incandescent, fluorescent, and metal halide high-intensity discharge
(HID) light products. A representative example of an LED device comprises
a device having at least one LED chip, a portion of which can be coated
with a phosphor such as, for example, yttrium aluminum garnet (YAG). The
phosphor coating can convert light emitted from one or more LED chips
into white light. For example, LED chips can emit light having desired
wavelengths, and phosphor can in turn emit yellow fluorescence with a
peak wavelength of about 550 nm. A viewer perceives the mixture of light
emissions as white light. As an alternative to phosphor converted white
light, light emitting devices of red, green, and blue (RGB) wavelengths
can be combined in one device or package to produce light that is
perceived as white.

[0004] FIGS. 1A and 1B illustrate a portion of a conventional, prior art
light emitting device, generally designated 10. A portion of light
emitting device 10 can comprise one or more attachment surfaces 14
disposed over a submount 12. Attachment surfaces 14 can provide an
electrically conductive material for electrically connecting to external
components, such as electrical components connected to a power source for
supplying electrical current to the light emitting device 10. Submount 12
can comprise any suitable substrate or submount, for example a printed
circuit board (PCB) or a metal core printed circuit board (MCPCB). At
least a portion of submount 12 can comprise a heatsink, for example PCBs
and MCPCBs can comprise thermally conductive layers including dielectric
and/or metal core layers. Thus, heat generated from one or more LEDs (not
shown) can dissipate quickly through submount 12. Joining components to
attachment surfaces 14 using, for example, soldering techniques is
inherently difficult. Typically, the entire submount 12 will need to be
heated in order to get a good flow of solder to the solder contacts. If
the LED component is already attached to a heatsink prior to wire-attach,
the whole heatsink assembly needs to be heated. This can cause heating or
over-heating of portions unsuited for such heat and can present time and
energy constraints associated with installing and/or using light emitting
devices in various applications.

[0005] FIG. 1B illustrates conventional, prior art attachment surface 14
for electrically connecting to an external electrical component.
Electrical component can comprise an electrically conductive wire,
generally designated 15. Wire 15 can comprise an electrically conductive
connecting portion 16 and an insulated portion 18. Connecting portion 16
can comprise an exposed, or bare, wire portion typically constructed of
an electrically conductive metal material. Conventional attachment
surface 14 comprises a flat surface formed integral with submount 12 over
which connecting portion 16 can be electrically connected. Such
connection is typically performed by soldering connecting portion 16 to
attachment surface 14 (solder not shown). In one aspect, submount 12 can
be mounted to a heatsink prior to attaching wire 15 so that the wires can
be short. As attachment surface 14 is flat and directly communicates with
submount 12, heat can dissipate quickly from the area during soldering,
thus making soldering connecting portion 16 to attachment surface 14
difficult, tedious, and time consuming.

[0006] Despite availability of various LED devices and methods in the
marketplace, a need remains for improved attachment devices and methods
suitable for industrial and commercial lighting products. LED devices and
methods described herein can advantageously promote ease of manufacture
by improving attachment members, such as solder contacts. Such attachment
member can further advantageously include connectors that are solder
free, gas-tight connections which eliminate the need to tediously solder
components altogether.

SUMMARY

[0007] In accordance with this disclosure, novel attachment devices and
methods for light emitting devices are provided that are well suited for
a variety of applications, including industrial and commercial lighting
products. It is, therefore, an object of the subject matter described
herein to provide light emitting devices and methods comprising at least
one raised attachment member, such as a solder contact. In other aspects,
an object of the subject matter described herein is to provide light
emitting devices and methods comprising at least one solder free,
gas-tight electrical connector or attachment member.

[0008] These and other objects of the present disclosure as can become
apparent from the disclosure herein are achieved, at least in whole or in
part, by the subject matter disclosed herein.

BRIEF DESCRIPTION OF THE DRAWINGS

[0009] A full and enabling disclosure of the present subject matter
including the best mode thereof to one of ordinary skill in the art is
set forth more particularly in the remainder of the specification,
including reference to the accompanying figures, in which:

[0011]FIG. 2 is a top perspective view illustrating a portion of a light
emitting device with attachment member according to the disclosure
herein;

[0012] FIGS. 3A and 3B are perspective views illustrating different
aspects of attachment members according to the disclosure herein;

[0013]FIG. 4 is a top perspective view illustrating an embodiment of a
light emitting device and attachment member according to the disclosure
herein;

[0014] FIG. 5 is a side view illustrating an embodiment of a light
emitting device and attachment member according to the disclosure herein;

[0015] FIG. 6 is a top plan view illustrating an embodiment of a light
emitting device having one or more patterns of light emitting diodes
(LEDs) according to the disclosure herein;

[0016] FIG. 7 is a top perspective view illustrating an embodiment of a
light emitting device having one or more patterns of LEDs according to
the disclosure herein;

[0017]FIG. 8A is a top perspective view illustrating an embodiment of a
light emitting device and attachment member according to the disclosure
herein;

[0018] FIG. 8B is a top perspective view of a portion of the light
emitting device and attachment member of FIG. 8A;

[0019] FIG. 9 is a first cross-sectional view illustrating a light
emission area of a light emitting device according to the disclosure
herein;

[0020] FIG. 10 is a second cross-sectional view illustrating a light
emission area of a light emitting device according to the disclosure
herein;

[0021] FIG. 11 is a top view illustrating a light emitting device
according to the disclosure herein;

[0022] FIG. 12 is a cross-sectional view illustrating a gap area of a
light emitting device according to the disclosure herein;

[0023] FIG. 13 is a top perspective view illustrating a portion of a light
emitting device with attachment member according to the disclosure
herein;

[0024] FIGS. 14A to 14H are top perspective views illustrating different
embodiments of attachment members according to the disclosure herein;

[0025] FIGS. 15A to 15E illustrate different embodiments of attachment
surfaces according to the disclosure herein;

[0026] FIGS. 16A to 16C are cross-sectional views of different embodiments
of attachment members according to the disclosure herein;

[0027] FIG. 16D is a side view of an attachment member according to the
disclosure herein;

[0028] FIGS. 17A to 17C are cross-sectional views of different embodiments
of attachment members according to the disclosure herein;

[0029] FIG. 18 is a top view illustrating a light emitting device and
attachment member according to the disclosure here;

[0030] FIG. 19 is a side view of the device in FIG. 18;

[0031]FIG. 20 is a top perspective view of the device in FIGS. 18 and 19
and illustrates electrical connection of an electrical component to
attachment member;

[0032] FIG. 21 is a cross-sectional view of the device in FIGS. 18 through
20 showing an attachment member connected to the submount; and

[0033]FIG. 22 is a side perspective view of a light emitting device
attachment member according to the disclosure herein.

DETAILED DESCRIPTION

[0034] Reference will now be made in detail to possible aspects or
embodiments of the subject matter herein, one or more examples of which
are shown in the figures. Each example is provided to describe the
subject matter and not as a limitation. In fact, features illustrated or
described as part of one embodiment can be used in another embodiment to
yield still a further embodiment. It is intended that the subject matter
disclosed and envisioned herein covers such modifications and variations.

[0035] As illustrated in the various figures, some sizes of structures or
portions are exaggerated relative to other structures or portions for
illustrative purposes and, thus, are provided to illustrate the general
structures of the present subject matter. Furthermore, various aspects of
the present subject matter are described with reference to a structure or
a portion being formed on other structures, portions, or both. As will be
appreciated by those of skill in the art, references to a structure being
formed "on" or "above" another structure or portion contemplates that
additional structure, portion, or both may intervene. References to a
structure or a portion being formed "on" another structure or portion
without an intervening structure or portion are described herein as being
formed "directly on" the structure or portion. Similarly, it will be
understood that when an element is referred to as being "connected",
"attached", or "coupled" to another element, it can be directly
connected, attached, or coupled to the other element, or intervening
elements may be present. In contrast, when an element is referred to as
being "directly connected", "directly attached", or "directly coupled" to
another element, no intervening elements are present.

[0036] Furthermore, relative terms such as "on", "above", "upper", "top",
"lower", or "bottom" are used herein to describe one structure's or
portion's relationship to another structure or portion as illustrated in
the figures. It will be understood that relative terms such as "on",
"above", "upper", "top", "lower" or "bottom" are intended to encompass
different orientations of the device in addition to the orientation
depicted in the figures. For example, if the device in the figures is
turned over, structure or portion described as "above" other structures
or portions would now be oriented "below" the other structures or
portions. Likewise, if devices in the figures are rotated along an axis,
structure or portion described as "above", other structures or portions
would now be oriented "next to" or "left of" the other structures or
portions. Like numbers refer to like elements throughout.

[0037] Light emitting devices according to embodiments described herein
may comprise group III-V nitride (e.g., gallium nitride) based light
emitting diodes (LEDs) or lasers fabricated on a growth substrate, for
example, silicon carbide substrate, such as those devices manufactured
and sold by Cree, Inc. of Durham, N.C. For example, Silicon carbide (SiC)
substrates/layers discussed herein may be 4H polytype silicon carbide
substrates/layers. Other silicon carbide candidate polytypes, such as 3C,
6H, and 15R polytypes, however, may be used. Appropriate SiC substrates
are available from Cree, Inc., of Durham, N.C., the assignee of the
present subject matter, and the methods for producing such substrates are
set forth in the scientific literature as well as in a number of commonly
assigned U.S. patents, including but not limited to U.S. Pat. No. Re.
34,861; U.S. Pat. No. 4,946,547; and U.S. Pat. No. 5,200,022, the
disclosures of which are incorporated by reference herein in their
entireties. Any other suitable growth substrates are contemplated herein.
For example, sapphire and gallium arsenide can be utilized as growth
substrates for fabricating LEDs or lasers as described herein.

[0038] As used herein, the term "Group III nitride" refers to those
semiconducting compounds formed between nitrogen and one or more elements
in Group III of the periodic table, usually aluminum (Al), gallium (Ga),
and indium (In). The term also refers to binary, ternary, and quaternary
compounds such as GaN, AIGaN and AIInGaN. The Group III elements can
combine with nitrogen to form binary (e.g., GaN), ternary (e.g., AIGaN),
and quaternary (e.g., AlInGaN) compounds. These compounds may have
empirical formulas in which one mole of nitrogen is combined with a total
of one mole of the Group III elements. Accordingly, formulas such as
AlxGa1-xN where 1>x>0 are often used to describe these compounds.
Techniques for epitaxial growth of Group III nitrides have become
reasonably well developed and reported in the appropriate scientific
literature, and in commonly assigned U.S. Pat. No. 5,210,051, U.S. Pat.
No. 5,393,993, and U.S. Pat. No. 5,523,589, the disclosures of which are
hereby incorporated by reference herein in their entireties.

[0039] Although various embodiments of LEDs disclosed herein comprise a
growth substrate, it will be understood by those skilled in the art that
the crystalline epitaxial growth substrate on which the epitaxial layers
comprising an LED are grown may be removed, and the freestanding
epitaxial layers may be mounted on a substitute carrier substrate or
submount which may have different thermal, electrical, structural and/or
optical characteristics than the original substrate. The subject matter
described herein is not limited to structures having crystalline
epitaxial growth substrates and may be used in connection with structures
in which the epitaxial layers have been removed from their original
growth substrates and bonded to substitute carrier substrates.

[0040] Group III nitride based LEDs according to some embodiments of the
present subject matter, for example, may be fabricated on growth
substrates (such as a silicon carbide substrates) to provide horizontal
devices (with both electrical contacts on a same side of the LED) or
vertical devices (with electrical contacts on opposite sides of the LED).
Moreover, the growth substrate may be maintained on the LED after
fabrication or removed (e.g., by etching, grinding, polishing, etc.). The
growth substrate may be removed, for example, to reduce a thickness of
the resulting LED and/or to reduce a forward voltage through a vertical
LED. A horizontal device (with or without the growth substrate), for
example, may be flip chip bonded (e.g., using solder) to a carrier
substrate or printed circuit board (PCB), or wire bonded. A vertical
device (with or without the growth substrate) may have a first terminal
solder bonded to a carrier substrate, mounting pad, or PCB and a second
terminal wire bonded to the carrier substrate, electrical element, or
PCB. Examples of vertical and horizontal LED chip structures are
discussed by way of example in U.S. Publication No. 2008/0258130 to
Bergmann et al. and in U.S. Publication No. 2006/0186418 to Edmond et
al., the disclosures of which are hereby incorporated by reference herein
in their entireties.

[0041] The LED can be coated, at least partially, with one or more
phosphors with the phosphors absorbing at least a portion of the LED
light and emitting a different wavelength of light such that the LED
emits a combination of light from the LED and the phosphor. In one
embodiment, the LED emits a white light which is a combination of light
emission from the LED chip and phosphor. The LED can be coated and
fabricated using many different methods, with one suitable method being
described in U.S. Patent Application Ser. Nos. 11/656,759 and 11/899,790,
both entitled "Wafer Level Phosphor Coating Method and Devices Fabricated
Utilizing Method", and both of which are incorporated herein by
reference. Other suitable methods for coating one or more LEDs are
described in U.S. patent application Ser. No. 12/014,404, entitled
"Phosphor Coating Systems and Methods for Light Emitting Structures and
Packaged Light Emitting Diodes Including Phosphor Coating" and the
continuation-in-part application U.S. patent application Ser. No.
12/717,048, entitled "Systems and Methods for Application of Optical
Materials to Optical Elements", the disclosures of which are hereby
incorporated by reference herein in their entireties. LEDs can also be
coated using other methods such as electrophoretic deposition (EPD), with
a suitable EPD method described in U.S. patent application Ser. No.
11/473,089 entitled "Close Loop Electrophoretic Deposition of
Semiconductor Devices", which is also incorporated herein by reference.
It is understood that LED devices and methods according to the present
subject matter can also have multiple LEDs of different colors, one or
more of which may be white emitting. Although the focus of the discussion
relates to white light, any other hue is contemplated herein.

[0042] Referring now to FIGS. 2 to 22, FIG. 2 illustrates a portion of a
light emitting device, generally designated 20. Light emitting device 20
can comprise a submount 22 over which one or more LEDs (not shown) may be
mounted. Submount 22 can comprise a PCB or metal core printed circuit
board (MCPCB), each of which can comprise one or more thermally
conductive layers or other laminate structure (FIG. 10). The thermally
conductive layers may either be electrically insulating (e.g.,
dielectric) or conducting (e.g., metal). Light emitting device 20 can
comprise a wire attachment surface on the surface of device 20 comprising
an attachment member, generally designated 30. Wire attachment surface
comprising attachment member 30 can be disposed on device 20 surface and
can be adapted to receive a wire, generally designated 15, for bonding
and can further comprise a pad or body portion 32 electrically coupled to
device 20 typically via solder. The attachment member 30 can provide
electrical connection between the wire and the device while reducing the
thermal coupling between the wire 15 and pad portion relative to the pad
portion and device 20 surface. Wire 15 can comprise any electrically
and/or thermally conductive wire. In one aspect, attachment member 30 can
be spaced apart from device 20 surface and can be configured to receive
an external component, for example, a wire 15 for attachment to the wire
attachment surface and for electrically coupling the wire 15 to device
20.

[0043] Attachment member 30 can be disposed over a portion of submount 22
during fabrication. for electrically connecting to an external component.
For example, attachment member 30 can be positioned over an attachment
surface, similar to surface 14 (FIG. 1A) which electrically connects to
and communicates with one or more LEDs of the device. (See also
attachment surface 124, FIG. 13 and FIGS. 15A-E). Attachment member 30
can electrically connect and/or link external component with light
emitting device 20. In one aspect, external component can comprise an
electrically conductive component for supplying electrical signal, or
current, to light emitting device 20. Attachment member 30 can comprise
any suitable electrically conductive member and/or material for
connecting to the external source. For example, attachment member 30 can
comprise a solder contact for facilitating electrical connection with an
external component capable of supplying electrical current to light
emitting device 20. Attachment member 30 can be formed integral with
submount 22 or as a separate portion attached to submount. Attachment
member 30 can comprise any suitable electrically conductive material. In
one aspect, attachment member 30 can comprise a metallic member including
but not limited to copper, silver, stainless steel and/or other metals or
alloys thereof. In other aspects as described further herein, attachment
members can comprise a gas-tight (e.g., solder free) connector or
separate PCB.

[0044]FIG. 2 illustrates an electrical component provided for
electrically connecting to attachment member 30. Attachment member 30 can
electrically communicate with submount 22 for supplying electrical
current to one or more LEDs (not shown). Electrical component can
comprise wire 15. Wire 15 can comprise a connecting portion 16 and an
insulated portion 18. Connecting portion 16 can comprise an exposed, or
bare, wire portion typically constructed of an electrically conductive
material such as metal. Connecting portion 16 can be solid or stranded.
As the arrows in FIG. 2 illustrate, connecting portion 16 of wire can be
positioned over attachment member 30 and subsequently attached such as by
soldering. Notably, connecting portion 16 will be positioned a distance
away from submount 22. In one aspect, connecting portion 16 can be
positioned at least over a portion of a raised portion of the attachment
member utilized (See, for example, FIG. 3A and 3B). In one aspect,
connecting portion 16 can be placed at least partially within one or more
grooves, or notches, of a raised portion of attachment member 30 (See,
for example, FIG. 3A).

[0045] FIGS. 3A and 3B illustrate for example and without limitation
aspects or embodiments of the attachment members possible. The attachment
member can be disposed over and electrically communication with a
submount of light emitting devices, (See, for example, FIGS. 7, 8A). For
illustration purposes, two embodiments of an attachment member are
illustrated, however, the attachment member can comprise any size, shape,
and/or dimension other than those described herein. Attachment members
can also comprise solder free connectors such as insulation displacement
connectors (IDC), see FIGS. 17A and 17B and/or electrical connectors
which receive and clamp the electrical wire component (e.g., see FIGS.
18-20). Suitable attachment members will position the connecting portion
of a wire or other electrical component at least a distance greater than
0 millimeters (mm) away from a submount of a light emitting device. FIG.
3A illustrates attachment member 30 comprising a body portion 32 having
an upper surface 36 and a lower surface 34. Although body portion 32 is
illustrated as substantially rectangular, any suitable shape is
contemplated herein not limited to a square, rectangle, circle, polygon
and/or any other suitable size, shape and/or dimension. Body portion 32
can be disposed adjacent at least one raised portion 38. In one aspect,
body portion 32 can be disposed adjacent and substantially central and
between least two raised portions 38 as shown in FIG. 3A that be
identical or different from one another in configuration. The two raised
portions 38 can be disposed on and extend by connection of legs 40 from
opposing sides of body portion 32. Each body portion 32 can comprise at
least one leg 40 that can extend from body portion 32 and can link or
interconnect body portion 32 with raised portion 38. Leg 40 can be formed
integral with body portion 32, and integral or as a separate piece from
raised portion 38. In one aspect, raised portion 38 can comprise an
extension of leg 40. In one aspect, raised portion 38 can be disposed
substantially parallel but on a different plane than body portion 32. Leg
portion 40 can be disposed along at least a portion of the length of body
portion 32 and can incline upwardly away from body portion 32. The width
and/or shape of leg portion 40 can be any suitable width for effectively
interconnecting body portion 32 and raised portion 38.

[0046] Attachment member 30 can be substantially rigid or can be bendable
and/or adjustable for locating the wire 15 at any suitable distance from
submount 72. For example, each raised portion 38 can be bendable about
leg 40. Each raised portion 38 can also comprise at least one groove, or
notch, generally designated 42. In some aspects, grooves or notches 42
are unnecessary (e.g., FIG. 14F, groove is in a phantom line). One or
more notches 42 can comprise attachment portions adapted to receive and
attach to electrical components, e.g., electrical wire 15. Notch 42 can
be disposed along at least a portion of an edge of raised portion 38 and
disposed at one end or central to raised portion 38. In one aspect, notch
42 can be disposed at least substantially centrally on raised portion 38
and can be rounded concave inwardly towards body portion 32 to
substantially correspond to a portion of the circumference and/or radius
of external component, for example, the connecting portion 16 of wire 15
(FIG. 2). In one aspect, at least a portion of notch 42 becomes
physically and electrically attached and/or soldered to connecting
portion 16.

[0047] Attachment member 30 can have at least a first distance D1 between
upper and lower surfaces 36 and 34 of body portion 32. Attachment member
30 can also comprise a second distance D2 from a bottom surface of raised
portion 38 to bottom surface 34 of body portion 32. At least a portion of
connecting portion 16 of wire 15 can be positioned and subsequently
soldered or otherwise attached at least first and/or second distances D1
or D2 away from submount, or at any distance between D1 and D2. Distance
D1 can be any distance greater than 0 mm. Connecting portion 16 of wire
can be positioned at least partially over upper surface 36 of body
portion and at least partially disposed within at least one notch 42 of
raised portion 38. Alternatively, connecting portion 16 of wire 15 can be
disposed above body portion 32 suspended above body portion 32 within
notches 42 of opposing raised portions 38. Soldering, or otherwise
attaching wire 15 to attachment member 30 can electrically couple wire 15
to device, for example, LED device, such that one or more LEDs within the
device can receive electrical signal and become illuminated.

[0048]FIG. 3B illustrates for example a second embodiment of an
attachment member, generally designated 50. Attachment member 50 can
comprise a body portion 52 comprising one or more upper body portions 54
and at least one lower body portion 56. Upper body portions 54 can each
comprise a raised portion of attachment member 50 and lower body portion
56 can comprise a central body portion. Lower body portion 56 can
comprise a lower surface 57 and an upper surface 58. Upper surface 58 can
comprise an attachment portion over which the connecting portion of wire
15 (FIG. 8A) can be positioned and physically and electrically connected
and/or attached using solder or any other attachment technique. The at
least one upper body portion 54 can comprise at least one inner wall 62
disposed adjacent and at an angle to upper surface 58 of lower body
portion 56. Inner wall 62 can be orthogonal or non-orthogonal to upper
surface 58. In one aspect, attachment member 50 can comprise at least two
upper body portions 54 opposing each other with at least a portion of
lower body portion 56 disposed therebetween. A gap generally designated
64 can exist between the one or more upper body portions 54, and the
upper body portions 54 can be parallel with each other. In one aspect,
attachment member 50 can comprise a substantially U-shaped member.

[0049] Attachment member 50 can provide one or more attachment portion
located at least a first distance D1 away from a submount. In one aspect,
upper surface 58 of lower body portion 56 can serve as comprise a first
attachment portion located a first distance D1 away from a submount. In
another aspect a second upper surface 60 of raised, or upper body portion
54 can comprise a second attachment portion located a second distance D2
away from a submount. In one aspect, second upper surface 60 is parallel
upper surface 58 and spaced a distance apart from upper surface 58. First
and second distances D1 and D2 can comprise any suitable distance greater
than 0 mm. Second distance 02 can be greater than first distance D1. In
one aspect, connecting portion 16 of wire can be positioned at least
partially over upper surface 58 and attached such that it is in
electrical communication with attachment member 50. Alternatively,
connecting portion 16 of wire 15 can be positioned at least partially
over second upper surface 60 of at least one upper body portion 54. In
one aspect, connecting portion 16 of wire 15 can be positioned at least
partially over at least two upper surfaces 60 of two opposing upper body
portions 54 and subsequently soldered, or otherwise electrically
connected to attachment member 50. In one aspect, soldering is
unnecessary for electrically connecting wire 15 to attachment member 50.
For example, one or both upper body portions 54 can press inwardly via a
force F indicated by the arrows. Force F can squeeze one or both upper
body portions 54 against connecting portion 16 of wire 15 such that the
wire becomes crimped between upper body portions 54. Thus, connecting
portion 16 can be fixedly held between upper portions of attachment
member 50 via a solder free connection, and attachment member 50 can
electrically communicate with connecting portion 16.

[0050] While crimping is shown, any connection which fixedly holds and
secures connecting portion 16 is envisioned in accordance with the
subject matter herein. Also, an attachment member such as disclosed
herein can be provided with or without a plastic housing, such as a
plastic housing disposed about the area where the wire is crimped or
otherwise held in place. As used herein, the term `solder free` when
describing a connector and/or connection refers to the connection between
portions of wire 15 and attachment members described herein (e.g., 50,
140 (FIGS. 16A through C) 150 (FIG. 17A), 170 (FIG. 18)). Of note,
attachment members may be soldered to an attachment surface (e.g., 124,
FIG. 13 or FIGS. 15A-E) of submount 72 prior receiving wire 15. However,
the physical, mechanical, and/or electrical connection between portions
of wire 15 and attachment members can be described as solder free, as
portions of wire 15 are not attached via soldering to attachment members
or connectors described herein. Notably, such connections can
advantageously reduce installation and manufacturing times as tedious
soldering processes become obsolete, as well as reduce cost associated
with installation of devices incorporating solder free connections or
connectors.

[0051] Each of the attachment members illustrated by FIGS. 3A and 3B can
be attached and in electrical communication with light emitting devices
70 and/or 90 as illustrated for example in FIGS. 4 through 12. Thus, when
external electrical components, such as one or more wires 15 are
connected and/or attached to the attachment member, an electrical signal
or current can flow into the attachment member and light emitting device
70 and/or 90 and into one or more LEDs 86 (FIGS. 6,7) thereby
illuminating the device. In one aspect, attachment members disclosed
herein can comprise solder free connectors, as solder may not be
necessary for the connection of wire 15 to attachment member 50. For
example and without limitation, attachment member 50 can comprise a
non-solder, gas-tight connector. In one aspect, attachment member 50 can
comprise an insulation displacement connector (IDC) type of attachment
member. IDCs can contain a contact member for piercing or otherwise
displacing the insulated covering 18 of wire 15 and allowing current to
flow from the connecting portion 16, into the light emitting device 70
and/or 90 (FIGS. 17A and 17B). In other aspects, attachment member 50 an
comprise a solder free connector which clamps, crimps, or otherwise
receives and holds connecting portion 16 of wire 18 (e.g., see FIGS.
18-20). IDCs can be advantageous in one aspect, as they eliminate the
need for manufacturing components with tedious soldered electrical
connections which can sometimes fail if inadequately soldered or if heat
from the soldering process damages other areas or components. Notably,
IDCs are solder free components which improve handling and ease of use
and manufacturing of devices and/or components as described herein. In
addition, no manual stripping of wires prior to soldering is necessary,
as the IDC contact member displaces the wire upon insertion.

[0052] Each of the attachment members described herein, including 30 and
50 can further comprise insulated wire guides (not shown). Insulated wire
guides can comprise a piece of electrically insulating material (e.g.,
plastic) positioned on attachment member and/or submount to prevent the
wire 15 from shorting or electrically arcing to the edge of the MCPCB
submount 72.

[0053]FIG. 4 illustrates a top view of a light emitting or LED device,
generally designated 70. LED device 70 can comprise a substrate or
submount 72 over which an emission area, generally designated 76, can be
disposed. In one aspect, emission area 76 can be disposed substantially
centrally on LED device 70. In an alternative, emission area 76 can be
disposed in any other suitable location on LED device 70. Notably, LED
device 70 can comprise a uniform optical source in the form of emission
area which can simplify the manufacturing process for manufacturers of
light products requiring a single component. LED device 70 can further
comprise a retention material 74 disposed at least partially about
emission area 76 where retention material 74 can be referred to as a dam.
Retention material 74 can also be disposed over at least one
electrostatic discharge (ESD) protection device, such as a Zener diode
114 (FIG. 12). In some aspects, retention material can be disposed over
more than one, such as two, Zener diodes 114 that can be connected in
series between two electrical elements (FIG. 11). Submount 72 can
comprise any suitable mounting substrate or submount, for example, a PCB,
a MCPCB, an external circuit, or any other suitable submount over which
lighting devices such as LEDs may mount and/or attach. In one aspect,
submount 72 can have a compact dimension of, for example, 22 millimeter
(mm)×22-mm square footprint. In other aspects, submount 72 can be
any suitable dimension and/or shape, for example, a circular or
rectangular shape.

[0054] Emission area 76 can comprise a plurality of LED chips, or LEDs 86
disposed within and/or below a filling material 87 such as illustrated in
FIG. 10. Retention material 74 can be adapted for dispensing, or placing,
about at least a portion of emission area 76. As illustrated in FIG. 6,
retention material 74 can be dispensed after wirebonding of the one or
more LEDs 86 such that retention material 74 is disposed over and at
least partially covers wirebonds 88 to contain at least a portion, such
as one end of each of wirebonds 88 within retention material 74. In FIG.
6, wirebonds 88 for the first and last, or outermost edge LEDs 86A for a
given string, or series of

[0055] LEDs 86 are disposed within retention material. In one aspect,
retention material 74 can be "planed" during dispersion at room
temperature for accurate volume and/or height control. After placement of
retention material 74, filling material 87 (FIG. 10) can be filled to any
suitable level within the space disposed between one or more inner walls
of retention material 74. For example, filling material 87 (FIG. 10) can
be filled to a level equal to the height of retention material 74 or to
any level above or below retention material. The level of filling
material 87 (FIG. 10) can be planar or curved in any suitable manner,
such as concave or convex. Emission are 76 can be substantially opaque
(as illustrated in FIG. 4), transparent, or semi-transparent depending
upon, for example, the amount and type of phosphor or other fillers that
are used in filling material 87 (FIG. 10).

[0056] Still referring to FIG. 4, LED device 70 can also comprise at least
one opening or hole, generally designated 78, disposed through submount
72 for facilitating attachment of LED device 70 to an external substrate
or surface.

[0057] For example, one or more screws can be inserted through the at
least one hole 78 for securing device 70 to another member, structure, or
substrate. LED device 70 can also comprise one or more electrical
attachment members 30 and/or 50 as described in FIGS. 3A and 3B. FIG. 4
illustrates at least one attachment member 30 which can comprise at least
one electrical contact such as solder contacts disposed at the corner of
light emitting device 70 for connecting to external components.
Attachment member 30 can comprise any suitable configuration, size, shape
and/or location and can comprise positive and/or negative electrode
terminals through which an electrical current or signal can pass when
connected to an external power source. For example, one or more
electrically conductive wires (FIGS. 2, 8) can be attached and
electrically connected to attachment members 30 and/or 50 when welded,
soldered, or any otherwise suitably attached. Electrical current or
signal can pass into LED device 70 from the external wires electrically
connected to the attachment members 30 and into emission area 76
comprised of LEDs 86 (FIGS. 6, 7, 10) to facilitate light output.
Attachment members 30 can electrically communicate with emission area 76
comprised of LEDs 86 (FIGS. 6, 7, and 10). Attachment members 30 can
electrically communicate with first and second conductive traces 103 and
104 (see FIG. 11) and therefore LEDs 86 which may be wirebonded or
otherwise electrically connected to first and second conductive traces
104 and 103.

[0058] LED device 70 can further comprise an indicator sign or symbol for
denoting the electrical polarity for a given a side of LED device 70. For
example, a first symbol 80 can comprise a "-" sign denoting the side of
LED device 70 comprising the negative electrode terminal. A second symbol
82 can comprise a "+" sign denoting the side of LED device 70 comprising
the positive electrode terminal. One or more test points 75 can be
located adjacent either a positive or negative side of the device for
testing the electrical and/or thermal properties of the LED device 70. In
one aspect, test point 75 can be disposed adjacent the negative side, or
terminal of LED device 70. In an alternative embodiment, test point 75
can be disposed adjacent the positive side of LED device 70.

[0059] FIG. 5 illustrates a side view of LED device 70. As illustrated by
FIGS. 4 and 5, retention material 74 can comprise a substantially
circular dam disposed about at least a portion of emission area 76 and
disposed over submount 72. Retention material 74 can be dispensed,
positioned or otherwise placed over submount 72 and can comprise any
suitable size and/or shape. Retention material 74 can comprise any
suitable reflective material and can comprise a clear or opaque white
material such as, for example, a silicone or epoxy material. Filler
particles such as titanium dioxide (TiO2), for example, can be used
and added to retention material 74 for providing an opaque material. The
addition of TiO2 can increase reflection about the emission area 76
to further to optimize light output of LED device 70. Fumed silica can be
added as a thixotropic agent. Dispersing retention material 74 can allow
increased board space and the ability to withstand higher voltages. In
some aspects, LED device 70 can be operable at 42 volts (V) or higher.

[0060] Retention material 74 can be dispensed or deposited in place using
an automated dispensing machine where any suitable size and/or shape of
dam can be formed. As FIG. 5 illustrates in a side view of LED device 70,
retention material 74 can comprise a rounded outer wall 84 such that the
upper surface of retention material 74 opposite submount 72 is rounded.
Rounding or curving outer wall 84 of retention material 74 may further
improve the amount of light reflected by LED device 70. FIG. 5 also
illustrates placement of one or more attachment members 30 disposed in
corners outside of retention material 74. As the side view illustrates,
attachment member 30 can comprise at least one leg 40 extending at an
incline to a raised portion 38 of the attachment member 30 for providing
an attachment area spaced a distance from submount 72. While the height
of attachment member 30 can be any suitable extent form the surface of
the submount 72, in one aspect attachment member 30 can extend to a
height or distance D2 such that raised portion 38 is still not as high as
the height of retention material 74 as shown for example in FIG. 5.

[0061] FIGS. 6 and 7 illustrate emission area 76 without a layer of
filling material 87. FIG. 6 illustrates LED device 70 and emission area
76 comprising at least one pattern, or arrangement, of LEDs. LEDs 86 can
be arranged, disposed, or mounted over a conductive pad 100. Conductive
pad 100 can be electrically and/or thermally conductive and can comprise
any suitable electrically and/or thermally conductive material. In one
aspect, conductive pad 100 can comprise a conductive metal. In one
aspect, emission area 76 can comprise one or more LEDs 86 arranged in a
single pattern over conductive surface, or pad 100. In the alternative,
emission area 76 can comprise a combination of more than one pattern of
LEDs 86 arranged over conductive pad 100. In one aspect, emission area 76
can comprise a combination of different arrangements or patterns, for
example, a combination of a first pattern P1, a second pattern P2 and/or
a third pattern P3 for optimizing light emission and device brightness.
Each string of LEDs 86 disposed over conductive pad 100 can comprise
outermost LEDs 86A with one or more LEDs 86 disposed therebetween. Each
string of LEDs 86 can comprise the same or a different pattern, for
example, patterns P1, P2, and/or P3. Strings of LEDs 86 can comprise
diodes of the same and/or different colors, or wavelength bins, and
different colors of phosphors can be used in the filling material 87
(FIG. 10) disposed over LEDS 86 that are the same or different colors in
order to achieve emitted light of a desired wavelength. The one or more
patterns of LEDs 86 can comprise an array of LEDs within emission area
76.

[0062] Still referring to FIGS. 6 and 7, attachment member 30 can provide
electrical connection between the electrical wire 15 and device 70 while
reducing the thermal coupling between the wire 15 and the body portion 32
of attachment member 30 relative to thermal coupling between body portion
32 and a surface of device 70. Raised portions 38 can be spaced apart
from device 70, and adapted to maintain the wire 15 spaced apart from a
surface of device 70. Attachment member 30 can be adapted to retain wire
15 prior to bonding. Wire attachment surface or attachment member 30 can
comprise a reduced area portion relative to a pad or body portion of the
wire attachment surface directly on surface of device or submount 72. As
illustrated, attachment portion, e.g., notch 42 of raised portion 38 can
comprise a reduced surface area relative to an area of body portion 32 of
attachment member 30. The reduced area portion can be adapted to reduce
the thermal conductivity of attachment portion notch 42 relative to the
pad or body portion 32. That is, attachment portion of attachment member
30 can comprise a reduced thermal conductivity relative to the body
portion 32 of attachment member 30. Therefore, it can be easier to attach
or solder wire 15 to notch 42 than to attach wire 15 to the body 32 which
is directly disposed over submount 72, as submount 72 can quickly draw
heat away from thermally conductive body 32.

[0063]FIG. 8A illustrates a second embodiment of a LED device, generally
designated 90. LED device 90 is similar in form and function to LED
device 70 but having attachment member 50 as shown and described in FIG.
3B. FIG. 8A illustrates at least one attachment member 50 disposed in a
first corner of LED device 90 and a second attachment member 50 disposed
at an opposite end and along an opposite edge of LED device 90. Each
attachment member 50 can correspond to a positive and negative terminal
of

[0064] LED device 90 for passing current through the device. FIG. 8A
illustrates connecting portion 16 of wire being positioned down and over
attachment member 50 such that it is disposed over upper surface 58. Once
connecting portion 16 is positioned, it can be subsequently welded,
soldered, crimped, or otherwise attached to attachment member 50 at a
distance D1 away from submount 72.

[0065] FIG. 8B illustrates a portion of LED device 90 in FIG. 8A. FIG. 8B
illustrates attachment member 50 attached and held in electrical
communication with wire 15 for passing current through device 90. Upper
body portions 54 of attachment member 50 can be pressed via force F (FIG.
3B) such that connecting portion 16 of wire 15 can be crimped and fixedly
attached to device 90 by attachment member 50. Electrically conductive
wire 15 can electrically communicate with electrically conductive
attachment member 50 when held in contact with each other. As illustrated
by FIG. 8B, at least a portion of conductive wire 15 can be attached via
a solder free connection with attachment member 50.

[0066] As FIGS. 9 and 10 further illustrate, the outermost LEDs 86A for a
series, string, or pattern of LEDs 86 can electrically communicate or
connect to one or more electrical elements. Electrical elements can
comprise first and second conductive traces 103 and 104 configured to
flow, or supply electrical signal or current to the respective strings of
LEDs 86. One of first and second conductive traces 103 and 104 can
comprise an anode and the other a cathode. The electrical polarity can be
denoted by first and second symbols 80 and 82 as discussed earlier.
Conductive pad 100 and conductive traces 103 and 104 can comprise any
suitable electrical and thermally conductive materials and can comprise
either the same or different materials. In one aspect, conductive pad 100
and conductive traces can comprise a layer of copper (Cu) deposited over
submount using any suitable technique. An electrically insulating solder
mask 102 can be disposed at least partially between conductive pad 100
and respective conductive traces 103 and 104. Solder mask 102 can provide
an electrical barrier between conductive traces and can comprise a white
reflective surface.

[0067] FIG. 9 illustrates various placement areas, positions, or locations
of retention material 74 about emission area 76. In one aspect, retention
material 74 can be disposed in areas, positions, or locations R1, R2,
and/or any location therebetween. When retention material 74 is disposed
in locations R1 or R2, it can be disposed over and cover at least a
portion of one or more wirebonds 88 connecting outermost LEDs 86A to
electrical elements, such as conductive trace 104. When in location R1,
retention material 74 can be disposed at least partially over each of
solder mask 102 and wirebond 88 connected to outermost LED 86A for a
respective string of LEDs 86. In one aspect, retention material 74 can be
disposed entirely over the portion of solder mask 102 disposed between
conductive pad 100 and conductive trace 104 and/or entirely over wirebond
88 when in location R1. In another aspect, retention material 74 can be
disposed over and at least partially or entirely cover each of the
wirebonds 88 of each of the outermost LEDs 86A for each string of LEDs 86
disposed in emission area 76. As illustrated, retention material 74
according to the subject matter herein comprises a substantially rounded
or hemispheric shaped cross-section. Rounding retention material 74 can
increase the surface area from which light may be emitted and/or
reflected.

[0068] FIG. 10 illustrates emission area 76 comprising a string of one or
more LEDs 86 disposed within a filling material 87. For illustration
purposes four LEDs 86 are shown but strings of LEDs 86 can comprise any
suitable number of LEDs, for example, 14 LEDs 86 arranged in series. In
one aspect, filling material 87 can comprise an encapsulant having a
predetermined, or selective, amount of phosphors, fillers, and/or
lumiphors in an amount suitable for any desired light emission, for
example, suitable for white light conversion. Filling material 87 can
interact with light emitted from the plurality of LEDs 86 such that a
perceived white light, or any suitable and/or desirable wavelength of
light, can be observed. Any suitable combination of encapsulant and/or
phosphors can be used, and combinations of different phosphors for
resulting in desired light emission can be used. In other aspects,
filling material 87 can comprise a molded lens material. In further
aspects, filling material 87 can comprise a lens that floats over LEDs
86. Filling material 87 can be substantially opaque such that emission
area 76 can be substantially opaque (as illustrated in FIG. 4),
transparent, or semi-transparent depending upon, for example, the amount
and type of phosphor or other fillers that are used.

[0069] FIG. 10 illustrates a cross-section of submount 72 over which LEDs
86 can be mounted or otherwise arranged. Submount 72 can comprise, for
example, conductive pad 100, first and second conductive traces 103 and
104, and solder mask 102 at least partially disposed between conductive
pad 100 and each of conductive traces 103 and/or 104. If retention
material is positioned adjacent outermost LEDs 86A, for example in
location R1, solder mask 102 between conductive pad 100 and first and
second conductive traces 103 and 104 could be eliminated as it would may
no longer be necessary. Solder mask 102 can be disposed between
conductive traces 103 and 104 and attachment members 30 (FIG. 11), the
proximal edges of which can be seen in FIG. 10 adjacent retention
material 74, adjacent the outer wall 84 of retention material 74.
Submount 72 can further comprise a dielectric layer 106, and a core layer
108. For illustration purposes, submount 72 can comprise a MCPCB, for
example, those available and manufactured by The Bergquist Company of
Chanhassan, Minn. Any suitable submount 72 can be used, however,
including those that use metal, ceramic or polymer base materials and
hybrid structures.

[0070] FIG. 10 further illustrates examples of first and second heights H1
and H2 of filling material 87 within LED device 70. First height H1 can
comprise a height at which filling material 87 is disposed over the LEDs
86.

[0071] The height may vary due to process variability, so an average
height above the string of LEDs 86 can be used and controlled for optimal
brightness and other characteristics (e.g., color point, uniformity,
etc.). Second height H2 can comprise a height at which filling material
87 is disposed over a top surface of conductive pad 100. Second height H2
can be controlled, for example, by controlling the location of retention
material 74 and whether it assumes location R1, R2 or any position
therebetween. Second height H2 can also be controlled by controlling the
amount of filling material 87 dispensed into the cavity defined by
retention material 74. Raised portion 38 of attachment member 30 and/or
upper surface 60 of attachment member 50 can comprises distances D2 which
can extend to a height less than the height of the retention material 74
and/or first and second heights H1 and H2.

[0072] FIG. 11 illustrates LED device 70 comprising submount 72 prior to
arranging, dispensing, or otherwise placing retention material 74 about
at least a portion of emission area 76. For illustration purposes, only a
first string of LEDs 86 is illustrated, however, as noted earlier,
emission area can comprise more than one string of LEDs 86 electrically
connected in series. As illustrated, prior to placing retention material
74, submount 72 comprises first and second conductive traces 103 and 104
arranged in a substantially circular arrangement about conductive pad 100
such that LEDs arranged over conductive pad 100 can electrically
communicate to each trace by wirebonding and wirebonds 88 or by any other
suitable attachment method. For illustration purposes, traces 103 and 104
are illustrated as substantially circular, however, any orientation is
contemplated. As illustrated, outermost LEDs 86A for a respective string
of LEDs 86 can electrically connect to conductive traces. Dotted lines
110 illustrate the size and/or shape of electrically conductive material
of which the conductive traces 103 and 104 are comprised. The lines are
dotted to illustrate how the material can be disposed under solder mask
102. Thus, conductive pad 100 and traces 103 and 104 are exposed portions
or layers of conductive material such as Cu (i.e., exposed on a surface
of submount 72) whereas dotted lines 110 illustrate portions of
conductive material below solder mask 102. Test point 75 can also be
exposed on a surface of submount 72, and can also be comprised of the
electrically conductive material illustrated by dotted line 110. Test
point 75 can be disposed to the left of trace 104 as shown, or between
trace 104 and attachment member 30 as indicated by test point 75 in
broken lines.

[0073] Attachment members 30 electrically and/or thermally communicate
with respective conductive traces via the layer of conductive material
defined by dotted lines 110, and can comprise the same layer of material.
In one aspect, the material formed within the bounds of dotted lines 110
comprises Cu, and can be plated or otherwise layered with one or more
reflection enhancement layers, for example, Ag, Ni, Ti, or dielectric
materials. External, conductive wires (not shown) can electrically
connect to attachment members 30, and electrical current or signal can
flow from the attachment members 30 to the respective conductive traces.
Attachment member can physically and electrically couple to submount 72
via attachment surfaces 124 (see FIG. 13 or FIGS. 15A-E) by soldering to
attachment surfaces 124 (see FIG. 21) as further described herein. As
attachment surfaces 124 are exposed portions of submount 72 comprised of
conductive material (i.e., material indicated by dotted lines 110) and
are disposed below attachment members 30, surfaces 124 are also
illustrated in broken lines, and can include any size and/or shape (e.g.,
see FIGS. 11 and 15A-15E), for illustration purposes only a circle
attachment surface 124 is shown. The electrical current can flow from
attachment members 30 into attachment surfaces 124 of submount 72 and
along the conductive material designated by dotted lines 110 disposed
below the layer of solder mask 102. The electrical current can flow into
and/or out of the conductive traces and therefore into and out of
respective strings of LEDs 86 mounted over conductive pad 100.

[0074] As noted earlier, Zener diodes 114 and, other electronic components
are typically black and absorb light. FIG. 12 illustrates Zener diode 114
upon placement of the retention material. In one aspect, retention
material 74 can be disposed at least partially over the at least one
Zener diode 114. In another aspect, retention material 74 can be disposed
entirely over the at least one Zener diode 114 such that the diode is
completely covered for further improving light output intensity. Zener
diode 114 can be disposed over an electrically and/or thermally
conductive surface or area 118 such that current can flow through the
diode 114, into the wirebonds 116, and to respective conductive traces
103 and 104. In one aspect, Zener diode 114 comprises a vertically
structured device having one bond pad (not shown) on an upper surface
that is wirebonded in reverse bias with respect to LEDs 86 for providing
ESD protection.

[0075] FIG. 13 illustrates a portion of LED device, generally designated
120. LED device 120 can comprise a device submount 122. In one aspect,
LED device 120 can comprise a portion of previously described LED device
70. An attachment surface, generally designated 124, can comprise an
exposed portion of submount 122. Attachment surface 124 can comprise a
depth (as illustrated) with respect to an upper surface of submount 122,
or it may comprise a surface that is a substantially flat portion of
submount 122. Attachment surface 124 can comprise an electrically
conductive material that can electrically couple attachment member 30 to
device 70. In one aspect, attachment surface 124 can be integrally formed
with device submount 122, for example, not limited to being formed as a
layer of submount 122 (e.g., having as size and shape of area 110 in FIG.
11). That is, attachment surface 124 can extend below a portion of solder
mask 102 (FIG. 10) and electrically connect with exposed trace 104, as
attachment member 124 and trace 104 can comprise the same layer of
material. In another aspect, attachment surface 124 is a separate surface
which can be deposited or otherwise adapted to electrically communicate
with submount 122.

[0076] Attachment member 30, previously described with respect to FIG. 3A,
can physically and electrically connect to attachment surface 124 such at
least a portion of attachment member 30 electrically couples to each of
attachment surface 124 and device 120. Attachment member 30 can attach to
attachment surface 124 using any suitable method such that attachment
member is suitably disposed over submount 122. In one aspect, attachment
member 30 can be soldered to attachment surface 124. As previously
described, attachment member 30 can comprise a body portion 32 and one or
more raised portions 38 with one or more notches 42 disposed therein.
Notches 42 can comprise attachment portions for receiving and bonding to
connecting portion 16 of an electrical wire 15 such that wire 15 and the
device 120 are electrically coupled upon bonding the wire to the
attachment member 30. Electrical signal can pass from the wire 15 into
attachment member 30 and device 120 for illuminating one or more LEDs
attached to and/or electrically connected to device 120.

[0077] Attachment member 30 can comprise an attachment portion, e.g.,
notches 42 of raised portion 38 adapted to receive connecting portion 16
of electrical wire 15 for electrically bonding to wire 15. Attachment
member 30 can also comprise a body portion 32 electrically coupled to
device 120 via attachment surface 124. Attachment member 30 can provide
electrical connection between the electrical wire 15 and device 120 while
reducing the thermal coupling between the wire 15 and the body portion 32
relative to the body portion 32 and the device surface. Raised portions
38 can be spaced apart from device 120, and adapted to maintain the wire
spaced apart from a surface of device 120. Attachment member 30 can be
adapted to retain wire 15 prior to bonding. Wire attachment surface or
attachment member 30 can comprise a reduced area portion relative to a
pad or body portion of the wire attachment surface directly on surface of
device or submount 72. As illustrated, attachment portion, e.g., notch 42
of raised portion 38 can comprise a reduced surface area relative to an
area of body portion 32 of attachment member 30. The reduced area portion
can be adapted to reduce the thermal conductivity of attachment portion
notch 42 relative to the pad or body portion 32. That is, attachment
portion of attachment member 30 can comprise a reduced thermal
conductivity relative to the body portion 32 of attachment member 30.
Therefore, it can be easier to attach or bond wire 15 to notch 42 of
attachment member 30 than to the body 32 which is directly disposed over
submount 122 which can quickly draw heat away from thermally conductive
body 32.

[0078] FIGS. 14A to 14H illustrate different embodiments of attachment
members. FIGS. 14A to 14F can comprise different embodiments of
attachment member 30. FIG. 14A illustrates an attachment member having a
substantially circular and/or rounded body portion 32A. Raised portion
38A can be spaced apart from body portion 32A. Similarly, FIG. 14B
illustrates attachment member having a substantially square shaped body
portion 32B with raised portion 38B spaced a distance away from body
portion 32B. FIG. 14C illustrates a substantially triangular shaped body
portion 32C and raised portion 38C spaced a distance therefrom. As
illustrated, areas of raised portion adapted to receive wire 15 can
comprise a reduced surface area relative to body portions 32A, 32B, and
32C. This can improve the ease of bonding a wire to attachment portion,
e.g., via notches 42A, 42B, and 42C of attachment members in 14A to 14C.
Each of the attachment members illustrated in FIGS. 14A to 14C can
comprise legs 40A, 40B, and 40C respectively which elevate raised
portions 38A, 38B, and 38C with respect to corresponding body portions.
Legs 40A, 40B, and 40C can comprise a smaller width than that of
corresponding body portions.

[0079] FIGS. 14D to 14F illustrate further embodiments of attachment
member 30. In FIGS. 14D and 14E, legs 40D and 40E elevate raised portions
38D and 38E with respect to corresponding body portions 32D and 32E. Legs
40D and 40E can comprise approximately the same width as a width of
corresponding body portions 32D and 32E. FIG. 14D illustrates an
attachment member having a notch 42D for receiving and holding an
external component such as a wire. FIG. 14E illustrates a design without
a notch, and any of the embodiments of attachment members described
herein can optionally comprise a notch or have no notch. Wire could
simply become soldered or otherwise attached to raised portions 38E. FIG.
14F illustrates an embodiment of an attachment member comprising
substantially curved surfaces. The attachment member comprises a body
portion 32F which extends into more than one raised portion 38F. As
illustrated by phantom lines L, raised portions can optionally comprise a
notch or area for receiving an external electrical component. The
attachment member illustrated by FIG. 14F comprises a substantially
U-shaped attachment member. Any shape is contemplated. For illustration
purposes, six different embodiments of attachment member 30 are
illustrated by FIGS. 14A to 14F. However, attachment member 30 is not
limited to the shapes and sizes shown.

[0081] FIGS. 14G and 14H illustrate different embodiments of attachment
members, generally designated 130. Attachment members 130 can comprise a
body 132 having one or more openings 134 disposed therein. In one aspect,
attachment member 130 comprises a circular opening 134 comprising a
circular wall 136. Circular wall 136 of opening 134 can be substantially
sized and/or shaped to fittingly receive the external element, component,
or wire to be positioned therein. An electrical component, such
connection portion 16 of wire 15 (FIG. 2) could be positioned within
opening 134. Wire could be soldered within opening 134 or areas adjacent
and outside of wall 136 thereby securing wire within opening. FIG. 14H
illustrates attachment member 130 comprising an opening 134 having more
than one inner wall 138. Here, opening 134 can comprise four inner walls
138 forming a substantially rectangular opening 134. Opening 134 can
receive an electrical component, for example, connecting portion 16 of
wire 15 (FIG. 2) and wire can become secured within attachment member 130
by applying a force F to essentially crimp or compress the wire between
one or more walls 138 of attachment member 130. While crimping is shown
or other structure is utilized to hold and secure the attachment member
in place, positioning attachment member 130 within any suitable housing,
such as a plastic housing, is contemplated and envisioned in accordance
with the subject matter disclosed herein.

[0082] FIGS. 15A to 15E illustrate different shapes of attachment surface
124 illustrated by FIG. 13. Attachment surface 124A comprises a
substantially triangular shape and attachment surface 124B comprises a
substantially oval shape. FIG. 15C illustrates attachment surface 124C as
having an irregular shape having curved and straight sides. FIG. 15D
illustrates attachment surface 124D having a substantially octagonal
shape, and FIG. 15E illustrates attachment surface 124E having a
substantially circular shape. Generally, the shape of attachment surfaces
can be selected to contemplate the shape of the body (e.g., 32) of
attachment members provided herein. Any suitable shape and/or dimension
of attachment surface 124 are contemplated herein, for example, a square,
regular or irregular polygon, or even asymmetrical shapes. Attachment
surface 124 can be configured to electrically and physically connect to
attachment members described herein via any suitable attachment process.
In one aspect, attachment members described herein can be soldered to
attachment surfaces 124. As noted earlier, solder free connectors refer
to the connection between attachment members and electrical components
such as wire 15, and does not refer to the connection between attachment
members and attachment surface. Notably, solder free connectors can
advantageously improve ease of manufacture and ease of use during
operation as soldering processes of connecting wire 15 to attachment
members can be avoided. Solder free connectors simplify electrical
connections between wire 15 and attachment members described herein and
allow devices to be quickly and easily installed and/or changed out
during operation.

[0083] FIGS. 16A through 16D illustrate different embodiments of
gas-tight, solder free connections between portions of wire 15 and
attachment member 140. That is, solder may not be necessary to connect
wire 15 to attachment member 140. FIGS. 16A to 16C illustrate an
attachment member 140 disposed about a connecting portion 16 of wire 15
(FIG. 2). FIG. 16D is a side view of attachment member 140 disposed about
insulated portion 18 and connecting portion 16 of wire 15. Attachment
member 140 can be similar in form and/or function to previously described
attachment member 50 which can be disposed over a portion of light
emitting devices 70, 90, and/or 120. In one aspect, as illustrated in
FIGS. 16A and 16B, attachment members 140 can essentially crimp and/or
forcibly enclose connecting portion 16 of wire such that attachment
member 140 is in electrical communication with connecting portion 16.
FIG. 16C illustrates an insulation crimp whereby attachment member 140
can crimp and/or forcibly enclose about insulated portion 18 of wire 15.
In this embodiment, attachment member 140 can penetrate or "bite through"
through insulated portion to electrically communicate with connecting
portion 16. Notably, attachment members 140 form gas-tight solder free
connections with insulated portion 18 and/or connecting portion 16 of
wire 15, such that electrical current or signal may be communicated from
wire into the underlying light emitting devices. As used herein, the term
`solder free` when describing a connector or connection refers to the
connection between portions of wire 15 and attachment members described
herein. Of note, attachment members may be soldered to an attachment
surface (e.g., 124, FIG. 13) of submount 72 prior receiving wire 15.
However, the physical, mechanical, and/or electrical connection between
portions of wire 15 and attachment members can be described as solder
free, as portions of wire 15 are not attached via soldering.

[0084] The connection disclosed for example by FIG. 16C could be used in
conjunction with connections disclosed in 16A and/or 16B to provide
mechanical stability (hold) to the insulation so that it can be pulled
back. For example and in one aspect as illustrated by FIG. 16D,
attachment member 140 can comprise a connector that employs a combination
of the cross-sectional embodiments disclosed by FIGS. 16A to 16C. That
is, in one aspect attachment member 140 can comprise a double contact
housing, where a first portion or channel 142 of member 140 can receive
and crimp about a stripped or bare connecting portion 16 of wire (e.g.,
where the cross-sectional view would be similar to FIG. 16A) thereby
forming a first electrical contact, and a second portion or channel 144
of member 140 can electrically connect with insulated portion 18 while
electrically connecting with connection portion 16 (e.g., cross-sectional
view of FIG. 16C) thereby forming a second electrical contact. In other
aspects, attachment member 140 can comprise a single contact housing,
where only first portion 142 electrically connects with connecting
portion 16 of wire 15 and where second portion 144 physically and
securely holds insulated portion 18 of wire. That is, second portion 144
can, but does not have to, bite into insulated portion 18 without making
electrical contact with connecting portion 16 and can serve to
mechanically hold wire 15 in place via securely gripping, biting, or
otherwise holding insulated portion 18. Attachment member 140 can
comprise one or more portions for electrically connecting with wire 15 in
any of the combinations illustrated by FIGS. 16A to 16C. A crimp tool
(not shown) can be used to crimp or clamp connecting portion 16 into
first channel 142 and insulated portion 18 into second channel 144
thereby forming a gas-tight, solder free connection. Attachment member
140 can comprise a connector formed from a phosphor bronze alloy that has
been coated with nickel (Ni), gold (Au), and/or tin (Sn).

[0085] FIGS. 17A to 17C illustrate further embodiments of an attachment
member 150. Attachment member 150 can be similar in form and/or function
as previously described attachment member 50 and can be disposed over a
portion of light emitting devices 70, 90, and/or 120. In one aspect,
attachment member 150 can comprise a non-solder or solder free gas-tight
connector. In one aspect, attachment member 150 can comprise an
insulation displacement type connector or IDC type of attachment member.
Referring to FIGS. 17A and 17B, attachment member 150 can comprise one or
more blade portions 152 configured for contacting, biting, piercing, or
otherwise displacing insulated portion 18 of wire 15 such that connecting
portion 16 is contacted upon positioning or insertion of wire 15 between
blade portions 152. Blade portions 152 can physically and electrically
communicate with wire 15. Blade portions 152 can be disposed within a
housing 154. Electrical current can be communicated from wire 15 and into
the underlying light emitting device via connection with attachment
member 150. FIG. 17B illustrates blade portions 152 mechanically and
electrically contacting connecting portion 16 of wire. Blade portions 152
can be integrally formed with housing 154 of attachment member 150 or it
may comprise a separate portion or attachment and/or material. In one
aspect, housing 154 of attachment member 150 can comprise a plastic
housing and blade portions 152 can comprise an electrically conductive
material such as a metal. In one aspect, blade portions 152 can comprise
metallic blades for piercing insulated covering 18 of wire 15. IDCs can
be advantageous as they eliminate the need for manufacturing components
with tedious soldered electrical connections which can sometimes fail if
inadequately soldered or if heat from the soldering process damages other
areas or components. Notably, IDCs are solder free components which
improve handling and ease of use and manufacturing of devices and/or
components as described herein. In addition, no manual stripping of wires
prior to soldering is necessary, as blade portions 152 of IDC attachment
member 150 can strip the wire upon insertion, such as insertion in the
direction indicated by the arrow in FIG. 17A.

[0086] FIG. 17C illustrates a second embodiment of attachment member 150,
where attachment member has multiple sets of blades portions 152.

[0087] That is, a first set of blade portions 152 can comprise an integral
U-shaped blade portion having two sharp edges facing inwardly towards
each other and configured to displace insulation of wire 15 to
electrically connect with connecting portion 16 of wire. A second set of
blade portions 152 can be disposed parallel to the first set, and can
allow for a more robust electrical connection by piercing wire 15 in a
second location to electrically connect to connecting portion 16. Thus,
attachment member 150 can comprise a double contact connector within
housing 154. In one aspect, housing 154 comprises a white plastic or
insulating material.

[0088] FIGS. 18 to 21 illustrate another embodiment of a light emitting or
LED device, generally designated 160, which can be similar in form and
function to any of the previously described devices (e.g., any of devices
70, 90, or 120). In one aspect, an attachment member 170 can provide
external electrical current to device 160 and can comprise a solder free
connector for releasably engaging and disengaging an electrical
component, such as an electrical wire 15. Attachment member 170 can
comprise a solder free connector. As used herein, the term `solder free`
when describing a connector or connection refers to the connection
between portions of wire 15 and attachment members described herein. Of
note, attachment member 170 may be soldered to an attachment surface 124
(FIG. 13) of submount 72 prior receiving wire 15. However, the physical,
mechanical, and/or electrical connection between portions of wire 15 and
attachment member 170 can be described as solder free, as portions of
wire 15 are not attached to member 170 via soldering.

[0089] LED device 160 can comprise submount 72 over which emission area 76
can be disposed. In one aspect, emission area 76 can be adapted to emit
light upon exposure to electrical current, power, or signal. In one
aspect, emission area 76 can be disposed substantially to one side or in
one corner of LED device 160 and mounted over submount 72. In an
alternative, emission area 76 can be substantially centrally disposed
over submount 72 and/or in any other suitable location on LED device 160.
Emission area 76 can comprise any suitable size and/or shape, for
example, any substantially circular, square, rectangle, oval, regular
polygon, irregular polygon, or asymmetric shaped area. In addition, more
than one emission area 76 can be provided over submount 72. Notably, LED
device 160 can comprise at least one uniform optical source in the form
of emission area 76 which can simplify the manufacturing process for
manufacturers of light products requiring a single component. LED device
160 can further comprise retention material 74 disposed at least
partially about emission area 76 where retention material 74 can be
referred to as a dam. Retention material 74 can also be disposed over at
least one electrostatic discharge (ESD) protection device, such as a
Zener diode 114 (FIG. 12). In some aspects, retention material can be
disposed over more than one, such as two, Zener diodes 114 that can be
connected in series between two electrical elements (FIG. 11).

[0090] As previously described, submount 72 can comprise any suitable
mounting substrate or submount, for example, a PCB, a MCPCB, an external
circuit, or any other suitable submount over which lighting devices such
as LEDs 86 (FIG. 10) may mount and/or attach. Emission area 76 can be in
electrical and/or thermal communication with submount 72. Emission area
76 can comprise a plurality of LED chips or LEDs 86 disposed within
and/or below a filling material 87 as previously illustrated and
described with respect to FIG. 10. In addition, LEDs 86 can be
electrically connected to one or more electrical traces 103, 104 of
submount 72 as previously illustrated and described with respect to FIG.
10. In one aspect, filling material 87 can comprise an encapsulant having
a predetermined, or selective, amount of phosphors and/or lumiphors in an
amount suitable for any desired color point or light emission, for
example, suitable for white light conversion. Retention material 74 can
be dispensed, placed, or otherwise positioned at least partially about
emission area 76. After positioning retention material 74, filling
material 87 can then be filled to any suitable level within the space
disposed between one or more inner walls of retention material 74. For
example, filling material 87 can be filled to a level equal to the height
of retention material 74 or to any level above or below retention
material. After placement of filling material 87, it may be cured or
otherwise hardened prior to insertion of LED device 160 into an external
lighting component or fixture (e.g., downlights, bay lights, etc.).

[0091] Still referring to FIGS. 18 to 21, LED device 160 can also comprise
at least one opening or hole, generally designated 78, disposed through
submount 72 for facilitating attachment of LED device 70 to an external
substrate or surface. For example, one or more screws can be inserted
through the at least one hole 78 for securing device 160 to another
member, structure, or substrate.

[0092] LED device 160 can further comprise at least one electrical
attachment member 170. Attachment member 170 can facilitate physical and
electrical attachment of electrical components (e.g., electrical wire 15)
to device 160 such that device 160 can receive electrical current,
thereby illuminating one or more LEDs disposed within emission area 76.
Attachment member 170 can be positioned or disposed at any location over
submount 72 in any suitable manner, such as for example via an adhesive,
electrically conductive tape, solder, or any other suitable connection
method. Such adhesive, tape, and solder connection methods can physically
and electrically connect attachment member 170 to submount 72. Attachment
member 170 can comprise a housing 172 having one or more openings 174 for
receiving a portion of one or more electrical components, for example,
electrically conductive wires 15 (FIG. 20). Each opening 174 can comprise
a positive, negative, or a combination of positive and negative electrode
terminals through which corresponding electrical current or signal can
pass from the electrically conductive connecting portion 16 one or more
electrically conductive wires 15.

[0093] Electrical current can pass into and out of device 160 via wires 15
electrically communicating with one or more electrically conductive
contacts 176 of housing 172, which in turn electrically communicate with
submount 72 via one or more attachment surfaces (e.g., FIGS. 13 and 15A
to 15E). In one aspect, conductive contacts 176 (e.g., corresponding to
an anode and a cathode) electrically communicate to more than one
attachment surface (e.g., two attachment surfaces also corresponding to a
cathode and anode) which electrically communicate with electrical traces
103, 104 (FIG. 10, also corresponding to an anode and a cathode) thereby
illuminating LEDS 86 within emission area 76. For example, a bottom
surface of housing (not shown) can comprise one more electrically
conductive bottom contacts 176 that upon connection to submount 72, can
electrically communicate with one or more attachment surfaces (e.g.,
similar to those illustrated in FIGS. 13 and 15A-15E) of LED device 160.
Thus, electrical current can flow along a path beginning and ending at
connecting portions 16 of one or more wires 15. In one aspect, electrical
current can flow from a first wire 15 into contacts 176 and into submount
72 via an attachment surface. Current can continue to flow into LEDs 86
of emission area 76 and then back out of device 160 via electrical traces
103, 104 (e.g., FIGS. 10 and 11). Current can then pass back into housing
172 and out of a second wire 15. Bottom contacts 176 may be fully
disposed over bottom surface of housing 172 such that no portion of the
contacts are visible from the outside, or the contacts 176 may extend
beyond the external walls of housing 172 as shown. Contacts 176 can
comprise any suitable electrically and/or thermally conductive metal or
material such as Sn, Cu, or a phosphor bronze alloy that can be Sn
coated.

[0094] Housing 172 can comprise an electrically insulating material, for
example, any plastic, ceramic, glass, or polymer-based material such as
polyphthalamide (PPA) or nylon. Housing can comprise any size and/or
shape, and can be taller or shorter than retention material 74. In one
aspect and without limitation, housing 172 can have a height of
approximately 4.5 millimeters (mm) and can receive wires 15 ranging in
diameter from approximately 14 to 26 gauge (i.e., approximately 0.13 to
2.08 mm2). In one aspect, attachment member 170 can receive wires 15
ranging in diameter from approximately 19 to 19 gauge (i.e.,
approximately 0.34 to 0.75 mm2). However, wires 15 that are any
sub-range smaller in diameter than 0.34 mm2 or larger in diameter
than 0.75 mm2 can also be received, for example, ranges from
approximately 0.13 to 0.26 mm2; 0.26 to 0.75 mm2; 0.75 to 1
mm2; 1 to 1.5 mm2; and/or 1.5 to 2.08 mm2. In one aspect,
housing 172 can comprise any size and any shape adapted to receive any
suitable size of electrical wire 15. In one aspect and without
limitation, housing 172 can have a footprint of approximately 8
mm×14 mm, however, any size is hereby contemplated. Housing 172 can
further comprise one or more tab portions 178 that are movable and/or
depressible via pushing or otherwise physically manipulating to
releasably receive and hold connecting portions 16 of one or more wires
15. As illustrated by FIG. 19, each opening 174 of member 170 can
comprise at least one grip member 180 for physically gripping, clamping,
crimping, or otherwise securing connecting portion 16 of wire 15 thereby
establishing a gas-tight, solder free connection.

[0095] Referring to FIG. 20, openings 174 can be adapted to receive and
releasably secure the electrically conductive connecting portion 16 of
wire 15. Grip members 180 disposed inside openings 174 can physically
grip, clamp, crimp, or otherwise secure the wire 15 within openings 174
of housing 172. The arrow denoted M indicates movement of the wire 15
during insertion and removal. During insertion, wire 15 can be pushed
into opening 174 until it is engaged and held secure by grip member 180.
To release wire 15, a force F can be applied in the direction indicated
by the arrow to depress tab portion 176 thereby releasing or disengaging
grip member 180 from connecting portion 16 of wire 15. Wire 15 can then
be pulled out of and/or otherwise removed from openings 174 of housing
172. Notably, devices and methods disclosed herein can allow for
easy-to-operate and solder free physical and electrical connectivity
between external electrical components to device 160. Such devices and
methods can advantageously improve ease of operation during installation
and removal from lighting fixtures, as well as improve ease of
manufacture by eliminating the need for solder technology and materials.

[0096] Referring to FIG. 21, one embodiment of a physical and electrical
connection of attachment member 170 to submount 72 is illustrated. As
noted, attachment member 170 can connect to submount 72 via adhesive,
electrically conductive tape, solder, or any other suitable connection
method. In one aspect, submount comprises a core layer 108 and a
dielectric layer 106 disposed over core layer 108. Core layer 108 can
comprise a base metal layer such as a layer of Cu or Al. Attachment
surface 124 can be at least partially disposed over dielectric layer,
where a portion of attachment surface 124 is at least partially exposed
between layers of solder mask 102. A second portion of attachment surface
124 can extend below solder mask (e.g., size/shape of material 110, FIG.
11) to electrically communicate with traces 104 and/or 103. In one
aspect, attachment surface 124 comprises a layer of Cu. One or more
optional intervening layers of material 190 can be disposed over
attachment surface 124. Intervening layers of material 190 can comprise
one or more layers of metal such as gold (Au), silver (Ag), nickel (Ni),
titanium (Ti), palladium (Pd), etc., and can be used to either improve
reflectivity of device 160 and/or improve adhesion between solder mask
102 and attachment surface 124.

[0097] Solder mask 102 can be applied over attachment surface 124 and
intervening layers 190 where such layers are present. Solder mask 102 can
be patterned to leave an area of attachment surface 124 and/or layer 190
exposed on a surface of submount 72 for connecting to attachment member
170. In one aspect, attachment member 170 can physically and electrically
connect to submount 72 via a soldering process where solder 192 is
applied between attachment surface 124 (and/or layer 190 where present)
and a bottom surface of attachment member 170. As noted earlier, bottom
surface of attachment member 170 can comprise an electrically conductive
contact for electrically and physically connecting with submount 72 via
solder attachment.

[0098] Attachment member 170 can comprise a solder free connector adapted
to electrically connect to wire 15 (FIG. 20) without the need for solder
material and/or a soldering process. The fact that member 170 may be
soldered to submount 72 does not affect the solder free connection method
established between member 170 and electrical component, (e.g., wire 15,
FIG. 20).

[0099]FIG. 22 illustrates a portion of another embodiment of a light
emitting device, generally designated 200. Device 200 can be similar in
form and function to any of the previously described devices such as
device 160, as such, for illustration purposes only a portion of the
device is shown. Device can comprise a submount 72 for physically and
electrically communicating with an attachment member, generally
designated 202. A light emission area 76 (FIG. 18) and a retention
material 74 (FIG. 18) can be disposed over submount 72. Attachment member
202 can be configured to electrically and physically communicate with an
external electrical component. In one aspect, the external electrical
component can comprise an external housing 204 configured with electrical
wires for supplying power from an external power source or circuit (not
shown).

[0100] Attachment member 202 can comprise one or more pins 206, a portion
of which are configured to engage external housing 204 and a portion of
which can physically and electrically connect to submount 72. Pins 206
can comprise a first portion extending from a housing 201 of attachment
member 202. Pins 206 can extend internally through housing 201 of
attachment member 202 and comprise a second portion which extends from a
side of housing 201 which opposing that from which the first portion
extends from. The second portion of pins 206 can be configured to
physically and electrically connect to submount 72 via attachment
surfaces 208. In one aspect, pins 206 can be soldered to attachment
surface 208. Attachment surfaces can be similar in form and function as
previously described surfaces 124 (FIGS. 13 and 15A-E). In one aspect,
pins 206 comprise connectors that are an electrically conductive material
such as a metal, for example, Au plated with one or more layers of Cu,
Sn, lead (Pb), and/or Ni. Housing 201 of attachment member 202 can be
disposed about pins 206 and can comprise an electrically insulating
material, for example, any plastic, ceramic, glass, or polymer-based
material such as PPA or nylon.

[0101] Attachment member 202 can comprise a solder free connector for
releasably engaging an electrical component, such as external housing
204.

[0102] That is, the connection between member 202 and external housing 204
is not established via solder and/or a soldering process. In one aspect,
external housing 204 comprises one or more electrically conductive wires
210. The wires extend through housing and become crimped to form at
female pins or terminals 212. The female terminals 212 can frictionally
engage pins 206 of member 202 and when pins 206 are inserted into
terminals 212 indicated by the arrows. The connection between member 202
and electrical component or external housing 204 can be a frictional
connection and/or snap-fit wherein pins 206 releasably engage female
terminals 212. Pins 206 can be released from female terminals 212 via
pulling apart member 202 from external housing 204, or otherwise ejecting
pins. Electrical signal can pass from wires 210 into pins 206 and then
into submount 72 of device 200 via attachment surfaces 208. For
illustration purposes, two pins 206 and terminals 212 are shown, however,
more than two pins 206 and terminals 212 are contemplated. Upon
connection of attachment member 202 to external housing 204, two
gas-tight connections are established. A first gas-tight connection
comprises the wires 210 crimped to form the female terminal 212 and a
second gas-tight connection comprises the female terminals 212 connecting
to pins 206.

[0103] LED devices disclosed herein can also advantageously allow more
robust electrical connections while decreasing manufacturing time. For
example, because the submount to which external electrical wires or
connectors are typically soldered or attached can be thermally conductive
and/or heat sinks, it is advantageous to space the attachment portion
away from the submount. By locating the attachment portion a distance
away from the thermally conductive submount, soldering or attaching
processes can become more efficient as heat will not be drawn away from
the attachment portion as quickly as in instances where the attachment
portion is not raised above the submount. The soldering or attachment
process can be carried out more quickly and can result in a more reliable
solder connection with better wetting to essential surfaces because the
heat is not easily drawn away. The steady flow of heat above the submount
can then more readily bond the wire to the attachment portion and create
a bond having fewer defects and/or voids due to improper melting and
wetting to the components during the attachment process. Attachment
members that form gas-tight, solder free connections are also more
robust, as solder is not used, and there is no risk of breakage off of
the wire at the solder joint, thereby cutting off the flow of electric
current to the devices described herein. By making solder obsolete when
connecting electrical components (e.g., wires) to attachment members
disclosed herein, manufacturing and/or installation time and costs can
also be saved.

[0104] Embodiments of the present disclosure shown in the drawings and
described above are exemplary of numerous embodiments that can be made
within the scope of the appended claims. It is contemplated that the
configurations of LED devices and methods of making the same can comprise
numerous configurations other than those specifically disclosed.