lundi 19 juin 2017

PRESS RELEASE

PACKPLAY 2 INTERNATIONAL COMPETITIONA high profile jury!

Montréal, June 19, 2017 – UQAM and Éco Entreprises Québec (ÉEQ) have revealed the names of the eight professionals who will select the best packaging ecodesign projects submitted by students to the Packplay 2 competition, which aims to promote research and innovation in packaging ecodesign and highlight the work of tomorrow’s designers in all packaging ecodesign fields: industrial, object, graphic and brand image design. “We sought to assemble a jury of experts with a variety of complementary expertise in ecodesign and packaging design,” says Sylvain Allard, professor at École de design de l’UQAM. “We received nearly 250 projects from 19 schools and universities around the world! The deliberation process is looking promising!”

The jury will meet on August 17 to assess the student projects. In each category, the members will award a special mention, a distinction and a grand prize to the designs that receive the highest scores. “The Packplay 2 competition drives innovation through ecodesign, an approach that enables designers to put forward solutions that are adapted to contemporary social and environmental issues. For ÉEQ, which has been involved in the competition since its very beginnings and sits on the jury, the initiative is a way to build bridges between young experts in the field and the businesses that seek to provide consumers with ecoresponsible products and packaging,” explained Geneviève Dionne, senior ecodesign advisor, ÉEQ.

The winning projects will be announced on October 17 at the launch of the Packplay 2 exhibition at the World Design Summit Expo at Palais des congrès de Montréal. The exhibition, which will feature a number of winning projects, is the opportunity for visitors to delve into the creative universe of tomorrow’s packaging designers!

About Packplay 2
The Packplay 2 project is organized by Prof. Sylvain Allard at École de design de l’UQAM, in collaboration with Éco Entreprises Québec (ÉEQ). The experience aims to bring together packaging designs by universities and design schools from around the world and see how they measure up against each other. The competition means to promote packaging ecodesign research and innovation and highlight the work of a new generation of designers in all packaging fields, including industrial, object, graphic and brand image design. A booklet entitled “Do we need more Packaging?” and an exhibition at the World Design Summit, held from October 17 to 20 at Palais des congrès in Montréal, will also be launched.