News | July 9, 2014

Microsemi Enables OEMs To Expedite Prototyping And Application Development With Its Comprehensive New SmartFusion2 SoC FPGA Evaluation Kit

Feature-rich, affordable platform enables OEMs to leverage SmartFusion2's lowest power consumption in its class, high reliability capabilities and best-in-class security to build highly differentiated products with significant time to market advantage

Aliso Viejo, CA /PRNewswire/ - Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the availability of the company's new leading-edge SmartFusion®2 SoC FPGA Evaluation Kit. The new SmartFusion2 Evaluation Kit is an easy-to-use, feature-rich, affordable platform designed to enable designers to quickly and easily accelerate evaluation or prototype their application. Utilizing Microsemi's mainstream SmartFusion2 FPGAs enables original equipment manufacturers (OEMs) to leverage the device's lowest power consumption in its class, high reliability capabilities and best-in-class security technology to build highly differentiated products that help them gain a significant time to market advantage.

A prime example is that the SmartFusion2 Evaluation Kit allows for simplified development of transceiver I/O-based FPGA designs necessary in today's PCI Express (PCIe) and Gigabit Ethernet-based systems. For faster evaluation and prototyping, Microsemi's leading-edge evaluation board is small form-factor PCIe compliant, which can be used on any desktop PC or laptop with a PCIe slot. According to market research firm Infonetics, the carrier Ethernet market will grow to approximately $39 billion in 2017.

"Leveraging our experience as a leader in this market, Microsemi's new SmartFusion2 SoC FPGA Evaluation Kit is the ideal development platform for designers just starting to work with FPGA-based processors. We've made it easier to implement new designs because designers aren't starting from scratch," said Venkatesh Narayanan, director of software and systems engineering at Microsemi. "It is important for our OEMs to implement designs quickly and Microsemi's new kit provides the key mainstream features customers demand most, with a 25K LE SmartFusion2 mainstream FPGA and SERDES evaluation capabilities at a very affordable price point."

The kit offers a comprehensive set of features that include PCIe, Gigabit Ethernet, full-duplex SERDES SMA pairs, DDR memory, SPI Flash, USB On-The-Go and several expansion interfaces that create the needed flexibility for a wide range of application development. With purchase of the evaluation kit, developers also have access to Microsemi's full array of industry leading development resources such as reference designs and the ability to launch example application demonstrations.

About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and synchronization devices and precise time solutions, setting the world's standard for time; voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,400 employees globally. Learn more at www.microsemi.com.

Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to its SmartFusion®2 SoC FPGA Evaluation Kit, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.