Thick Film

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Product description

Standard Thick Film Ceramic (96% Alumina) substrates are engineered to minimize as-fired resistor variations and maximize aged adhesion values. Superior resistor stability is achieved by controlling the substrates' effects on the temperature coefficient of resistance.Standard Thick Film Ceramic substrate is particularly well suited for small geometry and high resistor value circuitry.

LTCC is a multilayer ceramic technology and stands for Low Temperature Co-fired Ceramic, which low sintering temperature - around 900° C - allows the usage of noble high conductivity metals as silver and gold. Green sheets out of glass, alumina and organic binder are punched and the vias are filled with ...read more