IPC Printed Board Defense Roadmap

The IPC Defense Roadmap identifies the printed board designs and materials that will be needed to meet future Department of Defense (DoD) and Original Equipment Manufacturers (OEM) needs. Also discussed in the roadmap are the North American printed board industry’s future technology factors and capabilities for defense electronics. The roadmap is an excellent tool to facilitate better communication between the printed board industry, OEMs designing and manufacturing military hardware, the DoD and the military electronics supply chain.

The IPC Printed Circuit Board Executive Agent Task Force developed the roadmap to assist the DoD PCB Executive Agent in developing a DoD printed board and interconnect technology roadmap by identifying printed board technologies, designs and materials that will be required to meet future DoD and OEM needs. Congress mandated the establishment of the PCB Executive Agent program and development of the DoD Roadmap in order to strengthen national defense readiness.

What’s in the IPC Printed Board Defense Roadmap:

Identifies and addresses the challenging printed board designs, production processes and materials required to meet future DoD and OEM needs