In many threads here I have read and talked about Electroless Gold problems and have experienced my own problems with it. Love to hear what others are doing as a replacement. Is it Electroless tin, is it osp or is HASL good enough for .031 pitch BGA processing. The particular board we are running is about 8 x 10 with a Ceramic 256 pin BGA right in the middle of the board. It also has 2 .031 pitch BGA's and a host of various .019 and up pitch parts. Let me know what the thoughts are in today world

Doug: I guess every solderability preservative has it�s fans. You know what the issue is? � A supplier that makes it�s customer happy by doing a good job processing material!!!! I�m a HASL guy myself � too much heartache with the other stuff. Give that bias, go wid da HASL!!! With HASL, I�d be more concerned about the 19 pitch whatever�s than the 31 pitch BGA.