Basic specifications

Applicable wafer size： 300mm／200mm

Applicable wafer thickness： 400um or more

Throughput： 68wafers/hr.

※Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

DR8500III

Full-auto Protection Tape Applicator for 200mm wafer

Operation flow

Features

8""/6""/5"" wafer available
4"" wafer handling function (Option)

Low tension applying (RF version)

Adding Table/ Roller heating function available

Easy operation by Touch panel

Follow to CE mark

Adding SECS/GEM available

Basic spesifications

Applicable wafer size： 8/6/5/4 inch

Applicable wafer thickness： Non back grinding wafer

Throughput： 77wafers/hr. （RF version：68wafers／hr.）

※Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.

DSA840II

Semi-auto Protection Tape Applicator for 200mm wafer

Operation flow

Features

8"/6"/5"/4" wafer available

8"- 4" wafer handling available by 1 table

Easy operation by Touch panel

Follow to CE mark / SEMI S2/S8

Basic spesifications

Applicable wafer size： 8/6/5/4 inch

Applicable wafer thickness： Non back grinding wafer

Throughput： App.50sec.／wafer

※ Above spec. values will be influenced by wafer/tape/other conditions, and in several cases, the option function is included.
In the case the conditions are appropriate, the wafers out of above spec. could be applicable. Please contact us.