The global market for flip-chip technology totaled $24.9 billion in 2015. The market should total $27.2 billion and $41.4 billion in 2016 and 2021 respectively, increasing at a compound annual growth rate (CAGR) of 8.8% from 2016 to 2021.

This report provides:

An overview of the global markets for flip-chip technologies, a process to interconnect IC’s and other microelectronics devices (MEMS) to the external circuitry by means of a solder bumping process deposit on pads.

Analyses of global market trends, with data from 2015, 2016, and projections of compound annual growth rates (CAGRs) through 2021.

Discussion of the evolution, architecture, and value chain of flip-chip technologies.

Examination of market dynamics, including drivers, restraints, and opportunities.

Analysis of the flip-chip assembly markets by geography, including North America, Europe, Asia-Pacific, and others.

Coverage of the competitive landscape, including mergers and acquisitions, collaborations and agreements, and new product development.

Profiles of major players in the industry.

Purchase this report

License Information

1-User PDF

This license allows for use of a report by one person. This person may use the report on any computer, and may print out the report, but may not share the report (or any information contained therein) with any other person or persons. Unless a 5-User License, a Site License or an Enterprise License is purchased, a Single User License must be purchased for every person that wishes to use the report within the same enterprise. Customers who infringe these license terms are liable for an Enterprise license fee.

License Information

5-User PDF

This license allows for use of a report by five people within the same enterprise location. Each of these people may use the report on any computer, and may print out the report, but may not share the report (or any information contained therein) with any other person or persons. Customers who infringe these license terms are liable for an Enterprise license fee.