In 2016, KLA-Tencor will differentiate itself by introducing technologies that drive new systems for mask, IC device, bare wafer and packaging inspection. Second, continue to develop process control solutions that utilize multiple inspection/metrology systems and advanced data analysis to help IC manufacturers characterize, optimize and control the most critical yield issues. Third, continue to collaborate closely with our customers to better understand the requirements of their most challenging problems.

KLA-Tencor biggest area of differentiation has been in the area of optical inspection and metrology in spite of decade-long predictions that these will be eliminated as geometries shrink. Optical inspection continues to be the workhorse tool in both the mask shop and the fab as it offers throughput and COO that e-beam hasn't come close to. To meet the challenges of the current process control landscape, KLA-Tencor will introduce new extensions and tools for all areas of IC inspection and metrology.

Advancing process technology for the mobile arena will remain a driving factor, and we see expanding opportunities in the IoT and advanced-packaging. KLA-Tencor will continue to work closely with these IC manufacturers to implement advanced inspection and metrology solutions that will enable early identification and remedy of process issues.