The difference between PCB board and gold plate

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What is Shen Jin: by the method of chemical oxidation reduction to generate a layer of coating, the general thickness of the thick, is a chemical nickel Jin Jinceng deposition method, can reach a thick gold layer, usually called Shen jin.

The difference between PCB board and gold plate

1, gold and gold plating the formation of the crystal structure is not the same, gold for gold and gold thickness of a lot of gold, gold will be more yellow than gold, the customer is more satisfied.

2, gold and gold plating the formation of the crystal structure is not the same, gold plating more easy to welding, will not cause welding bad, causing customer complaints. The stress of the gold plate is more easily controlled, and it is more advantageous to the processing of the state. At the same time, it is also because of the gold plating gold plating soft, so the gold plate do not wear gold.

3, the gold plate is only on the welding plate nickel metal, the skin effect of the signal transmission is in the copper layer will not affect the signal.

4, gold is more gold than gold crystal structure is more compact, not easy to produce oxidation.

5, with the wiring more and more dense, line width, spacing has reached 3-4MIL. Gold is easy to produce gold wire short circuit. Gold plate only has a nickel gold, so it will not produce gold wire short circuit.

6, the gold plate is only on the welding plate nickel gold, so the wire on the solder and copper layer on the combination of more solid. The project will not affect the spacing when the compensation is made.

7, generally used for the relatively high requirements of the board, flat degree is good, the general use of heavy gold, gold will not appear after the general assembly of black pad phenomenon. Gold plate smooth and for life and is as good as gold plate.