PALO ALTO, Calif., February 12, 2018 — HP Inc. (NYSE: HPQ) today announced that ePac Flexible Packaging, an all-digital flexible packaging converter, purchased 10 additional HP Indigo 20000 digital presses to expand operations across the US through mid-2019. The new order quadruples production capacity for ePac and is the largest packaging deal for HP to ...

PALO ALTO, Calif., February 12, 2018 — HP Inc. (NYSE: HPQ) today announced that ePac Flexible Packaging, an all-digital flexible packaging converter, purchased 10 additional HP Indigo 20000 digital presses to expand operations across the US through mid-2019. The new order quadruples production capacity for ePac and is the largest packaging deal for HP to ...

HP Inc. (NYSE: HPQ) will present a live audio webcast of a conference call to review financial results for the first fiscal quarter ended January 31, 2018 on Thursday, February 22, 2018 at 5:35 p.m. ET / 2:35 p.m. PT.

HP Inc. (NYSE: HPQ) will present a live audio webcast of a conference call to review financial results for the first fiscal quarter ended January 31, 2018 on Thursday, February 22, 2018 at 5:35 p.m. ET / 2:35 p.m. PT.

PALO ALTO, Calif., February 7, 2018 — HP Inc. today unveiled a range of new devices, displays and accessories designed for the modern workforce, including the rollout of several award-winning premium features to the best-selling HP EliteBook 800 series and HP ZBook 14u/15u mobile workstations.

PALO ALTO, Calif., February 7, 2018 — HP Inc. today unveiled a range of new devices, displays and accessories designed for the modern workforce, including the rollout of several award-winning premium features to the best-selling HP EliteBook 800 series and HP ZBook 14u/15u mobile workstations.

LOS ANGELES, Feb. 5, 2018 – At SOLIDWORKS World, HP today announced it will power its bestselling performance workstation, the HP Z4, with a choice of Intel® Xeon® or Core™ X processors and support dual extreme graphics.