ROLLED COPPER FOIL OR ELECTROLYTIC COPPER FOIL FOR ELECTRONIC CIRCUIT AND METHOD OF FORMING ELECTRONIC CIRCUIT USING SAME

Document Type and Number:

WIPO Patent Application WO/2010/074053

Kind Code:

A1

Abstract:

A rolled copper foil or electrolytic copper foil for electronic circuits which is etched to form a circuit, characterized by including, formed on the side to be etched, a nickel alloy layer that has a lower etching rate than copper, the nickel alloy layer containing zinc. When a copper-clad laminate is subjected to circuit formation through etching of the copper foil, the etching can be prevented from resulting in an extended base and a desired circuit having an even circuit line width can be formed. The time period required for circuit formation by etching is minimized. The thickness of the nickel alloy layer has been minimized. The copper foil is inhibited from oxidizing upon heating and is prevented from suffering the discoloration commonly called "burning". The copper foil has improved suitability for pattern etching and is effective in preventing the occurrence of short circuits or circuit line width failures.