Dimensions

Plan Optik produces GOS and SOG wafers with diameters of 2" - 200 mm and thicknesses from 250 µm. The precise specification of each wafer is determined in agreement with the customer, depending on the intended application.

Diameter

2" - 200 mm

Thickness range

250 - 2000 µm

Thickness Si and / or glass layer

20 - 1000 µm

Edge geometry incl. flat(s) + notch

in accordance with SEMI for monocrystalline Si-wafers
Special bondgap removal

The use of the latest production technology at Plan Optik guarantees the maintenance of minimal thickness tolerance and total thickness variation (ttv).