DATE: 06-7-2013 HOTFIX VERSION:046=================================================================================== CCRID PRODUCT PRODUCTLEVEL2 TITLE =================================================================================== 1079538 F2B PACKAGERXL Ability to block all single noded nets to the board while packaging. 1123150 CONCEPTHDL CORE property on y axis in symbol view was moved by visibility change to None. 1144990 PCBLIBRARIAN CORE PDV expand collapse vector pins resizes symbol outline to maximum height 1149987 PCBLIBRARIAN PTFEDITOR Save As pushing the part name suffix into vendorpartnumber value 1152755 CONCEPTHDL COPYPROJECT Copy project hangs if library or design name has an underscore 1153857 CONCEPTHDL CORE Changing different power symbol should maintain the schematic level properties. 1155569 APD MODULES P1U1 and P1U3 Die pins are missing after Place Module. 1155728 CONCEPTHDL CORE Unable to uprev packaged 16.3 design in 16.5 due to memory 1156547 ALLEGROEDITOR DRCCONSTR Etch Turn under SMD pin rule check through pin Etch makes confused. 1158042 ALLEGROEDITOR DFA DFADLG writes the dra file name in uppercase. 1158528 CONCEPTHDL OTHER Dual Monitor issue: Retain Hard Packaging option is missing and attribute test distorted 1158718 CONCEPTHDL CHECKPLUS Customer could not get PN property values on logical rule of CheckPlus16.6. 1159516 ALLEGROEDITOR EDITETCH Unable to slide cline segment with new slide. 1160004 SCM UI The RMB->Paste does not insert signal names. 1161538 CONCEPTHDL CORE Espice model value edited in DE HDL then netlisting done, but it doesnt changes the earlier assigned model in Allegro 1162383 CONCEPTHDL CHECKPLUS Checkplus not using CDSSITE/customhelp and CDSSITE/customrulesinclude directories. 1162686 CONCEPTHDL CORE Changing NETSPACINGTYPE to display both shows up with NETSPACINGTYPE 1165469 CONCEPTHDL CORE Import Design loses design library name 1165801 CONCEPTHDL PDF Pin texts of spun symbol overlap in publish PDF. 1165836 SIGINTEGRITY GEOMETRYEXTRACT Some nets has no result at Bus Simulation and Comprehensive simulation.(update) 1166819 CONCEPTHDL CORE Cadence DEHDL Text Size Issue 1167519 ALLEGROEDITOR DATABASE Uprev dbdoctor does not log warnings about renaming properties. A hot fix is a software maintenance package containing a small number of code fixes, designed to fix a small number of critical problems. A hot fix enables a customer to receive fixes for urgent problems, without having to wait for the next service pack.

Each successive Fix Pack is comprehensive and contains the material from the earlier Fix Packs for that Release, as well as all Interim Fixes made available since the previous Fix Pack or full Release. In other words, when multiple Fix Packs are available, you would not need to apply Fix Pack 1 before applying Fix Pack 2.

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Cadence enables global electronic design innovation and plays an essential role in the creation of today``s integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry.