12:10 Chairman called the meeting to order and thanked
everyone for attending.

The Chairman reviewed the agenda and asked for a few
changes

Modify the agenda

Approve the minutes

Review action items

Tentative Discussion of PCIM Roundtable on Power
Module Specs,

Refocus Direction and Plan for Rapid Progress

Review and generation of action items

Close with next meeting agenda

These changes were accepted

Review and approval of the minutes

After some time Yuri
asked about the next meeting at PCMI, asking about the
propriety of having a IEEE standards meeting at an
industry funded meeting. Suggesting that IAS meeting a
few weeks later would be a better forum.

Asked to put off discussion until after the minutes
had been approved.

Yuri K Also asked about the consideration being given
other standards groups at work on related issues and
standards developed in the past but currently dormant.

Jaison Lai is doing this at the committee level but
Chairman asked that Yuri try and track down all other
activities he has knowledge off and let the working
group know about the.

Arthur K moved that the minutes be accepted and B Murty
seconded, there were no objections.

Reviewed action items

Mark H. WEB PAGE AND NEWSGROUP FOR 1461: The set up of a
chat room and better use of the WEB for communication was
discussed. Arthur K has volunteered to manage a listserver,
and will investigate the ability to have threaded discussions
like a newsgroup. Mark H will also look into doing this. Tom
Jahn also volunteered to help in this area.

Dennis--MORE MODULE MANFACTURER PATICIPATION: None of the
module manufacturers were present. Once more Dennis will try
to get them involved, also it is hoped that PCIM and IAS will
have more representatives from the module makers so they will
attend.

Dennis D. SAE STANDARD Has not been able to get it yet.

Dennis D. Find someone to take charge of the thermal
interface issue. Van Godbold was asked to take this on had is
now the Task Leader in that area.

Jeff F was then asked to talk about a panel discussion he
was trying to set up at PCIM 97.

Jeff has asked the organizers of PCIM for a half session
period to set up a roundtable to discuss the need for Power
Packaging standardization and the work being done in this
group. Proposed Format:

Introduction

Overview paper discussing the purpose, rationale,
progress and timetable of the current effort

A panel or open forum discussion with the attendees

This was proposed in addition to a meeting of the working
group that would be held in the evening.

Yuri K and others now asked about the propriety of
holding a IEEE standards group meeting at an
industry/commercial exhibition/conference. Tom J
suggested that informing and promoting was fine but
holding the actual meeting might not be a good idea.
Others pointed out that the Module Makers will be at the
IAS meeting the next month and that maybe holding Jeff
F's panel discussion in the PCIM technical session would
spark interest in attending a meeting held at IAS. The
pro's and con's of PCIM vs IAS were discussed

IA--Dennis D will look into the propriety issue for
future reference.

Arthur K motioned that the next meeting be moved to IAS
with support for the panel discussion at PCIM. This was
passed and accepted by the majority and there were no
objections.

THE NEXT FORMAL MEETING WILL BE AT IAS in
NEW ORLEANS SOMETIME DURING THE WEEK OF OCTOBER 5th.

Dennis now moved on to the next item. A discussion of a
change in focus/direction

Need to keep the effort general and in support of the
industry and users So we probably need to break the effort
into smaller pieces and start at a low level.

Probably need to be very mechanical at first and firmly
based in current practice.

Break the effort into a series of levels:

Level 0

Physical Characteristics of the mounting and
interconnect

Pin size

Wire size

Bolt pattern

Connectors

Thermal Interface

Liquid Cooled

Conduction Cooled

Level 1

Performance characteristics of the Interface

Current density

Thermal Impedance

Control Signals

Level 2

Test methods

We need to start a Glossary of Terms with definitions,
this will be put up on the WEB and discussed over the
listserver system so we have a common terminology to work
with in future.

Yuri and Raja then asked some of the questions about
Specs. vs Stds. and how we plan to keep this from becoming a
specification for one product. And if we had thought about
the fact that one size does not fit all. Yuri suggested that
we somehow break the application space into zones.

Several people, Arthur, Sunil and Yuri in the main
discussed how to break the space into zones. Voltage and box
size came up with power, dissipation and current suggested as
well. This is an interesting problem, AI Sunil
volunteered to try and create a prototype zoning system for
group consideration.

After some discussions on the topic Dennis asked AI
Yuri to take the lead in tracking down examples of
prior work/specs/standards. Yuri will get them to
Mark who will get them on the WEB site.

Now discussed how to break down the workload, in overview
there will not be much change.

Sunil C--Create the zoning system and work with
others from the work he has put in on the PNGV power
module spec.

Van G--Thermal Inerface Supported by Anand as well as
others

Jeff F--Mechanical Interface Supported by Jason and
Sunil

Angelo F--Control Interface Supported by Chuan

John M-- Power Interface Supported by Rob

Denns D emphasized that it would be in everyones interest
if we could have Level 0 of one zone ready for the next
meeting.

Tom J suggested that from prior experience e-mail and
brainstorming like techniques could be used to accelerate a
process like this.

Put in around 4 hours or less on a cut at the problem
assigned

E-mail to everyone in the group and solicit
suggestions

Repeat

Someone suggested that a backbone for the brainstorming be
provided in the form of a table of contents. AI Mark H
volunteered to take Sunils' strawman and create a generalized
table of content and get it out to the members.

B Murty suggested that all our work should be based on
existing technology/methods. That we should basically be
collecting a database of proven prior art for use in the
future. Although there is some issue with looking to the
future, for now it was generally agreed that this was the
basis for our initial work.

A quick review of the action items was held

The agenda for the next meeting will be as proposed for
this meeting.

Dennis D asked for a motion to adjourn it was submitted
and seconded and agreed on by acclaim.

THERE WILL BE A DISCUSSION OF OUR WORK AT
PCIM 97 IN BALTIMORE

BUT

THE NEXT FORMAL MEETING
WILL BE AT THE IAS GENERAL MEETING IN NEW ORLEANS
SOMETIME AROUND OCTOBER 6th