Prepreg laminate for Multilayer PCB

- nominal thickness 1,6 mm, is coated with copper foil of 35um from one or two sides. Standard FR4 material consist of eight layers of glass laminate. The logotype of producer is usually situated on the central layer, its color inform of flammability class of the material (red – UL94-VO, blue- UL94-HB). Usually, FR4 is transparent, the color of the board is defined by the chose of solder mask, applied.

Volume resistivity (Omxm): 9,2 õ 1013;

Surface resistance (Om): 1,4 õ1012;

peel resistance of the foil after impact of electroplating (N/mm): 2,2;

MI 1222

is multilayer pressed material based on fiberglass, impregnated with epoxide and coated with cooper plating foil.

surface resistance (Om): 7 õ 1011;

Volume resistivity(Omxm): 1 õ 1012;

permittivity (Omxm): 4,8;

flammability (Í/mm): 1,8.

FAF 4D

ïIs an armor-clad with fiberglass fluoroplastic, coated with cooper foil. Usage: as the basic PCB for microwave diapason. It is a PCB base for electrical insulation of printed elements in receiving and transmitting devices, with thermal durability from +60 to +250C

The strength of foil and base adhesion per 10mm 17,6 minimum

Tangent of dielectric loss with frequency of 106 Hz maximum 7x10-4

Permittivity 1 Hz 2,5+/- 0,1

The size of the list 500x500

T111

Is a material made of heat-conducting polymer on the base of ceramics, is suitable in case of usage of the mounting components, which emit large thermal power (exp: super bright light emitting diodes, laser emitter and etc.) The main features of the material are an excellent thermal dispersion and an increased dielectric durability under of High Voltage:

imported aluminum and copper

dielectric no-fiberglass

thermal conductivity 1.8-3.0w/m.k

Conductibility :1.8-3.0W/m·k

Peel Strength:1.5N/mm

Thermal stress:120S

TG:100

Solder masks, used in PCB production

Solder mask – is a layer of tough material which protects conductors from solder and flux interaction while soldering, as well as from overheating. The mask covers conductors, but leave pads and printing contacts open. The method of solder mask application is photoimaging- the process of transmission an original image by phototool on the surface of the PCB material and than clear areas are exposed to radiation and polymerised, while solder pads stay protected, and mask is easily removed from the surface after manifestation. Usually the mask covers cooper layer, consequently, before solder mask is applied, the protective tin layer is removed, as it can deform under the impact of heating while soldering.

IMAGECURE XV-501 (Coates Electrografics Ltd GB)

– XV501T-4 is the current standard LPISM range it offers a high level of performance, improved track encapsulation and wide process windows. With process optimization T4 formulations are suitable for Ni/Au processing and HDI PCBs. Is available for all application methods.