Prognostics & Health Management Solutions

Our innovative ePHM(Prognostics & Health Management)with real time sensors address critical fault areas such as - Digital Boards, Power supplies, Inter connectors, Software faults, Chip level failures, Intermittancies We have solutions for verticals such as aerospace, automotive, industrial and medical. We rely upon evidence of degradation through its background in physics-of-failure technologies. By extracting a distinct signature that precedes a failure, a meaningful and accurate indication of impending failure can be determined. Other issues of prognostics involve on-board vs. off-board implementations, and linkages with Autonomic Logistics Information System (ALIS) to optimize the placement of spare parts in key areas to support deployed equipment.

Sentinel Network is a web application that combines network monitoring and prognostic health management (PHM) technologies. The main feature of Sentinel Network is its ability to predict the remaining useful life of network assets such as power supply devices (UPS) and battery backups. This reduces network downtime by permitting condition-based maintenance of these critical assets prior to catastrophic failure.

CPT1000™ Avionics Troubleshooting ToolThe CPT1000 is a reliable, high performance power system tester. The integrity of main terminals, cables, and power supplies is crucial in power systems. This tool effectively tests and finds faults in power supplies and cabling.

Intermittent and catastrophic faults in electronic control systems can now be prevented with Ridgetop Group’s SJ BIST™. The SJ BIST (Solder Joint Built-In Self-Test) technology accurately detects and reports instances of high resistance, including intermittent opens, in field programmable gate arrays (FPGAs)-to-board interface.

The Sentinel Actuator product is used to detect anomalies in the operation of electromechanical actuators (EMAs). The detected anomalies can stem from electrical drive stages or mechanical faults in gearboxes. After detection, state-of-health (SoH) and remaining useful life (RUL) are calculated using advanced algorithms and presented on the Graphical User Interface (GUI).

TSV BIST, entails a combination of innovative techniques for improved verification of the quality and reliability of 2.5/3D IC packaging and for prognostics so that related interconnect operational faults can be determined before actual failure occurs. This technology is the first to address the difficult issue of 2.5/3D IC package interconnect integrity after assembly is done and when the related devices are deployed in larger systems. The innovation will improve reliability of TSV-based packaging and provide prognostics so that interconnect-related operational faults can be determined before actual system failure occurs.