OK, so is anyone qualifying CGA's yet? Our first batch of CGA qualification is not going too well. We stuck with the teardrop shaped pad but the solder fillet is not as big as expected. What size pads is anyone using, i'm getting conflicting information from IBM / others. We have small fillets, which look void-free but we haven't microsectioned yet, they are definately connected and likey to fail in vibration. I have pictures too if anyone's interested.