3D process delivers fine-pitch circuits

The MediSpec Molded Interconnect Device (MID) 3D
circuit capability uses Laser Directed Structuring (LDS) technology
to integrate electrical and mechanical design into a single molded
device for miniaturization. The capability is scalable from small-
to large-volume production quantities and produces interconnects
that are said to meet or exceed stringent medical device
guidelines, reduce component count and materials usage, minimize
development and production processes, lower prototyping costs, and
deliver faster time to market.