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Abstract:

Methods of cutting a light-emitting device chip wafer by using a laser
scribing process. The method includes: preparing a wafer that has a
plurality of semiconductor chips on an upper surface of the wafer;
attaching a first tape covering the semiconductor chips to the upper
surface of the wafer; forming scribing lines to define each of the
semiconductor chips on the wafer by irradiating a laser beam onto a lower
surface of the wafer; attaching a second tape to the lower surface of the
wafer; and breaking the wafer into a plurality of chips by applying a
physical force to the wafer along the scribing lines.

Claims:

1. A method of cutting a wafer, the method comprising: preparing the
wafer having a plurality of semiconductor chips on an upper surface of
the wafer; attaching a first tape covering the semiconductor chips to the
upper surface of the wafer; forming scribing lines to define each of the
semiconductor chips on the wafer by irradiating a laser beam onto a lower
surface of the wafer; attaching a second tape to the lower surface of the
wafer; and breaking the wafer into a plurality of chips by applying a
physical force to the wafer along the scribing lines.

3. The method of claim 2, wherein the wafer is a sapphire wafer through
which the laser beam passes.

4. The method of claim 1, wherein the forming of the scribing lines
comprises irradiating the laser beam in a thickness direction, so that
the laser beam is focused approximately in a middle position of the
thickness of the wafer.

5. The method of claim 1, wherein the forming of the scribing lines
comprises forming the scribing lines in an X direction and a Y direction
of the wafer, while moving an X-Y stage that supports the wafer in the X
direction and the Y direction.

6. The method of claim 1, wherein the breaking of the wafer comprises
cutting the wafer by pressing the wafer along the scribing lines by using
a break blade.

Description:

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of Korean Patent Application
No. 10-2011-0147417, filed on Dec. 30, 2011, in the Korean Intellectual
Property Office, the disclosure of which is incorporated herein in its
entirety by reference.

BACKGROUND

[0002] 1. Field

[0003] The present disclosure relates to methods of cutting a
light-emitting device chip wafer on which a plurality of light-emitting
device chips are formed using laser scribing.

[0004] 2. Description of the Related Art

[0005] Light-emitting device chips, e.g., light-emitting diodes (LEDs),
are semiconductor devices that realize various light colors by
configuring a light source through a PN junction of compound
semiconductors. LEDs have a long lifespan, may be miniaturized and
manufacture light, and may be driven at a low voltage due to high
directionality. Also, LEDs are resilient to impact and vibration, do not
require a preheating time and a complicated driving, and may be packaged
in various types. Accordingly, LEDs may be applied for various purposes.

[0006] When an LED is manufactured using a semiconductor manufacturing
process, a plurality of light-emitting device chips are formed on a wafer
to increase productivity.

[0007] In order to separate the light-emitting device chips, the
light-emitting device chips of the wafer are each cut. After the
light-emitting device chips are separated by using a wafer cutting
process, the characteristics of electrodes of each of the light-emitting
device chips are inspected through contact with a multi-probe.

[0008] In a related art, after attaching a protection tape on a side of
the wafer, the wafer is cut by using a sawing blade, i.e., a rotating
blade wheel, in a mechanical cutting process. However, the mechanical
cutting process may contaminate the environment due to dust, generated
during the mechanical cutting process. Also, a contact failure between
electrodes and a multi-probe may occur due to a disorder of alignment of
the separated light-emitting device chips on the protection tape. Thus,
the contact failure may cause problems in the light-emitting device
chips.

SUMMARY

[0009] Disclosed are methods of cutting light-emitting device chip wafers
to increase the productivity of a cutting process by separating the
light-emitting device chips by using a laser scribing process and a
breaking process.

[0010] Additional aspects will be set forth in part in the description
which follows and, in part, will be apparent from the description, or may
be learned by practice of the presented embodiments.

[0011] According to an aspect of the exemplary embodiments, there is
provided a method of cutting a wafer, the method including: preparing the
wafer having a plurality of semiconductor chips on an upper surface of
the wafer; attaching a first tape covering the semiconductor chips to the
upper surface of the wafer; forming scribing lines to define each of the
semiconductor chips on the wafer by irradiating a laser beam onto a lower
surface of the wafer; attaching a second tape to the lower surface of the
wafer; and breaking the wafer into a plurality of chips by applying a
physical force to the wafer along the scribing lines.

[0012] The semiconductor chips may be light-emitting device chips.

[0013] The wafer may be a sapphire wafer through which the laser beam
passes.

[0014] The forming of the scribing lines may include irradiating the laser
beam in a thickness direction, so that the laser beam is focused
approximately in a middle position of the thickness of the wafer.

[0015] The forming of the scribing lines may include forming the scribing
lines in a lattice type, that is, in an X direction and a Y direction of
the wafer, while moving an X-Y stage that supports the wafer in the X
direction and the Y direction.

[0016] The breaking of the wafer may include cutting the wafer by pressing
the wafer along the scribing lines by using a break blade.

[0017] According to a further aspect of the exemplary embodiments, there
is provided a wafer, the wafer including a plurality of semiconductor
chips on an upper surface of the wafer; a first tape, which covers the
semiconductor chips and is attached to the upper surface of the wafer;
and a second tape, which is attached to a lower surface of the wafer,
wherein scribing lines are formed to define each of the semiconductor
chips on the wafer.

[0018] According to the exemplary embodiments, the failure rate of
light-emitting device chips may be reduced by reducing particles
generated from a cutting process.

[0019] Also, because a tape that fixes the light-emitting device chips is
attached onto both surfaces of a wafer, after cutting the wafer, the
positions of the light-emitting device chips are fixed. Accordingly,
characteristics of each of the light-emitting device chips may be
inspected using a multi-probe.

BRIEF DESCRIPTION OF THE DRAWINGS

[0020] These and/or other aspects will become apparent and more readily
appreciated from the following description of the embodiments, taken in
conjunction with the accompanying drawings in which:

[0021] FIG. 1 is a schematic cross-sectional view of an example of a
light-emitting device chip according to an embodiment;

[0022] FIGS. 2A-2D are schematic cross-sectional views showing a method of
cutting a wafer by using a laser scribing process, according to an
embodiment;

[0023] FIG. 3 is a perspective view of a wafer ring on which a wafer is
mounted.

DETAILED DESCRIPTION

[0024] Reference will now be made in detail to embodiments, examples of
which are illustrated in the accompanying drawings. In the drawings, like
reference numerals refer to like elements throughout and the thicknesses
or sizes of elements are exaggerated for convenience of explanation and
clarity. It will be understood that when an element or layer is referred
to as being "on" another element or layer, it can be directly or
indirectly formed on the other element or layer. For example, intervening
elements or layers may be present.

[0025] FIG. 1 is a schematic cross-sectional view of an example of a
light-emitting device chip according to an embodiment of the present
invention.

[0026] Referring to FIG. 1, a buffer layer 120 is formed on a substrate
110. The substrate 110 may be a sapphire substrate 110. The buffer layer
120 may be formed of InxGayAl.sub.zN, ZrB2, HfB2,
ZrN, HfN, TiN, or AlN. An n-type nitride layer 130 is formed on the
buffer layer 120. The buffer layer 120 is formed to mitigate lattice
misalignment between the n-type nitride layer 130 and the sapphire
substrate 110. The n-type nitride layer 130 may be formed of
InxGayAl.sub.zN. The n-type nitride layer 130 may be formed as
a single layer or a plurality of layers, compositions thereof vary. A
portion of the n-type nitride layer 130 is exposed, and an n-type
electrode pad 140 may be formed on the exposed portion of the n-type
nitride layer 130. A multiple quantum well active layer 150 and a p-type
nitride layer 160 are sequentially formed on a portion of the first
nitride layer 130. A p-type electrode pad 170 is formed on the p-type
nitride layer 160.

[0027] In FIG. 1, the light-emitting device chip 100 has a horizontal type
electrode structure. However, the light-emitting device chip 100
according to the current embodiment is not limited. For example, the
light-emitting device chip may have a vertical type electrode structure.

[0028] FIGS. 2A through 2D are schematic cross-sectional views showing a
method of cutting a wafer by using a laser scribing process, according to
an embodiment.

[0029] Referring to FIG. 2A, the wafer 210 has a plurality of
semiconductor chips prepared on an upper surface 211. The semiconductor
chips may be light-emitting device chips 100. The wafer 210 may be formed
of sapphire, and the light-emitting device chips 100 may be GaN group
light-emitting diodes formed on the wafer 210. The light-emitting device
chips 100 may be arranged in a matrix on the wafer 210. For convenience,
three light-emitting device chips 100 are depicted in FIG. 2A. However,
embodiments are not limited to three light-emitting device chips 100. The
light-emitting device chips 100 may also have various structures. As an
example, the light-emitting device chips 100 may each include the
horizontal light-emitting device chip 100 of FIG. 1.

[0030] A first tape 220 may be attached above the upper surface 211 of the
wafer 210 to cover the light-emitting device chips 100. The first tape
220 fixes the wafer 210 in a laser scribing process and a cutting
process. The first tape 220 is not specifically limited and may be any
tape that provides adhesiveness. For example, the first tape 220 may be
an ultraviolet tape (UV tape), or a thermosetting tape. The first tape
220 may be formed to have a thickness in a range from about 50 μm to
about 200 μm.

[0031] In FIG. 2A, a gap between the light-emitting device chips 100 and
the first tape 220 is shown to be very large. The first tape 220 is also
shown to be separated from the upper surface 211 of the wafer 210.
However, in practice, the light-emitting device chips 100 formed on the
wafer 210 may have a height of a few μm, and the first tape 220 may
contact entire surfaces of the light-emitting device chips 100 and the
upper surface 211 of the wafer 210.

[0032] FIG. 3 is a perspective view of a wafer ring 215 on which the wafer
210 is mounted. The first tape 220 may be attached, in advance to the
wafer ring 215, where the upper surface 211 of the wafer 210 is attached.
Lines C define each of the light-emitting device chips 100 and may be
lines to be scribed.

[0033] Referring to FIG. 2B, the wafer 210 is disposed on an X-Y stage
(217 in FIG. 3). When the wafer ring 215 is used, the wafer ring 215 is
mounted on the X-Y stage 217. A driving device (219 in FIG. 3) moves the
X-Y stage 217 in two axes directions (X-Y axis). A description of the X-Y
stage 217 is omitted.

[0034] A laser apparatus 310 that irradiates a laser beam L is disposed on
the X-Y stage 217. While moving the X-Y stage 217 in the X direction and
the Y direction step-by-step, scribing lines S, that define each of the
light-emitting device chips 100, are formed on the wafer 210 by
irradiating the laser beam L onto a lower surface 212 of the wafer 210.
The wafer 210 may be a sapphire substrate through which a laser beam L
may pass. The scribing lines S formed on the wafer 210 are formed in a
lattice type to define the light-emitting device chips 100 formed in a
matrix. The scribing lines S and the lines C in FIG. 3 may be at a same
position.

[0035] The laser apparatus 310 for example, may be a fiber laser with a
power in a range from about 0.25 W to about 0.4 W. The moving speed of
the X-Y 217 stage may be approximately 400 mm/s. Cracks may be formed
along the scribing lines S of the wafer 210 by irradiating a laser beam L
so that the laser beam L is focused in the middle of the thickness of the
wafer 210.

[0036] Referring to FIG. 2C, a second tape 230 is attached on the lower
surface 212 of the wafer 210. The second tape 230 may be any tape that
provides adhesiveness. For example, the second tape 230 may be a UV tape
or a thermosetting tape having a thickness in a range from about 50 μm
to about 200 μm.

[0037] The attachment of the second tape 230 may be performed when the
wafer 210 is mounted on the wafer ring 215 in a state that the wafer ring
215 is mounted on the X-Y stage 217.

[0038] Referring to FIG. 2D, a breaking process for cutting the wafer 210
is performed on the scribing lines S of the wafer 210. After aligning the
lower surface 212 of the wafer 210 so that the scribing lines S are
disposed between a pair of breaking blocks 242, the upper surface 211 of
the wafer 210 is pressed with respect to the scribing lines S by using a
break blade 240, such that the wafer 210 is cut along the scribing lines
S formed on the wafer 210. At this point, the light-emitting device chips
100 formed on the wafer 210 are also separated. The pair of breaking
blocks 242 may be longer than the diameter of the wafers 210.

[0039] When the scribing operations are repeated while moving the X-Y
stage 217, the wafer 210 is separated into each of the light-emitting
device chips 100. In this process, the first tape 220 and the second tape
230 are not cut in the breaking process. Accordingly, the separated
light-emitting device chips 100 are fixed. In other words, the positions
of each of the light-emitting device chips 100 are fixed.

[0040] Next, after removing the first tape 220, that covers the
light-emitting device chips 100, characteristics of each of the
light-emitting device chips 100 may be inspected using a multi-probe. In
this process, a contact error between the multi-prober and the electrode
pads of the light-emitting device chips 100 is reduced. Thus, the
productivity for manufacturing the light-emitting device chips 100 may be
increased.

[0041] When a laser scribing process is used, instead of a mechanical
cutting process, the failure of light-emitting device chips due to
particles generated from the mechanical cutting process may be reduced.
Also, because a tape that fixes the light-emitting device chips is
attached onto both surfaces of a wafer, after cutting the wafer, the
positions of the light-emitting device chips are fixed. Accordingly,
characteristics of each of the light-emitting device chips may be
inspected, by using a multi-probe without a contact failure between the
light-emitting device chips and the multi-probe. Thus, productivity of
manufacturing the light-emitting device chips may be increased.

[0042] It should be understood that the exemplary embodiments described
herein should be considered in a descriptive sense only and not for
purposes of limitation. Descriptions of features or aspects within each
embodiment should typically be considered as available for other similar
features or aspects in other embodiments.