2. In the class 10,000 clean room, Okada diagrams the photolithography process used to image patterns for creating copper pillars and bumps.

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3. The Foothill Instruments spectrophotometer measures the thickness of the resist post-cure, and the software creates a 3D topographical image of the coating.

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4. Redding, Collopy, and Platt stroll down one of many halls lined with patents; a tribute to Rohm and Haas dedication to innovation.

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5. This state-of-the art high-purity building houses the manufacturing facilities for photo resist, developers, remover, and electroplating copper. The environment is virtually particle-free due to an air exchange and filtration system, and judicious monitoring.

7. Stainless steel tanks like these are an important part of the process to prevent cross-contamination from the tank materials into the product.

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1. So close to Advanced Packaging’s offices, and such a nice day, we almost walked to Chomerics, located 2.6 miles away in Hudson, NH. From left to right: Platt; Craig Lazinsky, marketing communications manager; Percy Chinoy, Ph.D., new business development manager; Jonathan Bergin, product manager, thermal business unit; Gary L. Wood, global business unit manager, thermal products; Meredith Courtemanche, assistant editor, AP; and von Trapp.

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2. This coating line for making the Therm-A-Gap and ThermFlow products is similar to the type used to coat breakfast cereals.

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3. Joe Hanby loads the web press with a base liner - which could be a metalized ripstop nylon or an adhesive film, depending on the product being manufactured.

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4. The end of the line. Therm-A-Gap rolls, film side up, to protect the sticky side from contamination.

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5. Judy Andrews inspects final die-cut parts before packing them to ship. She performs the inspection in a mill room with filtered atmosphere.