Halbleiter / Mikroelektronik

Semiconductors

The key words are 3D IC, TSV orFOWLP. In the semi-conductor industry innovations come thick and fast, however, new solutions have as yet not been established. This is partly true for applications driven by either IoT or automotive electronics. Using FRT multi-sensor metrology tools you can keep up with the high rate of innovations and yet remain flexible for the necessary change in trend.

WAFER THICKNESS / TTV

SEMI-compliant thickness and TTV measurement

Full wafer thickness map in 3D view, polished Si wafer

4 profiles of a polished Si wafer showing thickness variation

GLOBAL / LOCAL WAFER PARAMETERS

Measurement of global and local wafer parameters

Full wafer thickness map in 3D view

Wafer map with local parameters (LTIR, LTV, LT, LFPD, etc.)

FILM THICKNESS / LAYER STACK

Thin film and layer stack measurement

Film thickness, SiO2 layer on a Si wafer

Film thickness analysis of a 500 nm SiO2 layer on a Si wafer using a fit algorithm

HYBRID METROLOGY

Combination of different sensors, automated calculation of the desired sample parameters