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Next generation devices at 20nm and below require double-patterning, 3D (three-dimensional) structures, and complex, high-precision processes that include protective layer formation and finishing techniques for new materials. Hitachi High-Tech developed the Conductor Etch System 9000 Series to support these next-generation processes.

Features

The new HHT 9000 platform utilizes Hitachi’s proprietary low-contaminant, high-speed transfer system for high productivity. The linked common platform permits process flexibility and future expansion through its modular chamber design.