If you've ever built your own PC, you know there's an art to applying the thermal grease that helps to cool the system's processor. That technique could one day be a thing of the past thanks to a new thermal conducting sheet developed by Sony. It's far easier to apply than thermal grease, and it's more effective at keeping the processor from overheating.

Made from silicon densely packed with carbon fiber, the EX20000C sheet, as it's known, has a thermal resistance rating of 0.4-0.2K·cm2/W. Translated to English, that means it's far better than traditional methods and materials when it comes to transferring heat from a processor to a heatsink. In fact, as Sony demostrated the sheets at the Tokyo Techno-Frontier exhibition, it kept a microprocessor about 3°C cooler than one using the go-to goop. [Tech-On!]