Analysis of On-chip Interconnection Lines in High speed IC by the FDTD Method

A full wave analysis of lossy interconnection lines on doped semiconductor substrates in high speed integrated circuits is carried out by means of a finite difference time domain (FDTD) approach.By using lossy absorbing boundary conditions (LABCs) and an efficient calculation procedure for lossy structures,frequency dependent line parameters are calculated over a wide frequency range.All these provide the reliable parameters for the circuit simulation of IC.