I've had an AC L2 Pro on my HD 5770 for a few years. Every time I open my case, I find another VRM or RAM heatsink has popped off the board. It might have just happened during the movement of the case, or it might have happened in the last 6 months since the case was last opened up. <shrugs>

Anyone have a better adhesive solution? I'm tempted to find a thermally conductive epoxy and call it a day

And which chinese supplier would be a good source of it? Well, if you mind about somehow unproven solutions, there's also the infamously costly Fujipoly tape (give a look at the frozencpu store), while Amazon show off some more economical offerings (Gino, Startech, Ziotek and the likes).

I know for sure Akasa won't last for long time (I used the AS adhesive to replace some Akasa pads), while Fujipoly claims a twentyfold increased thermal conductivity over it.

I can vouch for Sekisui #5760 as a reliable thermal tape. Used it with my 2x 5770 rig a couple of years ago, and never had any of the RAMsinks fall off. As with any thermal tape, press down firmly for about 30 seconds to ensure good contact.

In a pinch, you can use regular heatsink compound and put some drops of super at the corners. It also allows you to easily remove the heatsink later by twisting it if you want to use it on another card. Acetone (nail polish remover) can be used to dissolve the glue. Just be careful when twisting so you don't remove the chip itself.

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