As far as using the heat thing as a selling point its not something they have been emphasizing. Its something I have noticed by looking at the design and specs. They have made minor mention that the case is designed for heat management. What I see is that they are actually taking heat as a serious consideration this go around. This is a good thing no matter how you try and slice it.

As far as using the heat thing as a selling point its not something they have been emphasizing. Its something I have noticed by looking at the design and specs. They have made minor mention that the case is designed for heat management. What I see is that they are actually taking heat as a serious consideration this go around. This is a good thing no matter how you try and slice it.

I think it's a good thing too, but heat management wasn't the problem with the 360, the materials were. It had substandard solder and weak thermo paste.

The problem with the Xbox 360 overheating and requiring repairs is a multifaceted subject. It involves Microsoft cutting corners during research and development, as well as bypassing the testing process required to ensure that the console was free of errors before putting it on the market. The heart of the matter is the heat generated during operation. The solder used to attach the GPU chip and the CPU chip to the motherboard is unable to withstand these temperatures. In essence, the heat causes the solder to become brittle and fragile, forming cracks and fissures in the soldered joints. The heat sinks used to cool the chips are too small to operate effectively, and the protective thermal paste used on the chips is likewise ineffective against overheating.