Abstract:

A SIM Card connector with an ESD protection in accordance with a preferred
embodiment of the present invention is provided. The SIM Card connector
comprises a connector housing (1) with a plurality of contact passageways
(101) in which a plurality of contact terminals (2) are received. Said
SIM Card connector further includes an IC member (4) attached onto a
bottom surface of the housing and a plurality of solder balls (3)
sandwiched between the IC member and the contacts and contacted with the
contact terminals.

Claims:

1. A SIM Card connector comprising:a connector housing with a plurality of
contact passageways in which a plurality of contacts retained; anda IC
member with ESD protection received in the connector housing and
electrically connected with the contacts.

2. The SIM Card connector as recited in claim 1, wherein one surface of
the IC member defines a plurality of electrical pads adapted for
connecting with the contacts.

3. The SIM Card connector as recited in claim 1, wherein each contact
comprises a base portion, a tail portion extending from an end of the
base portion, and an elastic portion extending from the other end of the
base portion and above the base portion.

4. The SIM Card connector as recited in claim 3, wherein the base portion
of the contact defines an upper surface and bottom surface, wherein the
upper surface is facing to the elastic portion and a solder ball is
sandwiched between the bottom surface of the base portion and the IC
member.

5. The SIM Card connector as recited in claim 4, wherein the bottom
surface of the base portion defines a concave in which the solder ball is
seated.

6. The SIM Card connector as recited in claim 1, wherein the connector
housingdefines a receptor on a bottom surface in which the IC member is
completely received.

7. The SIM Card connector as recited in claim 6, wherein a bottom surface
of the IC member is coplanar with the bottom of the connector housing.

8. The SIM Card connector as recited in claim 1, wherein a retention
device is disposed between an inner surface of the receptor of the
housing and an outer surface of the IC member.

9. The SIM Card connector as recited in claim 8, wherein the retention
device includes a notch and a post engaged with each other.

10. The SIM Card connector as recited in claim 9, wherein the notch is
defined on a side surface of the IC member and the post is defined on an
inner surface of the receptor.

11. A SIM Card connector comprising:an insulating housing having a mating
face and a mounting face opposite to the mating face;a plurality of
contacts seated in the insulating housing, each including a retaining
portion fixed into the insulating housing, a spring portion with a
contact engaging portion projecting the mating face of the insulating
housing, and a tail portion;an IC member with an ESD protection received
in a corresponding portion ofthe insulating housing; whereinthe IC member
is electrically connected with the contacts by planting a solder ball
therebetween.

12. The SIM Card connector as recited in claim 11, wherein the mounting
face defines a recess portion in which the solder ball are received.

13. The SIM Card connector as recited in claim 12, wherein the mounting
face of the insulating housing, the tail portion of the contact, and a
bottom face of the IC member are coplanar with each other.

14. The SIM Card connector according to claim 13, wherein the insulating
housing defines a plurality of room adapted for receiving the tail
portion of the contact, wherein the room is adjacent to the receptor.

15. The SIM Card connector according to claim 11, wherein the IC member
further defines a notch adapted for engaging with a dimple formed on an
inner face of the receptor.

16. A SIM card connector for mounting to a printed circuit board,
comprising:an insulative housing defining a receiving cavity in an
undersurface and a plurality of contact receiving passageways in two
opposite sides and an upper side;an IC member disposed in the receiving
cavity;a plurality of contacts disposed in the corresponding passageways,
respectively, each of said contacts defining a deflectable contact
section extending upwardly beyond the upper side, a solder tail around
the undersurface, and a connection section between the contacting section
and the tail; whereina portion of said connection section confronts the
IC member and electrically contacts the IC member.

17. The SIM card connector as claimed in claim 16, wherein said IC member
and said connection section is mechanically connected to each other via a
solder piece.

18. The SIM card connector as claimed in claim 16, wherein the connection
section is not downwardly deflectable while the contact section is.

Description:

BACKGROUND OF THE INVENTION

[0001]1. Field of the Invention

[0002]The present invention relates to a SIM Card connector, and more
particularly to a SIM Card connector incorporated with an electrostatic
discharge (ESD) protection. The SIM Card connector features that the ESD
protection is attached onto the connector by solder ball thereby
protecting a printed circuit board on which the connector is mounted.

[0003]2. Description of the Related Art

[0004]Traditional SIM Card connector at least includes an insulating
housing with a plurality of passageways in which a plurality of contact
terminals are received. Each terminal comprises a base portion retained
into the insulating housing, a contact engaging portion adapted for
contacting with electrical pads formed on a SIM Card, and a tail portion
adapted for mounting onto a printed circuit board, thereby the SIM Card
is electrically connected to the printed circuit board by the connector,
particular by the contact terminals.

[0005]With the development of society and improvement demands of consumer,
the function of mobile phone becomes more and more strongly, and
electrostatic discharge is often happened in the mobile phone. Therefore,
the printed circuit board further defines an electrostatic discharge
protection circuit in order to protect the printed circuit board and
components mounted thereon. When above SIM Card connector is mounted onto
the printed circuit board, the tail portion of the terminal is connected
with the electrostatic discharge protection circuit thereby protecting
the printed circuit board.

BRIEF SUMMARY OF THE INVENTION

[0006]It is an object of the present invention to provide a SIM Card
connector with ESD protection attached thereon by solder ball adapted for
protecting a printed circuit board on which the connector is mounted been
damaged from ESD.

[0007]In order to achieve the objective above, a SIM Card connector in
accordance with a preferred embodiment of the present invention is
provided. The SIM Card connector comprises a connector housing with a
plurality of contact passageways in which a plurality of contacts are
retained. Moreover, said connector further includes an IC member with ESD
protection, which is attached on the housing by a solder ball.

[0008]In order to achieve the objective above, another SIM Card connector
in accordance with a preferred embodiment of the present invention is
provided. The SIM Card connector comprises an insulating housing, a
plurality of contacts seated into the insulating housing, an IC member
with ESD protection attached to the insulating housing, and a plurality
solder balls sandwiched between the IC member and the contacts. The
insulating housing defines a mating face and a mounting face opposite to
the mating face. Each contact includes a retaining portion fixed into the
housing, a spring portion with a contact engaging portion projected the
mating face of the housing, and a tail portion.

[0009]Other objects, advantages and novel features of the invention will
become more apparent from the following detailed description of the
present embodiment when taken in conjunction with the accompanying
drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

[0010]The features of this invention which are believed to be novel are
set forth with particularity in the appended claims. The invention,
together with its objects and the advantages thereof, may be best
understood by reference to the following description taken in conjunction
with the accompanying drawings, in which like reference numerals identify
like members in the figures and in which:

[0011]FIG. 1 is a perspective view of a SIM Card connector according to
the embodiment of the present invention;

[0012]FIG. 2 is an exploded view of the electrical connector of FIG. 1.

[0013]FIG. 3 is a partly perspective view of the SIM Card connector of
FIG. 1, wherein the IC member is not assembled onto the insulating
housing;

[0014]FIG. 4 is another perspective view of an electrical connector of
FIG. 1;

[0015]FIG. 5 is a cross-section view of the SIM Card connector of the FIG.
1.

DESCRIPTION OF PREFERRED EMBODIMENT OF THE INVENTION

[0016]In the following detailed description, for purposes of explanation,
numerous specific details are set forth in order to provide a thorough
understanding of the present invention.

[0017]Please refer to FIG. 1 to FIG. 5, the SIM Card connector according
to the embodiment of present invention comprises an insulative housing 1,
a plurality of contacts 2 retained in the insulative housing 1, an IC
(Integrated Circuit) member 4 attached onto the insulative housing 1, and
a plurality of solder balls 3 sandwiched between the IC member 4 and the
contacts 2.

[0018]Please particular refer to FIG. 2 to FIG. 5, the insulating housing
1 configured as a rectangular, including a mating face 11 and a mounting
face 12 (see FIGS. 2 & 5) opposite to the mating face 11, two opposite
end faces 13 extending along a first direction, and two opposite side
faces 14 extending along a second direction vertical to the first
direction. A plurality of passageways 101 arranges as two sets along the
second direction, each passageway 101 penetrating the mating face 11, the
mounting face 12, and the corresponding end face 13.

[0019]Please particular refer to FIG. 3, the mounting face 12 defines a
receptor 120 in the center thereof in order to accommodate the IC member
4. An upper edge of an inner surface of the receptor 120 defines slant
surfaces 123 adapted to lead the IC member 4 into the receptor 120.
Furthermore, one inner surface of the receptor 120 defines a post 124
protruding into a center of the receptor 120 to engage with a
corresponding portion of the IC member 4.

[0020]Please still refer to FIG. 3, a plurality of recesses (no labeled)
are defined on the mounting face 12, which communicated with the
corresponding passageway 101 and adjacent to the receptor 120 but not
communicated therewith.

[0021]The contacts 2 are retained into the corresponding passageways 101
of the insulative housing 1 and includes a plurality of signal contacts
27 and at least one grounding contact 28. Each of the signal contacts 27
and the grounding contact 28 includes a horizontal retention portion 21
extending along the second direction, a solder portion 24 horizontally
extending from one end of the retention portion 21, a vertical portion 23
disposed between the retention portion 21 and the solder portion 24, a
bend portion 22 extending cured from the other end of the retention
portion 21 and forms a semi-circle along with the retention portion 21, a
contact engaging portion 25 extending cured from a distal end of the bend
portion 22 and disposed above the retention portion 21. A plurality of
barbs 210 are defined on side edges of the retention portion 21.
Moreover, the retention portion 21 defines an upper surface (no labeled)
and a bottom surface (no labeled) opposite to the upper surface, wherein
the bottom surface defines an accommodate portion 211 concaved from the
bottom surface to the upper surface so as to receive and retain the
solder ball 3. Finally, a press portion 26 is formed on a distal end of
the contact engaging portion 25 and extends into a center between the
contact engaging portion 25 and the retention portion 21 in order to
engaging with an abut portion formed on the insulating housing 1.

[0022]The IC member 4 is a rectangular shape and compress and congregate
at least an ESD protection member. Said IC member 4 includes two opposite
first and second surfaces (no labeled). A plurality of electrical pads 40
are formed on the first surface thereon and corresponding with the recess
portions 211 of the contacts 2. Further, a notch 41 is defined on one
side edge of the IC member 4 in order to engage with the post 124 of the
insulating housing 1.

[0023]A plurality of solder balls 3 are sandwiched between the IC member 4
and the housing 1 and disposed in the recess portion 211 of the contacts
2. When the solder balls 3 are planted onto the contacts 2, they are
firmly connected with the contacts 2 and the IC member 4.

[0024]Please also refer to FIGS. 1-4, when assembly, firstly, the contacts
2 are assembled into the corresponding passageways 101 of the insulating
housing 1, particular refer to FIG. 3 and FIG. 5, wherein the retention
portion 21 exposures on the mounting face 12 via the passageway 101, the
tail portion 24 is received into the recess adjacent to the receptor 120
and coplanar with the mounting face 12 of the insulating housing 1, and
the contact engaging portion 25 is protruding the mating face 11;
secondly, the solder balls 3 are planted onto the corresponding recess
portion 211 of the contact 2, for example, some solder paste is coating
into the recess portion 211 and then the solder balls 3 is attached into
the recess portion 211 via the solder paste, finally, heating is allied
on the contacts and the solder paste is thawing and then the solder balls
3 is firmly retained onto the contact 2; finally, the IC member 4 is
completely received into the receptor 120 of the housing, with the
electrical pads 40 contacted with the solder balls 3 and the notch 41
engaged with the post 124 of the insulating housing 1.

[0025]In the above description of the preferred embodiment, a receptor 120
adapted for receiving the IC member 4 is defined by mounting face 12 of
the insulating housing 1, and the IC member connected with the contact
via planting a solder ball onto the contact, therefore, there has no need
to provide a room to received the IC member with an ESD protection and
the IC member can firmly contact with the contact.

[0026]It is to be understood, however, that even though numerous,
characteristics and advantages of the present invention have been set
fourth in the foregoing description, together with details of the
structure and function of the invention, the disclosed is illustrative
only, and changes may be made in detail, especially in matters of number,
shape, size, and arrangement of parts within the principles of the
invention to the full extent indicated by the broad general meaning of
the terms in which the appended claims are expressed.