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Equipment: SEMCON 1000

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Semiconductor Plating Tool

Technic's SEMCON 1000 is the latest design of dependable, wet bench wafer metallization tools for the semiconductor industry. The SEMCON 1000 wet bench performs critical electroplating operations with a high degree of uniformity and repeatability on industry standard and non-standard substrates, including Si, GaAs, InP, and other glass-type substrates. Our equipment engineering and chemical process teams work together to provide the optimal SEMCON tool configuration for each specific application.

MEMS/MOEMS

Bump Application

LED Application

Chip Level Wafer

Photonics Application

Pilot Solar Application

SEMCON 1000 Wet Bench

Low cost wet bench design for R&D and low volume applications.

Same basic cell and wafer holder design as used on our highly successful SEMCON 1500 and 2000 series.

Tool features a single plating cell and dragout rinse cell.

Plating and electroforming of wafers or discrete parts, silvers, etc., up to 200mm.