This document provides guidelines for the design of thermal and mechanical solutions for the:• Intel® Xeon® Processor E5-1600 and E5-2600 product families

processors in 2 and 4-socket servers, and 2-socket workstations in the Intel® Xeon® Processor 5-1600/E5-2600/E5-4600 product families-based ...platform. The processors covered are listed in the processor family datasheets. The components described in this document include:• The processor thermal solution (heatsink) and associated retention hardware• The LGA2011-0 socket, the Independent Loading Mechanism (ILM) and back plate

The goals of this document are:• To assist board and system thermal mechanical designers• To assist designers and suppliers of processor heatsinksThermal profiles and other processor specifications are provided in the appropriate processor datasheet.
Read the full Intel® Xeon® Processor E5- 1600/2600/4600 product families: guide http://www.intel.com/content/www/us/en/chipsets/chipsets-overview.html