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Abstract

As a liquid cooled circuit component produces more heat, the method of cooling changes from convection cooling to cooling by nucleate boiling. This transition to nucleate boiling tends to occur only with a significant increase in the temperature of the component above the maximum temperature for convection cooling. It has been found that nucleate boiling is enhanced and this temperature overshoot is prevented, if nucleate boiling sites are created to produce a flow of bubbles across the surface of the component.

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United States

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English (United States)

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Preventing Overshoot in Liquid Cooled Circuit Device

As a liquid cooled circuit component produces more heat, the method of
cooling changes from convection cooling to cooling by nucleate boiling. This
transition to nucleate boiling tends to occur only with a significant increase in the
temperature of the component above the maximum temperature for convection
cooling. It has been found that nucleate boiling is enhanced and this
temperature overshoot is prevented, if nucleate boiling sites are created to
produce a flow of bubbles across the surface of the component.

The drawing shows a semiconductor chip 2 that is mounted on a support 3.
The chip and the support are located in an enclosure that contains a cooling fluid.
A resistance wire 4 is connected between two terminal points 5 on support 3.
The wire 4 is heated to a temperature to produce nucleate boiling. Bubbles 6
rise from wire 4 and sweep across the surface of chip 2, where they cause
nucleate boiling to occur at a lower temperature that prevents the temperature
overshoot.

In a second arrangement for enhancing nucleate boiling cooling of a chip 2,
holes on the back of the chip form nucleate boiling sites. The chip is masked in a
pattern for holes of about 0.25 mil diameter with a separation between holes of
about 0.3 mil. The holes are then etched to a depth of about 1 mil. These holes
taper to a very small cross section, and each hole is a nucleation site for boiling.