"Supermicro's new 1U hot-swap dual DP node TwinPro is exactly the best solution for customers that need high compute density with full redundancy for high availability applications," said Charles Liang, President and CEO of Supermicro. "With our Twin architecture featuring breakthrough redundant Titanium Level Power Stick modules, and PCI-E 3.0 x16 LP plus 1U optimized "0" slot expansion advantages, we provide maximum reliability and flexibility of configuration. The 1U TwinPro series will drive new opportunities for our customers that look for best performance, density and high availability in a 1U form factor."