Comparing this profile to the 'ideal' solder profile, the main difference is that we do not dwell on the 'pre-heat' phase (ie. 150-200°C). This is because we could not get the temperature to rise fast enough, so we were forced to stick to a steady, slow ramp.

The results of the final profile were excellent. The main restriction of this technology is the precise application and dosing of the solder paste, and the placement of the components. We will experiment with using stencils next time. This should improve success rate significantly.

Comparing this profile to the 'ideal' solder profile, the main difference is that we do not dwell on the 'pre-heat' phase (ie. 150-200°C). This is because we could not get the temperature to rise fast enough, so we were forced to stick to a steady, slow ramp.

The results of the final profile were excellent. The main restriction of this technology is the precise application and dosing of the solder paste, and the placement of the components. We will experiment with using stencils next time. This should improve success rate significantly.