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In the last post, Physics and Chemistry, I published the second excerpt from an article “A New and Innovative 3D Architecture for Lithium Batteries.” Ashok Lahiri, Enovix co-founder and CTO, authored the article that appears in the latest issue of Applied Wireless Technology. Following is the third excerpt.

A New, Modern Li-ion Battery Platform

In 2007, three cofounders and I started Enovix Corporation, initially under the operating name microAzure. Two of the cofounders, Harrold Rust and Murali Ramasubramanian, and I had previously worked together in the development of 3D architecture for high-density disk drive read-write heads, with IBM, and 3D MEMS contact technology for semiconductor wafer testing, with FormFactor. The fourth cofounder, Robert Spotnitz, and an early technology advisor, Venkat Srinivasan, had deep domain expertise in advanced battery design and development.

We conceived a new battery platform with an orthogonal approach that extends beyond chemistry to modern science and technology disciplines. The figure below illustrates how the Enovix 3D Silicon™ Lithium-ion Battery platform decouples the performance characteristics, which enables much greater innovation in materials, design, production, and packaging. With this approach, incremental improvements in each of these separate characteristics can collectively produce significant overall increases in Li-ion battery energy density and simultaneously improve safety.

Specifically, we believed that our new platform could:

Improve spatial efficiency to increase energy density.

Enable a 100% silicon anode to further increase energy density.

Incorporate several safety improvements to reduce the danger of injury or damage due to thermal runaway.

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ABOUT ENOVIX

Enovix is building a next-generation lithium-ion battery to increase energy density and improve safety. Our patented 3D cell architecture enables a high-capacity silicon anode to increase energy density by 30% to 80%, depending on cell size. And our patented 3D cell architecture includes features that reduce the danger of explosion and fire from thermal runaway. We’re backed by strategic relationships with Intel, Qualcomm, and Cypress and over $150 million in venture, strategic, and private funding. We’ve been awarded over 50 patents and have over 50 more pending that will create sustainable enterprise value and provide a competitive barrier for years to come.