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Thermal Loading Land Grid Array with Heat Sink Posts to Stiffen the PCB

Publishing Venue

Abstract

Disclosed is a method that uses a heat sink with attached posts to stiffen a PCB under the CPU and socket. Benefits include eliminating the need for a backing plate under the PCB.

Country

Undisclosed

Language

English (United States)

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This is the abbreviated version, containing approximately
53% of the total text.

Thermal Loading Land Grid Array with
Heat Sink Posts to Stiffen the PCB

Disclosed is a method that uses a heat sink with attached
posts to stiffen a PCB under the CPU and socket. Benefits include eliminating
the need for a backing plate under the PCB.

Background

Land grid array (LGA)
sockets require an activation force on the contacts to create electrical
contact and minimize electrical resistance. It is important to reduce
the flex in the PCB under the socket. Currently, direct socket loading (DSL)
requires a load plate, stiffener plate, and a lever to generate the required
load (see Figures 1 and 2); these components are made from stainless steel,
impacting the overall cost of the process.

General Description

In the disclosed
method, load is generated directly through a thermal device (i.e. heat sink) on
the processor package in order to activate the contacts. The required
activation force for the LGA contacts can range from 60 to 125 pounds of force,
and the load must be maintained for a 7 year design life of the processor. The
disclosed method is shown in Figures 3, 4, and 5.

The socket is made of
LCP material and copper alloy-based contacts, which are stitched in the
housing. Solder balls are attached to the contact paddle to allow surface
mounting of the socket to the PCB. The heat sink is designed with specially
shaped posts; these posts, in conjunction with an attachment device, are
secured through the PCB to prevent flex, twist, and rotation.