07009

REVISIONS
LTR
DESCRIPTION
A
DATE
20 APR 10
Add new vendor. Editorial changes throughout.
Prepared in accordance with ASME Y14.100
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OF PAGES
Original date of
drawing:
11 February 2009
APPROVED
M. Radecki
Source control drawing
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PREPARED BY
DEFENSE SUPPLY CENTER, COLUMBUS
Andrew R. Ernst
COLUMBUS, OH
CHECKED BY
TITLE
RESISTOR, CHIP, FIXED, FILM, STYLE 0201
Andrew R. Ernst
APPROVED BY
Michael Radecki
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AMSC N/A
CODE IDENT. NO.
DWG NO.
07009
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5905-E715
1. SCOPE
1.1 Scope. This drawing describes the requirements for a 0.020 x 0.010 chip resistor.
1.2 Part or Identifying Number (PIN). The complete PIN is shown in the following example:
07009


Drawing
number
K


Characteristic
(see 3.3.1)
1001


Resistance
value
(see 3.3.2)
F


Tolerance
(see 3.3.4)
B


Termination
material
(see 3.3.5)
P


Screening
level
(see 3.3.6)
2. APPLICABLE DOCUMENTS
2.1 Government documents.
2.1.1 Specifications and standards. The following specifications and standards form a part of this document to the
extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or
contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-55342
-
Resistors, Chip, Fixed, Film, Nonestablished Reliability, Established Reliability Space Level,
General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-202 MIL-STD-790 -
Test Methods for Electronic and Electrical Component Parts.
Standard Practice for Established Reliability and High Reliability Qualified Products List (QPL)
Systems for Electrical, Electronic, and Fiber Optic Parts Specifications.
(Copies of these documents are available online at https://assist.daps.dla.mil/quicksearch/ or from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. Unless otherwise noted herein or in the event of a conflict between the text of this
document and the references cited herein (except for related specification sheets), the text of this document takes
precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption
has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-55342, and as specified
herein.
3.2 Interface and physical dimensions. The resistor shall meet the interface and physical dimensions as specified in
MIL-PRF-55342 and herein (see figure 1).
3.3 Electrical characteristics.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
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3.3.1 Resistance temperature characteristic. The resistance temperature characteristic shall not exceed the values
specified below:
Characteristic
Resistance range
K (±100 ppm/°C)
L (±200 ppm/°C)
47 ohms to 1 megohms
10 ohms to 47 ohms
mm
0.05
0.07
0.10
0.15
0.23
0.30
0.60
A
0.6 ±0.05
B
0.3 ±0.05
C
0.23 ±0.05
D
0.15 ±0.07
Inches
0.002
0.003
0.004
0.006
0.009
0.012
0.024
E
0.15 +0.05
-0.10
NOTES:
1. Dimensions are in millimeters.
2. Inch equivalents are given for general information only.
3. The pictorial view of the style above does not depict the actual size and is given as representative of the envelope
of the item. Slight deviations from the outline shown, which are contained within the envelope, and do not alter the
functional aspects of the device are acceptable.
FIGURE 1. Chip resistor.
3.3.2 Resistance. The nominal resistance expressed in ohms is identified by four digits; the first three digits represent
significant figures and the last digit specifies the number of zeros to follow. When the value of resistance is less than 100
ohms, or when fractional values of an ohm are required, the letter "R" shall be substituted for one of the significant figures.
The resistance value designations are shown in table I. Minimum and maximum resistance values shall be as specified in
3.3.3. Resistance values not listed in the "10 to 100" decade table of MIL-PRF-55342 for the appropriate resistance
tolerance shall be considered as not conforming to the specification. The standard values for every decade shall follow
the sequence demonstrated for the "10 to 100" decade table specified in MIL-PRF-55342.
DEFENSE SUPPLY CENTER, COLUMBUS
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TABLE I. Resistance value designations.
Designation
Resistance ohms
10R0 to 98R8 incl.
1000 to 9880 incl.
1001 to 9881 incl.
1002 to 9882 incl.
1003 to 9883 incl.
1004
10.0
100.0
1,000.0
10,000.0
100,000.0
1,000,000.0
to
to
to
to
to
98.8
988.0
9,880.0
98,800.0
98,800.0
incl.
incl.
incl.
incl.
incl.
3.3.3 Resistance range. The resistance range shall be from 10 ohms to 1 megohms (see 3.3.1).
3.3.4 Resistance tolerance. Resistors are available in resistance tolerances as specified in table II.
TABLE II. Resistance tolerance.
Symbol
F
J
Resistance tolerance
percent
±1.0
±5.0
3.3.5 Termination. Termination material shall be in accordance with MIL-PRF-55342 code letter B.
3.3.5.1 Pure tin. The use of pure tin, as an underplate or final finish is prohibited both internally and externally. Tin
content of resistor components and solder shall not exceed 97 percent, by mass. Tin shall be alloyed with a minimum of 3
percent lead, by mass (see 6.3).
3.3.6 Screening level. Resistors are available screened (S) or partially screened (P) as specified in 4.4.1.1.1.1,
4.4.1.1.1.2, and table III herein.
3.3.7 Power rating. The power rating for chip resistors shall be 0.05 watts at +70°C derated to zero power at +150°C
(see figure 2).
FIGURE 2. Derating curve.
3.3.8 Voltage rating. The maximum continuous working voltage shall not exceed 30 volts.
3.3.9 DC resistance. When resistors are tested as specified in 4.6, the dc resistance shall be within the specified
tolerance of the nominal resistance.
DEFENSE SUPPLY CENTER, COLUMBUS
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3.3.10 Thermal shock. When resistors are tested as specified in 4.7, there shall be no evidence of mechanical
damage.
3.3.11 Power conditioning. When resistors are tested as specified in 4.8, there shall be no evidence of mechanical
damage. The change in resistance between initial and final measurements shall not exceed ±(0.5 percent +0.01 ohm).
3.3.12 Solderability. The requirement for solderability shall be as specified in MIL-PRF-55342 and 4.4.1.1.3 herein.
3.4 Recycled, recovered, or environmentally preferable materials. Recycled, recovered, or environmentally preferable
materials should be used to the maximum extent possible provided that the material meets or exceeds the operational
and maintenance requirements, and promotes economically advantageous life cycle costs.
3.5 Marking. Marking is not required on the resistor; however, each unit package shall be marked with the PIN
assigned herein (see 1.2), manufacturer's identification code and date and lot codes.
3.6 Manufacturer eligibility. To be eligible for listing as an approved source of supply, a manufacturer shall be listed on
the MIL-PRF-55342 Qualified Products List for at least one part, or perform the group A and group B inspections specified
herein on a sample agreed upon by the manufacturer and DSCC-VA.
3.6.1 Certificate of compliance. A certificate of compliance shall be required from manufacturers requesting to be listed
as an approved source of supply.
3.7 Workmanship. Resistors shall be uniform in quality and free from any defects that will affect life, serviceability, or
appearance.
4. VERIFICATION
4.1 Product assurance program. The product assurance program specified in MIL-PRF-55342 and maintained in
accordance with MIL-STD-790 is not applicable to this document.
4.2 Qualification inspection. Qualification inspection is not applicable to this document.
4.3 Failure rate qualification. The failure rate qualification specified in MIL-PRF-55342 is not applicable to this
document.
4.4 Conformance inspection.
4.4.1 Inspection of product for delivery. Inspection of product for delivery shall consist of groups A and B inspections.
4.4.1.1 Group A inspection. Group A inspection shall consist of the inspections specified in table III, and shall be made
on the same set of sample units, in the order shown. Part per million testing and verification as specified in
MIL-PRF-55342 is not applicable to this document.
4.4.1.1.1 Subgroup I.
4.4.1.1.1.1 Screened (S). Screened (S) tests shall be performed on a production lot basis on 100 percent of the
product supplied under this document. Resistors that are out of resistance tolerance, or which experience a change in
resistance greater than that permitted for the tests of this subgroup shall be removed from the lot. Lots having more than
5 percent total rejects, due to exceeding the specified resistance tolerance change limit shall not be furnished on
contracts.
4.4.1.1.1.2 Partially screened (P). Partially screened tests shall be as specified in 4.4.1.1.1.1 except only the 100
percent dc resistance test shall be performed (see 6.2d).
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4.4.1.1.2 Subgroup II. Subgroup II tests shall be performed on an inspection lot basis. A sample of 13 parts shall be
randomly selected, if one or more defects are found, the lot shall be rescreened and defects removed. A new sample of
13 parts shall then be randomly selected. If one or more defects are found in this second sample, the lot shall be rejected
and shall not be supplied against this document.
4.4.1.1.3 Subgroup III. A sample of five parts shall be randomly selected, if one or more defects are found, the lot shall
be rejected/rescreened in accordance with MIL-PRF-55342.
TABLE III. Group A inspection.
Inspection
Subgroup I
DC resistance
Thermal shock
Power conditioning
DC resistance
Subgroup II
Visual inspection
Subgroup III
Solderability
Requirement
paragraph
Method
paragraph
3.3.9
3.3.10
3.3.11
3.3.9
4.6
4.7
4.8
4.6
3.2, 3.4, 3.5
3.3.12
Sampling
procedure
100 percent
4.5
13 samples
0 failures
4.9
5 samples
0 failures
4.4.1.2 Group B inspection. Group B inspection shall be in accordance with MIL-PRF-55342 except that the force
applied for Subgroup 2, solder mounting integrity shall be .5 kilogram.
4.4.1.3 Certification. The acquiring activity, at its discretion, may accept a certificate of compliance with group B
requirements in lieu of performing group B tests (see 6.2d).
4.5 Visual and mechanical examination. Resistors shall be examined to verify that the materials, design, construction,
physical dimensions, marking, and workmanship are in accordance with the applicable requirements of MIL-PRF-55342.
4.6 DC resistance. DC resistance shall be tested in accordance with MIL-PRF-55342.
4.7 Thermal shock. Thermal shock shall be tested in accordance with MIL-PRF-55342.
4.8 Power conditioning. Resistors shall be tested in accordance with method 108 of MIL-STD-202. The following
details and exceptions shall apply:
a. Method of mounting: Chip resistors sample units shall be loaded on a test fixture.
b. Test temperature: +70°C ±5°C.
c. Initial resistance measurement of mounted resistors: Initial dc resistance measurement shall be measured at
+25°C.
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d. Operating conditions: Rated dc continuous working voltage or filtered, nonfiltered full-wave rectified ac voltage
shall be applied intermittently, 1 hour and 30 minutes “on”, and 30 minutes “off”, for the applicable number of
hours and applicable test temperature. "On time" shall be three quarters of the total elapsed time. During the
"on" cycle, the voltage shall be regulated and controlled to maintain ±5 percent of the rated continuous working
voltage.
e. Duration: 100 hours ±4 hours.
f. Stabilization and final dc resistance measurement: Resistors shall be removed from chambers for a minimum of
45 minutes and stabilized prior to final resistance measurement.
g. Examination after test: Resistors shall be examined for evidence of mechanical damage.
4.9 Solderability. Solderability shall be tested in accordance with MIL-PRF-55342 and 4.4.1.1.3 herein.
5. PACKAGING
5.1 Packaging. For acquisition purposes, the packaging requirements shall be as specified in the contract or order (see
6.2). When packaging of materiel is to be performed by DoD or in-house contractor personnel, these personnel need to
contact the responsible packaging activity to ascertain requisite requirements. Packaging requirements are maintained by
the Inventory Control Point's packaging activities within the Military Service or Defense Agency, or within the Military
Services System Command. Packaging data retrieval is available from the managing Military Department's or Defense
Agency's automated packaging files, CD-ROM products, or by contacting the responsible packaging activity.
6. NOTES
(This section contains information of a general or explanatory nature, which may be helpful; but is not mandatory.)
6.1 Intended use. Chip resistors are intended for use in thick or thin film circuits where microcircuitry is intended, also,
for use in surfacing mounting applications.
6.2 Ordering data. The contract or purchase order should specify the following:
a. Complete PIN (see 1.2).
b. Requirements for delivery: One copy of the conformance inspection data or certificate of compliance that parts
have passed conformance inspection with each shipment of parts by the manufacturer.
c. Packaging requirements.
d. Whether the manufacturer performs the group B tests or provides certification of compliance with group B
requirements (see 4.4.1.3).
6.3 Tin whisker growth. The use of alloys with tin content greater than 97 percent, by mass, may exhibit tin whisker
growth problems after manufacture. Tin whiskers may occur anytime from a day to years after manufacture and can
develop under typical operating conditions, on products that use such materials. Conformal coatings applied over top of a
whisker-prone surface will not prevent the formation of tin whiskers. Alloys of 3 percent lead, by mass, have shown to
inhibit the growth of tin whiskers. For additional information on this matter, refer to ASTM-B545 (Standard Specification
for Electrodeposited Coatings of Tin).
DEFENSE SUPPLY CENTER, COLUMBUS
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6.4 Electrostatic charge. Under several combinations, these resistors can be electrically damaged, by electrostatic
charges, and drift from specified value. Users should be considered this phenomena when ordering or shipping resistors.
Direct shipment to the Government is controlled by MIL-DTL-39032 which specifies a preventive packaging procedure.
6.5 Pulse applications. Designers are CAUTIONED on using the above resistors in high power pulse applications.
Since they have not been qualified nor tested for such applications, damage and premature failure are possible. These
resistors only see a one time pulse (Short-time overload) as part of the group B inspection of MIL-PRF-55342.
6.6 User of record. Coordination of this document for future revisions is coordinated only with the approved source of
supply and the users of record of this document. Requests to be added as a recorded user of this drawing may be
achieved online at [email protected] or in writing to: DSCC-VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by
telephone (614) 692-0552 or DSN 850-0552.
6.7 Approved source of supply. Approved source of supply is listed herein. Additional sources will be added as they
become available. Assistance in the use of this drawing may be obtained online at [email protected] or contact
DSCC-VAT, Post Office Box 3990, Columbus, OH 43218-3990 or by telephone (614) 692-0552 or DSN 850-0552.
DSCC drawing
Vendor
Vendor
Vendor name
PIN
CAGE
similar PIN 1/
and address
07009********
number
Characteristic: L
Vishay Dale Electronics, Inc.
Res. value: 10 ohms thru 47 ohms
P.O. Box 609
Res. Tolerance: 5 pct.
Columbus, NE 68602-0609
Termination: B
SH903
RCWP-0201-**
Screen level: P
Plant:
Characteristic: K
Vishay Israel
Res. value: 47 ohms thru 1 megohms
Hakotzer Street 3
Res. Tolerance: 1 pct.
POB 2317
Termination: B
Beer Sheva, Israel 84874
Screen level: P
Characteristic: L
Mini-Systems, Inc.
Res. value: 10 ohms thru 47 ohms
Thick Film Division
Res. Tolerance: 1 pct & 5 pct.
PO Box 69
Termination: B
50316
WA96PG-XXXXX-X 20 David Rd
Screen level: S & P
North Attleboro, MA 02761-0069
Characteristic: K
Res. value: 47 ohms thru 1 megohms
Res. Tolerance: 1 pct & 5 pct.
Termination: B
Screen level: S & P
1/ Parts must be purchased to the DSCC PIN to assure that all performance requirements and tests
are met.
DEFENSE SUPPLY CENTER, COLUMBUS
COLUMBUS, OHIO
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