Abstract:

Methods described include placing a sensor system over a substrate
positioned on a chuck. The sensor system generates a beam of optical
energy towards the substrate and is configured to receive optical energy
deflected from the substrate. The sensor system generates sensor signals
in response to variations in received optical energy from the substrate
and the chuck.

Claims:

1. A method, comprising:placing a sensor system over a substrate
positioned on a chuck, the sensor system generating a beam of optical
energy towards the substrate and configured to receive optical energy
deflected from the substrate;generating, by the sensor system, sensor
signals in response to variations in received optical energy from the
substrate and the chuck, the chuck having a first surface and an edge of
the substrate having a second surface such that the first surface directs
a beam substantially to the sensor system, and the second surface directs
a beam substantially away from the sensor system providing the variations
in received optical energy.

2. The method of claim 1, wherein the edge of the substrate is configured
with a chamfer.

3. The method of claim 2, wherein an angle of the chamfer results in less
optical energy being received by the sensor system.

4. The method of claim 1, further comprising processing the sensor signals
in a controller to locate in-stage position coordinates of the substrate.

5. The method of claim 4, imprinting an active area on the substrate
subsequent to locating the in-stage position coordinates of the
substrate.

6. The method of claim 1, wherein the sensor system includes a laser light
emitter configured to generate the beam of optical energy.

7. The method of claim 1, wherein the sensor system includes a photo
detector sensitive to a frequency of optical energy.

8. The method of claim 7, wherein the photo detector includes an angular
window.

9. The method of claim 1, wherein the sensor system includes an emitter
and a photo detector relatively positioned such that only optical energy
deflected within a predetermined angular window from the substrate and
the chuck impinges on the photo detector.

10. The method of claim 1, wherein the first surface of the chuck includes
at least one incline.

11. The method of claim 1, wherein the sensor system includes an emitter
and a detector and an incline of the first surface of the chuck is
substantially equal to one half an angle between the emitter and the
detector.

12. The method of claim 1, wherein the substrate is positioned on the
chuck such that an inner edge of the substrate overlaps at least a
portion of an incline of the first surface.

13. The method of claim 1, further comprising processing the sensor
signals in a controller to locate in-stage position coordinates of the
substrate; and determining a center location of the substrate.

14. The method of claim 1, further comprising processing the sensor
signals in a controller to locate in-stage position coordinates of the
substrate; and determining a diameter of the substrate.

15. A method, comprising:placing a sensor system over a substrate
positioned on a chuck, the sensor system generating a beam of optical
energy towards the substrate and configured to receive optical energy
deflected from the substrate;generating, by the sensor system, sensor
signals in response to variations in received optical energy from an edge
of the substrate and a surface of the chuck, such that the surface of the
chuck directs a beam substantially to the sensor system, and the edge of
the substrate directs a beam substantially away from the sensor system
providing the variations in received optical energy.

16. The method of claim 15, further comprising processing the sensor
signals in a controller to locate in-stage position coordinates of the
substrate.

17. The method of claim 15, further comprising processing the sensor
signals in a controller to locate in-stage position coordinates of the
substrate; and, determining a center location of the substrate.

18. The method of claim 15, further comprising processing the sensor
signals in a controller to locate in-stage position coordinates of the
substrate; and, determining a diameter of the substrate.

19. A method, comprising:placing a sensor system over a substrate
positioned on a chuck, the sensor system generating a beam of optical
energy towards the substrate and configured to receive optical energy
deflected from the substrate;generating, by the sensor system, sensor
signals in response to variations in received optical energy from an edge
of the substrate and a surface of the chuck, such that the surface of the
chuck directs a beam substantially to the sensor system, and the edge of
the substrate directs a beam substantially away from the sensor system
providing the variations in received optical energy;processing the sensor
signals in a controller to locate in-stage position coordinates of the
substrate; and,positioning the substrate with respect to a template mold
using in-stage position coordinates of the substrate.

20. The method of claim 19, further comprising imprinting an active area
on the substrate using the template mold.

Description:

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001]The present application is a continuation of U.S. application Ser.
No. 12/175,258 filed Jul. 17, 2008, now allowed, which claims priority to
U.S. Provisional Patent Application No. 60/951,002 filed Jul. 20, 2007.
Both of the aforementioned patent applications are hereby incorporated
herein by reference in their entirety.

BACKGROUND INFORMATION

[0002]Nano-fabrication involves the fabrication of very small structures,
e.g., having features on the order of nanometers or smaller. One area in
which nano-fabrication has had a sizeable impact is in the processing of
integrated circuits. As the semiconductor processing industry continues
to strive for larger production yields while increasing the circuits per
unit area formed on a substrate, nano-fabrication becomes increasingly
important. Nano-fabrication provides greater process control while
allowing increased reduction of the minimum feature dimension of the
structures formed. Other areas of development in which nano-fabrication
has been employed include biotechnology, optical technology, mechanical
systems and the like.

[0003]An exemplary nano-fabrication technique is commonly referred to as
imprint lithography. Exemplary imprint lithography processes are
described in detail in numerous publications, such as U.S. patent
application publication 2004/0065976, U.S. patent application publication
2004/0065252, and U.S. Pat. No. 6,936,194, all of which are assigned to
the assignee of the present invention, and incorporated by reference
herein.

[0004]The imprint lithography technique disclosed in each of the
aforementioned U.S. patent application publications and U.S. patent
includes formation of a relief pattern in a polymerizable layer and
transferring a pattern corresponding to the relief pattern into an
underlying substrate. The substrate may be positioned upon a motion stage
to obtain a desired position to facilitate patterning thereof. To that
end, a template is employed spaced-apart from the substrate with a
formable liquid present between the template and the substrate. The
liquid is solidified to form a solidified layer that has a pattern
recorded therein that is conforming to a shape of the surface of the
template in contact with the liquid. The template is then separated from
the solidified layer such that the template and the substrate are
spaced-apart. The substrate and the solidified layer are then subjected
to processes to transfer, into the substrate, a relief image that
corresponds to the pattern in the solidified layer.

BRIEF DESCRIPTION OF THE DRAWINGS

[0005]FIG. 1 is a simplified side view of a lithographic system having a
mold spaced-apart from a substrate;

[0006]FIG. 2 is a side view of the substrate shown in FIG. 1, having a
patterned layer thereon;

[0007]FIG. 3A illustrates a template with an added grating surrounding an
active area;

[0008]FIG. 3B illustrates a light beam from a sensor system impinging on
the back side of a grating on the template of FIG. 3A according to
embodiments herein;

[0009]FIG. 3c illustrates an exemplary waveform of the sensor in FIG. 3B;

[0010]FIG. 4A illustrates the sensor system of FIG. 3B as its light beam
crosses a substrate edge and impinges on a chamfered surface of a chuck
according to embodiments herein;

[0011]FIG. 4B illustrates an exemplary waveform of the sensor in FIG. 4A
as the sensor system scans across the substrate edge;

[0012]FIG. 5 illustrates the sensor system scanning across the bevel on a
substrate edge;

[0013]FIG. 6A illustrates scanning the sensor system across the grating
imprinted on the substrate and across the substrate edge and chuck
chamfer in-situ alignment measurement scheme;

[0014]FIG. 6B illustrates measurements suitable for determining relative
position of an imprinted pattern on a substrate;

[0015]FIG. 7A is a flow chart of method steps used in an embodiment
herein; and

[0016]FIG. 7B is a flow chart of additional method steps used in another
embodiment herein.

DETAILED DESCRIPTION

[0017]FIG. 1 shows a system 10 configured to form a relief pattern on a
substrate 12. Substrate 12 may be coupled to a substrate chuck 14. As
shown, substrate chuck 14 is a vacuum chuck, however, substrate chuck 14
may be any chuck including, but not limited to, vacuum, pin-type,
groove-type, or electromagnetic chuck, as described in U.S. Pat. No.
6,873,087, which is incorporated herein by reference. Substrate 12 and
substrate chuck 14 may be supported upon a stage 16. Further, stage 16,
substrate 12, and substrate chuck 14 may be positioned on a base (not
shown). Stage 16 may provide motion along the X and Y axes.

[0018]Spaced-apart from substrate 12 is a patterning device 17. Patterning
device 17 comprises a template 18 having a mesa 20 extending therefrom
towards substrate 12 with a patterning surface 22 thereon. Further, mesa
20 may be referred to as a mold 20. Mesa 20 may also be referred to as a
nano-imprint mold 20. In a further embodiment, template 18 may be
substantially absent of mold 20. Template 18 and/or mold 20 may be formed
from such materials including, but not limited to, fused-silica, quartz,
silicon, organic polymers, siloxane polymers, borosilicate glass,
fluorocarbon polymers, metal, and hardened sapphire. As shown, patterning
surface 22 comprises features defined by a plurality of spaced-apart
recesses 24 and protrusions 26. However, in a further embodiment,
patterning surface 22 may be substantially smooth and/or planar.
Patterning surface 22 may define an original pattern that forms the basis
of a pattern to be formed on substrate 12. Template 18 may be coupled to
a template chuck 28 selected from a set of chucks including but not
limited to vacuum, pin-type, groove-type, or electromagnetic chucks, as
described in U.S. Pat. No. 6,873,087. Further, template chuck 28 may be
coupled to an imprint head 30 to facilitate movement of template 18, and
therefore, mold 20. In the following detailed description, the template
18 and mold or mesa 20 may be referred to as a template mold to simply
descriptions.

[0019]System 10 further comprises a fluid dispense system 32. Fluid
dispense system 32 is configured to deposit polymeric material 34 on
substrate 12. System 10 may include any number of fluid dispensers and
fluid dispense system 32 may itself comprise a plurality of dispensing
units. Polymeric material 34 may be positioned upon substrate 12 using
any known technique, e.g., drop dispense, spin-coating, dip coating,
chemical vapor deposition (CVD), physical vapor deposition (PVD), thin
film deposition, thick film deposition, and the like. Typically,
polymeric material 34 is disposed upon substrate 12 before mold 20 is
moved into a predetermined proximity of substrate 12 thereby establishing
a desired volume between mold 20 and substrate 12. However, the amount of
polymeric material 34 may be sized so the desired volume is filled when
mold 20 is positioned to the desired proximity of substrate 20.

[0020]Referring to FIG. 1 and FIG. 2, system 10 further comprises a source
38 of energy 40 coupled to direct energy 40 along a path 42. Imprint head
30 and stage 16 are configured to superimpose mold 20 and substrate 12
and dispose them in path 42. Either imprint head 30, stage 16, or both
vary a distance between mold 20 and substrate 12 to define a desired
volume therebetween that may be filled by polymeric material 34. After
the desired volume is filled with polymeric material 34, source 38
produces the energy 40 (e.g., broadband ultraviolet radiation) to cause
polymeric material 34 to solidify and/or cross-link thus forming to the
shape of a surface 44 of substrate 12, patterning surface 22, and
defining a patterned layer 46 on substrate 12.

[0021]Patterned layer 46 may comprise a residual layer 48 and a plurality
of features shown as protrusions 50 and recessions 52. System 10 may be
regulated by a processor 54 that is in data communication with stage 16,
imprint head 30, fluid dispense system 32, and source 38, wherein the
processor 54 operates on a computer readable program stored in memory 56.

[0022]The system described above may be further employed in imprint
lithography processes and systems referred to in U.S. Pat. No. 6,932,934,
U.S. Pat. No. 7,077,992, U.S. Pat. No. 7,179,396, and U.S. Pat. No.
7,396,475, all of which are incorporated by reference herein. In another
embodiment, the above-described system may be employed in any known
technique, for example, photolithography (various wavelengths including G
line, I line, 248 nm, 193 nm, 157 nm, and 13.2-13.4 nm), contact
lithography, e-beam lithography, x-ray lithography, ion-beam lithography
and atomic beam lithography.

[0023]The present invention facilitates detection of the transparent
template mold on the imprint tool, especially for patterned media imprint
tools. Typically, a single digit micron of concentricity alignment is
desirable for the patterning. This requires a system and method that can
determine the relative location, within a few microns, between the
template active area and substrate in tool stage coordinates. Meeting
this system requirement is further complicated by the poor accuracy in
placing the mold 20 with respect to the template 18 edge (i.e., the edges
of template 18 cannot be used to determine the position of the template
18 active area). Also, the template 18 is placed with its active area
facing the wafer chuck 14 (downward), which restricts placing sensors
that can detect mold 20 when coupled to template 18. Hence, a system is
desired that can detect the template 18 while viewing its non-active side
and determine its position in tool stage coordinates without using the
edges of template 18 as a reference. Similarly, for detection of
substrate 12, only the edge or chamfer of substrate 12 may be used as a
reference.

[0024]Another associated problem is detection of the error in centricity
alignment of the imprinted pattern to substrate 12. Such a post-imprint
measurement provides critical data to update the centering location of
the substrate 12. In-line post-imprint measurement needs to be performed
in the tool during processing.

[0025]FIG. 3A is a surface view of a template 301 that has an imprint mold
(e.g., mold 20) with an active area 303. In this embodiment, circular
gratings 302 are formed around the active area 303. The gratings 302 are
formed on the same side as the active area during fabrication of the
imprint mold (e.g., mold 20). FIG. 3B is a side view of an emitter 307
and a sensor 304 herein referred as sensor system 315 for simplicity.
Emitter 307 and sensor 304 are positioned at angles with respect to a
normal to surfaces parallel to surface 308. Light from emitter 307
strikes the transparent template mold and impinges on the backside of
gratings 302. Light reflected from the gratings vary as the impinging
light moves from the wells 309 of the grating to the peaks 310. The edges
of the gratings interfere with the reflected light when the impinging
light is in the well 309 and does not interfere when it strikes the peak
310. The gratings 302 are formed with a precise pitch such that
electrical signals have voltage transitions at times proportional to a
distance parameter. The sensor 304 and emitter 307 are thus positioned so
that only reflected light at a certain angle window reaches the sensor
304. FIG. 3c illustrates a voltage waveform 320 having a peak 322 and a
valley 321 that is typical of a waveform generated by sensor 304
receiving reflected light 306 when the "teeth" of the grating pass
through the light beam 305 of emitter 307. The width of the pulse shown
is proportional to the physical width or pitch of the grating "teeth".

[0026]FIG. 4A illustrates a side view of emitter 307 and sensor 304 in
relation to substrate 401 and chuck 402. In this embodiment, the incident
light 305 and reflected light 306 interact with the edge of substrate 401
and chuck 402. Chuck 402 may be configured with a reflective incline or
chamfer 403 that insures the reflected light 306 misses sensor 304 when
the edge of substrate 401 is passed. In this manner, the edge of
substrate 401 may be detected by the sharp drop in reflected light
reaching sensor 304.

[0027]FIG. 4B illustrates an exemplary waveform 410 generated by the
sensor 304 when the sensor system 315 is scanned over the edge of
substrate 401 and impinges on chuck 402. Level 412 represents the sensor
signal when the light 305 is reflected from substrate 401 and level 411
represents the sensor signal when light 305 impinges on surface 403 of
chuck 402.

[0028]FIG. 5 illustrates an embodiment where the edge of the substrate 401
is configured with a chamfer 501. In this embodiment, there will be a
signal change when sensor system 315 is scanned over the edge of
substrate 401. The angle of chamfer 501 will cause the incident light 305
to take an altered path 306, which results in less reflected light
impinging on sensor 304.

[0029]FIG. 6A illustrates an embodiment wherein the grating 302 is
imprinted along with an active area as imprinted grating 601. Once the
edge of substrate 401 is located, the sensor system 315 may then be
scanned until the first "tooth" of grating 301 is located. In this
manner, the position of the template 301 relative to an edge of the
substrate 401 may be determined. In this case, the location of the
imprinted features may be located relative to the edge of the substrate
using sensor system 315. Location of the sensor during the measurement of
the edge of the substrate and the grating remain not changed.

[0030]FIG. 6B illustrates a shaped substrate 602 that has an inner edge
603 as well as an outer edge (not shown). The sensor system 315 may be
scanned from the inner edge of the substrate across the gratings 601.
Similarly, scanning can be made for outer edge of the substrate across
the gratings. In this illustration, four measurements (d1-d4) are made,
two on each orthogonal axis. In this manner, the imprinted pattern
concentricity may be determined for substrate 602.

[0031]The present invention solves the problem by providing a means to
determine the template 301 and substrate 401 in-stage position
coordinates. A set of gratings 302 used for template position detection
are etched into the template 301 at a pre-defined location during the
template fabrication process. Since the set of gratings 302 are
fabricated together with the active area, they may be used as references
to determine the position of the template 301 active area. These gratings
302 may be rectangular or circular depending on the initial theta
(angular) alignment requirement. The gratings 302 have a specific pitch
designed based on the wavelength of the incident laser beam (emitter 307)
and the incident angle of the laser beam. The size of the gratings 302 is
set based on the spot size of the laser beam 307 and the position
sensitivity required from the system. The system involves placing a laser
emitter 307 and a photo-electric detector 304 above the paths of the
template 301 and substrate 401. The photo-electric detector 304 is so
placed that it will only receive light 306 reflected at a specific angle.
The template 301 is placed onto a loading mechanism and moved by the XY
stages under the detection sensor. The photo-electric detector 304 is
configured to give a null signal when the laser beam 306 is not on the
grating 302, however, when the laser 307 is incident on the gratings 302,
the first order diffracted light (306) will be incident on the
photo-voltaic detector 304 thereby giving an electric signal. This signal
may be used to determine the position of the template 301 in the XY stage
(e.g., 16 in FIG. 1) or tool coordinates. In the diffraction mode, no
intensity of the returning light 306 will be detected on the sensor 304
when the light beam 306 is away from the edges of the substrate 401,
however, the edge will direct the returning light 306 to the sensor 304
when the light beam 306 is on the edges of the substrate 401.

[0032]In another embodiment, a small inclined surface 403 is provided
between the laser emitter 307 and the photo-electric detector 304 on the
wafer chuck 402. This reflective surface 403 is inclined by an amount
equal to one half the angle between the light source and detector. When
the substrate 401 is placed on the chuck 402, the inner edge would
overlap the inclined surface 403. In this embodiment, the light beam 305
from the emitter 307 is fully reflected into the detector 304 when the
light beam 305 is on the wafer chuck 402. As the scanning beam 305 hits
the edge of the substrate 401, the beam 305 is either blocked or directed
into a different angle (beam 306) so that no light reaches the
photo-electric detector. This sharp drop in signal 410 (slope 412) may be
used to detect the edge of the substrate 401.

[0033]Sensors for the template 301 and substrate 401 may be the same
units, which in turn serves to eliminate the calibration process that is
required when two different sets of sensors are used for the template 301
and substrate 401.

[0034]When the template grating 302 is imprinted on the substrate 401, the
duplicated grating 601 may provide centering information of the template
301 with respect to the substrate 401. The same sensor system 315 may now
detect both references: the imprinted grating 601 and the edge of
substrate 401.

[0035]FIGS. 7A and 7B are method steps incorporated in embodiments herein.
In step 701, a sensor system is placed over the transparent mold and the
substrate. The sensor system generates a beam of optical energy and is
configured to receive only portions of the optical energy reflected in an
angular window from the detection surfaces. The sensor system also
generates sensor signals in response to variations in received optical
energy reflected from the detection surfaces of the transparent template
mold and the substrate. In step 702, the transparent template mold is
positioned in response to control signals to locate the transparent
template mold in tool coordinates. The transparent template mold has an
active area with imprintable features surrounded by gratings that have
detection surfaces at a pitch corresponding to a predetermined
dimensional increment. In step 703 the substrate is positioned in
response to control signals to locate the substrate in tool coordinates.
The substrate has edges that are configured as detection surfaces. In
step 704, the sensor signals are processed in a controller to locate the
transparent template mold relative to the substrate in tool coordinates.
In step 705, the control signals are generated to thereby position the
substrate accurately with respect to the transparent template mold in the
tool coordinates.

[0036]In another embodiment the additional steps are incorporated. In step
706, a pattern of the gratings and the active area are imprinted on the
substrate. In step 707, the imprinted patterns of the gratings and the
active area on the substrate are scanned by the sensor system thereby
generating sensor signals from detection surfaces corresponding to the
substrate edges and detection surfaces on the imprinted gratings. In step
708, the sensor signals are processed in the controller to locate the
imprinted pattern in tool coordinates with respect to the edges of the
substrate to determine concentricity of the active area to the substrate
to facilitate process control.

[0037]The steps desired in FIGS. 7A-7B may be controlled through processor
54 to operate on system 10 in accordance with embodiments of the present
invention. The process steps may be stored as program steps in a computer
system stored in memory 56.

[0038]The embodiments of the present invention described above are
exemplary. Many changes and modifications may be made to the disclosure
recited above, while remaining within the scope of the invention.
Therefore, the scope of the invention should not be limited by the above
description, but instead should be determined with reference to the
appended claims along with their full scope of equivalents.