tag: Defect

As the semiconductor industry gears up for the 10nm logic node—now likely to begin in the second half of 2017—the photomask supply chain is preparing to grapple with the associated challenges, including dramatic increases in photomask complexity, write times and data volumes.
The 10nm node will require more photomasks per mask set, the ability to print smaller and more complex features, ... » read more

ASML Holding’s first production-worthy scanners for extreme ultraviolet (EUV) lithography are expected to ship this year, but there are still a number of challenges to bring the technology into high-volume manufacturing.
As before, the three main challenges for EUV are the power sources, resists and photomasks. To date, the resists are making progress, while the EUV power sources remain a ... » read more