The overall cost of wafer manufacturing is poised to decline with a new graphene-based “copy machine” that transfers intricate crystalline patterns from an underlying semiconductor wafer to a top layer of identical material. The technology supports fabrication of devices from exotic, higher-performing semiconductor materials.

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This MEMS-based device is about the size of a dime, and is mounted on a credit-card-sized printed circuit board that contains circuits, sensors, and other miniature components that control the microscope.

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ON Semiconductor showcased its portfolio of solutions for the effective implementation of USB Type-C applications at the 2017 Consumer Electronics Show. USB Type-C is the rapidly emerging default industry standard for wired, smart, rapid charging, and high-speed data transmission to support applications like augmented and virtual reality.

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An international team of scientists has modified the energy spectrum of acoustic phonons — elemental excitations, also referred to as quasi-particles, that spread heat through crystalline materials like a wave — by confining them to nanometer-scale semiconductor structures.

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