Recent advances in MEMS technology have resulted in relatively low cost MEMS gyroscopes. Their unique features compared to macro-scale devices, such as lighter weight, smaller size, and less power consumption, have made ...

Modeling the realistic burning behavior of condensed-phase fuels has remained out of reach, in part because of an inability to resolve complex interactions at the interface between gas-phase flames and condensed-phase ...

Material selection and processing techniques were investigated to form carbon-metal bonds. Mechanical and electrical characterization was performed to more fully comprehend the bonding mechanisms and properties. Utilizing ...

A simplified model is developed for analysis of interconnect stresses induced by changes in the curvature of printed wiring boards. The model utilizes the Rayleigh-Ritz variational approach and can be used for rapid ...

An embedded planar capacitor is a thin laminate embedded in a multilayered printed wiring board (PWB) that functions both as a power-ground plane and as a parallel plate capacitor. The capacitor laminate consists of a ...

With constant process intensification in recent years, the separation of fine micron and submicron size liquid droplets from gaseous flow mediums has become an important subject for the process and aerospace industries. ...

Today, probabilistic risk assessments (PRAs) at multi-unit nuclear power plants consider risk from each unit separately and do not formally consider interactions between the units. These interactions make the operation of ...

Minimization of frost formation on the outdoor coils of residential heat pumps and subsequent defrost cycles to remove the frost in an energy efficient manner remains an active area of research and development in the HVAC ...

This thesis treats radially symmetric steady states and radially symmetric motions of nonlinearly elastic and viscoelastic plates and shells subject to dead-load and hydrostatic pressures on their boundaries and with the ...

Solder joint fatigue failure is a prevalent failure mechanism for electronics subjected to thermal cycling loads. The failure is attributed to the thermo-mechanical stresses in the solder joints caused by differences in ...