Related Articles

Eyelet PackagesThese TO-25X type packages are designed for power controllers and power rectifiers with 75 percent less resistance than standard glass-to-metal packages. The units feature a ceramic eyelet brazed to low resistance copper alloy pins and copper alloy on the ground plane. All components are attached with a high temperature braze to ensure a reliable, hermetic joint and meet MIL-883 and MIL-PRF-38534 requirements. The packages are suitable for applications where the voltage drop across the package must be low or high power/current is required. Packages are available in TO-254, TO-258 and TO-259 outlines. Split or solid die attach and ground pin options also are available.Kyocera America Inc., Metallized Division, San Diego, CA (800) 468-2957.

Post a comment to this article

Name*

E-mail(will not be displayed)*

Subject

Comment*

Report Abusive Comment

Thank you for helping us to improve our forums. Is this comment offensive? Please tell us why.