| Hi all, | | What is the typical placement head pressure for the GSM1 for placing the micro / chip Scale BGAs ? | | Thanks | Upinder | ======= | Hello Upinder, The typical placement pressure for a GSM1 with Flex head is 150-170 grams. You can program this in the component data base, and its range is from 150-350 grams. With a High force head you can program 150 to 2,500 grams. I hope this helps Barney