VIA Technologies has announced the VIA EPIA-T700, the first motherboard based on the recently announced Mobile-ITX form factor. Measuring a 6x6cm, the VIA EPIA-T700 is a uniquely compact computer-on-module that is designed for a range of ultra-compact embedded devices in medical, military and in-vehicle applications.

The VIA EPIA-T700 can be used with a variety of carrier boards that can be adapted and customized to meet the needs of a range of applications and is powered by a specially miniaturized 1GHz VIA Eden ULV processor and the compact VIA VX820 media system processor that together offer I/O flexibility in the most compact of available form factors.

As of 2013, the 10 ASEAN nations had a total of over 700 million mobile subscriptions, with the CAGR from 2003-2013 reaching 24%. This Digitimes Research Special Report analyzes the various mobile broadband markets in ASEAN and looks at the respective trends in 4G LTE development for those markets.

This Digitimes Research Special Report analyzes the strategies of key China-based major panel makers BOE, Tianma and IVO for attacking the different market segments through technology and pricing, and their relationship to local vendors Huawei, Lenovo, ZTE, Xiaomi and Coolpad.