Unlike traditional packaging materials, AlSiC features an isotropic CTE value that can be tweaked for specific applications by modifying the Al-metal/SiC-particulate ratio. CTE matching capabilities eliminate the need for thermal interface stacking in the ICs, making them more reliable in the field.

AlSiC also exhibits a high thermal conductivity. This results in efficient thermal dissipation and helps prevent packaging and substrates from bowing. The bowing can lead to failures. Traditional packaging materials with lower thermal dissipation can delaminate, leading to air gaps and poor reliability.

A net-shape forming process builds AlSiC parts with highly complex features such as capacitor and resistor pockets in the flip-chip lids. It also lets designers integrate high thermal conductivity inserts (>1,000 W/mK) or cooling tubes for better thermal management. Net-shape forming reduces processing costs and makes for quicker prototyping of advanced thermal management devices. Part surfaces can be laser marked, painted, and screen printed, as well as anodized.