A Four Day Seminar

Course Overview:

This is an advanced seminar on the principles of high performance
simulations, signal integrity engineering and the design of high
performance systems. The seminar includes the presentation of the theory of
the simulation of semiconductor models and packages, printed wiring boards,
cable and connector electrical performance. The theory and formulations are
presented in the context of digital representations of the signals, i.e.,
in terms of their time domain signal properties of amplitude, clock rate,
symmetry and rise/fall times.

HSPICE and other SPICE dialects and "Method of Moments" field
calculations of PWB structures will be used to illustrate "Right by
Design" principles for the simulation of high performance digital
system design. In the context of SPICE simulations, convergence and
integration topics are considered. Integration solution methods such as
Gear, Trapezoidal, Euler and Newton-Rapson are discussed. Convergence
issues and fixes along with the source of computational errors, the use of
error bounds and effect on computation time and accuracy of time step
selection are also examined and discussed. HSPICE element usage and syntax
of more popular CMOS and Bipolar semiconductors and models are presented.
Circuit description modularity and the use of SPICE control features
important for creating re-usable models are illustrated with specific
examples. Some of the more important control and syntax features discussed
include .PARAM, .GLOBAL, .MEASURE, .INCLUDE, and the Model Selector.

A representative set of design based case studies will be used to round
out this seminar. Topics for case studies include analysis and simulations
of clocking architectures, development of accurate "passive
simulation" models to characterize backplanes and multi-load busses,
the role of SPICE simulations in the development of wire rules and
economical construction recommendations for single sided and differential
multi-layered PCBs. Lastly, a specific case study will be developed and
discussed on the basis of class choice and input.

Course Objective:

This seminar is designed to address the most important theoretical and
simulation issues facing high performance architects, logic designers and
signal integrity engineers. The case studies have been carefully chosen to
address many of the design choices faced by the participants in every
contemporary design. The NESA course instructors have "hands on"
experience with these problems, having been responsible for some of the
highest performance digital interconnects. Correct use of the principles
presented herein has a measurable effect on the execution of "Right by
Design" principles, EMI system compliance and time to market.

Who Should Attend:

The following high performance system design engineers have been found
to benefit the most from this seminar:

Signal integrity
and analog engineers who depend on the use of simulation tools for
design and validation of high performance designs.

EMI compliance and
design engineers responsible for the timely compliance of systems
platforms to the requirements of FCC Part 15, VCCI of Japan and the CE
for the Common European market.

It is recommended that for the most effective application of the theory
and principles of this course, seminar participants should have completed
undergraduate course requirements in a recognized Electrical Engineering,
Computer Design or Physics degree program or possess equivalent industrial
design experience.

Course Curriculum:

Day 1 - Signal Integrity and Transmission
Line Theory and Practice:

Introduction to High Performance Digital Interconnect
& Packaging

Course Theme - An
Off-chip and Near Chip "Simulated Experience"

HSPICE is de-facto
semiconductor simulation standard

What's the best way
- "Right by Design" or Post Layout Validation tools?

SPICE vs.
Transmission Line SI Validators

SPICE Behavioral
and IBIS modeling

Transmission Line Theory and Practice in Digital
System Design

Fundamental
Transmission Line Equations

Impedance/Time Delay
Description of Transmission Lines

R-L-C Discrete
Components as an Approximation to T-Lines

Impedance,
Reflection and Transmission Coefficients

Analytic formulas
for stripline and microstrip impedance

Limitations of
simple formulas

Geometric Based
models - An overview of numerical methods of field theory

Prediction for
capacitance, inductance, impedance, propagation delay

Crosstalk between
signal traces.

Discussion of the
effects of material dimensions and homogeneity, dielectric constant,
line dimensions in printed wiring board design.