Tuesday, August 12, 2014

Huawei and Telekom Malaysia signed a Memorandum of Understanding (MoU) to co-develop next generation access technologies for both fixed-line and wireless connectivity in Malaysia.

The partnership will see Huawei and Telekom Malaysia's Research & Development arm jointly research the most suitable, customized copper access and 4G solutions for Malaysia’s fixed and broadband landscapes. Through this collaboration, both parties will share research facilities and encourage knowledge transferring, as well as establish a joint lab within the TM Innovation Center, in Cyberjaya within the Multimedia Super Corridor (MSC) of Malaysia.

"Being a part of Malaysia’s digital transformation has been an exciting experience for us at Huawei. TM’s High Speed Broadband (HSBB) project has become a global reference point of future-oriented smart networks. By jointly developing technologies that utilize TM’s existing copper wires, TM can make efficient use of resources, quickly implement bandwidth strategies, and launch additional new services, including IPTV and HDTV based on the fast broadband to score more commercial success," stated Mr. Mike Wang, Chief Executive Officer of Huawei Malaysia.