Solder Paste

The NC676 No Clean Paste is a new generation halide-free, rosin-based chemistry designed to provide a previously unseen level of repeatability and consistency to the printing process. This paste offers an excellent open time, extended abandon time and good soldering activity with all surface finishes. NC676 meets or exceeds the requirements for ANSI/J-STD -004, -005 as well as all Bellcore test criteria for solder pastes. Residues left behind are clear and maintain a virtually indefinite pin probability life.

The NL932, manufactured by FCT Solder, delivers Surface Area Ratio (SAR) paste transfer efficiencies below 0.6 and 0.55 respectively. NL932 is formulated to deliver
exceptional cosmetics, especially when used in conjunction with Nihon Superior’s SN100C patented lead free alloy. It was specially designed to meet the requirements for reliable solder joints in printed circuit board assemblies.