The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.

In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.

The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.

The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.

The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.

MicroLine 2000 S - Cutting Assembled Circuit Boards

The UV laser cuts substrates in the immediate vicinity of sensitive components or strip conductors - without mechanical stress. Smaller components can thus be produced with a noticeably higher assembly density up to the edge of the PCB - and at the same time the process reduces the reject rate