Characterization of “Multipath Interconnects” for Microelectronic and Nanotechnology Circuits

Authors:

A.K. Goel and N.R. Eady

Affilation:

Michigan Technological University, US

Pages:

632 - 635

Keywords:

interconnects, capacitances, Green’s function, nanoelectronics, VLSI

Abstract:

A multipath interconnect carries a signal by using the concept of parallel processing by providing two or more paths between the driver and the load. These paths are stacked vertically isolated from one another by insulating layers between them. In this paper, we have used the Green’s function method to determine the parasitic capacitances associated with a system of multipath interconnects printed on a silicon-based substrate.