ACFBonding-gettingenoughpressure

ACF Bonding is different from hot bar soldering. Even though they use the same type of equipment, ACF bonding requires a higher degree of planarity and also typically requires more pressure. You need to run the calculations for how much pressure is required for the anisotropic conductive film that you'll be using and make sure the Hot Bar equipment you are looking at will apply enough force. Since pressure is force divided by area, larger hot bars require a lot more force to achieve enough pressure. Hot bars up to 6" long can require a few hundred pounds of force. Keep this in mind and do the math when you look at ACF bonding equipment. Learn more about this at http://www.a-i-t.com/hot-bar-soldering-equipment/acf-bonding

AboutUs

Advanced Integrated Technologies is essentially a manufacturing service company with two major divisions. The resistance welding and reflow soldering tool division grew out of our early work building micro tools for Hughes Aircraft. About the time that Microsoft was turning computers into a household item, computer hardware manufacturers were looking for companies to build reflow tools used in the assembly of hard drives and other components. The major players like Seagate found A.I.T. and we quickly grew into the industry leader, building more reflow tools and resistance welding electrodes than any other single manufacturer. We still hold that position today.