As always, we look at the part number to tell us what's going on. Micron's part numbers are a little different than Intel's but the key things to pay attention to here are the 128G (128Gbit packages, 16GB per package) and characters 11 and 14. Character 11 here is an F, which corresponds to 2 die per package (2 x 8GB 25nm die in each NAND device) while number 14 is an A, indicating that this is asynchronous NAND. To date I've only encountered 25nm synchronous (represented by the letter B) NAND, but as with any other silicon device there's always a cost savings if you can sacrifice performance.

These are Intel 25nm NAND devices, looking at the part number tells us a little bit about them. You can ignore the first three characters in the part number, they tell you that you're looking at Intel NAND. Characters 4 - 6 (if you sin and count at 1) indicate the density of the package, in this case 64G means 64Gbits or 8GB. The next two characters indicate the device bus width (8-bytes). Now the ninth character is the important one - it tells you the number of die inside the package. These parts are marked A, which corresponds to one die per device. The second to last character is also important, here E stands for 25nm.

Once again we have sixteen NAND devices, eight on each side. OCZ standardized on Intel 25nm NAND for both capacities initially. The density string on the 240GB drive is 16B for 16Gbytes (128 Gbit), which makes sense given the drive has twice the capacity.

A look at the ninth character on these chips and you see the letter C, which in Intel NAND nomenclature stands for 2 die per package (J is for 4 die per package if you were wondering).