Being a manufacturer in the electronics industry is not easy. Customers are demanding more for less money and products quickly become mainstream commodities, making it easy to shop from someone else. And the electronics industry has delivered, making great technological improvements while cutting prices ...

By Chad Gilliland and Eric Miller, Ascentec Engineering, Sherwood, ORSurface mount pallets (or carriers) are often an essential part of achieving consistent, highest quality success with new product introduction (NPI) or production volume builds. These tools are not new to the industry and are a proven part of designing a robust SMT process. Oftentimes only mechanical ...

By Mario Orduz, National Product Manager, Uyemura USA, Ontario, CAUnder Bump Metallization (UBM) is required for connecting the die to the substrate with solder bumps for Flip-Chip packages. The UBM of the integrated circuit (IC) bonds pads that are typically aluminum but can be copper. This is an essential process step for the reliability of the ...