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17 July 2017
Anglia Components, a UK and Ireland distributor for TDK and EPCOS products, today announced that it has received the TDK Silver Distribution Award for Outstanding Business Performance in 2016.
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01 April 2017
Anglia Components, a UK and Ireland distributor for TDK and EPCOS products, today announced that it has received the TDK Silver Distribution Award for Outstanding Business Performance in 2016.
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19 September 2016
The CeraLink capacitor product range from TDK is a highly compact solution for the snubber and DC links of converters with special requirements with respect to space, temperature or ESL. E.g. they are ideal in connection with SiC or GaN based devices.
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28 June 2016
Complementing the existing MLF1608 series of multilayer power inductors for signal lines, the MLJ1608 series was designed for use in near field communication (NFC) and power line applications especially in smartphones, tablets and NFC modules.
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25 April 2016
TDK Corporation has announced the new MHQ0402PSA series of multilayer inductors in case size IEC 0402. Measuring in with reduced dimensions of just 0.4 mm x 0.2 mm x 0.2 mm, the new inductors feature a Q factor of 21 at 1 GHz.
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12 May 2015
TDK Corporation presents a new EPCOS duplexer for LTE Band 1, which at 60 dB features very high isolation for both the Tx and Rx paths. Based on SAW technology the B8651 duplexer has a miniature footprint of just 1.8 mm x 1.4 mm.
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10 April 2015
TDK offer a wide range of surface mount power inductors designed for the most demanding applications. Some of the most recent introductions the VLF-M, VLS-E and VLS-HBX-1 series offer compact sizes and include low profile models and high current ratings.
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12 March 2015
TDK Corporation presents a new generation of the EPCOS CeraLink, a highly compact solution for the snubber and DC links of fast-switching converters based on SiC and GaN semiconductors.
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03 March 2015
The ultra-compact µDC-DC converters feature a footprint of only 2.9 mm x 2.3 mm and an insertion height of 1 mm. One 6-MHz power switch is embedded in the miniature PCB.
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02 February 2015
TDK has introduced two new SMT current sense transformers for automotive electronics. The SMT current sense transformers are designed for use in emerging 48-V automotive power systems as well as for all xEV applications.
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18 December 2014
With dimensions of just 3.2mm x 2.5mm x 2.4mm, the chokes are the extremely compact. Their footprint is approximately 45 percent smaller than that of existing components, while their volume has been more than cut in half.
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07 November 2014
TDK Corporation has developed a new multilayer diplexer in case size IEC 1005 for the implementation of 2.4 GHz/5 GHz band WLAN in smartphones and other mobile devices.
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11 October 2008
TDK Electronics Europe has introduced the AVF26BA12A400R201, a miniature chip varistor that uses a Ball Grid Array (BGA) terminal arrangement to reduce board mounting area by 33%.
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11 October 2008
TDK Electronics Europe has announced the introduction of a new generation of 100V-rated ceramic chip capacitors that offers the industry’s highest level of capacitance for mid-voltage applications in devices half the size of their predecessors.
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11 October 2008
TDK Electronics Europe has announced the MMZ1005-E series, a family of three Gigaspira multilayer gigahertz-band chip bead inductors offering the world’s highest impedance in a 1005-size device.
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