A focused ion beam on the NanoLab can cut tiny slivers out of wafers without destroying adjacent chips. The the sliver can then be analyzed by the scanning electron beam, enabling layers of a semiconductor wafer to be imaged as a cross-section.

Low-voltage scanning electron microscope resolution has also been improved, the company claims, for cross-sectional imaging, thereby enabling semiconductor materials at sub-65-nanometer design nodes to be more easily analyzed.