Micro-Star International (MSI) has announced the launch of the upgrade version of WindBOX III (MS-9A35) to the industrial PC (IPC) market.

Following the fanless design of the WindBOX series, MSI debuts the WindBOX III based on the Intel Core 2 Duo processor and the Intel GS45 + ICH9M chipset to provide an ultra-low power and slim form factor for solid embedded applications.

The WindBOX III (MS-9A35) offers 3D graphics performance for a high definition up to 1080P. It supports DirectX 10, shader model 4.0 and Intel clear video technology. It features six USB 2.0 ports, two powered COM ports, and multiple video output (DVI-I for VGA and DVI-D, HDMI) for dual independent display. There are two mini-PCIe slots, and the WindBOX III comes with a module that has a built-in Wi-Fi 802.11b/g/n and a Bluetooth module, the company said.

This Digitimes Research Special Report examines the China AMOLED industry, focusing on the expansion capacity of the makers, the current implementation plans of major smartphone vendors in the market and the technological hurdles faced by the China makers.

Digitimes Research expects global AP shipments to surpass the 1.9 billion mark in 2017, with smartphones remaining the main application. Qualcomm will be leading the market in 2017, as other players continue playing catch up and scramble for funds to invest in more diverse applications.