Abstract

Internal Y-shaped bifurcation has been proved to be an advantageous way on improvingthermal performance of microchannel heat sinks according to the previous research. Metal foams are known due to their predominate performance such as low-density, largesurface area, and high thermal conductivity. In this paper, different parameters of metalfoams in Y-shaped bifurcation microchannel heat sinks are designed and investigatednumerically. The effects of Reynolds number, porosity of metal foam, and the pore density(PPI) of the metal foam on the microchannel heat sinks are analyzed in detail. It is foundthat the internal Y-shaped bifurcation microchannel heat sinks with metal foam exhibitbetter heat transfer enhancement and overall thermal performance. This researchprovides broad application prospects for heat sinks with metal foam in the thermalmanagement of high power density electronic devices.