Although
much has been achieved by CMOS scaling and progress continues with 3D chip
stacking, this approach isnít necessarily the optimal solution to every
problem. Heterogeneous integration of disparate materials, thermal management,
chip design, and Known-Good-Die issues are some of the obstacles that industry
is still working to overcome.

IIC
has licensed QP technology for large format arrays, enabling customers to
partition large, poorly-yielding integrated circuits into smaller,
higher-yielding chips which are then tiled into arbitrarily large arrays. This
is made possible by QPís ability to deliver chip-to-chip gap (<10 um) while
maintaining sub-micron alignment. Revolutionary system improvements are also underway
for microwave/RF, power, and optical applications. 2013 saw a major increase in
activity and industry interest in the technology, with application to a variety
of high performance defense systems. As the technology matures, we anticipate a
crossover to commercial applications, particularly in power.

IIC
believes the adoption of Quilt Packaging will continue to increase with the number
of successfully deployed Quilt-Packaged systems on the rise in 2014.
Demonstrations are currently underway in a variety of material systems, including
GaAs, GaSb, InP, SiC and GaN. We look forward to working closely with our
customers to provide game-changing system performance increases while
decreasing costs and SWAP through Quilt Packaging this year.