第1章 簡介

第2章 摘要和亮點

第3章 市場與技術的背景

第4章 市場明細:零組件的各類型

第5章 市場明細:集積的各類型

第6章 市場明細:原料的各類型

第7章 市場明細:應用的各類型

光纖通訊

檢測

生醫光電(Biophotonics)

光信號處理

第8章 市場明細:各地區

北美

歐洲

亞太地區

其他

全球課題

第9章 專利檢討

重大的專利

專利檢討:各年度

專利檢討:各地區

第10章 市場佔有率分析

第11章 企業簡介

附錄:成長影響要素

關於BCC Research

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目錄

Product Code: PHO007B

Report Highlights

The global market for photonic integrated circuits reached $426 million in 2016. This market is expected to increase from $539 million in 2017 to $1.8 billion in 2022 at a compound annual growth rate (CAGR) of 27.5% for 2017-2022.

Report Includes:

An overview of the global market for photonic integrated circuit (IC) technology.

Analyses of global market trends, with data from 2016, estimated for 2017 and projections of compound annual growth rates (CAGRs) through 2022.

In-depth breakdown and analysis of the photonic integrated circuit market by application, by components, and by materials.

Definition of the market by supply chain, value chain, and future outlook and expectations.

Comprehensive profiles of leading companies in the industry.

Report Scope

The market for photonic integrated circuits is segmented into the following categories:

Geography: North America is segmented into the U.S., Canada and Mexico; Europe is segmented into France, Italy, Germany, U.K., Russia and the CIS; APAC is segmented into China, Japan, Taiwan, South Korea and others, and the RoW covers the Middle East and South America.

Industry and competitive analysis.

Patent analysis.

Company profiles

Analyst Credentials

GAURAV SINHA focuses on electronics and semiconductors markets, robotics and nanotechnology. His publications range from factory automation and big data to industrial controls and helmet-mounted displays. He holds a bachelor's degree in electrical engineering from Rajasthan University and an MBA degree in finance from ICFAI Business School.

Table of Contents

Chapter 1: Introduction

Study Goals and Objectives

Reasons for Doing This Study

Scope of Report

Information Sources

Methodology

Intended Audience

Geographic Breakdown

Analyst's Credentials

Related BCC Research Reports

Chapter 2: Summary and Highlights

Chapter 3: Market and Technology Background

Market Definition

Roadmap of Photonic Integrated Circuits

Current Trends and Outlook

Demand for High Speed Data Transfer

Reduced Power Consumption and High Efficiency of Photonic Integrated Circuits

Next Generation System Integration Using Silicon Photonics

Connectivity Issue of Photonic Integrated Circuits

Key Highlights by Major Market Participants

Chapter 4: Market Breakdown by Type of Component

Laser (Optical Laser)

Modulators

Detectors

Attenuators

Multiplexer/Demultiplexer (MUX/DEMUX)

Optical Amplifiers

Chapter 5: Market Breakdown by Type of Integration

Monolithic Integration

Hybrid Integration

Module Integration

Differentiation of Integration Methods

Chapter 6: Market Breakdown by Type of Raw Material

Indium Phosphide

Gallium Arsenide

Lithium Niobate

Silica-on-Silicon

Silicon

Others (Silicon Dioxide, Silicon Nitride, SOI, Ge, SiGe)

Chapter 7: Market Breakdown by Type of Application

Optical Communications

Sensing

Biophotonics

Optical Signal Processing

Chapter 8: Market Breakdown by Region

North America

Europe

Asia-Pacific (APAC)

Rest of the World (RoW)

Global Issues in the Development of PICs

Chapter 9: Patent Review

Significant Patents

Silicon Photonic Heater-Modulator

Optical Fiber for Silicon Photonics

III-V Photonic Crystal Microlaser Bonded on Silicon-on-Insulator

Redundant Light Supply for Silicon Photonic Chip

Silicon Photonics Integration Method and Structure

Silicon Photonics Device and Communication System

Photonic Flexible Interconnect

Integrated Control Module for Communication System on a Chip for Silicon Photonics