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The newly developed FIB-SEM system from Hitachi, the NX9000 incorporates an optimized layout for true high-resolution serial sectioning to tackle the latest demands in 3D structural analysis and for TEM and 3DAP analyses. The NX9000 FIB-SEM system allows the highest precision in material processing for a wide range of areas relating to advanced materials, electronic devices, biological tissues, and a multitude of other applications.

Cut & See·3D-EDS*1·3D-EBSD*1 available for a wide variety of materials

Cut&See

Cut & See supports high-resolution, high-contrast imaging of biological tissues, semiconductors, and magnetic materials, such as steel and nickel, at low accelerating voltages.Serial section images can be collected with high throughput due to the proper geometry of the ion and electron column.

3D-EBSD*1

Simultaneous SEM, FIB, and EBSD signals are obtained for 3D-EBSD without moving the stage during FIB sectioning and EBSD analysis. Accuracy and throughput of 3D crystal orientation analysis and segmentation yield high quality and less post-processing correction.