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Abstract:

An improved system for capacitive testing electrical connections in a low
signal environment. The system includes features that increase
sensitivity of a capacitive probe. One feature is a spacer positioned to
allow the probe to be partially inserted into the component without
contacting the pins. The spacer may be a collar on the probe that
contacts the housing of the component, contacts the substrate of the
circuit assembly, or both. In some other embodiments, the spacer may be a
riser extending beyond the surface of the sense plate that contacts the
component, a riser portion of the component, or a combination of both.
The spacer improves sensitivity by establishing a small gap between a
sense plate of the probe and pins under test without risk of damage to
the pins.
A second feature is a guard plate of the probe with reduced capacitance
to a sense plate of the probe. Reducing capacitance also increases the
sensitivity of the probe.

Claims:

1. A probe configured to test pins on a circuit assembly, the probe
comprising: a sense plate for receiving signals on the test pins through
capacitive coupling; a guard plate comprising a plurality of holes sized
and positioned to reduce capacitance between the sense plate and the
guard plate; and a dielectric between the guard plate and the sense
plate.

2. The probe of claim 1, wherein: the guard plate comprises a
substantially planar surface through which the plurality of holes are
formed, the substantially planar surface being bounded by a perimeter and
having an area within the perimeter; and a total area of the plurality of
holes comprises at least 25% of the area of the substantially planar
surface bounded by the perimeter.

3. The probe of claim 2, wherein the total area of the plurality of holes
comprises at least 50% of the area of the substantially planar surface
bounded by the perimeter.

4. The probe of claim 1, wherein: the sense plate comprises an area; and
a total area of the plurality of holes comprises at least 40% of the area
of the sense plate.

5. The probe of claim 4, wherein a total area of the plurality of holes
comprises at least 50% of an area bounded by the perimeter of the
substantially planar surface of the sense plate.

6. The probe of claim 5, wherein the plurality of holes are each of
substantially a same size and shape.

7. The probe of claim 5, wherein the plurality of holes are arranged in a
plurality of rows on the substantially planar surface, each row
comprising at least two holes of the plurality of holes.

8. The probe of claim 7, wherein, each of the plurality of holes has a
maximum dimension between 70 mils (1.8 mm) and 130 mils (3.3 mm), and an
edge-to-edge spacing between adjacent member of the at least two holes in
each row is between 27 mils (0.7 mm) and 33 mils (0.8 mm)

9. The probe of claim 7, wherein each of the plurality of through holes
is substantially circular.

10. The probe of claim 7, wherein each of the plurality of rows is
staggered relative to an adjacent row.

11. The probe of claim 10, wherein the plurality of rows are staggered
such that an angle between 54 and 66 degrees is created between a hole in
a row and a nearest hole in an adjacent row.

12. The probe of claim 1, wherein the sense plate and the guard plate are
parallel.

13. The probe of claim 1, wherein a capacitance between the sense plate
and the guard plate is less than 35 picofarads (pF).

14. The probe of claim 13, wherein the capacitance between the sense
plate and the guard plate is in a range of 10 to 20 pF.

15. The probe of claim 1, further comprising an electrical lead connected
to the sense plate and passing through a hole in the guard plate, the
hole being separate from the plurality of holes.

16. The probe of claim 15, further comprising an amplifier electrically
connected to the electrical lead and the guard plate.

17. The probe of claim 1, wherein the guard plate is separated from the
sense plate by a distance, d, and the holes each have a diameter greater
than d.

18. The probe of claim 1, wherein: the guard plate is separated from the
sense plate by a distance, d; and each of the plurality of holes have a
surface area greater than π(d/2).sup.2.

19. The probe of claim 1, wherein the sense plate further comprises a
hole in a center region of the sense plate having a surface area of at
least 0.5 cm.sup.2.

20. A method of testing a circuit assembly, the method comprising acts
of: driving a signal line on the circuit assembly with a test signal;
sensing a magnitude of the test signal coupled from a pin under test to a
probe having a sense plate for receiving the response signal, a guard
plate comprising a plurality of holes, and a dielectric between the guard
plate and the sense plate; and indicating a test result based on the
response signal.

21. The method of claim 20, further comprising an act of: amplifying the
response signal with an amplifier having an electrical lead connected to
the sense plate, the electrical lead passing through a hole, separate
from the plurality of holes, in the guard plate.

22. The method of claim 20, wherein the plurality of holes occupy a first
area comprising at least 25% of an area bounded by the perimeter of a
substantially planar surface of the guard plate.

23. The method of claim 22, wherein the first area comprises at least 50%
of an area bounded by the perimeter of a substantially planar surface of
the guard plate.

24. A method of manufacturing circuit assemblies, the method comprising:
testing circuit assemblies in accordance with the method of claim 21, the
circuit assemblies being tested after a first portion of a manufacturing
process has been performed; and for each circuit assembly tested,
selecting steps in a second portion of the manufacturing process based on
the indicated test result.

Description:

BACKGROUND

[0001] 1. Field of the Invention

[0002] The invention relates generally to testing of circuit assemblies,
and more particularly to capacitive testing of connections to pins of
components of the circuit assembly.

[0003] 2. Description of Related Art

[0004] During the manufacture of printed circuit board (PCB) assemblies,
testing is performed at one or more stages to ensure that the finished
product functions adequately.

[0005] In some manufacturing operations, circuit assemblies are first
tested before any components are mounted to them. The components may be
separately tested before they are attached to the circuit assemblies,
usually by soldering. Once the components are attached, a further test
may be performed to verify that the components are properly attached.
Such testing includes "opens" tests and "shorts" tests that indicate
defects in attachment of contact points of the components to the circuit
assembly. These contact points are generally referred to as "pins," even
though the contact points may take many shapes, including posts, gull
wing leads or solder balls.

[0006] One approach to testing the connections to pins is called
capacitive testing. In a capacitive "opens" test, a probe that includes a
sense plate is pressed against a component with a pin to be tested. A
test signal is generated at a point on the circuit assembly that should
be connected to the pin under test in a properly manufactured circuit
assembly. If the pin under test is properly connected to the circuit
assembly, the test signal will propagate from the circuit assembly
through the pin to conducting structures within the component. Though the
probe plate is separated from those conducting structures, the test
signal can capacitively couple to the probe plate. During a test, the
signal received at the probe plate is analyzed to determine whether the
test signal has been capacitively coupled to the probe plate, indicating
that there is a good connection between the assembly and the pin of the
component.

[0007] Though capacitive testing may be desirable, it has not been widely
used for certain types of components. For example, sockets have not been
widely tested using capacitive test techniques. Sockets generally contain
a cavity shaped to receive a semiconductor chip or other component. The
pins of the socket extend into the cavity and provide spring contacts to
which the other component can be connected. The socket can be soldered to
the circuit assembly and the chip can later be inserted. When the socket
is tested without the component inserted, there is little conductive
structure in the socket through which a test signal applied to a pin
under test can couple to a probe plate. Accordingly, even when a pin
under test is properly connected to a circuit assembly, it is difficult
to reliably detect a capacitively coupled test signal, increasing the
likelihood of errors when testing pins of a socket capacitively.

[0008] In some instances, the probe has been inserted into the socket to
increase the amount of the test signal coupled to the probe plate.
However, inserting a probe into the cavity introduces a substantial risk
of contacting and damaging the pins.

[0009] Also, it is known to include a guard plate in a probe for
capacitive testing. The guard plate shields the sense plate from
electrical noise that could change the signal detected at the sense plate
enough to produce an erroneous test result.

SUMMARY

[0010] A probe for capacitive testing in a low signal environment is
provided by reducing capacitance between a sense plate and a guard plate
of the probe. Reduced capacitance may be achieved through the shape of
the guard plate. For example, the guard plate may have a plurality of
holes, which reduce the capacitance between the guard and sense plate.
Reducing this capacitance increases the magnitude of the signal coupled
to the sense plate from the test pin when the probe is used as part of a
system for testing circuit assemblies.

[0011] The holes on the guard plate may be of any suitable size and shape
and distributed randomly or in a pattern. In some embodiments, the holes
have a circular shape and are arranged in rows. In some embodiments, the
conductive surface area of the sense plate is reduced by 25% or more.

[0012] The sense plate may be electrically connected to an amplifier to
amplify the signal coupled from the test pin. The holes in the guard
plate to reduce capacitance may be separate from holes in the guard plate
to pass an electrical lead from the amplifier to the sense plate.

[0013] The probe may be used as part of a system for testing circuit
assemblies. The probe may be used during a test phase of a circuit
assembly manufacturing process to determine whether pins of a component
on the assembly have a good electrical connection to the assembly's
substrate.

[0014] The foregoing is a non-limiting summary of the invention which is
defined by the attached claims.

BRIEF DESCRIPTION OF DRAWINGS

[0015] The invention and embodiments thereof will be better understood
when the following detailed description is read in conjunction with the
accompanying drawing figures. In the figures, elements are not
necessarily drawn to scale. In general, like elements appearing in
multiple figures are identified by a like reference designation. In the
drawings:

[0016] FIG. 1A is a sketch of a test setup configured for capacitive
testing in which embodiments of the invention may be practiced;

[0017] FIG. 1B is a top view of a component that may be tested using the
inventive principles as described herein;

[0018] FIG. 1C is a cross-sectional view of a portion of a test setup;

[0019] FIGS. 2A and 2B are cross-sections illustrating a portion of a test
setup including a probe having a spacer adapted to contact a lip of a
component housing at different stages of positioning the probe for
capacitive testing of pins of the component;

[0020] FIGS. 3A and 3B are cross-sections illustrating a portion of a test
setup including a probe having a spacer adapted to contact a substrate of
a circuit assembly and a lip of a component housing at different stages
of positioning the probe for capacitive testing of pins of the component;

[0021] FIGS. 4A and 4B are cross-sections illustrating an alternative
embodiment of a portion of a test setup including a probe having a spacer
adapted to contact a substrate of a circuit assembly at different stages
of positioning the probe for capacitive testing of pins of a component;

[0022] FIGS. 5A and 5B are cross-sections illustrating a portion of a test
setup including a probe having a spacer adapted to contact a surface
inside a cavity of a component housing at different stages of positioning
the probe for capacitive testing of pins of the component;

[0023] FIGS. 6A and 6B are cross-sections illustrating a portion of a test
setup including a probe having a spacer adapted to contact a surface of
the housing of a component at different stages of positioning the probe
for capacitive testing of pins of the component;

[0024] FIGS. 7A and 7B are cross-sections illustrating a portion of a test
setup including a component having a housing with a spacer adapted to
contact a surface of a probe at different stages of positioning the probe
for capacitive testing of pins of the component;

[0025] FIGS. 8A-8C are cross-sections illustrating a portion of a test
setup at different stages of positioning a probe for capacitive testing
of pins of a component, the probe having a beveled spacer adapted to
self-align the probe upon contact a lip of a component housing;

[0026] FIG. 9A is a cross-section of a probe having a beveled spacer
adapted to self-align the probe up with a component of a circuit
assembly;

[0027]FIG. 9B is a cross-section of a probe having a plurality of beveled
spacers adapted to self-align the probe up with a component of a circuit
assembly;

[0028]FIG. 9c is a cross-section illustrating a portion of a test setup
including a probe having a tapered spacer adapted to self-align the probe
with a component of a circuit assembly;

[0029]FIG. 9D is a cross-section illustrating a portion of a test setup
including a probe having a plurality of spacers adapted to self-align the
probe with a component of a circuit assembly;

[0030]FIG. 9E is a cross section illustrating a portion of a test setup
including a probe having a plurality of spacers adapted to self-align the
probe with a component of a circuit assembly;

[0032] FIG. 10B is a plan view of a guard plate of a low capacitance probe
according to some embodiments;

[0033] FIG. 10C is a plan view of a sense plate of a low capacitance probe
according to some embodiments;

[0034] FIG. 11A is a plan view of a guard plate of a low capacitance probe
according to some alternative embodiments;

[0035] FIG. 11B is a plan view of a guard plate of a low capacitance probe
according to yet other alternative embodiments;

[0036] FIG. 12 is a flow diagram of a method for testing a circuit
assembly according to some embodiments;

[0037] FIG. 13 is a flow diagram of a method for testing a circuit
assembly according to some embodiments; and

[0038] FIG. 14 is a flow diagram of a method of manufacturing a probe
assembly.

DETAILED DESCRIPTION

[0039] The inventor has recognized and appreciated that capacitive opens
testing for some types of circuit components, including chip sockets, has
been limited because of the risk of damaging the components during the
testing process which has led to the test probe being separated from the
component under test by too great a distance for a test signal to be
reliably detected. The inventor has recognized and appreciated that
capacitive testing can be made feasible by reducing the risk of damage to
components by using spacers to ensure proper alignment of a test probe
with a respective component of a circuit assembly to be tested. Such
spacers may be configured to ensure that when a probe assembly is moved
into the testing position, a gap of predetermined size exists between the
probe assembly and the pins of the component. In addition to ensuring the
proper vertical spacing (i.e., a gap), the spacers may be configured to
assist in the lateral alignment of the probe with the component. Beveled
or tapered surfaces may be used to guide the probe into the proper
testing position.

[0040] The inventor has further recognized that the quality of a signal
coupled to a test probe may be improved by using a low capacitance probe
for testing. The low capacitance effectively increases the amplitude of
the response signal coupled to the probe from the component. Increasing
the response signal's amplitude improves the signal to noise ratio and
the reliability of the test result. The inventor has recognized and
appreciated that a low capacitance probe may be achieved by reducing the
surface area of a guard plate. The surface area may be reduced by
providing holes over the surface of the guard plate. A suitable set of
holes reduces the probe's capacitance while still providing protection
from noise in the test environment.

[0041] FIG. 1A illustrates a test setup 100 for testing a component 110 of
a circuit assembly 120. Such a setup may be used as part of a
manufacturing process for producing circuit assemblies. Circuit assembly
120 includes a substrate 130, such as a printed circuit board (PCB), and
any number of devices and components such as device 121 and component
110. Circuit assembly 120 may be mounted in a fixture of test setup 100
(not shown) during the testing procedure. The fixture may include a
fixture over-clamp (also not shown) to which probe assembly 150 is
connected. The fixture over-clamp may be movable to allow circuit
assembly 120 to be removed and replaced with the next circuit assembly to
be tested. In some embodiments, the fixture over-clamp has a clam shell
design which allows probe assembly 150 to be lowered into an appropriate
position for conducting a test and raised to replace the circuit assembly
with another circuit assembly to be tested.

[0042] According to some embodiments, a test system 160 performs a
capacitive opens test on a pin 113 on a component 110 by generating a
test signal on a signal lead 161 (see also FIG. 1B). The test signal is
then coupled to a signal path 123 on circuit assembly 120 that, in a
properly manufactured circuit assembly, is coupled to the pin under test.
Signal path 123 may be any suitable type of electrical trace for
propagating signals on circuit assembly 120. The test signal may include
a time varying signal, which, if the pin under test is properly connected
to circuit assembly 120, is coupled to the pin. For example, if the pin
under test is pin 113 in component 110, the test signal will be coupled
to pin 113 within component 110. During this test, other signal paths on
circuit assembly 120 may be held at a constant voltage by test system 160
during the test or not driven. Though, in embodiments in which a test
signal on other signal paths will not interfere with the testing of pin
113, other signal paths may simultaneously be driven with other test
signals. Other possible test actions are possible, but for simplicity,
not illustrated in FIG. 1.

[0043] To test the connection of pin 113 to circuit assembly 130, probe
assembly 150 is positioned near component 110. The nature of the signal
coupled to probe assembly 150 may indicate whether pin under test 113 is
properly connected.

[0044] Probe assembly 150 includes a sense plate to which the test signal
may be capacitively coupled from pin under test 113. The properties, such
as the amplitude, of the test signal coupled to probe assembly 150 will
depend on the quality of the connection between the signal path 123 and
pin under test 113. For example, a large coupled signal may indicate the
pin under test is properly connected while a small coupled signal may
suggest the signal path and the pin under test have a poor electrical
connection. Though, the interpretation of the response signal may depend
on the type of test being performed.

[0045] Whatever signal is coupled to probe assembly 150 may be amplified
and provided, via signal path 162, to test system 160. Test system 160
and computer 170 may be configured to analyze the response signal and to
assess the quality of the electrical connection between the signal path
and the pin under test. The response signal may be digitized by a
suitable analog-to-digital converter to facilitate analysis. Test system
160 may perform signal processing of the response signal before providing
the response signal to a computer 170. Computer 170 may be configured to
perform further analysis of the response signal to make a determination
about the electrical connection between signal path 123 and pin under
test 113. Specifically, features of the response signal are analyzed by
computer 170 to determine whether the connection is "good" or "bad." The
particular thresholds and signal features computer 170 uses to make a
determination may be identified empirically during a learn phase or in
any other suitable way. During the learn phase, measurements are made on
a properly assembled circuit assembly such that the characteristics of
response signals when there is a good electrical connection between a
signal path and a pin under test may be identified.

[0046] As illustrated, test setup 100 is configured to test an electrical
connection between signal path 123 and pin under test 113 on component
110. Because the same test process may be used for each of pins 116 on
component 110 and each component on circuit assembly 120, testing is
described in connection with a single pin on a component for simplicity.
However, it should be understood that other pins on the same component
and pins associated with other components could be tested in a similar
fashion, at different times, or, where signals associated with testing of
one component or pin will not interfere with testing of others, at the
same time.

[0047] It should be appreciated that FIG. 1 illustrates one approach to
generating test signals, but other approaches are possible. In the
embodiment illustrated in FIG. 1A, test system 160 is connected to signal
path 123 directly by signal lead 161. In some other embodiments, the test
system 160 may be configured to control another device, such as device
121, to act as a virtual signal generator that generates test signals
onto signal leads. Test system 160 may be configured to generate test
signals on signal paths in any suitable way. Further description of
methods of capacitive testing may be found, for example in "Method and
apparatus for testing electrical connections on a printed circuit board"
U.S. Provisional Patent Application Ser. No. 61/115,005 and "Fast open
circuit detection for open power and ground pins," U.S. Provisional
Patent Application Ser. No. 61/115,011 both of which are herein
incorporated by reference in their entirety. These patent applications
describe techniques in which capacitive tests are performed using test
signals of various formats and good or bad pins are detected based on
measurements associated with multiple pins under test simultaneously,
which can allow detection of faults instead of or in addition to opens.
Accordingly, it should be appreciated that the techniques described
herein are applicable to any form of capacitive testing of circuit
assemblies.

[0048] Though any suitable components may be used to conduct capacitive
tests, as shown in FIG. 1A, computer 170 has a processing unit 171 and
memory 173, but this configuration is only an example. Though illustrated
as separate units, test system 160 and computer 170 may be embodied as a
single device or implemented in any other suitable way.

[0050] Memory 173 may be integrated into processor 171 and/or may include
"off-chip" memory that may be accessible to processor 171, for example,
via a memory bus (not shown). Memory 173 may store software modules that
when executed by processor 171 perform a desired function. Memory 173 may
be any suitable type of computer-readable storage medium such as, for
example and not limitation, RAM, a nanotechnology-based memory, one or
more floppy discs, compact discs, optical discs, volatile and
non-volatile memory devices, magnetic tapes, flash memories, hard disk
drive, circuit configurations in Field Programmable Gate Arrays, or other
semiconductor devices, or other tangible computer storage medium.

[0051] Computer 170 may be programmed to control the overall test process.
For example, computer 170 may reconfigure test setup 100 to test other
pins on circuit assembly 120. If computer 170 determines a test fails,
additional tests may be performed to identify the cause of the failure.
Computer 170 may output information about the tests to an output device
180, such as a display or printer, or may send information about defects
on circuit assembly 120 to other manufacturing equipment for use in
subsequent stages of manufacture.

[0052] Computer 170 may include computer executable software modules, each
containing computer executable instructions. The software modules may be
stored in memory 173 and executed by processor 171, though this is just
an illustrative embodiment and other storage locations and execution
means are possible. In some embodiments, suitable computer executable
modules are used to control test system 160 for testing of circuit
assembly 120.

[0053] For testing chip sockets or other components with relatively small
conductive members, such as pin 113, that provide weak capacitive
coupling to a sense plate in a conventional probe assembly, one or more
enhancements may be used to increase the accuracy of capacitive testing.
In some embodiments, a low capacitance probe, as described in greater
detail below, may be used.

[0054] Alternatively or additionally, mechanical features may be used to
provide a controlled spacing between a sense plate and the conductive
members. The spacing may be small enough to provide reliable capacitive
coupling, yet large enough to prevent contact between the probe assembly
and the conductive elements, which may be easily damaged For example,
probe assembly 150 may be configured for insertion into a cavity formed
in a chip socket or other similar component. Spacers may be incorporated
into one or more of the probe assembly, the component or the circuit
assembly substrate to allow a sense plate to be positioned close to pins
of the chip socket with a greatly reduced risk of damage.

[0055] Probe assembly 150 may have spacers for properly positioning a
sense plate of the probe near compliant members, which are generally
referred to as "pins," of component 110. These "pins" are designed to
make contact with pads on a semiconductor chip when it is inserted into
component 110, but are fragile and easily damaged. The spacers may have
any suitable shape and may be positioned such that probe assembly
contacts a housing of component 110 and/or a surface of the circuit
assembly's substrate 130 to prevent the probe assembly from contacting
the pins as the probe assembly is brought closer to component 110. In
some embodiments, the spacers may be adjustable such that the gap between
the sense plate of probe assembly 150 and the pins may be increased or
decreased. For example, screws may be used to fine tune the configuration
of the spacers.

[0056] Turning now to FIG. 1B, a top view of component 110 is illustrated,
which may be beneficially tested as described herein. Here component 110
is a land grid array (LGA) socket. An LGA socket is one type of component
110 that may be connected to circuit assembly 120 and tested using a low
capacitance probe assembly. The socket allows a microchip to be seated on
a circuit assembly such that the microchip may be mechanically removed. A
housing 111 provides mechanical support for pins 116 and the microchip.
Housing 111 may have a side wall that acts as a "lip" that extends above
the surface of pins 116. The lip may completely or partially circumscribe
pins 116 forming a cavity with pins 116 positioned at the cavity's floor.
Though, housing 111 may be formed in any suitable way. For example,
housing 111 may have raised portions within the interior surface of
component 110.

[0057] At least some of pins 116 of component 110 are intended to be
connected to signal paths on circuit assembly 120 (FIG. 1A). Any suitable
type or combination of types of pins may be used as part of component
110. For example, pins 116 may be male, female, hermaphroditic,
zero-insertion-force (ZIF), or any other type of interface for forming an
electrical connection. In some embodiments, a lever or other mechanical
structure (not shown) is provided with component 110 to securely fasten
and release the inserted microchip. Pins 116 may be shaped for electrical
connection to the signal paths on a circuit assembly in any suitable way,
for example, by soldering. In the embodiment illustrated, the solder ball
attachment is used, though it should be appreciated that this form of
attachment is illustrative and other forms of attachment may be used.

[0058] In the illustrated embodiment, component 110 has a region 114
devoid of pins 116. Such a feature is common in LGA sockets. Region 114
may be a center region of component 110 and may be completely surrounded
by pins 116 as shown. Though, component 110 may be populated by pins 116
in any suitable way.

[0059] As noted above, a spacer to provide a controlled separation between
a probe assembly and the pins of a component may be incorporated into the
probe, the component and/or the circuit assembly. Accordingly, component
110 may include spacers (not shown) for limiting insertion of a probe
assembly into a cavity formed within component 110. The spacers may be
positioned to restrict the probe from further encroaching on the surface
of pins 116 when the sense plate of the probe is a predetermined distance
from pins 116. Though not shown in FIG. 1B, a component may also be
shaped to assist in laterally aligning a probe over of pins 116.

[0060] Though component 110 is illustrated as an LGA socket in FIG. 1B, it
should be appreciated that component 110 may be any suitable type of
component that provides pins on the surface of circuit assembly 120.
Component 110 may be, for example and not limitation, a socket, an LGA
socket, a connector, or any other suitable type of component.

[0061] FIG. 1C illustrates in cross-section a view of a portion of test
setup 100. As illustrated, circuit assembly 120 may be held in place on a
fixture 190 by positioning pins 192. On circuit assembly 120, pins 116 of
component 110 are connected to circuit assembly substrate 130 at
connection points 115. Connection points 115 may be solder joints or any
other suitable type of connection for establishing electrical
conductivity between pins 116 and the signal paths (not shown) formed on
or in substrate 130. Connection points 115 may also provide mechanical
support for component 110. Though, in some embodiments additional
mechanical supports may also be used to further secure housing 111
directly to substrate 130.

[0062] Housing 111 of component 110 may have a lip 112 bounding a cavity
within which pins 116 reside. Lip 112 may circumscribe the perimeter of
component 110 or may be formed only at certain portions of housing 111.

[0063] FIG. 1C also illustrates a probe assembly 150 according to some
embodiments. Probe assembly 150 is connected to fixture over-clamp 193.
In the embodiment illustrated, probe assembly 150 includes a probe or
probe head formed by a sense plate 151 separated by a dielectric 152 from
a guard plate 153. Sense plate 151 and guard plate 153 may be
substantially parallel with one another. Sense plate 151 and guard plate
153 may be made of any suitable highly conductive material, such as
copper, gold, alloys, other metals or suitably conductive materials. Both
sense plate 151 and guard plate 153 may be coupled by wires or other
suitable conductors to a test system, such as test system 160 (FIG. 1A).
Guard plate 153 may be grounded to aid in isolating the test environment
between sense plate 151 and pins 116 from external electrical signals
that could disrupt measurement of a signal coupled between pins 116 and
sense plate 151.

[0064] Guard plate 153 and sense plate 151 are separated by a dielectric
152. Dielectric 152 is preferably a dielectric having low losses at least
in the frequency range used for testing. Suitable dielectrics include,
for example and not limitation, polytetrafluoroethylene (PTFE),
polycarbonate and polyethylene, though any suitable dielectric may be
used.

[0065] When fixture over-clamp 193 is lowered in direction 198 to position
probe assembly 150 for testing, a gap between pins 116 and sense plate
151 is achieved through the interaction of features on probe assembly 150
with features on housing 111 of component 110. In the example illustrated
in FIG. 1C, spacer 155 is provided on probe assembly 150 to allow sense
plate 151 of probe assembly 150 to come in close proximity to, but not
contact, pins 116. In the embodiment illustrated, spacer 155 is designed
to engage lip 112 on the housing 111 of component 110.

[0066] Specifically, when spacer 155 is fully engaged with circuit
assembly 120, sense plate 151 is precluded from contacting pins 116.
Sense plate 151 and pins 116 are separated by a gap of a predetermined
distance 199. In some embodiments, distance 199 of the gap in some
embodiments may be less than 20 mils (1 mil= 1/1000 inch=0.0254 mm). In
other embodiments, distance 199 of the gap in some embodiments may be
less than 40 mils. In some other embodiments, distance 199 of the gap may
be between 10 mils and 20 mils. In yet some other embodiments, distance
199 is between 10 mils and 100 mils. Though, spacer 155 may be configured
for any suitable gap width.

[0067] Spacer 155 is embodied as collar spacers in the illustration shown
in FIG. 1C, though any suitable type of spacer may be used. Example
configurations of spacer 155 according to some embodiments are described
with reference to FIGS. 2A-9E, below. Though, those of skill in the art
will appreciate that spacer 155 may take any suitable form.

[0068] FIGS. 2A-2B illustrate in cross-section a portion of test setup 100
at different stages of positioning probe assembly 150 using a spacer
according to some embodiments. In the embodiment illustrated in FIGS.
2A-2B, the spacer is embodied as collar spacers 155A. FIG. 2A illustrates
probe assembly 150 and circuit assembly 120 when the fixture over-clamp
(not shown) is in a raised position. FIG. 2B illustrates probe assembly
150 and circuit assembly 120 when the fixture over-clamp is in a lowered
position. In the lowered position, probe assembly 150 is partially
inserted into a cavity formed within component 110. The collar spacers
155A contact surfaces 197 of housing 111 when sense plate 151 is distance
199 from pins 116. When probe assembly 150 is in the fully engaged
position shown in FIG. 2B, capacitive testing of pins 116 may be
performed.

[0069] Collar spacers 155A may be configured to fully engage circuit
assembly 120 when sense plate 151 is at any desired distance 199 from
pins 116. For example, while collar spacers 155A are shown flat in the
illustrated embodiment, "L" shaped collar spacers may be used to permit
sense plate 151 to be positioned closer or further away from pins 116. In
some embodiments, a screw or other suitable adjustment mechanism may be
used to adjust distance 199. For example, a screw may control the
position of collar spacers 155A relative to sense plate 151 in a
direction perpendicular to the surface of sense plate 151.

[0070] Though collar spacers 155A are shown connected to guard plate 153,
collar spacers 155A may be integrated into probe assembly 150 in any
suitable way. Collar spacers 155A may be positioned along the entire
perimeter of probe assembly 150, along select portions of the perimeter,
or at any suitable portion of probe assembly 150. For example, collar
spacers 155A may be located at a few discrete portions of the perimeter
of probe assembly 150 such as at corners, spaced along the perimeter, or
on the underside of probe assembly 150. Collar spacers 155A are provided
at enough locations to ensure that when probe assembly 150 is fully
engaged the probe head is seated in a stable position. For example,
spacers may be provided at at least three points around the perimeter of
the probe to ensure stability.

[0071] FIGS. 3A-3B illustrate in cross-section a portion of test setup 100
at different stages of positioning probe assembly 150 according to some
other embodiments. Here the spacer is embodied as collar spacers 155B
which are configured to engage surfaces 196 of substrate 130 instead of
or in addition to surfaces 197 of housing 111.

[0072] FIGS. 4A-4B illustrate in cross-sections a portion of test setup
100 at different stages of positioning probe assembly 150 according to
some other embodiments. The spacer is again embodied as collar spacers
155B, though here collar spacers 155B only contacts surface 196 of
substrate 130 when fully engaged. While in this example housing 111 is
shown without a lip, housing 111 may have a lip portion even though
collar spacers 155B only engages surface 196 of substrate 130.

[0073] FIGS. 2A-4B have illustrated several embodiments of test setup 100
where the spacer is is part of a probe assembly. It should be appreciated
that a spacer may engage any suitable combination of portions of
component 110 and substrate 130. Different types of spacers may be used
in conjunction with test setup 100 in any suitable way. While probe
assembly 150 has been depicted as moving straight down in direction 198,
it should be appreciated that movement to engage probe assembly 150 with
circuit assembly 120 may take any suitable form. For example, probe
assembly 150 may be attached to a hinged fixture over-clamp. Thus, probe
assembly may move closer to component 110 in an arc or along any suitable
path. It should be appreciated that probe assembly 150 need not move in
an absolute sense. Rather, relative motion between the probe assembly 150
and component 110 can achieve the desired position of probe assembly 150
and component 110, even if such relative motion is achieved by motion of
the circuit assembly relative to probe assembly 150.

[0074] Turning now to FIGS. 5A-5B, a cross-section of a portion of test
setup 100 is illustrated where the spacer is embodied in the form of
risers 155C. Risers 155C are positioned to extend below the surface of
sense plate 151. The riser may be positioned along the entire perimeter
of probe assembly 150, along select portions of the perimeter such as at
the corners, spaced along the perimeter, on the underside of probe
assembly 150, or at any suitable portion of probe assembly 150. Risers
155C may be positioned to contact any suitable surface. In this example,
the risers are positioned to contact a surface 195 of component 110
devoid of pins 116. Surface 195, for example, could be around the
perimeter of component 110 or in the center region of an LGA socket, such
a region 114 (FIG. 1B).

[0075] FIGS. 6A-6B show in cross-section a configuration similar to that
shown in FIGS. 5A-5B. Here however, housing 111 of component 110 does not
have a lip.

[0076] FIGS. 7A-7B illustrate in cross-section a portion of test setup 100
where the spacer is configured as part of component 110. Specifically,
the spacer is embodied as housing spacers 155D which is formed as part of
housing 111 of component 110. Housing spacers 155D are configured and
arranged to prevent probe assembly 150 from contacting pins 116 when the
probe assembly is inserted into the cavity of component 110. When probe
assembly 150 is positioned for measuring, surfaces 194 contact a surface
of probe assembly 150. Surface 194 may be positioned to extend above the
upper surfaces of pins 116 by an amount that may be on the order of
distance 199 (FIG. 2B). Though housing spacers 155D are shown along the
perimeter of the cavity formed in component 110, housing spacers 155D may
be configured as part of housing 111 in any suitable location.

[0077] FIGS. 2A-7B have illustrated embodiments of test setup 100 using a
spacer to vertically (e.g. perpendicular to the surface of the circuit
assembly) position probe assembly 150 with respect to pins 116 of
component 110. Lateral (e.g. parallel to the surface of the circuit
assembly) positioning of probe assembly 150 may be controlled to ensure
that probe assembly 150 appropriately fits within a cavity of a component
housing and that spacers appropriately engage to establish a vertical
position. Any suitable technique may be used to laterally position probe
assembly 150 relative to a component containing a pin under test. In some
embodiments, lateral alignment may be achieved based on the shape of the
spacer either alone or in combination with a compliant mechanism on probe
assembly 150 that allows the lateral and/or vertical position of the
probe assembly to be controlled by features on the probe assembly, a
component and/or other parts of the circuit assembly.

[0078] Turning to FIG. 8A, probe assembly 150 is shown to be mounted to
over-clamp 193 through a compliance subassembly 156. Compliance
subassembly 156 allows for lateral and vertical movement of the probe
with respect to fixture over-clamp 193. In some embodiments, compliance
subassembly may additionally permit probe assembly 150 to rotate and/or
tilt or move in other dimensions such that positioning of the probe
assembly relative to a component under test is determined by alignment
features.

[0079] Compliance subassembly 156, in combination with guiding features
that guide the probe assembly 150 into a desired position relative to a
component to be tested, allows the positioning accuracy of the probe to
be lower than the accuracy required to properly position the probe with
respect to the pins of a component to be tested.

[0080] In the embodiment illustrated, compliance subassembly 156 uses
springs 163 to allow compliant motion. Here, compliance subassembly 156
is shown schematically to include a first member 164 rigidly coupled to
over-clamp 193 and a second member 165 rigidly coupled to probe assembly
150. First member 164 and second member 165 are shown to be compliantly
coupled through springs 163.

[0081] Other forms of compliant couplings may be used instead of or in
addition to springs. Such compliant couplings may be formed from
stretchable, bendable, or compressible materials, or any suitable
complaint mechanism or combination of mechanisms. Though not shown for
simplicity, compliance subassembly 156 may include other components, such
as fasteners to connect it to over-clamp 193, or members that limit the
range of compliant motion of probe assembly 150.

[0082] Compliance subassembly 156 may have different movement properties
in the lateral direction than in the vertical direction and those
movement properties need not be linear. For example, compliance
subassembly 156 may more easily allow lateral movement than vertical
movement. By allowing lateral movement with little resistance, compliance
subassembly 156 may prevent the head of probe assembly 150 from getting
"stuck" before spacers 155E are fully engaged and probe assembly 150 is
properly positioned for testing component 110. On the other hand, a firm
response to vertical pressure ensures that the spacers are fully engaged
and the desired gap of distance 199 has been achieved.

[0083] In some embodiments, compliance subassembly 156 may permit vertical
movement up to about 400 mils. Lateral movement of about 50 mils in any
lateral direction may also be permitted. In various embodiments,
compliance subassembly 156 allows movement in the vertical direction of
at least 25, 50, 100, 200, 400 or 600 mils. In various embodiments,
compliance subassembly 156 may allow movement in the lateral direction of
at least 5, 10, 25, 50 or 100 mils. In some embodiments, compliance
subassembly 156 returns probe assembly 150 to a neutral position when
fixture over-clamp 193 is in the raised position.

[0084]FIG. 8A also provides an example of a spacer including guiding
features that may be used to position a probe assembly. Guiding features
may be implemented by appropriately shaping the surfaces contacted
between probe assembly 150 and component 110 (and/or circuit assembly
120) when fixture over-clamp 193 is lowered to the test position. These
surfaces may be beveled and/or tapered to guide probe assembly 150 to the
desired measurement position. Though, surfaces of any suitable shape and
position may be used.

[0085] FIGS. 8A-8C illustrate positioning of a probe assembly in an
embodiment in which the spacer is embodied as beveled spacers 155E.
Beveled spacers 155E include a beveled surface 188 positioned to engage a
surface 187 with a complementary bevel on housing 111 of component 110.
Interaction of beveled surfaces 187 and 188 may guide probe assembly 150
into alignment with pins 116 of component 110. As probe assembly 150 is
lowered in direction 198, the guiding features, here the beveled surfaces
187 and 188 interact to provide alignment.

[0086] The length of the beveled surfaces of may be selected to ensure
that the maximum misalignment between probe assembly 150 and component
110 is accommodated. The maximum misalignment may be characteristic of
the positioning accuracy of the fixture to which probe assembly 150 and
circuit assembly 120 are attached. Misalignment of component 110 on
circuit assembly 120 may also be a factor. The length of the beveled
surface on probe assembly 150 and beveled surface on component 110 should
be chosen to ensure the initial contact between the two is at the beveled
surfaces. The surfaces are beveled with a steepness that ensures the
friction between the contacted surfaces of probe assembly 150 and
component 110 and the friction in compliance subassembly 156 is overcome.
This allows probe assembly 150 to be properly laterally aligned with
component 110 without getting stuck. A shallow bevel may be possible when
there is low friction between the surfaces and within compliance
subassembly 156. A steeper bevel relaxes the need for low friction, but
may require component 110 have greater height. In some embodiments, the
surfaces are beveled at an angle 183 have a value of at least 10 30
degrees. Though, in other embodiments, the angle may be at least 20 or 30
degrees. In yet other embodiments, the surfaces will be beveled at an
angle of about 45 degrees +/-5 degrees.

[0087] Compliance subassembly 156 allows probe assembly 150 to shift
laterally to be properly aligned with pins 116 of component 110. As shown
in FIG. 8A, probe assembly 150 may be attached to over-clamp 193 so that
it is not initially aligned with its desired position relative to
component 110. As illustrated in FIG. 8B, as probe assembly 150 moves
towards component 110, such as may occur when over-clamp 193 is closed to
test a circuit assembly, the beveled surfaces will engage and, through a
camming action associated with the motion of probe assembly 150 in
direction 198, probe assembly 150 will move in direction 189. Motion in
direction 189 is possible because compliance subassembly 156 provides
enough compliance such that probe assembly shifts a distance 191 to
properly align sense plate 151 with pins 116. As illustrated in FIG. 8c,
the position of probe assembly 150 for testing is determined by the
alignment features and spacers rather than the point of attachment of
probe assembly to over-clamp 193.

[0088] Those of skill in the art will appreciate that probe assembly 150
and component 110 may be vertically and laterally aligned for test
measurements using a spacer and guiding features of any suitable
configuration. FIGS. 8A-8C illustrated an embodiment of test setup 100
with beveled spacers to facilitate alignment. Alternatively, beveled
surfaces may be integrated into only one of probe assembly 150 and
component 110 or alternatively or additionally into a surface of a
circuit assembly. Moreover, it is not a requirement that the guiding
features be beveled surfaces. Guiding features may be implemented using
curved surfaces, conical surfaces, or surfaces of any other suitable
shape. FIGS. 9A-9E illustrate further examples of embodiments with
guiding features of different shapes and positions. FIGS. 9A-9E do not
illustrate a compliant mounting.

[0089] However, the probe assemblies illustrated in these embodiments may
similarly be used with a compliant mounting mechanism.

[0090] FIG. 9A illustrates in cross-section an embodiment where probe
assembly 150 includes wing spacers 155F which are beveled "wings" for
aligning the probe with a component 110 having a lip portion 112 (see
FIG. 3A). Wing spacers 155F may extend beyond lip portion 112 such that
each of the beveled wings, as probe assembly 150 moves towards a
component under test, will contact a portion of lip 112, even if probe
assembly 150 is not vertically aligned with the component. As probe
assembly 150 moves closer to the component, the beveled surfaces 186 of
wing spacers 155F will slide along the upper portions of lip 112,
generating a vertical force that moves probe assembly 150 into proper
alignment for a sense plate on the probe assembly to appropriately enter
a cavity of the component. In this embodiment, the beveled wings also act
as spacers, preventing the sense plate from contacting pins within the
cavity once the probe assembly is partially inserted into the cavity.
Because the vertical force will position probe assembly 150 with straight
surfaces 185 contacting the upper surfaces of lip portion 112, wing
spacers 155F can provide the same spacing as is illustrated in FIG. 2B.

[0091]FIG. 9B illustrates another embodiment where probe assembly 150
includes spacers 155G which include a number of beveled and tapered
surfaces that act as guiding features. In some embodiments, the housing
of a component (not shown) may be adapted to receive probe assembly 150,
as shown in FIG. 9B, such that when probe assembly 150 is fully engaged
with the component, the probe's sense plate is properly aligned and
spaced with respect to the pins in the component.

[0092]FIG. 9c illustrates in cross-section another embodiment of probe
assembly and component 110. Here, tapered spears 155H in probe assembly
150 and conical holes in housing 111 serve and as guiding features and
spacers for vertically and laterally aligning probe assembly 150 with
component 110. Similar considerations as were made in choosing the width
and slope of a beveled edges may be used in selecting the width and slope
of the taper. For example, the slope of the taper should be steep enough
to overcome friction between the tapered piece, the surface which it
contacts, and the internal friction of the compliance assembly.

[0093]FIG. 9D illustrates in cross-section yet another embodiment where
guiding features and spacers are used to achieve lateral alignment and
vertical alignment. Here spacers 155J have tapered spears which are used
to provide lateral alignment and a collar ensure proper vertical
alignment of probe assembly 150.

[0094]FIG. 9E illustrates in cross-section a further example embodiment
where holes drilled in substrate 130 are used to align probe assembly 150
with component 110. Here spacers 155K have a spear portion that provides
lateral alignment with the holes in substrate 130 and a riser portion
that contacts the surface of component 110 holding the sense plate the
desired distance from the pins.

[0095] Use of spacers and/or guiding features for achieving lateral and/or
vertical positioning of a probe assembly in close proximity to pins of a
component may increase the strength of a signal coupled to a sense plate
of the probe assembly. Consequently, more accurate testing may be
performed. Another approach from improving testing accuracy is to provide
a low-capacitance probe. These techniques may be used alone or in
combination.

[0096] FIG. 10A illustrates a cross section of a portion of a probe
assembly 150. As illustrated, probe assembly 150 may further include a
probe amplifier 154 electrically connected to sense plate 151. Probe
amplifier 154 may be of any suitable design configured to amplify the
response signal voltage detected on sense plate 151. In some embodiments,
probe amplifier 154 is a differential amplifier with a first terminal
electrically connected by a first electrical lead to guard plate 153 and
with a second terminal electrically connected by a second electrical lead
to sense plate 151. For example, probe amplifier 154 may be an
operational amplifier. Though any suitable amplifier may be used. In some
embodiments, probe amplifier 154 may be augmented with a filter or
designed to filter the response signal. The filter characteristics may be
determined, for example, in accordance with the tests being performed or
test signals being used.

[0097] Sense plate 151 and guard plate 153 are capacitively coupled to
each other through dielectric 152. The amplitude of the signal coupled to
sense plate 151 from a pin under test may depend on the capacitance
between sense plate 151 and guard plate 153. In some embodiments, it may
be desirable to reduce the capacitance between sense plate 151 and guard
plate 153 to provide a low capacitance probe.

[0098] A low capacitance probe may be provided in any suitable way.
According to some embodiments, a low capacitance between the sense and
guard plates is achieved by reducing a total surface area of guard plate
153 by introducing holes in its surface. When compared to a conventional
probe performing the same test, the voltage on sense plate 151 of the low
capacitance probe is larger before amplification by probe amplifier 154.
Accordingly, the response signal measured on a low capacitance probe may
have a superior signal to noise ratio, leading to more accurate testing.
The probe capacitance may also be reduced by increasing the thickness of
dielectric 152 and/or using a low-κ dielectric material.

[0099] FIG. 10B-10C show a top view of guard plate 153 and a top view of
sense plate 151, respectively. Sense plate 151 and guard plate 153 may
have any suitable shape, but in the embodiments illustrated are
substantially planar structures. According to some embodiments, guard
plate 153 has a plurality of holes 157 reducing the overall surface area
of guard plate 153 (FIG. 10B). Holes 157 may be formed in guard plate 153
in any suitable way and may be sized and positioned to reduce the
capacitance between sense plate 151 and guard plate 153. In the example
illustrated, circular holes are formed using known printed circuit board
manufacturing techniques to remove conductive material from guard plate
153.

[0100] It should be appreciated that the holes need not be filled with
air. Any suitable approach that reduces the amount of conductive material
at the surface of the guard plate 153 facing sense plate 151 may be used
to form the holes. For example, the holes may be formed by removing
material, embossing the plate to move conductive material away from the
surface, reducing the thickness of conductive material, or reducing the
conductance of conductive material. Any of these techniques to create
holes may be achieved by removing or changing material once in the form
of a plate or by depositing or otherwise selectively depositing or
otherwise positioning material over only selected portions of a region.

[0101] In some embodiments, guard plate 153 is separated from sense plate
151 by a distance, d, and each of holes 157 has a diameter greater than
d. For example, the holes may be circles with a diameter that is at least
equal to the dielectric thickness 184. In some embodiments, the diameter
may be 3 to 4 times the thickness. In yet some other embodiments, the
diameter may be about 10 times the thickness. Though, the holes may have
other shapes than circles. In some embodiments, whether or not the holes
are circular, each hole 157 occupies an area of at least π(n
d/2)2, where n may be, for example, 1, 3, 4, or 10. For example, in
one embodiment dielectric 152 has a thickness of about 50 mils and guard
plate 153 has a plurality of circular holes each having a diameter of
about 100 mils. In some embodiments, dielectric 152 has a thickness
between 25 mils and 150 mils and the guard plate has holes each with a
surface area in the range of 0.00049 to 0.0177 square inches (in2).

[0102] Alternatively or additionally, capacitance may be reduced by
removing a portion 158 from guard plate 153 when probe assembly 150 is
configured to test components having a center portion without pins. For
example, many LGA socket designs have such a center (see FIG. 1B).
Accordingly, guard plate 153 may have a removed portion in its center
region corresponding to the location in such a socket that is devoid of
pins. A portion 159 may similarly be removed from sense plate 151 as
shown in FIG. 10C. This removed portion may also correspond to a location
in an LGA socket which is devoid of pins. In various embodiments,
portions 158 and 159 may each have a surface area of about 0.1, 0.25,
0.5, or 0.75 in2, though, in some embodiments the area may be
greater or smaller. For example, in one embodiment portions 158 and 159
may each have dimensions of about 0.6 in.×0.8 in. (0.48 in2).

[0103] FIGS. 11A-11B illustrate some additional embodiments of guard
electrode 153 useful in a low capacitance probe. In FIG. 11A guard
electrode 153 has holes 157 aligned vertically and horizontally in rows.
As shown, the rows maybe parallel with one another and each row may
include a plurality of holes 157. Holes 157 have a maximum dimension, D,
and have an edge-to-edge spacing between adjacent member of a distance,
S. In some embodiments, D is in the range of 70 mils (1.8 mm) to 130 mils
(3.3 mm) and S is in the range of 27 mils (0.7 mm) to 33 mils (0.8 mm) In
some embodiments, D is in the range of 50 to 100 mils and S is in the
range of 10 to 30 mils. In some embodiments, D is in the range of 100 to
150 mils and S is in the range of 30 to 50 mils. Although any suitable
value of D and S may be used.

[0104] FIG. 11B illustrates another embodiment of guard plate 153. Here
holes 157 are aligned in rows which are staggered. In the example shown,
the center of each of holes 157A, 157B and 157C form 60° angles
with respect to the other two centers. In some embodiments, the rows are
staggered such that an angle is created between a hole in a row and a
nearest pair of holes in an adjacent row. For example, in various
embodiments, the angle may be between 54° and 66°, or
between 58° and 62°, or about 60°.

[0105] While sense plate 151 and guard plate 153 are shown having a square
shape, it should be appreciated that they may take any suitable shape. In
some embodiments, the plates are shaped to conform to a particular
component to be tested.

[0106] It should be appreciated that while circular holes were shown for
guard plate 153 in examples illustrated, the holes may take any shape and
size. For example, the holes could be triangles, squares, diamonds,
ovals, or any other shape or combination of shapes. The holes may be
arranged in a hatched pattern. In some embodiments, holes 157 each have
substantially the same size and shape. Though, in other embodiments,
holes 157 need not be of the same size or shape. For example, holes may
each have an irregular shape and have irregular spacing. Holes 157 may
account for any suitable amount of the surface area of guard plate 153,
as defined by the perimeter of the plate to reduce the capacitance as
compared to a probe without holes 157 to a desired level. For example,
sense plate 151 and guard plate 153 may each have an area defined by
there respective perimeters. In some embodiments, the areas may be at
least or at most 0.15, 0.5, 0.75, 1.0 or 3 in2. In some embodiments,
the holes may account for at least or at most 10 percent of the total
area. Though, in other embodiments, the holes may account for a larger
percentage of the total area, such as at least 25, 40 or 50 percent of
the total area. In some embodiments, the capacitance between sense plate
151 and guard plate 153 is less than 100 picofarads (pF). In some
embodiments, the capacitance is less than 35 pF. In some embodiments, the
capacitance is in the range of 10 to 20 pF.

[0107] Having discussed some embodiments of test setup 100, methods of
testing using test setup 100 and a method of manufacturing probe assembly
150 are briefly discussed with reference to FIGS. 12-14.

[0108] FIG. 12 is a flow chart of a method 200 of testing pins of a
component.

[0109] At step 201, the probe assembly is coarsely aligned with the
circuit assembly. The course alignment should be sufficient to ensure the
alignment features between the probe assembly and circuit assembly are
engaged when brought into contact with one another. Coarsely aligning the
probe and circuit assembly may be performed, for example, placing the
circuit assembly in a test fixture to which the probe is attached.

[0110] At step 202, the probe assembly and a component on the circuit
assembly are moved together while allowing compliant motion based on the
alignment features of the probe and/or circuit assembly. In some
embodiments, the probe and circuit assembly are brought into contact and
the alignment features cause compliant motion of the probe providing
lateral alignment of the probe with pins in the component of the circuit
assembly.

[0111] At step 203, the probe assembly is partially inserted into the
component. The component may have a cavity formed therein to which the
probe is partially inserted. For example, a socket may have a lip portion
that surrounds part or all of the pins in the socket. The probe assembly
is partially inserted into the component when at least a portion of the
probe assembly is within the cavity formed in the component. For example,
the sense plate of the probe assembly may be inserted into the cavity.

[0112] At step 204, insertion of the probe is restricted by a spacer. The
spacer may be formed in any suitable way, for example, the spacer may be
formed as a portion of the probe assembly, a portion of the component, a
portion of the circuit assembly, or any suitable combination of the probe
assembly, the component and the circuit assembly. In some embodiments,
the spacer may comprise alignment features which work in tandem with the
spacer to provider vertical and lateral alignment of the probe assembly
with the component. Insertion is fully restricted by the spacer when a
sense plate of the probe assembly is a predetermined distance from the
pins in the component. Different portions of the spacer may be used to
provide vertical and lateral alignment of the probe assembly with the
component.

[0113] At step 205, a signal coupled to the sense plate of the probe
assembly is measured. The signal may be coupled in response to excitation
of one or more pins under test in the component. The pins under test may
be excited in any suitable way. For example, the pin under test may be
excited in accordance with capacitive opens testing techniques. In some
embodiments, the response signal is suitably amplified and filtered by
the probe assembly.

[0114] Optionally, the measured signal may be analyzed to determine, for
example, if a pin under test is properly connected to the circuit
assembly. For example, the magnitude of the measured signal may be
compared to a threshold determined in a learn phase of testing. The
result of comparing the magnitude with the threshold may be indicated
through any suitable output device.

[0115] At step 206, a determination is made of whether there are any more
tests to perform. For example, further tests may be performed to test
other pins in the component. If another test is to be performed, method
200 returns to step 205 to conduct the subsequent test. If testing is
complete, method 200 ends.

[0116] FIG. 13 shows a flow chart of a method 300 for testing a circuit
assembly using a low capacitance probe assembly.

[0117] At step 301, a test signal is driven on a signal line of the
circuit assembly. The test signal may be supplied by a test system or by
a virtual circuit generator. Any suitable electrical signal may be used
as a test signal.

[0118] At step 303, a response signal coupled to a low capacitance probe
having a guard plate with a plurality of holes is sensed. For example,
the response signal may be coupled to a sense plate of the probe,
amplified and digitized by a test system for analysis. The holes on the
low capacitance probe's guard plate may take any suitable form. In some
embodiments, the holes account for at least 25% of the total surface area
of the guard plate as defined by the area within the perimeter of the
guard plate. In some other embodiments, the holes account for at least
50% of the surface area. In some other embodiments, the total area of the
holes is at least 40% of the surface area of the sense plate as defined
by the area within the perimeter of the sense plate. In yet some other
embodiments, the total area of the holes is at least 50% of the surface
area of the sense plate as defined by the area within the perimeter of
the sense plate. Though, the holes may account for any suitable amount of
guard plate surface area reduction.

[0119] At step 305, a test result is indicated based at least in part on
the response signal measured at step 303.

[0120] At step 307, a determination is made as to whether there are any
more tests to conduct. If the determination is yes, method 300 continues
to step 301. If the determination is no, method 300 continues to step
309.

[0121] At step 309, subsequent steps in the manufacturing process are
selected. The selection of the subsequent steps may be based, for example
on the one or more test results indicated at step 305.

[0122] Methods 200 and 300 may each be used as an intermediary step in a
manufacturing process for circuit assemblies. The measurement and/or test
results collected as a result of performing method 200 and 300 may be
used for each circuit assembly to determine which subsequent steps in the
manufacturing process are to be performed for that circuit assembly. For
example, if all tests performed on the component yielded a positive
result a determination may be made that the component has been properly
installed on the circuit assembly. If some tests have failed, a decision
may be made to conduct subsequent tests, to replace the component, or
take another suitable action. In some embodiments, method 200 is
performed using a low capacitance probe assembly.

[0123] FIG. 14 shows a flow chart of a method 400 for manufacturing a
probe assembly.

[0124] At step 401, a sense plate is affixed to a first surface of a
dielectric substrate. Sense plate may be affixed, for example, by gluing
the plate to the dielectric substrate.

[0125] At step 403, a guard plate having a plurality of holes is formed
and at step 405 the guard plate is affixed to a second surface of the
dielectric substrate. Steps 403 and 405 may be performed in the order
shown, in reverse order or performed simultaneously. For example, a plate
may be glued to the dielectric substrate and then etched or milled with
the desired holes. In another embodiment, the plate is deposited onto the
dielectric substrate in a pattern with a plurality of holes. In yet
another embodiment, holes are formed through a plate which is then
affixed to the dielectric substrate. In some embodiments, the second
surface is a surface substantially parallel to the first surface of the
dielectric substrate. In various embodiments, the guard plate has 10, 20,
50, 75, 100, 150 or 200 or more holes. Though, the guard plate may have
any suitable number of holes.

[0126] At step 407 a first electrical lead is connected from the guard
plate to a first terminal of an amplifier.

[0127] At step 409, a second electrical lead is connected from the sense
plate to a second terminal of the amplifier. In some embodiments, the
second electrical lead is provided to the amplifier through one of the
plurality of holes in the guard plate. More specifically a through hole
through the dielectric substrate and the guard plate may be used to feed
the second electrical lead from the sense plate to the amplifier. In some
embodiments, the lead is passed through a hole in the guard plate
separate from the plurality of holes. The hole the lead is passed through
may be a center removed region of the guard plate corresponding to a
center region without pins as in some LGA socket connectors.

[0128] Having thus described at least one illustrative embodiment of the
invention, various alterations, modifications, and improvements will
readily occur to those skilled in the art. Such alterations,
modifications, and improvements are intended to be within the scope of
the invention. Accordingly, the foregoing description is by way of
example only and is not intended as limiting. The invention is limited
only as defined in the following claims and the equivalents thereto.