Single and double-crystal multilayer microcables for chips with a step of pads 100, 80 and 50 microns;

Connecting cables with length up to 600 mm;

High-voltage cables with an operating voltage up to 5000 V and length up to 300 mm.

The technique of ultrasonic bonding of aluminum - polyimide boards and cables with chips and receivers of radiation are developed.

Innovative Aspect and Main Advantages

Ours aluminum - polyimide microcables and boards (thickness of polyimide: 10-20 microns and thickness of aluminum: 14- 30 microns) have successfully exchanged wire mounting in hybrid microassemblies and detector modules. These cables are developed for the advanced microprocessors such as ALICE-128, HAL-25, AMBRA-64, Pascal-64, etc., used in radiation instrumentation technologies having from 64 up to 128 channels of information processing with high-speed performance up to 100 nanosecond / channel. Processes of an ultrasonic bonding of aluminium conductors are compatible to TAB-technique and adapted for application of automated bonding settings such as FK Delvotec-6400, etc.

The high radiation stability of aluminum - polyimide carriers, a wide band of operating temperature from -150oС up to +200oС, stability of electrical performances, flexibility and plasticity allows creating microassemblies with practically any spatial arrangement in volume of detector modules. Thus by one hybrid microassembly can be processed up to 1000 channels with a ratio signal / noise 15. Substitution of heavy metals in switching elements (copper, gold, etc.) on aluminum has allowed to minimize their mass and to lower a background radiation in detector modules.

Areas of Application

In space instrumentation technologies.

For monitoring at customs houses and at the airports.

For experiments in the field of a high-energy physics.

For environment monitoring, including a level detection of radionuclides at the operations of an atomic industry and atomic power stations.

In an industrial and medical tomography.

In geology.

Fig. 1 Microstrip detector module.

Fig. 1 Drift detector module.

Stage of Development

Designed workpieces are tested and accessible to demonstrating. In-situ tests are realized.

The reached technological level matches to the fifth level (TRL) on gradation INTAS (STCU). By results of works it is made three inventors certificate of Ukraine. The small-scale manufacture is mastered. Deliveries are carried out in CERN (Geneva, Switzerland) for experiment ALICE.