Using 'ultrasonic cavitational phenomenon' the oxidised
layers on the surface are simply removed and cleaned. This means that the use of any 'flux' is no longer required. In combination with the special
active soldering compound CERASOLZER, soldering on glass, ceramic as well
as 'hard-to-solder metals' such as Aluminum, stainless steel,
Tantalum, metal oxides etc is easy.

An intensified ultrasonic beam generates micro vibrations with a 'brushing
effect', which results in a complete removal of the oxide
layerfor immediate wetting with the
solder alloy on the surface of the
substrate.

With high pressure, the liquid solder is forced efficiently into the
tiny crevices, cracks and micro-pores of the substrate and thereby
seal them and provide a greatly increased surface of solder for
bonding purposes.

Further technical information you will find under 'fields of
applications'.