CoolMOS™ ThinPAK 5x6 Technical Information Part 1 of 5

ThinPAK is a leadless SMD package and especially designed for High Voltage MOSFETs. One of the main features are the very small footprint of 5x6 mm2 and a very low profile with only 1 mm height. Due to the small package size and the low parasitic inductance the package enables faster and thus more efficient switching of Power MOSFETs and is easier to handle in terms of switching behavior and EMI.

CoolMOS™ ThinPAK 5x6 Technical Information Part 2 of 5

ThinPAK is a leadless SMD package and especially designed for High Voltage MOSFETs. One of the main features are the very small footprint of 5x6 mm2 and a very low profile with only 1 mm height. Due to the small package size and the low parasitic inductance the package enables faster and thus more efficient switching of Power MOSFETs and is easier to handle in terms of switching behavior and EMI.

CoolMOS™ ThinPAK 5x6 Technical Information Part 5 of 5

ThinPAK is a leadless SMD package and especially designed for High Voltage MOSFETs. One of the main features are the very small footprint of 5x6 mm2 and a very low profile with only 1 mm height. Due to the small package size and the low parasitic inductance the package enables faster and thus more efficient switching of Power MOSFETs and is easier to handle in terms of switching behavior and EMI.

CoolMOS™ in ThinPAK 5x6

ThinPAK 5x6 is a leadless SMD package especially designed for High Voltage MOSFETs.
This new package has a very small footprint of 5x6mm² and a very low profile with only 1mm height. The package enables faster and more effcient switching of Power MOSFETs and is easier to handle in terms of switching behavior and EMI.