3M and SUSS MicroTec Signs Agreement

3M, a leading supplier of advanced materials to the semiconductor industry,
and SUSS MicroTec, a leading
supplier of semiconductor processing equipment, today announced an agreement
to expand access to 3M Wafer Support System (WSS) equipment for temporary wafer
bonding of ultrathin wafers required for 3-D packaging. As part of this non-exclusive
agreement, SUSS MicroTec becomes an authorized equipment supplier for the 3M
WSS and will manufacture and sell XBC300 and CBC300 wafer bonders configured
to use 3M’s WSS materials including 3M Liquid UV-Curable Adhesive and
Light-To-Heat Conversion coating. Under the agreement, both companies will work
closely to address customer demands for high-performance process solutions that
support high-volume manufacturing with a competitive cost of ownership.

3M WSS uses processes and materials for temporary wafer bonding to support
wafer thinning and processing of ultra thin wafers for 3-D packaging. 3M’s
innovative use of a UV-curable adhesive for wafer bonding to glass carriers
provides robust wafer support throughout wafer grinding. This is particularly
important in the multiple high-temperature cycles required in subsequent wafer
processing steps. After processing, 3M’s unique Light-To-Heat Conversion
layer allows low stress, room temperature debonding of the thinned wafer directly
to the tape carrier. The thinned wafer is supported throughout the entire process
reducing warpage, stress and process complexity compared to other processes
that require high-temperature exposure and stress to the thinned wafer, or solvents
to release the temporary bonding material. 3M’s WSS enables wafer processing
currently in high-volume production at multiple semiconductor sites worldwide.

“SUSS MicroTec is a recognized leader in wafer bonding and applications
for 3-D and MEMS markets. Working with an industry leader, like SUSS, allows
3M to focus on advanced materials development. The joint efforts of both companies
provide 3M customers with improved support, lower overall costs and faster access
to more advanced solutions for their demanding 3-D packaging requirements,”
commented Mike Bowman, marketing development manager for 3M Electronics Markets
Materials Division.

“We are pleased to collaborate with a leading material expert like 3M
to offer customers a leading edge temporary bonding process with superior performance
compared to current materials and processes on the market,” said Wilfried
Bair, general manager, Wafer Bonder Division, SUSS MicroTec. “This relationship
and process offering fits nicely with SUSS MicroTec’s 3-D strategy to
provide a flexible and modular bonding platform that can be configured to meet
customers’ needs.”

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