Understanding Low Outgassing Adhesives

Engineers often want to know whether an adhesive is low outgassing or generic. And while there are cases when nothing but a low outgassing product will do, the truth is that many so-called generic adhesives inherently have low outgassing levels. What's more, most bonding, potting, encapsulation and sealing applications don't need to meet a defined outgassing specification. Here's a guide to understanding when low outgassing adhesives are the right choice.

More White Papers / Tech Papers by Master Bond Inc.

Die attach adhesives serve a critical role in semiconductor assembly and throughout the product lifecycle. Beyond their ability to form a tight bond between die and various substrates, these adhesives help minimize the impact of mechanical and the…

Thermal cycling can create stresses on bonded parts that fluctuate vastly between different temperatures, from extreme cold to extreme heat, during regular intervals or on an intermittent basis. Adhesives have a proven track record for thermal applic…

Polyethylene, polypropylene and related polyolefin blends and alloys have a reputation for being difficult to bond with conventional adhesives. However, advances in adhesive chemistry have made it possible to bond polyolefins effectively without the…

With adhesive products, high performance and rigidity are often thought to go hand in hand. And it is true that the very best strength, thermal, chemical and electrical properties tend to be found in rigid compounds, especially epoxies. Yet there is…

As electronic circuits become more complex, engineers are finding new ways to assemble and package them. Electrically conductive adhesives provide durable bonds with conductive paths to suit a variety of electronics applications. They can be engineer…

Fast cure adhesives are a great way to reduce assembly costs, but engineers would be wise to question the need for speed when selecting adhesives. In this white paper, Master Bond provides an overview of the different types of fast cure adhesives, in…

UV curable adhesives are among the most user friendly adhesive products on the market today—if you know how to apply them. We invite you to take a closer look at the capabilities of UV curable formulations, the requirements for an optimal cure…

What are the factors to consider when you need to maximize adhesive bonding performance? In this white paper, Master Bond explores the different joint designs, surface preparations, polymer types and performance properties to consider when using stru…

Selecting the right adhesive product for extreme temperature applications may seem as straightforward as reading temperature resistance values on data sheets. Some engineers will sometimes address temperature issues by simply selecting an adhesive ra…

Through heat dissipation, thermally conductive adhesives and potting compounds play a pivotal role in the protection of today’s electronic circuitry. In tandem with the great growth of the technological sector comes the need for a new generatio…

Modern adhesives offer medical device engineers a leg up with new options to simplify fastening and improve performance as medical devices and materials continue to advance. When faced with often hostile environments of human bodies and hospitals, mo…

One of the most effective approaches to prevent and inhibit corrosion of metals is to create a protective barrier over the component. This is most easily achieved with the use of a coating compound. Coatings protect against corrosion, moisture and ot…

The use and selection process of thermally conductive epoxies can make or break your application. Too much heat can lead to component malfunction or premature component failure while the inability to stay below specified temperature limits may result…

Remarkable silicones. The combination of their unique ability to maintain physical properties across a wide range of temperature, humidity, and frequency--combined with their flexibility--set them apart. Silicone based adhesives, sealants, potting an…

Potting compounds play a vital role in the assembly and long term protection of delicate electronic components. The design tips in this paper will help you navigate the more common dilemmas associated with the selection and application of epoxy potti…

Glob top encapsulations are often preferred for their ability to protect chips without damaging fragile wires. They are formulated to exhibit specific physical properties such as electrical insulation, resistance to moisture and chemicals and thermal…

Whereas once mechanical fasteners may have been the assembly option of choice, tremendous strides in polymer chemistry over the past few decades have made epoxy resins technically and economically superior. In this white paper, we explore the various…

Many of today’s intricate electronic assemblies are highly sensitive to the effects of temperature excursions, shock and vibration. An effective design strategy for managing thermal stress is to use stress absorbing materials to bond and encaps…

As technology in the optics industry continues to advance and improve, careful consideration of the properties of epoxies must be evaluated. When determining the most effective adhesive to be used in opto-electronics, medical and other optic related…

The development of epoxy based underfill encapsulants marked a turning point for flip chip technology, and the semiconductor industry. Underfill encapsulants are carefully formulated to ensure flowability, an acceptable CTE, and other desirable prope…

Breakthroughs in adhesive technology enable light curing adhesives to cure under a visible light wavelength of 405 nanometers. Learn how these environmentally friendly adhesives can improve worker safety and lower production costs while offering a ra…

Selecting the right adhesive is a balancing act as engineers attempt to find products that meet conflicting end-use and manufacturability requirements. Medical device engineers also have to contend with a strict regulatory environment, and therefore…

Silicone adhesive systems have several important performance characteristics that distinguish them from other adhesive families. Learn more about their unique combination of flexibility, high temperature resistance, and more specialized engineering p…

To understand one part epoxy systems, you need to know how a two part system works. In this white paper, we explore how a one part system is constructed, how it can and should be used, and how it can be modified to achieve a variety of performance pr…

The combination of increasingly complex assemblies and exacting quality requirements is compelling design engineers to be extremely diligent when selecting materials for the assembly of medical electronic devices.In this white paper, we explore vario…

This article provides an overview of the oil and gas industry, from the extraction to its processing, and how epoxies play a vital role in the equipment and devices used in these pursuits. Properties exhibited by epoxy adhesives stand up to the hosti…

Modern electronics have become part of our daily lives and the sophisticated electronic circuitry at the heart of these devices and systems must be reliable. Conformal coatings act as a barrier between the electronics and the environment, protecting…

Achieving good adhesion not only depends on selecting the right adhesive, but also on implementing the best surface preparation techniques. Regardless of the substrate, proper surface preparation always plays an essential role in achieving strong bon…

Gain a better understanding about glass transition temperature (Tg) and why it is one of many factors to consider for bonding, sealing, coating and encapsulation applications. In this paper, we explore how temperature impacts the performance of polym…

Dielectric constant, dissipation factor, dielectric strength, surface and volume resistivity are all fundamental electrical properties of epoxies. How they are measured, what values are desirable and how they react to changes in temperature, fillers…

With the trend toward smaller and smaller electronic devices, unintentional EMI/RFI interference has become more of an issue. Shielding of these interferences is critical and coatings can be successfully applied as protection on the materials used. I…

The unique requirements of microelectromechanical systems (MEMS) call for specialized materials. Versatile epoxy adhesives are often capable of providing the necessary properties to ensure support and protection from thermal and mechanical shock, vib…

As advances in epoxy and silicone materials constantly evolve, manufacturers of advanced electronic systems will find that adhesives offer the ability to meet nearly any combination of requirements for thermal, environmental, and structural stability…

Potting compounds offer superior protection for electronic circuits potting and encapsulation compounds are designed to completely enclose a component, module or PCB. This effectively shields the unit from its surroundings while providing structural…

06.26.17

More Content From Master Bond Inc.

Learn how to minimize the development of bubbles when mixing a two part epoxy system and how to most effectively remove bubbles if they are already present in your mixed material.
To learn more visit: www.masterbond.com…

Master Bond epoxy adhesives are freshly prepared to maximize shelf life. The date of manufacture is clearly shown on each label. Technical datasheets include storage directions and shelf life for every product. If not stored properly, the product…

Master Bond UV22DC80-1Med is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. Not only does it pass USP Class VI Tests for biocompatibility, but it also meets ISO 10993-5 for cytotoxicity, making it ideal fo…

Select Master Bond adhesives have been engineered to retain mechanical strength properties after prolonged exposure to elevated temperatures. This strength retention was recently demonstrated in a study performed by Master Bond involving several s…

EP30NG is ideal for bonding flat surfaces or where contact pressure can be applied. Although the compound is graphene filled, the minimum bond line thickness is 0.18mm since, by nature, when graphene nanoparticles align they agglomerate to form par…

Product: EP62-1LPSPMed
Formulated for medical electronic applications, Master Bond EP62-1LPSPMed is a biocompatible two part epoxy that has a mixed viscosity of 150-300 cps. Its ultra low viscosity makes it ideal for use in underfill, impregnat…

Master Bond EP30NG is a two part epoxy adhesive system developed for applications that require high thermal conductivity. It contains a specialty graphene filler which contributes not only to its high compressive strength, but also to its enhanced…

This video demonstrates the ease of use and impressive properties of Master Bond Supreme 18TC, a one component smooth epoxy paste adhesive. Formulated with a blend of special thermally conductive fillers, this system can be applied in bond lines as t…

This latest session of the Adhesive Academy series explains why going with the flow is not suitable for all applications. High viscosity and non-drip adhesive formulations are often selected for vertical substrates when sagging and flow are not desir…

Join us on a journey through the years, starting in 1976 when Master Bond was founded, until the present. You will discover key milestones for our company and interesting details about advances in adhesive technology. Along the way, we invite you to…

Yes, I would like to learn more about Master Bond Inc., Please contact me by Phone or Email.

Loading, Please Wait..

Cookies help us to provide you with an excellent service. By using our website, you declare yourself in agreement with our use of cookies. You can obtain detailed information about the use of cookies on our website by clicking on "More information”.