ChipConnect Cable Assemblies

TE Connectivity AMP's ChipConnect internal faceplate-to-processor cable assemblies are required for Intel® Omni-Path Architecture (OPA). In the CPU processor, these cable assemblies mate directly with LGA 3647 sockets at the processor and Intel internal faceplate transition (IFT) connectors at the faceplate for 25 Gbps speeds. TE Connectivity AMP is one of two Intel-qualified suppliers offering these first-generation cable assemblies (Intel OPA 100 Series) and they are also a development partner for future generation cable assembly designs with Intel. In addition to these cable assemblies, TE offers the compatible LGA 3647 sockets and hardware required for OPA.

Features and Benefits

Required for the latest Intel CPU processor design, Intel Omni-Path Architecture, by mating directly with LGA 3647 sockets at the processor and IFT connectors at the faceplate

Meet high speed demands with 25 Gbps speeds

Reduce system design costs by eliminating the need for costlier lower-loss PCB materials, such as retimers

Improve loss characteristics and simplify system design by reducing the complexity of PCB laminates and routing

Available in standard lengths and breakout configurations

Customize for specific applications by pairing with other products such as Sliver connectors or STRADA Whisper connectors on the board or faceplate