Function
This machine is designed for milling cavity on ISO card body for different modules, and do the testing, glue tape laying, punching and implanting those chips into the milled cavity.

Features

Features
●This machine is integrated with glue tape laying, milling, dust collection, cleaning, depth detection, sheet bonding, module punching, implanting, and testing.
●Mould stepping is controlled by servo system and the distance can be set directly. The accurate photoelectric sensor monitoring can recognize the mould automatically.
●Optimized fixture design makes the accuracy of milling depth not be affected by card thickness and dimension.
●Milling track can be written according to the model and shape of chips, so it’s easy to change the parameter.
●Separate X,Y-axis working platform solves the problem of the difficulty for modification of milling center.
●Z-axis of milling depth is worked by high precision servo to carry rail and finished by screw rod which can reduce the frequency of tool changing.
●Depth detection device ensures the milling accuracy.
●Film is released by special plane construction and several heading head to solve the problem of high temperature glue. No need to adjust the plane when the bonding heads are changed.
●Chips feed by servo precision combination module and the moving position can be set by parameter directly.
●Hot welding avoids the glue failure by special plane constructure. Several groups of hot welding head can keep the quality of implanting.
●Cards transferred through servo motor to ensure the safety and stability of the machine.
●HMI is easily operated and maintained.
●ATR test system is used to monitor production.
●Special feeding design avoids loading double cards caused by static electricity.
●Special in-feeder & out-feeder magazine auto-transfer system is easier to operation.