ENGENT

General Info:

Engent is a provider of next generation electronic manufacturing, packaging & technology services. We help our clients realize products that require small form factors, as well as high performance packaging for electronics systems which incorporate technologies including System in Package, Flip Chip, MEMS, Die stacking, and 0201 placement to name a few. Engent brings breadth and depth of knowledge about electronics process development and production to both your design team and manufacturing support groups. Working with Engent can shorten your time to market and enable your products to be manufactured at high volumes.