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Abstract

Disclosed is a method for a new thermoset polymer formed by the reaction between azide and alkyne compounds. Benefits include formulations low viscosity and excellent adhesion to a variety of surfaces.

Country

Undisclosed

Language

English (United States)

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This is the abbreviated version, containing approximately
53% of the total text.

Disclosed is a method for a new thermoset polymer formed by
the reaction between azide and alkyne compounds. Benefits include formulations
low viscosity and excellent adhesion to a variety of surfaces.

Background

Current thermoset materials in electronics packaging are
predominantly epoxy-based, with some silicone and bismaleimide materials also
being used; however, future needs for packaging materials indicate that there
will be issues with the integration of epoxy materials into future product
generations. The limitations of epoxies are caused by the flexible and thermo-degradable
structure of the ring-opened glycidyl ether group.

To address future packaging material needs, a higher Tg
thermoset material is needed. Additionally, there is a need for a material that
has a lower viscosity, cures at lower temperatures, and has improved adhesion
to a variety of surfaces.

General Description

The disclosed method uses a thermosetting material based on
the reaction between azide and alkyne compounds. The azides are synthesized
from any appropriate electrophile by a nucleophillic substitution with sodium
azide, or azides of other cations. This chemistry is very adaptable to a
variety of electrophiles and leaving groups. Figure 1 shows examples of the
synthesis of azide compounds for use in these formulations. Example A shows the
addition of the azide ion to the epoxy ring, creating a bis-b-hydroxyazide.
All commercially available epoxy resins and diluents are amenable to this
reaction, including 1,2-disubstituted epoxides (e.g. the cycloaliphatic epoxy
resins). Exam...