Laser cavities are a new technology for creating the smallest and finest deep milling grooves with the use of a laser. Applications that used to be impossible to produce are now possible. Laser cavities that are structured at the base, in particular, offer new possibilities for integrating flip chips into circuit boards.
Foldflex® technology: Innovative solutions with embedded passive components for customized applications.
Miniaturization is also proceeding rapidly in the area of inductive components and increasingly challenges manufacturers to find new solutions.
With Foldflex® technology, Würth Elektronik has developed a new procedure for folding flexible foil structures in order to embed coils with almost any number of layers, high current loading capacity, and low parasitic capacities into circuit boards. Download presentatieJürgen Wolf, Würth Elektronik