David Vye, MWJ Editor

David Vye is responsible for Microwave Journal's editorial content, article review and special industry reporting. Prior to joining the Journal, Mr. Vye was a product-marketing manager with Ansoft Corporation, responsible for high frequency circuit/system design tools and technical marketing communications. He previously worked for Raytheon Research Division and Advanced Device Center as a Sr. Design Engineer, responsible for PHEMT, HBT and MESFET characterization and modeling as well as MMIC design and test. David also worked at M/A-COM's Advanced Semiconductor Operations developing automated test systems and active device modeling methods for GaAs FETs. He is a 1984 graduate of the University of Massachusetts at Dartmouth, with a concentration in microwave engineering.

Recent Comments

With the ever-evolving nature of microwave technology, the education of an engineer is a never-ending process; one in which the suppliers of new technology play an increasingly critical role. From a simple data sheet to a full-length technical article or workshop/webinar presentation, marketers recognize the benefits of getting the right information in front of the right audience. When a product type is well understood and only modest differences exist between vendors, potential customers may only need to know a few details about key specs, costs and delivery. But the complexity of what we do has pushed many of us into the role of educators. Who else but a GaN device manufacturer will explain that a higher part cost will be offset by savings from a reduced bill of materials thanks to cooler operating temperatures and simplified power management?

Our end-users want and need very specific information in order to make smarter decisions. Savvy technology companies are investing in their ability to deliver this information, from tasking engineers to author papers to developing technical content for webinars. We at Microwave Journal understand the benefits that our clients gain from getting more information out into the marketplace. We also believe that face-to-face interaction offers the greatest opportunity to exchange information. And so we are developing an event in which our clients play a leading role in providing the content for an audience that needs specific knowledge concerning relevant cutting-edge technology.

This event, the Electronic Design Innovations Conference (EDI CON), is scheduled to take place in Beijing, China (March 2013). As a means to inform and educate engineers, the Journal will be working very closely with sponsors, exhibitors and academia to fill the speaker slots in the technical sessions and provide guidance as they develop content. Microwave Journal will be promoting the event through our English and Chinese magazines, web sites and dedicated EDI CON newsletter to raise show awareness and promote audience attendance. Event marketing will include promotion of the exhibiting companies, their guest speakers and content to our MWJ/MWJ China databases and via barter agreements with other media sources in China. At this early date, we are pleased to announce media partnerships with Portable Design China and Interference Technology, allowing EDI CON to incorporate relevant content and promote itself to the portable design manufacturer and EMC/EMI test market sectors.

Naturally, the content of the technical program and workshops will drive the show attendance and demographics. The paper/presentation guidelines are aligned with those of Microwave Journal’s editorial, i.e. practical design information, measurement and simulation techniques and system integration. We are aiming to attract the same audience that reads Microwave Journal or attends our webinars. To help ensure high-level technical content, the MWJ editorial staff is assembling a multi-national board of technical experts. So far, approximately thirty technologists representing test & measurement solutions, simulation software and RF/microwave semiconductor companies have joined the EDI CON technical advisory committee. Their responsibilities will be to recommend the topics and speakers that will be most attractive to engineers and managers attending an event in Beijing. As the technical program evolves, we continue to recruit more MMIC and RFIC designers, modelers, materials experts, passive components and antenna designers as well as high speed digital experts.

So far, reactions to the event have been extremely positive with the platinum and gold level sponsorship packages being sold out to leading RF/microwave companies. These sponsors will be conducting solution workshops, participating in the event planning and contributing to the general technical program. Exhibitors are also reserving their spaces and requesting opportunities to present in the technical sessions. In consideration of the audience’s language preference, most of the participating companies have volunteered Chinese-speaking representatives to serve on the technical advisory committee. At the conference, presentations will be offered in Chinese, either directly or through translation. Details on participating in the conference, submitting a paper or exhibiting can be found at www.ediconchina.com. As an industry-driven event, we look forward to hearing your thoughts on building the kind of show your company can best benefit from. Feel free to send me a comment or inquiry at Dvye@mwjournal.com.

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