More Bonds of Sumitomo Mitsui Banking Corp.

About the Sumitomo Mitsui Banking Corp.-Bond (US865622BM56)

The Sumitomo Mitsui Banking Corp.-Bond has a
maturity date of 7/11/2019 and offers a coupon of 2.2500%. The payment of the coupon will take place 2,0 times per biannual on the 11.01.. At the current price of 0 USD this equals a annual yield of 2.86%. The Sumitomo Mitsui Banking Corp.-Bond was issued on the 7/11/2014 with a volume of 1000 M. USD.