Using 3D microscope to test components from 360 degrees. Emphasis on checking outer packing condition, checking complete parts number, date code and lot code on the label; Chips marking and body condition; terminal layout, coplanarity and electroplating status, etc.; check if dimensions of the chip is in accordance with the specification of the datasheet, etc.

2.Acetone test

Use American army regulation chemical agent wipe the test object, to identify if this chips has been remarked or not.

3.X-ray inspection

Use X-Rays to analysis the internal structure of chips. With X-ray detection, we can find out if the internal structure of test objects are consistent or they are mixed parts; Mixed parts means there are different size wafer, different base, different wire frame, different lineup from the same batch products, etc.; In addition, it also can intuitively see the internal wire of chips open / short circuit, these defective will directly cause the product function failure.

4.Pin Assignment test

Check the X-Ray image of test object according to the Pin definition on original datasheet, identify if the chips Pin definition is consistent.

5.De-capsulation test

Take out the die with chip anatomical methods, analysis the die logo, wire, structure, MASK etc, to identify whether the chips are from original factory.

6.Function test

Use of VLSI/SOC test system, its diversified test function can be applied to display IC, LED IC, power IC, digital consumption IC, CSTN, OLED, MCU and peripheral devices of IC etc, testing center provides the most economical production testing and comprehensive test plan, provide complete Socket to meet various needs of packaging style. And we have the special transistor test instrument, LCR instruments to test the passive components, transistor, etc.

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