Outline
This coating removal method uses a micro abrasive blasting system and a very fine soft abrasive powder. The powder is propelled through a small nozzle toward the area where the coating needs to be removed.

To determine the appropriate coating removal procedure the coating must first be identified. Refer to procedure number 2.3.1.

Caution
Micro blasting will generate substantial static charges. The work area should be flooded with ionized air and the circuit board assembly should be grounded whenever possible.

Conformance Level - High
This procedure most closely duplicates the physical characteristics of the original, and most probably complies with all the functional, environmental and serviceability factors.

If the circuit board has static sensitive components, insert the entire circuit board into a shielded bag. Only the area needing rework should be exposed. Ground the circuit board to dissipate static charges

Insert the circuit board into the blasting chamber and blast away the damaged or unwanted coating\solder mask. Slowly move the nozzle along the area where the coating is to be removed. (See Figure 2)

Blow off the blasting dust and clean the area.

Evaluation

Visual examination or UV light may be used to verify complete removal of coating.