The new RealSense™ camera 400 series from Intel® is a modular concept that provides depth information and full colour HD images in both indoors and outdoors applications. It utlises proven Intel® depth sensor technology and includes a range of cameras and board level modules with depth computation via a next generation Intel ASIC. The technology supports both PC and embedded applications.

Mark Williamson, Director – Corporate Market Development at STEMMER IMAGING, said: “This exciting new technology represents a major development for 3D depth imaging and sets new levels of performance at a price point that opens up the use of 3D imaging to high volume embedded applications. It will have many applications in a wide variety of industries including retail, robotics and drones. The modular approach provides the flexibility to address the needs of many different market segments. In particular it brings 3D perception capabilities to the growing embedded vision sector, with modules optimised for embedded power and performance.”

Intel engineers will introduce this highly innovative technology with talks and live demonstrations at the STEMMER IMAGING Machine Vision Forum Tour 2017.