The Techspray 1608-100DSP (SMT Stencil Wipes) are pre-saturated 70 percent IPA and 30 percent DI water wipes. They are packaged in a pop-up dispener and with 100 wipes. The 70 percent IPA and 30 percent DI water blend effectively removes solder paste and uncured adhesives from stencil screens and misprinted substrates, as well as application accessories such as squeegees, spatulas, and mixers. Additionally, these wipes are low linting.