Whether the specific application is related to a high-performance microprocessor design, a low-cost ASIC and system design, power integrity, signal integrity, or simultaneous switching noise, effective solutions are available for all design types.

Fast, full-package extraction

High capacity quasistatic solver and hybrid/multi-core support combine for fast, full-package extraction while capturing all 3D effects.

Obtain impedance, resistance, conductance, capacitance, inductance, and complete SPICE netlists, with or without skin-effect frequency dependence, place chip layers and multiple packages and package types on boards and observe electrical behavior through the integrated chip through system.

Directly imports geometry in widely used CAD formats and produces output models that are compatible with standard circuit simulation engines.

Rapidly and accurately extract reliable and complete SPICE models in a fully automated manner for a variety of applications including chip interfaces, redistribution layers, packages, boards, systems, and SiPs.

Electromagnetic Modeling of Three Dimensional Integrated Circuits

This paper focuses on a fundamental aspect of design technology for 3DICs: Understanding the electromagnetic behavior of 3D structures and how to model them in practice.

It examines novel electromagnetic modeling aspects of 3DICs, in particular the use of silicon substrates such as silicon interposer, redistribution layer (RDL) and Through Silicon Via (TSV). Furthermore, this paper demonstrates how to model electromagnetic properties of silicon substrates, RDL and TSV, how to capture the physical effects in a full 3D solver, and how to incorporate these models into electromagnetic simulation tools. Includes examples that illustrate the techniques covered.