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Taipei, Taiwan, R.O.C. – February 22, 2017 – United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), at a meeting of the Board of Directors held today, approved the 2016 Business Report and Financial Statements, and set the agenda for the Annual General Meeting. A brief summary of major recognition and discussion items is as follows:

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Approved the 2016 Business Report and Financial Statements. The consolidated revenue for 2016 was NT$147,870 million and net income attributable to the shareholder of the parent was NT$8,316 million, with earnings per share of NT$0.68.

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Shareholder cash dividend of NT$6,112 million at approximately NT$0.50 per share.

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Employee cash compensation of NT$930.6 million.

Other major resolutions of today’s Board Meeting:

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Approved termination of the issuance plan for private placement ratified during the 2016 Annual General Meeting.

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Approved the proposal of a private placement plan in the 2017 Annual General Meeting to fulfill operational needs.

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Approved a donation of NT$12 million bestowed to UMC Science and Culture Foundation.

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Announced that the 2017 Annual General Meeting will be held at 9:00AM on Thursday, June 8, 2017 at UMC’s Fab 8S Conference Hall, located at No.16, Creation Rd. 1, Hsinchu Science Park.

About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced IC production for applications spanning every major sector of the electronics industry. UMC’s robust foundry solutions enable chip designers to leverage the company’s sophisticated technology and manufacturing, which include high volume production 28nm gate-last High-K/Metal Gate technology, ultra-low power platform processes specifically engineered for Internet of Things (IoT) applications and the automotive industry’s highest-rated AEC-Q100 Grade-0 manufacturing capabilities for production of ICs found in cars. UMC’s 11 wafer fabs are strategically located throughout Asia and are able to produce over 500,000 wafers per month. The company employs nearly 19,000 people worldwide, with offices in Taiwan, China, Europe, Japan, Korea, Singapore, and the United States. UMC can be found on the web at http://www.umc.com.

Note From UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are forward-looking within the meaning of the U.S. Federal Securities laws, including statements about introduction of new services and technologies, future outsourcing, competition, wafer capacity, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks. Further information regarding these and other risks is included in UMC’s filings with the U.S. Securities and Exchange Commission. UMC does not undertake any obligation to update any forward-looking statement as a result of new information, future events or otherwise, except as required under applicable law.