KAOHSIUNG, Taiwan--(BUSINESS WIRE)--Advanced Semiconductor Engineering, Inc (TSE: 2311, NYSE: ASX) today
announced the official inauguration of ASE Embedded Electronics
Incorporated, at a formal signing ceremony in Kaohsiung with TDK
Corporation and local officials.

On May 8th, 2015, both ASE and TDK entered into an agreement to
establish a joint venture company, named ASE Embedded Electronics
Incorporated, to manufacture IC embedded substrates using TDK’s
SESUB®(Semiconductor Embedded in SUBstrate) technology. The ASE Embedded
Electronics manufacturing facility is to be located in the Nantze Export
Processing Zone, Kaohsiung City, Taiwan. ASE’s System-in-Package (SiP)
solutions using SESUB technology will offer a robust embedded solution
in enabling a wide number of applications such as PMIC, sensors, RF
tuners, and many more. Through the joint venture company, ASE aims to
leverage ASE’s capabilities in advanced packaging, test and module level
solutions with TDK’s proven proprietary embedded technology to address
escalating market needs for semiconductor miniaturization.

As a leader in SiP technology, ASE continues to expand its product and
service portfolio through collaboration with key suppliers and partners.
"Such alliances enable ASE to strengthen its SiP ecosystem and offer our
customers a complete suite of solutions for integrating dozens of chips
into smaller and thinner spaces in the advent of portable and wearable
devices and the Internet of Things," said Dr. Tien Wu, COO, ASE Group.

About the ASE Group

The ASE Group is the world's largest provider of independent
semiconductor manufacturing services in assembly, test, materials and
design manufacturing. As a global leader geared towards meeting the
industry’s ever growing needs for faster, smaller and higher performance
chips, the Group develops and offers a wide portfolio of technology and
solutions including IC test program design, front-end engineering test,
wafer probe, wafer bump, substrate design and supply, wafer level
package, flip chip, system-in-package, final test and electronic
manufacturing services through Universal Scientific Industrial Co., Ltd.
and its subsidiaries, members of the ASE Group. The Group generated
sales revenues of US$8.5 billion in 2014 and employs over 68,000 people
worldwide. For more information about the ASE Group, visit www.aseglobal.com.

Safe Harbor Notice

This press release contains "forward-looking statements" within the
meaning of Section 27A of the United States Securities Act of 1933, as
amended, and Section 21E of the United States Securities Exchange Act of
1934, as amended, including statements regarding our future results of
operations and business prospects. Although these forward-looking
statements, which may include statements regarding our future results of
operations, financial condition or business prospects, are based on our
own information and information from other sources we believe to be
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words “anticipate,” “believe,” “estimate,” “expect,” “intend,” “plan”
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results of operations, financial condition or business prospects may
differ materially from those expressed or implied in these
forward-looking statements for a variety of reasons, including risks
associated with cyclicality and market conditions in the semiconductor
or electronic industry; changes in our regulatory environment, including
our ability to comply with new or stricter environmental regulations and
to resolve environmental liabilities; demand for the outsourced
semiconductor packaging, testing and electronic manufacturing services
we offer and for such outsourced services generally; the highly
competitive semiconductor or manufacturing industry we are involved in;
our ability to introduce new technologies in order to remain
competitive; international business activities; our business strategy;
our future expansion plans and capital expenditures; the strained
relationship between the Republic of China and the People’s Republic of
China; general economic and political conditions; the recent global
economic crisis; possible disruptions in commercial activities caused by
natural or human-induced disasters; fluctuations in foreign currency
exchange rates; and other factors. For a discussion of these risks and
other factors, please see the documents we file from time to time with
the Securities and Exchange Commission, including our 2014 Annual Report
on Form 20-F filed on March 18, 2015.