IMAPS Gives Details of MicroTech Conference

(AP) -- IMAPS-UK (The International Microelectronics And Packaging Society) is
pleased to announce details of the forthcoming MicroTech-2010 Conference
featuring “Disruptive Technologies” & APM featuring “Advanced Polymer,
Organic & Inorganic Materials” being held at the well known Cambridge
University Møller Centre. The location is ideally placed near many of the
forward thrusting new and established companies as well as at a great historic
city.

The Conference
will be the major spring 2010 event on Electronics Packaging, Interconnection
and Integration in Europe and is being held between 28th February and 2nd March
2010.

The event has
also attracted worldwide interest and features an exceptional technical
programme, with speakers providing Keynotes and contributions from USA, Korea,
China and across mainland Europe.

Keynote presentations for MicroTech include “Disruptive
Technologies” by Mark Christensen of Prismark Partners, USA; “MEMS packaging and
assembly in Harsh Environments” by Sean Neylon of Colibrys, Switzerland. APM
Keynote presentations include “Reliability study for high temperature stable
conductive adhesives” by Johan Liu of EMIT Centre, Gothenburg, Sweden; “Wafer
Level CSP & FlipChip Production Technology” by Elke Zakel of PacTech,
Berlin, Germany and “Single Sided Substrates and Packages Based on Laminate
Materials” by Bernd Appelt of ASE, USA. Further details of the full Technical
Programme can be downloaded off the IMAPS-UK website.

A free to visit
"Table-Top" exhibition will also span both Conference events. The exhibition
provides an excellent opportunity to view the latest products and services from
leading Companies involved in the Microelectronics field and for exhibitors to
market their products and services to a wide-ranging audience.

Further details of the
conference can be obtained by visiting the IMAPS-UK website www.imaps.org.uk or
by emailing the Societies Secretariat: secretariat@imaps.org.uk