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Abstract

In the manufacture of electronic circuit modules or cards in air cooled systems, it has become increasingly more important to provide a means for repairing by removal and replacement of defective individual components after they have been encapsulated. A suitable encapsulant capable of solvent removal without damaging operative components is Dow Corning 630 Protective Coating. Not only does this material provide adequate characteristics for module or card operation, but it may safely be removed by agitation in solvents such as trichloroethylene, perchloroethylene, toluene, xylene, or other aromatic solvent without producing undesirable by-products which might damage operative components.

Country

United States

Language

English (United States)

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Removable Encapsulation for Modules or Cards

In the manufacture of electronic circuit modules or cards in air cooled
systems, it has become increasingly more important to provide a means for
repairing by removal and replacement of defective individual components after
they have been encapsulated. A suitable encapsulant capable of solvent removal
without damaging operative components is Dow Corning 630 Protective Coating.
Not only does this material provide adequate characteristics for module or card
operation, but it may safely be removed by agitation in solvents such as
trichloroethylene, perchloroethylene, toluene, xylene, or other aromatic solvent
without producing undesirable by-products which might damage operative
components.