Skyscrapers are taking over skylines in virtually every major city in the world. The same is occurring in semiconductor packaging. Electronic product density requirements have driven semiconductor packaging to the point where the components are being assembled on top of each other. There are a variety of skyscraper building technologies being evaluated and promoted. The majority of these new technologies are being called “2.5D or 3D packages”. The most commonly accepted 2.5D technology employs a “PCB” built on silicon and is called an interposer. 3D technology doesn’t use silicon PCBs but incorporates newer, advanced die interconnection and solder reflow requirements. This lunch talk will discuss the hows and whys of what some people call the “2.5D Evolution, but 3D Revolution” by someone who’s living in the midst of the turmoil.

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The Neato Robotics XV-11 is a high tech robotic vacuum cleaner that competes favorably with traditional manual upright vacuums. It is a fully automatic unit that vacuums your house, including handling the tough problems of (more…)

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