Silicon wafer manufacturer 1366 Technologies announced it has jointly achieved with Hanwha Q CELLS a new performance record of 19.6% cell efficiency for 1366’s Direct Wafer technology. The result was independently confirmed by the Fraunhofer ISE CalLab and clearly demonstrates the combined potential of the two inventions – 1366’s kerfless, drop-in 156 mm multicrystalline wafers and Hanwha Q CELLS Q.ANTUM, passivated emitter rear contact (PERC) cell process. The wafers were produced with 1366’s current production furnaces in Bedford, Massachusetts, and the cell fabrication was completed at Hanwha Q CELLS’ Center for Technology Innovation and Quality in Thalheim, Germany.

“This year we’ve been focused on mass production trials and, together with Hanwha Q CELLS, we’ve continued to push the performance limits of multicrystalline cells while dramatically reducing their costs,” said Frank van Mierlo. “The Direct Wafer process provides an ultra-low cost option to manufacturers to extend multicrystalline’s dominant market position. This latest technical achievement is an impressive demonstration of our wafers’ compatibility with new cell architectures that provide long-term differentiation.”

“These latest results demonstrate the further potential of the Direct Wafer and Q.ANTUM cell technologies that can break the technical limitations of conventional wafer and cell making processes,” said Kai Petter, Senior Manager, R&D Silicon of Hanwha Q CELLS.