Abstract:

A test apparatus being capable of replacing a test module with the other
kind of test module that tests device under tests by using the test
module is provided. The test apparatus includes a plurality of test
modules that transmit/receive signals to/from the device under tests to
test the device under test; and a performance board for diagnosis that
diagnose the plurality of test modules. The performance board for
diagnosis including: a motherboard provided common to the plurality of
test, modules; a circuit for diagnosis that transmits/receives a signal
to/from each test module to diagnose the test module; a plurality of
inter-board to module connectors that connect between the corresponding
test module and the circuit for diagnosis; and plurality of sub-boards
each of which has at least one of the inter-board to module connectors
and is fixed to the motherboard to fix the inter-board to module
connectors to the motherboard.

Claims:

1. A test apparatus being capable of replacing a test module with the
other kind of test module that tests a device under test by using the
test module, comprising:a plurality of test modules that transmit/receive
signals to/from device under tests to test the device under tests; and a
performance board for diagnosis that diagnoses the plurality of test
modules, whereinthe performance board for diagnosis including;a
motherboard provided common to the plurality of test modules;a circuit
for diagnosis that transmits/receives a signal to/from each test module
to diagnose the test module;a plurality of inter-board to module
connectors arranged corresponding to the plurality of test modules that
connect the corresponding test modules to the circuit for diagnosis; anda
plurality of sub-boards each of which includes thereon at least one of
the inter-board to module connectors and is fixed to the motherboard to
fix the inter-board to module connector to the motherboard.

2. The test apparatus as set forth in claim 1, wherein each of the
sub-boards has a fixed part having the same structure which is fixed to
the motherboard.

3. The test apparatus as set forth in claim 1, wherein the circuit for
diagnosis is provided on the motherboard and diagnoses the plurality of
test modules, respectively.

4. The test apparatus as set firth in claim 3, the performance board, for
diagnosis has a fixed part that connects each of the sub-boards to the
circuit for diagnosis in the same structure.

5. The test apparatus as set forth in claim 4, whereinthe connection part
including:sub-board side connectors each of which is provided for each of
the sub-boards and connected to the inter-board to module connector; anda
plurality of motherboard side connectors arranged corresponding to the
plurality of sub-boards one to one on the motherboard, each of which
connects the corresponding sub-board side connector to the circuit for
diagnosis.

6. The test apparatus as set forth in claim 5, whereinthe kind of each of
the plurality of inter-board to module connectors is adapted to the
corresponding test modules, andthe sub-board side connector for each of
the sub-boards has the same structure each other.

7. The test apparatus as set forth in claim 6, wherein each of the
motherboard side connectors has the same structure.

8. The test apparatus as set forth in claim 1, wherein each of the
circuits for diagnosis is provided on each of the sub-boards and
diagnoses the test module connected to the sub-board.

9. The test apparatus as set forth in claim 8, wherein each of the
circuits for diagnosis independently operates for each sub-board.

10. The test apparatus as set forth in claim 3, wherein each of the
sub-boards further includes an identification information storage section
that previously stores identification information for identifying the
inter-board to module connector provided and notifies the circuit for
diagnosis of the identification information.

11. In a test apparatus being capable of replacing a test module with the
other kind of test modal to that tests a device under test by using the
test module, a performance board for diagnosis that diagnoses a plurality
of test modules, comprising:a motherboard provided common to the
plurality of test modules;a circuit for diagnosis feat transmits/receives
a signal to/from each test module to diagnose the test module;a plurality
of inter-board to module connectors arranged corresponding to the
plurality of test modules feat connect the corresponding test modules to
the circuit for diagnosis; anda plurality of sub-boards each of which
includes thereon at least one of the inter-board to module connectors and
is fixed to the motherboard to fix the inter-board to module connector to
the motherboard.

Description:

BACKGROUND

[0001]1. Technical Field

[0002]The present invention relates to a test apparatus and a performance
board for diagnosis. Particularly, the present invention relates to a
test apparatus being capable of replacing test modules and a performance
board for diagnosis used for the test apparatus.

[0003]2. Related Art

[0004]Generally, a test apparatus which employs an open-architecture
method has been known as a test apparatus that tests a device under test
such as a semiconductor circuit as, for example, in International
Publication WO2004/086071 brochure. The open-architecture method is, for
example, a method being capable of arbitrarily combining various test
modules as test modules that transmit/receive signals to/from device
under tests to test the device under tests.

[0005]In addition, there is a case that the test apparatus previously
diagnoses whether each test module is placed in the right place and each
test module appropriately operates. In order to perform such diagnosis, a
performance board for diagnosis has been used as, for example, in the
International Publication WO2004/086071 brochure.

[0006]The performance board, for diagnosis is provided with circuits for
diagnosis that diagnose each test module by transmitting/receiving a
signal to/from each test module. In addition, each performance board for
diagnosis is provided with connectors that connect the test modules to
the circuits for diagnosis, respectively.

[0007]However, since the open architecture method uses various test
modules as described above, each connecter that connects each test module
to each circuit for diagnosis has to be adapted to the test module which
is used.

[0008]Here, the general performance board has been designed based on the
premise that the above-described connecters are fixed onto the board.
Therefore, the performance board for diagnosis should, have been set in a
whole such that each test module used has the corresponding connector for
each combination and arrangement thereof.

SUMMARY

[0009]Accordingly, it is an advantage of the invention to provide a test
apparatus and a performance board for diagnosis which are capable of
solving the above-mentioned problem. This advantage may be achieved
through the combination of features described in independent claims of
the invention. Dependent claims thereof specify preferable embodiments of
the invention.

[0010]Thus, a first aspect of the present invention provides a test
apparatus being capable of replacing a test module with the other kind of
test module that tests a device under test by using the test module. The
test apparatus includes: a plurality of test modules that
transmit/receive signals to/from device under tests to test the device
under tests; and a performance board for diagnosis that diagnoses the
plurality of test modules. The performance board for diagnosis includes:
a motherboard provided common to the plurality of test modules; a circuit
for diagnosis that transmits/receives a signal to/from each, test module
to diagnose the test module; a plurality of inter-board to module
connectors arranged corresponding to the plurality of test modules mat
connect the corresponding test modules to the circuit for diagnosis; and
a plurality of sub-boards each of which includes thereon at least one of
the inter-board to module connectors and is fixed to the motherboard to
fix the inter-board to module connector to the motherboard.

[0011]A second aspect of the present invention provides, a test apparatus
being capable of replacing a test module with, the other kind of test
module that tests a device under test by using the test module, a
performance board for diagnosis that diagnoses a plurality of test
modules. The performance board for diagnosis includes: a motherboard
provided, common to the plurality of test modules; a circuit for
diagnosis that transmits/receives a signal to/from each test module to
diagnose the test module; a plurality of inter-board to module connectors
arranged corresponding to the plurality of test modules that connect the
corresponding test modules to the circuit, for diagnosis; and a plurality
of sub-boards each of which includes thereon at least one of the
inter-board to module connectors and is fixed to the motherboard to fix
the inter-board to module connector to the motherboard.

[0012]It is noted that the summary of the invention described above does
not necessarily describe all necessary features of the invention. The
invention may also be a sub-combination of the features described above.

BRIEF DESCRIPTION OF DRAWINGS

[0013]FIG. 1 slows the whole configuration of a test apparatus 10
according to an embodiment of the present invention at testing;

[0014]FIG. 2 shows an example of the whole configuration of the test
apparatus 10 at diagnosis;

[0015]FIG. 3 shows an example of surface view of a performance board for
diagnosis 50;

[0016]FIG. 4 shows an example of configuration of a connector unit 32:
FIG. 4A shows an example of surface view of the connector unit 32; and
FIG. 4B shows an example of cross-sectional view of the connector unit
32.

[0017]FIG. 5 is a block diagram showing an example of functional
configuration of the performance board for diagnosis 50;

[0018]FIG. 6 shows another example of configuration of the connector unit
32; and

[0019]FIG. 7 shows another example of configuration of the connector unit
32.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

[0020]The invention will now be described based on preferred embodiments,
which do not intend to limit the scope of the invention, but exemplify
the invention. All of the features and the combinations thereof described
in the embodiments are not necessarily essential to the invention.

[0021]FIG. 1 shows the whole configuration of a test apparatus 10
according to an embodiment of the present invention at testing. Test
apparatus 10 tests device under tests 100 (hereinafter referred to as
DUTs 100) such as semiconductor circuits. The test apparatus 10 includes
a main body 12, a test head 14 and a performance board 20. The main body
12 controls the whole of test apparatus 10, judges that the DUT passes or
fails and analyzes the test result.

[0022]The test heads includes therein a plurality of test modules 21 that
transmit/receive signals to/from the DUTs 100. Each teat module 21 is
mounted on a slot 22 to be inserted into the test head 14. Thereby each
test module can transmits/receives a signal to/from the DUT 100.

[0023]Each test module 21 transmits a test signal to the DUT 100 and
receives an output signal from the DUT 100 which is outputted in response
to the test signal. Each slot 22 is commonized with respect to a method
of electrically connecting between each slot 22 and each test module 21
and a method of mechanically holding the test modules 21 so as to be able
to replacing various test modules with each other. Therefore, the test
modules 21 can be freely combined and recombined in the test head 14.

[0024]A test fixture 16 is provided on the test head 14. The test fixture
16 electrically and mechanically connects each slot 22 built into the
test head 14 to the performance board 20. The test fixture 16 may switch
connectors 22 of the performance board 20 to which each slot 22 is
connected.

[0025]The performance board 20 is substantially flat, and placed on the
test head 14 via the test fixture 16 while the back surface thereof is
opposite to the test head 14. Back surface side connectors 23, each of
which is provided at the end of the wiring extending from each test
module 21, are connected to the back surface of the performance board 20.

[0026]DUT sockets 25 on which the DUTs 100 are placed are provided on the
surface of the performance board 20. Each DUT socket 25 transfers a
signal between each back surface side connector 23 and each DUT 100.
Thereby the DUTs 100 and the test apparatus 10 are electrically
connected.

[0027]The back surface connectors 23 and the DUT sockets 25 have the
characteristics and the shapes adapted to the characteristic of the
transmitted signal and the number of transmitted signals. For example,
each back surface side connector 23 that transmits a high-frequency
signal may be a connector having a good frequency characteristic.
Moreover, each back surface side connector 23 that transmits an electric
power may be a connector having a good pressure resistance.

[0028]By the above described feature, the test signal transmitted from
each test module 21 can be provided to the appropriate terminal of the
DUT 100, so that the output signal outputted from the terminal of the DUT
100 can be provided to the appropriate test module 21. Therefore, the
test apparatus 10 can test in parallel a plurality of DUTs 100 placed on
the performance board 20.

[0029]FIG. 2 shows an example of the whole configuration of the test
apparatus 10 at diagnosis. The test apparatus 10 at diagnosis previously
diagnoses whether each test module 21 is inserted into the appropriate
slot 22, whether the test module 21 is correctly connected to the back
surface side connector 23 and whether each test module 21 normally
operates before testing the DUTs 100 described with reference to FIG. 1,
for example.

[0030]The test apparatus 10 according to the present embodiment includes a
performance board for diagnosis 50 instead of the performance board 20 of
the test apparatus 10 described with reference to FIG. 1. That is, the
performance board 20 and the performance board for diagnosis 50 are
replaceably installed on the test apparatus 10. Here, any DUT 100 is not
placed on the performance board for diagnosis 50. The performance board
50 may not have any DUT socket 25.

[0031]A plurality of connector units 32 arranged corresponding to the
plurality of back surface connectors 23 are provided on the surface of
the performance board for diagnosis 50. Each connector unit 32 is
connected to the corresponding back surface side connector 23.

[0032]FIG. 3 shows an example of surface view of a performance board for
diagnosis 50. The performance board 50 includes a motherboard 30, a
plurality of connector units 32 and a circuit for diagnosis 34. The
motherboard 30 is provided common to a plurality of test modules 21, and
the circuit for diagnosis 34 is formed on the surface of the motherboard
30. In addition, wirings that electrically connect the connector units 32
and the circuit for diagnosis 34 are formed on the surface of the
motherboard 30. The motherboard 30 may be such as a printed circuit
board.

[0033]The circuit for diagnosis 34 transmits/receives a signal to/from
each test module 21 to diagnoses each test module 21. For example, the
circuit for diagnosis 34 is electrically connected to each test module 21
via the connector unit 32. Then, the circuit for diagnosis 34 may
diagnose each test module 21 based on whether a predetermined response
signal is returned from the test module 21 if the circuit for diagnosis
34 transmits a predetermined diagnostic signal to the test module 21.

[0034]The plurality of connector units 32 are arranged corresponding to
the plurality of test modules 21. For example, the connector units 32 are
arranged corresponding to the test modules one to one. Each connector
unit 32 includes a connector to be connected to the corresponding back
surface side connector 23. Then, the connector unit 32 is fixed to the
motherboard 30, so that the connector is fixed to the motherboard 30.

[0035]FIG. 4 shows an example of configuration of a connector unit 32:
FIG. 4A shows an example of surface view of the connector unit 32; and
FIG. 4B shows an example of cross-sectional view of the connector unit
32. As shown in FIG. 4A and FIG. 4B, each connector unit 32 includes a
sub-board 36, an inter-board to module connector 38 (hereinafter referred
to as an inter-BM connector 38 and a sub-board side connector 42.

[0036]As shown in FIG. 4B, the motherboard 30 has a through-hole on a
region on which the connector unit 32 should be formed. The through-whole
is formed from the first surface to the second surface of the motherboard
30. The aperture area of the through-hole is enough to pass through the
back surface side connector 23. The back surface side connector 23 and
the connector unit 32 are connected to each other through the
through-whole.

[0037]The connector unit 32 is disposed on the surface of the motherboard
30 so as to cover the through-hole as shown in FIG. 4B, and is fixed to
that position.

[0038]Each of the connector units 32 is fixed to tire motherboard 30 in
the same structure. That is, the structure for fixing the connector units
32 to the motherboard 30 is standardized in order to any kind of
connectors 32 can be installed on any installation region on which each
connector unit 32 should be provided. Each connector unit 32 may include
a fixed, part 72 having the same structure for being fixed to the
motherboard 30.

[0039]For example, each installation region on which each connector unit
32 should be provided has the same outer shape on the surface of tire
motherboard 30. In addition, the sub-board 36 for each connector unit 32
may have the same outer shape each other. Then, each sub-board may fixed
to the motherboard 30 in the same method each other.

[0040]Specifically, a first member for thermocompression bonding may be
provided at the same portion corresponding to the fixed part 72 on each
installation region on the motherboard 30. Then, a second member for
thermocompression bonding may be provided on a fixed part 72 which is
provided at the same position on each sub-board 36. The connector unit 32
is fixed to each installation region by thermocompression-bonding the
first member and the second member. By such structure, any kind of
connector unit 32 can be disposed on each installation region.

[0041]In addition, a first fitting part having the same shape may be
formed on the same position corresponding to the fixed part 72 on each
installation region of the motherboard 30. Moreover, a second fitting
part having the same shape may be formed on the fixed part 72 disposed at
the same position on each sub-board. 36. Then, each connector unit 32 may
be fixed to the motherboard 30 by fitting the first fitting part and the
second fitting part each other. By such structure, any kind of connector
unit 32 can be installed on each installation region. In addition, the
connector units 32 may be replaceably fixed to the motherboard 30.

[0042]The inter-BM connectors 38 are arranged corresponding to the
plurality of test modules 21, respectively, and each of them electrically
connects the corresponding test module 21 to the circuit for diagnosis
34. Each inter-BM connector 38 may have a shape, the number of pins and
characteristic and so forth adapted to the corresponding test module 21.
That is, each connector unit 32 may have any kind of inter-BM connector
38 different from each other. Here, the characteristic of the inter-BM
connector 38 may be such as frequency characteristic and pressure
resistance. Each connector unit 32 has the inter-BM connector 38 adapted
to the corresponding to the test module 21, so that each connector unit
32 and each test module 21 can be electrically connected.

[0043]Each sub-board side connector 42 electrically connects the inter-BM
connector 38 and the motherboard side connector 44. Each sub-board side
connector 42 is provided on the surface of the sub-board 36 and connected
to a pin to be connected to the circuit for diagnosis 34 among pins of
the inter-BM connector 38. Each motherboard side connector 44 is provided
on the surface of the motherboard 30 and connected to the circuit for
diagnosis 34. In addition, the sub-board side connector 42 and the
motherboard side connector 44 are connected through such as a cable 46.

[0044]Thereby each sub-board side connector 42 and each motherboard side
connector 44 function as a connection part 70 that connects the sub-board
36 and the circuit for diagnosis 34. Here, each connection part 70
provided for each sub-board 36 has the same structure. For example, each
sub-board side connector 42 has the same structure. Also each motherboard
side connector 44 has the same structure. Here, "having the same
structure" may mean that the structure of each connector has the same
structure enough to allow any sub-board side connector 41 and any
motherboard side connector 44 to be connected by the common cable 46.

[0045]Here, the feature of the connection part 70 is not limited to the
above described feature by using the connectors. For example, both ends
of the cable 46 may be soldered to the motherboard 30 and the sub-board
36. However, even if the connection part 70 has any other structure, it
is preferred that each connection part 70 has the same structure so as to
be able to connect any connector unit 32 to any pin of the circuit for
diagnosis 34. In addition, the connection part 70 and the fixed part 72
may be provided as one section. For example, when the motherboard 30 and
the sub-board 36 are soldered to each other, the soldered portion may
function as the connection part 70 and the fixed part 72.

[0046]As described above, each connection part 70 has the same structure,
any kind of connector unit 32 can be connected to the circuit for
diagnosis 34. Therefore, any kind of test module 21 can be diagnosed by
connecting the same to the circuit for diagnosis 34.

[0047]Each signal transmitted between each test module 21 and the DUT 100
has various frequencies, voltage values and current values, however, each
signal transmitted between each test module 21 and the circuit for
diagnosis 34 at diagnosis may not have various frequencies and so fourth.
For example, each diagnostic signal and response signal transmitted
between each test module 21 and the circuit for diagnosis 34 can be
standardized as a certain signal. Therefore, even if the structure of
each fixed part 70 is standardized and the electric characteristic of the
connection part 70 is standardized, a signal for diagnosing each test
module 21 can be accurately transmitted.

[0048]Moreover, the frequency and the voltage of a signal transmitted at
the time of diagnosis are not higher than those at the time of testing.
Therefore, the frequency band and the pressure resistance of the
connector used in the connection part 70 may be lower than those of the
connector provided between the test module 21 and the DUT 100 at the time
of testing. Thus, the cost can be reduced by using such connector.

[0049]In addition, each inter-BM connector 38 may have a plurality of pins
corresponding to a plurality of pins of the test module 21. Any pin of
the inter-BM connector 38 may be connected to the other pin. In this
case, the circuit for diagnosis 34 can loop the signal outputted from the
test module 21 back to the test module 21 to diagnose the test module 21.
In addition, any pin of the inter-BM connector 38 is connected to the
circuit for diagnosis 34 through the connection part 70 as described
above.

[0050]The circuit for diagnosis 34 may input a predetermined diagnostic
signal to each, test module 21 through each connector unit 32. Receiving
the diagnostic signal, the test module 21 may output a predetermined
response signal. The circuit for diagnosis 34 may receive the response
signal through the connector unit 32 and diagnose the test module 21
based on the response signal.

[0051]For example, the circuit for diagnosis 34 may sequentially input
diagnostic signals to each connector unit 32. Then, the test module 21
may output the response signal containing the self-identification
information in response to the diagnostic signal. The circuit for
diagnosis 34 may diagnose whether the appropriate test module 21 is
inserted into each slot 22 based on the identification information
sequentially received. In addition, the circuit for diagnosis 34 may
further diagnose whether the appropriate inter-BM connector 38 is
inserted into each position of the motherboard 30. In this case, each
connector unit 32 may previously store identification information for
identifying the own inter-BM connector and output the identification
information to the circuit for diagnosis 34 in response to the diagnostic
signal.

[0052]FIG. 5 is a block diagram showing an example of functional
configuration of the performance board for diagnosis 50. The performance
board 50, as described above, includes the motherboard 30 and a plurality
of connector units 32 and diagnoses a plurality of test modules 21.

[0053]The motherboard 30 is shared to the plurality of test modules 21. In
addition, the motherboard 30 includes a plurality of motherboard side
connectors 44 corresponding to the plurality of test modules 21 and the
common circuit for diagnosis 34.

[0054]The circuit for diagnosis 34 transmits/receives a signal to/from
each test module 21 to diagnose the test module 21. The plurality of
motherboard side connector 44 are arranged corresponding to the plurality
of connector units 32 one to one on the motherboard 30, and each of the
motherboard side connector 44 connects the corresponding sub-board side
connector 42 and the circuit for diagnosis 34.

[0055]Each of the connector unit 32 includes the sub-board 36 (cf. FIG.
4), the sub-board side connector 42, the inter-BM connector 38 and an
identification information storage section 48. The sub-board side
connector 42 connects between toe motherboard side connector 44 and the
inter-BM connector 38.

[0056]The inter-BM connector 38 connects between the corresponding test
module 21 and the sub-board side connector 42. By such feature, the
circuit for diagnosis 34 and each test module 21 are connected to each
other. The identification information storage section 48 may store
identification information for identifying the corresponding inter-BM
connector 38. The identification information may indicate the kind of
inter-BM connector 38, and also may indicate the kind of test module 21
to which the inter BM connector 38 should be connected.

[0057]The identification information storage section 48 may split a
diagnostic signal from the circuit for diagnosis 34 to the test module
21, receive the same and return a response signal containing the
identification information to the circuit for diagnosis 34 in response to
the diagnostic signal. Thereby the circuit for diagnosis 34 can diagnose
whether the appropriate connector unit 32 is connected to each
motherboard connector 44.

[0058]In addition, the circuit for diagnosis 34, as described above, may
further receive the identification information of the test module 21.
Thereby the circuit for diagnosis 34 can diagnose whether the appropriate
test module 21 is inserted into each slot 22. Moreover the circuit for
diagnosis 34 can diagnose cases that both of the connector unit 32 and
the test module 21 are not appropriately provided, and that either the
connector unit 32 or the test module 21 is not appropriately provided.

[0059]FIG. 6 show another example of configuration of the connector unit
32. The connector unit 32 according to the present embodiment is
different from the connector unit 32 described with reference to FIG.
2-FIG. 5 regarding having a plurality of inter-BM connectors 38. The
other features may be the same as those of the connector unit 32
described with reference to FIG. 2-FIG. 5.

[0060]The plurality of inter-BM connectors may be the same connectors but
may be connector's different from each other. The word "the different
connectors" means connectors having the number of pins, the frequency
characteristic and the pressure resistance which are different from each
other. The connector unit 32 may be connected to one test module 21 by
the plurality of inter-BM connectors 38, and also may be connected to a
plurality of test, module 21. The performance board for diagnosis 50 may
include both of the connector unit 32 having one inter-BM connector 38
and the connector unit 32 having the plurality of inter-BM connectors 38
at the same time.

[0061]FIG. 7 shows another example of configuration of the connector unit
32. The connector unit 32 according to the present embodiment further
includes a circuit for diagnosis 60 in addition to the components of the
connector unit 32 described with reference to FIG. 2-FIG. 6.

[0062]The circuit for diagnosis 60 and a predetermined, pin of the
inter-BM connector 38 are electrically connected within each connector
unit 32. Therefore, the connector unit 32 may not need the sub-board side
connector 42. In addition, the motherboard 30 may not need the
motherboard side connector 44.

[0063]Each circuit for diagnosis 60 diagnoses the test module 21 connected
to each, sub-board 36. The circuit for diagnosis 60 may have the function
the same as that of the circuit for diagnosis 34 described with reference
to FIG. 2-FIG. 6. Each circuit for diagnosis 60 independently operates
for each sub-board 36 to diagnoses the corresponding test module 21.

[0064]Here, the fixed part 72 (cf. FIG. 4) in each sub-board 36 also has
the same structure each other in the present embodiment. By such feature,
the performance board for diagnosis 50 corresponding to the test modules
used can be easily prepared.

[0065]Moreover, as described with reference to FIG. 3, when the common
circuit 34 for diagnosis is provided on the motherboard 30, a trigger
signal for causing the circuit for diagnosis 34 to start a diagnosis may
be provided from any test module 21. The circuit for diagnosis 34 may
diagnose each test module 21 in response to the trigger signal. In
addition, any test module 21 may provide an electric power for the
circuit for diagnosis 34.

[0066]Meanwhile, as described with reference to FIG. 7, when an individual
circuit for diagnosis 34 is provided for each connector unit 32, the
trigger signal may be provided from each test module 21 to each circuit
for diagnosis 34. Each circuit for diagnosis 34 may diagnose the
corresponding test module 21 in response to the trigger signal. In
addition, the electric power of the circuit for diagnosis 60 may be
provided from the corresponding test module 21. That is, each connector
unit 32 is not electrically connected to the other connector unit 32 or
the motherboard 30, therefore, any connector unit 32 can be disposed at
any position of the motherboard 30 provided that the mechanical
connection method between each connector unit 32 and the motherboard 30
is unified.

[0067]While the invention has been described by way of the exemplary
embodiments, it should be understood that those skilled in the art might
make many changes and substitutions without departing from the spirit and
scope of the invention. It is obvious from the definition of the appended
claims that the embodiments with such modifications also belong to the
scope of the invention.

[0068]As described above, according to the present embodiment, a
performance board for diagnosis that diagnoses test modules can be easily
prepared in a test apparatus being capable of replacing the test modules
with each other.