Description:
The MAX13174E contains six pin-selectable, multiprotocol cable termination networks. Each network is capable of terminating V.11 (RS-422, RS-530, RS-530A, RS-449, V.36, and X.21) with a 100Ω differential load, V.35 with a T-network load, or V.28 (RS-232) and V.10 (RS-423) with an open-circuit

Description:
The term â€architectureâ€, as applied to Instrumentation and Control (I&C), implies the arrangement of control components, sensors, operator interface devices, networks and communication devices. The I&C architecture is very important to the successful operation of a nuclear

Description:
The MAX1810 powers peripheral component interconnect(PCI) Ethernet network interface cards (NICs), modem cards, and other devices that utilize both the main and auxiliary (standby) voltages supplied by PCI-compliant systems. The device generates an uninterrupted+3.3V at up to 500mA from either

Description:
is known as the wireless body area network (BAN). BAN can share information effectively and securely, reduce functional redundancies, and allow new conveniences and services. Moreover, it provides new possibilities for high-quality service from hospitals, by linking various biotic sensors

Description:
IEC 62215-3:2013 specifies a method for measuring the immunity of an integrated circuit (IC) to standardized conducted electrical transient disturbances. The disturbances, not necessarily synchronized to the operation of the device under test (DUT), are applied to the IC pins via coupling networks

Description:
corresponding to the bus signal (wake-up flag). The TLE6251DS is also designed to withstand the severe conditions of automotive applications and to support 12 V and 24 V applications. The IC is based on the Smart Power Technology SPT® which allows bipolar and CMOS control circuitry in accordance

Description:
in the EC network with a switching system in the IC, INC, or consolidated carrier network. The interface is at a point of termination (POT) between the two switching systems. Technical requirements for IC-to-EC calls are described in American National Standard for Telecommunications

Description:
BD41020FJ-C is the best transceiver that can be used for BMS (Battery Management System). It has a Master/Slave protocol communication of LIN (Local Interconnect Network). BD41020FJ-C is available in small SOP Package. It has a normal slope mode, very low Electro Magnetic Emission (EME) and low

Description:
: support for message-passing was added, and the operating distance is not limited to 10 m. (The intent of that limitation was to make clear that this is not yet-another Local Area Network.) The real distinction between SCI and a network has more to do with the memory-accessbased model SCI uses

Description:
The MAX5945 quad network power controller is designed for use in IEEE® 802.3af-compliant power-sourcing equipment (PSE). The device provides power devices (PD) discovery, classification, current-limit, and both DC and AC load disconnect detections. The MAX5945 can be used in either endpoint PSE

Microchip Technology, Inc.MOST150 Data Link Layer Specification
Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that it has made available for license, on a royalty-bearing basis, its proprietary MOST150 Data Link Layer Specification. By making the key technologies available for the lower layers of MOST150, other semiconductor companies now have the opportunity to develop, manufacture and supply chips with a MOST150 interface. The open MOST ® standard for network...
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Linx TechnologiesPre-Certified, Low Cost RF Data Modules
to 10dBm. This results in a line-of-sight range of up to 1600m (1.0 mile). Pre-Certified, Low Cost RF Data Modules. The HumPRO ™ Series module is a completely integrated RF transceiver and processor designed to transmit digital data across a wireless link. It employs a fast-locking FHSS system for noise immunity and higher transmitter output power as allowed by government regulations. With modular FCC approval in the United States and IC approval in Canada, The HumPRO ™ &nbsp...
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Interplex Industries, Inc.Custom Semi-Conductor and Chip Packaging
Engineering combined with our product design and full compliment of turnkey manufacturing processes, allows IEP to offer complete solutions from concept through development and into scalable high volume production for most any electronic packaging requirement. Interplex Engineered Products, located in a modern 125,000 SqFt facility in East Providence RI, is part of the global network of Interplex Industries Companies. With over 25 world wide locations in 10 Countries, Interplex provides single source...
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Texas InstrumentsSimpleLink CC3100 Wi-Fi CERTIFIED Module
Add Wi-Fi to low-cost, low-power microcontroller (MCU) for Internet of Things (IoT) applications. The CC3100MOD is FCC, IC, CE, and Wi-Fi CERTIFIED module is part of the new SimpleLink Wi-Fi family that dramatically simplifies the implementation of Internet connectivity. The CC3100MOD integrates all protocols for Wi-Fi and Internet, which greatly minimizes host MCU software requirements. With built-in security protocols, the CC3100MOD solution provides a robust and simple security experience...
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Epoxy TechnologyEPO-TEK® Selector Guide
used successfully for over 35 years in a wide variety of applications including: IC packaging, hybrid microelectronics and circuit assembly as well as today in solar cell assembly, LEDs and high power management. EPO-TEK thermally conductive products are unparalleled in their performance in effectively removing heat, providing increased dielectric strength and protecting circuits from hostile environments. EPO-TEK optical adhesives are frequently used to bundle optical fibers and bond components...
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An Integrated Circuit chip manufacturer needs to verify performance of large shipments of IC chips before delivering them to their customer, a company that builds network systems. They need to test the Signal-to-Noise Ratio (SNR), the bit error rate, and other key IC chip performance parameters

. Productivity improvements realized by independent device manufacturers and foundries are measured in functions per dollar, numbers of transistors per unit area of silicon, or reduced manufacturing costs. Historically, three key factors have combined (albeit at different rates) to improve IC

in the electronics industry took a new twist Aug. 10, as criminal indictments were re-filed against Avanti Corp. and four of its employees, including Gerry Hsu, president and chief executive officer. The Avanti employees are accused of stealing IC layout code and algorithms from Cadence Design Systems

Startup looks to handle back-end IC production at wafer level A low-profile probe-card company has unveiled a new process it claims will consolidate entrenched, time-consuming test and packaging methods, slash costs and bring Moore's Law-type scaling to the back end of semiconductor manufacturing

Signal-conditioning IC simplifies strain-gage bridge sensor setup. Strain-gage sensors are used in many applications including manufacturing, process control, and research. They convert strain into an electrical signal for use in pressure sensors, weight, force, and torque measurements

at different rates) to improve IC manufacturing output by 25 30% per year: The IC industry faces the challenge of lifting 300-mm volume manufacturing up to current manufacturing standards and beyond. The new 300-mm fabs will have to match the performance of today's world-class 200-mm fabs, which

. Mosel-Vitelic files complaint against Hitachi and Elpida Mosel-Vitelic of Taiwan this week filed a complaint at the U.S. International Trade Commission charging that Hitachi Ltd. and Elpdia Memory Inc. had infringed certain patents on DRAM and flash memory. Consumer IC market to reach $15.7 billion