Samsung unveils high-capacity 32GB DRAM module for servers

Samsung has announced the availability of its new RDIMM DRAM module for servers, which boasts a maximum capacity of 32GB and makes use of 3D-TSV technology. According to the Korean electronics giant, the new high-capacity RDIMM DRAM module was designed to meet the needs of high-performance next-generation server platforms.

Samsung has announced the availability of its new RDIMM DRAM module for servers, which boasts a maximum capacity of 32GB. According to the Korean electronics giant, the new high-capacity RDIMM DRAM module was designed to meet the needs of high-performance next-generation server platforms.

Touted as the industry's first such high-capacity RDIMM DRAM module to be built with 3D-TSV technology, Samsung claims that the new 32GB memory stick, which is fabricated via a 30nm process, consumes a mere 4.5w of energy per hour, or almost 30% lower than what LRDIMMs of the same capacity typically draw. Samsung has also added that its new RDIMMS are able to achieve transfer speeds of up to 1,333Mbits/s, as opposed to the 800Mbits/s speed found on older RDIMM memory.

Samsung has not released any details pertaining to global availability of its new 32GB RDIMM DRAM modules, although it has confirmed that engineering samples of the modules have already been released for evaluation purposes, and that it will continue to produce memory modules based off 3D-TSV technology while working to help shrink down the fabrication process to as low as 20nm.

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