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Method for a folded foil interconnection

Publishing Venue

Abstract

Disclosed is a method for a folded foil interconnection. Benefits include improved functionality and improved ease of manufacturing.

Country

United States

Language

English (United States)

This text was extracted from a Microsoft Word document.

At least one non-text object (such as an image or picture) has been suppressed.

This is the abbreviated version, containing approximately
69% of the total text.

Method for a folded foil interconnection

Disclosed is a method for a folded foil interconnection. Benefits include improved functionality and improved ease
of manufacturing.

Description

� � � � � The disclosed method
utilizes a metal (or other conductive material) foil to enable the circuit path
from the input/output (I/O) side (active side) of the die to the top of the die
to provide the interconnection path. Metal foil that provides a circuit path to
top of the die can be prerouted with an appropriate I/O routing. Alternatively,
the foil can be routed after it is wrapped around the die (using laser or
similar cutting tools). Bump connection between the foil and the die can be
completed with flip-chip type assemblies, such as controlled collapse chip
collect (C4) and anisotropic conductive film (ACF). Die connection to the metal
foil can be completed before or after wrapping the foil around the die (see
Figure 1).

� � � � � Packages use flex
circuit or simple adhesive tape with pads and lines that are developed using standard
etching or impression printing processes. Thermal comparison bonding or C4-type
reflow processes can be used to attach the carrier tape pads to the bump side
of the die. A folded circuit is wrapped around the die (two sides or four
sides). The wrapping completes the folding process by attaching the top-side
pads to the top of the die.

� � � � � The carrier tape
connection pads can be exposed and accessible on both sides of the tape. This
technique enab...