Dr. Lee will lead the professional development course, Achieving High-Reliability of Lead-Free Solder Joints—Materials Considerations. The course is designed to help attendees understand the various factors of materials, thus enabling the best selection of the proper solder alloys and surface finishes for achieving high-reliability solder joints.

Dr. Lee will present Nano-Cu Sintering Paste for High Power Devices Die Attach Applications. The paper examines how a nano-Cu pressureless sintering paste, developed specifically for joint formation applications, performed when subjected to a variety of tests for oxidation resistance.

Dr. Lee is also presenting Novel Solder Alloy with Wide Service Temperature Capability for Automotive Applications. His interactive presentation reports on the development, testing, and results of Indalloy®276, a lead-free solder alloy created to target wide service temperatures with high reliability.

Dr. Lee is a world-renowned soldering expert, an SMTA Member of Distinction, and IEEE Fellow. He has extensive experience in the development of fluxes, alloys, and solder pastes for SMT, and extensive experience in the development of high-temperature polymers, encapsulants for microelectronics, underfills, and adhesives. In addition to SMT and semiconductor soldering materials, his research also extends to nanobonding technology and thermal conductive materials.

A paper co-authored by Indium Corporation’s Francis Mutuku, Research Metallurgist, will also be presented at the conference.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

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