Visit LatticeGear- Booth 86 (Nano Technology Solutions)

At IMC19 see live of sample preparation demos on the LatticeAx cleaving system and the FlipScribe backside scriber. Both prepare glass, sapphire, III-V, SiC and silicon. The LatticeAx integrates the indent and cleaving steps in a single tool and is cleanroom compatible, watch our latest video here. The FlipScribe scribes withouttouching fragile frontside features, ideal for compound substrates and off-crystalline cleaving.

Last week, LatticeGear with the great support of its local agent, V-TEK Co., LtD., delivered the seminar about ‘The power of the weak point: how to secure clean imaging and true analysis (in cleanroom too) at leading academic institutes across Taiwan (CGU, NTUST, NCKU, NCHU, NCTU) aiming to educate those who need to use cleaving technology (downsizing, cross-sections) to prepare samples for characterization. This type of lecture is not part of any curriculum, yet fundamental for research and development.

It was highly appreciated by those professors who are responsible for nanofabrication facilities to teach users how to properly cleave in the cleanroom with no contamination, as well as for researchers with limited sample material and must secure sample prep outcome (without the luck factor). Accurate characterization requires clean, sample preparation that does not alter the surface / sub-surface of the starting material.While we all invest much time and funds into our microscopes, we hardly talk about sample prep, YET as the microscopes advance, correct sample prep becomes critical.

Please contact LatticeGear at lg@latticegear.com if you would like to schedule a seminar at your industrial or academic laboratory.

Using the LatticeAx, a controlled, precise cleaving process was developed to downsize out-of-a-package samples repeatedly in <1-min. No skills required and no pre-prep. Single step for thin samples (‘out-of-a-package’ die or back-thinned samples): Using the LatticeAx’s microline indent to cleave, the cleaving step was eliminated. For thicker samples (or die on a host), a 2 step process, microline indent + 3-point cleave is used. These processes enable hard to prepare thin and thick back end samples to be prepared.

Out-of-package samples prepared using the LatticeAx. Bottom right shows sample on n-prober stub.

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About LatticeGear

LatticeGear has developed solutions for preparing the highest quality scribed and cleaved samples. Our smart mechanical solutions deliver samples with speed and simplicity at low startup cost and without service contracts. LatticeGear solutions enable you to get to the business of analysis faster. LatticeGear is a certified Emerging Small Business (ESB), Women Business Enterprise (WBE) and Minority Business Enterprise (MBE), Certification #10516.

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Welcome to LatticeGear

LatticeGear has developed solutions for preparing the highest quality scribed and cleaved samples. Our smart mechanical solutions deliver samples with speed and simplicity at low startup cost and without service contracts. LatticeGear solutions enable you to get to the business of analysis faster.