Electronics, Semiconductors and Solar

You can ideally adapt Polytec’s versatile solutions in the semiconductor industry for your applications in the electronics and solar technology industries. In the field of software, for example, you can do so by utilizing application-specific user interfaces for the OK / NOK analysis.

Polytec offers you solutions to check electronic contacts – both for analyzing the height of BGAs or “solder bumps” and for analyzing the co-planarity of IC pins. You’ll also find the right systems for packaging high-power laser diodes at Polytec.

Securing Reliable Electronic Contacts

There are a multitude of electronic components in most modern products these days, which is why it is all the more important that these components are reliably connected to ensure that functional faults don’t occur. TopMap surface metrology assures faultlessness during the soldering process by quickly examining parameters such as the solder bumps height or the co-planarity of IC pins.

Related products

Being a complete measuring station, the TopMap Metro.Lab is ideally suited to large-area topographies on almost all surfaces. Since it offers great value for money, it is also attractive for smaller companies with fewer tasks.

The TopMap In.Line’s compact design means it can be easily integrated into the production line and quickly carries out checks on differently reflective surfaces. Steps, larger ripples or other surface structures do not pose any problems here.

With the TMS-1200 TopMap µ.Lab, you can characterize microstructures’ surfaces with a very high lateral resolution. The optical profilometer contactlessly determines parameters such as texture, flatness, ripple and roughness on both fine and sensitive...

Capturing HPLDs in a Single Pass

To guarantee that high-power laser diodes (HPLDs) will work reliably, it is important to check that the enclosure has the correct flatness and step height levels. To do this, you should use tried-and-tested technology that captures the smallest of height differences and that gives you measurement results reliably and quickly. We are, of course, talking about the surface measurement systems from Polytec.

With TopMap products such as the TMS-350, TMS-500 and TMS-1200, you measure diodes in laser arrays and analyze both the “smile” surface curvature and the step heights directly on the semiconductors. You only need to perform one measurement, thanks to the large-area measurement ranges. This means that you capture the laser diodes’ enclosure conveniently and quickly without sacrificing high resolution.

Related products

The TopMap In.Line’s compact design means it can be easily integrated into the production line and quickly carries out checks on differently reflective surfaces. Steps, larger ripples or other surface structures do not pose any problems here.

With the TMS-1200 TopMap µ.Lab, you can characterize microstructures’ surfaces with a very high lateral resolution. The optical profilometer contactlessly determines parameters such as texture, flatness, ripple and roughness on both fine and sensitive...

For Reliable Smartphones and Mobile Devices

Nowadays, mobile terminals such as smartphones, tablets and notebooks have become very widespread and make our everyday lives a great deal easier. The tolerances of the components used have to be checked during production to ensure that mobile devices will work both durably and smoothly.

The touchscreen is the most important smartphone-user interface. You can check its flatness with Polytec’s TopMap Pro.Surf, which is particularly suitable for capturing large surfaces from a metrological standpoint. The TopSens systems from Polytec provide you with thickness or height readings almost in real time, so you can rest assured that the glass is the right thickness during production. Meanwhile, if you’re looking to inspect microelectromechanical systems (MEMS) right down to their smallest details, you can opt for microscope systems such as the TopMap µ.Lab.

In short, the surface measurement systems from Polytec provide basic information to ensure that users can rely on their mobile terminals at all times.

With the TMS-1200 TopMap µ.Lab, you can characterize microstructures’ surfaces with a very high lateral resolution. The optical profilometer contactlessly determines parameters such as texture, flatness, ripple and roughness on both fine and sensitive...

Reliable Pass-Fail Analysis in-line or at-line

In industrial processes, everything depends on high precision during the manufacturing process, and accordingly tight tolerances must be complied with if this is to be achieved. Modern production measuring technology ensures that these limits are complied with at all times. After all, you will only continuously achieve high product quality if you use precise instruments.

Optical surface measurement systems that can be integrated in the production line as in-line applications detect defective parts within the process. These results enable you to take precautions that adjust production operations in good time. Reliable pass/ fail decisions in production lines increase efficiency and keep your reputation high.

Polytec's white-light interferometers allow you to contactlessly examine both structures and surfaces in the blink of an eye. In many cases, an object’s entire topography needs to be checked prior to certification. Polytec TopMap surface measuring systems increase testing efficiency due to its large areal measurements.

Multi-sample measurements for efficient production testing

Related products

The TopMap In.Line’s compact design means it can be easily integrated into the production line and quickly carries out checks on differently reflective surfaces. Steps, larger ripples or other surface structures do not pose any problems here.

The all-in-one 3D optical surface profiler from Polytec. The precision of a white-light interferometer, complemented by chromatic confocal sensors to overcome form deviations and any roughness determined with one device. Pro.Surf+ measures topography over a...

Checking Solder Bumps Quickly

Unenclosed semiconductor chips are often connected by “bumps” in the flip chip bonding method. The bumps’ co-planarity is decisive in ensuring that the electrical connection between the chip’s individual contact surfaces and the enclosure is correct and working properly. TopMap surface measurement systems from Polytec help you to quickly check the height of solder bumps and the co-planarity with a high level of precision.

Related products

Being a complete measuring station, the TopMap Metro.Lab is ideally suited to large-area topographies on almost all surfaces. Since it offers great value for money, it is also attractive for smaller companies with fewer tasks.

The TopMap In.Line’s compact design means it can be easily integrated into the production line and quickly carries out checks on differently reflective surfaces. Steps, larger ripples or other surface structures do not pose any problems here.