Kulicke & Soffa Further Extends China Presence

Kulicke & Soffa Industries Inc. has officially opened its China Demo Center in its Suzhou manufacturing facility. K&S Suzhou was established in 2002, spanning over 17,000 square meters, encompasses the company’s equipment software and process engineering, R&D as well as production lines for consumables products such as capillaries, blades and wedge bonding tools.

The 1,200 square meters Demo Center houses a broad assembly line of the latest K&S solutions, including RAPID Pro GEN-S (Smart) Series ball bonder, OptoLux ball bonder for LED and APAMA DA (Die Attach) equipment. Customers can now visit the site for demonstration of the end-to-end surface mount technology (SMT) solution and to develop rapid prototyping setup from screen printing, soldering paste inspection, pick-and-place to automated optical inspection (AOI) systems. Besides the SMT solution, a full assembly line of K&S CMOS Image Sensor (CIS) solution is anticipated to complete in the next few weeks. The new China Demo Center also includes equipment repair and refurbishment facilities.

"The opening of Kulicke and Soffa’s China Demo Center marks another significant milestone for the Company. It further strengthen our strong collaboration with customers and industry partners to develop and drive next-generation packaging solutions in response to the industry's emerging opportunities," said Fusen Chen, Kulicke and Soffa’s President and Chief Executive Officer.

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices.

When considering implementation of Industry 4.0 solutions, following the hype in the market, attention typically is focused on the need for communication between machines on the shop-floor. Knowing what is currently executing and the status of each process in the factory, as well as all the related resources and support operations, provides critical information for Industry 4.0 computerized management systems.

Components such as quad flat no lead (QFNs), land grid array (LGAs), micro ball grid array (micro BGAs), 0201s and even 01005s continue to push manufacturers to use thinner stencil foils to apply the correct volume of paste onto their boards, but larger components such as edge connectors still require larger paste volumes.

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Kulicke & Soffa Further Extends China Presence

Kulicke & Soffa Industries Inc. has officially opened its China Demo Center in its Suzhou manufacturing facility. K&S Suzhou was established in 2002, spanning over 17,000 square meters, encompasses the company’s equipment software and process engineering, R&D as well as production lines for consumables products such as capillaries, blades and wedge bonding tools.

The 1,200 square meters Demo Center houses a broad assembly line of the latest K&S solutions, including RAPID Pro GEN-S (Smart) Series ball bonder, OptoLux ball bonder for LED and APAMA DA (Die Attach) equipment. Customers can now visit the site for demonstration of the end-to-end surface mount technology (SMT) solution and to develop rapid prototyping setup from screen printing, soldering paste inspection, pick-and-place to automated optical inspection (AOI) systems. Besides the SMT solution, a full assembly line of K&S CMOS Image Sensor (CIS) solution is anticipated to complete in the next few weeks. The new China Demo Center also includes equipment repair and refurbishment facilities.

"The opening of Kulicke and Soffa’s China Demo Center marks another significant milestone for the Company. It further strengthen our strong collaboration with customers and industry partners to develop and drive next-generation packaging solutions in response to the industry's emerging opportunities," said Fusen Chen, Kulicke and Soffa’s President and Chief Executive Officer.

About Kulicke & Soffa

Kulicke & Soffa (NASDAQ: KLIC) is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices.