DSA

Brewer Science is dedicated to pursuing the most advanced lithography technologies in the market today. The semiconductor industry relies on geometrical scaling, finding both optical and process solutions to follow Moore’s Law. Directed self-assembly is a leading-edge technique for next-generation lithography, harnessing the thermodynamic properties of block copolymers to create sub-22-nm features without the need for EUV equipment or numerous multi-patterning steps. Brewer Science has partnered with Arkema to develop and commercialize the next generation of DSA materials. Contact us to learn more about our Gen 1 DSA materials, or our next generation high-χ (high-chi) block copolymer solutions.

Advantages of DSA:

Process simplification over conventional multi-patterning steps

Same critical dimension distribution

The pattern is in the material with the pitch defined by molecular weight of the block copolymer

Benefits of DSA Technology:

Reduced defectivity through material and process optimization

Increased pattern fidelity

Increased material quality control at high-volume manufacturing

Increased throughput at sub-20-nm feature sizes

DSA and EUV: DSA and EUV technologies are on the forefront of advanced lithography processes and complement each other in advancing the industry. EUV improves DSA placement error performance in both contact shrink and contact multiplication by allowing for tighter guiding, while DSA improves EUV pattern fidelity and contact repairing.

Dr. Terry Brewer's anti-reflective coatings revolutionized microelectronics manufacturing and ushered in today's high-speed lightweight electronic devices... Brewer Science is once again prepared to lead the industry into the next generation!