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Abstract

A compact alignment-tolerant interconnect has been developed for
use within a prototype modulator-based free-space photonic
backplane. The interconnect design encompasses several unique
features. Microlens arrays are used, and several beams share each
microlens by clustering the optical input–output in a small field
about the optical axis of each lens. For simplifying the layout,
the optical input and output of each smart-pixel array are clustered
separately, thereby allowing a Fourier plane patterned-mirror array to
be used in the beam-combination optics. This allows a suitable
balance between high interconnection densities and reasonable optical
relay distances between adjacent boards to be achieved. The primary
advantages of this scheme are the simplicity of the optical design and
its alignability, making it ideally suited for high-density
interconnection applications.

References

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