IMT offers the most complete wafer fabrication services, featuring the largest pure MEMS production fab and most extensive suite of tools of any independent manufacturer to meet our customers' high-volume production requirement and foundry services

IMT has 20 different targets constantly under vacuum in multiple production-class cluster tools, from RF and DC magnetron systems to LPCVD and PECVD, as well as thermal oxidation and annealing furnaces. A short list of deposition experience includes the following:

Over 50% of all wafers produced at IMT are wafer bonded. It is a key technology in MEMS, necessary for wafer-level packaging and encapsulation and for creating 3D microfluidics. IMT works closely with the customers' needs to determine the bonding method that includes the following:

Au-Au thermal compression

Glass frit

Anodic

Fusion

Metal alloy (low temperature)

Polymer

With the exception of polymer bonding, IMT's bonding allows hermetic wafer-level packaging to reduce the cost of post-process die-level packaging and to improve the performance and reliability of the MEMS. Depending on the bonding method and hermeticity requirements, capabilities include the following:

Although not hermetic, polymer bonding is useful for fabricating microfluidics, creating fluidic channels. Frequently, multiple bonding methods can be combined to achieve the desired final packaging. In addition to hermeticity requirements, other considerations include:

Design/device footprint

Temperature budget

Materials used

Final packaging and environmental requirements

After bonding, the wafers are protected from environment and fragile MEMS structures are protected. These wafers can continue on-ward, through die singulation and die-level packaging.

In-process electrical testing of wafers includes various measurements, such as:

Capacitance

Resistance

Inductance

Isolation

High potential

Having this knowledge enables saving costs of producing devices. The end customer would only receive known-good-dies. IMT also offers reliability, environmental, and life testing, as well as other custom testing specific to individual customer's applications.

The ability to obtain characteristics and measurements of devices and materials helps in verifying wafer processing and failure analysis. IMT's comprehensive metrology capability allows us to measure cross-section, CDs, thickness, width, optical, roughness, reflectivity, composition, etc. The following lists some of the capabilities at IMT: