Newsletters

A Silicon Interposer-based 2.5D-IC Design Flow, Going 3D by Evolution Rather Than by Revolution
Dr. Michael Jackson, VP of R&D and Physical Implementation at Synopsys ponders the 3D-IC technology trends, their timeline, and the impact on EDA, proposing that a silicon interposer-based 2.5D-IC design flow is well within our reach.

This edition presents two articles. The first article examines the manufacturing, reliability, and performance analysis of 3D integration structures using through-silicon vias (TSVs), with the simulations performed using Fammos TX. The second article presents the simulation of GaAs-based heterojunction bipolar transistors (HBTs) and pseudomorphic high electron mobility transistors (PHEMTs).