United Microelectronics Corp., will join the development alliance of IBM Microelectronics and Infineon Technologies. The three companies will work together to develop common process technologies for logic chips with minimum feature sizes of 0.13 microns down to 0.10 microns under an agreement that extends until 2003. The processes, based on CMOS will incorporate copper wiring and let logic and mixed-signal circuitry and embedded DRAM memory be combined on a single chip