Search

WEEKLY NEWSLETTER

Our free weekly newsletter brings you the top MEMS stories from 9,200+ sources worldwide. Our newsletter also reports on the most vital newly-granted patents in the MEMS industry. Subscribe today and join our 34,800+ subscribers by clicking the link below.

Contact emails

The Institute of Microelectronics (IME) in Singapore, announced a collaborative partnership with Stanford University to develop nanoelectromechanical relay technology to enable ultra-low power computation. NEMS based integrated circuits are ideal for a wide range of emerging green electronics solutions as they eliminate leakage power, one of the leading sources of power consumption in today’s scaled devices.

NEMS, as the name implies, are made up of mechanical and electronic parts, and touted to be the next frontier of the semiconductor industry’s continuous miniaturization trend. NEMS components offer near ideal device performances of multi-functionality, ultra-low power consumption and operational ruggedness.

Driven by the rapid recovery in automotive production and inventory rebuilding among sensor component suppliers, the market for automotive MEMS sensors will expand to record size in 2010, according to market research firm iSuppli, now part of IHS Inc.

Wafer level packaging (WLP) technology offers protection of delicate MEMS structures from ambient environment, providing improved reliability, performance, and reduced cost benefits to meet real world requirements. In simple terms, WLP consists of bonding a cap or a lid wafer on top of a MEMS wafer. While aspects of WLP can be modular, some customization is necessary to meet the needs of each application, where such variables include device footprint, temperature budget, allowable materials, hermeticity, absolute pressure, and cost. WLP technology is now widely used in the MEMS industry, and has contributed to mainstream acceptance of MEMS.

DALSA Semiconductor has announceed this week the qualification of a new generation of optical MEMS products for optical communications leader JDSU. These new optical MEMS devices enable JDSU's ROADM products which are a key building block for the next generation of optical networks and improve the performance of the optical fiber networks on which today's telecommunications and internet traffic depend.

In Dan Siewiorek's vision of the future, each of us will get an "iPhone 20" at birth. Powered by a wide range of MEMS devices, this personalized mobile device will monitor your heart rate when you exercise, help the visually impaired to grocery-shop, and remember important social clues such as people's names, phone numbers and directions. More of a "friend for life" than a smartphone, this intelligent device will help you to navigate your environment and will sustain you on a daily basis as you age.

The company is developing the system to provide multiplexed endpoint analysis for diagnostic applications. Rheonix uses its patented device to manipulate samples as diverse as blood, saliva, mucosal swabs and environmental sources, and sample sizes from 10 microliters to 2-3 milliliters for integrated processing from the raw sample through end-point analysis for clinical, research and environmental purposes on its system.

Lilliputian Systems, developer of a MEMS based portable power solution for consumer electronics devices, announced that it has signed a wafer manufacturing supply agreement with Intel. Additionally, Lilliputian announced that Intel Capital has taken an equity stake in Lilliputian Systems. "Intel recognizes that portable power solutions will be essential to consumer electronics devices and is committed to manufacturing Lilliputian's technology," said Brian Krzanich, SVP and GM of Manufacturing and Supply Chain for Intel Corporation.

Glass is often considered a more desirable material for particular MEMS device applications due to its unique properties, such as optical transparency and biological compatibility.

As the desire to use glass in the MEMS industry increases, so does the need to develop better methods to micro-machine this material. Traditional machining methods, such as CNC, are not very effective at machining brittle materials such as glass. In addition, as the diversity of MEMS applications expands, the desired features continue to get smaller, denser and more intricate.

Plures Technologies is in the final phase of acquiring and recapitalizing Advanced MicroSensors (AMS), an established high volume MEMS fabrication facility. AMS offers a complete suite of MEMS processing capabilities and specific expertise in the use of magnetic films for MEMS and other applications.