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Adhesive Recommended For High-Temp Aerospace Apps

This thermally conductive adhesive is recommended for high-temperature aerospace applications, as well as for electronic thermal links. The 2255 line is said to offer enhance dmechanical reliability and strength. It bonds readily to ceramics, glass, plastics, laminates, and most metals. A two-part paste, the adhesive is also claimed to provide excellent resistance to water, galvanic action, salt solutions, mild acids and bases, petroleum products, and many other chemicals. Special packaging, called BIPAX, enables small quantities of the adhesive to be used either on an as-needed basis or in mass production.