Here is the abstract you requested from the IMAPS_2013 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

One of the challenges in using very thin die, that is needed in thin package, is how to dice it cleanly without chipping, de-lamination of fragile low-k insulation material and contamination of bonding pads. Narrow dicing line is also highly preferable for high wafer usage.
The authors developed a novel