The semiconductor industry has relied on CVD and PVD technologies to meet much of the requirements in thin film depositions. Along with these process technologies, many standard materials, such as SiO2, Al and Ti, have been relied on to meet a majority of the industry's needs. However, now the industry is facing significant change—starting with the conversion to FinFETS and VNAND, as well as high mobility channels, spacers, novel gates, and high-κ gate dielectrics, all growing rapidly.

These new devices are leading to the adoption of many advanced deposition precursors and processes including ALD, MOCVD, FCVD, Gapfill/SOD, electroplating and others. This report examines the applications for advanced precursors and forecasts demand to 2020.