Snap Electrode, Its Bonding Method And Using Method - Patent 7186122

The present invention relates to an electrode for mounting a semiconductor and an electrode for connection of a flexible printed circuit (hereinafter also referred to as "FPC"). More specifically, it relates to an electrode for mounting(hereinafter also referred to as "connecting") an insertion-type semiconductor package or an electrode for connecting an FPC.BACKGROUND ARTA semiconductor package (hereinafter also simply referred to as "package") is used for storing a semiconductor, protecting the semiconductor against the external environment and mounting the same on a printed board or the like. Suchsemiconductor packages are classified into a surface-mount type and an insertion-mount type depending on methods of mounting the same on substrates.A surface-mount type package includes a BGA (Ball Grid Array), for example, which is mounted by directly soldering solder balls arranged on a base surface of the package at a constant interval in a latticelike manner to soldering patterns (mountpads) provided on the surface of a substrate. An insertion-mount type package includes a PGA (Pin Grid Array), for example, which is mounted by inserting pin electrodes vertically taken out from the package body into socket electrodes of a substrate. Following high integration and speed-up of hodiernal semiconductors as well as miniaturization/weight reduction of electronic devices, high-density mounting and miniaturization of semiconductors are required.The surface-mount type package, allowing refinement of the soldering patterns on the surface of the substrate and the solder balls and mountable on either side of the substrate, has a structure easy to densify. If once mounted, however, thesurface-mount type package having the base surface soldered to the substrate cannot be separated. In order to separate the package, the solder must be dissolved by heating, leading to such a problem that the overall device is badly influenced orre-mounting is inhibited due to deformation of the

United States Patent: 7186122
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( 1 of 1 )
United States Patent
7,186,122
Haga
March 6, 2007
Snap electrode, its bonding method and using method
Abstract
An object of the present invention is to provide an electrode for
high-density connection capable of attachment/detachment of a package or
an FPC. In order to attain this object, a snap electrode according to the
present invention has a tubular ring presenting a circular or polygonal
section and at least one spring electrode provided in the ring and
coupled to the ring, to be connected to a substrate or an FPC by holding
a pin electrode of an insertion-mount type package or the FPC with the
spring electrode. The snap electrode preferably consists of nickel or a
nickel alloy or consists of copper or a copper alloy, and is preferably
coated with a noble metal or conductive diamondlike carbon.
Inventors:
Haga; Tsuyoshi (Ako-gun, JP)
Assignee:
Sumitomo Electric Industries, Ltd.
(Osaka,
JP)
Appl. No.:
10/514,828
Filed:
April 4, 2003
PCT Filed:
April 04, 2003
PCT No.:
PCT/JP03/04371
371(c)(1),(2),(4) Date:
November 17, 2004
PCT Pub. No.:
WO03/098753
PCT Pub. Date:
November 27, 2003
Foreign Application Priority Data
May 17, 2002
[JP]
2002-142902
Current U.S. Class:
439/82 ; 439/342
Current International Class:
H01R 12/00&nbsp(20060101); H05K 1/00&nbsp(20060101)
Field of Search:
439/82,844,853,342,861,860
References Cited [Referenced By]
U.S. Patent Documents
1696616
December 1928
Wappler
3383648
May 1968
Tems
5411400
May 1995
Subrahmanyan et al.
6129559
October 2000
Hirata et al.
Foreign Patent Documents
1 174 885
Jan., 2002
EP
63-51069
Mar., 1988
JP
3-29139
Apr., 1991
JP
3-29139
Apr., 1991
JP
10-189168
Jul., 1998
JP
2001-102141
Apr., 2001
JP
2002-212770
Jul., 2002
JP
Other References
Office Action dated Apr. 7, 2006 issued in the corresponding Finnish patent application No. 20041464 and English translation thereof. cited by
other
.
Search Report dated Mar. 23, 2006 issued in the corresponding Finnish patent application No. 20041464. cited by other
.
"Retrospects and Prospects of Plating in the Electronics Industry", Xia Chuanyi, vol. 33, No. 3 Jun. 1996, with English abstract. cited by other.
Primary Examiner: Nasri; Javaid H.
Attorney, Agent or Firm: McDermott Will & Emery LLP
Claims
The invention claimed is:
1. A snap electrode, having a tubular ring presenting a circular or polygonal section and one or two spring electrodes provided in said ring and coupled to said ring,
to be connected to a substrate or a flexible printed circuit by holding a pin electrode of an insertion-mount type package or the flexible printed circuit with said spring electrode, wherein said spring electrode extends in a direction perpendicular to a
central axis of said tubular ring and curves at a portion holding said pin electrode to form a gap for holding said pin electrode, and wherein said spring electrode bends in a direction perpendicular to a central axis of said tubular ring when said pin
electrode is inserted.
2. The snap electrode according to claim 1, wherein said snap electrode consists of nickel or a nickel alloy.
3. The snap electrode according to claim 1, wherein said snap electrode consists of copper or a copper alloy.
4. The snap electrode according to claim 1, wherein said snap electrode is coated with a noble metal or conductive diamondlike carbon.
5. A method of bonding a snap electrode having a tubular ring presenting a circular or polygonal section and one or two spring electrodes provided in said ring and coupled to said ring by bonding only said ring part of the snap electrode and a
substrate electrode or an electrode of a flexible printed circuit with each other by ultrasonic bonding through gold or by soldering, wherein said spring electrodes extend in a direction perpendicular to a central axis of said tubular ring and curve at a
portion holding said pin electrode to form a gap for holding said pin electrode, and wherein said spring electrode bends in a direction perpendicular to a central axis of said tubular ring when said pin electrode is inserted.
6. A method of using a snap electrode having a tubular ring presenting a circular or polygonal section and one or two spring electrodes provided in said ring and coupled to said ring by holding a pin electrode of an insertion-mount type package
or a flexible printed circuit with said spring electrode wherein said spring electrode extends in a direction perpendicular to a central axis of said tubular ring and curves at a portion holding said pin electrode to form a gap for holding said pin
electrode, thereby connecting the snap electrode to a substrate or the flexible printed circuit, and wherein said spring electrode bends in a direction perpendicular to a central axis of said tubular ring when said pin electrode is inserted.
7. A snap electrode comprising: a tubular ring having a circular or polygonal cross section; and a maximum of two spring electrodes situated within the ring and coupled thereto, the spring electrodes configured to be coupled to a substrate or
flexible printed circuit by holding a pin electrode of an insertion-mount type package or the flexible printed circuit; wherein at least one of the two spring electrodes extends in a direction perpendicular to a central axis of said tubular ring and
comprises a straight portion and a curved portion, the curved portion configured to form a gap for holding the pin electrode in contact with the curved portion, and wherein said spring electrode bends in a direction perpendicular to a central axis of
said tubular ring when said pin electrode is inserted. Description
TECHNICAL FIELD
The present invention relates to an electrode for mounting a semiconductor and an electrode for connection of a flexible printed circuit (hereinafter also referred to as "FPC"). More specifically, it relates to an electrode for mounting
(hereinafter also referred to as "connecting") an insertion-type semiconductor package or an electrode for connecting an FPC.
BACKGROUND ART
A semiconductor package (hereinafter also simply referred to as "package") is used for storing a semiconductor, protecting the semiconductor against the external environment and mounting the same on a printed board or the like. Such
semiconductor packages are classified into a surface-mount type and an insertion-mount type depending on methods of mounting the same on substrates.
A surface-mount type package includes a BGA (Ball Grid Array), for example, which is mounted by directly soldering solder balls arranged on a base surface of the package at a constant interval in a latticelike manner to soldering patterns (mount
pads) provided on the surface of a substrate. An insertion-mount type package includes a PGA (Pin Grid Array), for example, which is mounted by inserting pin electrodes vertically taken out from the package body into socket electrodes of a substrate.
Following high integration and speed-up of hodiernal semiconductors as well as miniaturization/weight reduction of electronic devices, high-density mounting and miniaturization of semiconductors are required.
The surface-mount type package, allowing refinement of the soldering patterns on the surface of the substrate and the solder balls and mountable on either side of the substrate, has a structure easy to densify. If once mounted, however, the
surface-mount type package having the base surface soldered to the substrate cannot be separated. In order to separate the package, the solder must be dissolved by heating, leading to such a problem that the overall device is badly influenced or
re-mounting is inhibited due to deformation of the solder balls.
The insertion-mount type package allows multiplication of input/output pin electrodes as well as attachment/detachment of the package due to its structure. However, the socket electrodes receiving the pin electrodes manufactured by machining are
so hard to miniaturize that the pin pitch is limited to about 500 .mu.m to 1 mm. Further, the package manufactured by machining exhibits large dimensional dispersion, and requires a thickness of at least about 1 mm for attaining reliable electrical
contact.
As to connection of an FPC, on the other hand, a connector prepared by covering an electrode formed by punching with a housing of resin is used for connecting FPCs or an FPC and a substrate such as a printed board with each other. In the FPC
connector, however, refinement of the electrode size is limited due to machining, and it is difficult to miniaturize the connector and narrow the pitch of terminals due to securement of mechanical strength of the housing.
DISCLOSURE OF THE INVENTION
An object of the present invention is to provide an electrode for high-density connection capable of attachment/detachment of a package or an FPC. In order to attain this object, a snap electrode according to the present invention has a tubular
ring presenting a circular or polygonal section and at least one spring electrode provided in this ring and coupled to this ring, to be connected to a substrate or an FPC by holding a pin electrode of an insertion-mount type package or the FPC with the
spring electrode. The snap electrode preferably consists of nickel or a nickel alloy, or of copper or a copper alloy, and is preferably coated with a noble metal or conductive diamondlike carbon.
A method of bonding a snap electrode according to the present invention is a method of bonding a snap electrode having a tubular ring presenting a circular or polygonal section and at least one spring electrode provided in the ring and coupled to
the ring by bonding only the ring part of the snap electrode and a substrate electrode or an electrode of an FPC with each other by ultrasonic bonding through gold or by soldering.
A method of using a snap electrode according to the present invention is a method of using a snap electrode having a tubular ring presenting a circular or polygonal section and at least one spring electrode provided in the ring and coupled to the
ring by holding a pin electrode of an insertion-mount type package or an FPC with the spring electrode thereby connecting the snap electrode to a substrate or the FPC.
BRIEF DESCRIPTION OF THE DRAWINGS
FIGS. 1A and 1B are perspective view showing a method of using a snap electrode according to the present invention.
FIGS. 2A to 2L are sectional views showing the shapes of snap electrodes according to the present invention.
FIGS. 3A to 3E and FIGS. 4A to 4G are process drawings showing methods of manufacturing snap electrodes according to the present invention.
FIG. 5 is a perspective view showing a method of bonding a snap electrode according to the present invention.
BEST MODE FOR CARRYING OUT THE INVENTION
(Snap Electrode)
A snap electrode according to the present invention typically consists of a ring 11a and spring electrodes 11b, as shown in FIG. 1A or 1B. This snap electrode 11 is bonded to a substrate electrode 12 provided on a substrate such as a printed
board or an electrode provided on an FPC. In order to connect an insertion-mount type package or an FPC to a substrate or another FPC, the spring electrodes 11b hold a pin electrode 13 of the insertion-mount type package or the FPC. While an electrode
of a conventional socket for a PGA is protected by a plastic case, refinement is limited in this structure. The snap electrode according to the present invention implements a micro size by integrally forming the ring protecting the electrode around the
spring electrodes.
In order to hold the pin electrode 13 with the spring electrodes 11b, the pin electrode 13 is inserted into a gap 14 formed by the spring electrodes 11b along arrow so that the pin electrode 13 is held with the spring electrodes 11b as shown in
FIG. 1A, for example. Alternatively, the pin electrode 13 is inserted into the ring 11a and thereafter displaced along arrow so that the pin electrode 13 moved to a gap 14 formed by the spring electrodes 11b is held with the spring electrodes 11b as
shown in FIG. 1B, for example.
The snap electrode according to the present invention can be effectively utilized for connecting an insertion-mount type package or an FPC to a substrate or another FPC. For example, the snap electrode can be utilized for mounting an
insertion-mount type package on a substrate such as a printed board, connecting an FPC to a substrate, connecting an insertion-mount type package to an FPC or connecting an FPC to another FPC, for example.
The ring is a tubular body presenting a circular or polygonal section. The term "circular or polygonal section" denotes a circular or polygonal section obtained by cutting the tubular ring along a plane perpendicular to the longitudinal
direction. The circular section includes not only a completely circular section but also an approximately circular section such as an elliptic section or a section having a partially distorted circumference, for example. The polygonal section, denoting
a quadrangular or hexagonal section, for example, includes not only a regular-polygonal section but also a polygonal section provided with sides having different lengths. FIGS. 2A to 2F show exemplary circular rings 21a. FIGS. 2G to 2L show exemplary
hexagonal rings 21a.
The ring has at least one spring electrode therein. The snap electrode provided with the spring electrode can hold a pin electrode of an insertion-type package or the like, to be connected to a substrate for attaining electrical and mechanical
connection. The spring electrode is coupled to the ring. The spring electrode coupled to the ring can be protected when the snap electrode is manufactured, and a load applied to the spring electrode when receiving the pin electrode can be dispersed to
the ring for protecting the spring electrode. FIGS. 2A to 2C, 2F, 2G to 2I and 2L show exemplary snap electrodes 21 each having a ring 21a and two spring electrodes 21b. FIGS. 2D, 2E, 2J and 2K show exemplary snap electrodes 21 each having a ring 21a,
a spring electrode 21b and a filler 21c consisting of an electrode material provided on the upper half of the ring 21a. As to a gap 24 for engaging with the pin electrode, the present invention also includes such a mode that the gap 24 is located on a
position slightly displaced from the central portion of the ring 21a in addition to a mode located on the central portion of the ring 21a as shown in FIG. 2A.
(Method of Manufacturing Snap Electrode)
The snap electrode according to the present invention is preferably manufactured by a method including steps of forming a resin mold by lithography and forming a layer consisting of a metallic material in the resin mold by electroforming. A
socket electrode used for connection of an insertion-type package or the like, manufactured by machining, cannot be miniaturized but has an outer diameter of 500 .mu.m to 1 mm and a thickness of about 1 mm at the minimum, and high-density connection of a
semiconductor is limited due to these sizes. The snap electrode according to the present invention, manufactured by the method combining lithography and electroforming, can be reduced to an outer diameter of 50 .mu.m to 500 .mu.m and a thickness of 50
.mu.m to 1 mm for enabling high-density connection. Further, the electrode for connection of an insertion-type package or the like allows attachment/detachment of the package. In addition, the snap electrode having the spring electrode coupled to the
ring for protecting the spring electrode can be readily monolithically manufactured, with no requirement for assembling.
According to the method of manufacturing the snap electrode, a resin layer 32 for lithography is first formed on a conductive substrate 31, as shown in FIG. 3A. A metal substrate of copper, nickel or stainless steel or a silicon substrate formed
by sputtering a metallic material such as titanium or chromium can be employed as the conductive substrate, for example. The material for forming the resin layer includes a resin material mainly composed of polymethacrylate ester such as polymethyl
methacrylate (PMMA) or a chemically amplified resin material having X-ray sensitivity. The thickness of the resin layer can be arbitrarily set to 50 .mu.m to 1 mm, for example, in response to the height of the snap electrode to be formed. The snap
electrode can attain an effect (wiping effect) of scraping off soil adhering to the electrode for implementing electrically reliable connection when receiving the pin electrode by ensuring a certain degree of height.
Then, a mask 33 is arranged on the conductive substrate 31, for applying X-rays 34 (or ultraviolet rays) through the mask 33. As to the X-rays, synchrotron radiation X-rays (hereinafter abbreviated as "SR") capable of implementing a high aspect
ratio are preferable. The mask 33 has X-ray absorption layers 33a formed in response to a prescribed pattern of the snap electrode. Comparing a circular shape and a hexagonal shape with each other, for example, as to the shape of the ring constituting
the snap electrode, the hexagonal shape allowing efficient arrangement on the mask is preferable to the circular shape. Light-transmittable bases 33b constituting the mask 33 can be prepared from silicon nitride, silicon, diamond or titanium, for
example. The X-ray absorption layers 33a can be prepared from a heavy metal such as gold, tungsten or tantalum or a compound thereof, for example. When development is performed and parts 32a altered by the X-rays 34 are removed after application of the
X-rays 34, a resin mold 32b shown in FIG. 3B is obtained.
Then, electroforming is performed for depositing a metallic material 35 in vacancies of the resin mold 32b, as shown in FIG. 3C. The term "electroforming" denotes an operation of forming a layer consisting of a metallic material on a conductive
substrate with a metal ionic solution. The conductive substrate 31 is employed as a plating electrode for performing electroforming so that the metallic material 35 can be deposited in the vacancies of the resin mold 32b, and the layer consisting of the
deposited metallic material 35 finally forms the snap electrode. The metallic material can be prepared from nickel, copper or gold, an alloy thereof or permalloy, while nickel, copper, a nickel alloy or a copper alloy is preferable in the point that
mechanical strength is large when and after a pin electrode of a package or the like is inserted and the point that the electrode exhibits high conductivity.
After the electroforming, a prescribed thickness is obtained by polishing or grinding, and the resin mold 32b is removed by wet etching or plasma etching (FIG. 3D). Then, the conductive substrate 31 is removed by wet etching with acid or alkali
or by mechanical working, for obtaining a snap electrode shown in FIG. 3E.
As another method of manufacturing the inventive snap electrode, a method including steps of forming a resin mold by a metal mold and forming a layer consisting of a metallic material in the resin mold by electroforming can be used. A
micro-sized snap electrode having an outer diameter of 50 .mu.m to 500 .mu.m and a thickness of 50 .mu.m to 1 mm can be manufactured also by this method. This snap electrode has a structure obtained by coupling a spring electrode and a ring for
protecting the spring electrode with each other, and can implement high-density connection of a semiconductor. Further, the electrode can be used as an electrode for an insertion-mount type package or an FPC, and allows attachment/detachment of the
package or the FPC.
As shown in FIG. 4A, a concave resin body 43 shown in FIG. 4B is formed by pressing or molding such as injection molding with a mold 42 having projections. Thermoplastic resin such as acrylic resin such as polymethyl methacrylate or polyacetal
resin such as polyurethane resin or polyoxymethylene, for example, can be employed as the resin. The mold 42, which is a microstructure similarly to the snap electrode according to the present invention, is preferably manufactured by lithography or the
like.
Then, the resin body 43 is vertically inverted and thereafter bonded to a conductive substrate 41, as shown in FIG. 4C. Then, the resin body 43 is polished for forming a resin mold 43a, as shown in FIG. 4D. Thereafter a metallic material 45 is
deposited by electroforming (FIG. 4E) and the thickness is adjusted for thereafter removing the resin mold 43a (FIG. 4F) and removing the conductive substrate 41, thereby obtaining a snap electrode shown in FIG. 4G, similarly to the above.
The snap electrode is preferably coated with a noble metal such as gold, palladium or platinum for improving electrical contact and corrosion resistance. The surface of the snap electrode can be readily coated with gold or the like by barrel
plating or the like. Alternatively, the snap electrode is preferably coated with conductive diamondlike carbon for improving abrasion resistance. When the snap electrode is coated with diamondlike carbon, a carbon film having a diamondlike crystal
structure is formed on the surface of the snap electrode.
(Method of Bonding Snap Electrode)
A method of bonding the snap electrode according to the present invention is employed for bonding only the ring part of the aforementioned snap electrode and a substrate electrode or an electrode of an FPC with each other by ultrasonic bonding
through gold or by soldering. Only the ring part of the snap electrode is bonded to the substrate electrode or the electrode of the FPC so that motion of the spring electrode can be smoothed when receiving the pin electrode by forming a gap between the
substrate electrode or the electrode of the FPC and the spring electrode. In order to bond only the ring part of the snap electrode and a substrate electrode with each other, for example, a substrate electrode 52 having a projection 52a on a portion
coming into contact with a ring 51a of a snap electrode 51 is so prepared that this substrate electrode 52 and the snap electrode 51 are bonded to each other, as shown in FIG. 5. Alternatively, only the portion of the substrate electrode coming into
contact with the ring of the snap electrode is soldered for bonding these electrodes to each other.
As the bonding method, a method of performing ultrasonic bonding through gold or a method of performing bonding by soldering is preferable in the point that high conductivity and sufficient bonding strength can be attained. The ultrasonic
bonding, ultrasonically applying vibration while pressing a contact surface in a solid-phase state for breaking an adsorption film or the like with its energy thereby attaining bonding, is preferable in the point that strong bonding is attained in a
short time. The ultrasonic vibration frequency is preferably 10 kHz to 1000 kHz, and more preferably 10 kHz to 100 kHz. It is difficult to sufficiently break an absorption layer if the vibration frequency is smaller than 10 kHz, while there is a
possibility of breakage due to high energy if the vibration frequency is larger than 1000 kHz. The pressurization condition is preferably 0.01 MPa to 100 MPa, and more preferably 0.01 MPa to 50 MPa. If the pressurization condition is smaller than 0.01
MPa, plastic deformation so readily takes place in the vicinity of the contact interface that sufficient bonding strength is hard to obtain. If the pressurization condition is larger than 100 MPa, on the other hand, there is an apprehension that the
electrode is deformed and broken. The ultrasonic boding is preferably performed after coating both of the snap electrode and the substrate electrode or the like with gold, in order to attain sufficient conductivity and bonding strength.
(Method of Using Snap Electrode)
A method of using the snap electrode according to the present invention is characterized in that the said snap electrode is connected to a substrate or an FPC by holding a pin electrode of an insertion-mount type package or the FPC with the
spring electrode. According to this using method, the snap electrode allows attachment/detachment of the package, and can implement high-density connection.
EXAMPLE 1
First, a resin layer 32 for lithography was formed on a conductive substrate 31, as shown in FIG. 3A. A silicon substrate obtained by sputtering titanium was employed as the conductive substrate. A copolymer of methyl methacrylate and
methacrylic acid was employed as the material for forming the resin layer, and the thickness of the resin layer was set to 100 .mu.m.
Then, a mask 33 was arranged on the conductive substrate 31, for applying X-rays 34 through the mask 33. SR was emitted from an SR-ring (NIJI-III) as the X-rays. A mask having X-ray absorption layers 33a consisting of a prescribed snap
electrode pattern was used as the mask 33. Light-transmittable bases 33b constituting the mask 33 consisted of silicon nitride, and layers consisting of tungsten nitride were employed as the X-ray absorption layers 33a.
Development was performed with methyl isobutyl ketone after the application of the X-rays 34, and parts 32a altered by the X-rays 34 were removed for obtaining a resin mold 32b shown in FIG. 3B. Then, electroforming was performed for depositing
a metallic material 35 in vacancies of the resin mold 32b, as shown in FIG. 3C. Nickel was employed as the metallic material.
After the electroforming, surface irregularities were removed by polishing, thereafter the resin mold 32b was removed by oxygen plasma (FIG. 3D), and wet etching was thereafter performed with an NaOH aqueous solution for removing the conductive
substrate 31, thereby obtaining a through-state snap electrode as shown in FIG. 3E.
As shown in FIG. 5, the obtained snap electrode 51 had a tubular ring 51a presenting a circular section, with two spring electrodes 51b provided in the ring 51a. Both ends of the spring electrodes 51b were coupled to the ring 51a. This ring 51a
had an outer diameter of 200 .mu.m and a height of 100 .mu.m.
A substrate electrode 52 having a projection 52a in a portion coming into contact with the ring 51a of the snap electrode 51 as shown in FIG. 5 was prepared, the snap electrode 51 and the substrate electrode 52 were coated with gold by barrel
plating, and the substrate electrode 52 was thereafter mounted on a printed board (not shown). Finally, the ring 51a of the snap electrode 51 and the projection 52a of the substrate electrode 52 were superposed with each other and ultrasonically bonded
to each other (at 50 kHz and 30 MPa). Similarly, 30 sets of snap electrodes and substrate electrodes were mounted on the printed board.
A PGA having a pin pitch of 250 .mu.m was mounted on the obtained printed board. This mounting was performed by inserting each pin electrode 13 into a gap 14 formed by each pair of spring electrodes 11b along arrow and holding the pin electrode
13 with the spring electrodes 11b, as shown in FIG. 1A. Consequently, electrical and mechanical connection was attained, and it was possible to attach/detach the PGA. While the outer diameter of the snap electrode was 200 .mu.m in this Example, it has
been clarified that further densified mounting is also possible since a snap electrode having an outer diameter of about 50 .mu.m can also be manufactured.
EXAMPLE 2
A printed board was manufactured similarly to Example 1 except that a snap electrode 11 shown in FIG. 1B was employed in place of the snap electrode 51 shown in FIG. 5. The snap electrode 11 had a tubular ring 11a presenting a circular section,
with two spring electrodes 11b provided in the ring 11a. The spring electrodes 11b according to this Example, having first ends coupled to the ring 11a and second ends not coupled to the ring 11a dissimilarly to the spring electrodes according to
Example 1, exhibited larger movability as compared with the spring electrodes according to Example 1.
A PGA having a pin pitch of 250 .mu.m was mounted on the obtained printed substrate. This mounting was performed by inserting each pin electrode 13 in the ring 11a and thereafter displacing the same along arrow for holding the pin electrode 13
moved to a gap 14 formed by the spring electrodes 11b with the spring electrodes 11b, as shown in FIG. 1B. Consequently, electrical and mechanical connection was attained, and it was possible to attach/detach the PGA.
Embodiments and Examples disclosed this time are to be considered as illustrative in all points and not restrictive. The scope of the present invention is shown not by the above description but by the scope of claim for patent, and it is
intended that all modifications within the meaning and the range equivalent to the scope of claim for patent are included.
INDUSTRIAL AVAILABILITY
According to the present invention, an electrode for high-density connection capable of attachment/detachment of a package or an FPC can be provided. This electrode has small dimensional dispersion despite its small size, and requires no
assembling.
* * * * *