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Method for embedded plated through-holes in an organic substrate core

Publishing Venue

Abstract

Disclosed is a method for embedded plated through-holes (PTHs) in an organic substrate core. Benefits include improved throughput.

Country

United States

Language

English (United States)

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Method for embedded plated
through-holes in an organic substrate core

Disclosed is a method for embedded
plated through-holes (PTHs) in an organic substrate core. Benefits include
improved throughput.

Background

The
conventional process of drilling and plating contribute to product cost. The
epoxy material with the required filler is cured to form the core. Holes are
drilled through this core material, followed by electroplating to form the
walls of the PTH. The area inside the copper walled holes is filled with an
organic material. By some estimates, drilling PTHs in a core contributes about
12% of the substrate cost.

General description

The disclosed
method utilizes a low-cost approach for
embedding conductors in an organic core to function as plated through-holes in
the substrate. The key element of this process is in the way the plated
through-holes are formed in a substrate with an organic core. The conventional
drilling, and copper electroplating steps are replaced by punching a copper
wire of the required thickness through the core material in the green state,
then curing the sheet to form the core. The processes to form the build-up
layers remain the same.

Advantages

The disclosed
method provides advantages, including:

§
Reduced cost

§
Simplicity
of process

Detailed description

The
disclosed method includes a wire dispenser that embeds the copper wire in green epoxy material
that contains the appropriate filler material (see Figure 1a). The dispensing
head can be preprogrammed to embed the wires in the required pattern on the
epoxy material. Some copper wire is exposed through both surfaces of the core
(see Figure 1b) to form PTH lands. The green epoxy is cured (see Figure 1c) to
firmly embed the copper wires in the epoxy medium. A mechanical press is used
to form lands on either side of the copper wire (see Figure 1d), using the wire
that protrudes through the surface.

Embedding
the copper wires on the core prior to epoxy curing reduces buckling because
epoxies are extremely compliant in their green state. Critical load for
buckling for a 150-micron diameter via is 140N (see Figure 2). As long as the
load required to push the wire through the core...