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1 Introduction

As the complexity of computer systems increases, so do power dissipation requirements. The additional power of next generation systems must be properly dissipated. Heat can be dissipated using improved system cooling, selective use of ducting, and/or active/passive heatsinks.

The objective of thermal management is to ensure that the temperatures of all components in a system are maintained within functional limits. The functional temperature limit is the range within which the electrical circuits can be expected to meet specified performance requirements. Operation outside the functional limit can degrade system performance, cause logic errors, or cause component and/or system damage. Temperatures exceeding the maximum operating limits may result in irreversible changes in the operating characteristics of the component. The goal of this document is to provide an understanding of the operating limits of the Intel® 82945G/82945GZ/82945GC Graphics and Memory Controller Hub (GMCH) and Intel® 82945P/82945PL Memory Controller Hub (MCH), and discuss a reference thermal solution.

The simplest and most cost-effective method to improve the inherent system cooling characteristics of the (G)MCH is through careful design and placement of fans, vents, and ducts. When additional cooling is required, component thermal solutions may be implemented in conjunction with system thermal solutions. The size of the fan or heatsink can be varied to balance size and space constraints with acoustic noise.

This document presents the conditions and requirements to properly design a cooling solution for systems that implement the 82945G/82945GZ/82945GC GMCH or 82945P/82945PL MCH. Properly designed solutions provide adequate cooling to maintain the (G)MCH case temperature at or below thermal specifications. This is accomplished by providing a low local-ambient temperature, ensuring adequate local airflow, and minimizing the case to local-ambient thermal resistance. By maintaining the (G)MCH case temperature at or below those recommended in this document, a system designer can ensure the proper functionality, performance, and reliability of these components.

The (G)MCH package uses a “balls anywhere” concept. The minimum ball pitch is 0.8 mm [0.031 in], but ball ordering does not follow a 0.8-mm grid. Board designers should ensure correct ball placement when designing for the non-grid array pattern. For exact ball locations relative to the package, contact your Field Sales Representative.

Thermal and Mechanical Design Guidelines

11

Product Specifications

Figure 1. (G)MCH Non-Grid Array

2.2Package Loading Specifications

Table 1 provides static load specifications for the chipset package. This mechanical maximum load limit should not be exceeded during heatsink assembly, shipping conditions, or standard use conditions. Also, any mechanical system or component testing should not exceed the maximum limit. The chipset package substrate should not be used as a mechanical reference or load-bearing surface for the thermal and mechanical solution.

Table 1. (G)MCH Loading Specifications

Parameter

Maximum

Notes

Static

15 lbf

1,2,3

NOTES:

1.These specifications apply to uniform compressive loading in a direction normal to the (G)MCH package.

2.This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide the minimum specified load on the (G)MCH package.

3.These specifications are based on limited testing for design characterization. Loading limits are for the package only.