Intel® 82563EB/82564EB LAN on Motherboard: Design Guide

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82571EB Gigabit Ethernet Controller Design Guide Application Note 447

Intel® 82563EB/82564EB LAN on Motherboard: Design Guide

Introduction

The Intel® 82563EB/82564EB Gigabit Platform LAN Connect device is a dual/single, compact component designed for 10/100/1000 Mbps operation. The Intel 82563EB/82564EB Gigabit Platform LAN Connect device enables dual/single port Gigabit Ethernet implementation in a very small area — easing routing constraints from the chipset to the PHY. Note that the 82564EB Gigabit Platform LAN Connect device is the single port implementation.

The 82563EB/82564EB Gigabit Platform LAN Connect device is designed for high performance. The device connects directly to the Intel® 631xESB/632xESB I/O Controller Hub using the serial Kumeran interface.

The 82563EB/82564EB Gigabit Platform LAN Connect device is packaged in a 14 mm x 14 mm x 1.2 mm with 0.5 mm pitch leads, 100-pin TQFL with Exposed-Pad*. An Exposed-Pad* is a central pad on the bottom of the package that serves as a ground and thermal connection.

Scope

This application note contains Ethernet design guidelines applicable to 82563EB/82564EB LOM designs based on 631xESB/632xESB designs. All guidelines are applicable to both the 82563EB and 82564EB unless specifically specified.

The Intel® 82563EB/82564EB Gigabit Platform LAN Connect device is a dual/single, compact component designed for 10/100/1000 Mbps operation. The Intel 82563EB/82564EB Gigabit Platform LAN Connect device enables dual/single port Gigabit Ethernet implementation in a very small area — easing routing constraints from the chipset to the PHY. Note that the 82564EB Gigabit Platform LAN Connect device is the single port implementation.

The 82563EB/82564EB Gigabit Platform LAN Connect device is designed for high performance. The device connects directly to the Intel® 631xESB/632xESB I/O Controller Hub using the serial Kumeran interface.

The 82563EB/82564EB Gigabit Platform LAN Connect device is packaged in a 14 mm x 14 mm x 1.2 mm with 0.5 mm pitch leads, 100-pin TQFL with Exposed-Pad*. An Exposed-Pad* is a central pad on the bottom of the package that serves as a ground and thermal connection.

Scope

This application note contains Ethernet design guidelines applicable to 82563EB/82564EB LOM designs based on 631xESB/632xESB designs. All guidelines are applicable to both the 82563EB and 82564EB unless specifically specified.