Samsung Electronics said Tuesday it has begun mass production of the world's
highest-capacity multi-chip (MCP) package for high-end mobile phones.

With two 1-gigabit NAND flash memory chips and two other dynamic random access memory
chips, the new MCP chip has a combined capacity of 2.5 gigabits in a package, the company
said in a statement.

The new chip will allow mobile phone users to store about four hours of moving images in their
handsets.

Samsung, which is also the world's No. 3 mobile phone maker, said it plans to develop an
8-gigabit MCP chip this year.

Multi-chip package products, popular in high-end mobile phones and other digital devices that
require advanced memory capability, are manufactured by combining different types of memory
chips in one chip.