An all-optical technique is developed to determine elastic parameters of both semiconductor wafers and cantilever beams through optical excitation and detection of vibration modes. Resonance frequency measurements of these modes are used to determine the materials Young’s modulus and Poisson’s ratio. The technique is remote, non-destructive and works on-line, making it an attractive inspection tool for use in semiconductor foundries and MEMS industries. Experimental results are compared with the values calculated by the theory of elasticity.

Publication date

2006-03-06

Language

English

Affiliation

National Research Council Canada (NRC-CNRC); NRC Industrial Materials Institute