The Society’s Journal is a scientific and professional journal established to deal with the specialized science and expertise behind the microelectronics and electronic packaging technology of the electronics industry, and is similar to the Journal of the International Microelectronics and Packaging Society in its configuration and operating system.

The papers published in the Journal focus predominantly on the study of electronic packaging, and their fields correspond to the interdisciplinary area. They cover PCB technology, soldering, system design, various levels of internal thermal design of electronic devices, miniaturization of electronic products, improvement of mechanical properties and reliability of various components, as well as optoelectronic technology in the fields of electronics, material science, mechanical engineering and chemical engineering, etc.

In addition, the Society cooperates closely with the domestic electronics industry in the field of microelectronics and packaging by forming relationships, actively conducts academic exchanges, and publishes papers in scientific journals regarding technological development trends of the industry. The value of this Journal is dedicated to developing the technology of Microelectronics and Electronic Packaging in our country, by presenting many creative studies through interdisciplinary studies and collaboration.