Brewer Science Releases ARC&reg;160 Series

Feb 26, 2007

Brewer Science, a leading supplier of advanced lithography materials, has released ARC®160, a ArF (193nm) anti-reflective coating that is demonstrating, as POR at large semiconductor fabricators, faster etch and dramatically lower out-gassing in the newer bake module than other ARC® materials. This versatile coating has proven value in multiple applications for semiconductor processing applications such as, pre-metal dielectric, hardmask and shallow trench isolation applications.

Solving the problem of out-gassing from lithography materials within new IC processing bake equipment is squarely and soundly addressed with the latest generation of ARC materials. ARC160 is designed to produce extremely low amounts of sublimates during bake, unlike less sophisticated spin-on materials (see out-gassing graph).

Less out-gassing helps increase wafer throughput, since you will not have unscheduled shutdowns to clean residue from your coat/bake module. And ARC®160 has a etch-budget saving etch rate (see etch rate graph).

Brian Larabee, Managing Director, Marketing for Brewer Science, wishes to express his excitement on the release of ARC®160 in that this clean baking spin-on organic BARC material demonstrates our continue focus on the customer's problems. He stated, "We understand that unscheduled maintenance of the bake module was really cutting into through-put and we knew we could help by carefully studying the core issues and then modifying our products to reduce the sublimates."