STE MS105 Versatile Magnetron Sputtering System Dec 3, 2013

Company details

Versatile System for the deposition processes in vacuum
using magnetron sputtering technique. STE MS105 System is designed in accordance with all modern principles of magnetron PVD processing.

System was intended in flexible design for a wide range
of magnetron related PVD applications in R&D and allows
to sputter magnetic materials and multicomponent
oxides on the substrate heated up to 900°C using magnetron
targets as a materials’ sources. Maximum wafer
size is 150 mm.
The System design allows its installation through the
clean room wall, and the control interface and load-lock
chamber are located in the clean room.
Main advantages:
• magnetron sputtering of multicomponent materials from 2-3 magnetrons simultaneously
• ability to reconfigure the System for using up to 7 magnetrons for sequential materials evaporation
• using 2 or 3 magnetrons with the same targets for achieving the best uniformity for ∅100 mm
and ∅150 mm wafers