Cascade Microtech to Showcase Newest Wafer Probing Solutions

Published on May 22, 2013 at 7:11 AM

Cascade Microtech, Inc., a leader at enabling precision measurements of integrated circuits at the wafer level, today announced the kickoff of its series of CONNECT events. In this series of local events beginning in San Jose, CA and travelling throughout Europe, Asia and Japan, CONNECT will feature the company’s newest wafer probing solutions and will provide a forum for discussing the most current challenges facing device and process design engineers and manufacturers today.

CONNECT is being launched as a platform for communication and sharing of ideas, challenges and best-practice solutions; it is Cascade Microtech’s belief that the information that drives discovery and innovation is the accumulated knowledge of its industry peers. During the course of CONNECT’s global tour, attendees will meet the innovative team of design engineers, technical managers and executives who created its newest wafer probing solutions to enable customers to meet evolving test challenges. Two specific areas will be highlighted; high-power device production probing and process characterization/modeling. Cascade Microtech has recently introduced new solutions that address these challenges.

In separate seminars targeted at process development and production test engineers, the CONNECT agenda will address the market outlook as well as introduce Cascade Microtech’s response to the industry challenges. For on-wafer power device probing, the company’s APS200TESLA fully-automated on-wafer probe system will be presented, underscoring the importance of its unique capabilities to provide a safe and high-performance production test environment for high-voltage/high-current applications. Rated up to 10.5kV DC/400 A, Cascade Microtech’s APS200TESLA is the first fully-automated on-wafer probe system to offer unmatched electrical performance for high-current/high-voltage probing of power devices in a production environment. The probe system features a high-voltage/high-power chuck port, and the patent-pending MicroVac™ chuck that can handle wafer thicknesses down to 50 µm, including the ultra-thin Taiko wafers. The APS200TESLA enables high-power device manufacturers to achieve better yields and deliver superior cost of test.

Another new product we will highlight is the new CM300. Delivering high integrity data, the CM300 is a semi-/fully-automated 300 mm probe system for device and process characterization and modeling. The CM300 is a flexible on-wafer measurement platform that scales to meet evolving needs in capability and automation. It enhances device and process characterization and modeling by capturing the true electrical performance of devices and enabling hands-off productivity. Its high-accuracy performance enables minimization of design iterations, delivering reliable data, reducing costs and speeding time-to-market.

"We are excited to be launching the first CONNECT series, which will bring Cascade Microtech’s innovators and leaders closer to the semiconductor process and production test engineers who face escalating demands to produce more data, and to deliver products to market, faster than ever before,” said Debbora Ahlgren, Vice President, Marketing. “This is a great opportunity for us to learn from the folks on the cutting edge who are reacting to the market drivers forcing changes in process technology. As a result, we can put our innovative resources to work helping them overcome challenges to test and measurement."

As a continuation of Cascade Microtech’s focus on knowledge exchange, we will be hosting the first Cascade Microtech user meeting, COMPASS, on September 9th in Anaheim. Look for information on the company’s website.

For full details and registration information on CONNECT, visit connect.cascademicrotech.com.