Circuit Board Aluminio Manufacturing CapabilitiesOur circuit board aluminio manufacturing capabilities can meet almost 95% demand of customer requirements and actually we concentrated on this field for decades, so plant facilities have been advanced to high level and your intelligent manufacturing could be well handled here

Total Pad Size

Standard

Advanced

Capture Pad

Drill + 0.008

Drill + 0.006

Landing Pad

Drill + 0.008

Drill + 0.006

BC Mechanical Drill (Type III)

0.008

0.006

Laser Drill Size

0.004-0.010

0.0025

Material Thickness

0.0035

0.0025

Stacked Via

Yes

Yes

Type I Capabilities single & Double Deep

Yes

Yes

Type II Capabilities Buried Vias with Microvias

Yes

Yes

Type III Capabilities

Yes

Yes

Copper Filled Microvia

Yes

Yes

Smallest Copper Filled Microvia

0.004

0.0025

Copper Filled Microvia Aspect Ratio

0.75:1

1:01

Smallest Laser Microvia Hole Size

0.004

0.0025

Laser Via Aspect Ratio (Depth:Diameter)

0.75:1

c

Circuit Board Aluminio Manufacturing Process

We are offering circuit board aluminio manufacturing and assembly services to following big customers all over the worldYour circuit board aluminio demand will be perfectly handled by our professional production line and responsible work team.