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A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate. It is also referred to as printed wiring board (PWB) or etched wiring board. Printed circuit boards are used in virtually all but the simplest commercially produced electronic devices.

A PCB populated with electronic components is called a printed circuit assembly (PCA), printed circuit board assembly or PCB Assembly (PCBA). In informal use the term “PCB” is used both for bare and assembled boards, the context clarifying the meaning.

Circuit properties of the PCB

Each trace consists of a flat, narrow part of the copper foil that remains after etching. The resistance, determined by width and thickness, of the traces must be sufficiently low for the current the conductor will carry. Power and ground traces may need to be wider than signal traces. In a multi-layer board one entire layer may be mostly solid copper to act as a ground plane for shielding and power return.

For microwave circuits, transmission lines can be laid out in the form of stripline and microstrip with carefully controlled dimensions to assure a consistent impedance. In radio-frequency and fast switching circuits the inductance and capacitance of the printed circuit board conductors become significant circuit elements, usually undesired; but they can be used as a deliberate part of the circuit design, obviating the need for additional discrete components.

Printed circuit assembly

After the printed circuit board (PCB) is completed, electronic components must be attached to form a functional printed circuit assembly,or PCA (sometimes called a “printed circuit board assembly” PCBA). In through-hole construction, component leads are inserted in holes. In surface-mount construction, the components are placed on pads or lands on the outer surfaces of the PCB. In both kinds of construction, component leads are electrically and mechanically fixed to the board with a molten metal solder.

There are a variety of soldering techniques used to attach components to a PCB. High volume production is usually done with SMT placement machine and bulk wave soldering or reflow ovens, but skilled technicians are able to solder very tiny parts (for instance 0201 packages which are 0.02 in. by 0.01 in.)by hand under a microscope, using tweezers and a fine tip soldering iron for small volume prototypes. Some parts may be extremely difficult to solder by hand, such as BGA packages.

Often, through-hole and surface-mount construction must be combined in a single assembly because some required components are available only in surface-mount packages, while others are available only in through-hole packages. Another reason to use both methods is that through-hole mounting can provide needed strength for components likely to endure physical stress, while components that are expected to go untouched will take up less space using surface-mount techniques.

After the board has been populated it may be tested in a variety of ways:

While the power is off, visual inspection, automated optical inspection. JEDEC guidelines for PCB component placement, soldering, and inspection are commonly used to maintain quality control in this stage of PCB manufacturing.

While the power is off, analog signature analysis, power-off testing.While the power is on, in-circuit test, where physical measurements (i.e. voltage, frequency) can be done.

While the power is on, functional test, just checking if the PCB does what it had been designed to do.

To facilitate these tests, PCBs may be designed with extra pads to make temporary connections. Sometimes these pads must be isolated with resistors. The in-circuit test may also exercise boundary scan test features of some components. In-circuit test systems may also be used to program nonvolatile memory components on the board.

In boundary scan testing, test circuits integrated into various ICs on the board form temporary connections between the PCB traces to test that the ICs are mounted correctly. Boundary scan testing requires that all the ICs to be tested use a standard test configuration procedure, the most common one being the Joint Test Action Group (JTAG) standard. The JTAG test architecture provides a means to test interconnects between integrated circuits on a board without using physical test probes. JTAG tool vendors provide various types of stimulus and sophisticated algorithms, not only to detect the failing nets, but also to isolate the faults to specific nets, devices, and pins.

When boards fail the test, technicians may desolder and replace failed components, a task known as rework.

Design

Printed circuit board artwork generation was initially a fully manual process done on clear mylar sheets at a scale of usually 2 or 4 times the desired size. The schematic diagram was first converted into a layout of components pin pads, then traces were routed to provide the required interconnections. Pre-printed non-reproducing mylar grids assisted in layout, and rub-on dry transfers of common arrangements of circuit elements (pads, contact fingers, integrated circuit profiles, and so on) helped standardize the layout. Traces between devices were made with self-adhesive tape. The finished layout “artwork” was then photographically reproduced on the resist layers of the blank coated copper-clad boards.

Modern practice is less labor intensive since computers can automatically perform many of the layout steps. The general progression for a commercial printed circuit board design would include:Schematic capture through an Electronic design automation tool.Card dimensions and template are decided based on required circuitry and case of the Determine the fixed components and heat sinks if required.Deciding stack layers of the PCB. 1 to 12 layers or more depending on design complexity. Ground plane and power plane are decided. Signal planes where signals are routed are in top layer as well as internal layers.

Line impedance determination using dielectric layer thickness, routing copper thickness and trace-width. Trace separation also taken into account in case of differential signals. Microstrip, stripline or dual stripline can be used to route signals.

Placement of the components. Thermal considerations and geometry are taken into account. Vias and lands are marked.

Routing the signal traces. For optimal EMI performance high frequency signals are routed in internal layers between power or ground planes as power planes behave as ground for AC.

Gerber file generation for manufacturing.

Multi-Layer PWBs

Option for dedicating layers to ground Forms reference planes for signals EMI Control Simpler impedance control Option for dedicating layers to Supply Voltages Low ESL/ESR power distribution More routing resources for signals

Electrical Considerations in Selecting Material

Dielectric Constant (permittivity) The more stable, the better Lower values may be more suitable for high layer counts Higher values may be more suitable for some RF structures Loss Tangent The lower, the better Becomes more of an issue at higher frequencies Moisture Absorption The lower, the better Can effect dielectric constant and loss tangent Voltage Breakdown The higher, the better Typically not an issue, except in high voltage applications Resistivity The higher, the better Typically not an issue, except in low leakage applications

Through-hole manufacture adds to board cost by requiring many holes to be drilled accurately, and limits the available routing area for signal traces on layers immediately below the top layer on multilayer boards since the holes must pass through all layers to the opposite side.pcb layout Once surface-mounting came into use, small-sized SMD components were used where possible, with through-hole mounting only of components unsuitably pcb design large for surface-mounting due to power requirements or mechanical limitations, or subject to mechanical stress which might damage the PCB.

About HVC Capacitor

HVC is emerging brand and top manufacturer of high voltage ceramic capacitor and high voltage resistor . Established in 1999, with production plant of 6000 square meter in Southern China, we are specialized in high voltage components, such as HV ceramic caps and HV resistor custom production. Our component with actually experience replacing TDK, Vishay or Morgan’s high voltage capacitors, well accepted by world class machine manufacturers.