Solder Properties

Values presented in the
table below are for some of the most commonly used solders. With the push for lead-free (Pb-free) versions that
conform the the RoHS1
initiative that will be in effect in Europe in the summer of 2006, new alloys have been developed that use little
or no lead at all. For those application, this resource compiled by NIST2
and the Colorado School of Mines will be very helpful.

A
big problem with lead-free (aka Pb-Free) solder is that the higher the tin content, the more likely the growth of
"tin whiskers." This phenomenon where tiny tendrils
grow out of the solder is still not fully understood. The problem is that short circuits can be established
between adjacent conductors, and within a high density connector or a fine-pitch IC package. Some military and
space-based platforms ban the use of Pb-Free solders for that reason.

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