Toshiba unveils XG5 Series NVMe SSDs using 64-layer 3D flash memory

Toshiba America Electronic Components, Inc. (TAEC), ), a committed technology leader, today launched the XG5 series, a new line of NVM Express (NVMeTM)1 SSDs integrating 64-layer, 3D flash memories, offering up to 1TB2 capacity in a compact M.23 form factor. Starting today, OEM customers will have access to limited quantities of qualification samples with shipments gradually increasing in the second half of 2017.

New XG5 Series SSDs with BiCS FLASH deliver up to 1TB in a thin and light design to accelerate high performance notebooks and systems

As the third generation of the popular Toshiba XG Series, XG5 SSDs feature the latest 3-bit-per-cell TLC (triple-level cell) BiCS FLASHTM4 and utilize PCI EXPRESS (PCIe)5 Gen3 x 4 lanes and NVMe Revision 1.2.1 to deliver extremely high performance up to 3000 MB/s of sequential read and 2100 MB/s of sequential write6. Compared to 6Gbit/s SATA storage, the XG5 Series is up to 5.4 times faster on sequential read performance and up to 3.8 times faster on

Additionally, XG5’s feature-set also features an SLC cache for excellent performance to accelerate burst type workloads, such as those experienced routinely on Windows -based PCs, as well as improved standby power consumption reduced by over 50%10 to less than 3mW11, making these SSDs an excellent solution for high performance mobile computing.

“The XG5 Series demonstrates Toshiba’s ability to deliver a cutting-edge, high performance and low power solution for client PC applications that can also be leveraged as a server or boot drive storage solution.”

XG5 Series SSDs will be available in three capacities, 256GB, 512GB and 1024GB, all on a single-sided M.2 2280 form factor. Self-encrypting drive (SED) models12 supporting TCG Opal Version 2.01 will also be offered, making the XG5 series highly suited to a wide range of applications including ultra-mobile PCs that prioritize performance and business applications requiring security.

The XG5 series SSDs will be showcased at COMPUTEX TAIPEI 2017 in Taipei, Taiwan, from May 30 to June 3.