Scientists Develop New Material For Better Cooling

If you think that the price for some top end CPU coolers is a little pricey, things might get even a little more expensive with a newly developed material, yet to be named.

Scientists at Fraunhofer-Forscher have developed a new material that is a mix of copper and diamond powder offers 1.5 times the heat conductance that regular copper provides. Apparently they don't have the process perfected yet as it is still a little bit tricky to get a stable mix of the material.

The use of diamonds for cooling purposes isn't exactly new to the computer industry, however few seem to know of its use. For many years overclockers have been turning to diamond thermal compound for their cooling needs. Some turn to the IC Diamond thermal paste and many have made their own using diamond powder that can be found readily around the internet. Many users have reported significant drops in both idle and load temps even when compared to the popular Arctic Silver thermal compound.

While high performance coolers made out of the new compound from Fraunhofer-Forscher are sure to attract many enthusiasts, it is more probably that the notebook market might see a huge advantage from such a material. Notebooks are almost always pushing the thermal envelope in some form and such a material could alleviate some of the problems associated with this.