With Artificial Intelligence, IoT, and virtual reality becoming more popular, supplying those demands will be a huge agenda to consider. Even with the development of automatic driving systems, we can easily expect the growing needs of power inverters such as power modules.

Our objective is to develop and introduce joining materials that will support their high reliability expectations. Our SN100CV®, and Alconano can be an answer.

Also, we are focusing on environmentally sustainable products such as halogen-free products and Bobbiness flux-cored solder wire, which does not have any bobbin to waste after finishing the use of the solder.

We will actively introduce SN100CV, which has the toughness to be used as an alternative for SAC solder paste. This is now mainly in the testing phase at various customers, but in 2017 it is expected to move on to mass production.

Of course our most well-known solder, SN100C is still growing rapidly as even after 17 years as many customers are converting from low-SAC solder to SN100C.

Also, to meet the growing demand of our Alconano silver sintering paste we have begun mass production at our Tsuyama factory by investing in new equipment. Other products such as Bobbinless flux-cored wire and ALUSAC-35, a solder for joining aluminum, are also ready to meet our customer's new needs.

As mentioned before, automatic driving systems, AI, IoT and VR are widely expanding and we are expecting them to expand much faster. We are ready to introduce our joining materials to secure the high reliability needs and of course, we are always investing in the development of new products that will meet the needs for future products.