congatec – a leading vendor of standardized and customized embedded computer boards and modules – introduces its brand new conga-TS370 COM Express Type 6 Computer-on-Modules in parallel with the launch of the 8th Generation Embedded Intel® Xeon® and Intel® Core™ processors (codename Coffee Lake H). They propel the 35-45 W TDP class of COM Express Type 6 modules to a new ‘six-pack’ level of high-end embedded computing, offering for the first time up to 6 cores, 12 threads and an impressive turbo boost of up to 4.4 GHz and drive up to three independent 4k UHD displays. Initial tests from congatec indicate that these brand new six-core modules offer between 45 to 50 percent more multi-thread and 15 to 25 percent more single-thread performance, compared to 7th Gen Intel® Core™ processor based variants. At a given TPD, system designs achieve higher bandwidth at overall lower power consumption ultimately leading to higher system efficiency. Target applications are high performance embedded and mobile systems, industrial and medical workstations, storage servers and cloud workstations, as well as media transcoding and edge computing cores.

“Markets such as medical imaging and Industry 4.0 as well as video analytics for e.g. situational awareness and transportation observation are keen on any new performance improvement,” explains Martin Danzer, Director of Product Management at congatec. “We simplify the use of these performance improvements with our standardized Computer-on-Modules, cooling solutions and eAPIs, making upgrading to the latest processor generations more or less a plug & play task.”

The feature set in detail
The new conga-TS370 COM Express Basic Type 6 Computer-on-Modules are available with six-core Intel® Xeon® and Intel® Core™ i7 processors, or quad core Intel® Core™ i5 processors in a 35 to 45 W cTDP envelope and up to 32 GB DDR4 2666 memory with ECC option. The integrated Intel® UHD630 graphics supports up to three independent 4k displays with up to 60Hz via DP 1.4 , HDMI, eDP and LVDS. For the first time, designers can switch now from eDP to LVDS purely by software without any hardware change. The modules excel with high bandwidth I/Os including 4x USB 3.1 Gen 2 (10 Gbit/s), 8x USB 2.0 and 1x PEG and 8 PCIe Gen 3.0 lanes for powerful system extensions including Intel® Optane™ memory. All common Linux operating systems as well as the 64-bit versions of Microsoft Windows 10 and Windows 10 IoT are executable. A premium class personal integration support in combination with an extensive range of accessories as well as standardized or customized carrier boards and systems complete the new modules’ service package.