GRASSE, France -- September 28, 2017 -- Gridbee Communications S.A.S. specialist in wireless communication IC development is pleased to announce the release of its GDB1000 SoC for Sub-GHz wireless communication solution and compliant with IEEE 802.15.4g/u/v. This is the first SoC capable of both FSK / OFDM modulations and embedding all processing power (MCU and flash memory) necessary for Smart Grid, Smart Cities and Industrial applications. The device provides 2 power amplifier outputs (one internal PA delivering + 18dBm and a second for external PA up to +30dBm) and exhibits a receiver sensitivity of -98dBm @800kb/s and -104dBm @400kb/s OFDM data rate. The high link budget guarantees successful communication over 2.5km distance at 800kb/s.

Gridbee GDB1000 offers both MR-FSK and MR-OFDM modulations and supports data rate from 50kb/s up to 800kb/s for distance ranging from few hundreds of meters to a few kilometers. GDB1000 features a large amount of memory (768kB of flash, 128kB of RAM), a full set of standard interfaces (USB, SPI, I²C, UART, etc.) and a 256 bits capable hardware AES encryption engine enabling secured, fast and reliable software upgrade over the air. Leveraging the high performance, power efficient capabilities of the GDB1000 processor, customers can run a very efficient and secure mesh network while processing data from the edge allowing for faster decision making.

"We are delighted to have reached this key technical milestone. We have enabled our global smart metering customers further with this state of the art SoC. The GDB1000 anticipates and enables more data exchange in IoT applications and our chip will have strong demand from multiple different applications," said, Stephane Laurent, VP Sales & Marketing and co-founder.

Evaluation kits have been sampled to lead customer in India and Korea and starting end of Q3 2017 for general customers.