NanoFoil®

NanoFoil® A reactive multi-layer foil that provides localized heat up to 1500°C in a nanosecond!

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Indium Corporation manufactures NanoFoil®, a nanotechnology material that delivers energy in a controlled and precise manner for joining, energetics and heating applications.

NanoFoil® is a reactive multi-layer foil that provides instantaneous heat for a variety of applications in many industries (semiconductor, aerospace, automobile, electronics, biomedical and defense markets). NanoFoil® is a predictable, controllable and affordable material that is industry accepted and proven to lower manufacturing costs while providing repeatable and reliable bonds and reactions.

Indium Corporation has scaled NanoFoil® production to high volume in an ISO certified process and is committed to helping customers realize the technical and economic benefits NanoFoil® provides.

This reactive multi-layer foil is fabricated by vapor-depositing thousands of alternating nanoscale layers of Aluminum (Al) and Nickel (Ni). When activated by a small pulse of local energy from electrical, optical or thermal sources, the foil reacts exothermically to precisely deliver localized heat up to temperatures of 1500°C in fractions (thousandths) of a second.

Traveling approximately eight meters per second, the reaction's rapid delivery coupled with its localized and versatile nature makes it ideal for many types of bonding and reaction initiation (energetics) applications.

Benefits of NanoFoil®

Customers around the world have discovered the unique benefits of NanoFoil® and NanoBond® to solve their current bonding challenges.

Frequently, in my role as a Technical Support Engineer, I am asked questions to which I may not immediately have an answer. Luckily, Indium Corporation has a team of experts here to back me up. The other day I was working...

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Sputtering Target Bonding

NanoFoil®, a nanotechnology material, is used to simplify the sputtering target bonding process in a process called NanoBonding®. NanoBonding allows target bonders and target manufacturers to make reliable and repeatable bonds while increasing margins and lower capex.

Electronics Assembly

NanoFoil® is used to melt adjoining solder layers and join components together without exposing components to reflow temperatures.
Better yet, the joining process is simple and fast.

The process is performed in air and at room temperature, it has no flux requirement, and it is completed in fractions of a second with no reflow equipment.

Thermal Management

The NanoBond® process can be used to solder a component, circuit board or a heat spreader directly to a heat sink to achieve
thermal performance that is 6 to 8 times better than that of polymer-based TIM.

Advantages:

Outstanding Thermal Performance

True Metallic Bond without exposure to Reflow Temperatures

Residual Stresses Minimized

Flux Free

In Air at Room Temperature

One Second Soldering

Energetics

NanoFoil® is well-suited for energetics applications such as propellant ignition, munitions and circuit protection applications. NanoFoil® utilizes controlled, localized heat, and can be engineered to deliver a broad range of reaction temperatures, reaction rates and reaction energies.