The concept of chip package co-design is novel. The chip-package
interaction for a low voltage operational transconductance amplifier (OTA) is
described in this thesis. The effects on the stability of the OTA were studied
when the compensation capacitor is placed in the package instead of on the chip.
As the packages have become more sophisticated, it is possible to enhance the
operation of the chip-package co-design. A detailed theoretical analysis of the
transfer function of the OTA is given. Stability issues like the phase margin and
the unity gain bandwidth frequency are discussed. A comparison of the
specifications is made between compensation capacitor (Cc) on-chip and Cc on
package.
The other part of the thesis discusses the effects of power supply noise on
the op-amp. As the technology has encouraged the scaling of the feature size
more number of functional blocks can be placed on the chip. As a result of this
the density of integrated circuits has increased to a great extent. Due to the
switching of the digital gates, current distributed in the power distribution planes
can cause noise in the power supply of the op-amp. Thus this may lead to
unwanted noise in the power distribution system. The effect of the power supply
noise on the op-amp is also analyzed in the thesis.