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Abstract

The probe used for detecting silicon dioxide (SiO/2/) cracks in wafers or chips is essentially an electrochemical pen. The pen, which has a felt tip, makes contact with the SiO/2/ surface of either a chip or a wafer and detects cracks in the SiO/2/ by generating a potential between the electrolyte in the pen and the aluminum layer underneath the SiO/2/ surface.

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United States

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English (United States)

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ELECTROCHEMICAL DETECTION OF SiO/2/ CRACKS IN WAFERS OR
CHIPS

The probe used for detecting silicon dioxide (SiO/2/) cracks in wafers or
chips is essentially an electrochemical pen. The pen, which has a felt tip, makes
contact with the SiO/2/ surface of either a chip or a wafer and detects cracks in
the SiO/2/ by generating a potential between the electrolyte in the pen and the
aluminum layer underneath the SiO/2/ surface.

The pen contains an absorbing medium (cotton pad) which is saturated with
an electrolyte, which may be, for example, 0.3-1.5 molar potassium hydrogen
phosphate (K/2/ H PO/4/). A gold wire runs from the top of the felt tip inside the
pen alongside of the saturated absorbing medium to the top of the pen and is
connected to the voltmeter. The wafer or chip (backside down) is in contact with
a grounding plate that is connected to the other terminal of the voltmeter.

As the pen moves along the wafer, a potential will be generated only if there
is a crack in the surface of the SiO/2/.