We offer coupling and packaging services that can include both electrical and optical I/O. Send us your diced chips and we will return packaged and connectorized devices with fast turnaround. Alternately, we can help you develop a process and work with you to transfer it fully to you. We aim to work with our customers in the best way suited to their needs. Speak to us early in your design process to discuss your needs with regard to:

Low-loss edge or face coupling, using a growing array of coupler options, for both probing and packaging.

Packages customized to application needs for high frequency, low frequency or all-optical/passive applications and optimized to meet your form factor requirements.

In order to assist customers in planning for optical packaging, we offer a free Optical Coupling & Packaging Design Guide. We encourage consideration of the packaging design early in the process to avoid common mistakes that could complicate the packaging process.

Exemplary Coupling and Packaging

Below are a sampling of exemplary coupling/packaging jobs that we have done that have been published. Our solutions and experience continue to expand with our customers’ needs across a broad variety of wavelength, bandwidth, package-type and application needs:

High Density Optical Packaging of High Radix Silicon Photonic Switches