The development of PCB and FPC led birth of rigid flex boards. Rigid flex printed circuit boards are PCBs using a combination of flexible and rigid board technologies. Rigid flex boards are PCBs with combination of FPC and PCB. First, electronic engineers draw circuits and shape according to production requirements. Then the order will be issued to factory with production capability of soft and hard combined PCB board. After CAM engineers process the file, then arrange FPC and PCB production lines to finish PCBs. These two kinds of boards will be seamlessly laminated. Due to high complex production process control and value, all rigid flex PCBs should be 100% detected before shipment. Rigid flex PCBs are used for special products with flexible and rigid areas and requirements of...

Today's high density interconnect (HDI) printed circuit boards (PCBs) increase the functionality of a circuit board while utilizing less area, driven by the miniaturization of components and IC substrate packages. This enables the use of an increasing number of advanced features in today's mobile and high-performance devices. As the pin count of substrate packages increases, and/or the pitch count decreases, HDI structures provide a solution to the very complex routing requirements of these devices. Dow Electronic Materials continues to innovate with enhanced Cu via fill chemistries that are central to the ability to build HDI boards. Today, enhanced via-fill (EVF) must repeatably produce void-free filled laser micro-vias while plating the through-holes with sufficient copper to provi...

As we introduced before what is Ball Grid Array. A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. There are mainly three types of BGAs: PBGA (plastic ball grid array), CBGA (ceramic ball grid array), and TBGA (tape ball grid array). A specific form of the BGA can have a certain size, but should use the same physical structure and the same material. The following will focus on the analysis of three specific BGA package, each kind of structure form is different.PBGACurrently the most common production of BGA package form is plastic ball grid array package PBGA. It has the advantages of: - glass fiber and BT resin substrates and 0.4mm thick - chip is dire...

What's OSP ?OSP (Organic Solderability Preservative) is the most popular final surface finishing for PWBs.OSP film has excellent humidity resistance to protect copper oxidation. For example, F2 series protect copper surface up to twelve month. Copper surface (Before OSP)Cross section of OSP film (FIB) (After OSP)Why OSP ?OSP has a lot of features.OSP process is lower cost than HASL and the other metal finishes.OSP process is good environmental. (VOC free etc.)OSP film is available for lead free solder application.Good solder joint strength compare with Ni/Au plating. Mechanism of OSP film formation ? OSP products line up ?We can develop the active ingredient imidazole by our selves and we can supply the suitable OSP for each assembly process. GlicoatGlicoat-...

Due diligence when selecting a source for a custom electronic product can be a critical sourcing procedure. Chains are only as good as the weakest link, and the electronic components assembled to create a marketable product need to combine into a robust solution. Fitting a mix of pieces together that have been manufactured by disparate companies into a robust final assembly requires high reliability in each component. But choosing a reliable supplier in the flexible circuit industry can be difficult to mitigate for a number of reasons: Tooling Investment. PCB are custom designed and built for a specific part number. As such, there is a front-end cost and set-up charge needed for the design, panelization and tooling. Sourcing a PCB manufacturer requires an investment, both in tooling and the engineering time to define the product. Switching suppliers requires new set-up charges in addition to time required to get a second supplier qualified and producing. Products requiring hi...

IPC is proud to celebrate today's 5th annual Manufacturing Day, alongside a group of industry sponsors and co-producers. On this day, manufacturers around the country are joining in a unified effort to highlight current innovations in the electronics industry and inspire the next generation of manufacturing professionals. "Each year, Manufacturing Day exemplifies the significant contributions our industry makes nationwide," said IPC President and CEO John Mitchell. "IPC and its member companies have witnessed the strides our industry has made this year and look forward to continued growth for years to come." As part of Manufacturing Day 2016, IPC member company Arc-Tronics Inc. is hosting a site visit for community leaders at their facility in Elk Grove Village, Illinois. Attendees will include: Elk Grove Village Trustees Jim Petri, Sam Lissner and Pat Feicher, along with Dan McManus, district representative for Congresswoman Tammy Duckworth (D...

According to IDC’s latest Asia/Pacific Quarterly Mobile Phone Tracker, the China smartphone market grew 5.8% YoY and 3.6% QoQ in the third quarter of 2016, with OPPO and vivo overtaking Huawei for the first time in the market. Vendor dynamics OPPO and vivo rose because the Chinese market has evolved beyond operator and online driven channels over to an offline structure that dovetails with OPPO and vivo's strengths. There were three key growth phases of the Chinese smartphone market seen in the past few years. The first phase (before 2014) was when it was driven mainly by operators. Samsung, Lenovo, and Coolpad led the smartphone market then with the help of huge subsidies offered by operators. In the second phase (2014-2015), with e-commerce booming in China, Xiaomi was one of the first vendors that rode on that e-commerce wave and disrupted the market by selling its phones online through its flash sales. That kicked off another trend as other ve...

From November 8–11, 2016, the international electronics industry will meet in Munich at the world's leading trade fair for electronic components, systems and applications. Besides more than 2,800 international exhibitors, visitors can expect an extensive supporting program with four conferences and five forums. From the Cyber Security Forum and the electronica Automotive Conference to the CEO Roundtable: Experts and exhibitors will present and discuss the latest developments from around the world at electronica. With an eye on current trends, electronica 2016 will focus on it main themes, i.e. Automotive, Embedded Systems, Solid State Lighting, Wearables and Healthcare as well as the related topics of cyber security and the Internet of Things. All of these topics will also be reflected in the supporting program. CEO Roundtable One of electronica's highlights is on the first day of the fair: the CEO Roundtable. The theme is “Connected Worlds—Safe and Secure,” and leading...

Numerous major participants in the global semiconductor sector are engaging in deal-making to make themselves larger and more competitive. As a result, different industries within the sector will be controlled by fewer companies in the future. In China, consolidation will also take place within the three broad sections of the semiconductor sector, namely foundry, IC testing/packaging and fabless design. According to the global market research firm TrendForce, various Chinese semiconductor enterprises will be integrated under the “virtual IDM” model during 2017. At the same time, the trend of integration will also become more noticeable among Chinese providers of semiconductor manufacturing equipment. In the foundry industry, Chinese participants are lagging behind international competitors. Leading domestic foundry SMIC is currently using the 28nm process as its most advanced technology for mass production. While most international foundries have achie...

The global 3D ICs market is considerably consolidated, with Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) and Samsung Electronics Co. Ltd collectively accounting more than 50%, and a host of mid-sized and small companies holding the remaining market share as of 2012, according to a new report by Transparency Market Research (TMR). Product development through strategic collaborations is on the growth charts of top companies in the global 3D ICs market. A case in point is TSMC, which has collaborated with a host of electronic design automation vendors for the manufacture of 3D IC reference flows and 16 nm FinFet. For instance, TSMC collaborated with Cadence Design Systems Inc. to develop a particular 3D IC reference flow, which helps in inventive 3D stacking. Business expansion through R&D of 3D ICs is also what key companies in this market are focused on. Companies are planning to strengthen their R&D efforts for the development of new technologies. Product diversi...

Due diligence when selecting a source for a custom electronic product can be a critical sourcing procedure. Chains are only as good as the weakest link, and the electronic components assembled to create a marketable product need to combine into a robust solution. Fitting a mix of pieces together that have been manufactured by disparate companies into a robust final assembly requires high reliability in each component. But choosing a reliable supplier in the flexible circuit industry can be difficult to mitigate for a number of reasons: Tooling Investment. PCB are custom designed and built for a specific part number. As such, there is a front-end cost and set-up charge needed for the design, panelization and tooling. Sourcing a PCB manufacturer requires an investment, both in tooling and the engineering time to define the product. Switching suppliers requires new set-up charges in addition to time required to get a second supplier qualified and producing. Products requiring hi...

IPC is proud to celebrate today's 5th annual Manufacturing Day, alongside a group of industry sponsors and co-producers. On this day, manufacturers around the country are joining in a unified effort to highlight current innovations in the electronics industry and inspire the next generation of manufacturing professionals. "Each year, Manufacturing Day exemplifies the significant contributions our industry makes nationwide," said IPC President and CEO John Mitchell. "IPC and its member companies have witnessed the strides our industry has made this year and look forward to continued growth for years to come." As part of Manufacturing Day 2016, IPC member company Arc-Tronics Inc. is hosting a site visit for community leaders at their facility in Elk Grove Village, Illinois. Attendees will include: Elk Grove Village Trustees Jim Petri, Sam Lissner and Pat Feicher, along with Dan McManus, district representative for Congresswoman Tammy Duckworth (D...

According to IDC’s latest Asia/Pacific Quarterly Mobile Phone Tracker, the China smartphone market grew 5.8% YoY and 3.6% QoQ in the third quarter of 2016, with OPPO and vivo overtaking Huawei for the first time in the market. Vendor dynamics OPPO and vivo rose because the Chinese market has evolved beyond operator and online driven channels over to an offline structure that dovetails with OPPO and vivo's strengths. There were three key growth phases of the Chinese smartphone market seen in the past few years. The first phase (before 2014) was when it was driven mainly by operators. Samsung, Lenovo, and Coolpad led the smartphone market then with the help of huge subsidies offered by operators. In the second phase (2014-2015), with e-commerce booming in China, Xiaomi was one of the first vendors that rode on that e-commerce wave and disrupted the market by selling its phones online through its flash sales. That kicked off another trend as other ve...

From November 8–11, 2016, the international electronics industry will meet in Munich at the world's leading trade fair for electronic components, systems and applications. Besides more than 2,800 international exhibitors, visitors can expect an extensive supporting program with four conferences and five forums. From the Cyber Security Forum and the electronica Automotive Conference to the CEO Roundtable: Experts and exhibitors will present and discuss the latest developments from around the world at electronica. With an eye on current trends, electronica 2016 will focus on it main themes, i.e. Automotive, Embedded Systems, Solid State Lighting, Wearables and Healthcare as well as the related topics of cyber security and the Internet of Things. All of these topics will also be reflected in the supporting program. CEO Roundtable One of electronica's highlights is on the first day of the fair: the CEO Roundtable. The theme is “Connected Worlds—Safe and Secure,” and leading...

Numerous major participants in the global semiconductor sector are engaging in deal-making to make themselves larger and more competitive. As a result, different industries within the sector will be controlled by fewer companies in the future. In China, consolidation will also take place within the three broad sections of the semiconductor sector, namely foundry, IC testing/packaging and fabless design. According to the global market research firm TrendForce, various Chinese semiconductor enterprises will be integrated under the “virtual IDM” model during 2017. At the same time, the trend of integration will also become more noticeable among Chinese providers of semiconductor manufacturing equipment. In the foundry industry, Chinese participants are lagging behind international competitors. Leading domestic foundry SMIC is currently using the 28nm process as its most advanced technology for mass production. While most international foundries have achie...

The global 3D ICs market is considerably consolidated, with Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) and Samsung Electronics Co. Ltd collectively accounting more than 50%, and a host of mid-sized and small companies holding the remaining market share as of 2012, according to a new report by Transparency Market Research (TMR). Product development through strategic collaborations is on the growth charts of top companies in the global 3D ICs market. A case in point is TSMC, which has collaborated with a host of electronic design automation vendors for the manufacture of 3D IC reference flows and 16 nm FinFet. For instance, TSMC collaborated with Cadence Design Systems Inc. to develop a particular 3D IC reference flow, which helps in inventive 3D stacking. Business expansion through R&D of 3D ICs is also what key companies in this market are focused on. Companies are planning to strengthen their R&D efforts for the development of new technologies. Product diversi...

说明：PCB fast prototyping manufacturability designThe technical specifications required for the manufacturability of PCBs are related to the development status of the manufacturing process technology of PCB rapid proofing manufacturers and the manufacturers of printed boards. For example, for PCBs with a wire width of 0.1 mm and a minimum through hole diameter of 0.3 mm, some pcb fast proofing manufacturers cannot process them, and only some manufacturers with good equipment and process conditions can process them. Some designers do not pay attention to these problems. They think that PCB can be designed and manufactured quickly, or that the layout and wiring design of the printed board is correct. Whether it can be manufactured is the production and process. The concept is wrong. When considering the manufacturability specifications of PCBs, pcb rapid prototyping manufacturers should be determined according to the current processing level of printed boards and the process require...

说明：How do material choices increase performance? You would be hard pressed to find an RF device that does notutilize printed circuit board substrate material in one form or another. This is but one ofthe many building block materials needed in a given design. All decisions are focused on materials that improve signa loss operating temperature stability over temperature heat sinking and solderability. Yet the material sals one edto decrease attenuation frequency shift, and limit thermal loss.Essential materials Selections That Should Be Reviewed:.Printed Circuit Board (PCB) Substrates.PCB Copper Weight .PCB Surface Finishes.Machined Metal Materials.Machined Metal Surface Finishes.Dielectric And Gasket Materials.Circuit Interface Conductors And Insulation Types