CAMBRIDGE, United Kingdom — (BUSINESS WIRE) — February 26, 2015 —
ARM today announced its vision for transforming network infrastructure
to address the demands of content-rich mobile experiences and IoT-based
services in the next decade. To achieve this vision, ARM has worked with
its partners to provide operators and service providers with a new
approach for an Intelligent Flexible Cloud (IFC) environment to meet the
unyielding latency, power and size constraints for next-generation
networks.

IFC brings together platforms based on diverse, scalable,
highly-integrated system-on-chips with heterogeneous compute
capabilities supported by a common layer of enabling software and
distributed network intelligence. It builds on technologies such as
Software-Defined Networking (SDN) and Network Function Virtualization
(NFV), which combined with distributed intelligence enables applications
to move out in the network to where data resides for a significant
reduction in power consumption and increased responsiveness. The result
is a more elastic and resilient network. This accelerates time to market
for new services to meet the high velocity of cloud business model
evolution and supports the forthcoming wave of data throughput and
storage requirements that are projected to grow nearly 4X and 2X,
respectively, in the next three to five years alone.

“The underlying network infrastructure that supports our mobile and
connected world is undergoing a dramatic shift,” said Charlene Marini,
vice president, segment marketing, ARM. “The scalability of ARM®
technology, combined with the networking systems expertise of our
partners is increasing node intelligence and configurability, laying a
new foundation for software-defined functions and applications. The move
to the ARM architecture is underway, enabling new possibilities for an
intelligent flexible cloud from device to data center.”

An array of diverse silicon solutions targeting IFC requirements have
been announced by many of the major silicon vendors who already have
large footprints in networking today. A number have already started
shipping highly-integrated and heterogeneous SoCs that will deliver
against this new vision for network infrastructure. ARM and ARM
ecosystem silicon vendors will be demonstrating multiple platforms
highlighting IFC concepts at
MWC
2015.

Partner Quotes:

“A rapid migration to heterogeneous computing architectures is underway
and ARM is innovating accordingly,” said Chris Balough, senior director
of SoC product marketing, Altera. “With ARM Cortex®-A53
processors in our Stratix® 10 SoCs and Cortex-A9 processors
in our Cyclone®- and Arria®-class SoCs, Altera is
able to deliver heterogeneous computing platforms that put us in a great
position to serve our customers’ increasing need for computing
performance.”

“With a rich legacy in delivering networking infrastructure solutions,
AMD, in collaboration with ARM, is well-positioned to meet the specific
demands of the Intelligent Flexible Cloud,” said Scott Aylor, corporate
vice president and general manager, AMD Embedded Solutions. “As
demonstrated with our recent NFV solution, AMD is leading the market
with 64-bit ARM solutions that enable service providers to innovate with
cost-effective designs, deployment and management of networking
services.”

“AppliedMicro’s X-Gene™ Server on a Chip® silicon
enables high performance, low TCO solutions for throughput-intensive,
data dense applications,” said Kumar Sankaran, associate vice president,
APM. “Not only does X-Gene eliminate the need for other discrete chips
for networking, it offers malleable offload engines to support SDN,
security and other user-defined applications to enable the flexibility
in workloads the Intelligent Flexible Cloud demands.”

“From the Cloud to the edge of the network, Cavium has adopted the
ARMv8-A architecture and Intelligent Flexible Cloud as the foundation
for our custom ARMv8 based SoC platforms,” said Gopal Hegde, vice
president and general manager, data center processor group, Cavium.
“Cavium’s ThunderX product family, with 48 64-bit ARM processors on a
single die, delivers an unprecedented level of integration and industry
leading ARMv8-A SoC performance with extensive optimization to suit the
needs of the complex protocol stacks involved in NFV and C-RAN.”

“Enea shares the vision of the Intelligent Flexible Cloud, and Enea’s
software platforms for heterogeneous system-on-chip solutions are well
aligned with these new use cases,” said Daniel Forsgren, senior vice
president, product management, Enea. “We are excited to be a key partner
in the ARM ecosystem, and we continue to drive the development of NFV,
SDN and distributed intelligence solutions for the next generation
infrastructure.”

“EZchip brings a new approach to an Intelligent Flexible Cloud with an
unprecedented combination of high performance, throughput and
efficiency,” said Amir Eyal, vice president, business development,
EZchip Semiconductor Ltd. “Our new TILE-Mx multicore processor
incorporates one hundred ARM Cortex-A53 cores onto a single chip. This
unique combination of high core count, highly efficient mesh for linear
scaling of the interconnected cores and proven hardware accelerators for
packet processing are tailored for the Intelligent Flexible Cloud.”