Solder Ability: More than 80% of immersed part shall be covered with solder

Soldering Temperature：235±5℃

Immersing Time：2～3S

13

Solder Heat Resistance

Dip Soldering：260±5℃ 5±1S

Manual Soldering：300±5℃ 2～3S

14

Safety Approvals

UL、CSA、CQC

15

Test Conditions

Ambient Temperature：20±5℃

Relative Humidity：65±5%RH

Air Pressure：86～106KPa

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