Xbox-Scene reports that some readers now have Xbox 360 games consoles with long-awaited Jasper motherboards. These should run cooler and should mean the end of the Red Ring of Death, which featured on a recent Guardian Technology cover.

The Jasper board has the new 65-nanometer version of the ATI graphics chip, which ran hotter than Xbox motherboards could sustain, over the long term. This should run cooler and it also costs less to produce.

It's not easy to tell which machines have the new board. However, they have 150W power supplies with a different plug, whereas Falcon boards have 175W power supplies. Maybe someone will figure out the numbering scheme so it will be possible to tell from the box.

Jasper boards also have 256 megabytes of Flash memory to store the new avatar-based (Wii-style) user interface, with space to spare. Earlier models had only 16MB of Flash.

At VentureBeat, Dean Takahashi (who has written two Xbox books, and wrote our cover story) adds:

What exactly was wrong with the older 90-nanometer graphics chips and the boards that came with them? I've gotten some new information about that. The main failure cause was "thermal fatigue" of the leaded C4 connections between the graphics chip die and its organic carrier. The underfill had too low a glass-transition temperature for the amount of heat generated. That caused cracking over time, resulting in graphics chips coming loose. In previous versions, Microsoft addressed this with better heat sinks. The temperature sense diode was off in a corner and didn't reflect the true temperature in the core regions. Jasper has shifted to a material with a significantly higher transition temperature. Coming up with this fix took time, since the new material had to be identified and tested. The smaller 65nm chip die also helps since the stresses that cause the thermal fatigue are related to size.