1-46 Rapid development has resulted in increased reliability and availability, reduced cost, and higher element density. LARGE-SCALE (lsi)and VERY LARGE-SCALE INTEGRATION (vlsi)allow thousands of elements in a single chip. MONOLITHIC ICsare produced by the diffusion or epitaxial methods. DIFFUSEDelements penetrate the substrate, EPITAXIALdo not. ISOLATIONis a production method to prevent unwanted interaction between elements within a chip. THIN-FILM ELEMENTSare produced through EVAPORATIONor CATHODE SPUTTERINGtechniques. THICK-FILM ELEMENTSare screened onto the substrate. The most common types of packages for ICs are TO, FLAT PACK, and DUAL INLINE.