Failure RateThe rate at which devices form a given population can be expected (or were found) to fail as a function of time (e.g. percent per 1000 hr of operation).

FilmSingle or multiple layers or coatings of paste material used to form various elements (resistors, capacitors, inductors) or interconnections and crossovers (conductors, insulators). Thick films are deposited by screen printing.

Final SealThe manufacturing operation that completes the enclosure of the hybrid microcircuit so that further internal processing cannot be performed with out de-lidding or disassembling the package.

Fine LeakA leak in a sealed package less than 10-5 cm3/sec at one atmosphere of differential air pressure

FireThe term used to describe the act of heating a thick-film circuit so that the resistors, conductors, capacitors, and other integrated elements will be transformed into their final form.

Flat PackAn integrated circuit package with leads extending from the sides and parallel to the base.

Functional TrimmingTrimming of a circuit element (usually resistors) on an operating circuit to set a voltage or current of the output.