FEATURES

SIGNAL INTEGRITYGeneralized I/O Timing Analysis, Part 2 Timing analysis is a complex engineering process. It requires the engineer to deal with logic design, signal integrity simulations, PCB and chip design timing parameters, and generate length/delay constraints for chip/package/PCB designs. This, the second of a two-part series, looks at how timing and PCB trace lengths affect different real systems, and design tricks for tuning timing. by Istvan Nagy

PCB WEST RECAPHot in the Valley Something isn’t getting through, as signal integrity classes were packed even though most designers say they don’t perform the critical analysis. by Mike Buetow

COVER STORYPCB Thermal Design Developments Heat coupling increases as components and PCBs become smaller and more powerful. Designers must take remedial action to bring all components within their respective thermal specifications, but this step is becoming more challenging and constrained, even when preventative measures are taken early in the design process. New 3D thermal quantities can help address thermal problems as they arise. by Byron Blackmore, John Parry and Robin Bornoff