Fudzilla has scored details on AMD Fusion – one of the main reasons behind the AMD, ATI merger. AMD have been working on the product since back in 2006 – and it aims to combine the CPU and GPU onto one die. The ambitious project will have to wait all the way till 2011 and the 32nm process.

The codename for the mobile Fusion is “Llano”. The CPU will consist of two or four cores, presumably based on the Bulldozer architecture.

More details next page. Fudzilla has scored details on AMD Fusion – one of the main reasons behind the AMD, ATI merger. AMD have been working on the product since back in 2006 – and it aims to combine the CPU and GPU onto one die. The ambitious project will have to wait all the way till 2011 and the 32nm process.

The codename for the mobile Fusion is “Llano”. The CPU will consist of two or four cores, presumably based on the Bulldozer architecture.

The GPU part of Llano will be DirectX 11, based on the mobile version of the Evergreen generation – probably the mainstream GPU codenamed Park.

Intel is releasing Arrandale and Clarksdale in early 2010, branded as Core i3/i5, which will be the first time a GPU and a CPU (dual core) is present on one package. However, the GPU in Core i3/i5 is based on the Intel’s integrated graphics processors (IGP), which are well known for being painfully slow compared to discrete graphics, and completely unsuitable for gaming. Moreover, the Core i3/i5 package is a separate GPU and CPU die on the same package.

Llano will be a native GPU/CPU die, or something AMD calls an APU (Accelerated Processing Unit). That is, both the GPU and CPU cores will be present on a single die, manufactured at 32nm.

Llano is expected to be available in notebooks some time in mid-2011.

The TDP is expected to be between 20W and 55W, for the complete APU. In comparison, Intel’s latest top mobile CPU releasing this month, Intel Core i7 920XM, eats up 55W all by itself.