this is not a race here. Are you curing some kind of glue on your board? THe shortest profile I ever ran is for AIM solder paste - about 4 minutes total. with speed 8m/min your profile is going to be 45 seconds and I don't think this is the optimal condittion for any solder paste REgards, Emil

Hi Evtimov. Yes, correct it is not a race, but I want to know the experience of those who have achieve high speed. Because I ever read some study that mentioned the optimum slope (from room temp to peak temp) is around 1.5°. If I calculate this correctly, with my reflow machine to achieve this slope, I must use speed of 0.95 m/mnt. With this high speed, I worry it will cause the parts to be scattered away due to vibration of the conveyor.

0.8m/min is a different story. I run my 10 zone reflow ovens with that speed all the time and never had a problem. For the short profile I mentioned the speed I used is even higher(about 1.25m/min). No issues with parts moving. Regards, Emil