Microtronic GmbH, a leading sales specialist of microelectronics, today announced plans to show the Sonix ECHO™ scanning acoustic microscope in Stand 221j in Hall 5 at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany. The ECHO™ enables package inspection of stacked dies, complex flip chips and more traditional plastic packages.

Ernst J. M. Eggelaar, President of Microtronic commented, “We are excited to present the latest developments and features of the Sonix ECHO to our customers. The system offers many new and cutting-edge features.”

For more information about Microtronic or to schedule a demonstration, visit www.microtronic.de.