What is the best way to process a 30 mil circuit board assembly that has micro BGAs that need to be soldered to both sides? The Assembly Brothers, Jim Hall and Phil Zarrow, answer this question.Board Talk

MELF Component Misalignment
We have glued SMD MELF components that are misaligned after reflow. But all the chip components are correctly aligned. In testing if we eliminate the gluing of the MELF components ...Ask the Experts

BGA BAll Sheer Testing
We soldered a lead-free 548-ball BGA. After reflow, we mechanically pulled the BGA component off the circuit board surface. See the areas of separation. In some areas the pad was ripped ...Ask the Experts