Corporate Awards

Dr. Ning-Cheng Lee, Vice President of Technology, was honored as IEEE Fellow 2016, November 2016.

Indium Corporation was presented with the Business Leadership Award at the New York Association of Training & Employment Professional’s (NYATEP) 2016 Statewide Workforce Awards Ceremony on Oct. 26 in Albany, NY, for its outstanding workforce development advocacy demonstrated through its intern program leadership, November 2016.

Indium Corporation was presented with the Global Technology Award for Solder Paste for Indium10.1HF Solder Paste at SMTA International (SMTAI) Conference in Rosemont, Ill. This award has acknowledged outstanding innovations in the printed circuit board assembly and packaging industry. This is the fourth consecutive year that Indium has won this award, October 2016.

Indium Corporation was honored with Circuits Assembly’s Service Excellence Award for a materials company at the IPC APEX Expo. The Service Excellence Award recognizes electronics companies that, as judged by their own customers, demonstrate the highest performance across the areas of Technology, Responsiveness, Dependability, Quality, and Value for Price. March 2016.

Indium Corporation was presented with the Global Technology Award for Best Products – Americas for InFORMS® high-reliability solder preforms, on Nov. 10 at Productronica in Munich, Germany. This award has acknowledged outstanding innovations in the printed circuit board assembly and packaging industry for the past 10 years. November 2015.

Dr. Ning-Cheng Lee, Vice President of Technology, was honored at SMTAI 2015 as the recipient of the Surface Mount Technology Association's (SMTA) 2015 Founder's Award, October 2015.

Indium Corporation was honored Excellence in Soldering Award from EM Media LLP at the EM Best of Industry Awards 2015 in Pragati Maidan, New Delhi, representing how Indium Corporation is meeting customers’ explicit needs through excellent technical support and expertise, September 2015.

Indium Corporation was presented with the SMT China Vision Award for its Indium10.1 solder paste at NEPCON China on April 21 in Shanghai, China. The SMT China Vision Award recognizes domestic and international companies with innovative products and technologies in SMT methods, processes, materials, equipment, software, and management services. Each product entry was evaluated based on its creativeness, technological advancement, and contributions to help reduce cost, improve quality, increase efficiency, enhance reliability, ensure safety, and protect the environment.

Greg Evans, President and CEO, was awarded with the Businessman Award by Cheongjy City for the outstanding performance of Indium Corporation’s Korean facility and its contribution to the Cheongju City economy, March 2015.

Indium Corporation’s LV1000 flux coating for solder preforms was presented with CIRCUITS ASSEMBLY's NPI Award at the IPC APEX Expo on Feb. 24 in San Diego, California. It recognizes the electronics assembly industry's leading new products, February 2015.

Ed Briggs’s Meeting Future Stencil Printing Challenges with Ultrafine Powder Solder Pastes has made the top 10 list of SMT Tech Tuesday articles for 2014 by SMTOnline, one of the PCBA industry's most respected publications. This is the third consecutive year that an Indium Corporation authored paper has been named to this list, January 2015.

Indium Corporation was presented with the SMTA Corporate Award, which is presented to an SMTA member company that has shown exceptional support for the association, September 2015. Indium Corporation previously won this award in 2010.

Indium Corporation’s Andy C. Mackie, PhD, MSc, senior product manager for semiconductor and advanced assembly materials, was presented with the 2014 William D. Ashman Award at the 47th International Symposium on Microelectronics on Oct. 14, 2014, in San Diego, Calif.

Global SMT & Packaging magazine’s Global Technology Award in the Solder Paste category for BiAgX® Solder Paste Technology. The award acknowledges outstanding innovations in the printed circuit board assembly and packaging industry. This is the second consecutive year that Indium Corporation has won the Solder Paste award, September 2015.

Wisdom Qu, Assistant Technical Manager in China, earned a Best Paper award at the SMTA China South conference for her for her paper, titled Epoxy Flux – A Low-Cost, High-Reliability Approach to PoP Assembly, September 2014.

LED Journal's "Innova Award", for Heat-Spring® thermal interface material. This award recognizes, "leading companies within the LED market which have shown, through their products and services, the most innovative and advanced technology breakthroughs in LEDs.", May 2010.

Frost & Sullivan Award

According to Frost & Sullivan, awards are presented to companies "for exhibiting a superior knowledge of
customer needs and the ability to exceed customer expectations." Indium Corporation was chosen to receive
the award based on an in-depth analysis of market competitors, and interviews with companies that make up
the SMT soldering materials industry.

"These awards are special because they are presented by the largest and most respected research firm
in the world," said Rick Short, Director of Corporation Communications. "It is truly a tribute to the
global Indium Corporation team."

Previous Frost & Sullivan Awards include:

2003: Product Innovation Award for the development of NC-SMQ230 Pb-Free Solder Paste

2000: Market Engineering Customer Service Leadership Award for developments in the solder paste and adhesive markets

1998: Market Engineering Customer Service Leadership Award for developments in the solder paste and adhesive markets

Triple Awards for NF260 No-Flow Underfill

Indium Corporation’s introduced the world’s first Pb-Free, Reworkable, Air-Reflowable, No-Flow Underfill, called NF260, in 2005. Since its introduction Indium’s NF260 No-Flow Underfill has won awards on three continents for its quality and innovation, as well as its ability to enhance customers’ finished goods reliability and cost savings.

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