Expected features
32 nm PCH.
A new cache design.
support for Thunderbolt technology.
There will be three versions of the integrated GPU: GT1, GT2, and GT3. According to vr-zone, the fastest version (GT3) will have 20 execution units (EU).[15] Another source, SemiAccurate, however says that the GT3 will have 40 EUs[16] with an accompanying 64MB cache on an interposer. Haswell's predecessor, Ivy Bridge, has a maximum of 16 EUs.
New advanced power-saving system.
Base clock (BClk) increase to 133 MHz.
128 bytes cache line.[citation needed]
Execution trace cache will be included L2 caching design.
Fully integrated voltage regulator, thereby moving another component from the motherboard onto the CPU.
25, 37, 47, 57W TDP mobile processors.
77/65/55/45/35W and ~ 100W+(high-end) TDP desktop processors.
15W TDP processors for the Ultrabook platform (multi-chip package like Westmere).

we know what moves they are making with the chip, more components more efficiency and innovation...

Click to expand...

Are they not always trying to do that? Maybe if you or someone could give a specific example, like this little thing here is new and does... I am far from a computer engineer. I do see that there is all those little solder prong things that are new. What are those? It is the same size as ivy which I guess is because the same 22nm process.

I feel like I sounding to negative and overly skeptical, when I am just skeptical and curious.

Are they not always trying to do that? Maybe if you or someone could give a specific example, like this little thing here is new and does... I am far from a computer engineer. I do see that there is all those little solder prong things that are new. What are those? It is the same size as ivy which I guess is because the same 22nm process.

I feel like I sounding to negative and overly skeptical, when I am just skeptical and curious.

Expected features
32 nm PCH.
A new cache design.
support for Thunderbolt technology.
There will be three versions of the integrated GPU: GT1, GT2, and GT3. According to vr-zone, the fastest version (GT3) will have 20 execution units (EU).[15] Another source, SemiAccurate, however says that the GT3 will have 40 EUs[16] with an accompanying 64MB cache on an interposer. Haswell's predecessor, Ivy Bridge, has a maximum of 16 EUs.
New advanced power-saving system.
Base clock (BClk) increase to 133 MHz.
128 bytes cache line.[citation needed]
Execution trace cache will be included L2 caching design.
Fully integrated voltage regulator, thereby moving another component from the motherboard onto the CPU.
25, 37, 47, 57W TDP mobile processors.
77/65/55/45/35W and ~ 100W+(high-end) TDP desktop processors.
15W TDP processors for the Ultrabook platform (multi-chip package like Westmere).

1150 is so close to 1155 just like 1155 was so close to 1156. Will our lga 1155 cpu coolers work on this?
If it is so close, why do we need a new socket?

Click to expand...

what you needs got nothing todo with it, intels pockets are what matters is it not, in all honesty though they do seem to make interconnect changes each time as far as i can see, id however argue that if they wanted to they could easily make them more future proof,,,,,in the extreme, 1 socket for all and so could amd for that matter

i mean if you think about it they could do a mega pin chip with a lot of pins unused on some processors it is mearly a pin package after all and could be standardized better then it is within brands