eMemory President Dr. Rick Shen pointed out, "We are happy to take our important strategic partner UMC to a higher level. We stand by our core principles of "embedded wisely, embedded widely", as we incorporate our core technologies into UMC’s process platforms. This represents the integration of the strengths of both companies and will allow us to provide our IC design clients eNVM platforms that boast quality and reliability, thereby enabling them to stay ahead of the rest of the market."

eMemory's eNVM technologies target a wide range of applications in mainstream consumer electronics, including power management ICs for smart phones and tablet computers, advanced LCD drivers, touch panel controllers, battery management, sensor controller, audio codec, and near field communications. The current silicon IP (SIP) include NeoBit, NeoFuse, NeoMTP, NeoFlash, and NeoEE, making eMemory the top provider in the industry for providing a full array of SIP products for both OTP and MTP eNVM technologies.

eMemory's MTP technology can be applied for different product needs including <10 times programming, low-medium or medium-high densities with high endurance requirements, and multiple-time-programmable embedded non-volatile memory technology applications. Furthermore, the technologies are highly compatible with logic processes for different process generations, making eMemory an ideal partner for wafer foundries seeking seamless eNVM integration into their process platforms. S.C. Chien, senior vice president in charge of the IP & Design Support division at UMC, said, "We are happy to extend our long-term collaboration with eMemory that dates back to 2006. eMemory's OTP and MTP technologies are a welcome addition to UMC's 28nm technology platform, further adding to the many specialty process options available to UMC customers. By providing better and more comprehensive eNVM technologies for different customer requirements, we can increase the competiveness of their system-on–chip designs both now and for their future product migration."

About UMCUMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing for applications spanning every major sector of the IC industry. UMC's robust foundry solutions allow chip designers to leverage the company's leading-edge processes, which include 28nm poly-SiON and gate-last High-K/Metal Gate technology, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i. Fab 12A consists of Phases 1-4 which are in production for customer products down to 28nm. Construction is underway for Phases 5&6, with future plans for Phases 7&8. The company employs over 13,000 people worldwide and has offices in Taiwan, Japan, China, Singapore, Europe, and the United States. UMC can be found on the web at
http://www.umc.com.

About eMemoryeMemory was established in August, 2000, and has focused on logic process eNVM silicon IP development. Since its establishment, eMemory has participated in research and development of innately innovative technologies, developing leading products like NeoBit® (OTP silicon IP), NeoFuse® (anti-fuse OTP silicon IP), NeoFlash® (10,000+ times programmable silicon IP), NeoEE® (100,000+ times programmable silicon IP) and NeoMTP® (1,000+ times programmable silicon IP). eMemory continues to develop advanced technologies, striving to provide customers with silicon IP services, NVM components, and embedded memory applications having broad application scope, and is a full-service provider of eNVM silicon IPs. eMemory currently has about 200 employees, and is traded on the Taiwan’s GreTai Securities Market (Stock symbol:3529).