Is flow (wave) soldering of surface mounting products possible?

Question:

Is flow (wave) soldering of surface mounting products possible?

Answer:

In the case of packages without radiating fins, such as the SC-59 and SOP, flow (wave) soldering is possible, but in the case of packages that have radiating fins on their rear surface, such as the SC-62, TO-252, and TO-220SMD, a solder connection between the rear-surface radiating fins and the substrate cannot be sufficiently achieved with flow (wave) solder, and the use of flow (wave) soldering is not recommended in this case.