Sentinel-TI

Sentinel-TI is a thermal simulation and mechanical stress integrity analysis platform for SoC and stacked-die/3D-IC designs. Through comprehensive modeling and simulation, Sentinel-TI enables engineers to accurately predict the thermal behavior of the chip and package, including its impact on chip-package reliability and stress.

Increasing design complexity and the use of stacked-die/3D IC increases the impact temperature has on power noise, reliability and performance. The temperature gradient on a chip can be two to five times greater when using fine-grain, temperature-dependent power density map versus a uniform on-chip power profile. Because the temperature gradient across a chip and the corresponding package depends on factors such as power, on-chip activity, location of memories, high-power cells, operating modes, etc., neglecting to take the temperature gradient of the package during analysis can impact the functional yield of an SoC design.