Thermal Management is the ability to control the temperature of a system using technology based on thermodynamics and heat transfer. Thermal management therefore, includes all the possible procedures like conduction, radiation, convection, heat transfer, and others in order to control the temperature of a framed system. Most of the devices generate huge amount of heat and thus, require thermal management in order to avoid failures at an early stage. The thermal management systems thus have widespread applications in servers and data centers, healthcare, consumer electronics, aerospace and defense, automotive and others. The rising demand for thermal management is mainly due to their functionality and reliability in its wide range of applications resulting in continued operational processes.

The Global Thermal Management Market accounted for USD 10.7 billion in 2016 growing at a CAGR of 6.9% during the forecast period of 2017 to 2024. The upcoming market report contains data for historic year 2014, 2015, the base year of calculation is 2016 and the forecast period is 2017 to 2024.

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Competitive Analysis:

The report for global thermal management market include detailed vendor level analysis for market shares in 2016 for Global, North America, Europe, Asia Pacific, Middle East and Africa and South America specifically.

Also impact and development analysis of key vendors is registered in the market and factored on the basis of Vendor Positioning Grid Analysis which measures the vendors strengths and opportunities against present market challenges, measure providers ability to identify or satisfy present market needs, map providers market vision to current and upcoming market dynamics among others. The report also measures technology life line curve and market time line to analyze and do more affective investments.

On the basis of material type:- Adhesive material, and non-adhesive material. The adhesive material segment is further sub-segmented into thermal tapes, films, and adhesive liquids.

The films segment is further sub-segmented into thermally conductive films, and electrically conductive films. The adhesive liquids segment is further sub-segmented into heat cure liquid, and room temperature cure.

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