PRO 1600 is a full forced air / nitrogen convection reflow oven with only a 31" x 31" footprint of floor space. It has been designed for reflow soldering of even the most challenging applications including metal core, high thermal mass, and ceramic assemblies. PRO 1600 is very flexible in terms of profile development and optimization. Sealed heating chamber enables air ramp up rates of up to 4° Celsius/second from ambient and programming of up to 10 profile zones. It offers a unique On-The-Fly settings adjustment capability that allows creating and optimizing profiles all in a single pass. Where other batch and conveyor ovens fail to meet the desired profile curve, PRO 1600 excels.

Precise software control delivers unsurpassed temperature uniformity. Maintaining a low delta T across all of the components on the assembly ensures that they are not overheated or thermally stressed. Even for prototypes, this often means avoiding to spend hours of testing and debugging failed boards. With the optional External Thermocouple Control (ETC), profiles may be processed based on temperature readings of the assembly, not the air temperature around it. An optional Video Recording and Observation Module allows taking high magnification images and recording video during a soldering cycle. Increased productivity, superior performance and ease of operation make the PRO 1600 a versatile system ideal for small to medium run production, prototyping, NPI, testing or curing.

Bare PCB’s to simulate profiles developed for volume production environments.

Delamination and other quality issues testing on multilayer PCB’s.

Various composite materials for analysis / testing.

Ceramic substrates to Gold Plated Nickel / Copper housings using preforms in an atmosphere with <50 PPM of Oxygen.

Copper heatsinks to PCB’s using preforms.

Gold / Tin reflow.

Wafer Bumping with Oxygen levels below 25 PPM

Preconditioning reflows of IC’s while in extruded aluminum tubes.

Aluminum pins to a metal housing.

Flex connector to ceramic substrate.

Surface Mount Devices / Passive Components to ceramic substrate.

Connector filters with fluxed preforms.

LED’s in production quantities.

Various solder pastes for analysis in an R&D environment.

Once the Power-Key switch is turned to the On position, top cover automatically opens while the loading tray slides out. Parts are loaded onto a mesh tray and the profile is selected with a few mouse clicks.

After the Start icon is activated, the tray automatically slides into the heating chamber at an adjustable and controlled speed. A profile is then executed as per the pre-programmed parameters. Software constantly monitors actual ramp up rates and temperature inside an oven to the programmed values for accuracy. At the completion of a reflow cycle, the tray automatically exits from a heating chamber. PRO 1600 is now in a standby mode, ready for a new cycle run.

The following parameters may be programmed for each profile:

Up to 5 Ramp Up stages ( ° Celsius / second)

Up to 5 Temperature stages

Up to 5 Time at Temperature stages

Up to 4 In-Process Cooling stages

Final Cooling stage

Cooling Modes - 4 types

Initial Lag time to reach low Oxygen level

Nitrogen purge time

Automatic Profile Repeat (up to 10 times)

Profiles are developed, stored, and recalled within PRO 1600’s software package. It controls the reflow cycle, automation of process sequences, and automatic execution of safety checks before and during every profile run.

Real-Time process graphing

Profile processing based on part / PCB temperature control*

Profile development with up to 7 thermocouples*

Library with predefined profiles

On-The-Fly settings adjustment

Real- time data recording for documentation and analysis

Password Protected Access

User friendly environment

Designed for Windows® 7 / 10 Pro OS

*Optional

There are two standard configurations of the PRO 1600 series. They both share the same design and principle of operation. Below is a comparison matrix outlining features of each model. Additionally, various modifications may be made to satisfy specific application requirements. They include higher temperature rating, process video recording, and fixture customization.