Discrete IGBT in TO-247PLUS Features and Benefits

TO-247PLUS package has the same dimensions as standard TO-247, but accomodates as much as 100A and 120A duopack IGBT can.
Due to bigger thermal pad area the TO-247PLUS package has lower package thermal resistance, better heat dissipation capabilities.
The TO-247PLUS allows around 25% thermal performance improvement compared to standard TO-247.
To comply with safety standards in high power applications the creepage distance has been increased to 4.25mm.

TO-247PLUS is the new Package introduced by Infineon to accommodate more silicone and to have higher current capability than the Industry JEDEC Standard TO-247. It allows higher power dissipation than standard TO-247 and it dramatically reduces the component footprint on the heatsink respect to a standard TO-264.

TO-247PLUS is the new Package introduced by Infineon to accommodate more silicone and to have higher current capability than the Industry JEDEC Standard TO-247. It allows higher power dissipation than standard TO-247 and it dramatically reduces the component footprint on the heatsink respect to a standard TO-264.

TO-247PLUS is intended to be mounted using clips or mechanical pressure systems. Thanks to the improved thermal performance Rth(jh) respect to standard TO-247, even using the same silicon dice than in a Standard TO-247, customers can reach higher current levels at the same junction temperature or getting lower junction temperature at the same collector current.

TO-247PLUS is intended to be mounted using clips or mechanical pressure systems. Thanks to the improved thermal performance Rth(jh) respect to standard TO-247, even using the same silicon dice than in a Standard TO-247, customers can reach higher current levels at the same junction temperature or getting lower junction temperature at the same collector current.