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Disclosed is
a technique for the application of liquid
adhesion promoters to printed circuit board (PCB) cores prior to dry
film photoresist lamination.

It is now common practice for increasing
adhesion of aqueous
processing dry film photoresists to apply a liquid adhesion promoter
to the surface of PCB cores prior to lamination of photoresist to the
copper substrate surface. Water is most
commonly used for this
purpose. The adhesion promoter increases
the conformation and
adhesion of the resist to the substrate surface. The liquid must be
distributed evenly as a fine film across the surface.

Certain known
methods of liquid application require accurate
liquid metering and distribution systems.
The application rollers
are typically covered with a two-layer cloth sock or open cell foam
rubber. Maintaining adjustment and
alignment is very time consuming.
A system not correctly adjusted results in non-uniform coverage of
the surface. Parts of the surface can
actually be dry or too wet.

This method
is an improvement on existing designs in that it
eliminates the need for accurate liquid metering and distribution.
There is no need for frequent operator intervention to maintain the
adjust ment of the liquid supply system.
Excess liquid is supplied
to the panel and is squeegeed off, leaving a fine uniform film of
water on the panel for r...