Eurotech Teams with Applied Micro and NVIDIA to Develop New HPC System Architecture

June 23, 2014

LEIPZIG, Germany, June 23 — Eurotech, a leading provider of embedded and supercomputing technologies, has teamed up with Applied Micro Circuits Corporation and NVIDIA to develop a new, original high performance computing (HPC) system architecture that combines extreme density and best-in-class energy efficiency. The new architecture is based on an innovative highly modular and scalable packaging concept.

Eurotech, which has years of significant experience in designing and manufacturing original HPC systems, has successfully developed an HPC systems architecture that optimizes the benefits of greater density, as well as the and energy efficiency of ARM processors and high-performance GPU accelerators.

“We are excited and proud of this new development we have undertaken with Applied Micro and NVIDIA,” said Giampietro Tecchiolli, Eurotech CTO. ”The new architecture we have developed is highly optimized for High Performance Computing applications and delivers amazing density and energy efficiency. We expect to introduce products based on this revolutionary architecture in the very near future.”

“Today’s announcement validates the performance of X-Gene’s robust, 64-bit sever-class processor cores and highlights the power efficiency and density enabled by X-Gene’s wide memory bandwidth and high speed I/O integrated onto a single piece of silicon,” said Gaurav Singh, Vice President of Technology Strategy at Applied Micro. “We are excited to collaborate with Eurotech and NVIDIA to commercialize this innovative, high performance platform.”

“GPUs provide the processing power and development ecosystem that will enable Eurotech and other ARM solution providers to deliver a new class of innovative computing solutions for HPC workloads,” said Ian Buck, vice president of Accelerated Computing at NVIDIA. “The availability of GPU-accelerated 64-bit ARM systems is the year’s most important development in HPC.”

Systems leveraging the new architecture can have a novel form factor that enables an innovative way of packaging electronics and water cooling, leaving no space unutilized and boasting an impressive computational density, with a peak performance of 1 PFlop/s in one square meter.

The new system exploits the latest generation of the Eurotech’s patented direct hot liquid cooling, which allows “free cooling” even in the warmest climates on earth and features the best PUE in the industry.

About Eurotech

Eurotech is a global company based in Italy and with subsidiaries in Europe, North America and Asia. The Eurotech Group develops and markets miniaturized computers for special uses (NanoPCs) and computers featuring high computing capacity (HPCs – High Performance Computers). The Eurotech HPC division has more than 15 years of experience in designing and manufacturing HPC systems, with a commitment to continuous innovation through R&D nurtured in house and in collaboration with the most important research centres in Europe. Eurotech HPC designs and delivers solutions that help customers to maximize results while minimizing time to market and TCO. Learn more about Eurotech at www.eurotech.com

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