Accelerating new processes for next-generation devices.ZEISS Process Control Solutions

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Process Control Solutions

As the complexity and variety of semiconductor technologies continues to increase so do the challenges for process control technologies. Modern manufacturing techniques are increasingly incorporating novel materials and more complex 3D structures to meet rapidly evolving market demands. Resulting new processes are driving the need for new failure analysis and process control methods.

Based on a broad technology portfolio, ZEISS offers innovative process control solutions that deliver actionable information for front-end of line (FEOL), back-end of line (BEOL), packaging and assembly. ZEISS’s ongoing development of these technologies is key to meeting the semiconductor industry’s challenges for next-generation devices.

Unleash acquisition speed of up to 91 parallel electron beams with MultiSEM. Image sample areas up to 1 cm2 at nanometer resolution in <3 hours. This multi-beam scanning electron microscope is designed for continuous, reliable operation. more