KGI Securities analyst Ming-Chi Kuo predicted in today’s research note that Apple may adopt a combination of fingerprint and face detection sensors to supplant Touch ID.

In another note to clients obtained
by MacRumors, Kuo claims that iPhone 8 will debut an enhanced form of
3D Touch technology with higher sensitivity and a wider range of
pressure levels.

But, using that technology means that Apple has to make a change with
the current implementation of 3D Touch, as they are not compatible with
one another. So, Kuo expects Apple to switch from an “FBCB sensor to a
film sensor,” which means it will feature a wider range of 3D Touch
pressure levels, and an overall higher sensitivity.

Kuo adds that Apple will implement a metal structural portion around
the 3D Touch area, because an OLED panel is more fragile than LCD
panels. However, Kuo does not say whether or not this part of the design
will be external or internal.

Here’s an excerpt from the analyst’s note:

Apple may switch to a film sensor from the current
FPCB 9 (Flexible Printed Circuit Board) sensor in order to provide
better 3D Touch user experience, as a film sensor offers higher
sensitivity. Also, we expect the new OLED iPhone will come with a
flexible OLED panel.To avoid deforming the form factor of the flexible OLED panel
from touch operation pressure, a metal structural part will be placed
under the film sensor to provide more robust structural support.

KGI Securities analyst Ming-Chi Kuo predicted in today’s research note that Apple may adopt a combination of fingerprint and face detection sensors to supplant Touch ID.

In another note to clients obtained
by MacRumors, Kuo claims that iPhone 8 will debut an enhanced form of
3D Touch technology with higher sensitivity and a wider range of
pressure levels.

But, using that technology means that Apple has to make a change with
the current implementation of 3D Touch, as they are not compatible with
one another. So, Kuo expects Apple to switch from an “FBCB sensor to a
film sensor,” which means it will feature a wider range of 3D Touch
pressure levels, and an overall higher sensitivity.

Kuo adds that Apple will implement a metal structural portion around
the 3D Touch area, because an OLED panel is more fragile than LCD
panels. However, Kuo does not say whether or not this part of the design
will be external or internal.

Here’s an excerpt from the analyst’s note:

Apple may switch to a film sensor from the current
FPCB 9 (Flexible Printed Circuit Board) sensor in order to provide
better 3D Touch user experience, as a film sensor offers higher
sensitivity. Also, we expect the new OLED iPhone will come with a
flexible OLED panel.To avoid deforming the form factor of the flexible OLED panel
from touch operation pressure, a metal structural part will be placed
under the film sensor to provide more robust structural support.