John Lau has been a visiting professor at HKUST (Hong Kong University Science & Technology) since January 2009. Prior to that, he was the Director ofMicrosystems, Modules & Components (MMC) Laboratorywith Institute of Microelectronics (IME, Singapore) for 2 years and a Senior Scientist/MTS at HP/Agilent in US for more than 25 years. With more than 30 years of R&D and manufacturing experience, he has authored or co-authored more than 300 peer-reviewed technical publications and more than 100 book chapters, and given more than 250 presentations. He has authored and co-authored 16 textbooks on advanced packaging, solder joint reliability, and lead-free soldering and manufacturing. John earned his Ph.D. degree in theoretical and applied mechanics (University of Illinois) and three M.S. degrees in structural engineering, engineering physics and management science in North America. He is an elected ASME Fellow and has been an IEEE Fellow since 1994