The following is a detailed listing of the awards and award winners:
* Dr. Dennis Olsen (Consultant, Scottsdale, Ariz.) -- The David Feldman
Outstanding Contribution Award -- for his exceptional service to the
IEEE and the CPMT Society and its conferences for over 20 years.
Formerly with Motorola, he earned recognition through a variety of
distinguished awards, such as the Patent of the Year Award in 1993.
Over the years, Dr. Olsen was issued five patents covering a broad
spectrum of electronic packaging, ranging from a state-of-matter patent
for lead-free solder alloy to a proke card for testing unencapsulated
semiconductors for known good die applications. He continues to
demonstrate exceptional service to the Society, the industry and its
technology through active leadership in organizing conference programs,
serving on numerous committees, and organizing and being elected as the
1st chair of the CPMT Society Phoenix, Ariz. Chapter. He is also a past
president of the CPMT Society.
* Dr. Thiam Beng Lim (Deputy Director, Institute of Microelectronics,
Singapore) -- Outstanding Sustained Technical Contribution Award -- for
his leading edge research in advanced packaging technologies, and for
managing and transferring the electronic packaging research and
development to the industry and other research organizations worldwide.
Dr. Lim has championed Singapore's influence in the electronics
industry. His work and dedication have helped it evolve from a low-end
high volume manufacturing industry to the development and manufacturing
of leading-edge products competing with the best in the world. He is
also a founding committee member of the prestigious IEEE CPMT Society's
Electronics Packaging Technology Conference (EPTC) held in Singapore.
* Mr. Bruce Freyman (Amkor Technology, Chandler, Ariz.) -- Electronics
Manufacturing Technology Award -- for his pioneering work in developing
the PBGA package and for his vision and drive in making the PBGA package
and its format commercially successful. Mr. Freyman is the co-inventor
and co-developer of the overmolded plastic ball grid array and holds 13
patents pertaining to array. He is a recognized leader in the sub-
contract packaging industry with over 20 years in the industry, the last
ten with Amkor Technology. He was formerly Motorola's Communications
Sector's I.C. Packaging Manager. It was his leadership, vision and hard
work that drove he and his sales team at Amkor to be the messengers of
PBGA technology at virtually every semiconductor company in the world in
1993 and 1994, changing the way the technology is applied today.
* Mr. Michael B. McShane, Mr. Paul Lin and Mr. Howard Wilson (Motorola,
Austin, Tex. -- Paul and Howard were formerly with Motorola) --
Exceptional Technical Achievement Award -- for co-inventing the PBGA
package that resulted in new and revolutionary applications for the
electronic packaging technologies. In fact, this innovation is now
accepted worldwide as the preferred packaging technology for new
products. The PBGA package technology has also driven a new supporting
infrastructure, such as assembly and test equipment. In 2001, Mr.
McShane was recognized as the Microelectronic Packaging Technologist of
the Year by Advanced Packaging Magazine and MEPTEC. Mr. McShane was
most recently the General Chairman of the 2002 ECTC, and an active
senior member of IEEE for 13 years. He is also on a past member of the
CPMT Society's Board of Governors.
* Prof. Emmanouil (Manos) Tentzeris (Georgia Institute of Technology,
Atlanta, Ga.) -- Outstanding Young Engineer Award -- for his
contributions to RF circuit design of high performance IC devices and to
IEEE and CPMT Society sponsored conferences and activities. His
numerous contributions include the development of the wavelet-based
MultiResolution Time-Domain (MRTD) technique that allows for the system-
level simulation of RF-Packaging structures with demonstrated
significant savings in memory and execution time requirements on one and
two order of magnitude, respectively with respect to the conventional
full-wave simulation tools. MRDT was applied for the modeling and the
evaluation of the most popular RF packaging structures, mainly of flip-
chip, wirebonds and embedded passives, that led to the full-wave system-
level analysis of packaged wireless multilayer modules for the first
time ever. Prof. Tentzeris is a member of the CPMT Society, and a
member of IEEE for over 13 years. He remains active in reviewing
technical papers, organizing conferences and other volunteer-leader
activities.

The awards will be presented at the 53rd Electronics Components
& Technology Conference (ECTC) in New Orleans, Louisiana, USA,
during the CPMT Society luncheon on May 29, 2003. The exception is the
Electronics Manufacturing Technology Award, which will be presented at
the International Electronics Manufacturing Technology (IEMT) Symposium and SEMICON West 2003 in San Jose, California, USA, July 16 - 18.

About the CPMT Society

IEEE Components, Packaging and Manufacturing Technology (CPMT)
Society is the leading international forum for scientists and engineers
engaged in the research, design and development of revolutionary
advances in microsystems packaging and manufacture. Members include
world-renowned authorities in microelectronics, optoelectronics,
semiconductor processing, materials and connector technologies at
companies, universities, government research centers and allied
enterprises around the globe. The CPMT Society (http://www.cpmt.org/)
promotes technical excellence and professional development, information
exchange and networking opportunities through its journals, conferences
and workshops, committee activities, chapter events, educational
programs and awards. The Institute of Electrical and Electronics
Engineers, Inc. (IEEE), CPMT Society's parent organization, is the
world's largest international technical professional society with
more than 360,000 members in over 150 countries.