MEMS Technical Congress opens MIG’s annual technical event -- formerly held for MIG members only -- to non-member companies from the MEMS/sensors supply chain for the first time. Expanded attendance will further enrich the type of technical exchanges among attendees that have resulted in major initiatives in past years that are propelling the MEMS/sensors industry forward. These include IEEE 2700-2014 and the MEMS Foundry Engagement Guide.

“While there are other technical conferences addressing MEMS and sensors, few if any are addressing near-term commercialization opportunities and challenges beyond the timeframe of the event,” said Ms. Lightman. “MIG has several very active working groups that meet throughout the year. It’s fitting that MIG embark on a technical congress to formally unite all the work that is currently going on under the MIG umbrella with input from potential MIG members and colleagues.”

Hands-on Technical Collaboration

In contrast with other MIG flagship events, such as MEMS Executive Congress US and Europe and MEMS Industry Group Conference Asia, MEMS Technical Congress focuses on critical technical issues of MEMS and sensors adoption, integration, commercialization and standards. Attendees include CTOs, vice presidents of engineering, design engineers, architects, product development engineers, academics and R&D managers.

MEMS Technical Congress also features an opening keynote by Francis Gouillart, president of The Experience Co-Creation Partnership, several technically focused speakers, a tour of Draper Laboratory, and a dinner event co-hosted with Analog Devices.

MEMS Technical Congress is a one-of-a-kind technical conference, with a focus on working through MEMS/sensors supply chain challenges. The event is a place for neutral discussion of pre-competitive issues affecting MEMS manufacturing and brings together foundries, equipment vendors, research groups, large companies, startups, buyers, suppliers and other stakeholders for solutions knowledge, networking and resources to support the industry’s imminent MEMS/sensors commercialization needs.

Enabled by micro-electromechanical systems (MEMS) and sensors, sensor hubs/SoCs, sensor fusion, low-power wireless connectivity, and specialized software development platforms, wearables represent one of the fastest-growing market segments in consumer electronics. And according to IHS Technology[i], shipments of sensors used in wearables will grow seven-fold from 2013-2019, from 67 million units to 466 million units.

“Wearables are poised to grow on a massive scale but the challenge and opportunity for consumer electronics OEMs and integrators is to sow the seeds of brand dominance while the market is still emerging,” said Karen Lightman, executive director, MEMS Industry Group. “Many wearable applications require multi-axis motion sensing, environmental sensing, hardware and software sensor fusion, and other MEMS- and sensors-based functionality. Understanding how to leverage this functionality to best advantage will differentiate the truly successful from the rest of the increasingly crowded pack.”

·Challenging Developers to “Make it Wearable” — At 2014 CES, Intel launched its “Make it Wearable” development challenge to “encourage innovation in wearable technology and help create new connected experiences.” Steven Holmes will share some of the most compelling new developments arising from the challenge.

·Transforming Wearables through Bluetooth Smart—power efficiency is more important to wearables than to any other product category, including smartphones. Bluetooth Low Energy fulfills a critical requirement for low-power wireless connectivity in wearables, enabling new applications for remote controls, watches, and healthcare/wellness equipment.

·Beyond Audio with Biometric Earbuds — the ear is the best place in the body for biometric measurement, say some sensor design firms. And they are embedding tiny optomechanical sensor modules in earbuds to prove it. Biometric earbuds will change gaming, performance coaching and fitness training.

Speaker:Dr. Steven F. LeBoeuf, president, Valencell, Inc.

·Wearables: A Very Real Market Opportunity — market analysts are closely following the market for wearables — but predictions on market size as well as the next ‘killer app’ beyond fitness & activity monitors vary greatly. Top market analysts will predict market trends and opportunities in wearables.

·MEMS and Sensors for a Smart IoT — MEMS and sensors are the bedrock of a smart Internet of Things (IoT) — spanning consumer, automotive, medical and industrial markets. Panelists will discuss how improved sensing technologies, smaller form factors and more integration will help unleash the considerable opportunities predicted for the IoT.

·Waiting for the Holy Grail for Data — with the next breakthrough in health sensors, consumers are poised to generate the holy grail of medical research: clinically accurate, contextual and continuous data. These sensors collect 400,000 vital signs per person, per day, creating an unprecedented opportunity to understand health.

Speaker: David He, CTO, Quanttus

·The Dynamic Duo: Wearables and People Analytics — wearables have a long history as an integral part of the workplace, but their real power comes from the behavioral data they generate. Pairing data from wearables with micro-level outcome data enables true people analytics: online-style behavioral analysis and A/B testing in the real world at an unprecedented scale.

Speaker:Ben Waber, president & CEO, Sociometric Solutions

·Getting to Low Power and Maximum Functionality through Sensor Fusion — consumers demand greater functionality in smaller, more power-efficient wearables. With diverse approaches — hardware/software sensor fusion, integrated ‘sensor hubs’ or some combination thereof— how can consumer OEMs and embedded systems integrators take full advantage of MEMS and sensors for wearable devices?

The MIG booth is located in Tech West, Sands Expo, Level 2, Booth 72032 and will be open January 6-9, 2015 during 2015 CES exhibition hours.

Conference Registration Information

MIG’s full-day conference “Sensors and MEMS Technology,” will be held January 6, 2015 from 9-4:30 p.m., and will be followed by an onsite reception for speakers and conference-session attendees. The post-conference reception is sponsored by Mutual Mobile, PNI Sensor Corp.and SPEC Sensors.

AUSTIN, Texas – Analog Devices, Freescale, PNI Sensor Corp., and the MEMS Industry Group formed theAccelerated Innovation Community, a group dedicated to providing open-source algorithms for sensors. AIC also plans to announce an I/O standard for sensors in collaboration with the MIPI Alliance.

Engineers shouldn't have "to reinvent the wheel on common algorithms every time they want to add or change functionality in their product," said Karen Lightman, executive director of the MEMS Industry Group (MIG). "Access to an open-source library of introductory algorithms fundamentally changes the development paradigm."

Freescale was an early catalyst of AIC and has added open-source algorithms such as a C source library for 3-, 6- and 9-axis sensor fusion. Sensor fusion is a basic building block for sensor data analytics and for motion tracking, said Freescale's Ian Chen.

"It's all about bringing the relevant data together from multiple sensors to provide a bigger picture of what's going on in a system," Steve Whalley, chief strategy officer at MIG and a former director of sensors at Intel, told EE Times. AIC aims to let engineers "focus their own real differentiating capabilities on the more complex algorithms that are needed for today's products above and beyond the introductory algorithms in the AIC."

Steve Whalley

The key challenge in sensor fusion is effectively separating signal, motion, and noise, Chen said. AIC's algorithms aim to take redundant data from different sensors that observe the same event to distinguish between noise and signals, then compute more accurate information.

"Sensor fusion encompasses a variety of techniques which leverage the inherent strengths and monitoring that these individual sensors do to achieve more accurate results than the individual components could achieve by themselves," Chen told EE Times.

Algorithm developments need to be supported with sensor data that captures actual use cases, Chen said, and collecting such data will be a significant barrier to entry for small innovative algorithm developers. The open-source community will do well to reduce this hurdle, he added.

While these algorithms can sometimes compensate for a lack of sensors or for low performance, there is usually a compromise in some area such as power, code size, cost, or development time. To lessen such compromises, MIG and AIC are working to develop standards, such as the IEEEdefinition of sensor parameters. In addition, MIG and the MIPI Alliance will also announce a I/O standard for sensors this week. But AIC does not see a big part of its role in creating standards.

Whalley hopes to populate the AIC site with various algorithms and increase awareness in sensor-based products in consumer electronics, the Internet of Things, wearable, and mobile health fields. For its part, Freescale is offering a sensor fusion development kit and software development support package.

Development board in Freescale's sensor fusion kit.(Image: Freescale)

Sensor fusion capability is provided by sensor companies and by algorithm companies, though few independent algorithm companies still exist as many have been acquired. For its part, PNI will contribute algorithms for motion, heart rate monitoring and step counting. Whalley expects other MEMS Industry Group members to add algorithms to AIC in the next 30 to 60 days.

There is "competition trying to keep basic algorithms proprietary, which is fundamentally limiting the speed of innovation and the expansion of the overall sensor market," Chen said. "By bringing sensor fusion software into an open-source setting, we’re making it much easier to use sensor technology to add intelligence to new applications," he added.

Whalley said he expects AIC to start with a few sensor and algorithm companies and universities as initial algorithm contributors. Over time, he hopes product companies will start to give back to improve what’s already there by adding more of their algorithms.

Facilitated by MIG with support and innovation from inaugural AIC member, Freescale Semiconductor, the purpose of AIC is to reduce time-to-market, startup costs, risk and barriers-to-entry by encouraging inputs and collaboration from across the MEMS/sensors supply chain.

“When companies are developing products that use MEMS/sensors, they often have to develop algorithms from scratch. This inhibits innovation by compelling designers to reinvent the wheel on common algorithms every time they want to add or change functionality in their product,” said Karen Lightman, executive director, MEMS Industry Group. “Giving them access to an open-source library of introductory algorithms fundamentally changes the development paradigm. Product designers can use field-proven, open-source algorithms supplied by MIG member companies to jumpstart their development process, enabling them to gain all the benefits of MEMS/sensors that much faster.”

Steve Whalley, chief strategy officer at MIG and a former director of sensors at Intel, foresees the evolution of AIC: “Freescale played the role of catalyst in first realizing AIC, and we have been working closely with them to launch the MIG Open Source Sensor Fusion site. The site already includes open-source algorithms from Freescale, including C source library for 3-, 6- and 9-axis sensor fusion. Freescale will continue to populate the site over the coming months.”

Whalley added that MIG is already seeing more industry support for AIC: “Analog Devices, Berkeley Sensor & Actuator Center (BSAC), Carnegie Mellon University, Kionixand NIST have already come on board, and PNI Sensor Corp. will contribute three algorithms: quaternion to heading pitch and roll; heart rate monitoring using PPG sensor; and step counting. We also fully expect other MIG member companies to add further algorithms to AIC over the next 30 to 60 days, providing a rich baseline algorithm capability to assist developers with sensor fusion solutions.”

It was over 10 years ago that I last visited Shanghai and oh my, how things have changed, most visibly, the skyline. Looking across the Huangpu River from The Bund back then, I clearly remember the ‘Pearl’ TV tower and a few tall buildings and thought how impressive it looked. Now, the view is an even more sumptuous feast for the eyes, day or night, and it keeps on growing and evolving. So too does the connectivity of the buildings and the people that live and work in Shanghai as the Internet of ‘Things’ brings it all together locally and globally.

Freescale Semiconductor

Freescale embedded systems for the Internet of Things include MEMS sensors as a data source for processed analytics

Q: It’s MIG's round – what are you having?A: I’m having whatever SteadyServ’s iKeg system is dispensing. SteadyServ’s iKeg sensors ensure that your favorite beer is always on tap. This application uses Freescale pressure sensors that help retailers know when they’re running low on each keg of beer. Rather than flow meters attached to the keg line SteadyServ’s solution allows keg beer measurements without impacting the quality of the beer. SteadyServ’s product and goals line up with Freescale’s focus on Internet of Things (IoT) applications by monitoring flow level of beverages and use predictive data analytics to track inventory and keep retailers’ coolers full of kegs. With Freescale’s support, SteadyServ is bringing to market a new IoT solution for an industry that has been around for a long time.

IEEE + MIG = MEMS Standards!

In the past month, MIG's Standard Sensor Performance Parameter Definitions was adopted and published by the IEEE Standards Association (IEEE Std 2700T-2014). The standard provides a common framework for MEMS sensor performance specification terminology, units, conditions and limits. This outcome landmarks MIG's strategy for addressing the rising cost of testing MEMS beginning with device data sheets. Standards are often thought to be slow to develop, however, the IEEE MEMS Testing Standards P2700 Working Group, chaired by Ken Foust (Intel) and Carlos Puig (Qualcomm), passed the standard in a near record time because MIG provides the forum to get the job done efficiently.Now there is more to come: most of the parameter definitions in the standard will require standard testing protocols. Keep a lookout for this and consider joining in as we begin with a standard test for MEMS accelerometer sensitivity.

Once you see the 2014 MEMS Executive Congress agenda, you will want to register! Early bird registration ends in one week! Don't miss the once-a-year opportunity to do business with the best in MEMS and Sensors.

Registration is now open for the second U.S. TSensors Summit to be held in the in San Diego, CA on November 12-13, 2014. Over two days you will hear from dozens of visionaries and experts on topics that will address global challenges in applications such as medical, infrastructure, agriculture, environmental, food production and safety, among many others. We are in the process of securing invited speakers; the program will be announced over the next few weeks. Click for more info!

What’s the next “smart thing?” Will it be a smartphone, a smartwatch such as Apple's new AppleWatch, smart glasses, an ear-worn computer like Kazuhiro Taniguchi’s Ear Switch (Fig. 1) — or something completely different? MEMS Industry Group recently polled leading technologists from LG, Samsung, Bosch, STMicroelectronics, InvenSense, and Freescale Semiconductor, as well as from Bluetooth SIG, about their perspectives on the future of smart devices. Whether or not they agree on the type of mobile device that will continue to drive the consumer electronics business forward, industry innovators agree that the consumer’s passion for intelligent mobile electronics is here to stay.

Fig. 1: Created by Hiroshima City University staffer Kazuhiro Taniguchi, who calls the prototype Bluetooth ear-worn computer an Ear Switch, the device puts gyro-sensors, compass, GPS functions, barometer, speaker, microphone, and battery in a form-fitting earpiece. The device's interface also uses infrared to detect when the wearer opens and closes his or her mouth; head and mouth movements send corresponding command signals back to the device. Apps could be created that would let the device, say, access weather or traffic information using head/mouth gestures.

Smartphone evolutionSmartphones are evolving quickly. With powerful processors, high-resolution cameras, and a wide range of MEMS and sensors making new classes of applications possible, smartphones now dominate the mobile-device market.

Jungkee Lee, principal engineer at Samsung, sees more “functional modules” embedded in smartphones, including pico projectors, noninvasive glucose meters, and food spectrometers. And if we can embed a 3D depth sensor into a smartphone or tablet, said Lee, new markets such as 3D scanning, 3D measurement, 3D video, 3D gaming, and indoor navigation will emerge. “There are several kinds of architectures being explored for 3D depth sensing,” added Lee, “including Structured Light by Prime Sense (now acquired by Apple), time-of-flight by Microsoft, SoftKinetic (Fig. 2), PMD, and a mobile array camera by Pelican Imaging. Each technology has pros and cons, but the final winner should satisfy the market.” An example of one of the technologies (SoftKinetic's) is seen in Fig. 2.

Fig. 2: SoftKinetic’s DepthSense 3D Imaging Time-of-Flight CMOS sensor measures how long it takes for infrared light to make the trip from the IR source to the target and back – the time of flight. The technology is currently being used in the Texas Instruments' chipset seen here for consumer applications, as well as the Melexis MLX75023 for the automobile safety and infotainment markets.

We found broad consensus on one point: the role of smartphones in the technology ecosystem. As the use of the phone (for actually calling people) has become almost a vestigial organ on the smartphone, perhaps we need a new moniker to describe its next evolutionary step.

Jong Sup Baek, innovation technologist at LG, believes that smartphones will become like smart gateways. “While they’ve evolved as standalone devices, from now on they will be a hub for the Internet of Things (IoT) and wearable devices.” And Wolfgang Schmitt, senior manager strategic marketing at Bosch Sensortec, called the smartphone “the hub for managing and communicating with all the smart things in the user’s daily smart environment. It will be ‘the’ device to interact with the Internet of Things and Services.” Michael Housholder, senior director, business development at InvenSense, noted that “emerging devices such as wearable activity monitors and smart watches will complement the smartphone by collecting data and displaying quick reference information.”

And because smartphones will remain the most convenient uplink to the cloud, according to Ian Chen, marketing director, Sensor Solutions Division, Freescale Semiconductor, we must pay more attention to security and privacy. “This will go beyond just passwords and encryption,” said Chen “and into multiple levels of security that use biometric and geometric finger prints that will make authentication difficult to fake.” We believe security and privacy are essential from the initial design through manufacturing.

Luca Difalco, vice president of marketing and applications at STMicroelectronics (ST), said that smartphones are “exceptional” because everyone carries one. He added that “smartphone evolution will build on this exclusivity by providing capabilities related to your current location, including location based services; health and wellness, via extensions that might monitor your heart rate, blood pressure or blood-sugar level; entertainment through embedded pico projectors and screen mirroring; and security, via activity, sound and/or environmental monitors.”

An intelligent futureWith manufacturers eagerly launching new types of smart devices for the consumer market, will the smartphone will remain the de facto smart device of the future — or will wearables displace it? Samsung’s Lee foresees a “renaissance of 3D mobile displays without glasses,” explaining that head or eye-gaze tracking by a front camera with a light field display screen may comprise the enabling technology. For Lee, more evolved smartphones rather than discrete wearables are the devices of the future.

When asked about volume leadership, LG’s Baek said that only wearables as a group, rather than a single type of wearable, will exceed the number of smartphones. “It might take five to ten years to get there, but we are going to have smart shoes, smart rings, and smart glasses.” Baek also mentioned LG's G Watch (Fig. 3) and the company’s Smart TVs as other smart devices that enhance the consumer experience.

Fig. 3: LG says its G Watch, powered by Android Wear technology, will be compatible with a wide range of Android smartphones.

Suke Jawanda, CMO of the Bluetooth SIG, also talked about new categories of “connected intelligence.” “Google Glass, beacons, and the Scanadu Scout – a tiny medical device that tracks and analyzes all of a patient’s vital information — are providing functionality we had never even dreamed of previously. This is the future of the intelligent mobile device — connectivity in the objects we already know and love, and new products we haven’t yet conceived of.”

Leading roleMEMS/sensors play a leading role, not only in the ever-evolving smartphone, but also in new categories of wearables. Asked about the future role of MEMS and sensors in mobile devices, ST’s Difalco said that “sensors will continue to output relevant information and interpret human interaction, though with far greater precision and in much-closer-to-real-life applications. They will become a completely integrated part of our daily activity.” (See Fig. 4.)

Fig. 4: Want a smarter way to role the dice? Game Technologies’ DICE+ uses motion-sensing and other technologies from ST.

Not surprisingly, all of these competitive MEMS/sensor makers were in agreement. Bosch Sensortec’s Schmitt claimed that there is “huge potential for many more smart sensors and sensor clusters beyond those which are already available in the CE world today.” And Freescale’s Chen noted that “MEMS will remain the most inexpensive means to provide accurate sensing, so it will play an integral part.” He added that MEMS sensor data will be a primary contributor to Big Data.

Of course, the role of connectivity is vitally important to the “next smart thing.” “Confined by proprietary wireless technologies," said Jawanda, "the fitness-tracking market shipped less than 15 million products in its early years. But since the adoption of Bluetooth Smart in 2010, shipment numbers for wearables have doubled to about 35 million, and are projected to reach more than 150 million by 2018.”

That certainly speaks to the impact that Bluetooth is having on the wearables market. And through the combined contributions of the MEMS/sensors device makers, mobile device manufacturers such as Samsung and LG will have the intelligent sensing and actuation they need to bring the “next smart thing” to market, year after year.

PISCATAWAY, N.J.--(BUSINESS WIRE)--IEEE, the world’s largest professional organization dedicated to advancing technology for humanity, today announced the availability of the IEEE 2700™-2014 “Standard for Sensor Performance Parameter Definitions,” recently approved by the IEEE Standards Association (IEEE-SA) Standards Board. With sensors being one of the primary technologies to help improve the lives of every connected person in the world, IEEE 2700-2014 is intended to provide a common methodology for specifying sensor performance in the ever-expanding sensor technologies in the consumer electronics industry.

IEEE 2700-2014 aims to reinforce innovation in a variety of sensor types for vendors considering ways to integrate two or more sensors—all introduced by Original Equipment Manufacturers (OEMs), Independent Software Vendors (ISVs) and other platform providers with non-scalable integration challenges.

The IEEE 2700-2014 fulfills the need for a common methodology to define sensor performance, and eases non-scalable integration challenges and burdens across manufacturers. Because sensor framework and technology span not only sensor vendors and ISVs, there are numerous types of sensors that require specification terminology, units, conditions and limits, including: accelerometers, magnetometers, gyrometers/gyroscopes, barometers/pressure sensors, hygrometers/humidity sensors, temperature sensors, ambient light sensors and proximity sensors.

“Ultimately, the goal for the standard is to help chipset manufacturers and OEMs achieve better performance and improved scalability,” said Ken Foust, chair of the IEEE 2700 Working Group. “The industry has been struggling to scale this technology across all platforms, because of the need to accommodate all sensor types from numerous vendors and all of the variations of those sensor types. This new industry standard is intended to reduce costs in working with sensors and help accelerate time to market.”

“The IEEE 2700 standard will be beneficial in the design of future technologies, such as the Internet of Everything that includes the Internet of Things, next generation of the cloud, telemedicine, augmented reality, vehicle-to-vehicle communications and vehicle-to-pedestrian communications,” said Herbert Bennett, chairman of the IEEE Electron Devices Society MEMS Standards Sponsor Committee for the IEEE-SA 2700 Working Group and NIST fellow and executive advisor at the National Institute of Standards and Technology.

The IEEE 2700-2014 resulted from extensive efforts of the IEEE 2700 Standard for Sensor Performance Parameter Definitions Working Group and was developed under the IEEE-SA Corporate Program as an IEEE Entity standard. It is the first standard to come out of the IEEE-SA and MEMS Industry Group (MIG) Memorandum of Understanding (MOU) announced in February 2014.

“The IEEE 2700-2014 standard's accelerated timeline was in part due to the early-stage development by MIG of an influential MEMS whitepaper. The strong support provided by the IEEE-SA and MIG volunteers and staff resulted in this new global standard,” said Karen Lightman, executive director, MEMS Industry Group. “Today’s rapid-paced technology innovation leaves consumers demanding better, faster and more features on their devices, so collaborating with IEEE-SA corporate working group members on a level playing field and leveraging the benefits of one technology in relation with others across industry lines is good for business and consumer choice.”

The IEEE Standards Association, a globally recognized standards-setting body within IEEE, develops consensus standards through an open process that engages industry and brings together a broad stakeholder community. IEEE standards set specifications and best practices based on current scientific and technological knowledge. The IEEE-SA has a portfolio of over 900 active standards and more than 500 standards under development. For more information visit http://standards.ieee.org/.

About IEEE

IEEE, a large, global technical professional organization, is dedicated to advancing technology for the benefit of humanity. Through its highly cited publications, conferences, technology standards, and professional and educational activities, IEEE is the trusted voice on a wide variety of areas ranging from aerospace systems, computers and telecommunications to biomedical engineering, electric power and consumer electronics. Learn more at http://www.ieee.org.

PITTSBURGH, PA--(Marketwired - May 12, 2014) - MEMS Industry Group® (MIG), the trade association advancing micro-electromechanical systems (MEMS) across global markets, today announced its line-up of speakers for "Designing MEMS In - How to Engage the Supply Chain," its pre-conference symposium at 2014 Sensors Expo & Conference. Attendees will learn how to take best advantage of a robust supply chain composed of device manufacturers, foundries, materials and equipment suppliers, software designers, and consultants as they prepare for success in this rich and diverse ecosystem.

"There is still great untapped opportunity for entrepreneurism and innovation in how MEMS devices are designed, where they are used, and how they can transform existing applications and create new markets. However, in order to pick the best MEMS device to design into your product, it is important to make the right choices," said Karen Lightman, executive director, MEMS Industry Group. "MIG's pre-conference symposium at Sensors Expo gives embedded systems integrators and OEMs a guided tour of the MEMS supply chain. Attendees will learn how to pick the right platform and partners for their applications, in order to collaborate effectively and achieve the best return on investment."

MEMS Conference Track As chair of the MEMS conference track at Sensors Expo & Conference on June 25-26, MIG has picked top speakers from the entire MEMS industry to discuss trends, strategies, technologies and solutions for engineers and sensing professionals. For more information on MIG's MEMS conference track, please visit: http://www.sensorsmag.com/sensors-expo/mems/mems-0.

MIG's active engagement in Sensors Expo stems from its collaborative relationship with Questex Media Group, producers of Sensors Expo & Conference. Wendy Loew, group show director of Questex Media Group, LLC, commented: "As the 'go-to' resource for globally linking the MEMS supply chain to strategic markets, MIG offers a neutral forum for exploring challenges and opportunities in the commercialization of MEMS. Tapping their global network of MEMS suppliers, MIG brings a group of accomplished and insightful speakers to our event. This makes them a valued partner in providing MEMS-centric programming to Sensors Expo & Conference attendees."

About Sensors Expo & ConferenceSince 1986, Sensors Expo & Conference has been the leading industry event in North America exclusively focused on sensors and has emerged as one of the largest and most important gatherings of engineers and scientists involved in the development and deployment of sensor systems. For more information, visit www.sensorsexpo.com.

The Sensors Expo & Conference takes place June 24-26 at the Donald E. Stephens Convention Center in Rosemont, IL. It is produced and managed by Questex Media Group LLC, a global, diversified business-to-business integrated media and information provider, headquartered in Newton, MA. For more information, visit: www.questex.com.

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