Indium Corporation is redefining solder with its InFORMS preforms and patent-pending solder ribbon for automated assembly.

According to Seth Homer, Product Manager, InFORMS are a composite fabrication consisting of solder and a reinforcing matrix that stabilizes bondline thickness. “Using an InFORM between the baseplate and substrate will ensure bondline planarity, giving your assembly a much more stable joint and increasing the reliability of your end product.”

InFORMS are invaluable in the production process because they provide:

A drop-in replacement for other bondline control methods

Increased lateral strength

Bondline co-planarity

Improved thermal cycling reliability

InFORMS are available in a variety of alloys, including SAC and SnPb alloys.

Indium Corporation uses cookies to provide you with the best possible experience on our website. By using our website, you agree to the placement of cookies on your device.Read more about our use of cookies here.