Interconnect Design Tradeoffs for Silicon and Glass Interposers

H. Kalargaris and V. F. Pavlidis

Abstract

Interposer technologies offer high density, high performance interconnects for integrated systems resulting in smaller form factors and improved system performance as compared to traditional packages. This paper sheds light on the different design tradeoffs which result from the usage of silicon and glass interposers due to the different material characteristics. The emphasis is on the redistribution layers (RDLs) of the interposer rather than the through silicon vias (TSVs) due to the long length of these wires. Guidelines of designing the interconnects for different design objectives such as power, delay, crosstalk, and area on silicon and glass interposers are presented.