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STMicroelectronics is expanding three of its advanced high-voltage power MOSFET families with the introduction of two new power packages, making energy-conscious equipment such as battery chargers, solar microinverters and computer power supplies even more compact, robust and reliable.

ST’s advanced PowerFLAT™ 5x6 HV and PowerFLAT 5x6 VHV packages provide the large insulation path lengths and clearances required for operation at up to 650V or 800V, within the same 5mm x 6mm footprint of a standard 100V PowerFLAT 5x6. This is 52% smaller than the popular DPAK footprint. In addition, the package is only 1mm high and features a large exposed metal drain pad that maximizes heat dissipation into pc-board thermal vias.

This combination of features simultaneously increases high-voltage capability, ruggedness, reliability, and system power density.